Circuit board assembly and electronic device

Abstract

The present application relates to the field of electronic products, and discloses a circuit board assembly and an electronic device. The circuit board assembly comprises a circuit board body, first functional devices, a second functional device and a telephone receiver; a recess is formed in the board surface of the circuit board body, and the first functional devices are arranged in the recess; a first boss is further provided on the board surface of the circuit board body, and the second functional device is arranged on the first boss; a cavity is formed in the circuit board body, the telephone receiver is arranged on the sidewall of the circuit board body, and a sound cavity of the telephone receiver is communicated with the cavity.

Description

Circuit board assemblies and electronic devices

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to the Chinese patent application filed with the China Patent Office on December 28, 2023, with application number 202311843735.6 and invention name “Circuit Board Assembly and Electronic Device”. The entire contents of the Chinese patent application are incorporated herein by reference. Technical Field

[0003] The present application belongs to the technical field of electronic products, and specifically relates to a circuit board assembly and an electronic device. Background Art

[0004] As the signal transmission frequency of 5G terminals (mobile phones, smart wearables, tablets, etc.) increases and the number of achievable functions continues to increase, the antenna area, the number of components, and the layout area of ​​components on the printed circuit board (PCB) are also increasing. Due to the overall size of 5G terminals (mobile phones, smart wearables, tablets, etc.) and battery space, the PCB layout area is becoming increasingly stretched. At the same time, multi-layer stacked PCB technology (multi-layer stacked PCB: multiple PCBs with components mounted on them are stacked vertically together through welding and other methods, using the vertical space of the terminal to increase the PCB layout area) came into being.

[0005] The multi-layer stacked PCB technology commonly used in 5G terminals (for example, motherboard + frame board + antenna board; motherboard + spacer board) has a complex soldering process and numerous interfaces after soldering, which increases application costs and reduces the reliability and durability of the entire device, affecting product reputation. Consequently, a cavity PCB (printed circuit board with a cavity structure) stacking technology has been developed and rapidly adopted, offering a simpler application process, lower costs, fewer interfaces, and improved reliability and durability.

[0006] To address the issue of excessive height for some components, the prior art employed a reverse patch-on-chip method after breaking the board. While this approach met the need for localized thinning, it also introduced issues such as poor reliability and strength across multiple interfaces and complex production processes. Summary of the Invention

[0007] The purpose of the embodiments of the present application is to provide a circuit board assembly and an electronic device that can solve the problems of poor reliability and strength, complex production process, etc. caused by thinning products in related technologies.

[0008] An embodiment of the present application provides a circuit board assembly, comprising: a circuit board body, a first functional component, a second functional component, and a receiver;

[0009] The board surface of the circuit board body is provided with a groove, and the first functional component is provided in the groove;

[0010] The board surface of the circuit board body is further provided with a first boss, and the second functional device is provided on the first boss;

[0011] A cavity is provided in the circuit board body, the receiver is arranged on the side wall of the circuit board body, and the sound cavity of the receiver is communicated with the cavity.

[0012] An embodiment of the present application further provides an electronic device, comprising a frame and the above-mentioned circuit board assembly;

[0013] The circuit board assembly is arranged in the space enclosed by the frame;

[0014] The circuit board assembly includes a power device, which is arranged on the end surface of the circuit board body and contacts the frame.

[0015] The circuit board assembly in the embodiment of the present application, by providing a groove on the surface of the circuit board body, can reduce the local thickness of the circuit board body. In this way, when the first functional device is arranged in the groove, the first functional device can be sunken, thereby reducing the thickness bottleneck of the entire structure. In addition, the sidewalls of the groove can also protect the first functional device, while also reducing interference with the signal, reducing signal insertion loss and reflection, and improving the integrity of signal transmission. By providing a first boss on the surface of the circuit board body, the second functional device can be supported and elevated to meet the installation requirements of the second functional device. By providing a cavity in the circuit board body, the cavity can be used to expand the sound cavity of the receiver, thereby improving the audio effect. Compared with the method of reverse patch transfer after breaking the board in the related art, the circuit board assembly in the embodiment of the present application can not only locally thin the circuit board assembly, but also avoid the situation of multi-interface welding, thereby alleviating the problems of poor reliability and complex process caused by multi-interface welding. In addition, it can also meet the installation requirements of some functional devices and improve the audio effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] FIG1 is a schematic structural diagram of a circuit board assembly disclosed in an embodiment of the present application;

