LED device, method for manufacturing LED device, and LED panel

Abstract

An LED device, a method for manufacturing the LED device, and an LED panel. The LED device comprises a carrying bracket (1), wherein an LED chip (2) is carried on the carrying bracket (1), and the periphery of the LED chip (2) is coated with an encapsulant (3); and a scattering material (5) is added in the encapsulant (3), and the scattering material (5) comprises two or more scattering objects. The two or more scattering objects comprise a first scattering object and a second scattering object, the first scattering object being configured to scatter and refract light emitted by the LED chip (2), and the second scattering object being configured to reflect light emitted by the LED chip (2).

Description

LED device, method for manufacturing LED device, and LED panel

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on December 29, 2023, with application number 202311843627.9, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the technical field of LED devices, for example, to an LED device, a method for manufacturing an LED device, and an LED panel. Background Art

[0003] Light emitting diode (LED) device products in related technologies are generally manufactured using a packaging process that combines LED chips with packaging glue. With advancements in LED device manufacturing technology, light output efficiency has gradually improved. At the same operating current, the brightness of LED devices continues to increase. While maintaining brightness, the size of LED chips has become increasingly smaller in order to reduce manufacturing costs. However, although the overall brightness of a small-sized LED chip is essentially the same as that of a large-sized LED chip at the same operating current, the central luminous brightness of a small-sized LED chip needs to be higher than that of a large-sized LED chip. This increases the difference in brightness between the small-sized LED chip and its surroundings, leading to a significantly smaller light spot on the surface of the LED device formed by a small-sized LED chip with the same overall brightness than a large-sized LED chip when observed with the naked eye. This results in poor luminous performance for LED devices using small-sized LED chips. Summary of the Invention

[0004] The present application provides an LED device, a method for manufacturing an LED device, and an LED panel, which can form a larger light spot area on the light-emitting surface of the LED device, enhance the light saturation of the LED device, and improve the display effect of the LED product.

[0005] The present application provides an LED device, the LED device comprising a supporting bracket, the supporting bracket carrying an LED chip, and the LED chip being coated with an encapsulating colloid on all sides;

[0006] A scattering material is added to the encapsulation colloid, and the scattering material includes two or more scattering objects, and the two or more scattering objects include a first scattering object and a second scattering object, wherein the first scattering object is used to scatter and refract the light emitted by the LED chip, and the second scattering object is used to reflect the light emitted by the LED chip.

[0007] The present application also provides a method for manufacturing an LED device, which is used to manufacture the above-mentioned LED device, and the manufacturing method includes:

[0008] Place the LED chip on the supporting bracket;

[0009] Prepare packaging glue, and add a preset proportion of scattering material into the prepared packaging glue;

[0010] Vacuum stirring the encapsulation glue after adding the scattering material;

[0011] Centrifuge the encapsulated glue after vacuum stirring;

[0012] The LED chip is packaged by dispensing the packaging glue after centrifugation to form a packaging colloid to manufacture an LED device.

[0013] The present application also provides an LED panel, on which the above-mentioned LED device is arranged. The LED panel also includes a substrate, and the LED device is placed on the substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The following will introduce the drawings required for the description of the embodiments. The drawings described below are drawings of some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0015] FIG1 is a schematic structural diagram of an LED device in an embodiment of the present application;

[0016] FIG2 is a schematic diagram of the particle size distribution of the scattering material in an embodiment of the present application;

[0017] FIG3 is a schematic diagram showing the relationship between the particle size of the scattering material and the scattering phenomenon in an embodiment of the present application;

[0018] FIG4 is a schematic diagram of the structure of the LED device after lighting in an embodiment of the present application;

[0019] FIG5 is a schematic diagram of the light spot area structure of the LED device after lighting in an embodiment of the present application;

[0020] FIG6 is a schematic diagram showing the relationship between the light spot deviation angle and the operating current when no scattering material is added in an embodiment of the present application;

[0021] FIG7 is a schematic diagram showing the relationship between the spot offset diameter and the operating current when no scattering material is added in an embodiment of the present application;

[0022] FIG8 is a schematic diagram showing the relationship between the light spot deviation angle and the operating current after adding scattering material in an embodiment of the present application;

[0023] FIG9 is a schematic diagram showing the relationship between the spot offset diameter and the operating current after adding scattering material in an embodiment of the present application;

[0024] FIG10 is a flow chart of a method for manufacturing an LED device in an embodiment of the present application. DETAILED DESCRIPTION

[0025] The following describes the embodiments of the present application in conjunction with the accompanying drawings. The embodiments described are some related embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0026] In this application, it should be understood that terms such as "including" or "having" are intended to indicate the presence of features, numbers, steps, actions, components, parts or their combinations disclosed in this specification, and are not intended to exclude the possibility that one or more other features, numbers, steps, actions, components, parts or their combinations exist or are added.

[0027] Example 1

[0028] Embodiment 1 of the present application provides an LED device, as shown in FIG1 . FIG1 shows a schematic structural diagram of the LED device in the embodiment of the present application, wherein the LED device includes a supporting bracket 1 on which an LED chip 2 is supported, and the LED chip 2 is surrounded by a packaging colloid 3.

[0029] In an optional implementation of this embodiment, the LED chip is a red light LED chip, and the light emitted by the LED device is red light.

[0030] In an optional implementation of this embodiment, a scattering material 5 is added to the encapsulation colloid, and the scattering material 5 includes two scattering objects, including a first scattering object and a second scattering object, wherein the first scattering object is used to scatter and refract the light emitted by the LED chip, and the second scattering object is used to reflect the light emitted by the LED chip.

[0031] In an optional implementation of this embodiment, the first scattering material is silicon dioxide powder, and the second scattering material is titanium dioxide powder.

[0032] In some embodiments, the main component of the silica powder is silicon dioxide, which mainly functions to scatter and refract the red light emitted by the LED chip.

[0033] The main component of the titanium dioxide is titanium dioxide, and its main function is to reflect the red light emitted by the LED chip.

[0034] In traditional LED devices, scattering materials, such as silica powder, are typically added only to the encapsulant to achieve a certain scattering effect. However, silica powder particles are generally large. If the proportion of scattering material added to the encapsulant is too high, the transparent encapsulant will partially refract the light, resulting in severe light loss and a significant reduction in light output intensity. On the other hand, if the proportion of scattering material added to the encapsulant is too low, the scattering effect is not significant, resulting in a small light spot area and poor display quality. In this embodiment, a mixed scattering material of silica powder and titanium dioxide is added. While the silica powder enhances the scattering and refractive effects, the titanium dioxide particles are small and have a good reflective effect. This allows the light emitted by the LED chip to be reflected as much as possible within the LED device. This increases the light spot area while ensuring a certain light output intensity, effectively improving the display quality.

[0035] In an optional implementation of this embodiment, the normal distribution center particle size of the silicon dioxide powder is 0.7 micrometers (um) to 1.5 micrometers (um), and the normal distribution center particle size of the titanium dioxide powder is 0.3um to 1.2um.

[0036] For example, the normal distribution center particle size of the silicon dioxide powder is 1 um-1.5 um, and the normal distribution center particle size of the titanium dioxide powder is 0.3 um-0.5 um.

[0037] In an optional implementation of this embodiment, the uniform particle size of the silicon dioxide powder is 0.5um-30um, and the uniform particle size of the titanium dioxide powder is 0.3um-1um.

[0038] For example, the uniform particle size of the silicon dioxide powder is 0.6um-0.66um, and the uniform particle size of the titanium dioxide powder is 0.3um-0.33um.

