Production of a substrate for a lighting device, and lighting device comprising such a substrate

Abstract

The invention relates to a method for producing a substrate (100) for a lighting device (300), having the steps of: - providing a support substrate (110), and - producing a conductor assembly (112) comprising at least one first conductor structure (121) and a second conductor structure (141) on the support substrate (110), wherein the second conductor structure (141) crosses over the first conductor structure (121) in at least one crossing region (150), and at least one part (143) of the second conductor structure (141) is produced by depositing a metal material using an aerosol jet method, said part being located in the respective crossing region (150).

Description

[0001] Manufacturing a substrate for a lighting device and a lighting device comprising such a substrate

[0002] The present invention relates to a method for producing a substrate for a lighting device, a correspondingly produced substrate and a lighting device comprising such a substrate.

[0003] This patent application claims priority from German patent application 10 2023 133 714 . 9 , the disclosure of which is hereby incorporated by reference .

[0004] DESCRIPTION

[0005] Substrates with conductor structures are used, among other things, to construct lighting devices such as transparent displays. Current methods for producing single-layer substrates with low resolution require complex processes such as sputtering or vacuum technology. If it is no longer possible to lay out the circuit to be manufactured in a single-layer substrate, an additional circuit level is required. Current technology for producing transparent displays only allows single-layer substrates because the metal layers are applied by cathode sputtering and structured by lithography or mechanical ablation.

[0006] The object of the invention is to provide multilayer substrates for transparent lighting devices. This object is achieved by a method having the features of independent claim 1. Furthermore, the object is achieved by a substrate having the features of independent claim 9 and by a lighting device having the features of independent claim 14. Further advantageous embodiments are specified in the dependent claims.

[0007] According to a first aspect, a method for producing a substrate having a plurality of conductor structures for a lighting device is provided, comprising the steps of: providing a carrier substrate, producing a first conductor structure arrangement with at least one first conductor structure on the carrier substrate, producing an insulation structure on the first conductor structure in at least one crossing region, and producing a second conductor structure arrangement with at least one second conductor structure on the carrier substrate that crosses the first conductor structure in the at least one crossing region and is electrically insulated from the first conductor structure by means of the insulation structure arranged in the relevant crossing region. At least one section of the second conductor structure arranged in a crossing region is produced by depositing a metallic material using an aerosol jetting process.Using this process, it is possible to produce not only single-layer substrates but also two- or multi-layer substrates in a particularly simple and cost-effective manner using an alternating printing process. In particular, the two- or multi-layer substrates can be produced without the usually necessary through-hole plating between the circuit levels, which is accompanied by a simplification of the manufacturing process. A variety of metallic materials can be used to manufacture the single- or multi-layer conductor arrangements. Furthermore, the aerosol jetting process can be used to produce structures with a very small resolution (for example L / S 10 micrometers), which is particularly advantageous for the production of high-resolution lighting devices or displays.

[0008] In one embodiment, it is provided that an insulation structure is produced in the crossing region by depositing an insulation material on the first conductor structure, wherein the second conductor structure is produced in the crossing region on the insulation structure. With the aid of the insulation structure, the electrical insulation of the two crossing conductor structures can be improved. In one embodiment, it is provided that the insulation structure is produced by depositing an insulation material using an aerosol jetting process. The use of the same technology for producing the insulation structure and the second conductor structure in the crossing region enables a simplification of the manufacturing process.

[0009] In one embodiment, it is provided that at least one section of the respective second conductor structure located outside the respective intersection region is produced by depositing the metallic material using the aerosol jetting process. This allows complex conductor arrangements to be realized relatively easily.

[0010] In one embodiment, it is provided that main sections of the at least one second conductor structure, which are arranged outside the at least one crossing region and are electrically separated from one another, are produced in a common process with the at least one first conductor structure. In this case, an insulation structure is produced in the at least one crossing region. Furthermore, in a further step, a bridge section of the second conductor structure, which electrically connects two separate main sections of a second conductor structure to one another, is produced on the insulation structure in the at least one crossing region. This enables an advantageous combination of several manufacturing processes. For example, the conductor structures, apart from the bridge sections, can be produced using the conventional process, with only the bridge sections being produced using the aerosol jetting process.This combination allows complex conductor arrangements in particular to be manufactured particularly easily and quickly.

