Enhanced heat dissipation structure of and heat dissipation method for high-power heating device

Abstract

The present invention provides an enhanced heat dissipation structure of and a heat dissipation method for a high-power heating device. The enhanced heat dissipation structure of a high-power heating device comprises a high-power heating device; the upper surface of the high-power heating device is provided with a phase change heat transfer device; the phase change heat transfer device is filled with a phase change working medium; an evaporation end of the phase change heat transfer device is in contact with the high-power heating device; a condensation end of the phase change heat transfer device is far away from the high-power heating device; and a contact surface of the high-power heating device and the phase change heat transfer device is provided with a heat conduction interface material. Heat of the high-power heating device can be transferred to the phase change heat transfer device by means of the heat conduction interface material, and then vapor-liquid phase change heat transfer is carried out in the phase change heat transfer device to achieve efficient diffusion of heat, thus increasing the equivalent heat dissipation area of the high-power heating device, and ensuring effective heat dissipation of the high-power heating device.

Description

An enhanced heat dissipation structure and heat dissipation method for a high-power heating device Technical Field

[0001] The present invention relates to the technical field of heat dissipation of electronic devices, and in particular to an enhanced heat dissipation structure and a heat dissipation method for a high-power heating device. Background Art

[0002] Today, the ever-increasing level of intelligence is placing ever-higher demands on chip computing speeds and, consequently, on heat dissipation. For example, while offering the same computing power, the 3nm chip generates only half the heat of the 7nm chip. To ensure that chips can fully utilize their computing power, efficient heat dissipation is crucial.

[0003] The current mainstream chip cooling methods are air cooling and liquid cooling, but due to the influence of the chip heat dissipation area, they cannot provide sufficient heat dissipation capacity for high-power chips.

[0004] Summary of the Invention

[0005] In view of the shortcomings of the existing technology, the present invention proposes an enhanced heat dissipation structure and heat dissipation method for a high-power heating device, which can increase the equivalent heat dissipation area of ​​the high-power heating device and provide a guarantee for achieving effective heat dissipation of the high-power heating device.

[0006] The technical solution of the present invention is achieved as follows:

[0007] A reinforced heat dissipation structure for a high-power heating device includes a high-power heating device, a phase change heat transfer device is provided on the upper surface of the high-power heating device, the phase change heat transfer device is filled with a phase change working medium, an evaporation end of the phase change heat transfer device is in contact with the high-power heating device, a condensation end of the phase change heat transfer device is away from the high-power heating device, and a thermal interface material is provided on the contact surface between the high-power heating device and the phase change heat transfer device.

[0008] Preferably, the evaporation end area of ​​the phase change heat transfer device is greater than or equal to the upper surface area of ​​the high-power heating device.

[0009] Preferably, the phase change heat transfer device includes a main body and a matching part arranged below the main body, the cross-sectional area of ​​the main body is larger than the cross-sectional area of ​​the matching part, the cross-sectional area of ​​the matching part is greater than or equal to the upper surface area of ​​the high-power heating device, and the lower surface of the matching part is in contact with the high-power heating device.

[0010] Preferably, a fin heat exchanger is provided on a side of the phase change heat transfer device away from the high-power heating device.

[0011] Preferably, a fan is provided on a side of the fin heat exchanger away from the phase change heat transfer device.

[0012] Preferably, a fan is provided on a side of the phase change heat transfer component away from the high-power heating component.

[0013] Preferably, a liquid cooling plate is provided on a side of the phase change heat transfer component away from the high-power heating component.

[0014] Preferably, the high-power heating device is mounted on a circuit board, and a threaded hole is provided through the corner of the phase-change heat transfer device, through which a bolt passes and is screwed to the circuit board.

[0015] A heat dissipation method for a high-power heating device comprises the following steps:

[0016] S1: Use copper, aluminum, stainless steel or ceramic as the shell of the phase change heat transfer device and fill the phase change working medium into the phase change heat transfer device;

[0017] S2: placing the phase change heat transfer device on the upper surface of the high-power heating device so that the evaporation end of the phase change heat transfer device contacts the upper surface of the high-power heating device, and fixing the thermal interface material within the contact surface between the high-power heating device and the phase change heat transfer device;

[0018] S3: The phase change heat transfer device is fixed on the upper surface of the high-power heating device by bolting, welding or gluing.

