Electronic circuit module and electronic device

Abstract

The present invention simplifies wiring in an electronic circuit module having an antenna or miniaturizes the electronic circuit module. This electronic circuit module according to one embodiment of the present invention includes: a first substrate having a first end that is a starting end in a first direction and a second end that is a terminal end on a side opposite to the first end in the first direction in a plan view; a semiconductor sealing material that overlaps the first substrate in the plan view; a first antenna, a second antenna and a third antenna positioned along the first direction and arranged in this order facing from the first end to the second end, and positioned on the first substrate in the plan view; an IC chip having a first communication unit, a second communication unit, and a third communication unit, and positioned inside the semiconductor sealing material; and a first wiring, a second wiring, and a third wiring, where in the plan view, the second communication unit is positioned more to the first end side than the first communication unit, or is positioned more to the second end side than the third communication unit.

Description

Electronic circuit modules, electronic devices

[0001] This disclosure relates to an electronic circuit module and an electronic device including the electronic circuit module. This application claims priority to Japanese Patent Application No. 2023-215009, filed on December 20, 2023, the contents of which are incorporated herein by reference.

[0002] Patent document 1 describes an antenna whose characteristics are improved by making the wiring lengths between each feeding point of the antenna element and the communication section of the integrated circuit approximately the same, thereby reducing differences in parameters such as impedance including parasitic components among multiple wirings.

[0003] Japanese Patent Application Laid-Open No. 2021-5795

[0004] In a device equipped with the antenna described in Patent Document 1, in order to make the wiring lengths of the multiple wirings in the antenna approximately the same, it is necessary to appropriately route at least some of the wiring on the substrate and adjust the wiring length of each wiring. As a result, in the device, the wiring on the antenna substrate may become complicated or the formation of the wiring may become difficult. Alternatively, in the device, it is necessary to secure an area on the substrate for routing the wiring, which may result in an increase in the size of the antenna and, ultimately, the device.

[0005] An electronic circuit module according to one aspect of the present disclosure comprises: a first substrate having, in a planar view, a first end that is a starting end in a first direction and a second end that is an end end on the opposite side from the first end in the first direction; a semiconductor encapsulant that overlaps the first substrate in a planar view; a first antenna, a second antenna, and a third antenna that are arranged in this order from the first end to the second end along the first direction in a planar view and are located on the first substrate; an IC chip that has a first communication unit, a second communication unit, and a third communication unit and is located within the semiconductor encapsulant; a first wiring that connects the first antenna and the first communication unit, a second wiring that connects the second antenna and the second communication unit, and a third wiring that connects the third antenna and the third communication unit; and the second communication unit is located closer to the first end than the first communication unit or closer to the second end than the third communication unit in a planar view.

[0006] According to one aspect of the present disclosure, in an electronic circuit module that transmits and / or receives electromagnetic waves, the influence of the wiring connecting the antenna and the IC chip on the transmission and reception of electromagnetic waves is reduced, while the routing of the wiring is simplified or the substrate is made smaller.

[0007] 1 is a schematic plan view of an electronic circuit module according to embodiment 1. FIG. 2 is a schematic view of an electronic device according to embodiment 1. FIG. 3 is a schematic side cross-sectional view of the electronic circuit module according to embodiment 1. FIG. 4 is a schematic plan view of a first substrate according to embodiment 1. FIG. 5 is a schematic plan view of a semiconductor encapsulation material according to embodiment 1. FIG. 6 is a schematic plan view of an electronic circuit module according to a comparative embodiment. FIG. 7 is a schematic plan view of a semiconductor encapsulation material according to embodiment 2. FIG. 8 is a schematic plan view of an electronic circuit module according to embodiment 2. FIG. 9 is a schematic plan view of an electronic circuit module according to another comparative embodiment. FIG. 10 is a schematic plan view of a first substrate according to embodiment 3. FIG. 11 is a schematic plan view of a semiconductor encapsulation material according to embodiment 3. FIG. 12 is a schematic plan view of an electronic circuit module according to embodiment 3. FIG. 13 is a schematic plan view of a semiconductor encapsulation material according to embodiment 4. FIG. 14 is a schematic plan view of an electronic circuit module according to embodiment 4. FIG. 15 is a schematic plan view of a semiconductor encapsulation material according to embodiment 5. FIG. 16 is a schematic side cross-sectional view of an electronic circuit module according to embodiment 6. FIG. 17 is a schematic plan view of a second substrate according to embodiment 6.

[0008] [Embodiment 1] <Electronic Device> An embodiment of the present disclosure will now be described in detail. Fig. 2 is a schematic diagram of an electronic device according to this embodiment. The electronic device 1 according to this embodiment includes a device body 2, an electronic circuit module 3, and a flexible printed circuit board 4.

[0009] The electronic device 1 is a device that performs at least one of emitting electromagnetic waves from the electronic circuit module 3 based on processing in the device main body 2, and transmitting a signal corresponding to the electromagnetic waves received in the electronic circuit module 3 to the device main body 2.

[0010] The electronic device 1 may be, for example, a device that transmits and receives electromagnetic waves, such as a smartphone, a tablet terminal, or a router.The electronic device 1 may also be a device that only receives electromagnetic waves, such as a radio or beacon receiver.Furthermore, the electronic device 1 may also be a device that only transmits electromagnetic waves, such as a GPS transmitter or a beacon transmitter.

[0011] The device main body 2 includes main components for realizing the functions of the electronic device 1, and may include, for example, a processor, a memory, an operation unit, a display unit, etc. In particular, the device main body 2 may perform processing for generating a signal corresponding to the electromagnetic waves transmitted by the electronic circuit module 3, or processing a signal corresponding to the electromagnetic waves received by the electronic circuit module 3.

[0012] The electronic circuit module 3 transmits and / or receives electromagnetic waves using a method described below. For example, the electronic circuit module 3 may generate and transmit electromagnetic waves based on a signal from the device body 2, or may transmit a signal corresponding to the received electromagnetic waves to the device body 2.

[0013] The flexible printed circuit board 4 is a flexible circuit board that mediates transmission and reception of signals between the device body 2 and the electronic circuit module 3. The electronic device 1 may include various circuit boards, including conventionally known circuit boards, instead of the flexible printed circuit board 4, as long as the circuit board mediates signals between the two components to be connected.

[0014] <Electronic Circuit Module: Overview> The details of the electronic circuit module 3 according to this embodiment will be described in more detail with reference to FIG. 3 . FIG. 3 is a schematic side cross-sectional view of the electronic circuit module 3. The schematic side cross-sectional views of the electronic circuit module 3 of the present disclosure, including FIG. 3 , also illustrate a portion of the flexible printed circuit board 4 connected to the electronic circuit module 3. In this disclosure, the direction from the laminate substrate 10 (described later) to the semiconductor encapsulation material 3S is defined as the downward direction, and the direction opposite to this downward direction is defined as the upward direction. Furthermore, the schematic side cross-sectional views of the electronic circuit module 3 of the present disclosure illustrate the side cross-section of the electronic circuit module 3 in a direction perpendicular to the top surface of the laminate substrate 10 or the semiconductor encapsulation material 3S. Furthermore, in this disclosure, the term "plan view" refers to a view of the electronic circuit module 3 from above the electronic circuit module 3, in the direction toward the laminate substrate 10 or the semiconductor encapsulation material 3S. Note that the schematic side cross-sectional views of the electronic circuit module 3 of the present disclosure may show components in front of the components more clearly, with the components shown through the perspective, in order to more clearly illustrate the components of the electronic circuit module 3.

[0015] <Electronic Circuit Module: First Substrate> As shown in Fig. 3, the electronic circuit module 3 includes a laminated substrate 10. The laminated substrate 10 includes a plurality of substrates stacked one on top of the other, and in particular includes a first substrate 11 shown in Fig. 3. The first substrate 11 and the components formed on the first substrate 11 will be described in more detail with reference to Fig. 4. Fig. 4 is a schematic diagram of the first substrate 11 in a plan view.

[0016] The first substrate 11 is a substrate having, for example, a rectangular shape in a plan view. In this embodiment, the direction along the longitudinal direction of the first substrate 11 in a plan view is referred to as a first direction D1, and the direction along the lateral direction of the first substrate 11 is referred to as a second direction D2. Therefore, the second direction D2 is perpendicular to the first direction D1. Furthermore, the first substrate 11 has, as end portions in a plan view, a first end 11A which is a starting end in the first direction D1 and a second end 11B which is a terminal end on the opposite side of the first end 11A in the first direction D1. Furthermore, the first substrate 11 has, as end portions in a plan view, a third end 11C which is a starting end in the second direction D2 and a fourth end 11D which is a terminal end on the opposite side of the third end 11C in the second direction D2.

[0017] In the schematic plan views of the first substrate 11 in the present disclosure, including FIG. 4 , a central position C1 located at the center of the first substrate 11 in the first direction D1 is indicated by a two-dot chain line. In other words, the central position C1 is a position that passes through the midpoint between the first end 11A and the second end 11B in the plan view. In the schematic plan views of the first substrate 11 in the present disclosure, a central position C2 located at the center of the first substrate 11 in the second direction D2 is indicated by a two-dot chain line. In other words, the central position C2 is a position that passes through the midpoint between the third end 11C and the fourth end 11D in the plan view.

