Resin composition, prepreg, laminate, resin film, printed wiring board, and semiconductor package

Abstract

Disclosed are: a resin composition which contains (A) a siloxane-modified maleimide resin that includes a structure derived from a maleimide resin (A1) which has one or more N-substituted maleimide groups and a structure derived from a siloxane compound (A2) which has two or more primary amino groups, (B) a polyphenylene ether-based resin that has a functional group which contains an ethylenically unsaturated bond, and (C) a phosphorus-based flame retardant that has a phosphorus atom content of 12 mass% or more; and a prepreg, a laminate, a resin film, a printed wiring board, and a semiconductor package, each of which uses the resin composition.

Description

Resin compositions, prepregs, laminates, resin films, printed wiring boards, and semiconductor packages

[0001] The present embodiment relates to a resin composition, a prepreg, a laminate, a resin film, a printed wiring board, and a semiconductor package.

[0002] The speed and capacity of signals used in electronic devices such as mobile phones, their base station equipment, servers, routers, and other network infrastructure equipment, as well as large-scale computers, are increasing year by year. Accordingly, the substrate materials for the printed wiring boards used in these electronic devices are required to have dielectric properties that can reduce transmission loss of high-frequency signals.

[0003] Patent Document 1 discloses a curable resin composition containing a naphthol novolac epoxy resin and a polyphenylene ether resin, which has an object of providing a curable resin composition that can be used for insulating layers of printed wiring boards and that has a low relative dielectric constant and dielectric loss tangent of the cured product obtained and excellent heat resistance.

[0004] JP 2013-185080 A

[0005] Good flame retardancy is required for insulating materials such as prepregs. However, adding a flame retardant to a resin composition to improve flame retardancy causes a problem of poor circuit embeddability. One method for improving circuit embeddability is to reduce the viscosity of the resin composition impregnated into the prepreg. However, simply reducing the viscosity of the resin composition causes resin flows, in which the molten resin composition flows out from the edges during press molding of the prepreg or the like, resulting in a problem of reduced thickness accuracy of the molded product.

[0006] In view of the current situation, an object of the present embodiment is to provide a resin composition that contains a flame retardant and that effectively suppresses resin flow while also exhibiting excellent circuit embedding properties, and a prepreg, a laminate, a resin film, a printed wiring board, and a semiconductor package that use the resin composition.

[0007] As a result of extensive research aimed at solving the above-mentioned problems, the present inventors have found that the above-mentioned problems can be solved by the following embodiment. [1] A resin composition containing: (A) a siloxane-modified maleimide resin including a structure derived from a maleimide resin (A1) having one or more N-substituted maleimide groups and a structure derived from a siloxane compound (A2) having two or more primary amino groups; (B) a polyphenylene ether resin having a functional group containing an ethylenically unsaturated bond; and (C) a phosphorus-based flame retardant having a phosphorus atom content of 12% by mass or more. [2] The resin composition according to [1] above, wherein the component (C) is a metal phosphate. [3] The resin composition according to [1] or [2] above, wherein the content of the component (C) is 1 to 30 parts by mass relative to the total amount (100 parts by mass) of the resin components in the resin composition. [4] The resin composition according to any one of [1] to [3] above, wherein the (B) component has a terminal functional group containing an ethylenically unsaturated bond. [5] The resin composition according to any one of [1] to [4] above, wherein the (B) component has a (meth)acryloyl group. [6] The resin composition according to any one of [1] to [5] above, further comprising (D) an inorganic filler. [7] The resin composition according to [6] above, wherein the content of the (D) component is 20 to 90 mass% relative to the total solid content (100 mass%) in the resin composition. [8] A prepreg containing the resin composition according to any one of [1] to [7] above or a semi-cured product of the resin composition. [9] A laminate having a cured product of the resin composition according to any one of [1] to [7] above and a metal foil.

[10] A resin film containing the resin composition according to any one of [1] to [7] above or a semi-cured product of the resin composition.

[11] A printed wiring board having a cured product of the resin composition according to any one of [1] to [7] above.

[12] A semiconductor package having the printed wiring board according to

[11] above and a semiconductor element.

[0008] According to the present embodiment, it is possible to provide a resin composition that contains a flame retardant and that has excellent circuit embedding properties while effectively suppressing resin flow, and a prepreg, a laminate, a resin film, a printed wiring board, and a semiconductor package that use the resin composition.

[0009] In this specification, a numerical range indicated using "to" indicates a range that includes the numerical values ​​before and after "to" as the minimum and maximum values, respectively. For example, a numerical range "X to Y" (X and Y are real numbers) means a numerical range that is equal to or greater than X and equal to or less than Y. In this specification, the term "X or greater" means X and a numerical value that exceeds X. In addition, the term "Y or less" in this specification means Y and a numerical value that is less than Y. The lower limit and upper limit of a numerical range described in this specification can be arbitrarily combined with the lower limit or upper limit of another numerical range. In the numerical ranges described in this specification, the lower limit or upper limit of that numerical range may be replaced with a value shown in the examples.

[0010] Unless otherwise specified, each of the components and materials exemplified in this specification may be used alone or in combination of two or more. In this specification, when a resin composition contains a plurality of substances corresponding to each component, the content of each component in the resin composition means the total amount of the plurality of substances present in the resin composition, unless otherwise specified.

[0011] The expression "containing XX" as used herein means both containing XX in a reacted state if XX is capable of reacting, and simply containing XX.

[0012] In this specification, the term "solid content" refers to components other than the solvent, and components that are liquid at 25°C are also considered to be solid content.

[0013] In this specification, "(meth)acryloyl" means "acryloyl" and its corresponding "methacryloyl".

[0014] The weight average molecular weight (Mw) in this specification means a value measured in terms of polystyrene by gel permeation chromatography (GPC), and specifically, can be measured by the method described in the examples.

[0015] The mechanism of action described in this specification is speculation and does not limit the mechanism by which the effects of this embodiment are achieved.

[0016] Any combination of the features described in this specification is also included in this embodiment.

[0017] [Resin Composition] The resin composition of the present embodiment contains: (A) a siloxane-modified maleimide resin containing a structure derived from a maleimide resin (A1) having one or more N-substituted maleimide groups and a structure derived from a siloxane compound (A2) having two or more primary amino groups; (B) a polyphenylene ether resin having a functional group containing an ethylenically unsaturated bond; and (C) a phosphorus-based flame retardant having a phosphorus atom content of 12 mass% or more.

