Resin composition, film, optical filter, solid-state imaging element, image display device, infrared sensor, and camera module

Abstract

The present invention is a resin composition containing an infrared-absorbing dye A, a resin B, a polymerizable monomer C, and a photopolymerization initiator D, wherein the infrared-absorbing dye A includes a phthalocyanine metal complex A1 forming a quadrangular pyramid structure from metal atoms a1 and a phthalocyanine compound a2, the resin B includes a resin b1 having an acid group and an acid value of 80-300 mg KOH / g, the phthalocyanine compound a2 constituting the phthalocyanine metal complex A1 has a Hansen solubility parameter distance of 13 MPa0.5 or less with the polymerizable monomer C, and the content of the polymerizable monomer C in the total solid content of the resin composition is 14 mass% or more. Also provided are a film, an optical filter, a solid-state imaging element, an image display device, an infrared sensor, and a camera module using the resin composition.

Description

Resin composition, film, optical filter, solid-state imaging device, image display device, infrared sensor and camera module

[0001] The present invention relates to a resin composition containing an infrared absorbing dye. The present invention also relates to a film, an optical filter, a solid-state imaging device, an image display device, an infrared sensor, and a camera module, which use the resin composition containing the infrared absorbing dye.

[0002] Video cameras, digital still cameras, and mobile phones with camera functions use solid-state image sensors for color imaging, such as CCDs (charge-coupled devices) and CMOSs ​​(complementary metal-oxide semiconductors). These solid-state image sensors use silicon photodiodes that are sensitive to infrared light in their light-receiving sections. For this reason, an infrared cut filter is sometimes used to correct visibility.

[0003] Infrared cut filters are produced using resin compositions containing infrared absorbing dyes, such as phthalocyanine metal complexes.

[0004] Patent Document 1 describes the production of an infrared cut filter or the like using a resin composition containing a specific aluminum phthalocyanine metal complex.

[0005] International Publication No. 2022 / 172980

[0006] Since the band gap of a dye compound narrows as the absorption wavelength shifts to longer wavelengths, it has been difficult to achieve a HOMO (Highest Occupied Molecular Orbital)-LUMO (Lowest Unoccupied Molecular Orbital) level that allows for compatibility with various resistances (heat, light, radicals, oxidation, reduction, etc.). For this reason, infrared absorbing dyes tend to be easily decomposed by the influence of heat and the like, and have low heat resistance.

[0007] Furthermore, according to the investigations of the present inventors, it has been found that in phthalocyanine metal complexes having a complex structure in which the metal atom is not present at the center of the phthalocyanine compound because the size of the metal atom is too large or the metal atom is attracted to an axial ligand, and the metal atom and the phthalocyanine compound form a square pyramidal structure, the metal atom is easily desorbed, and the desorption proceeds easily even under mild acidic conditions, and the desorption reaction of the metal atom is more likely to be promoted under high-temperature acidic conditions. Desorption of the metal atom from the phthalocyanine metal complex causes fluctuations in the spectroscopic characteristics.

[0008] In recent years, it has been considered to form pixels by forming a pattern by photolithography using a resin composition containing an infrared absorbing dye. In order to improve the developability of the resin composition, it is common to use a resin with a high acid value.

[0009] However, according to the investigations of the present inventors, it has been found that when a phthalocyanine metal complex in which a metal atom and a phthalocyanine compound form a square pyramidal structure is used as an infrared absorbing dye in a resin composition containing a resin with a high acid value, the heat resistance of the resulting film is low and the spectral characteristics before and after heating vary greatly.

[0010] Therefore, an object of the present invention is to provide a resin composition capable of forming a film having excellent developability and heat resistance, and a film, an optical filter, a solid-state imaging device, an image display device, an infrared sensor, and a camera module.

[0011] The present invention provides the following:

[0012] <1> A resin composition comprising an infrared absorbing dye A, a resin B, a polymerizable monomer C, and a photopolymerization initiator D, wherein the infrared absorbing dye A comprises a phthalocyanine metal complex A1 that forms a square pyramidal structure with a metal atom a1 and a phthalocyanine compound a2, the resin B comprises a resin b1 that has an acid group and has an acid value of 80 to 300 mgKOH / g, and the phthalocyanine compound a2 constituting the phthalocyanine metal complex A1 has a Hansen solubility parameter distance with the polymerizable monomer C of 13 MPa or less. ０．５<2> The phthalocyanine compound a2 constituting the phthalocyanine metal complex A1 has a Hansen solubility parameter distance from the polymerizable monomer C of 10 MPa or less, and a content of the polymerizable monomer C in the total solid content of the resin composition is 14 mass % or more. ０．５ The resin composition according to <1>, wherein the polymerizable monomer C is 150 parts by mass or more per 100 parts by mass of the photopolymerization initiator D. <3> The resin composition according to <1> or <2>, wherein the polymerizable monomer C is 150 parts by mass or more per 100 parts by mass of the photopolymerization initiator D. <4> The resin composition according to any one of <1> to <3>, wherein the metal atom a1 is Pb, Sn, Fe, Mg, Ta, Nb, Ga, Al, Ti, V, or Mo. <5> The resin composition according to any one of <1> to <3>, wherein the metal atom a1 is Ga, Al, Ti, V, or Mo. <6> The resin composition according to any one of <1> to <5>, wherein a ligand other than the phthalocyanine compound a2 is further coordinated to the metal atom a1. <7> The resin composition according to any one of <1> to <5>, wherein a ligand other than the phthalocyanine compound a2 is further coordinated to the metal atom a1, and the polymerizable monomer C includes a polymerizable monomer C1 having a hydroxy group. <8> The resin composition according to any one of <1> to <7>, further comprising a chromatic colorant. <9> A film obtained using the resin composition according to any one of <1> to <8>. <10> An optical filter comprising the film according to <9>. <11> A solid-state imaging device comprising the film according to <9>. <12> An image display device comprising the film according to <9>. <13> An infrared sensor comprising the film according to <9>. <14> A camera module comprising the film according to <9>.

[0013] According to the present invention, it is possible to provide a resin composition capable of forming a film having excellent developability and heat resistance. The present invention also provides a film, an optical filter, a solid-state imaging device, an image display device, an infrared sensor, and a camera module.

[0014] FIG. 1 is a schematic diagram illustrating an embodiment of an infrared sensor.

[0015] The present invention will be described in detail below. In this specification, the term "to" is used to mean that the numerical values ​​before and after the term are included as the lower and upper limits. In the description of groups (atomic groups) in this specification, a term without specifying whether it is substituted or unsubstituted encompasses both unsubstituted groups (atomic groups) and substituted groups (atomic groups). For example, the term "alkyl group" encompasses not only unsubstituted alkyl groups (unsubstituted alkyl groups) but also substituted alkyl groups (substituted alkyl groups). In this specification, unless otherwise specified, "exposure" includes not only exposure using light but also drawing using particle beams such as electron beams and ion beams. Examples of light used for exposure include the bright line spectrum of a mercury lamp, far ultraviolet light typified by excimer lasers, extreme ultraviolet light (EUV light), X-rays, electron beams, and other actinic rays or radiation. As used herein, "(meth)acrylate" refers to either or both of acrylate and methacrylate, "(meth)acrylic" refers to either or both of acrylic and methacrylic, and "(meth)acryloyl" refers to either or both of acryloyl and methacryloyl. As used herein, weight-average molecular weight and number-average molecular weight are defined as polystyrene equivalent values ​​measured by gel permeation chromatography (GPC). As used herein, Me in chemical formulas represents a methyl group, Et represents an ethyl group, Bu represents a butyl group, and Ph represents a phenyl group. As used herein, infrared light refers to light (electromagnetic waves) with a wavelength of 700 to 2500 nm. As used herein, total solids refers to the total mass of all components of a composition excluding the solvent. As used herein, the term "process" refers not only to an independent process, but also to a process that cannot be clearly distinguished from other processes, as long as the intended effect of the process is achieved.

[0016] <Resin Composition> The resin composition of the present invention is a resin composition containing an infrared absorbing dye A, a resin B, a polymerizable monomer C, and a photopolymerization initiator D, wherein the infrared absorbing dye A contains a phthalocyanine metal complex A1 that forms a square pyramidal structure with a metal atom a1 and a phthalocyanine compound a2, the resin B contains a resin b1 that has an acid group and has an acid value of 80 to 300 mgKOH / g, and the phthalocyanine compound a2 that constitutes the phthalocyanine metal complex A1 has a Hansen solubility parameter distance with the polymerizable monomer C of 13 MPa or less. ０．５ or less, and the content of the polymerizable monomer C in the total solid content of the resin composition is 14 mass% or more.

[0017] The resin composition of the present invention has excellent developability and can form a film with excellent heat resistance, in which the change in spectroscopic characteristics before and after heating is suppressed, even when heated to high temperatures. The reason for this effect is presumed to be as follows. Specifically, the resin composition of the present invention has excellent developability because it contains a resin b1 having an acid group and an acid value of 80 to 300 mgKOH / g. Meanwhile, the phthalocyanine metal complex A1 has a complex structure in which a metal atom and a phthalocyanine compound form a square pyramidal structure, so that the metal atom is easily desorbed, and desorption easily proceeds even under mild acidic conditions. However, in the present invention, the phthalocyanine compound a2 constituting the phthalocyanine metal complex A1 has a Hansen solubility parameter distance with the polymerizable monomer C of 13 MPa. ０．５ It is presumed that the use of a combination of phthalocyanine metal complex A1 and polymerizable monomer C that satisfy the following conditions makes it easier for polymerizable monomer C to be present around phthalocyanine metal complex A1 in the film, and that the polymerizable monomer C can suppress abstraction of metal atoms from phthalocyanine metal complex A1 by resin b1. Therefore, it is presumed that the resin composition of the present invention can form a film that has excellent heat resistance and in which fluctuations in spectroscopic properties before and after heating are suppressed, even when heated to high temperatures.

[0018] In the resin composition of the present invention, the phthalocyanine compound a2 constituting the phthalocyanine metal complex A1 has a Hansen solubility parameter distance (hereinafter also referred to as ΔHSP) with the polymerizable monomer C of 10 MPa or less. ０．５ Preferably, it is 8 MPa or less. ０．５ More preferably, it is 7 MPa or less. ０．５ The lower limit is preferably 0 MPa or less. ０．５ It can be more than that.

[0019] The Hansen solubility parameter (δ) is a physical property defined as the square root of the cohesive energy density, and is a parameter that takes into account the polarity of a substance by dividing it into three components: a dispersion term (δd), a polarization term (δp), and a hydrogen bond term (δh). The Hansen solubility parameter distance between the phthalocyanine compound a2 and the polymerizable monomer C can be calculated using the following formula: (δ) ２ = (δd1 - δd2) ２ +(δp1-δp2) ２ + (δ h1 - δ h2) ２ δ: Hansen solubility parameter distance between phthalocyanine compound a2 and polymerizable monomer C δd1: value of dispersion term of Hansen solubility parameter of phthalocyanine compound a2 δd2: value of dispersion term of Hansen solubility parameter of polymerizable monomer C δp1: value of polarization term of Hansen solubility parameter of phthalocyanine compound a2 δp2: value of polarization term of Hansen solubility parameter of polymerizable monomer C δh1: value of hydrogen bond term of Hansen solubility parameter of phthalocyanine compound a2 δh2: value of hydrogen bond term of Hansen solubility parameter of polymerizable monomer C

[0020] When the resin composition of the present invention contains two or more phthalocyanine metal complexes A1, the values ​​of δd1, δp1, and δh1 are each the mass average values ​​of two or more phthalocyanine compounds a2. When the resin composition of the present invention contains two or more polymerizable monomers C, the values ​​of δd2, δp2, and δh2 are each the mass average values ​​of two or more polymerizable monomers C.

[0021] In this specification, the values ​​of the dispersion term (δd), polarization term (δp), and hydrogen bond term (δh) of the Hansen solubility parameters are values ​​calculated using the software Hansen Solubility Parameters in Practice (HSPiP) ver. 5.3.06.

[0022] In the resin composition of the present invention, the difference between the value of the dispersion term (δd) of the Hansen solubility parameter of the phthalocyanine compound a2 constituting the phthalocyanine metal complex A1 and the value of the dispersion term (δd) of the Hansen solubility parameter of the polymerizable monomer C (hereinafter also referred to as ΔHSP-d) is 10 MPa because it becomes easy to approach the π-conjugated system of the phthalocyanine compound. ０．５ It is preferable that the temperature is 9 MPa or less. ０．５ More preferably, it is 8 MPa or less. ０．５ The lower limit is preferably 0 MPa or less. ０．５ It can be more than that.

[0023] In the resin composition of the present invention, the difference between the value of the polarization term (δp) of the Hansen solubility parameter of the phthalocyanine compound a2 constituting the phthalocyanine metal complex A1 and the value of the polarization term (δp) of the Hansen solubility parameter of the polymerizable monomer C (hereinafter also referred to as ΔHSP-p) is 10 MPa or less because it becomes easier to approach the polar group in the phthalocyanine compound. ０．５ Preferably, it is 8 MPa or less. ０．５ More preferably, it is 6 MPa or less. ０．５ The lower limit is preferably 0 MPa or less. ０．５ It can be more than that.

[0024] In the resin composition of the present invention, the difference (hereinafter also referred to as ΔHSP-H) between the value of the hydrogen bond term (δh) of the Hansen solubility parameter of the phthalocyanine compound a2 constituting the phthalocyanine metal complex A1 and the value of the hydrogen bond term (δh) of the Hansen solubility parameter of the polymerizable monomer C is 10 MPa because the phthalocyanine compound a2 is less likely to be attracted to hydrogen-bonding compounds other than the phthalocyanine compound. ０．５ It is preferable that the temperature is 9 MPa or less. ０．５More preferably, it is 8 MPa or less. ０．５ The lower limit is preferably 0 MPa or less. ０．５ It can be more than that.

[0025] The resin composition of the present invention can be used as a composition for optical filters, such as infrared cut filters and infrared transmission filters.

[0026] Each component used in the resin composition of the present invention will be described below.

[0027] <<Infrared absorbing dye A>> (Specific phthalocyanine metal complex) The resin composition of the present invention contains an infrared absorbing dye A (hereinafter referred to as infrared absorbing dye). The infrared absorbing dye used contains a phthalocyanine metal complex A1 (hereinafter also referred to as specific phthalocyanine metal complex) in which a metal atom a1 and a phthalocyanine compound a2 form a square pyramidal structure.

[0028] -Phthalocyanine Compound a2- Examples of the phthalocyanine compound a2 in the specific phthalocyanine metal complex include compounds represented by formula (1). In formula (1), X １ａ ~X １ｐ each independently represents a hydrogen atom, a halogen atom, a nitro group, a cyano group, a sulfo group, a carboxy group, an alkyl group, an aryl group, a heterocyclic group, an alkoxy group, an aryloxy group, a heterocyclic oxy group, an alkylthio group, an arylthio group, a heterocyclic thio group, an amino group, an acyl group, an alkoxycarbonyl group, an aryloxycarbonyl group, a heterocyclic oxycarbonyl group, a phthalimidomethyl group, a carbamoyl group, or a sulfamoyl group; １ａ ~X １ｐ may each independently bond to each other to form an aromatic ring.

[0029] When the phthalocyanine compound a2 is coordinated to a metal atom, the hydrogen atoms at the coordinated portion with the metal atom are dissociated. Therefore, in the compound represented by formula (1), when the compound is coordinated to a metal atom, the two hydrogen atoms present in the central portion (hydrogen atoms present on the nitrogen atoms of the pyrrole ring) are dissociated. Formula (1a) shows the state in which the phthalocyanine compound a2 is coordinated to a metal atom to form a complex. M １ is a metal atom. In the structural formula shown below, the metal atom and the phthalocyanine compound are shown on the same plane, but in reality, the metal atom is coordinated away from the center of the phthalocyanine compound, and the metal atom and the phthalocyanine compound form a square pyramidal structure. In formula (1a), the metal atom M １ may further be coordinated with other ligands as described below.

[0030] Examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom.

[0031] The number of carbon atoms in the alkyl group, alkoxy group, and alkylthio group is preferably 1 to 20, more preferably 1 to 10, and even more preferably 1 to 5. The alkyl group, alkoxy group, and alkylthio group may be linear, branched, or cyclic, but linear or branched groups are preferred, and linear groups are more preferred. The alkyl group, alkoxy group, and alkylthio group may have a substituent or may be unsubstituted. Examples of the substituent include an alkoxy group, an aryl group, a heterocyclic group, and a halogen atom.

[0032] The number of carbon atoms in the aryl group, aryloxy group, and arylthio group is preferably 6 to 30, more preferably 6 to 20, and even more preferably 6 to 12. The aryl group, aryloxy group, and arylthio group may have a substituent or may be unsubstituted. Examples of the substituent include an alkyl group, an alkoxy group, an aryl group, a heterocyclic group, and a halogen atom.

[0033] With respect to the heterocyclic group, heterocyclic oxy group, heterocyclic thio group, and heterocyclic oxycarbonyl group, the number of carbon atoms constituting the heterocyclic ring is preferably 1 to 30, more preferably 1 to 12. Examples of heteroatoms constituting the heterocyclic ring include nitrogen atoms, oxygen atoms, and sulfur atoms. The number of heteroatoms constituting the heterocyclic ring is preferably 1 to 3, more preferably 1 to 2. The heterocyclic ring is preferably a monocyclic ring or a fused ring having 2 to 8 rings, more preferably a monocyclic ring or a fused ring having 2 to 4 rings. The heterocyclic group, heterocyclic oxy group, heterocyclic thio group, and heterocyclic oxycarbonyl group may have a substituent or may be unsubstituted. Examples of the substituent include an alkyl group, an alkoxy group, an aryl group, a heterocyclic group, and a halogen atom.

[0034] The number of carbon atoms in the acyl group and alkoxycarbonyl group is preferably 2 to 30, and more preferably 2 to 20. The acyl group and alkoxycarbonyl group may have a substituent or may be unsubstituted. Examples of the substituent include an alkyl group, an alkoxy group, an aryl group, a heterocyclic group, and a halogen atom.

[0035] The aryloxycarbonyl group preferably has 7 to 30 carbon atoms, more preferably 7 to 20 carbon atoms, and even more preferably 7 to 12 carbon atoms. The aryloxycarbonyl group may have a substituent or may be unsubstituted. Examples of the substituent include an alkyl group, an alkoxy group, an aryl group, a heterocyclic group, and a halogen atom.

