Resin composition, build-up film, preparation method therefor and use thereof, and package substrate

Abstract

A resin composition, a build-up film, a preparation method therefor and a use thereof, and a package substrate. The resin composition comprises the following components in parts by mass: 20-60 parts of a functional resin, 10-50 parts of a first curing agent, 1-10 parts of a curing accelerator, 50-250 parts of an inorganic filler, and 5-40 parts of an organic filler. The structure of the first curing agent is shown as a formula (I), wherein n is a positive integer. In the resin composition, the functional resin is used as a main body, and the inorganic filler and the organic filler are added, so that under the action of the first curing agent and the curing accelerator of specific types, the moisture absorption and the coefficient of thermal expansion of the resin composition can be effectively reduced, and the modulus of elasticity of the resin composition is effectively improved; the warping degree of the build-up film formed by the resin composition can be effectively reduced; and the resin composition has a low dielectric constant and a dielectric loss angle, and has high flame retardation.

Description

Resin composition, build-up film, preparation method and application thereof, and packaging carrier Technical Field

[0001] The present application relates to the field of material technology, and in particular to a resin composition, a build-up film, a preparation method and application thereof, and a packaging carrier. Background Art

[0002] The flip chip ball grid array (FCBGA) substrate is an advanced packaging substrate. It flips the chip upside down and attaches it to the substrate. The chip and substrate are connected by solder balls to achieve electrical connection and signal transmission. FCBGA substrates have the characteristics of high integration, small packaging volume, high reliability and low power consumption. They are widely used in computers, communications, consumer electronics, medical care, industrial control and other fields. Among them, the build-up film is one of the key core materials in the semi-additive manufacturing process (SAP) of FCBGA packaging substrates. However, the thermal expansion coefficient and warpage of traditional build-up films are relatively high.

[0003] Therefore, it is necessary to improve the traditional technology.

[0004] Summary of the Invention

[0005] Based on this, the present application provides a resin composition with low thermal expansion coefficient and warpage, a build-up film, a preparation method and application thereof, and a packaging carrier.

[0006] The technical solution of this application to solve the above technical problems is as follows.

[0007] In a first aspect, the present application provides a resin composition comprising the following components in parts by mass:

[0008] 20-60 parts of functional resin, 10-50 parts of first curing agent, 1-10 parts of curing accelerator, 50-250 parts of inorganic filler and 5-40 parts of organic filler; the structure of the first curing agent is shown in formula (I):

[0009] (I)

[0010] Wherein, n is a positive integer.

[0011] In some embodiments, in the resin composition, the structure of the first curing agent is shown in Formula (I-1):

[0012] (I-1).

[0013] In some embodiments, in the resin composition, n is a positive integer from 1 to 6.

[0014] In some embodiments, in the resin composition, the structure of the first curing agent is shown in Formula (I-2):

[0015] (I-2).

[0016] In some embodiments, in the resin composition, the mass ratio of the first curing agent to the functional resin is (0.5-2):1.

[0017] In some embodiments, the resin composition satisfies at least one of the following characteristics (1) to (4):

[0018] (1) The functional resin includes at least one of epoxy resin, benzoxazine resin and bismaleimide resin;

[0019] (2) the curing accelerator comprises at least one of a tertiary amine accelerator, an imidazole accelerator, a peroxide accelerator, an organophosphorus accelerator, and a transition metal carboxylate accelerator;

[0020] (3) The inorganic filler includes at least one of silica and alumina;

[0021] (4) The organic filler includes at least one of silicone particles, core-shell rubber particles and olefin elastomer particles.

[0022] In some embodiments, the resin composition further comprises 10-50 parts by mass of a second curing agent, wherein the second curing agent comprises at least one of an amine curing agent, a phenolic curing agent, an acid anhydride curing agent, a cyanate curing agent and an active ester curing agent.

[0023] In some embodiments, the resin composition further comprises 10-30 parts by mass of a flame retardant.

[0024] In some embodiments, the resin composition further comprises 1-5 parts by mass of an auxiliary agent, wherein the auxiliary agent comprises at least one of a dispersant, a leveling agent, a defoaming agent, a treating agent and a coupling agent.

[0025] A second aspect of the present application provides a build-up film, the raw materials for preparing the build-up film include the resin composition provided in the first aspect.

[0026] A third aspect of the present application provides a method for preparing a build-up film, comprising the following steps:

[0027] Providing raw materials according to the components of the resin composition provided in the first aspect;

[0028] Mixing the raw materials and the solvent to obtain a resin slurry;

[0029] The resin slurry is placed on the surface of a support and dried to form a build-up film on the surface of the support.