[0018] In the following description, the siloxane-modified maleimide resin (A) containing a structure derived from a maleimide resin (A1) having one or more N-substituted maleimide groups and a structure derived from a siloxane compound (A2) having two or more primary amino groups may be simply referred to as the "siloxane-modified maleimide resin (A)." Furthermore, the polyphenylene ether resin (B) having a functional group containing an ethylenically unsaturated bond may be referred to as the "polyphenylene ether resin (B)." Furthermore, the phosphorus-based flame retardant (C) having a phosphorus atom content of 12% by mass or more may be referred to as the "phosphorus-based flame retardant (C)." Furthermore, each component may be referred to as the (A) component, the (B) component, etc. Below, each component that may be contained in the resin composition of this embodiment will be described in order.

[0019] <(A) Siloxane-Modified Maleimide Resin> The (A) siloxane-modified maleimide resin contains a structure derived from a maleimide resin (A1) (hereinafter also simply referred to as "maleimide resin (A1)") having one or more N-substituted maleimide groups and a structure derived from a siloxane compound (A2) (hereinafter also simply referred to as "siloxane compound (A2)") having two or more primary amino groups. The (A) siloxane-modified maleimide resins may be used alone or in combination of two or more.

[0020] The structure derived from the maleimide resin (A1) and the structure derived from the siloxane compound (A2) contained in the siloxane-modified maleimide resin (A) may each be one type alone or two or more types.

[0021] (Structure Derived from Maleimide Resin (A1)) Examples of the structure derived from the maleimide resin (A1) include a structure formed by a Michael addition reaction between at least one N-substituted maleimide group among the N-substituted maleimide groups contained in the maleimide resin (A1) and a primary amino group contained in the siloxane compound (A2).

[0022] The content of the structure derived from the maleimide resin (A1) in the siloxane-modified maleimide resin (A) is not particularly limited, but from the viewpoints of dielectric properties and film handling properties, it is preferably 5 to 95 mass %, more preferably 30 to 93 mass %, and even more preferably 60 to 90 mass %.

[0023] The maleimide resin (A1) is not particularly limited as long as it is a maleimide resin having one or more N-substituted maleimide groups. From the viewpoints of conductor adhesion and heat resistance, the maleimide resin (A1) is preferably a maleimide resin having two or more N-substituted maleimide groups, more preferably an aromatic maleimide resin having two or more N-substituted maleimide groups, and even more preferably an aromatic bismaleimide resin having two N-substituted maleimide groups. In this specification, "aromatic maleimide resin" refers to a compound having an N-substituted maleimide group directly bonded to an aromatic ring. In this specification, "aromatic bismaleimide resin" refers to a compound having two N-substituted maleimide groups directly bonded to an aromatic ring. In this specification, "aromatic polymaleimide resin" refers to a compound having three or more N-substituted maleimide groups directly bonded to an aromatic ring. In addition, in this specification, the term "aliphatic maleimide resin" means a compound having an N-substituted maleimide group directly bonded to an aliphatic hydrocarbon.

[0024] The maleimide resin (A1) is preferably a maleimide resin represented by the following general formula (A1-1) [hereinafter, sometimes referred to as "maleimide resin (A1)"].

[0025] (In the formula, X Ａ１１ is a divalent organic group.

[0026] X in the above general formula (A1-1) Ａ１１ is a divalent organic group. Ａ１１ Examples of the divalent organic group represented by formula (A1-2) below, a divalent group represented by formula (A1-3) below, a divalent group represented by formula (A1-4) below, a divalent group represented by formula (A1-5) below, and a divalent group represented by formula (A1-6) below.

[0027] (In the formula, R Ａ１１ is an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom. Ａ１１ is an integer from 0 to 4. * represents a binding site.)

[0028] R in the above general formula (A1-2) Ａ１１ Examples of the aliphatic hydrocarbon group having 1 to 5 carbon atoms represented by include alkyl groups having 1 to 5 carbon atoms, such as methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, t-butyl, and n-pentyl; alkenyl groups having 2 to 5 carbon atoms; and alkynyl groups having 2 to 5 carbon atoms. The aliphatic hydrocarbon group having 1 to 5 carbon atoms may be either linear or branched. Examples of halogen atoms include fluorine, chlorine, bromine, and iodine atoms. In the above general formula (A1-2), n Ａ１１ is an integer of 0 to 4, and from the viewpoint of availability, is preferably an integer of 0 to 2, more preferably 0 or 1, and even more preferably 0. Ａ１１ is an integer of 2 or more, a plurality of R Ａ１１ They may be the same or different.

[0029] (In the formula, R Ａ１２ and R Ａ１３ are each independently an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom. Ａ１２n is an alkylene group having 1 to 5 carbon atoms, an alkylidene group having 2 to 5 carbon atoms, an ether group, a sulfide group, a sulfonyl group, a carbonyloxy group, a keto group, a single bond, or a divalent group represented by the following general formula (A1-3-1): Ａ１２ and n Ａ１３ are each independently an integer of 0 to 4. * represents a binding site.

[0030] R in the above general formula (A1-3) Ａ１２ and R Ａ１３ The aliphatic hydrocarbon group having 1 to 5 carbon atoms and the halogen atom represented by R Ａ１１ The same can be mentioned.

[0031] X in the above general formula (A1-3) Ａ１２ Examples of the alkylene group having 1 to 5 carbon atoms represented by X include a methylene group, a 1,2-dimethylene group, a 1,3-trimethylene group, a 1,4-tetramethylene group, and a 1,5-pentamethylene group. Ａ１２ Examples of the alkylidene group having 2 to 5 carbon atoms represented by include an ethylidene group, a propylidene group, an isopropylidene group, a butylidene group, an isobutylidene group, a pentylidene group, and an isopentylidene group.

[0032] n in the above general formula (A1-3) Ａ１２ and n Ａ１３ are each independently an integer of 0 to 4. Ａ１２ or n Ａ１３ is an integer of 2 or more, a plurality of R Ａ１２ R Ａ１３ They may be the same or different from each other.

[0033] X in the above general formula (A1-3) Ａ１２ The divalent group represented by formula (A1-3-1) is as follows:

[0034] (In the formula, R Ａ１４ and R Ａ１５ are each independently an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom. Ａ１３is an alkylene group having 1 to 5 carbon atoms, an alkylidene group having 2 to 5 carbon atoms, an ether group, a sulfide group, a sulfonyl group, a carbonyloxy group, a keto group, or a single bond. Ａ１４ and n Ａ１５ are each independently an integer of 0 to 4. * represents a binding site.

[0035] R in the above general formula (A1-3-1) Ａ１４ and R Ａ１５ The aliphatic hydrocarbon group having 1 to 5 carbon atoms and the halogen atom represented by R Ａ１１ The same as X in the general formula (A1-3-1) above can be mentioned. Ａ１３ The alkylene group having 1 to 5 carbon atoms and the alkylidene group having 2 to 5 carbon atoms represented by the above X Ａ１２ Among these, X Ａ１３ As the alkylidene group, an alkylidene group having 2 to 5 carbon atoms is preferred, an alkylidene group having 2 to 4 carbon atoms is more preferred, and an isopropylidene group is even more preferred.

