Liquid cooling plate based on phase-change heat transfer device

Abstract

Disclosed in the present invention is a liquid cooling plate based on a phase-change heat transfer device, the liquid cooling plate comprising a liquid cooling plate lower shell internally provided with a flow channel, and a liquid cooling plate upper shell connected to the liquid cooling plate lower shell, wherein a liquid inlet allowing a liquid to flow into the flow channel and a liquid outlet allowing the liquid to flow out of the flow channel are provided on the liquid cooling plate lower shell, and the liquid cooling plate upper shell is configured as a phase-change heat transfer device. The liquid cooling plate upper shell is configured as a phase-change heat transfer device, such that the phase-change heat transfer device serves as part of the liquid cooling plate. The design significantly enhances the heat dissipation effect on a tiny heat source or a high-heat-flux heat source in the following two aspects: on the one hand, by means of the thermal diffusion of the phase-change heat transfer device, and on the other hand, by means of the direct cooling of liquid on the phase-change heat transfer device, thereby greatly improving the cooling efficiency.

Description

A liquid cooling plate based on phase change heat transfer device Technical Field

[0001] The present invention relates to the field of heat dissipation technology, and in particular to a liquid cooling plate based on a phase change heat transfer device. Background Art

[0002] Liquid cold plates are currently widely used as an efficient heat dissipation method for batteries, chips, and power semiconductors. However, traditional liquid cold plates, primarily made of aluminum alloy, are limited by the material's inherent thermal conductivity, making them ineffective at cooling small heat sources or those with high heat flux densities. This is particularly true when it comes to increasing the size of the cold plates. Therefore, improvements are needed.

[0003] Summary of the Invention

[0004] The purpose of the present invention is to overcome the deficiencies of the prior art and provide a liquid cooling plate based on a phase change heat transfer device with efficient heat dissipation effect.

[0005] The technical solution of the present invention provides a liquid cooling plate based on a phase change heat transfer device, comprising a liquid cooling plate lower shell with a flow channel inside and a liquid cooling plate upper shell connected to the liquid cooling plate lower shell, the liquid cooling plate lower shell being provided with a liquid inlet for liquid to flow into the flow channel and a liquid outlet for the liquid to flow out of the flow channel, and the liquid cooling plate upper shell being configured as a phase change heat transfer device.

[0006] Furthermore, the liquid cooling plate upper shell and the liquid cooling plate lower shell are connected by bolts.

[0007] Furthermore, a seal is provided between the lower shell of the liquid cooling plate and the upper shell of the liquid cooling plate.

[0008] Furthermore, the sealing member is a sealing ring, and a sealing groove for accommodating the sealing ring is provided on the lower shell of the liquid cooling plate.

[0009] Furthermore, a plurality of threaded holes are provided on the upper shell of the liquid cooling plate, the sealing ring and the sealing groove, and the three are connected by bolts.

[0010] Furthermore, the shape of the flow channel is a straight line shape; or a spiral shape; or a curved shape; or a serpentine shape.

[0011] Furthermore, a plurality of bosses for heat dissipation are provided on the surface of the upper shell of the liquid cooling plate that contacts the heat source.

[0012] The above technical solution has the following beneficial effects:

[0013] The present invention incorporates a phase-change heat transfer element into the liquid cooling plate's housing, making it an integral component. This design significantly improves the heat dissipation of small or high-heat-flux heat sources in two ways: firstly, through heat diffusion from the phase-change heat transfer element, and secondly, through direct cooling of the phase-change heat transfer element by the liquid, thereby significantly increasing cooling efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The disclosure of the present invention will become more easily understood with reference to the accompanying drawings. It should be understood that these drawings are for illustrative purposes only and are not intended to limit the scope of protection of the present invention. In the drawings:

[0015] FIG1 is a top view of a liquid cooling plate based on a phase change heat transfer device in one embodiment of the present invention.