[0030] In some embodiments, in the method for preparing a build-up film, the drying temperature is 70° C. to 140° C., and the drying time is 2 min to 15 min.

[0031] The fourth aspect of the present application provides an application of the build-up film provided in the second aspect or the build-up film prepared by the preparation method of the build-up film provided in the third aspect in a packaging carrier.

[0032] A fifth aspect of the present application provides a packaging carrier, comprising the build-up film provided in the second aspect or the build-up film prepared by the preparation method of the build-up film provided in the third aspect.

[0033] Compared with the prior art, the above resin composition has the following beneficial effects:

[0034] The above-mentioned resin composition is mainly composed of a functional resin, and is combined with inorganic fillers and organic fillers. Under the action of a specific type of first curing agent and a curing accelerator, since the first curing agent has multiple naphthalene ring structures, the planar structure of the naphthalene ring structures is a mesh chain arrangement, the free volume is relatively small, and the multiple naphthalene ring structures are connected by ether bonds, which can effectively reduce the hygroscopicity and thermal expansion coefficient of the resin composition, and effectively improve the elastic modulus of the resin composition; at the same time, the naphthalene ring structures in the first curing agent can increase the rigidity of the polymer chain segments, thereby effectively inhibiting the movement of the polymer chain segments during the curing process, thereby effectively reducing the warpage of the build-up film formed by the resin composition; moreover, the various components are combined with each other in a specific proportion, so that the above-mentioned resin composition also has a low dielectric constant and dielectric loss factor, as well as high flame retardant properties. DETAILED DESCRIPTION

[0035] Reference will now be made in detail to embodiments of the present invention, one or more examples of which are described below. Each example is provided to illustrate, not to limit, the present invention. Indeed, it will be apparent to those skilled in the art that various modifications and variations may be made to the present invention without departing from the scope or spirit of the invention. For example, features illustrated or described as part of one embodiment may be used in another embodiment to produce further embodiments.

[0036] Therefore, it is intended that the present invention covers such modifications and variations as come within the scope of the appended claims and their equivalents. Other objects, features, and aspects of the present invention are disclosed in or are obvious from the following detailed description. Those skilled in the art will appreciate that this discussion is merely a description of exemplary embodiments and is not intended to limit the broader aspects of the present invention.

[0037] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used in this specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0038] The term "comprises", "comprising" or any other variant thereof is intended to cover non-exclusive inclusion, so that the process, method, article or equipment comprising a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or equipment. In the absence of further restrictions, the elements limited by the sentence "comprising a ..." do not exclude the presence of other identical elements in the process, method, article or equipment comprising the elements. The indefinite articles "a" and "an" before the elements or components of the present invention have no restriction on the quantity requirements (i.e., the number of occurrences) of the elements or components. Therefore, "a" or "a" should be interpreted as including one or at least one, and elements or components in the singular also include plural forms, unless the quantity obviously refers only to the singular form. The meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0039] The weights of the relevant components mentioned in the description of the embodiments of the present invention may not only refer to the specific content of each component, but also represent the weight ratio between the components. Therefore, as long as the content of the relevant components is proportionally increased or decreased according to the description of the embodiments of the present invention, it is within the scope disclosed in the description of the embodiments of the present invention. Specifically, the weights mentioned in the description of the embodiments of the present invention may be mass units known in the chemical industry, such as μg, mg, g, and kg.

[0040] Except as shown in the operating examples or otherwise indicated, all numbers used in the specification and claims to express the amount of ingredients, physicochemical properties, etc. are understood to be adjusted by the term "about" in all cases. For example, therefore, unless otherwise indicated, the numerical parameters listed in the above specification and the appended claims are approximate values, and those skilled in the art will be able to appropriately change these approximate values ​​using the teachings disclosed herein to seek to obtain the desired properties. The use of numerical ranges expressed as endpoints includes all numbers within the range and any range within the range, for example, 1 to 5 includes 1, 1.1, 1.3, 1.5, 2, 2.75, 3, 3.80, 4 and 5, etc.

[0041] In the present application, when a linking site is not specified in a group, it means that any linking site in the group can be used as the linking site.

[0042] In the present application, the single bond to which the substituent is connected runs through the corresponding ring, indicating that the substituent can be connected to any position of the ring, for example R is connected to any substitutable position of the benzene ring.

