Substrate work machine and method for creating correction data

Abstract

A substrate work machine comprising: a holding device that holds a substrate; a work head that performs work on the substrate which is held by the holding device; an imaging device that images the substrate which is held by the holding device; a movement device that moves both the work head and the imaging device relative to the substrate which is held by the holding device; and a control device that, when a group of marks is defined as a plurality of marks which are from among a plurality of marks provided in a matrix on a matrix substrate, and given that each group has a plurality of marks, creates first correction data for correcting the work position of the work head on the basis of the position of each mark in a plurality of groups which is calculated on the basis of respective imaging data of each mark of a plurality of groups which the imaging device images while changing the imaging position.

Description

Substrate-related operation machine and correction data creation method

[0001] The present invention relates to a substrate-related operation machine or the like that creates correction data using a matrix substrate.

[0002] The following patent document describes a technique for creating correction data using a matrix substrate.

[0003] JP 2004-220371 A

[0004] An object of the present specification is to appropriately generate correction data using a matrix substrate.

[0005] In order to solve the above problems, this specification discloses a substrate-related work machine comprising: a holding device for holding a substrate; a work head for performing work on the substrate held by the holding device; an imaging device for imaging the substrate held by the holding device; a moving device for moving both the work head and the imaging device relative to the substrate held by the holding device; and a control device for defining a group of marks among a plurality of marks on a matrix substrate having the marks written in a matrix pattern, and for imaging each of the plurality of groups of marks while changing the imaging position of the imaging device, and for creating first correction data for correcting the work position of the work head based on the positions of the plurality of groups of marks calculated based on the imaging data of each of the plurality of marks.

[0006] Furthermore, in order to solve the above-mentioned problems, this specification discloses a correction data creation method for a substrate-related work machine comprising a holding device for holding a substrate, a work head for performing work on the substrate held by the holding device, an imaging device for imaging the substrate held by the holding device, and a moving device for moving both the work head and the imaging device relative to the substrate held by the holding device, in which a plurality of marks on a matrix substrate on which the plurality of marks are written in a matrix form are considered to be a group of marks, and the imaging device images each of the plurality of groups of marks while changing its imaging position, and correction data is created to correct the work position of the work head based on the position of each of the plurality of groups of marks calculated based on the imaging data for each of the plurality of groups of marks.

[0007] In the present disclosure, an imaging device captures images of a group of marks on a matrix substrate at least multiple times while changing the imaging position. Then, a control device generates correction data for correcting the work position of the work head based on the positions of the group of marks calculated based on the imaging data from each of the multiple images. This makes it possible to appropriately generate correction data for correcting the work position of the work head.

[0008] 1 is a perspective view showing an electronic component mounting apparatus; FIG. 2 is a block diagram showing a control device; FIG. 3 is a diagram showing a matrix substrate; FIG. 4 is a diagram showing a matrix substrate when imaging a first mark; FIG. 5 is a diagram showing a matrix substrate when imaging a first mark; FIG. 6 is a diagram showing a matrix substrate when imaging a first mark; FIG. 7 is a diagram showing a matrix substrate when imaging a first mark; FIG. 8 is a diagram showing a matrix substrate when imaging a first group of marks when creating correction data at 2.5 mm intervals; FIG. 9 is a diagram showing a matrix substrate when imaging a first group of marks when creating correction data at 2.5 mm intervals; FIG. 10 is a diagram showing a matrix substrate when imaging a first mark when creating correction data at 2.5 mm intervals; FIG. 11 is a diagram showing a matrix substrate when imaging a first mark when creating correction data at 2.5 mm intervals;

[0009] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings as modes for carrying out the present invention.

[0010] 1 shows an electronic component mounting apparatus 10. The electronic component mounting apparatus 10 is an apparatus for mounting electronic components on a circuit board. The electronic component mounting apparatus 10 has one system base 14 and two adjacent placement machines 16 on the system base 14. In the following description, the direction in which the placement machines 16 are lined up will be referred to as the X-axis direction, and the horizontal direction perpendicular to that direction will be referred to as the Y-axis direction.

[0011] Each placement machine 16 mainly comprises a placement machine main body 20, a transport device 22, a placement head moving device (hereinafter sometimes abbreviated as "moving device") 24, a placement head 26, a supply device 28, a mark camera (see FIG. 2) 30, and a part camera 32. The placement machine main body 20 is composed of a frame 36 and a beam 38 suspended from the frame 36.