[0017] FIG2 is a schematic structural diagram of a circuit board assembly with electrical components removed according to an embodiment of the present application;

[0018] FIG3 is a schematic cross-sectional view along AA in FIG2 ;

[0019] FIG4 is a schematic cross-sectional view along line BB in FIG2 ;

[0020] FIG5 is a schematic cross-sectional view along CC in FIG2 ;

[0021] FIG6 is a schematic cross-sectional view along line DD in FIG2 ;

[0022] FIG7 is a schematic structural diagram of the circuit board assembly and the frame disclosed in the embodiment of the application.

[0023] Explanation of the reference numerals: 100 - circuit board body; 110 - first circuit board; 111 - first groove; 112 - first boss; 113 - second boss; 114 - edge; 120 - second circuit board; 121 - second groove; 122 - avoidance hole; 123 - cavity; 124 - sound hole; 131 - first electrical connector; 132 - third electrical connector; 133 - fifth electrical connector; 210 - first functional component; 211 - second electrical connector; 220 - second functional component; 230 - receiver; 240 - power component; 250 - third functional component; 300 - frame. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0025] The terms "first," "second," and the like in the specification and claims of this application are used to distinguish similar objects, and are not used to describe a specific order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate, so that the embodiments of this application can be implemented in an order other than that illustrated or described herein, and that the objects distinguished by "first," "second," and the like are generally of the same type, and do not limit the number of objects; for example, the first object can be one or more. In addition, the term "and / or" in the specification and claims refers to at least one of the connected objects, and the character " / " generally indicates that the objects connected are in an "or" relationship.

[0026] The embodiments of the present application are described in detail below through specific embodiments and their application scenarios in conjunction with the accompanying drawings.

[0027] With reference to Figures 1 to 7 , embodiments of the present application disclose a circuit board assembly. This circuit board assembly can be used in electronic devices such as mobile phones, tablet computers, and wearable devices. Of course, other devices are also applicable, and are not specifically limited herein. The disclosed circuit board assembly includes a circuit board body 100, a first functional device 210, a second functional device 220, and a receiver 230.

[0028] The circuit board body 100 is a basic component that provides a mounting base for the first functional device 210, the second functional device 220, and the receiver 230. In some embodiments, a recess is defined on the surface of the circuit board body 100, and the first functional device 210 is positioned within the recess. This recess reduces the thickness of the circuit board body 100 at that location. This allows the first functional device 210 to be installed in the recess, allowing at least a portion of the first functional device 210 to reside within the recess. This effectively reduces the overall thickness of the first functional device 210 and the circuit board body 100, thinning the entire circuit board assembly.

[0029] It should be noted that at least a portion of the first functional device 210 is disposed within the groove, which may include: first, the entire first functional device 210 is completely located within the groove in the thickness direction of the circuit board assembly. In this case, the overall thickness of the circuit board assembly at this location is the thickness of the circuit board body 100 at this location; second, a portion of the first functional device 210 is located within the groove in the thickness direction of the circuit board assembly, while another portion protrudes from the notch of the groove. In this case, the overall thickness of the circuit board assembly at this location is the sum of the thickness of the circuit board body 100 at this location and the thickness of the first functional device 210 protruding from the notch. Both of the above methods can effectively reduce the overall thickness of the circuit board assembly in the area where the first functional device 210 is disposed, and can also provide a certain degree of protection for the first functional device 210 by wrapping at least a portion of the first functional device 210 with the sidewalls of the groove.

[0030] Optionally, the first functional device 210 may be a connector (such as a BTB connector), a chip, a camera, a stress-sensitive device, a signal transmission device, etc. When the first functional device 210 is a connector or a chip, the patch can be sunken to improve its stability. When the first functional device 210 is a camera, it can be sunken to avoid space, thereby providing a recess for the camera. Furthermore, the thickness of the circuit board assembly can be reduced to prevent it from being too thick at this location and affecting the size of the entire electronic device.

