Resin composition, and preparation method therefor and use thereof

Abstract

Provided in the embodiments of the present application are a resin composition, and a preparation method therefor and the use thereof. The resin composition comprises the following components in percentages by mass: 30-60% of a cycloolefin polymer, 3-15% of an alkene polymer and / or a modified alkene polymer, and 35-70% of a filler, wherein the filler comprises a titanate filler and a non-titanate filler, the mass percentage of the titanate filler is 10-40%, the mass percentage of the non-titanate filler is 0-40%, and the dielectric constant of the non-titanate filler is greater than 20. The resin composition provided in the embodiments of the present application has a high dielectric constant, low dielectric loss, and relatively high heat resistance and impact resistance; and when being used as a dielectric material in the field of communication, the resin composition can improve signal transmission efficiency and also meet the requirements of mechanical properties and heat resistance.

Description

Resin composition, preparation method and application thereof

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on December 26, 2023, with application number 202311816485.7 and application name “Resin composition, preparation method and application thereof”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The embodiments of the present application relate to the field of communication technology, and in particular to a resin composition, a preparation method thereof, and an application thereof. Background Art

[0003] With the advancement of communication technology, the demand for energy-efficient, high-frequency communications is increasing. In order to minimize signal transmission loss in high-frequency communications, dielectric materials with extremely low dielectric loss (Df) are required. Furthermore, given the limited size of microcapacitors, the development of high-power, high-safety capacitor elements necessitates the use of dielectric materials with higher dielectric constants (Dk) and lower dielectric loss (Df).

[0004] However, traditional high-dielectric ceramic materials are expensive to produce, lack toughness, and are difficult to process. High-dielectric, low-loss thermoplastic composites, the most widely used of which are polyphenylene ether composites, exhibit a dielectric loss of 0.0015-0.003 at high frequencies above 10 GHz, still insufficient to meet the demands of highly energy-efficient antennas. Furthermore, current requirements for dielectric materials' heat resistance and mechanical strength are increasing. For example, when active voice or data traffic is transmitted, the antenna RF module operates at high power, resulting in excessive heat generation. This necessitates a high thermal deformation temperature for the dielectric material.

[0005] Therefore, in order to better meet the application requirements of high-frequency communications and miniaturized electronic components, it is necessary to provide a resin material that has high dielectric constant, low dielectric loss, and high heat resistance and impact resistance. Summary of the Invention

[0006] In view of this, an embodiment of the present application provides a resin composition, which has a high dielectric constant, low dielectric loss, and high heat resistance and impact resistance. When used as a dielectric material in the communication field, it can improve signal transmission efficiency while meeting the mechanical properties and heat resistance requirements, thereby better meeting the application needs of high-frequency communication and miniaturized communication components.

[0007] A first aspect of an embodiment of the present application provides a resin composition, comprising the following components in the following mass percentages: 30%-60% of a cycloolefin polymer, 3%-15% of an olefin polymer and / or a modified olefin polymer, and 35%-70% of a filler;

[0008] The filler includes titanate filler and non-titanate filler, the mass percentage of the titanate filler is 10%-40%, the mass percentage of the non-titanate filler is 0-40%, and the dielectric constant of the non-titanate filler is greater than 20.

[0009] The resin composition provided in the embodiments of the present application is obtained by compounding a cycloolefin polymer with a chain olefin polymer and / or a modified chain olefin polymer, and a specific type of filler. It can have a high dielectric constant, low dielectric loss, and high heat resistance and impact resistance. When used as a dielectric material in the communication field, it can improve signal transmission efficiency while meeting the requirements of mechanical properties and heat resistance, thereby better meeting the application needs of high-frequency communication and miniaturized communication components, and promoting the high-frequency and miniaturization development of communication components such as antennas.

[0010] Cyclic olefin polymers possess excellent dielectric properties, heat resistance, and processing and molding capabilities. Their use as the main resin for dielectric materials in the communications field allows them to better meet the application requirements of the communications field. Cyclic olefin polymers include cyclic olefin copolymers (COC) and cyclic olefin homopolymers (COP). Cyclic olefin copolymers (COC) are formed by the copolymerization of ethylene or α-olefins (monoolefins with double bonds at the ends of the molecular chain) with cyclic olefin monomers such as norbornene. Cyclic olefin homopolymers (COP) are formed by the polymerization of cyclic olefin monomers such as norbornene.

[0011] In the embodiment of the present application, at least part of the cycloolefin polymer has a heat deformation temperature greater than or equal to 140° C. Cycloolefin polymers have a relatively high heat deformation temperature, which is beneficial for improving the heat resistance of the resin composition.

[0012] In an embodiment of the present application, at least part of the cycloolefin polymer has a heat deformation temperature greater than or equal to 150°C.

[0013] In an embodiment of the present application, at least part of the cycloolefin polymer has a heat deformation temperature greater than or equal to 160°C.

[0014] In the embodiment of the present application, at least part of the cycloolefin polymers are cycloolefin copolymers. The presence of cycloolefin copolymers can better improve the heat resistance of the resin composition.

[0015] In the embodiment of the present application, the mass percentage of the olefin polymer and / or modified olefin polymer is 5%-10%. The addition of an appropriate amount of the olefin polymer and / or modified olefin polymer can effectively improve the toughness of the resin composition, enhance the resin composition's resistance to impact damage, improve the interfacial bonding strength between inorganic and organic fillers, and allow the resin composition to contain sufficient cycloolefin polymer and filler, thereby ensuring the resin composition's heat resistance, dielectric properties, and other mechanical properties.

[0016] In some embodiments of the present application, the mass percentage of the alkene polymer in the resin composition is 5%-15%. The main function of the alkene polymer is to improve the toughness of the resin composition and enhance the impact resistance. Controlling the alkene polymer content at a relatively high level is beneficial to better improve the impact resistance.

[0017] In some embodiments of the present application, the weight percentage of the modified olefin polymer in the resin composition is 1%-5%. The main function of the modified olefin polymer is to improve the interfacial bonding performance of the components. Controlling its content to a relatively low level is beneficial for improving the interfacial bonding performance while ensuring improved impact resistance.

