Machining device, in a particular process gas supply machining device
The introduction of a cross-jet process gas supply unit in a processing device addresses the issue of thermal energy accumulation during laser drilling of electrochemical cell substrates, improving process stability and efficiency by effectively dissipating thermal energy and removing particles.
Patent Information
- Application Number
- PCT/EP2024/083388
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2023-11-28
- Filing Date
- 2024-11-25
- Publication Date
- 2025-06-05
AI Technical Summary
The accumulation of thermal energy during laser drilling of substrates for electrochemical cells leads to thermal expansion and bending of the substrate, disrupting the machining process due to changes in surface position and focal alignment.
A processing device with a further process gas supply unit configured as a cross-jet is introduced to supply process gas over the substrate, effectively dissipating thermal energy and removing particles and melt splashes by convection and medium flow.
The implementation of the cross-jet process gas supply unit improves thermal energy dissipation and particle removal, maintaining process stability and preventing re-melting of through-holes, thereby enhancing the machining process efficiency.
Smart Images

Figure EP2024083388_05062025_PF_FP_ABST
Abstract
Description
[0001] Description
[0002] Processing device, in particular process gas supply processing device
[0003] State of the art
[0004] A processing device, in particular a process gas supply processing device, with at least one processing unit, in particular a laser drilling unit, which is designed to create a through-hole in a substrate for an electrochemical cell, with at least one process gas supply unit, in particular a laser drilling process gas supply unit, which has at least one chamber element which is designed to supply process gas into an ongoing processing process, in particular a laser drilling process, wherein the process gas is applied over the entire surface of a side of the substrate for an electrochemical cell facing away from the processing unit, has already been proposed.
[0005] Disclosure of the invention
[0006] The invention is based on a processing device, in particular a process gas supply processing device, with at least one processing unit, in particular a laser drilling unit, which is designed to create a through-hole in a substrate for an electrochemical cell, with at least one process gas supply unit, in particular a laser drilling process gas supply unit, which has at least one chamber element which is designed to supply process gas into the ongoing processing process, in particular a laser drilling process, wherein the process gas is applied over the entire surface of a side of the substrate for an electrochemical cell facing away from the processing unit. It is proposed that the process gas supply unit has a further process gas supply unit which is designed to supply process gas into the ongoing processing process, in particular a laser drilling process,wherein the further process gas supply unit is designed as a cross-jet.,
[0007] In this context, a “processing device” should be understood to mean, in particular, a device that is configured to process a substrate. In particular, the processing device is configured to process a substrate for an electrochemical cell. The processing device is preferably designed in several parts. Preferably, a non-cutting machining process is carried out with the processing device. Furthermore, the processing device preferably has a holder for the substrate for an electrochemical cell. Preferably, direct processing of the substrate is carried out in one processing step. Alternatively, indirect processing of the substrate by the processing device is also conceivable. Particularly preferably, the processing device is configured to carry out all necessary steps, for example a process gas supply and / or a processing step.
[0008] In this context, a “substrate for an electrochemical cell” should preferably be understood to mean a substrate intended for use in a fuel cell. Preferably, the substrate for an electrochemical cell is designed as a sheet metal. Preferably, the substrate is intended for use in an electrolyte cell. Particularly preferably, the substrate for an electrochemical cell is used in a solid oxide fuel cell. Alternatively, the substrate is intended for use in a battery. Preferably, the substrate for an electrochemical cell is designed to provide a base for the electrolyte. Furthermore, a substrate made of a pre-sintered ceramic is conceivable. Furthermore, other materials that appear appropriate to a person skilled in the art are also conceivable.In this context, a non-shrinking material should be understood to mean materials which do not shrink further during a shrinking process, for example a sintering process, and / or which have already been shrunk beforehand, for example by a sintering process. In this context, a “processing unit” should be understood to mean, in particular, a unit which is designed to process a substrate. Preferably, the processing unit is provided for producing recesses, in particular through-holes, in the substrate. Preferably, a plurality of through-holes are produced in a substrate for an electrochemical cell by the processing unit. In particular, the substrate for an electrochemical cell absorbs the thermal energy introduced by the processing unit.In particular, by creating a plurality of through-holes, an accumulation of thermal energy builds up in the substrate for an electrochemical cell. The processing unit preferably has, in particular, at least one non-cutting tool for creating recesses. The processing unit is preferably designed in several parts. The processing unit is preferably configured to generate a laser pulse. The processing unit is preferably configured to generate a single laser pulse and / or a plurality of consecutive laser pulses. The processing unit is particularly preferably designed as a laser drill. In particular, the processing unit is configured to process at least one surface of the substrate for an electrochemical cell. Energy is preferably introduced locally by the laser pulse generated by the processing unit.Particularly preferably, the energy is locally so high that the surface of the substrate is at least substantially partially, preferably largely, particularly preferably completely melted and / or