Earphones

Abstract

The present application relates to the technical field of electronic devices, and provides earphones (01). Each earphone (01) comprises a housing (10) and at least one waterproof acoustic module (20); at least one accommodating cavity (130) and at least one sound through hole (140) are formed in the inner wall of the housing (10), and the at least one sound through hole (140) passes through the housing (10) and is communicated with the at least one accommodating cavity (130); the waterproof acoustic module (20) comprises a communication hole (240) and a waterproof assembly (220), the waterproof assembly (220) is configured to prevent liquid from entering the interior of the waterproof acoustic module (20) via the communication hole (240), and the at least one waterproof acoustic module (20) is arranged in the at least one accommodating cavity (130) and covers the at least one sound through hole (140), so as to prevent the liquid from entering the internal space of the housing (10) through the at least one sound through hole (140). By using the waterproof acoustic modules (20), the sensitivity difference of acoustic sensors installed in the earphones (01) can be controlled, ensuring that the sensitivity difference between different earphones (01) is within a deviation range, ensuring the consistency of different earphones (01).

Description

A headset Technical Field

[0001] The present invention relates to the technical field of electronic equipment, and in particular to a headset. Background Art

[0002] Headphones typically contain multiple acoustic sensors. When used outdoors or in humid environments, liquids can easily enter through the sound holes. For example, when a user wears headphones for underwater activities (such as swimming), water can enter through the sound holes. Therefore, headphones designed for use in humid environments need to be moisture-resistant and waterproof.

[0003] Since the sensitivity of the acoustic sensor will be affected during the assembly process of the earphones, and because of the moisture and liquid resistance requirements, the acoustic sensor needs to be installed in the earphones in combination with a waterproof structure and sealed, it is difficult to disassemble and adjust. As a result, the sensitivity of the acoustic sensor is also difficult to adjust, making it difficult to ensure that the sensitivity difference of earphones in the same batch is within the ideal deviation range, resulting in a low yield of earphones in the same batch.

[0004] Therefore, it is necessary to design an earphone and an acoustic module accessory for the earphone, the structure of which takes into account waterproofness and can solve the above-mentioned problem of low yield of earphones in the same batch.

[0005] Summary of the Invention

[0006] This specification provides an earphone. The earphone comprises a housing, and at least one waterproof acoustic module; the housing has at least one accommodating cavity and at least one sound hole formed on its inner wall, the at least one sound hole penetrating the housing and communicating with the at least one accommodating cavity; and at least one waterproof acoustic module comprising a communication hole and a waterproof component configured to prevent liquid from entering the interior of the waterproof acoustic module through the communication hole. The at least one waterproof acoustic module is disposed within the at least one accommodating cavity and covers the at least one sound hole, thereby preventing liquid from entering the interior space of the housing through the at least one sound hole.

[0007] In some embodiments, the at least one waterproof acoustic module includes a first waterproof acoustic module and a second waterproof acoustic module, the at least one accommodating cavity includes a first accommodating cavity and a second accommodating cavity, and the at least one sound hole includes a first sound hole and a second sound hole, wherein the first waterproof acoustic module is arranged in the first accommodating cavity and covers the first sound hole; the second waterproof acoustic module is arranged in the second accommodating cavity and covers the second sound hole.

[0008] In some embodiments, the inner wall of the shell includes a shell bottom wall and a shell side wall; the first accommodating cavity is arranged on the shell bottom wall, the second accommodating cavity is arranged on the shell side wall, and the first waterproof acoustic module and the second waterproof acoustic module are connected through a flexible circuit board.

[0009] In some embodiments, the first waterproof acoustic module and the second waterproof acoustic module respectively include a first acoustic sensor and a second acoustic sensor, and the first acoustic sensor and the second acoustic sensor are microphones or speakers.

[0010] In some embodiments, the first waterproof acoustic module and the second waterproof acoustic module include a first circuit board and a second circuit board, respectively; the inner wall of the shell forms a first accommodating side wall of the first accommodating cavity and a second accommodating side wall of the second accommodating cavity; the height of the first accommodating side wall is higher than the upper surface of the first circuit board, thereby forming a first accommodating space to accommodate the sealing material, and / or the height of the second accommodating side wall is higher than the upper surface of the second circuit board, thereby forming a second accommodating space to accommodate the sealing material.

[0011] In some embodiments, the first circuit board and the second circuit board are connected via a flexible circuit board.

[0012] In some embodiments, each of the accommodating chambers includes an accommodating side wall and an accommodating bottom wall, and each of the sound holes passes through the corresponding accommodating bottom wall to connect the internal space of the shell with the external space: each of the waterproof acoustic modules includes a base, the waterproof component, an acoustic component and a circuit board; the base includes a base side wall, a base bottom wall and the connecting hole, the base side wall and the base bottom wall form a base accommodating chamber, the connecting hole passes through the base bottom wall and is connected to the base accommodating chamber, and the base is sealed and connected to the accommodating chamber; the waterproof component is in the base accommodating chamber and covers the connecting hole to prevent liquid from entering the base accommodating chamber through the connecting hole; the acoustic component includes an acoustic sensor, which is placed on the side of the waterproof component away from the bottom wall of the base; and the circuit board is located between the acoustic sensor and the waterproof component and is mechanically connected to the acoustic sensor.

[0013] In some embodiments, a first seal and a second seal are further included, wherein the bottom wall of the base abuts against the bottom wall of the container and forms a first gap, and the side wall of the base and the side wall of the container form a second gap; and the first seal seals the first gap, and the second seal seals the second gap.

[0014] In some embodiments, the first sealing member is obtained by providing a fluid sealing material to the first gap and then curing the fluid sealing material, and / or the second sealing member is obtained by providing a fluid sealing material to the second gap and then curing the fluid sealing material.

[0015] In some embodiments, the first sealing member is a prefabricated sealing gasket.

[0016] In some embodiments, a first limiting portion is provided on the bottom wall of the base along the circumference of the connecting hole; and a second limiting portion is provided on the bottom wall of the container along the circumference of the sound hole. The first limiting portion and the second limiting portion cooperate and abut to form a third gap.

[0017] In some embodiments, a third seal is further included, which seals the third gap, and the third seal is obtained by providing a fluid sealing material to the third gap and then solidifying it; and the first limiting portion and the second limiting portion cooperate and abut to prevent the fluid sealing material from flowing into the sound hole.

[0018] In some embodiments, the first limiting portion includes a groove on the base arranged along the circumference of the communicating hole; and the second limiting portion includes a corresponding protrusion on the accommodating bottom wall arranged along the circumference of the sound hole.

[0019] In some embodiments, the circuit board is connected to the flexible circuit board after passing over the accommodating side wall from the target section of the accommodating side wall, wherein the target section of the accommodating side wall has a smoother design compared to other parts of the accommodating side wall to reduce the bending of the accommodating side wall on the circuit board.

[0020] In some embodiments, the target section includes a guide opening and an inclined guide surface opened on the accommodating side wall, and the guide opening is connected to the inner wall of the shell through the guide surface to support the circuit board.

[0021] In some embodiments, the diameter of the sound hole on the inner wall of the shell is smaller than or equal to the diameter of the sound hole on the outer wall of the shell.

[0022] In some embodiments, the central axis of the sound hole is tilted relative to the bottom wall of the accommodating cavity.