[0036] The amino group is -NRa １ Ra ２ and a cyclic amino group. １ Ra ２ In the group represented by １ and Ra ２are each independently a hydrogen atom, an alkyl group, or an aryl group, and are preferably an alkyl group. The number of carbon atoms in the alkyl group is preferably 1 to 10, more preferably 1 to 5, and even more preferably 1 to 3. The alkyl group may be linear, branched, or cyclic, but is preferably linear or branched, and more preferably linear. The alkyl group may have a substituent. Examples of the substituent include the groups listed for the substituent T described below. The number of carbon atoms in the aryl group is preferably 6 to 30, more preferably 6 to 20, and even more preferably 6 to 12. The aryl group may have a substituent. Examples of the substituent include an alkyl group, an alkoxy group, an aryl group, a heterocyclic group, and a halogen atom. Ra １ and Ra ２ and may be bonded to form a ring. Examples of the cyclic amino group include a pyrrolidine group, a piperidine group, a piperazine group, and a morpholine group. These groups may further have a substituent. Examples of the substituent include an alkyl group, an alkoxy group, an aryl group, a heterocyclic group, and a halogen atom.

[0037] In formula (1), adjacent X １ａ ~X １ｐ may each independently bond to each other to form an aromatic ring. １ｂ and X １ｃ , X １ｆ and X １ｇ , X １ｊ and X １ｋ , X １ｎ and X １ｏ It is preferable that at least one pair of these groups are bonded to each other to form an aromatic ring. The aromatic ring formed above may have a substituent. Examples of the substituent include a halogen atom, a nitro group, a cyano group, a sulfo group, a carboxy group, an alkyl group, an aryl group, a heterocyclic group, an alkoxy group, an aryloxy group, a heterocyclic oxy group, an alkylthio group, an arylthio group, a heterocyclic thio group, an amino group, an acyl group, an alkoxycarbonyl group, an aryloxycarbonyl group, a heterocyclic oxycarbonyl group, a phthalimidomethyl group, a carbamoyl group, and a sulfamoyl group. Details of these groups are as described above.

[0038] When the phthalocyanine compound a2 is a compound represented by formula (1), the phthalocyanine compound a2 is a compound represented by formula (1) １ｂ and X １ｃ , X １ｆ and X １ｇ , X １ｊ and X １ｋ , X １ｎ and X １ｏ and a compound in which none of X forms an aromatic ring. １ｂ and X １ｃ , X １ｆ and X １ｇ , X １ｊ and X １ｋ , X １ｎ and X １ｏ In addition, the compound may contain one or more compounds in which one or more pairs of X in formula (1) are bonded to each other to form an aromatic ring. １ｂ and X １ｃ , X １ｆ and X １ｇ , X １ｊ and X １ｋ , X １ｎ and X １ｏ The compound may contain a plurality of compounds in which one or more pairs of X in formula (1) are bonded to each other to form an aromatic ring. １ｂ and X １ｃ , X １ｆ and X １ｇ , X １ｊ and X １ｋ , X １ｎ and X １ｏ An example of an embodiment containing a plurality of compounds in which one or more pairs of X are bonded to each other to form an aromatic ring is １ｂ and X １ｃ , X １ｆ and X １ｇ , X １ｊ and X １ｋ , X １ｎ and X １ｏ a compound in which any one pair of X is bonded to each other to form an aromatic ring; １ｂ and X １ｃ , X １ｆ and X １ｇ , X １ｊ and X １ｋ , X １ｎ and X １ｏ and a compound in which any two or more pairs of the above are bonded to each other to form an aromatic ring;１ｂ and X １ｃ , X １ｆ and X １ｇ , X １ｊ and X １ｋ , X １ｎ and X １ｏ a compound in which any two pairs of X are bonded to each other to form an aromatic ring; １ｂ and X １ｃ , X １ｆ and X １ｇ , X １ｊ and X １ｋ , X １ｎ and X １ｏ and a compound in which any three or more pairs of the above are bonded to each other to form an aromatic ring; １ｂ and X １ｃ , X １ｆ and X １ｇ , X １ｊ and X １ｋ , X １ｎ and X １ｏ a compound in which any three pairs of X are bonded to each other to form an aromatic ring; １ｂ and X １ｃ , X １ｆ and X １ｇ , X １ｊ and X １ｋ , X １ｎ and X １ｏ and the like, which include compounds in which the above-mentioned groups are bonded to each other to form an aromatic ring.

[0039] -Metal atom a1- Examples of the metal atom a1 in the specific phthalocyanine metal complex include Pb, Sn, Fe, Mg, Ta, Nb, Ga, Al, Ti, V, and Mo. Ga, Al, Ti, V, or Mo is preferred, and Al is more preferred.

[0040] -Other Ligands- In the specific phthalocyanine metal complex, the metal atom a1 may further be coordinated with a ligand other than the phthalocyanine compound a2 (hereinafter also referred to as "other ligands"). Examples of the other ligands include oxygen atoms, halogen atoms, -OR Ｍ１ , -OCOR Ｍ１ , -OSO ２ R Ｍ１ , and ligands represented by formulas (6) to (8). Ｍ１represents a hydrogen atom, an alkyl group, an aryl group, or a heterocyclic group.

[0041] R Ｍ１ The number of carbon atoms in the alkyl group represented by is preferably 1 to 20, more preferably 1 to 10, and even more preferably 1 to 5. The alkyl group may be linear, branched, or cyclic, but is preferably linear or branched, and more preferably linear. The alkyl group may have a substituent or may be unsubstituted. Examples of the substituent include an alkoxy group, an aryl group, a heterocyclic group, and a halogen atom.

[0042] R Ｍ１ The number of carbon atoms in the aryl group represented by is preferably 6 to 30, more preferably 6 to 20, and even more preferably 6 to 12. The aryl group may have a substituent or may be unsubstituted. Examples of the substituent include an alkyl group, an alkoxy group, an aryl group, a heterocyclic group, and a halogen atom.

[0043] R Ｍ１ The number of carbon atoms constituting the heterocyclic ring of the heterocyclic group represented by is preferably 1 to 30, more preferably 1 to 12. Examples of heteroatoms constituting the heterocyclic ring include nitrogen atoms, oxygen atoms, and sulfur atoms. The number of heteroatoms constituting the heterocyclic ring is preferably 1 to 3, more preferably 1 to 2. The heterocyclic ring is preferably a monocyclic ring or a fused ring having 2 to 8 rings, more preferably a monocyclic ring or a fused ring having 2 to 4 rings. The heterocyclic group may have a substituent or may be unsubstituted. Examples of the substituent include an alkyl group, an alkoxy group, an aryl group, a heterocyclic group, and a halogen atom.

[0044] The other ligand is preferably a ligand represented by formula (6) to formula (8), more preferably a ligand represented by formula (7) or formula (8), and even more preferably a ligand represented by formula (7). Compounds having ligands represented by formula (6) to formula (8) can be synthesized with reference to the description in paragraphs 0081 to 0084 of JP-A-2022-091099.

[0045]

[0046] In formula (6), R ６ａ and R ６ｂ each independently represents a hydroxy group, an alkyl group, a heterocyclic group, an aryl group, an alkoxy group, a heterocyclic oxy group, or an aryloxy group; R ６ａ and R ６ｂ may be bonded to each other to form a ring, and * is a coordination site with a metal atom.

[0047] R ６ａ and R ６ｂ The alkyl group and alkoxy group represented by the formula (I) preferably have 1 to 20 carbon atoms, more preferably 1 to 10 carbon atoms, and even more preferably 1 to 5 carbon atoms. The alkyl group and alkoxy group may be linear, branched, or cyclic, but linear or branched groups are preferred, and linear groups are more preferred. The alkyl group and alkoxy group may have a substituent or may be unsubstituted. Examples of the substituent include an alkoxy group, an aryl group, a heterocyclic group, a halogen atom, a nitro group, a vinyl group, a (meth)allyl group, a (meth)acryloyl group, and a (meth)acryloyloxy group.

[0048] R ６ａ and R ６ｂ The aryl group and aryloxy group represented by the formula (I) preferably have 6 to 30 carbon atoms, more preferably 6 to 20 carbon atoms, and even more preferably 6 to 12 carbon atoms. The aryl group and aryloxy group may have a substituent or may be unsubstituted. Examples of the substituent include an alkyl group, an alkoxy group, an aryl group, a heterocyclic group, a halogen atom, a nitro group, a vinyl group, a (meth)allyl group, a (meth)acryloyl group, and a (meth)acryloyloxy group.

[0049] With regard to the heterocyclic group and heterocyclic-oxy ​​group, the number of carbon atoms constituting the heterocyclic ring is preferably 1 to 30, more preferably 1 to 12. Examples of heteroatoms constituting the heterocyclic ring include nitrogen atoms, oxygen atoms, and sulfur atoms. The number of heteroatoms constituting the heterocyclic ring is preferably 1 to 3, more preferably 1 to 2. The heterocyclic ring is preferably a monocyclic ring or a fused ring having 2 to 8 rings, more preferably a monocyclic ring or a fused ring having 2 to 4 rings. The heterocyclic group and heterocyclic-oxy ​​group may have a substituent or may be unsubstituted. Examples of the substituent include an alkyl group, an alkoxy group, an aryl group, a heterocyclic group, a halogen atom, a nitro group, a vinyl group, a (meth)allyl group, a (meth)acryloyl group, and a (meth)acryloyloxy group.

[0050] R in formula (6) ６ａ and R ６ｂ may be bonded to each other to form a ring. The ring formed is preferably a 5-membered or 6-membered ring. The ring formed may have a substituent. Examples of the substituent include an alkyl group, an alkoxy group, an aryl group, a heterocyclic group, a halogen atom, a nitro group, a vinyl group, a (meth)allyl group, a (meth)acryloyl group, and a (meth)acryloyloxy group.

[0051] R in formula (6) ６ａ and R ６ｂ are each independently preferably an aryl group, an alkoxy group, or an aryloxy group, more preferably an aryl group or an aryloxy group, and even more preferably an aryloxy group.

[0052] The ligand represented by formula (6) is also preferably a residue obtained by removing a hydrogen atom from the OH group on the phosphorus atom of the compound described in paragraph 0080 of JP-A 2022-091099, or a residue obtained by removing a hydrogen atom from the OH group on the phosphorus atom of a phosphate ester compound having an ethylenically unsaturated bond-containing group described in paragraphs 0045 to 0048 of JP-A 2019-105713.

[0053]

[0054] In formula (7), R７ａ and R ７ｂ each independently represents a hydrogen atom, a hydroxy group, an alkyl group, an aryl group, an alkoxy group, an aryloxy group, or a group represented by formula (10), R ７ａ and R ７ｂ At least one of the groups represented by formula (10) is a group represented by formula (10), and * is a coordination site with a metal atom. ８ Is -OSO ２ represents -, -OCO-, or -O-; ８ represents a single bond or an n8+1-valent linking group, Pm ８ represents a polymer chain, n8 represents an integer of 1 to 5, and when n8 is 2 to 5, a plurality of Pm ８ may be the same or different, and * is a coordination site with a metal atom. In formula (10), L １０ represents a single bond or an n10+1-valent linking group, Pm １０ represents a polymer chain, n10 represents an integer of 1 to 5, and when n10 is 2 to 5, a plurality of Pm １０ may be the same or different, and * is a bond to P in formula (7).

[0055] R in formula (7) ７ａ and R ７ｂ The alkyl group, aryl group, alkoxy group and aryloxy group represented by R in formula (6) ６ａ and R ６ｂ The preferred ranges are also the same as those described above for these groups represented by the formula (I).

[0056] Y in formula (8) ８ Is -OSO ２ represents -, -OCO-, or -O-, ２ - or -OCO- is preferred. ８ and L of formula (10) １０Examples of the n10+1-valent linking group represented by include hydrocarbon groups, -O-, -CO-, -COO-, -OCO-, -NH-, -S-, and groups combining two or more of these. Examples of the hydrocarbon group include aliphatic hydrocarbon groups and aromatic hydrocarbon groups. The aliphatic hydrocarbon group preferably has 1 to 30 carbon atoms, more preferably 1 to 20, and even more preferably 1 to 15. The aliphatic hydrocarbon group may be linear, branched, or cyclic. The aromatic hydrocarbon group preferably has 6 to 30 carbon atoms, more preferably 6 to 20, and even more preferably 6 to 10. The hydrocarbon group may have a substituent. Examples of the substituent include the groups exemplified for the substituent T described below, and preferred are a halogen atom, a hydroxy group, an alkyl group, and an aryl group.

[0057] Pm in formula (8) ８ and a polymer chain represented by Pm １０ The polymer chain represented by is preferably a polymer chain containing repeating units of at least one structure selected from a polyether structure, a polyester structure, and a poly(meth)acrylic structure.

[0058] Pm in formula (8) ８ and a polymer chain represented by Pm １０ The weight average molecular weight of the polymer chain represented by is preferably 1,000 to 50,000, and more preferably 1,500 to 20,000.

[0059] In formula (8), n8 represents an integer of 1 to 5, preferably 1 or 2, and more preferably 1. In formula (10), n10 represents an integer of 1 to 5, preferably 1 or 2, and more preferably 1.

[0060] Specific Examples Specific examples of the specific phthalocyanine metal complexes include phthalocyanine metal complexes P-1 to P-33 described in the examples below.

[0061] The resin composition of the present invention may contain an infrared absorbing dye (another infrared absorbing dye) other than the specific phthalocyanine metal complex described above. By further containing another infrared absorbing dye, a film capable of blocking infrared rays over a wider wavelength range can be formed. The other infrared absorbing dye may be a dye or a pigment (particles). Examples of the other infrared absorbing dye include pyrrolopyrrole compounds, polymethine compounds, squarylium compounds, quaterrylene compounds, merocyanine compounds, croconium compounds, oxonol compounds, iminium compounds, dithiol compounds, triarylmethane compounds, pyrromethene compounds, azomethine compounds, anthraquinone compounds, dibenzofuranone compounds, dithiolene metal complexes, metal oxides, and metal borides.

[0062] Examples of the pyrrolopyrrole compound include the compounds described in paragraphs 0016 to 0058 of JP-A-2009-263614, the compounds described in paragraphs 0037 to 0052 of JP-A-2011-068731, and the compounds described in paragraphs 0010 to 0033 of WO 2015 / 166873. Examples of squarylium compounds include compounds described in paragraphs 0044 to 0049 of JP 2011-208101 A, compounds described in paragraphs 0060 to 0061 of Japanese Patent No. 6065169 A, compounds described in paragraph 0040 of WO 2016 / 181987 A, compounds described in JP 2015-176046 A, compounds described in paragraph 0072 of WO 2016 / 190162 A, and compounds described in JP 2016-07464 A. Compounds described in paragraphs 0196 to 0228 of Patent Publication No. 9, compounds described in paragraph 0124 of JP-A-2017-067963, compounds described in WO 2017 / 135359, compounds described in JP-A-2017-114956, compounds described in Japanese Patent No. 6197940, compounds described in WO 2016 / 120166, compounds described in Table 1 of U.S. Pat. No. 11261172, and the like. Examples of polymethine compounds include compounds described in paragraphs 0044 to 0045 of JP 2009-108267 A, compounds described in paragraphs 0026 to 0030 of JP 2002-194040 A, compounds described in JP 2015-172004 A, compounds described in JP 2015-172102 A, compounds described in JP 2008-088426 A, compounds described in paragraph 0090 of WO 2016 / 190162 A, compounds described in JP 2017-031394 A, compounds described in JP 2021-134350 A, compounds described in WO 2021 / 085372 A, and compounds described in paragraphs 0188 to 0192 of WO 2022 / 181422 A. Examples of croconium compounds include compounds described in JP-A-2017-082029 and compounds described in JP-A-2016-079331.Examples of iminium compounds include the compounds described in JP-T-2008-528706, JP-A-2012-012399, JP-A-2007-092060, and WO 2018 / 043564, paragraphs 0048 to 0063. Examples of dithiolene metal complexes include the compounds described in Japanese Patent No. 5733804. Examples of metal oxides include indium tin oxide, antimony tin oxide, zinc oxide, Al-doped zinc oxide, fluorine-doped tin dioxide, niobium-doped titanium dioxide, and tungsten oxide. For details about tungsten oxide, see paragraph 0080 of JP-A-2016-006476, the contents of which are incorporated herein by reference. Examples of metal borides include lanthanum boride. A commercially available product of lanthanum boride is LaB. ６ -F (manufactured by Nippon Shinkinzoku Co., Ltd.). Furthermore, as the metal boride, compounds described in WO 2017 / 119394 can also be used. Commercially available indium tin oxide products include F-ITO (manufactured by Dowa Hitec Co., Ltd.).

[0063] Examples of the infrared absorbing dye include squarylium compounds described in JP-A-2017-197437, squarylium compounds described in JP-A-2017-025311, squarylium compounds described in WO 2016 / 154782, squarylium compounds described in Japanese Patent No. 5884953, squarylium compounds described in Japanese Patent No. 6036689, squarylium compounds described in Japanese Patent No. 5810604, squarylium compounds described in WO 201 the squarylium compounds described in paragraphs

[0090] to

[0107] of JP-A-7 / 213047, the pyrrole ring-containing compounds described in paragraphs

[0019] to

[0075] of JP-A-2018-054760, the pyrrole ring-containing compounds described in paragraphs

[0078] to

[0082] of JP-A-2018-040955, the pyrrole ring-containing compounds described in paragraphs

[0043] to

[0069] of JP-A-2018-002773, the pyrrole ring-containing compounds described in paragraphs

[0024] to

[0026] of JP-A-2018-041047, 0086, an amide-linked squarylium compound described in JP-A-2017-179131, a compound having a pyrrole bis-type squarylium skeleton or a croconium skeleton described in JP-A-2017-141215, a dihydrocarbazole bis-type squarylium compound described in JP-A-2017-082029, and paragraphs 0027 to 011 of JP-A-2017-068120. Asymmetric compounds described in 4, pyrrole ring-containing compounds (carbazole type) described in JP 2017-067963 A, compounds described in WO 2022 / 059619, compounds described in JP 2022-151682 A, compounds described in JP 2022-188858 A, compounds described in JP 2022-184710 A, compounds described in JP 2022-189736 A, and the like can also be used.

[0064] The content of the infrared absorbing dye in the total solid content of the resin composition is preferably 5 to 70% by mass, with the lower limit being preferably 10% by mass or more and more preferably 20% by mass or more, and the upper limit being preferably 60% by mass or less and more preferably 40% by mass or less.

[0065] The content of the specific phthalocyanine metal complex in the total solid content of the resin composition is preferably 5 to 70% by mass, with the lower limit being preferably 10% by mass or more and more preferably 20% by mass or more, and the upper limit being preferably 60% by mass or less and more preferably 40% by mass or less.