evaporated. Alternatively, in particular complete melting with in particular at least substantially partial evaporation is also conceivable. Preferably, by machining the surface of the substrate for an electrochemical cell, at least one recess is produced in the substrate for an electrochemical cell. Particularly preferably, by machining the surface of the substrate for an electrochemical cell, a through-hole is formed in the substrate for an electrochemical cell. Preferably, the through-hole is arranged perpendicular to a main extension plane of the substrate for an electrochemical cell.Alternatively, it is conceivable that optical imaging errors, in particular in the focusing elements of the optical beam path, of the processing unit, depending on the position of the through-hole along the main extension plane, lead to a change in the inclination of the central axis of the through-hole, whereby the through-hole is arranged at an angle perpendicular to a main extension plane of the substrate for an electrochemical cell. Furthermore, it is conceivable that central regions differ from edge regions. A "main extension plane" of a structural unit should be understood in particular as a plane which is parallel to a largest side surface of a smallest imaginary cuboid which just completely encloses the structural unit and in particular runs through the center of the cuboid. The processing unit preferably focuses the laser pulse.Preferably, the processing unit deflects / moves the focused laser beam along the main extension plane in order to introduce energy locally at different positions, whereby a plurality of through-holes can be created.
[0009] In this context, a “process gas supply unit” is to be understood in particular as a unit which supplies process gas into a processing area during a machining process. The process gas supply unit is preferably designed to remove particles and melt splashes from the processing area. In this context, a “process gas” is to be understood in particular as a gas which transfers a pulse to the material in a processing area which is detached from the substrate for an electrochemical cell during a machining process. The process gas is preferably introduced at a pressure which is higher than the ambient pressure. Preferably, a pulse is transferred to the material which is detached from the substrate for an electrochemical cell during a machining process via friction. For example, the process gas comprises in particular compressed air, nitrogen and / or helium.The process gas is preferably composed of compressed air, nitrogen and / or helium. The composition of the process gas is preferably adapted to the requirements of the machining process. Alternatively, any other process gas that appears appropriate to a person skilled in the art is also conceivable. The process gas supply unit preferably has at least one gas reservoir element which is designed to hold a process gas. In particular, the at least one gas reservoir element is arranged at a distance from the machining area. The process gas supply unit preferably has a line element which is designed to line the process gas to at least one machining area. The line element is preferably designed to supply a process gas to a machining area in a coordinated manner. The line element is particularly preferably designed to supply a process gas to a chamber element.The conducting element preferably forms a coupling point with the chamber element. The chamber element preferably forms a contact point with the substrate for an electrochemical cell. The chamber element and the substrate for an electrochemical cell preferably form a hollow space. In this context, a “chamber element” is to be understood in particular as an element which is designed to receive the process gas, wherein the chamber element is preferably designed to apply the process gas over the entire surface of at least one side of the substrate for an electrochemical cell. The chamber element is particularly preferably arranged on a side facing away from the processing unit. The chamber element is preferably designed as a cuboid open on one side. The cuboid is preferably hollow. The top side of the cuboid is particularly preferably open.Furthermore, other geometric shapes that would be considered appropriate by a person skilled in the art, such as a cylinder open on the top side, are also conceivable. Furthermore, the process gas supply unit comprises a regulating and / or control element, wherein the regulating and / or control element is designed as a valve. Preferably, the regulating and / or control element is configured to regulate the supply of the process gas.
[0010] The processing device preferably has a further process gas supply unit. The further process gas supply unit is preferably configured to supply a process gas to a surface of the substrate for an electrochemical cell. The further process gas supply unit preferably supplies the process gas to the surface of the substrate facing the processing unit. The further process gas supply unit is preferably configured as a directed gas flow. The direction and speed of the process gas supply can preferably be controlled by means of the further process gas supply unit.Preferably, the further process gas supply unit generates a cross-jet, which is arranged in a close region of the surface of the substrate for an electrochemical cell. In this context, a "cross-jet" is to be understood in particular as a medium flow which is generated at least substantially parallel to a main extension direction of the substrate for an electrochemical cell by means of a nozzle element. Particularly preferably, the medium flow is designed as a process gas flow. Preferably, the medium flow is directed in one direction. Alternatively, the medium flow is directed in multiple directions. Furthermore, the medium flow is directed in a cyclone shape."Substantially parallel" is understood here to mean, in particular, an alignment of a direction relative to a reference direction, in particular in a plane, wherein the direction has a deviation from the reference direction of, in particular, less than 8°, advantageously less than 5°, and particularly advantageously less than 2°. Preferably, the nozzle element has a connection point with a further line element. Preferably, the further line element is connected to the gas reservoir element. Alternatively, the further line element is connected to a further gas reservoir element.
