Flexible perovskite photovoltaic device package structure and manufacturing method therefor

Abstract

The present invention relates to the technical field of solar cell packaging, and in particular to a flexible perovskite photovoltaic device package structure and a manufacturing method therefor. A PI layer is arranged on a glass substrate, so that the technical risk that the substrate is separated due to static electricity dissipation in the manufacturing process is mitigated. A barrier layer is arranged between the PI layer and a first electrode layer, so that the problem of the water and oxygen barrier stability of perovskite is solved. The glass substrate is used as a substrate for preparing a photovoltaic module, so that the accuracy of preparing the photovoltaic module is improved. When a packaging layer is prepared, the position where electrodes are attached is reserved in advance, so that subsequent printing or attaching of the electrodes is facilitated. The matching materials and devices in the routing of the manufacturing method are relatively mature, so that large-scale production is facilitated.

Description

A flexible perovskite photovoltaic device packaging structure and preparation method thereof Technical Field

[0001] The present invention belongs to the technical field of solar cell packaging, and in particular relates to a flexible perovskite photovoltaic device packaging structure and a preparation method thereof. Background Art

[0002] Currently, most flexible perovskite photovoltaic module substrates are prepared using a roll-to-roll process for flexible plastic substrates. Due to the multiple precision laser etching processes involved in the roll-to-roll process, technical problems such as poor repeatability, difficulty in electrode lead-out, limited packaging supporting equipment and materials, and high implementation difficulty arise.

[0003] In this regard, an existing Chinese patent document (publication number: CN116761485A, publication date: September 15, 2023) discloses a method for preparing a flexible perovskite battery, and discloses that it uses electrostatic adsorption to attach the flexible substrate to a glass substrate. After the process is completed, the flexible substrate is peeled off by static elimination. However, the above operation does not consider how to avoid the technical risk of substrate detachment after static electricity dissipates during the process, nor does it consider the issue of packaging accuracy. In addition, there are no mature mass production cases.

[0004] In view of this, the present invention is proposed. Summary of the Invention

[0005] The purpose of the present invention is to overcome the shortcomings of the above-mentioned prior art and provide a flexible perovskite photovoltaic device packaging structure and a preparation method thereof to solve the problems of static dissipation and packaging accuracy in the process.

[0006] To achieve the above object, the present invention provides the following technical solutions:

[0007] On the one hand, the present invention provides a flexible perovskite photovoltaic device packaging structure, comprising a PI layer, a barrier layer, a functional layer, and an encapsulation layer sequentially stacked on a glass substrate, a first protective film attached to the lower surface of the PI layer, and a second protective film attached to the upper surface of the encapsulation layer; the functional layer comprises a first electrode layer, a hole transport layer HTL, a perovskite layer, an electron transport layer ETL, and a second electrode layer stacked from bottom to top on the barrier layer;

[0008] Electrode leads are respectively provided on two opposite sides of the first electrode layer for connecting to the perovskite solar cell for electrical conduction.

[0009] Specifically, the area of ​​the second protective film is larger than the area of ​​the encapsulation layer, and smaller than the area of ​​the first electrode layer;

[0010] The area of ​​the encapsulation layer is larger than that of the second electrode layer; the area of ​​the second electrode layer is larger than that of the electron transport layer ETL, the perovskite layer, and the hole transport layer HTL, and the electron transport layer ETL, the perovskite layer, and the hole transport layer HTL have the same shape and area;

[0011] Any side of the second electrode layer is overlapped with the first electrode layer, and the electrodes are led out through the electrode leads on both sides of the first electrode layer; the area of ​​the barrier layer is greater than or equal to the area of ​​the PI layer; the area of ​​the PI layer is greater than or equal to the area of ​​the first electrode layer; the area of ​​the first protective film is the same as the area of ​​the barrier layer.

[0012] Specifically, the electrode leads are led out from two opposite sides of the first electrode layer by printing or attaching auxiliary electrodes.