[0023] It can be seen from the above technical solution that the earphones provided in this specification adopt an acoustic sensor mounting structure with a liquid-proof effect. Since the sensitivity of the acoustic sensor will be affected during the assembly process of the earphones, and because of the moisture-proof and liquid-proof requirements, the acoustic sensor needs to be sealed and installed in the shell in combination with the waterproof component, which is difficult to disassemble and adjust, resulting in that the sensitivity of the acoustic sensor is also difficult to adjust. Therefore, it is difficult to ensure that the sensitivity difference of the earphones in the same batch is within the ideal range, thereby affecting the yield of the earphones. In this specification, the acoustic sensor and the waterproof component are placed in a prefabricated acoustic module, and then the acoustic module is installed in the earphones. The acoustic module adapted to the earphones is adjusted according to the preset sensitivity difference requirements. Therefore, the sensitivity difference of multiple acoustic sensors in the same earphones can be flexibly adjusted, thereby ensuring that the sensitivity difference of the earphones in the same batch is within the ideal range, thereby ensuring the yield of the earphones.

[0024] Other functions of the earphones provided by this specification will be partially listed in the following description. The creative aspects of the earphones provided by this specification can be fully explained by practicing or using the methods, devices and combinations described in the following detailed examples. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of this specification, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of this specification. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0026] FIG1A shows a schematic structural diagram of an earphone according to some embodiments of this specification;

[0027] FIG1B shows a cross-sectional view taken along line AA of the earphone shown in FIG1A of this specification;

[0028] FIG2A is a schematic diagram showing a waterproof acoustic module installed in a receiving cavity according to some embodiments of this specification;

[0029] FIG2B shows a schematic diagram of a waterproof acoustic module according to some embodiments of this specification;

[0030] FIG2C shows a BB cross-sectional view of the waterproof acoustic module shown in FIG2B of this specification;

[0031] FIG3 shows a schematic structural diagram of another waterproof acoustic module provided according to an embodiment of this specification;

[0032] FIG4A shows a schematic structural diagram of an acoustic component and a receiving cavity according to some embodiments of this specification;

[0033] FIG4B shows another AA cross-sectional view of the earphone shown in FIG1 of this specification;

[0034] FIG4C shows an enlarged view of portion C shown in FIG4B provided in this specification;

[0035] FIG5 shows a schematic structural diagram of a first waterproof acoustic module provided according to some embodiments of this specification;

[0036] FIG6 shows a schematic diagram of a first accommodating side wall provided according to some embodiments of this specification;

[0037] FIG7A shows a line graph of acoustic sensor sensitivity under solution A according to some embodiments of this specification;

[0038] FIG7B shows a line graph of acoustic sensor sensitivity under solution B provided in some embodiments of this specification. DETAILED DESCRIPTION

[0039] The following description provides specific application scenarios and requirements for this specification, with the goal of enabling those skilled in the art to make and use the contents of this specification. Various modifications to the disclosed embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other embodiments and applications without departing from the spirit and scope of this specification. Therefore, this specification is not limited to the embodiments shown, but is intended to be accorded the broadest scope consistent with the claims.

[0040] The terms used herein are for the purpose of describing specific example embodiments only and are not intended to be limiting. For example, as used herein, the singular forms "a," "an," and "the" may also include the plural forms unless the context clearly indicates otherwise. When used in this specification, the terms "comprise," "include," and / or "contain" are intended to refer to the presence of the associated integers, steps, operations, elements, and / or components, but do not preclude the presence of one or more other features, integers, steps, operations, elements, components, and / or groups or the addition of other features, integers, steps, operations, elements, components, and / or groups in the system / method.

[0041] In this application, terms such as "upper," "lower," "left," "right," "front," "back," "top," "bottom," "inner," "outer," "vertical," "horizontal," "transverse," and "longitudinal" indicate positions or locations based on the positions or locations shown in the accompanying drawings. These terms are primarily intended to better describe this application and its embodiments and are not intended to limit the devices, elements, or components indicated to having a specific orientation, or to being constructed or operated in a specific orientation.

[0042] Furthermore, some of the above terms may be used to express other meanings besides indicating a position or location. For example, the term "on" may also be used to indicate a dependency or connection in certain circumstances. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0043] Furthermore, the terms "installed," "disposed," "provided with," "connected," and "connected" should be interpreted broadly. For example, they can refer to fixed connections, removable connections, or integral structures; mechanical connections or electrical connections; direct connections, indirect connections through an intermediary, or internal communication between two devices, elements, or components. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0044] In this specification, "X includes at least one of A, B, or C" means that X includes at least A, or X includes at least B, or X includes at least C. In other words, X may include only any one of A, B, and C, or any combination of A, B, and C, as well as other possible contents / elements. Any combination of A, B, and C may be A, B, C, AB, AC, BC, or ABC.

[0045] In this specification, unless otherwise specified, the association relationship between structures can be a direct association relationship or an indirect association relationship. For example, when describing "A is connected to B", unless it is clearly stated that A is directly connected to B, it should be understood that A can be directly connected to B or indirectly connected to B; for another example, when describing "A is above B", unless it is clearly stated that A is directly above B (AB are adjacent and A is above B), it should be understood that A can be directly above B or indirectly above B (AB is separated by other elements and A is above B). And so on.

[0046] These and other features of this specification, as well as the operation and function of the associated elements of the structure, and the economical assembly and manufacture of the components, can be significantly improved with consideration of the following description. Reference is made to the accompanying drawings, all of which form a part of this specification. However, it should be expressly understood that the drawings are for illustration and description purposes only and are not intended to limit the scope of this specification. It should also be understood that the drawings are not drawn to scale.

[0047] When the earphone 01 has two or more acoustic sensors, there will usually be differences in sensitivity (i.e., Sgap) between each acoustic sensor assembled on the earphone 01 due to installation errors, differences in acoustic sensor components, etc., which will result in poor consistency in the assembled sensitivity (also called assembly sensitivity) between the earphones 01 during the assembly process, affecting the yield of the earphone 01. Among them, the assembly sensitivity consistency is the difference in Sgap between different earphones 01. Poor assembly sensitivity consistency means that the Sgap difference between the earphones 01 is large. In this case, the sensitivity consistency between multiple earphones 01 can be modulated by a preset algorithm. For example, the assembly sensitivity difference between multiple acoustic sensors in earphone A is Sgap. A ; The assembly sensitivity difference between multiple acoustic sensors in earphone B is Sgap B ; The assembly sensitivity difference between multiple acoustic sensors in earphone C is Sgap C For earphones A, B, and C, it is hoped that the same circuit design or algorithm will be used to adjust the gap between multiple acoustic sensors. Therefore, Sgap A , Sgap B and Sgap C Maintaining the difference between any two Sgap values ​​within a preset range ensures good assembly sensitivity consistency. However, algorithm adjustments typically have a certain threshold range, making it difficult to simultaneously improve sensitivity consistency across multiple earphones and ensure yield.

[0048] Therefore, the present application provides an earphone that uses a waterproof acoustic module. The waterproof acoustic module is a separate module separated from the shell. The waterproof acoustic module has been treated to be liquid (water) proof, so the assembly sensitivity of the waterproof acoustic module is basically fixed. By providing a separate acoustic module 20, the assembly sensitivity difference of the earphone 01 can be flexibly adjusted, thereby improving the consistency of the assembly sensitivity of different earphones 01. In other words, it can be ensured that the difference between the assembly sensitivity difference Sgap of different earphones 01 is within a preset range, thereby ensuring the yield of the earphone 01.