[0031] In addition, when the first functional device 210 is a stress-sensitive device, such as a glass chip, the stress-sensitive device can be protected by placing the stress-sensitive device in the groove. For example, the stress-sensitive device can be sunk into the groove and then fixed by gluing or injection molding.

[0032] When the first functional device 210 is a signal transmission device, placing the signal transmission device in the groove can help to ensure the integrity of high-frequency signal transmission. For example, directly sinking the 5G millimeter wave antenna chip into the Faraday cage signal layer can reduce high-frequency signal insertion loss and reflection, thereby helping to improve the transmission integrity of high-frequency signals.

[0033] Furthermore, to ensure a reliable connection between the first functional device 210 and the circuit board body 100, a first electrical connector 131 is provided at the bottom of the groove. Accordingly, the first functional device 210 is provided with a second electrical connector 211. When at least a portion of the first functional device 210 is disposed within the groove, the second electrical connector 211 is electrically connected to the first electrical connector 131. This arrangement ensures a stable connection between the second electrical connector 211 and the first electrical connector 131, as the groove secures the first functional device 210. This, in turn, ensures stable signal transmission between the first functional device 210 and the circuit board body 100.

[0034] Exemplarily, the first electrical connector 131 may be a solder pad, and the second electrical connector 211 may be a pin. When at least a portion of the first functional device 210 is disposed in the groove, the pin is in corresponding contact with the solder pad. Then, the pin can be soldered to the solder pad by welding to ensure the firmness and stability of the connection between the pin and the solder pad.

[0035] In other embodiments, the first electrical connector 131 may also be a metal sheet, such as a copper sheet, and the second electrical connector 211 may be a pin, which is welded to the metal sheet. In this case, the stability and firmness of the connection between the second electrical connector 211 and the first electrical connector 131 can also be ensured.

[0036] Alternatively, the first electrical connector 131 can be located at the bottom wall of the groove, and accordingly, the second electrical connector 211 can be located on the side of the first functional device 210 facing the circuit board body 100. Alternatively, the first electrical connector 131 can be located on the side wall of the groove close to the bottom wall, and accordingly, the second electrical connector 211 can be located on the side of the first functional device 210. In either of these approaches, a good connection between the second electrical connector 211 and the first electrical connector 131 can be ensured while at least a portion of the first functional device 210 is located within the groove.

[0037] Exemplarily, the shape of the groove can be designed according to the shape of the first functional device 210, and can be a polygonal groove, such as a square groove, a rectangular groove, a triangular groove, a trapezoidal groove, etc.; it can also be a circular groove, an elliptical groove, etc., and the specific shape is not specifically limited.

[0038] In addition, the depth of the groove can also be designed according to the size of the first functional device 210 so that at least a portion of the first functional device 210 can be embedded in the groove.

[0039] In an embodiment of the present application, the board surface of the circuit board body 100 may also be provided with a first boss 112, as shown in Figure 5, and the second functional device 220 is provided on the first boss 112. Some second functional devices 220 that need to be supported and raised can be installed through the first boss 112 to ensure their actual needs.

[0040] The second functional device 220 may be an antenna, an infrared device, a photosensitive device, a structured light device, a camera, etc., and may be supported and elevated by the first boss 112 , which is beneficial to improving the signal quality transmitted by each device.

[0041] When the second functional component 220 is a camera, when the camera is elevated by the first boss 112 , the dimensional accuracy can be improved, which is beneficial to improving the resolution of the camera, thereby enhancing the user's photography experience.

[0042] When the second functional device 220 is an antenna, when the antenna is raised by the first boss 112, the antenna clearance area can be increased, which is beneficial to improving the signal quality transmitted by the antenna device, and can effectively alleviate the signal transmission loss problem at the welding position of the current solution, which is beneficial to improving the signal transmission integrity and is more suitable for 5G millimeter wave and 6G high-frequency communication fields.

