Electronic packaging device and power module

Abstract

The present disclosure relates to the technical field of semiconductor packaging, and relates to an electronic packaging device and a power module. The electronic packaging device of the present disclosure comprises a substrate used for mounting chips, a plastic package wrapped around the substrate, and a plurality of first terminals used for connecting the substrate and an external electric appliance. At least parts of the first terminals are embedded into the plastic package, the first terminals are each of a step-shaped structure having a step, and step end surfaces of the step-shaped structures are flush with a formed top surface of the plastic package, so as to form contact sealing.

Description

Electronic packaging device and power module

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] The present disclosure claims priority to Chinese patent application CN 202311755263.9, filed on December 19, 2023, entitled “An electronic packaging device and power module,” the entire contents of which are incorporated by reference into the present disclosure. Technical Field

[0003] The present disclosure relates to the field of semiconductor packaging technology, and in particular to an electronic packaging device and a power module. Background Art

[0004] With the rapid development of new energy power generation and electric vehicles, IGBT power modules are increasingly being used in automobiles. Power modules are core components for motor control, and their performance, efficiency, and power consumption are directly related to the performance and energy consumption of new energy vehicles.

[0005] The packaging forms of power semiconductor modules are divided into potting packaging and plastic packaging. Among them, plastic packaging uses epoxy resin to encapsulate power modules. It has the advantages of high production efficiency, high reliability and low water absorption, and is therefore receiving increasing attention.

[0006] Currently, the manufacturing method of PIN pins in plastic packaging is complicated and requires processes such as cutting and forming to complete. If the PIN pins are individually welded to the liner and then plastic-sealed, it is necessary to configure a separate positioning structure for each PIN pin on the plastic packaging mold, which is difficult to achieve.

[0007] Public content

[0008] The present disclosure provides an electronic packaging device and a power module, which are used to solve the problem in the prior art that a positioning structure needs to be separately configured for each PIN pin on the plastic packaging mold during the plastic packaging process of the electronic packaging device.

[0009] On the one hand, the present disclosure provides an electronic packaging device, which includes a backing plate for mounting a chip, a plastic package wrapped around the backing plate, and a plurality of first terminals for connecting the backing plate and an external electrical appliance; the first terminals are at least partially embedded in the plastic package, and the first terminals are a stepped structure with steps, and the step end surface of the stepped structure is flush with the molded top surface of the plastic package to form a contact seal.

[0010] In an exemplary embodiment, the first terminal includes a first connecting segment and a second connecting segment connected to each other; wherein, the first connecting segment is embedded in the plastic package body, and one end of the first connecting segment is connected to the liner, and the other end is flush with the top surface of the plastic package body; the radial dimension of the first connecting segment is greater than the radial dimension of the second connecting segment; the first connecting segment and the second connecting segment are coaxially connected to form the stepped structure, and the step of the stepped structure is located on the end surface of the first connecting segment facing the second connecting segment.

[0011] In an exemplary embodiment, the first connecting section of the first terminal is a connector embedded in the plastic package and connected to the backing plate; the second connecting section is a pin connected between the connector and an external electrical appliance; the connector is a sleeve structure, and the outer diameter of one end of the pin used for connecting to the connector is larger than the inner hole diameter of the connector, and the pin is embedded in the inner hole of the connector with an interference fit.

[0012] In an exemplary embodiment, a connecting portion for connecting to the liner is formed at one end of the first connecting section, and the connecting portion is a stepped structure formed along the radial extension of the first connecting section; after plastic packaging, the connecting portion can be restrained and positioned between the liner and the plastic packaging body.

[0013] In an exemplary embodiment, the first terminal is an integrally formed stepped PIN pin.

[0014] In an exemplary embodiment, the first terminals are arranged perpendicular to the backing plate.

[0015] In an exemplary embodiment, the chip is provided in plurality, and the plurality of chips are interconnected via copper busbars; and / or the chip is soldered on the substrate, and the two are interconnected via copper busbars.

[0016] In an exemplary embodiment, the electronic packaging device further includes a substrate for supporting the mounting of the backing plate; the substrate includes a plate body for supporting the mounting of the backing plate, and pin fins arranged on the plate body; the heat generated by the chip can pass through the backing plate, the plate body and the pin fins in sequence, and exchange heat with the cooling liquid flowing through the pin fins.

[0017] In an exemplary embodiment, one end of the pin fin is connected to the plate body, and the other end extends in a direction away from the plate body.

