Tool reference for multi-plane referencing and device and method for determining an orientation and / or position of a component therewith

Abstract

Tool reference (200) for determining at least one orientation and / or position of a reference member, wherein the tool reference (200) is attached to the reference member, and including an apparatus for positioning one or more components (600) comprising the tool reference (200), and a method for determining at least one orientation and / or position of a reference member using the tool reference (200) in the apparatus for positioning one or more components (600).

Description

[0001] Applicant: Besi Switzerland AG, Hinterbergstrasse 32a

[0002] 6312 Steinhausen, Schweiz

[0003] Inventor: SELHOFER Hubert (AT), c / o Besi Switzerland AG

[0004] Hinterbergstrasse 32a, 6312 Steinhausen, Schweiz

[0005] Tool reference for multi-plane referencing and device and method for determining an orientation and / or position of a component therewith

[0006] Cross Reference to related Application

[0007] This application claims the priority of DE 102023 136 907.5 filed on 2023-12-31 ; this application is incorporated by reference herein in its entirety.

[0008] Technical Field

[0009] The present disclosure relates to an optical tool reference for determining at least one orientation and / or position of a reference member, and an apparatus comprising one or more tool references, wherein the reference member is comprised in the pick and place actuator. In particular, the pick and place actuator comprises a gripper, and such an apparatus may be arranged to modify at least one position and / or orientation of the pick and place actuator using the at least one up-position and / or up-orientation of the gripper.

[0010] State of the Art

[0011] From the state-of-the-art, similar apparatus and components are known, such as US 2021 / 0195816. This document discloses an apparatus comprising a bond head with a component gripper, a first drive system for moving a carrier over relatively long distances, a second drive system which is attached to the carrier for moving the bond head back and forth between a nominal working position and a stand-by position, a drive attached to the bond head for rotating the component gripper or a rotary drive for rotating the substrate about an axis, at least one substrate camera attached to the carrier and at least one component camera. Either the second drive system is also designed to perform high - precision correction movements with the bond head, or a third drive system is provided to perform high-precision correction movements with the substrate. At least one reference mark is attached to the bond head or the component gripper.

[0012] In systems that use one or more cameras for alignment, multiple measurements may be made using one or more substrate cameras (or look-down cameras) and / or one or more component cameras (or look-up cameras). The solution described in US 2021 / 0195816 arranges at least one reference mark to be measurable using both a substrate camera and a component camera. However, mechanical inaccuracies and thermal effects can cause measurement errors in such systems, causing unwanted offsets between component and substrates. There is an increasing need to further reduce unwanted offsets as the attachment accuracy to be consistently achieved increases greatly.

[0013] Summary of the invention

[0014] The present invention has been proposed in order to solve the aforementioned problems of the state-of-the-art, and an object of the present invention is to provide an optical tool reference for multi-plane referencing according to the features of independent claim 1 , apparatus according to the features of independent claim 8 and a method according to the features of independent claim 12 for determining an orientation and / or position of a component therewith. Further advantageous implementations and embodiments are shown in each of the respective subclaims and in the figures.

[0015] Brief description of the Figures

[0016] Further advantages and features of the invention are shown in the following figures, namely:

[0017] FIG. 1 , which depicts a schematic front view of the relevant parts of an apparatus for aligning one or more components with one or more substrates before and / or during attaching;

[0018] FIG. 2, which depicts a schematic side view of the relevant parts of the pick and place actuator of an apparatus for aligning one or more components with one or more substrates before and / or during attaching; and

[0019] FIG. 3, which depicts a schematic cross-section of a tool reference arranged to be imaged by one or more look-up cameras.

[0020] Description of the Figures In the figures, a first axis 910, a second axis 920 and a third 930 axis are depicted. The first axis 910 is perpendicular to the second axis 920, and the third axis 930 is perpendicular to both the first axis 910 and the second axis 920. During use, the first axis 910 is assumed to direct in an Y direction, the second axis 920 is assumed to direct in an X direction and the third axis 930 is assumed to direct in a Z direction. Conventionally, in use, the axes in the corresponding directions are therefore named as Y-axis 910 and X- axis 920 and are substantially horizontal, horizontal or approximately horizontal.

[0021] Functionally, the X-axis 920 and Y-axis 910 may be interchanged. Conventionally, in use, the axis in the corresponding direction is therefore named as Z-axis 930 and is substantially vertical, vertical or approximately vertical. To clarify the description of the different components, the figures depict parts in these conventional orientations. To clarify the description of the different components, some relative terms have been used, such as upper, side and base to match this convention, “for” should be interpreted as “suitable for”.

[0022] The apparatus described in this disclosure may be arranged by a skilled person to operate at different deviations from the conventional orientations and nominal co-ordinate axes.

[0023] FIG. 1 depicts a schematic cross-section, viewed from a side, of relevant parts of an apparatus 100 suitable for aligning one or more components 600 with one or more substrates 300 before and / or during attaching according to any of the methods disclosed herein. More particularly, the apparatus 100 is viewed if looking towards a plane comprising the X-axis 920, nominally indicated as having a positive direction from left to right, and comprising the Z-axis 930, nominally indicated as having a positive direction from bottom to top. The Y-axis 910 is nominally depicted as having a positive direction into the drawing plane from the viewer's perspective.

[0024] For example, the apparatus 100 may be an attachment apparatus such as a die bonding apparatus. Typically dies are rectangular in shape, but rounded or trapezoidal shapes are also possible.

[0025] In general, a degree of alignment may be corrected if at least a small degree of relative movement is possible in one or more directions between a component 600 and a substrate 300, which may be possible during an initial stage of attaching. This relative movement may be approximately linear along one or more axes 910, 920, 930 and / or rotational around one or more axes 910, 920, 930. No significant degree of alignment is possible after one or more components 600 have been rigidly attached with a substrate The one or more substrates 300 may comprise one or more substrate marks (or substrate alignment targets) 340, suitable for determining a position and / or orientation of the one or more substrates 300, whereby one or more components 600 may be mounted and attached with a precision in the micrometer range or sub-micrometer range. The one or more substrate marks 340 may be any suitable alignment target. For example, a substrate mark 340 may be one or more physical features of at least a portion of a substrate 300, one or more optical characteristics of at least a portion of a substrate 300, at least a portion of a fiducial, or any combination thereof.

[0026] The methods and apparatus described herein for aligning one or more components 600 is not limited to dies. For example, a component 600 may be a die, a semiconductor package, a chip, a flip chip, an integrated circuit, a further substrate, an optical element, an electronic element, an electro-optical element, or any combination thereof. For example, one component 600 may be attached to one substrate. For example, one or more components 600 may be attached to one substrate 300. For example, one component 600 may be attached to one or more substrates 300.

[0027] During one or more steps of the methods described herein, the apparatus may be preconfigured to perform one or more predetermined operations to improve throughput. Additionally or alternatively, the apparatus may be preconfigured to control one or more operations during use.

