Printing abnormality countermeasure device and printing abnormality countermeasure method

Abstract

This printing abnormality countermeasure device comprises a storage unit and a countermeasure unit. The storage unit stores, in association with each other, an improvement measure for improving printing abnormality for each type of printing abnormality, which is at least one of a printing failure in which the printing state of solder printed on a substrate via an opening in a stencil by sliding on the stencil by a squeegee is not included in an allowable range, and a member failure that is a failure of a member used when printing the solder on the substrate. When a printing abnormality occurs in the production of a product substrate, the countermeasure unit executes an improvement measure stored in association with the type of printing abnormality that occurred.

Description

Printing error handling device and printing error handling method

[0001] This specification discloses a technique relating to a printing error handling device and a printing error handling method.

[0002] The printing condition processor described in the patent document 1 can change printing conditions based on a table of symptom-solution pairings. For example, the printing condition processor can employ a solution of wiping the stencil if less than 5% of the pads have bridges of paste connecting adjacent solder pads.

[0003] U.S. Pat. No. 5,882,720

[0004] When a printing defect occurs, where the solder printing condition does not fall within the acceptable range, the worker may not be able to take appropriate action. Similarly, when a material defect occurs, where the material used to print the solder is defective, the worker may not be able to take appropriate action.

[0005] In view of the above circumstances, this specification discloses a printing abnormality handling device and a printing abnormality handling method that can improve a printing abnormality when the printing abnormality occurs in the production of product substrates.

[0006] This specification discloses a printing abnormality corrective device including a memory unit and a corrective unit. The memory unit stores a corrective measure for correcting the printing abnormality, which corresponds to at least one of a printing defect (a printing defect in which the printed state of solder printed on a board through an opening in a stencil by sliding the squeegee over the stencil is not within an acceptable range) and a material defect (a material defect in which a material used when printing the solder on the board is defective), in association with the printing abnormality. When the printing abnormality occurs during the production of a product board, the corrective measure is executed.

[0007] This specification also discloses a printing abnormality handling method including a storage step and a handling step. The storage step associates and stores a remedy for improving the printing abnormality with at least one type of printing abnormality, which is at least one of a printing defect in which the printed state of solder printed on a board through an opening in a stencil by sliding the squeegee over the stencil is not within an acceptable range, and a material defect in which a material used when printing the solder on the board is defective. The handling step, when the printing abnormality occurs during the production of product boards, executes the remedy stored in association with the type of printing abnormality that has occurred.

[0008] This specification discloses the technical idea of ​​changing "a device for dealing with a printing error according to claim 2" to "a device for dealing with a printing error according to any one of claims 2 to 6" in claim 7 of the claims originally attached to the application (hereinafter referred to as the original claims). This specification also discloses the technical idea of ​​changing "a device for dealing with a printing error according to claim 7" to "a device for dealing with a printing error according to claim 7 or claim 8" in claim 9 of the original claims. This specification also discloses the technical idea of ​​changing "a device for dealing with a printing error according to claim 7" to "a device for dealing with a printing error according to any one of claims 7 to 9" in claim 10 of the original claims.

[0009] This specification also discloses the technical idea of ​​changing "the device for dealing with a printing error according to claim 7" to "the device for dealing with a printing error according to any one of claims 7 to 10" in claim 11 originally claimed. Furthermore, this specification discloses the technical idea of ​​changing "the device for dealing with a printing error according to claim 2" to "the device for dealing with a printing error according to any one of claims 2 to 13" in claim 14 originally claimed. Furthermore, this specification discloses the technical idea of ​​changing "the device for dealing with a printing error according to claim 2" to "the device for dealing with a printing error according to any one of claims 2 to 14" in claim 15 originally claimed.

[0010] According to the above-described printing error corrective device, when a printing error occurs during the production of product substrates, it is possible to execute a remedial measure that is stored in association with the type of printing error that has occurred. What has been described above about the printing error corrective device also applies to the printing error corrective method.

[0011] 1 is a configuration diagram showing an example of the configuration of a substrate-related work line. FIG. 2 is a partial cross-sectional view showing an example of the configuration of a printing machine. FIG. 3 is a block diagram showing an example of a control block of a printing abnormality corrective device. FIG. 4 is a flowchart showing an example of a control procedure by the printing abnormality corrective device. FIG. 5 is a flowchart showing an example of an implementation of a remedy when insufficient scraping occurs. FIG. 6 is a schematic diagram showing an example of insufficient scraping where solder remains in a linear shape along the sliding direction of the squeegee. FIG. 7 is a schematic diagram showing an example of insufficient scraping where solder remains in a planar shape. FIG. 8 is a flowchart showing an example of an implementation of a remedy when an insufficient amount of transfer occurs. FIG. 9 is a schematic diagram showing an example of the relationship between a first opening and a squeegee. FIG. 10 is a schematic diagram showing an example of the relationship between a second opening and a squeegee. FIG. 11 is a cross-sectional view showing an example of a third opening, solder, and land before stencil release. FIG. 12 is a cross-sectional view showing an example of a third opening, solder, and land after stencil release. FIG. 13 is a flowchart showing an example of an implementation of a remedy when an excessive amount of transfer occurs. FIG. 14 is a flowchart showing an example of an implementation of a remedy when bridging occurs.

[0012] 1. Embodiment 1-1. Configuration Example of Substrate-Related Work Line WML In the substrate-related work line WML, a substrate-related work machine WM0 performs a predetermined substrate-related work on a substrate 90 to produce a product substrate 900. The substrate-related work line WML of the embodiment only needs to include a printer WM1, and the type and number of substrate-related work machines WM0 that make up the substrate-related work line WML are not limited. As shown in Figure 1, the substrate-related work line WML of the embodiment includes multiple (five) substrate-related work machines WM0: a printer WM1, a print inspection machine WM2, a component placement machine WM3, a reflow oven WM4, and a visual inspection machine WM5, and the substrate 90 is transported in this order by a substrate transport device.

[0013] The printer WM1 prints solder 80 at the mounting positions of multiple components on the board 90. The print inspection machine WM2 inspects the printing condition of the solder 80 printed by the printer WM1. The component mounting machine WM3 mounts multiple components on the board 90 on which the solder 80 has been printed by the printer WM1. There may be one or more component mounting machines WM3. When multiple component mounting machines WM3 are provided, the multiple component mounting machines WM3 can share the mounting work of multiple components.

