Laminated electronic component

Abstract

In this laminated electronic component, an active portion has dielectric layers and internal electrodes which are alternately laminated in a lamination direction. A cover overlaps the active portion from a first side in the lamination direction. A base electrode overlaps the cover from the first side. The active portion has an end surface facing a third side among the third side and a fourth side in a first direction intersecting the lamination direction. Each of the plurality of internal electrodes has an exposed edge that is exposed from the end surface. At least some of the plurality of exposed edge portions have different positions in the first direction. The base electrode is positioned in a region on the third side among the surface of the cover on the first side. Among the plurality of exposed edge portions, the position of the exposed edge portion positioned closest to the fourth side is referred to as the deepest position. At this time, the edge portion of the base electrode on the third side is positioned at the same position as the deepest position or more on the fourth side than the deepest position.

Description

Multilayer electronic components

[0001] The present disclosure relates to multilayer electronic components such as multilayer ceramic capacitors.

[0002] Multilayer ceramic capacitors are known as multilayer electronic components (see, for example, Patent Documents 1 and 2 below). A multilayer ceramic capacitor has, for example, a main body that directly functions as a capacitor and external electrodes for mounting the capacitor on a circuit board or the like. The main body has alternately stacked dielectric layers and flat internal electrodes. The edges of the internal electrodes are exposed from the side surfaces (surfaces along the stacking direction) of the main body. The external electrodes are, for example, made of metal layers, and cover the side surfaces of the main body as well as regions of the top and bottom surfaces of the main body that are close to the side surfaces.

[0003] Patent Document 1 discloses a capacitor in which the side surfaces of the main body are formed in a concave shape. Patent Document 2 discloses a capacitor in which base electrodes are provided on the side, top, and bottom surfaces of the main body, and external electrodes are formed by depositing metal on the base electrodes by plating.

[0004] JP 2000-49032 A JP 2023-13421 A

[0005] A multilayer electronic component according to one aspect of the present disclosure includes an effective portion, a first cover, and a first base electrode. The effective portion includes dielectric layers and internal electrodes alternately stacked in a stacking direction. The first cover overlaps the effective portion from the first side of a first side and a second side in the stacking direction. The first base electrode overlaps the first cover from the first side. The effective portion has an end face facing the third side of a third side and a fourth side in a first direction intersecting the stacking direction. The multiple internal electrodes include two or more internal electrodes each having an exposed edge exposed from the end face. The first base electrode is located in the third side region of the first side surface of the first cover.

[0006] In one example, the positions of at least some of the exposed edge portions in the first direction are different from each other. When the position of the exposed edge portion closest to the fourth side among the exposed edge portions is referred to as the innermost position, the edge portion on the third side of the first base electrode is located at the same position as the innermost position or on the fourth side of the innermost position.

[0007] In one example, a first end surface on the third side of the first base electrode is inclined with respect to the stacking direction so as to be positioned closer to the fourth side as it approaches the first side.

[0008] 3 is a perspective view showing a capacitor according to a first embodiment; a schematic exploded perspective view of the capacitor of FIG. 1; a cross-sectional view taken along line III-III of FIG. 1; an enlarged view of region IV of FIG. 3; a cross-sectional view showing another example of a side surface of a capacitor; a perspective view showing a capacitor according to a second embodiment; and a cross-sectional view showing a side surface of a capacitor according to a comparative example.

[0009] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. The drawings used in the following description are schematic. Therefore, for example, the dimensional ratios in the drawings do not necessarily correspond to the actual ones. Furthermore, the dimensional ratios may not match between drawings. Certain shapes and / or dimensions may be exaggerated, and details may be omitted. However, the above does not deny that the actual shapes and / or dimensions may be as shown in the drawings, or that features of shapes and / or dimensions may be extracted from the drawings.

[0010] Regarding the embodiments described relatively later, basically, only the differences from the embodiments described relatively earlier will be described. Matters not specifically mentioned may be considered to be the same as the embodiments described earlier or may be inferred from the embodiments described earlier. For convenience, the same reference numerals may be used for corresponding components between different embodiments, even if there are differences.

[0011] In the following description, when referring to a "rectangle" (or rectangular shape), a "square" (or square shape), and a "rectangle" (or rectangular shape), the corners may be chamfered by a curved surface or the like, as long as the concept of the shape is valid. For example, a corner formed by two sides may be chamfered to a length of 1 / 5 or less, 1 / 10 or less, or 1 / 20 or less of the length of the shorter of the two sides. It goes without saying that, when viewed microscopically, the corners may be rounded due to manufacturing precision (errors). The same applies to other polygons, etc.

[0012] When referring to the thickness of various layers, unless otherwise specified, the thickness refers to the thickness of the portion with a constant thickness. For example, as described below, the base electrode may be a layer with a basically constant thickness, but the thickness may be considered to vary at the edges. However, when it is said that the base electrode is thicker than the internal electrode, such variations in thickness at the edges are not taken into account unless otherwise specified.

[0013] (Overview of the Embodiments) Fig. 1 is a perspective view showing a capacitor 1 (an example of a multilayer electronic component) according to a first embodiment. For convenience, Fig. 1 and other figures described below are illustrated with a Cartesian coordinate system D1D2D3. The capacitor 1 may be used with either side designated as upper or lower. However, in the description of the embodiments, for convenience, the +D3 side may be designated as upper, and terms such as upper surface and lower surface may be used.

[0014] The capacitor 1 is, for example, a multilayer ceramic capacitor. The capacitor 1 has a roughly rectangular parallelepiped body 3 and four external electrodes 5 located at the four corners of the body 3 in a plan view (as viewed in the direction D3). The external electrodes 5 contribute to electrical connection between the capacitor 1 and other electronic components (for example, a circuit board (not shown)).

[0015] Fig. 3 is a cross-sectional view taken along line III-III in Fig. 1. Fig. 3 shows a D1D3 cross-section taken through the external electrode 5 on the +D2 side. However, the D1D3 cross-section taken through the external electrode 5 on the -D2 side, the D2D3 cross-section taken through the external electrode 5 on the -D1 side, and the D2D3 cross-section taken through the external electrode 5 on the +D1 side are basically the same. In explaining the embodiments, for convenience, the positional relationships between components may be explained using the terms D1, D2, and D3 without any particular mention, assuming the cross-section shown in Fig. 3.

[0016] The main body 3 has, for example, an active portion 11, two covers 13 respectively overlapping the upper and lower surfaces of the active portion 11, and an underlayer 15 overlapping the surface of each cover 13 opposite the active portion 11. The active portion 11 has a plurality of alternating dielectric layers 7 and a plurality of internal electrodes 9. The multiple internal electrodes 9 include a plurality of first internal electrodes 9A and a plurality of second internal electrodes 9B. Each underlayer 15 has, for example, four underlayer electrodes 16 at positions corresponding to the positions of the four external electrodes 5.

[0017] The active portion 11 directly functions as a capacitor. The cover 13 contributes, for example, to protecting and strengthening the main body portion 3. The base electrode 16 contributes, for example, to depositing a metal that will become the external electrode 5 by plating and / or improving the adhesive strength of the external electrode 5 to the main body portion 3.

[0018] Of the outer surfaces of the effective portion 11, the side surface facing the -D1 side is referred to as the end surface 11c. The -D1 side can be said to be one side (an example of a third side) in a direction (D1 direction) intersecting the stacking direction (D3 direction) of the dielectric layers 7 and the internal electrodes 9. A portion of the edge of the first internal electrode 9A (sometimes referred to as the exposed edge portion 9c) is exposed from the end surface 11c. The external electrode 5 on the -D1 side covers the end surface 11c and is fixed to the exposed edge portion 9c. This electrically connects the first internal electrode 9A and the external electrode 5.

[0019] FIG. 4 is an enlarged view of region IV in FIG. 3. The end surface 11c has, for example, a recessed portion 11d recessed toward the +D1 side. As a result, at least some (two or more) of the exposed edge portions 9c of the multiple first internal electrodes 9A are positioned differently in the D1 direction. Here, the position of the exposed edge portion 9c located furthest toward the +D1 side (an example of the fourth side) among the multiple exposed edge portions 9c is referred to as the innermost position P1. In this case, the edge portion on the −D1 side of the base electrode 16 (an example of a first base electrode) on the +D3 side (and the −D1 side) is located at the same position as the innermost position P1 or closer to the +D1 side than the innermost position P1. The same is true for the base electrode 16 (an example of a second base electrode) on the −D3 side (and the −D1 side).

[0020] In this configuration, for example, as will be described in detail later, the likelihood of forming a protrusion 5z (see FIG. 7) on the external electrode 5 is reduced. As a result, for example, when mounting the capacitor 1 on a circuit board (not shown), the likelihood of misalignment due to the protrusion 5z is reduced. Furthermore, for example, when the suction nozzle that has picked up the capacitor 1 is lowered toward the circuit board, the likelihood of the capacitor 1 being subjected to an unintended force from the circuit board is reduced. Consequently, the likelihood of cracks occurring in the external electrode 5 is reduced.

[0021] From this embodiment, it is also possible to extract features different from the positional relationship between the base electrode 16 and the innermost position P1 as described above. For example, in Fig. 4, the end face 16c (an example of a first end face) on the -D1 side (an example of a third side) of the base electrode 16 (an example of a first base electrode) on the +D3 side (an example of a first side) is inclined with respect to the D3 direction (an example of a stacking direction) so as to be positioned closer to the +D1 side (an example of a fourth side) as it approaches the +D3 side. Such features may be extracted.

[0022] If the end face 16c of the base electrode 16 is inclined as described above, for example, as will be described in detail later, the probability of forming the protrusion 5z is reduced. That is, the same or similar effect as the effect obtained by the above-described positional relationship between the edge of the base electrode 16 and the innermost position P1 is achieved. Furthermore, by combining the above-described positional relationship with the inclination of the end face 16c, the probability of forming the protrusion 5z is further reduced.