[0018] In an exemplary embodiment, the pin fins are provided in plurality, and the plurality of pin fins are arranged at intervals on the plate body in a uniform array.

[0019] In an exemplary embodiment, the pin fins are provided in plurality, and the plurality of pin fins are arranged on the plate body at intervals in a non-uniform array.

[0020] In an exemplary embodiment, the electronic packaging device further includes: a second terminal, which is a sheet-like structure, one end of which is welded to the backing plate, and the other end extends to the outside of the backing plate and the plastic package body for connection to other electrical components outside the electronic packaging device.

[0021] In an exemplary embodiment, the protruding portion of the second terminal is disposed parallel to the backing plate.

[0022] In an exemplary embodiment, a connection hole is provided on the protruding portion of the second terminal, and the second terminal is threadedly connected to an external component through the connection hole.

[0023] In another aspect, the present disclosure provides a power module, which includes the aforementioned electronic packaging device. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Hereinafter, the present disclosure will be described in more detail based on embodiments with reference to the accompanying drawings.

[0025] FIG1 is a three-phase full-bridge circuit diagram according to an embodiment of the present disclosure;

[0026] FIG2 is a schematic structural diagram of an electronic packaging device according to an embodiment of the present disclosure;

[0027] FIG3 is a schematic structural diagram of the electronic packaging device in FIG2 before being plastic-sealed;

[0028] FIG4 is a top view of the electronic packaging device in FIG3 ;

[0029] FIG5 is a side view of the electronic package device in FIG3;

[0030] FIG6 is an axonometric view of a substrate in an embodiment of the present disclosure;

[0031] FIG7 is a schematic diagram showing the structure of the internal device, which shows the first terminal of the first embodiment;

[0032] FIG8 is a schematic diagram showing the structure of the internal components, which shows the first terminal of the second embodiment;

[0033] FIG9 is a schematic structural diagram of a first terminal according to a second embodiment;

[0034] FIG10 is a schematic diagram showing the structure of the internal device, which shows the first terminal of the third embodiment;

[0035] FIG11 is a schematic structural diagram of a first terminal according to a third embodiment;

[0036] FIG12 is a schematic structural diagram of an electronic packaging device equipped with a second terminal in another embodiment;

[0037] FIG13 is a schematic structural diagram of the electronic packaging device in FIG12 before being plastic-sealed.

[0038] Reference numerals:

[0039] 1. Chip; 2. Liner; 3. Plastic package;

[0040] 4. First terminal; 41. First connecting section; 42. Second connecting section;

[0041] 5. Base plate; 51. Plate body; 52. Needle fins;

[0042] 6. Second terminal; 61. Connection hole; 7. Copper busbar. DETAILED DESCRIPTION

[0043] The present disclosure will be further described below with reference to the accompanying drawings.

[0044] The main components involved in this embodiment are chip 1, backing plate 2, substrate 5, first terminal 4, second terminal 6 and plastic package 3. The main components are introduced as follows:

[0045] (1) Liner 2: It can be used to install the connecting chip 1, the first terminal 4 and the second terminal 6. The liner 2 is a direct bond copper substrate (DBC or DCB) and is in the shape of a flat plate. The liner 2 can be made using processes such as toughened ceramic (ZTA) or active metal brazing copper cladding technology (AMB); the ceramic insulating layer can be made of ceramic materials such as aluminum oxide, silicon nitride, aluminum nitride, or other insulating materials; in order to enhance the thermal conductivity or structural strength of the insulating layer, the ceramic can be doped with oxides such as zirconium oxide (ZrO2). The upper and lower surfaces of the liner 2 are provided with a conductive copper cladding layer for achieving electrical connection between electronic components. The copper cladding layer of the liner 2 can be bare copper, or it can be plated with gold, nickel, silver or other plating layers on the copper surface. The shape of the copper cladding layer can be adjusted according to actual needs, and this embodiment does not limit this.

[0046] (2) Chip 1: Chip 1 is a power component mounted on substrate 2. Chip 1 and substrate 2 are mounted and connected and electrically interconnected. For example, tin-based soldering can be used, or processes such as silver sintering or copper sintering can be used to achieve mounting and connection between the two. Electrical interconnection between the two can be achieved through metal bonding wires or Cu Clips, and electrical connection can be achieved through copper wire, aluminum wire, copper ribbon, or aluminum ribbon.