[0039] As shown in Figure 2, Figure 2 shows a schematic diagram of the particle size distribution of the scattering material in the embodiment of the present application. The exemplary value of the uniform particle size of the above-mentioned silica powder is the particle size of the uniform particles, which means that the particle size of all particles of the added silica powder is the same. When the exemplary value of the uniform particle size of the uniform particles of the silica powder is 0.6um-0.66um, which is close to the wavelength of the red light LED chip of 600 nanometers (nm)-660 nanometers (nm), the scattering effect of the silica powder is better. In fact, the particle size of all particles of the silica powder is normally distributed, and the exemplary value of the normal distribution center particle size of all particles of the silica powder is 1um-1.5um. The particle size of all particles of titanium dioxide is also normally distributed, and the exemplary value of the normal distribution center particle size of all particles of titanium dioxide is 0.3um-0.5um.

[0040] Light emitted by the LED chip in an LED device is scattered by silica powder. The intensity of the scattered light is related to the particle size of the silica powder. The larger the particle size, the stronger the scattered light intensity. This is because light scatters during propagation due to the influence of the particles in the propagation medium. As shown in Figure 3, when the wavelength of light is much larger than the particle size of the material, that is, when the ratio is far less than 1, the scattering phenomenon is mainly caused by Rayleigh scattering, and the scattering probability increases exponentially. When the wavelength of light is equal to or close to the particle size of the material, that is, when the ratio is close to 1, the scattering phenomenon is mainly caused by Mie scattering, and the scattering probability approaches its maximum value and tends to be stable. In this embodiment, the uniform particle size of the silica powder is selected from 0.5um-30um, and the normal distribution center particle size is selected from 0.7um-1.5um. At this time, the scattering probability is relatively the largest. If the uniform particle size of the silica powder is too large, the mass concentration of the silica powder needs to be increased to meet the scattering effect. However, too high a mass concentration will lead to the inability to mix and stir during production, uneven distribution, and affect the light output effect. If the uniform particle size of the silica powder is too small, the silica powder particles will easily agglomerate, resulting in poor mixing uniformity, and then poor scattering effect; the uniform particle size of the titanium dioxide is selected from 0.3um-1um, and the normal distribution center particle size is selected from 0.3um-1.2um. At this time, the reflection effect is relatively the largest. If the uniform particle size of the titanium dioxide is too large, it will lead to excessive reflection, resulting in serious light loss, affecting the light output effect. If the uniform particle size of the titanium dioxide is too small, Rayleigh scattering is more, resulting in poor reflection effect, which will also affect the light output effect.

[0041] In an optional implementation of this embodiment, the mass concentration of the silicon dioxide powder is 0.5%-50%, and the mass concentration of the titanium dioxide powder is 0.1%-2%.

[0042] For example, the mass concentration of the silicon dioxide powder is 20%, and the mass concentration of the titanium dioxide powder is 0.5%.

[0043] Selecting exemplary values ​​of the mass concentration of silica powder and titanium dioxide has better scattering and reflection effects. If the mass concentration is too high, it will lead to the inability to mix and stir during production, affecting the uniform mixing with the packaging glue. If the mass concentration is too low, it will lead to poor scattering effect, making the formed light spot area smaller, affecting the light output effect.

[0044] In an optional implementation of this embodiment, when the LED device is turned on, a light spot is formed on the upper surface of the encapsulation body.

[0045] In an optional implementation of this embodiment, the light spot is defined as: when observing from an image point, the ratio of the edge brightness to the center brightness of the luminous surface of the LED device in the same direction is greater than 50%, and the luminous area formed is called a light spot.

[0046] In some embodiments, as shown in Figure 4, Figure 4 shows a schematic structural diagram of the LED device in the embodiment of the present application after being lit. When the LED device is lit, a light spot 4 is formed on the upper surface of the encapsulation colloid 3. The size of the light spot 4 is related to the mass concentration and uniform particle size of the scattering material added to the encapsulation colloid 3 of the LED device.

[0047] In an optional implementation of this embodiment, the light spot 4 includes a first light spot, a second light spot and a third light spot. The area of ​​the first light spot is the area of ​​the light-emitting surface of the LED chip, the area of ​​the second light spot is the area of ​​the rectangular light spot formed on each side of the light-emitting surface of the LED chip, and the area of ​​the third light spot is the area of ​​the light spot circle formed by the light-emitting surface of the LED chip in any direction according to the maximum circle radius.

[0048] In some embodiments, as shown in FIG5 , FIG5 shows a schematic diagram of the light spot area structure after the LED device in the embodiment of the present application is lit. After the LED device is lit, any point on the light-emitting surface of the LED chip 2 emits light in all directions, passes through the encapsulation colloid 3, and forms a plurality of light spot circles on the upper surface of the encapsulation colloid 3, which are superimposed to form a light spot 4. Based on any point on the light-emitting surface of the LED chip 2, light is emitted in all directions. After passing through the encapsulation colloid 3, there are corresponding edge points of the light spot circles on the encapsulation colloid 3, so that the light spot 4 is mainly composed of the first light spot 41, The second light spot 42 and the third light spot 43 are composed of the area of ​​the first light spot 41 being the area of ​​the light-emitting surface of the LED chip 2, the area of ​​the second light spot 42 being the area of ​​the rectangular light spot formed on each side of the light-emitting surface of the LED chip 2 (a total of 4 rectangular light spots), and the area of ​​the third light spot 43 being the area of ​​the light spot circle formed by the light-emitting surface of the LED chip in any direction according to the maximum circle radius (a total of 4 quarter-circle light spots), that is, the area of ​​the light spot 4 is obtained by adding the area of ​​the first light spot 41, the area of ​​the second light spot 42 and the area of ​​the third light spot 43.

[0049] The area of ​​the light spot satisfies the following calculation formula: S=S1+S2+S3; S1=ab; S2=2ax+2bx; x=tanθ*h;

[0050] Where S is the area of ​​the light spot, S1 is the area of ​​the first light spot, S2 is the area of ​​the second light spot, S3 is the area of ​​the third light spot, a is the length of the light-emitting surface of the LED chip, b is the width of the light-emitting surface of the LED chip, x is the light spot offset radius, θ is the light spot offset angle, and h is the height from the light-emitting surface of the LED chip to the upper surface of the packaging colloid.

[0051] In an optional implementation of this embodiment, the LED chip is a rectangular chip, and the length a, width b, and height h from the light-emitting surface of the LED chip to the upper surface of the packaging colloid are determined by numerical values. When the light spot offset angle θ is larger, the light spot offset radius x is larger, and the area of ​​the light spot 4 is larger.

[0052] Since in actual situations, the value of the light spot offset radius x is much larger than the length a and width b of the LED chip, the shape of the light spot 4 is approximately circular.

[0053] In this embodiment, a certain proportion of scattering material is added to the packaging colloid of the LED device, so that the visible light emitted by the LED chip is scattered, reflected, and refracted by the added scattering material. The high-brightness light is reflected and refracted in the packaging colloid, and the luminous path of the light emitted from the center of the LED chip is increased, and the intensity is passively reduced. The non-luminous area around the LED chip increases the brightness through the reflected and refracted light, thereby reducing the difference between the luminous intensity of the center of the LED chip and the luminous intensity of the surrounding non-luminous area, that is, the light spot offset angle in the above formula is increased, and then the light spot offset radius is increased, and the area of ​​the light spot is increased, thereby improving the luminous fullness of the LED device and improving the display effect.

