Cooling device and server

Abstract

Provided in the present disclosure are a cooling device and a server. The cooling device comprises a heat-dissipating assembly and a heat-spreading assembly, wherein the heat-dissipating assembly comprises a base plate having a flow channel and a through opening, the through opening running through the base plate in the direction of thickness of the base plate and being in communication with the flow channel, and the flow channel being configured to allow a first cooling medium to flow through; and the heat-spreading assembly comprises a heat-spreading plate and a cooling member integrally formed with the heat-spreading plate, the heat-spreading plate being connected to the bottom surface of the base plate, the cooling member being located in the through opening, and the heat-spreading plate comprising an accommodating cavity for accommodating a second cooling medium.

Description

Cooling equipment and servers

[0001] Cross-reference

[0002] This disclosure claims priority to the Chinese patent application filed with the China Patent Office on December 13, 2023, with application number 202311716530.1 and invention name “Cooling Equipment and Server,” the entire contents of which are incorporated by reference into this disclosure. Technical Field

[0003] The present disclosure relates to the technical field of servers, and in particular to a cooling device and a server. Background Art

[0004] With the promotion and application of artificial intelligence technology, the demand for high-computing power scenarios has continued to increase, causing the average power consumption of chips inside the server to jump from 300 watts (W) to more than 1000W, which in turn causes the temperature of the server to rise, affecting the normal use of the server.

[0005] In the related art, air cooling equipment or liquid cooling equipment is usually used to cool the chips inside the server to dissipate heat from the server. However, air cooling technology or liquid cooling technology can no longer meet the heat dissipation requirements of the chips inside the server.

[0006] Summary of the Invention

[0007] Embodiments of the present disclosure provide a cooling device and a server.

[0008] In a first aspect, an embodiment of the present disclosure provides a liquid cooling device, comprising:

[0009] The heat dissipation assembly includes a substrate having a circulation channel and a through-hole, wherein the through-hole penetrates the substrate along the thickness direction of the substrate and is connected to the circulation channel; the circulation channel is configured to flow a first cooling medium;

[0010] A heat spreader assembly, comprising a heat spreader plate and a cooling element integrally formed with the heat spreader plate, the heat spreader plate being connected to the bottom surface of the substrate, and the cooling element being located within the through opening; the heat spreader plate comprising a receiving cavity for receiving a second cooling medium;

[0011] In the accommodating cavity, the heated and vaporized second cooling medium moves toward the top of the accommodating cavity, exchanges heat with the first cooling medium, condenses into liquid, and flows back to the bottom of the accommodating cavity.

[0012] The liquid cooling device provided by the embodiment of the present disclosure includes a heat spreader assembly and a heat dissipation assembly, which organically combines liquid cooling technology and vacuum chamber heat spreader heat dissipation technology. After the second cooling medium at the bottom of the accommodating cavity absorbs the heat of the component to be cooled (for example, a chip), it evaporates and diffuses into the accommodating cavity, and transfers the heat to the cooling element. This heat is exchanged with the first cooling medium in the heat dissipation assembly, condensed into a liquid state, and refluxed to the bottom of the accommodating cavity. On the one hand, the accommodating cavity adopts a vacuum design, and the second cooling medium after being heated and vaporized can be conducted in three-dimensional space, which simplifies the heat transfer path of the second cooling medium after being heated and vaporized. Compared with the metal heat conduction solution in the related art, it has a larger conduction system, which greatly improves the heat dissipation efficiency of the cooling device. On the other hand, the second cooling medium located in the accommodating cavity repeatedly absorbs heat, vaporizes and condenses, and needs to absorb a large amount of heat. Therefore, it can take away the heat generated by the component to be cooled more quickly.

[0013] Furthermore, the vapor chamber and cooling element are integrally formed, meaning the cooling element can be machined directly onto the surface of the vapor chamber facing the substrate. The cooling element can be positioned directly within the through-hole of the substrate, directly contacting the first cooling medium. Compared to related art solutions where the cooling element is mounted on the substrate, this shortens the conduction path of the heated, vaporized second cooling medium, allowing it to quickly exchange heat and condense with the first cooling medium, improving the cooling efficiency of the cooling device.

[0014] In one possible implementation, the heat spreader partially overlaps with the bottom surface of the substrate; wherein the projection of the through-hole on the heat spreader covers a partial area of ​​the heat spreader and at least covers the projection of the cooling element on the heat spreader; the flow channel is distributed on opposite sides of the through-hole.

[0015] In a possible implementation, the vapor chamber at least completely overlaps with the bottom surface of the substrate; the cooling element is located in the middle of the vapor chamber;

[0016] The through-opening is located in the middle of the base plate and is arranged opposite to the cooling member; the flow channels are distributed on two opposite sides of the through-opening.

[0017] In one possible implementation, the cooling member includes a plurality of cooling channels, which are spaced apart along a first direction; the opening of each cooling channel faces the circulation channel and is connected to the circulation channel; wherein the first direction and the circulation channel are perpendicular to each other.

[0018] In a possible implementation, the cooling element includes a plurality of fins, which are spaced apart along a first direction; cooling channels are formed between adjacent fins, and / or a cooling channel is provided in each fin.