[0023] When the feature related to the inclination of the end face 16c is extracted as described above, the positional relationship between the base electrode 16 and the innermost position P1 may or may not be established. Furthermore, the positions of at least some (two or more) of the multiple exposed edge portions 9c in the direction D1 may be different from each other or may be the same as each other.

[0024] The above is an overview of the embodiments. Specifically, the embodiments will be described roughly in the following order: 1. Structure of the capacitor according to the first embodiment (FIGS. 1 to 3) 1.1. Overall structure 1.2. Active portion 1.3. Cover 1.4. Base electrode 1.4.1. Overview 1.4.2. Thickness 1.4.3. Materials 1.5. External electrode 2. Structure relating to the end of the base electrode 2.1. Edge position of the base electrode 2.2. Example of the shape of the side surface of the main body (FIGS. 4 and 5) 2.3. Slope of the end face of the base electrode 3. Method of manufacturing the capacitor 4. Structure of a capacitor according to another embodiment (FIG. 6) 5. Summary of the embodiment

[0025] (1. Configuration of the Capacitor According to the First Embodiment) (1.1. Overall Configuration) The capacitor 1 shown in FIG. 1 is configured, for example, as a surface-mounted chip component. Specifically, for example, the capacitor 1 is placed with the −D3 side or +D3 side facing a circuit board (not shown). Then, the four pads on the circuit board and the four external electrodes 5 are respectively joined with a conductive bonding material (for example, solder) (not shown), thereby mounting the capacitor on the circuit board.

[0026] The configuration (internal structure and external shape) of the capacitor 1 is, for example, approximately plane-symmetric with respect to a plane of symmetry (not shown) that is parallel to the D1D2 plane and passes through the center of the thickness direction (D3 direction) of the capacitor 1. Furthermore, the configuration of the capacitor 1 is, for example, rotationally symmetric by 180° when viewed in the D3 direction. Of course, the capacitor 1 does not have to have such symmetry.

[0027] The shape of the main body 3 is, for example, a generally thin rectangular parallelepiped. This rectangular parallelepiped may be square (as in the illustrated example) or rectangular (excluding squares; the same applies below) in plan view. For convenience, in the description of the embodiments, a square shape may be assumed unless otherwise specified.

[0028] The specific dimensions of the main body 3 (or capacitor 1) are arbitrary. To give an example of dimensions when the capacitor 1 is relatively small, the lengths of the main body 3 (or capacitor 1) in the D1 and D2 directions may each be 0.030 mm or more and 0.200 mm or less. When the length in the D1 direction is L and the length in the D2 direction is W, L / W may be 0.5 or more and 2.0 or less. The thickness in the D3 direction may be 0.030 mm or more and 0.200 mm or less. When the surface of the main body 3 is not flat, for example, the maximum values ​​of the various dimensions may satisfy the above ranges (the same applies hereinafter to the various dimensions of other components unless a contradiction arises).

[0029] Unless otherwise specified, the examples of dimensions of each component described below are for a relatively small capacitor 1. Therefore, dimensions larger (or smaller) than the illustrated dimensions may be used.

[0030] A plurality of components of the same type (e.g., 5, 7, 9, 13, 15, 16, 17, 19, or 20, etc.) may basically (except for relatively small differences, for example; the same applies hereinafter) be provided with the same (or corresponding) shape, size, material, position, etc. unless otherwise specified or unless a contradiction occurs. Therefore, unless otherwise specified or unless a contradiction occurs, a description of one component may be considered to be common to a plurality of components of the same type.

[0031] A layered (film-like) component (e.g., 5, 7, 9, 15, 17, or 19) may be entirely made of one material, but may also be made of layers made of different materials.

[0032] (1.2. Effective Portion) The shape of the effective portion 11 shown in FIG. 3 is, for example, a generally thin rectangular parallelepiped. Its planar shape is basically the same as that of the main body portion 3. The specific thickness of the effective portion 11 is arbitrary. For example, the thickness of the effective portion 11 may be 30% or more, 40% or more, or 50% or more of the thickness of the main body portion 3, and may be 90% or less, 80% or less, or 70% or less. The above lower and upper limits may be combined arbitrarily. The thickness of the main body portion 3 is, for example, the thickness from the upper surface of the upper base electrode 16 to the lower surface of the lower base electrode 16. The thickness of the effective portion 11 is, for example, the thickness from the upper surface of the uppermost internal electrode 9 to the lower surface of the lowermost internal electrode 9.

[0033] The dielectric layer 7 is essentially a layer having a constant thickness (at least between the internal electrodes 9). The thickness of the dielectric layer 7 may be appropriately set depending on the characteristics required of the capacitor 1. Examples of relatively thin thicknesses include a thickness between adjacent internal electrodes 9 (between the first internal electrode 9A and the second internal electrode 9B) of 0.1 μm or more or 0.5 μm or more, and a thickness of 3.0 μm or less, 2.0 μm or less, or 1.0 μm or less. The above lower and upper limits may be combined arbitrarily. The shape and dimensions of the dielectric layer 7 in a planar view are basically the same as those of the active portion 11 in a planar view. The material of the dielectric layer is, for example, ceramic, and the specific type is also arbitrary. The number of laminated dielectric layers 7 (internal electrodes 9) is arbitrary. For example, the number may be 10 to 30.

[0034] The internal electrode 9 is a layer having a constant thickness. The thickness of the internal electrode 9 is arbitrary, and may be thinner, the same as, or thicker than the thickness of the region of the dielectric layer 7 between the internal electrodes 9. Examples of relatively thin thicknesses include the thickness of the internal electrode 9 being 0.3 μm or more or 0.5 μm or more, and 3.0 μm or less, 2.0 μm or less, or 1.0 μm or less. The above lower and upper limits may be combined arbitrarily. The material of the internal electrode 9 is, for example, a metal. The specific type of metal is arbitrary, and for example, the entire or main component (e.g., 60 mass% or more of a component; the same applies hereinafter) is a base metal (e.g., Ni and / or Cu).

[0035] Fig. 2 is an exploded perspective view of the capacitor 1. Fig. 2 is a schematic diagram for understanding the shapes and relative positions of the internal electrodes 9, etc. Therefore, Fig. 2 shows a smaller number of various layers than Fig. 3.

[0036] The internal electrode 9 has, for example, a rectangular (square in the illustrated example) electrode body 9a in a plan view and a pair of lead electrodes 9b extending from a pair of opposing corners of the electrode body 9a. The electrode body 9a is located inside the outer edge of the dielectric layer 7 and is not exposed from the side surface of the effective portion 11. The pair of lead electrodes 9b reach the outer edge of the dielectric layer 7 and are connected to a pair of external electrodes 5 located at a pair of opposing corners of the main body portion 3.

[0037] The first internal electrode 9A and the second internal electrode 9B face each other across the dielectric layer 7. A pair of lead electrodes 9b of the first internal electrode 9A and a pair of lead electrodes 9b of the second internal electrode 9B are located on different diagonal lines in a planar perspective view, and are connected to different pairs of external electrodes 5.

[0038] The electrode body 9 a and the extraction electrode 9 b may have any dimensions. For example, the length of the extraction electrode 9 b on one side of the dielectric layer 7 (i.e., the length of the exposed edge 9 c) is approximately the same as the length of the external electrode 5 along the side.

[0039] (1.3. Cover) The cover 13 shown in FIG. 3 is, for example, a layer having a shape and dimensions that overlap the effective portion 11 without excess or deficiency. The thickness of the cover 13 is approximately constant in both the region where the base electrode 16 is disposed and the region where the base electrode 16 is not disposed. The ratio of the thickness of the cover 13 to the thickness of the main body portion 3 may be approximately the reverse of the ratio of the thickness of the effective portion 11 to the thickness of the main body portion 3 (as described above). For example, in an embodiment in which covers 13 are provided on both sides in the D3 direction, the thickness of one cover 13 may be, for example, 5% or more, 10% or more, or 15% or more of the thickness of the main body portion 3, or 35% or less, 30% or less, or 25% or less. The above lower and upper limits may be arbitrarily combined. The thickness of the cover 13 is, for example, the thickness in the region that overlaps the internal electrode 9 but does not overlap the base electrode 16 (i.e., the region that is not crushed by the base electrode 16).

[0040] Each cover 13 has, for example, multiple (two in the example of FIG. 3 ) insulating layers 17 and at least one (one in the example of FIG. 3 ) dummy layer 19 located between the multiple insulating layers 17. Each dummy layer 19 has, for example, four dummy electrodes 20 at positions corresponding to the positions of the four external electrodes 5. The dummy electrodes 20 contribute to, for example, reinforcing the cover 13 and / or improving the connection strength between the main body 3 and the external electrodes 5, and also function as a base for the external electrodes 5 in an embodiment in which the external electrodes 5 are formed by plating. Unlike the example shown in the figure, the cover 13 may have only one or more insulating layers 17 (it may not have a dummy layer 19).

[0041] The insulating layers 17 and the dummy layers 19 are alternately stacked one on top of the other. In other words, the dummy layers 19 are provided at the boundaries of all the insulating layers 17. Unlike the illustrated example, the dummy layers 19 may be provided only at some of the boundaries. For example, the dummy layers 19 may not be provided at one or more boundaries relatively close to the effective portion 11, and the dummy layers 19 may be provided only at one or more boundaries relatively far from the effective portion 11. However, in such a case, two or more insulating layers 17 that are in close contact with each other without a dummy layer 19 interposed therebetween may be regarded as a single insulating layer 17.