[0011] In particular, the accumulation of thermal energy disrupts the machining process, particularly the laser drilling process, due to thermal expansion and bending of the substrate, since the surface position is changed and the drilling process is disrupted by movement out of the focal position. The inventive design of the machining device makes it possible to achieve improved properties with regard to the dissipation of thermal energy introduced by the machining unit. In particular, particles and / or melt splashes can be removed from the machining area without contaminating the substrate surface, the optical components, and / or the machining area. This allows advantageous process support to be provided through the addition of a process gas. In particular, an advantageous process gas supply unit can be provided.
[0012] It is further proposed that the chamber element forms at least one gas-tight contact surface with the substrate. Preferably, the contact point having the gas-tight contact surface is formed on a side facing away from the processing unit. Preferably, the chamber element and the substrate for an electrochemical cell form a cavity. Preferably, the contact point is designed to retain process gas in the cavity created by the chamber element and on the substrate for an electrochemical cell. Preferably, the contact point is designed to be detachable. Furthermore, the contact point is designed to be detachable without tools. In this context, a “gas-tight contact surface” is to be understood as a contact point that has a technical gas density.The gas-tight contact surface preferably has a leakage of preferably a maximum of 5%, preferably a maximum of 3%, and particularly preferably a maximum of 1% of the volume of the process gas contained in the cavity. This makes it possible to provide, in particular, an advantageous chamber element. In particular, advantageous process gas utilization can be achieved.
[0013] Furthermore, the invention is based on a method for supplying process gas by means of a processing device, in particular a process gas supply processing device, with at least one processing step in which a through-hole is introduced into a substrate for an electrochemical cell by means of a processing unit, in particular a laser drilling unit, of the processing device, wherein in the processing step the at least one process gas supply unit has at least one chamber element by means of which a process gas is applied over the entire surface of the side of the substrate for an electrochemical cell facing away from the processing unit. It is proposed that in at least one processing step the process gas is additionally supplied as a cross-jet over the substrate for an electrochemical cell via a further process gas supply unit.Preferably, in a processing step, the process gas is supplied to the processing area at least substantially simultaneously via the first process gas supply unit and the further process gas supply unit. In this context, "at least substantially" is understood to mean a maximum time delay of preferably a maximum of 2 seconds, preferably a maximum of 1 second, and particularly preferably a maximum of 0.5 seconds. Preferably, in a processing step, the first process gas supply unit and the further process gas supply unit are operated independently of one another with process gas from a gas reservoir element via a first line element and a second line element.In this context, a “processing step” should be understood to mean, in particular, a method step in which processing of the substrate for an electrochemical cell is carried out by means of a processing unit and process gas is supplied to the processing area via the first process gas supply unit and the further process gas supply unit. Preferably, the cross jet of the first process gas supply unit is generated in a processing step by means of a nozzle element, wherein the nozzle element is configured to focus the medium flow in a processing step. Preferably, process gas is supplied to the process gas supply unit via the chamber element formed on the side facing away from the processing unit. This makes it possible, in particular, to provide advantageous process gas supply via the chamber element of the first process gas supply unit and the further process gas supply unit.In particular, an advantageous property can be achieved with regard to the dissipation of thermal energy introduced by the processing unit into the substrate for an electrochemical cell. Furthermore, an advantageous property can be achieved with regard to the dissipation of particles and / or melt splashes generated during processing by the processing unit.
[0014] Furthermore, it is proposed that, in at least one processing step, the further process gas supply unit removes thermal energy and / or particles from the surface of the substrate for an electrochemical cell. Preferably, particles and melt are removed in one processing step by means of a medium flow without contaminating the substrate surface, the optical components, and the machine interior. Preferably, the thermal energy is removed by convection with the medium flow. Preferably, the accumulation of thermal energy in the substrate for an electrochemical cell is removed by means of convection. Preferably, particles generated by the processing unit in one processing step are removed by the medium flow.This makes it possible to achieve, in particular, an advantageous property with regard to the dissipation of thermal energy introduced by the processing unit into the substrate for an electrochemical cell. Furthermore, it is possible to achieve, in particular, an advantageous property with regard to the dissipation of particles and / or melt splashes generated during processing by the processing unit.