[0028] The one or more substrates 300 may be one or more metallic substrates, also described as one or more lead frames, where one or more components 600 are soldered onto islands arranged one after the other and optionally next to one another. However, the methods and apparatus described herein are not limited to lead frames - the one or more substrates 300 may be any object having one or more attachable face and one or more device or attaching position. For example, a substrate may be a metallic substrate, a substrate strip, a lead frame, a wafer, a further component, or any combination thereof. The one or more substrates 300 may also be described as one or more media.

[0029] FIG. 1 depicts the apparatus 100 comprising a pick and place actuator 150, an optional feeding unit 120 for providing the one or more components 600, and an optional substrate chuck 140 for providing the one or more substrates 300. The feeding unit 120 is positioned at a loading position 820 for component loading, and may comprise a component handling system, such as a wafer or tape. The substrate chuck 140 is positioned at an attaching position 800 for component attaching. Optionally, the apparatus 100 may be configured as a bonding apparatus by suitable modifications, including configuring the pick and place actuator 150 as a bond head. FIG. 1 depicts an example of a pick and place drive, comprising a first drive system 111 for a drive member 130, and a second drive system 112 for the pick and place actuator 150. The second drive system 112 is arranged to provide a movement of the pick and place actuator 150 relative with respect to one or more second cameras 510, arranged as one or more look-down camera(s). Optionally, the second drive system 112 may be arranged to provide a movement of the pick and place actuator 150 using one or more drive guides 115. The second drive system 112 may optionally be attached to the drive member 130 or may be an independent handling system. Any suitable drive configuration may be included in the apparatus 100. For example, the first drive system 111 may be arranged to move the drive member 130 positively and negatively along the X-axis 920, and the second drive system 112 may be arranged to move the pick and place actuator 150 positively and negatively along the Y-axis 910, whereby the pick and place actuator 150 may be moved between the loading position 820 and the attaching position 800.

[0030] In the example depicted in FIG. 1, one or more look-up cameras 410 are arranged at a component inspection position 810 of the apparatus 100, and the pick and place actuator 150, on its way from the loading position 820 to the attaching position 800, is moved above the one or more look-up cameras 410 and one or more up-images are made. Optionally, the pick and place actuator 150 is slowed down or stopped to allow the one or more images to be made.

[0031] As depicted in FIG. 1, the apparatus includes one or more first cameras 410 arranged as one or more look-up cameras, and further includes the one or more second cameras 510 arranged as one or more look-down cameras. In the context of this disclosure, look-up means that the camera is approximately pointed in the positive direction of the Z-axis 930. In the context of this disclosure, look-down means that the camera is approximately pointed in the negative direction of the Z-axis 930. The one or more look-up cameras 410 are arranged to make images of an attaching surface of a component during attachment to the gripper 160, whereby a skilled person may also refer to it as a component camera 410. The one or more look-down cameras 510 may optionally comprise one or more illumination radiation source 530, and be arranged to illuminate an attaching surface of one or more substrates 300 and arranged make images of the one or more substrates, whereby a skilled person may also refer to it as a substrate camera 510.

[0032] Each camera 410, 510 comprises one or more radiation detectors such as one or more image sensors (not depicted), and comprises one or more optical elements (not depicted). The one or more image sensors may use any suitable optical detection technique, such as CMOS. Where necessary, optical beam paths may be deflected using one or more suitably-configured deflecting mirrors (not depicted). The radiation detectors may be arranged for detecting any convenient wavelengths, such as a UV (ultra-violet) wavelength, a visible wavelength, an IR (infra-red) wavelength, or any combination thereof. In the context of this closure, directing should be understood as making use of one or more physical and / or optical properties to determine, to a substantial degree, an optical path of beam. For example, directing may be reflecting, diffracting, transmitting or any combination thereof.

[0033] As depicted in FIG. 1, the pick and place actuator 150 comprises a component gripper 160, arranged to releasably attach to one or more components 600 during use, and to retain the attachment during movements of the pick and place actuator 150 and / or the gripper 160. The gripper 160 is, for example, vacuum-operated whereby a degree of suction may be used to retain one or more components 600 in the gripper 160, alternatively the one or more components 600 may be held by electrostatic force or a mechanical gripper. The gripper 160 may be arranged to be rotatable about the Z-axis 930, but it also possible to rotate the substrate about the Z-axis.

[0034] The apparatus 100 is arranged to provide at least a portion of an attaching process (not depicted) at the attaching position 800. During the at least a portion of the attaching process, the one or more components 600 are in contact with the one or more substrates 300, allowing one or more attaching operations to be performed on at a least a portion of the one or more attaching surfaces (not depicted) of the one or more components 600 and / or one or more substrates 300. The one or more attaching surfaces are typically at least a portion of a mutual region of contact between the one or more components 600 and / or one or more substrates 300.

[0035] In the example depicted in FIG. 1 and FIG. 2, the range of motion of the second drive system 112 is typically small or very small compared to the range of motion of the first drive system 111. However, the second drive system 112 can also be arranged to provide a long-range movement between the feeder unit 120 and the substrate chuck 140, moving relatively with respect to the pick and place actuator 150. One or more small correction movements to align the one or more components 600 with the one or more substrates 300 may be performed with the second drive system 112 or a drive system for the substrate chuck 140, or any combination thereof. The second drive system 112 is arranged to move the pick and place actuator 150 to one or more processing positions, and arranged to provide high-precision correction movements of the pick and place actuator 150 in two different directions 910, 920. For this purpose, it is sufficient if the range of motion of the second drive system 112 is relatively long along the X-axis 920, and relatively short along the Y axis 910. The range of motion along the X-axis 920 may be a few tens of millimeters, for example 20 mm or 30 mm or more, the range of motion along the Y-axis 910 may be only a few micrometers. The apparatus 100 is arranged at the attaching position 800 to move one or more components 600, attached to the gripper 160, along the Z-axis 930 towards one or more substrates 300, and to keep a position of close proximity between an attaching surface of the one or more components 600 and an attaching surface of the substrate 300 while images are made. For example, the average separation between the component attaching surface and the substrate attaching surface is 10 - 200 pm.

[0036] Optionally, the apparatus 100 comprises one or more second cameras, arranged as one or more look-down cameras 510, arranged to make one or more down-images of an attaching surface of the one or more substrates 300. In terms of this disclosure, a downimage is an image made by one or more second cameras, arranged as one or more lookdown cameras 510. Optionally, the one or more look-down cameras 510 may be further arranged to determine a substrate mark position and / or orientation of a substrate mark 340 in a portion of a substrate 300 on which a component 600 is to be placed and attached. Optionally, the determination may be performed before attaching of a component 600 to a substrate 300, during attaching of a component 600 to a substrate 300 or after attaching of a component 600 to a substrate 300.

[0037] Additionally or alternatively, one or more look-up cameras may be attached to the drive member 130. For example, either one or more look-up cameras or a pick and place actuator is attached to the drive member 130 by means of a retractable and extendable swivel mechanism. The one or more look-up cameras or the pick and place actuator 150, respectively, may then be retracted into an image capture position while moving from the loading position 820 to the attaching position 800, so that one or more up-images per look-up camera may be made during the move. For the loading of one or more components 600 and for recording down-images with the one or more look-down cameras 410 and for placing the one or more components 600, the one or more look-up cameras 410 are preferably extended or rotated into a stand-by position, and the pick and place actuator 150 is similarly extended or rotated into its working position.