[0042] The insulating layer 17 is a layer having a substantially constant thickness, excluding variations in thickness resulting from the presence or absence of overlap with the conductor layers (9, 15, and 19). The planar shape of the insulating layer 17 is, for example, basically the same as the planar shape of the dielectric layer 7. The material of the insulating layer 17 is arbitrary. For example, the material of the insulating layer 17 may be the same as or different from the material of the dielectric layer 7. Furthermore, the material of the insulating layer 17 may be, for example, ceramics or a material other than ceramics.

[0043] The thickness of the insulating layer 17 is arbitrary. For example, the thickness of the insulating layer 17 may be thicker (in the illustrated example), equal to, or thinner than the thickness of the dielectric layer 7 (both of which are thicknesses between conductor layers or thicknesses of regions not overlapping conductor layers; the same applies hereinafter in this paragraph). For example, the thickness of the insulating layer 17 may be two or more, three or more, or five or more times the thickness of the dielectric layer 7, and may be 20 or less, 10 or less, or 5 or less times the thickness of the dielectric layer 7. The above lower and upper limits may be combined in any combination. For example, the thickness of the insulating layer 17 may be 1.0 μm or more or 2.0 μm or more, and may be 10.0 μm or less or 5.0 μm or less. The above lower and upper limits may be combined in any combination. Note that an insulating layer overlapping the uppermost internal electrode 9 may be considered to be the insulating layer 17, not the dielectric layer 7, regardless of its material and thickness. The same applies to an insulating layer overlapping the lowermost internal electrode 9.

[0044] The dummy electrode 20 is, for example, a layer having a substantially constant thickness. The material of the dummy electrode 20 is, for example, a metal. The specific type of metal is arbitrary, and for example, the entire or main component thereof is a base metal (e.g., Ni and / or Cu). The material of the dummy electrode 20 may be the same as or different from the material of the internal electrode 9. The position, shape, and size of the dummy electrode 20 are arbitrary in plan view. In the examples of FIGS. 2 and 3 , the position, shape, and size of the dummy electrode 20 are such that, in plan perspective, they overlap approximately exactly with the external electrode 5 (however, the external electrode 5 is slightly wider). The dummy electrode 20 is exposed, for example, on the side surface of the main body 3. This exposed portion is fixed to the external electrode 5.

[0045] The thickness of the dummy electrode 20 is arbitrary. For example, the thickness of the dummy electrode 20 may be thicker than, equal to, or thinner than the thickness of the internal electrode 9 (as in the illustrated example). For example, the thickness of the dummy electrode 20 may be 1 time or more, 1.5 times or more, or 2 times or more, or 10 times or less, 5 times or less, or 2 times or less, of the thickness of the internal electrode 9. The above lower and upper limits may be combined in any combination. For example, the thickness of the dummy electrode 20 may be 0.3 μm or more, 0.5 μm or more, 1.0 μm or more, or 2.0 μm or more, or 10.0 μm or less, 5.0 μm or less, 3.0 μm or less, or 2.0 μm or less. The above lower and upper limits may be combined in any combination. The thickness of the dummy electrode 20 may be thinner than, equal to, or thicker than the thickness of the insulating layer 17 (as in the illustrated example).

[0046] (1.4. Base Electrode) (1.4.1. Overview) The base electrode 16 is, for example, a layer having a substantially constant thickness. The material of the base electrode 16 is, for example, a metal. The specific type of metal is arbitrary, and, for example, the entire or main component thereof is a base metal (for example, Ni and / or Cu). The material of the base electrode 16 may be the same as or different from the material of the internal electrode 9 and / or the material of the dummy electrode 20. In a plan view, the position, shape, and size of the base electrode 16 are arbitrary. In the examples of Figures 2 and 3, the position, shape, and size of the base electrode 16 are such that, in a planar perspective view, they approximately overlap with the external electrode 5 without excess or deficiency (however, the external electrode 5 is slightly wider).

[0047] (1.4.2. Thickness) The thickness of the base electrode 16 is arbitrary. For example, the thickness of the base electrode 16 may be thicker than, approximately the same as, or thinner than the thickness of the internal electrode 9 and / or the dummy electrode 20 (as in the illustrated example). For example, the thickness of the base electrode 16 may be two or more, three or more, or five or more times the thickness of the internal electrode 9 and / or the dummy electrode 20, and may be 20 or less, 10 or less, or 5 or less times the thickness of the internal electrode 9 and / or the dummy electrode 20. The above lower and upper limits may be combined in any combination. For example, the thickness of the base electrode 16 may be 2.0 μm or more, 3.0 μm or more, or 5.0 μm or more, and may be 20.0 μm or less, 10.0 μm or less, or 5.0 μm or less. The above lower and upper limits may be combined in any combination. The thickness of the base electrode 16 may be thinner than, equal to, or thicker than the thickness of the insulating layer 17 (as shown in the example).

[0048] The thickness from the surface (lower surface) on the -D3 side of the base electrode 16 on the +D3 side to the surface (upper surface) on the +D3 side of the base electrode 16 on the -D3 side is referred to as the first thickness. In the illustrated example, the first thickness is the total thickness of the active portion 11 and the covers 13 on both sides thereof. The thickness of the base electrode 16 may be, for example, 0.03 times or more, 0.06 times or more, or 0.09 times or more of the first thickness, or 0.20 times or less, 0.17 times or less, or 0.14 times or less. The above lower limit and upper limit may be combined arbitrarily.

[0049] (1.4.3. Material) The material of the base electrode 16 may be a metal as described above, but may also contain a ceramic material in addition to the metal. If the base electrode 16 contains a ceramic material, the likelihood of the base electrode 16 being excessively scraped off by, for example, barrel polishing (described later) is reduced. On the other hand, because the primary purpose of the base electrode 16 is not to provide electrical conductivity, there is little likelihood of any inconvenience occurring even if the electrical resistivity is increased by the ceramic material. Not only the base electrode 16, but also other conductive components (e.g., the internal electrode 9 and / or the dummy electrode 20) may contain a ceramic material in addition to the metal.

[0050] In an embodiment in which the insulating layer 17 of the cover 13 is made of a ceramic material, the ceramic material of the insulating layer 17 may diffuse into the base electrode 16, even if the material of the base electrode 16 is not intended to contain a ceramic material. The embodiment in which the base electrode 16 contains a ceramic material does not include diffusion due to such diffusion. If the manufacturing process is understood, it is clear whether the base electrode 16 contains a ceramic material without diffusion. In a finished product, whether the base electrode 16 contains a ceramic material may be determined, for example, by whether a significant volume percentage or mass percentage (see, for example, the lower limit value described below) of the ceramic material is contained in a position sufficiently distant from the cover 13.

[0051] The specific type of ceramic material contained in the base electrode 16 is arbitrary. For example, when the dielectric layer 7 of the active portion 11 and / or the insulating layer 17 of the cover 13 are made of a ceramic material, the ceramic material contained in the base electrode 16 may be the same as or different from the ceramic material (whole or main component) of either or both of these. Examples of the ceramic material (whole or main component) include barium titanate (BaTiO ３ ), titanium dioxide (TiO ２ ), strontium titanate (SrTiO ３ ), calcium titanate (CaTiO ３ ) and calcium zirconate (CaZrO ３ ) are listed.

[0052] The volume percentage and / or mass percentage (hereinafter sometimes referred to as "content percentage") of the ceramic material in the base electrode 16 is arbitrary. The content percentage of the ceramic material in the base electrode 16 may be greater than the content percentage of the ceramic material in the internal electrode 9 and / or the dummy electrode 20, for example. In this regard, the content percentage of the latter may be 0, and the former and latter ceramic materials may be entirely or mainly composed of the same type, or may be different types. Unlike the above, the content percentage of the former may be equal to or less than the content percentage of the latter.

[0053] Examples of the content ratio of the ceramic material in the base electrode 16 are as follows. For example, the volume percentage may be 10 volume percent or more, 20 volume percent or more, or 30 volume percent or more, and may be 80 volume percent or less, 70 volume percent or less, or 60 volume percent or less. The above lower and upper limits may be combined arbitrarily. Furthermore, the mass percentage may be 3 mass percent or more, 5 mass percent or more, 10 mass percent or more, or 20 mass percent or more, and may be 40 mass percent or less, 30 mass percent or less, or 20 mass percent or less. The above lower and upper limits may be combined arbitrarily.

[0054] For clarity, the volume percentage of the ceramic material refers to the ratio of the volume of the ceramic material to the unit volume of the target electrode (e.g., base electrode 16). Similarly, the mass percentage of the ceramic material refers to the ratio of the mass of the ceramic material to the unit mass of the target electrode (e.g., base electrode 16). The volume percentage and mass percentage may be determined by weighing the electrode material when it is produced, or by analyzing the completed capacitor 1. In the latter case, for example, the volume percentage may be determined based on a cross-sectional image acquired at an appropriate magnification using a scanning electron microscope (SEM). The mass percentage may be determined based on quantitative analysis using, for example, X-ray fluorescence (XRF) or wavelength dispersive X-ray spectroscopy (WDX).

[0055] As described above, at the interface between an electrode (e.g., base electrode 16) and a ceramic layer (e.g., insulating layer 17) that are in contact with each other, the latter ceramic material may diffuse into the former material. In this embodiment, when the content ratio is determined from the finished product, for example, the content ratio in a region where diffusion does not occur may be determined as the content ratio in the electrode. In cases where diffusion also affects the content ratio at positions away from the interface, the content ratio in a central thickness range obtained by dividing the thickness of the electrode into thirds may be determined as the content ratio in the electrode. Within the electrode, the ceramic material may be unevenly distributed, regardless of the influence of the diffusion. When the content ratio is determined from the finished product, the content ratio may be determined in a wide region and / or multiple regions to the extent that the influence of such uneven distribution is negligible, and the average value may be determined as the content ratio in the electrode.