[0013] On the other hand, the present invention provides a method for preparing a flexible perovskite photovoltaic device packaging structure, the specific method is as follows:

[0014] Step 1: Preparation of PI layer: First, polyamic acid solution PAA is coated on a glass substrate, and then heated to 300℃~450℃ and annealed to form a glass substrate with a transparent PI layer;

[0015] Step 2, preparation of barrier layer: depositing at least one barrier layer to prevent water and oxygen penetration on the basis of the PI layer, wherein the thickness of the barrier layer is 100 nm to 500 nm;

[0016] Step 3, preparation of functional layers: on the basis of the barrier layer, the first electrode layer, the hole transport layer HTL, the perovskite layer, the electron transport layer ETL and the second electrode layer are prepared in sequence;

[0017] Step 4, preparation of the encapsulation layer: first, on the basis of the functional layer, a thin film is prepared by alternating the organic layer and the inorganic layer using a thin film encapsulation method; and a position for printing or attaching electrode leads is reserved on the first electrode layer; then a second protective film is attached to the upper surface of the prepared encapsulation layer; the materials of the inorganic layer include but are not limited to silicon nitride, silicon dioxide, and aluminum oxide; the materials of the organic layer include but are not limited to epoxy resin, silicone, propylene acetate, and acrylate; the materials of the second protective film include but are not limited to TPT, TPE, TPC, CPC, PET, PA / PO, and ultra-thin glass;

[0018] Step 5, Preparation of Flexible Substrate: The glass substrate and the PI layer are peeled off by laser irradiation, wherein the laser wavelength is 308nm or 354nm to obtain a flexible substrate. A first protective film is attached to the lower surface of the PI layer. The peeled glass substrate can be reused after cleaning and grinding. The material of the first protective film includes but is not limited to TPT, TPE, TPC, CPC, PET, PA / PO, and ultra-thin glass.

[0019] Step 6: Leading out electrode leads: The electrode leads are led out from opposite sides of the first electrode layer by printing or attaching the electrode leads to complete the preparation of the flexible perovskite photovoltaic device packaging structure.

[0020] Compared with the prior art, the technical solution provided by the present invention has the following beneficial effects:

[0021] The present invention solves the technical risk of static electricity dissipation causing the substrate to detach during the process by providing a PI layer on the glass substrate; provides a barrier layer between the PI layer and the first electrode layer to solve the problem of water and oxygen barrier stability of the perovskite; adopts a glass substrate as the substrate for preparing photovoltaic modules, thereby improving the precision of photovoltaic modules during preparation; when preparing the encapsulation layer, by reserving the position for attaching the electrode in advance, the subsequent printing or attachment of the electrode is convenient; the process route of this preparation method has relatively mature supporting materials and equipment, and is easy to mass produce. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The accompanying drawings are incorporated in and constitute a part of this specification and, together with the description, serve to explain the principles of the invention.

[0023] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0024] FIG1 is a schematic diagram of the preparation process of the flexible perovskite photovoltaic device packaging structure of the present invention. DETAILED DESCRIPTION

[0025] Exemplary embodiments will now be described in detail, with examples shown in the accompanying drawings. The embodiments described in the following exemplary embodiments are not intended to represent all embodiments consistent with the present invention. Instead, they are merely examples consistent with some aspects of the present invention as detailed in the appended claims.

[0026] In order to enable those skilled in the art to better understand the technical solutions of the present invention, the present invention is described in further detail below with reference to the accompanying drawings and embodiments.

[0027] Example 1

[0028] This embodiment provides a flexible perovskite photovoltaic device packaging structure, comprising a PI layer, a barrier layer, a functional layer, and an encapsulation layer stacked in sequence on a glass substrate, a first protective film attached to the lower surface of the PI layer, and a second protective film attached to the upper surface of the encapsulation layer; the functional layer comprises, from bottom to top, a first electrode layer, a hole transport layer (HTL), a perovskite layer, an electron transport layer (ETL), and a second electrode layer stacked above the barrier layer;

[0029] Electrode leads are respectively provided on two opposite sides of the first electrode layer for connecting to the perovskite solar cell for electrical conduction.