[0043] One embodiment of the present application provides a resin composition, which comprises the following components in parts by mass:

[0044] 20-60 parts of functional resin, 10-50 parts of first curing agent, 1-10 parts of curing accelerator, 50-250 parts of inorganic filler and 5-40 parts of organic filler; the structure of the first curing agent is shown in formula (I):

[0045] (I)

[0046] Wherein, n is a positive integer.

[0047] The above-mentioned resin composition is mainly composed of a functional resin, and is combined with inorganic fillers and organic fillers. Under the action of a specific type of first curing agent and a curing accelerator, since the first curing agent has multiple naphthalene ring structures, the planar structure of the naphthalene ring structures is a mesh chain arrangement, the free volume is relatively small, and the multiple naphthalene ring structures are connected by ether bonds, which can effectively reduce the hygroscopicity and thermal expansion coefficient of the resin composition, and effectively improve the elastic modulus of the resin composition; at the same time, the naphthalene ring structures in the first curing agent can increase the rigidity of the polymer chain segments, thereby effectively inhibiting the movement of the polymer chain segments during the curing process, thereby effectively reducing the warpage of the build-up film formed by the resin composition; moreover, the various components are combined with each other in a specific proportion, so that the above-mentioned resin composition also has a low dielectric constant and dielectric loss factor, as well as high flame retardant properties.

[0048] In some examples, in the resin composition, the structure of the first curing agent is as shown in formula (I-1):

[0049] (I-1).

[0050] It is understood that n in the structural formula of the first curing agent includes, but is not limited to, positive integers such as 1, 2, 3, 4, 5, 6, 7, and 8; in some examples, it may be within a range formed by any two of these values, the same below. Accordingly, the first curing agent includes, but is not limited to, dimers, trimers, tetramers, pentamers, hexamers, heptamers, and octamers.

[0051] In some examples, in the resin composition, n is a positive integer ranging from 1 to 6.

[0052] Furthermore, n is 1, 2 or 3.

[0053] Optionally, n is 2. That is, the first curing agent is tripolynaphthalene diol.

[0054] In some examples, in the resin composition, the structure of the first curing agent is as shown in formula (I-2):

[0055] (I-2).

[0056] It can be understood that in the resin composition, the mass fraction of the functional resin includes but is not limited to 20 parts, 22 parts, 25 parts, 28 parts, 30 parts, 32 parts, 35 parts, 38 parts, 40 parts, 142 parts, 45 parts, 48 ​​parts, 50 parts, 52 parts, 55 parts, 58 parts, and 60 parts; the mass fraction of the first curing agent includes but is not limited to 10 parts, 12 parts, 15 parts, 18 parts, 20 parts, 22 parts, 25 parts, 28 parts, 30 parts, 32 parts, 35 parts, 38 parts, 40 parts, 142 parts, 45 parts, 48 ​​parts, and 50 parts; the mass fraction of the curing accelerator includes but is not limited to 1 part, The mass parts of inorganic fillers include but are not limited to 50 parts, 60 parts, 70 parts, 80 parts, 90 parts, 100 parts, 110 parts, 120 parts, 130 parts, 140 parts, 150 parts, 160 parts, 170 parts, 180 parts, 190 parts, 200 parts, 210 parts, 220 parts, 230 parts, 240 parts, 250 parts; the mass parts of organic fillers include but are not limited to 5 parts, 8 parts, 10 parts, 12 parts, 15 parts, 18 parts, 20 parts, 22 parts, 25 parts, 28 parts, 30 parts, 32 parts, 35 parts, 38 parts, 40 parts.

[0057] In some examples, the resin composition includes the following components in parts by mass:

[0058] 20-50 parts of functional resin, 10-50 parts of first curing agent, 1-10 parts of curing accelerator, 80-200 parts of inorganic filler

[0059] and 5-30 parts of organic filler.

[0060] In some examples, the resin composition includes the following components in parts by mass:

[0061] 20-40 parts of functional resin, 10-30 parts of first curing agent, 1-5 parts of curing accelerator, 80-200 parts of inorganic filler and 5-20 parts of organic filler.

[0062] In some examples, the resin composition includes the following components in parts by mass:

[0063] 30-40 parts of functional resin, 20-30 parts of first curing agent, 3-5 parts of curing accelerator, 140-200 parts of inorganic filler and 5-20 parts of organic filler.