[0012] The transport device 22 includes two conveyor devices 40, 42. The two conveyor devices 40, 42 are arranged on the frame 36 so as to be parallel to each other and extend in the X-axis direction. Each of the two conveyor devices 40, 42 transports a circuit board supported by the respective conveyor device 40, 42 in the X-axis direction by an electromagnetic motor (see FIG. 2) 44. The circuit board transported by each conveyor device 40, 42 is held at a predetermined position by a board holding device (see FIG. 2) 46.

[0013] The moving device 24 is an XY robot type moving device. The moving device 24 is equipped with an electromagnetic motor (see FIG. 2) 52 that slides the slider 50 in the X-axis direction, and an electromagnetic motor (see FIG. 2) 54 that slides the slider 50 in the Y-axis direction. The mounting head 26 is attached to the slider 50, and the mounting head 26 is moved to any position on the frame 36 by the operation of the two electromagnetic motors 52, 54.

[0014] The placement head 26 places electronic components on the circuit board. The placement head 26 has a suction nozzle 60 provided on its bottom surface. The suction nozzle 60 is connected to a positive / negative pressure supply device (see FIG. 2) 66 via negative pressure air and positive pressure air passages. The suction nozzle 60 sucks and holds electronic components by negative pressure and releases the held electronic components by positive pressure. The placement head 26 also has a nozzle lifting device (see FIG. 2) 68 that raises and lowers the suction nozzle 60. The nozzle lifting device 68 raises and lowers the suction nozzle 60 to change the vertical position of the electronic component held by the suction nozzle 60.

[0015] Supply device 28 is a feeder-type supply device and is disposed at an end of frame 36. Supply device 28 has a plurality of tape feeders 70. Tape feeders 70 accommodate tape-formed components in a wound state. Tape-formed components are electronic components taped to a carrier tape. Tape feeder 70 has a delivery device (see FIG. 2) 76, which is operated to deliver tape-formed components. Thus, feeder-type supply device 28 delivers tape-formed components to the delivery position.

[0016] The mark camera 30 (see FIG. 2) is fixed to the slider 50 of the moving device 24 in a downward facing position, and is moved to any position together with the mounting head 26 by the operation of the moving device 24. This allows the mark camera 30 to capture an image of any position on the frame 36. Also, as shown in FIG. 1, the part camera 32 is disposed on the top surface of the frame 36, between the transport device 22 and the supply device 28, in a upward facing position. This allows the part camera 32 to capture an image of a component held by the suction nozzle 60, etc.

[0017] As shown in FIG. 2 , the electronic component mounting apparatus 10 also includes a control device 80. The control device 80 includes a controller 82 and a plurality of drive circuits 84. The drive circuits 84 are connected to the electromagnetic motors 44, 52, and 54, the substrate holding device 46, the positive / negative pressure supply device 66, the nozzle lifting device 68, and the feed device 76. The controller 82, which includes a CPU, ROM, RAM, and the like and is primarily a computer, is connected to the plurality of drive circuits 84. This allows the controller 82 to control the operation of the transport device 22, the moving device 24, and the like. The controller 82 is also connected to an image processing device 86. The image processing device 86 processes image data captured by the mark camera 30 and the part camera 32. This allows the controller 82 to acquire various information from the image data.

[0018] In electronic component mounting apparatus 10, with the above-described configuration, mounting head 26 performs the operation of mounting electronic components on a circuit board held by conveyance device 22. Specifically, in response to a command from controller 82, the circuit board is conveyed to the operation position, where it is held by board holding device 46. Furthermore, once the circuit board is held by board holding device 46, mark camera 30 is moved above the circuit board in response to a command from controller 82 and captures an image of the circuit board. In this way, controller 82 obtains information regarding the holding position of the circuit board, etc.

[0019] Furthermore, in the supply device 28, the tape feeder 70 feeds out the tape-packaged components and supplies the electronic components at the supply position in response to a command from the controller 82. Then, the placement head 26 is moved to a position above the electronic component supply position in response to a command from the controller 82, and the suction nozzle 60 suctions and holds the electronic components. Next, the placement head 26 is moved to a position above the part camera 32 in response to a command from the controller 82, and the part camera 32 captures an image of the electronic components held by the suction nozzle 60. This allows the controller 82 to acquire information regarding the component holding posture, etc. Then, the placement head 26 is moved to a position above the circuit board in response to a command from the controller 82, and places the electronic components in predetermined positions on the circuit board based on the holding position of the circuit board, the holding posture of the electronic components, etc. At this time, the placement head 26 moves to a position above the intended placement position of the electronic components on the circuit board, and the suction nozzle 60 is lowered by the nozzle lifting device 68, thereby placing the electronic components in the intended placement positions on the circuit board.