[0054] In an optional implementation of this embodiment, the light spot offset angle is positively correlated with the operating current of the LED device.

[0055] Since the light spot is determined by the ratio of the brightness at the edge of the luminous surface to the brightness at the center, and the luminous intensity of the LED chip is proportional to the operating current, at low operating current, there is only a faint light on the surface of the LED chip. At this time, the brightness around the LED chip is quite different from the brightness at the center, and the size of the light spot is only the size of the light emitting surface of the LED chip, that is, ab. At this time, the light spot offset angle is small. When the operating current increases, the light is reflected at the bottom and wall of the cup of the LED device, so that the brightness of the light converged in all directions gradually increases, so that the difference between the brightness around and the brightness at the center is small, the light spot offset angle increases, and the light spot area increases.

[0056] In an optional implementation of this embodiment, as shown in FIG6 and FIG7, as the operating current increases, the light spot offset angle (light spot angle) increases, the light spot offset radius (light spot diameter) increases, and the light spot area increases.

[0057] In an optional implementation of this embodiment, as shown in Figures 8 and 9, after adding scattering material to the encapsulation colloid, under the same operating current, the spot offset angle (spot angle) and the spot offset radius (spot diameter) are both increased compared to when no scattering material is added, that is, after adding the scattering material, the spot area is increased and the display effect is better.

[0058] In an optional implementation of this embodiment, the light spot offset angle is related to the cup depth, cup mouth size and cup inner wall inclination angle of the LED device, wherein the cup depth is positively correlated with the light spot offset angle, the greater the cup depth, the more light reflected by the cup wall, and the larger the light spot area; the larger the cup mouth size, the lower the focus of the light reflected by the cup wall, and the smaller the light spot area; the larger the inclination angle of the cup inner wall, the lower the focus of the light reflected by the cup wall, and the smaller the light spot area.

[0059] In summary, Example 1 of the present application provides an LED device, which adds silica powder for scattering and refraction, and titanium dioxide for reflection, to the packaging colloid of the LED device carrying a small-sized LED chip, and sets a reasonable normal distribution center particle size and mass concentration for the added silica powder and titanium dioxide according to the color of the visible light emitted by the LED chip, so that the visible light emitted by the LED chip causes appropriate degrees of scattering, refraction, and reflection, thereby increasing the light spot offset angle of the LED device, making the light spot area formed on the upper surface of the LED device packaging colloid larger, enhancing the luminous fullness of the LED device, and improving the display effect of the LED product.

[0060] Example 2

[0061] Embodiment 2 of the present application provides an LED device, as shown in FIG1 . FIG1 shows a schematic structural diagram of the LED device in the embodiment of the present application, wherein the LED device includes a supporting bracket 1 on which an LED chip 2 is supported, and the LED chip 2 is surrounded by a packaging colloid 3.

[0062] In an optional implementation of this embodiment, the LED chip is a green LED chip, and the light emitted by the LED device is green light.

[0063] In an optional implementation of this embodiment, a scattering material 5 is added to the encapsulation colloid, and the scattering material 5 includes two scattering objects, including a first scattering object and a second scattering object, wherein the first scattering object is used to scatter and refract the light emitted by the LED chip, and the second scattering object is used to reflect the light emitted by the LED chip.

[0064] In an optional implementation of this embodiment, the first scattering material is silicon dioxide powder, and the second scattering material is titanium dioxide powder.

[0065] In some embodiments, the main component of the silica powder is silicon dioxide, which mainly functions to scatter and refract the green light emitted by the LED chip.

[0066] The main component of the titanium dioxide is titanium dioxide, and its main function is to reflect the green light emitted by the LED chip.

[0067] In traditional LED devices, scattering materials, such as silica powder, are typically added only to the encapsulant to achieve a certain scattering effect. However, silica powder particles are generally large. If the proportion of scattering material added to the encapsulant is too high, the transparent encapsulant will partially refract the light, resulting in severe light loss and a significant reduction in light output intensity. On the other hand, if the proportion of scattering material added to the encapsulant is too low, the scattering effect is not significant, resulting in a small light spot area and poor display quality. In this embodiment, a mixed scattering material of silica powder and titanium dioxide is added. While the silica powder enhances the scattering and refractive effects, the titanium dioxide particles are small and have a good reflective effect. This allows the light emitted by the LED chip to be reflected as much as possible within the LED device. This increases the light spot area while ensuring a certain light output intensity, effectively improving the display quality.

[0068] In an optional implementation of this embodiment, the normal distribution center particle size of the silicon dioxide powder is 0.7um-1.5um, and the normal distribution center particle size of the titanium dioxide powder is 0.3um-1.2um.

[0069] For example, the normal distribution center particle size of the silicon dioxide powder is 0.8um-1.2um, and the normal distribution center particle size of the titanium dioxide powder is 0.3um-0.5um.

[0070] In an optional implementation of this embodiment, the uniform particle size of the silicon dioxide powder is 0.5um-30um, and the uniform particle size of the titanium dioxide powder is 0.3um-1um.

[0071] For example, the uniform particle size of the silicon dioxide powder is 0.5um-0.56um, and the uniform particle size of the titanium dioxide powder is 0.25um-0.28um.

[0072] As shown in Figure 2, Figure 2 shows a schematic diagram of the particle size distribution of the scattering material in the embodiment of the present application. The exemplary value of the uniform particle size of the above-mentioned silica powder is the particle size of the uniform particles, which means that the particle size of all particles of the added silica powder is the same. When the exemplary value of the uniform particle size of the uniform particles of the silica powder is 0.5um-0.56um, which is close to the wavelength of the green light LED chip of 500nm-560nm, the scattering effect of the silica powder is better. In fact, the particle size of all particles of the first scatterer is normally distributed, and the exemplary value of the normal distribution center particle size of all particles of the silica powder is 0.8um-1.2um. The particle size of all particles of titanium dioxide is also normally distributed, and the exemplary value of the normal distribution center particle size of all particles of titanium dioxide is 0.3um-0.5um.

[0073] Light emitted by the LED chip in an LED device is scattered by silica powder. The intensity of the scattered light is related to the particle size of the silica powder. The larger the particle size, the stronger the scattered light intensity. This is because light scatters during propagation due to the influence of the particles in the propagation medium. As shown in Figure 3, when the wavelength of light is much larger than the particle size of the material, that is, when the ratio is far less than 1, the scattering phenomenon is mainly caused by Rayleigh scattering, and the scattering probability increases exponentially. When the wavelength of light is equal to or close to the particle size of the material, that is, when the ratio is close to 1, the scattering phenomenon is mainly caused by Mie scattering, and the scattering probability approaches its maximum value and tends to be stable. In this embodiment, the uniform particle size of the silica powder is selected from 0.5um-30um, and the normal distribution center particle size is selected from 0.7um-1.5um. At this time, the scattering probability is relatively the largest. If the uniform particle size of the silica powder is too large, the mass concentration of the silica powder needs to be increased to meet the scattering effect. However, too high a mass concentration will lead to the inability to mix and stir during production, uneven distribution, and affect the light output effect. If the uniform particle size of the silica powder is too small, the silica powder particles will easily agglomerate, resulting in poor mixing uniformity, and then poor scattering effect; the uniform particle size of the titanium dioxide is selected from 0.3um-1um, and the normal distribution center particle size is selected from 0.3um-1.2um. At this time, the reflection effect is relatively the largest. If the uniform particle size of the titanium dioxide is too large, it will lead to excessive reflection, resulting in serious light loss, affecting the light output effect. If the uniform particle size of the titanium dioxide is too small, Rayleigh scattering is more, resulting in poor reflection effect, which will also affect the light output effect.