[0064] In some examples, the resin composition includes the following components in parts by mass:

[0065] 30-35 parts of functional resin, 20-35 parts of first curing agent, 3-4 parts of curing accelerator, 180-200 parts of inorganic filler and 15-20 parts of organic filler.

[0066] In some examples, in the resin composition, the mass ratio of the first curing agent to the functional resin is (0.5-2):1.

[0067] It is understood that the mass ratio of the first curing agent to the functional resin includes but is not limited to 0.5:1, 0.6:1, 0.7:1, 0.8:1, 0.9:1, 1:1, 1.1:1, 1.2:1, 1.4:1, 1.5:1, 1.8:1, and 2:1.

[0068] Optionally, in the resin composition, the mass ratio of the first curing agent to the functional resin is (0.5-1):1.

[0069] Furthermore, in the resin composition, the mass ratio of the first curing agent to the functional resin is (0.5-0.8):1.

[0070] Preferably, in the resin composition, the mass ratio of the first curing agent to the functional resin is (0.6-0.8):1.

[0071] In some examples, in the resin composition, the functional resin includes at least one of an epoxy resin, a benzoxazine resin, and a bismaleimide resin.

[0072] Among them, the epoxy resin is not limited to a specific type, including but not limited to one or more of naphthalene-type epoxy resin, bisphenol A-type epoxy resin, bisphenol F-type epoxy resin, phosphorus-containing epoxy resin, unsaturated epoxy resin, phenolic epoxy resin, o-cresol-type epoxy resin, bisphenol A phenolic epoxy resin, multifunctional epoxy resin, alicyclic epoxy resin, resorcinol epoxy resin, rubber-modified epoxy resin, biphenyl epoxy resin, and dicyclopentadiene epoxy resin.

[0073] Among them, the benzoxazine resin is not limited to a specific type, and includes but is not limited to one or more of bisphenol A type benzoxazine resin, bisphenol F type benzoxazine resin, main chain type benzoxazine resin, phosphorus-containing benzoxazine, bisphenol S type benzoxazine resin, dicyclopentadiene benzoxazine resin, biphenyl type benzoxazine resin, tetraphenol ethane benzoxazine resin, and naphthalene type benzoxazine resin.

[0074] The bismaleimide resin is not particularly limited and is selected from organic compounds containing two or more maleimide structures in the molecular structure.

[0075] In some examples, in the resin composition, the curing accelerator includes at least one of a tertiary amine accelerator, an imidazole accelerator, a peroxide accelerator, an organophosphorus accelerator, and a transition metal carboxylate accelerator.

[0076] It is understood that tertiary amine accelerators include 2,4,6-tris(dimethylaminomethyl)phenol, benzyldimethylamine, triethylamine, triethanolamine and o-hydroxybenzyldimethylamine; imidazole accelerators include 2-methylimidazole, 2-ethyl-4-methylimidazole, 2- Ethyl imidazole, 2-propyl imidazole and C7-C17 long-chain alkyl substituted imidazole, etc.; peroxide accelerators include diisopropyl benzene peroxide, di(tert-butylperoxyisopropyl)benzene, 2,5-dimethyl-2,5-bis(tert-butylperoxy)hexane, 1,1-bis(tert-butylperoxy)-3,3,5-trimethylcyclohexane and di(2,4-dichlorobenzoyl)peroxide, etc.; organophosphorus accelerators include triphenylphosphine, tri-o-tolylphosphine, tri-p-tolylphosphine, tri(4-ethylphenyl)phosphine and tri(4-propylphenyl)phosphine, etc.; transition metal carboxylate accelerators include cobalt(II) acetylacetonate, copper(II) acetylacetonate, zinc(II) acetylacetonate and nickel(II) acetylacetonate, etc.

[0077] In some examples, in the resin composition, the inorganic filler includes at least one of silica and alumina.

[0078] In some of these examples, the inorganic filler in the resin composition is spherical.

[0079] In some examples, in the resin composition, the inorganic filler includes at least one of modified silica and modified alumina.

[0080] In some of the examples, in the resin composition, the inorganic filler includes but is not limited to epoxy-modified spherical silica, aniline-modified spherical silica, vinyl-modified spherical silica, hollow spherical silica, acrylic-modified spherical silica, fluoroalkyl-modified spherical silica, molybdate-modified spherical silica, epoxy-modified spherical alumina, aniline-modified spherical alumina, vinyl-modified spherical alumina, hollow spherical alumina, acrylic-modified spherical alumina, fluoroalkyl-modified spherical alumina, and molybdate-modified spherical alumina.