[0056] (1.5. External Electrode) The external electrode 5 is, for example, a layer having a substantially constant thickness. The material of the external electrode 5 is, for example, a metal. The specific type of metal is arbitrary, and for example, the entire or main component thereof is a base metal (for example, Ni and / or Cu). Furthermore, the external electrode 5 may be formed by laminating different materials as necessary. For example, the external electrode 5 may be formed by laminating Cu, Ni, and Sn from the side of the base electrode 16. The material of the external electrode 5 may be the same as or different from the material of the internal electrode 9, the material of the dummy electrode 20, and / or the material of the base electrode 16.

[0057] As shown in FIG. 1 , the external electrodes 5 cover the four surfaces (top, bottom, and two side surfaces) of the main body 3, for example, roughly at the corners of the main body 3 in a plan view. This allows one external electrode 5 to be connected to one extraction electrode 9b on two side surfaces of the main body 3, and also makes it possible to surface mount the capacitor 1 on either the top or bottom surface. The shape and dimensions of the portions of the external electrodes 5 on each surface are arbitrary. The planar shape of the portion of the external electrode 5 located on the top or bottom surface of the main body 3 is, for example, rectangular (square in the illustrated example). Furthermore, the planar shape and dimensions of the portion of the external electrode 5 located on the side surface of the main body 3 are, for example, rectangular with the same horizontal length as the portion located on the top or bottom surface.

[0058] The thickness of the external electrode 5 is arbitrary. For example, the thickness of the external electrode 5 may be thicker than the thicknesses of the internal electrode 9, the dummy electrode 20, and the base electrode 16. For example, the thickness of the external electrode 5 may be 1.2 times or more, 2 times or more, or 3 times or more the thickness of the base electrode 16, or 10 times or less, 5 times or less, or 3 times or less. The above lower limit and upper limit may be combined arbitrarily. Furthermore, for example, the thickness of the external electrode 5 may be 3 μm or more, 5 μm or more, or 10 μm or more, or 30 μm or less, 20 μm or less, or 10 μm or less. The above lower limit and upper limit may be combined arbitrarily.

[0059] (2. End of Base Electrode) (2.1. Edge Position of Base Electrode) As described with reference to FIG. 4 , the edge on the −D1 side of the base electrode 16 is located at the innermost position P1 in the D1 direction, or is located on the +D1 side of the innermost position P1 (hereinafter, for convenience, this may be referred to as “Requirement A”). In the example of FIG. 4 , the end face 16 c of the base electrode 16 is inclined. In other words, the position of the −D1 side edge of the base electrode 16 is different between the upper surface and the lower surface. In this way, when the position of the −D1 side edge of the base electrode 16 differs depending on the position in the D3 direction, the position closest to the −D1 side may be referred to as the position of the −D1 side edge of the base electrode 16. Note that the position of the edge of the center of the end face 16 c in the D3 direction may be located closest to the −D1 side (see FIG. 7 described later). If the position of the edge of the internal electrode 9 on the −D1 side differs between the upper surface and the lower surface (if the position of the edge of the internal electrode 9 on the −D1 side differs depending on the position in the D3 direction), the position closest to the +D1 side may be referenced, as opposed to the above. In other words, whether requirement A is met may be strictly determined.

[0060] Focus on one base electrode 16. The base electrode 16 and the internal electrode 9 (exposed edge portion 9c) have a length in the D2 direction. Therefore, there are an infinite number of cross sections like the one shown in FIG. 4 . Requirement A does not need to be satisfied for all of the cross sections. For example, requirement A may be satisfied over one-third or more, one-half or more, or two-thirds or more of the length of the base electrode 16 in the D2 direction. Of course, requirement A may also be satisfied over the entire length of the base electrode 16 in the D2 direction.

[0061] Whether or not requirement A is satisfied within the above length range may be determined, for example, based on a predetermined number (e.g., 3, 5, or 10) of D1D3 cross-sectional images set at equal distances along the length of the base electrode 16 in the D2 direction. If it is difficult to extract multiple cross-sectional images from one capacitor 1, multiple cross-sectional images may be extracted from multiple capacitors 1 of the same type. The cross-sectional images may be acquired at an appropriate magnification using, for example, an SEM.

[0062] In the example of FIGS. 1 to 3 , the base electrodes 16 are located at four corners on each of the upper and lower surfaces of the main body 3, and a total of eight base electrodes 16 are provided. Requirement A does not need to be met for all of the multiple (eight) base electrodes 16. Furthermore, each base electrode 16 may satisfy requirement A in both the D1 direction and the D2 direction, but it is not necessary for requirement A to be met in both directions. Therefore, for example, requirement A may be met in only one direction for only one base electrode 16. Of course, requirement A may be met for all base electrodes 16 and in all directions (limited to those in which requirement A can be met).

[0063] It has been stated that requirement A does not have to be met for all cross sections, etc. This explanation may also be applied to the dimensions, etc. described below. The same applies to requirements B and C, which will be described later, and the dimensions, etc. described in conjunction with these. For example, in the above explanation, the term requirement A may be replaced with the term requirement B or requirement C, as long as no contradiction, etc., arises.

[0064] When the innermost position P1 (FIG. 4) and the D1 direction position of the edge of the base electrode 16 on the −D1 side are the same, a difference of, for example, less than 0.5 μm is acceptable. Furthermore, when the D1 direction position of the edge of the −D1 side of the base electrode 16 is located on the +D1 side of the innermost position P1, the distance between them (in the D1 direction) is arbitrary. For example, the distance may be 0.5 μm or more, 1 μm or more, or 3 μm or more, and may be 10 μm or less or 5 μm or less. The above lower and upper limits may be combined in any combination. Furthermore, for example, the distance may be 0.01 times or more, 0.05 times or more, or 0.10 times or more the thickness of the main body portion 3, and may be 0.30 times or less, 0.20 times or less, or 0.10 times or less. The above lower and upper limits may be combined in any combination.

[0065] The degree of difference in the positions of the exposed edge portions 9c of the multiple first internal electrodes 9A in the D1 direction is arbitrary. For example, the difference between the position of the exposed edge portion 9c located furthest to the -D1 side (sometimes referred to as the "outermost position P2") and the innermost position P1 may be 0.5 μm or more, 1 μm or more, 2 μm or more, or 3 μm or more, and may be 10 μm or less or 5 μm or less. The above lower limit and upper limit may be combined arbitrarily. Furthermore, the difference may be 0.05 times or more, 0.1 times or more, or 0.2 times or more, or may be 1.0 times or less or 0.5 times or less, relative to the thickness of the effective portion 11. The above lower limit and upper limit may be combined arbitrarily.

[0066] In an embodiment where requirement A is satisfied, the edge of the base electrode 16 on the −D1 side (an example of the third side) is located on the +D1 side (an example of the fourth side) of the outermost position P2 (hereinafter, this may be referred to as “requirement B”). Unlike the illustrated example, requirement B may be satisfied without requirement A being satisfied. The explanation regarding requirement A may be incorporated into requirement B as long as no contradiction arises. Just to be clear, for example, the reference edge position may be selected so that requirement B is strictly satisfied. Requirement B may be satisfied over at least one-third, at least one-half, at least two-thirds, or over the entire length of the base electrode 16 in the D2 direction. Requirement B may be satisfied in only one direction for only one base electrode 16, or may be satisfied for all base electrodes 16 and in all directions.

[0067] When requirement B is met, there is no restriction on the distance in the D1 direction between the outermost position P2 and the edge on the −D1 side of the base electrode 16. A specific example of the distance when requirements A and B are met may be obtained by combining the specific example (already described) of the distance in the D1 direction between the innermost position P1 and the edge on the −D1 side of the base electrode 16 and the specific example (already described) of the degree of difference in the positions of the multiple exposed edge portions 9 c in the D1 direction.

[0068] Furthermore, for example, regardless of whether requirement A is satisfied, the distance in the D1 direction between the outermost position P2 and the edge of the base electrode 16 on the -D1 side may be 0.5 μm or more, 1 μm or more, 3 μm or more, or 6 μm or more, and may be 30 μm or less, 20 μm or less, 10 μm or less, or 5 μm or less. The above lower and upper limits may be arbitrarily combined so as not to cause a contradiction. Furthermore, for example, the distance may be 0.01 times or more, 0.05 times or more, 0.10 times or more, or 0.30 times or more the thickness of the main body portion 3, and may be 1.5 times or less, 1.0 times or less, 0.50 times or less, 0.30 times or less, 0.20 times or less, or 0.10 times or less. The above lower and upper limits may be arbitrarily combined so as not to cause a contradiction.

[0069] (2.2. Example of the Shape of the Side of the Main Body) In the example shown in FIG. 4 , as described above, the end face 11c of the effective portion 11 has a concave portion 11d. As a result, the positions of the exposed edge portions 9c in the D1 direction of at least some (two or more) of the multiple first internal electrodes 9A are different from each other. More specifically, the side face (including the end face 11c) of the main body 3 has a shape in which the ridge portion between the upper and lower faces is chamfered by a curved surface. The concave portion 11d is located between the upper and lower chamfered faces (from another perspective, between the convex portions). Due to the above-mentioned chamfered faces, the positions of the edges of the upper and lower faces of the base electrode 16 in the D1 direction are different from each other, as described above (the end face 16c connecting the two faces is inclined).

[0070] The specific shapes and dimensions of the recessed portion 11d and the chamfered surface are arbitrary. For example, the shapes of the upper and lower chamfered surfaces may be asymmetric, and the recessed portion 11d may also be asymmetric. That is, the side surface of the main body portion 3 may have an asymmetrical shape from top to bottom. In the illustrated example, the region on the +D3 side of the side surface of the main body portion 3 is located closer to the -D1 side than the region on the -D3 side. Of course, the side surface of the main body portion 3 may also be symmetrical with respect to an axis of symmetry that passes through the center of the main body portion 3 from top to bottom and is parallel to the D1 direction. In a cross-sectional view, the recessed portion 11d may be entirely concave in a curved shape (as in the illustrated example), or may include linear portions in part or in most part.