[0020] In this way, in electronic component mounting apparatus 10, electronic components held by suction nozzles 60 of mounting head 26 are mounted at the intended mounting positions on the circuit board. For this reason, it is necessary to properly align the position of mounting head 26, which is moved by moving device 24, with the intended mounting positions of electronic components on the circuit board in the vertical direction. Therefore, before shipping electronic component mounting apparatus 10, the mounting positions of electronic components by mounting head 26 are corrected using a matrix board.

[0021] More specifically, as shown in Fig. 3, a plurality of marks 102 are written in a matrix on the matrix substrate 100. The plurality of marks 102 are written at equal pitches in the vertical and horizontal directions which are orthogonal to each other, and the plurality of marks 102 are written in N rows and M columns at equal pitches. Note that on the matrix substrate 100 shown in Fig. 3, 16 plurality of marks 102 are written in 4 rows and 4 columns at 5 mm pitches.

[0022] The matrix substrate 100 is then transported by the transport device 22 to the work position, where it is held by the substrate holding device 46. The substrate holding device 46 holds the matrix substrate 100 so that the horizontal and vertical directions of the arrangement of the multiple marks 102 on the matrix substrate 100 coincide with the X-axis and Y-axis directions. The matrix substrate 100 may be placed on rails 48 of the substrate holding device 46. This is because the matrix substrate 100 is not the target of the mounting work and therefore does not necessarily need to be transported. The moving device 24 then moves the mark camera 30 above the matrix substrate 100. At this time, as shown in FIG. 4 , the moving device 24 moves the mark camera 30 so that a predetermined mark 102 a of the multiple marks 102 on the matrix substrate 100 is at the center of the imaging range 110 of the mark camera 30. The imaging range 110 of the mark camera 30 is a range determined by the angle of view of the mark camera 30, and is, for example, the range within a square with sides of 9 mm. In this way, when the mark camera 30 moves so that a predetermined one of the marks 102 a is at the center of the imaging range 110 of the mark camera 30, the mark camera 30 captures an image of the one mark 102 a. Then, the controller 82 calculates the position of the one mark 102 a, i.e., the XY coordinates, based on the imaging data.

[0023] In this way, when the mark camera 30 captures an image of the first mark 102a, the movement device 24 moves the mark camera 30 horizontally by 5 mm. As described above, the plurality of marks 102 are marked on the matrix substrate 100 at 5 mm pitches, and the horizontal and vertical directions in which the plurality of marks 102 are arranged on the matrix substrate 100 coincide with the X-axis and Y-axis directions. Therefore, by moving the mark camera 30 horizontally by 5 mm, as shown in FIG. 5 , the mark camera 30 moves so that the first mark 102b, which is adjacent to the first mark 102a among the plurality of marks 102, becomes the center of the imaging range 110 of the mark camera 30. Then, the mark camera 30 captures an image of the first mark 102b, and the controller 82 calculates the position of the first mark 102b, i.e., the X- and Y-coordinates, based on the image data.

[0024] Next, when the mark camera 30 captures an image of the first mark 102b, the movement device 24 moves the mark camera 30 horizontally by another 5 mm. Therefore, by moving the mark camera 30 horizontally by 5 mm, as shown in Fig. 6, the mark camera 30 moves so that the first mark 102c, which is adjacent to the first mark 102b among the multiple marks 102, becomes the center of the imaging range 110 of the mark camera 30. The mark camera 30 then captures an image of the first mark 102c, and the controller 82 calculates the position of the first mark 102c, i.e., the XY coordinates, based on the image data.

[0025] In this way, the mark camera 30 captures an image of one mark 102 every time it moves horizontally 5 mm, capturing images of multiple marks 102 arranged in one horizontal row. Then, the mark camera 30 moves vertically 5 mm, returns to the first column in the X direction, captures an image of a mark 102, and then captures an image of the first mark 102 every time it moves horizontally 5 mm. Using this method, the mark camera 30 captures images of all marks 102 within the range that can be moved by the moving device 24, and the controller 82 calculates the position of the first mark 102 based on the image data for each capture. The controller 82 then creates correction data based on the position of the first mark 102 calculated based on the image data. This correction data is data for correcting the operation of the moving device 24. By correcting the operation of the moving device 24 using the correction data, it is possible to reliably align the center of the imaging range 110 and the first mark 102 in the vertical direction when the moving device 24 moves the mark camera 30. Furthermore, in electronic component placement apparatus 10, placement head 26 is attached to slider 50 of moving device 24 together with mark camera 30, and moves together with mark camera 30. Therefore, by correcting the operation of moving device 24 using the calculated correction data, it is possible to reliably align the electronic component held by suction nozzle 60 with the intended placement position of the electronic component on the circuit board in the vertical direction when moving device 24 moves placement head 26. In this way, correction data is created using the matrix board, and the placement position of the electronic component by placement head 26 is corrected based on that correction data.