[0036] n in the above general formula (A1-3-1) Ａ１４ and n Ａ１５ are each independently an integer of 0 to 4, and from the viewpoint of availability, are each preferably an integer of 0 to 2, more preferably 0 or 1, and even more preferably 0. Ａ１４ or n Ａ１５ is an integer of 2 or more, a plurality of R Ａ１４ R Ａ１５ They may be the same or different from each other.

[0037] (In the formula, n Ａ１６ is an integer from 0 to 10. * represents a binding site.)

[0038] n in the above general formula (A1-4) Ａ１６ is preferably an integer of 0 to 5, more preferably an integer of 0 to 4, and even more preferably an integer of 0 to 3, from the viewpoint of availability.

[0039] (In the formula, n Ａ１７ is a number from 0 to 5. * represents a binding site.)

[0040] (In the formula, R Ａ１６ and R Ａ１７ are each independently a hydrogen atom or an aliphatic hydrocarbon group having 1 to 5 carbon atoms. Ａ１８ is an integer from 1 to 8. * represents a binding site.)

[0041] R in the above general formula (A1-6) Ａ１６ and R Ａ１７ The aliphatic hydrocarbon group having 1 to 5 carbon atoms and the halogen atom represented by R Ａ１１ The same as those mentioned above can be mentioned. Ａ１８ is an integer of 2 or more, a plurality of R Ａ１６ R Ａ１７ They may be the same or different from each other.

[0042] Examples of the maleimide resin (A1) include aromatic bismaleimide resins, aromatic polymaleimide resins, and aliphatic maleimide resins. Examples of the maleimide resin (A1) include bis(4-maleimidophenyl)methane, m-phenylene bismaleimide, 2,2-bis[4-(4-maleimidophenoxy)phenyl]propane, 4-methyl-1,3-phenylene bismaleimide, 3,3'-dimethyl-5,5'-diethyl-4,4'-diphenylmethane bismaleimide, polyphenylmethane maleimide, biphenylaralkyl maleimide, and aromatic bismaleimide resins having an indane skeleton. Among these, 2,2-bis[4-(4-maleimidophenoxy)phenyl]propane is preferred.

[0043] (Structure derived from siloxane compound (A2)) Examples of the structure derived from the siloxane compound (A2) include a structure formed by a Michael addition reaction between one or both of the two primary amino groups contained in the siloxane compound (A2) and an N-substituted maleimide group contained in the maleimide resin (A1).

[0044] The content of the structure derived from the siloxane compound (A2) in the siloxane-modified maleimide resin (A) is not particularly limited, but from the viewpoints of dielectric properties, heat resistance, flame retardancy, and glass transition temperature, it is preferably 5 to 95 mass%, more preferably 7 to 70 mass%, and even more preferably 10 to 40 mass%.

[0045] The siloxane compound (A2) is not particularly limited as long as it is a siloxane compound having two or more primary amino groups.

[0046] The siloxane compound (A2) preferably contains a divalent group represented by the following general formula (A2-1), and more preferably contains a divalent group represented by the following general formula (A2-2).

[0047] (In the formula, R Ａ２１ and R Ａ２２ are each independently an aliphatic hydrocarbon group having 1 to 5 carbon atoms, a phenyl group, or a substituted phenyl group. * represents a bonding site.

[0048] (In the formula, R Ａ２１ and R Ａ２２ is the same as in the general formula (A2-1), and R Ａ２３ and R Ａ２４ are each independently an aliphatic hydrocarbon group having 1 to 5 carbon atoms, a phenyl group, or a substituted phenyl group. Ａ２１ and X Ａ２２ are each independently a divalent organic group, and n Ａ２１ is an integer between 2 and 100. * represents a binding site.

[0049] R in the above general formulas (A2-1) and (A2-2) Ａ２１ ~R Ａ２４Examples of the aliphatic hydrocarbon group having 1 to 5 carbon atoms represented by R include alkyl groups having 1 to 5 carbon atoms such as methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, t-butyl, and n-pentyl; alkenyl groups having 2 to 5 carbon atoms; and alkynyl groups having 2 to 5 carbon atoms. The aliphatic hydrocarbon group having 1 to 5 carbon atoms may be either linear or branched. As the aliphatic hydrocarbon group having 1 to 5 carbon atoms, an aliphatic hydrocarbon group having 1 to 3 carbon atoms is preferred, an alkyl group having 1 to 3 carbon atoms is more preferred, and a methyl group is even more preferred. R Ａ２１ ~R Ａ２４ The substituent on the phenyl group in the substituted phenyl group represented by the formula (I) can be the above-mentioned aliphatic hydrocarbon groups having 1 to 5 carbon atoms.

[0050] X Ａ２１ and X Ａ２２ Examples of the divalent organic group represented by include an alkylene group, an alkenylene group, an alkynylene group, an arylene group, -O-, or a divalent linking group formed by combining these. Examples of the alkylene group include alkylene groups having 1 to 10 carbon atoms, such as a methylene group, an ethylene group, or a propylene group. Examples of the alkenylene group include alkenylene groups having 2 to 10 carbon atoms. Examples of the alkynylene group include alkynylene groups having 2 to 10 carbon atoms. Examples of the arylene group include arylene groups having 6 to 20 carbon atoms, such as a phenylene group or a naphthylene group. Among these, X Ａ２１ and X Ａ２２ As the alkylene group, an alkylene group or an arylene group is preferable, and an alkylene group is more preferable.

[0051] n Ａ２１ is an integer of 2 to 100, preferably an integer of 2 to 50, more preferably an integer of 3 to 40, and even more preferably an integer of 5 to 30. Ａ２１ is an integer of 2 or more, a plurality of R Ａ２１ R Ａ２２ They may be the same or different from each other.

[0052] The siloxane compound (A2) is preferably a polydimethylsiloxane having primary amino groups at both ends, more preferably a polydimethylsiloxane having primary amino groups only at both ends. The primary amino group equivalent of the siloxane compound (A2) is not particularly limited, but is preferably 300 to 2,000 g / mol, more preferably 400 to 1,500 g / mol, and even more preferably 500 to 1,000 g / mol.

[0053] The weight average molecular weight (Mw) of the siloxane compound (A2) is not particularly limited, but from the viewpoints of handleability and moldability, it is preferably 400 to 10,000, more preferably 1,000 to 5,000, even more preferably 1,500 to 4,000, and particularly preferably 2,000 to 3,000.

