Method for making signal holes in through-hole board, and through-hole board manufacturing method and system

Abstract

A method for making signal holes (21) in a through-hole board, and a through-hole board manufacturing method and system. According to the method for making signal holes (21) in a through-hole board, after two adjacent signal holes (21) are made with a small pitch, a large-pitch depth-controlled hole (22) is added between the two adjacent signal holes (21) for isolation. Therefore, the design effect of precise wiring of an HDI board is achieved, signal conduction of local layers is implemented, the manufacturing difficulty of the through-hole board is reduced, the product yield is improved, and costs are greatly reduced.

Description

Through-hole plate signal hole manufacturing method, through-hole plate manufacturing method and system Technical Field

[0001] The embodiments of the present invention relate to the technical field of PCB manufacturing, and in particular to a method for manufacturing signal holes in a through-hole plate, a through-hole plate manufacturing method and a system. Background Art

[0002] The advent of AI technology has led to stricter requirements for chip storage capacity and data conversion rates. Miniaturization and high-frequency signals have increased signal transmission throughput exponentially. Giant companies, led by NVIDIA, have placed even higher demands on AI servers. Whether it's PCIe 6.0 GPUs or 400G / 800G switches using PAM4 encoding, these demands are also increasing for the circuit boards—the fundamental carriers of information transmission and exchange: 1. More dense and miniaturized circuits; 2. High-speed signal transmission and minimal interference. This has led to a shift in circuit board design from standard through-hole boards to advanced high-end high-density fiber-optic (HDI) architectures. However, the increasing precision of HDI board manufacturing has led to a corresponding increase in the number of layers, making the process more complex and increasing processing costs exponentially. This has also reduced product reliability, hindering both production and market adoption. Summary of the Invention

[0003] In view of the above problems, the embodiments of the present invention provide a method for manufacturing signal holes in a through-hole plate, a method for manufacturing a through-hole plate, and a system for manufacturing the through-hole plate, which are used to solve the problems that the existing HDI board process is more complicated, the processing cost is increased many times, the product reliability is low, and it is not conducive to product production and promotion.

[0004] According to one aspect of an embodiment of the present invention, a method for manufacturing a signal hole in a through-hole plate is provided, the method comprising:

[0005] S101, hole making pre-processing: pressing multiple finished core boards into a through-hole board;

[0006] S102, drilling: drilling signal holes for conducting inner layer circuits on the through-hole board;

[0007] S103, electroplating: electroplating a conductive copper layer on the hole wall of the signal hole and the outer surface of the through-hole plate;

[0008] S104, first resin plugging hole: filling the signal hole with resin;

[0009] S105, depth-controlled drilling: add depth-controlled holes between adjacent signal holes;

[0010] S106, second resin plugging: filling the depth-controlled hole with resin.

[0011] In some embodiments, in step S102 , the minimum distance between the edge of two adjacent signal holes is 0.1 mm.

[0012] In some embodiments, in step S105, the depth control hole is set at the center point of the horizontal distance between two adjacent signal holes, and the aperture of the depth control hole is 0.3 mm.

[0013] In some embodiments, in step S105 , the depth of the depth-controlled hole is controlled according to the signal conduction requirements of each core board of the through-hole board.

[0014] In some embodiments, in step S104 and step S106 , the signal hole and the depth control hole are both filled with resin by vacuum plugging.

[0015] In some embodiments, after step S102 and before step S103 , the method further includes: removing residual glue from the hole wall of the signal hole.

[0016] According to another aspect of an embodiment of the present invention, a method for manufacturing a through-hole plate is provided, the method comprising:

[0017] S201, cutting process: using an automatic slitting machine to cut the substrate material into core boards;

[0018] S202, inner layer circuit process: using the principle of optical imaging to produce inner layer circuit patterns on the core board;

[0019] S203, pressing and hole making process: pressing the core board into a through-hole board by the above-mentioned through-hole board signal hole making method, and making signal holes in the through-hole board;

[0020] S204, outer layer circuit process: the conductive copper plating layer on the outer surface of the through-hole board is subjected to dry film pressing, exposure, development, etching and film stripping to complete the production of the outer layer circuit;

[0021] S205, solder mask process, printing ink on the board surface and guide holes of the through-hole board;

[0022] S206, a text baking process, printing text and logos on the outer layer pattern of the through-hole board and baking;

[0023] S207, surface treatment process, plating a layer of gold on the exposed circuit and guide hole PAD of the through-hole board;

[0024] S208, forming process, gong out the finished pattern of the through-hole plate;

[0025] S209, testing process, testing the through-hole board and selecting defective boards;

[0026] S210, FQC process, final inspection of through-hole boards;

[0027] S211, packaging process, packaging all qualified through-hole boards.