[0074] In an optional implementation of this embodiment, the mass concentration of the silicon dioxide powder is 0.5%-50%, and the mass concentration of the titanium dioxide powder is 0.1%-2%.

[0075] For example, the mass concentration of the silicon dioxide powder is 20%, and the mass concentration of the titanium dioxide powder is 0.5%.

[0076] Selecting exemplary values ​​of the mass concentration of silica powder and titanium dioxide has better scattering and reflection effects. If the mass concentration is too high, it will lead to the inability to mix and stir during production, affecting the uniform mixing with the packaging glue. If the mass concentration is too low, it will lead to poor scattering effect, making the formed light spot area smaller, affecting the light output effect.

[0077] In an optional implementation of this embodiment, when the LED device is turned on, a light spot is formed on the upper surface of the encapsulation body.

[0078] In an optional implementation of this embodiment, the light spot is defined as: when observing from an image point, the ratio of the edge brightness to the center brightness of the luminous surface of the LED device in the same direction is greater than 50%, and the luminous area formed is called a light spot.

[0079] In some embodiments, as shown in Figure 4, Figure 4 shows a schematic structural diagram of the LED device in the embodiment of the present application after being lit. When the LED device is lit, a light spot 4 is formed on the upper surface of the encapsulation colloid 3. The size of the light spot 4 is related to the mass concentration and uniform particle size of the scattering material added to the encapsulation colloid 3 of the LED device.

[0080] In an optional implementation of this embodiment, the light spot 4 includes a first light spot, a second light spot and a third light spot. The area of ​​the first light spot is the area of ​​the light-emitting surface of the LED chip, the area of ​​the second light spot is the area of ​​the rectangular light spot formed on each side of the light-emitting surface of the LED chip, and the area of ​​the third light spot is the area of ​​the light spot circle formed by the light-emitting surface of the LED chip in any direction according to the maximum circle radius.

[0081] In some embodiments, as shown in FIG5 , FIG5 shows a schematic diagram of the light spot area structure after the LED device in the embodiment of the present application is lit. After the LED device is lit, any point on the light-emitting surface of the LED chip 2 emits light in all directions, passes through the encapsulation colloid 3, and forms a plurality of light spot circles on the upper surface of the encapsulation colloid 3, which are superimposed to form a light spot 4. Based on any point on the light-emitting surface of the LED chip 2, light is emitted in all directions. After passing through the encapsulation colloid 3, there are corresponding edge points of the light spot circles on the encapsulation colloid 3, so that the light spot 4 is mainly composed of the first light spot 41, The second light spot 42 and the third light spot 43 are composed of the first light spot 41, the area of ​​the first light spot 41 is the area of ​​the light-emitting surface of the LED chip 2, the area of ​​the second light spot 42 is the area of ​​the rectangular light spot formed on each side of the light-emitting surface of the LED chip 2 (a total of 4 rectangular light spots), and the area of ​​the third light spot 43 is the area of ​​the light spot circle formed by the light-emitting surface of the LED chip in any direction according to the maximum circle radius (a total of 4 quarter-circle light spots), that is, the area of ​​the light spot 4 is obtained by adding the area of ​​the first light spot 41, the area of ​​the second light spot 42 and the area of ​​the third light spot 43.

[0082] The area of ​​the light spot satisfies the following calculation formula: S=S1+S2+S3; S1=ab; S2=2ax+2bx; x=tanθ*h;

[0083] Where S is the area of ​​the light spot, S1 is the area of ​​the first light spot, S2 is the area of ​​the second light spot, S3 is the area of ​​the third light spot, a is the length of the light-emitting surface of the LED chip, b is the width of the light-emitting surface of the LED chip, x is the light spot offset radius, θ is the light spot offset angle, and h is the height from the light-emitting surface of the LED chip to the upper surface of the packaging colloid.

[0084] In an optional implementation of this embodiment, the LED chip is a rectangular chip, and the length a, width b, and height h from the light-emitting surface of the LED chip to the upper surface of the packaging colloid are determined by numerical values. When the light spot offset angle θ is larger, the light spot offset radius x is larger, and the area of ​​the light spot 4 is larger.

[0085] Since in actual situations, the value of the light spot offset radius x is much larger than the length a and width b of the LED chip, the shape of the light spot 4 is approximately circular.

[0086] In this embodiment, a certain proportion of scattering material is added to the packaging colloid of the LED device, so that the visible light emitted by the LED chip is scattered, reflected, and refracted by the added scattering material. The high-brightness light is reflected and refracted in the packaging colloid, and the luminous path of the light emitted from the center of the LED chip is increased, and the intensity is passively reduced. The non-luminous area around the LED chip increases the brightness through the reflected and refracted light, thereby reducing the difference between the luminous intensity of the center of the LED chip and the luminous intensity of the surrounding non-luminous area, that is, the light spot offset angle in the above formula is increased, and then the light spot offset radius is increased, and the area of ​​the light spot is increased, thereby improving the luminous fullness of the LED device and improving the display effect.

[0087] In an optional implementation of this embodiment, the light spot offset angle is positively correlated with the operating current of the LED device.

[0088] Since the light spot is determined by the ratio of the brightness at the edge of the luminous surface to the brightness at the center, and the luminous intensity of the LED chip is proportional to the operating current, at low operating current, there is only a faint light on the surface of the LED chip. At this time, the brightness around the LED chip is quite different from the brightness at the center, and the size of the light spot is only the size of the light emitting surface of the LED chip, that is, ab. At this time, the light spot offset angle is small. When the operating current increases, the light is reflected at the bottom and wall of the cup of the LED device, so that the brightness of the light converged in all directions gradually increases, so that the difference between the brightness around and the brightness at the center is small, the light spot offset angle increases, and the light spot area increases.

[0089] In an optional implementation of this embodiment, as shown in FIG6 and FIG7, as the operating current increases, the light spot offset angle (light spot angle) increases, the light spot offset radius (light spot diameter) increases, and the light spot area increases.

[0090] In an optional implementation of this embodiment, as shown in Figures 8 and 9, after adding scattering material to the encapsulation colloid, under the same operating current, the spot offset angle (spot angle) and the spot offset radius (spot diameter) are both increased compared to when no scattering material is added, that is, after adding the scattering material, the spot area is increased and the display effect is better.

[0091] In an optional implementation of this embodiment, the light spot offset angle is related to the cup depth, cup mouth size and cup inner wall inclination angle of the LED device, wherein the cup depth is positively correlated with the light spot offset angle, the greater the cup depth, the more light reflected by the cup wall, and the larger the light spot area; the larger the cup mouth size, the lower the focus of the light reflected by the cup wall, and the smaller the light spot area; the larger the inclination angle of the cup inner wall, the lower the focus of the light reflected by the cup wall, and the smaller the light spot area.

[0092] In summary, Example 2 of the present application provides an LED device, which adds silica powder for scattering and refraction, and titanium dioxide for reflection, to the packaging colloid of the LED device carrying a small-sized LED chip, and sets a reasonable normal distribution center particle size and mass concentration for the added silica powder and titanium dioxide according to the color of the visible light emitted by the LED chip, so that the visible light emitted by the LED chip causes an appropriate degree of scattering, refraction, and reflection, thereby increasing the light spot offset angle of the LED device, making the light spot area formed on the upper surface of the LED device packaging colloid larger, enhancing the luminous fullness of the LED device, and improving the display effect of the LED product.

