Foldable electronic device comprising shielding material

Abstract

A foldable electronic device is disclosed. The foldable electronic device comprises: a first housing; a second housing; a hinge assembly which rotatably connects the first housing and the second housing and which includes a shielding material; and a display including a light-emitting layer, a support layer which supports the light-emitting layer and includes a pattern part that has a plurality of slits so that the foldable electronic device is bent on the basis of a folding axis when the foldable electronic device is folded, and a conductive pattern layer which is arranged below the light-emitting layer and which includes a conductive pattern that electromagnetically interacts with an external object, being at least partially arranged in the first housing and the second housing, and being connected to the hinge assembly.

Description

Foldable electronic devices containing shielding materials

[0001] The present disclosure relates to a foldable electronic device including a hinge assembly.

[0002] The foldable electronic device may have a folded state or an open state. While the foldable electronic device is changing between the folded and open states, each of the housings of the foldable electronic device may be interlocked and rotate about a folding axis. The structures in the area surrounding the folding axis may include shapes other than a flat shape (e.g., a pattern, a slit, or a repeated shape of a hole) to provide a folding structure. The area surrounding the folding axis may be difficult to provide a continuous surface as well as deformation, making it difficult to adhere a shielding material.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above-described matters constitute prior art related to the present disclosure.

[0004] A foldable electronic device may include a first housing and a second housing. The foldable electronic device may further include a hinge assembly. The hinge assembly may rotatably connect the first housing and the second housing. The foldable electronic device may further include a display. The display may include a light-emitting layer. The display may further include a support layer. The support layer may include a pattern portion having a plurality of slits formed therein to support the light-emitting layer and allow the flexible display to bend around a folding axis when the foldable electronic device is folded. The display may further include a conductive layer. The conductive layer may include a conductive layer disposed under the light-emitting layer and including a conductive pattern configured to electromagnetically interact with an external object. The display may be partially disposed within the first housing and the second housing. The hinge assembly may include a shielding material disposed under the pattern portion and spaced apart from the conductive layer.

[0005] A foldable electronic device may include a first housing and a second housing. The foldable electronic device may further include a hinge assembly. The hinge assembly may rotatably connect the first housing and the second housing. The foldable electronic device may further include a display. The display may include a light-emitting layer, a pattern portion that supports the light-emitting layer and has a plurality of slits formed therein so that the flexible display is bent about a folding axis when the foldable electronic device is folded, a first rigid portion disposed within the first housing and in contact with the pattern portion, a second rigid portion disposed within the second housing, connected to the hinge assembly, and in contact with the pattern portion, and a support plate including a pattern portion between the first rigid portion and the second rigid portion. The support plate may include a plurality of conductive pattern layers of a digitizer mounted within the support plate, wherein the pattern portion includes a plurality of slits such that the display can be bent together with the support plate along the folding axis of the electronic device. At least a portion of the first rigid portion of the support plate and at least a portion of the second rigid portion of the support plate may have at least one shielding layer. At least a portion of the first hinge plate and at least a portion of the second hinge plate disposed below the pattern portion of the support plate may have at least one shielding layer.

[0006] FIG. 1A illustrates an example of an unfolded state of a foldable electronic device according to one embodiment.

[0007] FIG. 1B illustrates an example of a folded state of a foldable electronic device according to one embodiment.

[0008] FIG. 1C is an exploded view of a foldable electronic device according to one embodiment.

[0009] FIG. 2 is an exploded view of the housings and hinge assembly of an exemplary foldable electronic device.

[0010] Figure 3a shows the relationship between the display and the hinge assembly in a folded state.

[0011] FIG. 3b is a cross-sectional view of a foldable electronic device having an exemplary support plate in an unfolded state.

[0012] FIG. 3c is a cross-sectional view of a foldable electronic device in a folded state, including an electromagnetic induction panel separated from a plate.

[0013] Figure 4a is a rear view of an exemplary flexible display.

[0014] FIG. 4b is a cross-sectional view of a support layer and a conductive layer of an exemplary foldable display.

[0015] Figure 5 shows a plan view of the hinge assembly.

[0016] Figures 6a, 6b and 6c are exemplary cross-sectional views showing the structure of a plate of an exemplary hinge assembly.

[0017] Figure 7 is an exploded view showing the structure of a plate of an exemplary hinge assembly.

[0018] FIG. 8 is a block diagram of an electronic device within a network environment according to various embodiments.

[0019] FIG. 1A illustrates an example of an unfolded state of an exemplary electronic device, FIG. 1B illustrates an example of a folded state of the exemplary electronic device, and FIG. 1C is an exploded view of the exemplary electronic device. FIG. 2 is an exploded view of the housings and hinge assembly of the exemplary foldable electronic device.

[0020] Referring to FIGS. 1A, 1B, and 1C, an electronic device (101) may include a first housing (110), a second housing (120), and a flexible display (130). The electronic device (101) may be a device in which the first housing (110) and the second housing (120) can come into contact with each other. The electronic device (101) may be referred to as a foldable electronic device.

[0021] In one embodiment, the first housing (110) may include a first surface (111), a second surface (112) spaced from the first surface (111), and a first side surface (113) enclosing at least a portion of the first surface (111) and the second surface (112). In one embodiment, the electronic device (101) may further include at least one camera (134) exposed through a portion of the second surface (112).

[0022] In one embodiment, the second housing (120) may include a third side (121), a fourth side (122) facing and spaced from the third side (121), and a second side (123) surrounding at least a portion of the third side (121) and the fourth side (122). The electronic device (101) may further include a display panel (135) disposed on the second support member (180). At least a portion of the fourth side (122) of the second housing (120) may be formed by the display panel (135). The electronic device (101) may further include a camera (116). The camera (126) may be disposed inside the second housing (120) to face the fourth side (122) so as to acquire an external image through the fourth side (122). The camera (126) may be an under display camera (UDC) that is positioned below the display panel (135), is covered by the display panel (135), and is configured to acquire an external image through light passing through the display panel (135). In one embodiment, the camera (126) is positioned below the display panel (135), and the display panel (135) may include an opening aligned with the camera (126) lens to transmit light from the outside to the camera (126).

[0023] According to one embodiment, each of the first housing (110) and the second housing (120) may include a first protective member (114) and a second protective member (124), respectively. The first protective member (114) and the second protective member (124) may be disposed on the first side (111) and the third side (121) along the periphery of the flexible display (130). The first protective member (114) and the second protective member (124) may prevent or reduce the ingress of foreign substances (e.g., dust or moisture) through the gap between the flexible display (130) and the first housing (110) and the second housing (120). The first protective member (114) may be arranged along the edge of the first display area (131), and the second protective member (124) may be arranged along the edge of the second display area (132). The first protective member (114) may be formed by being attached to the first side (113) of the first housing (110), or may be formed integrally with the first side (113). The second protective member (124) may be formed by being attached to the second side (123) of the second housing (120), or may be formed integrally with the second side (123).

[0024] In one embodiment, the first housing (110) may provide a space formed by the first face (111), the second face (112), and the second side (123) as a space for arranging components of the electronic device (101). The second housing (120) may provide a space formed by the third face (121), the fourth face (122), and the second side (123) as a space for arranging components of the electronic device (101).

[0025] In one embodiment, the first side (113) and the second side (123) may include a conductive material, a non-conductive material, or a combination thereof. For example, the second side (123) may include a conductive member (128) and a non-conductive member (129). The conductive member (128) may include a plurality of conductive members and may be spaced apart from each other. The non-conductive member (129) may be disposed between the plurality of conductive members. An antenna structure may be formed by some or a combination of the plurality of conductive members and the plurality of non-conductive members.

[0026] In one embodiment, the second side (123) may be pivotally connected to the first side (113) via a hinge assembly (160) disposed on a hinge cover (165). The hinge assembly (160) may include a hinge (162), a first hinge plate (166), and a second hinge plate (167). The first hinge plate (166) may be connected to the first housing (110), and the second hinge plate (167) may be connected to the second housing (120).

[0027] In one embodiment, the flexible display (130) may include a window exposed to the outside. The window may be formed as a protective layer to protect the surface of the flexible display (130) and transmit visual information provided from the flexible display (130) to the outside. The window may include a glass material such as ultra-thin glass (UTG) or a polymer material such as polyimide (PI). In one embodiment, the flexible display (130) may form a first side (111) of the first housing (110) and a third side (121) of the second housing (120) across the hinge assembly (160). The flexible display (130) may be disposed on the first support member (170) and the second support member (180). The flexible display (130) may include a first display area (131) disposed on a first support member (170), a second display area (132) disposed on a second support member (180), and a third display area (133) between the first display area (131) and the second display area (132). The first display area (131), the second display area (132), and the third display area (133) may form the front surface of the flexible display (130).