[0047] Multiple chips 1 are provided, and the multiple chips 1 are arranged on the backing plate 2. The chips are interconnected via bonding wires or Cu Clips, and can be interconnected via copper wire, aluminum wire, copper ribbon, or aluminum ribbon. The multiple chips 1 can be arranged on the backing plate 2 in such a way that the grounded lower chip is close to the DC terminal, and the upper chip connected to the positive power supply is close to the AC terminal. The separation line between the upper and lower chips is perpendicular to the line connecting the DC and AC terminals; the separation line between the upper and lower chips is along the line connecting the DC and AC terminals.

[0048] The chip 1 may be an FRD / IGBT, MOSFET or SBD / IGBT made of materials such as silicon, silicon carbide (SiC), gallium nitride (GaN), etc., or may be other high-power chips 1.

[0049] As shown in Figure 1, in this embodiment, the module circuit adopts a three-phase full-bridge structure, employing a single liner 2 layout. It uses six IGBTs and six FRD chips, with each IGBT chip and FRD chip connected in anti-parallel to form a single transistor, thus forming a six-in-one three-phase full-bridge circuit topology. Of course, SiC chips can also be used to replace the FRD chips in this embodiment.

[0050] (3) A first terminal 4 is used to electrically connect the lining plate 2 to the outside world. One end of the second terminal 6 is connected to the lining plate 2 by soldering or ultrasonic welding, and the other end extends in a direction perpendicular to the lining plate 2. A plurality of first terminals 4 are provided, and the plurality of first terminals 4 are arranged at intervals on the lining plate 2.

[0051] In this embodiment, the first terminals 4 are arranged perpendicular to the liner 2, which can avoid the traditional form of the terminals extending horizontally along the liner 2, and can fully utilize the vertical space of the liner 2, reduce the occupied area of ​​the first terminals 4 on the liner 2, effectively increase the utilization area of ​​the liner 2, and reduce the horizontal area of ​​the liner 2, thereby reducing the size of the electronic packaging device as a whole, increasing the power density of the electronic packaging device, and reducing the plastic packaging cost; in addition, it can also reduce parasitic parameters and enhance the controllability of the chip 1.

[0052] The first terminal 4 is at least partially embedded in the plastic package body 3 . The first terminal 4 is a stepped structure with steps. The end surface of the stepped structure is flush with the molded top surface of the plastic package body 3 to form a contact seal.

[0053] Currently, the manufacturing method for PIN pins in plastic encapsulation is complex and requires processes such as cutting and forming to complete. Furthermore, if the PIN pins are individually welded to the liner 2 and then plastic encapsulated, a separate positioning structure must be configured on the plastic encapsulation mold for each PIN pin, which is difficult to implement. To address the above technical issues, in this embodiment, since the first terminal 4 has a stepped structure with steps, the stepped end surface of the stepped structure is flush with the molded top surface of the plastic encapsulation body 3. During transfer molding, the first connecting section 41 directly contacts the wall surface of the upper mold cavity, eliminating the need for a separate positioning structure on the plastic encapsulation mold for each PIN pin. Furthermore, since a contact seal is formed between the stepped end surface of the first terminal 4 and the plastic encapsulation body 3 during plastic encapsulation, the problem of epoxy resin overflow that easily occurs during transfer molding is resolved.

[0054] The first terminal 4 includes a first connecting section 41 and a second connecting section 42 connected to each other; wherein, the first connecting section 41 is embedded in the plastic packaging body 3, and one end of the first connecting section 41 is connected to the liner 2, and the other end is flush with the top surface of the plastic packaging body 3; the radial dimension of the first connecting section 41 is greater than the radial dimension of the second connecting section 42; the first connecting section 41 and the second connecting section 42 are coaxially connected to form a stepped structure, and the steps of the stepped structure are located on the end surface of the first connecting section 41 facing the second connecting section 42.

[0055] As a first embodiment, the first terminal 4 is an integrally formed linear PIN.

[0056] As a second embodiment, the first terminal 4 is an integrally formed PIN pin and has a stepped “⊥”-shaped structure, wherein the top of the step of the “⊥”-shaped structure is flush with the molded top surface of the plastic package body 3, thereby forming a contact sealing area.

[0057] In a third embodiment, the first connecting section 41 of the first terminal 4 is a connector embedded in the plastic package 3 and connected to the backing plate 2. The second connecting section 42 is a pin that connects the connector to an external device. The connector is a sleeve structure, and the outer diameter of the pin end that connects to the connector is larger than the inner diameter of the connector. The pin is inserted into the inner hole of the connector with an interference fit. The pin is a press-fit pin. After the die is rotated, one end of the press-fit pin is inserted into the inner hole of the connector with an interference fit, forming a PressFIT structure, thereby achieving solder-free press-fit assembly.