[0019] Preferably, the method further comprises the following steps:

[0020] S4: Fix the fin heat exchanger, fan or liquid cooling plate on the side of the phase change heat transfer device away from the high-power heating device.

[0021] Compared with the prior art, the present invention has the following beneficial effects:

[0022] By bringing the evaporation end of the phase change heat transfer device into contact with the high-power heating device and providing a thermal interface material within the contact surface between the high-power heating device and the phase change heat transfer device, the heat of the high-power heating device can be transferred to the phase change heat transfer device through the heat conduction effect of the thermal interface material. Subsequently, vapor-liquid phase change heat transfer is carried out within the phase change heat transfer device to achieve efficient heat diffusion, thereby increasing the equivalent heat dissipation area of ​​the high-power heating device and providing a guarantee for achieving effective heat dissipation of the high-power heating device. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] FIG1 is a schematic structural diagram of a first embodiment of the present invention;

[0024] FIG2 is a schematic structural diagram of a phase change heat transfer device in Example 1 of the present invention;

[0025] FIG3 is a schematic structural diagram of a second embodiment of the present invention;

[0026] FIG4 is another structural diagram of the second embodiment of the present invention;

[0027] FIG5 is a schematic structural diagram of a third embodiment of the present invention;

[0028] FIG6 is a schematic structural diagram of a fourth embodiment of the present invention;

[0029] FIG7 is a schematic structural diagram of a fifth embodiment of the present invention;

[0030] FIG8 is a schematic structural diagram of a sixth embodiment of the present invention;

[0031] FIG9 is a simulation comparison and verification result of the fourth embodiment of the present invention;

[0032] FIG10 is a simulation comparison and verification result of the sixth embodiment of the present invention.

[0033] Figure symbols: 1- high-power heating device; 2- phase change heat transfer device; 21- main body; 22- mating part; 23- threaded hole; 24- liquid absorption core; 3- fin heat exchanger; 4- fan; 5- liquid cooling plate; 6- circuit board; 7- thermal interface material. DETAILED DESCRIPTION

[0034] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0035] Example 1

[0036] Referring to Figure 1, an enhanced heat dissipation structure of a high-power heating device includes a high-power heating device 1. A phase change heat transfer device 2 is provided on the upper surface of the high-power heating device 1. The phase change heat transfer device 2 is filled with a phase change working medium. The evaporation end of the phase change heat transfer device 2 is in contact with the high-power heating device 1. A thermal conductive interface material 7 is provided on the contact surface between the high-power heating device 1 and the phase change heat transfer device 2.

[0037] Among them, the phase change heat transfer device 2 is a high thermal conductivity device prepared based on the vapor-liquid phase change heat transfer principle, such as a heat spreader, a flattened heat pipe, and a loop heat pipe. The phase change heat transfer device 2 of this embodiment takes a heat spreader as an example; the phase change heat transfer device 2 can be a copper-based, aluminum-based, ceramic-based, or stainless steel-based phase change heat transfer device; the phase change working fluid filled in the phase change heat transfer device 2 can be deionized water; the working principle of the phase change heat transfer device 2 is that when the evaporation end of the phase change heat transfer device 2 contacts the high-power heating device 1, the heat of the high-power heating device 1 is transferred from the high-power heating device 1 to the phase change heat transfer device 2 The evaporation end causes the liquid phase change medium at the evaporation end to evaporate due to heat. At this time, the phase change medium absorbs heat energy and expands rapidly in volume. The gas phase phase change medium quickly fills the entire inner cavity of the phase change heat transfer device 2. When the gas phase phase change medium contacts the relatively cold condensation end, it releases heat and condenses into liquid. The liquid flows back to the evaporation end, and this cycle realizes heat transfer. The thermal interface material 7 can transfer the heat of the high-power heating device 1 to the phase change heat transfer device 2. The thermal interface material 7 can be made of thermal grease, thermal silica gel, thermal glue, liquid metal, or a solid metal layer formed by welding.