[0028] In some embodiments, in step S204, a signal hole welding pad is added at the signal hole position on the outer surface of the through-hole plate, and the ratio of the signal hole welding pad to the signal hole is 1:1.

[0029] In some embodiments, the through-hole board is a double-sided board or a multi-layer board, and each layer of the through-hole board is isolated and connected through signal holes and control depth holes, specifically including:

[0030] A conductive core board is provided which is conductive with the lower surface of the through-hole board, and two signal holes which need to be conductive in the conductive core board are conductively connected;

[0031] The chips between the conductive core plate and the upper surface of the through-hole plate are isolated by the depth-controlled holes.

[0032] According to another aspect of an embodiment of the present invention, a through-hole board manufacturing system is provided, including the above-mentioned through-hole board manufacturing method.

[0033] Embodiments of the present invention provide a method, method, and system for fabricating signal holes in a through-hole board. The beneficial effect lies in: after two adjacent signal holes are fabricated with a small pitch, a controlled-depth hole with a larger pitch is added between the two adjacent signal holes for isolation. This achieves the design effect of precise HDI board wiring while ensuring localized signal layer conductivity. This also reduces the difficulty of through-hole board fabrication, improves product yield, and significantly reduces costs.

[0034] The above description is only an overview of the technical solutions of the embodiments of the present invention. In order to more clearly understand the technical means of the embodiments of the present invention, they can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the embodiments of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are specifically listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] The accompanying drawings are only used to illustrate the embodiments and are not to be considered as limiting the present invention. In addition, the same reference symbols are used to represent the same components throughout the drawings. In the drawings:

[0036] FIG1 is a schematic flow chart showing a method for manufacturing a signal hole in a through-hole plate according to Example 1 of the present invention;

[0037] FIG2 shows a schematic diagram 1 of manufacturing a signal hole provided by the present invention;

[0038] FIG3 shows a second schematic diagram of the signal hole manufacturing method provided by the present invention;

[0039] FIG4 shows a schematic flow chart of a method for manufacturing a through-hole plate according to Example 2 of the present invention.

[0040] Reference numerals: 11, core board, 20, circuit PAD corresponding to the signal hole, 21, signal hole, 22, depth control hole, 23, signal hole welding pad. Modes for Carrying Out the Invention

[0041] The exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present invention are shown in the drawings, it should be understood that the present invention can be implemented in various forms and should not be limited to the embodiments set forth herein.

[0042] Example 1,

[0043] 1-3 , according to one aspect of an embodiment of the present invention, a method for manufacturing a signal hole in a through-hole plate is provided, the method comprising:

[0044] S101, Hole Forming Preprocessing: Multiple fabricated core boards are pressed together to form a through-hole board. In step S101, preparing the through-hole board for drilling can include dividing the substrate, creating the chip's inner layer pattern, and then pressing the multiple core boards together to form the through-hole board. This solution only requires a single press, eliminating the multiple presses, laser processing, electroplating, and circuit patterning required for HDI designs.

[0045] S102, Drilling: Drill signal holes on the through-hole board to connect to the inner layer circuits. In step 102, due to the 0.3mm minimum hole-edge distance limit for through-hole boards, all routing below this spacing will be considered HDI design. Under this process flow, the routing logic of the HDI board can be transferred to the through-hole board, meaning that the hole-edge distance can be adjusted to a minimum of 0.1mm. If the minimum drilling distance is defined as 0.15mm for a 0.2mm hole, the minimum distance must be adjusted to 0.15mm. This greatly increases the routing of precision circuits and reduces board space. In this step, the minimum margin between signal holes can be reduced to 0.1mm under different drilling conditions.

[0046] S103, electroplating: electroplating a conductive copper layer on the hole wall of the signal hole and the outer surface of the through-hole plate; in step 103, the through-hole plate and the signal hole after drilling are copper-plated to ensure the conductivity of the signal hole.