[0049] The present application is described in detail below through specific embodiments:

[0050] Figure 1A shows a schematic structural diagram of earphones 01 provided according to some embodiments of this specification. Figure 1B shows a cross-sectional view taken along line AA of earphones 01 shown in Figure 1A of this specification. The earphones shown in Figure 1A are wireless earphones. It is understood that wireless earphones can be bone conduction earphones, air conduction earphones, or bone-air conduction earphones, and the earphones can also be wired earphones. As shown in Figure 1B, earphones 01 may include a housing 10 and at least one waterproof acoustic module 20.

[0051] The shell 10 can be a mounting component of the earphone 01. Other components of the earphone 01 (such as the waterproof acoustic module 20, etc.) can be installed with the shell 10 as a carrier. The shell 10 may include an inner wall and an outer wall. The outer wall may be the appearance surface of the earphone 01 that is finally presented to the user. The outer wall may be a smooth curved surface. The inner wall may be provided with grooves or protrusions for easy assembly. As shown in Figure 2A, the inner wall of the shell 10 may include a shell bottom wall 110 and a shell side wall 120. The shell bottom wall 110 and the shell side wall 120 together enclose an internal space, and other components of the earphone 01 may be arranged in the internal space.

[0052] The shape of the shell 10 can be any shape, for example, it can be a runway shape (rounded rectangle) or a circle. In some embodiments, the shell 10 can include two parts. After the other parts are assembled, the two parts are buckled together to form the appearance of the earphone 01 seen by the user. The shape of the shell 10 can be any shape. For example, the shell 10 of the earphone 01 can be a shape that conforms to the contour of the human ear, so that the wireless earphones can be worn more firmly on the user's ear. The material of the shell 10 can be any material, such as metal, plastic, polymer, etc. This application does not limit the shape and material of the shell 10.

[0053] As shown in FIG1B , the inner wall of the housing 10 may form at least one accommodating cavity 130. Specifically, the inner wall of the housing 10 may form the accommodating sidewalls 131 and the accommodating bottom wall 132 of the accommodating cavity 130. For example, the housing bottom wall 110 of the housing 10 may form the accommodating sidewalls 131 and the accommodating bottom wall 132. Alternatively, the housing bottom wall 110 may form a portion of the accommodating sidewalls 131 and the accommodating bottom wall 132, and the housing sidewalls 120 may form another portion of the accommodating sidewalls 131 and the accommodating bottom wall 132. In some embodiments, the accommodating cavity 130 may also be a space enclosed by other components.

[0054] The inner wall of the shell 10 may also be formed with at least one sound hole 140. The at least one sound hole 140 passes through the shell 10 and is connected to the at least one accommodating cavity 130. For example, the accommodating bottom wall 132 of each accommodating cavity 130 may be provided with a sound hole 140. The sound hole 140 may pass through the accommodating bottom wall 132, connecting the internal space of the shell 10 with the external space. In some embodiments, the aperture of the sound hole 140 on the inner wall of the shell 10 may be smaller than the aperture of the sound hole 140 on the outer wall of the shell 10. The aperture here refers to the opening diameter of the sound hole on the wall surface. In other words, the sound hole 140 may be in the shape of a trumpet that is larger on the outside and smaller on the inside. By designing the sound hole 140 into a trumpet shape, on the one hand, it can make it easier for the user to clean foreign matter such as solids or liquids that enter the sound hole 140, and on the other hand, it can make the demolding smooth during the processing of the sound hole 140.

[0055] In some embodiments, the central axis of the sound hole 140 can be tilted relative to the bottom wall 132 to prevent water from entering the interior of the housing 10 through the sound hole 140. The central axis of the sound hole 140 can be a line connecting the center of the first opening of the sound hole 140 on the inner wall of the housing 10 and the center of the second opening of the sound hole 140 on the outer wall of the housing 10. The angle at which the central axis of the second sound hole 140 is tilted relative to the bottom wall 132 can be selected based on the design and processing requirements of the product, while not affecting the acoustic performance of the earphone 01. In some embodiments, the tilt angle can be in the range of [30, 90) degrees. When the tilt angle is in the range of [60, 90) degrees, while ensuring a certain degree of tilt, the processing difficulty of the second sound hole 111-C is also reduced. When the tilt angle is in the range of [30, 60] degrees, ensuring the tilt angle is within this range can further enhance the ability to prevent water from entering the interior of the housing 10 through the sound hole 140. In some applications, such as swimming, by tilting the sound hole 140, water will not flow directly into the sound hole 140 when the earphone 01 is subjected to dynamic water pressure, thereby improving the waterproof capability of the earphone 01 under dynamic water pressure. The shape of the sound hole 140 can be circular, oval, square, rectangular, L-shaped, etc., and this specification does not limit the shape of the sound hole 140.

[0056] In some embodiments, the earphone 01 may include at least one accommodating cavity 130 to respectively accommodate multiple components, such as at least one waterproof acoustic module 20. In some embodiments, the accommodating cavity 130 may include a first accommodating cavity and a second accommodating cavity. The first accommodating cavity may include a first sound hole, and the second accommodating cavity may include a second sound hole. The first accommodating cavity may be arranged on the bottom wall 110 of the shell. The second accommodating cavity may be arranged on the side wall 120 of the shell, so that the sound holes 140 in different accommodating cavities can receive sounds from different directions or transmit sounds to different directions. In some embodiments, the first accommodating cavity and the second accommodating cavity may both be arranged on the bottom wall 110 or the side wall 120 of the shell to enhance the ability of the sound hole 140 to receive sounds from the same direction or transmit sounds to the same direction.

[0057] At least one waterproof acoustic module 20 can be disposed within at least one accommodating cavity 130 and cover at least one sound hole 140 to prevent liquid from entering the interior space of the housing 10 through the at least one sound hole 140. FIG2A illustrates a schematic diagram of a waterproof acoustic module 20 provided in accordance with some embodiments of this specification installed in an accommodating cavity 130. FIG2B illustrates a schematic diagram of a waterproof acoustic module 20 provided in accordance with some embodiments of this specification. FIG2C illustrates a cross-sectional view taken along line BB of the waterproof acoustic module 20 shown in FIG2B of this specification. The waterproof acoustic module 20 may include a base 210, a waterproof component 220, an acoustic component 230, and a communication hole 240.

[0058] As shown in Figure 2A, the overall shape of the base 210 can be adapted to the accommodating space of the accommodating cavity 130 so as to be installed in the accommodating cavity 130. As shown in Figure 2C, the base 210 may include a base side wall 211 and a base bottom wall 212. The base side wall 211 and the base bottom wall 212 form a base accommodating cavity 213 to accommodate other components (such as a waterproof component 220, an acoustic component 230, etc.). The base 210 may be provided with a connecting hole 240. The connecting hole 240 may pass through the base bottom wall 212 and be connected to the base accommodating cavity 213. For example, a connecting hole 240 may be provided on the base bottom wall 212. After the base 210 is installed in the accommodating cavity 130, the connecting hole 240 and the sound hole 140 on the accommodating cavity 130 can be connected to ensure that sound can be transmitted in or out from the two holes. In some embodiments, the communication hole 240 is not coaxial with the opening of the sound hole 140 on the wall surface of the container bottom wall 132 facing the base 210. In some embodiments, the communication hole 240 can be coaxial with the opening of the sound hole 140 on the wall surface of the container bottom wall 132 facing the base 210 to minimize the sound transmission path and provide good acoustic performance for the earphone 01. The communication hole 240 can be coaxial with the opening of the sound hole 140 on the wall surface of the container bottom wall 132 facing the base 210, and the central axis of the communication hole 240 and the central axis of the opening of the sound hole 140 on the wall surface of the container bottom wall 132 facing the base 210 can coincide.