[0026] Furthermore, although the plurality of marks 102 are marked at 5 mm pitches on the matrix substrate 100, by using a matrix substrate on which the plurality of marks are marked at pitches shorter than 5 mm, it is possible to correct the mounting positions of electronic components with even greater precision. Specifically, as shown in Fig. 7, the matrix substrate 120 has 64 plurality of marks 122 marked at 2.5 mm pitches in 8 rows and 8 columns.

[0027] The matrix substrate 120 is then transported by the transport device 22 to the work position, where it is held by the substrate holding device 46. The substrate holding device 46 holds the matrix substrate 120 so that the horizontal and vertical directions in which the multiple marks 122 on the matrix substrate 120 are aligned coincide with the X-axis and Y-axis directions. The moving device 24 then moves the mark camera 30 above the matrix substrate 120. At this time, as shown in FIG. 8 , the moving device 24 moves the mark camera 30 so that a predetermined mark 122a among the multiple marks 122 on the matrix substrate 120 is located at the center of the imaging range 110 of the mark camera 30. In this way, when the mark camera 30 moves so that a predetermined mark 122a among the multiple marks 122 is located at the center of the imaging range 110 of the mark camera 30, it captures an image of the single mark 122a. The controller 82 then calculates the position of the single mark 122a, i.e., the X- and Y-coordinates, based on the imaging data.

[0028] In this way, when the mark camera 30 captures an image of the first mark 122a, the movement device 24 moves the mark camera 30 horizontally by 2.5 mm. As described above, the plurality of marks 122 are marked on the matrix substrate 120 at a 2.5 mm pitch, and the horizontal and vertical directions in which the plurality of marks 122 are arranged on the matrix substrate 120 coincide with the X-axis and Y-axis directions. Therefore, by moving the mark camera 30 horizontally by 2.5 mm, as shown in FIG. 9 , the mark camera 30 moves so that the first mark 122b, which is adjacent to the first mark 122a among the plurality of marks 122, becomes the center of the imaging range 110 of the mark camera 30. The mark camera 30 then captures an image of the first mark 122b, and the controller 82 calculates the position of the first mark 122b, i.e., the X- and Y-coordinates, based on the image data.

[0029] Next, when the mark camera 30 captures an image of the first mark 122b, the movement device 24 moves the mark camera 30 horizontally by another 2.5 mm. Therefore, by moving the mark camera 30 horizontally by 2.5 mm, as shown in Fig. 10, the mark camera 30 moves so that the first mark 122c, which is adjacent to the first mark 122b among the multiple marks 122, becomes the center of the imaging range 110 of the mark camera 30. The mark camera 30 then captures an image of the first mark 122c, and the controller 82 calculates the position of the first mark 122c, i.e., the XY coordinates, based on the image data.

[0030] In this way, when the mark camera 30 images one mark 122 every time it moves horizontally 2.5 mm, and images a row of multiple marks 122 lined up horizontally, the mark camera 30 moves vertically 2.5 mm, and then images one mark 122 every 2.5 mm of horizontal movement. Using this method, the mark camera 30 images all of the marks 122 within the range that can be moved by the moving device 24, and the controller 82 calculates the position of the first mark 122 based on the image data for each image capture. The controller 82 then creates correction data based on the position of the first mark 122 calculated based on the image data. At this time, by correcting the operation of the moving device 24 using the calculated correction data, it is possible to reliably align the electronic component held by the suction nozzle 60 with the intended mounting position of the electronic component on the circuit board in the vertical direction when the moving device 24 moves the mounting head 26. In this way, by creating correction data using a matrix substrate 120 on which multiple marks 122 are written at a 2.5 mm pitch, and correcting the mounting position of electronic components using the mounting head 26 based on that correction data, it is possible to correct the mounting position of electronic components with even greater accuracy.

[0031] However, in the matrix substrate 120 on which a plurality of marks 122 are marked at a 2.5 mm pitch, the marks 122 are imaged more frequently than in the matrix substrate 100 on which a plurality of marks 102 are marked at a 5 mm pitch. This increases the time required to image the marks 122, making the creation of correction data a time-consuming task. Furthermore, it is necessary to prepare two types of matrix substrates 100 and 120, which makes it difficult to manage the matrix substrates 100 and 120.