[0014] The reflow furnace WM4 heats the board 90 on which multiple components have been mounted by the component mounting machine WM3, melting the solder 80 and performing soldering. The visual inspection machine WM5 inspects the mounting state of the multiple components mounted by the component mounting machine WM3. In this way, the board-related work line WML uses multiple (five) board-related work machines WM0 to sequentially transport the boards 90 and perform production processes including inspection processes to produce the product board 900. Note that the board-related work line WML can also be equipped with other board-related work machines WM0 as needed, such as a function inspection machine, a buffer device, a board supply device, a board inverting device, a shield mounting device, an adhesive application device, and an ultraviolet irradiation device.

[0015] The plurality (five) of substrate-related performing machines WM0 and the control device WMC that make up the substrate-related performing line WML are communicatively connected by a communication unit LC0. The communication unit LC0 may perform communication via a wired connection or wirelessly. Various communication methods are possible. In this embodiment, the plurality (five) of substrate-related performing machines WM0 and the control device WMC form a local area network (LAN). This allows the plurality (five) of substrate-related performing machines WM0 to communicate with each other via the communication unit LC0. Furthermore, the plurality (five) of substrate-related performing machines WM0 can communicate with the control device WMC via the communication unit LC0.

[0016] The management device WMC controls the plurality (five) of substrate-related performing machines WM0 that make up the substrate-related performing line WML and monitors the operating status of the substrate-related performing line WML. The management device WMC stores various control data for controlling the plurality (five) substrate-related performing machines WM0. The management device WMC transmits the control data to each of the plurality (five) substrate-related performing machines WM0. Furthermore, each of the plurality (five) substrate-related performing machines WM0 transmits its operating status and production status to the management device WMC.

[0017] The management device WMC may be provided with a data server DSV. The data server DSV may store, for example, acquired data acquired by the substrate-related performing machine WM0 regarding substrate-related performing operations. For example, the acquired data may include various image data captured by the substrate-related performing machine WM0. The acquired data may also include records (log data) of the operating status acquired by the substrate-related performing machine WM0.

[0018] The data server DSV can also store various production information related to the production of the board 90. For example, component data such as information on the shape of each component type, information on electrical characteristics, and information on how to handle the components are included in the production information. Inspection results from inspection machines such as the print inspection machine WM2 and the appearance inspection machine WM5 are also included in the production information.

[0019] 1-2. Configuration Example of Printer WM1 In the printer WM1 of this embodiment, the squeegee 34 slides over the stencil 70 to print solder 80 onto the substrate 90 through the openings 71 in the stencil 70. As shown in FIG. 2 , the printer WM1 of this embodiment includes a substrate transport device 10, a stencil support device 20, a squeegee moving device 30, a control device 40, and a display device 41. In this specification, the transport direction of the substrate 90 (the direction perpendicular to the paper surface of FIG. 2 ) is defined as the X-axis direction. Furthermore, the direction perpendicular to the X-axis direction in the horizontal plane (XY plane) (the front-to-rear direction of the printer WM1, the left-to-right direction on the paper surface of FIG. 2 ) is defined as the Y-axis direction. Furthermore, the vertical direction perpendicular to the X-axis direction and the Y-axis direction (the up-to-down direction on the paper surface of FIG. 2 ) is defined as the Z-axis direction.

[0020] The board transfer device 10 transfers a board 90 to be printed. The board 90 is a circuit board on which various circuits such as electronic circuits, electric circuits, and magnetic circuits are formed. The board transfer device 10 is provided on a base BS1 of the printing machine WM1. The board transfer device 10 transfers the board 90, for example, by a belt conveyor extending in the X-axis direction.

[0021] The substrate transport device 10 includes a substrate holding unit 11 that holds the substrate 90 that has been carried into the printing machine WM1. The substrate holding unit 11 is provided below the stencil 70 and is configured to be able to move up and down in the Z-axis direction by, for example, a linear motion mechanism such as a feed screw mechanism. Specifically, the substrate holding unit 11 is lowered when the substrate 90 is transported, and when the substrate 90 is transported to a predetermined position, it rises together with the substrate 90 and holds the substrate 90 with the upper surface of the substrate 90 in close contact with the lower surface of the stencil 70.

[0022] The stencil support device 20 is provided above the substrate transfer device 10. The stencil support device 20 supports the stencil 70 using a pair of support tables. The pair of support tables are arranged on the left side (the far side of the paper in FIG. 2 and shown in the figure) and the right side (the near side of the paper in FIG. 2 and not shown in the figure) of the printing machine WM1 when viewed from the front, and are formed to extend along the Y-axis direction.

[0023] 2 is a partial cross-sectional view of the printer WM1 taken along the Y-axis direction, and schematically shows the interior of the printer WM1 as viewed from the side, as well as cross sections of the stencil 70 and the substrate 90. The stencil 70 has openings 71 formed therethrough at predetermined positions on the wiring pattern of the substrate 90. The stencil 70 is supported by the stencil support device 20, for example, via a frame member provided on the outer periphery.

[0024] The squeegee moving device 30 raises and lowers the squeegee 34 in a direction perpendicular to the stencil 70 (Z-axis direction), and moves the squeegee 34 in the Y-axis direction on the top surface of the stencil 70. The squeegee moving device 30 includes a head driving device 31, a squeegee head 32, a pair of lifting devices 33, 33, and a pair of squeegees 34, 34. The head driving device 31 is disposed on the upper side of the printing machine WM1. The head driving device 31 can move the squeegee head 32 in the Y-axis direction by, for example, a linear motion mechanism such as a feed screw mechanism.

[0025] The squeegee head 32 is clamped and fixed to a moving body that constitutes the linear motion mechanism of the head drive device 31. The squeegee head 32 holds a pair of lifting devices 33, 33. Each of the pair of lifting devices 33, 33 holds a squeegee 34 and can be driven independently of each other. Each of the pair of lifting devices 33, 33 drives an actuator such as an air cylinder to raise and lower the squeegee 34 that it holds.

[0026] The squeegee 34 slides over the upper surface of the stencil 70, moving the solder 80 supplied to the upper surface of the stencil 70 along the stencil 70. Cream solder (solder paste) can be used as the solder 80. The solder 80 is imprinted onto the substrate 90 through the openings 71 in the stencil 70, and the solder 80 is printed on the substrate 90 arranged below the stencil 70. In this embodiment, each of the pair of squeegees 34 is a plate-like member formed to extend along a width direction (X-axis direction) perpendicular to the printing direction (Y-axis direction).

