Antenna assembly, assembly method, and related device

Abstract

The present application relates to an antenna assembly, an assembly method, and a related device. The antenna assembly comprises: a dual antenna (1), a reference board (4), a first feed component (10), and a second feed component (30); the first feed component (10) and the second feed component (30) are arranged between the dual antenna (1) and the reference board (4); at least one first feed component (10) is provided; the dual antenna (1) comprises a receiving antenna (2), a first dielectric layer (5), and a transmitting antenna (3), and at least one receiving antenna (2) is provided; the receiving antenna (2) is arranged on a first surface of the first dielectric layer (5), the transmitting antenna (3) is arranged on a second surface of the first dielectric layer (5), and the receiving antenna (2) and the transmitting antenna (3) are insulated from each other by means of the first dielectric layer (5); the receiving antenna (2) is electrically connected to the reference board (4) by means of the corresponding first feed component (10); and the transmitting antenna (3) is electrically connected to the reference board (4) by means of the second feed component (30).

Description

Antenna assembly, assembly method, and related equipment

[0001] Related applications

[0002] This application claims priority to Chinese patent application number 202311777997.7, filed on December 22, 2023, entitled “An antenna assembly, assembly method and related equipment,” the entire text of which is hereby incorporated by reference. Technical Field

[0003] The present application relates to the technical field of detection electronic equipment, and in particular to an antenna assembly, an assembly method, and related equipment. Background Art

[0004] The principle of the nonlinear node detector is to send the S-band high-frequency fundamental wave (3.4-3.6GHz) to the target area or target object through the transmitting end of the device, and the receiving end captures the second harmonic (7-7.5GHz) and third harmonic (10-10.6GHz) generated by the target object. After analyzing and processing the harmonic signal using the fuzzy recognition algorithm and self-learning algorithm in the field of artificial intelligence, the harmonic change law before and after the fundamental wave is emitted is given, so that electronic devices with nonlinear junctions can be effectively identified.

[0005] Nonlinear node detectors can be used in military reconnaissance, counter-terrorism and riot control, prison contraband search, criminal investigation and technical investigation, search and rescue, tracking and searching, high-tech cheating prevention in exams, confidential meeting investigation, privacy protection and other fields.

[0006] Traditional nonlinear node detectors typically consist of a first-order transmitting antenna, a second-order receiving antenna, and a third-order receiving antenna. However, due to their inherent structural complexity, they are not suitable for scenarios requiring portability. Summary of the Invention

[0007] According to various embodiments of the present application, an antenna assembly, an assembly method, and related equipment are provided.

[0008] In a first aspect, an embodiment of the present application provides an antenna assembly, comprising:

[0009] A double-panel antenna, a reference board, a first feeding component and a second feeding component; the first feeding component and the second feeding component are arranged between the double-panel antenna and the reference board; the number of the first feeding component is at least one;

[0010] A double-panel antenna comprising a receiving antenna, a first dielectric layer, and a transmitting antenna; the number of the receiving antenna is at least one; the receiving antenna is disposed on a first surface of the first dielectric layer, the transmitting antenna is disposed on a second surface of the first dielectric layer, and the receiving antenna and the transmitting antenna are insulated from each other by the first dielectric layer;

[0011] The receiving antenna is electrically connected to the reference board through the corresponding first feeding component;

[0012] The transmitting antenna is electrically connected to the reference board through the second feeding component.

[0013] In one embodiment, the reference board includes a filter layer corresponding to at least one receiving antenna and a transmitting antenna;

[0014] The filter layer is electrically connected to the receiving antenna via a first feeding component;

[0015] The filter layer is electrically connected to the transmitting antenna through the second feeding component.

[0016] In one embodiment, the double-panel antenna and the reference board are arranged in parallel up and down, and there is a gap between the double-panel antenna and the reference board;

[0017] The reference board also includes: a reference ground layer and a second dielectric layer;

[0018] The reference ground layer and the filter layer are respectively arranged on the upper and lower surfaces of the second dielectric layer and are insulated from each other by the second dielectric layer;

[0019] The reference ground layer is arranged relative to the transmitting antenna.

[0020] In one embodiment, the transmitting antenna is electrically connected to the reference stratum at the target position, and the target position must meet the condition that when the transmitting antenna is electrically connected to the reference stratum at the target position, it will not affect the normal transmission of electromagnetic waves by the transmitting antenna.

[0021] In one embodiment, the transmitting antenna is a patch antenna, and the impedance at the target location is zero.

[0022] In one embodiment, a first via hole is formed on the receiving antenna, the first dielectric layer, the transmitting antenna, the reference ground layer, the second dielectric layer, and the filter layer;

[0023] The first feeding component includes a first feeding core wire and a first metal shell that are insulated from each other; the first feeding core wire passes through the first via hole; and a first end of the first feeding core wire is directly connected to the receiving antenna to form an electrical connection, and a second end of the first feeding core wire is directly connected to the receiving antenna feeding point of the filter layer to form an electrical connection;

[0024] The first end of the first metal shell is directly connected to the transmitting antenna to form an electrical connection, and the second end of the first metal shell is directly connected to the reference ground layer to form an electrical connection;

[0025] The first feeding core wire is insulated from the reference ground layer and the transmitting antenna respectively.

