Camera module, electronic device and related image stabilization method

Abstract

Disclosed in the embodiments of the present application are a camera module, an electronic device and a related image stabilization method. The camera module comprises an image stabilization assembly, and one or more optical path elements and an imaging assembly which are sequentially arranged in a light beam transmission direction, wherein the imaging assembly comprises a first image sensor and a second image sensor, and the image stabilization assembly is connected to at least one of the one or more optical path elements. The first image sensor is used for measuring a first jitter amount of the camera module; the image stabilization assembly is used for driving, on the basis of the first jitter amount, at least one of the one or more optical path elements to perform jitter compensation; and the second image sensor is used for performing optical imaging. The embodiments of the present application can improve the optical image stabilization performance of electronic devices, thereby improving the user experience.

Description

Camera module, electronic device and related anti-shake method

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office of China on December 6, 2023, with application number 202311673477.1, and priority to the Chinese patent application entitled “Camera module, electronic device and related anti-shake method”, all contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of smart terminal technology, and in particular to camera modules, electronic devices, and related anti-shake methods. Background Art

[0003] As demand for long-distance and close-up photography increases, camera modules are adopting increasingly larger zoom ratios. This high-zoom ratio requires a longer effective focal length for the optical path, necessitating a telephoto optical path. This telephoto optical path can cause even the slightest shake during shooting to cause significant vibration in the camera module's imaging beam. Therefore, the anti-shake function of a camera module is particularly important. Summary of the Invention

[0004] The embodiments of the present application provide a camera module, an electronic device, and a related anti-shake method to enhance the optical anti-shake effect and improve the user experience.

[0005] In a first aspect, an embodiment of the present application provides a camera module, which includes an anti-shake component and one or more optical path elements and an imaging component arranged in sequence along the direction of light beam transmission; wherein the imaging component includes a first image sensor and a second image sensor, and the anti-shake component is connected to at least one of the one or more optical path elements; the first image sensor can be used to detect a first shake amount of the camera module; the anti-shake component can be used to drive at least one of the one or more optical path elements to perform shake compensation based on the first shake amount; the second image sensor can be used to perform optical imaging.

[0006] In an embodiment of the present application, by adding a new image sensor to the camera module to detect the actual jitter of the camera module, image feedback information (i.e., the information collected by the newly added image sensor) is introduced in the process of jitter compensation for the camera module, which can more accurately restore the complete jitter information of the camera module and improve the anti-shake performance and imaging quality of the camera module.

[0007] In some embodiments, the first image sensor is specifically used to: capture a first output light beam, where the first output light beam is a light beam formed by the input light beam passing through one or more optical path elements; the anti-shake component includes a controller and an actuating structure, and the anti-shake component is specifically used to: determine a first jitter amount between the input light beam and the first output light beam through the controller; determine a first jitter compensation amount for the first jitter amount; and drive at least one of the one or more optical path elements through the actuating structure to perform jitter compensation for the first jitter compensation amount; the second image sensor is specifically used to: capture a second output light beam to obtain a first image, where the second output light beam is a light beam formed by the input light beam passing through one or more optical path elements after jitter compensation.

[0008] In an embodiment of the present application, since the first image sensor can capture a light beam at the same light source as the second image sensor, the beam jitter amount determined based on the light beam captured by the first image sensor is consistent with the beam jitter amount at the second image sensor. Furthermore, the jitter amount of the camera module can be determined based on the light beam captured by the first image sensor. Furthermore, the jitter compensation amount of the camera module can be determined based on the jitter amount, that is, the amount of movement of the optical element during optical image stabilization. Then, the optical path element can be driven to perform jitter compensation of the jitter compensation amount to achieve optical image stabilization. When the light beam imaging is captured on the second image sensor, the jitter amount of the light beam can be compensated, thereby improving the anti-shake performance and imaging quality of the camera module.

[0009] In some embodiments, one or more optical path elements include a beam splitter element and a mirror group. The beam splitter element is located between the mirror group and the imaging component. The first image sensor and the second image sensor in the imaging component are arranged on both sides of the beam splitter element. The beam splitter element is used to split the input light beam passing through the mirror group.

[0010] In an embodiment of the present application, one or more optical path elements may further include a spectroscopic element and a lens group, and the first image sensor and the second image sensor are arranged on both sides of the spectroscopic element, that is, the first image sensor and the second image sensor may be arranged on the two light-emitting sides of the spectroscopic element. The spectroscopic element may split the light beam passing through the lens group, such as into a first light beam and a second light beam, the first light beam may be transmitted to the first image sensor, and the second light beam may be transmitted to the second image sensor. By performing the light splitting by the spectroscopic element, while ensuring that the first image sensor and the second image sensor can capture the light beam from the same light source, the first image sensor and the second image sensor can be designed independently and will not interfere with each other, thereby improving the optical image stabilization effect and imaging quality of the electronic device.

[0011] In some embodiments, the beam splitting element includes a first beam splitting surface, and the beam splitting element is specifically configured to split the input light beam passing through the mirror assembly into wavelength bands through the first beam splitting surface.

[0012] In the embodiments of the present application, the beam splitting element can use the first beam splitting surface to split the light beam passing through the lens assembly according to wavelength bands. For example, the light beam in the non-visible light band can be transmitted to the first image sensor, and the light beam in the visible light band can be transmitted to the second image sensor. Furthermore, while ensuring that the first image sensor can detect imaging beam jitter, the amount of light entering the second image sensor will not be affected, thereby improving the optical image stabilization effect and imaging quality of the electronic device.

[0013] In some embodiments, the beam splitting element includes a second beam splitting surface, and the beam splitting element is specifically configured to split the input beam passing through the mirror assembly according to a beam ratio through the second beam splitting surface.

[0014] In an embodiment of the present application, the spectroscopic element can split the light beam passing through the mirror group according to the beam ratio through the second spectroscopic surface. For example, the spectroscopic effect can be split in equal proportions, or a larger proportion of the light beam can be transmitted to the second image sensor and a smaller proportion of the light beam can be transmitted to the first image sensor. That is, the more light energy received by the second image sensor responsible for imaging, the better the imaging effect. The coating on the second spectroscopic surface can be changed according to actual needs so that the spectroscopic element can split the light according to different beam ratios, thereby improving the optical image stabilization effect and imaging quality of the electronic device.

[0015] In some embodiments, the first image sensor and the second image sensor are located on a light-emitting side of at least one optical path element among the one or more optical path elements, and the first image sensor is connected to the second image sensor.

[0016] In an embodiment of the present application, the first image sensor and the second image sensor can both be located on the light-emitting side of the optical path element. The first image sensor is connected to the second image sensor. The image acquisition surface of the second image sensor and the image acquisition surface of the first image sensor can be positioned toward the optical path element, further reducing the size of the camera module.

[0017] In some embodiments, the first image sensor and the second image sensor are located on a light-emitting side of at least one optical path element among the one or more optical path elements, and the first image sensor is embedded in the second image sensor.

[0018] In the embodiment of the present application, the first image sensor is embedded in the second image sensor. To ensure imaging quality, the first image sensor can be deployed at the edge of the second image sensor or occupy a small amount of space in the second image sensor, which can further reduce the volume of the camera module.

[0019] In some embodiments, an imaging frame rate of the first image sensor is greater than an imaging frame rate of the second image sensor.

[0020] In an embodiment of the present application, the imaging frame rate of the first image sensor is greater than the imaging frame rate of the second image sensor. The higher the image acquisition frame rate, the faster the image acquisition speed. When the imaging frame rate of the first image sensor is greater than the imaging frame rate of the second image sensor, image acquisition can be performed based on the image acquisition area of ​​the first image sensor to obtain a first jitter amount. Then, the anti-shake component can perform anti-shake on the camera module and perform anti-shake compensation on the imaging light beam, so that the image captured by the second image sensor is clearer.

[0021] In some embodiments, the controller is configured to obtain a second jitter amount; and determine a first jitter compensation amount according to the first jitter amount and the second jitter amount.