[0038] Additionally or alternatively, one or more look-up cameras may be attached to the drive member 130. For example, either one or more look-up cameras or a pick and place actuator is attached to the drive member 130 by means of a retractable and extendable swivel mechanism. The one or more look-up cameras or the pick and place actuator 150, respectively, may then be retracted into an image capture position while moving from the loading position 820 to the attaching position 800, so that one or more up-images per look-up camera may be made during the move. For the loading of one or more components 600 and for recording down-images with the one or more look-down cameras 510 and for placing the one or more components 600, the one or more look-up cameras 410 are preferably extended or rotated into a stand-by position, and the pick and place actuator 150 is similarly extended or rotated into its working position. FIG. 2 depicts a schematic cross-section, viewed from a side, of the pick and place actuator 150 already described in relation to FIG. 1. More particularly, the pick and place actuator 150 is viewed if looking towards a plane comprising the Y-axis 910, nominally indicated as having a positive direction from left to right, and the Z-axis 930, nominally indicated as having a positive direction from bottom to top. The X-axis 920 is nominally depicted as having a positive direction out of the drawing, towards the viewer. As depicted in FIG. 2, one or more components 600 are retained by the gripper 160. In the example depicted, the component attaching apparatus 100 comprises one or more tool references 200 (or optical tool references or multi-level tool references) rigidly attached to the gripper 160. The one or more tool references 200 are arranged for determining at least one orientation and / or position of a reference member (not depicted).

[0039] In the example depicted, the reference member is comprised in the pick and place actuator 150, and the one or more tool references 200 are arranged to allow at least one position and / or orientation of the gripper 160 to be determined. Optionally, the reference member may be comprised in the gripper 160. In terms of this disclosure, an up-position and / or up-orientation is determined by one or more first cameras, arranged as one or more look-up cameras. In terms of this disclosure, a down-position and / or downorientation is determined by one or more second cameras, arranged as one or more lookdown cameras.

[0040] In the example depicted in FIG. 1 and FIG. 2, the first drive system 111 is arranged to transport the pick and place actuator 150 over relatively long distances, namely from the loading position 820, where the pick and place actuator 150 and gripper 160 receive one or more components 600 from the feeding unit 120, to the attaching location 800, where the pick and place actuator 150 and gripper 160 place the one or more components 600 on one or more substrates 300. The requirements for the position accuracy of the first drive system 111 are relatively modest, a position accuracy of + / - 10 pm is usually sufficient. In the example depicted in FIG. 1, the first drive system 111 is designed as a so-called “gantry” with two or more mechanically highly stable axes of motion, of which two axes of motion allow movements of the drive member 130 along axis 910 and along axis 920, both axes running perpendicular to each other. Typically, movements of the pick and place actuator 150 along the Z-axis 930 are required to remove a component 600 from the feeding unit 120, and also to place the component 600 in an intended attaching position on one or more substrates 300. This movement along the Z-axis 930 may be performed in many different ways, such as providing the first drive system 111 with a third, stable or highly stable axis of motion arranged to provide movement along the Z-axis 930 of the drive member 130. Additionally or alternatively, the second drive system 112 may be provided with an additional, high-precision drive arranged to provide movements of the pick and place actuator 150 along the Z-axis 930. Additionally or alternatively, the pick and place actuator 150 may comprise a high- precision drive arranged to provide movements of the gripper 160 along the Z-axis 930.

[0041] In the example depicted in FIG. 1 and FIG. 2, the second drive system 112 is arranged to move the pick and place actuator 150 between processing positions, and also to enable high-precision correction movements of the pick and place actuator 150 in two different directions along the axis 910 and / or along the axis 920.

[0042] In the example depicted in FIG. 2, the pick and place actuator 150 optionally comprises a drive 113 for the rotation of the component gripper 160 around the Z-axis 930. Additionally or alternatively, the feeding unit 120 may be arranged to rotate one or more components 600 about the Z-axis 930 to reduce or eliminate at least a degree of angular error. Additionally or alternatively, the substrate chuck 140 may be arranged to rotate one or more substrates 300 about the Z-axis 930 to reduce or eliminate at least a degree of angular error.

[0043] FIG. 3 depicts a schematic cross-section, viewed from a side, of the one or more too references 200 rigidly attached to the gripper 160, and with the one or more look-up cameras 410 arranged to make one or more up-images of the one or more tool references 200. In particular, the one or more tool references 200 are positioned in a look-up camera field-of-view (FOV) 440. In terms of this disclosure, an up-image is an image made by one or more first cameras, arranged as one or more look-up cameras. As depicted, the one or more look-up cameras 410 are viewed as if looking towards a plane comprising the Y-axis 910, nominally indicated as having a positive direction from left to right, and the Z-axis 930, nominally indicated as having a positive direction from bottom to top. The X-axis 920 is nominally depicted as having a positive direction out of the drawing, towards the viewer. A field of view as described herein is an angular extent which can be imaged at a given moment.

[0044] The one or more tool references 200 are arranged by direct and / or indirect rigid attachment to allow at least one up-position and / or up-orientation of the gripper 160 to be determined by the one or more look-up cameras 410. For example, the one or more tool references 200 may be directly attached by one or more rigid attachments, for example by direct attachment to the gripper 160, by being comprised in the gripper 160, or any combination thereof. For example, the one or more tool references 200 may be indirectly attached to the gripper 160 by one or more rigid attachments, for example by being comprised in the pick and place actuator 150, by being attached to the pick and place actuator 150, or any combination thereof.

[0045] In the example depicted in FIG. 2 and FIG. 3, the one or more tool references 200 are depicted as one member. However, the one or more tool references 200 may comprise more than one member attached rigidly at more than one positions to a common attachment member, such as the gripper 160.

[0046] In the example depicted in FIG. 2 and FIG. 3, the one or more look-down cameras 510 are optionally arranged to make one or more down-images of the one or more tool references 200. In particular, the one or more tool references 200 may be positioned in a field-of view 540 of the one or more look-down cameras 510.

[0047] Optionally, the one or more look-up cameras 410 may comprise one or more illumination radiation sources 430, arranged to provide illumination radiation suitable for making up- images of one or more portions of the one or more tool references 200. Optionally, the one or more look-down cameras 510 may comprise one or more illumination radiation sources 530, arranged to provide illumination radiation suitable for making down-images of one or more portions of the one or more tool references 200.

[0048] The apparatus is arranged such that the one or more tool references 200 may be up- imaged by the one or more look-up cameras 410. Optionally, the apparatus is arranged such that the one or more tool references 200 may be down-imaged by the one or more look-down cameras 510. For example, up-imaging and down-imaging may occur at the same positions of the pick and place actuator 150, at overlapping positions of the pick and place actuator 150, at different positions of the pick and place actuator 150, or any combination thereof. Optionally, the apparatus is arranged such that up-imaging and down-imaging may occur at the same moment in time, at different moments in time, at overlapping moments in time, or any combination thereof.