[0081] It is understood that there is no particular limitation on the average particle size of the inorganic filler, including but not limited to 10 μm, 5 μm, 3 μm, 1 μm, 0.5 μm, 0.1 μm, 0.05 μm, 0.01 μm, etc.

[0082] In some examples, in the resin composition, the organic filler includes at least one of silicone particles, core-shell rubber particles, and olefin elastomer particles.

[0083] The average particle size of the organic filler is not particularly limited, including but not limited to 10 nm, 50 nm, 100 nm, 200 nm, 300 nm, 500 nm, and 1000 nm.

[0084] In some examples, the resin composition further includes 10-50 parts by mass of a second curing agent, wherein the second curing agent includes at least one of an amine curing agent, a phenolic curing agent, an acid anhydride curing agent, a cyanate curing agent, and an active ester curing agent.

[0085] It can be understood that in the resin composition, the mass fraction of the second curing agent includes but is not limited to 20 parts, 22 parts, 25 parts, 28 parts, 30 parts, 32 parts, 35 parts, 38 parts, 40 parts, 142 parts, 45 parts, 48 ​​parts, and 50 parts.

[0086] In some examples, in the resin composition, the mass ratio of the first curing agent to the second curing agent is (0.5-2):1.

[0087] It can be understood that the mass ratio of the first curing agent to the second curing agent includes but is not limited to 0.5:1, 0.6:1, 0.7:1, 0.8:1, 0.9:1, 1:1, 1.1:1, 1.2:1, 1.4:1, 1.5:1, 1.8:1, and 2:1.

[0088] Optionally, in the resin composition, the mass ratio of the first curing agent to the second curing agent is (0.8-1.5):1.

[0089] In some examples, the resin composition further comprises 10-30 parts by mass of a flame retardant.

[0090] It can be understood that in the resin composition, the mass fraction of the flame retardant includes but is not limited to 10 parts, 12 parts, 15 parts, 18 parts, 20 parts, 22 parts, 25 parts, 28 parts, and 30 parts.

[0091] The flame retardant is not particularly limited.

[0092] In some examples, in the resin composition, the flame retardant includes at least one of a halogen flame retardant and a halogen-free flame retardant.

[0093] Furthermore, the halogenated flame retardant includes at least one of ethylene bispentabromobenzene, decabromodiphenyl ethane, tetrabromobisphenol A, ethylene bis tetrabromoimide and tetradecabromodiphenoxybenzene; and the halogen-free flame retardant includes at least one of phosphazene compounds, phosphate compounds, bisdiphenylphosphine oxide compounds and phosphinate compounds.

[0094] In some of the examples, the resin composition further comprises 1-5 parts by mass of an additive, wherein the additive comprises at least one of a dispersant, a leveling agent, a defoaming agent and a coupling agent.

[0095] It can be understood that in the resin composition, the mass parts of the auxiliary agent include but are not limited to 1 part, 2 parts, 3 parts, 4 parts, and 5 parts.

[0096] Furthermore, dispersants include cationic wetting dispersants, nonionic dispersants, anionic wetting dispersants, nanodispersants, etc.; leveling agents include silicone leveling agents, acrylic leveling agents, fluorocarbon leveling agents, etc.; defoaming agents include silicone defoaming agents, polyether defoaming agents, alcohol defoaming agents, etc.; coupling agents include silane coupling agents, titanate coupling agents, aluminate coupling agents, metal composite coupling agents, phosphate coupling agents and borate coupling agents, etc.

[0097] In some examples, the resin composition includes the following components in parts by mass:

[0098] 20-60 parts of functional resin, 10-50 parts of first curing agent, 10-50 parts of second curing agent, 1-10 parts of curing accelerator, 50-250 parts of inorganic filler, 5-40 parts of organic filler, 10-30 parts of flame retardant and 1-5 parts of other auxiliary agents.

[0099] In some examples, the resin composition includes the following components in parts by mass:

[0100] 20-50 parts of functional resin, 10-50 parts of first curing agent, 10-50 parts of second curing agent, 1-10 parts of curing accelerator, 80-200 parts of inorganic filler, 5-30 parts of organic filler, 10-30 parts of flame retardant and 1-5 parts of other auxiliary agents.

[0101] In some examples, the resin composition includes the following components in parts by mass:

[0102] 20-40 parts of functional resin, 10-30 parts of first curing agent, 10-30 parts of second curing agent, 1-5 parts of curing accelerator, 80-200 parts of inorganic filler, 5-20 parts of organic filler, 10-20 parts of flame retardant and 1-5 parts of other auxiliary agents.