[0059] As shown in FIG2C , the waterproof assembly 220 can be installed in the base accommodating cavity 213, sealedly connected to the base accommodating cavity 213 and covering the communication hole 240, thereby preventing liquid (water) from entering the base accommodating cavity 213 through the communication hole 240. The acoustic assembly 230 can be placed on a side of the waterproof assembly 220 away from the base bottom wall 212.

[0060] In some embodiments, the waterproof component 220 may include a waterproof membrane 221 and a buffer 222. The waterproof membrane 221 may allow air to pass through and block water from passing through. A center hole 222-A may be provided on the buffer 222. The buffer 222 may abut against the edge area of ​​the waterproof membrane 221. Specifically, the non-opening edge area of ​​the buffer 222 abuts against the edge area of ​​the waterproof membrane 221. In some embodiments, the center hole 222-A and the opening of the sound hole 140 on the inner wall of the shell 10 are not coaxial. In some embodiments, the center hole 222-A and the opening of the sound hole 140 on the inner wall of the shell 10 may be coaxial, so that the waterproof membrane 221 can be evenly subjected to the water pressure of the water flowing in from the sound hole 140, so that the waterproof membrane 221 is not easily damaged due to the uneven water pressure, thereby reducing the waterproof effect of the waterproof component 220 or even causing it to fail. The center hole 222-A and the opening of the sound hole 140 on the inner wall of the shell 10 are coaxial, and the center axis of the center hole 222-A and the center axis of the opening of the sound hole 140 on the inner wall of the shell 10 may coincide. The shape of the center hole 222-A may be any shape such as circular, elliptical, square, rectangular, etc., and this specification does not limit the shape of the center hole 222-A. In some embodiments, the shape of the center hole 222-A may be adapted to the shape of the sound hole 140, and the aperture of the sound hole 140 may be less than or equal to the aperture of the center hole 222-A, so that the waterproof membrane 221 has a larger area that can withstand water pressure, thereby being less likely to be damaged. The aperture mentioned here refers to the diameter of the hole.

[0061] In some embodiments, the waterproof component 220 may have an adhesive surface so that after the waterproof component 220 is placed in the base accommodating cavity 213, the adhesive surface can be bonded to the base bottom wall 212, thereby achieving a sealed connection between the two and fixing the waterproof component 220. For example, the waterproof component 220 may have a first adhesive surface 222-B and a second adhesive surface 222-C. The first adhesive surface 222-B can adhere the waterproof component 220 to the base accommodating cavity 213 after being subjected to external pressure. The external pressure can be the gravity of the acoustic component 230 or the pressure applied by the pressure jig. The second adhesive surface 222-C can seal the waterproof component 220 and the acoustic component 230 when they are in contact.

[0062] Specifically, the waterproof assembly 220 may include two buffer members 222, located on either side of the waterproof membrane 221. The two surfaces of the buffer members 222 facing the base cavity 213 and the acoustic assembly 230 may be adhesive. This adhesive surface allows the waterproof assembly 220 to be secured within the base cavity 213 by adhesion, achieving a waterproof effect while ensuring ease and convenience in operation.

[0063] Furthermore, the buffer 222 can also be elastic. The buffer 222 can evenly distribute the high-speed physical pressure (impact energy) exerted on the waterproof assembly 220. Furthermore, during the installation process of the waterproof assembly 220, the buffer 222 can protect the waterproof membrane 221 from wrinkling due to large impacts, thereby affecting its waterproof and acoustic performance. In some embodiments, the buffer 222 can be foam glue, elastic acrylic glue, or a foam matrix + elastic acrylic glue. In some embodiments, the thickness of a single buffer 222 ranges from 0.1 mm or greater. When the buffer 222 has a certain thickness, it can increase the height / thickness of the waterproof assembly 220, allowing the waterproof assembly 220 to adapt to the assembly space reserved in the housing 10, such as the depth of the base accommodating cavity 213. Furthermore, when the buffer 222 has a certain thickness, it can increase the deformability of the waterproof assembly 220, thereby accommodating different manufacturing errors in the base accommodating cavity 213 and making it easier to assemble the waterproof assembly 220 into the base 210.

[0064] The acoustic assembly 230 includes an acoustic sensor 231 and a circuit board 232. The acoustic sensor 231 is placed on a side of the waterproof assembly 220 away from the base bottom wall 212. The circuit board 232 may be placed between the acoustic sensor 231 and the waterproof assembly 220.

[0065] The acoustic sensor 231 may include a sound transmission hole 231-A. In some embodiments, the acoustic sensor 231 may include at least one microphone. The microphone may receive ambient sound transmitted through the waterproof component 220 through the sound transmission hole 231-A. In some embodiments, the acoustic sensor 231 may include at least one speaker. When in operation, the speaker may emit a target sound. The target sound may pass through the sound transmission hole 231-A and then through the waterproof component 220 to exit the earphone 01. The waterproof component 220 covers the communication hole 240 to prevent water from passing through the waterproof component 220 and contacting the acoustic sensor 231.

[0066] The circuit board 232 can be mechanically connected to the acoustic sensor 231. The mechanical connection mentioned herein can be bonding, welding, seam connection, riveting, etc. For example, the acoustic sensor 231 can be fixed to the circuit board 232 by welding. As mentioned above, the acoustic component 230 can be bonded to the waterproof component 220 through the second bonding surface 222-C. Specifically, the circuit board 232 can be bonded to the waterproof component 220 through the second bonding surface 222-C. In some embodiments, pressure can be further applied to the acoustic component 230 so that the circuit board 232 can be bonded more firmly to the second bonding surface 222-C. For example, the acoustic component 230 is pressed down by a pressure jig to apply pressure thereto. For another example, pressure can be applied thereto by placing a heavy object on the acoustic component 230.

[0067] In some embodiments, the circuit board 232 may be at least partially located within the base accommodating cavity 213. In some embodiments, the circuit board 232 may also be located outside the base accommodating cavity 213. For example, the circuit board 232 may be located outside the base accommodating cavity 213 and abut against the top surface of the base sidewall 211.

[0068] In some embodiments, the circuit board 232 may be flush with the edge of the base 210. For example, as shown in FIG2A , the edge of the circuit board 232 is flush with the edge of the base side wall 211. In some embodiments, the coverage of the circuit board 232 may exceed the base 210. FIG3 shows a schematic structural diagram of another waterproof acoustic module 20 provided according to an embodiment of the present specification. As shown in FIG3 , the right side of the circuit board 232 exceeds the edge of the base side wall 211. The protruding portion of the circuit board 232 may pass over the base side wall 211 and then bend to contact the bottom wall 110 or the side wall 120 of the shell. By designing the circuit board 232 to extend beyond the base 210, it is convenient to connect the waterproof acoustic modules 20 in the case of multiple waterproof acoustic modules 20.