[0049] In the example depicted in FIG. 3 the one or more look-up cameras 410 are arranged for making up-images of two or more reference marks comprised in the tool reference 200. In particular, two or more reference marks may be positioned in a look-up camera field-of- view 440. The tool reference 200 comprises a mark carrier 250 with a first surface at a first level 251, and a second surface at a second level 252, wherein the second level 252 is arranged to be positioned at a significant distance from the first level 251 along the positive Z axis 930 away from the one or more look-up cameras 410. As described below, the significant distance is predetermined. The tool reference 200 comprises one or more first reference marks 261 on or proximate the first surface at the first level 251, and comprises one or more second reference marks 262 on or proximate the second surface at the second level 252. If the one or more reference marks 261, 262 are optionally arranged to also be imaged by one or more look-down cameras 510, the mark carrier 250 comprises one or more transparent imaging portions, sufficiently transparent for the one or more look-down cameras 510 to image one or more reference marks 261, 262.

[0050] The material used for the mark carrier 250 is preferably selected to have a low or very low coefficient of thermal expansion. If the one or more reference marks 261 , 262 are arranged to be imaged only by one or more look-up cameras, the mark carrier may 250 may be one or more solid blocks for improved rigidity and stability. If the one or more reference marks 261, 262 are optionally arranged to also be imaged by one or more lookdown cameras 510, it may be advantageous to arrange the regions proximate the one or more reference marks 261 , 262 to have at least similar optical and / or physical properties, and preferably the same optical and / or physical properties, such as a similar or same thickness of the one or more transparent regions as depicted in FIG. 3.

[0051] The one or more reference marks 261, 262 may comprise one or more shapes suitable for determining a position and / or orientation. For example, one or more crosses, one or more annular rings, one or more openings, one or more rectangles, one or more squares, one or more corners, one or more edges, one or more lines, one or more circles, one or more ovals, one or more ellipses, or any combination thereof.

[0052] The one or more first reference marks 261 are arranged to allow one or more first up- images to be made by the one or more look-up cameras 410 if the first level 251 is positioned in a field-of-view 440 of the one or more look-up cameras 410 as depicted in FIG. 3. The one or more second reference marks 262 are arranged to allow one or more second up-images to be made by the one or more look-up camera 410 if the second level 252 is positioned in a field-of-view 440 of the one or more look-up cameras camera 410 as depicted in FIG. 3. The one or more look-up cameras 410 are arranged to collect radiation directed towards the one or more look-up cameras 410 for making up-images.

[0053] In general, the one or more first up-images are arranged to provide a first up-orientation and / or up-position of the reference member. In general, the one or more second up- images are arranged to provide a second up-orientation and / or up-position of the reference member. In the example depicted in FIG. 3, the reference member is comprised in the pick and place actuator 150, and arranged to allow at least one up-position and / or up-orientation of the gripper 160 to be determined. In this example, the apparatus is therefore arranged to determine at least one up-position and / or up-orientation of the gripper 160 relative to the one or more first reference marks 261 using the one or more first up-images and relative to the one or more second reference marks 262 using the one or more second up-images.

[0054] As depicted in the example of FIG. 3, the tool reference 200 comprises two or more surfaces at two or more different levels 251, 252, 253. A tool reference 200 with two different levels 251, 252, 253 may be described as bi-level or double-decked. A tool reference 200 with two or more different levels 252, 252, 253 may be described as multilevel or multiple-decked. In the example of FIG. 3, the mark carrier 250 is depicted as one member. However, the one or more tool references 200 may comprise more than one member attached directly and / or indirectly to the reference member.

[0055] In general, if a mark carrier is tilted, measurements made by a camera may have an unwanted offset depending on a tilt angle of the mark carrier from a camera optical axis. If the mark carrier 250 depicted in FIG. 3 is tilted, up-images and / or up-measurements made by the one or more look-up cameras 410 may have an unwanted offset depending on a tilt angle of the mark carrier 250 from a look-up camera optical axis (not depicted). If the relevant parameters are known, a predetermined offset may be applied to provide a suitable correction for the tilt. In practice, however, unpredictable tilts may occur due to, for example, mechanical tolerances, parasitic motor forces, linearity of bearings, stiffness of the system, thermal drifts, manufacturing limitations, static deformations, inaccuracy of motion drives, and / or actuator movement. Similarly, a tilt of the camera used and / or a tilt of the pick and place actuator 150 and / or a tilt of the gripper 160 may change over time, and / or be dependent on the positions along the first (Y) axis 910 and / or along the second (X) axis 920. For example, in practice, small angular changes of less than 1 millidegree may result in such unwanted offsets.

[0056] By measuring at least one up-position and / or up-orientation of at least two reference marks 261, 262, 263 on at least two substantially different levels 251, 252, 253, multiple degrees of freedom, for example 6 degrees-of-freedom (DOF) may be determined for the one or more tool references 200. Because the one or more tool references 200 are arranged to determine at least one up-orientation and / or up-position of the gripper 160, multiple degrees of freedom, for example 6 degrees-of-freedom (DOF), may be determined for the gripper 150. Similarly, multiple degrees of freedom, for example 6 degrees-of-freedom (DOF), may be determined of members attached to the gripper 150, such as one or more components 600.

[0057] To measure the one or more first reference marks 261, the first level 251 is positioned in a field-of-view 440 of the one or more look-up cameras 410, and one or more first up- images are made by the one or more look-up cameras 410. To measure the one or more second reference marks 262, the second level 252 is positioned in a field-of-view 440 of the one or more look-up cameras 410, and one or more second up-images are made by the one or more look-up cameras 410. The one or more first up-images and the one or more second up-images may be made in the same field-of-view, overlapping fields-of- view, or different fields-of-view to each other. The one or more look-up cameras 410 may be arranged with a depth of field sufficient to image both the first level 251 and the second level 252. Additionally or alternatively, the one or more look-up cameras 410 may be arranged to modify at least one optical and / or physical property to modify a degree of focus sufficient to image both the first level 251 and the second level 252. Additionally or alternatively, the one or more look-up cameras 410 may be arranged to modify at least one position and / orientation of at least one optical component to modify a degree of focus sufficient to image both the first level 251 and the second level 252. Additionally or alternatively, the one or more look-up cameras 410 may be arranged to focus simultaneously to image both the first level 251 and the second level 252. This may be provided, for example, by comprising one or more optical elements in the one or more look-up cameras 410 arranged such that at least one focal length may be changed between two or more significantly different focus settings. This may be provided, for example, by using one or more beam dividers with two or more different optical path lengths to two or more image sensors.

[0058] The one or more first up-images by the one or more look-up cameras 410 may be used to determine a first up-orientation and / or up-position (TF1) of the one or more first reference marks 261. The one or more second up-images by the one or more look-up cameras 410 may be used to determine a second up-orientation and / or up-position (TF2) of the one or more second reference marks 261.

[0059] The significant separation distance between the one or more first reference marks 261 and the one or more second reference marks 262 means that there will be a respectively significant difference in focal length at optimum focus between a first up-image and a second up-image when made with the same look-up camera 410. This may also be described as arranging the one or more first reference marks 261 to be in a different focal plane to the one or more second reference marks 262. As depicted in the example of FIG. 3, this significant difference in distance may be mainly along the third axis (Z) 930. This may also be described as a significant difference in height if the multi-level optical tool reference 200 is positioned on a substantially flat horizontal surface.