[0019] In one possible implementation, the circulation channel includes a first circulation channel and a second circulation channel, the first circulation channel and the second circulation channel are respectively located on either side of the through-opening and symmetrically arranged with respect to a center line of the through-opening, wherein the center line of the through-opening is parallel to the first direction;

[0020] The first circulation channel includes a first channel and at least two second channels. The first channel extends along a first direction. The at least two second channels are arranged on a side of the first channel facing the through-port and are communicated with the first channel.

[0021] In a possible implementation manner, a top surface of the cooling element located in the through-hole is lower than a bottom surface of the flow channel.

[0022] In one possible implementation, the accommodating chamber is a vacuum chamber, and the accommodating chamber includes at least two relatively independently arranged sub-chambers, the bottom surfaces of at least two sub-chambers are in contact with the component to be cooled, and the top surfaces of at least two sub-chambers are in contact with the surface of the cooling member facing the substrate.

[0023] In a possible implementation, the heat dissipation assembly further includes a top plate, which is disposed on the base plate to cover the flow channel and the through-hole;

[0024] A liquid inlet pipe and a liquid outlet pipe are provided on the top plate. One end of the liquid inlet pipe and the liquid outlet pipe are respectively communicated with the circulation channel and are located on both sides of the cooling element.

[0025] In a possible implementation, the cooling device further includes an annular mounting plate and a locking member, wherein the mounting plate is provided with a first mounting hole;

[0026] When the vapor chamber at least completely overlaps with the bottom surface of the substrate, a second mounting hole is provided on the vapor chamber, and the second mounting hole is arranged opposite to the first mounting hole; an annular mounting plate is provided on the vapor chamber and sleeved on the outer peripheral surface of the substrate; the locking member is fixedly connected to the circuit board after passing through the first mounting hole and the second mounting hole in sequence;

[0027] Alternatively, when the bottom surface of the heat spreader and the substrate partially overlap, the substrate includes a first substrate and a second substrate arranged on the first substrate, and the area of ​​the second substrate is smaller than that of the first substrate; a third mounting hole is provided on the first substrate, and the third mounting hole is arranged opposite to the first mounting hole; an annular mounting plate is provided on the first substrate and is sleeved on the outer peripheral surface of the second substrate; the locking piece is fixedly connected to the circuit board after passing through the first mounting hole and the third mounting hole in sequence.

[0028] In one possible implementation, the locking member includes a locking rod and an adapter sleeved on the locking rod;

[0029] The adapter comprises an annular body and a plurality of elastic claws; the plurality of elastic claws are connected to the inner surface of the annular body, and the plurality of elastic claws are arranged at intervals along the circumference of the annular body.

[0030] In a possible implementation, the locking member further includes an elastic member; the locking rod includes a first boss and a second boss spaced apart, and the second boss and the adapter are respectively located on two sides of the annular mounting plate;

[0031] The elastic piece is sleeved on the locking rod and is located between the first boss and the second boss.

[0032] In a second aspect, an embodiment of the present disclosure provides a server comprising a circuit board, a chip, and the cooling device of any one of the first aspects; the chip is arranged on the circuit board; the cooling device is arranged on the circuit board, and the heat spreader of the cooling device is at least attached to the chip.

[0033] Since the server provided by the embodiment of the present disclosure includes the cooling device of the first aspect, the server of the embodiment of the present disclosure also has the effects of the cooling device of the first aspect, which will not be repeated here.

[0034] In addition to the technical problems solved by the embodiments of the present disclosure, the technical features that constitute the technical solutions, and the beneficial effects brought about by the technical features of these technical solutions described above, other technical problems that can be solved by the cooling equipment and server provided by the embodiments of the present disclosure, other technical features included in the technical solutions, and the beneficial effects brought about by these technical features will be further described in detail in the specific implementation methods. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the embodiments of the present disclosure or the technical solutions in the prior art, a brief introduction will be given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0036] FIG1 is an exploded view of a cooling device provided by an embodiment of the present disclosure;

[0037] Figure 2 is a front view of Figure 1;

[0038] FIG3 is a top view of FIG1 ;

[0039] FIG4 is a schematic diagram of a vapor chamber and a substrate provided in one embodiment of the present disclosure;

[0040] FIG5 is a schematic diagram of a heat spreader assembly provided in one embodiment of the present disclosure;

[0041] FIG6 is an enlarged schematic diagram of area A in FIG5 ;

[0042] FIG7 is a schematic diagram of a substrate provided in one embodiment of the present disclosure;

[0043] FIG8 is a schematic diagram of a substrate and a cooling element provided in one embodiment of the present disclosure;

[0044] FIG9 is an exploded view of a cooling device provided by another embodiment of the present disclosure;

[0045] FIG10 is a schematic diagram of a heat spreader assembly provided in another embodiment of the present disclosure;

[0046] FIG11 is an enlarged schematic diagram of area B in FIG10 ;

[0047] FIG12 is a schematic diagram of a substrate provided by another embodiment of the present disclosure;

[0048] FIG13 is a schematic diagram of a substrate and a cooling element provided by another embodiment of the present disclosure;

[0049] FIG14 is a schematic diagram of a locking member provided in one embodiment of the present disclosure;

[0050] FIG15 is a schematic diagram of an adapter provided in one embodiment of the present disclosure;

[0051] FIG16 is a schematic diagram of an accommodating cavity provided in one embodiment of the present disclosure;

[0052] FIG17 is a schematic diagram of a server provided in accordance with an embodiment of the present disclosure.