[0016] FIG2 is a perspective view of a liquid cooling plate based on a phase change heat transfer device in one embodiment of the present invention;

[0017] FIG3 is a schematic structural diagram of a sealing ring in one embodiment of the present invention;

[0018] FIG4 is an exploded view of a liquid cooling plate based on a phase change heat transfer device in one embodiment of the present invention;

[0019] FIG5 is a top view of a shell (phase change heat transfer device) on a liquid cooling plate in one embodiment of the present invention;

[0020] FIG6 is a left side view of the upper shell (phase change heat transfer device) of the liquid cooling plate in one embodiment of the present invention;

[0021] FIG7 is a bottom view of the upper shell (phase change heat transfer device) of the liquid cooling plate in one embodiment of the present invention;

[0022] FIG8 is a perspective view of the upper shell (phase change heat transfer device) of the liquid cooling plate in one embodiment of the present invention.

[0023] Chart symbol comparison table:

[0024] 1. Liquid cooling plate lower shell; 11. Flow channel; 12. Liquid inlet; 13. Liquid outlet; 14. Sealing groove; 2. Liquid cooling plate upper shell; 3. Sealing ring; 4. Threaded hole; 5. Bolt. DETAILED DESCRIPTION

[0025] The specific embodiments of the present invention will be further described below with reference to the accompanying drawings.

[0026] It is easy to understand that according to the technical solution of the present invention, a variety of structural modes and implementation modes can be replaced with each other by those skilled in the art without changing the essential spirit of the present invention. Therefore, the following specific embodiments and drawings are only exemplary descriptions of the technical solution of the present invention and should not be regarded as the entire invention or as a limitation or restriction of the technical solution of the invention.

[0027] In this specification, directional terms such as "up," "down," "left," "right," "front," "back," "front," "back," "top," and "bottom" are defined relative to the configurations shown in the accompanying drawings. These terms are relative and may vary depending on the device's location or usage. Therefore, these and other directional terms should not be construed as restrictive. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0028] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed, detachable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediary; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0029] In some embodiments of the present invention, a liquid cooling plate lower shell 1 having a flow channel 11 therein and an upper shell 2 on the liquid cooling plate connected to the lower shell 1 of the liquid cooling plate is provided. The lower shell 1 of the liquid cooling plate is provided with a liquid inlet 12 for liquid to flow into the flow channel 11 and a liquid outlet 13 for liquid to flow out of the flow channel 11. The upper shell 2 on the liquid cooling plate is configured as a phase change heat transfer device.

[0030] Specifically, a flow channel 11 is designed inside the lower shell 1 of the liquid cooling plate. The shape and structure of the flow channel 11 can be adjusted according to actual needs. The liquid inlet 12 and the liquid outlet 13 are respectively located on the lower shell 1 of the liquid cooling plate for the inflow and outflow of liquid. The liquid inlet 12 and the liquid outlet 13 can be processed by one-piece molding, or they can be connected by means of threads, welding or interference fit after being processed separately. The shell material includes but is not limited to copper-based, aluminum-based or stainless steel-based pure metal materials or alloy materials. The upper shell 2 of the liquid cooling plate serves as a phase change heat transfer device, and its surface adopts high thermal conductivity phase change heat transfer device materials, such as copper-based, aluminum-based or stainless steel-based pure metal materials or alloy materials. The upper shell 2 of the liquid cooling plate is tightly connected to the lower shell 1 of the liquid cooling plate to form a complete liquid cooling plate structure.

[0031] Working Principle: When liquid enters flow channel 11 through liquid inlet 12, it directly contacts the surface of the phase-change heat transfer device, triggering a phase-change heat transfer process. The phase-change heat transfer device absorbs heat, causing the liquid to undergo a phase change, enhancing the heat diffusion efficiency of small heat sources or high heat flux density heat sources. After passing through flow channel 11, the cooling liquid flows out through liquid outlet 13, forming a cycle and achieving efficient cooling of the heat source.