[0027] The front squeegee 34 (left side in FIG. 2 ) of the pair of squeegees 34 is used in a printing process that moves the solder 80 from the front side to the rear side, and the direction from the front side to the rear side of the printer WM1 is the traveling direction. The rear squeegee 34 (right side in FIG. 2 ) of the pair of squeegees 34 is used in a printing process that moves the solder 80 from the rear side to the front side, and the direction from the rear side to the front side of the printer WM1 is the traveling direction. Furthermore, for both squeegees 34, the direction opposite to the traveling direction is the retreating direction.

[0028] Each of the pair of squeegees 34, 34 is held by the lifting device 33 at an inclination such that the front portion located on the forward direction side faces downward. In other words, each of the pair of squeegees 34, 34 is held by the lifting device 33 at an inclination such that the back portion located on the backward direction side faces upward. The inclination angle of each of the pair of squeegees 34, 34 is adjusted by an adjustment mechanism provided below the lifting device 33.

[0029] The control device 40 includes a known arithmetic unit and storage device, and forms a control circuit. The control device 40 is communicably connected to the management device WMC via the communication unit LC0 shown in FIG. 1, and can send and receive various data. The control device 40 can drive and control the substrate transport device 10, stencil support device 20, squeegee moving device 30, and display device 41 based on the production program, detection results of various sensors, etc.

[0030] As shown in Figure 3, the control device 40 is provided with a storage device 60. The storage device 60 can be, for example, a magnetic storage device such as a hard disk drive, or a storage device using semiconductor elements such as flash memory. The storage device 60 stores a production program for driving the printing press WM1, etc. The control device 40 acquires various pieces of information stored in the storage device 60 and detection results of various sensors provided in the printing press WM1.

[0031] The control device 40, for example, drives and controls the squeegee moving device 30. The control device 40 sends a control signal to the squeegee moving device 30 based on the above-mentioned various information and detection results, etc. This controls the positions in the Y-axis direction and the Z-axis direction (height), as well as the movement speed and tilt angle, of the pair of squeegees 34, 34 held by the squeegee head 32. Then, as described above, the pair of squeegees 34, 34 are driven and controlled, and solder 80 is printed on the substrate 90 placed on the underside of the stencil 70.

[0032] As shown in Figures 2 and 3, the control device 40 is provided with a display device 41. The display device 41 can display the operating status of the printing press WM1. The display device 41 is also configured as a touch panel and functions as an input device that accepts various operations by the operator. The operator can learn the operating status of the printing press WM1 via the display device 41. The operator can also set the printing press WM1, give instructions to the printing press WM1, and so on via the display device 41.

[0033] 1-3. Configuration Example of Printing Error Corrective Device 50 When a printing defect occurs in which the printed state of the solder 80 does not fall within an acceptable range, the worker may not be able to take appropriate action. Similarly, when a component defect occurs in which the component used when printing the solder 80 is defective, the worker may not be able to take appropriate action. Therefore, the substrate-related work line WML of this embodiment is provided with a printing error corrective device 50.

[0034] As shown in FIG. 3, the printing error handling device 50, when considered as a control block, includes a memory unit 51 and a handling unit 52. The printing error handling device 50 can be provided in the printing press WM1. The printing error handling device 50 can also be provided in various control devices and management devices other than the printing press WM1, such as the substrate-related operation machine WM0 and the management device WMC. The printing error handling device 50 can also be formed on the cloud. As shown in FIG. 3, the printing error handling device 50 of the embodiment is provided in the control device 40 of the printing press WM1.

[0035] The printing error correcting device 50 executes control in accordance with the flowchart shown in Fig. 4. The storage unit 51 performs the process shown in step S11. The correcting unit 52 makes the decision shown in step S12 and performs the process shown in step S13. The matters described in this specification can be selected and applied as appropriate. The matters described in this specification can also be combined as appropriate.

[0036] The memory unit 51 stores, in association with each type of printing abnormality, which is at least one of printing defects and component defects, a remedy for improving the printing abnormality (step S11 shown in FIG. 4). A printing abnormality refers to a state in which the printing condition of the solder 80 printed on the substrate 90 through the openings 71 of the stencil 70 by the squeegee 34 sliding over the stencil 70 is not within an acceptable range. For example, the printing abnormality can be detected by an inspection device equivalent to the print inspection machine WM2 provided in the printer WM1. The printing abnormality can also be detected by the print inspection machine WM2. The printing abnormality can also be input by an operator into the printer WM1.

[0037] A component defect refers to a defect in a component used when printing solder 80 on a substrate 90. For example, the stencil 70 is included in the component used. A component defect in the stencil 70 can be acquired, for example, by the imaging device FC1 shown in FIGS. 2 and 3. As shown in FIG. 2, the imaging device FC1 is provided above the stencil 70. The imaging device FC1 can be moved, for example, in the X-axis direction and the Y-axis direction using an XY table, and can capture an image of the top surface of the stencil 70 to acquire a defect in the stencil 70. In this way, a component defect can be acquired by a known imaging device such as the imaging device FC1. Furthermore, a component defect can also be acquired visually by an operator, or can be input by the operator into the printing machine WM1.

[0038] The storage unit 51 stores a remedy for correcting the printing abnormality in association with each type of printing abnormality, which is at least one of a printing defect and a component defect. The storage unit 51 may take various forms as long as it can store a remedy for each type of printing abnormality in association with each other. For example, the storage unit 51 can store a remedy for each type of printing abnormality in the storage device 60 in association with each type of printing abnormality. The storage unit 51 can also store a remedy for each type of printing abnormality in the data server DSV in association with each type of printing abnormality. The storage unit 51 can also store a remedy for each type of printing abnormality in association with each type of printing abnormality on the cloud.

[0039] When a printing abnormality occurs during the production of the product substrate 900, the countermeasure unit 52 executes a remedial measure stored in association with the type of the printing abnormality that has occurred (steps S12 and S13 shown in FIG. 4). The countermeasure unit 52 may take various forms as long as it is able to execute the remedial measure as described above. Furthermore, the type of printing abnormality and the remedial measure are not limited. In this specification, examples of the storage unit 51 and the countermeasure unit 52 are shown for each type of printing abnormality shown below.

[0040] 1-3-1. Incomplete Scraping Component defects include incomplete scraping, where solder 80 remains on the stencil 70. In this case, the remedy varies depending on the type of incomplete scraping. Therefore, the storage unit 51 stores remedy measures for each type of incomplete scraping when incomplete scraping occurs. Then, when incomplete scraping occurs during the production of the product substrate 900, the corrective unit 52 executes a remedy according to the type of incomplete scraping that occurred (steps S21 to S28 shown in FIG. 5 ).