[0028] According to one embodiment, an opening may be formed in a portion of a screen display area of ​​the flexible display (130), or a recess or opening may be formed in a support member (e.g., a bracket) that supports the flexible display (130). The electronic device (101) may include at least one of a sensor module (138) and a camera (136) aligned with the recess or the opening. For example, the first display area (131) may further include a camera (136) that can acquire an image from the outside through a portion of the first display area (131) and a sensor module (138) that generates an electric signal or data value corresponding to an external environmental state. According to one embodiment, at least one of a sensor module (138) and a camera (136) may be included on the back of the flexible display (130) corresponding to the first display area (131) or the second display area (132) of the flexible display (130). For example, at least one of the camera (136) and the sensor module (138) may be disposed below the flexible display (130) and may be covered by the flexible display (130). At least one of the camera (136) and the sensor module (138) may be covered by the flexible display (130) and may not be exposed to the outside. However, the present invention is not limited thereto, and the flexible display (130) may include an opening that exposes the camera (136) and the sensor module (138) to the outside. Although not shown in FIGS. 1A and 1B , in one embodiment, the flexible display (130) may further include a rear surface opposite the front surface. In one embodiment, the flexible display (130) may be supported by a first support member (170) and a second support member (180).

[0029] In one embodiment, the hinge assembly (160) may be configured to rotatably connect a first support member (170) forming a portion of the first housing (110) and a second support member (180) forming a portion of the second housing (120). The first support member (170) may be connected to or supported by a first hinge plate (166). The second support member (180) may be connected to or supported by a second hinge plate (167).

[0030] In one embodiment, a hinge cover (165) surrounding the hinge assembly (160) may be at least partially exposed between the first housing (110) and the second housing (120) while the electronic device (101) is in a folded state. The hinge cover (165) may be covered by the first housing (110) and the second housing (120) while the electronic device (101) is in an unfolded state.

[0031] In one embodiment, the electronic device (101) can be folded about a folding axis (137) passing through the hinge cover (165) (or hinge assembly (160)). For example, the hinge cover (165) can be disposed between a first housing (110) and a second housing (120) of the electronic device (101) to enable the electronic device (101) to be bent, curved, or folded. For example, the first housing (110) is connected to the second housing (120) through a hinge assembly (160) disposed in the hinge cover (165) and can rotate about the folding axis (137). For example, the hinge assembly (160) can include hinges (162) disposed at both ends of a first hinge plate (166) and a second hinge plate (167). The hinge (162) includes hinge gears interlocked with each other inside, so that the first hinge plate (166) and the second hinge plate (167) can rotate about the folding axis. The first housing (110) coupled to the first hinge plate (166) is connected to the second housing (120) coupled to the second hinge plate (167), and can rotate about the folding axis by the hinges (162).

[0032] In one embodiment, the electronic device (101) can be folded so that the first housing (110) and the second housing (120) face each other by rotating about the folding axis (137). In one embodiment, the electronic device (101) can be folded so that the first housing (110) and the second housing (120) cover or overlap each other.

[0033] Referring to FIG. 1C, the electronic device (101) may include a first support member (170), a second support member (180), a hinge assembly (160), a flexible display (130), a printed circuit board (150), a battery (155), a hinge cover (165), an antenna (185), a display panel (135), and a rear plate (190). According to one embodiment, the electronic device (101) may omit at least one of the components or additionally include another component.

[0034] The first housing (110) and the second housing (120) can support a flexible display (e.g., the flexible display (130) of FIG. 1A). The flexible display panel can include a front surface that provides information by emitting light and a back surface facing the front surface. When the first side (111) of the first housing (110) faces the third side (121) of the second housing (120), the side facing the first display area (131) of the flexible display (130) and the side facing the second display area (132) can be in a folded state facing each other. When the first side (111) of the first housing (110) and the third side (121) of the second housing (120) face the same direction, the flexible display (130) can be in an unfolded state in which the first display area (131) and the second display area (132) of the flexible display (130) face the same direction.

[0035] In one embodiment, the electronic device (101) can provide an unfolded state in which the first housing (110) and the second housing (120) are fully folded out by the hinge assembly (160). The first support member (170) is connected to the second support member (180) through the hinge assembly (160) to switch the electronic device (101) between the folded state and the unfolded state. The rotation of the hinge gear (163) allows the first support member (170) and the second support member (180) attached to the hinge plates (166, 167) of the hinge assembly (160) to move. The hinge plates (166, 167) may include a first hinge plate (166) coupled with a first support member (170) and a second hinge plate (167) coupled with a second support member (180). By rotation of the hinge gear (163), the electronic device (101) may be switched between a folded state and an unfolded state.

[0036] The hinge assembly (160) may include a hinge (162), a first hinge plate (166), and a second hinge plate (167). The hinge (162) may include a hinge gear (163) that pivotally enables the first hinge plate (166) and the second hinge plate (167). The hinge gear (163) may rotate while interlocking with each other to rotate the first hinge plate (166) and the second hinge plate (167). The hinge (162) may include a plurality of hinge assemblies. Each of the plurality of hinge assemblies may be disposed on both sides formed by the first hinge plate (166) and the second hinge plate (167).

[0037] The first hinge plate (166) can be coupled with the first support member (170) of the first housing (110), and the second hinge plate (167) can be coupled with the second support member (180) of the second housing (120). The first housing (110) and the second housing (120) can rotate in response to the rotation of the first hinge plate (166) and the second hinge plate (167).

[0038] The first housing (110) may include a first support member (170) and a second support member (180). The first support member (170) may be partially wrapped by the first side (113), and the second support member (180) may be partially wrapped by the second side (123). The first support member (170) may be formed integrally with the first side (113), and the second support member (180) may be formed integrally with the second side (123). According to one embodiment, the first support member (170) may be formed separately from the first side (113), and the second support member (180) may be formed separately from the second side (123). The first side (113) and the second side (123) may be formed of a metallic material, a non-metallic material, or a combination thereof, and may be used as an antenna.

[0039] The first support member (170) can be coupled to the flexible display (130) on one side and to the rear plate (190) on the other side. The second support member (180) can be coupled to the flexible display (130) on one side and to the display panel (135) on the other side.

[0040] A printed circuit board (150) and a battery (155) may be placed between the surface formed by the first support member (170) and the second support member (180) and the surface formed by the display panel (135) and the rear plate (190). The printed circuit board (150) may be separated so that it may be placed on each of the first support member (170) of the first housing (110) and the second support member (180) of the second housing (120). The shapes of the first printed circuit board (151) placed on the first support member (170) and the second printed circuit board (152) placed on the second support member (180) may be different from each other depending on the space inside the electronic device. Components for implementing various functions of the electronic device (101) may be placed on the first printed circuit board (151) and the second printed circuit board (152). According to one embodiment, the first printed circuit board (151) may have components for implementing the overall function of the electronic device (101) arranged thereon, and the second printed circuit board (152) may have electronic components for implementing some functions of the first printed circuit board (151) arranged thereon, or components for driving the display panel (135) arranged on the fourth surface (122) may be arranged thereon. The first printed circuit board (151) and the second printed circuit board (152) may be electrically connected by a flexible printed circuit board (140).

[0041] The battery (155) may be, for example, a device for supplying power to at least one component of the electronic device (101), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (155) may be disposed substantially on the same plane as the printed circuit board (150). The substantially coplanar surfaces of the printed circuit board (150) and the battery (155) may be disposed on one surface of the first support member (170) and the second support member (180) (e.g., the surface facing the second surface (112) and the fourth surface (122), or the surface facing the display panel (135) and the rear plate (190). For example, a flexible display (130) may be placed on the first side (111) and the third side (121), and a printed circuit board (150) and a battery (155) may be placed on the second side (112) and the fourth side (122) facing the side on which the flexible display (130) is placed.

[0042] Antenna (185) may be positioned between the rear plate (190) and the battery (155) in one embodiment. Antenna (185) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. Antenna (185) may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging.

[0043] Referring to FIG. 2, the hinge assembly (160) may include a hinge (162), a hinge cover (165), a first hinge plate (166), a second hinge plate (167), and bar-shaped plates (261-1, 261-2, 261-3, 262-1, 262-2). The hinge assembly (160) may pivotally connect a first housing (110) (or a first support member (170) of the first housing (110)) and a second housing (120) (or a second support member (180) of the second housing (120)). The hinge (162) may pivotally connect the first housing (110) and the second housing (120). The hinge (162) can be coupled to the first housing (110) (or the first support member (170) of the first housing (110)) on the right side with respect to the folding axis (137). The hinge (162) can be coupled to the second housing (120) (or the second support member (180) of the second housing (120)) on the left side with respect to the folding axis (137). When the electronic device (101) is folded with respect to the folding axis (137), the first support member (170) and the second support member (180) connected to the hinge (162) can rotate with respect to the folding axis (137).

[0044] The hinge (162) can be connected to the first hinge plate (166) and the second hinge plate (167). The hinge (162) can be connected to the first hinge plate (166) on the right side with respect to the folding axis (137). The hinge (162) can be connected to the second hinge plate (167) on the left side with respect to the folding axis (137). The first hinge plate (166) can be connected to the first housing (110) (or the first support member (170)). The second hinge plate (167) can be connected to the second housing (120) (or the second support member (180)). When the electronic device (101) is folded based on the folding axis (137), the first hinge plate (166) and the second hinge plate (167) connected to the hinge (162) can rotate about the folding axis (137). According to the rotation of the first hinge plate (166) and the second hinge plate (167), the first housing (110) (or the first support member (170)) and the second housing (120) (or the second support member (180)) can rotate about the folding axis (137).