[0022] In an embodiment of the present application, the second jitter amount can be obtained by the controller to preliminarily determine the jitter amount of the camera module, that is, the jitter amount of the electronic device can be first determined as the jitter amount of the camera module, and then the actual jitter amount of the camera module is compensated based on the imaging light beam captured by the first image sensor, that is, the first jitter amount is calculated using the imaging mode and characteristics of the optical path in the first image sensor. The first jitter amount can compensate for the uncompensated jitter caused by the error of the second jitter amount, thereby reducing the error, being able to more accurately restore the complete jitter information, and improving the anti-shake performance and imaging quality of the electronic device.

[0023] In some embodiments, the anti-shake component also includes a displacement sensor, which is connected to the actuating structure. The anti-shake component is also used to: when driving the optical path element to perform jitter compensation, send position information of the optical path element to the controller through the displacement sensor; the position information includes linear displacement information or angular movement information of the optical path element; determine a second jitter compensation amount of the optical path element based on the position information by the controller; and drive the optical path element again through the actuating structure to perform jitter compensation of the second jitter compensation amount.

[0024] In the embodiments of the present application, when a displacement sensor participates in the jitter process, it can be used to provide real-time feedback on the displacement information of the optical element. If the displacement information transmitted by the displacement sensor differs from the displacement amount obtained during the first jitter compensation, the actuator structure can be controlled to perform a second jitter compensation based on the displacement information provided by the displacement sensor to ensure jitter compensation accuracy. It can be understood that by providing a displacement sensor, the controller implements closed-loop feedback control over the actuator structure's drive, improving the controller's precise control of the actuator structure's current displacement and enhancing the accuracy of anti-shake compensation.

[0025] In some embodiments, one or more optical path elements include a lens group, and the anti-shake component is connected to the lens group, and the anti-shake component is specifically used to: drive the lens group through the actuating structure to perform jitter compensation of a first jitter compensation amount.

[0026] In an embodiment of the present application, if the camera module is an upright camera module, the optical path element includes a lens group, and shake compensation can be performed by driving the lens group to improve the anti-shake performance and imaging quality of the upright camera module.

[0027] In some embodiments, one or more optical path elements include an optical path folding element, and the anti-shake component is connected to the optical path folding element. The anti-shake component is specifically used to: drive the optical path folding element through an actuating structure to perform jitter compensation of a first jitter compensation amount.

[0028] In an embodiment of the present application, if the camera module is a periscope camera module, the optical path element includes an optical path folding element, and jitter compensation can be performed by driving the optical path folding element to improve the anti-shake performance and imaging quality of the periscope camera module.

[0029] In a second aspect, the present application provides an electronic device, comprising a camera module as described in any one of the first aspects and a first detection unit, wherein the first detection unit is configured to determine a first jitter amount based on a first output light beam captured by a first image sensor.

[0030] In an embodiment of the present application, an image sensor is added to the camera module of the electronic device to detect the actual jitter of the camera module, and image feedback information (i.e., information collected by the newly added image sensor) is introduced in the process of jitter compensation for the camera module, so that the first detection unit in the electronic device can analyze the information feedback from the image sensor to obtain the actual jitter amount of the camera module, and can more accurately restore the complete jitter information of the camera module, thereby improving the anti-shake performance and imaging quality of the electronic device.

[0031] In some embodiments, the first detection unit is specifically used to: obtain a first image set based on the first output light beam; the first image set includes at least two frames of continuous images; determine a feature point set of two adjacent frames of images from the first image set; establish a matching relationship between feature points in the feature point set based on the feature point set of two adjacent frames of images; and determine a first jitter amount based on the matching relationship.

[0032] In an embodiment of the present application, a new image sensor is added to the camera module to collect light beams, and the collected light signals are converted into electrical signals and sent to the first detection unit. Furthermore, the first inspection unit can obtain an image set based on the signal, and determine the feature point set of two adjacent frames based on the image set, establish a matching relationship between the feature points in the feature point set; based on the matching relationship, the amount of jitter can be determined. Since another image sensor is introduced in this application, and the imaging results of the image sensor are used to sense the jitter of the camera module, the complete jitter information of the camera module can be restored more accurately, thereby improving the anti-shake performance and imaging quality of the electronic device.

[0033] In some embodiments, the electronic device further includes a second detection unit, which is used to: obtain a shake signal and determine a second shake amount based on the shake signal; the shake signal includes the current angular velocity and / or acceleration of the electronic device, and the second shake amount includes a shake angle or shake displacement information.

[0034] In an embodiment of the present application, a shake signal (which may include an angular velocity signal of the electronic device and an acceleration signal of the electronic device) can be obtained through a second detection unit to preliminarily identify the shake amount of the camera module (i.e., the second shake amount). The current angular velocity and / or acceleration of the electronic device can be preliminarily determined as the shake angle and shake displacement information of the camera module. The shake amount of the electronic device can be determined as the shake amount of the camera module, thereby improving the anti-shake performance and imaging quality of the electronic device.

[0035] According to a third aspect, an anti-shake method is provided, which is applied to an electronic device. The electronic device includes a camera module, the camera module includes an anti-shake component and one or more optical path elements and an imaging component arranged in sequence along the light beam transmission direction; wherein the imaging component includes a first image sensor and a second image sensor, and the anti-shake component is connected to at least one of the one or more optical path elements; the method includes: detecting a first shake amount of the camera module through the first image sensor; driving at least one of the one or more optical path elements to perform shake compensation based on the first shake amount through the anti-shake component; and performing optical imaging through the second image sensor.

[0036] In some embodiments, the anti-shake component includes a controller and an actuating structure, which detects a first shake amount of the camera module through a first image sensor, including: collecting a first output light beam through the first image sensor, where the first output light beam is a light beam of the input light beam passing through one or more optical path elements; determining a first shake amount between the input light beam and the first output light beam through the controller; determining a first shake compensation amount of the first shake amount; driving at least one of the one or more optical path elements to perform shake compensation based on the first shake amount through the anti-shake component, including: driving at least one of the one or more optical path elements to perform shake compensation of the first shake compensation amount through the actuating structure; performing optical imaging through the second image sensor, including: collecting a second output light beam through the second image sensor to obtain a first image, where the second output light beam is a light beam of the input light beam passing through one or more optical path elements after shake compensation.

[0037] In some embodiments, the electronic device further includes a first detection unit, and the first jitter amount is determined by the first detection unit based on the first output light beam captured by the first image sensor.

[0038] In some embodiments, a first jitter amount is determined by a first detection unit based on a first output light beam captured by a first image sensor, including: obtaining a first image set based on the first output light beam; the first image set includes at least two frames of continuous images; determining a feature point set of two adjacent frames of images from the first image set; establishing a matching relationship between feature points in the feature point set based on the feature point set of the two adjacent frames of images; and determining the first jitter amount based on the matching relationship.

[0039] In some embodiments, the electronic device further includes a second detection unit, which obtains a shake signal through the second detection unit and determines a second shake amount based on the shake signal; the shake signal includes the current angular velocity and / or acceleration of the electronic device, and the second shake amount includes the shake angle or shake displacement information.

[0040] In some embodiments, determining a first jitter compensation amount for a first jitter amount includes: acquiring a second jitter amount through a controller, and determining the first jitter compensation amount according to the first jitter amount and the second jitter amount.

[0041] In a fourth aspect, an electronic device is provided, comprising: a memory and one or more processors; the memory is coupled to the one or more processors, the memory is used to store computer program code, the computer program code includes computer instructions, and the one or more processors call the computer instructions to enable the electronic device to execute a method as in the third aspect or any one of the embodiments of the third aspect.

[0042] In a fifth aspect, a computer-readable storage medium is provided, comprising instructions, which, when executed on an electronic device, cause the electronic device to execute a method as in the third aspect or any one of the embodiments of the third aspect.

[0043] In a sixth aspect, a computer program product is provided. When the computer program product is run on a computer, the computer is caused to execute the method as in the third aspect or any one of the embodiments of the third aspect.

