Pre-laminated structure for a smartcard with non-insulated wire connection

Abstract

The present invention refers to a pre-laminated structure for a smart card comprising a substrate and a plurality of electronic components directly formed on the substrate. The electronic components include: an electronic module area for placing an electronic module configured for performing a predefined operation of the smart card, for instance a payment operation, the electronic module area comprising a plurality of electronic module terminals for contacting the electronic module; a first antenna, such as a payment antenna, configured for providing energy to the electronic module; an electrical load area for placing an electrical load, for instance a lighting element, such as a Light Emitting Diode (LED), the electrical load area comprising a plurality of load area terminals for contacting the electrical load; a second antenna, such as a harvesting antenna, configured for providing energy to the electrical load. In the pre-laminated structure according to the present invention, the electronic connection between the electronic module terminals and the electrical load terminals is made by means of a non-insulated connection wire. The present invention also relates to the smart card comprising such a pre-laminated structure, and to the methods of forming same.

Description

[0001] PRE-LAMINATED STRUCTURE FOR A SMARTCARD WITH NON-INSULATED WIRE CONNECTION

[0002] Field of the Invention

[0003] The present invention relates to a pre-laminated structure for a smart card and to a smart card comprising such a pre-laminated structure, to a method of forming a pre-laminated structure for a smart card, and to a method of forming a smart card.

[0004] Background

[0005] The pre-laminated structures for smart cards and the smart cards known at the state of the art typically comprise a pre-implanted Printed Circuit Board (PCB) substrate to carry the electronic components of the smart card, for example lighting elements, such as Light Emitting Diodes (LEDs) or Organic Light Emitting Diodes (OLEDs), diodes or other rectifier components for the lighting elements, connection terminals for the lighting elements, and the like.

[0006] It is hence necessary to assemble and laminate the PCB to the pre-laminated structure for the smart card, by paying attention not to damage the PCB and the assembled electronic components during the lamination step. For example, it is necessary to prepare particular card layers and materials, such as card adhesives, for assembling the PCB to the pre-laminated structure. Moreover, the integration of the PCB with the assembled electronic components into the prelaminated structure sets a limitation on the thickness of the electronic components, because the final structure comprising the PCB, the electronic components and the other layers of the prelaminated structure must comply with predefined standards for smart cards.

[0007] In view of the above-described situation, it is desirable to provide a pre-laminated structure for a smart card which overcomes one or more of the problems outlined above.

[0008] Summary

[0009] The present invention is based on the idea of providing a pre-laminated structure wherein the electronic connection between the electronic components of the smart cards is made by means of a non-insulated connection wire instead of a PCB substrate.

[0010] According to a first aspect of the present invention, a pre-laminated structure for a smart card is provided, the pre-laminated structure comprising the following electronic components:

[0011] An electronic module area for placing an electronic module configured for performing a predefined operation of the smart card, for instance a payment operation, the electronic module area comprising a plurality of electronic module terminals for contacting the electronic module;

[0012] A first antenna, such as a payment antenna, configured for providing energy to the electronic module;

[0013] An electrical load area for placing an electrical load, for instance a lighting element, such as a Light Emitting Diode (LED), the electrical load area comprising a plurality of load area terminals for contacting the electrical load;

[0014] A second antenna, such as a harvesting antenna, configured for providing energy to the electrical load.

[0015] The pre-laminated structure according to the present invention further comprises a pre-laminated substrate, and the electronic components are directly formed on the pre-laminated substrate, and each load area terminal is electrically connected to a corresponding electronic module terminal by means of a corresponding non-insulated connection wire.

[0016] In the context of the present invention, the term “non-insulated connection wire” refers to conductive wires without insulating case or coating surrounding the conductive material.

[0017] The advantage of this configuration is that the non-insulated connection wire replaces the PCB substrate used in the pre-laminated structures known at the state of the art for realizing the electrical connections. Since the connection wire is formed on an insulating substrate, such as a plastic substrate, there is no need to insulate it from the external environment by providing an insulating case. Therefore, the manufacturing process of the pre-laminated structure is simplified and optimized. In fact, there is no need to assembly and laminate the PCB into the pre-laminated structure, with the risk of damaging the PCB and the electronic components.

[0018] Moreover, this configuration ensures more flexibility in the design of the pre-laminated structure. In fact, the pre-laminated structure integrating the PCB is subject to specific thickness requirements due to integration into a smart card that has to comply with predefined dimensions and standards. This results in a further limitation of the thickness of the PCB and of the electronic components assembled thereon. On the contrary, if no PCB is used as a substrate for the electronic components of the smartcard, there is more flexibility in their configurations.

