Method for manufacturing layered electronic component

Abstract

According to the present disclosure, a method for manufacturing a layered electronic component includes: a preparation step for producing a layered body sheet by layering a plurality of green sheets on which conductive films are formed that constitute a plurality of internal electrodes positioned and aligned in a first direction and a second direction; a cutting step for cutting the layered body sheet in the first direction and the second direction to produce a plurality of layered body chips; a mounting step for mounting the plurality of layered body chips so that the same are aligned on a flat mounting surface of a mounting stand; an adhesion step for pressing the plurality of layered body chips in the second direction and adhering side surfaces of the layered body chips to an adhesion surface of a retaining sheet; and a movement step for moving the retaining sheet in a third direction to move the layered body chips.

Description

Manufacturing method for multilayer electronic components

[0001] The present disclosure relates to a method for manufacturing a multilayer electronic component.

[0002] A conventional method for manufacturing a multilayer electronic component is described in, for example, Japanese Patent Application Laid-Open No. 2003-229999.

[0003] JP 2015-222762 A

[0004] The method for manufacturing a multilayer electronic component according to the present disclosure includes a laminate sheet preparation step of preparing a laminate sheet by stacking a plurality of green sheets on which conductive films constituting a plurality of internal electrodes are formed, the internal electrodes being aligned in a first direction and a second direction perpendicular to the first direction in a plan view; a cutting step of cutting the laminate sheet in the first direction and the second direction to prepare a plurality of laminate chips; a mounting step of placing the plurality of laminate chips in an aligned state on a mounting surface of a mounting table having a flat mounting surface; an adhesion step of pressing the plurality of laminate chips on the mounting surface with a predetermined pressing force in the second direction to adhere a side of the laminate chip that is located furthest downstream in the second direction among the plurality of laminate chips to an adhesive surface of a holding sheet having an adhesive surface perpendicular to the second direction; and a moving step of moving the holding sheet in a third direction perpendicular to the first direction and the second direction to move the laminate chip adhered to the adhesive surface in the third direction.

[0005] Furthermore, the method for manufacturing a multilayer electronic component according to the present disclosure includes a laminate sheet preparation step of preparing a laminate sheet by stacking a plurality of green sheets, each having a conductive film formed thereon that constitutes a plurality of internal electrodes aligned in a first direction and a second direction perpendicular to the first direction in a plan view; a placement step of cutting the laminate sheet in the first direction to prepare a plurality of laminate blocks, and placing the laminate blocks in an aligned state on the placement surface of a placement table having a flat placement surface; an adhesion step of pressing the plurality of laminate blocks on the placement surface with a predetermined pressing force in the second direction to adhere the downstream side of the laminate blocks in the second direction to an adhesive surface of a holding sheet having an adhesive surface perpendicular to the second direction; and a moving step of moving the holding sheet in a third direction perpendicular to the first direction and the second direction, thereby moving the laminate blocks adhered to the adhesive surface in the third direction.

[0006] Furthermore, the method for manufacturing a multilayer electronic component according to the present disclosure includes a laminate sheet preparation step of preparing a laminate sheet by stacking a plurality of green sheets on which conductive films constituting a plurality of internal electrodes are formed, the internal electrodes being aligned in a first direction and a second direction perpendicular to the first direction in a plan view; a placement step of cutting the laminate sheet in the second direction to prepare a plurality of laminate blocks, and placing the laminate blocks in an aligned state on the placement surface of a placement table having a flat placement surface; a cutting step of cutting the laminate blocks on the placement surface in the first direction to prepare a plurality of laminate chips; an adhesion step of pressing the plurality of laminate chips in the second direction with a predetermined pressing force to adhere side surfaces of the plurality of laminate chips to an adhesive surface of a holding sheet having an adhesive surface perpendicular to the second direction; and a moving step of moving the holding sheet in a third direction perpendicular to the first direction and the second direction, thereby moving the laminate chip located most downstream in the second direction in the third direction.

[0007] Furthermore, a method for manufacturing a multilayer electronic component according to the present disclosure includes a laminate sheet preparation step of preparing a laminate sheet by stacking a plurality of green sheets, each having a conductive film formed thereon that constitutes a plurality of internal electrodes aligned in a first direction and a second direction perpendicular to the first direction in a plan view; a placement step of placing the laminate sheet on the placement surface of a placement table having a flat placement surface; an adhesion step of pressing the laminate sheet on the placement surface in the second direction with a predetermined pressing force to adhere a downstream side of the laminate sheet in the second direction to an adhesive surface of a holding sheet having an adhesive surface perpendicular to the second direction; a cutting step of cutting the laminate sheet adhered to the adhesive surface in the first direction to prepare a laminate block; and a moving step of moving the holding sheet in a third direction perpendicular to the first direction and the second direction to move the laminate block in the third direction.

[0008] Furthermore, a method for manufacturing a multilayer electronic component according to the present disclosure includes a laminate sheet preparation step of preparing a laminate sheet by stacking a plurality of green sheets, each having a conductive film formed thereon that constitutes a plurality of internal electrodes aligned in a first direction and a second direction perpendicular to the first direction in a plan view; a loading step of cutting the laminate sheet in the second direction to prepare a plurality of laminate blocks, and loading the plurality of laminate blocks in an aligned state on the loading surface of a loading table having a flat loading surface; an adhesion step of pressing the plurality of laminate blocks on the loading surface with a predetermined pressing force in the second direction to adhere the downstream side surfaces of the plurality of laminate blocks in the second direction to an adhesive surface of a holding sheet having an adhesive surface perpendicular to the second direction; a cutting step of cutting the plurality of laminate blocks adhered to the adhesive surface in the first direction to prepare a plurality of laminate chips; and a moving step of moving the holding sheet in a third direction perpendicular to the first direction and the second direction to move the laminate chips adhered to the adhesive surface in the third direction.

[0009] Objects, features, and advantages of the present disclosure will become more apparent from the following detailed description and drawings.

[0023] FIG. 1 is a perspective view illustrating an example of a multilayer ceramic capacitor manufactured by a method for manufacturing a multilayer electronic component according to an embodiment of the present disclosure.

[0024] FIG. 2 is a perspective view illustrating a laminate chip of the multilayer ceramic capacitor shown in FIG. 1.

[0025] FIG. 3 is a cross-sectional view illustrating a step of cutting a laminate sheet.

[0026] FIG. 4 is a cross-sectional view illustrating a step of cutting a laminate sheet into laminate blocks.

[0027] FIG. 5 is a perspective view illustrating a step of cutting a laminate block into laminate chips.

[0028] FIG. 6 is a perspective view illustrating each step of a method for manufacturing a multilayer electronic component according to a first embodiment of the present disclosure.

[0029] FIG. 7 is a perspective view illustrating each step of a method for manufacturing a multilayer electronic component according to the first embodiment of the present disclosure.

[0029] FIG. 8 is a flowchart illustrating a procedure for a method for manufacturing a multilayer electronic component according to the first embodiment of the present disclosure.

[0029] FIG. 9 is a perspective view illustrating each step of a method for manufacturing a multilayer electronic component according to a second embodiment of the present disclosure.

[0029] FIG. 10 is a perspective view illustrating each step of a method for manufacturing a multilayer electronic component according to the second embodiment of the present disclosure.