[0018] In embodiments of the present application, the alkene polymer and / or modified alkene polymer has a melting temperature greater than 105°C. Melting temperature refers to the temperature at which a substance transitions from a highly elastic state to a viscous flow state. The relatively high melting temperature of the alkene polymer and modified alkene polymer facilitates the alkene polymer and modified alkene polymer in enhancing the toughness of the resin composition while maintaining high heat resistance.

[0019] In embodiments of the present application, the olefin polymer comprises an olefin block copolymer. An olefin block copolymer is a polymer obtained by block copolymerization of two or more olefin monomers. It comprises two or more different olefin monomer units, combined in an ordered manner. The block copolymerization of the olefin block copolymer can maintain material toughness while ensuring high heat resistance. Examples of the olefin block copolymer include propylene-butadiene block copolymer, ethylene-propylene block copolymer, and ethylene-butadiene block copolymer.

[0020] In the embodiment of the present application, the modified olefin polymer includes a maleic anhydride grafted olefin polymer.

[0021] In the embodiment of the present application, the mass ratio of the titanate filler to the non-titanate filler is greater than or equal to 0.5: 1. Controlling the mass ratio within the above range is beneficial to improving the dielectric properties of the resin composition and better ensuring the dimensional stability of the resin composition molded product.

[0022] In the embodiments of the present application, the titanate filler includes one or more of calcium titanate, magnesium calcium titanate, strontium calcium titanate, strontium barium titanate, and barium titanate. These titanate fillers have a high dielectric constant, can improve mechanical properties, and combine well with the resin component. Adding them to the resin composition can help improve the dielectric properties and impact resistance of the resin composition.

[0023] In the embodiment of the present application, the titanate filler is a spherical or quasi-spherical particle with an average sphericity greater than 0.85. Titanate fillers are spherical or quasi-spherical particles that are beneficial to better reduce the dielectric loss Df of the resin composition, reduce interface defects, improve the mechanical properties of the resin composition, improve the melt index of the composition, and facilitate injection molding. The higher the sphericity, the more favorable it is. Among them, sphericity is a parameter that characterizes the morphology of the particles. It is the ratio of the surface area of ​​a sphere with the same volume as the particle to the surface area of ​​the particle. The closer the particle is to a ball in appearance, the closer its sphericity is to 1.

[0024] In the embodiments of the present application, the titanate filler has a D50 particle size of 0.5 μm to 100 μm. D50 is the particle size corresponding to the 50% cumulative particle size distribution percentage of a sample, also known as the median diameter or median particle size. Having a suitable particle size facilitates uniform dispersion of the titanate filler in the resin composition, better leveraging the performance advantages of the titanate filler and improving the density, dielectric properties, and mechanical properties of the resulting molded article after molding the resin composition.

[0025] In the embodiments of the present application, the non-titanate filler includes a metal or non-metal oxide, and the metal or non-metal oxide includes hafnium dioxide, titanium oxide, lead oxide, tantalum oxide, etc. These metal oxides all have high dielectric constants and structural stability. When compounded with a titanate filler and added to a resin composition, the dielectric properties and dimensional stability of the resin composition can be effectively improved.

[0026] In some embodiments of the present application, the dielectric constant of the non-titanate filler is greater than 50. Selecting a non-titanate filler with a larger dielectric constant is beneficial to improving the dielectric properties of the resin composition.

[0027] In the embodiments of the present application, the non-titanate filler is a spherical or quasi-spherical particle with an average sphericity greater than 0.85. The non-titanate filler being a spherical or quasi-spherical particle is beneficial for better reducing the dielectric loss Df of the resin composition, reducing interfacial defects, and improving the mechanical properties of the resin composition.

[0028] In the embodiment of the present application, the non-titanate filler has a D50 particle size of 0.1 μm to 10 μm. The appropriate particle size of the non-titanate filler facilitates uniform dispersion in the resin composition, better utilizing the performance advantages of the non-titanate filler, and improving the density, dielectric properties, and mechanical properties of the resulting molded article after molding the resin composition.

[0029] In the embodiment of the present application, the mass percentage of the non-titanate filler is 20%-35%. The addition of an appropriate amount of non-titanate filler to the resin composition can better cooperate with the titanate filler, thereby improving the dielectric properties of the resin composition while reducing the impact of temperature drift. At the same time, it further reduces the thermal expansion coefficient of the resin composition, allowing the resin composition to better achieve both excellent dielectric properties and a low thermal expansion coefficient.

[0030] In the embodiment of the present application, the resin composition further comprises an auxiliary agent, the mass percentage of which is less than or equal to 2%. The auxiliary agent can be added according to actual needs to improve relevant properties of the resin composition.

[0031] In the embodiment of the present application, the auxiliary agent includes one or more of an antioxidant, a flame retardant, and a lubricant. The antioxidant can improve the antioxidant performance of the resin composition, the flame retardant can improve the flame retardant performance of the resin composition, and the lubricant can improve the lubrication performance of the resin composition.

[0032] In the embodiment of the present application, the dielectric constant Dk of the resin combination is ≥ 4.5, and the dielectric loss Df at 10GHz is 0.0004-0.001. The embodiment of the present application is designed with specific components so that the resin combination has a high dielectric constant and has extremely low dielectric loss at a high frequency of 10GHz. When the resin combination is applied to the preparation of communication components, it is possible to effectively improve signal transmission efficiency and reduce loss, so as to better meet the high-quality and high-efficiency signal transmission demand under high frequency of communication components and the demand for miniaturization of communication components. Dielectric constant and dielectric loss can be tested using a network analyzer with a 10GHz fixture.

[0033] In the embodiment of the present application, the heat deformation temperature of the resin composition is ≥155 ° C. Heat deformation temperature (HDT) refers to the temperature at which a resin material is deformed under the action of an external force, and heat deformation temperature is an important indicator for judging the heat resistance of a resin composition. The resin composition of the embodiment of the present application has a higher heat deformation temperature, indicating that it has excellent heat resistance, can better meet the needs of high temperature application scenarios, and improve the reliability of communication components. The heat deformation temperature can be tested using an HDT Vicat test instrument according to standard ISO75-1 "Plastic-Determination of Deflection Temperature under Load".