[0019] In the present disclosure, it is to be understood that the expression “pre-laminated structure” indicates a structure with one or more layers of an insulating material, such as PVC, PC or some other appropriate thermoplastic polymer. In particular, the expression “pre-laminated structure” may denote an inlay formed of one layer which is added to the smart card. Alternatively, the expression “pre-laminated structure” may denote a multi-layered structure with multiple layers, which are pre-laminated together. In any case, a pre-laminated structure may be considered as representing an intermediate product obtained during fabrication of a smart card. For example, an illustrative pre-laminated structure being formed of multiple layers may be obtained by fusing together different layers of a thermoplastic material into a single homogeneous sheet body, thereby forming a monolithic substrate body.

[0020] It is to be understood that the electrical load may be a lighting element, such as a Light Emitting Diode (LED), an Organic Light Emitting Diode (OLED), a LED array, a micro-LED paste based on Nth-Degree stamp technology, or the like, or any other electrical load, such as batteries for active smartcards, loudspeakers (even ultrasonic), buzzers, pumps, actuators, like electric engines, electromagnets, piezoelectric devices (speakers or micro-vibration devices), heaters / coolers, or the like.

[0021] Preferably, the first antenna, or payment antenna, is configured for providing energy to the payment chip of the electronic module, when exposed to an external electro-magnetic field generated by a reader.

[0022] Preferably, the second antenna, or harvesting antenna, is configured for providing energy to the electrical load via the connection to the electronic module.

[0023] According to a preferred embodiment of the first aspect of the present invention, a pre-laminated structure is provided, wherein each load area terminal is formed by a wire meander portion of the connection wire and is configured to be connected to one or more pads of the electrical load.

[0024] The advantage of this configuration is that the meander wire portions provide a stable and secure electronic connection with the connection pads of the electrical load.

[0025] According to a preferred embodiment of the first aspect of the present invention, a pre-laminated structure is provided, wherein each electronic module terminal is formed by a wire meander portion of the connection wire and is configured to be connected to one or more pads of the electronic module.

[0026] The advantage of this configuration is that the meander wire portions provide a stable and secure electronic connection with the connection pads of the electronic module and ensure that the electronic module is connected to the other electronic components.

[0027] According to a preferred embodiment of the first aspect of the present invention, a pre-laminated structure is provided, wherein the non-insulated connection wire is a metallic wire, such as a copper wire with a silver coating. The advantage of this configuration is that the connection wire ensures a simple, stable and secure electrical connection. Moreover, using a metallic wire without any insulating coating is advantageous because the complex procedure of forming an insulating coating is avoided.

[0028] According to a preferred embodiment of the first aspect of the present invention, a pre-laminated structure is provided, wherein the pre-laminated structure does not comprise any Printed Circuit Board (PCB) substrate for mounting the electronic components.

[0029] The advantage of this configuration is that the manufacturing process is simplified and improved, because there is no need to assembly and laminate the PCB with the electronic components, with the risk of damaging them. Moreover, this configuration ensures flexibility in the design of the prelaminated structure, because there is no need to mount the electronic components on the PCB substrate.

[0030] According to a preferred embodiment of the first aspect of the present invention, a pre-laminated structure is provided, wherein the pre-laminated structure further comprises an electrical load, for instance a lighting element, such as a Light Emitting Diode (LED), or an OLED, placed on the electrical load area.

[0031] The advantage of this configuration is that the lighting element may be used to indicate a working condition of the pre-laminated structure or the smart card, or to illuminate a portion of the prelaminated structure or smart card, such as a logo.

[0032] According to a preferred embodiment of the first aspect of the present invention, a pre-laminated structure is provided, wherein an electrical connection between the load area terminals and one or more pads of the electrical load is made by means of a force fit direct galvanic contact, or by means of an electrical connection layer comprising an isotropic glue, a solder portion, and / or an Anisotropic Conductive Film (ACF) portion.

[0033] According to a second aspect of the present invention, a smart card is provided, the smart card comprising: a pre-laminated structure as the ones described above; an electronic module placed on the electronic module area.

[0034] This configuration is advantageous because it provides a simple and stable solution for connecting the electronic module to the electrical load and to the antenna for the smart card. According to a preferred embodiment of the second aspect of the present invention, a smart card is provided, wherein an electrical connection between the electronic module terminals and one or more pads of the electronic module is made by means of an electrical connection layer comprising an isotropic glue, a solder portion, and / or an Anisotropic Conductive Film (ACF) portion.

[0035] According to a preferred embodiment of the second aspect of the present invention, a smart card is provided, wherein the electronic module is a dual interface module for a smart card comprising a payment chip, such as an ISO module.

[0036] The advantage of this configuration is that the electronic module can operate both in contact mode and in contactless mode.