[0066] <<Resin>> The resin composition of the present invention contains Resin B (hereinafter referred to as Resin). Resins are blended, for example, to disperse pigments and the like in the composition or as binders. Resins used primarily to disperse pigments and the like in the composition are also called dispersants. However, these uses of resins are merely examples, and resins can also be used for purposes other than these uses.

[0067] The weight average molecular weight of the resin is preferably 3,000 to 2,000,000. The upper limit is preferably 1,000,000 or less, more preferably 500,000 or less. The lower limit is preferably 4,000 or more, more preferably 5,000 or more.

[0068] Examples of the resin include (meth)acrylic resin, epoxy resin, ene-thiol resin, polycarbonate resin, polyether resin, polyarylate resin, polysulfone resin, polyethersulfone resin, polyphenylene resin, polyarylene ether phosphine oxide resin, polyimide resin, polyamide resin, polyamideimide resin, polyolefin resin, cyclic olefin resin, polyester resin, styrene resin, vinyl acetate resin, polyvinyl alcohol resin, polyvinyl acetal resin, polyurethane resin, and polyurea resin. One of these resins may be used alone, or two or more of them may be mixed and used. From the viewpoint of improving heat resistance, norbornene resin is preferable as the cyclic olefin resin. Examples of commercially available norbornene resins include the ARTON series (e.g., ARTON F4520) manufactured by JSR Corporation. In addition, as the resin, the resins described in paragraph numbers 0091 to 0099 of International Publication No. 2022 / 065215, the block polyisocyanate resin described in Japanese Patent Application Laid-Open No. 2016-222891, the resin described in Japanese Patent Application Laid-Open No. 2020-122052, the resin described in Japanese Patent Application Laid-Open No. 2020-111656, the resin described in Japanese Patent Application Laid-Open No. 2020-139021, the resin containing a structural unit having a ring structure in the main chain and a structural unit having a biphenyl group in the side chain described in Japanese Patent Application Laid-Open No. 2017-138503, the resins described in paragraphs 0199 to 0233 of Japanese Patent Application Laid-Open No. 2020-186373, the alkali-soluble resin described in Japanese Patent Application Laid-Open No. 2020-186325, the resin represented by Formula 1 described in Korean Patent Publication No. 10-2020-0078339, the copolymer containing an epoxy group and an acid group described in International Publication No. 2022 / 030445, the resins described in paragraphs 0199 to 0233 of Japanese Patent Application Laid-Open No. 2020-186373, the alkali-soluble resin described in Japanese Patent Application Laid-Open No. 2020-186325, the resin represented by Formula 1 described in Korean Patent Publication No. 10-2020-0078339, the resin described in Japanese Patent Application Laid-Open No. 2021-134350, and the copolymer described in Japanese Patent Application Laid-Open No. 2020-041046 can also be used. Further, as the resin, a resin having a fluorene skeleton can also be preferably used.Examples of resins having a fluorene skeleton include resins described in U.S. Patent Application Publication No. 2017 / 0102610. Further, as the resin, the resin described in paragraphs 0199 to 0233 of JP 2020-186373 A, the alkali-soluble resin described in JP 2020-186325 A, the resin represented by formula 1 described in Korean Patent Publication No. 10-2020-0078339, the resin described in JP 2021-134350 A, the resin described in JP 2022-174597 A, the copolymer containing an epoxy group and an acid group described in WO 2022 / 030445, the resin described in JP 2018-135514 A, the resin described in JP 2023-033156 A, the resin described in JP 2023-030386 A, the resin described in JP 2023-027753 A can also be used.

[0069] The resin composition of the present invention contains a resin b1 having an acid group and an acid value of 80 to 300 mgKOH / g. The resin b1 can be used as a binder or a dispersant.

[0070] Examples of the acid group contained in the resin b1 include a carboxy group, a phosphate group, a sulfo group, and a phenolic hydroxy group, and the carboxy group is preferred.

[0071] The lower limit of the acid value of the resin b1 is preferably 85 mgKOH / g or more, more preferably 90 mgKOH / g or more, and the upper limit is preferably 200 mgKOH / g or less, more preferably 150 mgKOH / g or less.

[0072] The weight average molecular weight (Mw) of resin b1 is preferably 3,000 to 100,000. The upper limit is preferably 50,000 or less, and more preferably 30,000 or less. The lower limit is preferably 5,000 or more, and more preferably 6,000 or more.

[0073] Resin b1 also preferably has a polymerizable group, such as an ethylenically unsaturated bond-containing group.

[0074] Resin b1 is also preferably a resin having a graft chain (hereinafter also referred to as an acidic graft resin). In this specification, a graft chain refers to a polymer chain that branches off from the main chain of a repeating unit. The graft chain preferably has 40 to 10,000 atoms excluding hydrogen atoms, more preferably 50 to 2,000 atoms excluding hydrogen atoms, and even more preferably 60 to 500 atoms excluding hydrogen atoms. The graft chain preferably contains repeating units of at least one structure selected from a polyether structure, a polyester structure, a poly(meth)acrylic structure, a polystyrene structure, a polyurethane structure, a polyurea structure, and a polyamide structure. It is more preferable that the graft chain contains repeating units of at least one structure selected from a polyether structure, a polyester structure, a poly(meth)acrylic structure, and a polystyrene structure. It is even more preferable that the graft chain contains repeating units of a polyether structure or a polyester structure, and it is particularly preferable that the graft chain contains repeating units of a polyester structure. Acidic graft resins can be used as dispersants, but they may also be used as binders.

[0075] The resin preferably contains a resin as a dispersant. Examples of dispersants include acidic dispersants (acidic resins) and basic dispersants (basic resins). Here, the term "acidic dispersant (acidic resin)" refers to a resin in which the amount of acid groups is greater than the amount of basic groups. As the acidic dispersant (acidic resin), a resin in which the amount of acid groups is 70 mol% or more is preferred when the total amount of the acid groups and the basic groups is taken as 100 mol%. The acid group possessed by the acidic dispersant (acidic resin) is preferably a carboxy group. The acid value of the acidic dispersant (acidic resin) is preferably 10 to 105 mgKOH / g. Furthermore, the term "basic dispersant (basic resin)" refers to a resin in which the amount of basic groups is greater than the amount of acid groups. As the basic dispersant (basic resin), a resin in which the amount of basic groups is greater than 50 mol% is preferred when the total amount of the acid groups and the basic groups is taken as 100 mol%. The basic group possessed by the basic dispersant is preferably an amino group.

[0076] The resin used as the dispersant is preferably a graft resin. For details of the graft resin, please refer to the description in paragraphs 0025 to 0094 of JP 2012-255128 A, the contents of which are incorporated herein by reference.

[0077] The resin used as the dispersant is preferably a polyimine-based dispersant containing a nitrogen atom in at least one of the main chain and the side chain. The polyimine-based dispersant is preferably a resin having a main chain with a partial structure containing a functional group with a pKa of 14 or less and a side chain having 40 to 10,000 atoms, and having a basic nitrogen atom in at least one of the main chain and the side chain. There are no particular restrictions on the basic nitrogen atom, as long as it is a nitrogen atom that exhibits basicity. For details about polyimine-based dispersants, please refer to the description in paragraphs 0102 to 0166 of JP 2012-255128 A, the contents of which are incorporated herein by reference.

[0078] The resin used as a dispersant is preferably a resin having a structure in which multiple polymer chains are bonded to a core portion. Examples of such resins include dendrimers (including star-shaped polymers). Specific examples of dendrimers include polymer compounds C-1 to C-31 described in paragraphs 0196 to 0209 of JP-A-2013-043962.

[0079] The resin used as a dispersant is also preferably a resin containing a repeating unit having an ethylenically unsaturated bond-containing group in a side chain. The content of the repeating unit having an ethylenically unsaturated bond-containing group in a side chain is preferably 10 mol % or more, more preferably 10 to 80 mol %, and even more preferably 20 to 70 mol %, of all repeating units of the resin.

[0080] As the dispersant, the resin described in JP 2018-087939 A, the block copolymers (EB-1) to (EB-9) described in paragraphs 0219 to 0221 of Japanese Patent No. 6432077 A, polyethyleneimine having a polyester side chain described in WO 2016 / 104803, block copolymers described in WO 2019 / 125940 A, block polymers having an acrylamide structural unit described in JP 2020-066687 A, block polymers having an acrylamide structural unit described in JP 2020-066688 A, dispersants described in WO 2016 / 104803, and the like can also be used.

[0081] Dispersants are also available as commercially available products, and specific examples thereof include the DISPERBYK series manufactured by BYK-Chemie, the SOLSPERSE series manufactured by Lubrizol Japan, the Efka series manufactured by BASF, and the AJISPER series manufactured by Ajinomoto Fine-Techno Co., Ltd. In addition, the products described in paragraph 0129 of JP 2012-137564 A and the products described in paragraph 0235 of JP 2017-194662 A can also be used as dispersants.

[0082] The resin content of the resin composition is preferably 15 to 50% by mass based on the total solid content, with the lower limit being preferably 20% by mass or more, more preferably 25% by mass or more, and the upper limit being preferably 45% by mass or less, more preferably 40% by mass or less.

[0083] The resin content of the resin composition is preferably 15 to 50% by mass based on the total solid content, with the lower limit being preferably 20% by mass or more, more preferably 25% by mass or more, and the upper limit being preferably 45% by mass or less, more preferably 40% by mass or less.

[0084] The content of the resin b1 in the resin contained in the resin composition is preferably 10% by mass or more, more preferably 20% by mass or more, and even more preferably 30% by mass or more, with the upper limit being 100% by mass or less, 90% by mass or less, or 80% by mass or less.

[0085] The resin composition of the present invention may contain only one type of resin or two or more types of resins. When two or more types of resins are contained, the total amount thereof is preferably within the above range.

[0086] <<Polymerizable Monomer>> The resin composition of the present invention contains a polymerizable monomer C (hereinafter referred to as polymerizable monomer). Examples of the polymerizable monomer include compounds having an ethylenically unsaturated bond-containing group. Examples of the ethylenically unsaturated bond-containing group include a vinyl group, a (meth)allyl group, a (meth)acryloyl group, and a (meth)acryloyloxy group. The polymerizable monomer used in the present invention is preferably a radically polymerizable monomer.

[0087] The molecular weight of the polymerizable monomer is preferably 100 to 2500. The upper limit is preferably 2000 or less, more preferably 1500 or less. The lower limit is preferably 150 or more, more preferably 250 or more.

[0088] The Hansen solubility parameter of the polymerizable monomer is 15 to 20 MPa. ０．５ The upper limit is preferably 19 MPa. ０．５ It is preferable that the pressure is 18.5 MPa or less. ０．５ The lower limit is more preferably 16 MPa or less. ０．５ It is preferable that the pressure is 17 MPa or more. ０．５ More preferably, it is equal to or greater than this.

[0089] The dispersion term (δd) of the Hansen solubility parameter of the polymerizable monomer is 15 to 20 MPa. ０．５ The upper limit is preferably 18 MPa. ０．５ It is preferable that the pressure is 17 MPa or less. ０．５ The lower limit is more preferably 15.5 MPa or less. ０．５ It is preferable that the pressure is 16 MPa or more. ０．５ More preferably, it is equal to or greater than this.

[0090] The value of the polarization term (δp) of the Hansen solubility parameter of the polymerizable monomer is 1 to 10 MPa. ０．５ The upper limit is preferably 8 MPa or less. ０．５ It is preferable that the pressure is 6 MPa or less.０．５ The lower limit is more preferably 2 MPa or less. ０．５ It is preferable that the pressure is 3 MPa or more. ０．５ More preferably, it is equal to or greater than this.

[0091] The value of the hydrogen bond term (δh) of the Hansen solubility parameter of the polymerizable monomer is 1 to 10 MPa. ０．５ The upper limit is preferably 9 MPa or less. ０．５ It is preferable that the pressure is 8.5 MPa or less. ０．５ The lower limit is preferably 3 MPa or less. ０．５ It is preferable that the pressure is 4 MPa or more. ０．５ More preferably, it is equal to or greater than this.

[0092] The polymerizable monomer is preferably a compound containing two or more ethylenically unsaturated bond-containing groups. The upper limit of the number of ethylenically unsaturated bond-containing groups is preferably 15 or less, more preferably 6 or less, and even more preferably 4 or less. The polymerizable monomer is particularly preferably a compound containing 2 to 4 ethylenically unsaturated bond-containing groups, and even more preferably a compound containing 2 or 3. Specific examples of the polymerizable monomer include the compounds described in the examples below, the compounds described in paragraphs 0075 to 0083 of WO 2022 / 065215, and the compounds described in Taiwan Patent Application Publication No. 201832008.

[0093] It is also preferable to use a polymerizable monomer having a hydroxy group as the polymerizable monomer, as the rectangular shape of the resulting pixel can be improved by using such a compound.

[0094] It is also preferable to use a polymerizable monomer having an ethylenically unsaturated bond-containing group and a urethane bond as the polymerizable monomer. By using such a compound, the heat resistance of the resulting film can be further improved. It is presumed that the reason for this effect is that the urethane bond moiety forms a physical crosslinked structure due to intermolecular hydrogen bonding. As the polymerizable monomer having an ethylenically unsaturated bond-containing group and a urethane bond, the compounds described in paragraphs 0308 to 0315 of JP 2022-173080 A can also be used.

[0095] A compound having a caprolactone structure can also be used as the polymerizable monomer. For details of the compound having a caprolactone structure, please refer to the description in paragraphs 0042 to 0045 of JP 2013-253224 A, the contents of which are incorporated herein by reference. Examples of the compound having a caprolactone structure include DPCA-20, DPCA-30, DPCA-60, and DPCA-120, which are commercially available from Nippon Kayaku Co., Ltd. as the KAYARAD DPCA series.

[0096] A compound having an ethylenically unsaturated bond-containing group and an alkyleneoxy group can also be used as the polymerizable monomer. Such a compound is preferably a compound having an ethylenically unsaturated bond-containing group and an ethyleneoxy group and / or a propyleneoxy group, more preferably a compound having an ethylenically unsaturated bond-containing group and an ethyleneoxy group, and even more preferably a tri- to hexa-functional (meth)acrylate compound having 4 to 20 ethyleneoxy groups. Examples of commercially available products include SR-494, a tetrafunctional (meth)acrylate having four ethyleneoxy groups manufactured by Sartomer Corporation, and KAYARAD TPA-330, a trifunctional (meth)acrylate having three isobutyleneoxy groups manufactured by Nippon Kayaku Co., Ltd.

[0097] As the polymerizable monomer, a polymerizable compound having a fluorene skeleton can also be used. Commercially available products include OGSOL EA-0200 and EA-0300 (manufactured by Osaka Gas Chemicals Co., Ltd., (meth)acrylate monomers having a fluorene skeleton).

[0098] It is also preferable to use a compound that is substantially free of environmentally restricted substances such as toluene as the polymerizable monomer. Examples of commercially available products of such compounds include KAYARAD DPHA LT and KAYARAD DPEA-12 LT (manufactured by Nippon Kayaku Co., Ltd.).

[0099] The content of the polymerizable monomer in the total solid content of the resin composition is 14% by mass or more, preferably 18% by mass or more, and more preferably 22% by mass or more, and the upper limit is preferably 75% by mass or less, more preferably 60% by mass or less, and even more preferably 50% by mass or less.

[0100] The resin composition of the present invention preferably contains 150 parts by mass or more, more preferably 200 parts by mass or more, and even more preferably 300 parts by mass or more of the polymerizable monomer per 100 parts by mass of the photopolymerization initiator, and the upper limit is preferably 1000 parts by mass or less, more preferably 900 parts by mass or less, and even more preferably 800 parts by mass or less.

[0101] The resin composition of the present invention may contain only one type of polymerizable compound or may contain two or more types. When two or more types are contained, the total amount thereof is preferably in the above range.

[0102] <<Photopolymerization initiator>> The resin composition of the present invention contains a photopolymerization initiator D (hereinafter referred to as photopolymerization initiator). The photopolymerization initiator is not particularly limited and can be appropriately selected from known photopolymerization initiators. For example, a compound that is photosensitive to light in the ultraviolet to visible region is preferred. The photopolymerization initiator is preferably a photoradical polymerization initiator.

[0103] Examples of the photopolymerization initiator include halogenated hydrocarbon derivatives (e.g., compounds having a triazine skeleton, compounds having an oxadiazole skeleton, etc.), acylphosphine compounds, hexaarylbiimidazole compounds, oxime compounds, organic peroxides, thio compounds, ketone compounds, aromatic onium salts, α-hydroxyketone compounds, α-aminoketone compounds, etc. From the viewpoint of exposure sensitivity, the photopolymerization initiator is preferably a trihalomethyltriazine compound, a benzyl dimethyl ketal compound, an α-hydroxyketone compound, an α-aminoketone compound, an acylphosphine compound, a phosphine oxide compound, a metallocene compound, an oxime compound, a hexaarylbiimidazole compound, an onium compound, a benzothiazole compound, a benzophenone compound, an acetophenone compound, a cyclopentadiene-benzene-iron complex, a halomethyloxadiazole compound, or a 3-aryl-substituted coumarin compound, more preferably a compound selected from an oxime compound, an α-hydroxyketone compound, an α-aminoketone compound, and an acylphosphine compound, and even more preferably an oxime compound. Further, as the photopolymerization initiator, compounds described in paragraphs 0065 to 0111 of JP-A-2014-130173, compounds described in Japanese Patent No. 6301489, compounds described in MATERIAL STAGE 37 to 60pp, vol. 19, No. 3,peroxide-based photopolymerization initiators described in WO 2019, photopolymerization initiators described in WO 2018 / 221177, photopolymerization initiators described in WO 2018 / 110179, photopolymerization initiators described in JP 2019-043864 A, photopolymerization initiators described in JP 2019-044030 A, peroxide-based initiators described in JP 2019-167313 A, aminoacetophenone-based initiators having an oxazolidine group described in JP 2020-055992 A, oxime-based photopolymerization initiators described in JP-A-2020-172619, polymers described in JP-A-2020-172619, compounds represented by formula 1 described in WO 2020 / 152120, compounds described in JP-A-2021-181406, photopolymerization initiators described in JP-A-2022-013379, compounds represented by formula (1) described in JP-A-2022-015747, fluorine-containing fluorene oxime ester-based photoinitiators described in JP-T-2021-507058, and those described in Chinese Patent Application Publication No. 110764367. Initiators described in JP-A-2022-518535, initiators described in WO 2021 / 175855, compounds described in Taiwan Patent Application Publication No. 202200534, compounds described in JP-A-2022-078550, compounds described in Korean Patent Publication No. 10-2017-0087330, compounds described in WO 2022 / 075452, oxime ester compounds described in Chinese Patent Application Publication No. 110066225, Korean Patent Publication No. 10-2022-0076157 Compounds described in WO 2019 / 013112, compounds having a triarylamine or N-arylcarbazole skeleton described in paragraphs 0042 to 0062, oxime ester photopolymerization initiators described in Japanese Patent No. 7219378, photopolymerization initiators described in Korean Patent Publication No. 10-2021-0146174, photopolymerization initiators described in WO 2019 / 013112, photopolymerization initiators described in JP 2023-033731, initiators described in JP 2022-515524, initiators described in JP 2023-517304, initiators described in Chinese Patent Publication No. 114149517, and the like.