[0044] In a seventh aspect, a chip system is provided, comprising at least one processor for implementing the method of the third aspect or any one of the embodiments of the third aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] FIG1 is a schematic structural diagram of an implementation of an electronic device 1000 provided in an embodiment of the present application.

[0046] FIG2 is a partial cross-sectional view of the electronic device 1000 shown in FIG1 taken along line AA in one embodiment.

[0047] FIG3 is a partially exploded schematic diagram of an embodiment of the camera module 100 shown in FIG2 .

[0048] FIG4 is a schematic diagram of a light splitting path provided in an embodiment of the present application.

[0049] FIG5 is a schematic diagram of two adjacent frames of images provided in an embodiment of the present application.

[0050] FIG6 is a schematic diagram of determining a jitter compensation amount of an optical path folding element according to an embodiment of the present application.

[0051] FIG7 is a schematic diagram of jitter compensation performed by an optical path folding element provided in an embodiment of the present application.

[0052] FIG8 is a partial structural decomposition diagram of another embodiment of the camera module 100 shown in FIG2 .

[0053] FIG9 is a schematic diagram of the assembly of another different image sensor provided in an embodiment of the present application.

[0054] FIG10 is a schematic diagram of the assembly of yet another different image sensor provided in an embodiment of the present application.

[0055] FIG11 is a schematic structural diagram of another embodiment of the camera module 100 shown in FIG2 .

[0056] FIG12 is a schematic structural diagram of another embodiment of the camera module 100 shown in FIG11 . DETAILED DESCRIPTION

[0057] The embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application.

[0058] The terms "first," "second," "third," and "fourth," etc., in the specification and claims of this application and the accompanying drawings are used to distinguish between different objects, rather than to describe a specific order. In addition, the terms "including," "having," and any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or apparatus comprising a series of steps or elements is not limited to the listed steps or elements, but may optionally include steps or elements not listed, or may optionally include other steps or elements inherent to the process, method, product, or apparatus.

[0059] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0060] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the term "connection" should be understood in a broad sense. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. Among them, "fixed connection" means that the two parts are connected to each other and the relative positional relationship after the connection remains unchanged. It should be understood that when component A is fixedly connected to component C through component B, changes in the relative positional relationship caused by the deformation of component A, component B and component C themselves are allowed.

[0061] The embodiments of the present application are described below in conjunction with the drawings in the embodiments of the present application.

[0062] Fig. 1 is a schematic structural diagram of an embodiment of an electronic device 1000 provided in an embodiment of the present application. Fig. 2 is a partial cross-sectional view of an embodiment of the electronic device 1000 shown in Fig. 1 taken along line AA.

[0063] As shown in FIG1 and FIG2 , electronic device 1000 may be a device with a camera function, such as a mobile phone, a tablet personal computer, a laptop computer, a personal digital assistant (PDA), a camera, a personal computer, a notebook computer, an in-vehicle device, a video surveillance device, a wearable device, augmented reality (AR) glasses, an AR helmet, virtual reality (VR) glasses, or a VR helmet. The electronic device 1000 of the embodiment shown in FIG1 is described using a mobile phone as an example.

[0064] The electronic device 1000 includes a camera module 100, a housing 200 and a screen 300. The camera module 100 may be a rear camera module 100 or a front camera module 100. This application is introduced by taking the camera module 100 as an example of a rear camera module 100. It should be noted that Figures 1 and 2 and the following related drawings only schematically illustrate some components included in the electronic device 1000, and the actual shape, actual size, actual position and actual structure of these components are not limited by Figures 1 and 2 and the following drawings. In other embodiments, when the electronic device 1000 is a device of some other form, the electronic device 1000 may also not include the screen 300.

[0065] For ease of description, the thickness direction of the electronic device 1000 is defined as the X-axis. The length direction of the electronic device 1000 is defined as the Y-axis. The width direction of the electronic device 1000 is defined as the Z-axis. It is understood that the coordinate system setting of the electronic device 1000 can be flexibly set according to specific actual needs.

[0066] In this embodiment, the housing 200 may include a frame 210 and a back cover 220. The back cover 220 is fixedly connected to the frame 210. For example, the back cover 220 may be fixedly connected to the frame 210 by adhesive. The back cover 220 may also be integrally formed with the frame 210, i.e., the back cover 220 and the frame 210 form a single unitary structure.

[0067] Alternatively, the screen 300 can be located on the side of the frame 210 away from the back cover 220. In this case, the screen 300 and the back cover 220 are located on either side of the frame 210. The screen 300, the frame 210, and the back cover 220 together enclose the interior of the electronic device 1000. The interior of the electronic device 1000 can be used to house components of the electronic device 1000, such as a battery, a receiver, or a microphone.

[0068] In this embodiment, screen 300 can be used to display images, etc. Screen 300 can be a flat screen or a curved screen. The display screen of screen 300 can be an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode (AMOLED) display screen, or a liquid crystal display (LCD).

[0069] For example, the camera module 100 can be located inside the electronic device 1000. The camera module 100 can be fixedly connected to the side of the screen 300 facing the back cover 220. The back cover 220 can be provided with a light-transmitting hole 2201. The shape of the light-transmitting hole 2201 is not limited to the circular shape shown in FIG. 1 . The light-transmitting hole 2201 connects the interior of the electronic device 1000 to the exterior of the electronic device 1000. Light outside the electronic device 1000 can enter the interior of the electronic device 1000 through the light-transmitting hole 2201. The camera module 100 can collect ambient light entering the interior of the electronic device 1000.

[0070] For example, the camera module 100 can be a conventional camera module 100 (i.e., the optical axis of the camera module 100 is in the thickness direction of the electronic device 1000, i.e., the X-axis direction). In some embodiments, the camera module 100 can also be a periscope camera module 100 (i.e., the optical axis of the camera module 100 can be in any direction on the YZ plane).

[0071] Figure 3 is a partially exploded schematic diagram of an embodiment of the camera module 100 shown in Figure 2. The camera module 100 in Figure 3 is described as a periscope camera module. The optical axis of the camera module 100 is parallel to the Z axis.

[0072] As shown in Figures 2 and 3, the camera module 100 may include an optical path folding element 10, a lens group 20, an imaging component 30, an anti-shake component 40, and a housing 60. The optical path folding element 10 and the lens group 20 may be multiple optical elements in the camera module 100, the optical path folding element 10 is an optical element of the camera module 100, and the lens group 20 is an optical element of the camera module 100. The optical path folding element 10, the lens group 20, and the imaging component 30 are arranged in sequence along the transmission direction of the imaging light beam (that is, the input light beam) (the propagation direction of the imaging light beam is indicated by dotted lines and arrows in Figures 2 and 3). The imaging light beam refers to a light beam formed by the light incident on the camera module 100. For example, as shown in Figure 1, the electronic device 1000 may also include a main control chip (also known as a system on chip), and the main control chip may include a detection structure 41 and a detection structure 42. The detection structure 41 and the detection structure 42 may be a computing unit on the main control chip of the electronic device 1000, or may be different computing units on the main control chip. For example, the detection structure 41 and the detection structure 42 may both be the core processor (Central Processing Unit, CPU) of the electronic device 1000 .

[0073] 3 , the anti-shake assembly 40 may include a controller 43, an actuator structure 44, and a displacement sensor 45. The anti-shake assembly 40 may be connected to at least one of the optical path folding element 10, the lens assembly 20, and the image sensor 32 to perform shake compensation on the imaging beam.

[0074] For example, light from outside the electronic device 1000 may first enter the optical path folding element 10, then enter the lens assembly 20, and then be transmitted to the imaging assembly 30 after passing through the lens assembly 20. In some embodiments, the controller 43 may move the optical path folding element 10 by driving the actuator structure 44 to achieve anti-shake compensation.

[0075] In some embodiments, the electronic device 1000 may include a main control chip, and the driving chip in the actuating structure 44 may also exchange data with the main control chip.

[0076] In some embodiments, the detection structure 41 may be referred to as a first detection unit, and the detection structure 42 may be referred to as a second detection unit.