[0018] The electronic circuit module 3 includes at least three antennas on the first substrate 11. In particular, the electronic circuit module 3 according to this embodiment includes a first antenna 21, a second antenna 22, a third antenna 23, and a fourth antenna 24 on the first substrate 11. The first antenna 21, the second antenna 22, the third antenna 23, and the fourth antenna 24 have a first feed point 31, a second feed point 32, a third feed point 33, and a fourth feed point 34, respectively.

[0019] Each antenna included in the electronic circuit module 3 transmits a signal corresponding to the received electromagnetic wave to a wiring (described below) connected to a feed point, and transmits an electromagnetic wave corresponding to the signal transmitted to the feed point via the wiring. Each antenna may receive and transmit electromagnetic waves having linear polarization, including at least one of V polarization and H polarization. However, without being limited to this, each antenna may transmit and receive electromagnetic waves having polarization other than linear polarization, such as circular polarization.

[0020] In particular, the electronic circuit module 3 includes a first antenna 21, a second antenna 22, a third antenna 23, and a fourth antenna 24 arranged in this order from the first end 11A to the second end 11B on the first substrate 11 along a first direction D1 in a plan view. Therefore, the first antenna 21 is located closer to the first end 11A than the second antenna 22, and the fourth antenna 24 is located closer to the second end 11B than the third antenna 23.

[0021] The first feed point 31, the second feed point 32, the third feed point 33, and the fourth feed point 34 are also arranged in this order from the first end 11A to the second end 11B in a plan view. In particular, the first feed point 31, the second feed point 32, the third feed point 33, and the fourth feed point 34 are located at a central position C2 in a plan view.

[0022] 3 , the electronic circuit module 3 includes a module-side connector 3C as a connector, a communication IC chip 40 as an IC chip, and a power supply IC chip 3P, for example, on the side of the laminated substrate 10 opposite the first substrate 11. For example, the module-side connector 3C, the communication IC chip 40 as an IC chip, and the power supply IC chip 3P may be formed on the lower surface of the laminated substrate 10.

[0023] The electronic circuit module 3 further includes a semiconductor encapsulant 3S. The semiconductor encapsulant 3S encapsulates at least the communication IC chip 40 and the power supply IC chip 3P in the laminated substrate 10. Therefore, it can be said that the communication IC chip 40 and the power supply IC chip 3P are located within the semiconductor encapsulant 3S, and that the semiconductor encapsulant 3S overlaps with the first substrate 11 in a plan view. The semiconductor encapsulant 3S may include, for example, a molding resin.

[0024] The semiconductor encapsulant 3S and the components located within the semiconductor encapsulant 3S will be described in more detail with reference to FIG. 5 . FIG. 5 is a schematic diagram of the semiconductor encapsulant 3S in a plan view. The schematic plan views of the semiconductor encapsulant 3S in the present disclosure, including FIG. 5 , show components located above the semiconductor encapsulant 3S in a see-through manner. The schematic plan views of the semiconductor encapsulant 3S in the present disclosure also show the outline of the first substrate 11 with dotted lines, as well as the module-side connector 3C located closer to the flexible printed circuit board 4 than the semiconductor encapsulant 3S in the plan view. However, for simplicity, the power supply IC chip 3P is omitted from the schematic plan views of the semiconductor encapsulant 3S in the present disclosure. The schematic plan views of the semiconductor encapsulant 3S in the present disclosure also show, with dashed lines, a central position C1 located at the center of the first substrate 11 in the first direction D1 and a central position C2 located at the center of the first substrate 11 in the second direction D2.

[0025] The module-side connector 3C connects to, for example, a main body-side connector 2C formed on a flexible printed circuit board 4. The module-side connector 3C may include, for example, a plurality of terminals 3CT that connect to terminals of the main body-side connector 2C. The electronic circuit module 3 transmits signals to the flexible printed circuit board 4 via the module-side connector 3C and the main body-side connector 2C, and further transmits signals to the device main body 2. The module-side connector 3C and the main body-side connector 2C are not limited to connectors that fit together, and may be joined to each other by joining solder plating, solder bumps, copper pillars, or other substrate joining materials.

[0026] The communication IC chip 40 may be formed at a position where the center in the first direction D1 substantially coincides with the center in the first direction D1 of the first substrate 11. In other words, in a plan view, the center in the first direction D1 of the communication IC chip 40 may substantially coincide with the central position C1. In the present disclosure, "the positions of the two members substantially coincide" does not necessarily mean that the positions of the two members completely coincide, and for example, the positions of the two members may differ within the range of manufacturing tolerance.

[0027] The communication IC chip 40 has a first communication unit 41, a second communication unit 42, a third communication unit 43, a fourth communication unit 44, and a connector communication unit 49. The first communication unit 41, the second communication unit 42, the third communication unit 43, and the fourth communication unit 44 are located closer to the third end 11C than the center position C2 in a plan view, for example.

[0028] In the present embodiment, the second communication unit 42 is located closer to the first end 11A than the first communication unit 41 in a plan view. Furthermore, the third communication unit 43 is located closer to the second end 11B than the fourth communication unit 44 in a plan view. Therefore, on the communication IC chip 40, the second communication unit 42, the first communication unit 41, the fourth communication unit 44, and the third communication unit 43 are arranged in this order from the first end 11A to the second end 11B along the first direction D1 in a plan view. The connector communication unit 49 is located, for example, on the module-side connector 3C side of the IC chip 40 in a plan view, and is connected to one of the terminals 3CT of the module-side connector 3C via connector wiring 59.

[0029] 3 , the electronic circuit module 3 includes a first wiring 51, a second wiring 52, a third wiring 53, and a fourth wiring 54. The first wiring 51, the second wiring 52, the third wiring 53, and the fourth wiring 54 are formed to penetrate contact holes formed in the laminated substrate 10 including the first substrate 11.

[0030] The first wiring 51 connects the first feed point 31 of the first antenna 21 and the first communication unit 41 of the communication IC chip 40. The second wiring 52 connects the second feed point 32 of the second antenna 22 and the second communication unit 42 of the communication IC chip 40. The third wiring 53 connects the third feed point 33 of the third antenna 23 and the third communication unit 43 of the communication IC chip 40. The fourth wiring 54 connects the fourth feed point 34 of the fourth antenna 24 and the fourth communication unit 44 of the communication IC chip 40.

[0031] The wiring connecting each antenna on the first substrate 11 and each communication unit of the communication IC chip 40 will be described in further detail with reference to Fig. 1. Fig. 1 is a schematic plan view of the electronic circuit module 3, or in other words, a schematic diagram of the electronic circuit module 3 in a plan view. In the schematic plan views of the electronic circuit module 3 in the present disclosure, including Fig. 1, the wiring connecting each antenna on the first substrate 11 and each communication unit of the communication IC chip 40 is shown with solid lines. Meanwhile, in the schematic plan views of the electronic circuit module 3 in the present disclosure, the outlines of the communication IC chip 40 and the module-side connector 3C are shown with dotted lines, and the outlines of the components on the first substrate 11, including each antenna, are shown with dashed lines.

[0032] As shown in Fig. 1, in order to connect each antenna on the first substrate 11 to each communication unit of the communication IC chip 40, each wire is routed within the laminated substrate 10. In particular, all wires connecting the antennas and communication units are routed in a routing region 50E located on one of the substrates of the laminated substrate 10 as shown in Fig. 3. The routing region 50E, as shown by the dashed dotted line in Fig. 1, indicates an area in which each wire can be routed between each feed point of the antenna on the first substrate 11 and each communication unit of the communication IC chip 40 in the first direction D1 and the second direction D2 in a plan view of the laminated substrate 10. All of the wires routed in the routing region 50E are located on the same substrate of the laminated substrate 10, and therefore need to be routed without crossing each other. As shown in FIG. 3, a routing area in which wiring connecting each communication section of the communication IC chip 40, the power supply IC chip 3P, and the module side connector 3C is routed may be formed on any of the substrates of the laminated substrate 10, separate from the routing area 50E.

[0033] Here, from the viewpoint of reducing the influence of the resistance value of each wiring or parasitic components including inductance components or capacitance components on the characteristics of the electronic circuit module 3, it is conceivable to reduce the difference in wiring length in a plan view among the multiple wirings. For this reason, each wiring between each antenna on the first substrate 11 and each communication unit of the communication IC chip 40 may be routed longer than the shortest route.

[0034] From the above viewpoint, the difference in wiring length between the first wiring 51 and the second wiring 52 in a plan view may be 1 / 20 or less of the wavelength of the transmission wave of the electronic circuit module 3. Furthermore, the difference in wiring length between the third wiring 53 and the fourth wiring 54 in a plan view may be 1 / 20 or less of the wavelength of the transmission wave of the electronic circuit module 3.