[0041] The unscraped portion occurs when solder 80 enters the gap between the squeegee 34 and the stencil 70 and remains on the stencil 70. FIG. 6 shows an example of unscraped portion in which solder 80 remains linearly along the sliding direction (Y-axis direction) of the squeegee 34. For example, if a missing portion 34r, in which a portion of the squeegee 34 is missing, occurs in the squeegee 34, the solder 80 cannot be imprinted onto the substrate 90 at the missing portion 34r. Therefore, when the squeegee 34 moves along the sliding direction (Y-axis direction), the solder 80 remains linearly along the sliding direction (Y-axis direction) of the squeegee 34, resulting in unscraped portion. In this case, the squeegee 34 needs to be replaced.

[0042] Therefore, the memory unit 51 may store, as a type of remaining unscraped portion, replacement of the squeegee 34 as a remedy for the occurrence of remaining unscraped portion in which solder 80 remains linearly along the sliding direction (Y-axis direction) of the squeegee 34. Then, the corrective action unit 52 may guide the worker to replace the squeegee 34 when remaining unscraped portion along the sliding direction (Y-axis direction) of the squeegee 34 occurs during the production of the product substrate 900, and have the worker replace the squeegee 34 (steps S21 and S22).

[0043] For example, the troubleshooting unit 52 uses the imaging device FC1 to capture an image of the top surface of the stencil 70. The troubleshooting unit 52 processes the image of the stencil 70 captured by the imaging device FC1 and determines whether or not a linear portion of the solder 80 remains along the sliding direction (Y-axis direction) of the squeegee 34, i.e., whether or not a portion of the solder 80 remains (step S21). If such a portion of the solder 80 remains (step S21: Yes), the troubleshooting unit 52 uses, for example, the display device 41 to guide the worker to replace the squeegee 34, and has the worker replace the squeegee 34 (step S22). Then, control by the print error troubleshooting device 50 is temporarily terminated. This allows the worker to replace the squeegee 34, and the portion of the solder 80 remains (step S22).

[0044] FIG. 7 shows an example of a situation where solder 80 remains in a flat, unscraped state. As shown in the figure, if solder 80 remains in a flat, unscraped state, the relationship between printing speed and printing pressure may be inappropriate. Therefore, the printing speed and printing pressure must be reconsidered. Furthermore, if the printing pressure is increased too much, the squeegee 34 may easily sink into the opening 71, reducing the volume of solder 80 printed on the substrate 90 and potentially degrading print quality. Furthermore, if the printing pressure is increased too much, the stencil 70 may be damaged.

[0045] Therefore, the storage unit 51 may store a parameter change for changing at least the printing speed out of the printing speed and the printing pressure as a remedy for the occurrence of a type of unscraped solder, in which the solder 80 remains flat on the stencil 70. The corrective unit 52 may then execute the parameter change when an unscraped solder, in which the solder 80 remains flat, occurs during the production of the product substrate 900 (steps S23 to S28).

[0046] Furthermore, the parameters can be changed so that the relationship between the printing pressure and the printing speed becomes a predetermined relationship that has been derived in advance. This makes it easier for the countermeasure unit 52 to adjust the printing pressure and the printing speed. Specifically, the predetermined relationship can be expressed as a relationship in which the printing pressure is proportional to the printing speed. For example, the printing pressure is represented by a variable F, and the printing speed is represented by a variable V. The relationship between the variables F and V can be expressed as F = aV + b, using a proportional constant a and an intercept b. The proportional constant a and the intercept b vary depending on the material, dimensions, etc. of the squeegee 34, so it is advisable to derive them in advance through simulations, verification using an actual machine, etc.

[0047] For example, if the result of the image processing described above indicates that there is a scraped-off portion of solder 80 that is different from the linear scraped-off portion of solder 80 that remains along the sliding direction (Y-axis direction) of the squeegee 34 (No in step S21), the corrective action unit 52 determines that a scraped-off portion of solder 80 that remains in a planar shape has occurred. Then, the corrective action unit 52 determines whether the relationship F<aV+b holds (step S23). If the relationship does not hold (No in step S23), the corrective action unit 52 changes the printing speed (step S24). Specifically, the corrective action unit 52 reduces the printing speed. For example, the corrective action unit 52 can reduce the printing speed by a certain amount from the current printing speed.

[0048] If the relationship F<aV+b holds (Yes in step S23), the handling unit 52 determines whether the relationship F>Fmax holds (step S25). The constant Fmax represents the maximum allowable value of printing pressure. If the above relationship holds (Yes in step S25), the handling unit 52 changes the printing pressure and printing speed (step S26). For example, the handling unit 52 sets the printing pressure to the predetermined relationship F=aV+b described above. Also, the handling unit 52 sets the printing speed to V'=(F'-b) / a. The variables V' and F' represent the printing speed and printing pressure when the above predetermined relationship (F=aV+b) is derived for the printing speed.

[0049] If the relationship F>Fmax does not hold (No in step S25), the countermeasure unit 52 changes the printing speed (step S27). For example, the countermeasure unit 52 sets the printing speed to the previously described V' = (F' - b) / a. After the processing in step S24, step S26, or step S27 is completed, the countermeasure unit 52 determines whether the printing abnormality has been improved (step S28). For example, the countermeasure unit 52 can determine that the printing abnormality has been improved if the remaining unscraped solder 80, which remains flat, is eliminated (if the area of ​​the unscraped solder 80 is within the allowable range). If the printing abnormality has been improved (Yes in step S28), control by the printing abnormality correcting device 50 is temporarily terminated.

[0050] If the printing abnormality has not been resolved (No in step S28), control by the printing abnormality correcting device 50 returns to the determination in step S23, and the previously described determination and processing are repeated. In this way, by using the predetermined relationship (F = aV + b), the correcting unit 52 can more efficiently adjust the printing pressure and printing speed to an appropriate relationship compared to reducing the printing speed by a fixed amount from the current printing speed. Note that the predetermined relationship (F = aV + b) may fluctuate depending on the management status of the printing process. For example, the predetermined relationship may fluctuate depending on the management status of the substrate 90, the relationship between the squeegee 34 and the table on the device side (e.g., the flatness of the table), and other factors. Therefore, the predetermined relationship may be modified to offset errors resulting from these factors.