[0053] Reference numerals: 100: heat dissipation assembly; 110: base plate; 111: circulation channel; 1111: first circulation channel; 1111a: first channel; 1111b: second channel; 1112: second circulation channel; 112: through-hole; 113: first base plate; 1131: third mounting hole; 114: second base plate; 120: top plate; 121: notch; 130: liquid inlet pipe; 140: liquid outlet pipe; 200: heat spreader assembly; 210: heat spreader; 211: second mounting hole; 220: cooling element; 221: cooling channel; 230: accommodating chamber; 240: partition; 300: mounting plate; 400: locking element; 410: locking lever; 411: first boss; 412: second boss; 420: adapter; 421: annular body; 422: elastic claw; 430: elastic member; 500: circuit board; 600: chip. DETAILED DESCRIPTION

[0054] As mentioned in the background, the cooling equipment has poor cooling performance and cannot meet the heat dissipation requirements of the chips inside the server. The inventors discovered that this problem arises because related technologies typically use liquid cooling for heat dissipation. Specifically, a heat sink is placed directly above the chip to absorb the heat generated by the chip. However, heat sinks are typically made of metal, such as copper or aluminum, which have poor thermal conductivity and cannot meet the heat dissipation requirements of the chip.

[0055] In view of this, the embodiments of the present disclosure provide a cooling device and server, which organically combine liquid cooling technology and vacuum chamber heat dissipation technology. After the second cooling medium at the bottom of the accommodating cavity absorbs the heat of the component to be cooled (for example, a chip), it evaporates and diffuses into the accommodating cavity, and transfers the heat to the cooling element. This heat is exchanged with the first cooling medium in the heat dissipation component, condensed into a liquid state, and flows back to the bottom of the accommodating cavity. On the one hand, the accommodating cavity adopts a vacuum design, and the second cooling medium after being heated and vaporized can be conducted in three-dimensional space, which simplifies the heat transfer path of the second cooling medium after being heated and vaporized. Compared with the metal heat conduction solution in the related art, it has a larger conduction system, which greatly improves the heat dissipation efficiency of the cooling device. On the other hand, the second cooling medium located in the accommodating cavity repeatedly absorbs heat, vaporizes and condenses, and needs to absorb a large amount of heat. Therefore, it can take away the heat generated by the component to be cooled more quickly.

[0056] Furthermore, the vapor chamber and cooling element are integrally formed, meaning the cooling element can be machined directly onto the surface of the vapor chamber facing the substrate. The cooling element can be positioned directly within the through-hole of the substrate, directly contacting the first cooling medium. Compared to related art solutions where the cooling element is mounted on the substrate, this shortens the conduction path of the heated, vaporized second cooling medium, allowing it to quickly exchange heat and condense with the first cooling medium, improving the cooling efficiency of the cooling device.

[0057] The present disclosure organically combines liquid cooling technology and vacuum chamber heat dissipation technology. After the second cooling medium located at the bottom of the accommodating chamber absorbs the heat of the component to be cooled, it evaporates and diffuses into the accommodating chamber, and transfers the heat to the cooling part. This heat is exchanged with the first cooling medium in the heat dissipation component, condensed into liquid, and refluxed to the bottom of the accommodating chamber, which is beneficial to improving the heat dissipation effect of the cooling equipment.

[0058] In order to make the above-mentioned purposes, features and advantages of the embodiments of the present disclosure more obvious and easy to understand, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, not all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present disclosure.

[0059] Referring to Figures 1 through 16 , embodiments of the present disclosure provide a cooling device for dissipating heat from a component to be cooled to ensure its normal operation. For example, the cooling device is used to dissipate heat from a server chip. The cooling device has strong heat dissipation performance, rapidly dissipating heat generated by the server chip and ensuring its normal operation.

[0060] The cooling device includes a heat dissipation assembly 100 and a heat spreader assembly 200. The heat dissipation assembly 100 includes a base plate 110 having a flow channel 111 and a through-hole 112. The flow channel 111 is configured to flow a first cooling medium. The flow channel 111 and the through-hole 112 are interconnected to facilitate the flow of the first cooling medium through the flow channel 111 and the through-hole. The through-hole 112 penetrates the base plate 110 along the thickness direction of the base plate 110, so that the through-hole 112 is a through hole that connects vertically to accommodate the cooling element 220 of the heat spreader assembly 200.

[0061] The heat spreader assembly 200 includes a heat spreader plate 210 and a cooling member 220. The heat spreader plate 210 is connected to the bottom surface of the substrate 110, and the cooling member 220 is located in the through-opening 112. The heat spreader plate 210 includes a accommodating cavity 230 for accommodating a second cooling medium (see Figure 16). The accommodating cavity 230 of the heat spreader plate 210 is a vacuum cavity. It should be noted that, in the specific preparation process, the second cooling medium can be filled into the accommodating cavity 230 and the accommodating cavity 230 can be evacuated to form a vacuum in the accommodating cavity 230.