[0045] The first hinge plate (166) and the second hinge plate (167) may be spaced apart from each other. The first hinge plate (166) and the second hinge plate (167) may be line-symmetrical with respect to the folding axis (137). The hinge assembly (160) may have a space between the first hinge plate (166) and the second hinge plate (167) due to the separation of the first hinge plate (166) and the second hinge plate (167).

[0046] The flexible display (130) may be supported by a first hinge plate (166), a second hinge plate (167), a first support member (170), and a second support member (180). To fill the space between the first hinge plate (166) and the second hinge plate (167), bar-shaped plates (261-1, 261-2, 261-3, 262-1, 262-2) may be included. The bar-shaped plates (261-1, 261-2, 261-3, 262-1, 262-2) may be placed between the first hinge plate (166) and the second hinge plate (167). The bar-shaped plates (261-1, 261-2, 261-3, 262-1, 262-2) can support the flexible display (130) by filling the space between the first hinge plate (166) and the second hinge plate (167). The bar-shaped plates (261-1, 261-2, 261-3, 262-1, 262-2) can reduce damage to the flexible display (130) by limiting the flexible display (130) from directly contacting the hinge gear or the connecting member (e.g., screw). Some of the plates (261-1, 261-2, 261-3) of the bar-shaped plates can be assembled to the hinge assemblies (162-1, 162-2, 162-3).

[0047] The number of the above-described plates (261-1, 261-2, 261-3) may correspond to the number of hinge assemblies (162-1, 162-2, 162-3). The hinge assemblies (162-1, 162-2, 162-3) may include a first hinge assembly (162-1), a second hinge assembly (162-2), and a third hinge assembly (162-3). The first hinge assembly (162-1) may be arranged on the upper side of the folding axis (137) based on the drawing, and the third hinge assembly (162-3) may be arranged on the lower side of the folding axis (137). The second hinge assembly (162-2) may be disposed between the first hinge assembly (162-1) and the third hinge assembly (162-3). The first hinge assembly (162-1), the second hinge assembly (162-2), and the third hinge assembly (162-3) may be spaced apart from each other and disposed along the folding axis (137). Although the number of hinge assemblies is described as three, this is not limited thereto. The hinge assembly (160) may include two hinge assemblies by omitting the second hinge assembly (162-2), or may include three or more hinge assemblies by including more hinge assemblies.

[0048] The first plate (261-1) can be coupled to the first hinge assembly (162-1). The second plate (261-2) can be coupled to the second hinge assembly (162-2). The third plate (261-3) can be coupled to the third hinge assembly (162-3). Each of the first plate (261-1), the second plate (261-2), and the third plate (261-3) can be positioned at the center of the first hinge assembly (162-1), the second hinge assembly (162-2), and the third hinge assembly (162-3). For example, the first plate (261-1), the second plate (261-2), and the third plate (261-3) may be respectively disposed on the first hinge assembly (162-1), the second hinge assembly (162-2), and the third hinge assembly (162-3) along the folding axis (137). The first plate (261-1), the second plate (261-2), and the third plate (261-3) may be formed in a bar shape, and may be referred to as a center bar in terms of being disposed at the center of the hinge (162). The first plate (261-1), the second plate (261-2), and the third plate (261-3) may be spaced apart from the flexible display (130). The first plate (261-1), the second plate (261-2), and the third plate (261-3) can move toward the hinge cover (165) to be spaced apart from the bending portion (e.g., the portion corresponding to the third display area (133)) of the flexible display (130) while the electronic device (101) changes into a folded state. The first plate (261-1), the second plate (261-2), and the third plate (261-3) can move toward the hinge plates (166, 167) (or toward the bending portion of the flexible display (130)) to maintain a distance from the bending portion (e.g., the portion corresponding to the third display area (133)) of the flexible display (130) while the electronic device (101) changes into an unfolded state.

[0049] The fourth plate (262-1) and the fifth plate (262-2) can be placed in a spaced space between the first plate (261-1), the second plate (261-2), and the third plate (261-3). The fourth plate (262-1) can be placed between the first plate (261-1) and the second plate (261-2). The fourth plate (262-1) can connect the first plate (261-1) and the second plate (261-2). For example, one end of the fourth plate (262-1) can be placed on the first plate (261-1), and the other end of the fourth plate (262-1) can be placed on the second plate (261-2). The fifth plate (262-2) can be placed between the second plate (261-2) and the third plate (261-3). The fifth plate (262-2) can connect the second plate (261-2) and the third plate (261-3). One end of the fifth plate (262-2) can be placed on the second plate (261-2), and the other end of the fifth plate (262-2) can be placed on the third plate (261-3). The fourth plate (262-1) and the fifth plate (262-2) can be referred to as a bridge in terms of connecting the first plate (261-1), the second plate (261-2), and the third plate (261-3).

[0050] Figure 3a illustrates the relationship between the display and the hinge assembly in a folded state. Figure 3b is a cross-sectional view of a foldable electronic device having an exemplary support plate in an unfolded state.

[0051] Referring to FIGS. 3A and 3B, the electronic device (101) may include a first housing (110), a second housing (120), a display (130), and a hinge assembly (160). The electronic device (101) may omit at least one of the components or additionally include other components.

[0052] The first housing (110) and the second housing (120) may form at least a portion of the exterior of the electronic device (101). The first housing (110) may include a first support member (170). The first support member (170) may extend from a first side (113) of the first housing (110) into a space enclosed by the first side (113). The second housing (120) may include a second support member (180). The second support member (180) may extend from a second side (123) of the second housing (120) into a space enclosed by the second side (123).

[0053] The first support member (170) and the second support member (180) can support the display (130). The display (130) can be attached to the first support member (170) and the second support member (180). For example, an adhesive member can be disposed between the display (130) and the first support member (170) and between the display (130) and the second support member (180). The adhesive member can include an adhesive, an adhesive tape, a double-sided tape, a sealing tape, or a waterproof tape. The first support member (170) and the second support member (180) can be referred to as a bracket from the side where other components are fixed. The first support member (170) and the second support member (180) can be referred to as a front from the side where they support the display (130) that forms the front of the electronic device (101). The first support member (170) and the second support member (180) can be referred to as support plates in terms of their plate-shaped form.

[0054] The display (130) may include a light-emitting layer (310), a support plate (330), and shielding layers (351, 352). The display (130) may omit at least one of the components or additionally include other components. The display (130) may be partially disposed within the first housing (110) and the second housing (120). The light-emitting layer (310) may be configured to emit light to the outside to provide visual information. The light-emitting layer (310) may include a pixel, a switching circuit, a transparent layer, or glass. The outermost layer of the light-emitting layer (310) may include glass or a rigid transparent polymer. The substrate of the light-emitting layer (310) may include a flexible polymer material. The glass of the light-emitting layer (310) may include a bendable ultra-thin glass (UTG).

[0055] The support plate (330) may include a first support layer (331), a second support layer (332), and a conductive pattern layer (333). The support plate (330) may support the light-emitting layer (310). For example, the support plate (330) may support a display. The support plate (330) may be formed to be rigid while being bent about a folding axis (137) to support folding of the electronic device (101). The support plate (330) may include rigid portions (330a, 330b) having rigidity and a pattern portion (330c) having flexibility. The support plate (330) may provide rigid portions (330a, 330b) formed in a plane to provide a flat portion of the display (130). The rigid portions (330a, 330b) may be referred to as planar portions or planar parts when viewed from a plane-shaped side. The support plate (330) may provide a flexible pattern portion (330c) to provide bending of the display (130). The pattern portion (330c) may include a plurality of slits (S) formed in the pattern portion (330c) so that the display (130) is bent relative to the folding axis (137) when the electronic device (101) is folded. The slits (S) may penetrate the pattern portion (330c) in a direction from the light-emitting layer (310) toward the hinge assembly (160). The slits (S) may be rectangular through holes extending along the folding axis. For example, the slits (S) may penetrate the pattern portion (330c). The pattern portion (330c) can be folded with respect to the folding axis (137) by means of slits (S) extending in a direction parallel to the folding axis.

[0056] The first support layer (331) and the second support layer (332) may form the outer periphery of the support plate (330). The first support layer (331) and the second support layer (332) may include a polymer compound of a composite material such as CFRP, GFRP, BFRP, or AFRP. The pattern portion (330c) may include a plurality of slits (S) so that the display can be bent together with the support plate (330) along the folding axis of the electronic device. The first support layer (331) and the second support layer (332) may have rigidity for supporting the display (130) and may have flexibility through the plurality of slits (S) formed in the pattern portion (330c).