[0038] It should be noted that the upper surface of the high-power heating device 1 is the side away from the mounting substrate. Generally, the high-power heating device 1 is mounted on the substrate. In this embodiment, the high-power heating device 1 is mounted on the circuit board 6. The high-power heating device 1 is a high-power heating device such as a chip, IGBT chip, MOS tube, etc. This application takes the chip as an example.

[0039] By bringing the evaporation end of the phase change heat transfer device 2 into contact with the high-power heating device 1 and providing a thermal interface material 7 within the contact surface between the high-power heating device 1 and the phase change heat transfer device 2, the heat of the high-power heating device 1 can be transferred to the phase change heat transfer device 2 through the heat conduction effect of the thermal interface material 7. Subsequently, vapor-liquid phase change heat transfer is performed within the phase change heat transfer device 2 to achieve efficient heat diffusion, thereby increasing the equivalent heat dissipation area of ​​the high-power heating device and providing a guarantee for the effective heat dissipation of the high-power heating device, thereby ensuring the timely dissipation of heat from the high-power heating device and reducing the operating temperature of the high-power heating device.

[0040] Preferably, the evaporation end area of ​​the phase-change heat transfer device 2 is greater than or equal to the upper surface area of ​​the high-power heating device 1. Since the evaporation end area of ​​the phase-change heat transfer device 2 is greater than or equal to the upper surface area of ​​the high-power heating device 1, the evaporation end of the phase-change heat transfer device 2 can cover the upper surface of the high-power heating device 1, turning a small-area high-power density heat source into an equivalent large-area low-power density heat source, which is conducive to efficient heat diffusion.

[0041] Preferably, referring to Figures 1 and 2 , a high-power heating element 1 is mounted on a circuit board 6 . A threaded hole 23 is provided through the corner of the phase-change heat transfer element 2 . Bolts pass through these holes and are screwed onto the circuit board 6 . These bolts secure the circuit board 6 and the phase-change heat transfer element 2 together, preventing displacement of the phase-change heat transfer element 2 that could affect heat dissipation. In practice, the phase-change heat transfer element 2 can be directly mounted and secured to the high-power heating element 1 , using bolting, welding, or gluing.

[0042] Preferably, the surface of the phase-change heat transfer device 2 is coated with an insulating coating to prevent the phase-change heat transfer device 2 from electric shock.

[0043] This embodiment also provides a heat dissipation method for a high-power heating device, comprising the following steps:

[0044] S1: Use copper, aluminum, stainless steel or ceramic as the shell of the phase change heat transfer device 2, and fill the phase change working medium into the phase change heat transfer device 2;

[0045] S2: placing the phase change heat transfer device 2 on the upper surface of the high-power heating device 1 so that the evaporation end of the phase change heat transfer device 2 contacts the upper surface of the high-power heating device 1, and fixing the thermal interface material 7 on the contact surface between the high-power heating device 1 and the phase change heat transfer device 2;

[0046] S3: The phase change heat transfer device 2 is fixed on the upper surface of the high-power heating device 1 by bolt connection, welding or gluing.

[0047] Example 2

[0048] Referring to Figure 3, unlike the first embodiment, the phase change heat transfer device 2 of this embodiment includes a main body 21 and a matching portion 22 arranged below the main body 21. The cross-sectional area of ​​the main body 21 is larger than the cross-sectional area of ​​the matching portion 22. The cross-sectional area of ​​the matching portion 22 is greater than or equal to the upper surface area of ​​the high-power heating device 1. The lower surface of the matching portion 22 is in contact with the high-power heating device 1.

[0049] The inner cavities of the main body 21 and the mating portion 22 are interconnected. When the high-power heating device 1 generates heat, the heat from the high-power heating device 1 can be transferred to the mating portion 22 through the thermal conductivity of the thermal interface material 7. Subsequently, a vapor-to-liquid phase change occurs within the phase change heat transfer device 2, and the heat is diffused to the main body 21 for dissipation. This achieves efficient heat diffusion, increases the equivalent heat dissipation area of ​​the high-power heating device, and provides a guarantee for achieving effective heat dissipation of the high-power heating device. A liquid wick 24 is provided within the phase change heat transfer device 2. By providing the liquid wick 24, the liquid wick 24 has a capillary effect, which can flow the liquid working medium at the condensation end back to the evaporation end along the liquid wick 24.