[0029] FIG. 11 is a flowchart illustrating a procedure for a method for manufacturing a multilayer electronic component according to the second embodiment of the present disclosure. FIG. 1 is a perspective view illustrating each step of a method for manufacturing a multilayer electronic component according to a third embodiment of the present disclosure. FIG. 2 is a perspective view illustrating each step of a method for manufacturing a multilayer electronic component according to a third embodiment of the present disclosure. FIG. 3 is a perspective view illustrating each step of a method for manufacturing a multilayer electronic component according to a third embodiment of the present disclosure. FIG. 4 is a flowchart illustrating a procedure for a method for manufacturing a multilayer electronic component according to a third embodiment of the present disclosure. FIG. 5 is a perspective view illustrating each step of a method for manufacturing a multilayer electronic component according to a fourth embodiment of the present disclosure. FIG. 6 is a perspective view illustrating each step of a method for manufacturing a multilayer electronic component according to a fourth embodiment of the present disclosure. FIG. 7 is a flowchart illustrating a procedure for a method for manufacturing a multilayer electronic component according to a fourth embodiment of the present disclosure.FIG. 1 is a perspective view illustrating each step of a method for manufacturing a multilayer electronic component according to a fifth embodiment of the present disclosure. FIG. 2 is a perspective view illustrating each step of a method for manufacturing a multilayer electronic component according to a fifth embodiment of the present disclosure. FIG. 3 is a flowchart illustrating a procedure for a method for manufacturing a multilayer electronic component according to a fifth embodiment of the present disclosure. FIG. 4 is a perspective view illustrating each step of a method for manufacturing a multilayer electronic component according to a sixth embodiment of the present disclosure. FIG. 5 is a perspective view illustrating each step of a method for manufacturing a multilayer electronic component according to a sixth embodiment of the present disclosure. FIG. 6 is a flowchart illustrating a procedure for a method for manufacturing a multilayer electronic component according to a sixth embodiment of the present disclosure. FIG. 7 is a perspective view illustrating each step of a method for manufacturing a multilayer electronic component according to a seventh embodiment of the present disclosure. FIG. 8 is a perspective view illustrating each step of a method for manufacturing a multilayer electronic component according to a seventh embodiment of the present disclosure. FIG. 9 is a flowchart illustrating a procedure for a method for manufacturing a multilayer electronic component according to a seventh embodiment of the present disclosure. FIG. 10 is a perspective view illustrating each step of a method for manufacturing a multilayer electronic component according to an eighth embodiment of the present disclosure. FIG. 11 is a perspective view illustrating each step of a method for manufacturing a multilayer electronic component according to an eighth embodiment of the present disclosure. FIG. 12 is a perspective view illustrating each step of a method for manufacturing a multilayer electronic component according to an eighth embodiment of the present disclosure. 22 is a flowchart illustrating a procedure of a method for manufacturing a multilayer electronic component according to an eighth embodiment of the present disclosure. FIG. 23 is a side view showing an example of an alignment device used in the method for manufacturing a multilayer electronic component according to the first to eighth embodiments. FIG. 24 is an enlarged cross-sectional view of a portion of the alignment device shown in FIG.

[0010] Patent Document 1 describes an alignment device for aligning, on an alignment sheet, a plurality of unfired individual pieces obtained by dividing a mother block having internal electrodes at predetermined positions during a process for manufacturing a multilayer ceramic capacitor, a multilayer electronic component. The alignment device includes a holding plate, an opposing plate, and a plate-shaped pusher that presses downward on the members to be aligned in a transport path between the holding plate and the opposing plate. To align the members to be aligned, the members are placed on the horizontally positioned holding plate, and the holding plate is rotated 90° about a line connecting a pair of end faces of the members to be aligned as a rotation axis, moving the members to the vertical transport path between the holding plate and the opposing plate. The members to be aligned are then pressed downward from above by the pusher, while held by the opposing plate in the transport path, to be aligned on the horizontal alignment sheet.

[0011] In Patent Document 1, the holding plate is rotated 90 degrees from a horizontal position to change the orientation of the members to be aligned vertically relative to the alignment sheet, and then the members are pushed downward from above to align the members on the alignment sheet. Therefore, a means for holding the members to be aligned vertically on the holding plate and the opposing plate is required. If the holding force of the holding means is insufficient, one or more rows of members to be aligned may be pushed off the opposing plate and fall onto the alignment sheet simultaneously before the members are held on the alignment sheet, potentially preventing the members from being reliably aligned on the alignment sheet. Furthermore, this conventional technology requires the members to be aligned horizontally on the holding plate to be rotated 90 degrees to change their orientation vertically, which requires many steps to align the members to be aligned on the alignment sheet, resulting in low alignment efficiency. Therefore, there has been a need for a method for manufacturing multilayer electronic components that can reliably align members to be aligned with fewer steps and improve work efficiency.

[0012] Below, the configuration of a multilayer ceramic capacitor will be described as an example of a multilayer electronic component manufactured by the manufacturing method for a multilayer electronic component according to the first to eighth embodiments of the present disclosure. The manufacturing method for a multilayer electronic component according to the present disclosure is not limited to multilayer ceramic capacitors, and can also be applied to the manufacture of multilayer piezoelectric elements, multilayer thermistor elements, multilayer chip coils, ceramic multilayer substrates, and the like. Note that the drawings referred to below are schematic, and the dimensional ratios and the like shown in the drawings are not necessarily accurate.

[0013] (Multilayer Ceramic Capacitor) FIG. 1 is a perspective view showing an example of a multilayer ceramic capacitor 1 manufactured by a manufacturing method for a multilayer electronic component according to an embodiment of the present disclosure, and FIG. 2 is a perspective view showing a laminate chip 23 of the multilayer ceramic capacitor 1 shown in FIG. The multilayer ceramic capacitor 1, which is an example of a multilayer electronic component, includes a laminate 21 formed by firing the laminate chip 23. The laminate 21 has a substantially rectangular parallelepiped shape. The laminate 21 has a first surface 7 a and a second surface 7 b facing each other, first end surfaces 8 a and second end surfaces 8 b that are perpendicular to the first surfaces 7 a and 7 b and that face each other, and a first side surface 9 a and a second side surface 9 b that are perpendicular to the first surface 7 a and the second surface 7 b and the first end surfaces 8 a and second end surfaces 8 b and that face each other.

[0014] The laminate 21 is manufactured by firing a laminate chip 23 described below. The laminate chip 23 is an individual piece obtained by stacking a plurality of ceramic green sheets (hereinafter also simply referred to as "green sheets") 10, each of which has a conductive film that constitutes an internal electrode 5 patterned along a first plane including the first surface 7a or the second surface 7b on the first dielectric layer 4, to produce a laminate sheet, and cutting the laminate sheet along a second plane perpendicular to the first plane and a third plane perpendicular to the first and second planes.

[0015] The dielectric layer 4 is made of an insulating material, such as BaTiO ３ , CaTiO ３ , SrTiO ３ , BaZrO ３ , CaZrO ３A ceramic powder containing a dielectric material such as SiO2 or a mixture thereof as a main component is prepared, and an organic vehicle is added to the powder to prepare a ceramic slurry. A ceramic green sheet is then produced using a sheet forming method such as a doctor blade method or a die coater method. The thickness of the green sheet 10 may be, for example, about 0.5 to 10 μm. In this specification, the term "main component" refers to the component with the highest component ratio in the material or member of interest. The component ratio may be expressed as a content concentration (mol %).

[0016] The first surface 7a and the second surface 7b may be perpendicular to the first plane and the third plane. The first end surface 8a and the second end surface 8b may be perpendicular to the first plane and the second plane. The first side surface 9a and the second side surface 9b may be perpendicular to the second plane and the third plane. Hereinafter, the first surface 7a and the second surface 7b may be referred to as main surfaces 7a and 7b, the first end surface 8a and the second end surface 8b may be referred to as end surfaces 8a and 8b, and the first side surface 9a and the second side surface 9b may be referred to as side surfaces 9a and 9b.