[0015] It is further proposed that, in at least one processing step, a gas-tight contact surface is formed between the chamber element and the side of the substrate for an electrochemical cell facing away from the processing unit. Preferably, the gas-tight contact surface is formed in one processing step at a contact point between the chamber element and the side of the surface of the substrate for an electrochemical cell facing away from the processing unit. In particular, in one processing step, the contact point is designed as a detachable connection. Preferably, the contact point between the chamber element and the side of the surface of the substrate for an electrochemical cell facing away from the processing unit is connected in a gas-tight manner before a processing step. This makes it possible, in particular, to provide an advantageous process gas supply via the chamber element.
[0016] Furthermore, it is proposed that, in at least one processing step, a process gas guide is formed from the chamber element through at least one through-hole opened after the breakthrough. The through-hole is preferably created by the processing unit during the processing step. In this context, a "through-hole" is understood to mean a recess that extends completely through the substrate for an electrochemical cell. The through-hole is preferably arranged perpendicular to a main extension plane of the substrate for an electrochemical cell. Preferably, a process gas guide is created from a chamber element through the substrate for an electrochemical cell in one processing step as soon as the through-hole has been opened by the processing unit.The process gas is preferably guided from a chamber element through the substrate for an electrochemical cell at the same time as a breakthrough through the substrate for an electrochemical cell. This makes it possible, in particular, to provide an advantageous process gas supply via the chamber element. It is further proposed that, in at least one processing step, thermal energy and / or particle removal be established via the process gas guide from the chamber element through at least one through-hole opened after the breakthrough. It is further proposed that, in at least one processing step, particles and / or melt are expelled from the through-hole by means of the process gas flowing through the through-hole. In one processing step, particles and melt are preferably expelled from the through-hole by means of the process gas guide through the through-hole.In particular, the particles and the melt are expelled in the direction of the flow of the process gas from the chamber element through the substrate for an electrochemical cell in the direction of the side facing the processing unit. The thermal energy is preferably dissipated via convection with the medium flow. This can advantageously prevent the through-hole from remelting. In particular, an advantageous property can be achieved with regard to the dissipation of thermal energy introduced into the substrate for an electrochemical cell by the processing unit. Furthermore, an advantageous property can be achieved with regard to the dissipation of particles and / or melt splashes that are generated during processing by means of the processing unit.
[0017] It is further proposed that in at least one processing step, the particles and / or melt expelled by the process gas flowing through the through-hole are removed from the surface of the substrate for an electrochemical cell by means of the cross jet. Preferably, in one processing step, thermal energy is removed from the surface of the substrate for an electrochemical cell by means of the process gas flowing through the through-hole by means of the cross jet. Preferably, in one processing step, the particles and / or melt and / or the thermal energy are directly transferred from the process gas flowing through the through-hole to a cross jet. Furthermore, in one processing step, a time delay takes place between the transfer of the particles and / or melt and / or thermal energy from a process gas flowing through the through-hole to a cross jet.Preferably, the cross-jet completely absorbs the process gas containing the particles and / or melt and / or thermal energy through the through-hole. This allows for a particularly advantageous property regarding the removal of thermal energy introduced by the processing unit into the substrate for an electrochemical cell. Furthermore, a particularly advantageous property regarding the removal of particles and / or melt splashes generated during processing by the processing unit can be achieved.
[0018] Furthermore, it is proposed that in at least one processing step, the process gas is extracted from the processing process, in particular the laser drilling process, via an extraction unit. The process gas containing the particles and / or melt and / or thermal energy is preferably completely extracted by the extraction unit. Extraction by means of the extraction unit is particularly preferably carried out in a processing area on the side facing the processing unit. Furthermore, a targeted extraction of the cross jet takes place, wherein the cross jet completely absorbs the process gas containing the particles and / or melt and / or thermal energy that passes through the through-hole. The extraction unit is preferably arranged in a processing area on the side facing the processing unit. Components of the extraction unit are preferably arranged outside the processing area.This makes it possible to achieve, in particular, advantageous properties with regard to the removal of particles and / or melt splashes generated during processing by the processing unit. Advantageous properties with regard to the cleanliness of the component surface, the optical components, and the machine interior can be achieved.