[0043] Based on the above settings, the embodiment of the present application can support and raise the second functional device 220 by setting the first boss 112, which is beneficial to improving the structural strength and dimensional accuracy of the second functional device 220, and can meet the needs of precision applications, and can also improve signal integrity to improve signal integrity.

[0044] To achieve signal transmission, the first boss 112 can also be provided with a third electrical connector 132, and the second functional device 220 can be provided with a fourth electrical connector (not shown in the figure). In this way, when the second functional device 220 is provided on the first boss 112, the third electrical connector 132 is electrically connected to the fourth electrical connector. In this way, a stable connection can be ensured between the second functional device 220 and the circuit board body 100, thereby ensuring the stability of signal transmission between the second functional device 220 and the circuit board body 100.

[0045] In some embodiments, the third electrical connector 132 may be a soldering pad. In this case, the fourth electrical connector may be soldered to the soldering pad to ensure the firmness and stability of the connection between the fourth electrical connector and the soldering pad.

[0046] In other embodiments, the third electrical connector 132 may also be a metal sheet, such as a copper sheet, and the fourth electrical connector may be welded to the metal sheet. In this case, the stability and firmness of the connection between the fourth electrical connector and the third electrical connector 132 may also be ensured.

[0047] For example, the third electrical connector 132 may be located at the protruding end surface of the first boss 112 , and correspondingly, the fourth electrical connector may be provided on the side of the second functional component 220 facing the circuit board body 100 .

[0048] In the embodiment of the present application, a cavity 123 is provided in the circuit board body 100 , and the receiver 230 is provided on the side wall of the circuit board body 100 , and the sound cavity of the receiver 230 is connected to the cavity 123 to play a cavity expansion role.

[0049] 2 , in an embodiment of the present application, the circuit board assembly may further include an audio device, which is disposed at an end of the circuit board body 100. For example, the audio device may be a receiver 230, a speaker, or the like. This embodiment of the present application uses the receiver 230 as an example for explanation.

[0050] To enhance the audio effect, a cavity 123 may be provided in the circuit board body 100. The wall of the cavity 123 is provided with a sound hole 124. The sound cavity of the receiver 230 is connected to the cavity 123 through the sound hole 124. In this way, the cavity 123 can be used to expand the volume of the sound cavity, thereby enhancing the low-frequency effect of the audio and making the sound rounder and fuller. Moreover, through volume control, it can cooperate with the speaker to produce sound under high power conditions, thereby enhancing the user's audio and video and gaming experience.

[0051] Based on the above configuration, the embodiment of the present application can reduce the local thickness of the circuit board body 100 by setting a groove on the board surface of the circuit board body 100. In this way, when the first functional device 210 is set in the groove, the first functional device 210 can be sunk, which is beneficial to thinning the thickness bottleneck of the entire structure. In addition, the side wall of the groove can also protect the first functional device 210. At the same time, it can also reduce interference with the signal, reduce signal insertion loss and reflection, and help improve the integrity of signal transmission; by setting a first boss 112 on the board surface of the circuit board body 100, the second functional device 220 can be supported and raised to meet the setting requirements of the second functional device 220; by setting a cavity 123 in the circuit board body 100, the cavity 123 can be used to expand the sound cavity of the receiver 230, thereby improving the audio effect.

[0052] Compared with the method of reverse patch transfer after breaking the board in related technologies, the circuit board assembly in the embodiment of the present application can not only thin the local part of the circuit board assembly, but also does not involve multi-interface welding, thereby alleviating the problems of poor reliability and complex process caused by multi-interface welding; and it can also meet the setting requirements of some functional components and improve the audio effect.

[0053] Referring to Figures 1 and 2 , in some embodiments, the circuit board body 100 can employ a split structure. Specifically, the circuit board body 100 can include a first circuit board 110 and a second circuit board 120, with the second circuit board 120 stacked on the first circuit board 110. The first circuit board 110 can be a primary circuit board, and the second circuit board 120 can be a secondary circuit board. For example, when the circuit board assembly is applied to an electronic device, such as a mobile phone or tablet computer, the first circuit board 110 can be a primary board, and the second circuit board 120 can be a secondary board.