[0011] In one embodiment, it is provided that at least some of the conductor structures are formed from a plurality of interconnected conductor tracks arranged in a network. This measure can increase the optical transparency of the conductor structures. In one embodiment, it is provided that each of the conductor structures of the conductor arrangement is produced at least partially by depositing a metallic material on the carrier substrate using the aerosol jetting method. This can further simplify the manufacturing process.

[0012] In one embodiment, the second conductor structure is crossed by at least one other conductor structure in a further intersection region. Since each of the generated conductor structures can both cross over and under other conductor structures as needed, this enables particularly complex interconnections to be realized, which typically require more than two circuit levels in conventional manufacturing.

[0013] In one embodiment, the main sections of the conductor structures produced using the aerosol jetting process are made of a metallic material containing silver, copper, nickel, gold, platinum, and / or aluminum. These materials can be applied particularly well to various surfaces using an aerosol jetting process. Since these metals also exhibit very good electrical conductivity, they are particularly well suited for creating particularly thin and thus particularly transparent conductor structures.

[0014] According to a further aspect, a substrate is provided which is produced using one of the methods described above. The substrate comprises a carrier substrate, a conductor structure arrangement arranged on the carrier substrate with at least a first electrical conductor structure and a second electrical conductor structure crossing the first electrical conductor structure in at least one crossing region. An insulation structure is arranged in the crossing region between the first and the second electrical conductor structure. Furthermore, the insulation structure and at least one part of the first and / or second electrical conductor structure arranged in the crossing region are designed in the form of a structure produced using an aerosol jetting process. The advantages described in connection with the production process apply to the substrate.

[0015] In one embodiment, the conductor structures are arranged in a matrix-like manner in at least one partial region of the conductor arrangement. Since such matrix-like arrangements have a particularly high number of intersection regions of the conductor structures, a particularly high number of areas of electrical interconnection can be used here using the advantageous aerosol jetting process.

[0016] In one embodiment, at least some of the conductor structures are formed from a plurality of interconnected conductor tracks arranged in a network. The network-like design of the conductor tracks allows for greater transparency.

[0017] In one embodiment, the main sections of the conductor structures produced using the aerosol jetting process consist of a metallic material containing silver, copper, nickel, gold, platinum, and / or aluminum. These materials can be applied particularly well to various surfaces using an aerosol jetting process. Since these metals also exhibit very good electrical conductivity, they are particularly well suited for creating thin and transparent conductor structures.

[0018] Finally, a further aspect provides a lighting device with a correspondingly designed substrate. The lighting device comprises at least one optoelectronic component arranged on the substrate and electrically contacted by means of at least one electrical conductor structure of the substrate. The advantages already described in connection with the manufacturing method and the substrate also apply to the lighting device.

[0019] In one embodiment, it is provided that the lighting device is designed in the form of a transparent display and comprises a transparent carrier substrate and a plurality of optoelectronic components arranged next to one another on the transparent carrier substrate and electrically contacted by means of the electrical conductor structures formed on the surface of the transparent carrier substrate.

[0020] The above-described properties, features, and advantages of this invention, as well as the manner in which they are achieved, will become clearer and more readily understood in connection with the following description of the embodiments, which are explained in more detail in conjunction with the drawings.

[0021] Fig. 1 schematically shows a perspective view of a substrate with a carrier substrate and two conductor structures arranged thereon and crossing each other,

[0022] Fig. 2 shows schematically a cross section through the conductor arrangement of Figure 1,

[0023] Fig. 3 schematically shows an aerosol jetting device for depositing a material onto a carrier substrate,

[0024] Fig. 4 schematically shows a first stage of the manufacturing process for a substrate with matrix-shaped conductor structures, in which several first conductor structures were produced on the carrier substrate,

[0025] Fig. 5 schematically shows a further stage of the manufacturing process, wherein an insulation structure was produced in several crossing regions of the first conductor structures, Fig. 6 schematically shows a plan view of a finished substrate with a carrier substrate and a conductor arrangement of several matrix-shaped conductor structures,

[0026] Fig. 7 schematically shows a first stage of an alternative method for producing the substrate of Figure 1, wherein both the first conductor structures and two separate main sections of the second conductor structures have been produced on the carrier substrate,

[0027] Fig. 8 schematically shows a further stage of the process of Figure 7, wherein an insulation layer has been produced on the first conductor structure,

[0028] Fig. 9 schematically shows a further stage of the method of Figures 7 and 8, wherein a bridge section of the second conductor structures has been produced on the insulation structure, which bridge section electrically connects the two separate main sections,