[0034] In the embodiment of the present application, the notched Izod impact strength of the resin composition is greater than 5 kJ / m 2 The Izod notched impact strength reflects the material's ability to resist impact and can be tested using an Izod notched impact strength testing machine according to the standard ISO 180: Plastics - Determination of Izod impact strength.

[0035] The second aspect of the embodiment of the present application provides a method for preparing the resin composition described in the first aspect, comprising:

[0036] mixing the components of the resin composition to obtain a mixture;

[0037] The mixed material is melted and then extruded and granulated to obtain the resin composition.

[0038] The preparation method provided in the embodiments of the present application has a simple process and is conducive to mass production.

[0039] A third aspect of the present invention provides a molded article comprising a molded article of the resin composition described in the first aspect. The molded article can be designed into various regular or irregular shapes and specific sizes according to actual application requirements. The molded article is solid. The molded article can be obtained by injection molding, calendering molding, or extrusion molding.

[0040] A fourth aspect of the present application provides an electronic component, comprising a molded article of the resin composition described in the first aspect. The electronic component can be any electronic component requiring dielectric material applications, such as communication components and capacitors.

[0041] In the embodiments of the present application, the electronic components include communication components. Communication components using the resin composition of the embodiments of the present application as a dielectric material can effectively improve signal transmission efficiency, while also being beneficial in improving thermal stability and impact resistance, thereby enhancing product reliability.

[0042] In the embodiment of the present application, the communication components include antennas, microwave devices, radio frequency devices, metal strip line components, etc. The molded article of the resin composition can be specifically used as a dielectric substrate or a dielectric frame.

[0043] In some embodiments, the resin composition is used in a microwave device in an antenna, for example, it can be used in a phase control device of a microwave device, and the microwave device can be a microwave modulator, a microwave amplifier, a microwave filter, a microwave switch, a microwave mixer, etc.

[0044] In some embodiments, the resin composition is used in a metal strip assembly, for example, to form an isolation device between metal strips.

[0045] In some embodiments, the resin composition is used in a radio frequency device, which may be, for example, a radio frequency amplifier, a radio frequency switch, a radio frequency filter, a radio frequency mixer, a radio frequency power amplifier, a combiner, a phase shifter, etc.

[0046] The present application also provides a communication system comprising a communication component, wherein the communication component comprises a molded article of the resin composition described in the first aspect. The communication system using the communication component has improved signal transmission efficiency, better thermal stability, and better impact resistance. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] FIG1 is a flow chart of a method for preparing a resin composition according to an embodiment of the present application;

[0048] FIG2 is a schematic structural diagram of an electronic component 100 provided in an embodiment of the present application. DETAILED DESCRIPTION

[0049] The embodiments of the present application will be described below with reference to the accompanying drawings.

[0050] Currently, dielectric materials used in the communications industry struggle to achieve both high-frequency low loss, high heat deformation temperature, and high impact resistance, hindering the development of high-frequency and miniaturized communication components such as antennas. To better meet the application requirements of high-frequency and miniaturized communication components, the present invention provides a resin composition that combines a high dielectric constant with low dielectric loss, along with high heat resistance and impact resistance.

[0051] The resin composition provided in the embodiment of the present application comprises the following components in the following mass percentages: 30%-60% of a cycloolefin polymer, 3%-15% of an olefin polymer and / or a modified olefin polymer, and 35%-70% of a filler;

[0052] The filler includes titanate filler and non-titanate filler, the mass percentage of the titanate filler is 10%-40%, the mass percentage of the non-titanate filler is 0-40%, and the dielectric constant of the non-titanate filler is greater than 20.

[0053] The resin composition provided in the embodiments of the present application is obtained by compounding a cycloolefin polymer with a chain olefin polymer and / or a modified chain olefin polymer, and a specific type of filler. It can have a high dielectric constant, low dielectric loss, and high heat resistance and impact resistance. When used as a dielectric material in the communication field, it can improve signal transmission efficiency while meeting the requirements of mechanical properties and heat resistance, thereby better meeting the application needs of high-frequency communication and miniaturized communication components, and promoting the high-frequency and miniaturization development of communication components such as antennas.

[0054] Cyclic olefin polymers possess excellent dielectric properties, heat resistance, and processing and molding capabilities. Their use as the main resin for dielectric materials in the communications field allows them to better meet the application requirements of the communications field. Cyclic olefin polymers include cyclic olefin copolymers (COC) and cyclic olefin homopolymers (COP). Cyclic olefin copolymers (COC) are formed by the copolymerization of ethylene or α-olefins (monoolefins with double bonds at the ends of the molecular chain) with cyclic olefin monomers such as norbornene. Cyclic olefin homopolymers (COP) are formed by the polymerization of cyclic olefin monomers such as norbornene.

[0055] In an embodiment of the present application, in order to achieve higher heat resistance for the resin composition, at least a portion of the cycloolefin polymers in the resin composition has a heat deformation temperature greater than or equal to 140°C, that is, a portion or all of the cycloolefin polymers have a heat deformation temperature greater than or equal to 140°C. The at least portion can be at least 50%, that is, at least 50% of the cycloolefin polymers have a heat deformation temperature greater than or equal to 140°C. In some embodiments, the at least portion can specifically be, for example, 50%, 55%, 60%, 70%, 80%, 90%, 95%, or 100%.

[0056] In some embodiments, at least a portion of the cycloolefin polymers in the resin composition has a heat deformation temperature greater than or equal to 150°C, that is, a portion or all of the cycloolefin polymers have a heat deformation temperature greater than or equal to 150°C. The term "at least a portion" may be at least 50%, that is, at least 50% of the cycloolefin polymers have a heat deformation temperature greater than or equal to 150°C. In some embodiments, the term "at least a portion" may specifically be 50%, 55%, 60%, 70%, 80%, 90%, 95%, or 100%.

[0057] In some embodiments, in the resin composition, at least a portion of the cycloolefin polymer has a heat deformation temperature greater than or equal to 160°C, that is, a portion or all of the cycloolefin polymer has a heat deformation temperature greater than or equal to 160°C. The term "at least a portion" may be at least 10%, that is, at least 10% of the cycloolefin polymer has a heat deformation temperature greater than or equal to 160°C. In some embodiments, the term "at least a portion" may specifically be 10%, 20%, 30%, 40%, 50%, 55%, 60%, 70%, 80%, 90%, 95%, or 100%.