[0019] Furthermore, a solid oxide fuel cell with a substrate for an electrochemical cell is produced by means of a method and / or a device according to the invention. In particular, an electrolyte is arranged between the anode and the cathode. Preferably, the substrate for an electrochemical cell is designed to provide a base for the electrolyte. Preferably, the solid oxide fuel cell is designed to convert chemical reaction energy of a continuously supplied fuel and an oxidizing agent into electrical energy. For example, hydrogen is used as the fuel and oxygen as the oxidizing agent. Alternatively, other fuels that appear appropriate to a person skilled in the art, for example, methanol, butane, and / or natural gas, are also conceivable. Preferably, in one process step of the solid oxide fuel cell, electrical energy is generated between the anode and the cathode.The anode preferably splits the electrons from the fuel. The electrons are preferably conducted to the cathode via a connecting element. In particular, this movement of electrons from anode to cathode generates the electrical energy. Preferably, the electrons are transferred to the oxidant in the cathode and split the oxidant. The negatively charged oxidant is attracted to the positively charged protons of the fuel, particularly through the electrolyte. Preferably, the end products of the chemical reaction are water and exhaust air. This makes it possible to provide, in particular, an advantageous solid oxide fuel cell.
[0020] The processing device according to the invention is not intended to be limited to the application and embodiment described above. In particular, the processing device according to the invention may have a number of individual elements, components, units, and method steps that differs from the number stated herein to fulfill a function described herein. Furthermore, in the value ranges specified in this disclosure, values within the stated limits are also to be considered disclosed and can be used arbitrarily.
[0021] drawing
[0022] Further advantages will become apparent from the following description of the drawings. The drawings illustrate an exemplary embodiment of the invention. The drawings, the description, and the claims contain numerous features in combination. Those skilled in the art will also expediently consider the features individually and combine them into useful further combinations.
[0023] Shown are: Fig. 1 a solid oxide fuel cell with a substrate for an electrochemical cell produced by a method according to the invention and / or a device according to the invention in a schematic representation,
[0024] Fig. 2 shows a processing device in a schematic representation and
[0025] Fig. 3 is a schematic flow diagram of a method for operating a processing device according to the invention.
[0026] Description of the embodiment
[0027] Fig. 1 shows a solid oxide fuel cell 26 with a substrate for an electrochemical cell 16 produced by means of a method and / or a device according to the invention. The solid oxide fuel cell 26 has an anode 28 and a cathode 30. An electrolyte 88 is arranged between the anode 28 and the cathode 30. The substrate for an electrochemical cell 16 is designed to provide a base for the electrolyte 88. The solid oxide fuel cell 26 is designed to convert a chemical reaction energy of a continuously supplied fuel 32 and an oxidizing agent 34 into electrical energy. Hydrogen is used as the fuel 32 and oxygen as the oxidizing agent 32. Alternatively, other fuels 32 that would be deemed appropriate by a person skilled in the art, for example, methanol, butane, and / or natural gas, are also conceivable.In one process step of the solid oxide fuel cell 26, electrical energy is generated between the anode 28 and the cathode 30. The anode 28 splits off an electron 36 from the fuel 32. The electrons 36 are conducted to the cathode 30 via a connecting element 38. This movement of the electrons 36 from the anode 28 to the cathode 30 generates the electrical energy. The electrons 36 in the cathode 30 are transferred to the oxidizing agent 34 and split the oxidizing agent 34. The negatively charged oxidizing agent 34 is attracted to the positively charged protons 40 of the fuel 32 by the electrolyte 88. The end product of the chemical reaction is, in particular, water 42 and exhaust air 44, for example. Fig. 2 shows a processing device 10 for carrying out a method according to the invention. The processing device 10 is configured to process a substrate for an electrochemical cell 16.The processing device 10 is constructed in several parts. A non-cutting machining process is performed with the processing device 10. Furthermore, the processing device 10 has a holder for the substrate for an electrochemical cell 16. In a processing step 50, the substrate 16 is directly machined. Alternatively, indirect processing of the substrate 16 by the processing device 10 is also conceivable. The processing device 10 is configured to perform all necessary steps, for example, a process gas supply and / or a processing step 50.