[0069] In some embodiments, the circuit board 232 may be provided with a plurality of positioning holes 232-A, and the top surface of the base sidewall 211 may be provided with a plurality of positioning protrusions 232-B that correspond one to one. By providing the positioning holes 232-A and positioning protrusions 232-B, it is possible to facilitate the relative positioning of the sound transmission hole 231-A and the center hole 222-A of the buffer 222, thereby ensuring the shortest sound transmission path and ensuring that the earphone 01 has good acoustic performance. The number of positioning protrusions 232-B and positioning holes 232-A can be three as shown in Figure 2B. This specification does not limit the number of positioning protrusions and positioning holes. In some embodiments, the plurality of positioning protrusions 232-B can be approximately evenly distributed around the waterproof component 220 or the acoustic sensor 231 to facilitate positioning. For example, the line connecting the three positioning protrusions 232-B in Figure 2B forms a triangle, which is approximately evenly distributed around the acoustic sensor 231.

[0070] In some embodiments, positioning protrusion 232-B can be cylindrical, as shown in Figure 2B. In some embodiments, positioning protrusion 232-B can also be truncated into a cone shape, narrow at the top and wide at the bottom, to avoid interference with positioning hole 232-A during installation. In some embodiments, positioning protrusion 232-B includes a columnar body and an enlarged columnar head. The columnar body is inserted into the corresponding positioning hole 232-A.

[0071] In some embodiments, the circuit board 232 may be a printed circuit board (PCB). The PCB is not easily bent and has a certain degree of rigidity, so it can well support the acoustic sensor 231.

[0072] In some embodiments, the circuit board 232 can be a flexible printed circuit (FPC). As mentioned above, in order to enhance the local thickness or hardness of the FPC and ensure the flatness of the FPC, the FPC can be partially or overall reinforced. In some embodiments, the acoustic component 230 can also include a steel plate or PI (Polymide, PI for short) material as a reinforcing plate 233 to reinforce the FPC. Among them, PI material is an engineering plastic with excellent mechanical properties, with the characteristics of light weight, thin thickness, and good bendability. The reinforcing plate 233 for enhancing the strength of the circuit board 232 can be located between the circuit board 232 and the waterproof component 220, as shown in Figure 2C. The reinforcing plate 233 can abut the top surface of the base side wall 211. In some embodiments, the thickness of the reinforcing plate 233 can range from 0.05mm to 0.5mm to ensure that the occupied space is reduced while enhancing the strength of the circuit board 232.

[0073] Therefore, multiple positioning holes 232-A can be provided on the reinforcing plate 233. As shown in FIG2B, the reinforcing plate 233 is provided with three positioning holes 232-A, and the three positioning holes 232-A are distributed approximately evenly around the acoustic sensor 231 in a triangular shape.

[0074] In some embodiments, positioning protrusion 232-B is made of a hot-melt material. The end of positioning protrusion 232-B is hot-melted and pressurized to form an enlarged stud. This hot-melt pressurization method forms positioning protrusion 232-B into a rivet-like structure, which is not only simple and efficient, but also allows the hot-melt material to simultaneously seal the gap between positioning protrusion 232-B and positioning hole 232-A, eliminating the need for further sealing between positioning protrusion 232-B and positioning hole 232-A. This simplifies operation, improves efficiency, and reduces costs.

[0075] Figure 4A shows a schematic diagram of the structure of the waterproof acoustic module 20 and the accommodating cavity 130 according to some embodiments of this specification. Figure 4B shows another AA cross-sectional view of the earphone 01 shown in Figure 1 of this specification. Figure 4C shows an enlarged view of the C section shown in Figure 4B provided in this specification.

[0076] In order to reduce the difficulty of assembling the waterproof acoustic module 20 and the accommodating cavity 130, the size of the waterproof acoustic module 20 can be slightly smaller than the size of the accommodating cavity 130. Therefore, there can be a gap between the waterproof acoustic module 20 and the accommodating side wall 131. In some embodiments, the base side wall 211 and the accommodating side wall 131 form a second gap I2, as shown in Figure 4A. The second sealant 40 that seals the second gap I2 can be obtained by providing a fluid sealing material to the second gap and then curing it. For example, the second sealant 40 is silicone, hot melt adhesive, UV adhesive, etc. The above sealants all have the advantages of strong adhesion, low pollution, and fast curing.

[0077] In some embodiments, after the waterproof acoustic module 20 is installed in the accommodating cavity 130 , the base bottom wall 212 of the base 210 abuts against the accommodating bottom wall 132 to form a first gap I1 , as shown in FIG4A . The first gap I1 can be sealed using a first sealing member 30 .

[0078] In some embodiments, the first sealing member 30 can be a prefabricated sealing gasket. By pre-bonding the first sealing member 30 to the bottom wall 132 and then placing the waterproof acoustic module 20 on the first sealing member 30, the waterproof acoustic module 20 can be secured within the accommodating cavity 130. In some embodiments, the sealing gasket can be double-sided tape, foam tape, or a combination of foam and double-sided tape.

[0079] As mentioned above, the interior of the shell 10 can form an accommodating side wall 131 and an accommodating bottom wall 132 of the accommodating cavity 130. In some embodiments, the accommodating bottom wall 132 may include a first step. As shown in Figure 4B, the first step can divide the accommodating bottom wall 132 into a first bottom wall 132-A and a second bottom wall 132-B. Among them, the connecting hole 240 passes through the first bottom wall 132-A and is connected to the accommodating cavity 130. The base 210 can abut against the second bottom wall 132-B. The above-mentioned first gap I1 can be formed between the base 210 and the first bottom wall 132-A. The first seal 30 can be in the first gap I1 and seal the first gap I1. At this time, the first seal 30 can be obtained by providing a fluid sealing material to the first gap I1 and then solidifying it.

[0080] During the flow of the fluid sealing material, it may enter the sound hole 140, partially or completely filling the sound hole 140 and thus affecting sound transmission. Furthermore, when the sound hole 140 is tilted, it is more difficult to clean the fluid sealing material that has flowed into the hole. In some embodiments, by providing a stopper on the base bottom wall 212 and the container bottom wall 132, the fluid sealing material can be prevented from flowing into the sound hole 140.

[0081] In some embodiments, a first limiting portion 212-A is provided on the base bottom wall 212 along the circumference of the connecting hole 240; and a second limiting portion is provided on the accommodating bottom wall 132 along the circumference of the sound hole 240. For example, as shown in FIG4B , the base bottom wall 212 is provided with a circle of first limiting portions 212-A around the opening of the connecting hole 240. The accommodating bottom wall 132 is provided with a circle of second limiting portions 212-B around the opening of the sound hole 140. The first limiting portion 212-A is provided on the side of the base bottom wall 212 facing the accommodating cavity 130. The first limiting portion 212-A and the first limiting portion 212-B cooperate and abut against each other, thereby preventing the fluid sealing material from flowing into the sound hole 140. By providing a circle of first limiting portions 212-A and a circle of second limiting portions 212-B, all pathways for the fluid sealing material to flow into the sound hole 140 are blocked.