[0017] The laminate 21 is formed by alternately stacking a plurality of dielectric layers 4 and a plurality of internal electrodes 5. The conductive film material for forming the internal electrodes 5 may be a base metal such as nickel (Ni) or copper (Cu), which allows for a high degree of lamination and reduces manufacturing costs. Nickel (Ni) may also be used, as it allows for simultaneous firing of the internal electrodes 5 and the dielectric layers 4. The thickness of the internal electrodes 5 may be approximately 0.1 μm to 1.0 μm, or approximately 0.4 μm to 0.5 μm. The internal electrodes 5 are exposed at the first end surface 8a and the second end surface 8b, depending on their polarity.

[0018] The external electrodes 3 may be made of a sintered body of metal and glass, for example, a composition obtained by sintering copper (Cu) powder or a powder of an alloy of copper and another metal, such as a base metal such as nickel (Ni), with glass powder. Furthermore, a metal plating layer such as Ni plating or Sn plating may be applied to the surface.

[0019] As shown in FIG. 2 , the multilayer ceramic capacitor 1 includes a protective layer 6. The protective layer 6 is located on a first side surface 9 a and a second side surface 9 b of the laminate 21. The protective layer 6 electrically insulates the internal electrodes 5 of different polarities exposed on the side surfaces 9 a, 9 b. The protective layer 6 also mechanically protects the outer portions of the internal electrodes 5 exposed on the side surfaces 9 a, 9 b. The laminate 21 having the protective layer 6 disposed on each side surface 9 a, 9 b is also referred to as an element body 2.

[0020] The protective layer 6 is made of an insulating material, such as barium titanate (BaTiO ３ ), calcium titanate (CaTiO ３ ), strontium titanate (SrTiO ３ ), barium zirconate (BaZrO ３ ), or calcium zirconate (CaZrO ３ ) as a main component. The protective layer 6 may be made of the same ceramic material as the ceramic material that constitutes the dielectric layer 4. The protective layer 6 may have a thickness in the second direction Y of, for example, about 5 μm to 30 μm.

[0021] The multilayer ceramic capacitor 1 includes external electrodes 3 covering the first end face 8a and the second end face 8b and connected polarly to the internal electrodes 5. The external electrodes 3 are used for electrical connection to an external substrate or an external device.

[0022] The external electrode 3 is composed of a first external electrode 3a and a second external electrode 3b. The first external electrode 3a is located on a first end surface 8a of the laminate 21. The first external electrode 3a is electrically connected to the internal electrode 5 exposed at the first end surface 8a. The second external electrode 3b is located on a second end surface 8b of the laminate 21. The second external electrode 3b is electrically connected to the internal electrode 5 exposed at the second end surface 8b. The first external electrode 3a and the second external electrode 3b may be located partially on the main surfaces 7a and 7b, for example, as shown in FIG. 1 . Alternatively, the first external electrode 3a and the second external electrode 3b may be located partially on the side surfaces 9a and 9b, for example, as shown in FIG. 1 , and may partially cover the protective layer 6.

[0023] The first external electrode 3 a and the second external electrode 3 b may be formed of a single conductive layer or multiple conductive layers. In this embodiment, the first external electrode 3 a and the second external electrode 3 b may be formed of a two-layer structure having a base layer and an outer layer.

[0024] The underlayer is in contact with the laminate 21 and is connected to the internal electrodes 5 exposed at the first end surface 8 a and the second end surface 8 b. The underlayer may be made of a sintered body of metal and glass, for example, a composition obtained by firing copper (Cu) powder or an alloy powder of copper and another metal, such as a base metal such as nickel (Ni), with glass powder. Alternatively, the underlayer may be formed using a thin-film formation technique such as plating, sputtering, or vapor deposition, or a thick-film formation technique such as screen printing or gravure printing. Alternatively, the underlayer may be formed of a conductive resin. Examples of the metal material used for the underlayer include metals such as Ni, Cu, Ag, Pd, and Au, or alloys of these metals.

[0025] The outer layer covers the underlayer. The outer layer may be formed using a thin film formation technique such as electroless plating or electrolytic plating. The outer layer is made of a metal material. The metal material used for the outer layer may be, for example, a metal such as Ni, Sn, Cu, or Au, or an alloy made of these metals. The outer layer may be made of a single plated layer or a plurality of plated layers.

[0026] The aforementioned multilayer ceramic capacitor 1 can be produced by stacking a plurality of ceramic green sheets to produce a laminate sheet, cutting the laminate sheet along the short side direction perpendicular to the stacking direction of the plurality of ceramic green sheets to produce a plurality of laminate blocks 22, cutting the plurality of laminate blocks 22 along the long side direction perpendicular to the short side direction to produce a plurality of laminate chips 23, and firing the plurality of laminate chips 23.

[0027] Fig. 3 is a cross-sectional view illustrating the step of cutting the laminate sheet, Fig. 4 is a cross-sectional view illustrating the step of cutting the laminate sheet into laminate blocks 22, and Fig. 5 is a perspective view illustrating the step of cutting the laminate blocks 22 into laminate chips 23. A cutting device 11 is used to manufacture the multilayer ceramic capacitor 1. As shown in Fig. 5, the cutting device 11 includes a base 13 having a through hole 12, a pair of cutting blades, namely, a first cutting blade 14 and a second cutting blade 15, a first support 16, a push-out member 18, a pair of guide members 19a, 19b, and a push-out drive device 20. In Fig. 5, for convenience, a Cartesian coordinate system X1, Y1, Z1 is defined for the cutting device 11.

[0028] The through-hole 12 is a long hole extending in the Z1 direction, into which the second cutting blade 15 fits so as to be movable in the X1 direction. The base 13 may be formed of a plate-like body made of a metal such as stainless steel or polyethylene terephthalate (PET). The pair of guide members 19a, 19b may be formed of a metal such as stainless steel or polyethylene terephthalate, and the surface roughness of the inner surface that comes into contact with the laminate block 22 may be such that the laminate block 22 is not damaged.

[0029] The base 13 has a flat, horizontal support surface 13a, and a plurality of laminate blocks 22 are placed on the support surface 13a with, for example, the second end surfaces 8b facing downward.

[0030] The plurality of laminate blocks 22 are sandwiched between a pair of guide members 19a, 19b on the support surface 13a in a state in which they can move in the directions X1 and Y1. The plurality of laminate blocks 22 are simultaneously pressed in a push-out direction D1 parallel to the direction Y1 by the push-out member 18 and guided by the inner surfaces of the guide members 19a, 19b. Therefore, the laminate blocks 22 are prevented from being displaced in a direction Z1 intersecting the push-out direction D1 on a horizontal plane parallel to the support surface 13a. The push-out member 18 and the push-out drive device 20 intermittently push each laminate block 22 in the push-out direction D1 by an amount corresponding to the width b of the laminate chip 23 with each cutting operation of the first cutting blade 14 and the second cutting blade 15. Even if the laminate blocks 22 are moved while in contact with the support surface 13a of the base 13 and the inner surfaces of the guide members 19a, 19b, damage to the laminate blocks 22 is prevented.

[0031] The first cutting blade 14 and the second cutting blade 15 are moved parallel to the direction Z1 in a direction in which the cutting edges 26, 27 approach each other, and then move parallel to the direction Z1 in a direction in which the cutting edges 26, 27 move away from each other and return to their initial positions. The first cutting blade 14 and the second cutting blade 15, which perform this cutting operation, are driven and displaced by a cutting blade drive device (not shown). The cutting blade drive device may be driven, for example, by a double-acting hydraulic cylinder and multiple link members, or may be driven by a stepping motor and a ball screw shaft that is driven to rotate about its axis of rotation by the stepping motor.