[0047] S104, First Resin Via Plug: Fill the signal hole with resin. In step 104, unlike conventional through-hole and HDI process flows, this embodiment adds a post-plating resin via plugging process. Its primary function is to fill the smallest hole with resin after copper plating. Firstly, this protects the copper on the hole wall, preventing signal transmission from being affected. Secondly, after resin filling, the signal hole penetrates the entire motherboard at the Z value, increasing its robustness and stability. This facilitates subsequent deep drilling processes to prevent external forces from pulling the copper on the hole wall, which could cause poor hole wall quality and affect signal transmission. Resin plugging improves the stability of the signal hole. Filling can be performed using vacuum plugging.

[0048] S105, controlled depth drilling: Add controlled depth holes between adjacent signal holes. In step 105, the minimum safe distance between through-hole board holes is defined as 0.3mm. Under the minimum 0.3mm routing principle, the drill diameter for the increased depth drilling is 0.3mm. While ensuring the minimum safe distance between through-hole board holes is defined as 0.3mm, a 0.3mm controlled depth drill is added between signal holes. Based on the client's requirements for different signal transmission layers, local inter-layer connectivity is achieved, avoiding the blind via concept in HDI design. This means that first-order, second-order, third-order, fourth-order, fifth-order, and arbitrary-order technical requirements can be met. Simply controlling the depth of the controlled depth hole can ensure signal connectivity in local layers.

[0049] S106, Second Resin Via Plug: Fill the depth-controlled holes with resin. In step S106, this embodiment uses vacuum plugging to plug the depth-controlled holes with resin, ensuring hole wall quality and preventing residual resin in the hole during subsequent processing, which can lead to poor quality such as hole wall oxidation. Normal plugging parameters are sufficient.

[0050] See Figure 2, 11, core board; 20, circuit pad corresponding to the signal hole; 21, signal hole; 22, depth control hole; 23, signal hole solder pad. Figure 2 is a schematic diagram of signal hole fabrication; Figure 2-(a) shows drilling a hole in a through-hole board to form a signal hole; Figure 2-(b) shows drilling a depth control hole between two adjacent signal holes; Figure 2-(c) shows the effect of eliminating the depth control hole filling; and Figure 2-(d) shows the addition of a signal hole solder pad at the signal hole location on the outer surface of the through-hole board during the outer layer wiring process. The signal hole edge spacing is the spacing between the two signals in Figure 2-(a). The depth control hole diameter can be the same as the depth control hole diameter. Using the through-hole board signal hole fabrication method, after two adjacent signal holes are fabricated with a small pitch, depth control holes with a larger pitch are added to isolate the two adjacent signal holes. This achieves the design effect of precise HDI board wiring while ensuring localized signal layer conductivity. This reduces the difficulty of through-hole board fabrication, improves product yield, and significantly reduces costs.

[0051] In some embodiments, referring to FIG3 , in step S105, according to the signal conduction requirements of each core board of the through-hole board, the depth of the depth-controlled hole is controlled. The through-hole board is a double-sided board or a multi-layer board, and each layer of the through-hole board is isolated and connected through the signal hole and the depth-controlled hole, specifically including: setting a conductive core board that is conductive with the lower surface of the through-hole board, and conducting and connecting the two signal holes that need to be conducted in the conductive core board; isolating the chip between the conductive core board and the upper surface of the through-hole board through the depth-controlled hole. In this embodiment, the through-hole board is a multi-layer board structure. If any core board in the multi-layer board structure is connected to the signal hole pad on the outer surface, the two adjacent signal holes of the core board of this layer can be connected through the line; then the core boards of other layers that do not need to be connected are drilled and isolated through the depth-controlled hole to separate their adjacent signal holes.

[0052] In some embodiments, in step S104 and step S106 , the signal hole and the depth control hole are both filled with resin by vacuum plugging.

[0053] In some embodiments, after step S102 and before step S103, the process further includes removing residual adhesive from the walls of the signal holes. This can be done using a plasma cleaner. The plasma cleaner primarily removes residual adhesive from the holes after drilling, improving the activity within the holes and allowing the solution to fully clean the holes, thereby improving the electrical conductivity of the PCB.