[0093] Example 3

[0094] Embodiment 3 of the present application provides an LED device, as shown in FIG1 . FIG1 shows a schematic structural diagram of the LED device in the embodiment of the present application, wherein the LED device includes a supporting bracket 1 on which an LED chip 2 is supported, and the LED chip 2 is surrounded by a packaging colloid 3.

[0095] In an optional implementation of this embodiment, the LED chip is a blue light LED chip, and the light emitted by the LED device is blue light.

[0096] In an optional implementation of this embodiment, a scattering material 5 is added to the encapsulation colloid, and the scattering material 5 includes two scattering objects, including a first scattering object and a second scattering object, wherein the first scattering object is used to scatter and refract the light emitted by the LED chip, and the second scattering object is used to reflect the light emitted by the LED chip.

[0097] In an optional implementation of this embodiment, the first scattering material is silicon dioxide powder, and the second scattering material is titanium dioxide powder.

[0098] In some embodiments, the main component of the silica powder is silicon dioxide, which mainly functions to scatter and refract the blue light emitted by the LED chip.

[0099] The main component of the titanium dioxide is titanium dioxide, and its main effect is to reflect the blue light emitted by the LED chip.

[0100] In traditional LED devices, scattering materials, such as silica powder, are typically added only to the encapsulant to achieve a certain scattering effect. However, silica powder particles are generally large. If the proportion of scattering material added to the encapsulant is too high, the transparent encapsulant will partially refract the light, resulting in severe light loss and a significant reduction in light output intensity. On the other hand, if the proportion of scattering material added to the encapsulant is too low, the scattering effect is not significant, resulting in a small light spot area and poor display quality. In this embodiment, a mixed scattering material of silica powder and titanium dioxide is added. While the silica powder enhances the scattering and refractive effects, the titanium dioxide particles are small and have a good reflective effect. This allows the light emitted by the LED chip to be reflected as much as possible within the LED device. This increases the light spot area while ensuring a certain light output intensity, effectively improving the display quality.

[0101] In an optional implementation of this embodiment, the normal distribution center particle size of the silicon dioxide powder is 0.7um-1.5um, and the normal distribution center particle size of the titanium dioxide powder is 0.3um-1.2um.

[0102] For example, the normal distribution center particle size of the silicon dioxide powder is 0.7um-1.1um, and the normal distribution center particle size of the titanium dioxide powder is 0.8um-1.2um.

[0103] In an optional implementation of this embodiment, the uniform particle size of the silicon dioxide powder is 0.5um-30um, and the uniform particle size of the titanium dioxide powder is 0.3um-1um.

[0104] For example, the uniform particle size of the silicon dioxide powder is 0.43um-0.48um, and the uniform particle size of the titanium dioxide powder is 0.22um-0.24um.

[0105] As shown in Figure 2, Figure 2 shows a schematic diagram of the particle size distribution of the scattering material in the embodiment of the present application. The exemplary value of the uniform particle size of the above-mentioned silica powder is the uniform particle size of the uniform particles, which means that the particle size of all particles of the added silica powder is the same. When the exemplary value of the uniform particle size of the uniform particles of the silica powder is 0.43um-0.48um, which is close to the wavelength of the blue light LED chip of 430nm-480nm, the scattering effect of the silica powder is better. In fact, the particle size of all particles of the silica powder is normally distributed, and the exemplary value of the normal distribution center particle size of all particles of the silica powder is 0.7um-1.1um. The particle size of all particles of titanium dioxide is also normally distributed, and the exemplary value of the normal distribution center particle size of all particles of titanium dioxide is 0.8um-1.2um.

[0106] Light emitted by the LED chip in an LED device is scattered by silica powder. The intensity of the scattered light is related to the particle size of the silica powder. The larger the particle size, the stronger the scattered light intensity. This is because light scatters during propagation due to the influence of the particles in the propagation medium. As shown in Figure 3, when the wavelength of light is much larger than the particle size of the material, that is, when the ratio is far less than 1, the scattering phenomenon is mainly caused by Rayleigh scattering, and the scattering probability increases exponentially. When the wavelength of light is equal to or close to the particle size of the material, that is, when the ratio is close to 1, the scattering phenomenon is mainly caused by Mie scattering, and the scattering probability approaches its maximum value and tends to be stable. In this embodiment, the uniform particle size of the silica powder is selected from 0.5um-30um, and the normal distribution center particle size is selected from 0.7um-1.5um. At this time, the scattering probability is relatively the largest. If the uniform particle size of the silica powder is too large, the mass concentration of the silica powder needs to be increased to meet the scattering effect. However, too high a mass concentration will lead to the inability to mix and stir during production, uneven distribution, and affect the light output effect. If the uniform particle size of the silica powder is too small, the silica powder particles will easily agglomerate, resulting in poor mixing uniformity, and then poor scattering effect; the uniform particle size of the titanium dioxide is selected from 0.3um-1um, and the normal distribution center particle size is selected from 0.3um-1.2um. At this time, the reflection effect is relatively the largest. If the uniform particle size of the titanium dioxide is too large, it will lead to excessive reflection, resulting in serious light loss, affecting the light output effect. If the uniform particle size of the titanium dioxide is too small, Rayleigh scattering is more, resulting in poor reflection effect, which will also affect the light output effect.

[0107] In an optional implementation of this embodiment, the mass concentration of the silicon dioxide powder is 0.5%-50%, and the mass concentration of the titanium dioxide powder is 0.1%-2%.

[0108] For example, the mass concentration of the silicon dioxide powder is 20%, and the mass concentration of the titanium dioxide powder is 0.5%.

[0109] Selecting exemplary values ​​of the mass concentration of silica powder and titanium dioxide has better scattering and reflection effects. If the mass concentration is too high, it will lead to the inability to mix and stir during production, affecting the uniform mixing with the packaging glue. If the mass concentration is too low, it will lead to poor scattering effect, making the formed light spot area smaller, affecting the light output effect.

[0110] In an optional implementation of this embodiment, when the LED device is turned on, a light spot is formed on the upper surface of the encapsulation body.

[0111] In an optional implementation of this embodiment, the light spot is defined as: when observing from an image point, the ratio of the edge brightness to the center brightness of the luminous surface of the LED device in the same direction is greater than 50%, and the luminous area formed is called a light spot.

[0112] In some embodiments, as shown in Figure 4, Figure 4 shows a schematic structural diagram of the LED device in the embodiment of the present application after being lit. When the LED device is lit, a light spot 4 is formed on the upper surface of the encapsulation colloid 3. The size of the light spot 4 is related to the mass concentration and uniform particle size of the scattering material added to the encapsulation colloid 3 of the LED device.

[0113] In an optional implementation of this embodiment, the light spot 4 includes a first light spot, a second light spot and a third light spot. The area of ​​the first light spot is the area of ​​the light-emitting surface of the LED chip, the area of ​​the second light spot is the area of ​​the rectangular light spot formed on each side of the light-emitting surface of the LED chip, and the area of ​​the third light spot is the area of ​​the light spot circle formed by the light-emitting surface of the LED chip in any direction according to the maximum circle radius.