[0032] The first cutting blade 14 and the second cutting blade 15 have bases 24, 25 with a constant thickness and cutting edges 26, 27. The first cutting blade 14 and the second cutting blade 15 are positioned with high precision so that the cutting edges 26, 27 face each other on an imaginary plane including the Y1 and Z1 directions. This minimizes deviations in the propagation direction of cracks formed on the end faces 8a, 8b of the laminate block 22 when the blades cut into the laminate block 22 during cutting. This allows each crack to propagate vertically along the imaginary plane including the Y1 and Z1 directions. Therefore, only incisions are formed in the laminate block 22 by the cutting edges 26, 27 of the first cutting blade 14 and the second cutting blade 15, and the laminate block 22 is subsequently divided as the cracks propagate. This reduces the area where the cutting edges 26, 27 contact the laminate block 22, reducing the occurrence of blade scratches on the laminate block 22 and allowing the laminate block 22 to have a flat cut surface due to the propagation of the cracks.

[0033] The first cutting blade 14 and the second cutting blade 15 may be made of a cemented carbide such as tungsten carbide. The cutting edge 26 of the first cutting blade 14 may be a double-sided blade, as shown in Figures 3 to 5, or a single-sided blade. Because the cutting edges 26, 27 have high rigidity, distortion due to the reaction force from the workpiece during cutting is small. This allows the cut surface of the laminate block 22 to have high flatness.

[0034] 6A to 6C are perspective views illustrating the steps of a method for manufacturing a multilayer electronic component according to a first embodiment of the present disclosure, and FIG. 7 is a flowchart illustrating the steps of the method for manufacturing a multilayer electronic component according to the first embodiment. In the following description, a Cartesian coordinate system XYZ is defined for convenience. The X-axis direction is also referred to as the first direction, the Y-axis direction is also referred to as the second direction, and the Z-axis direction is also referred to as the third direction. The method for manufacturing a multilayer electronic component according to this embodiment includes a laminate sheet preparation step a1, a cutting step a2, a placement step a3, an adhesion step a4, a movement step a5, a protective layer formation step a6, and a firing step a7.

[0035] In the laminate sheet preparation process a1, a laminate sheet is produced by stacking a plurality of green sheets on which conductive films are formed, constituting a plurality of internal electrodes 5 aligned in a first direction X and a second direction Y perpendicular to the first direction X in a plan view.

[0036] In the cutting step a2, the laminate sheet prepared in the laminate sheet preparation step a1 is cut in the first direction X and the second direction Y to prepare a plurality of laminate chips 23.

[0037] 6A, in the mounting step a3, the plurality of laminate chips 23 produced in the cutting step a2 are mounted in an aligned state on a flat mounting surface 31a of a mounting table 31. At this time, the plurality of laminate chips 23 are mounted so that the normals to the side surfaces on which the internal electrodes 5 of opposite polarities are exposed are aligned in the second direction Y.

[0038] 6A, in the adhesion step a4, the plurality of stack chips 23 on the mounting surface 31a are pressed in the second direction Y with a predetermined pressing force P, and the side surface 9a or 9b of the stack chip 23 located furthest downstream in the second direction Y among the plurality of stack chips 23 is adhered to the adhesive surface 30a of the holding sheet 30. The adhesive surface 30a of the holding sheet 30 forms a plane perpendicular to the second direction Y.

[0039] 6B, in moving step a5, holding sheet 30 is moved in a third direction Z perpendicular to first direction X and second direction 30a, and stack chip 23 adhered to adhesive surface 30a is moved in third direction Z. Thereafter, as shown in FIG. 6C, adhering step a4 and moving step a5 are repeated to adhere the next stack chip 23 to adhesive surface 30a, and stack chips 23 are sequentially adhered to adhesive surface 30a.

[0040] In the protective layer forming step a6, the protective layer 6 is formed on the side surfaces 9a and 9b of the plurality of laminated chips 23 adhered to the holding sheet 30. The protective layer 6 may be formed, for example, by applying a ceramic slurry to each side surface of the laminated chips 23 before firing and then drying the applied slurry.

[0041] In the firing step a7, the plurality of stacked chips 23 on which the protective layer 6 is formed are fired. The firing temperature of the stacked chips 23 may be, for example, 900°C or higher and 1300°C or lower.

[0042] The pressing force P when pressing the plurality of stacked chips 23 against the adhesive surface 30a is, for example, 1 g / mm ２ 100g / mm or more ２ The mounting table 31 may be made of, for example, a stainless steel plate such as SUS304. The holding sheet 30 may be made of, for example, an ultra-high molecular weight PE film or a fluororesin film. The pressing force is 1 g / mm ２ If the pressing force is less than 100 g / mm, the plurality of stacked chips 23 will not adhere to the holding sheet 30. ２ If the pressure exceeds this value, the laminate chip 23 will deform. As the adhesive for the adhesive layer, for example, an acrylic or silicone pressure-sensitive adhesive, a temperature-sensitive resin, or the like can be used. Such an adhesive can provide an adhesive strength of 0.01 N / mm or more and 10.00 N / mm or less, which is an appropriate adhesive strength for adhering and holding each laminate chip 23 until subsequent processes and for easily removing it from the holding sheet 30.

[0043] 8A to 8C are perspective views illustrating the steps of a method for manufacturing a multilayer electronic component according to a second embodiment of the present disclosure, and Fig. 9 is a flowchart illustrating the steps of the method for manufacturing a multilayer electronic component according to the second embodiment. The method for manufacturing a multilayer electronic component according to this embodiment includes a laminate sheet preparation step b1, a placement step b2, an adhesion step b3, a movement step b4, a protective layer formation step b5, and a firing step b6.

[0044] In the laminate sheet preparation process b1, a laminate sheet is produced by stacking multiple green sheets on which conductive films are formed, constituting multiple internal electrodes 5 aligned in the first direction X and the second direction Y in a plan view.

[0045] 8A , in the placing step b2, the laminate sheet is cut in the first direction X to prepare a plurality of laminate blocks 22, which are then placed in an aligned state on the placing surface 31 a of the placing table 31 having a flat placing surface 31 a. At this time, the plurality of laminate blocks 22 are placed so that the normals to the side surfaces on which the internal electrodes 5 of opposite polarities are exposed are aligned in the second direction Y.

[0046] In the adhesion process b3, as shown in Figure 8A, multiple laminate blocks 22 on the mounting surface 31a are pressed in the second direction Y with a predetermined pressing force P, and the side 9a or 9b downstream of the laminate sheet in the second direction Y is adhered to the adhesive surface 30a of the holding sheet 30.

[0047] 8B, in the moving step b4, the holding sheet 30 is moved in a third direction Z perpendicular to the first direction X and the second direction Y, and the laminate block 22 adhered to the adhesive surface 30a is moved in the third direction Z. Thereafter, as shown in Fig. 8C, the above-described adhering step b3 and moving step b4 are repeated to adhere the next laminate block 22 to the adhesive surface 30a, and the laminate blocks 22 are sequentially adhered to the adhesive surface 30a.

[0048] In the protective layer forming process b5, the plurality of laminate blocks 22 are cut in the second direction Y to produce the plurality of laminate chips 23, and then the protective layer 6 is formed on the side surfaces 9a and 9b of the plurality of laminate chips 23.

[0049] In the firing step b6, the plurality of stacked chips 23 on which the protective layer 6 is formed are fired, thereby forming the stacked body 21 described above.

[0050] According to the method for manufacturing a multilayer electronic component of the second embodiment of the present disclosure, the number of steps in the alignment work can be reduced, the laminate chips 23 can be aligned, and the efficiency of the alignment work can be improved.