[0060] An average separation distance (Zav) of the one or more first reference marks 261 and the one or more second reference marks 262 may be 1mm or more, or 3mm or more, or 5mm or more, or 6mm or more, or 10mm or more, or 25 mm or more.

[0061] At least one average separation distance between the one or more first reference marks 261 at the first level 251 and the one or more second reference marks 262 at the second level 252 is predetermined. Therefore at least one known average separation distance may be used to determine a degree of unpredicted or unexpected offsets. For example, CAD data of the one or more tool references 200 may be used and / or measurements may be made prior to fitting in the apparatus on a measurement table. Additionally or alternatively, the apparatus may be arranged to measure at least one average separation distance after fitting (in-situ).

[0062] Measurements of the one or more first reference marks 261 thereby determine at least a TF1-X value and a TF1-Y value using one or more first up-images, Measurements of the one or more second reference marks 262 thereby determine at least a TF2-X value and a TF2-Y value. At least one predetermined value of Zav is known. Using these values as the initial starting point, an appropriate iteration algorithm may be used until convergence. For example, the so-called “Kabsch algorithm” may be used with at least one predetermined Zav value to provide an initial estimate of the transformation T. Applying T to the at least one predetermined Zav value provides an improved estimate of at least one in-situ Zav value. Using improved estimates of at least one in-situ Zav value together with the measured TF1-X, TF1-Y, TF2-X and TF2-Y values, iteration may be performed until convergence, which is expected to be within 5-10 steps.

[0063] After convergence, one or more unpredicted or unexpected tilt values may be used to determine an appropriate tool reference alignment correction for any subsequent measurements made on one or more reference marks 261, 262, 263 comprised in the one or more tool references 200. Similarly, after convergence, one or more unpredicted or unexpected tilt values may be used to determine an appropriate gripper alignment correction for any subsequent measurements made on one or more reference marks attached directly or indirectly to the gripper 160. For example, if Zav is 3mm, and 1 millidegree of tool reference tilt is measured, tool reference alignment correction (or gripper alignment correction) of approximately 52nm may be applied. In the example depicted in FIG. 3, a component 600 has been received by the gripper 160, thereby being rigidly attached directly to the gripper 160. The component 600 comprises one or more component marks 640 at a component mark level 641. The one or more component marks 640 are arranged to allow one or more component up-images to be made by the one or more look-up cameras 410 if the component mark level 641 is positioned in a field-of-view of the one or more look-up cameras 410. The one or more component up-images by the one or more up-cameras 410 are arranged to provide at least one component orientation and / or component position of the one or more components 600. Up-images and / or up-measurements of the one or more component marks 640 may thereby determine at least a CF1-X value and a CF1-Y value. Optionally, one or more gripper alignment corrections determined using the one or more tool references 200 may be applied, for example to at least partially correct CF1-X and / or CF1-Y.

[0064] In the example depicted in FIG. 3, the apparatus is arranged such that the first level 251 is arranged to be positioned at a significant distance from the component mark level 641 along the positive Z axis 930 away from the one or more look-up cameras 410. Their significant separation distance between the one or more component marks 640 at the component mark level 641 and the one or more first reference marks 261 at the first level 251 may be advantageous to reduce a risk of a collision during attachment, particularly when attaching components 600 close to each other. For example, the significant separation distance between the component mark level 641 and the first level 251 may be 1 mm or more. The significant separation distance between the one or more component marks 640 and the one or more first reference marks 261 means that there will be a respectively significant difference in focal length at optimum focus between a component up-image and a first up-image when made with the same look-up camera 410. This may also be described as arranging the one or more first reference marks 261 to be in a different focal plane to the one or more component marks 640.

[0065] The one or more first up-images and the one or more second up-images may be made in the same field-of-view, overlapping fields-of-view, or different fields-of-view to the one or more component up-images. The one or more look-up cameras 410 may be arranged with a depth of field sufficient to image both the component mark level 641 and the first level 251. Optionally, the one or more look-up cameras 410 may be arranged with a depth of field sufficient to image the component mark level 641 , the first level 251. and the second level 252. Additionally or alternatively, the one or more look-up cameras 410 may be arranged to modify at least one optical and / or physical property to modify a degree of focus sufficient to image the component mark level 641, the first level 251 and optionally the second level 252. Additionally or alternatively, the one or more look-up cameras 410 may be arranged to modify at least one position and / orientation of at least one optical component to modify a degree of focus sufficient to image the component mark level 641 , the first level 251 and optionally the second level 252. This may be provided, for example, by comprising one or more optical elements in the one or more look-up cameras 410 arranged such that at least one focal length may be changed between two or more significantly different focus settings. This may be provided, for example, by using one or more beam dividers with two or more different optical path lengths to two or more image sensors.

[0066] It may be advantageous to arrange an average separation distance between the component mark level 641 and the first level 251 to be approximately the same as an average separation distance between the first level 251 and the second level 252. This may be advantageous because a degree of unwanted tilt of the gripper 160 may cause a degree of unwanted offset measured using the one or more optical tool references 200 to be similar to a degree of unwanted offset when measuring the a component orientation and / or position relative to the one or more tool references 200. Additionally or alternatively, it may reduce at least one accuracy requirement for the one or more look-up cameras 410 if it is arranged to image the one or more component marks 640, the one or more first reference marks 261 and the one or more second reference marks 262.

[0067] In the example depicted in FIG. 3, the mark carrier 250 has an optional third surface at a third level 253, and the one or more tool references 200 optionally comprise one or more third reference marks 263 on or proximate the third surface at the third level 253. The one or more third reference marks 263 are arranged to allow one or more third up-images to be made by the one or more look-up cameras 410 if the third level 253 is positioned in a field-of-view 440 of the first camera 410. In general, the optional one or more third up- images are arranged to provide a third up-orientation and / or up-position of the reference member. If the one or more third reference marks 263 are optionally arranged to also be imaged by one or more look-down cameras 510, the mark carrier 250 comprises one or more transparent imaging portions, sufficiently transparent for the one or more look-down cameras 510 to image one or more third reference marks 263.

[0068] Optionally, measuring and / or imaging of the one or more third reference marks 263 may be arranged to provide at least one further up-orientation and / or up-position of the reference member to be used to improve an accuracy of the measurements described above using the one or more first reference marks 261 and the one or more second reference marks 262. Additionally or alternatively, measuring and / or imaging of the one or more third reference marks 263 may be arranged with the one or more first reference marks 261 as described above, but using the one or more third reference marks 263 instead of the one or more second reference marks 262 for an advantageously larger separation distance. Additionally or alternatively, measuring and / or imaging of the one or more third reference marks 263 may be arranged with the one or more second reference marks 262 as described above, but using the one or more third reference marks 263 instead of the one or more first reference marks 261.

[0069] It may be advantageous to arrange the one or more tool references 200 to be measurable and imageable by only one or more look-down cameras 510instead of the one or more look-up cameras 410. This may be arranged by orienting the reference markers 261, 262, 263 of the one or more tool references 200 to face the one or more look-down cameras 510.