[0077] The optical path folding element 10 can be used to fold the optical path of the imaging light beam entering the camera module 100 and transmit it to the lens assembly 20. Optical path folding, also known as optical path deflection, refers to changing the transmission path of light. For example, the optical path folding element 10 can be a reflective element such as a prism or a reflector.

[0078] The lens assembly 20 may include one lens 21 or multiple lenses 21 (three lenses 21 are shown in FIG3 ). The lens assembly 20 may be used to perform certain processing on the received imaging light beam, such as correcting aberrations, eliminating chromatic aberrations, and the like.

[0079] The imaging light beam passes through the lens assembly 20 and is transmitted to the imaging assembly 30 . The imaging assembly 30 includes an image sensor 31 and an image sensor 32 .

[0080] In some embodiments, image sensor 31 may be referred to as a second image sensor, and image sensor 32 may be referred to as a first image sensor.

[0081] The image sensor 31 may have an image acquisition area, and the received imaging light beam is collected through the image acquisition area (also called a photosensitive area or a photosensitive surface). The image sensor 31 may convert the optical signal of the imaging light beam collected on the image acquisition area into an electrical signal that is in a corresponding proportional relationship with the optical signal. Exemplarily, the image sensor 31 may be a hybrid image sensor, a CCD image sensor composed of a charge coupled device (CCD), or a CMOS image sensor composed of a complementary metal oxide semiconductor (CMOS). In some embodiments, the image sensor 31 may convert the imaging light beam in its photosensitive area into an electrical signal, and the electrical signal is transmitted to the screen 300 of the electronic device 1000, and finally an image is formed on the screen 300 of the electronic device 1000. That is, the electrical signal converted from the imaging light beam on the image sensor 31 serves as the image captured by the camera module 100.

[0082] In some embodiments, image sensor 32 may be spaced apart from image sensor 31. Image sensor 32 may have an image acquisition region (also referred to as a photosensitive region or photosensitive surface) that captures the received imaging light beam. Image sensor 32 may convert the optical signal of the imaging light beam captured in the image acquisition region into an electrical signal proportional to the optical signal.

[0083] Exemplarily, the image sensor 32 may be a hybrid image sensor, a DVS event image sensor, a pulsed visual perception sensor, a charge coupled device (CCD) image sensor, or a complementary metal oxide semiconductor (CMOS) image sensor. The image sensor 32 may provide image jitter detection, thereby enabling anti-shake compensation. Specifically, the detection structure 41 may detect whether the imaging light beam within the photosensitive area of ​​the light beam captured by the image sensor 32 is jittering.

[0084] As shown in FIG3 , in some embodiments, one or more optical path elements of the camera module 100 may further include a beam splitter 50. The beam splitter 50 may be located in the propagation direction of the imaging light beam and may be located between the image sensor 32 and the lens assembly 20. The beam splitter 50 is used to split the imaging light beam passing through the lens assembly 20 into two parts, one of which is transmitted to the image acquisition area of ​​the image sensor 31, and the other is transmitted to the image acquisition area of ​​the image sensor 32.

[0085] It can be understood that by splitting light through the spectrometer element 50, while ensuring that the image sensor 32 can collect the light beam from the same light source as the image sensor 31, the image sensor 32 and the image sensor 31 can be designed independently without interfering with each other, thereby improving the optical image stabilization effect and imaging quality of the electronic device.

[0086] In some embodiments, the beam splitting element 50 may include a first beam splitting surface, and the beam splitting element 50 may split the imaging light beam passing through the lens assembly 20 into wavelength bands through the first beam splitting surface.

[0087] Specifically, the spectroscopic element 50 can split the passing light beam into different wavelength bands using a first spectroscopic surface. The first spectroscopic surface can be a cold mirror coated with materials such as SiO2, TA2O5, or Ti3O5. For example, a light beam in the non-visible light band can be transmitted to the image sensor 32, while a light beam in the visible light band can be transmitted to the image sensor 31. Furthermore, while ensuring that the image sensor 32 can detect imaging beam jitter, the amount of light entering the image sensor 31 is not affected, thereby improving the optical image stabilization effect and imaging quality of the electronic device.

[0088] It should be noted that, since the cold mirror can be used as the first splitting surface in the embodiment of the present application, the imaging light beam can be directly transmitted to the image sensor 31 after being split by the splitting element 50, and there is no need to set an infrared filter between the splitting element 50 and the image sensor 31 for additional filtering, thereby reducing the volume of the camera module 100 and improving the user experience.

[0089] In some embodiments, the beam splitting element 50 may include a second beam splitting surface, and the beam splitting element 50 may split the imaging light beam passing through the lens assembly 20 according to a beam ratio through the second beam splitting surface.

[0090] Specifically, the beam splitting element 50 can split the light beam passing through the lens assembly 20 according to beam ratios via a second beam splitting surface. The second beam splitting surface can be a dielectric beam splitting film. Using different dielectric beam splitting films, the beam can be split in equal proportions, or a larger proportion of the light beam can be transmitted to the image sensor 31 while a smaller proportion of the light beam is transmitted to the image sensor 32. In other words, the more light energy received by the image sensor 31 responsible for imaging, the better the imaging effect. The coating on the second beam splitting surface can be changed according to actual needs to enable the beam splitting element 50 to split the light according to different beam ratios, thereby improving the optical image stabilization effect and imaging quality of the electronic device.

[0091] It should be noted that the coatings on the first and second beam-splitting surfaces are different, and different coatings on the beam-splitting surfaces result in different beam-splitting effects.

[0092] For example, the RGB bands included in the visible light of the imaging light beam are separated and transmitted to the image sensor 31, and the IR band included in the imaging light beam is transmitted to the image sensor 32. In other embodiments, the light splitting element 50 can also split the light proportionally, for example, separating 90% of the visible light of the imaging light beam and transmitting it to the image sensor 31, and transmitting 10% of the visible light to the image sensor 32.

[0093] In some embodiments, the spectroscopic element 50 may be located between the optical path element and the imaging component 30, such as between the lens group 20 and the imaging component 30. The image sensor 32 and the image sensor 31 in the imaging component 30 are arranged on both sides of the spectroscopic element 50. The spectroscopic element 50 can be used to split the imaging light beam passing through the lens group 20, wherein the path length of the spectroscopic path of the split light beam reaching the image sensor 31 is less than or equal to the path length reaching the image sensor 32, and the spectroscopic path includes the internal path of the spectroscopic element 50 and the path from the spectroscopic element 50 to the imaging component 30.

[0094] Exemplarily, the spectroscopic element 50 includes an incident surface 51, a spectroscopic surface 52, a first exit surface 53, and a second exit surface 54. The image sensor 31 and the second exit surface 54 are arranged opposite to each other, and the image sensor 32 and the first exit surface 53 are arranged opposite to each other. The imaging light beam first enters the spectroscopic element 50 through the incident surface 51, reaches the spectroscopic surface 52, and is divided into two parts by the spectroscopic surface 52, namely the first light beam and the second light beam, and the first light beam and the second light beam are arranged at an angle. The first light beam is emitted from the spectroscopic element 50 through the first exit surface 53 and is transmitted to the image sensor 32. The second light beam is emitted from the spectroscopic element 50 through the second exit surface 54 and is transmitted to the image sensor 31. In some embodiments, the spectroscopic element 50 can be a triangular transmission prism.