[0071] Furthermore, for example, the position in the D3 direction of the apex of the portion of the side surface of the main body 3 that bulges toward the -D1 side may be located at the boundary between the effective portion 11 and the cover 13, or may be located on the cover 13, or may be located in the effective portion 11. Furthermore, for example, the recessed portion 11d may include the central portion of the end surface 11c in the D3 direction. Furthermore, for example, the deepest portion of the recessed portion 11d may be located at the center of the end surface 11c in the D3 direction, or may be shifted from the center. The recessed portion 11d may extend, for example, over one-half or two-thirds of the length of the end surface 11c in the D3 direction.

[0072] FIG. 5 is a cross-sectional view showing another example of the shape of the end face 11c of the effective portion 11 (and the side face of the main body portion 3), and corresponds to FIG.

[0073] In the example of Fig. 5, the end face 11c has a convex portion 11e that bulges toward the -D1 side, and as a result, the positions of the exposed edge portions 9c in the D1 direction of at least some (two or more) of the multiple first internal electrodes 9A are different from each other. More specifically, the side surface (including the end face 11c) of the main body 3 has a shape in which the ridges between its upper and lower faces are chamfered by curved surfaces, and thus presents a convex shape. In addition, the area between the upper and lower chamfered surfaces also presents a convex shape that bulges toward the -D1 side. The end face 11c has a convex portion 11e because both the upper and lower regions are located on the chamfered surfaces and / or because the central region is located on the convex surface between the chamfered surfaces.

[0074] Unlike the illustrated example, the area between the upper and lower chamfered surfaces may be flat. The end surface 11c may have a convex portion 11e by having both upper and lower regions located on the chamfered surfaces (from another perspective, the top surface of the convex portion 11e may be flat). The chamfered surface may be located above or below the end surface 11c, and the convex portion 11e may be formed solely by the convex surface between the chamfered surfaces. The upper and lower chamfered surfaces and the convex surface therebetween may or may not be distinguishable based on differences in their radii of curvature, etc. In the former case, the radius of curvature of the convex surface between the upper and lower chamfered surfaces may be larger (in the illustrated example) or smaller than the radius of curvature of the chamfered surface. In the latter case, a concave portion may be formed between the chamfered surface and the convex surface.

[0075] The specific shape and dimensions of the convex portion 11e (chamfered surfaces and / or the surfaces therebetween) are arbitrary. For example, the top and bottom shapes of the side surfaces of the main body 3 may be symmetrical (as in the illustrated example) or asymmetrical. Furthermore, for example, the convex portion 11e may include the central portion of the end surface 11c in the D3 direction. Furthermore, for example, the apex of the convex portion 11e may be located at the center of the end surface 11c in the D3 direction, or may be offset from the center. For example, the convex portion 11e may extend over at least half or at least two-thirds of the length of the end surface 11c in the D3 direction.

[0076] For the specific dimensions of the depth of the concave portion 11d and the height of the convex portion 11e, for example, the explanation of the specific example of the degree of difference in the position of the exposed edge portion 9c of the internal electrode 9 in the D1 direction may be used.

[0077] (2.3. Inclination of End Surface of Base Electrode) As already mentioned, in FIG. 4 or 5 , the −D1-side end surface 16c of the +D3-side base electrode 16 is inclined with respect to the D3 direction in a direction that moves more toward the +D1 side as it approaches the +D3 side (hereinafter, this may be referred to as “Requirement C”). In this regard, strictly speaking, the entire end surface 16c (from the ridge with the upper surface to the ridge with the lower surface) does not have to be inclined in the D3 direction. For example, the edge (corner) on the −D1 side of the lower surface of the +D3-side base electrode 16 may be rounded, so that the inclination in the above direction does not occur near the edge. For example, if an inclined surface is formed over 60% or more (more than half) or 80% or more (most) of the thickness (thickness of the portion with a constant thickness) of the base electrode 16, then Requirement C may be satisfied. Of course, the entire end surface 16c may be inclined (excluding rounding that is unavoidable from a microscopic manufacturing perspective).

[0078] 4 and 5 , at least a portion (all of the entire portion in the illustrated example) of the end face of the cover 13 on the base electrode 16 side is inclined. The surface (lower or upper surface) of the base electrode 16 on the cover 13 side, for example, does not overlap the inclined end face of the cover 13, but only overlaps the surface (upper or lower surface) of the cover 13 on the base electrode 16 side. The end face 16 c of the base electrode 16 is inclined because the thickness of the base electrode 16 becomes thinner toward the end. In other words, the inclined surface of the end face 16 c is not formed by the end of the base electrode 16, which has a constant thickness, overlapping the inclined end face of the cover 13 and inclining.

[0079] More specifically, for example, the position in the D1 direction of the edge of the surface of the base electrode 16 facing the cover 13 is the same as the position in the D1 direction of the edge of the surface of the cover 13 facing the base electrode 16 (in the illustrated example), or is located inside the latter position (on the +D1 side in FIGS. 4 and 5 ). Note that a relatively small difference between the above-mentioned same positions may exist. The difference may be, for example, 1 / 5 or less, 1 / 10 or less, or 1 / 20 or less of the length of the end face 16 c in the D1 direction, and / or 5 μm or less, 2 μm or less, or 1 μm or less.

[0080] From another perspective, the inclined surface of the end face of the cover 13 and the end face 16c (inclined surface) of the base electrode 16 are smoothly connected. In other words, both of them constitute the chamfered surface (as described above) of the main body 3. Unlike the illustrated example, for example, only the end face 16c of the base electrode 16 may constitute the chamfered surface of the main body 3.

[0081] As can be understood from the above description regarding the chamfered surface of the ridge between the side surface and the upper surface (or lower surface) of the main body 3, the specific shape and dimensions of the end surface 16c of the base electrode 16 are arbitrary. For example, in the cross-sectional views shown in FIGS. 4 and 5, the end surface 16c may be entirely linear, entirely bulged, or entirely concave. Furthermore, the end surface 16c may include only one or more linear portions, only one or more curved portions, or both. Furthermore, the end surface 16c may have multiple convex portions (corners) and / or multiple concave portions.

[0082] In the cross-sectional views shown in Figures 4 and 5, the inclination angle of the end surface 16c with respect to the D1 direction (or, from another perspective, the upper and lower surfaces) is designated as θ. The inclination angle θ may have any value. For example, the inclination angle θ may be greater than 3°, greater than 5°, or greater than 10°, or may be less than 80°, less than 45°, less than 30°, or less than 20°. The above upper and lower limits may be combined with any other limit.

[0083] As described above, the end surface 16c is not limited to being linear in the cross-sectional view shown in Figures 4 and 5. That is, the inclination angle (e.g., the inclination angle of the tangent) may vary depending on the position within the end surface 16c. Therefore, the inclination angle θ (the angle simply referred to as the inclination angle of the end surface 16c) may be specified as follows.

[0084] In this explanation, we focus on the base electrode 16 on the +D3 side in Figures 4 and 5. The intersection of the end face 16c and the surface of the base electrode 16 on the -D3 side is defined as the first position. The thickness of the base electrode 16 at a constant thickness (i.e., the portion away from the end face 16c) is defined as the reference thickness. The position within the end face 16c where the height from the surface of the base electrode 16 on the -D3 side is 80% of the reference thickness is defined as the second position. A straight line connecting the first position and the second position is assumed. The angle between this line and the D1 direction (the upper and lower surfaces of the base electrode 16) is defined as the inclination angle θ.

[0085] The reason why the intersection point between the end face 16c and the +D3 side surface of the base electrode 16 is not set as the second position is as follows. The end face 16c may extend in a curved manner so as to become closer to parallel to the D1 direction as it approaches the +D3 side, and may smoothly connect to the +D3 side surface of the base electrode 16. In such an embodiment, it may be difficult to identify the intersection point, or the inclination angle θ when the intersection point is set as the second position may be too small compared to the inclination angle of most of the end face 16c. Such inconveniences can be avoided by setting the position at a height that is 80% of the reference thickness as the second position. If there is variation in the thickness of the base electrode 16 due to the surface roughness of the base electrode 16 or the like, the reference thickness may be the average thickness.

[0086] (3. Method for Manufacturing Capacitor) The capacitor 1 may be manufactured by various methods. For example, the general procedure may be the same as a known procedure. An example is shown below.

[0087] First, ceramic green sheets that will become the dielectric layers 7 and insulating layers 17 are prepared. Next, a conductive paste that will become the internal electrodes 9, dummy electrodes 20, or base electrodes 16 is applied (e.g., printed) to the ceramic green sheets. Next, the ceramic green sheets are stacked to prepare a laminate that will become the main body portion 3. Note that the stacking of the laminate that will become the active portion 11 and the stacking of the portion that will become the cover 13 on the laminate may be performed together or separately.

[0088] The process up to the production of the laminate is carried out, for example, on a mother substrate the size of which will be used to produce a large number of main body portions 3. After the laminate is produced, the mother substrate including the laminate is diced (e.g., cut) into pieces each having a size roughly corresponding to the size of the main body portion 3. Next, the laminate having the size of the main body portion 3 is fired. After that, a metal film is formed on the main body portion 3, and the external electrodes 5 are formed.

[0089] Degreasing may be performed before firing. Firing may be performed, for example, in a reducing atmosphere. Re-oxidation heat treatment may be performed after firing. Polishing (e.g., barrel polishing) of the main body portion 3 may be performed before and / or after firing. In polishing, for example, the ridges of the main body portion 3 may be chamfered or the side surfaces of the main body portion 3 may be polished.