[0030] Specifically, the area of ​​the second protective film is larger than the area of ​​the encapsulation layer, and smaller than the area of ​​the first electrode layer;

[0031] The area of ​​the encapsulation layer is larger than that of the second electrode layer; the area of ​​the second electrode layer is larger than that of the electron transport layer ETL, the perovskite layer, and the hole transport layer HTL, and the electron transport layer ETL, the perovskite layer, and the hole transport layer HTL have the same shape and area;

[0032] Any side of the second electrode layer is overlapped with the first electrode layer, and the electrodes are led out through the electrode leads on both sides of the first electrode layer; the area of ​​the barrier layer is greater than or equal to the area of ​​the PI layer; the area of ​​the PI layer is greater than or equal to the area of ​​the first electrode layer; the area of ​​the first protective film is the same as the area of ​​the barrier layer.

[0033] Specifically, the electrode leads are led out from two opposite sides of the first electrode layer by printing or attaching auxiliary electrodes.

[0034] Example 2

[0035] Referring to FIG1 , based on Example 1, this embodiment provides a method for preparing a flexible perovskite photovoltaic device packaging structure, and the specific method is as follows:

[0036] Step 1, Preparation of PI layer: First, a polyamic acid (PAA) solution is coated on a glass substrate, and then the polyamic acid (PAA) is polymerized at 300°C to 450°C to form a PI layer (transparent film layer). After annealing, a glass substrate with a transparent PI layer is formed.

[0037] Step 2, preparation of barrier layer: silicon nitride / aluminum oxide is deposited on the upper surface of the PI layer by using CVD / ALD / RPVD or other thin film deposition methods to form a barrier layer to prevent water and oxygen from penetrating, thereby blocking water and oxygen from the PI layer or from the air, and preventing water and oxygen from entering the perovskite layer and causing failure of the perovskite layer. The thickness of the barrier layer is 100nm to 500nm;

[0038] Step 3, preparation of functional layers: on the basis of the barrier layer, the first electrode layer, the hole transport layer HTL, the perovskite layer, the electron transport layer ETL and the second electrode layer are prepared in sequence;

[0039] Step 4, preparation of the encapsulation layer: first, on the basis of the functional layer, a thin film encapsulation method is used to alternately composite the organic layer and the inorganic layer to prepare a thin film, and a position for printing or attaching the electrode lead is reserved on the first electrode layer; then a second protective film is attached to the upper surface of the prepared encapsulation layer to protect the entire component; wherein, the thin film encapsulation method is used to alternately composite the organic layer and the inorganic layer to prepare a thin film as follows: first, a layer of acetic acid ester polymer layer is made on the second electrode layer, then a layer of silicon nitride inorganic layer is made, and then a layer of acrylate polymer layer is made. The purpose of this design is to better protect the basic device, prevent the entry of external water and oxygen, and better improve the flexibility of the perovskite solar cell. The materials of the inorganic layer include but are not limited to silicon nitride, silicon dioxide, and aluminum oxide. The materials of the organic layer include but are not limited to epoxy resin, silicone, acetic acid ester, and acrylate. The material of the second protective film includes but is not limited to TPT, TPE, TPC, CPC, PET, PA / PO, and ultra-thin glass.

[0040] Step 5, Preparation of Flexible Substrate: The glass substrate and the PI layer are peeled off by laser irradiation, wherein the wavelength of the laser is 308nm or 354nm; a first protective film is attached to the lower surface of the flexible substrate to achieve the purpose of upper and lower protection. The peeled glass substrate can be reused after cleaning and grinding. The material of the first protective film includes but is not limited to TPT, TPE, TPC, CPC, PET, PA / PO, and ultra-thin glass;

[0041] Step 6: Leading out electrode leads: Electrode leads are led out from opposite sides of the first electrode layer by printing or attaching electrode leads, so as to facilitate series connection with adjacent perovskite solar cell devices to prepare a flexible component and obtain a flexible perovskite photovoltaic device packaging structure.

[0042] In summary, the preparation method of the present application solves the problem that the accuracy of the existing roll-to-roll process cannot be guaranteed, and solves the technical problem that the substrate is easily detached during the electrostatic adsorption process.

[0043] The foregoing description is intended only to provide specific embodiments of the present invention, which will enable those skilled in the art to understand and implement the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention.

[0044] It should be understood that the present invention is not limited to the above description and that various modifications and changes may be made without departing from the scope thereof. The scope of the present invention is limited only by the appended claims.