[0095] In some embodiments, as shown in Figure 4, Figure 4 is a schematic diagram of a splitting path provided in an embodiment of the present application. In the figure, after the imaging light beam passes through the lens group 20, it is split into a first light beam and a second light beam by the splitting element 50. The first light beam is transmitted to the image sensor 32, and the light beam transmission path D1 includes the internal path d1 of the splitting element 50 and the path d2 from the splitting element 50 to the image sensor 32; the second light beam is transmitted to the image sensor 31, and the light beam transmission path D2 includes the internal path d3 of the splitting element 50 and the path d4 from the splitting element 50 to the image sensor 31. In some embodiments, since the transmission medium through which the first light beam and the second light beam pass is the same, that is, the transmission medium inside the spectrometer element 50 is the same, and the transmission medium from the spectrometer element 50 to different image sensors is the same, it is ensured that the path length of the light beam transmission path D1 is less than or equal to the path length of the light beam transmission path D2. For example, the path length of the light beam transmission path D1 in Figure 4 (a) is equal to the path length of the light beam transmission path D2, or the path length of the light beam transmission path D1 in Figure 4 (b) is less than the path length of the light beam transmission path D2. This ensures that the first light beam can reach the image sensor 32 at the same time or faster, so that the jitter amount of the light beam collected by the image sensor 32 is closer to or equal to the jitter amount of the light beam collected by the image sensor 31 (that is, the jitter amount of the light beam collected by the image sensor 31 is the actual jitter amount of the camera module 100), ensuring optical homology, and then performing jitter compensation based on the light beam collected by the image sensor 32 can obtain a better anti-shake effect and improve the user experience.

[0096] In some embodiments, image sensors 32 of varying sizes can be selected based on actual needs. Generally, the area of ​​image sensor 32 can be smaller than or equal to that of image sensor 31. A larger area of ​​image sensor 32 results in better imaging and a smaller error between the obtained first jitter amount and the actual jitter amount of camera module 100. In the embodiments of the present application, image sensor 32 does not participate in imaging, allowing for flexible selection to ensure optical homology with image sensor 31, reducing calculation errors introduced by parallax, and effectively reducing power consumption.

[0097] The detection structure 41 can be electrically connected to the image sensor 32. The detection structure 41 can be used to measure whether the image on the imaging component 30 is jittering to obtain a first jitter amount. Exemplarily, the detection structure 41 can be used to measure whether the image on the image sensor 32 is jittering.

[0098] In some embodiments, the imaging assembly 30 captures a first output beam via the image sensor 32. The first output beam is the input beam (i.e., the imaging beam) that sequentially passes through optical path elements, such as the optical path folding element 10 and the lens assembly 20. Furthermore, the detection structure 41 can receive an electrical signal transmitted by the image sensor 32, which is converted from the optical signal of the first output beam captured by the image sensor 32. The detection structure 41 can obtain a first image set based on the first output beam captured by the image sensor 32; the first image set includes at least two consecutive frames of images.

[0099] For example, when a user uses the electronic device 1000 to shoot a distant scene, the user may shake the electronic device 1000 during the shooting process, thereby causing the camera module 100 to shake during the shooting process. In order to avoid the problem of blurred shooting caused by shaking, an image sensor 32 is added in the present application. Before the image sensor 31 forms an image, the imaging light beam is first collected by the image sensor 32 to obtain a first image set. The first image set may include multiple consecutive images, such as n+2 images, and these n+2 images are arranged in the order of imaging, that is, the first imaging obtains the first frame image, and the second imaging obtains the second frame image.

[0100] In some embodiments, the image sensor 32 may be configured as an image sensor that independently outputs information. The image sensor 32 may be a small-sized sensor that may capture only a local field of view, such as only capturing images of a local area.

[0101] In some embodiments, the detection structure 41 determines a feature point set of two adjacent frames of images from a first image set; based on the feature point set of the two adjacent frames of images, a matching relationship is established between the feature points in the feature point set; based on the matching relationship, a first jitter amount can be determined, and the first jitter amount can include a pixel displacement between the two adjacent frames of images.

[0102] Specifically, as shown in Figure 5, the two adjacent frames of images can be the nth frame and the n+1th frame of image. First, the feature point set of the two adjacent frames of image can be obtained, for example, the feature point set of the nth frame of image is S1, and the feature point set of the n+1th frame of image is S2, wherein the feature point set S1 may include multiple feature points (such as feature point 1 and feature point 2), and the feature point set S2 may also include multiple corresponding feature points (such as feature point 1' and feature point 2'). Furthermore, a matching relationship between feature points can be established based on the feature points in the feature point set S1 and the feature point set S2. Then, the pixel displacement d between the two adjacent frames of image can be solved according to the matching relationship between the feature points to determine the first jitter amount. Since another image sensor is introduced in this application, and the imaging results of the image sensor are used to sense the jitter of the camera module 100, the control scheme in which the cumulative error of the hardware sensor cannot be perceived is supplemented, and the complete jitter information can be restored more accurately, thereby improving the anti-shake performance and imaging quality of the camera module 100.

[0103] In some embodiments, the anti-shake component 40 may determine a first compensation angle of the optical path folding element 10 according to the first shake amount through the controller 43 , and determine a first shake compensation amount based on the first compensation angle.

[0104] Specifically, the first compensation angle can be understood as the angle that the optical path element, such as the optical path folding element 10 or the lens group 20, needs to rotate along the X axis and along the Y axis, which can be expressed as θ i Indicates that θ i It can be obtained by formula 1, which is as follows:

[0105] Wherein, i represents the yaw axis (corresponding to the X axis in FIG3 ) and the tilt axis (corresponding to the Y axis in FIG3 ), and efl represents the equivalent focal length.

[0106] In some embodiments, the detection structure 42 can be fixedly connected to the housing 60 of the camera module 100 (not shown). The detection structure 42 can be used to detect whether the electronic device 1000 is shaking and obtain a second shaking amount. Exemplarily, the second shaking amount may include the angular velocity and / or acceleration of the camera module 100. The detection structure 42 can be an angular velocity detector and / or an acceleration detector of the electronic device 1000.

[0107] Controller 43 is electrically connected to detection structure 41, detection structure 42, displacement sensor 45, and actuation structure 44. Controller 43 can be configured to obtain a first jitter amount based on images captured by detection structure 41 and a second jitter amount based on data from detection structure 42. Controller 43 can then calculate a jitter compensation amount based on the first and second jitter amounts, and drive actuation structure 44 to perform jitter compensation.

[0108] In some embodiments, a jitter signal can be acquired through the detection structure 42 to obtain a second jitter amount; the jitter signal includes the current angular velocity and / or acceleration of the camera module 100; and the controller 43 determines a first jitter compensation amount based on the first jitter amount and the second jitter amount.

[0109] Specifically, the jitter signal acquired by the detection structure 42 may include the current angular velocity detected by the angular velocity meter of the electronic device 1000 and the current acceleration detected by the accelerometer of the electronic device 1000. In the embodiment of the present application, the jitter signal (which may include the angular velocity signal of the electronic device 1000 and the acceleration signal of the electronic device 1000) can be acquired by the detection structure 42 to preliminarily identify the jitter amount of the camera module 100 (i.e., the second jitter amount), that is, the jitter amount of the electronic device 1000 can be determined as the jitter amount of the camera module 100, and then the detection structure 41 is used to compensate for the actual jitter amount of the camera module 100 based on the imaging light beam captured by the image sensor 32, that is, the imaging modality and characteristics of the optical path in the image sensor 32 are used to calculate the first jitter amount. The first jitter amount can compensate for the uncompensated jitter caused by the error of the second jitter amount, thereby reducing the error, more accurately restoring the complete jitter information, and improving the anti-shake performance and imaging quality of the camera module 100.

[0110] In some embodiments, the detection structure 42 may determine the second jitter amount based on the current angular velocity and / or acceleration of the electronic device 1000 .

[0111] Specifically, the shaking angle can be calculated based on the gyroscope, θ = ∫(f g ,gyro), where f g Represents the gyroscope data filtering function. When the jitter is small, the displacement of the camera module 100 can be approximated by a small angle, that is, L = R*Tan(θ)≈R*θ=R*∫(f g ,gyro). The displacement information of the camera module 100 can be obtained through the accelerometer, L'=∫(f a ,acc), where f a Represents the accelerometer data filtering function. Because, L=L', that is, R*∫(f g ,gyro)=∫(f a ,acc), so the radius of rotation is Second jitter amount in, Indicates the compensation amount caused by rotation, The compensation amount caused by the translation of the rotation center, i represents the yaw axis and the tilt axis, respectively. In the embodiment of the present application, the jitter signal (which may include an angular velocity signal and an acceleration signal) can be obtained by the detection structure 42 to preliminarily identify the jitter amount (i.e., the second jitter amount) of the camera module 100. Then, the detection structure 41 is used to compensate for the actual jitter amount of the camera module 100 based on the imaging light beam collected by the image sensor 32. That is, the imaging mode and characteristics of the optical path in the image sensor 32 are used to calculate the first jitter amount. The first jitter amount is the uncompensated jitter caused by the compensation error of the second jitter amount, thereby reducing the error, being able to more accurately restore the complete jitter information, and improving the anti-shake performance and imaging quality of the camera module 100.