[0054] (Method for Producing (A) Siloxane-Modified Maleimide Resin) The (A) siloxane-modified maleimide resin can be produced, for example, by reacting a maleimide resin (A1) with a siloxane compound (A2) in an organic solvent. By reacting the maleimide resin (A1) with the siloxane compound (A2), a siloxane-modified maleimide resin (A) is obtained through a Michael addition reaction between the N-substituted maleimide group of the maleimide resin (A1) and the primary amino group of the siloxane compound (A2). The reaction temperature for the Michael addition reaction is, for example, 50 to 160°C from the viewpoints of workability such as reaction rate, and suppression of gelation of the product during the reaction. The reaction time for the Michael addition reaction is, for example, 0.5 to 10 hours from the viewpoints of productivity and allowing the reaction to proceed sufficiently.

[0055] (Content of (A) Siloxane-Modified Maleimide Resin) In the resin composition of this embodiment, the content of the (A) siloxane-modified maleimide resin is not particularly limited, but is preferably 20 to 90 mass%, more preferably 30 to 80 mass%, and even more preferably 40 to 70 mass%, relative to the total amount (100 mass%) of resin components in the resin composition of this embodiment. When the content of the (A) siloxane-modified maleimide resin is equal to or greater than the above-mentioned lower limit, a cured product having better moldability, heat resistance, and conductor adhesion tends to be easily obtained. Furthermore, when the content of the (A) siloxane-modified maleimide resin is equal to or less than the above-mentioned upper limit, a cured product having better dielectric properties tends to be easily obtained.

[0056] Here, in this specification, the term "resin component" refers to a resin and a compound that forms a resin through a curing reaction. For example, component (A) and component (B) correspond to the resin component. Furthermore, when the resin composition contains, as optional components, resins or compounds that form a resin through a curing reaction in addition to the above components, these optional components are also included in the resin component. Examples of optional resin components include component (E) and component (F), which will be described later. On the other hand, component (C), component (D), and component (G) are not included in the resin component.

[0057] The content of the resin component in the resin composition of this embodiment is not particularly limited, but is preferably 20 to 90% by mass, more preferably 30 to 70% by mass, and even more preferably 40 to 60% by mass, relative to the total solid content (100% by mass) of the resin composition. When the content of the resin component is equal to or greater than the above-mentioned lower limit, the moldability of the resin composition tends to be improved. Furthermore, when the content of the resin component is equal to or less than the above-mentioned upper limit, a cured product with excellent low thermal expansion tends to be obtained.

[0058] <(B) Polyphenylene ether-based resin> The (B) polyphenylene ether-based resin is not particularly limited as long as it is a resin having a polyphenylene ether chain and a functional group containing an ethylenically unsaturated bond. By including the (B) polyphenylene ether-based resin, the resin composition of the present embodiment tends to easily produce a cured product with more excellent dielectric properties. The (B) polyphenylene ether-based resin may be used alone or in combination of two or more.

[0059] The polyphenylene ether resin (B) has a phenylene ether bond and preferably has a structural unit represented by the following general formula (B-1).

[0060] (In the formula, R Ｂ１ is a hydrocarbon group having 1 to 5 carbon atoms or a halogen atom. Ｂ１ is an integer from 0 to 4.

[0061] R in the above general formula (B-1) Ｂ１ Examples of the hydrocarbon group having 1 to 5 carbon atoms represented by include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, a t-butyl group, an n-pentyl group, etc. The hydrocarbon group having 1 to 5 carbon atoms may be either linear or branched. As the hydrocarbon group having 1 to 5 carbon atoms, a hydrocarbon group having 1 to 3 carbon atoms is preferred, and a methyl group is more preferred. Examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, an iodine atom, etc.

[0062] n in the above general formula (B-1) Ｂ１ is an integer of 0 to 4, preferably 1 or 2, and more preferably 2. Ｂ１ When R is 1 or 2, Ｂ１ The substitution position of is preferably at the ortho position on the benzene ring with respect to the substitution position of the oxygen atom. Ｂ１ is an integer of 2 or more, a plurality of R Ｂ１The phenylene ether units represented by the general formula (B-1) above are preferably phenylene ether units represented by the following general formula (B-1′):

[0063]

[0064] The polyphenylene ether resin (B) has a functional group containing an ethylenically unsaturated bond (hereinafter, may be referred to as an "ethylenically unsaturated bond-containing group"). In this specification, the term "ethylenically unsaturated bond" means a carbon-carbon double bond capable of undergoing an addition reaction, and does not include a double bond in an aromatic ring.

[0065] Examples of the ethylenically unsaturated bond-containing group include a vinyl group, an allyl group, a 1-methylallyl group, an isopropenyl group, a 2-butenyl group, a 3-butenyl group, a styryl group, a maleimide group, and a group represented by the following general formula (B-2):

[0066] (In the formula, R Ｂ２ is a hydrogen atom or an alkyl group having 1 to 20 carbon atoms.

[0067] R in the above general formula (B-2) Ｂ２ The number of carbon atoms in the alkyl group having 1 to 20 carbon atoms represented by R is preferably 1 to 10, more preferably 1 to 3, and even more preferably 1. That is, R Ｂ２ More preferably, R is a methyl group. Ｂ２ The group represented by the above general formula (B-2) in which R is a hydrogen atom corresponds to an acryloyl group, Ｂ２ The group represented by the above general formula (B-2) in which is a methyl group corresponds to a methacryloyl group.

[0068] Among the above, from the viewpoint of dielectric properties, the ethylenically unsaturated bond-containing group of the polyphenylene ether resin (B) is preferably a group represented by the above general formula (B-2), more preferably a (meth)acryloyl group, and even more preferably a methacryloyl group.

[0069] The number of ethylenically unsaturated bond-containing groups contained in one molecule of the (B) polyphenylene ether resin is not particularly limited, but is preferably 1 to 5, more preferably 2 to 3, and even more preferably 2. When the number of ethylenically unsaturated bond-containing groups is equal to or greater than the above-mentioned lower limit, a cured product having more excellent heat resistance tends to be obtained. On the other hand, when the number of ethylenically unsaturated bond-containing groups is equal to or less than the above-mentioned upper limit, the flowability and moldability of the resin composition tend to be more improved.

[0070] The (B) polyphenylene ether resin preferably has an ethylenically unsaturated bond-containing group at its terminal, more preferably at both terminals. The (B) polyphenylene ether resin may have an ethylenically unsaturated bond-containing group at a terminal other than the terminal, but preferably has an ethylenically unsaturated bond-containing group only at its terminal, more preferably has an ethylenically unsaturated bond-containing group only at both terminals.

