Camera device and method for producing camera device

Abstract

This camera device comprises: a camera module having an imaging board on which an image sensor is mounted and a lens; a main board connected to the camera module via a communication line; a connector connected to a connector connection part; and a housing having a base part and a cover part, and accommodating the camera module and the main board. The housing has: a first space accommodating at least a part of the camera module and the main board; and a second space separated from the first space by a partition wall and accommodating a board region. In the second space, a sealing material is disposed so as to encapsulate the board region.

Description

Camera device and method for manufacturing the same

[0001] The present invention relates to an in-vehicle camera device and a method for manufacturing the camera device.

[0002] Japanese Patent Laid-Open Publication No. 2007-001334 (Patent Document 1) is a background art in this technical field. This publication states, "An in-vehicle camera comprising: a circuit board; a camera case that houses and arranges the circuit board; and a connector portion for external connection provided on the outer surface of the camera case, the connector portion comprising: a connector housing integrally formed on the outer surface of the camera case; connector terminals that are housed within the connector housing and penetrate the outer wall of the camera case and are electrically connected to the circuit board; and a sealant filled between the connector terminals and the connector housing."

[0003] Japanese Patent Application Laid-Open No. 2007-001334

[0004] In recent years, with the rise in safety awareness, the installation of on-board cameras on motorcycles has been considered, and there is a demand for on-board cameras with higher vibration and impact resistance. Furthermore, since camera devices for motorcycles are mounted on the exterior of the vehicle, they require waterproofing. In the on-board camera described in Patent Document 1, the connector housing is integrally formed with the camera case, and a sealant is filled between the connector housing and the connector terminals electrically connected to the circuit board housed in the camera case, thereby providing waterproofing for the camera case and the connector housing, and for the connector housing and the connector terminals.

[0005] However, with this structure, for example, if stress is applied to the connector part, there is a possibility that the integrally formed camera case may break, or that stress may be applied to the connection part between the board and the connector terminal, causing a poor connection.

[0006] A camera device according to one aspect of the present invention comprises a camera module having an imaging board on which an imaging element is mounted and a lens; a main board on which an image processing circuit is mounted and connected to the camera module via a communication line; a connector having a connection terminal connected to a connector connection portion of the main board; and a housing having a base portion and a cover portion connected to each other, the housing having a first space in which at least a portion of the camera module and the main board are accommodated, and a second space separated from the first space by a partition wall in which a board area including the connector connection portion of the main board is accommodated, and a sealing material is arranged in the second space so as to enclose the board area.

[0007] According to the present invention, it is possible to improve vibration resistance and reliability while ensuring waterproofing in an in-vehicle camera device.

[0008] Fig. 1 is an exploded perspective view of a camera device according to a first embodiment; Fig. 2 is a cross-sectional view of a camera device according to a modified example; Fig. 3 is a cross-sectional view of a camera device according to a second embodiment; Fig. 4 is a cross-sectional view of a camera device according to a third embodiment; Fig. 5 is a diagram illustrating an assembly procedure of the camera device.

[0009] <First Embodiment> A camera device according to a first embodiment of the present invention will be described with reference to Figures 1 and 2. Figure 1 is an exploded perspective view of camera device 1. Figure 2 is a cross-sectional view of camera device 1. Camera device 1 is an in-vehicle camera device, and is mounted on, for example, a motorcycle. Camera device 1 includes a camera module 2, a camera cover 3, a main board 5, a connector 7, and a housing 8 that houses the camera module 2 and the main board 5.

[0010] 2, the camera module 2 includes an imaging board 20 having an imaging element (not shown) mounted thereon, and an imaging optical system 21 having an optical lens mounted on a lens barrel. The camera module 2 is adhesively or screwed to a mounting portion (not shown) provided on a base portion 8a of the housing 8. The imaging optical system 21 is attached to the base portion 8a so as to be exposed to the outside of the housing. The camera cover 3 is a cover that protects the imaging optical system 21 exposed to the outside of the housing, and is attached to the base portion 8a. Although not shown, the camera cover 3 and the housing 8 are fixed together via a waterproof adhesive or a waterproof O-ring.

[0011] The imaging board 20 is mounted with imaging elements such as a CCD sensor or a CMOS sensor, as well as electronic components (circuits) that drive the imaging elements and perform predetermined processing on the electrical signals output from the imaging elements. Although not shown, the main board 5 is mounted with electronic components (image processing circuits) such as a CPU, MPU, and AGTG that perform image processing and system control. The imaging board 20 and the main board 5 are connected via a communication line 4. For example, press-fit connectors are used for the connectors 40a and 40b of the communication line 4. A press-fit connector establishes an electrical connection by press-fitting press-fit terminals provided in a connector housing into through holes in the board, i.e., a connector that establishes a connection without soldering.