[0082] In some embodiments, the first limiting portion 212-A includes a groove provided on the bottom wall 212 of the base along the circumference of the communicating hole 240, and the second limiting portion 251-B includes a second step provided on the bottom wall 132 along the circumference of the sound hole 140, as shown in FIG4B . By providing a second step or a similar protrusion, the fluid sealing material is prevented from flowing into the sound hole 140. By providing a corresponding groove, the bottom wall 212 of the base can better abut and cooperate with the second limiting portion 251-B, thereby better preventing the fluid sealing material from flowing into the sound hole 140. By providing the groove and the second step, not only can the fluid sealing material be prevented from flowing into the sound hole 140, but it also plays a role in positioning when the waterproof acoustic module 20 is placed in the accommodating cavity 130.

[0083] In some embodiments, to take into account manufacturing precision errors and to reduce the difficulty of assembling the waterproof acoustic module 20 and the accommodating cavity 130, the notch of the groove can be slightly larger than the second step. Therefore, the first limiting portion 212-A and the second limiting portion 212-B can form a third gap. Referring to Figure 4C, the third gap can be sealed by a third sealing member 50. The third sealing member 50 can be obtained by providing a fluid sealing material to the third gap and then curing it. In some embodiments, the third sealant 50 can be a UV glue, silicone or hot melt glue, etc. In some embodiments, after the fluid sealing material of the first sealing member 30 flows into the first gap, if there is any excess amount that can enter the third gap, the third gap can be further sealed by the first sealing member 30. The existence of the third gap not only ensures that the fluid sealing material does not flow into the sound hole 140, but also extends the accommodation path of the fluid sealing material, allowing more fluid sealing material to be placed between the waterproof acoustic module 20 and the accommodating cavity 130, thereby enhancing the firmness of the connection between the two.

[0084] As previously described, the earphone 01 may include at least one waterproof acoustic module 20. In some embodiments, the earphone 01 may also include a single acoustic module 20. In some embodiments, the earphone 01 may also include multiple acoustic modules 20, thereby including multiple acoustic sensors 231 to achieve more functions. Any two of the circuit boards 232 of the waterproof acoustic module 20 can be connected via a flexible circuit board, thereby connecting the two waterproof acoustic modules. Any two of the circuit boards 232 of the waterproof acoustic module 20 can also be directly connected, thereby connecting the two waterproof acoustic modules.

[0085] In some embodiments, the headset 01 may include two acoustic modules 20, thereby including two acoustic sensors 231. For example, when the acoustic sensor 231 is a microphone, providing two microphones within the headset can achieve a noise reduction effect. One microphone can be a standard microphone used by the user for conversations, used to collect human voices. The other microphone can have a noise collection function to facilitate the collection of ambient noise.

[0086] As previously mentioned, the housing 10 may include two cavities 130. The two cavities 130 may respectively accommodate two waterproof acoustic modules 20: a first waterproof acoustic module 20-A and a second waterproof acoustic module 20-B (not shown). Figure 5 shows a schematic diagram of the structure of the first waterproof acoustic module 20-A, according to some embodiments of this specification.

[0087] The first waterproof acoustic module 20-A is disposed in the first accommodating cavity 130-A and covers the first sound hole 140-A. The first waterproof acoustic module 20-A may include a first acoustic sensor 231-A and a first circuit board 232-A. As previously mentioned, the inner wall of the housing 10 may form a first accommodating side wall 130-A1 of the first accommodating cavity 130-A. The height of the first accommodating side wall 130-A1 is higher than the upper surface of the first circuit board 232-A, thereby forming a first accommodating space S1 for accommodating the sealing material. The sealing material may be the aforementioned sealant.

[0088] The second waterproof acoustic module is disposed within the second accommodating cavity and covers the second sound hole. The second waterproof acoustic module may include a second acoustic sensor and a second circuit board. As previously described, the inner wall of the housing 10 may form a second accommodating sidewall of the second accommodating cavity. The height of the second accommodating sidewall may be higher than the upper surface of the second circuit board, thereby forming a second accommodating space for accommodating the sealing material. The structure of the second accommodating space may be similar to that of the first accommodating space described above.

[0089] The first circuit board and the second circuit board may be connected directly or through another flexible circuit board, thereby realizing the connection between the first waterproof acoustic module and the second waterproof acoustic module.

[0090] In some embodiments, both the first circuit board 232-A and the second circuit board can be the above-mentioned circuit board 232 whose right side exceeds the edge of the base side wall 211. Therefore, the protruding parts of the first circuit board 232-A and the second circuit board can pass over their respective base side walls 211, and then bend and contact at the bottom wall 110 or the side wall 120 of the shell. In some embodiments, the first circuit board 232-A and the second circuit board can contact, and the contact parts can be directly welded together. In some embodiments, when the first circuit board 232-A and the second circuit board are PCBs, the two can also be electrically connected through board-to-board connectors (Board-to-board Connectors, referred to as BTB connectors). In some embodiments, the parts of the first circuit board 232-A and the second circuit board extending outward from the base side wall 211 cannot contact each other. The two circuit boards 232 can be connected through another connecting circuit board. The connecting circuit board can be an FPC or a PCB.

[0091] As previously mentioned, first circuit board 232-A can be an FPC, and the right side of first circuit board 232-A can extend beyond the edge of the base sidewall. Therefore, when the height of first accommodating sidewall 130-A1 is higher than the upper surface of first circuit board 232-A, first circuit board 232-A must bend within first accommodating cavity 130-A, extend out of first accommodating cavity 130-A, pass over first accommodating sidewall 130-A1, and then bend to the bottom wall 110 / side wall 120 of the housing to connect to the connecting circuit board or the second circuit board.

[0092] FIG6 illustrates a schematic diagram of a first accommodating sidewall 130-A1 according to some embodiments of the present specification. FIG6 does not illustrate the portion of the first circuit board 232-A that extends beyond the edge of the first base sidewall 130-A1. To reduce the degree of bending of the first circuit board 232-A as it passes over the first accommodating cavity 130-A and to prevent damage to the first circuit board 232-A due to excessive bending at the first accommodating sidewall 130-A1, a target segment 131-A, as shown in FIG6 , may be provided on the first accommodating sidewall 130-A1. The first circuit board 232 may pass over the first accommodating sidewall 130-A1 from the target segment 131-A of the first accommodating sidewall 130-A1.

[0093] The target segment 131-A can have a flatter design compared to other portions of the first accommodating side wall 130-A1, thereby reducing the degree of bending of the first circuit board 232-A at the first accommodating side wall 130-A1 and thereby increasing the lifespan of the first circuit board 232-A. For example, if the corners of other portions of the first accommodating side wall 130-A1 are sharp right angles, the flatter design of the target segment 131-A can be rounded corners. For another example, if the corners of other portions of the first accommodating side wall 130-A1 are rounded corners with smaller angles, the flatter design of the target segment 131-A can be rounded corners with larger angles. For another example, if the height difference between other portions of the first accommodating side wall 130-A1 and the inner wall of the housing 10 is large, the flatter design of the target segment 131-A can be small in height difference with the inner wall of the housing 10, and there can be a sloped support between the target segment 131-A and the inner wall of the housing 10. As shown in Figure 6, the target section 131-A may include a guide opening 131-a1 and an inclined guide surface 131-a2 opened on the first accommodating side wall 130-A1. The upper surface of the first circuit board 232-A may be flush with the upper surface of the guide opening 131-a1, so that the first circuit board 232-A does not need to bend in order to cross the first accommodating side wall 130-A1. The guide opening 131-a1 can be connected to the inner wall of the shell 10 through the inclined guide surface 131-a2. Since there is a certain height difference between the guide opening 131-a1 and the inner wall of the shell 10, the provision of the guide surface 131-a2 can support the circuit board 232, prevent the circuit board 232 from being suspended in the air, and reduce the risk of damage to the circuit board 232.