[0035] In addition, in a plan view, the first wiring 51, the second wiring 52, the third wiring 53, and the fourth wiring 54 are each drawn out toward the third end 11C from the first communication unit 41, the second communication unit 42, the third communication unit 43, and the fourth communication unit 44, respectively. With the above configuration, it is possible to more efficiently draw out the wiring from each communication unit located closer to the third end 11C than the central position C2.

[0036] <Electronic Circuit Module According to Comparative Embodiment> The effects of the electronic circuit module 3 according to this embodiment will be described by comparing it with an electronic circuit module according to a comparative embodiment with reference to Fig. 6. Fig. 6 is a schematic plan view of the electronic circuit module 3A according to the comparative embodiment, in other words, Fig. 6 is a schematic view of the electronic circuit module 3A in a plan view.

[0037] The electronic circuit module 3A according to the comparative embodiment differs from the electronic circuit module 3 according to the present embodiment in the order in which the multiple communication units are arranged in the direction from the first end 11A to the second end 11B. In particular, in the comparative embodiment, the first communication unit 41, the second communication unit 42, the third communication unit 43, and the fourth communication unit 44 are arranged in this order from the first end 11A to the second end 11B on the communication IC chip 40 along the first direction D1 in a plan view. Except for the above, the electronic circuit module 3A according to the comparative embodiment has the same configuration as the electronic circuit module 3 according to the present embodiment.

[0038] Generally, when connecting each of a plurality of power supply points and each of a plurality of communication units by wiring, it is considered to shorten the distance between the power supply points and the communication units connected by one wiring in order to simplify the routing of the wiring and reduce the size of the electronic circuit module. Therefore, from the above viewpoint, it is considered to make the arrangement order of the antennas on the first substrate 11 and the arrangement order of the communication units of the communication IC chip 40 the same as in the electronic circuit module 3A of the comparative embodiment.

[0039] On the other hand, when reducing the difference in wiring length in a planar view for multiple wirings, for example, wiring connecting a power supply point and a communication unit that are close to each other requires a larger area for routing the wiring than wiring connecting other power supply points and communication units.

[0040] In the comparative example, the distance between the second feeding point 32 and the second communication unit 42 is shorter in plan view than the distance between the first feeding point 31 and the first communication unit 41. Therefore, in the comparative example, the routing of the second wiring 52 may be more complex than the first wiring 51. Also, in the comparative example, the distance between the third feeding point 33 and the third communication unit 43 is shorter in plan view than the distance between the fourth feeding point 34 and the fourth communication unit 44. Therefore, in the comparative example, the routing of the third wiring 53 may be more complex than the fourth wiring 54.

[0041] In particular, in the comparative example, the distance between the second feeding point 32 and the second communication unit 42 is extremely short in plan view, so that it may be necessary to route a portion of the second wiring 52 from the center position C2 to the fourth end 11D side in plan view, which complicates the wiring including the second wiring 52 in the electronic circuit module 3A according to the comparative example.

[0042] Furthermore, for example, in the electronic circuit module 3A according to the comparative example, suppose that all of the wiring from each communication unit is drawn out toward the third end 11C in a plan view. In this case, in a plan view, the second wiring 52 needs to be routed so as to pass outside the first wiring 51, and the third wiring 53 needs to be routed so as to pass outside the fourth wiring 54. In this case, the electronic circuit module 3A needs to expand the routing region 50E in a plan view of the laminated substrate 10, which is shown by the dashed dotted line in FIG. 6, and therefore the first substrate 11 needs to be enlarged.

[0043] To avoid these problems, at least the second wiring 52 and the third wiring 53 need to be drawn out from the second communication unit 42 and the third communication unit 43 toward the fourth end 11D in a planar view. In this case, the second wiring 52 and the third wiring 53 need to be routed between the second feeding point 32 and the second communication unit 42 and between the third feeding point 33 and the third communication unit 43 in a planar view. For this reason, if the area of ​​the routing region 50E of the laminated substrate 10 in a planar view is the same, the structure of each of the second wiring 52 and the third wiring 53 becomes complex. Furthermore, if the area of ​​the routing region 50E of the laminated substrate 10 in a planar view is the same, the difference in the parasitic inductance or parasitic capacitance between the second wiring 52 and the third wiring 53 and the other wirings increases, which is likely to affect the characteristics of the electronic circuit module 3A. In order to solve these problems in the electronic circuit module 3A relating to the comparative embodiment, it is necessary to increase the area of ​​the laminated substrate 10 in accordance with the expansion of the routing area 50E in a planar view of the laminated substrate 10, and ultimately to enlarge the first substrate 11.

[0044] <Wiring> On the communication IC chip 40 of the electronic circuit module 3 according to this embodiment, the second communication unit 42, the first communication unit 41, the fourth communication unit 44, and the third communication unit 43 are arranged in this order from the first end 11A to the second end 11B. This runs counter to the technical idea of ​​arranging the antennas on the first substrate 11 in the same order as the communication units of the communication IC chip 40.

[0045] However, in the present embodiment, compared to the comparative example, the difference in plan view between the distance between the first feeding point 31 and the first communication unit 41 and the distance between the second feeding point 32 and the second communication unit 42 is smaller. Therefore, in the present embodiment, the extra distance over which the second wiring 52 is routed in order to reduce the difference in wiring length between the first wiring 51 and the second wiring 52 in plan view is reduced, and the second wiring 52 is simplified.

[0046] Furthermore, with the above configuration, in this embodiment, the first wiring 51 can be routed toward the periphery of the first substrate 11 in a plan view. As a result, in this embodiment, the second wiring 52 can be more easily routed toward the center of the first substrate 11 than the first wiring 51 in a plan view. In particular, as shown in FIG. 1 , in this embodiment, it is easier to ensure an area for routing the second wiring 52 toward the center of the first substrate 11 in the routing region 50E of the laminated substrate 10 in a plan view.

[0047] Additionally, in the present embodiment, the difference in plan view between the distance between the third feeding point 33 and the third communication unit 43 and the distance between the fourth feeding point 34 and the fourth communication unit 44 is small. Therefore, in the present embodiment, the distance over which the third wiring 53 is routed in order to reduce the difference in wiring length in plan view between the third wiring 53 and the fourth wiring 54 is reduced, and the third wiring 53 is simplified.

[0048] Furthermore, with the above configuration, in this embodiment, the fourth wiring 54 can be routed toward the periphery of the first substrate 11 in a plan view. As a result, in this embodiment, the third wiring 53 can be more easily routed toward the center of the first substrate 11 than the fourth wiring 54 in a plan view. In particular, as shown in FIG. 1 , in this embodiment, it is easier to ensure an area for routing the fourth wiring 54 toward the center of the first substrate 11 in the routing region 50E of the laminated substrate 10 in a plan view.

[0049] As a result, the electronic circuit module 3 reduces the influence of each wire on the transmission and reception of electromagnetic waves, while simplifying the routing of each wire or miniaturizing the first substrate 11. The electronic device 1 including the electronic circuit module 3 improves the performance of transmitting or receiving electromagnetic waves, while also realizing easier manufacturing or miniaturization.

[0050] In the present embodiment, the electronic circuit module 3 is described as having four antennas, but the present invention is not limited to this, and the electronic circuit module 3 may not have, for example, the fourth antenna 24. In this case, the electronic circuit module 3 may not have the fourth communication unit 44 and the fourth wiring 54 of the communication IC chip 40.

[0051] In this case, in a plan view, the second communication unit 42 is located closer to the first end 11A in the first direction D1 than the first communication unit 41, or closer to the second end 11B than the third communication unit 43. As a result, for the same reasons as described above, the electronic circuit module 3 reduces the influence of each wiring on the transmission and reception of electromagnetic waves, while simplifying the routing of each wiring or making the first substrate 11 smaller.

[0052] In this embodiment, the first feed point 31, the second feed point 32, the third feed point 33, and the fourth feed point 34 are located along the first direction D1 and at the central position C2 in a plan view. Therefore, in this embodiment, most of the wiring in the laminated substrate 10 can be formed closer to the third end 11C than the central position C2 in a plan view, as shown in FIG.

[0053] As will be described in a later embodiment, in an electronic circuit module, the number of communication units of a communication IC chip or the number of antennas may increase, which increases the number of wirings in the electronic circuit module. Therefore, if the area of ​​the wiring region 50E in the plan view of the laminated substrate 10 is the same, the wiring arrangement of each wiring becomes more complicated.

[0054] With the above configuration, in this embodiment, most of the wiring can be formed only on the third end 11C side of the central position C2 in a plan view, making it easy to secure an area in which the wiring can be routed only on the fourth end 11D side of the central position C2. In other words, in this embodiment, as shown in FIG. 1 , in a plan view of the laminated substrate 10, it is easy to route the wiring only on the third end 11C side of the central position C2 within the routing region 50E. For example, in this embodiment, suppose the number of antennas, the communication unit of the communication IC chip 40, and the wiring connecting them in the electronic circuit module 3 is increased. Even in this case, in this embodiment, it is easier to route the increased wiring more on the fourth end 11D side of the central position C2 without expanding the routing region 50E in a plan view. Therefore, even when the number of wirings is increased, the electronic circuit module 3 according to this embodiment simplifies the routing of the wiring or reduces the size of the first substrate 11 while reducing the impact of each wiring on the transmission and reception of electromagnetic waves.