[0032] Liquid Cold Plate Manufacturing Method: Drilling and milling techniques are used to fabricate the lower housing 1 of the liquid cold plate. The internal flow channel 11, liquid inlet 12, and liquid outlet 13 are fabricated according to design requirements. Milling techniques are also used to fabricate the upper housing 2 of the liquid cold plate. The shape and structure of the phase change heat transfer device are designed to ensure a tight fit with the lower housing 1 of the liquid cold plate. The lower housing 1 and the upper housing 2 of the liquid cold plate are assembled and connected according to design requirements to form a complete liquid cold plate.

[0033] Technical effects of liquid cooling plate:

[0034] 1. Improve the heat diffusion effect of small heat sources or high heat flux density heat sources, and achieve more uniform and efficient heat dissipation through phase change heat transfer devices.

[0035] 2. Direct liquid cooling of phase change heat transfer devices improves cooling efficiency and reduces thermal resistance.

[0036] 3. Through the structural optimization of the liquid cooling plate, an efficient heat dissipation solution is provided, which is widely used in the fields of battery heat dissipation, chip heat dissipation and power semiconductor heat dissipation.

[0037] In some embodiments of the present invention, the liquid cooling plate upper shell 2 and the liquid cooling plate lower shell 1 are connected by bolts 5 .

[0038] Specifically, this design offers the following technical benefits: 1. Removability: Bolt 5 connection makes the connection between the upper shell 2 and the lower shell of the liquid cooling plate removable, facilitating maintenance, replacement, or upgrades of the liquid cooling plate components. This facilitates future maintenance and repair. 2. Simple process: Bolt 5 connection is a relatively simple assembly process that does not require complex equipment or technology, making it easy to manufacture and assemble. This helps reduce manufacturing costs and improve production efficiency.

[0039] In some embodiments of the present invention, glue sealing is used to achieve waterproof sealing between the upper shell 2 and the lower shell 1 of the liquid cooling plate. This means that a waterproof glue sealing material is used to fill or cover the connection interface between the upper shell 2 and the lower shell of the liquid cooling plate to ensure that no liquid leakage occurs during the operation of the liquid cooling plate. Principle: The principle of waterproof glue sealing is to utilize the elasticity and sealing properties of the glue sealing material to form an effective sealing layer between the upper shell 2 and the lower shell of the liquid cooling plate. When the glue sealing material is compressed, it can fill the tiny gaps in the connection interface to prevent liquid from leaking through these gaps. Compared with other complex sealing methods, the use of glue sealing is a relatively simple and low-cost sealing solution, which helps to reduce manufacturing costs.

[0040] In some embodiments of the present invention, the sealing element is a sealing ring 3, and a sealing groove 14 is defined on the lower housing 1 of the liquid cooling plate to accommodate the sealing ring 3. The sealing ring 3 is typically made of a waterproof material such as rubber, while the sealing groove 14 is a depression or groove-shaped structure on the surface of the lower housing 1 of the liquid cooling plate, which secures and accommodates the sealing ring 3. The sealing ring 3 utilizes its soft and elastic properties to form an effective seal between the upper housing 2 and the lower housing of the liquid cooling plate. When the liquid cooling plate assembly is assembled, the sealing ring 3 is placed in the sealing groove 14. The elasticity of the sealing ring 3 allows it to fill the gaps in the groove, forming a seal and providing compression resistance, ensuring an effective seal during assembly. The design of the sealing ring 3 and sealing groove 14 simplifies installation and maintenance. During assembly, the sealing ring 3 can be placed in the sealing groove 14 relatively easily, and during maintenance, the sealing ring 3 can be replaced or repaired relatively easily. The elasticity of the sealing ring 3 allows it to adapt to slight dimensional variations between liquid cooling plate assemblies, improving sealing performance and ensuring a long-term sealing effect.