[0028] The processing device 10 has a processing unit 12, which transfers thermal energy into the substrate for an electrochemical cell 16 during processing. The processing unit 12 has a non-cutting tool. The processing unit 12 is designed in several parts. The processing unit 12 is configured to generate a laser pulse 52. The processing unit 12 is configured to generate a single laser pulse 52 and / or a plurality of consecutive laser pulses 52. The processing unit 12 is designed as a laser drill. The processing unit 12 is configured to process at least one surface 54 of the substrate for an electrochemical cell 16. The processing unit 12 is configured to create a through-hole 14 in a substrate for an electrochemical cell 16.The laser pulse 52 generated by the processing unit 12 locally introduces energy into the substrate for an electrochemical cell 16. The processing unit 12 forms a through-hole 14 in the surface 54 of the substrate for an electrochemical cell 16. The through-hole 14 is arranged perpendicular to a main extension plane of the substrate for an electrochemical cell 16. The processing unit 12 focuses the laser pulse 52.
[0029] The substrate for an electrochemical cell 16 is used for an electrochemical cell in a solid oxide fuel cell 26. Alternatively, the substrate 16 is intended for use in an electrolytic cell. Furthermore, the substrate 16 is intended for use in a battery. The substrate for an electrochemical cell 16 is configured to provide a base for the electrolyte 88. The substrate 16 is formed from a metallic material. Alternatively, another non-shrinking material is also conceivable. Furthermore, a substrate 16 made of a pre-sintered ceramic is conceivable.
[0030] The processing device 10 has a process gas supply unit 18, in particular a laser drilling process gas supply unit. The process gas supply unit 18 is configured to remove particles and melt splashes from a processing area 56. For example, the process gas is composed of compressed air, nitrogen, and / or helium. The composition of the process gas is adapted to the requirements of a processing process 22. Alternatively, any other process gas deemed appropriate by a person skilled in the art is also conceivable. The process gas supply unit 18 has a gas reservoir element 58 configured to receive a process gas. The gas reservoir element 58 is arranged at a distance from the processing area 56. The process gas supply unit 18 has a conduit element 60 configured to conduct the process gas to a processing area 56.The conduit element 60 is configured to supply a process gas in a coordinated manner into a processing area 56. The process gas supply unit 18 has a chamber element 20, which is configured to supply process gas into the ongoing processing process 22, in particular the laser drilling process. The conduit element 60 is configured to supply a process gas into a chamber element 20. The conduit element 60 forms a coupling point 62 with the chamber element 20. The chamber element 20 forms a contact point 64 with the substrate for an electrochemical cell 16. The chamber element 20 and the substrate for an electrochemical cell 16 form a cavity 66. The process gas is applied over the entire surface of a side 24 of the substrate for an electrochemical cell 16 facing away from the processing unit 12. The chamber element 20 is arranged on the side 24 facing away from the processing unit 12.The chamber element 20 is designed as a cuboid open on one side. The cuboid is hollow. A cover side 68 of the cuboid is open. Furthermore, other geometric shapes that appear appropriate to a person skilled in the art, for example a cylinder open on the cover side 68, are also conceivable. The process gas supply unit 18 has a regulating and / or control element 70, wherein the regulating and / or control element 70 is designed as a valve. The regulating and / or control element 70 is designed to regulate a supply of the process gas. The chamber element 20 forms a gas-tight contact surface 48 with the substrate 16. The contact point 64, which has the gas-tight contact surface 48, is formed on the side 24 facing away from the processing unit 12. The contact point 64 is designed to retain process gas in the cavity 66 created by the chamber element 20 and on the substrate for an electrochemical cell 16.Contact point 64 is designed to be detachable. Furthermore, contact point 64 is designed to be detachable without tools.