[0051] Furthermore, the storage unit 51 can also store, as types of unscraped solder, a remedy for when unscraped solder 80 remains linearly along the sliding direction (Y-axis direction) of the squeegee 34, and a remedy for when unscraped solder 80 remains planarly on the stencil 70. In this case, when unscraped solder 80 occurs during the production of the product substrate 900, the corrective action unit 52 can execute a remedy corresponding to the type of unscraped solder that has occurred.

[0052] 1-3-2. Insufficient Transfer Amount Printing defects include an insufficient transfer amount, where the amount of solder 80 printed on the board 90 is less than the allowable range. In this case, the remedy varies depending on the shape of the opening 71. Therefore, the storage unit 51 stores remedy measures for when an insufficient transfer amount occurs, for each shape of the opening 71 where the insufficient transfer amount occurs. Then, when an insufficient transfer amount occurs during the production of the product board 900, the corrective unit 52 executes a remedy according to the shape of the opening 71 where the insufficient transfer amount occurs (steps S31 to S41 shown in FIG. 8 ).

[0053] 9 shows an example of the relationship between the first opening 71a and the squeegee 34. The first opening 71a refers to an opening 71 whose dimension in the width direction (X-axis direction) of the squeegee 34, which is perpendicular to the sliding direction (Y-axis direction) of the squeegee 34 in the horizontal plane (XY plane), is larger than a predetermined dimension. The larger the dimension in the width direction (X-axis direction) of the first opening 71a, the more likely it is that the tip 34a of the squeegee 34 will partially deform and enter the first opening 71a. As a result, the amount of solder 80 transferred is more likely to decrease.

[0054] Therefore, the memory unit 51 may store parameter changes including at least a printing pressure reduction change, which reduces the printing pressure, and a speed reduction change, which reduces the printing speed, as a remedy for when an insufficient amount of solder 80 is transferred at the first opening 71 a, as the shape of the opening 71. The corrective action unit 52 may then execute the parameter changes when an insufficient amount of solder 80 is transferred at the first opening 71 a during production of the product substrate 900 (steps S31 and S32). This reduces deformation of the tip 34 a of the squeegee 34, making it easier to increase the amount of solder 80 transferred.

[0055] The insufficient transfer amount includes a state in which at least one of the area, volume, and height of the solder 80 printed on the substrate 90 is smaller than the allowable range. For example, the insufficient transfer amount can be obtained by an inspection device equivalent to the print inspection machine WM2 provided in the printer WM1. The insufficient transfer amount can also be obtained by the print inspection machine WM2. From these, the handling unit 52 can obtain shape information regarding the shape of the opening 71 along with printing information regarding the insufficient transfer amount.

[0056] When an insufficient transfer amount occurs during the production of the product substrate 900, the countermeasure unit 52 acquires shape information regarding the shape of the opening 71 where the insufficient transfer amount occurs. The countermeasure unit 52 then determines whether the opening 71 is the first opening 71a (step S31). If the opening 71 is the first opening 71a (Yes in step S31), the countermeasure unit 52 executes parameter changes, including at least a printing pressure reduction change, of a printing pressure reduction change and a speed reduction change (step S32). For example, the countermeasure unit 52 can execute a printing pressure reduction change, which reduces the printing pressure by a certain amount from the current printing pressure. The countermeasure unit 52 can also execute a speed reduction change using the predetermined relationship (F = aV + b) described above.

[0057] 10 shows an example of the relationship between the second opening 71b and the squeegee 34. The second opening 71b refers to an opening 71 whose dimension in the sliding direction (Y-axis direction) of the squeegee 34 is larger than a specified dimension. The larger the dimension of the second opening 71b in the sliding direction (Y-axis direction), the more likely it is that the amount of transferred solder 80 will decrease at the base end side 71b1 in the sliding direction (Y-axis direction) of the second opening 71b. Therefore, it is preferable that the memory unit 51 stores the following parameter changes as the shape of the opening 71 as a remedy for when an insufficient amount of solder is transferred at the second opening 71b.

[0058] For example, the parameter changes may include at least an angle decrease change or a speed decrease change among an angle decrease change that decreases the angle of the squeegee 34 relative to the stencil 70, a speed decrease change that decreases the printing speed, and an interval shortening change that shortens the cleaning interval of the stencil 70. The corrective unit 52 may then execute the parameter changes described above when an insufficient amount of solder 80 is transferred to the second opening 71b during production of the product substrate 900 (steps S33 to S36). This makes it easier to increase the amount of solder 80 transferred to the base end side 71b1 of the second opening 71b.

[0059] Specifically, if the opening 71 is not the first opening 71 a (No in step S31), the countermeasure unit 52 determines whether the opening 71 is the second opening 71 b (step S33). If the opening 71 is the second opening 71 b (Yes in step S33), the countermeasure unit 52 determines whether the angle of the squeegee 34 is changeable (step S34). If the angle of the squeegee 34 is changeable (Yes in step S34), the countermeasure unit 52 can execute any of the parameter changes of decreasing the angle, decreasing the speed, and shortening the interval (step S35).

[0060] For example, the countermeasure unit 52 can execute an angle reduction change to reduce the angle of the squeegee 34 by a fixed angle from the current angle. If the countermeasure unit 52 executes an angle reduction change, it can execute a speed reduction change using the predetermined relationship (F = aV + b) described above, with the printing pressure as the reference. The countermeasure unit 52 can also execute an interval shortening change to shorten the cleaning interval of the stencil 70 by a fixed number of times from the current interval. If the angle of the squeegee 34 cannot be changed (No in step S34), the countermeasure unit 52 can execute a parameter change for a speed reduction change, and can execute a parameter change for an interval shortening change (step S36). In this case, the countermeasure unit 52 can execute a speed reduction change to reduce the printing speed by a fixed speed from the current printing speed. In this case, the countermeasure unit 52 can also omit the parameter change for the interval shortening change.

[0061] Fig. 11 shows an example of the third opening 71c, the solder 80, and the land 90a before the stencil 70 is separated. Fig. 12 shows an example of the third opening 71c, the solder 80, and the land 90a after the stencil 70 is separated. The third opening 71c refers to an opening 71 whose dimension in the width direction (X-axis direction) of the squeegee 34 perpendicular to the sliding direction (Y-axis direction) of the squeegee 34 in the horizontal plane (XY plane) is equal to or less than a predetermined dimension, and whose dimension in the sliding direction (Y-axis direction) of the squeegee 34 is equal to or less than a specified dimension.