[0090] Any method can be used to make the end surface 11c of the effective portion 11 non-flat (to make the positions of the exposed edge portions 9c of the multiple internal electrodes 9 in the D1 direction different from one another). For example, the ridges of the main body portion 3 may be chamfered by the above-mentioned polishing (e.g., barrel polishing) to form inclined surfaces on both the upper and lower sides of the end surface 11c. Alternatively, for example, the ratio of the thickness (or volume) of the conductive paste (internal electrodes 9) in the effective portion 11 may be made larger than the ratio of the thickness (or volume) of the conductive paste (dummy electrodes 20) in the cover 13, thereby causing the effective portion 11 to shrink in the D1 direction relative to the cover 13 during firing, thereby forming the concave portion 11d on the end surface 11c. Alternatively, for example, the concave portion 11d or the convex portion 11e may be formed by locally removing the side surface of the main body portion 3 by blasting (e.g., sandblasting) or laser processing.

[0091] Any method can be used to position the edge of the base electrode 16 on the −D1 side (outside) toward the +D1 side (inside) of the innermost position P1. For example, the edge of the base electrode 16 may be positioned inward by chamfering the ridge of the main body portion 3 through the above-mentioned polishing (e.g., barrel polishing). Alternatively, the base electrode 16 (conductive paste) may be made relatively thick so that the base electrode 16 shrinks in the D1 direction relative to the active portion 11 and the cover 13 during firing, thereby positioning the edge of the base electrode 16 inward. Furthermore, the edge of the base electrode 16 may be positioned inward in advance, for example, when the conductive paste for the base electrode 16 is applied to the ceramic green sheet for the insulating layer 17. Alternatively, the edge of the base electrode 16 may be positioned inward by scraping the edge of the base electrode 16 before or after firing using, for example, a blasting process (e.g., sandblasting) or a laser treatment.

[0092] The external electrode 5 may be formed by various methods. For example, a metal may be deposited on the surface of the base electrode 16 and the exposed edge portion 9 c by electroless plating and / or electrolytic plating. Alternatively, a thin film formation method such as a dipping method, a printing method, CVD (Chemical Vapor Deposition), or PVD (Physical Vapor Deposition) may be employed. As understood from the above, the base electrode 16 may or may not contribute to the deposition of the metal.

[0093] 6 is a perspective view of a capacitor 201 according to a second embodiment. FIGS. 3 to 5 according to the first embodiment may be referred to as cross-sectional views of the capacitor 201.

[0094] Generally speaking, capacitor 201 is a two-terminal type, which differs from capacitor 1, which is a four-terminal type. In capacitor 201, as described with reference to Figures 3 to 5, the edge of base electrode 16 on the -D1 side may be located at innermost position P1 or may be located on the +D1 side of innermost position P1.

[0095] The specific shapes and dimensions of the components of capacitor 201 may differ from those of capacitor 1, since capacitor 201 is a two-terminal type. Specifically, they are as follows.

[0096] The shape of the main body 203 (or the capacitor 201) is, for example, a roughly rectangular parallelepiped. For example, the height (length in the D3 direction) of this rectangular parallelepiped may be equal to or smaller than the width (length in the D2 direction) (as in the illustrated example). The length (D1 direction) of the rectangular parallelepiped is, for example, greater than the width. The dimensions of the main body 203 are arbitrary. As long as the length in the D1 direction is longer than the length in the D2 direction, the specific examples of the dimensions of the main body 3 in the first embodiment may be applied to the dimensions of the main body 203. The external electrode 5 is generally layer-like, covering the longitudinal ends of the main body 203 over five faces of the rectangular parallelepiped.

[0097] The planar shape of the internal electrode 9 is, for example, approximately a rectangle having four sides parallel to the four sides of the rectangular main body 203 (dielectric layer 7). Of the four sides of the internal electrode 9, two long sides and one short side are, for example, located inside the side surface of the main body 203 (not exposed). The remaining short side is exposed from the side surface on the +D1 side or the -D1 side of the main body 203, forming an exposed edge portion 9c. The region of the internal electrode 9 that overlaps with other internal electrodes 9 in a planar perspective view is the electrode main body 9a. The portion extending from the electrode main body 9a to the external electrode 5 is the extraction electrode 9b.

[0098] Each dummy layer 19 has, for example, two dummy electrodes 20 at both ends in the longitudinal direction of the main body portion 203. The planar shape of the dummy electrode 20 is, for example, a rectangle spanning the entire width (length in the D2 direction) of the main body portion 203, and is exposed, for example, from the side surface on the +D1 side or the −D1 side of the main body portion 203 and from the side surface on the +D2 side and the −D2 side. The above description of the configuration of the dummy layer 19 (dummy electrode 20) in a planar view may be applied to the configuration of the base layer 15 (base electrode 16) in a planar view.

[0099] Although not specifically shown, another example of the capacitor configuration will be given below.

[0100] The capacitor may have an exterior resin covering the entire structure illustrated in Fig. 1 or 6, and lead wires connected to the external electrodes 5 and extending from the exterior resin. From another perspective, the capacitor may be a through-hole mount type rather than a surface mount type. In such an embodiment, one external electrode 5 may cover only one side surface.

[0101] Two types of internal electrodes 9 connected to different external electrodes 5 may be alternately stacked two by two, rather than one by one. In this case, for example, the thickness of the dielectric layer 7 between the mutually opposing internal electrodes 9 connected to the same external electrode 5 may be thinner than the thickness of the dielectric layer 7 between the mutually opposing internal electrodes 9 connected to different external electrodes 5. As can be understood from this, the multiple dielectric layers 7 do not need to have the same shape and size.

[0102] Furthermore, two types of internal electrodes 9 connected to different external electrodes 5 do not have to face each other. For example, two types of internal electrodes 9 connected to different external electrodes 5 may be provided in the same layer, and an internal electrode 9 facing the two types of internal electrodes 9 may be provided, thereby forming a circuit in which two parallel plate capacitors are connected in series. Also, a circuit in which three or more parallel plate capacitors are connected in series may be formed.

[0103] In the example of Figure 6, the edges of the internal electrode 9 other than the exposed edge 9c (referred to as "non-exposed edge" in this paragraph) are not exposed from the side surface of the main body portion 203. This non-exposed edge is covered by the portions of the dielectric layer 7 and the insulating layer 17 that extend outward beyond the non-exposed edge. However, the non-exposed edge may be covered by overlapping another dielectric layer on the side surface of the laminate formed by the dielectric layer 7 and the insulating layer 17, thereby preventing it from being exposed. From another perspective, the main body portion 203 does not need to have a laminated structure in its entirety.

[0104] (5. Summary of the Embodiments) In the following description, for convenience, the reference numerals of the first embodiment will be used, but the matters described below also apply to the other embodiments unless a contradiction arises.

[0105] The multilayer electronic component (capacitor 1) includes an active portion 11, a first cover (e.g., a cover 13 on the +D3 side), and a first base electrode (e.g., a base electrode 16 on the +D3 side). The active portion 11 includes dielectric layers 7 and internal electrodes 9 alternately stacked in a stacking direction (D3 direction). The +D3-side cover 13 overlaps the active portion 11 from the +D3 side of a first side (e.g., the +D3 side) and a second side (e.g., the -D3 side) in the D3 direction. The +D3-side base electrode 16 overlaps the +D3-side cover 13 from the +D3 side. The active portion 11 has an end face 11c facing the -D1 side of a third side (e.g., the -D1 side) and a fourth side (e.g., the +D1 side) in a first direction (e.g., the D1 direction) intersecting the D3 direction. The multiple internal electrodes 9 each include two or more internal electrodes (e.g., a first internal electrode 9A) having an exposed edge portion 9c exposed from the end face 11c. At least some (two or more) of the multiple exposed edges 9c are located at different positions in the D1 direction. The +D3-side base electrode 16 is located in the -D1 region (relative to the center) of the +D3-side surface of the +D3-side cover 13 (i.e., the -D1-side edge of the base electrode 16 described below is not the edge of the base electrode 16 located in the +D1-side region closer to the center of the cover 13 in the D1 direction). The position of the exposed edge 9c located furthest to the +D1 side is referred to as the innermost position P1. In this case, the -D1-side edge of the +D3-side base electrode 16 is located at the same position as the innermost position P1 or closer to the +D1 side than the innermost position P1 (the aforementioned "requirement A" is satisfied).

[0106] Therefore, for example, as described in the outline of the embodiment, the probability of forming the protrusions 5z on the external electrodes 5 is reduced. Specifically, for example, the following is true.

[0107] 7 is a cross-sectional view showing a capacitor according to a comparative example, and corresponds to FIGS. 4 and 5. Unlike the capacitor 1 according to the embodiment, the capacitor according to the comparative example has an edge on the −D1 side of the base electrode 16 located closer to the −D1 side than the innermost position P1. In other words, requirement A is not satisfied.

[0108] In the capacitor according to the comparative example, the dummy electrode 20 is not provided, and the cover 13 is composed only of the insulating layer 17. The cover 13 and the base electrode 16 are also relatively thin compared to those shown in FIGS. 4 and 5. Because the cover 13 is thin, the overall thickness of the main body 3 is also thin. As a result, it is difficult to chamfer the body 3 by barrel polishing. Furthermore, because the dummy electrode 20 is not provided and the base electrode 16 is thin, the force applied to the insulating layer 17 by the contraction of the conductive paste during firing is small. For the reasons described above, it is difficult to satisfy requirement A.