[0026] In one embodiment, the aperture of the first via hole at the reference ground layer and the transmitting antenna is larger than the outer diameter of the first feeding core wire.

[0027] In one embodiment, a second via hole is opened on the reference ground layer, the second dielectric layer and the filter layer;

[0028] The second feeding component passes through the second via hole; and the first end of the second feeding component is directly connected to the transmitting antenna to form an electrical connection, and the second end of the second feeding component is directly connected to the transmitting antenna feeding point of the filter layer to form an electrical connection;

[0029] The reference ground layer is insulated from the second feeding member.

[0030] In one embodiment, a diameter of a portion of the second via hole in the reference ground layer is larger than an outer diameter of the second feeding component.

[0031] In one embodiment, the receiving antenna and the transmitting antenna are both patch antennas, and the projection of the first feeding core line on the transmitting antenna is located on the center line of the transmitting antenna;

[0032] In one embodiment, the receiving antenna is a patch antenna, and the connection point between the first feeding core wire and the receiving antenna is set at a position where the impedance of the receiving antenna is approximately 50 ohms.

[0033] In one embodiment, the transmitting antenna is a patch antenna, and the connection point between the second feeding component and the transmitting antenna is located at a position where the impedance of the transmitting antenna is approximately 50 ohms.

[0034] In one embodiment, both the receiving antenna and the transmitting antenna are patch antennas, and a first distance corresponding to a projection of any point on the receiving antenna on the transmitting antenna is greater than a second distance corresponding to the projection, where the first distance is the distance between the projection and the edge of the transmitting antenna, and the second distance is the distance between the projection and the center of the transmitting antenna.

[0035] In a second aspect, an embodiment of the present application provides an electronic device, which includes the antenna assembly provided in an embodiment of the present application.

[0036] In a third aspect, an embodiment of the present application provides a nonlinear node detector, which includes an antenna assembly provided by an embodiment of the present application; at least one receiving antenna includes a second-order receiving antenna and a third-order receiving antenna.

[0037] In a fourth aspect, an embodiment of the present application provides a method for assembling an antenna assembly, comprising the following steps:

[0038] Provided are a double-panel antenna, a reference board, a second feeding component, and a first feeding component comprising a mutually insulated first feeding core and a first metal shell; wherein the double-panel antenna and the reference board are provided with first vias at positions corresponding to the first feeding core of the first feeding component; and the reference board is provided with a second via at a position corresponding to the second feeding component; the double-panel antenna comprises a receiving antenna, a first dielectric layer, and a transmitting antenna; the receiving antenna is provided on a first surface of the first dielectric layer, and the transmitting antenna is provided on a second surface of the first dielectric layer, and the receiving antenna and the transmitting antenna are insulated from each other by the first dielectric layer;

[0039] Apply welding material to at least one side of the reference board facing the transmitting antenna and one side of the transmitting antenna facing the reference board, where the first metal shell is mounted; and apply welding material to the one side of the transmitting antenna facing the reference board, where the second feeding component is mounted;

[0040] Inserting the first feeding component into the first via hole so that the first metal shell is located between the double-panel antenna and the reference board; and inserting the second feeding component into the second via hole to obtain a component to be welded;

[0041] The parts to be welded are welded using a reflow process.

[0042] In one embodiment, before performing soldering using a reflow soldering process, the method further includes:

[0043] Apply welding material to the edge of the first via hole on the bottom surface of the reference board and the surface of the receiving antenna; and apply welding material to the edge of the second via hole on the bottom surface of the reference board.

[0044] In one embodiment, after the step of soldering the workpiece using a reflow process, the method further includes:

[0045] Welding the two ends of the first feed core wire to the surface of the receiving antenna and the bottom surface of the reference board respectively;

[0046] Solder the bottom end of the second feeding member to the bottom surface of the reference board.

[0047] Other features and advantages of the present application will be described in the following description, and in part will become apparent from the description, or will be understood by practicing the present application. The purposes and other advantages of the present application can be realized and obtained by the structures particularly pointed out in the written description, claims, and drawings.

[0048] The technical solution of the present application is further described in detail below through the accompanying drawings and examples. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the conventional technology, the following briefly introduces the drawings required for use in the embodiments or the conventional technology descriptions. Obviously, the drawings described below are merely embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the disclosed drawings without any creative work.

[0050] FIG1 is a schematic top view of an antenna assembly in a first embodiment of the present application;

[0051] FIG2 is a schematic cross-sectional view taken along line AA in FIG1 ;

[0052] FIG3 is a schematic structural diagram of the first feeding component in the first embodiment of the present application;

[0053] FIG4 is a schematic cross-sectional view of BB in FIG1 ;

[0054] FIG5 is a bottom view of the antenna assembly in the first embodiment of the present application;

[0055] FIG6 is a flow chart of an assembly method of an antenna assembly in the first embodiment of the present application.