[0062] The smaller the size of the opening 71, such as the third opening 71c, the more likely it is that an insufficient amount of transfer will occur due to insufficient filling of the solder 80 or poor release. Poor release is more likely to occur the slower the speed at which the solder 80 passes through the third opening 71c. The release speed can be derived from the thickness T0 of the stencil 70 and the release acceleration α shown in FIGS. 11 and 12. For example, assuming that release is a linear motion with a constant acceleration, the release speed hv can be expressed as hv = √(2 × α × T0). A transfer insufficiency that occurs when the release speed falls within a predetermined range is likely due to insufficient filling of the solder 80.

[0063] Therefore, the memory unit 51 may store the following parameter changes as a remedy for a transfer amount shortage occurring in a stencil 70 having a third opening 71c as the shape of the opening 71 and a plate release speed within a predetermined range. For example, the parameter changes may include at least an angle reduction change or a speed reduction change among an angle reduction change to reduce the angle of the squeegee 34 relative to the stencil 70, a speed reduction change to reduce the printing speed, and an interval reduction change to shorten the cleaning interval of the stencil 70. The corrective action unit 52 may then execute the parameter changes described above when a transfer amount shortage occurs in the third opening 71c during the production of the product substrate 900 (step S37, steps S34 to S36). This makes it easier to increase the transfer amount of solder 80 in the third opening 71c.

[0064] The parameter change for a stencil 70 having a third opening 71c and a plate release speed within the predetermined range is similar to the parameter change for the second opening 71b. Specifically, if the opening 71 is not the second opening 71b (No in step S33), the countermeasure unit 52 determines whether the plate release speed is within the predetermined range (step S37). If the plate release speed is within the predetermined range (Yes in step S37), the countermeasure unit 52 determines whether the angle of the squeegee 34 can be changed (step S34). If the angle of the squeegee 34 can be changed (Yes in step S34), the countermeasure unit 52 can execute any of the parameter changes: angle reduction, speed reduction, and spacing reduction (step S35). If the angle of the squeegee 34 cannot be changed (No in step S34), the countermeasure unit 52 can execute the parameter change for speed reduction or spacing reduction (step S36).

[0065] In contrast, a transfer amount shortage that occurs when the stencil release speed is outside the predetermined range is likely to be due to a stencil release failure. Therefore, the memory unit 51 may store a parameter change for changing the stencil release speed as a remedy for a transfer amount shortage that occurs when the stencil 70 has a third opening 71c as the shape of the opening 71 and the stencil release speed is outside the predetermined range. The corrective unit 52 may then execute the parameter change when a transfer amount shortage occurs at the third opening 71c during the production of the product substrate 900 (steps S37 to S40). This resolves the stencil release failure and facilitates an increase in the transfer amount of solder 80.

[0066] For example, the parameter change can change the plate separation speed based on the area ratio SR0, which is the ratio between the opening area S1 and the side area S2 of the third opening 71c. For example, the third opening 71c shown in Figures 11 and 12 is a cylindrical opening 71 with a radius R0 and a thickness T0. In this case, the opening area S1 is calculated by π x R0. ２The side area S2 can be expressed as 2π×R0×T0. The larger the side area S2 is relative to the opening area S1 (the smaller the area ratio SR0 is), the faster the plate separation speed needs to be.

[0067] Therefore, the parameter change may be performed by increasing the plate detachment speed for the third openings 71c for which the area ratio SR0, which is the ratio between the opening area S1 and the side area S2 of the third openings 71c, is less than a predetermined value, compared to the plate detachment speed for the third openings 71c for which the area ratio SR0 is less than a predetermined value (steps S38 to S40). Specifically, the corrective unit 52 determines whether the area ratio SR0 is greater than or equal to the predetermined value (step S38). If the area ratio SR0 is greater than or equal to the predetermined value (Yes in step S38), the corrective unit 52 changes the plate detachment speed to a first speed (step S39). If the area ratio SR0 is less than the predetermined value (No in step S38), the corrective unit 52 changes the plate detachment speed to a second speed that is faster than the first speed (step S40).

[0068] The predetermined value for determining the area ratio SR0 and the predetermined ranges for determining the first speed, the second speed, and the plate release speed can be derived in advance through simulation, verification using an actual machine, etc. Similarly, the parameter changes described above and the change amounts for the parameter changes described below can be derived in advance through simulation, verification using an actual machine, etc. Furthermore, the threshold values ​​for the dimensions of the openings 71 described above (the predetermined dimension for the first opening 71a, the specified dimension for the second opening 71b, and the predetermined and specified dimensions for the third opening 71c) can be changed depending on the material of the squeegee 34.

[0069] For example, even for first openings 71a of the same size, the softer the squeegee 34, the more easily the tip 34a of the squeegee 34 deforms and penetrates into the first opening 71a, reducing the amount of transferred solder 80. Therefore, the predetermined dimension of the first opening 71a should be set smaller for a softer squeegee 34. The same applies to the second opening 71b and the third opening 71c, and the threshold value for the dimension of the opening 71 should be set smaller for a softer squeegee 34.

[0070] When the processing shown in step S32, step S35, step S36, step S39, or step S40 is completed, the handling unit 52 determines whether the printing abnormality has been improved (step S41). For example, the handling unit 52 can determine that the printing abnormality has been improved if the print inspection machine WM2 determines that the insufficient transfer amount has been resolved (if the transfer amount of solder 80 printed on the board 90 is within the allowable range). If the printing abnormality has been improved (Yes in step S41), the control by the printing abnormality handling device 50 is temporarily terminated. If the printing abnormality has not been improved (No in step S41), the control by the printing abnormality handling device 50 returns to the determination shown in step S31, and the previously described determination and processing are repeated.

[0071] The storage unit 51 can store at least one of the above-described remedial measures for the first opening 71 a, the second opening 71 b, and the third opening 71 c. In this case, when an insufficient amount of transfer occurs in the production of the product substrate 900, the corrective measure can be implemented according to the shape of the opening 71 where the insufficient amount of transfer occurs.

[0072] 1-3-3. Excessive Transfer Amount Printing defects include excessive transfer amounts, where the amount of solder 80 printed on the board 90 exceeds the allowable range. Excessive transfer amounts include a state in which at least one of the area, volume, and height of the solder 80 printed on the board 90 exceeds the allowable range. For example, excessive transfer amounts can be detected using an inspection device equivalent to the print inspection machine WM2 installed in the printer WM1. Excessive transfer amounts can also be detected by the print inspection machine WM2. If the printing defect is excessive transfer amounts, a remedial measure to reduce the transfer amount is required. Therefore, the memory unit 51 may store the following parameter changes as a remedial measure when excessive transfer amounts occur.