[0054] In some embodiments, the area of ​​the first circuit board 110 is larger than the area of ​​the second circuit board 120. When setting the second circuit board 120, the second circuit board 120 can be stacked on a local area of ​​the first circuit board 110. In this case, it can be ensured that functional devices can be set in other areas of the first circuit board 110, and it can also be ensured that functional devices can be set in the second circuit board 120, thereby meeting the requirements for setting functional devices under some working conditions.

[0055] For example, the second circuit board 120 may be stacked on the first circuit board 110 by welding to ensure the firmness and stability of the connection between the two and to ensure stable signal transmission between the two.

[0056] Considering that the surface of the circuit board body 100 is provided with a groove, in this case, the groove can be provided on the surface of the first circuit board 110, or on the surface of the second circuit board 120, or on both the surface of the first circuit board 110 and the surface of the second circuit board 120. In other words, the surface of at least one of the first circuit board 110 and the second circuit board 120 is provided with a groove. Based on this arrangement, the groove can be provided at the corresponding position according to the requirements of the functional device layout.

[0057] Referring to Figure 2 , in a more specific embodiment, a groove may be provided on the surface of the first circuit board 110 facing the second circuit board 120. This groove is the first groove 111, and the first groove 111 is offset from the second circuit board 120. Specifically, the first circuit board 110 may be divided into a first area and a second area, wherein the second area is used to mount the second circuit board 120, and the first area may directly mount the first functional device 210. The first groove 111 is provided in the first area to prevent the second circuit board 120 from blocking the first groove 111 and thereby interfering with the first functional device 210 mounted in the first groove 111.

[0058] The second circuit board 120 may be provided with a groove, which is a second groove 121. The second groove 121 is located on the side of the second circuit board 120 facing away from the first circuit board 110. Based on this arrangement, the notch of the second groove 121 can be made to face away from the first circuit board 110, thereby preventing the first circuit board 110 from interfering with the first functional device 210 installed in the second groove 121.

[0059] For example, the first circuit board 110 may have one or more first grooves 111, and the second circuit board 120 may have one or more second grooves 121. Of course, the number of first grooves 111 and second grooves 121 may be set based on actual needs and are not specifically limited herein. Furthermore, the positions of the first grooves 111 and second grooves 121 may also be set based on actual needs.

[0060] In the embodiment of the present application, the first boss 112 is arranged on the side of the first circuit board 110 facing the second circuit board 120. Considering that the second circuit board 120 is stacked on the side of the first circuit board 110, in this case, when the first boss 112 is located in the area on the first circuit board 110 that overlaps with the second circuit board 120, the first boss 112 will be blocked by the second circuit board 120, thereby interfering with the second functional device 220 provided on the first boss 112.

[0061] Based on the above situation, the second circuit board 120 in the embodiment of the present application can be provided with an avoidance hole 122, and the first boss 112 is passed through the avoidance hole 122 and protrudes from the side of the second circuit board 120 facing away from the first circuit board 110. In this way, the blocking effect of the second circuit board 120 on the first boss 112 can be avoided, thereby ensuring that the second functional device 220 provided on the first boss 112 is not interfered with by the second circuit board 120.

[0062] In some embodiments, the first boss 112 is integrally provided with the first circuit board 110. This design method can eliminate the interface between the first boss 112 and the first circuit board 110 between copper-tin ball-copper in the multi-layer stacking scheme, thereby greatly improving the overall structural strength and stress resistance, which is beneficial to improving the service life of the product; in addition, when the second functional device 220 is raised by using the integrally provided first boss 112 and the first boss 112 in the first circuit board 110, the multi-layer cumulative tolerance of the multi-layer stacking scheme can be effectively avoided, thereby achieving higher dimensional accuracy.

[0063] In order to meet the needs of supporting and raising the third functional component 250, the first circuit board 110 can also be provided with a second boss 113. As shown in Figures 6 and 7, the second boss 113 is provided with the third functional component 250. In this way, the third functional component 250 can be installed and supported by the second boss 113 to ensure the needs under different working conditions.