[0054] Example 2,

[0055] 4 , according to another aspect of an embodiment of the present invention, a method for manufacturing a through-hole plate is provided. The method includes:

[0056] S201, cutting process: using an automatic slitting machine to cut the substrate material into core boards;

[0057] S202, inner layer circuit process: using the principle of optical imaging to produce inner layer circuit patterns on the core board;

[0058] S203, pressing and hole making process: pressing the core board into a through-hole board by the through-hole board signal hole making method of Example 1, and making signal holes in the through-hole board;

[0059] S204, outer layer circuit process: the conductive copper plating layer on the outer surface of the through-hole board is subjected to dry film pressing, exposure, development, etching and film stripping to complete the production of the outer layer circuit;

[0060] S205, solder mask process, printing ink on the board surface and guide holes of the through-hole board;

[0061] S206, a text baking process, printing text and logos on the outer layer pattern of the through-hole board and baking;

[0062] S207, surface treatment process, plating a layer of gold on the exposed circuit and guide hole PAD of the through-hole board;

[0063] S208, forming process, gong out the finished pattern of the through-hole plate;

[0064] S209, testing process, testing the through-hole board and selecting defective boards;

[0065] S210, FQC process, final inspection of through-hole boards;

[0066] S211, packaging process, packaging all qualified through-hole boards.

[0067] In the above steps, this embodiment uses an automatic slitting machine to cut the material and make the substrate material into a core board. Make the inner layer circuit of the through-hole board. Press multiple inner-layer boards into a through-hole board. Use a drilling machine to drill signal holes and control depth holes of different diameters on the board according to customer requirements. Copper is plated for the holes drilled in the outer layer board to make the circuits on each layer of the board conductive; and the hole copper and surface copper are electroplated and thickened on the basis of copper deposition. Scan the outer layer circuit pattern, pick out the short circuit of the through-hole board and repair it. Print ink on the board surface and guide hole of the through-hole board for solder mask. Print text and logo on the outer layer pattern of the through-hole board and bake it. Plate a layer of gold or alloy on the exposed circuit and guide hole PAD of the through-hole board. The board shape required by the customer is produced to facilitate the customer's SMT patch and assembly. In step S209, after the through-hole board is formed, it is tested through a testing process, wherein the testing process includes incoming materials, cleaning, inductance test, VPP test, turn-to-turn test, voltage withstand test, and appearance inspection.

[0068] The cutting, baking, metallization, and molding processes can all be conventional through-hole board production processes. The present invention provides a novel through-hole board manufacturing method. After two adjacent signal holes are produced with a small pitch, larger-pitch controlled depth holes are added between them for isolation. This achieves the precise wiring design of HDI boards while ensuring localized signal layer conductivity. This reduces the manufacturing difficulty of through-hole boards, improves product yield, and significantly reduces costs.

[0069] In some embodiments, in step S204, a signal hole soldering pad is added at the signal hole position on the outer surface of the through-hole board, with the ratio of the signal hole soldering pad to the signal hole being 1:1. The signal hole soldering pad is conductively connected to the external circuit.

[0070] In some embodiments, the through-hole board is a double-sided board or a multi-layer board, and the layers of the through-hole board are isolated and connected through signal holes and depth-controlled holes. Specifically, the process includes: providing a conductive core board that is conductive with the bottom surface of the through-hole board, and conducting a connection between two signal holes that need to be conducted in the conductive core board; isolating the chip between the conductive core board and the top surface of the through-hole board through the depth-controlled holes. In this embodiment, the through-hole board is a multi-layer board structure. If any core board in the multi-layer board structure is connected to the signal hole pad on the outer surface, the two adjacent signal holes of the core board on this layer can be conductively connected through the line; then, the core boards on other layers that do not need to be connected are drilled and isolated through the depth-controlled holes to separate their adjacent signal holes.

[0071] Example 3,

[0072] According to another aspect of the present invention, a through-hole board manufacturing system is provided, including the through-hole board manufacturing method described in Example 2. After two adjacent signal holes are fabricated with a small pitch, the through-hole board signal hole manufacturing method adds a larger-pitch controlled-depth hole between the two adjacent signal holes for isolation. This achieves the design effect of precise HDI board wiring while ensuring localized signal layer conductivity. This also reduces the difficulty of through-hole board manufacturing, improves product yield, and significantly reduces costs.

[0073] In the description provided herein, numerous specific details are set forth. However, it is understood that embodiments of the present invention may be practiced without these specific details. Similarly, in order to streamline the present invention and aid in understanding one or more of the various inventive aspects, in the above description of exemplary embodiments of the present invention, various features of embodiments of the present invention are sometimes grouped together into a single embodiment, figure, or description thereof. The claims that follow the detailed description are hereby expressly incorporated into that detailed description, with each claim itself serving as a separate embodiment of the present invention.