[0041] In some embodiments of the present invention, multiple threaded holes 4 are provided on the liquid cold plate housing 2, sealing ring 3, and sealing groove 14. This means that these three components are connected together via bolts 5. Threaded holes 4 are pre-recorded holes in each component, through which bolts 5 are passed to securely connect the components. The bolted connection 5 ensures a uniform and stable seal between the liquid cold plate housing 2, sealing ring 3, and sealing groove 14, improving the sealing performance of the liquid cold plate.

[0042] In some embodiments of the present invention, the threaded hole 4 can be set as a countersunk hole or a through hole. The countersunk hole refers to a depression formed at the bottom of the threaded hole 4, which is suitable for installing a bolt 5 with a countersunk head. The through hole completely passes through the entire component and is suitable for using an ordinary bolt 5. Countersunk hole structure: A depression is formed at the bottom of the threaded hole 4 to accommodate the countersunk part of the bolt 5, so that the bolt 5 can be flush with the surface of the component. Through hole structure: The threaded hole 4 completely passes through the entire component, allowing the bolt 5 to pass from one side to the other side, which is suitable for using an ordinary bolt 5. Countersunk hole principle: The design of the countersunk hole can ensure that the head of the bolt 5 is embedded in the surface of the component, making the surface of the component smoother. This helps to prevent the bolt 5 from protruding from the surface, improve the overall appearance and avoid interfering with other components. Through hole principle: The design of the through hole allows the bolt 5 to pass from one side to the other side, providing greater flexibility, making the connection between components more flexible. The through hole is suitable for ordinary bolts 5 and is convenient for installation and disassembly.

[0043] In some embodiments of the present invention, the upper shell 2 of the liquid cooling plate and the lower shell 1 of the liquid cooling plate are connected by low-temperature brazing, and the seal between the two is set to brazing paste. At the same time, a solder paste groove for accommodating the brazing paste is opened on the lower shell 1 of the liquid cooling plate.

[0044] Specifically, the solder paste is a welding material that can melt and flow under low temperature conditions, and is used to fill the joints and form a seal. The solder paste groove is a groove opened on the lower shell 1 of the liquid cooling plate, which is used to hold the solder paste. Low-temperature brazing is a process of using a brazing material at a relatively low temperature to melt and penetrate into the tiny gaps at the joints, thereby forming a strong connection. The solder paste is a special welding material that melts at low temperatures and fills the tiny gaps at the joints, which not only plays a connecting role but also forms a sealing effect. Low-temperature brazing provides a stronger connection, ensuring that the connection between the upper shell 2 of the liquid cooling plate and the lower shell 1 of the liquid cooling plate is firm and reliable. Compared with some high-temperature welding methods, low-temperature brazing and the use of solder paste have a simpler manufacturing process and will not produce excessive thermal effects on the liquid cooling plate material.

[0045] Optionally, the solder paste groove can be omitted from the lower housing 1 of the liquid cooling plate. This means that solder paste can be applied directly to the joint without requiring a dedicated groove to hold the solder paste. This simplifies the manufacturing process, allowing solder paste to be applied directly to the joint without the need for a dedicated groove. Omitting the solder paste groove reduces manufacturing steps, thereby improving connection efficiency and reducing manufacturing costs.

[0046] In some embodiments of the present invention, the shape of the flow channel 11 in the liquid cooling plate may be a straight line, a spiral, a curved shape, or a serpentine shape. This refers to the direction of the channel or pipe designed inside the liquid cooling plate. Straight line shape: The flow channel 11 extends in a straight line direction, which may be horizontal, vertical, or oblique. The straight line-shaped flow channel 11 is usually used for a simple liquid flow path. The straight line design helps to simplify the flow of the liquid, reduce flow resistance, and improve cooling efficiency. Spiral shape: The flow channel 11 is spiral and extends along a spiral path to form a spiral channel. The spiral-shaped flow channel 11 increases the flow path of the liquid in the channel, prolongs the contact time between the liquid and the surface of the cold plate, and improves the cooling effect. Curved shape: The flow channel 11 has a curved shape and may include a single curve or multiple curves connected. The curved shape of the flow channel 11 design can make the liquid generate more turbulence in the channel, increase the heat exchange effect, and improve the heat dissipation performance. Serpentine shape: The flow channel 11 is serpentine and changes direction alternately along a continuous curved path. The serpentine shape of the flow channel 11 design combines changes in multiple directions, which can form a more complex flow pattern of the liquid in the channel and improve the heat transfer efficiency.