[0057] The conductive pattern layer (333) may be disposed between the first support layer (331) and the second support layer (332). The conductive pattern layer (333) may be disposed on the first support layer (331) and under the second support layer (332). The conductive pattern layer (333) may be configured to electromagnetically interact with an external object (e.g., an electronic pen). The conductive pattern layer (333) may include a plurality of layers. For example, the conductive pattern layer (333) may include a layer including a plurality of patterns extending in the direction of a folding axis and another layer disposed on the layer and including a plurality of patterns extending in a direction perpendicular to the folding axis. The conductive pattern layer (333) may identify the location of the external object by using the plurality of vertically intersecting patterns. The conductive pattern layer (333) may be configured to identify the coordinates of the point where the tip of the electronic pen contacts the surface of the display (130) through an electronic pen that supports electromagnetic induction. The electronic pen may include an antenna having a coil of a ferrite material wound inside the pen. By identifying the coordinates of the electronic pen through the electromagnetic interaction between the coil and the conductive pattern layer (333), the electronic pen can provide input to the electronic device through the conductive pattern layer (333). If an electromagnetic induction panel is separately provided instead of the conductive pattern layer (333), the thickness of the electronic device (101) may be thickened. By including the conductive pattern layer (333) that functions as the electromagnetic induction panel within the support plate (330), the thickness of the electronic device (101) may be thinned.

[0058] The conductive pattern layer (333) may be referred to as an electromagnetic induction panel in terms of identifying the location of an external object through electromagnetic induction with the external object. The conductive pattern layer (333) may be referred to as an input device or digitizer in terms of identifying the location of an external object, such as an electronic pen, and providing input.

[0059] The hinge assembly (160) may include a hinge (162), a first hinge plate (166), a second hinge plate (167), and a bar-shaped plate (261). The hinge assembly (160) may omit at least one of the components or additionally include other components. The hinge assembly (160) may rotatably connect the first housing (110) and the second housing (120) about a folding axis (137). The hinge (162) may include gears and shafts. The hinge (162) may include a metal material to prevent or reduce wear. The first hinge plate (166) may be rotatably connected to the hinge (162) and may be connected to a first support member (170) of the first housing (110). The second hinge plate (167) is rotatably connected to the hinge (162) and can be connected to the second support member (180) of the second housing (120). The first hinge plate (166) and the second hinge plate (167) can include a rigid material so as to be connected to the first support member (170) and the second support member (180). For example, the first hinge plate (166) and the second hinge plate (167) can include a high molecular polymer composite material or a metal material such as CFRP (carbon fiber reinforced plastic), GFRP (glass fiber reinforced plastic), AFRP (aramid fiber reinforced plastic), or BFRP (basalt fiber reinforced plastic).

[0060] A bar-shaped plate (261) can be coupled to a hinge (162). The bar-shaped plate (261) can prevent contact between the hinge (162) and the display (130) due to deflection when the electronic device (101) is folded. The bar-shaped plate (261) can include a high molecular polymer composite material such as CFRP, GFRP, AFRP, BFRP, or a metal material. The hinge assembly (160) including the bar-shaped plate (261) can provide a shape of a bent portion of the display (130) in a water droplet shape, thereby reducing the thickness of the electronic device (101) in a folded state.

[0061] The shielding layers (351, 352) may be configured to receive a magnetic field of the electronic pen in order to improve the input performance of the electronic pen through the conductive pattern layer (333). The shielding layers (351, 352) may include a shielding material having high magnetic permeability characteristics in order to receive the magnetic field of the electronic pen. The shielding layers (351, 352) may reduce the influence of metals constituting mechanisms and circuits arranged inside the electronic device (101). For example, the shielding layers (351, 352) may prevent or reduce a decrease in inductance due to metal or a decrease in magnetic permeability due to the generation of eddy current. The shielding layers (351, 352) may include magnetic metal powder (MMP). The shielding layers (351, 352) may be films or sheets attached to the bottom of the support plate (330).

[0062] The shielding layers (351, 352) may be arranged on a flat portion of the support plate (330). For example, the first shielding layer (351) may be attached to the first rigid portion (330a), and the second shielding layer (352) may be attached to the second rigid portion (330b). The shielding layers (351, 352) may have insufficient ductility and low viscosity, and thus may have difficulty in attachment due to insufficient contact area on the pattern portion (330C) in which a plurality of slits are formed. Since it is difficult for the shielding layers to be attached to the pattern portion (330C) including the plurality of slits (S), the shielding layers (351, 352) may be spaced apart from each other. In order to accommodate the magnetic field of the conductive pattern layer (333) arranged on the pattern portion (330c), a shielding material may be further included under the pattern portion (330c).

[0063] The hinge assembly (160) may include a plurality of plates (166, 167, 261) facing the display (130) and positioned below the pattern portion (330c). The hinge assembly (160) positioned below the pattern portion (330c) may further include shielding layers (361, 362, 363) including a shielding agent (or shielding material). The shielding layers (361, 362, 363) may be positioned on the plates (166, 167, 261) constituting the hinge assembly (160). For example, at least one of the plates (166, 167, 261) positioned below the pattern portion of the support plate (330) may include at least one shielding layer. The shielding agents may be arranged in a layered form on the plates (166, 167, 261) and may be mixed with other materials to form the plates (166, 167, 261). For example, the shielding agents may include a powder form or a slurry form based on the material of the plates (166, 167, 261). For example, when the plates (166, 167, 261) are produced through an injection molding process, a mixture of powder and slurry may be possible.

[0064] The shielding layers (361, 362, 363) formed by the shielding agents may be placed on a flat layer having a plane surface facing the display (130) among the plurality of layers constituting the plates (166, 167, 261). In order to improve the performance of the conductive pattern layer (333) or the electromagnetic induction panel (340), the product of the thickness of the shielding layers (361, 362, 363), which is a coefficient of performance, and the permeability of the shielding agents constituting the shielding layers (361, 362, 363) may be approximately 800 to 1600 H (henry). Preferably, the coefficient of performance may be approximately 900 to 1500 H.

[0065] The shielding layers (361, 362, 363) including shielding agents located on the plates (166, 167, 261) can receive magnetic fields from the lower portion of the conductive pattern layer (333) that is not covered by the shielding layers (351, 352) attached to the support plate (330). By receiving magnetic fields of the electronic pen transmitted to the lower portion of the conductive pattern layer (333) covered by the shielding layers (361, 362, 363) of the hinge structure (160) and the shielding layers (351, 352) of the support plate (330), the input performance through the electronic pen and the conductive pattern layer (333) can be improved.

[0066] FIG. 3c is a cross-sectional view of a foldable electronic device in a folded state, including an electromagnetic induction panel separated from a plate.

[0067] Referring to FIGS. 3A and 3C, the electronic device (101) may include a first housing (110), a second housing (120), a display (130), and a hinge assembly (160). Except for the configuration of the display (130) and the hinge assembly (160), the configuration of the electronic device (101) of FIG. 3C may be the same as or similar to the electronic device of FIG. 3B. Descriptions of configurations similar to those of the electronic device of FIG. 3B are omitted.

[0068] The display (130) may include a light-emitting layer (310), a support plate (330'), an electromagnetic induction panel (340), and shielding layers (351, 352). The support plate (330') may include a polymer of a composite material such as CFRP, GFRP, AFRP, or BFRP. The electromagnetic induction panel (340), similar to the conductive pattern layer of FIG. 3B, may include a first electromagnetic induction panel (341) and a second electromagnetic induction panel (342) spaced apart from each other with respect to the folding axis (137). The first electromagnetic induction panel (341) and the second electromagnetic induction panel (342) may receive an input signal through an electronic pen through electromagnetic induction with an electronic pen. The electromagnetic induction panel (340) may be disposed under the support plate (330'). The electromagnetic induction panel (340) can be attached to the rigid portion of the support plate (330'). The electromagnetic induction panel (340) can be spaced apart from the pattern portion (330c) when the electronic device (101) is folded.

[0069] The first shielding layer (351) may be disposed under the first electromagnetic induction panel (341), and the second shielding layer (352) may be disposed under the second electromagnetic induction panel (342). The first shielding layer (351) and the second shielding layer (352) may receive a magnetic field at the bottom of the electromagnetic induction panel (340). The first shielding layer (351) and the second shielding layer (352) may not be disposed at the bottom of the electromagnetic induction panel (340) corresponding to the pattern portion. The electromagnetic induction panel (340) disposed at the pattern portion may be peeled off from the first shielding layer (351) and the second shielding layer (352) by contact with the hinge assembly (160) (e.g., contact with the plate (261)) when the electronic device (101) is folded or unfolded. When the thickness of the electromagnetic induction panel (340) adjacent to the folding axis (137) increases, a distance may be required between the electromagnetic induction panel (340) and the hinge assembly (160) to avoid interference with the hinge assembly (160) when the electronic device (101) is folded or unfolded. Due to the distance, the thickness of the electronic device (101) may increase. In order to reduce the distance, a shielding layer may not be attached to the lower portion of the area corresponding to the pattern portion of the electromagnetic induction panel (340).

[0070] Since the surface forming the pattern portion (330c) is not continuous, attachment of the shielding layers (351, 352) may be difficult. The pattern portion (330c) may cause peeling of the shielding layers (351, 352) that lack flexibility due to deformation caused by the folding operation of the electronic device (101). When the shielding layer is placed on the pattern portion (330c), peeling of the layers for shielding may occur due to interference with the plate (261) of the hinge assembly (160) caused by the repetitive folding or unfolding operation of the electronic device (101). Due to peeling of the layers for shielding, the performance of the electromagnetic induction panel (340) may be degraded.