[0031] The processing device 10 has a further process gas supply unit 46, which is configured to supply process gas into the ongoing processing process 22, in particular the laser drilling process, wherein the further process gas supply unit 46 is designed as a crossjet 72. The further process gas supply unit 46 is configured to supply a process gas to the surface 54 of the substrate for an electrochemical cell 16. The further process gas supply unit 46 supplies the process gas to the surface 54 of the substrate 16 facing the processing unit 12. The further process gas supply unit 46 is configured as a directed gas flow. The direction and speed of the supply of the process gas by means of the further process gas supply unit 46 is controllable. The further process gas supply unit 46 generates a crossjet 72, which is arranged in a vicinity of the surface 54 of the substrate for an electrochemical cell 16.A cross-jet 72 is a medium flow that is generated parallel to a main extension direction of the substrate for an electrochemical cell 16 by means of a nozzle element 74. Particularly preferably, the medium flow is designed as a process gas flow. The medium flow is expressed in one direction. Alternatively, the medium flow is expressed in several directions. Furthermore, the medium flow is expressed in a cyclone shape. The nozzle element 74 has a connection point 76 with a further line element 78. The further line element 78 is connected to the gas reservoir element 58. Alternatively, the further line element 78 is connected to a further gas reservoir element. Fig. 3 shows a method for supplying process gas by means of a processing device 10 according to the invention, in particular a process gas supply processing device.The method comprises a processing step 50 in which a through-hole 14 is introduced into a substrate for an electrochemical cell 16 by means of a processing unit 12 of the processing device 10, in particular a laser drilling unit. The processing is carried out within the processing step 50 in a processing process 22. In the processing step 50, the at least one process gas supply unit 18 has a chamber element 20, by means of which, in the processing step 50, a process gas is applied over the entire surface of a side 24 of the substrate for an electrochemical cell (16) facing away from the processing unit 12. A first process gas supply 80 is provided via the process gas supply unit 18, and a further process gas supply 82 is provided via the further process gas supply unit 46.A process gas supply 80 of the process gas supply unit 18 is effected via the chamber element 20 formed on the side 24 facing away from the processing unit 12. The first process gas supply 80 and the further process gas supply 82 are carried out in parallel with a processing process 22. In a processing step 50, the process gas is additionally supplied via a further process gas supply unit 46 as a cross-jet 72 over the substrate for an electrochemical cell 16. In a processing step 50, the process gas is supplied via the first process gas supply unit 18 and the further process gas supply unit 46 into the processing area 56. In a processing step 50, the first process gas supply unit 18 and the further process gas supply unit 46 are operated independently of one another with process gas from a gas reservoir element 58 via a first line element 60 and a second line element 78.The cross-jet 72 of the further process gas supply unit 46 is generated in a further process gas supply 82 by means of a nozzle element 74, wherein the nozzle element 74 in a further process gas supply 82 is configured to focus the medium flow.
[0032] In at least one processing step 50, the further process gas supply unit 46 removes thermal energy and / or particles from the surface 54 of the substrate for an electrochemical cell 16. The particles and melt are removed in a processing step 50 by means of a medium flow without contaminating the substrate surface 54, the optical components and the machine interior. The thermal energy is removed by convection with the medium flow. The particles which are generated by the processing unit 12 in a processing step 50 are removed by the medium flow. In at least one processing step 50, a gas-tight contact surface 48 is formed between the chamber element 20 and the side 24 of the substrate for an electrochemical cell 16 facing away from the processing unit 12.The gas-tight contact surface 48 is formed in a processing step 50 at a contact point 64 between the chamber element 20 and the side 24 of the substrate for an electrochemical cell 16 facing away from the processing unit 12. In a processing step 50, the contact point 64 is formed as a detachable connection. The contact point 64 is connected in a gas-tight manner between the chamber element 20 and the side 24 of the substrate for an electrochemical cell 16 facing away from the processing unit 12 prior to a processing step 50.
[0033] In at least one processing step 50, a process gas guide is formed from the chamber element 20 through at least one through-hole 14 opened after the breakthrough. The through-hole 14 is created in the processing step 50 by the processing unit 12. A process gas guide is created from a chamber element 20 through the substrate for an electrochemical cell 16 in a processing step 50 as soon as the through-hole 14 has been opened by the processing unit 12. The process gas guide occurs from a chamber element 20 through the substrate for an electrochemical cell 16 simultaneously with a breakthrough through the substrate for an electrochemical cell 16.
[0034] In at least one processing step 50, thermal energy and / or particle removal is established via the process gas guide from the chamber element 20 through at least one through-hole 14 opened after the breakthrough. In at least one processing step 50, particles and / or melt are expelled from the through-hole 14 by means of the process gas flowing through the through-hole 14. In a processing step 50, the particles and the melt are expelled in the direction of the flow of the process gas from the chamber element 20 through the substrate for an electrochemical cell 16 in the direction of the side facing the processing unit 12. The process gas flowing through the through-hole 14 has a direction 84. The direction 84 of expulsion is arranged perpendicular to a main extension plane of the substrate for an electrochemical cell 16.The thermal energy is dissipated in a processing step 50 via convection with the medium flow. In at least one processing step 50, the particles and / or melt expelled by the process gas flowing through the through-hole 14 are removed from the surface 54 of the substrate for an electrochemical cell 16 by means of the cross jet 72. In a processing step 50, thermal energy is dissipated with the process gas flowing through the through-hole 14 by means of the cross jet 72 from the surface 54 of the substrate for an electrochemical cell 16. In a processing step 50, the particles and / or melt and / or the thermal energy are directly transferred from the process gas flowing through the through-hole 14 to a cross jet 72.Furthermore, in a processing step 50, a time delay occurs between the transfer of the particles and / or melt and / or thermal energy from a process gas flowing through the through-hole 14 to a cross-jet 72. The cross-jet 72 completely absorbs the process gas containing the particles and / or melt and / or thermal energy flowing through the through-hole 14.