[0047] In some embodiments of the present invention, a plurality of bosses are provided on the surface of the shell 2 of the liquid cooling plate that contacts the heat source. A boss refers to a small raised structure protruding from the surface, which can be distributed throughout the area in contact with the heat source. Principle of boss design: The design of the boss is to increase the local protrusions on the surface in contact with the heat source, thereby increasing the actual thermal contact area. This helps to improve the efficiency of heat conduction between the liquid cooling plate and the heat source. The provision of the boss increases the irregularities of the surface and increases the actual surface area in contact with the heat source. This helps to transfer heat more efficiently and improve the cooling effect. By increasing the actual contact area, the liquid cooling plate can absorb and conduct heat more effectively, thereby improving the cooling effect of the liquid cooling plate on the heat source. The design of the boss helps to alleviate the situation where the local temperature of the heat source is too high, and through better heat conduction, the heat is quickly transferred to the liquid cooling plate, thereby reducing the local temperature of the heat source.

[0048] The present invention incorporates a phase-change heat transfer element into the upper shell 2 of the liquid cooling plate, making it an integral component of the liquid cooling plate. This design significantly improves the heat dissipation of small or high-heat-flux heat sources in two ways: firstly, through heat diffusion from the phase-change heat transfer element, and secondly, through direct cooling of the phase-change heat transfer element by the liquid, thereby greatly improving cooling efficiency.

[0049] The above are only the principles and preferred embodiments of the present invention. It should be noted that, for those skilled in the art, several other variations can be made based on the principles of the present invention, which should also be considered as the scope of protection of the present invention.

Claims

1. A liquid cooling plate based on a phase change heat transfer device, characterized in that, It includes a liquid-cooling plate lower housing with a flow channel inside and a liquid-cooling plate upper housing connected to the liquid-cooling plate lower housing. An inlet for the liquid to flow into the flow channel and an outlet for the liquid to flow out of the flow channel are provided on the liquid-cooling plate lower housing, and the liquid-cooling plate upper housing is configured as a phase change heat transfer device.

2. The liquid cooling plate based on the phase change heat transfer device according to claim 1, wherein The liquid-cooling plate upper housing and the liquid-cooling plate lower housing are connected by bolts.

3. The liquid cooling plate based on the phase change heat transfer device according to claim 1, wherein A seal is provided between the liquid-cooling plate lower housing and the liquid-cooling plate upper housing.

4. The liquid cooling plate based on the phase change heat transfer device according to claim 3, characterized in that, The seal is an O-ring, and a sealing groove for accommodating the O-ring is formed on the liquid-cooling plate lower housing.

5. The liquid cooling plate based on the phase change heat transfer device according to claim 4, characterized in that, A plurality of threaded holes are provided on the liquid-cooling plate upper housing, the O-ring, and the sealing groove, and the three are connected by bolts.

6. The liquid cooling plate based on the phase change heat transfer device according to any one of claims 1-5, characterized in that, The shape of the flow channel is a straight shape; or a spiral shape; or a bent shape; or a meandering shape.

7. The liquid cooling plate based on the phase change heat transfer device according to any one of claims 1-5, characterized in that, A plurality of bosses for heat dissipation are provided on the surface of the liquid-cooling plate upper housing in contact with the heat source.

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