[0058] In the present application, it can be that according to actual application demand, cycloolefin polymer with specific heat distortion temperature is selected, in resin combination, it can be that including a kind of cycloolefin polymer, it can also be that including multiple cycloolefin polymer.The cycloolefin polymer in resin combination can be that having the same heat distortion temperature, it can also have different heat distortion temperatures.In some embodiments, multiple cycloolefin polymer with different heat distortion temperatures is included in resin combination.

[0059] In an embodiment of the present application, at least a portion of the cycloolefin polymer is a cycloolefin copolymer. The cycloolefin polymer in the resin composition may be entirely cycloolefin copolymer (COC), or may be partially cycloolefin copolymer (COC) and partially cycloolefin homopolymer (COP). The presence of the cycloolefin copolymer can further enhance the heat resistance of the resin composition.

[0060] In an embodiment of the present application, the mass percentage of the cycloolefin polymer in the resin composition is 30%-60%. In some embodiments, the mass percentage of the cycloolefin polymer in the resin composition is 35%-60%. In some embodiments, the mass percentage of the cycloolefin polymer in the resin composition is, for example, 30%, 35%, 40%, 45%, 50%, 55%, or 60%. Maintaining the cycloolefin polymer in the resin composition at an appropriate amount is conducive to ensuring the basic physical and chemical properties required for the resin composition to be used as a dielectric material, making it more conducive to molding and processing into the required shape for application in various scenarios, while also being able to better achieve insulation and corrosion protection.

[0061] The resin composition of the present application can effectively improve the toughness of the resin composition and enhance its resistance to impact damage by adding a small amount of an olefin polymer as a modifier for the cycloolefin polymer. An olefin polymer is a polymer formed by the polymerization of one or more olefins, and can be an olefin homopolymer, an olefin random copolymer, or an olefin block copolymer. It is an unmodified olefin polymer. An olefin homopolymer is a polymer formed by the polymerization of a single olefin monomer; an olefin random copolymer is a polymer formed by the random copolymerization of two or more olefin monomers; and an olefin block copolymer is a polymer formed by the block copolymerization of two or more olefin monomers, comprising two or more different olefin monomer units arranged in an ordered manner. Specifically, the olefin polymer can be, but is not limited to, one or more olefin monomers selected from the group consisting of ethylene, propylene, butene, isobutylene, pentene, hexene, heptene, octene, nonene, butadiene, pentadiene, hexadiene, heptadiene, and octadiene. Examples of olefin homopolymers include polyethylene, polypropylene, polybutene, polybutadiene, and polyhexadiene. The olefin block copolymer can be, for example, a propylene-butadiene block copolymer, an ethylene-propylene block copolymer, an ethylene-butadiene block copolymer, etc. In some embodiments of the present application, the olefin polymer includes an olefin block copolymer. The block copolymerization of the olefin block copolymer can better maintain the toughness of the material while ensuring high heat resistance.

[0062] The resin composition of the present application, by adding a small amount of a modified alkene polymer as a modifier for the cycloolefin polymer, can improve interfacial bonding strength, improve the toughness of the resin composition to a certain extent, and effectively enhance the resin composition's resistance to impact damage. The modified alkene polymer can be a modified product of the aforementioned alkene polymer. In some embodiments, the modified alkene polymer includes an alkene polymer grafted with maleic anhydride.

[0063] In some embodiments, the resin composition contains only an alkene polymer and no modified alkene polymer; in some embodiments, the resin composition contains only a modified alkene polymer and no alkene polymer; and in some embodiments, the resin composition contains both an alkene polymer and a modified alkene polymer. The primary function of the alkene polymer is to provide toughness, while the primary function of the modified alkene polymer is to improve interfacial bonding. The alkene polymer and the modified alkene polymer are highly compatible, and the inclusion of both polymers in the resin composition can further enhance the mechanical properties of the resin composition.

[0064] In embodiments of the present application, the mass percentage of the alkene polymer and / or modified alkene polymer in the resin composition is 3%-15%. The addition of an appropriate amount of alkene polymer and / or modified alkene polymer can effectively improve the toughness of the resin composition, enhance the resin composition's ability to resist impact damage, improve the interfacial bonding between inorganic and organic fillers, and enable the resin composition to contain sufficient cycloolefin polymers and fillers, thereby helping to ensure the resin composition's heat resistance, dielectric properties, and other mechanical properties. In some embodiments of the present application, the mass percentage of the alkene polymer and / or modified alkene polymer is 5%-10%. In some examples of the present application, the mass percentage of the alkene polymer and / or modified alkene polymer is 3%, 4%, 5%, 5.5%, 6%, 6.5%, 7%, 7.5%, 8%, 8.5%, 9%, 9.5%, 10%, 11%, 12%, 13%, 14%, or 15%.

[0065] In some embodiments of the present application, the mass percentage of the alkene polymer in the resin composition is 5%-15%. For example, 5%, 5.5%, 6%, 6.5%, 7%, 7.5%, 8%, 8.5%, 9%, 9.5%, 10%, 11%, 12%, 13%, 14%, and 15%. The main function of the alkene polymer is to improve the toughness and impact resistance of the resin composition. Controlling its content at a relatively high level can help improve the impact resistance of the resin composition.

[0066] In some embodiments of the present application, the weight percentage of the modified olefin polymer in the resin composition is 1%-5%, for example, 1%, 2%, 3%, 4%, or 5%. The primary function of the modified olefin polymer is to improve the interfacial bonding properties of the components. Keeping the modified olefin polymer content relatively low helps improve both interfacial bonding properties and impact resistance.

[0067] In some embodiments, the resin composition contains both an olefin polymer and a modified olefin polymer, and the mass percentage of the olefin polymer is greater than the mass percentage of the modified olefin polymer.

[0068] In the embodiments of the present application, the alkene polymer and / or modified alkene polymer has a melting temperature greater than 105°C. Melting temperature refers to the temperature at which a substance transitions from a highly elastic state to a viscous flow state. The relatively high melting temperature of the alkene polymer and modified alkene polymer facilitates the alkene polymer and modified alkene polymer in enhancing the toughness of the resin composition while maintaining high heat resistance.