[0037] According to a preferred embodiment of the second aspect of the present invention, a smart card is provided, wherein the smart card further comprises a rectifier for rectifying a signal generated by the second antenna, and the rectifier is integrated into the electronic module.

[0038] The advantage of this configuration is that the smart card manufacturing is less complex, because the chip of the electronic module and the rectifier are integrated into a single electronic component. Moreover, production costs are reduced, because an additional PCB is not required and, accordingly, the number of components and of manufacturing steps are reduced.

[0039] According to a preferred embodiment of the second aspect of the present invention, a smart card is provided, wherein the rectifier comprises one or more diodes.

[0040] According to a preferred embodiment of the second aspect of the present invention, a smart card is provided, the smart card further comprising:

[0041] One or more printed layers comprising printed information attached to the pre-laminated structure;

[0042] One or more overlays attached to the one or more printed layers.

[0043] The advantage of this configuration is that the manufacturing process of the smart card is simplified.

[0044] Preferably, the smart card may be operated in contact mode and in contactless mode.

[0045] Preferably, the electrical load is a lighting element that can be used to illuminate a portion of the smart card, for instance a card logo, or to indicate an operating condition, such as a payment condition. According to third aspect of the present invention, a method for forming a pre-laminated structure for a smart card is provided, the method comprising the following steps: a) Providing a substrate for the pre-laminated structure; b) Forming, directly on the substrate, the following electronic components:

[0046] An electronic module area for placing an electronic module configured for performing a predefined operation of the smart card, for instance a payment operation, the electronic module area comprising a plurality of electronic module terminals for contacting the electronic module;

[0047] A first antenna, such as a payment antenna, configured for providing energy to the electronic module;

[0048] An electrical load area for placing an electrical load, for instance a lighting element, such as a LED, the electrical load area comprising a plurality of load area terminals for contacting the electrical load;

[0049] A second antenna, such as a harvesting antenna, configured for providing energy to the electrical load; c) Connecting each load area terminal to a corresponding electronic module terminal by means of a corresponding non-insulated connection wire.

[0050] According to a preferred embodiment, the wire structures, such as the wire meander portions, are made by ultrasonic wire embedding process.

[0051] According to a preferred embodiment of the third aspect of the present invention, a method is provided, further comprising the step d) of placing an electrical load on the electrical load area and connecting it to the load area terminals by means of a force fit direct galvanic contact, or an electrical connection layer comprising an isotropic glue, a solder portion, and / or an Anisotropic Conductive Film (ACF) portion.

[0052] These methods are advantageous because they enable forming a pre-laminated structure for a smart card with the advantages disclosed above.

[0053] According to a fourth aspect of the present invention, a method for forming a smart card is provided, the method comprising the following steps: e) Forming a pre-laminated structure according to one of the methods disclosed above; f) Placing an electronic module on the electronic module area: g) Providing an electronic connection between the electronic module and the electrical load; h) Providing an electronic connection between the electronic module and the first antenna, and between the electronic module and the second antenna.

[0054] According to a preferred embodiment of the fourth aspect of the present invention, a method is provided, wherein the electronic connection of the step g) is formed by means of a force fit direct galvanic contact, or an electrical connection layer (170) comprising an isotropic glue, a solder portion, and / or an Anisotropic Conductive Film (ACF) portion.

[0055] Preferably, the electrical connection between the electrical load and the wire meander terminals of the non-insulated wire in the load area is made by means of a force fit connection. Alternatively, the electrical connection between the electrical load and the wire meander terminals of the noninsulated wire in the load area may be made by means of isotropic glue, soldering, and / or an Anisotropic Conductive Film (ACF) portion.

[0056] Preferably, the electrical connection between the electronic module and the wire meander terminals of the non-insulated wire in the electronic module area is made by means of isotropic glue, soldering, and / or an ACF portion.

[0057] According to a preferred embodiment of the fourth aspect of the present invention, a method for forming a smart card is provided, the method further comprising the following steps:

[0058] Laminating one or more printed layers comprising printed information to the pre-laminated structure;

[0059] Laminating one or more overlays to one or more printed layers.

[0060] This method is advantageous because it enables forming a smart card with the advantages disclosed above.

[0061] Figures

[0062] Various illustrative embodiments and other advantageous of the various aspects will become apparent from the detailed description of the accompanying figures as presented below.

[0063] Fig. 1 schematically shows a top view of a smart card, in accordance with some illustrative embodiments of the present disclosure; Fig. 2A schematically shows an exploded view of a smart card, in accordance with some other illustrative embodiments of the present disclosure;

[0064] Fig. 2B schematically shows a top view of a smart card in the assembled state, in accordance with some other illustrative embodiments of the present disclosure;

[0065] Fig. 3 schematically shows a cross-section of a pre-laminated structure for a smart card, in accordance with some other illustrative embodiments of the present disclosure;

[0066] Fig. 4 schematically shows a cross-section of a smart card in accordance with some other illustrative embodiments of the present disclosure.