[0029] Fig. 10 schematically shows a plan view of a substrate during a first stage of the alternative manufacturing process for the substrate of Figure 3, wherein both first conductor structures and main sections of the second conductor structures have been produced on the carrier substrate,

[0030] Fig. 11 schematically shows a further stage of the manufacturing process from Figure 10, wherein an insulation structure was produced on the first conductor structures in several crossing areas,

[0031] Fig. 12 schematically shows an alternative embodiment of the substrate of Figure 3, wherein the first and second conductor structures alternately cross each other,

[0032] Fig. 13 schematically shows a plan view of a further alternative embodiment in which the conductor structures themselves were produced from network-shaped conductor tracks, Fig. 14 schematically shows a cross section through a substrate equipped with at least one optoelectronic component for a transparent lighting device, and

[0033] Fig. 15 schematically shows a transparent lighting device with the substrate of Figure 14.

[0034] The new concept provides for the production of conductor structures on substrates which are used to construct lighting devices and in particular transparent lighting devices, by depositing metallic materials using an aerosol jetting or aerosol jet process. Figure 1 shows an example of a typical substrate 100 for a lighting device. Such a substrate 100 comprises a carrier substrate 110 which, in the case of a transparent lighting device, consists of a transparent material, and a conductor arrangement 112 formed on a surface 111 of the carrier substrate 110 and having a number of different conductor structures 121, 141. Depending on the complexity of the circuit implemented using the conductor structures 121, 141, the conductor arrangement 112 can have one or more crossing regions 150 with mutually crossing conductor structures 121, 141.For reasons of clarity, Figure 1 only shows two conductor structures 121, 141 which cross in a crossing region 150. The two conductor structures 121, 141 run essentially in the same circuit level, with only a bridge section 143 of the second conductor structure 141 which crosses the first conductor structure 121 being arranged in a second circuit level. As can be seen from Figure 1, in the crossing region 150 there is an insulation layer 130 made of a dielectric on the first conductor structure 121, which forms electrical insulation between the two conductor tracks 121, 141. It is provided that at least the bridge section 143 of the second conductor structure 141 is produced using the aerosol jetting process. Preferably, however, the further main sections 142.1, 142.2 of the second conductor structure 141 can also be produced by means of this method.Depending on the application, the first conductor structure 121 and / or the insulation layer 130 can also be produced using the aerosol jetting process.

[0035] Figure 2 shows a cross-section through the substrate from Figure 1. It can be seen that the insulation structure in the crossing region 150 completely surrounds the first conductor structure 121 and thus completely electrically insulates it from the second conductor structure 141.

[0036] Figure 3 illustrates, by way of example, the material deposition using a device 400 that uses the aerosol jetting process. This deposition process is an additive 2D or 3D printing process with which various materials (e.g., nanoparticles made of electrically conductive materials such as metals, or nanoparticles made of dielectric materials, etc.) can be deposited on any suitable surface. The aerosol jetting process uses aerodynamic focusing to apply electronic ink precisely and accurately to the substrates 110. The material to be printed (e.g., ink) is placed in an atomizer 410, which, using a suitable process (e.g., ultrasonic atomization), generates a dense mist of material-laden droplets with a diameter of preferably a few micrometers.The resulting aerosol mist 440 is then fed via the supply line 420 into the aerosol print head 430, where it is focused by a sheath gas 450 supplied via the opening 431, which surrounds the aerosol in a ring. As the sheath gas 450 and the aerosol flow through the profiled nozzle 432 of the aerosol print head 430, they are accelerated, and the aerosol is focused into a dense stream of droplets flowing within the sheath gas. The sheath gas 450 also serves to prevent the printing material from contacting the nozzle 432. Various gases can be used as the sheath gas, for example, nitrogen or compressed air. The high-speed particle stream 441 resulting at the exit of the nozzle 432 remains focused over a distance of a few millimeters on its path from the nozzle 432 to the substrate 110, thereby maintaining feature resolution even on non-uniform and 3D substrates.The process is suitable for printing features with feature widths ranging from approximately 10 pm to millimeters. Depending on the starting material used, post-treatment (such as heating, sintering, etc.) of the deposited material may be useful or necessary to maintain certain properties, such as good electrical conductivity, in the resulting structures.