[0094] In some embodiments, the degree of bending of the first circuit board 232-A in the side wall section of the first accommodating side wall 130-A1 can be measured by the bending angle of the first circuit board 232-A. The smaller the bending angle, the lower the degree of bending. For example, the degree of bending is lower when the bending angle is an acute angle than when the bending angle is a right angle. When there is no guide surface 131-a2, the first circuit board 232-A needs to bend at a right angle along the first accommodating side wall 130-A1. As shown in Figure 6, since the inclined guide surface 131-a2 is provided, the first circuit board 232-A can avoid generating a sharp bending angle when bending downward. The support of the guide surface 131-a2 makes the bending angle of the first circuit board 232-A acute and very small. In some embodiments, compared with the right-angle design of other segments, a rounded corner design can be adopted at the target segment 131-A, so that the first circuit board 232-A can bend along the rounded corner when passing through the first accommodating side wall 130-A1, and no direct bending will occur, thereby reducing damage to the first circuit board 232-A.

[0095] In some embodiments, the second housing cavity (primarily the second housing sidewall) housing the second waterproof acoustic module can have the same design as the first housing cavity, and will not be further described here. By providing a target segment on the second housing sidewall, the second circuit board can be bent without sharp angles, thereby minimizing damage to the second circuit board.

[0096] As mentioned above, the waterproof acoustic module 20 is made into a standard part that is separated from the shell 10. The acoustic module 20 has been treated to be liquid (water) proof, so the overall sensitivity of the acoustic module 20 is basically fixed. By providing a separate acoustic module 20, the sensitivity difference of the earphone 01 can be flexibly adjusted, and the sensitivity consistency of different earphones 01 can be improved. In other words, it is possible to ensure that the difference between the sensitivity difference Sgap of different earphones 01 is within a preset range, thereby ensuring the yield of the earphone 01. Therefore, when the earphone 01 includes two acoustic sensors, at least one of the two acoustic sensors comes from the waterproof acoustic module 20. In some embodiments, two acoustic waterproof modules 20 are respectively provided in the earphone 01, so that it is easier to control the sensitivity of the acoustic sensor after assembly, thereby ensuring the consistency of different earphones 01.

[0097] FIG7A shows a line graph of acoustic sensor sensitivity under solution A according to some embodiments of the present specification.

[0098] 7B shows a line graph of acoustic sensor sensitivity according to solution B provided in some embodiments of this specification. An example is given in which two acoustic sensors are provided in the earphone 01 and the two acoustic sensors are microphones (MIC1 and MIC2).

[0099] Solution A is a sensitivity curve chart when earphone 01 does not use the waterproof acoustic module 20. Figure 7A shows the sensitivity values ​​of MIC1 and MIC2 of three earphones A, B, and C among many earphones. Among them, the sensitivity of the microphones of the same earphone 01 is shown using the same curve line. The difference in sensitivity between the two microphones is recorded as Sgap. The average value of the difference in sensitivity between the two microphones of earphone A is Sgap. A The average sensitivity difference between the two microphones of earphone B is Sgap B The average sensitivity difference between the two microphones of earphone C is Sgap C Among them, Sgap A With Sgap B The difference between A-B About 1.07dB; Sgap A With Sgap C The difference between A-C About 1.9dB; SgapB With Sgap C The difference between B-C This is approximately 0.83dB. This means that if you need to adjust the sensitivity consistency between the headphones, the adjustment threshold should be at least 1.9dB.

[0100] Solution B is a sensitivity curve chart when one microphone in earphone 01 is from the waterproof acoustic module 20 and the other microphone is not from the waterproof acoustic module 20. Figure 7B shows the sensitivity values ​​of MIC1 and MIC2 of three earphones A', B', and C' in the range of 200Hz to 4kHz. Among them, the sensitivity of the microphones of the same earphone 01 is shown by the same curve line, and the sensitivity difference between the two microphones is recorded as Sgap'. The average sensitivity difference between the two microphones of earphone A' is Sgap A The average sensitivity difference between the two microphones of earphone B' is Sgap B The average sensitivity difference between the two microphones of headphone C' is Sgap C '. Among them, Sgap A 'With Sgap B 'The difference between Sgap A ' -B 'About 0.47dB; Sgap A 'With Sgap C 'The difference between Sgap A ' -C 'About 0.85dB; Sgap B 'With Sgap C 'The difference between Sgap B '- C ' is about 0.38dB. That is to say, if you need to adjust the sensitivity consistency between the headphones, the adjustment threshold only needs to reach 0.85dB.

[0101] It can be seen from the above data that the maximum difference between Sgap' after using at least one waterproof acoustic module 20 (Scheme B) is much smaller than the maximum difference between Sgap' after not using the waterproof acoustic module 20 (Scheme A). After testing and statistically analyzing the microphone sensitivity of nearly 100 earphones 01 using Scheme A and nearly 100 earphones 01 using Scheme B, it was found that the average value of the difference in Sgap of the earphones using Scheme A is approximately 0.83dB to 2.1dB. The average value of the difference in Sgap' of the earphones using Scheme B is approximately 0.3dB to 0.84dB. Therefore, it can be considered that the earphones 01 after using the waterproof acoustic module 20 have higher consistency and higher yield.

[0102] Therefore, it is not difficult to conclude that the above-mentioned effect can also be achieved when the two microphones of the earphone 01 come from two waterproof acoustic modules 20, that is, when the two waterproof modules 20 are respectively installed inside the housing 10. In particular, when two waterproof acoustic modules 20 are respectively installed in the earphone 01, the sensitivity of the two waterproof acoustic modules 20 can be measured separately. When the sensitivity difference is too different from that of other earphones 01, any one of the two waterproof acoustic modules 20 can be replaced to adjust the sensitivity difference of the two waterproof acoustic modules 20, and then the appropriate waterproof acoustic module 20 can be installed in the housing 10. Therefore, by making the waterproof acoustic module 20 into a standard part, not only can the waterproof acoustic module 20 be mass-produced, but it can also be ensured that the difference between the sensitivity differences of different earphones 01 is within a preset range, thereby ensuring the yield of the same batch of earphones 01.

[0103] The foregoing description of this specification describes specific embodiments. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recited in the claims can be performed in an order different from that described in the embodiments and still achieve the desired results. Furthermore, the processes depicted in the accompanying drawings do not necessarily require the particular order or sequential order shown to achieve the desired results. In certain embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0104] In summary, after reading this detailed disclosure, those skilled in the art will appreciate that the foregoing detailed disclosure may be presented by way of example only and may not be limiting. Although not expressly stated herein, those skilled in the art will understand that this specification encompasses various reasonable changes, improvements, and modifications to the embodiments. Such changes, improvements, and modifications are intended to be suggested by this specification and are within the spirit and scope of the exemplary embodiments of this specification.