[0070] It may be advantageous to retain the capability of one or more tool references 200 to be measurable and imageable by the one or more look-up cameras 410, and to provide one or more further tool references 200 which are measurable and imageable only by the one or more look-down cameras 510.

[0071] It may be advantageous to arrange the one or more tool references 200 depicted in FIG. 3 to be measurable and imageable by both the one or more look-down cameras 510 and by the one or more look-up cameras 410. For example, the mark carrier 250 may comprise one or more transparent imaging portions 255. Advantageously, an average refractive index (n) of the imaging portions 255 is approximately 2, or in the range of 1.0 to 3.0; or 1.5 to 2.5; or 1.7 to 2.3; or 1.75 to 2.25; or 1.8 to 2.2; or 1.85 to 2.15; or 1.9 to 2.1; or 1.95 to 2.05. Advantageously, the one or more imaging portions comprise a material selected from the group comprising: a glass, a Lanthanum dense flint glass, a crystal, a plastic, a semiconductor, silicon, a liquid, a metal, or any combination thereof.

[0072] The one or more first reference marks 261 may be further arranged to allow one or more first down-images to be made by the one or more look-down cameras 510 through the one or more imaging portions 255 if the first level 251 is positioned in a field-of-view 540 of the one or more look-down cameras 510. The one or more second reference marks 262 may be further arranged to allow one or more second down-images to be made by one or more look-down cameras 510 through the one or more imaging portions 255 if the second level 251 is positioned in a field-of-view 540 of the one or more look-down cameras 510. The one or more first images by the one or more look-down cameras 510 may be arranged to provide a first down-orientation and / or down-position of the reference member. The one or more second down-images by the one or more look-down cameras 510 may be arranged to provide a second down-orientation and / or down-position of the reference member. The optional one or more third reference marks 263 may be further arranged to allow one or more third down-images to be made by the one or more lookdown cameras 510 through the one or more imaging portions 255 if the third level 253 is positioned in a field-of-view 540 of the one or more look-down cameras 510. The one or more third down-images by the one or more look-down cameras 510 may be arranged to provide a third down-orientation and / or down-position of the reference member.

[0073] For example, a transparent mark carrier 250 may be provided on a portion of a glass plate. One or more reference marks 261, 262, 263 may be at least partially embedded or at least partially recessed in a portion of a surface of the mark carrier 250. Optionally, one or more reference marks 261, 262, 263 may be fully embedded in a portion of a surface of the mark carrier 250. For example, transparent imaging regions may be provided in a metal layer, such as chrome, which has been deposited onto a surface of a glass platelet. Additionally, the one or more reference marks 261 , 262, 263 may be provided by selective etching or masking of a metal layer, such as chrome, which has been deposited onto a surface of a glass platelet. The material used for the mark carrier 250, such as a glass, must be sufficiently transparent to the radiation used for the down-images.

[0074] As described above, the one or more look-up cameras 410 may be further arranged to determine at least one component position and / or orientation of one or more component marks 640. Optionally, the determination may be performed before attachment of a component 600 to the gripper 160, during attachment to the gripper 160 or after attachment to the gripper 160. Any suitable component mark 640 may be used. For example, a component mark 640 may be a physical feature of at least a portion of a component, an optical characteristic of at least a portion of a component 600, at least a portion of a fiducial, or any combination thereof.

[0075] The apparatus described herein, and all the variations and embodiments described herein, are suitable for performing the methods disclosed below.

[0076] The one or more tool references described herein are suitable for performing at least one alignment or calibration procedure, wherein at least one orientation and / or position of a reference member attached to one or more tool references described herein.

[0077] For example, a method for performing at least one alignment or calibration procedure comprising the steps of: making one or more first up-images using the one or more first cameras 410; making one or more second up-images using the one or more first cameras 410; determining a first up-orientation and / or up-position of the reference member using the one or more first up-images; and determining a second up-orientation and / or up- position of the reference member using the one or more second up-images.

[0078] Additionally or alternatively, if the mark carrier 250 comprises one or more transparent imaging portions 255, a method for performing at least one alignment or calibration procedure may comprise: making one or more first down-images using the one or more second cameras 510; making one or more second down-images using the one or more second cameras 510; determining a first down-orientation and / or down-position of the reference member using the one or more first down-images; and determining a second down-orientation and / or down-position of the reference member using the one or more second down-images.

[0079] The one or more tool references described herein are also suitable for positioning one or more components 600 using a pick and place actuator 150, wherein: the pick and place actuator 150 comprises a gripper 160 for releasably attaching to the one or more components 600; and the reference member of one or more tool references as described herein is comprised in the pick and place actuator 150.

[0080] For example, a method for positioning one or more components 600 comprising the steps of: using one or more first cameras 410 as one or more look-up cameras, to make one or more first up-images of the one or more first reference marks 261; using the one or more first cameras 410 to make the one or more second up-images of the one or more second reference marks 262; and determining at least one up-orientation and / or up-position of the gripper 160 using the one or more first up-images and / or one or more second up-images.

[0081] Optionally, the method for positioning one or more components may comprise: modifying at least one position and / or orientation of the pick and place actuator 150 using the at least one up-orientation and / or up-position of the gripper 160.

[0082] Optionally, if the one or more components 600 comprise one or more component marks 640 at a component mark level 641 , wherein the one or more component marks 640 are arranged to allow one or more component images to be made by the one or more first cameras 410, the method for positioning one or more components 600 may further comprise: attaching the one or more components 600 to the gripper 160; using the one or more first cameras 410 to make one or more component images of the one or more component marks 640; and determining at least one component orientation and / or component position using the one or more component images. Optionally, the method for positioning one or more components 600 may further comprise: modifying at least one position and / or orientation of the gripper 160 using the at least one component orientation and / or component position. The one or more tool references described herein are also suitable for both positioning one or more components 600 and aligning the one or more components 600 with one or more substrates 300 before attachment.

[0083] For example, a method for aligning the one or more components 600 with one or more substrates 300 before attachment comprising the steps of: providing the one or more substrates 300 to an attaching position 800, wherein the one or more substrates 300 comprise one or more substrate marks 340; using the one or more first cameras 410, arranged as one or more look-up cameras, to make one or more first up-images of the one or more first reference marks 261, and to make one or more second up-images of the one or more second reference marks 262; determining a first up-orientation and / or up- position using the one or more first up-images of the one or more first reference marks 261 ; determining a second up-orientation and / or up-position using the one or more second up-images of the one or more second reference marks 262; determining a gripper alignment correction using the first up-orientation and / or up-position with the second up- orientation and / or up-position; moving the gripper 160 to the attaching position 800; using the one or more look-down cameras at the attaching position 800 to make one or more substrate mark images of the one or more substrate marks 340; determining a substrate mark orientation and / or position using the one or more substrate mark images of the one or more substrate marks 340; and determining a substrate mark alignment correction using the substrate mark position and / or orientation.