[0114] In some embodiments, as shown in FIG5 , FIG5 shows a schematic diagram of the light spot area structure after the LED device in the embodiment of the present application is lit. After the LED device is lit, any point on the light-emitting surface of the LED chip 2 emits light in all directions, passes through the encapsulation colloid 3, and forms a plurality of light spot circles on the upper surface of the encapsulation colloid 3, which are superimposed to form a light spot 4. Based on any point on the light-emitting surface of the LED chip 2, light is emitted in all directions. After passing through the encapsulation colloid 3, there are corresponding edge points of the light spot circles on the encapsulation colloid 3, so that the light spot 4 is mainly composed of the first light spot 41, The second light spot 42 and the third light spot 43 are composed of the area of ​​the first light spot 41 being the area of ​​the light-emitting surface of the LED chip 2, the area of ​​the second light spot 42 being the area of ​​the rectangular light spot formed on each side of the light-emitting surface of the LED chip 2 (a total of 4 rectangular light spots), and the area of ​​the third light spot 43 being the area of ​​the light spot circle formed by the light-emitting surface of the LED chip in any direction according to the maximum circle radius (a total of 4 quarter-circle light spots), that is, the area of ​​the light spot 4 is obtained by adding the area of ​​the first light spot 41, the area of ​​the second light spot 42 and the area of ​​the third light spot 43.

[0115] The area of ​​the light spot satisfies the following calculation formula: S=S1+S2+S3; S1=ab; S2=2ax+2bx; x=tanθ*h;

[0116] Where S is the area of ​​the light spot, S1 is the area of ​​the first light spot, S2 is the area of ​​the second light spot, S3 is the area of ​​the third light spot, a is the length of the light-emitting surface of the LED chip, b is the width of the light-emitting surface of the LED chip, x is the light spot offset radius, θ is the light spot offset angle, and h is the height from the light-emitting surface of the LED chip to the upper surface of the packaging colloid.

[0117] In an optional implementation of this embodiment, the LED chip is a rectangular chip, and the length a, width b, and height h from the light-emitting surface of the LED chip to the upper surface of the packaging colloid are determined by numerical values. When the light spot offset angle θ is larger, the light spot offset radius x is larger, and the area of ​​the light spot 4 is larger.

[0118] Since in actual situations, the value of the light spot offset radius x is much larger than the length a and width b of the LED chip, the shape of the light spot 4 is approximately circular.

[0119] In this embodiment, a certain proportion of scattering material is added to the packaging colloid of the LED device, so that the visible light emitted by the LED chip is scattered, reflected, and refracted by the added scattering material. The high-brightness light is reflected and refracted in the packaging colloid, and the luminous path of the light emitted from the center of the LED chip is increased, and the intensity is passively reduced. The non-luminous area around the LED chip increases the brightness through the reflected and refracted light, thereby reducing the difference between the luminous intensity of the center of the LED chip and the luminous intensity of the surrounding non-luminous area, that is, the light spot offset angle in the above formula is increased, and then the light spot offset radius is increased, and the area of ​​the light spot is increased, thereby improving the luminous fullness of the LED device and improving the display effect.

[0120] In an optional implementation of this embodiment, the light spot offset angle is positively correlated with the operating current of the LED device.

[0121] Since the light spot is determined by the ratio of the brightness at the edge of the luminous surface to the brightness at the center, and the luminous intensity of the LED chip is proportional to the operating current, at low operating current, there is only a faint light on the surface of the LED chip. At this time, the brightness around the LED chip is quite different from the brightness at the center, and the size of the light spot is only the size of the light emitting surface of the LED chip, that is, ab. At this time, the light spot offset angle is small. When the operating current increases, the light is reflected at the bottom and wall of the cup of the LED device, so that the brightness of the light converged in all directions gradually increases, so that the difference between the brightness around and the brightness at the center is small, the light spot offset angle increases, and the light spot area increases.

[0122] In an optional implementation of this embodiment, as shown in FIG6 and FIG7, as the operating current increases, the light spot offset angle (light spot angle) increases, the light spot offset radius (light spot diameter) increases, and the light spot area increases.

[0123] In an optional implementation of this embodiment, as shown in Figures 8 and 9, after adding scattering material to the encapsulation colloid, under the same operating current, the spot offset angle (spot angle) and the spot offset radius (spot diameter) are both increased compared to when no scattering material is added, that is, after adding the scattering material, the spot area is increased and the display effect is better.

[0124] In an optional implementation of this embodiment, the light spot offset angle is related to the cup depth, cup mouth size and cup inner wall inclination angle of the LED device, wherein the cup depth is positively correlated with the light spot offset angle, the greater the cup depth, the more light reflected by the cup wall, and the larger the light spot area; the larger the cup mouth size, the lower the focus of the light reflected by the cup wall, and the smaller the light spot area; the larger the inclination angle of the cup inner wall, the lower the focus of the light reflected by the cup wall, and the smaller the light spot area.

[0125] In summary, Example 3 of the present application provides an LED device, which adds silica powder for scattering and refraction, and titanium dioxide for reflection, to the packaging colloid of the LED device carrying a small-sized LED chip, and sets a reasonable normal distribution center particle size and mass concentration for the added silica powder and titanium dioxide according to the color of the visible light emitted by the LED chip, so that the visible light emitted by the LED chip causes an appropriate degree of scattering, refraction, and reflection, thereby increasing the light spot offset angle of the LED device, making the light spot area formed on the upper surface of the LED device packaging colloid larger, enhancing the luminous fullness of the LED device, and improving the display effect of the LED product.

[0126] Example 4

[0127] Embodiment 4 of the present application provides an LED device, as shown in FIG1 . FIG1 shows a schematic structural diagram of the LED device in the embodiment of the present application, wherein the LED device includes a supporting bracket 1 on which an LED chip 2 is supported, and the LED chip 2 is surrounded by a packaging colloid 3.

[0128] In an optional implementation of this embodiment, the LED chip is a blue LED chip or a purple LED chip, and the light emitted by the LED device is white light.

[0129] In an optional implementation of this embodiment, a scattering material 5 is added to the encapsulation colloid, and the scattering material 5 includes two scattering objects, including a first scattering object and a second scattering object, wherein the first scattering object is used to scatter and refract the light emitted by the LED chip, and the second scattering object is used to reflect the light emitted by the LED chip.

[0130] In an optional implementation of this embodiment, the first scatterer is phosphor, and the second scatterer is titanium dioxide.

[0131] In some embodiments, the phosphor mainly functions to scatter and refract the white light emitted by the LED chip.

[0132] The main component of the titanium dioxide is titanium dioxide, and its main function is to reflect the white light emitted by the LED chip.

[0133] In traditional LED devices, only scattering materials that provide scattering and refraction effects are typically added to the encapsulant to achieve a certain scattering effect. However, these scattering materials are generally large in size. If the proportion of scattering materials added to the encapsulant is too high, the transparent encapsulant will partially refract the light, resulting in severe light loss and a significant reduction in light output intensity. On the other hand, if the proportion of scattering materials added to the encapsulant is too low, the scattering effect is not significant, resulting in a small light spot area and poor display quality. In this embodiment, a mixed scattering material of phosphor and titanium dioxide is added. While the phosphor enhances the scattering and refraction effects, the titanium dioxide particles are small and have a good reflective effect. This allows the light emitted by the LED chip to be reflected as much as possible within the LED device. This increases the light spot area while ensuring a certain light output intensity, effectively improving the display quality.

[0134] In an optional implementation of this embodiment, when the LED device is turned on, a light spot is formed on the upper surface of the encapsulation body.