[0112] In some embodiments, the anti-shake component 40 can determine the second compensation angle of the optical path element according to the second jitter amount through the controller 43; and fuse the first compensation angle and the second compensation angle to obtain the first jitter compensation amount.

[0113] Specifically, a first compensation angle can be determined based on the first jitter amount, and a second compensation angle can be determined based on the second jitter amount. Because the first and second compensation angles have the same physical meaning, they can be compensated and fused by superposition. Optionally, the first and second compensation angles can be time-aligned to more accurately restore complete jitter information, thereby improving the anti-shake performance and image quality of the camera module 100.

[0114] For example, as shown in FIG6, FIG6 is a schematic diagram of a method for determining the jitter compensation amount of the optical path folding element provided by an embodiment of the present application. In the figure, the current first jitter information of the electronic device where the camera module is located can be obtained first, and the first jitter amount can be determined. The first jitter amount is obtained by the detection structure 41, that is, Where i=1, 2 represent the yaw axis and the tilt axis respectively; obtain the current second jitter information of the electronic device where the camera module is located, and determine the second jitter amount, the second jitter amount Right now Among them, i=1, 2 represent the yaw axis and the tilt axis respectively; the first jitter amount and the second jitter amount are fused, and the fused compensation amount is The negative sign represents rotating the optical path folding element 10 in the opposite direction. The magnitude of the rotation is Wherein, i=1, 2 represents the yaw axis and the tilt axis, respectively. Based on the fused jitter amount, jitter compensation information can be obtained according to the compensation information mapping model. The driving information of the anti-shake component is calculated based on the compensation information. Based on the driving information of the anti-shake component, the optical path folding element is driven to rotate in a specified direction.

[0115] In the anti-shake scenario of the periscope camera module 100 in the embodiment of the present application, an image sensor 32 is added to detect the shaking, which supplements the control scheme in which the errors generated by hardware sensors (for example, gyroscopes, accelerometers, and position sensors) cannot be perceived. Compared with some anti-shake algorithms, image feedback information is introduced in the anti-shake link, which plays a role in correcting and calibrating the sensor errors (i.e., correcting the accumulated errors of the anti-shake system). It can more accurately restore the complete shaking information, reduce the accumulated errors of the sensors, extend the upper limit of the exposure time for obtaining clear pictures, and improve the anti-shake performance and imaging quality of electronic equipment.

[0116] The actuating structure 44 is connected to at least one of the optical path folding element 10 and the lens group 20. That is, the actuating structure 44 can be connected to any one of the optical path folding element 10 and the lens group 20, or can be connected to two or more structures therein. In a periscope camera module, the actuating structure 44 can be connected to the optical path folding element 10, and in an upright camera module, the actuating structure 44 can be connected to the lens group 20. The actuating structure 44 can be used to drive at least one of the optical path folding element 10 and the lens group 20 to move for jitter compensation. When the actuating structure 44 drives two or more structures of the optical path folding element 10 and the lens group 20 to move, the actuating structure 44 can include multiple sub-actuating units, and the multiple sub-braking units are used to move different structures respectively.

[0117] In some embodiments, the actuating structure 44 may be a motion motor. For example, the actuating structure 44 may include a bracket, a magnet, an elastic supporting component, a circuit component, and the like.

[0118] The displacement sensor 45 can be connected to the actuating structure 44 or the structure driven by the actuating structure 44. The displacement sensor 45 is used to send a displacement feedback signal of the current displacement sensor 45 to the controller 43 when the actuating structure 44 drives the optical path folding element 10, the lens group 20 and other structures to perform anti-shake. It can be understood that the number of displacement sensors 45 can be one or more. When the actuating structure 44 moves multiple structures for anti-shake, displacement sensors 45 can be correspondingly provided on multiple structures, so that the controller 43 can grasp the displacement information of all structures in the camera module 100. Exemplarily, the displacement sensor 45 may include at least one of a linear displacement sensor 45 and an angular displacement sensor 45. Among them, the linear displacement sensor 45 is used to feed back the linear displacement information of the linear displacement sensor 45 during the movement process to the controller 43. The angular displacement sensor 45 is used to feed back the angular movement information of the angular displacement sensor 45 during the movement process to the controller 43.

[0119] In some embodiments, when driving an optical path element to perform jitter compensation, position information of the optical path element is sent to the controller 43 via the displacement sensor 45; the position information includes linear displacement information or angular movement information of the optical path element; the controller 43 determines a second jitter compensation amount of the optical path element based on the position information; and the optical path element is driven again via the actuating structure 44 to perform jitter compensation of the second jitter compensation amount.

[0120] For example, in a periscope camera module, the optical path elements include an optical path folding element 10. When the actuating structure 44 drives the optical path folding element 10 to perform jitter compensation, the position information of the optical path folding element 10 can be sent to the controller 43 through the displacement sensor 45; the position information may include linear displacement information or angular movement information of the optical path folding element 10; the controller 43 determines the second jitter compensation amount of the optical path folding element 10 according to the position information; and the actuating structure 44 drives the optical path folding element 10 again to perform jitter compensation of the second jitter compensation amount.

[0121] For example, the following specifically introduces an anti-shake process of a camera module 100, taking the example of the actuating structure 44 connecting to the optical path folding element 10 and driving the optical path folding element 10 to perform anti-shake:

[0122] When the anti-shake component 40 performs anti-shake supplement on the camera module 100, the controller 43 calculates the shake compensation amount based on the obtained first shake amount and the second shake amount, and then the controller 43 controls the actuating structure 44, and the actuating structure 44 drives the optical path folding element 10 to move according to the shake compensation amount, and performs shake compensation on the imaging light beam. The actuating structure 44 can drive the optical path folding element 10 to rotate around the axis according to the shake direction, and perform the first shake compensation on the imaging light beam. For example, when the shake direction of the imaging light beam received by the camera module 100 is clockwise along the X-axis, the actuating structure 44 drives the optical path folding element 10 to move clockwise along the X-axis. When the shake direction of the imaging light beam received by the camera module 100 is clockwise along the Y-axis, the actuating structure 44 drives the optical path folding element 10 to move clockwise along the Y-axis.

[0123] When the displacement sensor 45 participates in the anti-shake process and the actuating structure 44 is connected to the optical path folding element 10 for control, the displacement sensor 45 can be fixed to the optical path folding element 10. During the anti-shake process, the displacement sensor 45 is used to provide real-time feedback on the displacement information of the optical path folding element 10. When the displacement information transmitted by the displacement sensor 45 differs from the displacement amount of the first shake compensation, the controller 43 can control the actuating structure 44 to perform a second shake compensation based on the displacement information fed back by the displacement sensor 45 to ensure the accuracy of the shake compensation. For example, when the difference between the displacement information fed back by the displacement sensor 45 and the shake compensation amount is positive, the controller 43 controls the actuating structure 44 to drive the optical path folding element 10 to move a first displacement in the positive direction of the first shake compensation direction. The first displacement is the absolute value of the difference between the actual distance moved by the optical path folding element 10 and the shake compensation amount. When the difference between the displacement information fed back by the displacement sensor 45 and the shake compensation amount is negative, the controller 43 controls the actuating structure 44 to drive the optical path folding element 10 to move a first displacement in the opposite direction of the first shake compensation direction.

[0124] It is understandable that by providing the displacement sensor 45 , the controller 43 implements closed-loop feedback control over the driving of the actuating structure 44 , thereby improving the controller 43 's precise control over the current displacement of the actuating structure 44 and improving the anti-shake compensation accuracy.