[0067] Detailed description

[0068] The present description is presented for purposes of illustration but is not intended to be exhaustive or limited to the disclosed embodiments. The scope of protection of the present disclosure is defined in the appended set of claims. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope of the disclosure. The embodiments were chosen and described in order to best explain the principles of the disclosure and the practical application, and to enable others of ordinary skill in the art to understand the disclosure for various embodiments with various modifications as are suited to the particular use contemplated. Finally, those fields considered known to the skilled person will not be described to avoid covering in a useless way the described invention.

[0069] In the present disclosure, it is to be understood that the terms “top”, “bottom”, “up”, “down”, “front”, “back”, etc., must be interpreted with reference to the enclosed set of figures. However, it is to be understood that, in the context of the present disclosure, there is no preferred orientation of the pre-laminated structure, the pre-laminated structure for a smart card and / or the smart card according to the embodiments described below.

[0070] In the following, the present invention is explained with reference to the enclosed figures.

[0071] Fig. 1 schematically shows a top view of a smart card 500, in accordance with some illustrative embodiments of the present invention.

[0072] The smart card 500 comprises a pre-laminated structure 200 and an electronic module 110.

[0073] The electronic module 110 may include a chip for performing a predefined operation of the smart card, for instance a payment operation. Preferably, the electronic module 110 is an ISO module, for instance an ISO 8 pin module. The electronic module 110 may have at least one I / O terminal (this means an input / output terminal for supplying electric signals and / or electrical energy to the module and / or receiving electric signals from the module). Preferably, the electronic module 110 comprises connection pads on the back side (not visible in Fig. 1 ). The electronic module 110 is powered up by means of a first antenna 120, such as a payment antenna.

[0074] The pre-laminated structure 200 comprises a substrate 210 made of a plastic material. For example, the substrate 210 may be made of a thermoplastic material, such as PVC, PC, PETG, or the like, a recycling plastic material, a plurality of layers of different plastic material, or natural fiber material, such as wood, or wood with a paper layer.

[0075] The present invention is based on the idea of forming the pre-laminated structure 200 in such a way that the electronic components for the smart card are directly formed on the substrate 210, without using an additional substrate comprising a PCB.

[0076] On the substrate 210, the first antenna 120 for powering up the electronic module 110 is formed.

[0077] Moreover, as schematically shown in Fig. 1 , a lighting element 130 with a lighting source 136 is formed on the substrate 210, for example an OLED, a LED array, a micro-LED paste based on Nth-Degree stamp technology. Alternatively, the lighting element 130 with a lighting source 136 may be formed in a partial recess (not shown) formed on the substrate 210, or on another layer (not shown) of the pre-laminated structure 200. The lighting element 130 may be used for lighting up a predefined area of the smartcard, for instance for illuminating a portion with a logo. Moreover, the lighting element 130 may be used as an indicator of a working condition of the smartcard, for instance an indicator of a successful transaction of a smartcard.

[0078] According to alternative configurations (not shown), the pre-laminated structure may comprise any other electrical load replacing the lighting element 130, such as batteries for active smartcards, loudspeakers (even ultrasonic), buzzers, pumps, actuators, like electric engines, electromagnets, piezoelectric devices (speakers or micro-vibration devices), heaters / coolers, or the like.

[0079] With continued reference to Fig. 1 , the lighting element 130 comprises a lighting source 136 and two connection pads 132 and 134 formed on a substrate, such as a PCB, or a PET foil containing the elements of the lighting source.

[0080] The lighting element 130 (or the electrical load) is powered up by means of a second antenna 140, such as a harvesting antenna.

[0081] With continued reference to Fig. 1 , the second antenna 140 is electrically connected to a rectifier 150 configured to convert the alternating signal, which is generated by the second antenna 140 after exposure to an alternating electro-magnetic field, into a direct signal, which can be transmitted to the lighting element 130 to power it up.

[0082] The rectifier 150 may comprise one or more diodes, for example a diode bridge. Alternatively, the rectifier 150 may be configured as one of the rectifying electronic circuits 100 disclosed in the International Patent Application PCT / IB2023 / 000086 by the same Applicant, whose content is herein entirely incorporated by reference.

[0083] According to the preferred configuration shown in Fig. 1 , the rectifier 150 is integrated into the electronic module 110, in order to reduce the number of distinct electronic components in the smart card 500.