Claims

1. A flexible perovskite photovoltaic device packaging structure, characterized in that It includes a PI layer, a barrier layer, a functional layer, and a packaging layer that are sequentially stacked on a glass substrate. A first protective film is attached to the lower surface of the PI layer, and a second protective film is attached to the upper surface of the packaging layer; the functional layer includes a first electrode layer, a hole transport layer, a perovskite layer, an electron transport layer, and a second electrode layer that are stacked from bottom to top above the barrier layer; Electrode leads are respectively arranged on two opposite sides of the first electrode layer for connecting and conducting electricity with a perovskite solar cell.

2. The flexible perovskite photovoltaic device packaging structure according to claim 1, wherein The area of the second protective film is larger than the area of the packaging layer and both are smaller than the area of the first electrode layer; The area of the packaging layer is larger than the area of the second electrode layer; the area of the second electrode layer is larger than the areas of the electron transport layer, the perovskite layer, and the hole transport layer, and the electron transport layer, the perovskite layer, and the hole transport layer have the same shape and area; One side of the second electrode layer overlaps with the first electrode layer, and electrodes are led out through the electrode leads on both sides of the first electrode layer; the area of the barrier layer is greater than or equal to the area of the PI layer; the area of the PI layer is greater than or equal to the area of the first electrode layer; the area of the first protective film is the same as the area of the barrier layer.

3. The flexible perovskite photovoltaic device encapsulation structure according to claim 1, wherein The electrode leads are led out from two opposite sides of the first electrode layer by means of printing or attaching auxiliary electrodes.

4. The preparation method of the flexible perovskite photovoltaic device packaging structure according to any one of claims 1-3, characterized in that, The specific method is as follows: Step 1. Preparation of the PI layer: First, a polyamic acid solution is coated on a glass substrate, and then it is annealed after being heated to a specified temperature to form a glass substrate with a transparent PI layer; Step 2. Preparation of the barrier layer: At least one barrier layer for preventing water and oxygen permeation is deposited on the basis of the PI layer; Step 3. Preparation of the functional layer: The first electrode layer, the hole transport layer, the perovskite layer, the electron transport layer, and the second electrode layer are sequentially prepared on the basis of the barrier layer; Step 4. Preparation of the packaging layer: First, a film is prepared by alternately laminating an organic layer and an inorganic layer on the basis of the functional layer by means of thin-film encapsulation, and a position for printing or attaching electrode leads is reserved on the first electrode layer; then a second protective film is attached to the upper surface of the prepared packaging layer; Step 5. Preparation of the flexible substrate: The glass substrate and the PI layer are peeled off to obtain a flexible substrate and a first protective film is attached to the lower surface of the PI layer; Step 6. Leading out of the electrode leads: The electrode leads are led out from two opposite sides of the first electrode layer by means of printing or attaching electrode leads to complete the preparation of the packaging structure of the flexible perovskite photovoltaic device.

5. The preparation method of the flexible perovskite photovoltaic device packaging structure according to claim 4, wherein, In Step 1, the specified temperature is 300 °C to 450 °C.

6. The preparation method of the flexible perovskite photovoltaic device packaging structure according to claim 4, wherein, In Step 2, the thickness of the barrier layer is 100 nm to 500 nm.

7. The preparation method of the flexible perovskite photovoltaic device packaging structure according to claim 4, characterized in that, In Step 4, the materials of the inorganic layer include but are not limited to silicon nitride, silicon dioxide, and aluminum oxide, and the materials of the organic layer include but are not limited to epoxy resin, silicone, propyl acetate, and acrylate.

8. The preparation method of the flexible perovskite photovoltaic device packaging structure according to claim 4, characterized in that In Step 4, the materials of the second protective film include but are not limited to TPT, TPE, TPC, CPC, PET, PA / PO, and ultra-thin glass.

9. The preparation method of the flexible perovskite photovoltaic device packaging structure according to claim 4, characterized in that, In Step 5, the glass substrate and the PI layer are peeled off by means of laser irradiation.

10. The preparation method of the flexible perovskite photovoltaic device packaging structure according to claim 4, wherein, In step 5, the material of the first protective film includes but is not limited to TPT, TPE, TPC, CPC, PET, PA / PO, and ultra-thin glass.

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