[0073] For example, the parameter changes may include at least an angle increase change or a speed increase change among an angle increase change to increase the angle of the squeegee 34 relative to the stencil 70, a speed increase change to increase the printing speed, and an interval extension change to lengthen the cleaning interval of the stencil 70. The corrective unit 52 may then execute the parameter changes described above when an excessive amount of transfer occurs during the production of the product substrate 900 (steps S51 to S54 shown in FIG. 13). This makes it easier to reduce the amount of transferred solder 80.

[0074] For example, the countermeasure unit 52 determines whether the angle of the squeegee 34 can be changed (step S51). If the angle of the squeegee 34 can be changed (Yes in step S51), the countermeasure unit 52 can execute any of the parameter changes: angle increase change, speed increase change, and interval extension change (step S52). For example, the countermeasure unit 52 can execute an angle increase change, which increases the angle of the squeegee 34 by a certain angle from the current angle. If the countermeasure unit 52 executes an angle increase change, it can execute an interval extension change, which increases the speed using the predetermined relationship (F = aV + b) described above based on the printing pressure. Furthermore, the countermeasure unit 52 can execute an interval extension change, which extends the cleaning interval of the stencil 70 by a certain number of times from the current interval.

[0075] If the angle of the squeegee 34 cannot be changed (No in step S51), the handling unit 52 can execute a parameter change to increase the speed, or execute a parameter change to increase the interval (step S53). For example, the handling unit 52 can execute a speed increase change to increase the printing speed by a certain amount from the current printing speed. In this case, the handling unit 52 can also omit the parameter change to increase the interval.

[0076] When the processing shown in step S52 or step S53 is completed, the handling unit 52 determines whether the printing abnormality has been improved (step S54). For example, the handling unit 52 can determine that the printing abnormality has been improved if the print inspection machine WM2 determines that the excessive transfer amount has been resolved (if the transfer amount of solder 80 printed on the board 90 is within the allowable range). If the printing abnormality has been improved (Yes in step S54), the control by the printing abnormality handling device 50 is temporarily terminated. If the printing abnormality has not been improved (No in step S54), the control by the printing abnormality handling device 50 returns to the determination shown in step S51, and the previously described determination and processing are repeated.

[0077] 1-3-4. Bridges Printing defects include bridges, which are connections between solder 80 printed on the board 90. For example, bridges can be detected using an inspection device equivalent to the print inspection machine WM2 installed in the printer WM1. Bridges can also be detected by the print inspection machine WM2. If the printing defect is a bridge, a remedial measure is required to increase the frequency of cleaning the stencil 70. Therefore, the memory unit 51 may store parameter changes, including interval shortening, to shorten the cleaning interval of the stencil 70 as a remedial measure when a bridge occurs. Then, the countermeasure unit 52 may execute parameter changes when a bridge occurs during the production of the product board 900 (steps S61 to S64 shown in FIG. 14). This makes it easier to reduce bridges.

[0078] For example, the countermeasure unit 52 checks the number of product substrates 900 produced after cleaning the stencil 70 (the number after cleaning) (step S61). If the number after cleaning is unknown, the countermeasure unit 52 can, for example, execute a parameter change including an interval shortening change to reduce the cleaning interval of the stencil 70 from the currently set number to a predetermined number (e.g., one) (step S62). If the number after cleaning is the Nth, the countermeasure unit 52 can, for example, execute a parameter change including an interval shortening change to reduce the cleaning interval of the stencil 70 from N to a predetermined number (e.g., N-1) (step S63).

[0079] When the processing shown in step S62 or step S63 is completed, the handling unit 52 determines whether the printing abnormality has been resolved (step S64). For example, the handling unit 52 can determine that the printing abnormality has been resolved if the print inspection machine WM2 determines that the bridge has been resolved. If the printing abnormality has been resolved (Yes in step S64), control by the printing abnormality handling device 50 is temporarily terminated. If the printing abnormality has not been resolved (No in step S64), control by the printing abnormality handling device 50 returns to the determination shown in step S61, and the previously described determination and processing are repeated.

[0080] 1-4. Example of Processing by Printing Abnormality Handling Device 50 The storage unit 51 can store at least one of the following remedial measures: a remedial measure for when insufficient scraping occurs, a remedial measure for when an insufficient amount of transfer occurs, a remedial measure for when an excessive amount of transfer occurs, and a remedial measure for when a bridge occurs. When a printing abnormality occurs during the production of the product substrate 900, the handling unit 52 can execute the remedial measure stored in association with the type of the printing abnormality that has occurred.

[0081] For example, the memory unit 51 stores at least a remedy for when insufficient scraping occurs, and the countermeasure unit 52 can execute at least the remedy for improving the insufficient scraping before executing another remedy. The memory unit 51 stores at least a remedy for when an insufficient amount of transfer occurs, and the countermeasure unit 52 can execute at least the remedy for improving the insufficient amount of transfer before executing another remedy. The memory unit 51 stores at least a remedy for when an excessive amount of transfer occurs, and the countermeasure unit 52 can execute at least the remedy for improving the excessive amount of transfer before executing another remedy.

[0082] The storage unit 51 stores at least a remedy for when a bridge occurs, and the countermeasure unit 52 can execute at least one remedy for correcting the bridge and then execute another remedy. In this way, the storage unit 51 can store at least one of the remedy measures described above, and the countermeasure unit 52 can execute at least one of the remedy measures stored in association with the type of printing abnormality that has occurred when a printing abnormality occurs in the production of the product substrate 900.

[0083] 2. Printing Abnormality Handling Method The same applies to the printing abnormality handling method described above for the printing abnormality handling device 50. Specifically, the printing abnormality handling method includes a storage step and a handling step. The storage step corresponds to the control performed by the storage unit 51. The handling step corresponds to the control performed by the handling unit 52. Duplicate explanations will be omitted in this specification.

[0084] 3. Example of Effect of the Embodiment According to the print error corrective device 50, when a print error occurs during the production of the product substrate 900, it is possible to execute a remedial measure that is stored in association with the type of the print error that has occurred. What has been described above about the print error corrective device 50 also applies to the print error corrective method.

[0085] 34: Squeegee, 50: Printing abnormality handling device, 51: Memory unit, 52: Handling unit, 70: Stencil, 71: Opening, 71a: First opening, 71b: Second opening, 71c: Third opening, 80: Solder, 90: Board, 900: Product board, S1: Opening area, S2: Side area, SR0: Area ratio.