[0037] Figures 4 to 6 illustrate by way of example the production of a substrate with a matrix-shaped arrangement of conductor structures. As shown in Figure 4, a first group of several first conductor structures 121i, 1212, 121a running parallel to one another are initially produced on the surface 111 of the carrier substrate 110, which extend, for example, vertically in the drawing. This is preferably carried out by depositing an electrically conductive material (e.g. a metal) using the aerosol jetting process, but can also be carried out using a conventional process, such as, for example, photographic structuring.

[0038] As shown in Figure 5, suitable insulation structures 130 are then created on the first conductor structures 121i, 1212, 1213 in specific intersection regions 150 of the arrangement by depositing a dielectric. This is also preferably done by depositing a dielectric material using the aerosol jetting method, although in principle any other suitable method can also be used for this purpose.

[0039] As shown in Figure 6, in a further step, a second group 140 of a plurality of parallel conductor structures 141i, 1412, 141a is created on the carrier substrate 110, which run transversely to the first conductor structures. For this purpose, a suitable electrically conductive material, in particular a metal, is deposited using the aerosol jetting process. As can be seen from Figure 6, this results in a substrate 110 with a matrix-like arrangement 112 of conductor structures 121, 141.

[0040] Figures 7 to 9 illustrate an alternative method for producing the substrate 100 with the conductor arrangement 112 from Figure 2. In this method, the bridge section 143 of the second conductor structure 141 is produced separately from the other main sections 142.1 and 142.2 of the second conductor structure 141. Thus, in addition to the first conductor structure 121, two main sections 142.1 and 142.2 of the second conductor structure 141 have already been produced on the carrier substrate 110 shown in Figure 7. As can be seen, the two main sections 142.1 and 142.2 of the second conductor structure 141 are spaced apart from one another and have no electrical connection either to one another or to the first conductor structure 121. In principle, the first conductor structure 121 and the two main sections 142.1 and 142.2 can be produced independently of one another. However, it is advantageous to produce the two main sections 142.1 and 142.2 together with the first conductor structure 121.In principle, any suitable method can be used to produce the electrically conductive structures 121, 142.1, and 142.2, e.g., the aerosol jetting process or photographic structuring. The first conductor structure 121 and the two main sections 142.1 and 142.2 of the second conductor structure can be produced from the same or a different material.

[0041] As shown in Figure 8, in a further method step, an insulation structure 130 can be deposited on the first conductor structure 121. The insulation structure 130, produced, for example, using the aerosol jetting method, preferably completely surrounds the first conductor structure 121, ie, both on the top side and on the side walls.

[0042] As Figure 9 shows, in a further method step, a bridge section 143 of the second conductor structure 141 is created in the intersection region 150 on the upper sides of the insulation structure 130 and the immediately adjacent regions of the main sections 142.1, 142.2 of the second conductor structure 141. This is preferably done by depositing a suitable material using the aerosol jetting process. As can be seen from Figure 9, this bridge section 143 electrically connects the two further main sections 142.1 and 142.2 of the second conductor structure 141. In principle, any suitable electrically conductive material, e.g., a metal, can be used as the material for the bridge section 143. The two main sections 142.1 and 142.2 and the bridge section 143 are preferably made of the same material.In principle, however, it is also possible to manufacture the bridge section 143 from a different material, like the two main sections 142.1 and 142.2.

[0043] Figures 10 and 11 illustrate the production of the substrate with the matrix-shaped conductor structure arrangement 112 from Figure 6 using the alternative production method explained in Figures 7 to 9. Figure 10 shows a process stage in which the three first conductor structures 121i, 1212, 121a, which run parallel to one another in the vertical direction, as well as the main sections 142.1, 142.2,

[0044] 142.3 and 142.4 of the three second conductor structures 141i, 141a running parallel to each other in the horizontal direction,

[0045] 1413 were produced. For reasons of clarity, only the four main sections 142.1, 142.2, 142.3, 142.4 of the uppermost second conductor structure 141i have been provided with reference numerals. Depending on the application, the main sections 142.1, 142.2, 142.3, 142.4 of the second conductor structures 141i, 141a, 1413 can be produced in a common manufacturing process with the first conductor structures 121i, 1212, 121a, wherein the same material is preferably used for all structures. Alternatively, however, it is also possible to produce the main sections 142.1, 142.2, 142.3, 142.4 in a separate manufacturing process, wherein the same material is also preferably used for all structures. However, when manufacturing the main sections and the conductor structures separately, it is also possible to manufacture the main sections 142.1, 142.2, 142.3, 142.4 from a different material than the conductor structures 1211, 1211, 1213.The electrically conductive structures can be produced by depositing an electrically conductive material using the aerosol jetting process. Alternatively, other deposition and patterning methods are also possible, such as photolithographic patterning.