[0084] Optionally, the method for aligning the one or more components 600 with one or more substrates 300 before attachment may further comprise: modifying at least one orientation and / or position of the gripper 160 relative to the substrate 300, based on the gripper alignment correction. Optionally, the method for aligning the one or more components 600 with one or more substrates 300 before attachment may further comprise: modifying at least one orientation and / or position of the gripper 160 relative to the substrate 300 based on the substrate mark alignment correction. Optionally, the method for aligning the one or more components 600 with one or more substrates 300 before attachment may further comprise: attaching the one or more components 600 with the one or more substrates 300.

[0085] Optionally, if the mark carrier 250 comprises one or more transparent imaging portions 255, the method for aligning the one or more components 600 with one or more substrates 300 before attachment may further comprise: using the one or more second cameras 510, arranged as one or more look-down cameras, to make one or more first down-images of the one or more first reference marks 261, and to make one or more second down-images of the one or more second reference marks 262; determining a first down-orientation and / or down-position using the one or more first down-images of the one or more first reference marks 261 ; determining a second down-orientation and / or downposition using the one or more second down-images of the one or more second reference marks 262; and determining a further gripper alignment correction using the first downorientation and / or down-position with the second down-orientation and / or down-position. Optionally, the method for aligning the one or more components 600 with one or more substrates 300 before attachment may further comprise: modifying at least one orientation and / or position of the gripper 160 based on the further gripper alignment correction.

[0086] The embodiments described above refer to methods for attaching one or more components 600 and one or more substrates 300 using an attaching apparatus 100 to provide an example. The alignment methods and alignment and attaching apparatus described above may be adapted using obvious modifications to provide any further processing methods and respectively any further processing apparatus.

[0087] The pick and place actuator 150 is depicted in FIG. 2 as an assembly, with an approximate cross-sectional extent indicated by a dashed line. Many functions and features are described in this disclosure as being comprised in a pick and place actuator, or attached to a pick and place actuator, or associated with a pick and place actuator, but these should be taken as mere examples. A skilled person may configure and arrange one or more of these functions and features to be only partially comprised in a pick and place actuator, or only partially attached to a pick and place actuator, or only partially associated with a pick and place actuator.

[0088] List of Numerals

[0089] No. Short description

[0090] 100 component attaching apparatus

[0091] 111 first drive system

[0092] 112 second drive system

[0093] 113 gripper rotation drive

[0094] 115 drive guide

[0095] 120 feeder unit

[0096] 130 drive member

[0097] 140 substrate chuck

[0098] 150 pick and place actuator

[0099] 160 component gripper

[0100] 200 tool reference

[0101] 250 mark carrier

[0102] 251 first level

[0103] 252 second level

[0104] 253 third level

[0105] 255 imaging portion

[0106] 261 first reference mark at a first level

[0107] 262 second reference mark at a second level

[0108] 263 third reference mark at a third level

[0109] 300 substrate

[0110] 340 substrate mark

[0111] 410 first camera arranged as look-up camera

[0112] 430 illumination radiation source for a look-up camera

[0113] 440 look-up camera field-of-view

[0114] 510 second camera arranged as look-down camera

[0115] 530 illumination radiation source for a look-down camera

[0116] 540 look-down camera field-of-view

[0117] 600 component

[0118] 640 component mark

[0119] 641 component mark level

[0120] 800 attaching position

[0121] 810 component inspection position

[0122] 820 loading position

[0123] 910 first axis in Y direction

[0124] 920 second axis in X direction

[0125] 930 third axis in Z direction

Claims

Claims1. Tool reference (200) for determining at least one orientation and / or position of a reference member, wherein the tool reference (200) is attached to the reference member, the tool reference (200) comprising:- a mark carrier (250) with a first surface at a first level (251) and a second surface at a second level (252);- one or more first reference marks (261) on or proximate the first surface at the first level (251); and- one or more second reference marks (262) on or proximate the second surface at the second level (252); wherein the one or more first reference marks (261) are arranged to allow one or more first up-images to be made by one or more first cameras (410); wherein the one or more second reference marks (262) are arranged to allow one or more second up-images to be made by the one or more first cameras (410); wherein the one or more first up-images are arranged to provide a first up-orientation and / or up-position of the reference member; wherein the one or more second up-images are arranged to provide a second up- orientation and / or up-position of the reference member; and wherein the one or more first reference marks (261) at the first level (251) and the one or more second reference marks (262) at the second level (252) have an average separation distance of 1mm or more, or of 3mm or more, or of 5mm or more, or of 10mm or more, or of 25mm or more.

2. Tool reference (200) according to claim 1, wherein the mark carrier (250) has a third surface at a third level (253), the tool reference (200) comprising one or more third reference marks (263) on or proximate the third surface at the third level (253), wherein the one or more third reference marks (263) are arranged to allow one or more third up-images to be made by the one or more first cameras (410), wherein the one or more third up-images by the one or more first cameras (410) are arranged to provide a third up-orientation and / or up-position of the reference member.

3. Tool reference (200) according to claim 2 or claim 3, wherein the mark carrier (250) comprises one or more transparent imaging portions (255), wherein the one or more first reference marks (261) are arranged to allow one or more first down-images to be made by one or more second cameras (510) through the one or more imaging portions (255);wherein the one or more second reference marks (262) are arranged to allow one or more second down-images to be made by the one or more second cameras (510) through the one or more imaging portions (255); wherein the one or more first downimages are arranged to provide a first down-orientation and / or down-position of the reference member, and; wherein the one or more second down-images are arranged to provide a second down-orientation and / or down-position of the reference member.

4. Tool reference (200) according to claim 3, wherein the tool reference (200) comprises one or more third reference marks (263) on or proximate the third surface at the third level (253), wherein the one or more third reference marks (263) are arranged to allow one or more third down-images to be made by the one or more second cameras (510) through the one or more imaging portions (255), and wherein the one or more third down-images are arranged to provide a third down-orientation and / or down-position of the reference member.

5. Tool reference (200) according to claim 3 or claim 4, wherein the one or more transparent imaging portions (255) comprise a material selected from the group comprising: a glass, a crystal, a plastic, a semiconductor, silicon, a liquid, a metal, or any combination thereof.

6. Tool reference (200) according to any preceding claim, wherein the tool reference (200) comprises one or more code marks, arranged to allow one or more code images to be made by an image sensor, wherein the one or more code images are arranged to provide one or more parameters of the one or more code marks selected from the group comprising: an orientation, a position, a parameter, a value, a number, or any combination thereof.

7. Tool reference (200) according to any preceding claim, wherein the tool reference (200) comprises an illumination radiation source, arranged to provide radiation for one or more camera images.

8. Apparatus (100) for positioning one or more components (600), the apparatus (100) comprising:- a pick and place actuator (150), wherein the pick and place actuator (150) comprises a gripper (160) for releasably attaching to the one or more components (600);- one or more tool references (200) according to any one of the claims 1 to 8, wherein the reference member is comprised in the pick and place actuator (150), and wherein the one or more tool references (200) are arranged to allow at least one up-orientation and / or up-position of the gripper (160) to be determined;- one or more first cameras (410), arranged as one or more look-up cameras, for making one or more first up-images of the one or more first reference marks (261), and further arranged for making the one or more second up-images of the one or more second reference marks (262); and wherein the apparatus (100) is arranged to modify at least one position and / or orientation of the pick and place actuator (150) using the at least one up-position and / or up-orientation of the gripper (160).