[0084] It is to be understood that, even if in the present disclosure the first antenna 120 (e.g. payment antenna) and the second antenna 140 (e.g. harvesting antenna) are represented as being formed on the same side of the substrate 210 of the pre-laminated structure 200, they could also be formed on opposite sides of the substrate 210 of the pre-laminated structure 200, in order to minimize interference. Accordingly, the payment antenna 120 and the harvesting antenna 130 may have one of the configurations of the energy harvesting antenna 104 and the payment antenna 102 disclosed with reference to Figs. 1-6 of the International Patent Application PCT / IB2023 / 000026 by the same Applicant, whose content is herein entirely incorporated by reference.

[0085] Moreover, even if it is shown that the first antenna 120 (e.g. payment antenna) and the second antenna 140 (e.g. harvesting antenna) are formed on the substrate 210, they could also be formed on other layers of the pre-laminated structure 200 (not shown), for instance not on the same layer of the pre-laminated structure where the non-insulated connection wires 160A and 160B are formed.

[0086] Furthermore, even if it is shown that the first antenna 120 (e.g. payment antenna) and the second antenna 140 (e.g. harvesting antenna) are formed on the same layer, e.g. the substrate 210, they could also be independently arranged on different layers of the pre-laminated structure 200.

[0087] Moreover, it is to be understood that, even if in the present disclosure the first antenna 120 (e.g. payment antenna) is represented as surrounding the second antenna 140 (e.g. harvesting antenna), the electronic assembly 100 of the present invention may be also designed in such a way that the second antenna 140 surrounds the first antenna 120.

[0088] According to the present invention, the electrical connection between the electronic module 110 and the lighting element 130 is realized by means of non-insulated connection wires 160A and 160B, such as non-insulated metallic wires, for instance copper wires with a silver coating. Each connection wire 160A, 160B comprises connection terminals for connecting the connection pads of the lighting element 130 and of the electronic module 110.

[0089] Each connection wire 160A, 160B preferably comprises two wire meander portions (not shown in Fig. 1 ) forming connection terminals for connecting the connection pads of the lighting element 130 and of the electronic module 110.

[0090] The connection wires 160A and 160B, preferably having wire meander portions, replace the PCB substrate used in the pre-laminated structures known at the state of the art to connect the connection pads of the lighting element and of the electronic module. In this way, an electrical circuit connecting the electronic module 110 with the first antenna 120, the second antenna 140, the rectifier 150, and the lighting element 130 by means of the connection wires 160A, 160B is obtained. The pre-laminated structure 200 comprising such an electrical circuit may be integrated into a smart card for performing predefined operations, such as payment, as described in the following.

[0091] It is to be noted that, since the connection wires 160A, 160B are formed on an insulating substrate (i.e. the plastic substrate 210 of the pre-laminating structure 200), there is no need to insulate them from the external environment.

[0092] Preferably, each connection wire 160A, 160B has a diameter of 112 pm.

[0093] The configuration of the connection wires 160A, 160B with the wire meander portions 162, 164, 166A, and 166B is schematically shown in Figs. 2A and 2B.

[0094] Fig. 2A represents an exploded view of a smart card 500 comprising the electronic module 110, the lighting device 130 and the pre-laminated structure 200, wherein the arrows schematically indicate how the electronic components (i.e. the electronic module 110 and the lighting device 130) are assembled on the substrate 210 of the pre-laminated structure 200. Fig. 2B represents a top view of a smart card 500 comprising an electronic module 110 and a pre-laminated structure 200 according to the present invention, the layout being obtained in accordance with an x-ray imaging of the pre-laminated structure 200.

[0095] As visible in Fig. 2A, in correspondence with a region of the pre-laminated structure 200 where the lighting device 130 will be placed, an electrical load area 161 is formed. In the electrical load area 161 , the connection wires 160A, and 160B are bent so as to form two meander portions 162, and 164. Each meander portion 162, 164 comprises a plurality of turning portions of the corresponding connection wire 160A, 160B. Each meander portion 162, 164 will form a connection terminal for connecting a corresponding connection pad formed on the lighting device 130, in order to establish an electronic connection. The electronic connection between the wire meander portions 162, 164 and the corresponding connection pads 132, 134 of the lighting element 130 may be formed by means of a force fit direct galvanic contact, or by means of an isotropic glue, an ACF portion, or soldering.

[0096] According to an illustrative and non-limiting embodiment, the wire meander portions 162, 164 may have a wire pad design as illustrated in one of Figs. 2 to 6 of the International Patent Application PCT / IB2021 / 000828 by the same Applicant, whose content is herein entirely incorporated by reference.

[0097] Moreover, as visible in Fig. 2A, in correspondence with a region of the pre-laminated structure 200 where the electronic module 110 will be placed, an electronic module area 165 is formed. In the electronic module area 165, the connection wires 160A, 160B are bent so as to form two wire meander portions 166A, and 166B. Each meander portion 166A and 166B comprises a plurality of turning portions of the corresponding connection wire 160A and 160B.