[0056] Explanation of the accompanying drawings: 1-double-panel antenna; 2-receiving antenna; 21-receiving antenna feeding point; 22-receiving antenna assembly feeding point; 3-transmitting antenna; 31-transmitting antenna feeding point; 32-transmitting antenna assembly feeding point; 4-reference board; 5-first dielectric layer; 10-first feeding component; 101-first feeding core wire; 103-first columnar insulator; 102-first metal shell; 401-reference ground layer; 402-second dielectric layer; 403-filtering layer; 4031-first filter; 4032-second filter; 4033-third filter; 30-second feeding component; 1011-first end of the first feeding core wire; 1012-second end of the first feeding core wire; 3011-first end of the second feeding component; 3012-second end of the second feeding component. DETAILED DESCRIPTION

[0057] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0058] Traditional nonlinear node detectors have large antenna array areas and complex structures, which are not conducive to portable application scenarios.

[0059] In response to the problems existing in these related technologies, embodiments of the present application provide an antenna assembly, an assembly method, and related equipment.

[0060] Example 1:

[0061] The structure of an antenna assembly provided in an embodiment of the present application is described in detail below with reference to the accompanying drawings:

[0062] 1 to 3 , an antenna assembly provided in an embodiment of the present application includes:

[0063] The double-panel antenna 1, the reference board 4, the first feeding component 10 and the second feeding component 30 are provided between the double-panel antenna 1 and the reference board 4. The number of the first feeding component 10 is at least one.

[0064] A double-panel antenna 1 includes a receiving antenna 2, a first dielectric layer 5, and a transmitting antenna 3. There is at least one receiving antenna 2. The receiving antenna 2 is disposed on a first surface of the first dielectric layer 5, and the transmitting antenna 3 is disposed on a second surface of the first dielectric layer 5. The receiving antenna 2 and the transmitting antenna 3 are insulated from each other by the first dielectric layer 5.

[0065] The receiving antenna 2 is electrically connected to the reference board 4 via the corresponding first feeding component 10 .

[0066] The transmitting antenna 3 is electrically connected to the reference board 4 via the second feeding component 30 .

[0067] In the antenna assembly provided in the embodiment of the present application, the receiving antenna 2 and the transmitting antenna 3 are respectively arranged on the first surface and the second surface of the first dielectric layer 5, that is, the transmitting and receiving antennas are made into a stacked design, which can effectively reduce the array area of ​​the antenna, make the antenna and the equipment using the antenna more compact, and the volume can be made smaller, thereby achieving a portable effect. On the other hand, the stacked design of the transmitting and receiving antennas makes the transmitting and receiving antennas close to coaxial, reduces the error of the detection angle, and improves the detection performance of the nonlinear node detector using the antenna assembly.

[0068] The receiving antenna 2 may be disposed on the top layer of the double-panel antenna 1. In addition, multiple receiving antennas 2 may be provided, such as a second-order receiving antenna and a third-order receiving antenna.

[0069] The transmitting antenna 3 may be disposed on the bottom layer of the double-panel antenna 1 . The transmitting antenna 3 may be, for example, a first-order transmitting antenna.

[0070] Among them, the first feeding component 10 and the second feeding component 30 are used for feeding. The first dielectric layer 5 can be an insulating material. The first-order transmitting antenna, the second-order receiving antenna, and the third-order receiving antenna can all be microstrip patch oscillators. The reference board 4 cooperates with the double-panel antenna 1 to realize electromagnetic wave transmission and reception. In order to improve the performance of the antenna, it is preferable to set the operating frequencies of the transmitting antenna 3 and each receiving antenna 2 to be in different frequency ranges. For example, in the embodiment of the present application, the frequency range of the first-order transmitting antenna can be, for example, 2.4-2.5 GHz, the frequency range of the second-order receiving antenna can be, for example, 4.8-5 GHz, and the frequency range of the third-order receiving antenna can be, for example, 7.2-7.5 GHz. The frequency difference between the three is large, so that the interference between the antennas can be relatively small.

[0071] In one embodiment, the reference board 4 specifically includes a filter layer 403 corresponding to the receiving antenna 2 and the transmitting antenna 3.

[0072] The filter layer 403 is electrically connected to the receiving antenna 2 via the first feeding component 10 .

[0073] The filter layer 403 is electrically connected to the transmitting antenna 3 through the second feeding component 30 .

[0074] For reception, the filter layer 403 may filter the signal received by the receiving antenna 2. For transmission, the filter layer 403 may send the filtered signal to the transmitting antenna 3.

[0075] 2 , in one embodiment, the double-panel antenna 1 and the reference board 4 are arranged in parallel up and down, with a gap between the double-panel antenna 1 and the reference board 4 .

[0076] The reference board 4 further includes a reference ground layer 401 and a second dielectric layer 402 .