[0012] The main board 5 is placed on a fixing portion 80 and a partition wall 81 provided on the base portion 8a, and is fixed by screwing into the fixing portion 80. By screwing the main board 5 into the fixing portion 80, the main board 5 is tightly attached to the partition wall 81. In FIG. 2 , a connector 7 for connecting to an external device is provided in a board region 52 at the right end of the main board 5 in the figure. Hereinafter, the portion of the board region 52 where the connection terminal 70 of the connector 7 is soldered will be referred to as the connector connection portion 50. The connection terminal 70 extends downward from the main board 5 in the figure, and is bent 90 degrees to the right in the figure from the middle, so that the connector 7 faces rightward.

[0013] After the main board 5 is fixed to the fixing part 80, the cover part 8b is fixed to the base part 8a so that the convex part 83 of the cover part 8b is inserted into the groove part 84 of the base part 8a. In this case, the cover part 8b and the base part 8a are fixed via a waterproof adhesive or a waterproof O-ring. The waterproof adhesive or the waterproof O-ring is placed in the groove part 84.

[0014] A partition wall 82 is formed on the cover portion 8b so as to face the partition wall 81 on the base portion 8a. The partition walls 81 and 82 are formed in a bent shape as indicated by the dashed arrow L in Fig. 1. When the cover portion 8b is fixed to the base portion 8a, the partition walls 81 and 82 are connected to sandwich the main board 5. As a result, a first space 11 and a second space 12 separated by the partition walls 81 and 82 are formed inside the housing 8 consisting of the cover portion 8b and the base portion 8a.

[0015] In FIG. 2 , the first space 11 on the left side of the partitions 81 and 82 accommodates the camera module 2 and a board area 51 of the main board 5. Electronic components for image processing and system control are mounted in the board area 51. The second space 12 on the right side of the partitions 81 and 82 accommodates a board area 52 of the main board 5, including the connector connection portion 50. That is, most of the main board 5 is accommodated in the first space 11, but the board area 52 on the right side, including the connector connection portion 50, penetrates the connection boundary 85 (shown by the dashed line) between the partitions 81 and 82 and is accommodated in the second space 12. The second space 12 is filled with a sealant 13. The sealant 13 is filled in the second space 12 so as to enclose the board area 52 including the connector connection portion 50. Note that after the sealant 13 is filled, a gap may be formed in a portion (such as a corner) of the second space 12. Of course, the entire area of ​​the second space 12 may be filled with the sealing material 13 .

[0016] The camera device 1 is assembled as follows. The following describes the case where the base portion 8a and the cover portion 8b are connected using a waterproof adhesive. The main board 5 and the camera module 2, to which the connector 7 is connected, are attached to the base portion 8a. When the main board 5 is fixed to the fixing portion 80 with screws, the upper end of the partition wall 81 and the back surface of the main board 5 come into close contact with each other.

[0017] Next, the imaging board 20 and the main board 5 are connected via the communication line 4, and the camera cover 3 is attached. Waterproof adhesive is then applied to the groove 84 (see FIG. 1 ) of the base portion 8a, and the base portion 8a and the cover portion 8b are connected so that the tip of the partition wall 82 of the cover portion 8b is in close contact with the board surface of the main board 5. The housing 8 is then positioned so that the opening of the second space 12 faces upward, and the sealant 13 is filled through the opening of the second space 12. In the example shown in FIG. 2 , the sealant 13 is filled up to the base (convex portion) of the connector 7 where the connection terminals 70 protrude from the connector 7. However, the sealant 13 may be filled into the second space 12 so that it extends up to the flange-like portion on the left side of the connector 7. Because the sealant 13 fills both the front and back sides of the main board 5, deformation of the main board 5 due to thermal expansion of the sealant 13 can be prevented.

[0018] Examples of the sealing material 13 include (a) a two-component room temperature curing type in which a curing agent and a base compound are mixed and cured at room temperature, (b) a two-component heat curing type in which a curing agent and a base compound are mixed and cured by heating, and (c) a one-component curing type in which a base compound and a curing agent are contained in one liquid and the curing agent is reacted by heating. In addition, the types of resins that can be used for the sealing material 13 include urethane, silicone, and epoxy resins.

[0019] From the viewpoint of manufacturing takt time, a two-component heating type that cures quickly is more preferable. Furthermore, from the viewpoint of vibration resistance, a urethane or silicone resin sealing material is preferable because the resin is highly flexible after curing. To prevent contact failure of electronic components caused by low-molecular-weight siloxane, urethane resin or silicone resin with low-molecular-weight siloxane components removed is most suitable. When using a heat-curing type, after filling the second space 12 with the sealing material 13, the sealing material 13 is heated in a curing oven to harden, thereby achieving waterproofing between the connector 7, the base portion 8a, and the cover portion 8b.