[0103] In some examples, the resin composition includes the following components in parts by mass:

[0104] 30-40 parts of functional resin, 20-30 parts of first curing agent, 20-30 parts of second curing agent, 3-5 parts of curing accelerator, 140-200 parts of inorganic filler, 5-20 parts of organic filler, 15-20 parts of flame retardant and 3-5 parts of other auxiliary agents.

[0105] In some examples, the resin composition includes the following components in parts by mass:

[0106] 30-35 parts of functional resin, 20-35 parts of first curing agent, 20-35 parts of second curing agent, 3-4 parts of curing accelerator, 180-200 parts of inorganic filler, 15-20 parts of organic filler, 15-18 parts of flame retardant and 4-5 parts of other additives.

[0107] One embodiment of the present application provides a build-up film, the raw materials for preparing the build-up film include the above-mentioned resin composition.

[0108] It can be understood that the above-mentioned build-up layer film has low hygroscopicity and thermal expansion coefficient, low warpage, low dielectric constant and dielectric loss angle, and good flame retardancy.

[0109] In some examples, in the build-up layer film, the thickness of the build-up layer film is preferably, but not limited to, 3 μm-105 μm.

[0110] One embodiment of the present application provides a method for preparing a build-up film, comprising the following steps:

[0111] Step S10: providing raw materials according to the components of the resin composition.

[0112] Step S20: Mix the raw materials and the solvent to obtain resin slurry.

[0113] In some examples, in step S20, the solvent includes at least one of butanone, toluene, and propylene glycol methyl ether.

[0114] In some examples, in step S20 , the solvent includes butanone, toluene, and propylene glycol methyl ether.

[0115] In some examples, in step S20, the mass ratio of butanone, toluene, and propylene glycol methyl ether is (1-3):(1-3):1.

[0116] Furthermore, in step S20, the mass ratio of butanone, toluene and propylene glycol methyl ether is 1:1:1.

[0117] Step S30: placing resin slurry on the surface of the support, and forming a build-up film on the support after drying.

[0118] In some examples, in step S30 , the drying temperature is 70° C. to 140° C., and the drying time is 2 min to 15 min.

[0119] It can be understood that in step S30, the drying temperature includes but is not limited to 70°C, 80°C, 90°C, 100°C, 110°C, 120°C, 130°C, and 140°C, and the time is 2 min, 5 min, 8 min, 10 min, 12 min, and 15 min.

[0120] In some examples, in step S30 , a resin slurry is applied to the surface of the support.

[0121] It can be understood that the build-up film does not include a support body.

[0122] In some examples, in step S30 , the support is selected from one of a plastic film and a metal film.

[0123] Furthermore, the plastic film includes but is not limited to polyethylene terephthalate (PET), polycarbonate (PC), and polymethyl methacrylate (PMMA).

[0124] Furthermore, the metal film includes but is not limited to copper foil and aluminum foil.

[0125] In some examples, in step S30 , the thickness of the support body is preferably, but not limited to, 3 μm-105 μm.

[0126] It can be understood that the resin slurry disposed on the surface of the support first forms a resin slurry layer on the surface of the support, and then forms a build-up film after drying.

[0127] It can be further understood that the thickness of the resin slurry layer is not limited and is adjusted according to the thickness of the prepared build-up film.

[0128] In some examples, in step S30 , the thickness of the resin slurry layer is preferably, but not limited to, 3 μm-105 μm.

[0129] One embodiment of the present application provides the use of the above-mentioned build-up film or the build-up film prepared by the above-mentioned preparation method in a packaging carrier. Another embodiment of the present application provides a packaging carrier, including the above-mentioned build-up film or the build-up film prepared by the above-mentioned preparation method.

[0130] In some of these examples, the package carrier is a FCBGA package carrier.

[0131] The above-mentioned build-up film or the build-up film prepared by the above-mentioned preparation method has low hygroscopicity and thermal expansion coefficient, low warping, low dielectric constant and dielectric loss angle, and good flame retardant performance. When used to prepare a packaging carrier, it can effectively avoid damage to the packaging carrier caused by thermal stress due to the large thermal expansion coefficient, thereby effectively improving the reliability of the packaging system.

[0132] The present application will be described in further detail below in conjunction with specific implementation methods, but the implementation methods of the present application are not limited thereto.