[0062] In actual use, the cooling device is installed on the component to be cooled so that the heat spreader 210 fits the component to be cooled to dissipate heat from the component to be cooled. In this embodiment, the liquid cooling technology and the vacuum chamber heat spreader heat dissipation technology are organically combined. After the second cooling medium at the bottom of the accommodating cavity absorbs the heat of the component to be cooled (for example, a chip), it evaporates and diffuses into the accommodating cavity, and transfers the heat to the cooling member 220. This heat is exchanged with the first cooling medium in the heat dissipation assembly 100 and condensed into liquid cooling, and then flows back to the bottom of the accommodating cavity. On the one hand, the accommodating cavity adopts a vacuum design, and the second cooling medium after being heated and vaporized can be conducted in three-dimensional space, which simplifies the heat transfer path of the second cooling medium after being heated and vaporized. Compared with the metal heat conduction solution in the related art, it has a larger conduction system, which greatly improves the heat dissipation efficiency of the cooling device. On the other hand, the second cooling medium located in the accommodating cavity repeatedly absorbs heat, vaporizes and condenses, and needs to absorb a large amount of heat. Therefore, it can take away the heat generated by the component to be cooled more quickly.

[0063] The cooling member 220 is disposed on the vapor chamber 210 and is integrally formed with the vapor chamber 210. For example, the surface of the vapor chamber 210 facing the substrate 110 can be machined using a shovel or other processing tool to form the cooling member 220 on the vapor chamber 210. In this embodiment, the cooling member can be located within the through-hole 112 penetrating the substrate 110 and in direct contact with the first cooling medium.

[0064] The cooling element in the related art is directly arranged on the substrate. In this way, the heat carried by the second cooling medium after being heated and vaporized needs to be conducted to the lower surface of the substrate 110 first, and then conducted to the upper surface of the substrate 110 through the substrate 110 before it can exchange heat with the first cooling medium.

[0065] In this embodiment, the heat carried by the heated and vaporized second cooling medium is directly transferred to the cooling element 220, and the cooling element 220 is located in the through-hole 112 and in direct contact with the first cooling medium. This arrangement shortens the conduction path of the heated and vaporized second cooling medium, allowing the heated and vaporized second cooling medium to quickly exchange heat and condense with the first cooling medium, thereby improving the cooling effect of the cooling device. In addition, the cooling element 220 and the heat spreader 210 are integrally formed, which can simplify the welding process of the cooling element 220 and the heat spreader 210 and simplify the preparation process of the heat spreader assembly 200.

[0066] The vapor chamber 210 may partially overlap with the bottom surface of the substrate 110, or may at least completely overlap with the bottom surface of the substrate 110. In one possible implementation, referring to Figures 4 to 8 , the vapor chamber 210 partially overlaps with the bottom surface of the substrate 110. In other words, the vapor chamber 210 is a small-sized structural component, and the area of ​​the vapor chamber 210 is smaller than the area of ​​the substrate 110.

[0067] The cooling element 220 is formed on the surface of the vapor chamber 210, wherein the projection of the through-port 112 on the vapor chamber 210 covers the portion of the vapor chamber 210 and at least covers the projection of the cooling element 220 on the vapor chamber 210. In other words, the area of ​​the through-port 112 is smaller than the area of ​​the vapor chamber 210, but larger than the area of ​​the cooling element 220. This arrangement allows the vapor chamber 210 to both cover the bottom of the through-port 112 and install the cooling element 220 into the through-port 112.

[0068] The circulation channels 111 are distributed on opposite sides of the through-port 112. That is, the circulation channels 111 on one side of the through-port 112 are used to circulate the first cooling medium with a lower temperature; the circulation channels 111 on the other side of the through-port 112 are used to circulate the first cooling medium that absorbs heat, so that the first cooling medium circulates between the circulation channels 111 and the through-port 112.

[0069] In this embodiment, the vapor chamber 210 is a small structural component that can be directly installed on the surface of the main component to be cooled. For example, the vapor chamber 210 can be directly installed on the chip on a circuit board and bonded to the chip. This arrangement can not only cool the main component to be cooled promptly and effectively, but also reduce the manufacturing cost of the vapor chamber assembly 200, thereby reducing the manufacturing cost of the cooling device.

[0070] In another possible implementation, referring to Figures 9 to 13 , the vapor chamber 210 at least completely overlaps with the bottom surface of the substrate 110. Thus, the vapor chamber 210 can provide support for the substrate 110. In one example, the vapor chamber 210 may completely overlap only with the bottom surface of the substrate 110, i.e., the area of ​​the vapor chamber 210 is equal to the area of ​​the substrate 110. In another example, the area of ​​the vapor chamber 210 is greater than the area of ​​the substrate 110.

[0071] The cooling member 220 is located in the middle of the heat spreader 210, and the through-hole 112 is located in the middle of the substrate 110 and is arranged opposite to the cooling member 220; the circulation channels 111 are distributed on opposite sides of the through-hole 112, that is, the circulation channels 111 on one side of the through-hole 112 are used to circulate the first cooling medium with a lower temperature; the circulation channels 111 on the other side of the through-hole 112 are used to circulate the first cooling medium after absorbing heat, so that the first cooling medium forms a circulation between the circulation channels 111 and the through-hole 112. It should be noted that the middle of the heat spreader 210 in this embodiment can refer to the central area of ​​the heat spreader 210, and can also refer to the area near the central area of ​​the heat spreader 210.

[0072] When the cooling device in this example is used to dissipate heat from the server's circuit board, the chip is the primary component to be cooled, but other components on the circuit board also generate a certain amount of heat. The heat spreader 210 in this embodiment is large enough to cover most of the circuit board. This allows for quick and effective heat dissipation from the chip while also facilitating heat dissipation from other components on the circuit board, improving the overall cooling effect on the server's circuit board.