[0058] In an exemplary embodiment, a connecting portion for connecting to the liner 2 is formed at one end of the first connecting section 41, and the connecting portion is a stepped structure formed by radially extending along the first connecting section 41; after plastic packaging, the connecting portion can be restrained and positioned between the liner 2 and the plastic packaging body 3.

[0059] The first connecting section 41 is connected to the liner 2 through the connecting part. The connecting part can increase the contact area between the first connecting section 41 and the liner 2, making the connection more secure. At the same time, the top wall of the connecting part abuts against the plastic sealing body 3 to prevent the sleeve from falling out of the plastic sealing body 3, making the connection more secure; the other end of the first connecting section 41 is flush with the top surface of the plastic sealing body 3.

[0060] In this embodiment, the connector is first welded to the backing plate 2. During the transfer mold, the top of the connector directly contacts the wall of the upper mold cavity. After the transfer mold forms the plastic encapsulation body 3, one end of the lead is inserted into the hole of the connector with an interference fit, connecting the lead to the connector. Because the top of the connector directly contacts the wall of the upper mold cavity during the transfer mold, the mold eliminates the need for a separate positioning structure for each PIN and also solves the problem of epoxy resin overflow during transfer molding.

[0061] In this embodiment, when a PIN pin is used as the first terminal 4, the connection method can be reasonably selected and flexibly selected according to actual conditions. It can be achieved by welding the PIN pin to the backing plate 2, or by press-fitting the connector and the press-fit pin to form a PressFIT structure. This can realize flexible configuration of the interface of the electronic packaging appliance to meet the different interface application requirements of customers.

[0062] (4) The second terminal 6 is a sheet-like structure. One end of the second terminal 6 is connected to the backing plate 2 by soldering or ultrasonic welding, and the other end of the second terminal 6 extends to the outside of the backing plate 2 and the plastic package 3, and is used to connect to other electrical components outside the electronic packaging device. The extended portion of the second terminal 6 is arranged parallel to the backing plate 2. As an embodiment, the extended portion of the second terminal 6 is provided with a connection hole 61, through which the second terminal 6 can be threadedly connected to an external component. As an embodiment, the extended portion of the second terminal 6 is a planar plate-shaped structure, which can be laser welded to the external component.

[0063] Preferably, copper bus bars 7 (DLBs) are used to connect chips to each other, between chip 1 and terminals, and between chip 1 and substrate 2, which can reduce the thermal resistance of chip 1, reduce loop inductance, and reduce overall loss.

[0064] (5) The substrate 5 plays a vital role in dissipating heat from the entire electronic packaging device. The substrate 5 includes a plate body 51 and pin fins 52 disposed on the plate body 51. The heat generated by the chip 1 passes through the backing plate 2, the plate body 51, and the pin fins 52 in sequence, and exchanges heat with the coolant flowing through the pin fins 52, transferring the heat to the coolant, thereby reducing the temperature of the chip 1.

[0065] The function of the plate body 51 is to provide mechanical support for the electronic packaging device in this embodiment and to improve the installation interface. The liner 2 is mounted on the plate body 51. The interconnection between the liner 2 and the substrate can be achieved by welding with tin-based solder, or by sintering methods such as silver sintering and copper sintering, or by transient liquid phase welding. A boss is provided on the circumference of the plate body 51 to support the liner 2 and maintain the welding thickness between the liner 2 and the plate body 51; in an exemplary embodiment, the boss thickness is 0.05mm to 0.3mm. The size of the plate body 51 is adjusted according to the size of the circuit layout range. In this embodiment, the overall size of the plate body 51 is not greater than 80*90 square millimeters.

[0066] The pin fin 52 is mainly used for heat dissipation. One end of the pin fin 52 is connected to the plate body 51, and the other end extends in a direction away from the plate body 51. There are multiple pin fins 52, and multiple pin fins 52 are arranged at intervals on the plate body 51; multiple pin fins 52 can be arranged in a uniform array or in a non-uniform array. The length of the pin fin 52 is slightly smaller than the depth of the radiator. In an exemplary embodiment, the length of the pin fin 52 is 5.5mm to 6.5mm. The pin fin 52 is columnar, and the shape of the cross section of the pin fin 52 can be circular, elliptical, diamond-shaped, square, track-shaped, fin-shaped, or a combination of two or three. Of course, it can also be other shapes, and this embodiment does not limit this.