[0135] In an optional implementation of this embodiment, the light spot is defined as: when observing from an image point, the ratio of the edge brightness to the center brightness of the luminous surface of the LED device in the same direction is greater than 50%, and the luminous area formed is called a light spot.

[0136] In some embodiments, as shown in Figure 4, Figure 4 shows a schematic structural diagram of the LED device in the embodiment of the present application after being lit. When the LED device is lit, a light spot 4 is formed on the upper surface of the encapsulation colloid 3. The size of the light spot 4 is related to the mass concentration and uniform particle size of the scattering material added to the encapsulation colloid 3 of the LED device.

[0137] In an optional implementation of this embodiment, the light spot 4 includes a first light spot, a second light spot and a third light spot. The area of ​​the first light spot is the area of ​​the light-emitting surface of the LED chip, the area of ​​the second light spot is the area of ​​the rectangular light spot formed on each side of the light-emitting surface of the LED chip, and the area of ​​the third light spot is the area of ​​the light spot circle formed by the light-emitting surface of the LED chip in any direction according to the maximum circle radius.

[0138] In some embodiments, as shown in FIG5 , FIG5 shows a schematic diagram of the light spot area structure after the LED device in the embodiment of the present application is lit. After the LED device is lit, any point on the light-emitting surface of the LED chip 2 emits light in all directions, passes through the encapsulation colloid 3, and forms a plurality of light spot circles on the upper surface of the encapsulation colloid 3, which are superimposed to form a light spot 4. Based on any point on the light-emitting surface of the LED chip 2, light is emitted in all directions. After passing through the encapsulation colloid 3, there are corresponding edge points of the light spot circles on the encapsulation colloid 3, so that the light spot 4 is mainly composed of the first light spot 41, The second light spot 42 and the third light spot 43 are composed of the area of ​​the first light spot 41 being the area of ​​the light-emitting surface of the LED chip 2, the area of ​​the second light spot 42 being the area of ​​the rectangular light spot formed on each side of the light-emitting surface of the LED chip 2 (a total of 4 rectangular light spots), and the area of ​​the third light spot 43 being the area of ​​the light spot circle formed by the light-emitting surface of the LED chip in any direction according to the maximum circle radius (a total of 4 quarter-circle light spots), that is, the area of ​​the light spot 4 is obtained by adding the area of ​​the first light spot 41, the area of ​​the second light spot 42 and the area of ​​the third light spot 43.

[0139] The area of ​​the light spot satisfies the following calculation formula: S=S1+S2+S3; S1=ab; S2=2ax+2bx; x=tanθ*h;

[0140] Where S is the area of ​​the light spot, S1 is the area of ​​the first light spot, S2 is the area of ​​the second light spot, S3 is the area of ​​the third light spot, a is the length of the light-emitting surface of the LED chip, b is the width of the light-emitting surface of the LED chip, x is the light spot offset radius, θ is the light spot offset angle, and h is the height from the light-emitting surface of the LED chip to the upper surface of the packaging colloid.

[0141] In an optional implementation of this embodiment, the LED chip is a rectangular chip, and the length a, width b, and height h from the light-emitting surface of the LED chip to the upper surface of the packaging colloid are determined by numerical values. When the light spot offset angle θ is larger, the light spot offset radius x is larger, and the area of ​​the light spot 4 is larger.

[0142] Since in actual situations, the value of the light spot offset radius x is much larger than the length a and width b of the LED chip, the shape of the light spot 4 is approximately circular.

[0143] In this embodiment, a certain proportion of scattering material is added to the packaging colloid of the LED device, so that the visible light emitted by the LED chip is scattered, reflected, and refracted by the added scattering material. The high-brightness light is reflected and refracted in the packaging colloid, and the luminous path of the light emitted from the center of the LED chip is increased, and the intensity is passively reduced. The non-luminous area around the LED chip increases the brightness through the reflected and refracted light, thereby reducing the difference between the luminous intensity of the center of the LED chip and the luminous intensity of the surrounding non-luminous area, that is, the light spot offset angle in the above formula is increased, and then the light spot offset radius is increased, and the area of ​​the light spot is increased, thereby improving the luminous fullness of the LED device and improving the display effect.

[0144] In an optional implementation of this embodiment, the light spot offset angle is positively correlated with the operating current of the LED device.

[0145] Since the light spot is determined by the ratio of the brightness at the edge of the luminous surface to the brightness at the center, and the luminous intensity of the LED chip is proportional to the operating current, at low operating current, there is only a faint light on the surface of the LED chip. At this time, the brightness around the LED chip is quite different from the brightness at the center, and the size of the light spot is only the size of the light emitting surface of the LED chip, that is, ab. At this time, the light spot offset angle is small. When the operating current increases, the light is reflected at the bottom and wall of the cup of the LED device, so that the brightness of the light converged in all directions gradually increases, so that the difference between the brightness around and the brightness at the center is small, the light spot offset angle increases, and the light spot area increases.

[0146] In an optional implementation of this embodiment, as shown in FIG6 and FIG7, as the operating current increases, the light spot offset angle (light spot angle) increases, the light spot offset radius (light spot diameter) increases, and the light spot area increases.

[0147] In an optional implementation of this embodiment, as shown in Figures 8 and 9, after adding scattering material to the encapsulation colloid, under the same operating current, the spot offset angle (spot angle) and the spot offset radius (spot diameter) are both increased compared to when no scattering material is added, that is, after adding the scattering material, the spot area is increased and the display effect is better.

[0148] In an optional implementation of this embodiment, the light spot offset angle is related to the cup depth, cup mouth size and cup inner wall inclination angle of the LED device, wherein the cup depth is positively correlated with the light spot offset angle, the greater the cup depth, the more light reflected by the cup wall, and the larger the light spot area; the larger the cup mouth size, the lower the focus of the light reflected by the cup wall, and the smaller the light spot area; the larger the inclination angle of the cup inner wall, the lower the focus of the light reflected by the cup wall, and the smaller the light spot area.

[0149] In summary, Example 4 of the present application provides an LED device, which adds phosphor for scattering and refraction, and titanium dioxide for reflection, into the packaging colloid of the LED device carrying a small-sized LED chip, so that the visible light emitted by the LED chip causes an appropriate degree of scattering, refraction, and reflection, thereby increasing the light spot offset angle of the LED device, making the light spot area formed on the upper surface of the LED device packaging colloid larger, enhancing the luminous fullness of the LED device, and improving the display effect of the LED product.

[0150] Example 5

[0151] Embodiment 5 of the present application provides a method for manufacturing an LED device, which is used to manufacture the LED devices of Embodiment 1, Embodiment 2, Embodiment 3, and Embodiment 4. The manufacturing method includes: placing an LED chip on a supporting bracket; preparing packaging glue, and adding a preset proportion of scattering material to the prepared packaging glue; vacuum stirring the packaging glue after adding the scattering material; centrifuging the packaging glue after vacuum stirring; and dispensing and packaging the LED chip based on the packaging glue after centrifugation to form a packaging colloid to manufacture the LED device.

[0152] In an optional implementation of this embodiment, as shown in FIG10 , FIG10 shows a flow chart of a method for manufacturing an LED device in an embodiment of the present application, comprising the following steps:

[0153] S101: placing LED chips on a supporting bracket;

[0154] In an optional implementation of this embodiment, according to actual design requirements, a red LED chip, a green LED chip, a blue LED chip, or a purple LED chip is placed at a corresponding position of the supporting bracket.