[0073] It should be noted that when the heat spreader 210 partially overlaps with the bottom surface of the substrate 110 , or when the heat spreader 210 at least completely overlaps with the bottom surface of the substrate 110 , the structures of the substrates 110 corresponding to the two are different.

[0074] In one example, please refer to Figure 7. When the heat spreader 210 partially overlaps with the bottom surface of the substrate 110, the substrate 110 includes a first substrate 113 and a second substrate 114. The second substrate 114 is arranged on the first substrate 113, and the area of ​​the second substrate 114 is smaller than the area of ​​the first substrate 113, that is, the shape of the substrate 110 is a convex shape.

[0075] The through-opening 112 is disposed at the center of the second substrate 114 and extends through the first substrate 113 and the second substrate 114 along the thickness of the substrate 110. The circulation channels 111 are located on opposite sides of the through-opening 112 and formed on the second substrate 114. In other words, along the X direction in FIG. 7 , the circulation channels 111 are located on both sides of the through-opening 112 in the X direction. Specifically, a portion of the circulation channels 111 is located on the left side of the through-opening 112, while the remaining circulation channels 111 are located on the right side of the through-opening 112.

[0076] In another example, please refer to Figure 12. When the heat spreader 210 at least completely overlaps with the bottom surface of the substrate 110, the shape of the substrate 110 is the same as the shape of the second substrate 114 in the above example. At this time, the through-hole 112 and the flow channel 111 are both formed on the substrate 110.

[0077] In this embodiment, the cooling element 220 can be a plate heat exchanger or a microchannel heat exchanger. For example, referring to Figures 5 and 6, as well as Figures 10 and 11, the cooling element 220 includes a plurality of cooling channels 221 spaced apart along a first direction. If the cooling element 220 has a square structure, the plurality of cooling channels 221 can be spaced apart along the width of the cooling element 220. In other words, the first direction is perpendicular to the flow channels, i.e., the first direction is the Y direction in Figures 5 and 10.

[0078] The opening of each cooling channel 221 faces the circulation channel 111 and is in communication with the circulation channel 111, so that the first cooling medium can circulate in the cooling channel 221. It should be noted that when the circulation channel 111 includes the first circulation channel 1111 and the second circulation channel 1112, the first circulation channel 1111 and the second circulation channel 1112 are respectively located on both sides of the through-opening 112. In this case, each cooling channel 221 has two openings, one of which faces the first circulation channel 1111 and is in communication with the first circulation channel 1111, and the other faces the second circulation channel 1112 and is in communication with the second circulation channel 1112. With this arrangement, one of the openings can serve as the inlet of the cooling channel 221 and the other opening can serve as the outlet of the cooling channel 221, so that the first cooling medium can circulate in the circulation channel and the cooling channel 221.

[0079] In this embodiment, the cooling element 220 includes multiple cooling channels 221. The first cooling medium can flow in each cooling channel 221 and exchange heat with the heat transferred to the cooling element 220, so that the second cooling medium that has been heated and vaporized can quickly exchange heat and condense with the first cooling medium, thereby improving the cooling effect of the cooling equipment.

[0080] Among them, the formation of multiple cooling channels 221 in the cooling member 220 can be in various forms. For example, the cooling member 220 can be a plate structure, and multiple cooling channels 221 can be formed in the cooling member 220 so that multiple microchannels are formed inside the cooling member 220. For another example, the cooling member 220 includes a plurality of fins, the plurality of fins are spaced apart along a first direction, each fin extends along a second direction, and the first direction and the second direction intersect. That is, the first direction and the second direction are two intersecting directions within the plane where the substrate 110 is located. Cooling channels 221 are formed between adjacent fins, and / or, a cooling channel 221 is provided in each fin. In other words, the cooling channel 221 can be simply composed of the area between adjacent fins; or, the cooling channel 221 can be simply formed in each fin; or, the cooling channel 221 is simultaneously composed of the area between adjacent fins; and the cooling channel 221 is provided in each fin.

[0081] To facilitate the description of the circulation channels 111 located on both sides of the through-port 112, it is advisable to divide the circulation channels 111 so that the circulation channels 111 include a first circulation channel 1111 and a second circulation channel 1112. The first circulation channel 1111 and the second circulation channel 1112 are respectively located on both sides of the through-port 112, and the first circulation channel 1111 and the second circulation channel 1112 are symmetrically arranged relative to the center line of the through-port 112, wherein the center line of the through-port 112 is parallel to the first direction, and the center line of the through-port 112 can be the S line in Figure 7. The symmetrical arrangement of the first circulation channel 1111 and the second circulation channel 1112 can, on the one hand, facilitate the preparation of the first circulation channel 1111 and the second circulation channel 1112 and simplify the preparation process; on the other hand, it can balance the flow rate of the first cooling medium in the first circulation channel 1111 and the second circulation channel 1112, thereby improving the cooling effect of the cooling device.

[0082] In this example, the first circulation channel 1111 includes a first channel 1111a and at least two second channels 1111b. The first channel 1111a extends along a first direction; the at least two second channels 1111b are arranged on the side of the first channel 1111a facing the first through-port 112 and are connected to the first channel 1111a. The at least two second channels 1111b can be spaced apart along the first direction, and the at least two second channels 1111b can be parallel to each other or arranged at an angle relative to each other. Exemplarily, each second channel 1111b extends along the second direction so that the at least two second channels 1111b are parallel to each other.