[0104] Specific examples of the hexaarylbiimidazole compound include 2,2',4-tris(2-chlorophenyl)-5-(3,4-dimethoxyphenyl)-4,5-diphenyl-1,1'-biimidazole.

[0105] Commercially available α-hydroxyketone compounds include Omnirad 184, Omnirad 1173, Omnirad 2959, and Omnirad 127 (all manufactured by IGM Resins B.V.), and Irgacure 184, Irgacure 1173, Irgacure 2959, and Irgacure 127 (all manufactured by BASF). Commercially available α-aminoketone compounds include Omnirad 907, Omnirad 369, Omnirad 369E, Omnirad 379EG (all manufactured by IGM Resins B.V.), Irgacure 907, Irgacure 369, Irgacure 369E, Irgacure 379EG (all manufactured by BASF), etc. Commercially available acylphosphine compounds include Omnirad 819, Omnirad TPO (all manufactured by IGM Resins B.V.), Irgacure 819, Irgacure TPO (all manufactured by BASF), etc.

[0106] Examples of the oxime compound include the compounds described in paragraph 0142 of WO 2022 / 085485, the compounds described in Japanese Patent No. 5430746, the compounds described in Japanese Patent No. 5647738, the compounds represented by the general formula (1) of JP-A-2021-173858, and the compounds described in paragraphs 0022 to 0024, and the compounds represented by the general formula (1) of JP-A-2021-170089 and the compounds described in paragraphs 0117 to 0120. Specific examples of the oxime compound include 3-benzoyloxyiminobutan-2-one, 3-acetoxyiminobutan-2-one, 3-propionyloxyiminobutan-2-one, 2-acetoxyiminopentan-3-one, 2-acetoxyimino-1-phenylpropan-1-one, 2-benzoyloxyimino-1-phenylpropan-1-one, 3-(4-toluenesulfonyloxy)iminobutan-2-one, 2-ethoxycarbonyloxyimino-1-phenylpropan-1-one, 1-[4-(phenylthio)phenyl]-3-cyclohexyl-propane-1,2-dione-2-(O-acetyloxime), etc. Commercially available products include Irgacure OXE01, Irgacure OXE02, Irgacure OXE03, Irgacure OXE04, Irgacure OXE05, Irgacure OXE06, Irgacure OXE07, Irgacure OXE08, Irgacure OXE09, Irgacure OXE10, Irgacure OXE11, Irgacure OXE12, Irgacure OXE13, Irgacure OXE14, Irgacure OXE15, Irgacure OXE16, Irgacure OXE17, Irgacure OXE18, Irgacure OXE19, Irgacure OXE20, Irgacure OXE21, Irgacure OXE22, Irgacure OXE23, Irgacure OXE24, Irgacure OXE25, Irgacure OXE26, Irgacure OXE27, Irgacure OXE28, Irgacure OX OXE04 (all manufactured by BASF), TR-PBG-301, TR-PBG-304, TR-PBG-305, TR-PBG-309, TR-PBG-3054, TR-PBG-3057, TR-PBG-314, TR-PBG-327, TR-PBG-345, TR-PBG-346, TR- Examples of the oxime compound include PBG-358, TR-PBG-365, TR-PBG-380, TR-PBG-610, TR-PBG-A, and TR-PBG-B (all manufactured by TRONLY Corporation), and ADEKA OPTOMER N-1919 (manufactured by ADEKA Corporation; photopolymerization initiator 2 described in JP 2012-014052 A). In addition, it is also preferable to use, as the oxime compound, a compound that is not colorable or a compound that is highly transparent and does not easily discolor. Commercially available products include ADEKA ARCLES NCI-730, NCI-831, NCI-831E, and NCI-930 (all manufactured by ADEKA Corporation).

[0107] As the photopolymerization initiator, an oxime compound having a fluorene ring, an oxime compound having a skeleton in which at least one benzene ring of a carbazole ring is replaced with a naphthalene ring, an oxime compound having a fluorine atom, an oxime compound having a nitro group, an oxime compound having a benzofuran skeleton, an oxime compound in which a substituent having a hydroxy group is bonded to a carbazole skeleton, or a compound described in paragraphs 0143 to 0149 of WO 2022 / 085485 can also be used.

[0108] As the photopolymerization initiator, a compound represented by formula (OX-1) can also be used.

[0109] In formula (OX-1), X １ａ represents a divalent linking group containing at least one ring selected from the group consisting of an aromatic ring and a heterocyclic ring; １ａ represents a hydrogen atom or an acyl group; R ２ａ represents an alkyl group or an aryl group; R ３ａ and R ４ａ each independently represents a hydrogen atom or an alkyl group; Alk １ and Alk ２ each independently represents an alkyl group; R ３ａ and R ４ａ may be bonded to form a ring, Alk １ and Alk ２ may be bonded to form a ring, and n represents 0 or 1.

[0110] X in formula (OX-1) １ａ Examples of the divalent linking group represented by include a divalent aromatic ring group, a divalent heterocyclic group, a divalent group in which two or more aromatic rings are bonded via a single bond or a linking group, a divalent group in which two or more heterocycles are bonded via a single bond or a linking group, and a divalent group in which an aromatic ring and a heterocycle are bonded via a single bond or a linking group. Examples of the linking group that bonds the above-mentioned aromatic rings, heterocyclic groups, or aromatic rings and heterocycles include -CH ２ -, -O-, -CO-, -S-, -NR ｘ - and groups combining these. ｘrepresents a hydrogen atom, an alkyl group, an alkenyl group, an alkynyl group, an aryl group, or a heterocyclic group.

[0111] X in formula (OX-1) １ａ is preferably a group represented by any one of formulas (X-1) to (X-13), more preferably a group represented by formula (X-1), formula (X-2), formula (X-4), formula (X-6) or formula (X-8), and further preferably a group represented by formula (X-2) or formula (X-6). In the formula R Ｘ１ ~R Ｘ９ each independently represents a hydrogen atom, an alkyl group, an alkenyl group, an alkynyl group, an aryl group, or a heterocyclic group.

[0112] R Ｘ１ ~R Ｘ９ The number of carbon atoms in the alkyl group represented by is preferably 1 to 15, and more preferably 1 to 10. The alkyl group may be linear, branched, or cyclic. The alkyl group may have a substituent. Examples of the substituent include a halogen atom, an aryl group, and a heterocyclic group.

[0113] R Ｘ１ ~R Ｘ９ The number of carbon atoms in the alkenyl group represented by is preferably 2 to 15, and more preferably 2 to 10. The alkenyl group may be linear, branched, or cyclic. The alkenyl group may have a substituent. Examples of the substituent include a halogen atom, an aryl group, and a heterocyclic group.

[0114] R Ｘ１ ~R Ｘ９ The number of carbon atoms in the alkynyl group represented by is preferably 2 to 15, and more preferably 2 to 10. The alkynyl group may be linear, branched, or cyclic. The alkynyl group may have a substituent. Examples of the substituent include a halogen atom, an aryl group, and a heterocyclic group.

[0115] R Ｘ１ ~R Ｘ９The number of carbon atoms in the aryl group represented by is preferably 6 to 20, more preferably 6 to 12, still more preferably 6 to 10, and particularly preferably 6. The aryl group may have a substituent. Examples of the substituent include a halogen atom, an alkyl group, an alkenyl group, an alkynyl group, and a heterocyclic group.

[0116] R Ｘ１ ~R Ｘ９ The heterocyclic group represented by is preferably a 5-membered or 6-membered ring. The heteroatoms contained in the heterocyclic group are preferably oxygen atoms, nitrogen atoms, and sulfur atoms. The number of heteroatoms contained in the heterocyclic group is preferably 1 to 3. The heterocyclic group may have a substituent. Examples of the substituent include a halogen atom, an alkyl group, an alkenyl group, an alkynyl group, and an aryl group.

[0117] R in formula (OX-1) １ａ represents a hydrogen atom or an acyl group, and is preferably an acyl group. １ａ The acyl group represented by is —C(O)—R １０１ It is preferable that R １０１ represents an aryl group or a heterocyclic group, and is preferably an aryl group.

[0118] R １０１ The number of carbon atoms in the aryl group represented by R is preferably 6 to 20, and more preferably 6 to 12. The aryl group may have a substituent. Examples of the substituent include a halogen atom, an alkyl group, an alkenyl group, an alkynyl group, and a heterocyclic group. １０１ The aryl group represented by is preferably a phenyl group, a methylphenyl group or a naphthyl group, more preferably a methylphenyl group or a naphthyl group.

[0119] R １０１ The heterocyclic group represented by is preferably a 5-membered or 6-membered ring. The heteroatoms contained in the heterocyclic group are preferably oxygen atoms, nitrogen atoms, and sulfur atoms. The number of heteroatoms contained in the heterocyclic group is preferably 1 to 3. The heterocyclic group may have a substituent. Examples of the substituent include a halogen atom, an alkyl group, an alkenyl group, an alkynyl group, and an aryl group.

[0120] R in formula (OX-1)２ａ represents an alkyl group or an aryl group, and is preferably an alkyl group because the reactivity of the generated radical is high. ２ａ The number of carbon atoms in the alkyl group represented by is preferably 1 to 15, more preferably 1 to 10, even more preferably 1 to 5, and even more preferably 1 to 3. The alkyl group may be linear, branched, or cyclic, but is preferably linear or branched, and more preferably linear. The alkyl group may have a substituent, but is preferably an unsubstituted alkyl group. R ２ａ The alkyl group represented by R is preferably an unsubstituted linear or branched alkyl group, and more preferably an unsubstituted linear alkyl group. ２ａ The number of carbon atoms in the aryl group represented by is preferably 6 to 20, more preferably 6 to 12, still more preferably 6 to 10, and particularly preferably 6. The aryl group may have a substituent, but is preferably an unsubstituted aryl group.

[0121] R in formula (OX-1) ３ａ and R ４ａ R each independently represents a hydrogen atom or an alkyl group, and is preferably a hydrogen atom. ３ａ and R ４ａ The number of carbon atoms in the alkyl group represented by is preferably 1 to 15, more preferably 1 to 10, even more preferably 1 to 5, and even more preferably 1 to 3. The alkyl group may be linear, branched, or cyclic, but is preferably linear or branched, and more preferably linear. The alkyl group may have a substituent, but is preferably an unsubstituted alkyl group. R ３ａ and R ４ａ may be bonded to form a ring. The ring formed is preferably a 5- or 6-membered ring, and more preferably a 5- or 6-membered aliphatic hydrocarbon ring.

[0122] Alk of formula (OX-1) １ and Alk ２each independently represents an alkyl group. The number of carbon atoms in the alkyl group is preferably 1 to 15, more preferably 1 to 10, even more preferably 1 to 5, and even more preferably 1 to 3. The alkyl group may be linear, branched, or cyclic, but is preferably linear or branched, and more preferably linear. The alkyl group may have a substituent, but is preferably an unsubstituted alkyl group. Alk １ and Alk ２ may be bonded to form a ring, and preferably form a ring. The ring formed is preferably a 5- or 6-membered ring, more preferably a 5- or 6-membered aliphatic hydrocarbon ring, and more preferably a cyclopentane ring or a cyclohexane ring.

[0123] In formula (OX-1), n ​​represents 0 or 1, and is preferably 0.

[0124] Specific examples of the compound represented by formula (OX-1) include the compounds described in paragraphs 0092 to 0096 of JP-A No. 2012-113104 and the compound described in paragraph 0041 of JP-A No. 2012-189997.

[0125] As the photopolymerization initiator, a compound represented by formula (OX-2) can also be used.

[0126] In formula (OX-2), R １ｂ and R ２ｂ each independently represents a substituent, R ３ｂ ~R ７ｂ each independently represents a hydrogen atom or a substituent, Ar １ｂ represents an aromatic ring group or a heterocyclic group which may have a substituent; n represents 0 or 1;

[0127] R １ｂ and R ２ｂExamples of the substituent represented by include an alkyl group and an aryl group, and an alkyl group is preferred. The alkyl group preferably has 1 to 15 carbon atoms, and more preferably 1 to 10 carbon atoms. The alkyl group may be linear, branched, or cyclic. The alkyl group may have a substituent. Examples of the substituent include a halogen atom, an aryl group, an alkenyl group, an alkynyl group, and a heterocyclic group. The aryl group preferably has 6 to 20 carbon atoms, more preferably 6 to 12 carbon atoms, even more preferably 6 to 10 carbon atoms, and particularly preferably 6 carbon atoms. The aryl group may have a substituent. Examples of the substituent include a halogen atom, an alkyl group, an alkenyl group, an alkynyl group, and a heterocyclic group.

[0128] R ３ｂ ~R ７ｂ Examples of the substituent represented by R include a halogen atom, an alkyl group, and an aryl group. Examples of the alkyl group and the aryl group include those described above. ３ｂ ~R ７ｂ is preferably a hydrogen atom.

[0129] Ar １ｂ represents an aromatic ring group or a heterocyclic group which may have a substituent, Ar １ｂ is preferably an aromatic ring group which may have a substituent. The aromatic ring group is preferably a benzene ring group or a naphthalene ring group, more preferably a benzene ring group. Examples of the substituent include a halogen atom, an alkyl group, an alkoxy group, an aryl group, an aryloxy group, an alkylthio group, an arylthio group, a nitro group, and an acyl group, and an acyl group is preferred.

[0130] As the photopolymerization initiator, a compound represented by formula (OX-3) can also be used.

[0131] In formula (OX-3), Ar １ｃ represents a (k+m+1)-valent aromatic ring group or a (k+m+1)-valent heterocyclic group; Ar ２ｃ represents a (k+2)-valent aromatic ring group or a (k+2)-valent heterocyclic group; R １ｃ ~R ３ｃ each independently represents a substituent;１ｃ is a single bond or CR １１ｃ R １２ｃ represents R １１ｃ and R １２ｃ each independently represents a hydrogen atom, an alkyl group, or an aryl group; １ｃ represents -O- or -S-; k represents 0 or 1; m represents an integer of 0 to 4; and n represents 0 or 1.

[0132] R １ｃ and R ２ｃ Examples of the substituent represented by include an alkyl group and an aryl group, and an alkyl group is preferred. The alkyl group preferably has 1 to 15 carbon atoms, and more preferably 1 to 10 carbon atoms. The alkyl group may be linear, branched, or cyclic. The alkyl group may have a substituent. Examples of the substituent include a halogen atom, an aryl group, an alkenyl group, an alkynyl group, and a heterocyclic group. The aryl group preferably has 6 to 20 carbon atoms, more preferably 6 to 12 carbon atoms, even more preferably 6 to 10 carbon atoms, and particularly preferably 6 carbon atoms. The aryl group may have a substituent. Examples of the substituent include a halogen atom, an alkyl group, an alkenyl group, an alkynyl group, and a heterocyclic group. R ２ｃ is preferably an alkyl group having a branched or cyclic structure.

[0133] R ３ｃ Examples of the substituent represented by include a halogen atom, an alkyl group, an alkoxy group, an aryl group, an aryloxy group and an acyl group, and an acyl group is preferred.

[0134] Ar １ｃ represents a (k+m+1)-valent aromatic ring group or a (k+m+1)-valent heterocyclic group, and is preferably a (k+m+1)-valent aromatic ring group. The aromatic ring group is preferably a benzene ring group or a naphthalene ring group, and more preferably a benzene ring group.

[0135] Ar ２ｃrepresents a (k+2)-valent aromatic ring group or a (k+2)-valent heterocyclic group, and is preferably a (k+2)-valent aromatic ring group. The aromatic ring group is preferably a benzene ring group or a naphthalene ring group, and more preferably a benzene ring group.

[0136] k represents 0 or 1, and is preferably 0.

[0137] m represents an integer of 0 to 4, preferably 0 or 1, and more preferably 1.

[0138] Specific examples of oxime compounds that can be preferably used in the present invention are shown below, but the present invention is not limited to these.

[0139]

[0140] The oxime compound is preferably a compound having a maximum absorption wavelength in the wavelength range of 350 to 500 nm, and more preferably a compound having a maximum absorption wavelength in the wavelength range of 360 to 480 nm. Furthermore, from the viewpoint of sensitivity, the molar absorption coefficient of the oxime compound at a wavelength of 365 nm or 405 nm is preferably high, more preferably 1,000 to 300,000, even more preferably 2,000 to 300,000, and particularly preferably 5,000 to 200,000. The molar absorption coefficient of the compound can be measured using a known method. For example, it is preferably measured using a spectrophotometer (Varian Cary-5 spectrophotometer) at a concentration of 0.01 g / L using ethyl acetate as a solvent.

[0141] As the photopolymerization initiator, a bifunctional or trifunctional or higher functional photoradical polymerization initiator may be used. By using such a photoradical polymerization initiator, two or more radicals are generated from one molecule of the photoradical polymerization initiator, thereby obtaining good sensitivity. Furthermore, when a compound with an asymmetric structure is used, crystallinity is reduced and solubility in solvents is improved, making it less likely to precipitate over time, thereby improving the stability of the resin composition over time. Specific examples of bifunctional or trifunctional or higher functional photoradical polymerization initiators include the compounds described in paragraph 0148 of WO 2022 / 065215.

[0142] The content of the photopolymerization initiator in the total solid content of the resin composition is preferably 0.1 to 30% by mass. The lower limit is preferably 0.5% by mass or more, and more preferably 1% or more. The upper limit is preferably 25% by mass or less, more preferably 20% by mass or less, and even more preferably 15% by mass or less. The resin composition may contain only one type of photopolymerization initiator, or may contain two or more types. When two or more types are contained, the total amount thereof is preferably within the above range.