[0051] 10A to 10C are perspective views illustrating the steps of a method for manufacturing a multilayer electronic component according to a third embodiment of the present disclosure, and Fig. 11 is a flowchart illustrating the steps of manufacturing the multilayer electronic component according to the third embodiment. The method for manufacturing a multilayer electronic component according to this embodiment includes a laminate sheet preparation step c1, a placement step c2, a cutting step c3, an adhesion step c4, a moving step c5, a protective layer formation step c6, and a firing step c7.

[0052] In the laminate sheet preparation process c1, a laminate sheet is produced by stacking multiple green sheets on which conductive films are formed, constituting multiple internal electrodes 5 aligned in the first direction X and the second direction Y in a plan view.

[0053] 10A , in the placing step c2, a plurality of laminate blocks 22 obtained by cutting the laminate sheet in the second direction Y are placed in an aligned state on the flat placing surface 31 a of the placing table 31. At this time, the plurality of laminate blocks 22 are placed so that the normals of the side surfaces on which the internal electrodes 5 of opposite polarities are exposed are aligned in the second direction Y.

[0054] In the cutting step c3, as shown in FIG. 10A, the laminate block 22 on the mounting surface 31a is cut in the first direction X to produce a plurality of laminate chips 23.

[0055] In the adhesion process c4, as shown in Figure 10B, the multiple laminate chips 23 are pressed in the second direction Y with a predetermined pressing force P, and the side 9a or 9b of the laminate chip 23 that is located furthest downstream in the second direction Y among the multiple laminate chips 23 is adhered to the adhesive surface 30a of the holding sheet 30.

[0056] In the movement process c5, as shown in Figure 10C, the holding sheet 30 is moved in a third direction Z perpendicular to the first direction X and the second direction Y, and the laminate chip 23 located furthest downstream in the second direction Y is moved in the third direction Z.

[0057] In the protective layer forming step c6, the protective layer 6 is formed on the side surfaces 9a and 9b of the plurality of stacked chips 23 adhered to the holding sheet 30.

[0058] In the firing step c7, the plurality of stacked chips 23 are fired, thereby forming the stack 21 described above.

[0059] According to the method for manufacturing a multilayer electronic component of the third embodiment of the present disclosure, the number of steps in the alignment work can be reduced, the laminate chips 23 can be aligned, and the efficiency of the alignment work can be improved.

[0060] 12A to 12C are perspective views illustrating the steps of a method for manufacturing a multilayer electronic component according to a fourth embodiment of the present disclosure, and Fig. 13 is a flowchart illustrating the steps of the method for manufacturing a multilayer electronic component according to the fourth embodiment. The method for manufacturing a multilayer electronic component according to this embodiment includes a laminate sheet preparation step d1, a placement step d2, an adhesion step d3, a cutting step d4, a moving step d5, a protective layer formation step d6, and a firing step d7.

[0061] In the laminate sheet preparation process d1, a laminate sheet is produced by stacking multiple green sheets on which conductive films are formed, constituting multiple internal electrodes 5 aligned in the first direction X and the second direction Y in a plan view.

[0062] 12A , in the placing step d2, the laminate sheet is placed on a flat placing surface 31 a of a placing table 31. At this time, the laminate sheet is placed so that the normal to the side surface on which the internal electrodes 5 of opposite polarities are exposed is aligned with the second direction Y.

[0063] In the adhesion process d3, as shown in Figure 12A, the laminate sheet on the mounting surface 31a is pressed in the second direction Y with a predetermined pressing force P, and the downstream side 9a or 9b of the laminate sheet in the second direction Y is adhered to the adhesive surface 30a of the holding sheet 30.

[0064] In the cutting step d4, as shown in FIG. 12B, the laminate sheet adhered to the adhesive surface 30a is cut in the first direction X to prepare laminate blocks 22.

[0065] In the moving process d5, as shown in FIG. 12C, the holding sheet 30 is moved in a third direction Z perpendicular to the first direction X and the second direction Y, and the laminate block 22 adhered to the adhesive surface 30a is moved in the third direction Z.

[0066] In the protective layer formation process d6, multiple laminate blocks 22 adhered to the holding sheet 30 are cut in the second direction Y to form multiple laminate chips 23, and then a protective layer 6 is formed on the side surfaces 9a, 9b of the multiple laminate chips 23.

[0067] In the firing step d7, the plurality of stacked chips 23 are fired, thereby forming the stack 21 described above.

[0068] According to the manufacturing method of the multilayer electronic component of the fourth embodiment of the present disclosure, the number of steps in the alignment work can be reduced, the laminate chips 23 can be aligned, and the efficiency of the alignment work can be improved.

[0069] 14A to 14C are perspective views illustrating the steps of a method for manufacturing a multilayer electronic component according to a fifth embodiment of the present disclosure, and Fig. 15 is a flowchart illustrating the steps of the method for manufacturing a multilayer electronic component according to the fifth embodiment. The method for manufacturing a multilayer electronic component according to this embodiment includes a laminate sheet preparation step e1, a placement step e2, an adhesion step e3, a cutting step e4, a moving step e5, a protective layer formation step e6, and a firing step e7.

[0070] In the laminate sheet preparation process e1, a laminate sheet is produced by stacking multiple green sheets on which conductive films are formed, constituting multiple internal electrodes 5 aligned in the first direction X and the second direction Y in a plan view.

[0071] 14A , in the placing step e2, a plurality of laminate blocks 22 obtained by cutting the laminate sheet in the second direction Y are placed in an aligned state on the placing surface 31 a of the holding sheet 30 having a flat placing surface 31 a. At this time, the plurality of laminate blocks 22 are placed so that the normals of the side surfaces on which the internal electrodes 5 of opposite polarities are exposed are aligned in the second direction Y.

[0072] In the adhesion process e3, as shown in Figure 14A, the multiple laminate blocks 22 on the mounting surface 31a are pressed in the second direction Y with a predetermined pressing force P, and the multiple laminate blocks 22 are adhered to the adhesive surface 30a of the holding sheet 30.

[0073] In the cutting step e4, as shown in FIG. 14B, the plurality of laminate blocks 22 adhered to the adhesive surface 30a are cut in the first direction X to produce a plurality of laminate chips 23.

[0074] In the movement process e5, as shown in Figure 14C, the holding sheet 30 is moved in a third direction Z perpendicular to the first direction X and the second direction Y, and the laminate chip 23 adhered to the adhesive surface 30a is moved in the third direction Z.

[0075] In the protective layer forming step e6, the protective layer 6 is formed on the side surfaces 9a and 9b of the plurality of stacked chips 23.

[0076] In the firing step e7, the plurality of stacked chips 23 on which the protective layer 6 is formed are fired, thereby forming the stacked body 21 described above.

[0077] According to the method for manufacturing a multilayer electronic component of the fifth embodiment of the present disclosure, the number of steps in the alignment work can be reduced, the laminate chips 23 can be aligned, and the efficiency of the alignment work can be improved.

[0078] In the above-mentioned first to fifth embodiments, the laminate block 22 or the laminate chip 23 was placed on the mounting surface 31a of the mounting table 31 so that either the first end face 8a or the second end face 8b of the laminate block 22 or the laminate chip 23 faced the adhesive surface 30a of the holding sheet 30. However, in other embodiments of the present disclosure, as in the following sixth to eighth embodiments, the laminate block 22 or the laminate chip 23 may be placed on the mounting surface 31a of the mounting table 31 so that either the first side face 9a or the second side face 9b of the laminate block 22 or the laminate chip 23 faces the adhesive surface 30a.