[0077] The reference ground layer 401 and the filter layer 403 are respectively disposed on the upper and lower surfaces of the second dielectric layer 402 and are insulated from each other by the second dielectric layer 402 .

[0078] The reference ground layer 401 is arranged opposite to the transmitting antenna 3 .

[0079] Reference ground layer 401 serves as the reference ground for transmitting antenna 3. A gap exists between the double-panel antenna 1 and the reference board 4, and reference ground layer 401 is positioned opposite transmitting antenna 3. This positioning of reference ground layer 401 and transmitting antenna 3 means that reference ground layer 401 is adjacent to transmitting antenna 3, with a gap between them. This gap is filled with air. This structure allows transmitting antenna 3 to use air as a reference layer. Due to the low dielectric loss of air, this improves gain and bandwidth, enhancing antenna performance.

[0080] As shown in Figure 2 , the dual-panel antenna 1 may be located at the top, while the reference board 4 may be located at the bottom. The top layer of the reference board 4 may be a reference ground layer 401, the middle layer may be a second dielectric layer 402, and the bottom layer may be a filter layer 403. If the dual-panel antenna 1 includes a second-order receiving antenna and a third-order receiving antenna, and the transmitting antenna 3 is a first-order transmitting antenna, the filter layer 403 may include a first filter 4031 electrically connected to the third-order receiving antenna, a second filter 4032 electrically connected to the second-order receiving antenna, and a third filter 4033 electrically connected to the first-order transmitting antenna. The first filter 4031, the second filter 4032, and the third filter 4033 may be, for example, microstrip filters.

[0081] In one embodiment, the transmitting antenna 3 is electrically connected to the reference stratum 401 at the target position, and the target position must meet the condition that when the transmitting antenna 3 is electrically connected to the reference stratum 401 at the target position, it will not affect the normal transmission of electromagnetic waves by the transmitting antenna 3.

[0082] The transmitting antenna 3 needs to select a target location for electrical connection with the reference ground layer 401, and this target location must ensure that it does not affect the normal transmission of the transmitting antenna 3. For example, if the transmitting antenna 3 is a patch antenna, the impedance of the location on the transmitting antenna 3 that is electrically connected to the reference ground layer 401 (i.e., the target location) is zero. Because the impedance of this electrically connected location is zero, regardless of whether this location is electrically connected to the reference ground layer 401, it will not affect the transmission of electromagnetic waves by the transmitting antenna 3.

[0083] In this embodiment, since the transmitting antenna 3 is electrically connected to the reference ground layer 401 to achieve a common ground, the receiving antenna 2 can use the transmitting antenna 3 as a reference ground. Both the transmitting antenna 3 and the receiving antenna 2 are fed using a backfeed method.

[0084] 2 , in one embodiment, a first via hole (not shown) is formed on the receiving antenna 2 , the first dielectric layer 5 , the transmitting antenna 3 , the reference ground layer 401 , the second dielectric layer 402 and the filter layer 403 .

[0085] As shown in Figures 2 and 3, the first feed component 10 includes a first feed core 101 and a first metal shell 102, which are insulated from each other. The first feed core 101 passes through the first via. The first end 1011 of the first feed core 101 is directly connected to the receiving antenna 2 to form an electrical connection, and the second end 1012 of the first feed core 101 is directly connected to the receiving antenna feed point 21 of the filter layer 403 to form an electrical connection. In this embodiment, the first feed core 101 passes through, from top to bottom, the following: the receiving antenna 2, the first dielectric layer 5, the transmitting antenna 3, the reference ground layer 401, the second dielectric layer 402, and the filter layer 403.

[0086] 3 , the first feed component 10 further includes a first cylindrical insulator 103. A first metal shell 102 covers the outer surface of the first cylindrical insulator 103, and a first feed core 101 extends through both ends of the first cylindrical insulator 103 along the axis of the first cylindrical insulator 103. The first feed core 101 is insulated from the first metal shell 102 by the first cylindrical insulator 103.

[0087] The transmitting antenna 3 and the reference ground layer 401 are electrically connected via the first metal shell 102 of the first feeding component 10 to achieve a common ground.

[0088] The first end 1021 of the first metal housing 102 of the first feeding component 10 is directly connected to the transmitting antenna 3 to form an electrical connection, and the second end 1022 of the first metal housing 102 is directly connected to the reference ground layer 401 to form an electrical connection, thereby achieving electrical continuity between the transmitting antenna 3 and the reference ground layer 401. In this way, the transmitting antenna 3 can serve as a reference ground for the receiving antenna 2. The impedance of the first end 1021 of the first metal housing 102 at the location on the transmitting antenna 3 is zero.

[0089] In the embodiment of the present application, the first feeding component 10 can be, for example, a radio frequency insulator, wherein the first columnar insulator 103 is made of plastic. This feeding component is easy to weld and has high processing consistency, thereby ensuring the performance of the antenna.