[0125] It should be noted that the jitter process is a continuous process. In actual implementation, the above-mentioned first jitter compensation and second jitter compensation processes can be repeated continuously, so that the position of the optical path folding element 10 can be adjusted in real time, thereby ensuring the final jitter compensation accuracy.

[0126] In some embodiments, the actuating structure 44 may be connected to the optical path folding element 10 via a bearing, a spring, or an SMA suspension wire.

[0127] In some embodiments, the imaging frame rate of the image sensor 32 is greater than or equal to the imaging frame rate of the image sensor 31 .

[0128] Exemplarily, the imaging frame rate of the image sensor 32 is greater than the imaging frame rate of the image sensor 31. For example, the imaging frame rate of the image sensor 32 may be 10 times the imaging frame rate of the image sensor 31. It is understandable that the higher the frame rate of image acquisition, the faster the image is acquired. When the imaging frame rate of the image sensor 32 is greater than the imaging frame rate of the image sensor 31, the detection structure 41 may first perform image acquisition based on the image acquisition area of ​​the image sensor 32 to obtain a first jitter amount, and then the anti-shake component 40 may perform anti-shake on the camera module 100 and perform anti-shake compensation on the imaging light beam, so that the image finally acquired by the image sensor 31 is clearer.

[0129] After driving the optical path element for anti-shake, the imaging component 30 can collect the second output beam through the image sensor 31 to obtain the first image. The second output beam is the beam of the imaging beam passing through the optical path element after shake compensation.

[0130] 7 , after compensating the optical path folding element 10 , the imaging assembly 30 can capture the second output light beam through the image sensor 31 to obtain a first image. The first image can be an image that the user needs to capture.

[0131] In other implementations, the anti-shake assembly 40 may not be provided with the displacement sensor 45 .

[0132] In some embodiments, the same technical contents as those of the camera module 100 in the above embodiments are not described in detail. FIG8 is a partial structural exploded diagram of another embodiment of the camera module 100 shown in FIG2.

[0133] As shown in FIG8 , image sensor 31 and image sensor 32 can both be located on the light-emitting side of lens assembly 20. Image sensor 31 is connected to image sensor 32. The image acquisition surfaces of image sensor 31 and image sensor 32 are positioned toward lens assembly 20. In this manner, camera module 100 can be provided without beam splitter 50, further reducing the size of camera module 100.

[0134] Figure 9 is a schematic diagram of the assembly of an embodiment of the image sensor 31 and the image sensor 32. Figure 10 is a schematic diagram of the assembly of another embodiment of the image sensor 31 and the image sensor 32. In Figures 9 and 10, the image sensor 31 and the image sensor 32 are schematically distinguished by a fill pattern.

[0135] As shown in FIG9 , the image sensor 32 can be arranged around the image sensor 31. As shown in FIG10 , the image sensor 32 can be embedded in the image sensor 31. To ensure imaging quality, the image sensor 32 can be deployed at the edge of the image sensor 31 or occupy a small area within the image sensor 31. It is understood that the arrangement of the image sensors 31 and 32 can be designed according to actual needs and is not limited by this application.

[0136] The number of image sensors 32 can be one or more. For example, FIG10 shows four image sensors 32 arranged at intervals.

[0137] In some embodiments, the same technical contents as those of the camera module 100 in the above embodiments are not described in detail. FIG11 is a schematic structural diagram of another embodiment of the camera module 100 shown in FIG2 .

[0138] FIG11 is a partially exploded schematic diagram of another embodiment of a camera module 100. The camera module 100 in FIG11 is a vertical camera module. Compared with a periscope camera module, the vertical camera module 100 may not be provided with the optical path folding element 10, but the remaining components have similar functions to those of the periscope camera module.

[0139] That is, the camera module 100 may be a common camera module 100 , and the optical axis direction of the camera module 100 is the thickness direction of the electronic device 1000 , that is, the X-axis direction.

[0140] For example, the camera module 100 may include a housing 60, a lens assembly 20, an imaging component 30, and an anti-shake assembly 40. The lens assembly 20 may constitute an optical element of the camera module 100. The anti-shake assembly 40 may include a detection structure 41, a detection structure 42, a controller 43, an actuation structure 44, and a displacement sensor 45. The imaging component 30 may include an image sensor 31 and an image sensor 32.

[0141] For example, as shown in FIG12 , the optical element in the upright camera module may also include the above-mentioned spectroscopic element 50 . For a detailed description of the spectroscopic element 50 , reference may be made to the above description of the spectroscopic element 50 , which will not be repeated here.

[0142] For example, light outside the electronic device 1000 can directly enter the lens assembly 20 and then be transmitted to the imaging component 30. In some embodiments, the controller 43 can drive the actuator 44 to move the lens assembly 20 to achieve anti-shake compensation.

[0143] In summary, the current optical image stabilization technology has the problem that the cumulative error caused by the physical limitations of the sensor cannot be completely eliminated by the algorithm. The camera module proposed in the embodiment of the present application adds an imaging sensor (i.e., image sensor) and utilizes the different imaging characteristics of the two imaging sensors in the camera module to optimize the motion compensation residual settlement, solve the problems of image blur and no information feedback from the imaging sensor under dark light and long exposure conditions, form a full-link closed-loop anti-shake framework, and improve the anti-shake performance.

[0144] The present application provides a computer storage medium, characterized in that the computer storage medium stores a computer program, and when the computer program is executed by a processor, any of the above-mentioned anti-shake methods is implemented.

[0145] An embodiment of the present application provides an electronic device, comprising a processor configured to support the electronic device in implementing the corresponding functions of any of the aforementioned anti-shake methods. The electronic device may further comprise a memory coupled to the processor and storing program instructions and data necessary for the electronic device. The electronic device may further comprise a communication interface for the electronic device to communicate with other devices or a communication network.

[0146] The present application provides a chip system, which includes a processor for supporting an electronic device in implementing the functions described above, such as generating or processing information involved in one of the aforementioned anti-shake methods. In one possible design, the chip system also includes a memory for storing program instructions and data necessary for the electronic device. The chip system can be composed of a chip or can include a chip and other discrete components.

[0147] The present application provides a computer program, characterized in that the computer program includes instructions, and when the computer program is executed by a computer, the computer is caused to perform the above-mentioned anti-shake method.

[0148] In the above embodiments, the description of each embodiment has its own focus. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0149] It should be noted that for the aforementioned method embodiments, for the sake of simplicity, they are all expressed as a series of action combinations, but those skilled in the art should be aware that this application is not limited by the order of the actions described, because according to this application, certain steps may be performed in other orders or simultaneously. Secondly, those skilled in the art should also be aware that the embodiments described in this specification are all preferred embodiments, and the actions and modules involved are not necessarily required by this application.

[0150] In the several embodiments provided in this application, it should be understood that the disclosed devices can be implemented in other ways. For example, the device embodiments described above are merely illustrative. For example, the division of the above-mentioned units is only a logical function division. In actual implementation, there may be other division methods, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, and the indirect coupling or communication connection of devices or units can be electrical or other forms.

[0151] The units described above as separate components may or may not be physically separate, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed across multiple network units. Some or all of these units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0152] In addition, the functional units in the embodiments of the present application may be integrated into a single processing unit, or each unit may exist physically separately, or two or more units may be integrated into a single unit. The aforementioned integrated units may be implemented in the form of hardware or software functional units.

[0153] If the above-mentioned integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application is essentially or the part that contributes to the prior art or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including a number of instructions for enabling a computer device (which can be a personal computer, a server or a network device, etc., specifically a processor in a computer device) to execute all or part of the steps of the above-mentioned methods of each embodiment of the present application. Among them, the aforementioned storage medium may include: U disk, mobile hard disk, magnetic disk, optical disk, read-only memory (Read-Only Memory, abbreviated: ROM) or random access memory (Random Access Memory, abbreviated: RAM) and other media that can store program codes.