[0071] The weight-average molecular weight (Mw) of the (B) polyphenylene ether-based resin is not particularly limited, but is preferably 500 to 7,000, more preferably 800 to 5,000, and even more preferably 1,000 to 3,000. When the weight-average molecular weight (Mw) of the (B) polyphenylene ether-based resin is equal to or greater than the above-mentioned lower limit, a cured product having excellent dielectric properties and heat resistance tends to be easily obtained. Furthermore, when the weight-average molecular weight (Mw) of the (B) polyphenylene ether-based resin is equal to or less than the above-mentioned upper limit, the moldability of the resin composition tends to be more easily improved.

[0072] The method for synthesizing (B) the polyphenylene ether resin is not particularly limited, and known methods for synthesizing and modifying polyphenylene ether can be applied.

[0073] (Content of (B) Polyphenylene Ether Resin) The content of the (B) polyphenylene ether resin in the resin composition of this embodiment is not particularly limited, but is preferably 1 to 30 mass %, more preferably 5 to 25 mass %, and even more preferably 10 to 20 mass %, relative to the total amount (100 mass %) of resin components in the resin composition of this embodiment. When the content of the (B) polyphenylene ether resin is equal to or greater than the above lower limit, a cured product having excellent dielectric properties tends to be easily obtained. Furthermore, when the content of the (B) polyphenylene ether resin is equal to or less than the above upper limit, the moldability of the resin composition tends to be more easily improved.

[0074] <(C) Phosphorus-Based Flame Retardant Having a Phosphorus Atom Content of 12% by Mass or More> The (C) phosphorus-based flame retardant is not particularly limited as long as the phosphorus atom content is 12% by mass or more. However, metal phosphates are preferred, and metal salts of disubstituted phosphinic acids are more preferred. Examples of metal salts of disubstituted phosphinic acids include metal salts of dialkylphosphinic acids, metal salts of diallylphosphinic acids, metal salts of divinylphosphinic acids, and metal salts of diarylphosphinic acids. Examples of metal salts of disubstituted phosphinic acids include lithium salts, sodium salts, potassium salts, calcium salts, magnesium salts, aluminum salts, titanium salts, and zinc salts. Among these, aluminum salts are preferred, and aluminum trisdiethylphosphinate is more preferred. The (C) phosphorus-based flame retardant may be used alone or in combination of two or more.

[0075] The content of phosphorus atoms in the (C) phosphorus-based flame retardant is 12% by mass or more. By having the content of phosphorus atoms in the (C) phosphorus-based flame retardant be 12% by mass or more, excellent circuit embedding properties can be obtained while effectively suppressing resin flow of the resin composition. From the same viewpoint, the content of phosphorus atoms in the (C) component is preferably 13 to 50% by mass, more preferably 15 to 40% by mass, and even more preferably 20 to 30% by mass.

[0076] (Content of (C) Phosphorus-Based Flame Retardant) The content of the (C) phosphorus-based flame retardant in the resin composition of the present embodiment is not particularly limited, but is preferably 1 to 30 parts by mass, more preferably 3 to 20 parts by mass, and even more preferably 4 to 10 parts by mass, relative to the total amount (100 parts by mass) of the resin components in the resin composition of the present embodiment. When the content of the (C) phosphorus-based flame retardant is equal to or greater than the above-mentioned lower limit, the flame retardancy, resin flow, and circuit embeddability tend to be more improved. The content of the (C) phosphorus-based flame retardant in the resin composition of the present embodiment is not particularly limited, but is preferably 0.5 to 15% by mass, more preferably 1 to 10% by mass, and even more preferably 2 to 5% by mass, relative to the total amount (100% by mass) of solids in the resin composition of the present embodiment. When the content of the (C) phosphorus-based flame retardant is equal to or greater than the above-mentioned lower limit, the flame retardancy, resin flow, and circuit embeddability tend to be more improved.

[0077] <(D) Inorganic Filler> The resin composition of this embodiment preferably further contains (D) an inorganic filler. By containing (D) an inorganic filler, the resin composition of this embodiment tends to easily produce a cured product that is excellent in low thermal expansion, heat resistance, and flame retardancy. The (D) inorganic filler may be used alone or in combination of two or more.

[0078] (D) inorganic filler can be enumerated as follows: silica, alumina, titanium oxide, mica, beryllia, barium titanate, potassium titanate, strontium titanate, calcium titanate, aluminum carbonate, magnesium hydroxide, aluminum hydroxide, aluminum silicate, calcium carbonate, calcium silicate, magnesium silicate, silicon nitride, boron nitride, clay, talc, aluminum borate, silicon carbide etc.Among these, from the viewpoint of low thermal expansion, heat resistance and flame retardancy, silica, alumina, mica, talc are preferred, silica, alumina are more preferred, and silica is even more preferred.As silica, from the viewpoint of dispersibility and moldability, fused silica is preferred.

[0079] The average particle diameter of the (D) inorganic filler is not particularly limited, but from the viewpoint of the dispersibility and fine wiring properties of the (D) inorganic filler, it is preferably 0.01 to 20 μm, more preferably 0.1 to 10 μm, even more preferably 0.2 to 1 μm, and particularly preferably 0.3 to 0.8 μm. In this specification, the average particle diameter of the (D) inorganic filler refers to the particle diameter at the point corresponding to 50% volume when a cumulative frequency distribution curve of particle diameters is calculated assuming the total volume of the particles to be 100%. The average particle diameter of the (D) inorganic filler can be measured, for example, using a particle size distribution measuring device using a laser diffraction scattering method. The shape of the (D) inorganic filler can be, for example, spherical or crushed, with spherical being preferred.

[0080] (Content of (D) inorganic filler) When the resin composition of the present embodiment contains (D) inorganic filler, the content of the (D) inorganic filler is not particularly limited, but is preferably 20 to 90 mass%, more preferably 30 to 70 mass%, and even more preferably 40 to 60 mass%, relative to the total amount of solids in the resin composition (100 mass%). When the content of the (D) inorganic filler is equal to or greater than the above lower limit, a cured product having excellent low thermal expansion properties, heat resistance, and flame retardancy tends to be easily obtained. Furthermore, when the content of the (D) inorganic filler is equal to or less than the above upper limit, the moldability of the resin composition tends to be more easily improved.

[0081] <(E) Maleimide Resin> The resin composition of this embodiment preferably further contains (E) a maleimide resin. The (E) maleimide resin may be used alone or in combination of two or more. Examples of the (E) maleimide resin include the same maleimide resin (A1) as described in the section <(A) Siloxane-Modified Maleimide Resin>.