[0109] When requirement A is not satisfied, the edge of the base electrode 16 on the -D1 side is likely to form a sharp ridge of the main body 3. As a result, the metal that will become the external electrode 5 adheres not only to the +D3 and -D1 sides of the edge of the base electrode 16, but also to the -D3 side. Furthermore, when electrolytic plating is used, the amount of metal deposited increases due to electric field concentration. For these reasons, the external electrode 5 is likely to become thick. As a result, a protrusion 5z is likely to be formed. The protrusion 5z, for example, protrudes laterally (to the -D1 side in FIG. 7 ) and / or upward or downward relative to other portions of the external electrode 5.

[0110] If the protrusion 5z protrudes laterally, for example, depending on the specific alignment method, there is a high probability of alignment errors. Furthermore, if the protrusion 5z protrudes upward or downward, for example, when a suction nozzle that has picked up the capacitor 1 is lowered toward a circuit board (not shown), there is a high probability that the external electrode 5 will be subjected to an unintended force from the circuit board (or the bonding material therebetween) due to the protrusion 5z. And / or, the reaction force that the external electrode 5 receives from the circuit board via the bonding material (e.g., solder) becomes relatively large at the protrusion 5z. As a result, there is a high probability of cracks occurring near the protrusion 5z, for example.

[0111] However, in the capacitor 1 according to the embodiment, requirement A is satisfied, and therefore the probability of the protrusion 5z being formed is reduced, and thus the probability of the above-described inconvenience occurring is reduced.

[0112] Although the effects relating to the external electrode 5 have been exemplified above, other effects are also achieved. For example, when requirement A is satisfied, the edge on the -D1 side of the base electrode 16 is less likely to form a sharp ridge of the main body portion 3, thereby reducing the likelihood of stress concentrating on the edge on the -D1 side of the base electrode 16, thereby improving the strength of the main body portion 3. Furthermore, for example, a force applied in the D3 direction to the edge on the -D1 side of the base electrode 16 is supported by all of the internal electrodes 9 (and the dielectric layer 7). This also improves the strength of the main body portion 3.

[0113] The capacitor 1 may further include a second cover (e.g., the -D3 side cover 13) and a second base electrode (e.g., the -D3 side base electrode 16). The -D3 side cover 13 may overlap the active portion 11 from the second side (-D3 side). The -D3 side base electrode 16 may overlap the -D3 side cover 13 from the second side (-D3 side). The thickness from the first side (+D3 side) surface of the +D3 side base electrode 16 to the -D3 side surface of the -D3 side base electrode 16 (the thickness of the main body 3) may be 0.2 mm or less.

[0114] In this case, for example, because the main body 3 is relatively thin, it is difficult to chamfer the ridges of the main body 3 by barrel polishing. As a result, the ridges of the main body 3 tend to have sharp shapes. This increases the likelihood that protrusions 5z will be formed on the external electrode 5 or that stress will be concentrated on the ridges of the main body 3. In other words, there is a high demand for the effect of requirement A. In other words, requirement A is useful.

[0115] The total thickness of the cover 13 on the +D3 side and the base electrode 16 on the +D3 side may be 10% or more of the thickness from the +D3 side surface of the base electrode 16 on the +D3 side to the -D3 side surface of the base electrode 16 on the -D3 side (the thickness of the main body 3).

[0116] In this case, for example, the cover 13 is relatively thick, so that the thickness of the main body 3 can be made thicker than the thickness of the effective portion 11. As a result, for example, it becomes easier to chamfer the ridges of the main body 3 by barrel polishing. Ultimately, it becomes easier to satisfy requirement A.

[0117] The thickness of the base electrode 16 on the +D3 side may be equal to or less than half the thickness of the cover 13 on the +D3 side.

[0118] In this case, for example, because the thickness of the base electrode 16 is relatively thin, the size of the ridges at the edges of the base electrode 16 is also relatively small. Consequently, the influence of the ridges of the base electrode 16 on the formation of the external electrode 5 is reduced, and together with the effect of requirement A, the likelihood of an unintended protrusion 5z being formed on the external electrode 5 is reduced.

[0119] 4, the end surface 11c may have a recessed portion 11d recessed toward the fourth side (+D1). At least some of the exposed edge portions 9c may be located in the recessed portion 11d, and thus may be positioned at different positions in the first direction (D1 direction) from one another.

[0120] In this case, for example, the recess 11d tends to cause the ridges of the main body 3 to have a sharp shape. This increases the likelihood of forming protrusions 5z or of stress concentration on the ridges of the main body 3. In other words, there is a high demand for the effect of requirement A. In other words, requirement A is useful. Furthermore, by providing the recess 11d, the film formation area of ​​the external electrode 5 can be increased without increasing the external size, thereby improving the reliability of the connection between the external electrode 5 and the internal electrode 9.

[0121] 5, the end surface 11c may have a convex portion 11e that bulges toward the third side (the −D1 side). At least some of the exposed edges 9c may be located on the convex portion 11e, and thus may be positioned at different positions in the first direction (the D1 direction).

[0122] In this case, for example, the combination of the convex portion 11e and requirement A tends to make the surface (the side surface of the main body 3) from the end face 11c, through the side surface of the cover 13, to the edge of the base electrode 16 a smoothly curved surface that bulges outward. As a result, a metal layer (e.g., the external electrode 5) is more likely to be formed on the side surface of the main body 3. This in turn improves the reliability of the connection between the external electrode 5 and the internal electrode 9.

[0123] The capacitor 1 may further include an external electrode 5 that overlaps the base electrode 16 on the +D3 side from the +D3 side, overlaps the end face 11c, and contacts the exposed edge portion 9c.

[0124] In this case, for example, since the external electrode 5 is formed directly on the end face 11c without forming a base electrode on the end face 11c, the configuration and manufacturing process are simplified. The absence of a base electrode on the end face 11c means that the thickness of the base electrode shifts the side surface on the -D1 side of the main body portion 3 toward the +D1 side (to the position of the end face 11c). From another perspective, the edge on the -D1 side of the base electrode 16 approaches the side surface on the -D1 side of the main body portion 3. As a result, the ridge portion of the main body portion 3 is likely to become sharp. In other words, there is a high demand for the effect of requirement A. In other words, requirement A is useful. Incidentally, an embodiment in which a base electrode is formed on the end face 11c may also be included in the technology disclosed herein.

[0125] The cover 13 may have a plurality of insulating layers 17 stacked in a stacking direction (direction D3) and a dummy electrode 20 positioned between the plurality of insulating layers 17.

[0126] Requirement A, for example, moves the base electrode 16 away from the side surface of the cover 13. As a result, for example, the strength of the cover 13 may be reduced and / or the adhesive strength of the external electrode 5 to the side surface of the cover 13 may be reduced. However, the provision of the dummy electrode 20 can compensate for such inconveniences.

[0127] The maximum length of the effective portion 11 in the first direction (D1 direction) is defined as L. The maximum length of the effective portion 11 in the second direction (D2 direction) perpendicular to the stacking direction (D3 direction) and the D1 direction is defined as W. In this case, L and W may each be 0.030 mm or more and 0.200 mm or less. L / W may be 0.5 or more and 2.0 or less. In this embodiment, L and W of the effective portion 11 are approximately the same as L and W of the main body portion 3.

[0128] In this case, for example, since L and W are relatively small, the ridges formed by the side surfaces of the main body 3 are less likely to be chamfered by barrel polishing. Consequently, corners where the ridges between the side surfaces intersect with the ridges between the upper surface (or lower surface) and the side surfaces are likely to have sharp shapes. Consequently, there is a high probability that protrusions 5z will be formed on the corners or that stress will be concentrated at the corners. In other words, there is a high demand for the effect of requirement A. In other words, requirement A is useful.

[0129] From another perspective, the multilayer electronic component (capacitor 1) according to the embodiment includes an active portion 11, a first cover (e.g., a cover 13 on the +D3 side), and a first base electrode (e.g., a base electrode 16 on the +D3 side). The active portion 11 includes dielectric layers 7 and internal electrodes 9 that are alternately stacked in a stacking direction (D3 direction). The +D3-side cover 13 overlaps the active portion 11 from the +D3 side of a first side (e.g., the +D3 side) and a second side (e.g., the −D3 side) in the D3 direction. The +D3-side base electrode 16 overlaps the +D3-side cover 13 from the +D3 side. The active portion 11 has an end face 11c that faces the −D1 side of a third side (e.g., the −D1 side) and a fourth side (+D1 side) in a first direction (e.g., the D1 direction) that intersects the D3 direction. The multiple internal electrodes 9 include two or more internal electrodes (e.g., first internal electrodes 9A), each having an exposed edge 9c exposed from the end surface 11c. The +D3-side base electrode 16 is located in a region on the -D1 side (relative to the center) of the +D3-side surface of the +D3-side cover 13 (i.e., the -D1-side edge of the base electrode 16 described below is not the edge of the base electrode 16 located in the +D1-side region closer to the center of the cover 13 in the D1 direction). The first end surface (end surface 16c) on the -D1 side of the +D3-side base electrode is inclined with respect to the D1 direction so as to be positioned closer to the +D1 side as it approaches the +D3 side (the aforementioned "requirement C" is satisfied).

[0130] Therefore, for example, as described in the overview of the embodiment, the probability of forming a protrusion 5z on the external electrode 5 is reduced. Specifically, for example, compared to an embodiment in which the end face 16c is parallel to the D3 direction or an embodiment in which the end face 16c is inclined with respect to the D3 direction in the opposite direction to the embodiment, the ridge of the main body portion 3 is less likely to be sharp. As a result, the probability of forming a protrusion 5z is reduced by the same or similar action as when requirement A is met. Furthermore, because the ridge of the main body portion 3 is less likely to be sharp, the thickness of the plating formed can be made uniform, and as a result, the external electrode 5 can be formed to a uniform thickness.