[0067] The pin fins 52 can be integrally formed with the plate body 51 or fixed to the plate body 51 by bonding, welding, etc. In this embodiment, the integrally formed substrate 5 structure with the pin fins 52 and the design of the special-shaped pin fins 52 can achieve efficient heat dissipation and can be applied to low-power modules.

[0068] The material of the plate body 51 and the pin fins 52 is a high thermal conductivity material, which can be bare copper, or the copper layer can be plated with nickel, silver or other coatings, or of course other high thermal conductivity materials.

[0069] (6) Plastic encapsulation 3, which wraps around liner 2 and chip 1 on liner 2, provides insulation and sealing protection, supports circuit mounting interfaces, and has no effect on the heat dissipation of the electronic package. Plastic encapsulation 3 is usually made of a polymer material, such as epoxy resin. Utilizing the high-temperature resistance of epoxy resin, it can support the continuous operation of the electronic package at higher temperatures. Of course, plastic encapsulation 3 can also be made of other materials that meet the pressure and moisture resistance requirements.

[0070] In this embodiment, the steps for forming the electronic packaging device are as follows: the chip 1, the first terminal 4, and the second terminal 6 are respectively welded to the backing plate 2, and the backing plate 2 is welded to the substrate 5; the electronic device is electrically connected; and then the plastic packaging is performed to form a plastic package body 3.

[0071] In this embodiment, the first terminals 4 are arranged perpendicular to the lining plate 2, which can make full use of the vertical space of the lining plate 2 and reduce the horizontal area of ​​the lining plate 2, thereby improving the power density of the electronic packaging device and reducing the size of the electronic packaging device as a whole, and making the structure more compact; further, the one-piece molded substrate 5 structure with pin fins 52 and the design scheme of special-shaped pin fins 52 in this embodiment can improve the heat dissipation capacity of the electronic packaging device, and the heat dissipation is more efficient, thereby supporting the electronic packaging device to continue working at a higher temperature, and can be applied to low-power modules.

[0072] When a PIN needle is used as the first terminal 4, the connection method can be reasonably selected and flexibly selected according to actual conditions, that is, the PIN needle can be welded to the liner 2, or the connector and the press-fit pin can be press-fitted to form a PressFIT structure.

[0073] The disclosed embodiment adopts a single-liner 2-three-phase full-bridge solution, which can flexibly adjust the circuit configuration according to the application scenario and is suitable for low-power and high-power density module packaging in automotive-grade application scenarios.

[0074] The advantages of the electronic packaging device and power module disclosed herein are:

[0075] 1. Currently, the manufacturing method for PIN pins in plastic encapsulation is complex and requires processes such as cutting and forming to complete. Furthermore, if the PIN pins are individually welded to the liner and then plastic encapsulated, a separate positioning structure must be configured on the plastic encapsulation mold for each PIN pin, which is difficult to implement. In response to the above technical issues, in this embodiment, since the first terminal has a stepped structure with steps, the stepped end surface of the stepped structure is flush with the molded top surface of the plastic encapsulation body, and the first connecting section is in direct contact with the wall surface of the upper mold cavity during mold transfer, there is no need to configure a separate positioning structure for each PIN pin on the plastic encapsulation mold. Furthermore, since a contact seal is formed between the stepped end surface of the first terminal and the plastic encapsulation body during plastic encapsulation, the problem of epoxy resin overflow that easily occurs during mold transfer is resolved.

[0076] 2. In the present disclosure, the first terminals are arranged perpendicular to the lining plate, which can fully utilize the vertical space of the lining plate and reduce the horizontal area of ​​the lining plate, thereby improving the power density of the electronic packaging device and reducing the size of the electronic packaging device as a whole, making the structure more compact.

[0077] 3. In the present disclosure, the one-piece molded substrate structure with pin fins and the design of special-shaped pin fins can improve the heat dissipation capacity of electronic packaging devices and make heat dissipation more efficient, thereby supporting the electronic packaging devices to continue working at higher temperatures and can be applied to small power modules.

[0078] 4. In the present disclosure, copper bus bars (DLBs) are used to connect chips to each other, chips to terminals, and chips to substrates, which can reduce both chip thermal resistance and loop inductance, thereby reducing overall losses.