[0082] (Content of (E) Maleimide Resin) When the resin composition of the present embodiment contains an (E) maleimide resin, the content of the (E) maleimide resin in the resin composition of the present embodiment is not particularly limited, but is preferably 5 to 40 mass %, more preferably 10 to 30 mass %, and even more preferably 15 to 25 mass %, relative to the total amount (100 mass %) of resin components in the resin composition of the present embodiment. When the content of the (E) maleimide resin is equal to or greater than the above-mentioned lower limit, a cured product having more excellent moldability, heat resistance, and conductor adhesion tends to be easily obtained. On the other hand, when the content of the (E) maleimide resin is equal to or less than the above-mentioned upper limit, a cured product having more excellent dielectric properties tends to be easily obtained.

[0083] <(F) Styrene-based elastomer> The resin composition of this embodiment preferably further contains (F) a styrene-based elastomer. By containing (F) the styrene-based elastomer, the resin composition of this embodiment tends to have better dielectric properties. One type of (F) styrene-based elastomer may be used alone, or two or more types may be used in combination.

[0084] (F) The styrene elastomer has structural units derived from styrene compounds (hereinafter, sometimes referred to as "styrene units"). Examples of styrene compounds include styrene; and alkyl-substituted styrenes such as α-methylstyrene, o-methylstyrene, m-methylstyrene, and p-methylstyrene. The alkyl group in the alkyl-substituted styrene preferably has 1 to 5 carbon atoms, more preferably 1 to 3 carbon atoms, and even more preferably 1 or 2 carbon atoms.

[0085] The (F) styrene-based elastomer may contain structural units other than styrene-based units. Examples of structural units other than styrene-based units include butadiene-derived structural units, isoprene-derived structural units, maleic acid-derived structural units, and maleic anhydride-derived structural units. The butadiene-derived structural units and isoprene-derived structural units may be hydrogenated. When hydrogenated, the butadiene-derived structural units become structural units in which ethylene units and butylene units are mixed, and the isoprene-derived structural units become structural units in which ethylene units and propylene units are mixed.

[0086] Examples of (F) styrene-based elastomers include hydrogenated products of styrene-butadiene-styrene block copolymers, hydrogenated products of styrene-isoprene-styrene block copolymers, and styrene-maleic anhydride copolymers. Examples of hydrogenated products of styrene-butadiene-styrene block copolymers include SEBS, which is obtained by completely hydrogenating the carbon-carbon double bonds in the butadiene block, and SBBS, which is obtained by partially hydrogenating the carbon-carbon double bonds at 1,2-bond sites in the butadiene block. Hydrogenated products of styrene-isoprene-styrene block copolymers are obtained as SEPS by hydrogenating the polyisoprene portion. Among these, SEBS and SEPS are preferred, with SEBS being more preferred, from the viewpoints of dielectric properties, conductor adhesion, heat resistance, glass transition temperature, and low thermal expansion.

[0087] In the (F) styrene-based elastomer, the content of styrene-based units (hereinafter, may be referred to as "styrene content") is preferably 5 to 60 mass%, more preferably 7 to 40 mass%, and even more preferably 10 to 20 mass%, from the viewpoints of dielectric properties, conductor adhesion, heat resistance, and low thermal expansion.

[0088] The styrene elastomer (F) may be acid-modified with maleic anhydride or the like. The acid value of the acid-modified styrene elastomer (F) is preferably 2 to 20 mg CH ３ ONa / g, more preferably 5 to 15 mg CH ３ ONa / g, more preferably 7 to 13 mg CH ３ONa / g.

[0089] The number average molecular weight (Mn) of the (F) styrene-based elastomer is preferably 10,000 to 500,000, more preferably 50,000 to 350,000, and even more preferably 100,000 to 200,000.

[0090] When the resin composition of this embodiment contains a (F) styrene-based elastomer, the content of the (F) styrene-based elastomer in the resin composition of this embodiment is preferably 1 to 30 mass%, more preferably 3 to 20 mass%, and even more preferably 5 to 10 mass%, relative to the total amount (100 mass%) of resin components in the resin composition. When the content of the (F) styrene-based elastomer is equal to or greater than the above-mentioned lower limit, the dielectric properties tend to be better. On the other hand, when the content of the (F) styrene-based elastomer is equal to or less than the above-mentioned upper limit, the heat resistance and flame retardancy tend to be better.

[0091] <(G) Curing Accelerator> The resin composition of this embodiment preferably further contains a (G) curing accelerator. By containing the (G) curing accelerator, the resin composition of this embodiment tends to have improved curability and better dielectric properties, heat resistance, and conductor adhesion. One type of (G) curing accelerator may be used alone, or two or more types may be used in combination.

[0092] Examples of the (G) curing accelerator include acidic catalysts such as p-toluenesulfonic acid; amine compounds such as triethylamine, tributylamine, pyridine, and dicyandiamide; imidazole compounds such as methylimidazole, phenylimidazole, 2-undecylimidazole, 1-cyanoethyl-2-phenylimidazole, and 1-cyanoethyl-2-phenylimidazolium trimellitate; isocyanate-masked imidazole compounds such as the addition reaction product of hexamethylene diisocyanate resin and 2-ethyl-4-methylimidazole; quaternary ammonium compounds; and phosphorus compounds such as triphenylphosphine and quaternary phosphonium compounds which are addition reaction products of p-benzoquinone and tri-n-butylphosphine. peroxides such as dicumyl peroxide, 2,5-dimethyl-2,5-bis(t-butylperoxy)hexyne-3, 2,5-dimethyl-2,5-bis(t-butylperoxy)hexane, t-butylperoxyisopropyl monocarbonate, and α,α'-bis(t-butylperoxy)diisopropylbenzene; inorganic peroxides such as potassium persulfate, sodium persulfate, and ammonium persulfate; azo compounds such as 2,2'-azobisisobutyronitrile, 2,2'-azobis(2,4-dimethylvaleronitrile), and 2,2'-azobis(4-methoxy-2'-dimethylvaleronitrile); carboxylates of manganese, cobalt, zinc, and the like; and acidic catalysts such as p-toluenesulfonic acid. Among these, from the viewpoints of curing acceleration effect and storage stability, organic peroxides, imidazole compounds, and phosphorus-based compounds are preferred, and it is more preferable to use these in combination.

[0093] When the resin composition of this embodiment contains a (G) curing accelerator, the content of the (G) curing accelerator is preferably 0.01 to 10 parts by mass, more preferably 0.1 to 7 parts by mass, and even more preferably 0.5 to 5 parts by mass, relative to the total amount (100 parts by mass) of the resin components in the resin composition of this embodiment. When the content of the (G) curing accelerator is equal to or greater than the above-mentioned lower limit, a sufficient curing acceleration effect tends to be easily obtained. Furthermore, when the content of the (G) curing accelerator is equal to or less than the above-mentioned upper limit, storage stability tends to be more easily improved.