[0143] <<Solvent>> The resin composition of the present invention preferably contains a solvent. Examples of the solvent include water and organic solvents, and organic solvents are preferred. Examples of organic solvents include ester solvents, ketone solvents, alcohol solvents, amide solvents, ether solvents, and hydrocarbon solvents. For details, see paragraph 0223 of WO 2015 / 166779, the contents of which are incorporated herein by reference. Furthermore, ester solvents substituted with a cyclic alkyl group and ketone solvents substituted with a cyclic alkyl group can also be preferably used. Specific examples of organic solvents include polyethylene glycol monomethyl ether, dichloromethane, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, ethyl cellosolve acetate, ethyl lactate, diethylene glycol dimethyl ether, butyl acetate, methyl 3-methoxypropionate, 2-heptanone, 2-pentanone, 3-pentanone, 4-heptanone, cyclohexanone, 2-methylcyclohexanone, 3-methylcyclohexanone, 4-methylcyclohexanone, cycloheptanone, cyclooctanone, cyclohexyl acetate, cyclopentanone, ethyl carbitol acetate, butyl carbitol acetate, propylene glycol monomethyl ether ... Examples of suitable ethylene glycol monomethyl ether acetate include 3-methoxy-N,N-dimethylpropanamide, 3-butoxy-N,N-dimethylpropanamide, propylene glycol diacetate, 3-methoxybutanol, methyl ethyl ketone, gamma butyrolactone, sulfolane, anisole, 1,4-diacetoxybutane, diethylene glycol monoethyl ether acetate, butane-1,3-diyl diacetate, dipropylene glycol methyl ether acetate, diacetone alcohol (also known as diacetone alcohol, 4-hydroxy-4-methyl-2-pentanone), 2-methoxypropyl acetate, 2-methoxy-1-propanol, and isopropyl alcohol.However, it may be preferable to reduce the amount of aromatic hydrocarbons (benzene, toluene, xylene, ethylbenzene, etc.) used as organic solvents for environmental reasons (for example, the amount may be 50 ppm by mass (parts per million) or less, 10 ppm by mass or less, or 1 ppm by mass or less, relative to the total amount of organic solvents).

[0144] The metal content of the organic solvent is preferably low. The metal content of the organic solvent is preferably, for example, 10 parts per billion (ppb) by mass or less. If necessary, an organic solvent having a metal content of ppt (parts per trillion) by mass may be used, and such an organic solvent is provided, for example, by Toyo Gosei Co., Ltd. (The Chemical Daily, November 13, 2015).

[0145] Methods for removing impurities such as metals from organic solvents include, for example, distillation (molecular distillation, thin-film distillation, etc.) and filtration using a filter. The pore size of the filter used for filtration is preferably 10 μm or less, more preferably 5 μm or less, and even more preferably 3 μm or less. The filter material is preferably polytetrafluoroethylene, polyethylene, or nylon.

[0146] The organic solvent may contain isomers (compounds having the same number of atoms but different structures). The organic solvent may contain only one type of isomer or multiple types of isomers.

[0147] The organic solvent preferably has a peroxide content of 0.8 mmol / L or less, and more preferably contains substantially no peroxide.

[0148] The content of the solvent in the resin composition is preferably 10 to 97% by mass. The lower limit is preferably 30% by mass or more, more preferably 40% by mass or more, even more preferably 50% by mass or more, still more preferably 60% by mass or more, and particularly preferably 70% by mass or more. The upper limit is preferably 96% by mass or less, more preferably 95% by mass or less. The resin composition may contain only one type of solvent, or may contain two or more types. When two or more types are contained, the total amount thereof is preferably within the above range.

[0149] <<Pigment Derivative>> The resin composition of the present invention may contain a pigment derivative. The pigment derivative is used as a dispersing aid. A dispersing aid is a material that enhances the dispersibility of a pigment in a resin composition.

[0150] Examples of the pigment derivative include a compound having at least one structure selected from the group consisting of a dye structure and a triazine structure, and an acid group or a basic group.

[0151] Examples of the dye structure include a squarylium dye structure, a pyrrolopyrrole dye structure, a diketopyrrolopyrrole dye structure, a quinacridone dye structure, an anthraquinone dye structure, a dianthraquinone dye structure, a benzisoindole dye structure, a thiazine indigo dye structure, an azo dye structure, a quinophthalone dye structure, a phthalocyanine dye structure, a naphthalocyanine dye structure, a dioxazine dye structure, a perylene dye structure, a perinone dye structure, a benzimidazolone dye structure, a benzothiazole dye structure, a benzimidazole dye structure, and a benzoxazole dye structure. Of these, a squarylium dye structure, a pyrrolopyrrole dye structure, a diketopyrrolopyrrole dye structure, a phthalocyanine dye structure, a quinacridone dye structure, and a benzimidazolone dye structure are preferred, and a squarylium dye structure and a pyrrolopyrrole dye structure are more preferred.

[0152] Examples of the acid group possessed by the pigment derivative include a carboxy group, a sulfo group, a phosphoric acid group, a boronic acid group, a carboxylic acid amide group, a sulfonic acid amide group, an imidic acid group, and salts thereof. Examples of the atom or atomic group constituting the salt include an alkali metal ion (Li ＋ , Na ＋ , K. ＋ etc.), alkaline earth metal ions (Ca ２＋ , Mg ２＋ Examples of the carboxylic acid amide group include -NHCOR, ... Ｘ１ As the sulfonic acid amide group, a group represented by -NHSO is preferred. ２ R Ｘ２ As the imide acid group, a group represented by -SO ２ NHSO ２ R Ｘ３ , -CONHSO ２ R Ｘ４ , -CONHCOR Ｘ５ or -SO ２ NHCOR Ｘ６ A group represented by the formula: ２ NHSO ２ R Ｘ３ is more preferred. Ｘ１ ~R Ｘ６ R each independently represents an alkyl group or an aryl group. Ｘ１ ~R Ｘ６ The alkyl group and aryl group represented by may have a substituent. The substituent is preferably a halogen atom, more preferably a fluorine atom.

[0153] Examples of basic groups possessed by the pigment derivative include amino groups, pyridinyl groups and their salts, ammonium salts, and phthalimidomethyl groups. Examples of atoms or atomic groups that constitute the salts include hydroxide ions, halogen ions, carboxylate ions, sulfonate ions, and phenoxide ions.

[0154] Specific examples of pigment derivatives include compounds described in paragraphs 0037 to 0054 of WO 2016 / 035695, compounds described in paragraphs 0061 to 0086 of WO 2017 / 146092, compounds described in paragraphs 0017 to 0068 of WO 2018 / 230387, compounds described in paragraphs 0085 to 0099 of WO 2020 / 054718, compounds described in paragraph 0099 of WO 2020 / 054718, compounds described in paragraph 0124 of WO 2022 / 085485, benzimidazolone compounds or salts thereof described in JP-A-2018-168244, and compounds having an isoindoline skeleton described in the general formula (1) of Japanese Patent No. 6996282.

[0155] The content of the pigment derivative is preferably 1 to 50 parts by mass relative to 100 parts by mass of the pigment. The lower limit is preferably 3 parts by mass or more, and more preferably 5 parts by mass or more. The upper limit is preferably 40 parts by mass or less, and more preferably 30 parts by mass or less. Only one type of pigment derivative may be used, or two or more types may be used. When two or more types are used, it is preferable that the total amount be in the above range.

[0156] <<Compound Having a Cyclic Ether Group>> The resin composition of the present invention can contain a compound having a cyclic ether group. Examples of compounds having a cyclic ether group include compounds having an epoxy group and compounds having an oxetanyl group, with compounds having an epoxy group being preferred. Examples of compounds having a cyclic ether group include compounds having 1 to 100 cyclic ether groups per molecule. The upper limit of the number of cyclic ether groups can be, for example, 10 or less, or 5 or less. The lower limit of the number of cyclic ether groups is preferably 2 or more.

[0157] The compound having a cyclic ether group may be a low molecular weight compound (e.g., a molecular weight of less than 1,000) or a high molecular weight compound (macromolecule) (e.g., a molecular weight of 1,000 or more, and in the case of a polymer, a weight average molecular weight of 1,000 or more). The weight average molecular weight of the cyclic ether group is preferably 200 to 100,000, more preferably 500 to 50,000. The upper limit of the weight average molecular weight is preferably 10,000 or less, more preferably 5,000 or less, and even more preferably 3,000 or less.

[0158] As the compound having a cyclic ether group, the compounds described in paragraphs 0034 to 0036 of JP-A-2013-011869, the compounds described in paragraphs 0147 to 0156 of JP-A-2014-043556, the compounds described in paragraphs 0085 to 0092 of JP-A-2014-089408, and the compounds described in JP-A-2017-179172 can also be used.

[0159] Commercially available compounds having a cyclic ether group include Denacol EX-212L, EX-212, EX-214L, EX-214, EX-216L, EX-216, EX-321L, EX-321, EX-614, EX-850L, and EX-850 (all manufactured by Nagase ChemteX Corporation), ADEKA RESIN EP-4000S, EP-4003S, EP-4010S, EP-4011S (all manufactured by ADEKA Corporation), NC-2000, NC-3000, NC-7300, XD-1000, EPPN-501, EPPN-502 (all manufactured by ADEKA Corporation), Celloxide 2021P, Celloxide 2081, Celloxide 2083, Celloxide 2085, EHPE3150, EPOLEAD PB 3600, PB 4700 (all manufactured by Daicel Corporation), Cyclomer P ACA 200M, ACA 230AA, ACA Z250, ACA Z251, ACA Z300, ACA Z320 (all manufactured by Daicel Corporation), jER1031S, jER157S65, jER152, jER154, jER157S70 (all manufactured by Mitsubishi Chemical Corporation), Aron Oxetane OXT-121, OXT-221, OX-SQ, PNOX (all manufactured by Toagosei Co., Ltd.), Adeka Glycirol Examples of such monomers include ED-505 (manufactured by ADEKA Corporation, epoxy group-containing monomer), Marproof G-0150M, G-0105SA, G-0130SP, G-0250SP, G-1005S, G-1005SA, G-1010S, G-2050M, G-01100, and G-01758 (manufactured by NOF Corporation, epoxy group-containing polymers), OXT-101, OXT-121, OXT-212, and OXT-221 (manufactured by Toagosei Co., Ltd., oxetanyl group-containing monomers), and OXE-10 and OXE-30 (manufactured by Osaka Organic Chemical Industry Ltd., oxetanyl group-containing monomers).

[0160] The content of the compound having a cyclic ether group in the total solid content of the resin composition is preferably 0.1 to 20% by mass. The lower limit is, for example, more preferably 0.5% by mass or more, and even more preferably 1% by mass or more. The upper limit is, for example, more preferably 15% by mass or less, and even more preferably 10% by mass or less. Only one type of compound having a cyclic ether group may be used, or two or more types may be used. When two or more types are used, it is preferable that the total amount thereof is within the above range.

[0161] <<Curing Agent>> When the resin composition of the present invention contains a compound having a cyclic ether group, it is preferable that the resin composition of the present invention further contains a curing agent. Examples of curing agents include amine compounds, acid anhydride compounds, amide compounds, phenolic compounds, polycarboxylic acids, and thiol compounds. Specific examples of curing agents include succinic acid, trimellitic acid, pyromellitic acid, N,N-dimethyl-4-aminopyridine, and pentaerythritol tetrakis(3-mercaptopropionate). The curing agent may also be the compounds described in paragraphs 0072 to 0078 of JP 2016-075720 A or the compounds described in JP 2017-036379 A. The content of the curing agent is preferably 0.01 to 20 parts by mass, more preferably 0.01 to 10 parts by mass, and even more preferably 0.1 to 6.0 parts by mass, per 100 parts by mass of the compound having a cyclic ether group.

[0162] <<Chromatic Colorant>> The resin composition of the present invention can contain a chromatic colorant. Examples of chromatic colorants include red colorants, green colorants, blue colorants, yellow colorants, purple colorants, and orange colorants. The chromatic colorant may be a pigment or a dye. A pigment and a dye may be used in combination. The pigment may be either an inorganic pigment or an organic pigment. Furthermore, the pigment may be a material in which an inorganic pigment or an organic-inorganic pigment has been partially substituted with an organic chromophore. Substituting an inorganic pigment or an organic-inorganic pigment with an organic chromophore makes it easier to design the hue.

[0163] The average primary particle diameter of the pigment is preferably 1 to 200 nm. The lower limit is preferably 5 nm or more, more preferably 10 nm or more. The upper limit is preferably 180 nm or less, more preferably 150 nm or less, and even more preferably 100 nm or less. In this specification, the primary particle diameter of the pigment can be determined from an image photograph obtained by observing the primary particles of the pigment with a transmission electron microscope. Specifically, the projected area of ​​the primary particles of the pigment is determined, and the corresponding circle-equivalent diameter is calculated as the primary particle diameter of the pigment. In this specification, the average primary particle diameter is the arithmetic mean value of the primary particle diameters of 400 primary particles of the pigment. Furthermore, primary particles of the pigment refer to independent particles that are not aggregated.

[0164] The crystallite size of the pigment, determined from the half-width of a peak derived from any crystal plane in an X-ray diffraction spectrum obtained using CuKα radiation as an X-ray source, is preferably 0.1 to 100 nm, more preferably 0.5 to 50 nm, even more preferably 1 to 30 nm, and particularly preferably 5 to 25 nm.

[0165] The specific surface area of ​​the pigment is 1 to 300 m ２ / g. The lower limit is 10 m ２ / g or more, and ２ / g or more is more preferable. ２ / g or less, and ２ The value of the specific surface area can be determined according to the BET (Brunauer, Emmett and Teller) method in accordance with DIN 66131: Determination of the specific surface area of ​​solids by gas adsorption.

[0166] The chromatic colorant preferably contains a pigment. The content of the pigment in the chromatic colorant is preferably 50% by mass or more, more preferably 70% by mass or more, even more preferably 80% by mass or more, and particularly preferably 90% by mass or more. Examples of the pigment include the following.

[0167] Color Index (C.I.) Pigment Yellow 1, 2, 3, 4, 5, 6, 10, 11, 12, 13, 14, 15, 16, 17, 18, 20, 24, 31, 32, 34, 35, 35:1, 36, 36:1, 37, 37:1, 40, 42, 43, 53, 55, 60, 61, 62, 63, 65, 73, 74, 77, 81, 83, 86, 93, 94, 95, 97, 98, 100, 101, 104, 106, 108, 109, 110, 113, 114, 115, 116, 117, 118, 119, 120, 123, 125, 126, 127, 128, 129, 137, 13 8,139,147,148,150,151,152,153,154,155,156,161,162,164,166,167,168,169,170,171,172,173,174,175,176,177,179,180,181,182,185,187,188,193,194,199,213,214,215,228,231,232 (methine-based), 233 (quinoline-based), 234 (aminoketone-based), 235 (aminoketone-based), 236 (aminoketone-based), etc. (all yellow pigments), C.I. C.I. Pigment Orange 2, 5, 13, 16, 17:1, 31, 34, 36, 38, 43, 46, 48, 49, 51, 52, 55, 59, 60, 61, 62, 64, 71, 73, etc. (all orange pigments), C.I. Pigment Red 1, 2, 3, 4, 5, 6, 7, 9, 10, 14, 17, 22, 23, 31, 38, 41, 48:1, 48:2, 48:3, 48:4, 49, 49:1, 49:2, 52:1, 52:2, 53:1, 57:1, 60:1, 63:1, 66, 67, 81:1, 81:2, 81:3, 83, 88, 90, 105, 112, 119, 122, 123, 144, 146, 149, 150, 155, 166, 168, 169, 170, 171, 172, 175, 176, 177, 178, 179, 184, 185, 187, 188, 190, 200, 202, 206, 207, 208, 209, 210, 216, 220, 224, 226, 242, 246, 254, 255, 264, 269, 270, 272, 279, 291, 294 (xanthene type, Organo Ultramarine, Bluish Red), 295 (monoazo type), 296 (diazo type),297 (aminoketone system) and the like (above, red pigments), C.I. Pigment Green 7, 10, 36, 37, 58, 59, 62, 63, 64 (phthalocyanine system), 65 (phthalocyanine system), 66 (phthalocyanine system) and the like (above, green pigments), C.I. Pigment Violet 1, 19, 23, 27, 32, 37, 42, 60 (triarylmethane system), 61 (xanthene system) and the like (above, purple pigments), C.I. Pigment Blue 1, 2, 15, 15:1, 15:2, 15:3, 15:4, 15:6, 16, 22, 29, 60, 64, 66, 79, 80, 87 (monoazo type), 88 (methine type), etc. (all blue pigments).

[0168] As a green colorant, a halogenated zinc phthalocyanine pigment having an average of 10 to 14 halogen atoms, an average of 8 to 12 bromine atoms, and an average of 2 to 5 chlorine atoms per molecule can also be used. Specific examples include the compounds described in WO 2015 / 118720. Furthermore, as a green colorant, the compounds described in paragraph 0029 of WO 2022 / 085485, the aluminum phthalocyanine compounds described in JP 2020-070426 A, and the diarylmethane compounds described in JP 2020-504758 A can also be used.

[0169] As the blue colorant, an aluminum phthalocyanine compound having a phosphorus atom can also be used. Specific examples include the compounds described in paragraphs

[0022] to

[0030] of JP-A No. 2012-247591 and paragraph

[0047] of JP-A No. 2011-157478.

[0170] As the yellow colorant, the compounds described in paragraphs 0031 to 0033 of WO 2022 / 085485, the methine dyes described in JP-A 2019-073695, and the methine dyes described in JP-A 2019-073696 can be used.

[0171] As the red colorant, the compound described in paragraph 0034 of WO 2022 / 085485 and the brominated diketopyrrolopyrrole compound described in JP-A 2020-085947 can also be used.

[0172] Dyes can also be used as chromatic colorants. There are no particular limitations on the dyes, and known dyes can be used. Examples include pyrazole azo dyes, anilino azo dyes, triarylmethane dyes, anthraquinone dyes, anthrapyridone dyes, benzylidene dyes, oxonol dyes, pyrazolotriazole azo dyes, pyridone azo dyes, cyanine dyes, phenothiazine dyes, pyrrolopyrazole azomethine dyes, xanthene dyes, phthalocyanine dyes, benzopyran dyes, indigo dyes, and pyrromethene dyes. Furthermore, the dyes can also include thiazole compounds described in JP-A-2012-158649, azo compounds described in JP-A-2011-184493, and azo compounds described in JP-A-2011-145540.