[0055] The electronic circuit module 3 according to this embodiment may be manufactured by various methods, including conventionally known methods. For example, the laminated substrate 10 may be formed by stacking multiple substrates, including a first substrate 11 on which each antenna is formed and a substrate having a routing region 50E on which multiple wiring lines are formed. In this case, contact holes may be formed as appropriate in the substrates included in the laminated substrate 10, and the wiring lines may be routed in the vertical direction of the electronic circuit module 3 through the contact holes.

[0056] Furthermore, the communication sections of the communication IC chip 40, the power supply IC chip 3P, and the module-side connector 3C may be formed on the side of the laminated substrate 10 opposite the first substrate 11. In this case, the communication sections of the communication IC chip 40 and the power supply IC chip 3P may be sealed with a semiconductor sealing material 3S to complete the manufacturing process of the electronic circuit module 3. Alternatively, the electronic device 1 may be manufactured by connecting the module-side connector 3C and the main body-side connector 2C and connecting the electronic circuit module 3 and the device main body 2 via the flexible printed circuit board 4.

[0057] Second Embodiment <Change in Position of IC Chip> The electronic circuit module 3 according to this embodiment differs from the electronic circuit module 3 according to the previous embodiment in the position of the communication IC chip 40 in a plan view. Fig. 7 is a schematic plan view of a semiconductor encapsulation material 3S according to this embodiment.

[0058] 7 , in a plan view, the communication IC chip 40 according to this embodiment is located closer to the module connector 3C than the center position C1, which is located in the center of the first substrate 11 in the first direction D1. This brings the communication IC chip 40 according to this embodiment closer to the module connector 3C. Therefore, the electronic circuit module 3 according to this embodiment can shorten the length of the connector wiring 59, making it easier to connect the communication IC chip 40 and the module connector 3C.

[0059] In the present disclosure, "the communication IC chip 40 is located closer to the module connector 3C than the central position C1" does not necessarily mean that the entire communication IC chip 40 is located closer to the module connector 3C than the central position C1. For example, in a plan view, the central position of the communication IC chip 40 in the first direction D1 is defined as the central position C3. In this case, in the present disclosure, "the communication IC chip 40 is located closer to the module connector 3C than the central position C1" may also mean that the central position C3 is located closer to the module connector 3C than the central position C1.

[0060] <Electronic Circuit Module According to Another Comparative Embodiment> The effects of the electronic circuit module 3 according to this embodiment will be described by comparing it with electronic circuit modules according to another comparative embodiment with reference to Fig. 8 and Fig. 9. Fig. 8 is a schematic plan view of the electronic circuit module 3 according to this embodiment, in other words, Fig. 8 is a schematic diagram of the electronic circuit module 3 in a plan view. Fig. 9 is a schematic plan view of an electronic circuit module 3B according to another comparative embodiment, in other words, Fig. 9 is a schematic diagram of the electronic circuit module 3B in a plan view.

[0061] The electronic circuit module 3B of the comparative embodiment differs from the electronic circuit module 3 of the present embodiment in the order in which the multiple communication units are arranged in the direction from the first end 11A to the second end 11B. In particular, in the comparative embodiment, the first communication unit 41, the second communication unit 42, the third communication unit 43, and the fourth communication unit 44 are arranged in this order from the first end 11A to the second end 11B on the communication IC chip 40 along the first direction D1 in a plan view. Except for the above, the electronic circuit module 3B of the comparative embodiment has the same configuration as the electronic circuit module 3 of the present embodiment.

[0062] 9 , in the electronic circuit module 3B, the communication IC chip 40 is closer to the module-side connector 3C, which further reduces the distance between the second power supply point 32 and the second communication unit 42. This makes the routing of the second wiring 52 more complicated in the electronic circuit module 3B. Furthermore, in the electronic circuit module 3B, it becomes more difficult to secure an area for routing the second wiring 52 within the routing area 50E in the plan view of the laminated substrate 10, which is indicated by the dashed-dotted line in FIG. 9 .

[0063] On the other hand, for the same reasons as those described in the previous embodiment, the electronic circuit module 3 according to this embodiment can more easily secure an area for routing the second wiring 52 within the routing area 50E in plan view of the laminated substrate 10, which is shown by the dashed dotted line in Fig. 8. In particular, as shown in Fig. 8, for example, the electronic circuit module 3 according to this embodiment makes it easier to limit the position for forming the second wiring 52 in plan view to only on the side of the third end 11C relative to the central position C2.

[0064] As described above, the electronic circuit module 3 simplifies the routing of each wiring or reduces the size of the first substrate 11 while reducing the impact of each wiring on the transmission and reception of electromagnetic waves, regardless of the position of the communication IC chip 40 in a planar view.

[0065] Third Embodiment <Transmission and Reception of Dual Polarized Waves> Compared to the electronic circuit module 3 according to the previous embodiment, the electronic circuit module 3 according to this embodiment has an increased number of feed points on each antenna on the first substrate 11 and an increased number of communication units on the communication IC chip 40. Accordingly, the electronic circuit module 3 according to this embodiment also has an increased number of wires connecting each feed point and each communication unit, compared to the electronic circuit module 3 according to the previous embodiment.

[0066] The electronic circuit module 3 according to this embodiment will be described in more detail with reference to Figures 10, 11, and 12. Figure 10 is a schematic plan view of a first substrate 11 according to this embodiment. Figure 11 is a schematic plan view of a semiconductor encapsulation material 3S according to this embodiment. Figure 12 is a schematic plan view of the electronic circuit module 3 according to this embodiment.

[0067] 10 , the first antenna 21, the second antenna 22, the third antenna 23, and the fourth antenna 24 further include a fifth feed point 35, a sixth feed point 36, a seventh feed point 37, and an eighth feed point 38, respectively. The fifth feed point 35, the sixth feed point 36, the seventh feed point 37, and the eighth feed point 38 are arranged, for example, along the first direction D1.

[0068] Furthermore, for example, in a plan view, the fifth feed point 35, the sixth feed point 36, the seventh feed point 37, and the eighth feed point 38 are each located closer to the fourth end 11D than the first feed point 31, the second feed point 32, the third feed point 33, and the fourth feed point 34. This makes it easier to draw wiring (described later) from the fifth feed point 35, the sixth feed point 36, the seventh feed point 37, and the eighth feed point 38 from the side of the fourth end 11D in the second direction D2 in a plan view.

[0069] The fifth feed point 35, the sixth feed point 36, the seventh feed point 37, and the eighth feed point 38 may each be located at a center position C4 in the first direction D1 of each antenna in a plan view, which makes it easier to draw wiring (described later) from either the first end 11A side or the second end 11B side in the first direction D1 from the fifth feed point 35, the sixth feed point 36, the seventh feed point 37, and the eighth feed point 38 in a plan view.

[0070] 11 , the communication IC chip 40 further includes a fifth communication unit 45, a sixth communication unit 46, a seventh communication unit 47, and an eighth communication unit 48. The fifth communication unit 45, the sixth communication unit 46, the seventh communication unit 47, and the eighth communication unit 48 are located, for example, in a plan view, on the opposite side in the second direction D2 from the third end 11C where the first communication unit 41, the second communication unit 42, the third communication unit 43, and the fourth communication unit 44 are located. In particular, the fifth communication unit 45, the sixth communication unit 46, the seventh communication unit 47, and the eighth communication unit 48 are located, for example, on the fourth end 11D side of the center position C2 in the second direction D2 in a plan view.

[0071] In the present embodiment, the sixth communication unit 46 is located closer to the first end 11A than the fifth communication unit 45 in a plan view. Furthermore, the seventh communication unit 47 is located closer to the second end 11B than the eighth communication unit 48 in a plan view. Therefore, on the communication IC chip 40, the sixth communication unit 46, the fifth communication unit 45, the eighth communication unit 48, and the seventh communication unit 47 are arranged in this order from the first end 11A to the second end 11B along the first direction D1 in a plan view.

[0072] 12 , the electronic circuit module 3 further includes a fifth wiring 55, a sixth wiring 56, a seventh wiring 57, and an eighth wiring 58 formed on the laminate substrate 10. The fifth wiring 55 connects the fifth feeding point 35 and the fifth communication unit 45. The sixth wiring 56 connects the sixth feeding point 36 and the sixth communication unit 46. The seventh wiring 57 connects the seventh feeding point 37 and the seventh communication unit 47. The eighth wiring 58 connects the eighth feeding point 38 and the eighth communication unit 48.

[0073] The fifth wiring 55, the sixth wiring 56, the seventh wiring 57, and the eighth wiring 58, together with the first wiring 51, the second wiring 52, the third wiring 53, and the fourth wiring 54, are routed inside the routing region 50E in a plan view of the laminated substrate 10. For this reason, in the electronic circuit module 3, these wirings need to be routed so that they do not cross each other.