[0131] Furthermore, for example, the inclination of the end face 16c of the base electrode 16 on the +D3 side as described above means that, when the intersection of the end face 16c and the upper surface (the surface on the +D3 side) of the base electrode 16 is considered as a reference, the lower surface of the base electrode 16 is closer to the exposed edge portion 9c of the internal electrode 9 (and the edge portion of the dummy electrode 20). As a result, the plating layer deposited on the exposed edge portion 9c and the plating layer deposited on the base electrode 16 are more likely to connect. This reduces the need for a base layer on the end face 16c, for example (although such a base layer may be provided). Furthermore, the plating layer deposited on the exposed edge portion 9c is more likely to grow to the lower surface of the base electrode 16, thereby shortening the plating deposition time. Meanwhile, the strength of the base electrode 16 can be ensured compared to an embodiment in which the entire base electrode 16 is thinned.

[0132] The inclination angle θ of the first end face (end face 16c) with respect to the first direction (direction D1) may be smaller than 45°.

[0133] In this case, for example, the end face 16c can be said to be sufficiently inclined with respect to the D3 direction, and therefore the above-mentioned effect is improved.

[0134] The tilt angle θ may be greater than 5°.

[0135] In this case, for example, it is possible to avoid a state in which a thin portion extends over a relatively long range in the direction D1 of the end face 16c, thereby improving the effect of reinforcing the main body portion 3 by the base electrode 16.

[0136] The first base electrode (base electrode 16 on the +D3 side) may be thicker than the internal electrode 9 .

[0137] In this case, for example, it is easier to incline the end face 16c. Specifically, within the length range of the end face 16c in the D1 direction, the smaller the inclination angle θ, the smaller the change in thickness of the base electrode 16 relative to the change in position in the D1 direction. If the base electrode 16 is thin, it is difficult to achieve such small changes in the thickness of the base electrode 16. However, if the base electrode 16 is thick, it is easier to achieve an arbitrary inclination angle θ. Furthermore, for example, if the base electrode 16 is thicker than the internal electrode 9, the density of the lamination of the multiple internal electrodes 9 can be increased, thereby increasing the capacitance, while the strength of the capacitor 1 can be improved by the base electrode 16.

[0138] The capacitor 1 may have a second cover (-D3 side cover 13) overlapping the effective portion 11 from the second side (-D3 side). The thickness of the first base electrode (+D3 side base electrode 16) may be 0.06 times or more the thickness from the first side (+D3 side) surface of the first cover (+D3 side cover 13) to the -D3 side surface of the -D3 side cover 13.

[0139] In this case, for example, as in the above case, it is easy to realize any tilt angle θ (especially a small value). Also, for example, by making the thickness of the base electrode 16 relatively thick, it is easy to ensure the thickness of the main body portion 3, and it is easy to chamfer the ridge portion of the main body portion 3 by barrel polishing. Consequently, it is easy to tilt the end face 16c.

[0140] The base electrode 16 may include a ceramic material.

[0141] In this case, for example, the strength of the base electrode 16 against polishing or the like is improved. As a result, for example, the likelihood of the base electrode 16 being excessively scraped when barrel polishing is performed is reduced. For example, if the strength of the base electrode 16 against polishing is low, the end of the base electrode 16 may be scraped across the entire thickness, and an inclined surface may not be formed on the end face 16c. The likelihood of such a problem occurring can be reduced.

[0142] The volume percentage of the ceramic material in the base electrode 16 may be greater than the volume percentage of the ceramic material in the internal electrodes 9 (which may be 0 volume percentage).

[0143] In this case, for example, the base electrode 16 can achieve the above-mentioned effects, while the conductivity of the internal electrode 9 can be improved, thereby improving the electrical characteristics of the capacitor 1 .

[0144] At least some of the exposed edges 9c may be located at different positions in the first direction (direction D3). The position of the exposed edge 9c located furthest to the third side (the -D1 side) among the exposed edges 9c is referred to as the outermost position P2. In this case, the edge of the base electrode 16 on the -D1 side may be located on the fourth side (the +D1 side) of the outermost position P2 (the requirement B described above may be satisfied).

[0145] In this case, the probability of forming the protrusion 5z is reduced due to the same or similar effect as when the above-mentioned requirement A is met. The above effect is enhanced by the combination of requirement B and the inclination of the end face 16c of the base electrode 16.

[0146] The technology according to the present disclosure is not limited to the above-described embodiments and may be implemented in various forms.

[0147] For example, the multilayer electronic component is not limited to a capacitor. For example, in a multilayer electronic component, some of the multiple internal electrodes may form a capacitor, and the other multiple internal electrodes may form an inductor or resistor. The multilayer electronic component may also form an appropriate circuit (e.g., a resonant circuit) as a whole. Furthermore, the cover, base electrode, and external electrode may be provided on only one of the upper and lower surfaces of the active portion.

[0148] 1...capacitor (multilayer electronic component), 7...dielectric layer, 9...internal electrode, 9c...exposed edge portion (of internal electrode), 11...effective portion, 11c...end surface (of effective portion), 13...cover (first cover or second cover), 16...base electrode (first base electrode or second base electrode).

Claims

1. A multilayer electronic component comprising: an effective portion having dielectric layers and internal electrodes stacked alternately in a stacking direction; a first cover overlapping the effective portion from the first side of a first side and a second side in the stacking direction; and a first base electrode overlapping the first cover from the first side, wherein the effective portion has an end face facing the third side of a third side and a fourth side in a first direction intersecting the stacking direction, the multiple internal electrodes include two or more internal electrodes each having an exposed edge portion exposed from the end face, at least some of the multiple exposed edges are positioned differently from each other in the first direction, the first base electrode is located in a region of the third side of the face of the first side of the first cover, and when the position of the multiple exposed edges furthest to the fourth side is referred to as the innermost position, the third side edge of the first base electrode is located at the same position as the innermost position or on the fourth side of the innermost position.

2. The multilayer electronic component according to claim 1, wherein a first end face on the third side of the first base electrode is inclined with respect to the stacking direction in a direction such that the first side is closer to the fourth side.

3. A multilayer electronic component comprising: an effective portion having dielectric layers and internal electrodes alternately stacked in a stacking direction; a first cover overlapping the effective portion from the first side of a first side and a second side in the stacking direction; and a first base electrode overlapping the first cover from the first side, wherein the effective portion has an end face facing the third side of a third side and a fourth side in a first direction intersecting the stacking direction, and the multiple internal electrodes include two or more internal electrodes each having an exposed edge exposed from the end face, the first base electrode is located in the third side region of the first side surface of the first cover, and a first end face on the third side of the first base electrode is inclined with respect to the stacking direction in a direction such that the first side is located closer to the fourth side.

4. The multilayer electronic component according to any one of claims 1 to 3, comprising: a second cover overlapping said effective portion from said second side; and a second base electrode overlapping said second cover from said second side, wherein a thickness from said first side surface of said first base electrode to said second side surface of said second base electrode is 0.2 mm or less.

5. A multilayer electronic component according to any one of claims 1 to 4, comprising: a second cover overlapping said effective portion from the second side; and a second base electrode overlapping said second cover from the second side, wherein the total thickness of said first cover and said first base electrode is 10% or more of the thickness from the first side surface of said first base electrode to the second side surface of said second base electrode.

6. The multilayer electronic component according to any one of claims 1 to 5, wherein the thickness of the first base electrode is equal to or less than half the thickness of the first cover.

7. A multilayer electronic component according to any one of claims 1 to 6, wherein the end face has a recessed portion recessed towards the fourth side, and at least a portion of the exposed edges are located in the recessed portion and therefore have different positions in the first direction.

8. A multilayer electronic component according to any one of claims 1 to 7, wherein the end face has a convex portion bulging towards the third side, and at least some of the exposed edges are located on the convex portion and therefore have different positions in the first direction from one another.

9. The multilayer electronic component according to any one of claims 1 to 8, further comprising an external electrode overlapping said first base electrode from said first side and overlapping said end face in contact with said exposed edge portion.

10. A multilayer electronic component according to any one of claims 1 to 9, wherein the first cover has a plurality of insulating layers stacked in the stacking direction, and a dummy electrode located between the plurality of insulating layers.

11. A multilayer electronic component according to any one of claims 1 to 10, wherein, when the maximum length of the effective portion in the first direction is L and the maximum length of the effective portion in a second direction perpendicular to the stacking direction and the first direction is W, each of L and W is 0.030 mm or more and 0.200 mm or less, and L / W is 0.5 or more and 2.0 or less.

12. A multilayer electronic component according to claims 2 and 3, and any one of claims 4 to 11 which directly or indirectly cites at least one of claims 2 and 3, wherein the inclination angle of the first end face with respect to the first direction is smaller than 45°.

13. A multilayer electronic component according to claim 2, 3, or any one of claims 4 to 12 which directly or indirectly cites at least one of claims 2 and 3, wherein the inclination angle is greater than 5°.

14. The multilayer electronic component according to any one of claims 1 to 13, wherein the first base electrode is thicker than the internal electrodes.

15. A multilayer electronic component according to any one of claims 1 to 14, further comprising a second cover overlapping said active portion from said second side, and wherein the thickness of said first base electrode is 0.06 times or more the thickness from said first side surface of said first cover to said second side surface of said second cover.

16. The multilayer electronic component according to any one of claims 1 to 15, wherein the first base electrode contains a ceramic material.

17. The multilayer electronic component according to claim 16, wherein the volume percentage of the ceramic material in the first base electrode is greater than the volume percentage of the ceramic material in the internal electrodes.

18. A multilayer electronic component as claimed in any one of claims 1 to 17, wherein at least some of the multiple exposed edge portions are positioned differently from one another in the first direction, and when the position of the exposed edge portion that is positioned furthest to the third side among the multiple exposed edge portions is referred to as the outermost position, the edge portion on the third side of the first base electrode is positioned on the fourth side of the outermost position.

Images