[0071] When a shielding layer is not disposed on the lower portion of the electromagnetic induction panel (340) corresponding to the pattern portion, the hinge assembly (160) may include shielding layers (361', 362') or shielding material including shielding material disposed on the plates (166, 167). The shielding layers (361', 362') including shielding materials located on the plates (166, 167) may accommodate magnetic fields of the lower portion of the electromagnetic induction panel (340) that are not covered by the shielding layers (351, 352) disposed on a portion of the lower portion of the electromagnetic induction panel (340). By receiving the magnetic fields of the electronic pen transmitted to the lower part of the electromagnetic induction panel (340) covered by the shielding layers (361', 362') including shielding agents and the shielding layers (351, 352) disposed under the electromagnetic induction panel (340), the input performance through the electronic pen and the electromagnetic induction panel (340) can be improved.

[0072] The shielding layers (361', 362') including the shielding agent have been described as being attached to the flat surfaces of the plates (166, 167) constituting the hinge assembly (160), but are not limited thereto. They may be mixed with the material of the plates (166, 167) of the hinge assembly (160) and mixed within the plates (166, 167).

[0073] According to the above-described embodiment, the hinge assembly (160) can reduce magnetization of the hinge assembly (160) through shielding layers (361, 362, 363, 361', 362') including a shielding agent arranged on the pattern portion (330c). For example, the hinge assembly (160) can include a metal material having rigidity to provide repetitive unfolding and folding. The shielding layers (361, 362, 363, 361', 362') including a shielding agent can prevent or reduce performance degradation of the electromagnetic induction panel (340) or the conductive pattern layer (333) due to magnetization of the metal material.

[0074] Fig. 4a is a rear view of an exemplary flexible display. Fig. 4b is a cross-sectional view of a support layer and a conductive pattern layer of an exemplary foldable display.

[0075] Referring to FIGS. 4A and 4B, the support plate (330) disposed on the rear surface of the display (130) may include rigid portions (330a, 330b) and a pattern portion (330c). The rigid portions (330a, 330b) are illustrated as not having a pattern including slits (S), but are not limited thereto. The rigid portions (330a, 330b) may include slits in at least some areas. The width of the slits included in the rigid portions (330a, 330b) and the spacing between the slits may be different from the width of the slits (S) of the pattern portion (330c) and the spacing between the slits (S).

[0076] Referring to FIG. 4b, which is a section A-A' including a pattern portion (330c), the support plate (330) constituting the display (130) may include a plurality of layers. The plurality of layers may include outer layers (430-1, 430-2) forming the outer surface of the support plate (330) (e.g., the first support layer (331) and the second support layer (332) of FIG. 3a), conductive pattern layers (441, 442, 443, 444) including conductive patterns, and inner layers (431, 432, 433) disposed between the conductive pattern layers (441, 442, 443, 444). The outer layers (430-1, 430-2) and the inner layers (431, 432, 433) may be formed of a rigid material to support the light-emitting layer of the display (130) (e.g., the light-emitting layer (310) of FIGS. 3B and 3C). For example, the outer layers (430-1, 430-2) and the inner layers (431, 432, 433) may include a polymer compound of a composite material such as CFRP, GFRP, BFRP, or AFRP. The outer layers (430-1, 430-2) and the inner layers (431, 432, 433) may include a plurality of slits (S) in the pattern portion (330c) so that the display (130) is bent about the folding axis (137) when the electronic device (e.g., the electronic device (101) of FIG. 1A) is folded. The plurality of slits (S) may penetrate and be connected to each layer. Each of the conductive pattern layers (441, 442, 443, 444) may include a conductive pattern. Each of the conductive patterns disposed in each of the conductive pattern layers (441, 442, 443, 444) may be electrically connected to each other. For example, a conductive pattern disposed on a first conductive pattern layer (441) can be connected to a conductive pattern disposed on a second conductive pattern layer (442) through a conductive via.The conductive pattern disposed on the second conductive pattern layer (442) can be connected to the conductive pattern disposed on the third conductive pattern layer (443) through a conductive via. The conductive pattern disposed on the third conductive pattern layer (443) can be connected to the conductive pattern disposed on the fourth conductive pattern layer (444) through a conductive via. The conductive patterns within the conductive pattern layers (441, 442, 443, 444) connected through the conductive via can be electrically connected to each other.

[0077] Among the conductive pattern layers (441, 442, 443, 444), one layer (e.g., the first conductive pattern layer (441)) may include conductive patterns extending in a direction parallel to the folding axis. Another layer (e.g., the second conductive pattern layer (442)) different from the one layer may include conductive patterns extending in a direction perpendicular to the folding axis. The remaining layers (e.g., the third conductive pattern layer (443) and the fourth conductive pattern layer (444)) may form a pattern in an area where the one layer and the other layer are not arranged (e.g., an area corresponding to a pattern portion or a portion where a camera hole is formed). In one of the remaining layers, the area where the camera hole is formed may extend along the edge of the hole. Another layer among the remaining layers may include a conductive pattern (410) extending along the edge (491) of the slits (S) within a portion corresponding to the pattern portion (330c). The conductive pattern (410) may be spaced apart from the edge (491) of the slits (S) and may extend along the edge (491). The layer on which the conductive patterns are arranged is described by way of example, and the layer on which the conductive patterns are arranged may be one of a first conductive pattern layer (441), a second conductive pattern layer (442), a third conductive pattern layer (443), and a fourth conductive pattern layer (444). The stacking order of the first conductive pattern layer (441), the second conductive pattern layer (442), the third conductive pattern layer (443), and the fourth conductive pattern layer (444) may be changed.

[0078] Figure 5 shows a plan view of the hinge assembly.

[0079] Referring to FIG. 5, the hinge assembly (160) may include a hinge (162), a first hinge plate (166), a second hinge plate (167), and plates (561) (e.g., plates (261-1, 261-2, 261-3, 262-1, 262-2) of FIG. 2). The first hinge plate (166) and the second hinge plate (167) may be rotatably coupled to the hinge (162). The plates (561) may be coupled to the hinge (162). The plates (561) may move in a direction perpendicular to the folding axis (e.g., toward the display or toward the hinge cover) when the electronic device (101) is folded or unfolded.

[0080] The first hinge plate (166), the second hinge plate (167), and the plates (561) may include a flat surface facing the display (130). To improve the permeability between the electromagnetic induction panel (e.g., the conductive pattern layer (333) of FIG. 3b or the electromagnetic induction panel (340) of FIG. 3c) and the shielding layer including the shielding agent, the shielding layer including the shielding agent may be disposed on a non-conductive material.

[0081] The first hinge plate (166), the second hinge plate (167), and the plates (561) may include a polymer compound of a composite material such as CFRP, GFRP, BFRP, or AFRP. The first hinge plate (166), the second hinge plate (167), and the plates (561) may include a shielding agent.

[0082] The shielding agent can compensate for shielding layers that are difficult to attach to the pattern portion (e.g., shielding layers (351, 352) of FIG. 3b). It may not be placed on the hinge (162) formed of a metal material.

[0083] The arrangement structure of the shielding agent and the polymer compound of the composite material is described in detail through Figs. 6a, 6b, 6c and 7.

[0084] Figures 6a, 6b, and 6c are exemplary cross-sectional views illustrating the structure of a plate of an exemplary hinge assembly. Figure 7 is an exploded view illustrating the structure of a plate of an exemplary hinge assembly. The cross-sectional views of Figures 6a, 6b, and 6c may be cross-sectional views of one of AA, BB, or CC illustrated in Figure 5.

[0085] Referring to FIG. 6a, a plate (600a) (e.g., the first hinge plate (166), the second hinge plate (167), the plates (261-1, 261-2, 261-3, 262-1, 262-2) of FIG. 2 or the plates (561) of FIG. 5) may include a first layer (611), a second layer (612), and a shielding layer (613) including a shielding agent. The first layer (611) and the second layer (612) may include a polymer compound of a composite material such as CFRP, GFRP, BFRP, or AFRP to reinforce the rigidity of the plate (600a). The shielding layer (613) including the shielding agent may include MMP. A shielding layer (613) including a shielding agent having magnetism can be arranged on the hinge plates (166, 167) and plates (261-1, 261-2, 261-3, 262-1, 262-2) to complement the function of shielding layers (351, 352) (e.g., shielding layers (351, 352) of FIG. 3b) that are difficult to attach under a pattern portion (e.g., pattern portion (330c) of FIG. 3b). The hinge plates (166, 167) and plates (261-1, 261-2, 261-3, 262-1, 262-2) including a shielding layer (613) containing a shielding agent and the shielding layers (351, 352) attached to the support plate (330) can be configured to receive a magnetic field of the electronic pen under the pattern portion (330c) where the shielding layers (351, 352) attached to the support plate (330) are not placed. The shielding layer (613) containing a shielding agent can reduce magnetic field distortion caused by metal constituting the mechanism and circuitry placed inside the electronic device (101).