[0083] At least two second channels 1111b divide the first cooling medium flowing through the first channel 1111a into at least two flow directions, which can reduce the impact force of the first cooling medium on the fins of the cooling member 220. It can not only reasonably adjust the flow rate and flow velocity of the first cooling medium in the cooling channel 221, but also reduce the damage to the fins of the cooling member 220, thereby improving the service life of the fins of the cooling member 220.

[0084] In a possible implementation, the top surface of the cooling member 220 located in the through-hole 112 is lower than the bottom surface of the circulation channel 111. In other words, there is a height difference between the top surface of the cooling member 220 and the bottom surface of the circulation channel 111.

[0085] In this embodiment, the second circulation channel may be used as the liquid inlet end of the first cooling medium, and the first circulation channel may be used as the liquid outlet end of the first cooling medium; when the first cooling medium flows to the through-port 112 through the second circulation channel, since the top surface of the cooling member 220 in the through-port 112 is lower than the bottom surface of the circulation channel 111, the flow speed of the first cooling medium in the through-port 112 can be slowed down, and the flow time of the first cooling medium at the through-port 112 can be increased, providing more sufficient heat exchange time for the first cooling medium and the vaporized second cooling medium, thereby improving the heat exchange effect of the cooling equipment.

[0086] In one possible implementation, please refer to Figure 15, the accommodating chamber 230 is a vacuum chamber, and the accommodating chamber 230 includes at least two relatively independently arranged sub-chambers. For example, a partition 240 is provided in the accommodating chamber 230, and the partition 240 separates the accommodating chamber 230 into at least two relatively independently arranged sub-chambers.

[0087] Among them, in a direction perpendicular to the bottom surface of the heat spreader 210, one end of the partition 240 is connected to the bottom surface of the heat spreader 210, and the other end of the partition is connected to the top surface of the heat spreader 210, so that the bottom surface of each sub-chamber formed is in contact with the component to be cooled, and the top surface is in contact with the surface of the cooling member 220 facing the substrate 110. With this arrangement, the second cooling medium in each sub-chamber can absorb the heat of the component to be cooled and vaporize. The vaporized second cooling medium can move to the top of the sub-chamber, exchange heat with the first cooling medium, and condense into a liquid. The liquid second cooling medium flows back to the bottom of the sub-chamber under the action of its own gravity. When one of the sub-chambers fails, the other sub-chamber can still keep working and complete the cooling function of the heat spreader, so that the cooling equipment can perform its cooling function normally.

[0088] It should be noted that the partition 240 can be a straight plate. The partition 240 can be perpendicular to the bottom surface of the vapor chamber 210, or can be arranged at an angle relative to the direction perpendicular to the bottom surface of the vapor chamber 210, so that the at least two sub-chambers have regular shapes. The partition 240 can also be an irregular shape, so that the at least two sub-chambers have irregular shapes.

[0089] In one possible implementation, the heat dissipation assembly 100 further includes a top plate 120 , which is disposed on the substrate 110 to cover the circulation channel 111 and the through-port 112 . This configuration can prevent the first cooling medium from overflowing the circulation channel 111 , thereby ensuring the normal use of the heat dissipation assembly 100 .

[0090] The top plate 120 is provided with a liquid inlet pipe 130 and a liquid outlet pipe 140. One end of the liquid inlet pipe 130 and the liquid outlet pipe 140 are respectively connected to the circulation channel 111 and are located on both sides of the cooling element 220. In other words, one end of the liquid inlet pipe 130 is connected to the second circulation channel 1112, and one end of the liquid outlet pipe 140 is connected to the first circulation channel 1111. To improve the flow path of the first cooling medium within the circulation channel 111, the liquid inlet pipe 130 and the liquid outlet pipe 140 are located on a diagonal line of the top plate 120. It should be noted that the other ends of the liquid outlet pipe 140 and the liquid inlet pipe 130 can also be connected to a storage box, which is used to store the first cooling medium to ensure normal use of the cooling equipment.

[0091] At least two notches 121 are spaced apart on top plate 120. These notches 121 extend through the top plate 120 along its thickness and are disconnected from the circulation channel 111 and the through-port 112. Specifically, the projections of the notches 121 on base plate 110 are offset from the circulation channel 111 and the through-port 112. This prevents the first cooling medium within the circulation channel 111 and the through-port 112 from overflowing, thereby improving the safety of the cooling device.

[0092] It should be noted that the cooling device disclosed in the embodiment of the present disclosure needs to be installed on the component to be cooled, for example, it needs to be installed on a circuit board. Therefore, the cooling device disclosed in the embodiment of the present disclosure also includes a mounting plate 300 and a locking member 400.

[0093] For example, please refer to Figures 1 and 9. The mounting plate 300 is a ring-shaped member, and a first mounting hole (not shown in the figure) is set on the mounting plate 300. One end of the locking member 400 passes through the first mounting hole and other mounting holes set on the cooling device in sequence, and is fixedly connected to the component to be cooled.

[0094] It should be understood that when the structures of the vapor chamber 210 and the base plate 110 differ, the locations of the other mounting holes will also differ. In one example, referring again to Figures 1 and 2 , when the bottom surfaces of the vapor chamber 210 and the base plate 110 partially overlap, the base plate 110 includes a first base plate 113 and a second base plate 114 disposed thereon, with the area of ​​the second base plate 114 being smaller than that of the first base plate 113.