[0079] 16A to 16C are perspective views illustrating the steps of a method for manufacturing a multilayer electronic component according to a sixth embodiment of the present disclosure, and FIG. 17 is a flowchart illustrating the steps of the method for manufacturing a multilayer electronic component according to the sixth embodiment. This embodiment is similar to the second embodiment shown in FIGS. 8A to 8C and 9, and corresponding parts are designated by the same reference numerals. The method for manufacturing a multilayer electronic component according to this embodiment includes a laminate sheet preparation step f1, a placement step f2, an adhesion step f3, a movement step f4, a cutting step f5, a protective layer formation step f6, and a firing step f7.

[0080] In the laminate sheet preparation process f1, a laminate sheet is produced by stacking multiple green sheets on which conductive films are formed, constituting multiple internal electrodes 5 aligned in the first direction X and the second direction Y in a plan view.

[0081] 16A , in the placing step f2, the laminate sheet is cut in the first direction X to prepare a plurality of laminate blocks 22, which are then placed in an aligned state on the flat placing surface 31 a of the flat placing table 31. At this time, the plurality of laminate blocks 22 are placed so that the normals to the side surfaces on which the internal electrodes 5 of opposite polarities are exposed are aligned in the first direction X.

[0082] In the adhesion process f3, as shown in Figure 16A, multiple laminate blocks 22 on the mounting surface 31a are pressed in the second direction Y with a predetermined pressing force P, and the side 9a or 9b downstream of the laminate blocks 22 in the second direction Y is adhered to the adhesive surface 30a of the holding sheet 30.

[0083] 16B , in the moving step f4, the holding sheet 30 is moved in a third direction Z perpendicular to the first direction X and the second direction Y, so that one of the plurality of laminate blocks 22 adhered to the adhesive surface 30 a, which is located furthest downstream in the second direction Y, is moved in the third direction Z. Then, as shown in FIG. 16C , in the adhering step f3, the plurality of laminate blocks 22 on the placing surface 31 a are pressed in the second direction Y with a predetermined pressing force, so that the laminate block 22 located furthest downstream in the second direction Y is adhered to the adhesive surface 30 a of the holding sheet 30. The adhering step f3 and the moving step f4 are repeated until a predetermined number of laminate blocks 22 remain. After the predetermined number of laminate blocks 22 have been adhered to the holding sheet 30, the next cutting step f5 is performed.

[0084] In the cutting step f5, a predetermined number of the laminate blocks 22 adhered to the holding sheet 30 are cut in the first direction X to produce a plurality of laminate chips 23, and the next protective layer forming step f6 is then carried out.

[0085] In the protective layer forming step f6, the protective layer 6 is formed on the side surfaces 9a and 9b of the plurality of stacked chips 23.

[0086] In the firing step f7, the plurality of stacked chips 23 are fired, thereby forming the stack 21 described above.

[0087] According to the method for manufacturing a multilayer electronic component of the sixth embodiment of the present disclosure, the number of steps in the alignment work can be reduced, the laminate chips 23 can be aligned, and the efficiency of the alignment work can be improved.

[0088] Seventh Embodiment Figures 18A to 18C are perspective views illustrating the steps of a method for manufacturing a multilayer electronic component according to a seventh embodiment of the present disclosure, and Figure 19 is a flowchart illustrating the steps of the method for manufacturing a multilayer electronic component according to the seventh embodiment. This embodiment is similar to the fourth embodiment shown in Figures 12A to 12C and 13, and corresponding parts are designated by the same reference numerals. The method for manufacturing a multilayer electronic component according to this embodiment includes a laminate sheet preparation step g1, a placement step g2, a cutting step g3, an adhesion step g4, a moving step g5, a protective layer formation step g6, and a firing step g7.

[0089] In the laminate sheet preparation process g1, a laminate sheet is produced by stacking multiple green sheets on which conductive films are formed, constituting multiple internal electrodes 5 aligned in the first direction X and the second direction Y in a plan view.

[0090] 18A , in the placing step g2, the laminate sheets are placed in an aligned state on the flat placing surface 31a of the placing table 31. At this time, the laminate sheets are placed so that the normals to the side surfaces on which the internal electrodes 5 of opposite polarities are exposed are aligned in the first direction X.

[0091] In the cutting step g3, as shown in FIG. 18A, the laminate sheet is cut in the second direction Y to produce laminate blocks 22.

[0092] In the adhesive step g4, as shown in Figure 18B, the laminate block 22 on the mounting surface 31a is pressed together with the uncut laminate sheet in the second direction Y with a predetermined pressing force P, and the downstream side 9a or 9b of the laminate block 22 in the second direction Y is adhered to the adhesive surface 30a of the holding sheet 30.

[0093] 18C , in the moving step g5, the holding sheet 30 is moved in a third direction Z perpendicular to the first direction X and the second direction Y, and the laminate block 22 adhered to the adhesive surface 30a is moved in the third direction Z. Thereafter, the cutting step g3 and the adhering step g4 are repeated to adhere the next laminate block 22 to the adhesive surface 30a, and the laminate blocks 22 are sequentially adhered to the adhesive surface 30a.

[0094] In the protective layer forming step g6, the plurality of laminate blocks 22 are cut in the second direction Y to produce the plurality of laminate chips 23, and then the protective layer 6 is formed on the side surfaces 9a and 9b of the plurality of laminate chips 23.

[0095] In the firing step g7, the plurality of stacked chips 23 are fired, thereby forming the stack 21 described above.

[0096] According to the method for manufacturing a multilayer electronic component of the seventh embodiment of the present disclosure, the number of steps in the alignment work can be reduced, the laminate chips 23 can be aligned, and the efficiency of the alignment work can be improved.

[0097] Eighth Embodiment Figures 20A to 20C are perspective views illustrating the steps of a method for manufacturing a multilayer electronic component according to an eighth embodiment of the present disclosure, and Figure 21 is a flowchart illustrating the steps of the method for manufacturing a multilayer electronic component according to the eighth embodiment. This embodiment is similar to the fourth embodiment shown in Figures 12A to 12C and 13, and corresponding parts are designated by the same reference numerals. The method for manufacturing a multilayer electronic component according to this embodiment includes a laminate sheet preparation step h1, a placement step h2, an adhesion step h3, a cutting step h4, a moving step h5, a protective layer formation step h6, and a firing step h7.

[0098] In the laminate sheet preparation process h1, a laminate sheet is produced by stacking multiple green sheets on which conductive films are formed, constituting multiple internal electrodes 5 aligned in the first direction X and the second direction Y in a plan view.

[0099] 20A , in the placing step h2, the laminate sheet is placed on the flat placing surface 31a of the placing table 31. At this time, the laminate sheet is placed so that the normal to the side surface on which the internal electrodes 5 of opposite polarities are exposed is aligned with the first direction X.

[0100] In the adhesion process h3, as shown in Figure 20A, the laminate sheet on the placement surface 31a is pressed in the second direction Y with a predetermined pressing force P, and the downstream side 9a or 9b of the laminate sheet in the second direction Y is adhered to the adhesive surface 30a of the holding sheet 30.

[0101] In the cutting step h4, as shown in FIG. 20B, the laminate sheet adhered to the adhesive surface 30a is cut in the first direction X to produce laminate blocks 22.

[0102] 20C , in the moving step h5, the holding sheet 30 is moved in a third direction Z perpendicular to the first direction X and the second direction Y, and the laminate block 22 adhered to the adhesive surface 30a is moved in the third direction Z. Thereafter, the cutting step h4 and the moving step h5 are repeated to prepare a predetermined number of laminate blocks 22, and after the predetermined number of laminate blocks 22 are adhered to the holding sheet 30, the next protective layer forming step h6 is carried out.

[0103] In the protective layer formation process h6, a predetermined number of laminate blocks 22 adhered to the holding sheet 30 are cut in the second direction Y to produce multiple laminate chips 23, and then a protective layer 6 is formed on the side surfaces 9a, 9b of the multiple laminate chips 23.