[0090] In this embodiment, the first feeding component 10 is implemented by the above-mentioned first metal shell 102 and the first feeding core wire 101. Since the first metal shell 102 is located between the double-panel antenna 1 and the reference board 4, a gap can be created between the double-panel antenna 1 and the reference board 4 under the support of the first metal shell 102, which also makes assembly easier.

[0091] In the above structure, the first feeding core wire 101 is insulated from the reference ground layer 401 and the transmitting antenna 3 respectively.

[0092] To achieve insulation between the first feeder core 101 and the reference ground layer 401 and the transmitting antenna 3, in one embodiment, the aperture of the first via hole at the reference ground layer 401 and the transmitting antenna 3 (such as a and b in FIG2 ) is larger than the outer diameter of the first feeder core 101. In this way, the first via hole at the reference ground layer 401 and the transmitting antenna 3 acts as a avoidance hole. When the first feeder core 101 passes through the reference ground layer 401 and the transmitting antenna 3, it will not be electrically connected to the reference ground layer 401 and the transmitting antenna 3, and thus maintain insulation.

[0093] 4 , in one embodiment, a second via hole (not shown) is formed on the reference ground layer 401 , the second dielectric layer 402 and the filter layer 403 .

[0094] The second power feeding component 30 is, for example, a second power feeding core wire.

[0095] The second feeding component 30 passes through the second via hole, and the first end 3011 of the second feeding component 30 is directly connected to the transmitting antenna 3 to form an electrical connection, and the second end 3012 of the second feeding component 30 is directly connected to the transmitting antenna feeding point 31 of the filter layer 403 to form an electrical connection.

[0096] 4 , for example, the second feeding component 30 and the corresponding transmitting antenna feeding point 31 on the filter layer 403 can be electrically connected by welding. The second feeding component 30 passes through the filter layer 403, the second dielectric layer 402, and the reference ground layer 401 from bottom to top, and is electrically connected to the transmitting antenna 3.

[0097] Traditional filters are typically connected to antennas via feeders, which are then connected via RF connectors. The male and female connectors of these RF connectors are typically connected together using two metal springs, typically through compression. This connection method often creates nonlinear nodes, which can cause intermodulation interference. In the present embodiment, the receiving antenna 2 and the transmitting antenna 3 are each directly welded to their corresponding filter layer 403, i.e., without using an RF connector. This eliminates nonlinear nodes at the connection, thereby reducing intermodulation interference.

[0098] In one embodiment, the reference ground layer 401 is insulated from the second feeding component 30 .

[0099] In one embodiment, the diameter of the portion of the second via hole located in the reference ground layer 401 (e.g., c in FIG4 ) is larger than the outer diameter of the second feeding component 30. With this design, the second via hole located in the reference ground layer 401 acts as a relief hole, so that the second feeding component 30 will not be electrically connected to the reference ground layer 401 when passing through it.

[0100] The present invention also optimizes the position of each antenna and feed point to ensure the performance of the antenna assembly. Referring to Figure 1 , in one embodiment, both the receiving antenna 2 and the transmitting antenna 3 are patch antennas, and the projection of the first feed core 101 of the first feeding component 10 onto the transmitting antenna 3 is located on the centerline of the transmitting antenna 3.

[0101] The feed point on the receiving antenna 2 is located at the projection of the transmitting antenna 3, that is, the projection of the first feed core 101 (indicated by the "+" sign in Figure 1) on the transmitting antenna 3. The center line refers to the line passing through the center of the transmitting antenna 3.

[0102] If the transmitting antenna 3 and the receiving antenna 2 use patch antennas, that is, microstrip patch oscillators, and the projection of the feeding point of the receiving antenna 2 on the transmitting antenna 3 is located on the center line of the transmitting antenna 3, the receiving antenna 2 has little impact on the transmitting antenna 3.

[0103] For another example, in one embodiment, both receiving antenna 2 and transmitting antenna 3 are patch antennas, and the first distance corresponding to the projection of any point on receiving antenna 2 on transmitting antenna 3 is greater than the second distance corresponding to the projection. The first distance is the distance between the projection and the edge of transmitting antenna 3, and the second distance is the distance between the projection and the center of transmitting antenna 3. Assuming that A is any point on receiving antenna 2, the distance between the projection of A on transmitting antenna 3 and the edge of transmitting antenna 3 is greater than the distance between the projection of A on transmitting antenna 3 and the center of transmitting antenna 3. In other words, receiving antenna 2 is positioned as far away from the edge of transmitting antenna 3 as possible. For example, the projection of receiving antenna 2 on transmitting antenna 3 can be located in the middle of transmitting antenna 3.

[0104] If the transmitting antenna 3 and the receiving antenna 2 use patch antennas, that is, microstrip patch oscillators, since the radiation of the microstrip patch oscillator is at the edge, the projection of the receiving antenna 2 on the transmitting antenna 3 needs to be as far away from the edge of the transmitting antenna 3 as possible to avoid affecting the radiation performance of the transmitting antenna 3.