[0069] In an embodiment of the present application, the mass percentage of the filler in the resin composition is 35%-70%. The appropriate addition of filler can improve the mechanical properties of the resin composition, such as strength and hardness, and can also improve dielectric properties and heat resistance. In some embodiments, the mass percentage of the filler in the resin composition is 35%, 40%, 45%, 50%, 55%, 60%, 65%, or 70%.

[0070] In embodiments of the present application, the filler may include a titanate filler and a non-titanate filler, with the mass percentage of the titanate filler being 10%-40% and the mass percentage of the non-titanate filler being 0-40%. In some embodiments, the filler includes only a titanate filler and does not include a non-titanate filler; in some embodiments, the filler includes both a titanate filler and a non-titanate filler.

[0071] Titanate filler has a high dielectric constant, and including titanate filler in the filler is more conducive to improving the dielectric properties and impact resistance of the resin composition. Taking into account the dielectric properties and the possible temperature drift effects of titanate filler, in the embodiment of the present application, the mass percentage of titanate filler is controlled to 10%-40%. In some embodiments, the mass percentage of titanate filler is controlled to 15%-35%. In some embodiments, the mass percentage of titanate filler is controlled to 15%-30%. In some embodiments, the mass percentage of titanate filler is 10%, 15%, 20%, 25%, 30%, 35%, 40%. In this application, temperature drift refers to the change in dielectric constant brought about by temperature changes.

[0072] In some embodiments of the present application, when the filler includes only titanate filler, the mass percentage of the titanate filler is controlled to be 35%-40%, for example, 35%, 36%, 37%, 38%, 39%, or 40%.

[0073] In the embodiments of the present application, the titanate filler, i.e., a titanium oxyacid salt filler, can be one or more of calcium titanate, magnesium calcium titanate, strontium calcium titanate, barium strontium titanate, and barium titanate. These titanate fillers have a high dielectric constant, can improve mechanical properties, and can bond well with the resin component. Adding them to the resin composition can help improve the dielectric properties and impact resistance of the resin composition.

[0074] In the embodiment of the present application, the titanate filler is a spherical or quasi-spherical particle. The spherical or quasi-spherical particle of the titanate filler is beneficial to better reduce the dielectric loss Df of the resin composition, reduce interface defects, improve the mechanical properties of the resin composition, improve the melt index of the composition, and facilitate injection molding. The higher the sphericity, the more advantageous it is. In some embodiments, the average sphericity of the titanate filler is greater than 0.85. Among them, sphericity is a parameter that characterizes the morphology of the particles. It is the ratio of the surface area of ​​a sphere with the same volume as the particle to the surface area of ​​the particle. The closer the particle is to a sphere in morphology, the closer its sphericity is to 1. In some embodiments of the present application, the average sphericity of the titanate filler can be, for example, 0.86, 0.87, 0.88, 0.9, 0.92, 0.93, 0.95, 0.96, 0.98, 0.99, 1.

[0075] In the embodiment of the present application, the D50 particle size of the titanate filler is 0.5μm-100μm. D50 is the particle size corresponding to when the cumulative particle size distribution percentage of a sample reaches 50%. D50 is also called the median diameter or median particle size. The titanate filler has a suitable particle size, which is conducive to its uniform dispersion in the resin composition, better exerting the performance advantages of the titanate filler, and improving the density, dielectric and mechanical properties of the molded product obtained after the resin composition is molded. In the embodiment of the present application, the D50 particle size of the titanate filler is 1μm-20μm. In some embodiments, the D50 particle size of the titanate filler can be, for example, 0.5 μm, 1 μm, 5 μm, 10 μm, 15 μm, 20 μm, 25 μm, 30 μm, 35 μm, 40 μm, 45 μm, 50 μm, 55 μm, 60 μm, 65 μm, 70 μm, 75 μm, 80 μm, 85 μm, 90 μm, or 100 μm.

[0076] In an embodiment of the present application, the mass percentage of the non-titanate filler can be 0-40%. The addition of the non-titanate filler in the resin composition can synergize with the titanate filler, so that the resin composition can improve the dielectric properties while reducing the impact of temperature drift, and at the same time better reduce the thermal expansion coefficient of the resin composition, so that the resin composition can better have both excellent dielectric properties and low thermal expansion coefficient. In some embodiments of the present application, the mass percentage of the non-titanate filler is 10%-30%. In some embodiments, the mass percentage of the non-titanate filler is 1%, 3%, 4%, 5%, 10%, 12%, 15%, 18%, 20%, 22%, 25%, 28%, 30%, 32%, 35%, 38%, 40%.

[0077] In some embodiments of the present application, the mass ratio of titanate filler to non-titanate filler is greater than or equal to 0.5:1. Controlling the mass ratio within the above mass ratio is beneficial to improving the dielectric properties of the resin composition, while better ensuring the dimensional stability of the resin composition molded product. In some embodiments, the mass ratio of titanate filler to non-titanate filler is 0.5:1, 0.6:1, 0.8:1, 1:1, 1.5:1, 2:1, 2.5:1, 3:1. In some embodiments, the mass ratio of titanate filler to non-titanate filler is greater than or equal to 1:1.

[0078] In embodiments of the present application, the non-titanate filler comprises a metal or non-metal oxide, which may include, but is not limited to, hafnium dioxide, titanium oxide, lead oxide, tantalum oxide, and the like. In some embodiments, the non-titanate filler comprises one or more of hafnium dioxide, titanium oxide, lead oxide, and tantalum oxide. These metal oxides all have high dielectric constants and structural stability. When compounded with a titanate filler and added to a resin composition, they can effectively improve the dielectric properties and dimensional stability of the resin composition.