[0032] In consideration of this, two types of correction data are created using one type of matrix substrate 100: correction data with 5 mm intervals and correction data with 2.5 mm intervals, which is more accurate than the correction data with 5 mm intervals. More specifically, when creating the correction data with 5 mm intervals, as described above, the mark camera 30 captures images of at least one mark 102 out of the multiple marks 102 on the matrix substrate 100 multiple times while changing the imaging position at 5 mm intervals. The controller 82 then calculates the position of one mark 102 based on the imaging data from each of the multiple images, and creates correction data with 5 mm intervals based on the calculated position of one mark 102. The correction data with 5 mm intervals calculated in this manner is used to correct the placement positions of electronic components by the mounting head.

[0033] On the other hand, when creating correction data with 2.5 mm intervals, the mark camera 30 images two or more marks 102 of the multiple marks 102 on the matrix substrate 100 as a group of marks 102 multiple times while changing the imaging position at 2.5 mm intervals. Specifically, the matrix substrate 100 is transported to the work position by the transport device 22 and held at that position by the substrate holding device 46. The substrate holding device 46 holds the matrix substrate 100 so that the horizontal and vertical directions in which the multiple marks 102 on the matrix substrate 100 are aligned coincide with the X-axis and Y-axis directions. The moving device 24 then moves the mark camera 30 above the matrix substrate 100. At this time, the moving device 24 moves the mark camera 30 so that the centers of two adjacent marks 102d and 102e of the multiple marks 102 on the matrix substrate 100 are aligned with the center of the imaging range 110 of the mark camera 30, as shown in FIG. 11 . In this way, when the mark camera 30 moves so that the center of the two marks 102d, 102e is at the center of the imaging range 110 of the mark camera 30, the two marks 102d, 102e are imaged. Then, the controller 82 calculates the XY coordinates of the centers of the two marks 102d, 102e as the position of the group of marks based on the image data. In other words, the controller 82 calculates the average value of the XY coordinates of the two marks 102d, 102e as the position of the group of marks.

[0034] In this way, after the mark camera 30 captures the images of the two marks 102d and 102e, the movement device 24 moves the mark camera 30 horizontally by 2.5 mm. As described above, the multiple marks 102 are marked on the matrix substrate 100 at 5 mm pitches, and the horizontal and vertical directions in which the multiple marks 102 are arranged on the matrix substrate 100 coincide with the X-axis and Y-axis directions. Therefore, when the mark camera 30 moves horizontally by 2.5 mm, it moves horizontally by a distance equivalent to half the formation pitch of the marks 102. As a result, the mark camera 30 moves so that the centers of the four marks 102d, 102e, 102f, and 102g, including the two marks 102d and 102e captured previously, are at the center of the imaging range 110 of the mark camera 30, as shown in FIG. 12 . The mark camera 30 then captures images of the four marks 102d, 102e, 102f, and 102g, and the controller 82 calculates the X and Y coordinates of the centers of the four marks 102d, 102e, 102f, and 102g as the position of a group of marks based on the captured image data. In other words, the controller 82 calculates the average value of the X and Y coordinates of the four marks 102d, 102e, 102f, and 102g as the position of a group of marks.

[0035] Next, when the mark camera 30 captures images of the four marks 102d, 102e, 102f, and 102g, the movement device 24 moves the mark camera 30 horizontally by another 2.5 mm. Therefore, the mark camera 30 moves horizontally a distance equivalent to half the formation pitch of the marks 102. As a result, the mark camera 30 moves so that the centers of two marks 102f and 102g, of the four marks 102d, 102e, 102f, and 102g previously captured, are positioned at the center of the imaging range 110 of the mark camera 30, as shown in FIG. 13 . The mark camera 30 then captures images of the two marks 102f and 102g, and the controller 82 calculates the XY coordinates of the centers of the two marks 102f and 102g as the position of the group of marks based on the captured image data. In other words, the controller 82 calculates the average value of the XY coordinates of the two marks 102f and 102g as the position of the group of marks.