[0105] For another example, in one embodiment, the receiving antenna 2 adopts a patch antenna, and the connection point between the first feeding core wire 101 of the first feeding component 10 and the receiving antenna 2 is set at a position where the impedance of the receiving antenna 2 is 50 ohms, that is, the receiving antenna 2 is electrically connected to the first feeding core wire 101 at a position where the impedance is approximately 50 ohms, thereby achieving impedance matching.

[0106] For another example, in one embodiment, the transmitting antenna 3 adopts a patch antenna, and the connection point between the second feeding component 30 and the transmitting antenna 3 is set at a position where the impedance of the transmitting antenna 3 is approximately 50 ohms. That is, the transmitting antenna 3 is electrically connected to the second feeding component 30 at a position where the impedance is approximately 50 ohms to achieve impedance matching.

[0107] Refer to Figure 5, which is a bottom view of the antenna assembly of Example 1 of the present application. The filter layer 403 includes a first filter 4031, a second filter 4032 and a third filter 4033. Among them, one end of the first filter 4031 and the second filter 4032 is the receiving antenna feeding point 21. The receiving antenna feeding point 21 is electrically connected to the second end 1012 of the first feeding core wire 101. The other end of the first filter 4031 and the second filter 4032 is the receiving antenna assembly feeding point 22, and the receiving antenna assembly feeding point 22 is electrically connected to the RF board (not shown in the figure) through an SMP connector (ultra-miniature push-in connector) or a coaxial cable. One end of the third filter 4033 is the transmitting antenna feed point 31, which is electrically connected to the second end 3012 of the second feeding component 30. The other end of the third filter 4033 is the transmitting antenna assembly feed point 32, which can also be electrically connected to the RF board (not shown) through an SMP connector (ultra-miniature push-in connector) or a coaxial cable.

[0108] In this embodiment, if the receiving antenna assembly feed point 22 and the transmitting antenna assembly feed point 32 are both electrically connected to the RF board via an SMP connector (ultra-miniature push-in connector), the SMP connectors can also share a reference ground layer 401 (e.g., by using a via with a metal plating inside (not shown in the figure) to electrically connect the reference ground layer 401 to the ground end of the SMP connector). In this way, there is no need to set up a separate reference ground for the SMP connector, thereby reducing the size of the antenna assembly. Based on the above antenna assembly, an embodiment of the present application also provides an electronic device, which includes the antenna assembly provided in an embodiment of the present application.

[0109] Based on the above antenna assembly, embodiments of the present application further provide a nonlinear node detector, which includes the antenna assembly provided in embodiments of the present application. The at least one receiving antenna 2 includes a second-order receiving antenna and a third-order receiving antenna. In other words, the number of receiving antennas 2 in this embodiment is at least two, with one second-order receiving antenna being one receiving antenna 2 and the other third-order receiving antenna being another receiving antenna 2. Embodiments of the present application do not limit the specific number and arrangement of the second-order and third-order receiving antennas.

[0110] Based on the above antenna assembly, an embodiment of the present application provides an assembly method of the antenna assembly, referring to FIG6 and the structures shown in FIG1 , FIG2 , and FIG4 , the method comprising the following steps:

[0111] S1. Provide a double-panel antenna 1, a reference board 4, a second feed component 30, and the first feed component 10 comprising a first feed core 101 and a first metal shell 102, both insulated from each other. The double-panel antenna 1 and the reference board 4 have first vias at positions corresponding to the first feed core 101 of the first feed component 10. The reference board 4 has second vias at positions corresponding to the second feed component 30. The double-panel antenna 1 includes a receiving antenna 2, a first dielectric layer 5, and a transmitting antenna 3. The receiving antenna 2 is disposed on the first surface of the first dielectric layer 5, and the transmitting antenna 3 is disposed on the second surface of the first dielectric layer 5. The receiving antenna 2 and the transmitting antenna 3 are insulated from each other by the first dielectric layer 5.

[0112] S2. Apply welding material to at least the side of the reference board 4 facing the transmitting antenna 3 and the side of the transmitting antenna 3 facing the reference board 4, corresponding to the pads on which the first metal housing 102 is mounted. Also apply welding material to the side of the transmitting antenna 3 facing the reference board 4, corresponding to the pads on which the second feeding component 30 is mounted.

[0113] In this step, soldering material is applied to the locations that require soldering (i.e., the locations where the two ends of the first metal housing 102 need to be installed and the location where the first end 3011 of the second feeding component 30 needs to be installed) located in the gap between the reference board 4 and the double-panel antenna 1. Furthermore, in the embodiment of the present application, the soldering material used may be, for example, solder paste.

[0114] S3: Insert the first feeding component 10 into the first via hole, and position the first metal shell 102 between the double-panel antenna 1 and the reference board 4. Insert the second feeding component 30 into the second via hole to obtain the components to be welded.