[0095] At this time, a third mounting hole 1131 is provided on the first substrate 113 , and the third mounting hole 1131 is arranged opposite to the first mounting hole.

[0096] The annular mounting plate 300 is disposed on the first substrate 113 and sleeved on the outer circumference of the second substrate 114 ; the locking member 400 passes through the first mounting hole and the third mounting hole 1131 in sequence and is fixedly connected to the circuit board.

[0097] In another example, please refer to Figure 9. When the heat spreader 210 at least completely overlaps with the bottom surface of the substrate 110, a second mounting hole 211 is provided on the heat spreader 210, and the second mounting hole 211 is arranged opposite to the first mounting hole; the annular mounting plate 300 is provided on the heat spreader 210 and is sleeved on the outer peripheral surface of the substrate 110; the locking member 400 passes through the first mounting hole and the second mounting hole 211 in sequence and is fixedly connected to the circuit board.

[0098] Please refer to Figure 14, in which the locking member 400 includes a locking rod 410 and an adapter 420, and the adapter 420 is sleeved on the locking rod 410, wherein the adapter 420 is located below the mounting plate 300 and is located in the second mounting hole 211 or the third mounting hole 1131, and is used to adapt to the second mounting hole 211 or the third mounting hole 1131.

[0099] Referring to FIG. 15 , the adapter 420 includes an annular body 421 and a plurality of elastic claws 422 . The plurality of elastic claws 422 are connected to the inner surface of the annular body 421 and are spaced apart along the circumference of the annular body 421. The end of each elastic claw 422 facing away from the annular body 421 extends toward the center of the annular body 421, such that the diameter of the area enclosed by the plurality of elastic claws 422 gradually decreases in a direction away from the annular body 421. This arrangement allows the adapter 420 to adapt to locking rods 410 of varying sizes and improves the connection strength between the vapor chamber 210 or base plate 110 and the locking member 400.

[0100] The locking member 400 also includes an elastic member 430, which may include a spring. The locking lever 410 includes a first boss 411 and a second boss 412 spaced apart from each other. The second boss 412 and the adapter 420 are located on either side of the annular mounting plate 300. Taking the orientation shown in FIG. 1 as an example, the second boss 412 is located above the mounting plate 300, and the adapter 420 is located below the annular mounting plate 300.

[0101] The elastic member 430 is sleeved on the locking rod 410 and is located between the first boss 411 and the second boss 412 , so as to buffer the installation force, reduce damage to the circuit board, and increase the service life of the circuit board.

[0102] An embodiment of the present disclosure further provides a server. Please refer to FIG16 . The server includes a circuit board 500 , a chip 600 , and the cooling device described in any of the above embodiments.

[0103] The chip 600 is disposed on the circuit board 500 ; the cooling device is disposed on the circuit board 500 , and the heat spreader 210 of the cooling device is at least attached to the chip.

[0104] Since the server provided by the embodiment of the present disclosure includes the cooling device described in any of the above embodiments, the server of the embodiment of the present disclosure also has the effects of the cooling device described in any of the above embodiments, which will not be repeated here.

[0105] It should be noted that other components on the circuit board 500 can also dissipate heat through cooling equipment. For example, other components can contact the bottom surface of the heat spreader 210 with thermal conductive materials to conduct the heat generated by other components to the heat spreader 210.

[0106] In the description of the embodiments of the present disclosure, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to a fixed connection, an indirect connection via an intermediate medium, internal communication between two components, or an interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the embodiments of the present disclosure based on specific circumstances.

[0107] In the embodiments of the present disclosure, any device or element referred to or implied must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be understood as limiting the embodiments of the present disclosure. In the description of the embodiments of the present disclosure, the meaning of "plurality" is two or more, unless otherwise specifically specified.

[0108] The terms "first," "second," "third," "fourth," and the like (if any) in the specification and claims of the embodiments of the present disclosure and in the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a particular order or sequential sequence. It should be understood that the terms used in this manner are interchangeable where appropriate, so that the embodiments of the embodiments of the present disclosure described herein, for example, can be implemented in orders other than those illustrated or described herein. In addition, the terms "may include" and "have," and any variations thereof, are intended to cover non-exclusive inclusions, for example, a process, method, system, product, or apparatus that includes a series of steps or components is not necessarily limited to those steps or components that are clearly listed, but may include other steps or components that are not clearly listed or that are inherent to such processes, methods, products, or apparatus.

[0109] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of the present disclosure, rather than to limit them. Although the embodiments of the present disclosure have been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or replace some or all of the technical features therein with equivalents, and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present disclosure. Industrial Applicability

[0110] The solution provided by the embodiment of the present disclosure can be applied to the heat dissipation process of the cooling equipment. The liquid cooling equipment includes a heat dissipation component and a heat spreader component. The heat dissipation component includes a substrate having a circulation channel and a through-hole. The through-hole penetrates the substrate along the thickness direction of the substrate and is connected to the circulation channel; the circulation channel is configured to circulate a first cooling medium; the heat spreader component includes a heat spreader and a cooling part integrally formed with the heat spreader, the heat spreader is connected to the bottom surface of the substrate, and the cooling part is located in the through-hole; the heat spreader includes a accommodating cavity for accommodating the second cooling medium, thereby solving the technical problem of poor cooling effect of the cooling equipment.