[0064] To achieve signal transmission, the second boss 113 can also be provided with a fifth electrical connector 133, and the third functional device 250 can be provided with a sixth electrical connector (not shown in the figure). When the third functional device 250 is provided on the second boss 113, the fifth electrical connector 133 is electrically connected to the sixth electrical connector. In this way, a stable connection can be ensured between the third functional device 250 and the first circuit board 110, thereby ensuring the stability of signal transmission between the third functional device 250 and the first circuit board 110.

[0065] In some embodiments, the fifth electrical connector 133 may be a soldering pad. In this case, the sixth electrical connector may be soldered to the soldering pad to ensure the firmness and stability of the connection between the sixth electrical connector and the soldering pad.

[0066] In other embodiments, the fifth electrical connector 133 may also be a metal sheet, such as a copper sheet, and the sixth electrical connector may be welded to the metal sheet. In this case, the stability and firmness of the connection between the sixth electrical connector and the fifth electrical connector 133 may also be ensured.

[0067] For example, the fifth electrical connector 133 may be located at the protruding end surface of the second boss 113 , and correspondingly, the sixth electrical connector may be provided on the side of the third functional component 250 facing the first circuit board 110 .

[0068] Considering that the second circuit board 120 is stacked on the side of the first circuit board 110, in this case, when the second boss 113 is located in the area on the first circuit board 110 that overlaps with the second circuit board 120, the second boss 113 will be blocked by the second circuit board 120, thereby interfering with the third functional device 250 provided on the second boss 113.

[0069] Based on the above situation, one end of the first circuit board 110 extends out of the second circuit board 120 to form an edge 114, and the second boss 113 is arranged on the edge 114 and protrudes from the side of the second circuit board 120 away from the first circuit board 110. In this way, the blocking effect of the second circuit board 120 on the second boss 113 can be avoided, thereby ensuring that the third functional device 250 provided on the second boss 113 is not interfered with by the second circuit board 120.

[0070] In some embodiments, the second boss 113 is integrally provided with the first circuit board 110. This design method can eliminate the interface between the second boss 113 and the first circuit board 110 between copper-tin ball-copper in the multi-layer stacking scheme, thereby greatly improving the overall structural strength and stress resistance, which is beneficial to improving the service life of the product; in addition, when the third functional device 250 is raised by using the integrally provided second boss 113 and the second boss 113 in the first circuit board 110, the multi-layer cumulative tolerance in the multi-layer stacking scheme can also be effectively avoided, thereby achieving higher dimensional accuracy.

[0071] Among them, when the third functional component 250 is a camera, when the camera is elevated by the integrally arranged second boss 113 and the second boss 113 in the first circuit board 110, the dimensional accuracy can be improved, which is beneficial to improving the resolution of the camera, thereby enhancing the user's photo-taking experience.

[0072] When the third functional device 250 is an antenna, the support and elevation of the antenna by the second boss 113 can increase the antenna clearance area, which is beneficial to improving the signal quality of the antenna transmission, and can effectively alleviate the signal transmission loss problem at the welding position of the current solution, which is beneficial to improving the signal transmission integrity and is more suitable for 5G millimeter wave and 6G high-frequency communication fields.

[0073] Of course, the third functional device 250 can also be an infrared device, a photosensitive device, a structured light device, etc., which can be supported and elevated by the second boss 113, which is beneficial to improving the signal quality transmitted by each device.

[0074] In the embodiment of the present application, the circuit board assembly may further include a power device 240 . The power device 240 here may be understood as a device with higher power and higher heat generation, such as a flash lamp.

[0075] Considering that the power device 240 generates a lot of heat during operation, if the heat dissipation is not good, the circuit board components may become seriously heated or even burn out, thereby affecting both the service life of the electronic device and the user experience.

[0076] Based on the above situation, as shown in Figure 2, in the embodiment of the present application, the power device 240 is connected to the metal layer provided on the end surface of the second circuit board 120. In this way, the side end surface space of the second circuit board 120 can be fully utilized to install the power device 240, so as to achieve the purpose of saving installation space. In addition, the power device 240 can also be cooled by the metal layer on the end surface of the second circuit board 120, thereby alleviating the problem of the power device 240 being too hot and affecting normal use.