[0115] During the specific implementation of this step, for example, after the first feeding component 10 is inserted into the first via hole, the ends of the first feeding core wire 101 of the first feeding component 10 extend to the surface of the receiving antenna 2 and the bottom surface of the filter layer 403, respectively. Furthermore, the ends of the first metal shell 102 abut against the bottom surface of the transmitting antenna 3 and the reference ground layer 401, respectively. After the second feeding component 30 is inserted into the second via hole, one end of the second feeding component 30 abuts against the bottom surface of the transmitting antenna 3, and the other end extends to the bottom surface of the filter layer 403.

[0116] S4, soldering the workpiece using a reflow soldering process.

[0117] In step S4, the parts to be welded may be placed in a reflow oven to solidify the welding material, thereby completing welding using a reflow process.

[0118] In this embodiment, after executing step S4, at least the soldering of the required locations located in the gap between the dual-panel antenna 1 and the reference board 4 is completed. Since these locations are located within the gap between the dual-panel antenna 1 and the reference board 4, manual soldering is difficult. Therefore, this embodiment utilizes reflow soldering to overcome this problem. Furthermore, reflow soldering also achieves higher process consistency, thereby improving the performance of the antenna assembly.

[0119] In addition, there are two implementation options for welding other parts.

[0120] The first solution: In one embodiment, before the above step S4, the following steps are further included:

[0121] S5 , applying soldering material on the surface of the receiving antenna 2 and the edge of the first via hole on the bottom surface of the reference board 4 , and applying soldering material on the edge of the second via hole on the bottom surface of the reference board 4 .

[0122] In this solution, before using the reflow soldering process for soldering, all parts that need to be soldered (including the parts to be soldered located in the gap between the double-panel antenna 1 and the reference board 4, and the parts to be soldered located on the surface of the receiving antenna 2 and the bottom of the reference board 4) are coated with soldering material. In this way, after step S4 is completed, all parts of the antenna assembly that need to be soldered are soldered.

[0123] The specific execution order of step S5 only needs to be before step S4 and after step S1.

[0124] Second solution: In one embodiment, after the step of soldering the workpiece using a reflow process (i.e., the above-mentioned step S4), the above-mentioned assembly method may further perform the following steps:

[0125] The two ends of the first feeding core wire 101 are welded to the surface of the receiving antenna 2 and the bottom surface of the reference board 4 respectively.

[0126] The bottom end of the second feeding member 30 is welded to the bottom surface of the reference board 4 .

[0127] Specifically, the two ends of the first feeding core wire 101 can be welded to the surface of the receiving antenna 2 and the bottom surface of the filter layer 403 respectively, and the bottom end of the second feeding component 30 can be welded to the bottom surface of the filter layer 403 .

[0128] In this solution, the parts to be welded located in the gap between the double-panel antenna 1 and the reference board 4 are welded using a reflow process, while other parts to be welded located on the surface can be welded manually or by other means.

[0129] In an embodiment of the present application, further, the edge of the antenna assembly after welding can be fixed and installed by screw columns, for example, the transmitting antenna 3 and the reference ground layer 401 can be fixed and installed by fasteners to enhance the stability of the antenna.

[0130] In the assembly method provided in the embodiment of the present application, since the first feeding component 10 adopts a radio frequency insulator, welding is facilitated and the processing consistency is high, thereby ensuring the performance of the antenna.

[0131] In addition, since the filter layer 403 is directly welded to the receiving antenna 2 and the transmitting antenna 3, there is no metal contact at the connection point, and no nonlinear node is generated, thereby reducing intermodulation interference.

[0132] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0133] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. An antenna assembly, characterized in that: include: A double panel antenna, a reference board, a first feeding component and a second feeding component; The first feeding component and the second feeding component are arranged between the double-panel antenna and the reference board; The number of the first feeding component is at least one; The double-panel antenna comprises a receiving antenna, a first dielectric layer and a transmitting antenna; The number of the receiving antenna is at least one; the receiving antenna is arranged on the first surface of the first dielectric layer, the transmitting antenna is arranged on the second surface of the first dielectric layer, and the receiving antenna and the transmitting antenna are insulated from each other by the first dielectric layer; The receiving antenna is electrically connected to the reference board through the first feeding component; The transmitting antenna is electrically connected to the reference board through the second feeding component.

2. The antenna assembly according to claim 1, wherein: The reference board includes a filter layer corresponding to the receiving antenna and the transmitting antenna; The filter layer is electrically connected to the receiving antenna via the first feeding component; The filter layer is electrically connected to the transmitting antenna through the second feeding component.

3. The antenna assembly according to claim 2, wherein: The double-panel antenna and the reference board are arranged in parallel up and down, and there is a gap between the double-panel antenna and the reference board; The reference plate further comprises: a reference ground layer and a second dielectric layer; The reference ground layer and the filter layer are respectively arranged on the upper and lower surfaces of the second dielectric layer and are insulated from each other by the second dielectric layer; The reference stratum is arranged opposite to the transmitting antenna.

4. The antenna assembly according to claim 3, characterized in that The transmitting antenna is electrically connected to the reference stratum at the target position, and the target position needs to meet the condition that: when the transmitting antenna is electrically connected to the reference stratum at the target position, it will not affect the normal transmission of electromagnetic waves by the transmitting antenna.