[0050] Optionally, referring to Figure 4, the mating portion 22 is a heat sink boss arranged below the main body 21. When the high-power heating device 1 generates heat, the heat of the high-power heating device 1 can be transferred to the heat sink boss through the heat conduction effect of the thermal interface material 7, and then the heat sink boss transfers the heat to the main body 21. The main body 21 absorbs the heat of the heat sink boss and undergoes a vapor-liquid phase change in the main body 21 to diffuse the heat to the end away from the mating portion 22, thereby realizing the diffusion of heat of the high-power heating device 1.

[0051] Example 3

[0052] Referring to Figure 5 , in this embodiment, a fin heat exchanger 3 is provided on the side of the phase-change heat transfer device 2 facing away from the high-power heating device 1. Fin heat exchanger 3 can be a pure fin or a fin with a heat sink; the fin heat exchanger can be made of copper, aluminum, or stainless steel. The phase-change heat transfer device 2 and fin heat exchanger 3 can be mounted and fixed using welding or bolts.

[0053] Copper, aluminum, stainless steel or ceramic is used as the shell of the phase change heat transfer device 2, and the phase change working medium is filled into the phase change heat transfer device 2; then the phase change heat transfer device 2 is placed on the upper surface of the high-power heating device 1 so that the evaporation end of the phase change heat transfer device 2 contacts the upper surface of the high-power heating device 1, and the thermal interface material 7 is fixed on the contact surface between the high-power heating device 1 and the phase change heat transfer device 2; then the phase change heat transfer device 2 is installed and fixed on the upper surface of the high-power heating device 1 by bolt connection, welding or gluing; finally, the fin heat exchanger 3 is fixed on the side of the phase change heat transfer device 2 away from the high-power heating device 1.

[0054] The heat of the high-power heating device 1 can be transferred to the phase change heat transfer device 2 through the heat conduction effect of the thermal interface material 7. Subsequently, vapor-liquid phase change heat transfer is carried out in the phase change heat transfer device 2 to diffuse the heat to the end of the phase change heat transfer device 2 away from the high-power heating device 1 (i.e., the condensation end). Then, the heat is transferred from the end of the phase change heat transfer device 2 away from the high-power heating device 1 to the fin heat exchanger 3. The heat is dissipated to the outside through the fin heat exchanger 3, which can enhance the heat dissipation effect of the phase change heat transfer device 2 and further ensure the timely dissipation of the heat of the high-power heating device.

[0055] In this embodiment, the phase-change heat transfer device 2 may adopt a flat plate structure or the structure of the phase-change heat transfer device 2 as described in the second embodiment.

[0056] Example 4

[0057] 6 , this embodiment differs from the third embodiment in that a fan 4 is provided on the side of the fin heat exchanger 3 away from the phase change heat transfer device 2. The heat of the high-power heating device 1 can be transferred to the phase change heat transfer device 2 through the heat conduction of the thermal interface material 7. Subsequently, vapor-liquid phase change heat transfer is performed in the phase change heat transfer device 2 to diffuse the heat to the end of the phase change heat transfer device 2 away from the high-power heating device 1 (i.e., the condensation end). Then, the heat is transferred from the end of the phase change heat transfer device 2 away from the high-power heating device 1 to the fin heat exchanger 3. At this time, due to the air cooling effect of the fan 4, the heat of the fin heat exchanger 3 can be quickly dissipated, which can further enhance the heat dissipation effect of the phase change heat transfer device 2 and ensure the timely dissipation of heat from the high-power heating device.