Claims

1. A printing abnormality countermeasure device comprising: a storage unit that associates and stores improvement measures for improving printing abnormalities for each type of printing abnormality, which is at least one of a printing defect in which a squeegee slides on a stencil and solder printed on a substrate through an opening of the stencil is not within an allowable range, and a member defect that is a defect of a member used when printing the solder on the substrate; and a countermeasure unit that executes the improvement measure stored in association with the type of the printing abnormality that has occurred when the printing abnormality occurs in the production of a product substrate.

2. The member defect includes scraping residue in which the solder remains on the stencil. The storage unit stores the improvement measure when the scraping residue occurs for each type of the scraping residue. The countermeasure unit executes the improvement measure corresponding to the type of the scraping residue that has occurred when the scraping residue occurs in the production of the product substrate. The printing abnormality countermeasure device according to claim 1.

3. The storage unit stores, as a type of the scraping residue, replacement of the squeegee as an improvement measure when the scraping residue in which the solder remains linearly along the sliding direction of the squeegee occurs. The countermeasure unit guides an operator to replace the squeegee and causes the operator to replace the squeegee when the scraping residue along the sliding direction of the squeegee occurs in the production of the product substrate. The printing abnormality countermeasure device according to claim 2.

4. The storage unit stores, as a type of the scraping residue, a parameter change for changing at least the printing speed among the printing speed and the printing pressure as an improvement measure when the scraping residue in which the solder remains in a planar shape occurs on the stencil. The countermeasure unit executes the parameter change when the scraping residue in which the solder remains in a planar shape occurs in the production of the product substrate. The printing abnormality countermeasure device according to claim 2 or claim 3.

5. The parameter change according to claim 4 is changed so that the relationship between the printing pressure and the printing speed becomes a predetermined relationship derived in advance.

6. The printing abnormality countermeasure device according to claim 5, wherein the predetermined relationship is a relationship in which the printing pressure is proportional to the printing speed.

7. The printing defect includes an insufficient transfer amount in which the transfer amount of the solder printed on the substrate is less than the allowable range. The storage unit stores the improvement measures when the insufficient transfer amount occurs for each shape of the opening where the insufficient transfer amount occurs. The countermeasure unit executes the improvement measure corresponding to the shape of the opening where the insufficient transfer amount occurs when the insufficient transfer amount occurs in the production of the product substrate. The printing abnormality countermeasure device according to claim 2.

8. When the storage unit stores, as the improvement measure when the insufficient transfer amount occurs in the first opening, which is an opening whose dimension in the width direction of the squeegee perpendicular to the sliding direction of the squeegee in the horizontal plane is larger than a predetermined dimension, as the shape of the opening, at least the printing pressure reduction change including the printing pressure reduction change for reducing the printing pressure and the speed reduction change for reducing the printing speed. The countermeasure unit executes the parameter change when the insufficient transfer amount occurs in the first opening in the production of the product substrate. The printing abnormality countermeasure device according to claim 7.

9. When the storage unit stores, as the improvement measure when the insufficient transfer amount occurs in the second opening, which is an opening whose dimension in the sliding direction of the squeegee is larger than a specified dimension, as the shape of the opening, at least the angle reduction change for reducing the angle of the squeegee with respect to the stencil, the speed reduction change for reducing the printing speed, and the parameter change including at least the angle reduction change or the speed reduction change for shortening the cleaning interval of the stencil. The countermeasure unit executes the parameter change when the insufficient transfer amount occurs in the second opening in the production of the product substrate. The printing abnormality countermeasure device according to claim 7.

10. The memory unit stores, as the shape of the opening, a parameter change including at least the angle reduction change of reducing the angle of the squeegee with respect to the stencil, the speed reduction change of reducing the printing speed, or the interval shortening change of shortening the cleaning interval of the stencil, as improvement measures when insufficient transfer amount occurs in the stencil including a third opening where the dimension in the width direction of the squeegee perpendicular to the sliding direction of the squeegee on a horizontal plane is equal to or less than a predetermined dimension and the dimension in the sliding direction of the squeegee is equal to or less than a specified dimension, and the release speed is within a predetermined range. The countermeasure unit executes the parameter change when insufficient transfer amount occurs in the third opening during the production of the product substrate. The printing abnormality countermeasure device according to claim 7.

11. The memory unit stores, as improvement measures when insufficient transfer amount occurs in the stencil including a third opening where the dimension in the width direction of the squeegee perpendicular to the sliding direction of the squeegee on a horizontal plane is equal to or less than a predetermined dimension and the dimension in the sliding direction of the squeegee is equal to or less than a specified dimension, and the release speed is not within a predetermined range, a parameter change of changing the release speed. The countermeasure unit executes the parameter change when insufficient transfer amount occurs in the third opening during the production of the product substrate. The printing abnormality countermeasure device according to claim 7.

12. The parameter change increases the release speed for the third opening with an area ratio less than a predetermined value compared to the release speed for the third opening with an area ratio (the ratio of the opening area to the side area of the third opening) equal to or greater than a predetermined value. The printing abnormality countermeasure device according to claim 11.

13. The threshold value for the dimension of the opening is set to be smaller for a softer squeegee. The printing abnormality countermeasure device according to any one of claims 7 to 12.

14. The printing defect includes an excessive transfer amount in which the transfer amount of the solder printed on the substrate exceeds the allowable range. When the excessive transfer amount occurs, the storage unit stores a parameter change including at least the angle increase change of increasing the angle of the squeegee with respect to the stencil, the speed increase change of increasing the printing speed, and the interval extension change of lengthening the cleaning interval of the stencil as improvement measures. The countermeasure unit executes the parameter change when the excessive transfer amount occurs in the production of the product substrate. The printing abnormality countermeasure device according to claim 2.

15. The printing defect includes a bridge in which the solders printed on the substrate are connected to each other. When the bridge occurs, the storage unit stores a parameter change including an interval shortening change of shortening the cleaning interval of the stencil as an improvement measure. The countermeasure unit executes the parameter change when the bridge occurs in the production of the product substrate. The printing abnormality countermeasure device according to claim 2.

16. A storage step of associating and storing improvement measures for improving the printing abnormality for each type of printing abnormality, which is at least one of a printing defect in which the printing state of the solder printed on the substrate through the opening of the stencil when the squeegee slides on the stencil is not within the allowable range, and a member defect which is a defect of a member used when printing the solder on the substrate; A countermeasure step of executing the improvement measure stored in association with the type of the printing abnormality that has occurred when the printing abnormality occurs in the production of the product substrate. A printing abnormality countermeasure method comprising:

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