[0094] <Other Components> The resin composition of the present embodiment may further contain, as necessary, one or more additives selected from the group consisting of resin materials other than the above components, antioxidants, heat stabilizers, antistatic agents, UV absorbers, pigments, colorants, lubricants, and other additives. Each of these may be used alone or in combination of two or more. The amount of these additives used is not particularly limited, and they may be used as needed within a range that does not impair the effects of the present embodiment.

[0095] (Organic Solvent) The resin composition of this embodiment may contain an organic solvent from the viewpoint of ease of handling and ease of production of the prepreg described below. One type of organic solvent may be used alone, or two or more types may be used in combination. Examples of organic solvents include alcohol-based solvents such as ethanol, propanol, butanol, methyl cellosolve, butyl cellosolve, and propylene glycol monomethyl ether; ketone-based solvents such as acetone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone; ether-based solvents such as tetrahydrofuran; aromatic hydrocarbon-based solvents such as toluene, xylene, and mesitylene; nitrogen-containing solvents such as dimethylformamide, dimethylacetamide, and N-methylpyrrolidone; sulfur-containing solvents such as dimethyl sulfoxide; and ester-based solvents such as γ-butyrolactone. Among these, from the viewpoint of solubility, alcohol-based solvents, ketone-based solvents, nitrogen-containing solvents, and aromatic hydrocarbon-based solvents are preferred, ketone-based solvents are more preferred, and methyl ethyl ketone is even more preferred.

[0096] <Method for producing resin composition> The resin composition of this embodiment can be produced by mixing the components by a known method. At this time, the components may be dissolved or dispersed while stirring. The conditions such as the mixing order, temperature, and time are not particularly limited and may be set as desired depending on the types of raw materials, etc.

[0097] [Prepreg] The prepreg of the present embodiment is a prepreg containing the resin composition of the present embodiment or a semi-cured product of the resin composition. The prepreg of the present embodiment contains, for example, the resin composition of the present embodiment or a semi-cured product of the resin composition and a sheet-like fiber base material.

[0098] The sheet-like fiber substrate contained in the prepreg of this embodiment can be, for example, a known sheet-like fiber substrate used in various laminates for electrical insulating materials. Examples of the material for the sheet-like fiber substrate include inorganic fibers such as E-glass, D-glass, S-glass, and Q-glass; organic fibers such as polyimide, polyester, and tetrafluoroethylene; and mixtures thereof. These sheet-like fiber substrates have shapes such as woven fabric, nonwoven fabric, roving, chopped strand mat, and surfacing mat.

[0099] The prepreg of this embodiment can be produced, for example, by impregnating or applying the resin composition of this embodiment to a sheet-like fiber substrate, and then heating and drying to B-stage it. The temperature and time of heating and drying are not particularly limited, but from the viewpoints of productivity and appropriately B-staging the resin composition of this embodiment, it can be, for example, 50 to 200°C and 1 to 30 minutes.

[0100] The content of the resin composition in the prepreg of the present embodiment is not particularly limited, but from the viewpoint of easily obtaining better moldability when made into a laminate, it is preferably 20 to 90 mass%, more preferably 40 to 85 mass%, and even more preferably 50 to 80 mass%.

[0101] [Resin Film] The resin film of this embodiment is a resin film containing the resin composition of this embodiment or a semi-cured product of the resin composition. The resin film of this embodiment can be produced, for example, by applying the resin composition of this embodiment containing an organic solvent to a support and then heating and drying it. Examples of the support include plastic film, metal foil, and release paper. The temperature and time of the heating and drying are not particularly limited, but can be set to 50 to 200°C and 1 to 30 minutes from the viewpoints of productivity and appropriately B-staging the resin composition of this embodiment.

[0102] The resin film of this embodiment is preferably used to form an insulating layer when producing a printed wiring board.

[0103] [Laminate] The laminate of the present embodiment is a laminate having a cured product of the resin composition of the present embodiment and a metal foil. Note that a laminate having a metal foil is sometimes called a metal-clad laminate.

[0104] The metal of the metal foil is not particularly limited, and examples thereof include copper, gold, silver, nickel, platinum, molybdenum, ruthenium, aluminum, tungsten, iron, titanium, chromium, and alloys containing one or more of these metal elements.

[0105] The laminate of this embodiment can be produced, for example, by placing metal foil on one or both sides of the prepreg of this embodiment and then hot-press molding. Typically, the B-staged prepreg is cured by this hot-press molding to obtain the laminate of this embodiment. When hot-press molding, only one prepreg may be used, or two or more prepregs may be laminated together. For hot-press molding, for example, a multi-stage press, a multi-stage vacuum press, a continuous molding machine, an autoclave molding machine, or the like can be used. The conditions for hot-press molding are not particularly limited, but can be, for example, a temperature of 100 to 300°C, a time of 10 to 300 minutes, and a pressure of 1.5 to 5 MPa.

[0106] [Printed Wiring Board] The printed wiring board of this embodiment is a printed wiring board having a cured product of the resin composition of this embodiment. The printed wiring board of this embodiment can be produced, for example, by forming a conductor circuit on one or more materials selected from the group consisting of a cured product of the prepreg of this embodiment, a cured product of the resin film of this embodiment, and a laminate by a known method. Furthermore, a multilayer printed wiring board can also be produced by further performing a multilayer adhesive process as necessary. The conductor circuit can be formed, for example, by appropriately performing drilling, metal plating, etching of metal foil, etc.

[0107] [Semiconductor Package] The semiconductor package of this embodiment is a semiconductor package including the printed wiring board of this embodiment and a semiconductor element. The semiconductor package of this embodiment can be manufactured, for example, by mounting a semiconductor chip, a memory, etc. on the printed wiring board of this embodiment by a known method.

[0108] The present embodiment will be specifically described below with reference to examples, although the present embodiment is not limited to the following examples.

[0109] In each example, the weight average molecular weight (Mw) was measured by the following method. It was calculated by gel permeation chromatography (GPC) from a calibration curve using standard polystyrene. The calibration curve was approximated by a cubic equation using standard polystyrene: TSKstandard POLYSTYRENE (Types: A-2500, A-5000, F-1, F-2, F-4, F-10, F-20, F-40) [manufactured by Tosoh Corporation, trade name]. The GPC measurement conditions are shown below. Apparatus: Pump: L-6200 type [manufactured by Hitachi High-Technologies Corporation] Detector: L-3300 type RI [manufactured by Hitachi High-Technologies Corporation] Column oven: L-655A-52 [manufactured by Hitachi High-Technologies Corporation] Column: Guard column; TSK Guard column HHR-L + column; TSKgel G4000HHR + TSKgel G2000HHR (all manufactured by Tosoh Corporation, trade names) Column size: 6.0 x 40 mm (guard column), 7.8 x 300 mm (column) Eluent: tetrahydrofuran Sample concentration: 30 mg / 5 mL Injection volume: 20 μL Flow rate: 1.00 mL / min Measurement temperature: 40°C

[0110] Production Example 1: Production of Siloxane-Modified Maleimide Resin. 100 parts by weight of 2,2-bis[4-(4-maleimidophenoxy)phenyl]propane, 5.6 parts by weight of a silicone compound (primary amino group equivalent: 750 g / mol) having primary amino groups at both ends, 7.9 parts by weight of 3,3'-diethyl-4,4'-diaminodiphenylmethane, and 171 parts by weight of propylene glycol monomethyl ether were added to a 5-liter reaction vessel equipped with a thermometer, a stirrer, and a reflux condenser and moisture content monitor, and the mixture was refluxed for 2 hours to react. The mixture was concentrated at reflux temperature for 3 hours to produce a siloxane-modified maleimide resin solution with a solids concentration of 65% by weight. The weight-average molecular weight (Mw) of the resulting siloxane-modified maleimide resin was approximately 2,700.