[0046] In a subsequent method step, insulation structures 130 are created in the intersection regions 150 of the conductor structure arrangement 112 by depositing a dielectric onto the respective first conductor structure 121i, 1212, 121a. This process stage is shown in Figure 11. Subsequently, the bridge sections 143 of the second conductor structures 141i, 1412, 141s are created in the respective intersection regions 150 by depositing an electrically conductive material onto the insulation structures 130 and the directly adjacent regions of the main sections 142.1, 142.2, 142.3, 142.4 of the second conductor structures 141i, 1412, 141s. This is preferably done using the aerosol jetting process. The material used for the bridge sections 143 can be either the material of the main sections 142.1, 142.2, 142.3, 142.4 or another electrically conductive material.

[0047] The separate production of the bridge sections of the conductor structures fundamentally also enables more complex conductor structure arrangements, in which the conductor structures overlap in many ways and for whose production typically more than two circuit levels are used. To illustrate this concept, Figure 12 shows an example of a corresponding matrix-shaped conductor arrangement 112, in which each conductor structure 121i, 1212, 121a, 141i, 141a, 1413 alternately runs above and below other conductor structures. Accordingly, both the horizontally running conductor structures 141i, 141a, 141a and the vertically running conductor structures 121i, 121a, 121a each alternately have corresponding bridge sections 143, 123 in the intersection regions 150.In principle, however, other conductor arrangements can also be realized using this concept, in which individual or multiple conductor structures cross over and under other conductor structures as desired.

[0048] Figure 13 illustrates an example of a further alternative embodiment of the conductor structures 121, 141 produced on the carrier substrate 110. To increase the optical transparency of the conductor structures 121, 141, the respective conductor structures 121, 141 can be formed in a network-like manner. In Figure 13, both the first conductor structure 121 and the second conductor structure 141, which surrounds the first conductor structure 121 in the intersection region 150, are each constructed from a plurality of interconnected conductor tracks 129, 149.

[0049] Figure 14 shows an intermediate product for a lighting device 300, which consists of a substrate 110 preferably equipped with a plurality of optoelectronic components 200 (such as mini-LEDs, micro-LEDs, etc.). The optoelectronic components 200 are electrically contacted in a suitable manner by means of the conductor structures 121, 141 arranged on the carrier substrate 110. For reasons of clarity, only one optoelectronic component 200 is shown here.

[0050] Figure 15, however, shows an example of the finished lighting device 300, which is designed, for example, in the form of a transparent display. The lighting device 300 additionally comprises transparent intermediate layers 310, 320, which enclose the intermediate product from Figure 14 on both sides, as well as two outer layers 330, 340 adjacent to the outer sides of the intermediate layers 310, 320, which are preferably also transparent. In principle, however, the transparent lighting device 300 can also be constructed differently. In principle, the corresponding substrates can also be used for other lighting devices, such as high-resolution illumination.

[0051] In the concept described here, multilayer substrates are preferably realized using a sequence of aerosol jetting steps. Single-layer structures can be produced quickly and cost-effectively with the corresponding resolution of L / S 10 pm using a printing process for electrically conductive materials such as metals (Ag, Cu, Ni, Au, Pt, Al, ...) in combination with a curing process using an aerosol print head. Multilayer substrates can be produced using an alternating printing process for metal and dielectric. This makes it fundamentally possible to create crossing points in the circuit using insulating bridges. This also eliminates the need for vias from one circuit level to another.

[0052] The invention has been illustrated and described in more detail using preferred embodiments. However, the invention is not limited to the disclosed examples. Rather, other variations may be derived therefrom by those skilled in the art without departing from the scope of the invention.LIST OF REFERENCE SYMBOLS Substrate Carrier substrate Surface of the carrier substrate Conductor arrangement first conductor group first conductor structure Main section of the first conductor structure Bridge section of the first conductor structure Net-shaped conductor tracks of the first conductor structure Isolation structure second conductor group second conductor structure Main section of the second conductor structure Bridge section of the second conductor structure Net-shaped conductor tracks of the second conductor structure Intersection region Matrix-shaped arrangement of conductor structures Component Lighting device , 320 Transparent intermediate layer , 340 Transparent outer layer Aerosol jetting device Atomizer Access opening Feed line Aerosol print head Gas feed opening Nozzle Aerosol mist High-speed particle stream.