[0086] The shielding layer (613) including the shielding agent can be arranged in various forms. The shielding agent can be mixed with an adhesive material (e.g., a binder) in powder form and applied to the surface of one of the support layers (611, 612) to form the shielding layer (613). The shielding agent can be formed as a film-type tape including MMP or as a shielding layer (613) including MMP. The shielding layer (613) including the shielding agent can be bonded to the first layer (611) and the second layer (612) through thermocompression. The adhesive material or film material of the shielding layer (613), excluding the shielding agent, can be identical or similar to the resin components of the first layer (611) and the second layer (612). For example, if the resin of the first layer (611) and the second layer (612) is an acrylic series, the material (e.g., adhesive material or film material) mixed with the shielding agent of the shielding layer (613) may be an acrylic series. If the resin of the first layer (611) and the second layer (612) is an epoxy series, the material (e.g., adhesive material or film material) mixed with the shielding agent of the shielding layer (613) may be an epoxy series.

[0087] Although the shielding layer (613) is described as being positioned between the first layer (611) and the second layer (612) in FIG. 6A, the shielding layer (613) may be positioned in various locations. For example, the first layer (611) may be positioned between the shielding layer (613) and the second layer (612). For example, the second layer (612) may be positioned between the first layer (611) and the shielding layer (613).

[0088] Referring to FIG. 6b, the plates (600b) (e.g., the first hinge plate (166), the second hinge plate (167), the plates (261-1, 261-2, 261-3, 262-1, 262-2) of FIG. 2 or the plates (561) of FIG. 5) may include layers (621, 622) including a shielding agent, a first layer (623), and a second layer (624). The first layer (623) and the second layer (624) may include a polymer compound of a composite material such as CFRP, GFRP, BFRP, or AFRP to reinforce the rigidity of the plate (600b). The shielding agent may include MMP. The first layer (623) and the second layer (624) may be identical to or similar to the first layer (611) and the second layer (612) of the plate (600a) of FIG. 6A. The shielding layers (621, 622) including a shielding agent may be identical to or similar to the shielding layer (613) including a shielding agent of the plate (600a) of FIG. 6A.

[0089] The sequential layers (621, 622) including a shielding agent may be arranged on the outer surfaces of the first layer (623) and the second layer (624) constituting the plate (600b). The first layer (623) and the second layer (624) are illustrated as two layers, but are not limited thereto. The support plate (600b) may be formed as a single layer formed of a composite polymer compound, or may be formed by stacking multiple layers formed of a composite polymer compound. For example, the shielding layers (621, 622) including a shielding agent may be arranged on the outer surface of the support plate (600b). For example, the first shielding layer (621) may be arranged under the first layer (623), and the second shielding layer (622) may be arranged on the second layer (624). The first shielding layer (621) and the second shielding layer (622) may be disposed on the first layer (623) and the second layer (624). Although the shielding agents or shielding layers (621, 622) are described as being disposed on both sides of the plate (600b), they may be disposed on one side. For example, the first shielding layer (621) may be omitted, and the adhesive film of the second shielding layer (622) including the shielding agent may be attached on the second layer (624). The second shielding layer (622) may be omitted, and the adhesive film of the first shielding layer (621) including the shielding agent may be attached under the first layer (623).

[0090] Referring to FIG. 6c, the plates (600c) (e.g., the first hinge plate (166), the second hinge plate (167), the plates (261-1, 261-2, 261-3, 262-1, 262-2) of FIG. 2 or the plates (561) of FIG. 5) may include a first layer (631), a second layer (632), and shielding layers (633, 634). The first layer (631) and the second layer (632) may include a polymer compound of a composite material such as CFRP, GFRP, BFRP, or AFRP to reinforce the rigidity of the plate (600c). The shielding agent of the shielding layers (633, 634) may include MMP. The first layer (631) and the second layer (632) may be identical to or similar to the first layer (611) and the second layer (612) of the plate (600a) of FIG. 6A or the first layer (623) and the second layer (624) of the plate (600b) of FIG. 6B. The shielding layers (633, 634) including a shielding agent may be identical to or similar to the shielding layer (613) including a shielding agent of the plate (600a) of FIG. 6A or the shielding layers (621, 622) including a shielding agent of the plate (600b) of FIG. 6B.

[0091] One (633) of the shielding layers (633, 634) including a shielding agent may be placed between the first layer (631) and the second layer (632) constituting the plate (600c). The other (634) of the shielding layers (633, 634) including a shielding agent may be placed on the outer surfaces of the first layer (631) and the second layer (632) constituting the plate (600c).

[0092] According to the above-described embodiment, the plate (600a; 600b; 600c) includes at least one shielding layer made of a shielding material, thereby inducing the magnetic field of the electronic pen near the conductive pattern layer (333) or the electromagnetic induction panel (340).

[0093] Referring to FIG. 7, the plate (600a) (e.g., the first hinge plate (166), the second hinge plate (167), the plates (261-1, 261-2, 261-3, 262-1, 262-2) of FIG. 2 or the plates (561) of FIG. 5) may include a first layer (611), a second layer (612), and a shielding layer (613) including a shielding agent. The first layer (611) and the second layer (612) may include a polymer compound of a composite material such as CFRP, GFRP, BFRP, or AFRP to reinforce the rigidity of the plate (600a).

[0094] The first layer (611) may include layers (701) containing resin and layers (711, 712) containing composite material fibers. The second layer (612) may include layers (721) containing resin and layers (731, 732) containing composite material fibers.

[0095] The layers (701) of the first layer (611) including resin and the layers (721) of the second layer (612) may include acrylic or epoxy resins. The layers (711, 712, 731, 732) including composite material fibers may include carbon fibers, glass fibers, aramid fibers, or basalt fibers. The layers (711, 712, 731, 732) including composite material fibers may reinforce the rigidity of the plate. The composite material fibers arranged in the layers (711, 712, 731, 732) may intersect with each other. For example, the layer (711) of the first layer (611) may include composite material fibers extending in a first direction (e.g., a direction parallel to the folding axis (137)), and the layer (712) of the first layer (611) may include composite material fibers extending in a second direction (e.g., a direction perpendicular to the folding axis (137)). The layers (711) and (712) may be alternately laminated with each other. Each of the layers (701) including a resin may be disposed between the layers (711) and (712).

[0096] The layer (731) of the second layer (612) may include composite material fibers extending in a first direction (e.g., a direction parallel to the folding axis (137)), and the layer (732) of the second layer (612) may include composite material fibers extending in a second direction (e.g., a direction perpendicular to the folding axis (137)). Each of the layers (721) including a resin may be disposed between the layers (731) and (732).

[0097] The first layer (611) and the second layer (612) formed of composite material fibers can be lightweight and have rigidity. The first layer (611) and the second layer (612) having rigidity can form the hinge plates (166, 167) of the hinge assembly (160) and the plate (261) arranged at the center of the hinge (162).

[0098] The shielding agent of the shielding layer (613) may include MMP. The shielding layer (613) may include an adhesive material or binder mixed with the shielding agent, MMP. In order to increase the adhesion between the shielding layer (613) and the first layer (611) and the second layer (612), the shielding layer (613) may include a material of the same series as the resin of the layers (701, 721). The binder, adhesive material, or film material mixed with the shielding agent of the shielding layer (613) may be identical or similar to the resin components of the first layer (611) and the second layer (612). For example, if the resins of the first layer (611) and the second layer (612) are acrylic series, the material (e.g., adhesive material or film material) mixed with the shielding agent of the shielding layer (613) may be acrylic series. If the resin of the first layer (611) and the second layer (612) is epoxy-based, the material mixed with the shielding agent of the shielding layer (613) (e.g., adhesive material or film material) may be epoxy-based.

[0099] In one embodiment, when inputting into an electronic device using an external object (e.g., an electronic pen), a method is needed to increase the density of the magnetic field of the electronic pen transmitted to the electromagnetic induction panel.

[0100] The technical tasks to be achieved in this document are not limited to the technical tasks mentioned above, and other technical tasks not mentioned will be clearly understood by those with ordinary knowledge in the technical field to which this document pertains.

[0101] The foldable electronic device according to the above-described embodiment (e.g., the electronic device (101) of FIG. 1A) may include a first housing (e.g., the first housing (110) of FIG. 1B), a second housing (e.g., the second housing (120) of FIG. 1B), and a hinge assembly (e.g., the hinge assembly (160) of FIG. 1C) that rotatably connects the first housing (110) and the second housing (120). The foldable electronic device may include a display (e.g., the display (130) of FIG. 1A). The display includes a light-emitting layer (310), a support layer (331; 332) including a pattern portion (330c) that supports the light-emitting layer (310) and includes a plurality of slits (S) to bend the flexible display (130) along a folding axis when the foldable electronic device (101) is folded, a conductive pattern layer (333) that is disposed under the light-emitting layer (310) and includes a conductive pattern configured to electromagnetically interact with an external object, and may be partially disposed within the first housing (110) and the second housing (120). The hinge assembly (160) may include a shielding material that is disposed under the pattern portion (330c) and spaced apart from the conductive pattern layer (333).