[0133] The first curing agent used in the following examples or comparative examples has a structural formula as shown in formula (I-2), which is defined as tripolynaphthalene diol:

[0134] (I-2).

[0135] The sources of raw materials used in the following examples and comparative examples are as follows:

[0136] Tripolynaphthalene diol: Kungang New Materials; biphenyl epoxy resin: Nippon Kayaku NC3500; naphthalene-type epoxy resin: DIC Chemical HP-4032D; phenolic curing agent: Nippon Kayaku GPH-65; imidazole accelerator: Shikoku Chemical 2MI; spherical silica: Yaduma SO-C1; core-shell rubber particles: UMG Co., Ltd. B0603; flame retardant: Otsuka Chemical SPB100; additive: BYK-1650.

[0137] Example 1:

[0138] Calculated by mass, 10 parts of the first curing agent (trisnaphthalene diol), 10 parts of the second curing agent (phenolic curing agent), 20 parts of biphenyl epoxy resin, 1 part of imidazole accelerator, 80 parts of spherical silica, 12.5 parts of core-shell rubber particles, 10 parts of flame retardant and 1 part of auxiliary agent are dissolved in 50 parts of a mixed solvent of butanone, toluene and propylene glycol methyl ether, wherein butanone, toluene and propylene glycol methyl ether are mixed in a mass ratio of 1:1:1, stirred thoroughly, coated on one surface of PET, and then baked at 100°C for 6 minutes to obtain a build-up film with a thickness of 80 μm.

[0139] Example 2, Example 3 and Example 4 are basically the same as Example 1, and the only difference is that the mass fractions are different, as shown in Table 1.

[0140] Example 5

[0141] The process is basically the same as Example 1, except that the second curing agent is omitted and the number of parts of the first curing agent is 20 parts.

[0142] Example 6

[0143] The method is basically the same as Example 3, except that, in Example 6, the first curing agent (tert-naphthalene diol) is 20 parts and the second curing agent (phenolic curing agent) is 40 parts.

[0144] Comparative Example 1

[0145] The process is basically the same as Example 1, except that the first curing agent is omitted in Comparative Example 1, and the amount of the phenolic curing agent is 20 parts.

[0146] Comparative Example 2

[0147] Calculated by mass, 5 parts of tri-naphthalene diol, 20 parts of biphenyl epoxy resin, 15 parts of phenolic curing agent, 1 part of imidazole accelerator, 80 parts of spherical silica, 12.5 parts of core-shell rubber particles, 10 parts of flame retardant and 1 part of auxiliary agent are dissolved in a mixed solvent of butanone, toluene and propylene glycol methyl ether, wherein butanone, toluene and propylene glycol methyl ether are mixed in a mass ratio of 1:1:1, after being fully stirred, coated on one surface of PET, and then baked at 100°C for 6 minutes to obtain a build-up layer film.

[0148] Comparative Example 3

[0149] Calculated by mass, 20 parts of naphthalene-type epoxy resin, 20 parts of phenolic curing agent, 1 part of imidazole accelerator, 80 parts of spherical silica, 12.5 parts of core-shell rubber particles, 10 parts of flame retardant and 1 part of auxiliary agent are dissolved in a mixed solvent of butanone, toluene and propylene glycol methyl ether, wherein butanone, toluene and propylene glycol methyl ether are mixed in a mass ratio of 1:1:1, after being fully stirred, coated on one surface of PET, and then baked at 100°C for 5 minutes to obtain a build-up layer film.

[0150] Comparative Example 4

[0151] The comparative example 4 is basically the same as Example 1, except that the first curing agent in Example 1 is replaced by 1,4-dihydroxynaphthalene, the structure of which is shown in Formula (II):

[0152] Formula (II).

[0153] The main parameters of the build-up films of various embodiments and comparative examples are shown in Table 1.

[0154] Table 1

[0155] The build-up films prepared in each embodiment and comparative example were tested using the following test methods:

[0156] The above-obtained build-up film (without PET film) was laminated to a 12μm thick copper foil by a laminating machine. After removing the PET film, the copper foil was covered with a 12μm thick copper foil. The film was placed in a programmable temperature and pressure controlled vacuum press. The vacuum parameters were <10mBar and the pressure was 13kgf / cm 2 The test samples were obtained by curing completely at 100℃*30min+170℃*30min+190℃*100min under the pressure of 100℃*30min+170℃*30min to carry out the following tests.