[0079] In an embodiment of the present application, the dielectric constant of the non-titanate filler is greater than 20. Selecting a non-titanate filler with a larger dielectric constant is beneficial to improving the dielectric properties of the resin composition. In some embodiments, the dielectric constant of the non-titanate filler is greater than or equal to 30; in some embodiments, the dielectric constant of the non-titanate filler is greater than or equal to 40; in some embodiments, the dielectric constant of the non-titanate filler is greater than or equal to 50; in some embodiments, the dielectric constant of the non-titanate filler is greater than or equal to 55; in some embodiments, the dielectric constant of the non-titanate filler is greater than or equal to 60; in some embodiments, the dielectric constant of the non-titanate filler is greater than or equal to 70; in some embodiments, the dielectric constant of the non-titanate filler is greater than or equal to 80.

[0080] In the embodiments of the present application, the non-titanate filler is a spherical or quasi-spherical particle. The non-titanate filler is a spherical or quasi-spherical particle, which is beneficial to better reduce the dielectric loss Df of the resin composition, reduce interface defects, and improve the mechanical properties of the resin composition. In some embodiments, the average sphericity of the non-titanate filler is greater than 0.85. In some embodiments of the present application, the average sphericity of the non-titanate filler can be, for example, 0.86, 0.87, 0.88, 0.9, 0.92, 0.93, 0.95, 0.96, 0.98, 0.99, 1.

[0081] In the embodiments of the present application, the D50 particle size of the non-titanate filler is 0.1 μm to 10 μm. A suitable particle size of the non-titanate filler facilitates its uniform dispersion in the resin composition, better leveraging the performance advantages of the non-titanate filler and improving the density, dielectric properties, and mechanical properties of the resulting molded article after molding the resin composition. In some embodiments, the D50 particle size of the non-titanate filler can be, for example, 0.1 μm, 0.2 μm, 0.5 μm, 1 μm, 2 μm, 3 μm, 4 μm, or 5 μm.

[0082] In order to improve certain properties of the resin composition, an auxiliary agent may be added according to actual needs. In some embodiments of the present application, the resin composition further includes an auxiliary agent, and the mass percentage of the auxiliary agent in the resin composition is less than or equal to 2%. The auxiliary agent may be one or more of an antioxidant, a flame retardant, and a lubricant. The antioxidant can enhance the antioxidant properties of the resin composition, the flame retardant can enhance the flame retardant properties of the resin composition, and the lubricant can enhance the lubrication properties of the resin composition.

[0083] In the embodiment of the present application, the dielectric constant Dk of resin combination is ≥4.5, and the dielectric loss Df at 10GHz is 0.0004-0.001. The embodiment of the present application is designed by specific components so that resin combination has high dielectric constant, has extremely low dielectric loss at 10GHz high frequency, and when the resin combination is applied to the preparation of communication components, it is possible to effectively improve signal transmission efficiency, reduce loss, so as to better meet the demand of high-quality and high-efficiency signal transmission under high frequency of communication components and the demand of communication components to miniaturization development. The higher the dielectric constant, the more conducive to the miniaturization design of antenna. In some embodiments, the dielectric constant Dk of resin combination is, for example, 4.5, 4.6, 4.8, 5.0, 5.2, 5.5, 6.0, 6.2, 6.5, 7.0, 7.1. In some embodiments, the dielectric constant Dk of resin combination is ≥5.0. In some embodiments, the dielectric loss Df of the resin composition at 10 GHz is 0.0004, 0.0005, 0.0006, 0.0007, 0.0008, 0.0009, or 0.001. In some embodiments, the dielectric loss Df of the resin composition at 10 GHz is 0.0004-0.0008. The dielectric constant and dielectric loss of the resin composition can be tested using a network analyzer with a 10 GHz fixture.

[0084] In the embodiment of the present application, the heat deformation temperature of the resin composition is ≥155 ° C. Heat deformation temperature (Heat deflection temperature, HDT) refers to the temperature at which a resin material is deformed under the action of an external force, and heat deformation temperature is an important indicator for judging the heat resistance of a resin composition. The resin composition of the embodiment of the present application has a higher heat deformation temperature, indicating that it has excellent heat resistance, can better meet the needs of high temperature application scenarios, and improve the reliability of communication components. In some embodiments, the heat deformation temperature of the resin composition is, for example, 155 ° C, 160 ° C, and 165 ° C. The heat deformation temperature can be tested using an HDT Vicat test instrument according to standard ISO75-1 "Plastics - Determination of Deflection Temperature under Load".

[0085] In the embodiment of the present application, the notched Izod impact strength of the resin composition is greater than 5 kJ / m 2 The notched Izod impact strength reflects the material's ability to resist impact and can be tested using an Izod notched impact strength tester according to ISO 180: Plastics - Determination of Izod Impact Strength. In some embodiments, the notched Izod impact strength of the resin composition is greater than or equal to 5.3 kJ / m 2 In some embodiments, the resin composition has an Izod notched impact strength greater than or equal to 6 kJ / m 2 In some embodiments, the resin composition has an Izod notched impact strength greater than or equal to 6.5 kJ / m 2 In some embodiments, the resin composition has an Izod notched impact strength greater than 7 kJ / m 2 .

[0086] The resin composition provided in the embodiments of the present application has a high dielectric constant, low dielectric loss, and high heat resistance and impact resistance. When used as a dielectric material in the communication field, it can improve signal transmission efficiency while meeting the requirements of mechanical properties and heat resistance, thereby better meeting the application needs of high-frequency communication and miniaturized communication components, and promoting the high-frequency and miniaturization development of communication components such as antennas.

[0087] Referring to FIG1 , this embodiment of the present application further provides a method for preparing the above-mentioned resin composition, comprising:

[0088] S101, mixing the components of the resin composition to obtain a mixture;

[0089] The method for mixing the cycloolefin polymer, alkene polymer and / or modified alkene polymer, and filler is not limited. Mixing can be performed directly in an extrusion device, such as a twin-screw extruder. Specifically, for example, the cycloolefin polymer, alkene polymer, and / or modified alkene polymer as the resin components are mixed and then added to the main feed system of the twin-screw extruder. The filler is added to the side feed system of the twin-screw extruder, and the feed rate is set according to the ratio of the resin components to the filler.

[0090] When the resin composition further comprises an auxiliary agent, the auxiliary agent can be added into the main feeding system of the twin-screw extruder together with the resin component.

[0091] S102, melting the mixture obtained in step S101, and extruding and granulating the mixture to obtain the resin composition.