[0102] According to the above-described embodiment, the electronic device can enhance the performance of the conductive pattern layer that performs electromagnetic interaction with an external object by including a shielding agent. For example, a magnetic field generated from an external object can be received by the conductive pattern layer by the shielding agent. When an external object (e.g., an electronic pen) is used to input information into the electronic device, the shielding agent and the shielding layer placed under the electromagnetic induction panel can increase the density of the magnetic field of the electronic pen transmitted to the electromagnetic induction panel.

[0103] According to one embodiment, the hinge assembly (160) may include a plurality of plates (e.g., hinge plates (166, 167) of FIG. 1b and plate (261) of FIG. 3a) facing the display (130) and positioned below the pattern portion (330c).

[0104] According to one embodiment, the shielding agent may form shielding layers (351, 352) disposed on the surfaces of the plurality of plates (166, 167, 261).

[0105] According to one embodiment, the hinge assembly (160) may include a plurality of plates (e.g., plates (166, 167, 261) of FIG. 3A) facing the display (130) and positioned below the pattern portion (330c). Each of the plurality of plates (166, 167, 261) may include a plurality of layers (611, 612, 613; 621, 622, 623, 624; 631, 632, 633, 634). According to one embodiment, at least one shielding layer (613; 621, 622; 631, 632, 633) among the plurality of layers (611, 612, 613; 621, 622, 623, 624; 631, 632, 633, 634) may include the shielding agent.

[0106] According to one embodiment, the at least one shielding layer (613; 621, 622; 631, 632, 633) may be disposed on a planarizing layer having one surface facing the display (130) among the plurality of layers (611, 612, 613; 621, 622, 623, 624; 631, 632, 633, 634) that is planar.

[0107] According to one embodiment, the hinge assembly (160) may further include hinge plates (166, 167) facing each other with the folding axis therebetween. The shielding material may be disposed on the hinge plates (166, 167).

[0108] According to the above-described embodiment, the shielding material placed on the hinge plates (166, 167) can complement the function of the shielding layers (351, 352).

[0109] According to one embodiment, the hinge assembly (160) may further include a center plate (261; 561) disposed between the hinge plates (166, 167) along the folding axis.

[0110] According to one embodiment, the shielding agent may be placed on the center plate (261; 561).

[0111] According to one embodiment, the hinge assembly (160) may include a shielding layer.

[0112] According to one embodiment, the shielding layer may include a layer (331; 611; 624; 631; 632) comprising a composite material and disposed on the layer (331; 611; 624; 631; 632), and may include the shielding agent.

[0113] According to one embodiment, the material of the resin included in the layers (331; 611; 624; 631; 632) and the other material different from the shielding agent included in the shielding layer may be polymers of the same series.

[0114] According to the above-described embodiment, by including the same type of polymer as the material of the shielding agent and the resin, the adhesion between the shielding agent (or shielding layer) and the layer can be improved.

[0115] According to one embodiment, the resin of the layers (331; 611; 624; 631; 632) and the binder of the shielding layer may include an epoxy-based polymer or an acrylic-based polymer.

[0116] The above layers (331; 611; 624; 631; 632) may include carbon fiber reinforced plastic (CFRP), glass fiber reinforced plastic (GFRP), basalt fiber reinforced plastic (BFRP), or aramid fiber reinforced plastic (AFRP).

[0117] According to the above-described embodiment, the hinge plate or the layer constituting the plate can secure rigidity for operating the hinge by including a composite material. The plates including the composite material can provide ease of attachment of the shielding agent and secure the performance of the shielding agent.

[0118] According to one embodiment, the hinge assembly (160) may include a first hinge plate (166) and a second hinge plate (167).

[0119] The first hinge plate (166) can be coupled to the first housing (110). The second hinge plate (167) can be coupled to the second housing (120).

[0120] The above hinge assembly may further include a hinge (162). The hinge (162) may rotatably connect the first hinge plate (166) and the second hinge plate (167) about the folding axis.

[0121] According to one embodiment, the hinge assembly may further include a center plate (261; 561). The center plate (261; 561) may be disposed between the first hinge plate (166) and the second hinge plate (167) and may be disposed along the folding axis.

[0122] The shielding agent may be disposed on the first hinge plate (166), the second hinge plate (167), the hinge (162), and the center plate (261; 561) among the first hinge plate (166), the second hinge plate (167), and the center plate (261; 561).

[0123] The above-mentioned conductive pattern layer (333) can be placed on the support layer (331; 332).

[0124] A portion of the above-described conductive pattern (410) may extend along the edge of the slits (S) of the pattern portion (330c).

[0125] The above shielding agent may have heat resistance capable of withstanding heat between 100 degrees Celsius and 200 degrees Celsius.

[0126] The foldable electronic device may further include another conductive pattern layer disposed on the conductive pattern layer (333), the other conductive pattern being configured to electromagnetically interact with an external object together with the conductive pattern layer (333).

[0127] The conductive pattern within the conductive pattern layer (333) may include wiring extending in a direction perpendicular to the folding axis.

[0128] The other conductive pattern within the other conductive pattern layer (333) may include wiring extending in a direction parallel to the folding axis.

[0129] The product of the thickness of the shielding layer including the above shielding agent and the investment rate of the shielding agent may be 900 to 1500.

[0130] The above shielding agent may include magnetic metal powder or magnetic metal slurry.

[0131] A foldable electronic device (e.g., electronic device (101) of FIG. 1A) may include a first housing (e.g., first housing (110) of FIG. 1A), a second housing (e.g., second housing (120) of FIG. 1A), and a hinge assembly (e.g., hinge assembly (160) of FIG. 1B).

[0132] The hinge assembly can rotatably connect the first housing (110) and the second housing (120).

[0133] The foldable electronic device may further include a display (e.g., the display (130) of FIG. 1A). The display (130) may further include a light-emitting layer (310) and a support plate. The support plate may include a pattern portion, a first rigid portion, and a second rigid portion.

[0134] The pattern portion may have a plurality of slits (S) formed to support the light-emitting layer (310) and allow the flexible display (130) to bend around the folding axis when the foldable electronic device (101) is folded.

[0135] The first rigid portion is placed within the first housing (110) and can come into contact with the pattern portion (330c).

[0136] The second rigid portion is disposed within the second housing (120), connected to the hinge assembly (160), and can come into contact with the pattern portion (330c).

[0137] The above support plate may include a first support layer (331), a conductive pattern layer (333) disposed on the first support layer (331) and including a conductive pattern configured to electromagnetically interact with an external object, and a second support layer (332) disposed on the conductive pattern layer (333).

[0138] The above hinge assembly (160) may include plates including a shielding layer disposed below the pattern portion (330c) and spaced apart from the conductive pattern layer (333).

[0139] According to the above-described embodiment, the electronic device can enhance the performance of the conductive pattern layer that performs electromagnetic interaction with an external object by including a shielding agent. For example, a magnetic field generated from an external object can be accommodated in the conductive pattern layer by the shielding agent.

[0140] According to one embodiment, the hinge assembly (160) may include a first hinge plate (166) coupled to the first housing (110), a second hinge plate (167) coupled to the second housing (120), a hinge (162) that rotatably couples the first hinge plate (166) and the second hinge plate (167) about the folding axis, and a center plate (261) disposed between the first hinge plate (166) and the second hinge plate (167) and along the folding axis.

[0141] The shielding layer may be disposed on the first hinge plate (166), the second hinge plate (167), the hinge (162), and the center plate (261) among the first hinge plate (166), the second hinge plate (167), and the center plate (261).

[0142] According to one embodiment, the surface of the first support layer (331) on which the conductive pattern layer (333) is disposed may be flat.

[0143] According to one embodiment, the resin of the first support layer (331), the resin of the second support layer (332), and the binder of the shielding layer may include polymers of the same series among epoxy series polymers or acrylic series polymers.

[0144] According to one embodiment, the first support layer (331) and the second support layer (332) may include carbon fiber reinforced plastic (CFRP), glass fiber reinforced plastic (GFRP), basalt fiber reinforced plastic (BFRP), or aramid fiber reinforced plastic (AFRP).

[0145] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned will be clearly understood by a person having ordinary skill in the art to which the present disclosure pertains.

[0146] FIG. 8 is a block diagram of an electronic device within a network environment according to various embodiments.

[0147] FIG. 8 is a block diagram of an electronic device (801) within a network environment (800) according to various embodiments. Referring to FIG. 8, in the network environment (800), the electronic device (801) may communicate with the electronic device (802) via a first network (898) (e.g., a short-range wireless communication network), or may communicate with at least one of the electronic device (804) or the server (808) via a second network (899) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (801) may communicate with the electronic device (804) via the server (808). According to one embodiment, the electronic device (801) may include a processor (820), a memory (830), an input module (850), an audio output module (855), a display module (860), an audio module (870), a sensor module (876), an interface (877), a connection terminal (878), a haptic module (879), a camera module (880), a power management module (888), a battery (889), a communication module (890), a subscriber identification module (896), or an antenna module (897). In some embodiments, the electronic device (801) may omit at least one of these components (e.g., the connection terminal (878)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (876), the camera module (880), or the antenna module (897)) may be integrated into one component (e.g., the display module (860)).