9. Apparatus (100) according to claim 8, wherein the one or more components (600) comprise one or more component marks (640) at a component mark level (641), wherein after attaching the one or more components (600) to the gripper (160), the one or more component marks (640) are arranged to allow one or more component images to be made by the one or more first cameras (410), wherein the one or more component images are arranged to provide at least one orientation and / or position of the one or more components (600), and wherein the apparatus (100) is arranged to modify at least one position and / or orientation of the pick and place actuator (150) using the at least one position and / or orientation of the one or more components (600).

10. Apparatus (100) according to claim 8 or claim 9, wherein the pick and place actuator (150) is arranged to be disposed at an attaching position (800), the apparatus (100) comprising a substrate chuck (140) for providing one or more substrates (300) to the attaching position (800); and wherein the apparatus (100) is arranged for aligning one or more components (600) with one or more substrates (300) before attaching using the at least one up-position and / or up-orientation of the gripper (160).

11. Apparatus (100) according to claim 10, the apparatus (100) comprising one or more second cameras (510), arranged as one or more look-down cameras, for making one or more first down-images of the one or more first reference marks (261), and further arranged for making one or more second down-images of the one or more second reference marks (262), wherein the one or more first down-images are arranged to provide a first down-orientation and / or down-position of the reference member, wherein the one or more second down-images are arranged to provide a second down-orientation and / or down-position of the reference member, and wherein the apparatus (100) is arranged to modify at least one position and / or orientation of the pick and place actuator (150) using at least one down-position and / or downorientation of the gripper (160).

12. Method for determining at least one orientation and / or position of a reference member attached to one or more tool references (200), wherein the one or more toolreferences (200) comprising a mark carrier (250) with a first surface at a first level (251) and a second surface at a second level (252); one or more first reference marks (261) on or proximate the first surface at the first level (251); and one or more second reference marks (262) on or proximate the second surface at the second level (252), wherein the one or more first reference marks (261) are arranged to allow one or more first up-images to be made by one or more first cameras (410), wherein the one or more second reference marks (262) are arranged to allow one or more second up- images to be made by the one or more first cameras (410), wherein the one or more first reference marks (261) at the first level (251) and the one or more second reference marks (262) at the second level (252) have an average separation distance of 1mm or more, or of 3mm or more, or of 5mm or more, or of 10mm or more, or of 25mm or more, whereby the method comprising the steps of:- making one or more first up-images using the one or more first cameras (410);- making one or more second up-images using the one or more first cameras (410);- determining a first up-orientation and / or up-position of the reference member using the one or more first up-images; and- determining a second up-orientation and / or up-position of the reference member using the one or more second up-images.

13. Method according to claim 12, wherein, the mark carrier (250) comprises one or more transparent imaging portions (255), wherein the one or more first reference marks (261) are arranged to allow one or more first down-images to be made by one or more second cameras (510) through the one or more imaging portions (255), and wherein the one or more second reference marks (262) are arranged to allow one or more second down-images to be made by the one or more second cameras (510) through the one or more imaging portions (255); the method further comprising:- making one or more first down-images using the one or more second cameras (510);- making one or more second down-images using the one or more second cameras (510);- determining a first down-orientation and / or down-position of the reference member using the one or more first down-images; and- determining a second down-orientation and / or down-position of the reference member using the one or more second down-images.

14. Method for positioning one or more components (600) using a pick and place actuator (150), wherein the pick and place actuator (150) comprises a gripper (160) forreleasably attaching to the one or more components (600), and the reference member of one or more tool references (200) according to any one of the claims 1 to 8 is comprised in the pick and place actuator (150), the method comprising the steps of:- using one or more first cameras (410) as one or more look-up cameras, to make one or more first up-images of the one or more first reference marks (261);- using the one or more first cameras (410) to make the one or more second up- images of the one or more second reference marks (262);- determining at least one up-orientation and / or up-position of the gripper (160) using the one or more first up-images and / or one or more second up-images; and modifying at least one position and / or orientation of the pick and place actuator (150) using the at least one up-orientation and / or up-position of the gripper (160).

15. Method according to claim 14, wherein the one or more components (600) comprise one or more component marks (640) at a component mark level (641), wherein the one or more component marks (640) are arranged to allow one or more component images to be made by the one or more first cameras (410); the method further comprising:- attaching the one or more components (600) to the gripper (160);- using the one or more first cameras (410) to make one or more component images of the one or more component marks (640);- determining at least one component orientation and / or component position using the one or more component images; and- modifying at least one position and / or orientation of the gripper (160) using the at least one component orientation and / or component position.

16. Method for aligning one or more components (600) with one or more substrates (300) before attachment, comprising the method for positioning one or more components according to any one of claims 14 to 15, the method further comprising the steps of:- providing the one or more substrates (300) to an attaching position (800), wherein the one or more substrates (300) comprise one or more substrate marks (340);- using the one or more first cameras (410), arranged as one or more look-up cameras, to make one or more first up-images of the one or more first reference marks (261), and to make one or more second up-images of the one or more second reference marks (262);- determining a first up-orientation and / or up-position using the one or more first up- images of the one or more first reference marks (261);- determining a second up-orientation and / or up-position using the one or more second up-images of the one or more second reference marks (262);- determining a gripper alignment correction using the first up-orientation and / or up- position with the second up-orientation and / or up-position;- moving the gripper (160) to the attaching position (800);- using the one or more look-down cameras at the attaching position (800) to make one or more substrate mark images of the one or more substrate marks (340);- determining a substrate mark orientation and / or position using the one or more substrate mark images of the one or more substrate marks (340); and- determining a substrate mark alignment correction using the substrate mark position and / or orientation.

17. Method according to claim 16, wherein the method further comprises modifying at least one orientation and / or position of the gripper (160) relative to the substrate (300), based on the gripper alignment correction.

18. Method according to any one of claims 16 to 17, wherein the method further comprises modifying at least one orientation and / or position of the gripper (160) relative to the substrate (300) based on the substrate mark alignment correction.

19. Method according to any one of claims 16 to 18, wherein the method further comprises attaching the one or more components (600) with the one or more substrates (300).

20. Method according to any one of the claims 16 to 18, wherein the one or more first reference marks (261) are arranged to allow one or more first down-images to be made by one or more second cameras (510) through the one or more imaging portions (255), and wherein the one or more second reference marks (262) are arranged to allow one or more second down-images to be made by the one or more second cameras (510) through the one or more imaging portions (255), the method further comprising the steps of:- using the one or more second cameras (510), arranged as one or more lookdown cameras, to make one or more first down-images of the one or more first reference marks (261), and to make one or more second down-images of the one or more second reference marks (262);- determining a first down-orientation and / or down-position using the one or more first down-images of the one or more first reference marks (261);- determining a second down-orientation and / or down-position using the one or more second down-images of the one or more second reference marks (262); and- determining a further gripper alignment correction using the first down-orientation and / or down-position with the second down-orientation and / or down-position.

21. Method according to claim 20, wherein the method further comprises modifying at least one orientation and / or position of the gripper (160), based on the further gripper alignment correction.

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