[0154] As described above, the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A camera module, characterized in that: The camera module includes an anti-shake component and one or more optical path elements and an imaging component arranged in sequence along a light beam transmission direction; wherein the imaging component includes a first image sensor and a second image sensor, and the anti-shake component is connected to at least one of the one or more optical path elements; The first image sensor is used to: detect a first shaking amount of the camera module; The anti-shake component is used to: drive at least one of the one or more optical path elements to perform jitter compensation based on the first jitter amount; The second image sensor is used to perform optical imaging.

2. The camera module according to claim 1, characterized in that: The first image sensor is specifically used to: collect a first output light beam, where the first output light beam is a light beam obtained by the input light beam passing through the one or more optical path elements; The anti-shake component includes a controller and an actuating structure, and the anti-shake component is specifically used to: determine the first jitter amount between the input light beam and the first output light beam through the controller; determine a first jitter compensation amount of the first jitter amount; driving at least one of the one or more optical path elements to perform jitter compensation of the first jitter compensation amount through the actuating structure; The second image sensor is specifically used to collect a second output light beam to obtain a first image, where the second output light beam is a light beam obtained by the input light beam passing through the one or more optical path elements after jitter compensation.

3. The camera module as claimed in claim 2, characterized in that: The one or more optical path elements include a beam splitter and a mirror group, wherein the beam splitter is located between the mirror group and the imaging component, and the first image sensor and the second image sensor in the imaging component are arranged on both sides of the beam splitter, and the beam splitter is used to: The input light beam passing through the mirror group is split.

4. The camera module as claimed in claim 3, characterized in that: The beam splitter element comprises a first beam splitter surface, and the beam splitter element is specifically used to split the input light beam passing through the mirror assembly according to wavelength bands through the first beam splitter surface.

5. The camera module as claimed in claim 3, characterized in that: The beam splitting element comprises a second beam splitting surface, and the beam splitting element is specifically used to split the input light beam passing through the mirror assembly according to a beam ratio through the second beam splitting surface.

6. The camera module according to claim 1 or 2, characterized in that: The first image sensor and the second image sensor are located on the light-exiting side of at least one optical path element among the one or more optical path elements, and the first image sensor is connected to the second image sensor.

7. The camera module according to claim 1 or 2, characterized in that: The first image sensor and the second image sensor are located on the light-emitting side of at least one optical path element among the one or more optical path elements, and the first image sensor is embedded in the second image sensor.

8. The camera module according to any one of claims 1 to 7, characterized in that: An imaging frame rate of the first image sensor is greater than an imaging frame rate of the second image sensor.

9. The camera module according to any one of claims 1 to 8, characterized in that: The controller is used to: Acquire a second jitter amount; and determine the first jitter compensation amount according to the first jitter amount and the second jitter amount.

10. The camera module according to any one of claims 2 to 9, characterized in that: The anti-shake component further includes a displacement sensor, which is connected to the actuating structure. The anti-shake component is further used for: When driving the optical path element to perform jitter compensation, the position information of the optical path element is sent to the controller through the displacement sensor; the position information includes linear displacement information or angular movement information of the optical path element; Determining, by the controller, a second jitter compensation amount of the optical path element according to the position information; The optical path element is driven again by the actuating structure to perform jitter compensation of the second jitter compensation amount.

11. The camera module according to any one of claims 2 to 10, characterized in that: The one or more optical path elements include a lens group, the anti-shake component is connected to the lens group, and the anti-shake component is specifically used to: drive the lens group to perform the first jitter compensation amount jitter compensation through the actuating structure.

12. The camera module according to any one of claims 2 to 10, characterized in that: The one or more optical path elements include an optical path folding element, the anti-shake component is connected to the optical path folding element, and the anti-shake component is specifically used to: drive the optical path folding element to perform jitter compensation of the first jitter compensation amount through the actuating structure.

13. An electronic device, characterized in that: The electronic device comprises the camera module according to any one of claims 1 to 12 and a first detection unit, wherein the first detection unit is used to: The first jitter amount is determined based on the first output light beam captured by the first image sensor.

14. The electronic device according to claim 13, characterized in that: The first detection unit is specifically used for: Based on the first output light beam, a first image set is obtained; the first image set includes at least two frames of continuous images; Determine a feature point set of two adjacent frames of images from the first image set; Based on the feature point sets of the two adjacent frames of images, establishing a matching relationship between the feature points in the feature point sets; Based on the matching relationship, the first jitter amount is determined.

15. The electronic device according to claim 13 or 14, characterized in that: The electronic device further includes a second detection unit, wherein the second detection unit is configured to: A shaking signal is acquired, and a second shaking amount is determined based on the shaking signal; the shaking signal includes a current angular velocity and / or acceleration of the electronic device, and the second shaking amount includes a shaking angle or shaking displacement information.

16. An anti-shake method, characterized in that: Applied to an electronic device, the electronic device includes a camera module, the camera module includes an anti-shake component and one or more optical path elements and an imaging component arranged in sequence along a light beam transmission direction; wherein the imaging component includes a first image sensor and a second image sensor, and the anti-shake component is connected to at least one of the one or more optical path elements; the method includes: Detecting a first jitter amount of the camera module by using the first image sensor; By means of the anti-shake component, driving at least one of the one or more optical path elements to perform jitter compensation based on the first jitter amount; Optical imaging is performed by means of the second image sensor.

17. The method according to claim 16, characterized in that: The anti-shake component includes a controller and an actuating structure, and the first image sensor is used to detect a first shake amount of the camera module, including: Collecting a first output light beam by the first image sensor, where the first output light beam is a light beam obtained by the input light beam passing through the one or more optical path elements; determining, by the controller, the first jitter amount between the input light beam and the first output light beam; determining a first jitter compensation amount of the first jitter amount; The step of driving at least one of the one or more optical path elements to perform jitter compensation based on the first jitter amount by the anti-shake component includes: driving at least one of the one or more optical path elements to perform jitter compensation of the first jitter compensation amount through the actuating structure; The performing optical imaging by the second image sensor includes: The second output light beam is collected by the second image sensor to obtain the first image, where the second output light beam is a light beam of the input light beam passing through the one or more optical path elements after jitter compensation.

18. The method according to claim 17, characterized in that: The electronic device further includes a first detection unit, and the method further includes: The first jitter amount is determined by the first detection unit based on the first output light beam collected by the first image sensor.

19. The method according to claim 18, characterized in that The determining the first jitter amount based on the first output light beam collected by the first image sensor by the first detection unit includes: Based on the first output light beam, a first image set is obtained; the first image set includes at least two frames of continuous images; Determine a feature point set of two adjacent frames of images from the first image set; Based on the feature point sets of the two adjacent frames of images, establishing a matching relationship between the feature points in the feature point sets; Based on the matching relationship, the first jitter amount is determined.

20. The method according to claims 16-19, characterized in that: The electronic device further includes a second detection unit, and the method further includes: The second detection unit obtains a shaking signal, and determines a second shaking amount based on the shaking signal; the shaking signal includes a current angular velocity and / or acceleration of the electronic device, and the second shaking amount includes a shaking angle or shaking displacement information.

21. The method according to claim 20, characterized in that The determining a first jitter compensation amount of the first jitter amount includes: A second jitter amount is acquired by the controller, and the first jitter compensation amount is determined according to the first jitter amount and the second jitter amount.

22. An electronic device, characterized in that: include: A memory, one or more processors; the memory is coupled to the one or more processors, the memory is used to store computer program code, the computer program code includes computer instructions, and the one or more processors call the computer instructions to enable the electronic device to execute the method as described in any one of claims 16-21.

23. A chip system, characterized in that: The chip system includes at least one processor, a memory and an interface circuit. The memory, the interface circuit and the at least one processor are interconnected by lines. Instructions are stored in the at least one memory. When the instructions are executed by the processor, the method described in any one of claims 16 to 21 is implemented.

24. A computer-readable storage medium comprising instructions, characterized in that: When the instructions are executed on an electronic device, the electronic device executes the method as claimed in any one of claims 16 to 21.

25. A computer program product, characterized in that The computer program product comprises computer instructions, and when the computer instructions are run on an electronic device, the electronic device executes the method as claimed in any one of claims 16 to 21.

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