[0173] Examples of chromatic colorants include triarylmethane dye polymers described in Korean Patent Publication No. 10-2020-0028160, xanthene compounds described in JP 2020-117638 A, phthalocyanine compounds described in WO 2020 / 174991 A, isoindoline compounds or salts thereof described in JP 2020-160279 A, ​​compounds represented by formula 1 described in Korean Patent Publication No. 10-2020-0069442 A, compounds represented by formula 1 described in Korean Patent Publication No. 10-2020-0069730 A, and compounds represented by formula 1 described in Korean Patent Publication No. 10-2020-0069730 A. Compounds represented by formula 1 described in Korean Patent Publication No. 10-2020-0069070, compounds represented by formula 1 described in Korean Patent Publication No. 10-2020-0069067, compounds represented by formula 1 described in Korean Patent Publication No. 10-2020-0069062, halogenated zinc phthalocyanine pigments described in Japanese Patent No. 6809649, isoindoline compounds described in JP 2020-180176, phenothiazine compounds described in JP 2021-187913, halogenated zinc phthalocyanines described in WO 2022 / 004261, Halide zinc phthalocyanine described in Publication No. 2021 / 250883, quinophthalone compound represented by formula 1 of Korean Patent Publication No. 10-2020-0030759, polymer dye described in Korean Patent Publication No. 10-2020-0061793, colorant described in JP-A-2022-029701, isoindoline compound described in WO 2022 / 014635, aluminum phthalocyanine compound described in WO 2022 / 024926, compound described in JP 2022-045895, WO 2022 / 05005 Compounds described in JP-A-2020-090676, compounds described in JP-A-2020-055956, compounds described in JP-A-2021-031681, compounds described in JP-A-2022-056354, compounds described in US Patent Application Publication No. 2021 / 0355327, compounds described in WO 2022 / 065357, compounds described in JP-A-2020-045436, compounds described in Korean Patent Publication No. 10-2021-0146726, compounds described in JP-A-2018-178039,Compounds described in Chinese Patent Application Publication No. 113881244, compounds described in Chinese Patent Application Publication No. 113881245, compounds described in Chinese Patent Application Publication No. 113881246, compounds described in JP 2022-104822 A, compounds described in JP 2022-096701 A, compounds described in JP 2020-023652 A, green pigments described in the Journal of the Japan Color Materials Association (published in 2022) pages 80 to 84, compounds described in JP 2022-143135 A, compounds described in JP 2022-140287 A, compounds described in WO 2022 / 136308, perylene compounds described in Chinese Patent Application Publication No. 113061349, Korean Patent Publication No. 10-2017-0018993 Cyan pigments described in the publication, isoindoline compounds described in JP 2020-180176 A, compounds described in JP 2023-013209 A, compounds described in JP 2023-013166 A, xanthene compounds described in WO 2023 / 286526, compounds described in JP 2021-155746 A, compounds described in JP 2021-155747 A, compounds described in JP 2021-155748 A, compounds described in JP 2021-155749 A, compounds described in WO 2018 / 051876, compounds described in JP 2020-083981 A, compounds described in JP 2023-056463 ​​A, compounds described in JP-T-2023-515473 A can also be used. The chromatic colorant may be a rotaxane, and the dye skeleton may be used in the cyclic structure of the rotaxane, in the rod-like structure, or in both structures.

[0174] When the resin composition of the present invention contains a chromatic colorant, the content of the chromatic colorant in the total solid content of the resin composition is preferably 1 to 50 mass %. When the resin composition of the present invention contains two or more chromatic colorants, the total amount thereof is preferably within the above range.

[0175] When the resin composition of the present invention is used for an infrared cut filter, it is preferable that the resin composition of the present invention is substantially free of chromatic colorants. Note that, "the resin composition of the present invention is substantially free of chromatic colorants" means that the content of chromatic colorants in the total solid content of the resin composition is 0.5% by mass or less, preferably 0.1% by mass or less, and more preferably contains no chromatic colorants.

[0176] <<Colorant that transmits infrared light and blocks visible light>> The resin composition of the present invention may also contain a colorant that transmits infrared light and blocks visible light (hereinafter also referred to as a colorant that blocks visible light). A resin composition containing a colorant that blocks visible light is preferably used as a resin composition for forming an infrared transmission filter.

[0177] The coloring material that blocks visible light is preferably a coloring material that absorbs light in the violet to red wavelength region. Furthermore, the coloring material that blocks visible light is preferably a coloring material that blocks light in the wavelength region of 450 to 650 nm. Furthermore, the coloring material that blocks visible light is preferably a coloring material that transmits light in the wavelength region of 900 to 1500 nm. The coloring material that blocks visible light preferably satisfies at least one of the following requirements (A) and (B): (A): Contains two or more types of chromatic coloring agents, and forms black by combining two or more types of chromatic coloring agents. (B): Contains an organic black coloring agent.

[0178] Examples of chromatic colorants include those described above. Examples of organic black colorants include bisbenzofuranone compounds, azomethine compounds, perylene compounds, and azo compounds, with bisbenzofuranone compounds and perylene compounds being preferred. Examples of bisbenzofuranone compounds include compounds described in JP-A-2010-534726, JP-A-2012-515233, and JP-A-2012-515234, and are available, for example, as "Irgaphor Black" manufactured by BASF. Examples of perylene compounds include compounds described in paragraphs 0016 to 0020 of JP-A-2017-226821, C.I. Pigment Black 31, 32, and the like. Examples of the azomethine compound include compounds described in JP-A Nos. 01-170601 and 02-034664, and are available as "Chromofine Black A1103" manufactured by Dainichiseika Color & Chemicals Co., Ltd.

[0179] When a black color is formed by combining two or more chromatic colorants, the combination of chromatic colorants may include, for example, the following embodiments (1) to (8): (1) An embodiment containing a yellow colorant, a blue colorant, a violet colorant, and a red colorant; (2) An embodiment containing a yellow colorant, a blue colorant, and a red colorant; (3) An embodiment containing a yellow colorant, a violet colorant, and a red colorant; (4) An embodiment containing a yellow colorant and a violet colorant; (5) An embodiment containing a green colorant, a blue colorant, a violet colorant, and a red colorant; (6) An embodiment containing a violet colorant and an orange colorant; (7) An embodiment containing a green colorant, a violet colorant, and a red colorant; (8) An embodiment containing a green colorant and a red colorant.

[0180] When the resin composition of the present invention contains a colorant that blocks visible light, the content of the colorant that blocks visible light in the total solid content of the resin composition is preferably 1 to 50% by mass, with the lower limit being preferably 5% by mass or more, more preferably 10% by mass or more, even more preferably 20% by mass or more, and particularly preferably 30% by mass or more.

[0181] When the resin composition of the present invention is used for an infrared cut filter, it is preferable that the resin composition of the present invention is substantially free of a colorant that blocks visible light. Note that, "the resin composition of the present invention is substantially free of a colorant that blocks visible light" means that the content of the colorant that blocks visible light in the total solid content of the resin composition is 0.5% by mass or less, preferably 0.1% by mass or less, and more preferably contains no colorant that blocks visible light.

[0182] <<Surfactant>> The resin composition of the present invention can contain a surfactant. As the surfactant, various surfactants such as a fluorine-based surfactant, a nonionic surfactant, a cationic surfactant, an anionic surfactant, and a silicone-based surfactant can be used. The surfactant is preferably a silicone-based surfactant or a fluorine-based surfactant. For details of the surfactant, reference can be made to the surfactants described in paragraphs 0238 to 0245 of WO 2015 / 166779, the contents of which are incorporated herein by reference.

[0183] As the fluorine-based surfactant, compounds described in paragraphs 0167 to 0173 of WO 2022 / 085485 can be used.

[0184] Examples of nonionic surfactants include the compounds described in paragraph 0174 of WO 2022 / 085485.

[0185] Examples of silicone surfactants include SH8400, SH8400 FLUID, FZ-2122, 67 Additive, 74 Additive, M Additive, and SF 8419. OIL (all manufactured by Dow Toray Industries, Inc.), TSF-4440, TSF-4300, TSF-4445, TSF-4460, TSF-4452 (all manufactured by Momentive Performance Materials), KP-341, KF-6000, KF-6001, KF-6002, KF-6003 (all manufactured by Shin-Etsu Chemical Co., Ltd.), BYK-307, BYK-322, BYK-323, BYK-330, BYK-3760, BYK-UV3510 (all manufactured by BYK-Chemie). As the silicone surfactant, compounds having the following structure can also be used.

[0186] The content of the surfactant in the total solid content of the resin composition is preferably 0.001 to 5% by mass. The lower limit is preferably 0.005% by mass or more. The upper limit is preferably 3% by mass or less, more preferably 1% by mass or less, even more preferably 0.5% by mass or less, and particularly preferably 0.2% by mass or less. The resin composition may contain only one type of surfactant, or may contain two or more types. When two or more types are contained, the total amount thereof is preferably within the above range.

[0187] <<Polymerization Inhibitor>> The resin composition of the present invention may contain a polymerization inhibitor. Examples of polymerization inhibitors include hydroquinone, p-methoxyphenol, di-tert-butyl-p-cresol, pyrogallol, tert-butylcatechol, benzoquinone, 4,4'-thiobis(3-methyl-6-tert-butylphenol), 2,2'-methylenebis(4-methyl-6-t-butylphenol), and N-nitrosophenylhydroxyamine salts (ammonium salts, cerous salts, etc.), with p-methoxyphenol being preferred. The content of the polymerization inhibitor in the total solid content of the resin composition is preferably 0.0001 to 5 mass%. The resin composition may contain only one type of polymerization inhibitor, or two or more types. When two or more types are contained, the total amount thereof is preferably within the above range.

[0188] <<Silane Coupling Agent>> The resin composition of the present invention can contain a silane coupling agent. The silane coupling agent is preferably a silane compound having a hydrolyzable group, and more preferably a silane compound having a hydrolyzable group and other functional groups. The hydrolyzable group refers to a substituent directly bonded to a silicon atom that can form a siloxane bond by at least one of a hydrolysis reaction and a condensation reaction. Examples of the hydrolyzable group include a halogen atom, an alkoxy group, and an acyloxy group, with an alkoxy group being preferred. The silane coupling agent is preferably a compound having an alkoxysilyl group. Furthermore, examples of functional groups other than the hydrolyzable group include a vinyl group, a styryl group, a (meth)acryloyl group, a mercapto group, an epoxy group, an oxetanyl group, an amino group, a ureido group, a sulfide group, an isocyanate group, and a phenyl group, with a (meth)acryloyl group and an epoxy group being preferred. Examples of silane coupling agents include the compounds described in paragraph 0177 of WO 2022 / 085485 and the compounds described in JP 2019-183020 A. The content of the silane coupling agent in the total solid content of the resin composition is preferably 0.1 to 15% by mass. The upper limit is preferably 10% by mass or less, more preferably 5% by mass or less. The lower limit is preferably 0.5% by mass or more, more preferably 1% by mass or more. The resin composition may contain only one type of silane coupling agent, or may contain two or more types. When two or more types are contained, it is preferable that the total amount thereof is within the above range.

[0189] <<Ultraviolet Absorber>> The resin composition of the present invention may contain an ultraviolet absorber. Examples of the ultraviolet absorber include conjugated diene compounds, aminodiene compounds, salicylate compounds, benzophenone compounds, benzotriazole compounds, acrylonitrile compounds, hydroxyphenyltriazine compounds, indole compounds, triazine compounds, and dibenzoyl compounds. The ultraviolet absorber includes compounds described in paragraphs 0038 to 0052 of JP-A-2009-217221, compounds described in paragraphs 0052 to 0072 of JP-A-2012-208374, compounds described in paragraphs 0317 to 0334 of JP-A-2013-068814, compounds described in paragraphs 0061 to 0080 of JP-A-2016-162946, compounds described in paragraphs 0059 to 0076 of WO 2016 / 181987, compounds described in paragraphs 0052 and 0074 of WO 2021 / 131355, The compounds described in paragraphs 0022 to 0024 of WO 2021 / 132247, the compounds described in paragraph 0179 of WO 2022 / 085485, the reactive triazine ultraviolet absorbers described in JP 2021-178918 A, the ultraviolet absorbers described in JP 2022-007884 A, the compounds described in Korean Patent Publication No. 10-2022-0014454, the compounds described in JP 2023-013321 A, the compounds described in paragraphs 0049 to 0059 of Japanese Patent No. 6268967 A can also be used. Commercially available ultraviolet absorbers include the Tinuvin series and Uvinul (Uvinal) series manufactured by BASF Corporation. Further, examples of benzotriazole compounds include the MYUA series manufactured by Miyoshi Oil & Fats (The Chemical Daily, February 1, 2016). The content of the ultraviolet absorber in the total solid content of the resin composition is preferably 0.01 to 30% by mass. The lower limit is preferably 0.05% by mass or more. The upper limit is preferably 25% by mass or less, more preferably 20% by mass or less, even more preferably 10% by mass or less, and particularly preferably 5% by mass or less. The resin composition may contain only one type of ultraviolet absorber, or may contain two or more types.When two or more types are contained, the total amount thereof is preferably within the above range.

[0190] <<Antioxidant>> The resin composition of the present invention may contain an antioxidant. Examples of the antioxidant include phenol-based antioxidants, amine-based antioxidants, phosphorus-based antioxidants, and sulfur-based antioxidants.

[0191] Examples of phenolic antioxidants include hindered phenol compounds. The phenolic antioxidant is preferably a compound having a substituent at the site adjacent to the phenolic hydroxy group (ortho position). The substituent is preferably a substituted or unsubstituted alkyl group having 1 to 22 carbon atoms. The antioxidant is also preferably a compound having a phenol group and a phosphite ester group in the same molecule.

[0192] Examples of the amine-based antioxidant include hindered amine compounds. Specific examples of the amine-based antioxidant include bis(2,2,6,6-tetramethyl-4-piperidyl)sebacate, bis(1,2,2,6,6-pentamethyl-4-piperidyl)sebacate, 1-{2-[3-(3,5-di-t-butyl-4-hydrophenyl)propionyloxy]ethyl}-4-(3,5-di-t-butyl-4-hydroxyphenyl)propionyloxy-2,2,6,6-tetramethylpyridine, 8-benzyl- Examples of the compound include compounds having a hindered amine structure, such as 7,7,9,9-tetramethyl-3-octyl-1,3,8-triazaspiro[4,5]undecane-2,4-dione, benzoyloxy-2,2,6,6-tetramethylpiperidine, 2,2,6,6-tetramethyl-4-piperidinol, and tetrakis(2,2,6,6-teto-tetramethyl-4-piperidyl / decyl)-1,2,3,4-butanetetracarboxylate.

[0193] Examples of phosphorus-based antioxidants include tris[2-[[2,4,8,10-tetrakis(1,1-dimethylethyl)dibenzo[d,f][1,3,2]dioxaphosphepin-6-yl]oxy]ethyl]amine, tris[2-[(4,6,9,11-tetra-tert-butyldibenzo[d,f][1,3,2]dioxaphosphepin-2-yl)oxy]ethyl]amine, ethyl bis(2,4-di-tert-butyl-6-methylphenyl)phosphite, and tris(2,4-di-tert-butylphenyl)phosphite.

[0194] Commercially available antioxidants include the ADK STAB AO series, ADK STAB PEP series, ADK STAB A series, and ADK STAB LA series (all manufactured by ADEKA Corporation), and JP-650 (manufactured by Johoku Chemical Industry Co., Ltd.). As the antioxidant, compounds described in paragraphs 0023 to 0048 of Japanese Patent No. 6268967, compounds described in WO 2017 / 006600, compounds described in WO 2017 / 164024, and compounds described in Korean Patent Publication No. 10-2019-0059371 can also be used.

[0195] The content of the antioxidant in the total solid content of the resin composition is preferably 0.01 to 20% by mass. The lower limit is preferably 0.3% by mass or more, and more preferably 0.5% by mass or more. The upper limit is preferably 15% by mass or less, and even more preferably 10% by mass or less. The content of the antioxidant is preferably 0.5 to 10 parts by mass per 100 parts by mass of the specific phthalocyanine metal complex. The lower limit is preferably 1 part by mass or more, and more preferably 2 parts by mass or more. The upper limit is preferably 8 parts by mass or less, and even more preferably 6 parts by mass or less. The resin composition may contain only one type of antioxidant, or may contain two or more types. When two or more types are contained, the total amount thereof preferably falls within the above range.

[0196] <<Other Components>> The resin composition of the present invention may contain, as necessary, sensitizers, fillers, thermosetting accelerators, plasticizers, and other auxiliaries (e.g., conductive particles, antifoaming agents, flame retardants, leveling agents, release accelerators, fragrances, surface tension modifiers, chain transfer agents, latent antioxidants, etc.). By appropriately incorporating these components, properties such as film physical properties can be adjusted. As these components, compounds described in paragraph 0182 of WO 2022 / 085485 can be used. In addition, as the chain transfer agent, thiol compounds described in JP 2020-109068 A can be used.

[0197] The resin composition of the present invention preferably has a free metal content of 100 ppm or less, more preferably 50 ppm or less, other than the metal species contained in the infrared absorbing dye A. The free halogen content is preferably 100 ppm or less, more preferably 50 ppm or less. Methods for reducing free metals and halogens in the resin composition include washing with ion-exchanged water, filtration, ultrafiltration, purification with an ion-exchange resin, and purification with an inorganic adsorbent such as hydrotalcite.

[0198] From the viewpoint of environmental regulations, the use of perfluoroalkyl sulfonic acid and its salts, and perfluoroalkyl carboxylic acid and its salts may be restricted. When the content of the above-mentioned compounds in the resin composition of the present invention is reduced, the content of perfluoroalkyl sulfonic acid (particularly perfluoroalkyl sulfonic acid having a perfluoroalkyl group of 6 to 8 carbon atoms) and its salts, and perfluoroalkyl carboxylic acid (particularly perfluoroalkyl carboxylic acid having a perfluoroalkyl group of 6 to 8 carbon atoms) and its salts is preferably in the range of 0.01 ppb to 1,000 ppb, more preferably in the range of 0.05 ppb to 500 ppb, and even more preferably in the range of 0.1 ppb to 300 ppb, relative to the total solids content of the resin composition. The resin composition of the present invention may be substantially free of perfluoroalkyl sulfonic acid and its salts, and perfluoroalkyl carboxylic acid and its salts. For example, by using a compound that can replace perfluoroalkyl sulfonic acid and its salts, and a compound that can replace perfluoroalkyl carboxylic acid and its salts, a resin composition that is substantially free of perfluoroalkyl sulfonic acid and its salts, and perfluoroalkyl carboxylic acid and its salts, may be selected. Examples of compounds that can replace regulated compounds include compounds that are exempt from regulation due to differences in the number of carbon atoms in the perfluoroalkyl group. However, the above content does not preclude the use of perfluoroalkyl sulfonic acid and its salts, and perfluoroalkyl carboxylic acid and its salts. The resin composition of the present invention may contain perfluoroalkyl sulfonic acid and its salts, and perfluoroalkyl carboxylic acid and its salts, within the maximum allowable range.

[0199] From the viewpoint of environmental regulations, the content of the fluorine-containing compound in the resin composition may be 5% by mass or less, 1% by mass or less, 100 ppm by mass or less, or 1 ppm by mass or less, or may be substantially free of the fluorine-containing compound.