[0074] For the same reasons as those described above, this embodiment also allows for simpler routing of the sixth wiring 56 and the seventh wiring 57. Therefore, the electronic circuit module 3 according to this embodiment simplifies the routing of the wiring or reduces the size of the first substrate 11 while reducing the influence of the wiring on the transmission and reception of electromagnetic waves.

[0075] Furthermore, as described above, many of the first wiring 51, the second wiring 52, the third wiring 53, and the fourth wiring 54 are located closer to the third end 11C than the central position C2 in a plan view. Therefore, in the electronic circuit module 3 according to this embodiment, as shown in FIG. 12 , the fifth wiring 55, the sixth wiring 56, the seventh wiring 57, and the eighth wiring 58 can be routed closer to the fourth end 11D than the central position C2 in a plan view. In other words, the electronic circuit module 3 according to this embodiment makes it easier to secure an area for routing the fifth wiring 55, the sixth wiring 56, the seventh wiring 57, and the eighth wiring 58 within the routing region 50E of the laminated substrate 10 in a plan view, which is indicated by the dashed-dotted line in FIG. 12 . As a result, the electronic circuit module 3 can simplify the routing of each wiring while minimizing the increase in the area of ​​the laminated substrate 10 in a plan view, regardless of an increase in the number of wirings.

[0076] In particular, in a plan view, the fifth wiring 55, the sixth wiring 56, the seventh wiring 57, and the eighth wiring 58 may be drawn from the fifth communication unit 45, the sixth communication unit 46, the seventh communication unit 47, and the eighth communication unit 48, respectively, toward the fourth end 11D. In this case, in a plan view, the fifth wiring 55, the sixth wiring 56, the seventh wiring 57, and the eighth wiring 58 can be routed more simply closer to the fourth end 11D than the central position C2. In other words, the electronic circuit module 3 according to this embodiment makes it easier to ensure, within the routing region 50E of the laminated substrate 10 in a plan view, an area for routing the fifth wiring 55, the sixth wiring 56, the seventh wiring 57, and the eighth wiring 58 closer to the fourth end 11D than the central position C2.

[0077] The communication IC chip 40 may transmit a signal corresponding to the first polarization to each of the first feed point 31, the second feed point 32, the third feed point 33, and the fourth feed point 34. On the other hand, the communication IC chip 40 may transmit a signal corresponding to the second polarization having a polarization different from the first polarization to each of the fifth feed point 35, the sixth feed point 36, the seventh feed point 37, and the eighth feed point 38.

[0078] Each antenna may receive electromagnetic waves including a first polarized wave and a second polarized wave. In addition, when each antenna receives the first polarized wave, it may transmit a signal corresponding to the first polarized wave to each of the first feed point 31, the second feed point 32, the third feed point 33, and the fourth feed point 34. On the other hand, when each antenna receives the second polarized wave, it may transmit a signal corresponding to the second polarized wave to each of the fifth feed point 35, the sixth feed point 36, the seventh feed point 37, and the eighth feed point 38.

[0079] In other words, the first communication unit 41, the second communication unit 42, the third communication unit 43, and the fourth communication unit 44 may transmit or receive signals corresponding to the first polarization, while the fifth communication unit 45, the sixth communication unit 46, the seventh communication unit 47, and the eighth communication unit 48 may transmit or receive signals corresponding to the second polarization.

[0080] As a result, the electronic circuit module 3 may transmit and receive electromagnetic waves having two different polarizations, a first polarization and a second polarization, using each antenna on the first substrate 11. For example, the first polarization may be a V polarization, and the second polarization may be an H polarization. In other words, the first polarization and the second polarization may be linear polarizations in which the magnetic field vibration directions are orthogonal to each other. However, this is not limited thereto, and the first polarization and the second polarization may be circular polarizations in which the magnetic field vibration planes rotate in opposite directions to each other. As shown in FIG. 11 , the communication IC chip 40 according to this embodiment may be provided with individual connector communication units 49 between the module-side connector 3C and the communication IC chip 40 for transmitting and receiving signals corresponding to the first polarization and the second polarization.

[0081] As described above, the electronic circuit module 3 according to this embodiment facilitates the transmission and reception of electromagnetic waves of multiple systems. In addition, the electronic circuit module 3 according to this embodiment simplifies the routing of the wiring, regardless of an increase in the number of wirings. Therefore, the electronic circuit module 3 simplifies the routing of the wiring, or reduces the size of the first substrate 11, while reducing the influence of each wiring on the transmission and reception of electromagnetic waves, and further improves the performance of the transmission and reception of electromagnetic waves.

[0082] [Embodiment 4] <Variation of the position of the communication section> Compared to the electronic circuit module 3 of the previous embodiment, the electronic circuit module 3 of this embodiment has a different position of some of the communication sections of the communication IC chip 40, and as a result, the shape of the communication IC chip 40 in a planar view is different.

[0083] The electronic circuit module 3 according to this embodiment will be described in more detail with reference to Fig. 13 and Fig. 14. Fig. 13 is a schematic plan view of a semiconductor encapsulation material 3S according to this embodiment. Fig. 14 is a schematic plan view of the electronic circuit module 3 according to this embodiment.

[0084] In this embodiment, the first communication unit 41, the second communication unit 42, the third communication unit 43, and the fourth communication unit 44 are located closer to the first end 11A than the center position C3 of the communication IC chip 40 in a planar view. On the other hand, the fifth communication unit 45, the sixth communication unit 46, the seventh communication unit 47, and the eighth communication unit 48 are located closer to the second end 11B than the center position C3 of the communication IC chip 40 in a planar view. Therefore, the shape of the communication IC chip 40 in a planar view may extend in the first direction D1. However, the center position C3 may be located closer to the first end 11A than the center position C1 in a planar view.

[0085] 14 , in the electronic circuit module 3 according to this embodiment, the distance between the fifth feed point 35 and the fifth communication unit 45 and the distance between the sixth feed point 36 and the sixth communication unit 46 are long in a plan view. Therefore, in this embodiment, as shown by the dashed-dotted line in FIG. 14 , a larger area can be secured for routing the fifth wiring 55 and the sixth wiring 56 within the routing region 50E of the laminated substrate 10 in a plan view. Therefore, in the electronic circuit module 3 according to this embodiment, the fifth wiring 55 and the sixth wiring 56 can be routed more simply.

[0086] On the other hand, with the above configuration, in the electronic circuit module 3 according to this embodiment, the distance between the seventh feed point 37 and the seventh communication unit 47 and the distance between the eighth feed point 38 and the eighth communication unit 48 are longer in a planar view. However, as described above, in a planar view, the seventh communication unit 47 and the eighth communication unit 48 are located closer to the second end 11B than the center position C3. Therefore, in this embodiment, within the routing region 50E of the laminated substrate 10 in a planar view, a larger area of ​​the laminated substrate 10 for routing the seventh wiring 57 and the eighth wiring 58 can be secured closer to the second end 11B. Therefore, in the electronic circuit module 3 according to this embodiment, the seventh wiring 57 and the eighth wiring 58 can be routed more simply.

[0087] Therefore, the electronic circuit module 3 can further improve the performance of transmitting and receiving electromagnetic waves, while simplifying the routing of each wire.

[0088] Fifth Embodiment <Further Modification of the Position of the Communication Unit> The electronic circuit module 3 according to this embodiment differs from the electronic circuit module 3 according to the previous embodiment in the position of part of the communication unit of the communication IC chip 40. The electronic circuit module 3 according to this embodiment will be described in more detail with reference to FIGS. 15 and 16. FIG. 15 is a schematic plan view of a semiconductor encapsulation material 3S according to this embodiment. FIG. 16 is a schematic plan view of the electronic circuit module 3 according to this embodiment.

[0089] The fifth communication unit 45, the sixth communication unit 46, the seventh communication unit 47, and the eighth communication unit 48 according to the present embodiment are located closer to the third end 11C than the central position C2 in a plan view, together with the first communication unit 41, the second communication unit 42, the third communication unit 43, and the fourth communication unit 44. Furthermore, in the present embodiment, the first communication unit 41, the second communication unit 42, the third communication unit 43, the fourth communication unit 44, the fifth communication unit 45, the sixth communication unit 46, the seventh communication unit 47, and the eighth communication unit 48 are arranged along the first direction D1 in a plan view.

[0090] More specifically, the sixth communication unit 46 is located between the second communication unit 42 and the first communication unit 41. The fifth communication unit 45 is located between the first communication unit 41 and the fourth communication unit 44. The eighth communication unit 48 is located between the fourth communication unit 44 and the third communication unit 43. The seventh communication unit 47 is located closer to the second end 11B than the third communication unit 43.

[0091] Therefore, in this embodiment as well, the second communication unit 42, the first communication unit 41, the fourth communication unit 44, and the third communication unit 43 are arranged in this order from the first end 11A to the second end 11B along the first direction D1 in a plan view on the communication IC chip 40. Furthermore, the sixth communication unit 46, the fifth communication unit 45, the eighth communication unit 48, and the seventh communication unit 47 are arranged in this order from the first end 11A to the second end 11B along the first direction D1 in a plan view on the communication IC chip 40.