[0157] Thermomechanical Analysis (TMA): Tests the glass transition temperature (TG), the coefficient of thermal expansion (CTE) before and after the glass transition temperature (TG) in accordance with IPC-TM-650 2.4.24.5.

[0158] Warpage test: Warpage is tested according to IPC-TM-650-2.4.22.1;

[0159] Electrical performance test: Dielectric constant (Dk) and dielectric loss factor (Df) are tested according to IPC-TM-650 2.5.5.2;

[0160] Flame retardant grade: tested according to IPC-TM650-2.3.10;

[0161] Water absorption: tested according to IPC-TM650-2.6.2.1;

[0162] The test results are shown in Table 2.

[0163] Table 2

[0164] As can be seen from Table 2, compared with the comparative example, the build-up layer films prepared in each embodiment have lower hygroscopicity, thermal expansion coefficient and warpage, and also have lower dielectric constant and dielectric loss factor, as well as higher flame retardancy.

[0165] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0166] The embodiments described above only express several implementation methods of the present application, which are convenient for understanding the technical solutions of the present application in a specific and detailed manner, but they cannot be understood as limiting the scope of protection of the invention patent. It should be pointed out that for ordinary technicians in this field, without departing from the concept of the present application, several variations and improvements can be made, which all fall within the scope of protection of the present application. It should be understood that the technical solutions obtained by those skilled in the art through logical analysis, reasoning or limited experiments on the basis of the technical solutions provided in the present application are all within the scope of protection of the claims attached to the present application. Therefore, the scope of protection of the patent of this application shall be based on the content of the attached claims, and the description can be used to interpret the content of the claims.

Claims

1. A resin composition, characterized in that By mass, it includes the following components: 20-60 parts of functional resin, 10-50 parts of first curing agent, 1-10 parts of curing accelerator, 50-250 parts of inorganic filler and 5-40 parts of organic filler; the structure of the first curing agent is shown in formula (I): Wherein, n is a positive integer.

2. The resin composition according to claim 1, characterized in that The structure of the first curing agent is shown in formula (I-1):

3. The resin composition according to claim 1, characterized in that n is a positive integer between 1 and 6.

4. The resin composition according to claim 1, characterized in that The structure of the first curing agent is shown in formula (I-2):

5. The resin composition according to claim 1, characterized in that The mass ratio of the first curing agent to the functional resin is (0.5-2):

1.

6. The resin composition according to any one of claims 1 to 5, characterized in that The resin composition satisfies at least one of the following characteristics (1) to (4): (1) The functional resin includes at least one of epoxy resin, benzoxazine resin and bismaleimide resin; (2) the curing accelerator comprises at least one of a tertiary amine accelerator, an imidazole accelerator, a peroxide accelerator, an organophosphorus accelerator and a transition metal carboxylate accelerator; (3) The inorganic filler includes at least one of silicon dioxide and aluminum oxide; (4) The organic filler includes at least one of silicone particles, core-shell rubber particles and olefin elastomer particles.

7. The resin composition according to any one of claims 1 to 5, characterized in that The resin composition further comprises 10-50 parts by mass of a second curing agent, wherein the second curing agent comprises at least one of an amine curing agent, a phenolic curing agent, an acid anhydride curing agent, a cyanate curing agent and an active ester curing agent.

8. The resin composition according to any one of claims 1 to 5, characterized in that: The resin composition further comprises 10-30 parts by mass of a flame retardant.

9. The resin composition according to any one of claims 1 to 5, characterized in that: The resin composition further comprises 1-5 parts of auxiliary agents by weight, and the auxiliary agents comprise at least one of a dispersant, a leveling agent, a defoaming agent and a coupling agent.

10. A build-up film, characterized in that: The raw materials for preparing the resin composition include the resin composition as claimed in any one of claims 1 to 9.

11. A method for preparing a build-up film, characterized in that: The following steps are involved: Providing raw materials according to the components of the resin composition according to any one of claims 1 to 9; Mixing the raw materials and the solvent to obtain a resin slurry; The resin slurry is disposed on the surface of a support body, and is dried to form a build-up film on the surface of the support body.

12. The preparation method according to claim 11, characterized in that: The drying temperature is 70° C. to 140° C., and the drying time is 2 min to 15 min.

13. Use of the build-up film according to claim 10 or the build-up film prepared by the preparation method according to any one of claims 11 to 12 in preparing a packaging carrier.

14. A packaging carrier, characterized in that: It comprises the build-up film as claimed in claim 10 or the build-up film prepared by the preparation method according to any one of claims 11 to 12.

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