[0200] <Storage container> The storage container for the resin composition of the present invention is not particularly limited, and a known storage container can be used. Further, the container described in paragraph 0187 of WO 2022 / 085485 can be used as the storage container.

[0201] <Method for preparing resin composition> The resin composition of the present invention can be prepared by mixing the above-mentioned components. When preparing the resin composition, all components may be simultaneously dissolved or dispersed in a solvent to prepare the resin composition, or, if necessary, two or more solutions or dispersions in which the respective components are appropriately blended may be prepared in advance, and these may be mixed at the time of use (at the time of application) to prepare the resin composition.

[0202] The preparation of the resin composition may include a process for dispersing the pigment. In the process for dispersing the pigment, mechanical forces used to disperse the pigment include compression, squeezing, impact, shear, and cavitation. Specific examples of these processes include a bead mill, a sand mill, a roll mill, a ball mill, a paint shaker, a microfluidizer, a high-speed impeller, a sand grinder, a flow jet mixer, high-pressure wet atomization, and ultrasonic dispersion. Furthermore, when grinding the pigment in a sand mill (bead mill), it is preferable to use small-diameter beads, increase the bead packing ratio, or otherwise increase the grinding efficiency under such conditions. Furthermore, it is preferable to remove coarse particles after the grinding process by filtration, centrifugation, or the like. In addition, the process and disperser for dispersing pigments can be suitably used, for example, the process and disperser described in "Dispersion Technology Encyclopedia," published by Joho Kiko Co., Ltd., July 15, 2005, or "Dispersion Technology and Industrial Applications Focused on Suspension (Solid / Liquid Dispersion System) - Comprehensive Data Collection," published by the Management Development Center Publishing Department, October 10, 1978, or paragraph 0022 of JP 2015-157893 A. In addition, in the process for dispersing pigments, the pigment may be subjected to a salt milling process to refine the pigment. For details on the materials, equipment, processing conditions, etc. used in the salt milling process, see, for example, JP 2015-194521 A and JP 2012-046629 A. Examples of materials for beads used in dispersion include zirconia, agate, quartz, titania, tungsten carbide, silicon nitride, alumina, stainless steel, and glass. The beads may also be made of an inorganic compound having a Mohs hardness of at least 2. The resin composition may contain 1 to 10,000 ppm of the beads.

[0203] When preparing the resin composition, it is preferable to filter the resin composition with a filter for the purpose of removing foreign matter, reducing defects, etc. Examples of the types of filters and filtration methods used for filtration include the filters and filtration methods described in paragraphs 0196 to 0199 of WO 2022 / 085485.

[0204] <Film> Next, the film of the present invention will be described. The film of the present invention is obtained from the resin composition of the present invention described above. The film of the present invention can be preferably used as an optical filter. The use of the optical filter is not particularly limited, but examples include infrared cut filters and infrared transmission filters. Examples of infrared cut filters include infrared cut filters on the light-receiving side of a solid-state imaging device (e.g., as an infrared cut filter for a wafer-level lens), infrared cut filters on the back side (opposite the light-receiving side) of a solid-state imaging device, and infrared cut filters for ambient light sensors (e.g., an illuminance sensor that senses the illuminance and color tone of the environment in which an information terminal device is placed and adjusts the color tone of the display, or a color correction sensor that adjusts the color tone). In particular, it can be preferably used as an infrared cut filter on the light-receiving side of a solid-state imaging device. Examples of infrared transmission filters include filters that block visible light and selectively transmit infrared rays of a specific wavelength or above.

[0205] The film of the present invention may have a pattern or may be a film without a pattern (flat film). The film of the present invention may be used by being laminated on a support, or may be used by being peeled off from the support. Examples of the support include semiconductor substrates such as silicon substrates and transparent substrates.

[0206] A charge-coupled device (CCD), a complementary metal oxide semiconductor (CMOS), a photoelectric conversion layer, a transparent conductive film, or the like may be formed on the semiconductor substrate used as a support. Furthermore, a partition wall is formed on the semiconductor substrate to separate each pixel. Examples of the partition wall include a metal, a metal oxide, and a black matrix. Furthermore, if necessary, an undercoat layer may be provided on the semiconductor substrate to improve adhesion with an upper layer, prevent diffusion of substances, or flatten the substrate surface.

[0207] The transparent substrate used as the support is not particularly limited as long as it is made of a material that can transmit at least visible light. Examples of substrates include substrates made of glass, resin, and the like. Examples of resins include polyester resins such as polyethylene terephthalate and polybutylene terephthalate; polyolefin resins such as polyethylene, polypropylene, and ethylene-vinyl acetate copolymer; acrylic resins such as norbornene resin, polyacrylate, and polymethyl methacrylate; urethane resin, vinyl chloride resin, fluororesin, polycarbonate resin, polyvinyl butyral resin, and polyvinyl alcohol resin. Examples of glass include soda-lime glass, borosilicate glass, alkali-free glass, quartz glass, and copper-containing glass. Examples of copper-containing glass include copper-containing phosphate glass and copper-containing fluorophosphate glass. Commercially available copper-containing glass can also be used. Examples of commercially available copper-containing glass include NF-50 (manufactured by AGC Technoglass Co., Ltd.).

[0208] The thickness of the film of the present invention can be adjusted appropriately depending on the purpose. The thickness of the film can be 200 μm or less, 150 μm or less, 120 μm or less, 20 μm or less, 10 μm or less, or 5 μm or less. The lower limit of the film thickness is preferably 0.1 μm or more, more preferably 0.2 μm or more.

[0209] When the film of the present invention is used as an infrared cut filter, it is preferable that the film of the present invention has a maximum absorption wavelength in the wavelength range of 650 to 1500 nm (preferably 660 to 1200 nm, more preferably 660 to 1000 nm). Furthermore, the average transmittance in the wavelength range of 700 to 720 nm is preferably 10% or less, more preferably 7% or less, even more preferably 4% or less, and particularly preferably 2% or less. Furthermore, the average transmittance in the wavelength range of 400 to 550 nm is preferably 86% or more, more preferably 89% or more, even more preferably 92% or more, and particularly preferably 95% or more. Furthermore, the transmittance over the entire wavelength range of 420 to 550 nm is preferably 50% or more, more preferably 70% or more, and even more preferably 80% or more. The transmittance at at least one point in the wavelength range of 650 to 1500 nm (preferably 660 to 1200 nm, more preferably 660 to 1000 nm) is preferably 10% or less, more preferably 7% or less, even more preferably 4% or less, and particularly preferably 2% or less. Furthermore, when the absorbance at the maximum absorption wavelength of the film of the present invention is taken as 1, the average absorbance in the wavelength range of 400 to 550 nm is preferably less than 0.030, more preferably less than 0.025.

[0210] When the film of the present invention is used as an infrared transmission filter, it is preferable that the film of the present invention has, for example, any one of the following spectral characteristics (i1) to (i3). (i1): A filter having a maximum transmittance of 20% or less (preferably 15% or less, more preferably 10% or less) in the wavelength range of 400 to 850 nm, and a minimum transmittance of 70% or more (preferably 75% or more, more preferably 80% or more) in the wavelength range of 1000 to 1500 nm. A film having such spectral characteristics can block light in the wavelength range of 400 to 850 nm and transmit light with wavelengths longer than 950 nm. (i2): A filter having a maximum transmittance of 20% or less (preferably 15% or less, more preferably 10% or less) in the wavelength range of 400 to 950 nm, and a minimum transmittance of 70% or more (preferably 75% or more, more preferably 80% or more) in the wavelength range of 1100 to 1500 nm. A film having such spectral characteristics can block light in the wavelength range of 400 to 950 nm and transmit light with wavelengths longer than 1050 nm. (i3): A filter having a maximum transmittance of 20% or less (preferably 15% or less, more preferably 10% or less) in the wavelength range of 400 to 1050 nm and a minimum transmittance of 70% or more (preferably 75% or more, more preferably 80% or more) in the wavelength range of 1200 to 1500 nm. A film having such spectral characteristics can block light in the wavelength range of 400 to 1050 nm and transmit light with wavelengths longer than 1150 nm.

[0211] The film of the present invention can also be used in combination with a color filter containing a chromatic colorant. The color filter can be produced using a coloring composition containing a chromatic colorant. When the film of the present invention is used as an infrared cut filter and is used in combination with the film of the present invention and a color filter, it is preferable that the color filter is arranged on the optical path of the film of the present invention. For example, it is preferable to use the film of the present invention and a color filter stacked together to form a laminate. In the laminate, the film of the present invention and the color filter may or may not be adjacent to each other in the thickness direction. When the film of the present invention and the color filter are not adjacent to each other in the thickness direction, the film of the present invention may be formed on a support other than the support on which the color filter is formed, and other members constituting a solid-state imaging device (e.g., microlenses, planarization layers, etc.) may be interposed between the film of the present invention and the color filter.

[0212] The film of the present invention can also be used in combination with a white film containing a white pigment. The white film can be produced using a resin composition containing a white pigment. When the film of the present invention is used in combination with a white film, it is preferable that the white film is disposed on the optical path of the film of the present invention. For example, it is preferable that the film of the present invention and the white film are laminated together to form a laminate. In the laminate, the film of the present invention and the white film may or may not be adjacent to each other in the thickness direction.

[0213] The film of the present invention can be used in various devices such as solid-state imaging devices such as CCDs (charge-coupled devices) and CMOSs ​​(complementary metal-oxide semiconductors) (the imaging section can be made of compound semiconductors such as InGaAs, organic semiconductors, quantum dots, etc., in addition to Si), infrared sensors, light-emitting elements, optical communication devices (for both transmission and reception), and image display devices.

[0214] <Pixel manufacturing method> The pixel manufacturing method preferably includes a step of applying the resin composition of the present invention onto a support to form a composition layer, a step of patternwise exposing the composition layer formed on the support (exposure step), and a step of developing and removing the composition layer in the unexposed areas to form a pattern (development step). If necessary, a step of baking the developed pattern (post-baking step) may be provided. Each step will be described below.

[0215] In the step of forming a composition layer, the resin composition of the present invention is applied to a support to form a composition layer. Examples of the support include those described above. As a method for applying the resin composition, a known method such as a spin coating method can be used. For example, the application method described in paragraph 0207 of WO 2022 / 085485 can be used.

[0216] The composition layer formed by applying the resin composition may be dried (prebaked). When prebaking is performed, the prebaking temperature is preferably 150°C or lower, more preferably 120°C or lower, and even more preferably 110°C or lower. The lower limit can be, for example, 50°C or higher, or can be 80°C or higher. The prebaking time is preferably 10 seconds to 3000 seconds, more preferably 40 to 2500 seconds, and even more preferably 80 to 220 seconds. Drying can be performed using a hot plate, an oven, or the like.

[0217] In the exposure step, the composition layer is exposed to light in a pattern. For example, the composition layer can be exposed to light in a pattern by using a stepper exposure machine, a scanner exposure machine, or the like, through a mask having a predetermined mask pattern. This allows the exposed portion to be cured.

[0218] Examples of radiation (light) that can be used for exposure include g-line and i-line. Light with a wavelength of 300 nm or less (preferably light with a wavelength of 180 to 300 nm) can also be used. Examples of light with a wavelength of 300 nm or less include KrF line (wavelength 248 nm) and ArF line (wavelength 193 nm), with KrF line (wavelength 248 nm) being preferred. Long-wave light sources of 300 nm or more can also be used.

[0219] The exposure may be performed by continuous irradiation with light or by pulsed irradiation (pulse exposure), which is an exposure method in which light is repeatedly irradiated and paused in a short cycle (for example, on the order of milliseconds or less).

[0220] The irradiation amount (exposure amount) is, for example, 0.03 to 2.5 J / cm ２ is preferred, and 0.05 to 1.0 J / cm ２ The oxygen concentration during exposure can be appropriately selected. In addition to exposure in the atmosphere, exposure may be performed in a low-oxygen atmosphere with an oxygen concentration of 19% by volume or less (e.g., 15% by volume, 5% by volume, or substantially oxygen-free), or in a high-oxygen atmosphere with an oxygen concentration of more than 21% by volume (e.g., 22% by volume, 30% by volume, or 50% by volume). The exposure illuminance can be appropriately set, and is usually 1000 W / m ２ ~100000W / m ２ (For example, 5000 W / m ２ , 15000W / m ２ , or 35,000 W / m ２ The oxygen concentration and exposure illuminance may be appropriately combined. For example, an oxygen concentration of 10% by volume and an illuminance of 10,000 W / m ２ , oxygen concentration 35% by volume, illuminance 20,000 W / m ２ etc.

[0221] Next, the unexposed portions of the composition layer after exposure are developed and removed to form a pattern. The unexposed portions of the composition layer can be developed and removed using a developer. As a result, the unexposed portions of the composition layer in the exposure step are dissolved into the developer, and only the photocured portions remain on the support. The temperature of the developer is preferably, for example, 20 to 30°C. The development time is preferably 20 to 180 seconds. Furthermore, to improve residue removability, the process of shaking off the developer every 60 seconds and then supplying fresh developer may be repeated several times.

[0222] Examples of the developer include organic solvents and alkaline developers, and alkaline developers are preferably used. Regarding the developer and the washing (rinsing) method after development, the developer and washing method described in paragraph 0214 of WO 2022 / 085485 can be used.

[0223] After development and drying, it is preferable to perform additional exposure treatment or heating treatment (post-baking). The additional exposure treatment or post-baking is a post-development curing treatment to ensure complete curing. The heating temperature in post-baking is preferably, for example, 100 to 240°C, more preferably 200 to 240°C. Post-baking can be performed continuously or batchwise using a heating means such as a hot plate, convection oven (hot air circulation dryer), or high-frequency heater to achieve the above conditions for the developed film. When additional exposure treatment is performed, it is preferable that the light used for exposure has a wavelength of 400 nm or less. The additional exposure treatment may also be performed by the method described in Korean Patent Publication No. 10-2017-0122130.

[0224] <Optical Filter> The optical filter of the present invention has the above-described film of the present invention. Types of optical filters include infrared cut filters and infrared transmission filters.

[0225] In addition to the above-described film of the present invention, the optical filter of the present invention may further include a copper-containing layer, a dielectric multilayer film, an ultraviolet absorbing layer, a white layer, etc. Examples of ultraviolet absorbing layers include the absorbing layers described in paragraphs 0040 to 0070 and 0119 to 0145 of International Publication No. 2015 / 099060. Examples of dielectric multilayer films include the dielectric multilayer films described in paragraphs 0255 to 0259 of Japanese Patent Application Laid-Open No. 2014-041318. Examples of copper-containing layers include glass substrates made of copper-containing glass (copper-containing glass substrates) and layers containing copper complexes (copper complex-containing layers). Examples of copper-containing glass substrates include copper-containing phosphate glass and copper-containing fluorophosphate glass. Commercially available copper-containing glass products include NF-50 (manufactured by AGC Technoglass Co., Ltd.), BG-60, and BG-61 (all manufactured by Schott Corporation), and CD5000 (manufactured by HOYA Corporation). The white layer may be a resin film containing a white pigment such as titanium oxide.

[0226] The optical filter of the present invention may be formed on a support. Examples of the support include those described above. Preferred substrates include transparent substrates made of materials such as glass and resin. Examples of resins include polyester resins such as polyethylene terephthalate and polybutylene terephthalate; polyolefin resins such as polyethylene, polypropylene, and ethylene-vinyl acetate copolymer; acrylic resins such as norbornene resin, polyacrylate, and polymethyl methacrylate; urethane resin, vinyl chloride resin, fluororesin, polycarbonate resin, polyvinyl butyral resin, and polyvinyl alcohol resin. Examples of glass include soda-lime glass, borosilicate glass, alkali-free glass, quartz glass, and copper-containing glass. Furthermore, the optical filter may be formed directly on various elements.

[0227] <Solid-state imaging device> The solid-state imaging device of the present invention has the above-described film of the present invention. The configuration of the solid-state imaging device is not particularly limited as long as it has a configuration having the film of the present invention and functions as a solid-state imaging device. For example, the following configurations can be mentioned.

[0228] The solid-state imaging device has a support on which a plurality of photodiodes constituting a light-receiving area and transfer electrodes made of polysilicon or the like are disposed; a light-shielding film made of tungsten or the like is disposed on the photodiodes and transfer electrodes, with only the light-receiving portions of the photodiodes being opened; a device protective film made of silicon nitride or the like is disposed on the light-shielding film so as to cover the entire light-shielding film and the light-receiving portions of the photodiodes; and a film of the present invention is disposed on the device protective film. Furthermore, the device protective film may have a light-focusing means (e.g., a microlens, etc.; the same applies hereinafter) disposed below the film of the present invention (on the side closer to the support), or a light-focusing means disposed on the film of the present invention. Furthermore, the color filter may have a structure in which a film forming each pixel is embedded in a space partitioned, for example, in a lattice pattern, by partition walls. In this case, the partition walls preferably have a lower refractive index than each pixel. Examples of imaging devices having such a structure include the devices described in JP 2012-227478 A and JP 2014-179577 A.

[0229] <Image Display Device> The image display device of the present invention has the film of the present invention. Examples of image display devices include liquid crystal display devices and organic electroluminescence (organic EL) display devices. Definitions and details of image display devices are described, for example, in "Electronic Display Devices" (written by Akio Sasaki, published by Kogyo Chosakai Co., Ltd. in 1990) and "Display Devices" (written by Nobuaki Ibuki, published by Sangyo Tosho Co., Ltd. in 1989). Liquid crystal display devices are described, for example, in "Next Generation Liquid Crystal Display Technology" (edited by Tatsuo Uchida, published by Kogyo Chosakai Co., Ltd. in 1994). There are no particular limitations on the liquid crystal display device to which the present invention can be applied, and the present invention can be applied to various types of liquid crystal display devices described in the above-mentioned "Next Generation Liquid Crystal Display Technology." The image display device may have a white organic EL element. The white organic EL element preferably has a tandem structure. The tandem structure of organic EL elements is described in, for example, JP 2003-045676 A and Akiyoshi Mikami, editor, "The Frontline of Organic EL Technology Development - High Brightness, High Precision, Long Life, and Know-How Collection," Technical Information Association, pp. 326-328, 2008. The spectrum of white light emitted by the organic EL element preferably has strong maximum emission peaks in the blue region (430-485 nm), green region (530-580 nm), and yellow region (580-620 nm). It is more preferable that the spectrum has a maximum emission peak in the red region (650-700 nm) in addition to these emission peaks. The film of the present invention can also be used as an infrared-transmitting film provided in an opening for infrared communication formed in the frame portion of a protective plate for a display device.