[0092] Therefore, for the same reasons as those described above, the electronic circuit module 3 according to this embodiment simplifies the routing of the wiring formed on the laminated substrate 10 and achieves miniaturization.

[0093] 16 , wiring may be drawn from the first communication unit 41, the second communication unit 42, the third communication unit 43, and the fourth communication unit 44 toward the third end 11C in a plan view. Also, wiring may be drawn from the fifth communication unit 45, the sixth communication unit 46, the seventh communication unit 47, and the eighth communication unit 48 toward the fourth end 11D in a plan view. This makes it easier to ensure a wider area for routing each wiring within the routing region 50E of the laminated substrate 10 in a plan view, as shown by the dashed dotted lines in FIG.

[0094] Sixth Embodiment <Second Substrate> The electronic circuit module 3 according to this embodiment differs in configuration from the electronic circuit modules 3 according to the previously described embodiments in that the laminated substrate 10 further includes a second substrate 12. The electronic circuit module 3 according to this embodiment will be described in more detail with reference to FIGS. 17 and 18. FIG. 17 is a schematic side cross-sectional view of the electronic circuit module 3 according to this embodiment. FIG. 18 is a schematic plan view of a second substrate 12 (described later) according to this embodiment.

[0095] 17, the laminated substrate 10 includes a second substrate 12 between a first substrate 11 and a semiconductor encapsulation material 3S. In particular, the second substrate 12 overlaps with the first substrate 11 and the semiconductor encapsulation material 3S in a plan view.

[0096] The first substrate 11 according to this embodiment has the same configuration as, for example, the first substrate 11 according to embodiment 1. In other words, each antenna of the first substrate 11 according to this embodiment has a single feed point. Furthermore, the communication IC chip 40 according to embodiment 3, 4, or 5 is located within the semiconductor encapsulation material 3S according to this embodiment. In other words, the communication IC chip 40 according to this embodiment has a first communication unit 41, a second communication unit 42, a third communication unit 43, a fourth communication unit 44, a fifth communication unit 45, a sixth communication unit 46, a seventh communication unit 47, and an eighth communication unit 48.

[0097] 18 , the electronic circuit module 3 according to this embodiment includes a fifth antenna 25, a sixth antenna 26, a seventh antenna 27, and an eighth antenna 28 on the second substrate 12. The fifth antenna 25 has a fifth feed point 35, the sixth antenna 26 has a sixth feed point 36, the seventh antenna 27 has a seventh feed point 37, and the eighth antenna 28 has an eighth feed point 38.

[0098] In this embodiment, the fifth wiring 55 connects the fifth feed point 35 of the fifth antenna 25 and the fifth communication unit 45 of the communication IC chip 40. The sixth wiring 56 connects the sixth feed point 36 of the sixth antenna 26 and the sixth communication unit 46 of the communication IC chip 40. The seventh wiring 57 connects the seventh feed point 37 of the seventh antenna 27 and the seventh communication unit 47 of the communication IC chip 40. The eighth wiring 58 connects the eighth feed point 38 of the eighth antenna 28 and the eighth communication unit 48 of the communication IC chip 40.

[0099] Furthermore, the fifth antenna 25, the sixth antenna 26, the seventh antenna 27, and the eighth antenna 28 overlap with the first antenna 21, the second antenna 22, the third antenna 23, and the fourth antenna 24, respectively, in a plan view. Furthermore, the fifth antenna 25, the sixth antenna 26, the seventh antenna 27, and the eighth antenna 28 have a first contact hole 61, a second contact hole 62, a third contact hole 63, and a fourth contact hole 64, respectively. For example, each contact hole communicates with each antenna and the second substrate 12 in a direction from the first substrate 11 side toward the semiconductor encapsulation material 3S, and is formed at a position overlapping with each power supply point of the first substrate 11 in a plan view.

[0100] 17 , in the present embodiment, the first wiring 51 passes through the inside of the first contact hole 61 to connect the first feed point 31 of the first antenna 21 and the first communication unit 41 of the communication IC chip 40. The second wiring 52 passes through the inside of the second contact hole 62 to connect the second feed point 32 of the second antenna 22 and the second communication unit 42 of the communication IC chip 40. The third wiring 53 passes through the inside of the third contact hole 63 to connect the third feed point 33 of the third antenna 23 and the third communication unit 43 of the communication IC chip 40. The fourth wiring 54 passes through the inside of the fourth contact hole 64 to connect the fourth feed point 34 of the fourth antenna 24 and the fourth communication unit 44 of the communication IC chip 40.

[0101] The routing of each wire within the routing region 50E in the plan view of the laminated substrate 10 according to this embodiment may be performed in the same manner as the routing of each wire in, for example, embodiment 3, embodiment 4, or embodiment 5. Therefore, for the same reasons as described above, the electronic circuit module 3 according to this embodiment simplifies the routing of each wire formed on the laminated substrate 10 or achieves miniaturization.

[0102] In particular, the electronic circuit module 3 according to this embodiment includes a first substrate 11 on which multiple antennas are formed and a second substrate 12 on which other multiple antennas are formed, as a laminated substrate 10. This makes it easier for the electronic circuit module 3 to differentiate the characteristics, such as frequency, of the electromagnetic waves transmitted and received by the antennas on the first substrate 11 from those transmitted and received by the antennas on the second substrate 12. Therefore, the electronic circuit module 3 according to this embodiment is capable of transmitting and receiving multiple types of electromagnetic waves with a simpler configuration.

[0103] The electronic circuit module 3 according to this embodiment has the antennas on the first substrate 11 and the antennas on the second substrate 12 stacked in a plan view. Therefore, the electronic circuit module 3 can reduce the size of the laminated substrate 10 including the first substrate 11 and the second substrate 12 in a plan view.

[0104] In particular, in this embodiment, the connection between each antenna on the first substrate 11 and each communication unit of the communication IC chip 40 is achieved via a contact hole provided in each antenna on the second substrate 12. As a result, in order to achieve the above connection, the electronic circuit module 3 does not require a design that routes wiring so as to avoid each antenna on the second substrate 12 within the routing region 50E in a plan view of the laminated substrate 10. Therefore, the electronic circuit module 3 achieves the connection between each antenna on the first substrate 11 and each communication unit of the communication IC chip 40 with a simpler configuration.

[0105] The communication IC chip 40 may transmit a signal corresponding to a first electromagnetic wave having a first frequency to each of the first feed point 31, the second feed point 32, the third feed point 33, and the fourth feed point 34. Meanwhile, the communication IC chip 40 may transmit a signal corresponding to a second electromagnetic wave having a second frequency different from the first frequency to each of the fifth feed point 35, the sixth feed point 36, the seventh feed point 37, and the eighth feed point 38.

[0106] Furthermore, each antenna on first substrate 11 may receive a first electromagnetic wave and transmit a signal corresponding to the first electromagnetic wave to first feed point 31, second feed point 32, third feed point 33, and fourth feed point 34. Meanwhile, each antenna on second substrate 12 may receive a second electromagnetic wave and transmit a signal corresponding to the second electromagnetic wave to fifth feed point 35, sixth feed point 36, seventh feed point 37, and eighth feed point 38, respectively.

[0107] In other words, the first communication unit 41, the second communication unit 42, the third communication unit 43, and the fourth communication unit 44 may perform at least one of transmitting and receiving signals corresponding to the first electromagnetic waves, while the fifth communication unit 45, the sixth communication unit 46, the seventh communication unit 47, and the eighth communication unit 48 may perform at least one of transmitting and receiving signals corresponding to the second electromagnetic waves.

[0108] As a result, the electronic circuit module 3 according to this embodiment transmits and receives a first electromagnetic wave using each antenna on the first substrate 11, and transmits and receives a second electromagnetic wave using each antenna on the second substrate 12. Therefore, the electronic circuit module 3 according to this embodiment can transmit and receive electromagnetic waves having two different frequencies. For example, the first electromagnetic wave may be an electromagnetic wave with a higher frequency than the second electromagnetic wave.

[0109] [Summary] An electronic circuit module according to aspect 1 of the present disclosure comprises: a first substrate having, in a planar view, a first end that is a starting end in a first direction and a second end that is an end end on the opposite side from the first end in the first direction; a semiconductor encapsulant that overlaps the first substrate in a planar view; a first antenna, a second antenna, and a third antenna that are arranged in this order from the first end to the second end along the first direction in a planar view and are located on the first substrate; an IC chip that has a first communication unit, a second communication unit, and a third communication unit and is located within the semiconductor encapsulant; a first wiring that connects the first antenna and the first communication unit, a second wiring that connects the second antenna and the second communication unit, and a third wiring that connects the third antenna and the third communication unit; and the second communication unit is located closer to the first end than the first communication unit or closer to the second end than the third communication unit in a planar view.

[0110] An electronic circuit module according to aspect 2 of the present disclosure is, in the above-mentioned aspect 1, an IC chip having a fourth communication unit, located on the first substrate, arranged along the first direction with the first antenna, the second antenna, and the third antenna, and comprising a fourth antenna located closer to the second end than the third antenna in a planar view, and a fourth wiring connecting the fourth antenna and the fourth communication unit, wherein, in a planar view, the second communication unit is located closer to the first end than the first communication unit, and the third communication unit is located closer to the second end than the fourth communication unit.