Claims

PATENT CLAIMS 1. A method for producing a substrate (100) for a lighting device (300), comprising the steps: - providing a carrier substrate (110), - Producing a conductor arrangement (112) with at least a first and a second conductor structure (121, 141) on the carrier substrate (110), wherein the second conductor structure (141) crosses the first conductor structure (121) in at least one crossing region (150), and wherein at least one section (143) of the second conductor structure (141) arranged in the respective crossing region (150) is produced by depositing a metallic material using an aerosol jetting process, wherein main sections (142) of the at least one second conductor structure (141) arranged outside the at least one crossing region (150) and electrically separated from one another are produced in a joint process with the at least one first conductor structure (121), wherein an insulation structure (130) is produced in the at least one crossing region (150),and wherein in a further step, in the at least one crossing region (150), a bridge section (143) of the second conductor structure (141) electrically connecting two separate main sections (142) of the second conductor structure (141) is produced on the insulation structure (130).

2. The method according to claim 1, wherein in the crossing region (150) the insulation structure (130) is produced by depositing an insulation material on the first conductor structure (121).

3. The method according to claim 2, wherein the insulation structure (130) is formed by depositing a Insulation material is produced using an aerosol jetting process.

4. The method according to any one of the preceding claims, wherein at least one section (143) of the second conductor structure (141) arranged outside the respective crossing region (150) is produced by depositing the metallic material using the aerosol jetting method.

5. Method according to one of the preceding claims, wherein at least a part of the conductor structures (121, 141) is formed from a plurality of conductor tracks (149) arranged in a network and electrically connected to one another.

6. The method according to any one of the preceding claims, wherein each of the conductor structures (121, 141) of the conductor arrangement (112) is produced at least partially by depositing a metallic material on the carrier substrate (110) using the aerosol jetting method.

7. Method according to one of the preceding claims, wherein the second conductor structure (141) is crossed by at least one other conductor structure (121) in a further crossing region (150).

8. Method according to one of the preceding claims, wherein the sections (122, 123, 142, 143) of the conductor structures (121, 141) produced by means of the aerosol jetting method are produced from a metallic material containing silver, copper, nickel, gold, platinum and / or aluminum.

9. Substrate (100) produced by a method according to one of the preceding claims, the substrate (100) comprising: - a carrier substrate (110), - a conductor arranged on the carrier substrate (110) A conductor structure arrangement (120, 140) having at least one first electrical conductor structure (121) and a second electrical conductor structure (141) crossing the first electrical conductor structure (121) in at least one crossing region (150), wherein an insulation structure (130) is arranged in the crossing region (150) between the first and the second electrical conductor structure (141), wherein the insulation structure (130) and at least one part of the first and / or second electrical conductor structure (141) arranged in the crossing region (150) is designed in the form of a structure produced using an aerosol jetting process.

10. Substrate (100) according to claim 9, wherein main sections (142) of the at least one second conductor structure (141) arranged outside the at least one crossing region (150) and electrically separated from one another are produced in a common process with the at least one first conductor structure (121), and wherein in the crossing region (150) a bridge section (143) of the second conductor structure (141) electrically connecting two separate main sections (142) of the second conductor structure (141) to one another is arranged on the insulation structure (130).

11. Substrate (100) according to claim 9 or 10, wherein the conductor structures (121, 141) are arranged in a matrix in at least a partial region of the conductor arrangement (112).

12. Substrate (100) according to claim 9 to 11, wherein at least a part of the conductor structures (121, 141) is formed from a plurality of interconnected conductor tracks (129, 149) arranged in a network.

13. Substrate (100) according to one of claims 9 to 12, wherein the sections (123, 143) of the conductor structures (121, 141) produced by means of the aerosol jetting process consist of a metallic material containing silver, copper, nickel, gold, platinum and / or aluminum.

14. Lighting device (300) with a substrate (100) according to one of claims 9 to 13, comprising at least one optoelectronic component (200) arranged on the substrate (100) and electrically contacted by means of at least one electrical conductor structure (121, 141) of the substrate (100).

15. Lighting device (300) according to claim 14, wherein the lighting device (300) is designed in the form of a transparent display and comprises a transparent carrier substrate (110) and a plurality of optoelectronic components (200) arranged next to one another on the transparent carrier substrate (100) and electrically contacted by means of the electrical conductor structures (121, 141) formed on the surface (111) of the transparent carrier substrate (110).

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