[0104] In the firing step h7, the plurality of stacked chips 23 on which the protective layer 6 is formed are fired, thereby forming the stacked body 21 described above.

[0105] According to the method for manufacturing a multilayer electronic component of the eighth embodiment of the present disclosure, the number of steps in the alignment work can be reduced, the laminate chips 23 can be aligned, and the efficiency of the alignment work can be improved.

[0106] (Alignment Device) Figure 22 is a side view showing an example of an alignment device 40 used in the manufacturing methods of multilayer electronic components according to the first to eighth embodiments, and Figure 23 is an enlarged cross-sectional view of a portion of the alignment device 40 shown in Figure 22. The alignment device 40 includes a flat base 42 placed on a substantially horizontal floor 41, a plurality of support columns 43 erected vertically on the base 42, a holding sheet driving device 44 mounted on one side of the base 42, and an aligned-component supply device 45 that supplies the laminate blocks 22 or laminate chips 23 to the holding sheet driving device 44.

[0107] The holding sheet drive device 44 comprises a lifting drive unit 46 installed on the base 42, a guide rail 47 erected on the lifting drive unit 46, a lifting body 48 driven to move up and down along the guide rail 47 by the lifting drive unit 46, a lifting frame 49 fixed to one side of the lifting body 48 facing the aligned component supply device 45, and a base plate 50 facing the aligned component supply device 45 of the lifting frame 49 and having a flat sheet holding surface to which the holding sheet 30 is attached.

[0108] The aligned-component supply device 45 includes a mounting table 31 supported horizontally on the upper ends of the support columns 43 and having a mounting surface 31a on which the aforementioned laminate sheet, laminate block 22, or laminate chip 23 is placed, a base plate 51, a pressure plate 52 that applies an appropriate pressure from above to the laminate sheet, laminate block 22, or laminate chip 23 placed on the mounting surface 31a, a plurality of rib plates 53 to which the pressure plate 52 is fixed, a spring biasing unit 54 to which the rib plate 53 is attached and that biases the rib plate 53 with an appropriate pressure, and the aforementioned push-out drive device 20, such as a pneumatic cylinder, that applies the predetermined pressure P to the laminate sheet, laminate block 22, or laminate chip 23 on the mounting surface 31a. The distance ΔL1 between the adhesive surface 30a of the holding sheet 30 and the downstream end of the pressure plate 52 in the second direction Y is, for example, 1.5 mm. The distance ΔL2 between the adhesive surface 30a of the holding sheet 30 and the downstream end of the mounting table 31 in the second direction Y is, for example, 0.5 mm.

[0109] The surface of base plate 50 facing component supply device 45 and pressure plate 52 are made of, for example, ultra-high molecular weight polyethylene film or fluororesin film. By making pressure plate 52 out of ultra-high molecular weight polyethylene film or fluororesin film, damage to the sliding laminate sheet, laminate block 22, or laminate chip 23 can be reduced.

[0110] According to the method for manufacturing a multilayer electronic component according to the present disclosure, the number of steps in the alignment work can be reduced, the laminated chips can be aligned reliably, and the efficiency of the alignment work can be improved.

[0111] The present disclosure can be implemented in the following configurations (1) to (8).

[0112] (1) A method for manufacturing a multilayer electronic component, comprising: a laminate sheet preparation step of stacking a plurality of green sheets, on each of which a conductive film is formed, constituting a plurality of internal electrodes aligned in a first direction and a second direction perpendicular to the first direction in a plan view, to prepare a laminate sheet; a cutting step of cutting the laminate sheet in the first direction and the second direction to prepare a plurality of laminate chips; a mounting step of mounting the plurality of laminate chips in an aligned state on the mounting surface of a mounting table having a flat mounting surface; an adhesion step of pressing the plurality of laminate chips on the mounting surface with a predetermined pressing force in the second direction, and adhering a side of the laminate chip that is positioned furthest downstream in the second direction among the plurality of laminate chips to an adhesive surface of a holding sheet having an adhesive surface perpendicular to the second direction; and a moving step of moving the holding sheet in a third direction perpendicular to the first direction and the second direction, to move the laminate chip adhered to the adhesive surface in the third direction.

[0113] (2) A method for manufacturing a multilayer electronic component, comprising: a laminate sheet preparation step of stacking a plurality of green sheets, on each of which a conductive film is formed, constituting a plurality of internal electrodes aligned in a first direction and a second direction perpendicular to the first direction in a plan view, to prepare a laminate sheet; a placement step of cutting the laminate sheet in the first direction to prepare a plurality of laminate blocks, and placing the laminate blocks in an aligned state on the placement surface of a placement table having a flat placement surface; an adhesion step of pressing the plurality of laminate blocks on the placement surface with a predetermined pressing force in the second direction, and adhering the side surfaces of the laminate blocks downstream in the second direction to an adhesive surface of a holding sheet having an adhesive surface perpendicular to the second direction; and a moving step of moving the holding sheet in a third direction perpendicular to the first direction and the second direction, to move the laminate blocks adhered to the adhesive surface in the third direction.

[0114] (3) A method for manufacturing a multilayer electronic component, comprising: a laminate sheet preparation step of stacking a plurality of green sheets, on which conductive films constituting a plurality of internal electrodes are formed and aligned in a first direction and a second direction perpendicular to the first direction in a plan view, to prepare a laminate sheet; a mounting step of cutting the laminate sheet in the second direction to prepare a plurality of laminate blocks, and mounting the plurality of laminate blocks in an aligned state on the mounting surface of a mounting table having a flat mounting surface; a cutting step of cutting the laminate blocks on the mounting surface in the first direction to prepare a plurality of laminate chips; an adhesion step of pressing the plurality of laminate chips in the second direction with a predetermined pressing force to adhere side surfaces of the plurality of laminate chips to an adhesive surface of a holding sheet having an adhesive surface perpendicular to the second direction; and a moving step of moving the holding sheet in a third direction perpendicular to the first direction and the second direction, to move the laminate chips adhered to the adhesive surface in the third direction.

[0115] (4) A method for manufacturing a multilayer electronic component, comprising: a laminate sheet preparation step of preparing a laminate sheet by stacking a plurality of green sheets, each having a conductive film formed thereon that constitutes a plurality of internal electrodes aligned in a first direction and a second direction perpendicular to the first direction in a plan view; a placement step of placing the laminate sheet on the placement surface of a placement table having a flat placement surface; an adhesion step of pressing the laminate sheet on the placement surface with a predetermined pressing force in the second direction, and adhering a downstream side of the laminate sheet in the second direction to an adhesive surface of a holding sheet having an adhesive surface perpendicular to the second direction; a cutting step of cutting the laminate sheet adhered to the adhesive surface in the first direction to prepare laminate blocks; and a moving step of moving the holding sheet in a third direction perpendicular to the first direction and the second direction, thereby moving the laminate block adhered to the adhesive surface in the third direction.

[0116] (5) A method for manufacturing a multilayer electronic component, comprising: a laminate sheet preparation step of stacking a plurality of green sheets, on each of which a conductive film constituting a plurality of internal electrodes is formed, the conductive film being aligned in a first direction and a second direction perpendicular to the first direction in a plan view, to prepare a laminate sheet; a mounting step of cutting the laminate sheet in the second direction to prepare a plurality of laminate blocks, and mounting the plurality of laminate blocks in an aligned state on the mounting surface of a mounting table having a flat mounting surface; an adhering step of pressing the plurality of laminate blocks on the mounting surface with a predetermined pressing force in the second direction, and adhering the downstream side surfaces of the plurality of laminate blocks in the second direction to an adhesive surface of a holding sheet having an adhesive surface perpendicular to the second direction; a cutting step of cutting the plurality of laminate blocks adhered to the adhesive surface in the first direction to prepare a plurality of laminate chips; and a moving step of moving the holding sheet in a third direction perpendicular to the first direction and the second direction, to move the laminate chips adhered to the adhesive surface in the third direction.