[0111] Examples 1 to 5 and Comparative Examples 1 to 5 (Production of Resin Compositions) Resin compositions with a solid content concentration of 55% by mass were prepared by stirring and mixing at room temperature the components shown in Table 1 together with methyl ethyl ketone according to the formulation shown in Table 1. In Table 1, the unit of the amount of each component is parts by mass, and in the case of a solution, it means parts by mass converted into solid content.

[0112] (Prepreg Production) Prepregs were produced by applying the resin compositions obtained above to a glass cloth having a thickness of 0.02 mm and then drying for 5 minutes at the drying temperature shown in Table 1. The content of the resin compositions in the prepregs obtained in each example is shown in Table 1.

[0113] [Evaluation Method] Each evaluation was carried out according to the following methods. The results are shown in Table 1.

[0114] (Method for Evaluating Resin Flow) Resin flow was evaluated in accordance with the IPC TM-650 method using the following method. The prepreg obtained in each example was cut into 102 mm square pieces, and four pieces were stacked to form a test piece, and the weight of the test piece was measured. The measured weight was designated W1. Next, the test piece was placed in a press set to a temperature of 171±3°C, a pressure of 1.38±0.07 MPa, and a time of 5±0.5 minutes, and pressed. Thereafter, a disk with a diameter of 81.1 mm was punched out from the center of the test piece, and the weight was measured. The measured weight was designated W2. Using the W1 and W2 obtained above, the resin flow was calculated using the following formula: Resin flow (%) = {[W1-2×W2] / W1}×100

[0115] (Method for evaluating circuit embeddability) The prepreg and copper foil obtained above were placed in this order on a circuit board having a circuit for embedding tests (a total of six 70 mm x 115 mm rectangular areas, 12 μm thick, with a pattern having dot-shaped openings and a residual copper rate of 50 volume %, arranged in two rows and three columns, separated by 2 mm-wide slits), and press-molded under the following conditions. <Press-molding conditions> Heating temperature (maximum temperature reached): 230°C Press pressure: 3 MPa Press time: 3 hours After press-molding, the copper foil on both sides was removed by etching, and the area around the circuit was observed visually and using a fluorescent microscope. The circuit embeddability of the prepreg was evaluated according to the following criteria: A: No areas not embedded in the circuit pattern or slits. B: No areas not embedded in the circuit pattern, but some areas not embedded in the slits. C: Some areas not embedded in both the circuit pattern and the slits.

[0116]

[0117] The details of each material in Table 1 are as follows: [Component (A)] Siloxane-modified maleimide resin: the siloxane-modified maleimide resin obtained in Production Example 1

[0118] [Component (B)] Polyphenylene ether resin having a methacryloyl group: polyphenylene ether having a methacryloyl group at both ends (weight average molecular weight (Mw) 1,700)

[0119] [Component (C)] Phosphorus-based flame retardant 1: aluminum dialkylphosphinate, metal salt of disubstituted phosphinic acid, phosphorus atom content: 23.5% by mass

[0120] [Comparative Components] Phosphorus-based flame retardant 2: 4,4'-biphenylene-bis(di-2,6-dimethylphenylphosphate), phosphorus atom content: 8.1% by mass

[0121] [Component (D)] Silica: spherical fused silica with an average particle size of 0.5 μm

[0122] [Component (E)] Maleimide resin: polyphenylmethane maleimide (manufactured by Daiwa Chemical Industry Co., Ltd., product name "BMI-2300")

[0123] [Component (F)] SEBS: carboxylic acid-modified hydrogenated styrene-butadiene copolymer resin (manufactured by Asahi Kasei Chemicals Corporation, product name "Tuftec (registered trademark) M1913", styrene content 30 mass%, acid value 10 mg CH ３ ONa / g)

[0124] [Component (G)] α,α'-di(t-butylperoxy)diisopropylbenzene 2-undecylimidazole p-benzoquinone and tri-n-butylphosphine addition product

[0125] From the results shown in Table 1, it can be seen that the prepregs formed from the resin compositions of Examples 1 to 5 of this embodiment have improved circuit embedding properties while effectively suppressing resin flow.

Claims

1. A resin composition comprising: (A) a siloxane-modified maleimide resin including a structure derived from a maleimide resin (A1) having one or more N-substituted maleimide groups and a structure derived from a siloxane compound (A2) having two or more primary amino groups; (B) a polyphenylene ether resin having a functional group including an ethylenically unsaturated bond; and (C) a phosphorus-based flame retardant having a phosphorus atom content of 12 mass% or more.

2. The resin composition according to claim 1, wherein the component (C) is a metal phosphate.

3. The resin composition according to claim 1 or 2, wherein the content of the (C) component is 1 to 30 parts by mass relative to the total amount (100 parts by mass) of the resin components in the resin composition.

4. The resin composition according to claim 1 or 2, wherein the component (B) has a functional group containing an ethylenically unsaturated bond at its terminal.

5. The resin composition according to claim 1 or 2, wherein the functional group containing an ethylenically unsaturated bond contained in the component (B) is a (meth)acryloyl group.

6. The resin composition according to claim 1 or 2, further comprising (D) an inorganic filler.

7. The resin composition according to claim 6, wherein the content of the component (D) is 20 to 90 mass % relative to the total amount (100 mass %) of solids in the resin composition.

8. A prepreg containing the resin composition according to claim 1 or 2 or a semi-cured product of said resin composition.

9. A laminate comprising a cured product of the resin composition according to claim 1 or 2 and a metal foil.

10. A resin film comprising the resin composition according to claim 1 or 2 or a semi-cured product of said resin composition.

11. A printed wiring board having a cured product of the resin composition according to claim 1 or 2.

12. A semiconductor package comprising the printed wiring board according to claim 11 and a semiconductor element.

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