[0077] Taking the power device 240 as a flash as an example, the flash is welded on the side end face to fully utilize the space on the side of the second circuit board 120, and the overall layout of the circuit board assembly can be optimized. At the same time, the metal layer on the side end face of the second circuit board 120 can be used to dissipate heat for the flash, so as to improve the use effect and service life of the flash. In addition, since the flash and the like are arranged on the side of the second circuit board 120, only corresponding holes need to be opened on the screen surface, battery cover surface and end of the frame 300 of the electronic device to realize the functions of front camera selfie fill light, rear camera photo flash and end flashlight, thereby achieving the effect of three uses of one light, improving user experience and reducing product manufacturing costs.

[0078] Considering that the power device 240 is located at the end of the second circuit board 120, and the circuit board assembly is installed in the frame 300 of the electronic device, the end of the second circuit board 120 is spaced apart from the inner wall of the frame 300. In this case, the power device 240 is located between the end of the second circuit board 120 and the inner wall of the frame 300. In this way, the power device 240 can also be in contact with the inner wall of the frame 300, thereby dissipating heat through the frame 300.

[0079] Based on the above configuration, the power device 240 can be cooled not only through the metal layer of the second circuit board 120 but also through the frame 300, thereby greatly improving the cooling efficiency and effectively preventing the power device 240 from being overheated during operation and affecting the use effect and service life.

[0080] In some embodiments, the cavity 123 may be defined between the first circuit board 110 and the second circuit board 120. Specifically, a groove may be defined on the side of the second circuit board 120 facing the first circuit board 110. After the second circuit board 120 is mounted on the first circuit board 110, the first circuit board 110 may seal the groove opening, thereby forming a sealed cavity 123.

[0081] In other embodiments, the cavity 123 may be provided in the second circuit board 120 or the first circuit board 110. It should be noted that the first circuit board 110 and the second circuit board 120 may be manufactured by injection molding, and the sidewalls of the cavity 123 may be provided with openable and closable through holes to facilitate mold removal.

[0082] In some cases, the second circuit board 120 may be provided with both a cavity 123 and a groove. In this case, to avoid interference and the occurrence of a larger thickness of the circuit board body 100, the projection of the cavity 123 and the projection of the groove are offset in the thickness direction of the circuit board body 100. This arrangement effectively prevents the groove from being formed on the sidewall of the cavity 123, ensuring both a certain depth and thickness for the groove and preventing the groove from communicating with the cavity 123. Therefore, while ensuring the respective functions of the groove and cavity 123, the thickness of the circuit board body 100 can be minimized, thereby preventing the thickness of the circuit board assembly from being excessively large, thereby ensuring that the electronic device using the circuit board assembly is thinner and more lightweight.

[0083] In other cases, the first circuit board 110 may be provided with a first boss 112, and the second circuit board 120 may be provided with a cavity 123. To prevent the overall thickness of the circuit board from being increased when the second circuit board 120 is stacked on the first circuit board 110, the projection of the cavity 123 is offset from the projection of the first boss 112 in the thickness direction of the circuit board body 100. This arrangement effectively prevents the first boss 112 from protruding toward the sidewalls of the cavity 123, ensuring both a certain height and a certain thickness for the first boss 112 and preventing the first boss 112 from passing through the cavity 123. Therefore, while ensuring the respective functions of the first boss 112 and the cavity 123, the thickness of the circuit board body 100 can be minimized, thereby preventing the thickness of the circuit board assembly from being excessively large, thereby ensuring that the electronic device incorporating the circuit board assembly is thinner and more lightweight.

[0084] In some other embodiments, the circuit board body 100 may also be an integral structure to facilitate the manufacture of the circuit board body 100. It should be noted that in this case, the circuit board body 100 may also be provided with structures such as grooves, bosses, and cavities 123. The specific configuration forms and positions thereof may refer to the corresponding configurations in the aforementioned case where the circuit board body 100 adopts a split structure, and will not be further described here.