Claims

1. A cooling device comprising: A heat dissipation component comprises a substrate having a circulation channel and a through-hole, wherein the through-hole penetrates the substrate along the thickness direction of the substrate and is connected to the circulation channel; the circulation channel is configured to flow a first cooling medium; A heat spreader assembly, comprising a heat spreader and a cooling member integrally formed with the heat spreader, wherein the heat spreader is connected to the bottom surface of the substrate, and the cooling member is located in the through opening; the heat spreader comprises a receiving cavity for receiving a second cooling medium; Wherein, in the accommodating cavity, the heated and vaporized second cooling medium moves toward the top of the accommodating cavity, exchanges heat with the first cooling medium, and is condensed into liquid, and the liquid second cooling medium flows back to the bottom of the accommodating cavity.

2. The cooling device according to claim 1, wherein: The heat spreader partially overlaps with the bottom surface of the substrate; wherein the projection of the through-hole on the heat spreader covers a partial area of ​​the heat spreader and at least covers the projection of the cooling element on the heat spreader; the flow channel is distributed on opposite sides of the through-hole.

3. The cooling device according to claim 1, wherein: The heat spreader at least completely overlaps with the bottom surface of the substrate, and the cooling element is located in the middle of the heat spreader; The through-opening is located in the middle of the substrate and is arranged opposite to the cooling member; the flow channels are distributed on two opposite sides of the through-opening.

4. The cooling device according to any one of claims 1 to 3, wherein: The cooling member comprises a plurality of cooling channels, which are arranged at intervals along a first direction; the opening of each cooling channel faces the circulation channel and is connected to the circulation channel; wherein the first direction is perpendicular to the circulation channel.

5. The cooling device according to claim 4, wherein: The cooling element includes a plurality of fins, and the plurality of fins are arranged at intervals along the first direction; the cooling channel is formed between adjacent fins, and / or the cooling channel is provided in each of the fins.

6. The cooling device according to claim 4, wherein: The circulation channel includes a first circulation channel and a second circulation channel, wherein the first circulation channel and the second circulation channel are respectively located on both sides of the through-port and are symmetrically arranged relative to the center line of the through-port, wherein the center line of the through-port is parallel to the first direction.

7. The cooling device according to claim 6, wherein: The first circulation channel includes a first channel and at least two second channels, the first channel extends along the first direction; the at least two second channels are arranged on a side of the first channel facing the through-hole and are communicated with the first channel.

8. The cooling device according to any one of claims 1 to 3, wherein: The top surface of the cooling element located in the through-hole is lower than the bottom surface of the flow channel.

9. The cooling device according to any one of claims 1 to 3, wherein: The accommodating chamber is a vacuum chamber, and the accommodating chamber includes at least two relatively independently arranged sub-chambers, the bottom surfaces of at least two of the sub-chambers are in contact with the component to be cooled, and the top surfaces of at least two of the sub-chambers are in contact with the surface of the cooling member facing the substrate.

10. The cooling device according to any one of claims 1 to 3, wherein: The heat dissipation assembly further includes a top plate, which is disposed on the base plate to cover the flow channel and the through-hole; A liquid inlet pipe and a liquid outlet pipe are arranged on the top plate, one end of the liquid inlet pipe and the liquid outlet pipe are respectively communicated with the circulation channel and are located on both sides of the cooling element.

11. The cooling device according to claim 2 or 3, wherein: The cooling device further comprises an annular mounting plate and a locking member, wherein the mounting plate is provided with a first mounting hole; The heat spreader at least completely overlaps with the bottom surface of the substrate, and a second mounting hole is provided on the heat spreader, and the second mounting hole is arranged opposite to the first mounting hole; the annular mounting plate is arranged on the heat spreader and sleeved on the outer peripheral surface of the substrate; the locking member is fixedly connected to the circuit board after passing through the first mounting hole and the second mounting hole in sequence; Alternatively, the heat spreader partially overlaps with the bottom surface of the substrate, and the substrate includes a first substrate and a second substrate arranged on the first substrate, the area of ​​the second substrate is smaller than the area of ​​the first substrate; a third mounting hole is arranged on the first substrate, and the third mounting hole is arranged opposite to the first mounting hole; the annular mounting plate is arranged on the first substrate and is sleeved on the outer peripheral surface of the second substrate; the locking piece is fixedly connected to the circuit board after passing through the first mounting hole and the third mounting hole in sequence.

12. The cooling device according to claim 11, wherein: The locking member comprises a locking rod and an adapter sleeved on the locking rod.

13. The cooling device according to claim 12, wherein: The adapter comprises an annular body and a plurality of elastic claws; the plurality of elastic claws are connected to the inner surface of the annular body, and the plurality of elastic claws are arranged at intervals along the circumference of the annular body.

14. The cooling device according to claim 13, wherein: The locking member further comprises an elastic member; the locking rod comprises a first boss and a second boss which are spaced apart, the second boss and the adapter being respectively located on two sides of the annular mounting plate; The elastic member is sleeved on the locking rod and is located between the first boss and the second boss.

15. A server, comprising a circuit board, a chip and the cooling device according to any one of claims 1 to 14; the chip is arranged on the circuit board; The cooling device is arranged on the circuit board, and the heat spreader of the cooling device is at least attached to the chip.

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