[0074] Those skilled in the art will appreciate that the modules in the devices of the embodiments can be adaptively changed and installed in one or more devices different from the embodiments. The modules, units, or components in the embodiments can be combined into one module, unit, or component, and furthermore, they can be divided into multiple submodules, subunits, or subcomponents. Except that at least some of such features and / or processes or units are mutually exclusive.

[0075] It should be noted that the above embodiments illustrate rather than limit the invention, and that alternative embodiments may be devised by a person skilled in the art without departing from the scope of the appended claims. In the claims, any reference signs placed between brackets should not be construed as limiting the claims. The word "comprising" does not exclude the presence of elements or steps not listed in the claims. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. The present invention may be implemented by means of hardware comprising several different elements and by means of appropriately programmed computers. In a unit claim enumerating several systems, several of these systems may be embodied by the same item of hardware. The use of the words first, second, and third etc. does not indicate any order. These words may be interpreted as names. The steps in the above embodiments should not be understood as limiting the order of execution unless otherwise specified.

Claims

1. A method for manufacturing signal holes on a through-hole board, characterized in that, The method includes: S101, Hole-making pretreatment: Press multiple completed core boards into a through-hole board; S102, Drilling: Drill signal holes on the through-hole board to conduct inner-layer circuits; S103, Electroplating: Electroplate a layer of conductive copper plating on the hole walls of the signal holes and the outer surface of the through-hole board; S104, First resin plugging: Fill the signal holes with resin; S105, Depth-controlled drilling: Add depth-controlled holes between adjacent signal holes; S106, Second resin plugging: Fill the depth-controlled holes with resin.

2. The method for manufacturing a signal hole of a via board according to claim 1, wherein In step S102, the minimum distance between the hole edges of two adjacent signal holes is 0.1 mm.

3. The method for manufacturing a signal hole of a via board according to claim 2, characterized in that In step S105, the depth-controlled holes are provided at the central positions of the horizontal distances between two adjacent signal holes, and the aperture size of the depth-controlled holes is 0.3 mm.

4. A method for manufacturing signal holes of a via board according to claim 3, characterized in that, In step S105, according to the signal conduction requirements of each core board of the through-hole board, control the depth of the depth-controlled holes.

5. A method for manufacturing signal holes of a via board according to claim 3, characterized in that, In steps S104 and S106, filling the signal holes with resin and filling the depth-controlled holes with resin are both carried out by the vacuum plugging method.

6. A method for manufacturing signal holes of a via board according to claim 3, characterized in that, After step S102 and before step S103, it further includes: removing the residual glue on the hole walls of the signal holes.

7. A method for manufacturing a through-hole board, characterized in that, The method includes: S201, Blanking process: Use an automatic slitting machine to blank and make the substrate material into core boards; S202, Inner-layer circuit process: Use the principle of optical imaging to make inner-layer circuit patterns on the core boards; S203, Laminating and hole-making process: Press the core boards into a through-hole board by the through-hole board signal hole manufacturing method according to any one of claims 1-6, and make signal holes on the through-hole board; S204, Outer-layer circuit process: Perform dry film pressing, exposure, development, etching, and film stripping on the conductive copper plating layer on the outer surface of the through-hole board to complete the production of the outer-layer circuit; S205, Solder mask process, Print solder mask ink on the board surface and via holes of the through-hole board; S206, Letter baking process, Print letters and marks on the outer-layer pattern of the through-hole board and bake; S207, Surface treatment process, Plate a layer of gold on the exposed circuits and via hole PADs of the through-hole board; S208, Shaping process, Route the finished product pattern of the through-hole board; S209, Testing process, Detect the through-hole board; and select defective boards; S210, FQC process, Conduct final inspection on the through-hole board; S211, Packaging process, Package all qualified through-hole boards.

8. A method for manufacturing a through-hole board according to claim 7, characterized in that, In step S204, add signal hole solder pads at the positions of the signal holes on the outer surface of the through-hole board, and the ratio of the signal hole solder pads to the signal holes is 1:

1.

9. A method for manufacturing a via board according to claim 7, characterized in that, The through-hole board is a double-sided board or a multi-layer board, and each layer of the through-hole board is isolated and conducted through signal holes and depth-controlled holes, specifically including: Set a conductive core board that conducts with the lower surface of the through-hole board, and conduct and connect two signal holes that need to be conducted in the conductive core board; Isolate the chips between the conductive core board and the upper surface of the through-hole board through the depth-controlled holes.

10. A through-hole board manufacturing system, characterized in that, Includes a through-hole board manufacturing method according to any one of claims 7-9.

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