[0148] The processor (820) may, for example, execute software (e.g., a program (840)) to control at least one other component (e.g., a hardware or software component) of the electronic device (801) connected to the processor (820) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (820) may store commands or data received from other components (e.g., a sensor module (876) or a communication module (890)) in a volatile memory (832), process the commands or data stored in the volatile memory (832), and store result data in a non-volatile memory (834). According to one embodiment, the processor (820) may include a main processor (821) (e.g., a central processing unit or an application processor) or an auxiliary processor (823) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (821). For example, when the electronic device (801) includes the main processor (821) and the auxiliary processor (823), the auxiliary processor (823) may be configured to use less power than the main processor (821) or to be specialized for a given function. The auxiliary processor (823) may be implemented separately from the main processor (821) or as a part thereof.

[0149] The auxiliary processor (823) may control at least a portion of functions or states associated with at least one component (e.g., a display module (860), a sensor module (876), or a communication module (890)) of the electronic device (801), for example, on behalf of the main processor (821) while the main processor (821) is in an inactive (e.g., sleep) state, or together with the main processor (821) while the main processor (821) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (823) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (880) or a communication module (890)). In one embodiment, the auxiliary processor (823) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (801) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (808)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0150] The memory (830) can store various data used by at least one component (e.g., the processor (820) or the sensor module (876)) of the electronic device (801). The data can include, for example, software (e.g., the program (840)) and input data or output data for commands related thereto. The memory (830) can include a volatile memory (832) or a non-volatile memory (834).

[0151] The program (840) may be stored as software in the memory (830) and may include, for example, an operating system (842), middleware (844), or an application (846).

[0152] The input module (850) can receive commands or data to be used in a component of the electronic device (801) (e.g., a processor (820)) from an external source (e.g., a user) of the electronic device (801). The input module (850) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0153] The audio output module (855) can output audio signals to the outside of the electronic device (801). The audio output module (855) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0154] The display module (860) can visually provide information to an external party (e.g., a user) of the electronic device (801). The display module (860) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (860) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0155] The audio module (870) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (870) can acquire sound through the input module (850), output sound through the sound output module (855), or an external electronic device (e.g., electronic device (802)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (801).

[0156] The sensor module (876) can detect the operating status (e.g., power or temperature) of the electronic device (801) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (876) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0157] The interface (877) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (801) with an external electronic device (e.g., the electronic device (802)). In one embodiment, the interface (877) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0158] The connection terminal (878) may include a connector through which the electronic device (801) may be physically connected to an external electronic device (e.g., the electronic device (802)). In one embodiment, the connection terminal (878) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0159] The haptic module (879) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (879) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0160] The camera module (880) can capture still images and videos. According to one embodiment, the camera module (880) may include one or more lenses, image sensors, image signal processors, or flashes.

[0161] The power management module (888) can manage the power supplied to the electronic device (801). According to one embodiment, the power management module (888) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0162] A battery (889) may power at least one component of the electronic device (801). In one embodiment, the battery (889) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0163] The communication module (890) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (801) and an external electronic device (e.g., electronic device (802), electronic device (804), or server (808)), and the performance of communication through the established communication channel. The communication module (890) may operate independently from the processor (820) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (890) may include a wireless communication module (892) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (894) (e.g., a local area network (LAN) communication module, or a power line communication module). Any of these communication modules may communicate with an external electronic device (804) via a first network (898) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (899) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (892) may use subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (896) to verify or authenticate the electronic device (801) within a communication network such as the first network (898) or the second network (899).

[0164] The wireless communication module (892) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimizing terminal power and connecting multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (892) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (892) may support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (892) may support various requirements specified in the electronic device (801), an external electronic device (e.g., the electronic device (804)), or a network system (e.g., the second network (899)). According to one embodiment, the wireless communication module (892) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0165] The antenna module (897) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (897) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (897) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (898) or the second network (899), may be selected from the plurality of antennas by, for example, the communication module (890). A signal or power may be transmitted or received between the communication module (890) and an external electronic device via the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (897).

[0166] According to various embodiments, the antenna module (897) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band.

[0167] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0168] According to one embodiment, commands or data may be transmitted or received between the electronic device (801) and an external electronic device (804) via a server (808) connected to a second network (899). Each of the external electronic devices (802 or 804) may be the same or a different type of device as the electronic device (801). According to one embodiment, all or part of the operations executed in the electronic device (801) may be executed in one or more of the external electronic devices (802, 804, or 808). For example, when the electronic device (801) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (801) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (801). The electronic device (801) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (801) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (804) may include an Internet of Things (IoT) device. The server (808) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (804) or the server (808) may be included in the second network (899).The electronic device (801) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0169] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0170] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0171] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0172] Various embodiments of the present document may be implemented as software (e.g., a program (840)) including one or more instructions stored in a storage medium (e.g., an internal memory (836) or an external memory (838)) readable by a machine (e.g., an electronic device (801)). For example, a processor (e.g., a processor (820)) of the machine (e.g., an electronic device (801)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0173] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as included in a computer program product. The computer program product may be traded as a commodity between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0174] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In a foldable electronic device, 1st housing; Second Housing; A hinge assembly rotatably connecting the first housing and the second housing; and A display partially disposed within the first housing and the second housing; The display comprises a light-emitting layer, a support layer including a pattern portion including a plurality of slits to support the light-emitting layer and enable the display to be bent along a folding axis of the foldable electronic device, and a conductive pattern layer including a conductive pattern disposed under the light-emitting layer and configured to electromagnetically interact with an external object. The above hinge assembly, A shielding material disposed below the pattern portion and spaced apart from the conductive pattern layer, Foldable electronic devices.

2. In paragraph 1, The above hinge assembly, comprising a plurality of plates facing the display and positioned below the pattern portion; The above plurality of plates form at least one shielding layer having the shielding agent, Foldable electronic devices.

3. In paragraph 1 or 2, The above hinge assembly, comprising a plurality of plates facing the display and positioned below the pattern portion; Each of the above plurality of plates comprises a plurality of layers, The above shielding agent forms at least one shielding layer among the plurality of layers, Foldable electronic devices.

4. In paragraph 3, At least one shielding layer, Placed on a layer having a plane facing the display among the above multiple layers, Foldable electronic devices.

5. In any one of paragraphs 1 to 4, The above hinge assembly, Further comprising hinge plates facing each other with the folding axis interposed therebetween, The above shielding material is arranged on the hinge plates, Foldable electronic devices.

6. In paragraph 5, The above hinge assembly, Further comprising a center plate disposed between the hinge plates along the folding axis; The above shielding agent is placed on the center plate, Foldable electronic devices.

7. In any one of paragraphs 1 to 6, The above hinge assembly, A layer comprising a composite material and a shielding layer disposed on the layer and comprising the shielding agent, The above shielding layer comprises a polymer of the same series as the resin of the layer containing the composite material. Foldable electronic devices.

8. In paragraph 7, The resin of the above layer and the binder of the above shielding layer include an epoxy series polymer or an acrylic series polymer. Foldable electronic devices.

9. In paragraph 7 or 8, The above layer is, Including carbon fiber reinforced plastic (CFRP), glass fiber reinforced plastic (GFRP), basal fiber reinforced plastic (BFRP), or aramid fiber reinforced plastic (AFRP), Foldable electronic devices.

10. In any one of paragraphs 1 to 9, The above hinge assembly, A first hinge plate coupled to the first housing; A second hinge plate coupled to the second housing; A hinge that rotatably connects the first hinge plate and the second hinge plate about the folding axis; and A center plate is disposed between the first hinge plate and the second hinge plate and is disposed along the folding axis. The above shielding agent Among the first hinge plate, the second hinge plate, the hinge and the center plate, the first hinge plate, the second hinge plate and the center plate are disposed on the first hinge plate, the second hinge plate and the center plate. Foldable electronic devices.

11. In any one of paragraphs 1 to 10, The above challenge pattern layer is, is placed on the above support layer, Some of the above challenge patterns are: Extending along the edges of the slits of the above pattern portion, Foldable electronic devices.

12. In any one of paragraphs 1 to 11, The above shielding agent is, Heat resistant to temperatures between 100 and 200 degrees Celsius; Foldable electronic devices.

13. In any one of paragraphs 1 to 12, A conductive pattern layer comprising another conductive pattern configured to electromagnetically interact with an external object together with the conductive pattern layer, and further comprising another conductive pattern layer disposed on the conductive pattern layer, The conductive pattern of the above conductive pattern layer includes a wiring extending in a direction perpendicular to the folding axis, The other conductive pattern of the other conductive pattern layer includes a wiring extending in a direction parallel to the folding axis. Foldable electronic devices.

14. In any one of paragraphs 1 to 13, The product of the thickness of the shielding layer including the shielding agent and the investment rate of the shielding agent is 900 to 1500. Foldable electronic devices.

15. In any one of paragraphs 1 to 14, The above shielding agent is, Comprising magnetic metal powder or magnetic metal slurry, Foldable electronic devices.

Images