[0117] (6) The method for producing a multilayer electronic component according to (1) above, further comprising a protective layer forming step of forming a protective layer on the side surface of the laminate chip on which the internal electrodes of opposite polarities are exposed.

[0118] (7) The predetermined pressing force is 1 g / mm ２ 100g / mm or more ２ A method for producing a multilayer electronic component according to any one of (1) to (6) above, which is as follows:

[0119] (8) The method for producing a multilayer electronic component according to any one of (1) to (7) above, wherein the adhesive surface of the holding sheet has an adhesive strength of 0.01 N / mm or more and 10.00 N / mm or less.

[0120] Although the embodiments of the present disclosure have been described in detail above, the present disclosure is not limited to the above-described embodiments, and various modifications and improvements are possible within the scope of the gist of the present disclosure. It goes without saying that all or part of the components constituting each of the above-described embodiments can be combined as appropriate within the scope of not contradicting each other.

[0121] REFERENCE SIGNS LIST 1 Multilayer ceramic capacitor 2 Element body 3 External electrode 3a First external electrode 3b Second external electrode 4 Dielectric layer 5 Internal electrode 6 Protective layer 7a First surface 7b Second surface 8a First end surface 8b Second end surface 9a First side surface 9b Second side surface 11 Cutting device 12 Through hole 13 Base 13a Support surface 14 First cutting blade 15 Second cutting blade 16 First support 17 Second support 18 Push-out member 19a, 19b Guide member 20 Push-out drive device 21 Laminate 22 Laminate block 23 Laminate chip 24, 25 Base 26, 27 Blade tip 30 Holding sheet 30a Adhesive surface 31 Mounting table 31a Mounting surface 40 Alignment device 41 Floor 42 Base 43 Support 44 Holding sheet drive device 45 Aligned component supply device 46 Lifting drive unit 47 Guide rail 48 Lifting body 49 Lifting frame 50 Base plate 51 Base plate 52 Pressing plate 53 Rib plate 54 Spring biasing unit b Cutting depth D1 Push-out direction X First direction Y Second direction Z Third direction

Claims

1. A method for manufacturing a multilayer electronic component, comprising: a laminate sheet preparation step of preparing a laminate sheet by stacking a plurality of green sheets, each having a conductive film formed thereon that constitutes a plurality of internal electrodes aligned in a first direction and a second direction perpendicular to the first direction in a plan view; a cutting step of cutting the laminate sheet in the first direction and the second direction to prepare a plurality of laminate chips; a mounting step of mounting the plurality of laminate chips in an aligned state on the mounting surface of a mounting stand having a flat mounting surface; an adhesion step of pressing the plurality of laminate chips on the mounting surface with a predetermined pressing force in the second direction, and adhering a side of the laminate chip that is located most downstream in the second direction among the plurality of laminate chips to an adhesive surface of a holding sheet having an adhesive surface perpendicular to the second direction; and a moving step of moving the holding sheet in a third direction perpendicular to the first direction and the second direction, to move the laminate chip adhered to the adhesive surface in the third direction.

2. A method for manufacturing a multilayer electronic component, comprising: a laminate sheet preparation step of preparing a laminate sheet by stacking a plurality of green sheets, each having a conductive film formed thereon that constitutes a plurality of internal electrodes aligned in a first direction and a second direction perpendicular to the first direction in a plan view; a placement step of cutting the laminate sheet in the first direction to prepare a plurality of laminate blocks, and placing the laminate blocks in an aligned state on the mounting surface of a mounting table having a flat mounting surface; an adhesion step of pressing the plurality of laminate blocks on the mounting surface with a predetermined pressing force in the second direction, and adhering the downstream side of the laminate blocks in the second direction to an adhesive surface of a holding sheet having an adhesive surface perpendicular to the second direction; and a moving step of moving the holding sheet in a third direction perpendicular to the first direction and the second direction, to move the laminate blocks adhered to the adhesive surface in the third direction.

3. A method for manufacturing a multilayer electronic component, comprising: a laminate sheet preparation step of preparing a laminate sheet by stacking a plurality of green sheets, on which conductive films constituting a plurality of internal electrodes are formed and aligned in a first direction and a second direction perpendicular to the first direction in a plan view; a placement step of cutting the laminate sheet in the second direction to prepare a plurality of laminate blocks, and placing the laminate blocks in an aligned state on the mounting surface of a mounting table having a flat mounting surface; a cutting step of cutting the laminate blocks on the mounting surface in the first direction to prepare a plurality of laminate chips; an adhesion step of pressing the plurality of laminate chips in the second direction with a predetermined pressing force and adhering side surfaces of the plurality of laminate chips to an adhesive surface of a holding sheet having an adhesive surface perpendicular to the second direction; and a moving step of moving the holding sheet in a third direction perpendicular to the first direction and the second direction, to move the laminate chips adhered to the adhesive surface in the third direction.

4. A method for manufacturing a multilayer electronic component, comprising: a laminate sheet preparation step of preparing a laminate sheet by stacking a plurality of green sheets, each having a conductive film formed thereon that constitutes a plurality of internal electrodes aligned in a first direction and a second direction perpendicular to the first direction in a plan view; a placement step of placing the laminate sheet on the placement surface of a placement stand having a flat placement surface; an adhesion step of pressing the laminate sheet on the placement surface with a predetermined pressing force in the second direction, and adhering a downstream side surface of the laminate sheet in the second direction to an adhesive surface of a holding sheet having an adhesive surface perpendicular to the second direction; a cutting step of cutting the laminate sheet adhered to the adhesive surface in the first direction to prepare a laminate block; and a moving step of moving the holding sheet in a third direction perpendicular to the first direction and the second direction, to move the laminate block adhered to the adhesive surface in the third direction.

5. A method for manufacturing a multilayer electronic component, comprising: a laminate sheet preparation step of stacking a plurality of green sheets, on which conductive films constituting a plurality of internal electrodes aligned in a first direction and a second direction perpendicular to the first direction in a plan view, to prepare a laminate sheet; a loading step of cutting the laminate sheet in the second direction to prepare a plurality of laminate blocks, and loading the plurality of laminate blocks in an aligned state on the loading surface of a loading stand having a flat loading surface; an adhesion step of pressing the plurality of laminate blocks on the loading surface with a predetermined pressing force in the second direction, and adhering the downstream side surfaces of the plurality of laminate blocks in the second direction to an adhesive surface of a holding sheet having an adhesive surface perpendicular to the second direction; a cutting step of cutting the plurality of laminate blocks adhered to the adhesive surface in the first direction to prepare a plurality of laminate chips; and a moving step of moving the holding sheet in a third direction perpendicular to the first direction and the second direction, to move the laminate chips adhered to the adhesive surface in the third direction.

6. The method for producing a multilayer electronic component according to claim 1, further comprising a protective layer forming step of forming a protective layer on the side surface of the multilayer chip on which the internal electrodes of opposite polarity are exposed.

7. The predetermined pressure is 1 g / mm ２ More than 100g / mm ２ The method for producing a multilayer electronic component according to any one of claims 1 to 6, wherein:

8. The method for manufacturing a multilayer electronic component according to any one of claims 1 to 7, wherein the adhesive surface of the holding sheet has an adhesive strength of 0.01 N / mm or more and 10.00 N / mm or less.

Images