[0085] Based on the above-mentioned circuit board assembly, an embodiment of the present application further discloses an electronic device. Referring to Figures 1 to 7, the disclosed electronic device includes a frame 300 and the above-mentioned circuit board assembly, wherein the circuit board assembly is arranged in a space enclosed by the frame 300, and the frame 300 can surround the circuit board assembly to provide protection and shielding.

[0086] In addition, the circuit board assembly may include a power device 240, which is arranged on the end cap of the circuit board body 100 and in contact with the frame 300. In this way, the power device 240 can be dissipated through the circuit board body 100 and the frame 300, thereby greatly improving the heat dissipation efficiency and effectively preventing the power device 240 from overheating during operation and affecting the use effect and service life.

[0087] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of this application, ordinary technicians in this field can also make many forms without departing from the purpose of this application and the scope of protection of the claims, all of which are within the protection of this application.

Claims

1. A circuit board assembly, comprising: A circuit board body (100), a first functional device (210), a second functional device (220) and a receiver (230); The board surface of the circuit board body (100) is provided with a groove, and the first functional device (210) is arranged in the groove; The board surface of the circuit board body (100) is also provided with a first boss (112), and the second functional device (220) is provided on the first boss (112); A cavity (123) is provided in the circuit board body (100), the receiver (230) is provided on the side wall of the circuit board body (100), and the sound cavity of the receiver (230) is communicated with the cavity (123).

2. The circuit board assembly according to claim 1, wherein: The first functional device (210) is a chip.

3. The circuit board assembly according to claim 1, wherein: The second functional device (220) is an antenna.

4. The circuit board assembly according to claim 1, wherein: The circuit board body (100) comprises a first circuit board (110) and a second circuit board (120), wherein the second circuit board (120) is stacked on the first circuit board (110); The groove is provided on a surface of at least one of the first circuit board (110) and the second circuit board (120).

5. The circuit board assembly according to claim 4, wherein: The groove provided on the board surface of the first circuit board (110) facing the second circuit board (120) is a first groove (111), and the first groove (111) and the second circuit board (120) are arranged in a staggered manner; The groove provided on the second circuit board (120) is a second groove (121), and the second groove (121) is located on a surface of the second circuit board (120) that faces away from the first circuit board (110).

6. The circuit board assembly according to claim 4, wherein: The first boss (112) is arranged on a side of the first circuit board (110) facing the second circuit board (120); The second circuit board (120) is provided with an avoidance hole (122), and the first boss (112) is passed through the avoidance hole (122) and protrudes from a surface of the second circuit board (120) facing away from the first circuit board (110).

7. The circuit board assembly according to claim 6, wherein: The first boss (112) is integrally arranged with the first circuit board (110).

8. The circuit board assembly according to claim 4, wherein: The first circuit board (110) is also provided with a second boss (113); One end of the first circuit board (110) extends out of the second circuit board (120) to form an edge (114); the second boss (113) is arranged on the edge (114) and protrudes from a surface of the second circuit board (120) facing away from the first circuit board (110).

9. The circuit board assembly according to claim 8, wherein: The second boss (113) is integrally arranged with the first circuit board (110).

10. The circuit board assembly according to claim 4, wherein: The circuit board assembly also includes a power device (240); The power device (240) is connected to a metal layer provided on an end surface of the second circuit board (120).

11. The circuit board assembly according to claim 4, wherein: The second circuit board (120) is provided with the cavity (123) and the groove; In the thickness direction of the circuit board body (100), the projection of the cavity (123) and the projection of the groove are arranged in a staggered manner.

12. The circuit board assembly according to claim 4, wherein: The second circuit board (120) is provided with the cavity (123); In the thickness direction of the circuit board body (100), the projection of the cavity (123) and the projection of the first boss (112) are arranged in a staggered manner.

13. An electronic device comprising: A frame (300) and a circuit board assembly as claimed in any one of claims 1 to 12; The circuit board assembly is arranged in the space enclosed by the frame (300); The circuit board assembly comprises a power device (240), wherein the power device (240) is arranged on the end surface of the circuit board body (100) and is in contact with the frame (300).

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