[0058] Copper, aluminum, stainless steel or ceramic is used as the shell of the phase change heat transfer device 2, and the phase change working medium is filled into the phase change heat transfer device 2; then the phase change heat transfer device 2 is placed on the upper surface of the high-power heating device 1 so that the evaporation end of the phase change heat transfer device 2 contacts the upper surface of the high-power heating device 1, and the thermal interface material 7 is fixed on the contact surface between the high-power heating device 1 and the phase change heat transfer device 2; then the phase change heat transfer device 2 is installed and fixed on the upper surface of the high-power heating device 1 by bolt connection, welding or gluing; then the fin heat exchanger 3 is fixed on the side of the phase change heat transfer device 2 away from the high-power heating device 1; finally, the fan is fixed on the side of the fin heat exchanger 3 away from the phase change heat transfer device 2, and the installation and fixation of the fin heat exchanger 3 and the fan 4 can be achieved by bolt connection or gluing.

[0059] In this embodiment, the phase-change heat transfer device 2 may adopt a flat plate structure or the structure of the phase-change heat transfer device 2 as described in the second embodiment.

[0060] 9, compared with the traditional air-cooled fin structure, under the same air-cooled fin structure, size and air flow rate conditions, as the power of the power device increases, the heat dissipation effect of the heat dissipation structure of this embodiment gradually becomes more significant. When the power device heats up to 200W / cm 2 The maximum temperature drop is 67° C. In the conventional air-cooled fin structure, the fin heat exchanger 3 is in direct contact with the upper surface of the high-power heating element 1 .

[0061] Example 5

[0062] Referring to Figure 7, in this embodiment, a fan 4 is provided on the side of the phase-change heat transfer device 2 away from the high-power heating device 1. The shell of the phase-change heat transfer device 2 is made of copper, aluminum, stainless steel, or ceramic, and a phase-change working medium is filled into the phase-change heat transfer device 2. The phase-change heat transfer device 2 is then placed on the upper surface of the high-power heating device 1 so that the evaporation end of the phase-change heat transfer device 2 contacts the upper surface of the high-power heating device 1, and a thermal interface material 7 is fixed to the contact surface between the high-power heating device 1 and the phase-change heat transfer device 2. The phase-change heat transfer device 2 is then fixed to the upper surface of the high-power heating device 1 by bolting, welding, or gluing. Finally, the fan 4 is fixed to the side of the phase-change heat transfer device 2 away from the high-power heating device 1. The phase-change heat transfer device 2 and the fan 4 can be fixed by bolting or gluing.

[0063] The heat of the high-power heating device 1 can be transferred to the phase change heat transfer device 2 through the heat conduction effect of the thermal interface material 7. Subsequently, vapor-liquid phase change heat transfer is carried out in the phase change heat transfer device 2 to diffuse the heat to the end of the phase change heat transfer device 2 away from the high-power heating device 1 (i.e., the condensation end). Then, the heat of the phase change heat transfer device 2 is dissipated through the air cooling effect of the fan 4. The fan 4 can enhance the heat dissipation effect of the phase change heat transfer device 2, further ensuring the timely dissipation of the heat of the high-power heating device.

[0064] In this embodiment, the phase-change heat transfer device 2 may adopt a flat plate structure or the structure of the phase-change heat transfer device 2 as described in the second embodiment.

[0065] Example 6

[0066] Referring to FIG8 , in this embodiment, a liquid cooling plate 5 is provided on the side of the phase-change heat transfer device 2 away from the high-power heating device 1. The shell of the phase-change heat transfer device 2 is made of copper, aluminum, stainless steel, or ceramic, and a phase-change working medium is filled into the phase-change heat transfer device 2. The phase-change heat transfer device 2 is then placed on the upper surface of the high-power heating device 1 so that the evaporation end of the phase-change heat transfer device 2 contacts the upper surface of the high-power heating device 1, and a thermal interface material 7 is fixed to the contact surface between the high-power heating device 1 and the phase-change heat transfer device 2. The phase-change heat transfer device 2 is then fixed to the upper surface of the high-power heating device 1 by bolting, welding, or gluing. Finally, the liquid cooling plate 5 is fixed to the side of the phase-change heat transfer device 2 away from the high-power heating device 1. The phase-change heat transfer device 2 and the liquid cooling plate 5 can be fixed by bolting, welding, or gluing.