[0036] In this way, the mark camera 30 captures an image of one group of marks 102 every time it moves 2.5 mm in the horizontal direction, and when it has captured an image of a row of multiple marks 102 lined up in the horizontal direction, the mark camera 30 moves 2.5 mm in the vertical direction. Therefore, the mark camera 30 moves vertically a distance equivalent to half the formation pitch of the marks 102. As a result, the mark camera 30 moves so that one mark 102f of the two marks 102f, 102g captured earlier is at the center of the imaging range 110 of the mark camera 30, as shown in FIG. 14 . Then, the mark camera 30 captures an image of one mark 102f, and the controller 82 calculates the XY coordinates of the one mark 102f based on the image data.

[0037] When the mark camera 30 captures an image of one mark 102f, the movement device 24 moves the mark camera 30 horizontally by 2.5 mm. Therefore, the mark camera 30 moves horizontally a distance equivalent to half the formation pitch of the marks 102. As a result, the mark camera 30 moves so that the center of the two marks 102f, 102h, including the previously captured mark 102f, is at the center of the imaging range 110 of the mark camera 30, as shown in FIG. 15 . The mark camera 30 then captures images of the two marks 102f, 102h, and the controller 82 calculates the XY coordinates of the centers of the two marks 102f, 102h as the position of the group of marks based on the captured image data. In other words, the controller 82 calculates the average value of the XY coordinates of the two marks 102f, 102h as the position of the group of marks.

[0038] After the mark camera 30 captures the images of the two marks 102f, 102h, the movement device 24 moves the mark camera 30 horizontally by an additional 2.5 mm. As a result, the mark camera 30 moves horizontally a distance equivalent to half the formation pitch of the marks 102. As a result, the mark camera 30 moves so that one mark 102h of the two marks 102f, 102h captured earlier is at the center of the imaging range 110 of the mark camera 30, as shown in FIG. 16 . The mark camera 30 then captures an image of one mark 102h, and the controller 82 calculates the XY coordinates of the one mark 102h based on the captured image data.

[0039] Using this method, the mark camera 30 captures images of all marks 102 within the range that can be moved by the moving device 24, and the controller 82 calculates the positions of the group of marks 102 and the positions of individual marks 102 based on the image data for each capture. When creating correction data at 2.5 mm intervals, as shown in FIGS. 11 to 13 and 15 , the mark camera 30 captures images of marks 102 not only at the center of the image capture range 110 but also at locations near the outer edge of the image capture range 110. Therefore, the lens of the mark camera 30 is corrected so that there is no distortion between the center and the outer edge of the image capture range 110. This allows the positions of the marks 102 located near the center of the image capture range 110 and the marks 102 located near the outer edge to be properly calculated. After calculating the positions of the group of marks 102 and the positions of individual marks 102 based on the image capture data, the controller 82 creates correction data at 2.5 mm intervals based on the positions of the group of marks 102 and the positions of individual marks 102. By using the correction data calculated in this manner, the placement positions of electronic components by the placement head can be corrected with high accuracy. In other words, the correction data for 2.5 mm intervals is created by having the mark camera 30 capture images of a group of marks 102 or a single mark 102 among the multiple marks 102 on the matrix substrate 100 multiple times while changing the imaging position at 2.5 mm intervals. On the other hand, the correction data for 5 mm intervals is created by having the mark camera 30 capture images of a single mark 102 among the multiple marks 102 on the matrix substrate 100 multiple times while changing the imaging position at 5 mm intervals. Therefore, the use of correction data for 2.5 mm intervals allows the placement positions of electronic components by the placement head to be corrected with higher accuracy than the use of correction data for 5 mm intervals.

[0040] In this way, the controller 82 can create two types of correction data, one with 5 mm intervals and the other with 2.5 mm intervals, using one type of matrix substrate 100. Therefore, by creating correction data using a matrix substrate 100 having a smaller number of marks 102 than the matrix substrate 120, it is possible to reduce the number of times the marks 102 are imaged. This shortens the time required to image the marks 102 and reduces the effort required to create correction data. Furthermore, because two types of correction data can be created using one type of matrix substrate 100, there is no need to prepare two types of matrix substrates 100 and 120, making it easier to manage the matrix substrates.

[0041] The controller 82 selectively creates correction data with 5 mm intervals or correction data with 2.5 mm intervals depending on the intended use of the electronic component placement apparatus 10 to be shipped, and corrects the placement positions of electronic components by the placement head 26. That is, for example, if the electronic component placement apparatus 10 to be shipped is to be used for normal-precision placement, the operator selects correction data with 5 mm intervals. The controller 82 then creates correction data with 5 mm intervals in accordance with the operator's selection, and corrects the placement positions of electronic components by the placement head 26 based on the correction data with 5 mm intervals. Also, for example, if the electronic component placement apparatus 10 to be shipped is to be used for high-precision placement, the operator selects correction data with 2.5 mm intervals. The controller 82 then creates correction data with 2.5 mm intervals in accordance with the operator's selection, and corrects the placement positions of electronic components by the placement head 26 based on the correction data with 2.5 mm intervals.