[0092] The melting temperature depends on the type of resin component. During the extrusion granulation process, the extrusion temperature of the twin-screw extruder can be 220°C-290°C, for example, 220°C, 230°C, 240°C, 250°C, 260°C, 270°C, 280°C, or 290°C. The screw speed can be 400 rpm-600 rpm, for example, 400 rpm, 500 rpm, or 600 rpm. The screw aspect ratio can be 40:1. The resin composition obtained after granulation is resin composition particles.

[0093] The preparation method provided in the embodiments of the present application has a simple process and is conducive to mass production.

[0094] The present invention also provides a molded article comprising a molded article of the resin composition described in the embodiments of the present invention. The molded article can be designed into various regular or irregular shapes and specific sizes according to actual application requirements. The molded article is solid. The molded article can be obtained by injection molding, calendering molding, or extrusion molding.

[0095] Referring to Figure 2, an embodiment of the present application further provides an electronic component 100, which includes a molded product of the resin composition described above in the embodiment of the present application. In some embodiments, the electronic component includes a functional layer 102, and an insulating dielectric layer 101 arranged on opposite sides of the functional layer 102, and the insulating dielectric layer 101 includes a molded product of the resin composition described above in the embodiment of the present application. The electronic component 100 can be various electronic components with application requirements for dielectric materials, such as communication components, capacitors, etc. It should be noted that Figure 2 only schematically shows the possible existence forms of the insulating dielectric layer 101 of the electronic component 100 to show the existence form of the molded product of the resin composition, and this structural schematic diagram does not limit the specific structure of the electronic component 100.

[0096] In some embodiments, the electronic component 100 is a communication component, which may include various communication components that require dielectric materials, such as antennas, microwave devices, radio frequency devices, and metal strip line assemblies. The molded article of the resin composition can specifically serve as a dielectric substrate, a dielectric frame, or a dielectric layer. The communication component uses the resin composition of the embodiment of the present application as a dielectric material, which can effectively improve signal transmission efficiency, while also helping to improve thermal stability and impact resistance, thereby improving product reliability.

[0097] In some embodiments, the resin composition is used in microwave devices in antennas, for example, it can be used in phase control devices of microwave devices. These microwave devices can be microwave modulators, microwave amplifiers, microwave filters, microwave switches, microwave mixers, etc.

[0098] In some embodiments, the resin composition is used in a radio frequency device, which may be, for example, a radio frequency amplifier, a radio frequency switch, a radio frequency filter, a radio frequency mixer, a radio frequency power amplifier, a combiner, a phase shifter, etc.

[0099] In some embodiments, the resin composition is used in a metal strip line component in an antenna, for example, it can be used to form an isolation device between metal strip lines.

[0100] The present invention also provides a communication system comprising the communication components described above. The communication system using the communication components has better signal transmission efficiency, better thermal stability and better shock resistance.

[0101] The embodiments of the present application are further described below with reference to a number of embodiments.

[0102] Examples 1 to 7

[0103] The resin components, cycloolefin polymer, alkene polymer and / or modified alkene polymer, and additives, are mixed and added to the main feed system of a twin-screw extruder. The filler is added to the side feed system of the twin-screw extruder. After melting, the mixture is extruded and granulated to obtain resin composition particles. The proportions of the cycloolefin polymer, alkene polymer and / or modified alkene polymer, filler, and additives are shown in Table 1.

[0104] Comparative Examples 1 to 4

[0105] The same preparation method as in Example 1 was used to prepare resin composition particles, and the formulation thereof is shown in Table 1.

[0106] In Table 1, spherical or quasi-spherical calcium titanate, quasi-spherical titanium oxide, and silicon dioxide are all fillers.

[0107] The resin compositions and molded articles of Examples 1 to 7 and Comparative Examples 1 to 4 were tested for heat deformation temperature (HDT), notched Izod impact strength, dielectric constant, and dielectric loss. The test results are shown in Table 1.

[0108] Heat Deflection Temperature (HDT): Tested in accordance with ISO 75-1 "Plastics - Determination of Deflection Temperature under Load" using HDT Vicat test equipment;

[0109] Izod notched impact strength: According to the standard ISO 180: "Plastics - Determination of Izod impact strength", the test is carried out using an Izod notched impact strength testing machine.

[0110] Dielectric constant and dielectric loss test: Use a network analyzer with a 10 GHz fixture for testing.

[0111] Table 1

[0112] As can be seen from the test results in Table 1, Examples 1 to 7 of the present application are obtained by compounding the cycloolefin polymer with the modifier olefin polymer and / or the modified olefin polymer, and a specific type of filler in a suitable ratio to obtain a resin composition, which can have a high dielectric constant ≥4.5, a low dielectric loss ≤0.001, a high heat deformation temperature ≥155°C and an Izod notched impact strength ≥5.0 kJ / m 2 .

[0113] The difference between Example 1 and Comparative Example 1 is that no modifier olefin block copolymer is added to Comparative Example 1. From the results of Example 1 and Comparative Example 1, it can be seen that Example 1 significantly improves the Izod notched impact strength of the resin composition by compounding the modifier chain olefin polymer into the cycloolefin polymer system.

[0114] The difference between Example 1 and Comparative Example 2 is that the mass percentage of the modifier olefin block copolymer added in Comparative Example 2 is greater than 15%. From the results of Example 1 and Comparative Example 2, it can be seen that when fillers with the same total mass percentage are used to ensure dielectric properties, the addition of too much modifier olefin block copolymer will cause the heat deformation temperature of the resin composition to fail to meet the high heat resistance requirements.

[0115] The difference between Example 2 and Comparative Example 3 is that in Comparative Example 3, too little calcium titanate filler is added, while too much titanium oxide filler is added. From the results of Example 2 and Comparative Example 3, it can be seen that for fillers with the same total mass proportion, too little calcium titanate filler and too much titanium oxide filler are not conducive to improving the dielectric properties and impact resistance. In Example 2, an appropriate amount of calcium titanate filler and titanium oxide filler are compounded, and the dielectric properties and impact resistance of the resin composition are significantly improved.