[0067] The heat of the high-power heating device 1 can be transferred to the phase change heat transfer device 2 through the heat conduction effect of the thermal interface material 7. Subsequently, vapor-liquid phase change heat transfer is carried out in the phase change heat transfer device 2 to diffuse the heat to the end of the phase change heat transfer device 2 away from the high-power heating device 1 (i.e., the condensation end). Then, the heat of the phase change heat transfer device 2 is dissipated through the liquid cooling effect of the liquid cooling plate 5. The liquid cooling plate 5 can enhance the heat dissipation effect of the phase change heat transfer device 2, further ensuring the timely dissipation of heat from the high-power heating device.

[0068] In this embodiment, the phase-change heat transfer device 2 may adopt a flat plate structure or the structure of the phase-change heat transfer device 2 as described in the second embodiment.

[0069] Referring to FIG10 , compared with the traditional liquid cooling structure, under the same liquid cooling plate size, structure, coolant and flow rate conditions, as the power device heat generation power increases, the heat dissipation effect of the heat dissipation structure of this embodiment gradually becomes more significant. When the power device heat generation power is 200W / cm 2 The maximum temperature drop is 84.2°C. In the conventional liquid cooling structure, the liquid cooling plate 5 is in direct contact with the upper surface of the high-power heating device 1. Furthermore, this embodiment ensures that the maximum temperature of the chip under various operating conditions is below 50°C, ensuring that the chip is always within the optimal operating temperature range.

[0070] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. An enhanced heat dissipation structure for a high-power heating device, comprising a high-power heating device, characterized in that a phase change heat transfer device is provided on the upper surface of the high-power heating device, a phase change working fluid is filled in the phase change heat transfer device, the evaporation end of the phase change heat transfer device is in contact with the high-power heating device, the condensation end of the phase change heat transfer device is far from the high-power heating device, and a thermal interface material is provided in the contact surface between the high-power heating device and the phase change heat transfer device.

2. The enhanced heat dissipation structure for a high-power heating device according to claim 1, characterized in that the area of the evaporation end of the phase change heat transfer device is greater than or equal to the area of the upper surface of the high-power heating device.

3. The enhanced heat dissipation structure for a high-power heating device according to claim 2, characterized in that the phase change heat transfer device comprises a main body part and a matching part provided below the main body part, the cross-sectional area of the main body part is greater than the cross-sectional area of the matching part, the cross-sectional area of the matching part is greater than or equal to the area of the upper surface of the high-power heating device, and the lower surface of the matching part is in contact with the high-power heating device.

4. The enhanced heat dissipation structure for a high-power heating device according to any one of claims 1-3, characterized in that a fin heat exchanger is provided on the side of the phase change heat transfer device far from the high-power heating device.

5. The enhanced heat dissipation structure for a high-power heating device according to claim 3, characterized in that a fan is provided on the side of the fin heat exchanger far from the phase change heat transfer device.

6. The enhanced heat dissipation structure for a high-power heating device according to any one of claims 1-3, characterized in that a fan is provided on the side of the phase change heat transfer device far from the high-power heating device.

7. The enhanced heat dissipation structure for a high-power heating device according to any one of claims 1-3, characterized in that a liquid cooling plate is provided on the side of the phase change heat transfer device far from the high-power heating device.

8. The enhanced heat dissipation structure for a high-power heating device according to claim 1, characterized in that the high-power heating device is mounted on a circuit board, and threaded holes are provided through the corners of the phase change heat transfer device, and bolts pass through the threaded holes and are screwed onto the circuit board.

9. A heat dissipation method for a high-power heating device, characterized in that, It includes the following steps: S1: Using copper, aluminum, stainless steel or ceramic as the housing of the phase change heat transfer device, and filling the phase change working fluid into the phase change heat transfer device; S2: Placing the phase change heat transfer device on the upper surface of the high-power heating device so that the evaporation end of the phase change heat transfer device is in contact with the upper surface of the high-power heating device, and fixing the thermal interface material in the contact surface between the high-power heating device and the phase change heat transfer device; S3: Mounting and fixing the phase change heat transfer device on the upper surface of the high-power heating device by means of bolt connection, welding or bonding.

10. The heat dissipation method of the high-power heating device according to claim 9, characterized in that, It further includes the following steps: S4: Fixing the fin heat exchanger, fan or liquid cooling plate on the side of the phase change heat transfer device far from the high-power heating device.

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