[0111] An electronic circuit module according to aspect 3 of the present disclosure may be such that, in the above-described aspect 2, the first substrate has a third end which is a starting end in a second direction perpendicular to the first direction in a planar view, and in a planar view, the first communication unit, the second communication unit, the third communication unit, and the fourth communication unit are located closer to the third end than the center of the IC chip in the second direction perpendicular to the first direction, and in a planar view, each of the first wiring, the second wiring, the third wiring, and the fourth wiring may be pulled out from each of the first communication unit, the second communication unit, the third communication unit, and the fourth communication unit toward the third end.

[0112] An electronic circuit module according to aspect 4 of the present disclosure may be the same as that of aspect 2 or 3 above, wherein the first antenna, the second antenna, the third antenna, and the fourth antenna each have a first feed point connected to the first wiring, a second feed point connected to the second wiring, a third feed point connected to the third wiring, and a fourth feed point connected to the fourth wiring, and the first feed point, the second feed point, the third feed point, and the fourth feed point may be arranged along the first direction in a planar view and positioned at the center of the first substrate in a second direction perpendicular to the first direction in a planar view.

[0113] An electronic circuit module according to aspect 5 of the present disclosure may be any of aspects 2 to 4 above, wherein the difference between the wiring length of the first wiring and the wiring length of the second wiring in a planar view is 1 / 20 or less of the wavelength of the transmission wave, and the difference between the wiring length of the third wiring and the wiring length of the fourth wiring in a planar view is 1 / 20 or less of the wavelength of the transmission wave.

[0114] An electronic circuit module according to aspect 6 of the present disclosure is any of aspects 2 to 5 above, wherein the IC chip has a fifth communication unit, a sixth communication unit, a seventh communication unit, and an eighth communication unit, and includes a fifth wiring connecting the first antenna and the fifth communication unit, a sixth wiring connecting the second antenna and the sixth communication unit, a seventh wiring connecting the third antenna and the seventh communication unit, and an eighth wiring connecting the fourth antenna and the eighth communication unit, and in a planar view, the sixth communication unit is located closer to the first end than the fifth communication unit, and the seventh communication unit is located closer to the second end than the eighth communication unit.

[0115] An electronic circuit module according to aspect 7 of the present disclosure is, in the above-mentioned aspect 6, wherein the first substrate has a third end which is a starting end in a second direction perpendicular to the first direction in a planar view, and a fourth end which is an end on the opposite side of the third end in the second direction, and in a planar view, the first communication unit, the second communication unit, the third communication unit, and the fourth communication unit are located closer to the third end than the center of the IC chip in the second direction, and the fifth communication unit, the sixth communication unit, the seventh communication unit, and the eighth communication unit are located closer to the fourth end than the center of the IC chip in the second direction.

[0116] In the electronic circuit module of aspect 8 of the present disclosure, in the above-mentioned aspect 7, when viewed in a plane, each of the fifth wiring, the sixth wiring, the seventh wiring, and the eighth wiring may be pulled out from each of the fifth communication unit, the sixth communication unit, the seventh communication unit, and the eighth communication unit to the side of the fourth end.

[0117] The electronic circuit module of aspect 9 of the present disclosure may be, in the above-mentioned aspects 7 or 8, such that, in a planar view, the first communication unit, the second communication unit, the third communication unit, and the fourth communication unit are located closer to the first end than the center of the IC chip in the first direction, and the fifth communication unit, the sixth communication unit, the seventh communication unit, and the eighth communication unit are located closer to the second end than the center of the IC chip in the first direction.

[0118] An electronic circuit module according to aspect 10 of the present disclosure is, in the above-mentioned aspect 6, wherein the first substrate has a third end which is a starting end in a second direction perpendicular to the first direction in a planar view, and a fourth end which is an end on the opposite side to the third end in the second direction, and in a planar view, the first communication unit, the second communication unit, the third communication unit, the fourth communication unit, the fifth communication unit, the sixth communication unit, the seventh communication unit, and the eighth communication unit are located closer to the third end than the center of the IC chip in the second direction, and in a planar view, the fifth communication unit is located between the first communication unit and the fourth communication unit, the sixth communication unit is located between the first communication unit and the second communication unit, the seventh communication unit is located closer to the second end than the third communication unit, and the eighth communication unit is located between the third communication unit and the fourth communication unit.

[0119] An electronic circuit module according to aspect 11 of the present disclosure is any of aspects 6 to 10 above, wherein the first antenna, the second antenna, the third antenna, and the fourth antenna each have a fifth feed point connected to the fifth wiring, a sixth feed point connected to the sixth wiring, a seventh feed point connected to the seventh wiring, and an eighth feed point connected to the eighth wiring, and the fifth feed point, the sixth feed point, the seventh feed point, and the eighth feed point may be arranged along the first direction.

[0120] An electronic circuit module according to aspect 12 of the present disclosure is the above-described aspect 11, wherein the first substrate has a third end that is a starting end in a second direction perpendicular to the first direction in a planar view, and a fourth end that is an end on the opposite side of the third end in the second direction, and in a planar view, at least one of the first wiring, the second wiring, the third wiring, and the fourth wiring is located only on the third end side from the center of the first substrate in the second direction, and at least one of the fifth feed point, the sixth feed point, the seventh feed point, and the eighth feed point is located on the fourth end side from the center of the first substrate in the second direction in a planar view.

[0121] An electronic circuit module according to aspect 13 of the present disclosure may be any of aspects 6 to 12 above, wherein the first communication unit, the second communication unit, the third communication unit, and the fourth communication unit perform at least one of transmitting or receiving signals corresponding to a first polarization, and the fifth communication unit, the sixth communication unit, the seventh communication unit, and the eighth communication unit perform at least one of transmitting or receiving signals corresponding to a second polarization different from the first polarization.

[0122] In the electronic circuit module according to aspect 14 of the present disclosure, in the above-described aspect 13, the first polarized wave and the second polarized wave may be linearly polarized waves whose magnetic field vibration directions are orthogonal to each other.

[0123] An electronic circuit module according to aspect 15 of the present disclosure is, in any of aspects 2 to 5 above, an electronic circuit module wherein the IC chip has a fifth communication unit, a sixth communication unit, a seventh communication unit, and an eighth communication unit, and the electronic circuit module comprises: a second substrate positioned between the first substrate and the semiconductor encapsulant and overlapping the first substrate and the semiconductor encapsulant in a planar view; a fifth antenna, a sixth antenna, a seventh antenna, and an eighth antenna arranged in this order from the first end to the second end along the first direction in a planar view and positioned on the second substrate; a fifth wiring connecting the fifth antenna and the fifth communication unit, a sixth wiring connecting the sixth antenna and the sixth communication unit, a seventh wiring connecting the seventh antenna and the seventh communication unit, and an eighth wiring connecting the eighth antenna and the eighth communication unit, wherein, in a planar view, the sixth communication unit is positioned closer to the first end than the fifth communication unit, and the seventh communication unit is positioned closer to the second end than the eighth communication unit.

[0124] In the electronic circuit module of aspect 16 of the present disclosure, in the above-mentioned aspect 15, the fifth antenna, the sixth antenna, the seventh antenna, and the eighth antenna may overlap with the first antenna, the second antenna, the third antenna, and the fourth antenna, respectively, in a planar view.

[0125] An electronic circuit module according to aspect 17 of the present disclosure may be configured such that, in the above-described aspect 16, the fifth antenna, the sixth antenna, the seventh antenna, and the eighth antenna each have a first contact hole, a second contact hole, a third contact hole, and a fourth contact hole that communicate from the side of the first substrate to the side of the semiconductor encapsulant, and the first wiring, the second wiring, the third wiring, and the fourth wiring pass through the inside of the first contact hole, the second contact hole, the third contact hole, and the fourth contact hole, respectively, to connect the IC chip to the first antenna, the second antenna, the third antenna, and the fourth antenna.

[0126] An electronic circuit module according to aspect 18 of the present disclosure may be any of aspects 15 to 17 above, wherein the first communication unit, the second communication unit, the third communication unit, and the fourth communication unit perform at least one of transmitting or receiving a signal corresponding to a first electromagnetic wave having a first frequency, and the fifth communication unit, the sixth communication unit, the seventh communication unit, and the eighth communication unit perform at least one of transmitting or receiving a signal corresponding to a second electromagnetic wave having a second frequency different from the first frequency.

[0127] An electronic circuit module according to aspect 19 of the present disclosure, in any of aspects 1 to 18 above, may include a connector located closer to the semiconductor encapsulant than the first substrate and connected to the IC chip, and in a planar view, the IC chip may be located closer to the connector than the center of the first substrate in the first direction.

[0128] An electronic device according to aspect 20 of the present disclosure may include any of the electronic circuit modules according to aspects 1 to 19 above.