[0042] The placement machine 16 is an example of a substrate-related operation machine. The moving device 24 is an example of a moving device. The placement head 26 is an example of a work head. The mark camera 30 is an example of an imaging device. The substrate holding device 46 is an example of a holding device. The controller 82 is an example of a control device. The matrix substrate 100 is an example of a matrix substrate. The marks 102 are an example of marks 102. The correction data with 2.5 mm intervals is an example of first correction data. The correction data with 5 mm intervals is an example of second correction data.

[0043] As described above, the present embodiment has the following advantages.

[0044] 11 to 13, mark camera 30 captures images of two or more of the multiple marks 102 as a group of marks, changing the imaging position, at least multiple times. Controller 82 then calculates the positions of the group of marks 102 based on the imaging data from each of the multiple images, and creates correction data at 2.5 mm intervals for correcting the placement positions of electronic components by mounting head 26 based on the calculated positions of the group of marks. By using the correction data at 2.5 mm intervals created in this manner, the placement positions of electronic components by mounting head 26 can be corrected with high precision.

[0045] Furthermore, the controller 82 selectively creates correction data for 5 mm intervals and correction data for 2.5 mm intervals. When creating correction data for 5 mm intervals, the mark camera 30 captures images of at least one mark 102 among the multiple marks 102 on the matrix substrate 100 multiple times while changing the imaging position. The controller 82 then calculates the position of one mark 102 based on the imaging data from each of the multiple images, and creates correction data for 5 mm intervals based on the calculated position of one mark 102. On the other hand, when creating correction data for 2.5 mm intervals, the mark camera 30 captures images of two or more marks 102 among the multiple marks 102 on the matrix substrate 100 multiple times while changing the imaging position, treating two or more marks 102 as one group of marks based on the imaging data from each of the multiple images, and creates correction data for 2.5 mm intervals based on the calculated positions of the first group of marks. Therefore, creating correction data using a matrix substrate 100 with a small number of marks 102 makes it possible to reduce the number of times the marks 102 are captured. This shortens the time required to capture the mark 102 and reduces the effort required to create correction data. Also, it is no longer necessary to prepare two types of matrix substrates 100 and 120, making it easier to manage the matrix substrates.

[0046] Furthermore, when creating correction data with 5 mm intervals, the mark camera 30 images one mark 102 on the matrix substrate 100 so that the one mark 102 is at the center of the imaging range 110. Furthermore, when creating correction data with 2.5 mm intervals, the mark camera 30 images one group of marks on the matrix substrate 100 so that the center of the one group of marks is at the center of the imaging range 110. This makes it possible to properly image one mark 102 and one group of marks.

[0047] Furthermore, the controller 82 calculates the average value of the positions of two or more marks 102 that make up one group of marks as the position of the one group of marks, thereby making it possible to appropriately calculate the position of the one group of marks.

[0048] Furthermore, when the mark camera 30 images the group of marks on the matrix substrate 100 multiple times during the second correction, for example, it images two marks 102d and 102e (see FIG. 11) during the first image capture, four marks 102d, 102e, 102f, and 102g (see FIG. 12) during the second image capture, and two marks 102f and 102g (see FIG. 13) during the third image capture. In other words, the number of marks in the group imaged on even-numbered images differs from the number of marks in the group imaged on odd-numbered images. This allows the group of marks to be properly imaged.

[0049] Furthermore, when creating the correction data for 2.5 mm intervals, not only does the mark camera 30 capture images of two or more marks 102 as one group of marks multiple times while changing the imaging position, but it also captures images of one mark 102 multiple times while changing the imaging position, as shown in Figures 14 and 16. Then, the controller 82 calculates the positions of the first group of marks and the first mark based on the imaging data from each of the multiple images, and creates correction data for 2.5 mm intervals based on the calculated positions of the first group of marks and the first mark. By using the correction data for 2.5 mm intervals created in this way, it is possible to highly accurately correct the placement positions of electronic components by the placement head 26.

[0050] Furthermore, the present invention is not limited to the above-described embodiment, and various modifications and improvements can be made based on the knowledge of those skilled in the art. Specifically, for example, in the above-described embodiment, the mounting position of the electronic components by the mounting head 26 is corrected using correction data at 5 mm intervals or correction data at 2.5 mm intervals, but correction of the work position by various work heads may also be performed. For example, correction of the discharge position by a viscous fluid discharge head, correction of the inspection position by an inspection head, etc. may be performed using correction data at 5 mm intervals or correction data at 2.5 mm intervals.