[0230] <Infrared Sensor> The infrared sensor of the present invention has the above-described film of the present invention. The configuration of the infrared sensor is not particularly limited as long as it functions as an infrared sensor. Hereinafter, one embodiment of the infrared sensor of the present invention will be described with reference to the drawings.

[0231] 1 , reference numeral 110 denotes a solid-state imaging element. An infrared cut filter 111 and an infrared transmission filter 114 are disposed on an imaging region of the solid-state imaging element 110. A color filter 112 is disposed on the infrared cut filter 111. A microlens 115 is disposed on the incident light hν side of the color filter 112 and the infrared transmission filter 114. A planarization layer 116 is formed to cover the microlens 115.

[0232] The infrared cut filter 111 can be formed using the resin composition of the present invention. The color filter 112 is a color filter formed with pixels that transmit and absorb light of specific wavelengths in the visible range, and is not particularly limited, and a conventionally known color filter for forming pixels can be used. For example, a color filter formed with red (R), green (G), and blue (B) pixels can be used. For example, the description in paragraphs 0214 to 0263 of JP 2014-043556 A can be referred to, and the contents of this specification are incorporated herein. The characteristics of the infrared transmission filter 114 are selected according to the emission wavelength of the infrared LED used. The infrared transmission filter 114 can be formed using the resin composition of the present invention.

[0233] In the infrared sensor shown in FIG. 1 , an infrared cut filter (another infrared cut filter) other than the infrared cut filter 111 may be disposed on the planarization layer 116. Examples of the other infrared cut filter include those having a copper-containing layer and / or a dielectric multilayer film. Details of these filters are as described above. Furthermore, a dual bandpass filter may be used as the other infrared cut filter.

[0234] <Camera Module> The camera module of the present invention has the above-described film of the present invention. The configuration of the camera module is not particularly limited as long as it has a configuration including the film of the present invention and functions as a camera module. For example, a camera module can be configured to have a solid-state image sensor, a lens, and a circuit for processing images obtained from the solid-state image sensor. Known lenses and circuits for processing images obtained from the solid-state image sensor used in the camera module can be used. Examples of camera modules include the camera modules described in JP 2016-006476 A and JP 2014-197190 A, the contents of which are incorporated herein by reference.

[0235] <Light-emitting element> The film of the present invention can also be used for a light-emitting element. The configuration of the light-emitting element is not particularly limited as long as it functions as a light-emitting element, and examples thereof include light-emitting diodes (LEDs), organic light-emitting diodes (OLEDs), quantum dot light-emitting diodes (QLEDs), and vertical-cavity surface-emitting lasers (VISELs). The film of the present invention may be formed directly on the light-emitting element, or may be disposed on the light-emitting path.

[0236] <Optical Communication Element> The film of the present invention can also be used in an optical communication element. The configuration of the optical communication element is not particularly limited as long as it functions as an optical communication element, and it may be a transmitting element or a receiving element. Examples of optical communication elements include infrared remote controls, infrared transceivers, optical interposers, and optical interconnections. The film of the present invention may be formed directly on a receiving element, or may be formed directly on a transmitting element, or may be disposed on a transmitting / receiving path.

[0237] The present invention will be explained in more detail below with reference to examples. The materials, amounts used, ratios, treatment details, treatment procedures, etc. shown in the following examples can be changed as appropriate without departing from the spirit of the present invention. In the structural formulas shown below, Me represents a methyl group, Et represents an ethyl group, Bu represents a butyl group, and Ph represents a phenyl group.

[0238] <Preparation of Dispersions> (Preparation of Dispersions 1 to 33 and 101) The pigments, derivatives, dispersing resins, and solvents of the types shown in the table below were mixed in the parts by mass shown below, and 117 parts by mass of zirconia beads having a diameter of 0.3 mm were added. Dispersion treatment was carried out for 5 hours using a paint shaker, and the beads were separated by filtration to prepare Dispersions 1 to 33 and 101.

[0239]

[0240] (Production of Dispersions 201 to 203) The pigments, dispersing resins, and solvents shown in the table below were mixed in the parts by mass shown in the table below to prepare mixtures, which were then mixed and dispersed for 3 hours using a bead mill (zirconia beads 0.1 mm in diameter). Then, using a high-pressure disperser NANO-3000-10 equipped with a pressure reducing mechanism (manufactured by Nippon BEE Co., Ltd.), the mixtures were dispersed at a pressure of 2000 kg / cm. ２ The dispersion treatment was carried out under conditions of 500 g / min and a flow rate of 500 g / min. This dispersion treatment was repeated a total of 10 times to obtain dispersions 201 to 203. The water content of each dispersion is also shown. The water content of the dispersions was measured by the Karl Fischer method.

[0241]

[0242] The materials listed in the table above are as follows. (Pigments) P-1 to P-33: Phthalocyanine metal complexes (infrared absorbing pigments) in which the metal atoms listed in the table below are coordinated with the phthalocyanine compounds listed in the table below and other ligands. P-1 to P-33 form a square pyramidal structure with the metal atoms listed in the table below and the phthalocyanine compounds listed in the table below.

[0243] Pc1 to Pc18 and L-1 to L-14 each have the structure shown below. The * in L-1 to L-14 indicates the coordination site with the metal atom. In phthalocyanine compounds Pc1 to Pc18, when coordinated to the metal atom, the two hydrogen atoms present in the central portion, which is the coordination site with the metal atom (hydrogen atoms present on the nitrogen atoms of the pyrrole ring), are dissociated. In the table above, HSP-d is the value of the dispersion term (δd) of the Hansen solubility parameter, HSP-p is the value of the polarization term (δp) of the Hansen solubility parameter, and HSP-H is the value of the hydrogen bond term (δh) of the Hansen solubility parameter.

[0244] P-1 to P-18 are phthalocyanine metal complexes having the structure shown below. P-19 to P-33 are phthalocyanine metal complexes having the same structure as P-7, except for the types of other ligands and metal atoms. In the structural formulas shown below, the metal atom and the phthalocyanine compound are depicted on the same plane, but in reality, the metal atom is coordinated away from the center of the phthalocyanine compound, and the metal atom and the phthalocyanine compound form a square pyramidal structure.

[0245] PR254: C.I. Pigment Red 254 (diketopyrrolopyrrole compound, red pigment) PB15:6: C.I. Pigment Blue 15:6 (phthalocyanine compound, blue pigment) PY139: C.I. Pigment Yellow 139 (isoindoline compound, yellow pigment)

[0246] W-1: Titanium oxide particles (white pigment, manufactured by Ishihara Sangyo Kaisha, Ltd., Tipaque CR90-2, average primary particle diameter 250 nm) W-2: Titanium oxide particles (white pigment, manufactured by Ishihara Sangyo Kaisha, Ltd., MPT-141, average primary particle diameter 90 nm)

[0247] (Derivatives) Syn-1 and Syn-2: Compounds having the following structure

[0248] (Dispersion Resin) D-1: Resin having the following structure (the number attached to the main chain is the molar ratio, and the number attached to the side chain is the number of repeating units. Weight average molecular weight: 10,000, acid value: 61.8 mgKOH / g) D-2: Resin having the following structure (the number attached to the main chain is the molar ratio, and the number attached to the side chain is the number of repeating units. Weight average molecular weight: 10,000, acid value: 99.6 mgKOH / g) B-100: Resin having the following structure (weight average molecular weight 12,100, acid value 156 mg KOH / g) B-101: Resin having the following structure (weight average molecular weight 14,100, acid value 167 mg KOH / g)

[0249] (Solvent) S-1: Propylene glycol monomethyl ether acetate (PGMEA) S-2: Propylene glycol monomethyl ether (PGME)

[0250] <Production of Resin Compositions> (Examples 1 to 45, Comparative Examples 1 to 3) The materials shown in the table below were mixed in the parts by mass shown in the table below, and then filtered through a nylon filter with a pore size of 0.45 μm (manufactured by Nippon Pall Co., Ltd.) to produce each resin composition.

[0251]

[0252] The materials listed in the table above are as follows:

[0253] (Dispersion) Dispersion 1 to 33, 101: Dispersion 1 to 33, 101 described above

[0254] (Resins) B-1: Resin having the following structure (the numbers attached to the main chain are molar ratios; weight average molecular weight 20,000, acid value 79.7 mg KOH / g) B-2: Resin having the following structure (the numbers attached to the main chain are molar ratios; weight average molecular weight 15,000, acid value 171.4 mg KOH / g) B-3: Resin having the following structure (the numbers attached to the main chain are molar ratios; weight average molecular weight 10,000, acid value 209.6 mg KOH / g) B-4: Resin having the following structure (the numbers attached to the main chain are molar ratios; weight average molecular weight 10,000, acid value 70.3 mg KOH / g)

[0255] (Polymerizable Monomers) M-1 to M-5: Compounds having the following structures In the above table, HSP-d is the value of the dispersion term (δd) of the Hansen solubility parameter, HSP-p is the value of the polarization term (δp) of the Hansen solubility parameter, and HSP-H is the value of the hydrogen bond term (δh) of the Hansen solubility parameter.

[0256] (Photopolymerization initiator) I-1: Irgacure OXE01 (manufactured by BASF) I-2: Irgacure OXE02 (manufactured by BASF) I-3: Adeka Arcles NCI-831E (manufactured by ADEKA Corporation) I-4: Omnirad 2959 (manufactured by IGM Resins B.V.)

[0257] (Surfactants) Su-1: KF-6001 (manufactured by Shin-Etsu Chemical Co., Ltd., silicone surfactant) Su-2: SH8400 (manufactured by Dow-Toray Industries, Inc., silicone surfactant)

[0258] (Additives) A-1: ​​p-methoxyphenol (polymerization inhibitor) A-2: Compound having the following structure (ultraviolet absorber) A-3: Avobenzone (ultraviolet absorber) A-4: Adekastab AO-80 (manufactured by ADEKA Corporation, antioxidant) A-5: Adekastab LA-82 (manufactured by ADEKA Corporation, antioxidant) A-6: EHPE3150 (manufactured by Daicel Corporation, epoxy compound) A-7: Denacol EX-614 (manufactured by Nagase ChemteX Corporation, epoxy compound) A-8: Compound having the following structure (silane coupling agent) A-9: KBM-502 (Shin-Etsu Chemical Co., Ltd., silane coupling agent)

[0259] (Solvents) S-1: Propylene glycol monomethyl ether acetate (PGMEA) S-2: Propylene glycol monomethyl ether (PGME) S-3: Cyclopentanone

[0260] <Performance Evaluation> (Heat Resistance) Each resin composition was applied to a glass substrate using a spin coater (manufactured by Mikasa Co., Ltd.) to form a coating film so that the film thickness after pre-baking would be 0.8 μm. Next, the coating film was heated (pre-baked) at 100° C. for 120 seconds using a hot plate, and then exposed to 1000 mJ / cm 2 using an i-line stepper exposure system FPA-3000i5+ (manufactured by Canon Corporation). ２ After the entire surface was exposed to an exposure amount of 100 ppm, the film was again heated (post-baked) at 200°C for 300 seconds using a hot plate to obtain a film. The obtained film was heated at 265°C for 5 minutes and a heat resistance test was carried out. The film before and after the heat resistance test was measured using a spectrophotometer (U-4100, manufactured by Hitachi High-Tech Corporation). The absorbance at the absorption maximum λmax, which exists at the longest wavelength in the wavelength range of 400 to 2000 nm, was measured, and the color retention rate was calculated based on the following formula, and the heat resistance was evaluated based on the following criteria. Color retention rate (%) = (absorbance at absorption maximum λmax of film after heat resistance test / absorbance at absorption maximum λmax of film before heat resistance test) x 100 5: Color retention rate exceeds 95% 4: Color retention rate is more than 90% and not more than 95% 3: Color retention rate is more than 85% and not more than 90% 2: Color retention rate is more than 50% and not more than 85% 1: Color retention rate is 50% or less

[0261] (Developability) Each resin composition was applied to a glass substrate using a spin coater (manufactured by Mikasa Co., Ltd.) so that the film thickness after prebaking would be 0.8 μm, forming a coating film. Next, the coating film was heated (prebaked) at 100° C. for 120 seconds using a hot plate, and then exposed to 50 to 2000 mJ / cm using an i-line stepper exposure system FPA-3000i5+ (manufactured by Canon Corporation). ２The substrate was exposed to light through a 1.1 μm square Bayer pattern mask at an exposure dose of 1000 μm, and then puddle development was performed using a 0.3% by mass aqueous solution of tetramethylammonium hydroxide (TMAH) at 23° C. for 60 seconds. The substrate was then rinsed with a spin shower and further washed with pure water. Then, pixels were formed by heating (post-baking) at 200° C. for 5 minutes using a hot plate. The spaces between the pixels (unexposed areas) were observed using a scanning electron microscope, and the residues were evaluated according to the following criteria: 3: No residues with a diameter of 200 nm or more were present in the unexposed areas; 2: The number of residues with a diameter of 200 nm or more was more than 0 and 3 or less, on average, in 10 unexposed areas; 1: The number of residues with a diameter of 200 nm or more was more than 3, on average, in 10 unexposed areas, or the unexposed areas were barely dissolved, and no pixels were formed.

[0262] The results are shown in the table below. The content of the polymerizable monomer in the total solid content of the resin composition is shown in the "Polymerizable monomer content" column, and the Hansen solubility parameter distance between the phthalocyanine compound constituting the phthalocyanine metal complex contained in the resin composition and the polymerizable monomer contained in the resin composition is shown in the "ΔHSP" column.

[0263]

[0264]

[0265] As shown in the table above, the examples were excellent in the evaluation of developability and heat resistance. On the other hand, Comparative Example 1, which did not contain a resin having an acid value of 80 to 300 mgKOH / g, was inferior in developability. In addition, ΔHSP was 13 MPa. ０．５ Even if the content of the polymerizable monomer in the total solid content of the resin composition was 14 mass % or more, the heat resistance was poor in Comparative Example 2. ０．５ Comparative Example 3, which exceeded 100%, was particularly poor in heat resistance.

[0266] <Production of White Resin Compositions> The dispersions, polymerizable monomers, photopolymerization initiators, surfactants, additives, and solvents shown in the table below were mixed in the parts by mass shown in the table below, and stirred for 1 hour in an environment of 25° C. and a relative humidity of 50%. Thereafter, the mixed liquid was filtered through a PP (polypropylene) filter with a pore size of 6 μm, to obtain White Resin Compositions 1 to 5.

[0267]

[0268] The materials listed in the table above are as follows:

[0269] (Dispersions) Dispersions 201 to 203: Dispersions 201 to 203 described above. (Resin) B-110: Resin having the following structure (the numerical values ​​attached to the main chain are mass ratios; weight average molecular weight 31,500, acid value 70 mgKOH / g, Mw / Mn=2.2). (Polymerizable Monomers) M-1, M-5: the above-mentioned polymerizable monomers M-1, M-5 M-100: a compound having the following structure (Photopolymerization initiators) I-1 to I-3: the above-described photopolymerization initiators I-1 to I-3 (Surfactant) Su-1: the above-described surfactant Su-1 (Additives) A-1, A-4, A-8: the above-described additives A-1, A-4, A-8 (Solvent) S-1: the above-described solvent S-1

[0270] Infrared cut filters were formed using the resin compositions of Examples 1 to 45. Specifically, each resin composition was applied to a glass substrate using a spin coater (manufactured by Mikasa Co., Ltd.) so that the film thickness after prebaking would be 0.8 μm, forming a coating film. Next, the film was heated (prebaked) at 100°C for 120 seconds using a hot plate, and then exposed to 1000 mJ / cm using an i-line stepper exposure system FPA-3000i5+ (manufactured by Canon Corporation). ２After the entire surface was exposed to light with an exposure amount of 100 mJ / cm, the film was again heated (post-baked) at 200°C for 300 seconds using a hot plate to form an infrared cut filter. White resin compositions 1 to 5 were applied onto the obtained infrared cut filter using a spin coater (manufactured by Mikasa Co., Ltd.) so that the film thickness after pre-baking would be 5 μm. Next, the film was heated (pre-baked) at 120°C for 120 seconds using a hot plate, and then exposed to light at 50 to 2000 mJ / cm using an i-line stepper exposure system FPA-3000i5+ (manufactured by Canon Corporation). ２ The resulting optical filter was exposed to an exposure dose of 1000 ppm. The resulting optical filter was then heated (post-baked) at 220° C. for 5 minutes using a hot plate to produce an optical filter in which a white layer was formed on an infrared cut filter. By incorporating these optical filters into solid-state imaging devices, excellent image recognition performance can be achieved.

[0271] 110: solid-state imaging element, 111: infrared cut filter, 112: color filter, 114: infrared transmission filter, 115: microlens, 116: planarization layer

Claims

1. A resin composition comprising an infrared absorbing dye A, a resin B, a polymerizable monomer C, and a photopolymerization initiator D, wherein the infrared absorbing dye A comprises a phthalocyanine metal complex A1 that forms a square pyramidal structure with a metal atom a1 and a phthalocyanine compound a2, the resin B comprises a resin b1 having an acid group and an acid value of 80 to 300 mg KOH / g, and the phthalocyanine compound a2 constituting the phthalocyanine metal complex A1 has a Hansen solubility parameter distance with the polymerizable monomer C of 13 MPa or less. ０．５ or less, and a content of the polymerizable monomer C in a total solid content of the resin composition is 14 mass% or more.

2. The phthalocyanine compound a2 constituting the phthalocyanine metal complex A1 has a Hansen solubility parameter distance with the polymerizable monomer C of 10 MPa or less. ０．５ The resin composition according to claim 1, wherein:

3. The resin composition according to claim 1 or 2, comprising 150 parts by mass or more of the polymerizable monomer C per 100 parts by mass of the photopolymerization initiator D.

4. A resin composition according to claim 1 or 2, wherein the metal atom a1 is Pb, Sn, Fe, Mg, Ta, Nb, Ga, Al, Ti, V or Mo.

5. A resin composition according to claim 1 or 2, wherein the metal atom a1 is Ga, Al, Ti, V or Mo.

6. The resin composition according to claim 1 or 2, wherein the metal atom a1 is further coordinated with a ligand other than the phthalocyanine compound a2.

7. The resin composition according to claim 1 or 2, wherein the metal atom a1 is further coordinated with a ligand other than the phthalocyanine compound a2, and the polymerizable monomer C includes a polymerizable monomer C1 having a hydroxy group.

8. The resin composition according to claim 1 or 2, further comprising a chromatic colorant.

9. A film obtained by using the resin composition according to claim 1 or 2.

10. An optical filter comprising the film of claim 9.

11. A solid-state imaging device comprising the film according to claim 9.

12. An image display device comprising the film according to claim 9.

13. An infrared sensor comprising the film of claim 9.

14. A camera module comprising the membrane of claim 9.

Images