[0098] Moreover, as visible in Fig. 2A, in correspondence with the electronic module area 165, the wire 120 forming the first antenna, or payment antenna, is bent so as to form two wire meander portions 166E and 166CF. Each meander portion 166E and 166F comprises a plurality of turning portions of the first antenna wire 120.

[0099] Furthermore, as visible in Fig. 2A, in correspondence with the electronic module area 165, the wire 140 forming the second antenna, or harvesting antenna, is bent so as to form two wire meander portions 166D and 166D. Each meander portion 166C and 166D comprises a plurality of turning portions of the second antenna wire 140.

[0100] It is to be understood that, even if six meander portions 166A-166F are shown in the electronic module area 165 of Fig. 2A, they are not limited to this number, but they could be one, two, three, four, five, seven, or more. The number of wire meander portions formed in correspondence with the region for placing the electronic module depends on the number of contacts formed on the electronic module.

[0101] Each meander portion 166A to 166F will form a connection terminal for connecting a corresponding connection pad 110A to 166F formed on the electronic module 110, in order to establish an electronic connection. The electronic connection between the wire meander portions 166A to 166F and the corresponding connection pads 110A to 110F of the electronic module 110 may be formed by means of an ACF portion, an isotropic adhesive, or soldering. According to an illustrative and non-limiting embodiment, the electrical connection between the wire meander portions 166A, 166F of the non-insulated connection wires 160A and 160B, and the electronic module 110 may have a configuration similar to the electrical connection between the connection pads 210 and 220 formed by wire portions 211 and turning portions 213 and the module disclosed in the International Patent Application published as WO 2023 / 026071 A1 by the same Applicant, whose content is herein entirely incorporated by reference (see for example figure 9).

[0102] Fig. 2B schematically illustrates the smart card 500 of Fig. 2A in the assembled configuration.

[0103] In the schematic configuration of Fig. 2B, it is possible to see that the connection pads 110A and 110B of the electronic module 110 overlap the corresponding connection terminals 166A and 166B of the connection wires 160A, 160B for establishing an electronic connection with the lighting element 130.

[0104] Moreover, the connection pads 110C and 110D of the electronic module 110 overlap the corresponding connection terminals 166C and 166B of the second antenna wire 140 for establishing an electronic connection with the second antenna 140. Since the rectifier 150 is integrated into the electronic module 110, an electrical connection between the rectifier 150 and the second antenna 140 is also established. Accordingly, the alternating signal generated by the second antenna 140 is rectified by means of the rectifier 150 before reaching the lighting element 130.

[0105] Finally, the connection pads 110E and 11 OF of the electronic module 110 overlap the corresponding connection terminals 166E and 166F of the first antenna wire 120 for establishing an electronic connection with the first antenna 120.

[0106] The electrical connection between the connection pads 110A to 11 OF of the electronic module 110 and the corresponding connection terminals 166A and 166A of the electronic module area 165 may be made by means of isotropic glue, soldering, and / or ACF.

[0107] In the configurations shown in Figs. 120A and 120B, the first antenna 120 and the second antenna 140 are represented as crossing each other in correspondence of the symmetry line S. It is to be understood that this configuration is not limiting the present invention. According to an alternative configuration, the payment antenna 120 may surround the harvesting antenna 140, as shown in Fig. 1. According to another alternative configuration (not shown), the harvesting antenna 140 may surround the payment antenna 120. A cavity (not visible in Fig. 2B) is preferably formed to accommodate the electronic module 110 into the smart card 500. The person skilled in the art will appreciate that the dimensions of the cavity will depend on the electronic module 110 to be integrated into the smart card 500. For instance, if the electronic module 110 is an ISO 8 pin module, the cavity will have dimensions configured to accommodate such an ISO module.

[0108] Fig. 3 schematically shows a cross-section of the pre-laminated structure 200 along the axis A-A shown in Fig. 2B. Accordingly, Fig. 3 schematically represents a portion of the electrical load area 161 with the electrical connection between the connection pad 132 of the lighting element 130 and the wire meander portions 162 of the connection wire 160B. The lighting element 130 and the connection wire 160B are formed on the substrate 210.

[0109] In the configuration of Fig. 3, a connection layer 170 is placed between the lighting element 130 and the non-insulated wire 160B in order to establish the electrical connection.

[0110] The connection layer 170 may comprise for instance an isotropic glue, a solder portion, and / or an Anisotropic Conductive Film (ACF) portion

[0111] According to other illustrative configurations (not shown), the electrical connection between the connection pads 132, 134 of the lighting element 130 and the wire meander portions 162, 164 of the connection wires 160A, 160B may be simply made by means of a force fit galvanic contact, and the connection layer 170 may not be present.