[0155] S102: preparing packaging glue, and adding a scattering material of a preset proportion into the prepared packaging glue;

[0156] In an optional implementation of this embodiment, packaging glue is prepared, and a scattering material in a preset proportion is added to the prepared packaging glue according to the type of the LED chip provided.

[0157] For example, when the LED chip is a red light LED chip, silica powder and titanium dioxide are added to the finished packaging glue, wherein the mass concentration of silica powder is 20%, the mass concentration of titanium dioxide is 0.5%, the normal distribution center particle size of silica powder is 1um-1.5um, and the normal distribution center particle size of titanium dioxide is 0.3um-0.5um.

[0158] When the LED chip is a green light LED chip, silica powder and titanium dioxide are added to the finished packaging glue, wherein the mass concentration of silica powder is 20%, the mass concentration of titanium dioxide is 0.5%, the normal distribution center particle size of silica powder is 0.8um-1.2um, and the normal distribution center particle size of titanium dioxide is 0.3um-0.5um.

[0159] When the LED chip is a blue light LED chip, silica powder and titanium dioxide are added to the prepared packaging glue, wherein the mass concentration of silica powder is 20%, the mass concentration of titanium dioxide is 0.5%, the normal distribution center particle size of silica powder is 0.7um-1.1um, and the normal distribution center particle size of titanium dioxide is 0.8um-1.2um.

[0160] When the LED chip is a blue LED chip or a purple LED chip, phosphor and titanium dioxide are added to the finished packaging glue.

[0161] S103: vacuum stirring the packaging glue after adding the scattering material;

[0162] In an optional implementation of this embodiment, the packaging glue to which a certain proportion of scattering material is added is vacuum stirred to ensure that the scattering material is evenly mixed in the packaging glue.

[0163] S104: centrifuging the encapsulated glue after vacuum stirring;

[0164] In an optional implementation of this embodiment, the packaging glue that has been uniformly stirred under vacuum is centrifuged in a centrifuge at 1200-2300 rpm.

[0165] Due to the large amount of scattering materials added, the surface fluidity is poor, and there will be unevenness after the encapsulation colloid is formed. The centrifugal operation here can increase the fluidity of the encapsulation glue and achieve a smooth surface of the encapsulation colloid formed by the LED device.

[0166] S105: performing dispensing and packaging of the LED chip based on the packaging glue after centrifugation to form a packaging colloid to manufacture an LED device.

[0167] In summary, Example 5 of the present application provides a method for manufacturing an LED device, which is used to manufacture the LED devices in Example 1, Example 2, Example 3, and Example 4. According to the color of the visible light emitted by the LED chip, silica powder or phosphor for scattering and refraction, and titanium dioxide for reflection are added to the packaging colloid of the LED device carrying a small-sized LED chip, and a reasonable normal distribution center particle size and mass concentration are set for the added silica powder and titanium dioxide, so that the visible light emitted by the LED chip causes an appropriate degree of scattering, refraction, and reflection, thereby increasing the light spot offset angle of the LED device, making the light spot area formed on the upper surface of the LED device packaging colloid larger, enhancing the luminous fullness of the LED device, and improving the display effect of the LED product.

[0168] Example 6

[0169] Embodiment 6 of the present application provides an LED panel, which includes the LED devices in Embodiment 1, Embodiment 2, Embodiment 3, and Embodiment 4.

[0170] In some embodiments, the LED panel further includes a substrate 6. Placing the LED devices on the substrate 6 can enhance the structural stability of the LED panel. In other embodiments, the LED panel further includes a control component, which can be placed on the front or back of the substrate 6 to adjust the brightness of the LED panel.

[0171] In summary, Example 6 of the present application provides an LED panel, which includes the LED devices in Example 1, Example 2, Example 3, and Example 4. Silica powder or phosphor for scattering and refraction, and titanium dioxide for reflection are added to the packaging colloid of the LED device carrying a small-size LED chip, and a reasonable normal distribution center particle size and mass concentration are set for the added silica powder and titanium dioxide according to the color of the visible light emitted by the LED chip, so that the visible light emitted by the LED chip causes an appropriate degree of scattering, refraction, and reflection, thereby increasing the light spot offset angle of the LED device, making the light spot area formed on the upper surface of the LED device packaging colloid larger, enhancing the luminous fullness of the LED device, and improving the display effect of the LED product.

Claims

1. An LED device, the LED device includes a carrier bracket, an LED chip is carried on the carrier bracket, and the periphery of the LED chip is coated with encapsulation colloid; The encapsulating colloid is added with a scattering material, the scattering material includes more than two kinds of scatterers, the more than two kinds of scatterers include a first scatterer and a second scatterer, wherein, The first scatterer is used for scattering and refracting the light emitted by the LED chip, and the second scatterer is used for reflecting the light emitted by the LED chip.

2. The LED device according to claim 1, wherein, The LED chip is a red LED chip, or the LED chip is a green LED chip, or the LED chip is a blue LED chip, or the LED chip is a violet LED chip.

3. The LED device according to claim 2, wherein, When the LED chip is a red LED chip or a green LED chip or a blue LED chip, the first scatterer is silica powder, and the second scatterer is titanium dioxide powder.

4. The LED device according to claim 3, wherein, The median particle size of the silica powder in the normal distribution is between 0.7 micrometers and 1.5 micrometers, and the median particle size of the titanium dioxide powder in the normal distribution is between 0.3 micrometers and 1.2 micrometers.

5. The LED device according to claim 3, wherein, The mass concentration of the silica powder is between 0.5% and 50%, and the mass concentration of the titanium dioxide powder is between 0.1% and 2%.

6. The LED device according to claim 2, wherein, When the LED chip is a blue LED chip or a violet LED chip, the first scatterer is phosphor powder, and the second scatterer is titanium dioxide powder.

7. The LED device according to claim 1, wherein, When the LED device is lit, a light spot is formed on the upper surface of the encapsulation colloid. The light spot includes a first light spot, a second light spot and a third light spot. The area of the first light spot is the area of the light-emitting surface of the LED chip. The area of the second light spot is the area of the rectangular light spot formed by the light-emitting surface of the LED chip on each side. The area of the third light spot is the area of the light spot circle formed by the light-emitting surface of the LED chip in any direction according to the maximum circle radius.

8. The LED device according to claim 7, wherein, The area of the light spot satisfies the following calculation formula: S = S1 + S2 + S3; S1 = ab; S2 = 2ax + 2bx; x = tanθ * h; Wherein, S is the area of the light spot, S1 is the area of the first light spot, S2 is the area of the second light spot, S3 is the area of the third light spot, a is the length of the light-emitting surface of the LED chip, b is the width of the light-emitting surface of the LED chip, x is the offset radius of the light spot, θ is the offset angle of the light spot, and h is the height from the light-emitting surface of the LED chip to the upper surface of the encapsulation colloid.

9. A manufacturing method of an LED device, the manufacturing method of the LED device is used to manufacture the LED device according to any one of claims 1-8, and the manufacturing method includes: Placing an LED chip on a carrier bracket; Manufacturing encapsulation glue and adding a preset proportion of scattering material to the manufactured encapsulation glue; Performing vacuum stirring on the encapsulation glue added with the scattering material; Centrifuging the encapsulation glue after being evenly stirred by vacuum; Performing dispensing encapsulation on the LED chip based on the encapsulation glue after centrifugation to form an encapsulation colloid and manufacturing an LED device.

10. An LED panel, the LED panel is provided with the LED device according to any one of claims 1-8, and the LED panel further includes a substrate, and the LED device is placed on the substrate.

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