[0129] The present disclosure is not limited to the above-described embodiments, and various modifications are possible within the scope of the claims. Embodiments obtained by appropriately combining the technical means disclosed in different embodiments are also included in the technical scope of the present disclosure. Furthermore, new technical features can be formed by combining the technical means disclosed in each embodiment.

Claims

1. An electronic circuit module comprising: a first substrate having, in a plan view, a first end which is a starting end in a first direction and a second end which is an end end on a side opposite to the first end in the first direction; a semiconductor encapsulant overlapping the first substrate in a plan view; a first antenna, a second antenna, and a third antenna which are arranged in this order from the first end to the second end along the first direction in a plan view and are positioned on the first substrate; an IC chip having a first communication unit, a second communication unit, and a third communication unit and positioned within the semiconductor encapsulant; a first wiring connecting the first antenna and the first communication unit, a second wiring connecting the second antenna and the second communication unit, and a third wiring connecting the third antenna and the third communication unit, wherein, in a plan view, the second communication unit is positioned closer to the first end than the first communication unit or closer to the second end than the third communication unit.

2. The electronic circuit module described in claim 1, wherein the IC chip has a fourth communication unit, a fourth antenna located on the first substrate, arranged along the first direction with the first antenna, the second antenna, and the third antenna, and located closer to the second end than the third antenna in a planar view, and a fourth wiring connecting the fourth antenna and the fourth communication unit, wherein, in a planar view, the second communication unit is located closer to the first end than the first communication unit, and the third communication unit is located closer to the second end than the fourth communication unit.

3. The electronic circuit module described in claim 2, wherein the first substrate has a third end which is a starting end in a second direction perpendicular to the first direction in a planar view, the first communication unit, the second communication unit, the third communication unit, and the fourth communication unit are located on the third end side of the center of the IC chip in the second direction perpendicular to the first direction in a planar view, and the first wiring, the second wiring, the third wiring, and the fourth wiring are each pulled out from the first communication unit, the second communication unit, the third communication unit, and the fourth communication unit, respectively, to the third end side in a planar view.

4. The electronic circuit module described in claim 2, wherein the first antenna, the second antenna, the third antenna, and the fourth antenna each have a first feed point connected to the first wiring, a second feed point connected to the second wiring, a third feed point connected to the third wiring, and a fourth feed point connected to the fourth wiring, and the first feed point, the second feed point, the third feed point, and the fourth feed point are arranged along the first direction in a planar view and are located at the center of the first substrate in a second direction perpendicular to the first direction in a planar view.

5. An electronic circuit module as described in claim 2, wherein the difference between the wiring length of the first wiring and the wiring length of the second wiring in a planar view is 1 / 20 or less of the wavelength of the transmission wave, and the difference between the wiring length of the third wiring and the wiring length of the fourth wiring in a planar view is 1 / 20 or less of the wavelength of the transmission wave.

6. The electronic circuit module described in claim 2, wherein the IC chip has a fifth communication unit, a sixth communication unit, a seventh communication unit, and an eighth communication unit, and is provided with a fifth wiring connecting the first antenna and the fifth communication unit, a sixth wiring connecting the second antenna and the sixth communication unit, a seventh wiring connecting the third antenna and the seventh communication unit, and an eighth wiring connecting the fourth antenna and the eighth communication unit, and wherein, in a planar view, the sixth communication unit is located closer to the first end than the fifth communication unit, and the seventh communication unit is located closer to the second end than the eighth communication unit.

7. The electronic circuit module described in claim 6, wherein the first substrate has a third end which is a starting end in a second direction perpendicular to the first direction in a plan view, and a fourth end which is an end end on the opposite side to the third end in the second direction, and wherein, in a plan view, the first communication unit, the second communication unit, the third communication unit, and the fourth communication unit are located closer to the third end than the center of the IC chip in the second direction, and the fifth communication unit, the sixth communication unit, the seventh communication unit, and the eighth communication unit are located closer to the fourth end than the center of the IC chip in the second direction.

8. An electronic circuit module as described in claim 7, wherein, in a planar view, the fifth wiring, the sixth wiring, the seventh wiring, and the eighth wiring are each pulled out from the fifth communication unit, the sixth communication unit, the seventh communication unit, and the eighth communication unit, respectively, to the side of the fourth end.

9. An electronic circuit module as described in claim 7, wherein, in a planar view, the first communication unit, the second communication unit, the third communication unit, and the fourth communication unit are located closer to the first end than the center of the IC chip in the first direction, and the fifth communication unit, the sixth communication unit, the seventh communication unit, and the eighth communication unit are located closer to the second end than the center of the IC chip in the first direction.

10. The electronic circuit module described in claim 6, wherein the first substrate has a third end which is a starting end in a second direction perpendicular to the first direction in a plan view, and a fourth end which is an end end on the opposite side to the third end in the second direction, and wherein, in a plan view, the first communication unit, the second communication unit, the third communication unit, the fourth communication unit, the fifth communication unit, the sixth communication unit, the seventh communication unit, and the eighth communication unit are located closer to the third end than the center of the IC chip in the second direction, and wherein, in a plan view, the fifth communication unit is located between the first communication unit and the fourth communication unit, the sixth communication unit is located between the first communication unit and the second communication unit, the seventh communication unit is located closer to the second end than the third communication unit, and the eighth communication unit is located between the third communication unit and the fourth communication unit.

11. The electronic circuit module described in claim 6, wherein the first antenna, the second antenna, the third antenna, and the fourth antenna each have a fifth feed point connected to the fifth wiring, a sixth feed point connected to the sixth wiring, a seventh feed point connected to the seventh wiring, and an eighth feed point connected to the eighth wiring, and the fifth feed point, the sixth feed point, the seventh feed point, and the eighth feed point are arranged along the first direction.

12. The electronic circuit module described in claim 11, wherein the first substrate has a third end which is a starting end in a second direction perpendicular to the first direction in a plan view, and a fourth end which is an end end on the opposite side to the third end in the second direction, wherein at least one of the first wiring, the second wiring, the third wiring, and the fourth wiring is located only on the third end side from the center of the first substrate in the second direction in a plan view, and wherein at least one of the fifth feeding point, the sixth feeding point, the seventh feeding point, and the eighth feeding point is located on the fourth end side from the center of the first substrate in the second direction in a plan view.

13. An electronic circuit module as described in claim 6, wherein the first communication unit, the second communication unit, the third communication unit, and the fourth communication unit perform at least one of transmitting or receiving a signal corresponding to a first polarization, and the fifth communication unit, the sixth communication unit, the seventh communication unit, and the eighth communication unit perform at least one of transmitting or receiving a signal corresponding to a second polarization different from the first polarization.

14. The electronic circuit module according to claim 13, wherein the first polarized wave and the second polarized wave are linearly polarized waves whose magnetic field vibration directions are perpendicular to each other.

15. The electronic circuit module described in claim 2, wherein the IC chip has a fifth communication unit, a sixth communication unit, a seventh communication unit, and an eighth communication unit; a second substrate located between the first substrate and the semiconductor encapsulant and overlapping the first substrate and the semiconductor encapsulant in a planar view; a fifth antenna, a sixth antenna, a seventh antenna, and an eighth antenna arranged in this order from the first end to the second end along the first direction in a planar view and located on the second substrate; and a fifth wiring connecting the fifth antenna and the fifth communication unit, a sixth wiring connecting the sixth antenna and the sixth communication unit, a seventh wiring connecting the seventh antenna and the seventh communication unit, and an eighth wiring connecting the eighth antenna and the eighth communication unit, wherein in a planar view, the sixth communication unit is located closer to the first end than the fifth communication unit, and the seventh communication unit is located closer to the second end than the eighth communication unit.

16. The electronic circuit module according to claim 15, wherein, in a plan view, the fifth antenna, the sixth antenna, the seventh antenna, and the eighth antenna overlap with the first antenna, the second antenna, the third antenna, and the fourth antenna, respectively.

17. The electronic circuit module described in claim 16, wherein the fifth antenna, the sixth antenna, the seventh antenna, and the eighth antenna each have a first contact hole, a second contact hole, a third contact hole, and a fourth contact hole that communicate from the first substrate side to the semiconductor encapsulant side, and the first wiring, the second wiring, the third wiring, and the fourth wiring pass through the inside of the first contact hole, the second contact hole, the third contact hole, and the fourth contact hole, respectively, to connect the IC chip to the first antenna, the second antenna, the third antenna, and the fourth antenna.

18. The electronic circuit module described in claim 15, wherein the first communication unit, the second communication unit, the third communication unit, and the fourth communication unit perform at least one of transmitting or receiving a signal corresponding to a first electromagnetic wave having a first frequency, and the fifth communication unit, the sixth communication unit, the seventh communication unit, and the eighth communication unit perform at least one of transmitting or receiving a signal corresponding to a second electromagnetic wave having a second frequency different from the first frequency.

19. An electronic circuit module as described in claim 1, further comprising a connector located closer to the semiconductor encapsulant than the first substrate and connected to the IC chip, wherein in a plan view, the IC chip is located closer to the connector than the center of the first substrate in the first direction.

20. An electronic device comprising an electronic circuit module according to any one of claims 1 to 19.

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