[0112] Preferably, the pre-laminated structure 200 has a thickness T comprised in the range between 350 pm and 500 pm, preferably between 400 pm and 450 pm, even more preferably equal to 420 pm.

[0113] Fig. 4 schematically illustrates a cross-section of a smartcard 500 according to an embodiment of the present invention, along the axis A-A of Fig. 2B.

[0114] Preferably, the smart card 500 is a dual-interface smart card which is configured for operating both in contact mode and in contactless mode.

[0115] The smart card 500 of Fig. 4 comprises the pre-laminated structure 200, which includes the electronic components formed on the substrate 210. The substrate 210 may be laminated to additional layers 212, 214 to form a final pre-laminated structure 200.

[0116] With continued reference to Fig. 4, the smart card 500 further includes a top printed layer 502, including a translucent foil with printed elements, and a bottom printed layer 504, including a colored foil, for instance a white foil, with printed elements. The printed layers 502, 504 are directly laminated to the pre-laminated structure 200. Furthermore, the smart card 500 includes a top overlay 506 laminated to the top printed layer 502, and a bottom overlay 508 laminated to the bottom printed layer 504.

[0117] It is to be understood that, even if Fig. 4 schematically shows one top printed layer 502 and one bottom printed layer 504 laminated to the pre-laminated structure 200, their number is not limited thereto, but there could be two, three, four or more top printed layers and / or two, three, four or more bottom printed layers.

[0118] According to a preferred configuration of the present invention, the process for manufacturing the smart card 500 comprises providing a substrate 210 for a pre-laminated structure 200 for a smart card and forming thereon the following electronic components for the smart card: the first antenna 120, the connection wires 160A, 160B forming the meander wire portions 162, 164, 166A, and 166B, the lighting element 130, and the second antenna 140. The lighting element 130 is advantageously mounted on the substrate 210 so that the connection pads 132 and 134 of the lighting element 130 overlap with the corresponding meander wire portions 162, 164 of the connection wires 160A, 160B. Preferably, one or more additional layers 212, 214 may be added to the substrate 210 to form the pre-laminated structure 200.

[0119] As a further manufacturing step, the printed layers 502, 504 and the overlays 506, 508 are laminated to the pre-laminated structure 200 for forming the card-body. Generally, during the manufacturing process, the pre-laminated structure 200, the printed layers 502, 504, and the overlays 506, 508 are in the form of sheets of material. Therefore, it is necessary to punch out the single cards from the laminated sheets to obtain the card-body.

[0120] Finally, a cavity may be milled in the card-body for accommodating the electronic module 110 incorporating the rectifier 150. The cavity is advantageously provided in the card-body in correspondence with the electronic module area 165, so that the connection pads 110A and 110B of the electronic module 110 are brought into electrical contact with the corresponding meander wire portions 166A and 166B of the connection wires 160A and 160B.

[0121] REFERENCE NUMBERS

[0122] 110: electronic module

[0123] 110A, 110B, 110C, 110D, 110E, 110F: pads of the electronic module

[0124] 120: payment antenna

[0125] 130: lighting element , 134: pads of the lighting element : lighting source : harvesting antenna : rectifier A, 160B: connection wires : electrical load area , 164: wire meander portions for lighting elements : electronic module area A, 166B, 166C, 166D, 166E, 166F: wire meander portions for electronic module: electrical connection layer : pre-laminated structure : substrate of pre-laminated structure , 214: additional layers of pre-laminated structure : smart card , 504: printed layers of smart card , 508: overlays of smart card

Claims

CLAIMS1. A pre-laminated structure (200) for a smart card (500), said pre-laminated structure (200) comprising the following electronic components:An electronic module area (165) for placing an electronic module (110) configured for performing a predefined operation of said smart card (500), for instance a payment operation, said electronic module area (165) comprising a plurality of electronic module terminals (166A, 166B, 166C, 166D, 166E, 166F) for contacting said electronic module (110);A first antenna (120), such as a payment antenna, configured for providing energy to said electronic module (110);An electrical load area (161 ) for placing an electrical load, for instance a lighting element (130), such as a Light Emitting Diode (LED), said electrical load area (161 ) comprising a plurality of load area terminals (162, 164) for contacting said electrical load;A second antenna (140), such as a harvesting antenna, configured for providing energy to said electrical load; said pre-laminated structure (200) further comprising a pre-laminated substrate (210), wherein said electronic components are directly formed on said pre-laminated substrate (210), and wherein each of said load area terminals (162, 164) is electrically connected to a corresponding electronic module terminal (166A, 166B) by means of a corresponding noninsulated connection wire (160A, 160B).