[0116] By comparing Example 1 and Comparative Example 4, it can be seen that Example 1 of the present application compounds titanium oxide filler with Dk>50 with calcium titanate filler to obtain a higher dielectric constant, while the non-titanate filler added in Comparative Example 4 is silicon dioxide with an equal mass of Dk<20, resulting in the Dk of the resin composition being much less than 4.5.

[0117] Comparing Example 4 and Example 5, it can be seen that when the total mass proportion of fillers is the same, the proportion of calcium titanate filler is greater than that of titanium oxide filler, which is beneficial to improving the dielectric constant of the resin composition.

[0118] It should be understood that the first, second and various numerical numbers involved in this document are only distinguished for the convenience of description and are not intended to limit the scope of this application.

[0119] In this application, "and / or" describes the relationship between related objects, indicating that three possible relationships exist. For example, "A and / or B" can mean: A exists alone, A and B exist simultaneously, and B exists alone. A and B can be singular or plural. The character " / " generally indicates that the related objects are in an "or" relationship.

[0120] In this application, "at least one" means one or more, and "more than one" means two or more. "At least one of the following" or similar expressions refers to any combination of these items, including any combination of single items or plural items. For example, "at least one of a, b, or c", or "at least one of a, b, and c" can all mean: a, b, c, ab (i.e., a and b), ac, bc, or abc, where a, b, and c can be single or multiple.

[0121] In this application, “-” represents a range value, including the endpoint values ​​at both ends. For example, the value of a can be 0.5-15, which means that the value of a can be between 0.5 and 15, and includes the endpoint values ​​0.5 and 15.

[0122] It should be understood that in the various embodiments of the present application, the size of the serial numbers of the above-mentioned processes does not mean the order of execution. Some or all of the steps can be executed in parallel or sequentially. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

Claims

1. A resin composition, characterized in that, The resin composition comprises the following components in mass percentages: 30%-60% of a cycloolefin polymer, 3%-15% of an olefin polymer and / or a modified olefin polymer, and 35%-70% of a filler; Wherein, the filler comprises a titanate filler and a non-titanate filler, the mass percentage of the titanate filler is 10%-40%, the mass percentage of the non-titanate filler is 0%-40%, and the dielectric constant of the non-titanate filler is greater than 20.

2. The resin composition according to claim 1, wherein The heat distortion temperature of at least part of the cycloolefin polymer is greater than or equal to 140 °C.

3. The resin composition according to claim 1, characterized in that, The heat distortion temperature of at least part of the cycloolefin polymer is greater than or equal to 150 °C.

4. The resin composition according to any one of claims 1 to 3, characterized in that, The heat distortion temperature of at least part of the cycloolefin polymer is greater than or equal to 160 °C.

5. The resin composition according to any one of claims 1 to 4, characterized in that, At least part of the cycloolefin polymer is a cycloolefin copolymer.

6. The resin composition according to any one of claims 1 to 5, characterized in that, The mass percentage of the olefin polymer and / or the modified olefin polymer is 5%-10%.

7. The resin composition according to any one of claims 1 to 6, characterized in that The melting temperature of the olefin polymer and / or the modified olefin polymer is greater than 105 °C.

8. The resin composition according to any one of claims 1 to 7, characterized in that, The olefin polymer comprises an olefin block copolymer.

9. The resin composition according to any one of claims 1 to 8, characterized in that, The modified olefin polymer comprises a maleic anhydride-grafted olefin polymer.

10. The resin composition according to any one of claims 1 to 9, characterized in that, The mass ratio of the titanate filler to the non-titanate filler is greater than or equal to 0.5:

1.

11. The resin composition according to any one of claims 1 to 10, characterized in that, The titanate filler comprises one or more of calcium titanate, calcium magnesium titanate, calcium strontium titanate, strontium barium titanate, and barium titanate.

12. The resin composition according to any one of claims 1 to 11, characterized in that, The titanate filler is spherical or quasi-spherical particles, and the average sphericity is greater than 0.

85.

13. The resin composition according to any one of claims 1 to 12, characterized in that, The D50 particle size of the titanate filler is 0.5 μm - 100 μm.

14. The resin composition according to any one of claims 1 to 13, characterized in that, The non-titanate filler comprises a metal or non-metal oxide, and the metal or non-metal oxide comprises titanium oxide.

15. The resin composition according to any one of claims 1 to 14, characterized in that, The dielectric constant of the non-titanate filler is greater than 50, the non-titanate filler is spherical or quasi-spherical particles, and the average sphericity is greater than 0.

85.

16. The resin composition according to any one of claims 1 to 15, characterized in that, The D50 particle size of the non-titanate filler is 0.1 μm - 10 μm.

17. The resin composition according to any one of claims 1 to 16, characterized in that, The mass percentage of the non-titanate filler is 10%-30%.

18. The resin composition according to any one of claims 1 to 17, characterized in that, The resin composition further comprises an additive, and the mass percentage of the additive is less than or equal to 2%.

19. The resin composition according to claim 18, wherein The additive comprises one or more of an antioxidant, a flame retardant, and a lubricant.

20. The resin composition according to any one of claims 1 to 19, characterized in that, The dielectric constant Dk of the resin composition is ≥4.5, and the dielectric loss Df at 10 GHz is 0.0004 - 0.

001.

21. The resin composition according to any one of claims 1 to 20, characterized in that, The heat distortion temperature of the resin composition is ≥155 °C.

22. The resin composition according to any one of claims 1 to 21, characterized in that, The notched Izod impact strength of the resin composition is greater than 5 kJ / m 2 .

23. The method for preparing the resin composition according to any one of claims 1-22, characterized in that, Comprising: Mixing the components of the resin composition to obtain a mixture; Melting the mixture and then extruding and pelletizing to obtain the resin composition.

24. A molded article, characterized in that, A molded article comprising the resin composition according to any one of claims 1-22.

25. An electronic component, characterized in that, The electronic component comprises a molded article of the resin composition according to any one of claims 1-22.

26. The electronic component according to claim 25, wherein The electronic component comprises a communication component and a capacitor.

27. The electronic component according to claim 26, wherein The communication component comprises an antenna, a microwave device, a radio frequency device, or a metal strip line assembly.

28. A communication system, characterized in that, The communication system comprises a communication component, and the communication component comprises a molded article of the resin composition according to any one of claims 1-22.

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