[0105] Furthermore, certain terms in this specification have been used to describe embodiments of this specification. For example, “one embodiment,” “an embodiment,” and / or “some embodiments” mean that a particular feature, structure, or characteristic described in connection with that embodiment may be included in at least one embodiment of this specification. Therefore, it is emphasized and should be understood that two or more references to “an embodiment,” “one embodiment,” or “an alternative embodiment” in various parts of this specification do not necessarily refer to the same embodiment. Furthermore, particular features, structures, or characteristics may be appropriately combined in one or more embodiments of this specification.

[0106] It should be understood that in the foregoing descriptions of the embodiments of this specification, to facilitate understanding of a feature and to simplify this specification, various features are combined in a single embodiment, figure, or description thereof. However, this does not necessarily mean that these features are combined. When reading this specification, those skilled in the art may extract some of the features and understand them as separate embodiments. In other words, the embodiments of this specification can also be understood as the integration of multiple sub-embodiments. This also applies when each sub-embodiment contains fewer than all the features of a single previously disclosed embodiment.

[0107] Each patent, patent application, patent application publication, and other materials, such as articles, books, specifications, publications, documents, articles, etc., cited herein is hereby incorporated by reference in its entirety for all purposes, except for any prosecution document history related thereto, any equivalent that may be inconsistent or conflicting with this document, or any equivalent prosecution document history that may have a limiting effect on the broadest scope of the claims now or hereafter associated with this document. For example, if there is any inconsistency or conflict between the description, definition, and / or use of terms associated with any incorporated material and the terminology, description, definition, and / or use associated with this document, the terminology in this document shall control.

[0108] Finally, it should be understood that the embodiments of the application disclosed herein are illustrative of the principles of the embodiments of this specification. Other modified embodiments are also within the scope of this specification. Therefore, the embodiments disclosed in this specification are merely examples and not limitations. Those skilled in the art can adopt alternative configurations based on the embodiments in this specification to implement the application in this specification. Therefore, the embodiments of this specification are not limited to the embodiments precisely described in the application.

Claims

1. A kind of earphone, characterized in that, Comprising: A housing, at least one accommodation cavity and at least one sound passage hole are formed on the inner wall of the housing, the at least one sound passage hole penetrates through the housing and communicates with the at least one accommodation cavity; and At least one waterproof acoustic module, the waterproof acoustic module includes a communication hole and a waterproof component, the waterproof component is configured to prevent liquid from entering the interior of the waterproof acoustic module through the communication hole, wherein The at least one waterproof acoustic module is disposed in the at least one accommodation cavity and covers the at least one sound passage hole to prevent the liquid from entering the internal space of the housing through the at least one sound passage hole.

2. The earphone according to claim 1, wherein, The at least one waterproof acoustic module includes a first waterproof acoustic module and a second waterproof acoustic module, the at least one accommodation cavity includes a first accommodation cavity and a second accommodation cavity, the at least one sound passage hole includes a first sound passage hole and a second sound passage hole, wherein The first waterproof acoustic module is disposed in the first accommodation cavity and covers the first sound passage hole; The second waterproof acoustic module is disposed in the second accommodation cavity and covers the second sound passage hole.

3. The earphone according to claim 2, wherein The inner wall of the housing includes a housing bottom wall and a housing side wall; The first accommodation cavity is disposed on the housing bottom wall, the second accommodation cavity is disposed on the housing side wall, and the first waterproof acoustic module and the second waterproof acoustic module are connected by a flexible circuit board.

4. The earphone according to claim 2 or 3, characterized in that, The first waterproof acoustic module and the second waterproof acoustic module respectively include a first acoustic sensor and a second acoustic sensor, and the first acoustic sensor and the second acoustic sensor are microphones or speakers.

5. The earphone according to claim 2, characterized in that, The first waterproof acoustic module and the second waterproof acoustic module respectively include a first circuit board and a second circuit board; The inner wall of the housing forms a first accommodation side wall of the first accommodation cavity and a second accommodation side wall of the second accommodation cavity; The height of the first accommodation side wall is higher than the upper surface of the first circuit board, thereby forming a first accommodation space for accommodating a sealing material, and / or, The height of the second accommodation side wall is higher than the upper surface of the second circuit board, thereby forming a second accommodation space for accommodating a sealing material.

6. The earphone according to claim 5, characterized in that, The first circuit board and the second circuit board are connected by a flexible circuit board.

7. The earphone according to any one of claims 1 to 6, characterized in that Each of the accommodation cavities includes an accommodation side wall and an accommodation bottom wall, and each of the sound passage holes penetrates through the corresponding accommodation bottom wall to communicate the internal space of the housing with the external space: Each of the waterproof acoustic modules includes: A base, including a base side wall, a base bottom wall and the communication hole, the base side wall and the base bottom wall form a base accommodation cavity, the communication hole penetrates through the base bottom wall and communicates with the base accommodation cavity, and the base is hermetically connected to the accommodation cavity; The waterproof component, in the base accommodation cavity and covering the communication hole to prevent liquid from entering the base accommodation cavity through the communication hole; An acoustic component, including an acoustic sensor, the acoustic sensor is disposed on a side of the waterproof component away from the base bottom wall; and A circuit board, located between the acoustic sensor and the waterproof component and mechanically connected to the acoustic sensor.

8. The earphone according to claim 7, characterized in that, Also includes a first seal and a second seal, The bottom wall of the base abuts against the bottom wall of the accommodation and forms a first gap, and the side wall of the base forms a second gap with the side wall of the accommodation; and The first seal seals the first gap, and the second seal seals the second gap.

9. The earphone according to claim 8, characterized in that, The first seal is obtained by providing a fluid sealing material to the first gap and then curing it, and / or The second seal is obtained by providing a fluid sealing material to the second gap and then curing it.

10. The earphone according to claim 8 or 9, characterized in that, The first seal is a prefabricated gasket.

11. The earphone according to claim 8-10, wherein A first limiting portion is circumferentially arranged on the bottom wall of the base along the communication hole; and A second limiting portion is circumferentially arranged on the bottom wall of the accommodation along the sound passing hole, and the first limiting portion and the second limiting portion cooperate and abut to form a third gap.

12. The earphone according to claim 11, characterized in that, It further includes a third seal, the third seal seals the third gap, and the third seal is obtained by providing a fluid sealing material to the third gap and then curing it; and The first limiting portion and the second limiting portion cooperate and abut to prevent the fluid sealing material from flowing into the sound passing hole.

13. The earphone according to claim 11 or 12, wherein The first limiting portion includes a groove arranged on the base along the circumference of the communication hole; and The second limiting portion includes a corresponding protrusion arranged on the bottom wall of the accommodation along the circumference of the sound passing hole.

14. The earphone according to any one of claims 7-13, wherein The circuit board passes over the side wall of the accommodation from the target section of the side wall of the accommodation and then is connected to the flexible circuit board, wherein the target section of the side wall of the accommodation has a smoother design than other parts of the side wall of the accommodation to reduce the bending of the side wall of the accommodation on the circuit board.

15. The earphone according to claim 14, characterized in that, The target section includes a guiding opening and an inclined guiding surface formed on the side wall of the accommodation, and the guiding opening is connected to the inner wall of the housing through the guiding surface to support the circuit board.

16. The earphone according to any one of claims 1 to 15, characterized in that, The aperture of the sound passing hole on the inner wall of the housing is less than or equal to the aperture of the sound passing hole on the outer wall of the housing.

17. The earphone according to any one of claims 1-16, characterized in that, The central axis of the sound passing hole is inclined with respect to the bottom wall of the accommodation cavity.

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