2. The pre-laminated structure (200) of claim 1 , wherein each of said load area terminals (162, 164) is formed by a wire meander portion (162, 164) of said connection wire (160A, 160B) and is configured to be connected to one or more pads (132, 134) of said electrical load.

3. The pre-laminated structure (200) of claim 1 or 2, wherein each of said electronic module terminals (166A, 166B) is formed by a wire meander portion (166A, 166B) of said connection wire (160A, 160B) and is configured to be connected to one or more pads (110A, 110B) of said electronic module (110).

4. The pre-laminated structure (200) of any of previous claims, wherein said non-insulated connection wire (160A, 160B) is a metallic wire, such as a copper wire with a silver coating.

5. The pre-laminated structure (200) of any of previous claims, wherein said pre-laminated structure (200) does not comprise any Printed Circuit Board (PCB) substrate for mounting said electronic components.

6. The pre-laminated structure (200) of any of previous claims, further comprising said electrical load, for instance a lighting element (130), such as a Light Emitting Diode (LED), placed on said electrical load area (161 ).

7. The pre-laminated structure (200) of claim 6, wherein an electrical connection between said load area terminals (162, 164) and one or more pads (132, 134) of said electrical load is made by means of a force fit direct galvanic contact, or by means of an electrical connection layer (170) comprising an isotropic glue, a solder portion, and / or an Anisotropic Conductive Film (ACF) portion.

8. A smart card (500) comprising: the pre-laminated structure (200) of any of the previous claims; an electronic module (110) placed on said electronic module area (165).

9. The smart card (500) of claim 8, wherein an electrical connection between said electronic module terminals (166A, 166B) and one or more pads (110A, 110B) of said electronic module (110) is made by means of an electrical connection layer (170) comprising an isotropic glue, a solder portion, and / or an Anisotropic Conductive Film (ACF) portion.

10. The smart card (500) of claim 8 or 9, wherein said electronic module (110) is a dual interface module for a smart card comprising a payment chip, such as an ISO module.11 . The smart card (500) of any of claims 8 to 10, further comprising a rectifier (150) for rectifying a signal generated by said second antenna (140), wherein said rectifier (150) is integrated into said electronic module (110).

12. The smart card (500) of claim 11 , wherein said rectifier (150) comprises one or more diodes.

13. The smart card (500) of any of claims 8 to 12, further comprising:One or more printed layers (502, 504) comprising printed information attached to said prelaminated structure (200);One or more overlays (506, 508) attached to said one or more printed layers.

14. A method for forming a pre-laminated structure (200) for a smart card (500) comprising the following steps: a) Providing a substrate (210) for the pre-laminated structure (200); b) Forming, directly on said substrate (210), the following electronic components:An electronic module area (165) for placing an electronic module (110) configured for performing a predefined operation of said smart card (500), for instance a payment operation, said electronic module area (165) comprising a plurality of electronic module terminals (166A, 166B, 166C, 166D, 166E, 166F) for contacting said electronic module (110);A first antenna (120), such as a payment antenna, configured for providing energy to said electronic module (110);An electrical load area (161 ) for placing an electrical load, for instance a lighting element (130), such as a Light Emitting Diode (LED), said electrical load area (161 ) comprising a plurality of load area terminals (162, 164) for contacting said electrical load;A second antenna (140), such as a harvesting antenna, configured for providing energy to said electrical load; c) Connecting each of said load area terminals (162, 164) to a corresponding electronic module terminal (166A, 166B) by means of a corresponding non-insulated connection wire (160A, 160B).

15. The method of claim 14, further comprising the following step: d) Placing an electrical load on said electrical load area (161 ) and connecting it to said load area terminals (162, 164) by means of a force fit direct galvanic contact, or an electrical connection layer (170) comprising an isotropic glue, a solder portion, and / or an Anisotropic Conductive Film (ACF) portion.

16. A method for forming a smart card (500) comprising the following steps: a) Forming a pre-laminated structure (200) according to a method of claim 14 or 15; b) Placing an electronic module (110) on said electronic module area (165) and providing the electronic connections between said electronic module (110) and said electricalload, between said electronic module (110) and said first antenna (120), and between said electronic module (110) and said second antenna (140).

17. The method of claim 16, wherein one or more of said electronic connections is formed by means of a force fit direct galvanic contact, or an electrical connection layer (170) comprising an isotropic glue, a solder portion, and / or an Anisotropic Conductive Film (ACF) portion.

18. The method of any of claims 14 to 17 further comprising the following steps:Laminating one or more printed layers (502, 504) comprising printed information to said pre-laminated structure (200);Laminating one or more overlays (506, 508) to said one or more printed layers.

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