[0051] Furthermore, in the above embodiment, the mark camera 30 captures images of two marks 102 or four marks 102 as one group of marks, but as long as there are two or more marks 102, any number of marks 102 may be captured as one group of marks.

[0052] Furthermore, in the above embodiment, when creating correction data for 2.5 mm intervals, the mark camera 30 not only images two or more marks 102 as one group of marks multiple times while changing the imaging position, but also images one mark 102 multiple times while changing the imaging position. On the other hand, when creating correction data for 2.5 mm intervals, the mark camera 30 may image only one group of marks multiple times while changing the imaging position. In this case, the controller 82 calculates the positions of the first group of marks based on the imaging data from each of the multiple images, and creates correction data for 2.5 mm intervals based on the calculated positions of the first group of marks.

[0053] Furthermore, in the above embodiment, the mounting position of the electronic component by the mounting head 26 is corrected when the electronic component mounting device 10 is shipped, but the mounting position of the electronic component by the mounting head 26 may also be corrected at the factory after shipment.

[0054] The contents of this disclosure are not limited to the dependent relationships described in the claims. For example, this specification also discloses the technical idea of ​​changing "the substrate-related operating machine according to claim 1" in claim 4 to "the substrate-related operating machine according to any one of claims 1 to 3." Furthermore, this specification also discloses the technical idea of ​​changing "the substrate-related operating machine according to claim 1" in claim 5 to "the substrate-related operating machine according to any one of claims 1 to 4."

[0055] 16: Placement machine (substrate-related work machine) 24: Movement device 26: Placement head (working head) 30: Mark camera (imaging device) 46: Substrate holding device (holding device) 82: Controller (control device) 100: Matrix substrate 102: Mark

Claims

1. A substrate processing machine comprising: a holding device for holding a substrate; a working head for performing work on the substrate held by the holding device; an imaging device for imaging the substrate held by the holding device; a moving device for relatively moving both the working head and the imaging device with respect to the substrate held by the holding device; and a control device for creating first correction data for correcting a working position by the working head based on positions of each of the plurality of groups of marks, where a plurality of marks out of the plurality of marks on a matrix substrate in which the plurality of marks are arranged in a matrix are defined as a group of marks, and the imaging device images each of the plurality of groups of marks while changing an imaging position assuming there are a plurality of such groups of marks.

2. The substrate processing machine according to claim 1, wherein the control device selectively creates the first correction data and second correction data for correcting a working position by the working head based on positions of each of the plurality of single marks on the matrix substrate, where the imaging device images each of the plurality of single marks while changing an imaging position and the positions are calculated based on their respective imaging data.

3. The substrate processing machine according to claim 2, wherein the imaging device images such that the center of the group of marks on the matrix substrate is at the center of the imaging range when creating the first correction data, and images such that the single mark on the matrix substrate is at the center of the imaging range when creating the second correction data.

4. The substrate processing machine according to claim 1, wherein the control device creates the first correction data based on an average value of positions of the group of marks.

5. The substrate processing machine according to claim 1, wherein when the imaging device images each of the plurality of groups of marks on the matrix substrate while changing an imaging position when creating the first correction data, the number of marks in the group of marks imaged at an even number of times is different from the number of marks in the group of marks imaged at an odd number of times.

6. The control device causes the imaging device to image each of the plurality of groups of marks while changing the imaging position, and causes the imaging device to image each of the plurality of single marks on the matrix substrate while changing the imaging position, and creates the first correction data based on the positions of each of the plurality of groups of marks and the positions of each of the plurality of single marks calculated based on their respective imaging data. The substrate processing machine according to any one of claims 1 to 5.

7. In a substrate processing machine including a holding device for holding a substrate, a working head for performing work on the substrate held by the holding device, an imaging device for imaging the substrate held by the holding device, and a moving device for relatively moving both the working head and the imaging device with respect to the substrate held by the holding device, a plurality of marks among the plurality of marks on a matrix substrate on which a plurality of marks are arranged in a matrix are defined as a group of marks, and assuming that there are a plurality of such groups of marks, the imaging device images each of the plurality of groups of marks while changing the imaging position, and creates correction data for correcting the working position by the working head based on the positions of each of the plurality of groups of marks calculated based on their respective imaging data. A correction data creation method.

Images