5. The antenna assembly according to claim 4, characterized in that The transmitting antenna is a patch antenna, and the impedance of the target position is zero.

6. The antenna assembly according to claim 4, wherein: A first via hole is formed on the receiving antenna, the first dielectric layer, the transmitting antenna, the reference ground layer, the second dielectric layer and the filtering layer; The first feeding component comprises a first feeding core wire and a first metal shell which are insulated from each other; the first feeding core wire passes through the first via hole; and the first end of the first feeding core wire is directly connected to the receiving antenna to form an electrical connection, and the second end of the first feeding core wire is directly connected to the receiving antenna feeding point of the filter layer to form an electrical connection; The first end of the first metal shell is directly connected to the transmitting antenna to form an electrical connection, and the second end of the first metal shell is directly connected to the reference ground layer to form an electrical connection; The first feeding core wire is insulated from the reference ground layer and the transmitting antenna respectively.

7. The antenna assembly according to claim 6, wherein: The aperture of the first via hole in the reference ground layer and the transmitting antenna is larger than the outer diameter of the first feeding core wire.

8. The antenna assembly according to claim 3, characterized in that: A second via hole is formed on the reference ground layer, the second dielectric layer and the filter layer; The second feeding component passes through the second via hole; and the first end of the second feeding component is directly connected to the transmitting antenna to form an electrical connection, and the second end of the second feeding component is directly connected to the transmitting antenna feeding point of the filter layer to form an electrical connection; The reference ground layer is insulated from the second feeding member.

9. The antenna assembly according to claim 8, wherein: A hole diameter of a portion of the second via hole in the reference ground layer is larger than an outer diameter of the second feeding member.

10. The antenna assembly according to claim 6 or 7, characterized in that: The receiving antenna and the transmitting antenna are both patch antennas, and the projection of the first feeding core wire on the transmitting antenna is located on the center line of the transmitting antenna.

11. The antenna assembly according to claim 6 or 7, characterized in that: The receiving antenna is a patch antenna, and the connection point between the first feeding core wire and the receiving antenna is arranged at a position where the impedance of the receiving antenna is about 50 ohms.

12. The antenna assembly according to claim 8 or 9, characterized in that: The transmitting antenna is a patch antenna, and the connection point between the second feeding component and the transmitting antenna is arranged at a position where the impedance of the transmitting antenna is about 50 ohms.

13. The antenna assembly according to any one of claims 1 to 9, characterized in that: The receiving antenna and the transmitting antenna are both patch antennas, and a first distance corresponding to a projection of any point on the receiving antenna on the transmitting antenna is greater than a second distance corresponding to the projection, the first distance is the distance between the projection and the edge of the transmitting antenna, and the second distance is the distance between the projection and the center of the transmitting antenna.

14. An electronic device, characterized in that: The electronic device comprises the antenna assembly as described in any one of claims 1-13.

15. A nonlinear node detector, characterized in that: The nonlinear node detector comprises the antenna assembly as described in any one of claims 1-13; the at least one receiving antenna comprises a second-order receiving antenna and a third-order receiving antenna.

16. A method for assembling an antenna assembly, characterized in that: include: A double-panel antenna, a reference board, a second feeding component, and a first feeding component including a first feeding core wire and a first metal shell insulated from each other are provided; wherein the double-panel antenna and the reference board are provided with a first via hole at a position corresponding to the first feeding core wire of the first feeding component; the reference board is provided with a second via hole at a position corresponding to the second feeding component; the double-panel antenna comprises a receiving antenna, a first dielectric layer, and a transmitting antenna; the receiving antenna is provided on a first surface of the first dielectric layer, the transmitting antenna is provided on a second surface of the first dielectric layer, and the receiving antenna and the transmitting antenna are insulated from each other by the first dielectric layer; Apply welding material to at least one side of the reference board facing the transmitting antenna and one side of the transmitting antenna facing the reference board, where the first metal shell is mounted; and apply welding material to the one side of the transmitting antenna facing the reference board, where the second feeding component is mounted; Inserting the first feeding component into the first via hole, and making the first metal shell located between the double-panel antenna and the reference board; and inserting the second feeding component into the second via hole to obtain a component to be welded; The parts to be welded are welded using a reflow process.

17. The method for assembling an antenna assembly according to claim 16, wherein: Before soldering using the reflow process, it also includes: Soldering material is applied on the edge of the first via hole on the surface of the receiving antenna and the bottom surface of the reference board; and soldering material is applied on the edge of the second via hole on the bottom surface of the reference board.

18. The method for assembling an antenna assembly according to claim 16, wherein: After the step of soldering the parts to be soldered by using a reflow soldering process, the method further includes: Welding two ends of the first feeding core wire to the surface of the receiving antenna and the bottom surface of the reference board respectively; The bottom end of the second feeding member is welded to the bottom surface of the reference board.

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