[0079] 5. This disclosure adopts a single-liner three-phase full-bridge solution, which can flexibly adjust the circuit configuration according to the application scenario and is suitable for low-power and high-power density module packaging in automotive-grade application scenarios.

[0080] While the present disclosure has been described with reference to preferred embodiments, various modifications may be made thereto and equivalent components may be substituted without departing from the scope of the present disclosure. In particular, the various technical features described in the various embodiments may be combined in any manner, provided no structural conflicts exist. The present disclosure is not limited to the specific embodiments disclosed herein, but encompasses all technical solutions within the scope of the claims.

Claims

1. An electronic packaging device, wherein: It comprises a backing plate (2) for mounting a chip (1), a plastic package (3) wrapped outside the backing plate (2), and a plurality of first terminals (4) for connecting the backing plate (2) and an external electrical appliance; The first terminal (4) is at least partially embedded in the plastic package body (3); the first terminal (4) is a stepped structure with steps; the step end surface of the stepped structure is flush with the molded top surface of the plastic package body (3) to form a contact seal.

2. The electronic package device according to claim 1, wherein: The first terminal (4) comprises a first connecting section (41) and a second connecting section (42) which are connected to each other; wherein the first connecting section (41) is embedded in the plastic package body (3), and one end of the first connecting section (41) is connected to the liner (2), and the other end is flush with the top surface of the plastic package body (3); The radial dimension of the first connecting section (41) is greater than the radial dimension of the second connecting section (42); The first connecting section (41) and the second connecting section (42) are coaxially connected to form the stepped structure, and the steps of the stepped structure are located on the end surface of the first connecting section (41) facing the second connecting section (42).

3. The electronic package device according to claim 2, wherein: The first connecting section (41) of the first terminal (4) is a connecting body embedded in the plastic package (3) and connected to the liner (2); The second connecting section (42) is a pin connected between the connecting body and the external electrical appliance; The connector is a sleeve structure, the outer diameter of one end of the pin used for connecting the connector is larger than the inner hole diameter of the connector, and the pin is embedded in the inner hole of the connector by interference fit.

4. The electronic packaging device according to claim 2 or 3, wherein: A connecting portion for connecting to the lining plate (2) is formed at one end of the first connecting section (41), and the connecting portion is a stepped structure extending radially along the first connecting section (41); After the plastic packaging, the connection portion is stopped and limited between the liner (2) and the plastic packaging body (3).

5. The electronic package device according to claim 1, wherein: The first terminal (4) is an integrally formed stepped PIN pin.

6. The electronic package device according to claim 1, wherein: The first terminals (4) are all arranged perpendicular to the lining plate (2).

7. The electronic packaging device according to any one of claims 1 to 3, wherein: The chip (1) is provided in plurality, and the plurality of chips (1) are interconnected via copper busbars (7); and / or, The chip (1) is welded on the backing plate (2), and the two are interconnected via a copper busbar (7).

8. The electronic packaging device according to any one of claims 1 to 3, wherein: It also includes a base plate (5) for supporting and installing the lining plate (2); the base plate (5) includes a plate body (51) for supporting and installing the lining plate (2), and pin fins (52) arranged on the plate body (51); The heat generated by the chip (1) can pass through the liner (2), the plate body (51) and the pin fins (52) in sequence, and perform heat exchange with the cooling liquid flowing through the pin fins (52).

9. The electronic package device according to claim 8, wherein: One end of the pin fin (52) is connected to the plate body (51), and the other end extends in a direction away from the plate body (51).

10. The electronic package device according to claim 9, wherein: The pin fins (52) are provided in plurality, and the plurality of pin fins (52) are arranged at intervals on the plate body (51) in a uniform array.

11. The electronic package device according to claim 9, wherein: The pin fins (52) are provided in plurality, and the plurality of pin fins (52) are arranged at intervals on the plate body (51) in a non-uniform array.

12. The electronic packaging device according to any one of claims 1 to 3, wherein: Also includes: The second terminal (6) is a sheet-like structure, one end of which is welded to the lining plate (2), and the other end of which extends to the outside of the lining plate (2) and the plastic package body (3) for connection with other electrical components outside the electronic packaging device.

13. The electronic package device according to claim 12, wherein: The extended portion of the second terminal (6) is arranged parallel to the liner (2).

14. The electronic package device according to claim 13, wherein: A connection hole (61) is provided on the extended portion of the second terminal (6), and the second terminal (6) is threadedly connected to an external component through the connection hole (61).

15. A power module, wherein: An electronic packaging device comprising any one of claims 1-14.

Images