[0035] In at least one processing step 50, the process gas is extracted from the processing process 22, in particular the laser drilling process, via an extraction unit 86. In a processing step 50, the process gas containing the particles and / or melt and / or thermal energy is completely extracted by the extraction unit 86. In a processing step 50, extraction takes place by means of the extraction unit 86 in a processing area 56 on the side facing the processing unit 12. Furthermore, a targeted extraction of the cross jet 72 takes place, wherein the cross jet 72 completely absorbs the process gas containing the particles and / or melt and / or thermal energy flowing through the through-hole 14. The extraction unit 86 is arranged in a processing area 56 on the side facing the processing unit 12. The components of the extraction unit 86 are partially arranged outside the processing area 56.
Claims
Claims 1 .Processing device (10), in particular a process gas supply processing device, with at least one processing unit (12), in particular a laser drilling unit, which is designed to create a through-hole (14) in a substrate for an electrochemical cell (16), with at least one process gas supply unit (18), in particular a laser drilling process gas supply unit, which has at least one chamber element (20) which is designed to supply process gas into an ongoing processing process (22), in particular a laser drilling process, wherein the process gas is applied over the entire surface of the side (24) of the substrate for an electrochemical cell (16) facing away from the processing unit (12), characterized by a further process gas supply unit (46) which is designed to supply process gas into the ongoing processing process (22), in particular a laser drilling process, wherein the further process gas supply unit (46) is designed as a cross-jet (72).
2. Processing device (10), in particular process gas supply processing device, according to claim 1, characterized in that the chamber element (20) forms at least one gas-tight contact surface (48) with the substrate (16).
3. Method for supplying process gas by means of a processing device (10), in particular a process gas supply processing device, according to one of the preceding claims, with at least one processing step (50), in which a through-hole (14) is introduced into a substrate for an electrochemical cell (16) by means of a processing unit (12) of the processing device (10), in particular a laser drilling unit, wherein in the processing step (50) the at least one process gas supply unit (18) has at least one chamber element (20), by means of which in the processing step (50) a Process gas is applied over the entire surface of a side (24) of the substrate for an electrochemical cell (16) facing away from the processing unit (12), characterized in that in at least one processing step (50) the process gas is additionally supplied via a further process gas supply unit (46) as a cross-jet (72) over the substrate for an electrochemical cell (16).
4. The method according to claim 3, characterized in that in at least one processing step (50) the further process gas supply unit removes thermal energy and / or particles from the surface of the substrate for an electrochemical cell (16).
5. The method according to claim 3 or 4, characterized in that in at least one processing step (50) a gas-tight contact surface (48) is formed between the chamber element (20) and a side (24) of the substrate for an electrochemical cell (16) facing away from the processing unit (12).
6. Method according to claim 3 to 5, characterized in that in at least one processing step (50) a process gas guide is formed from the chamber element (20) through at least one through-hole (14) opened after the breakthrough.
7. The method according to claim 6, characterized in that in at least one processing step (50) a thermal energy and / or particle removal is established via the process gas guide from the chamber element (20) through at least one through-hole (14) opened after the breakthrough.
8. Method according to claim 3 to 7, characterized in that in at least one processing step (50) by means of the Particles and / or melt are expelled from the through-hole (14) by the process gas flowing through the through-hole (14).
9. The method according to claim 3 to 8, characterized in that in at least one processing step (50) the particles and / or melt expelled by the process gas flowing through the through-hole (14) are removed from the surface of the substrate for an electrochemical cell (16) by means of the cross jet (72).
10. The method according to claim 3, characterized in that in at least one processing step (50) the process gas is extracted from the processing process (22), in particular the laser drilling process, via an extraction unit (86).
11. A solid oxide fuel cell (26) comprising a substrate for an electrochemical cell (16) produced by means of a device according to one of claims 1 or 2 and / or a method according to one of claims 3 to 10.
Citation Information
Patent Citations
Micromachined electrolyte sheet, fuel cell devices utilizing such, and micromachining method for making fuel cell devices
WO2008054774A2
Apparatus and method for laser machining of a substrate
WO2022214183A1