[0020] As described above, the first space 11 is separated from the second space 12 by the partitions 81 and 82, so that the sealant 13 can be disposed in the second space 12 without affecting the optical system of the camera module 2 or the connection by the communication line 4. That is, it is possible to prevent the effects of the sealant 13 on the optical system as in the past, i.e., problems such as poor connection due to the sealant 13 adhering to the communication line 4 and the inability to obtain an accurate image due to the sealant 13 adhering to the imaging lens of the camera module 2. For example, when a connector with plug-in contact such as a press-fit connector is used for the communication line 4, if the sealant 13 enters the first space 11, the sealant 13 may get into the plug-in contact portion, causing a communication failure.

[0021] Furthermore, since the sealant 13 is filled so as to enclose the substrate region 52 that penetrates the partition walls 81 and 82, it is possible to improve the waterproofing of the penetration portion. Furthermore, since the partition walls 81 and 82 are arranged so as to be in close contact with the substrate surface of the main substrate 5, it is possible to prevent the sealant 13, which is highly fluid in an uncured state, from penetrating from the second space 12 into the first space 11 during the sealant filling operation.

[0022] Furthermore, by enclosing the substrate area 52 including the connector connection portion 50 in the sealant 13 filled in the second space 12, when stress is applied to the connector 7, the stress is dispersed by the sealant 13, thereby reducing the impact on the connector connection portion 50. As a result, it is possible to improve vibration resistance and improve the reliability of the camera device 1 mounted on a vehicle.

[0023] Conventionally, the body of the connector 7 has been formed integrally with the housing to ensure waterproofing. However, when the camera device 1 is mounted on a motorcycle, it is subjected to greater vibrations and impacts than when mounted on a four-wheeled vehicle. As a result, cracks are likely to occur at the boundary between the integrated connector body and the housing due to vibrations, resulting in a decrease in waterproofing performance. In contrast, in this embodiment, the second space 12 is filled with the sealant 13 as described above, which prevents a decrease in waterproofing due to vibrations.

[0024] (Modification) Next, a modification of the first embodiment will be described with reference to FIG. 3. FIG. 3 is a cross-sectional view of the camera device 1 according to the modification. The following description will focus on differences from the configuration shown in FIG. 2, and descriptions of identical configurations will be omitted. In the modification, the opening of the second space 12 faces the negative y-direction. Unlike the case of FIG. 2, the connection terminal 70 connected to the connector connection portion 50 of the main board 5 is a straight terminal, not bent. Therefore, the connector 7 also faces the negative y-direction.

[0025] 2 described above, the opening of the second space 12 faces both the front and back sides of the substrate region 52. Therefore, when the sealing material 13 is filled from the opening of the second space 12, the sealing material 13 can be easily filled on both the front and back sides of the substrate region 52.

[0026] On the other hand, in the modified example shown in FIG. 3 , the opening of the second space 12 faces only the back surface of the substrate region 52. When filling the sealant, the housing 8 is turned upside down so that the opening of the second space 12 faces upward, and the sealant 13 is filled through the opening into the space on the back surface of the substrate region 52. Therefore, the gap 120 between the right end of the substrate region 52 and the housing 8 is set to a sufficient size so that the sealant 13 can easily move from the space on the base portion 8a side to the space on the cover portion 8b side through the gap 120 during filling, and air can easily escape from the space on the cover portion 8b side to the space on the base portion 8a side. This configuration allows the second space 12 to be filled with sealant 13 containing few air bubbles.

[0027] Of course, it is also possible to set the gap 120 small and apply the sealant 13 only to the back surface side of the substrate area 52 of the second space 12 (the space on the base portion 8a side). However, if the sealant 13 is filled only on one side of the substrate area 52, there is a possibility that the main substrate 5 will be deformed due to thermal expansion of the sealant 13. Furthermore, in order to improve the vibration resistance of the connector connection portion 50, it is desirable to also fill the space on the cover portion 8b side with the sealant 13.

[0028] 3, the opening of the second space 12 is provided on the bottom side of the base portion 8a (the illustrated lower side of the housing 8), but it may also be provided on the side side of the housing 8 (the direction perpendicular to the paper surface) or on the illustrated upper side of the housing 8 (the cover portion 8b side), and the connection direction of the connector 7 may be set in those directions. In this modified example, the same effects as those of the first embodiment described above are achieved, and by changing the arrangement of the opening of the second space 12, the installation space (space in the xz plane) for the camera device 1 can be made smaller, and the degree of freedom in the layout of the camera device when installed in various vehicles is improved.

[0029] <Second embodiment> Fig. 4 is a diagram for explaining a second embodiment, and is a cross-sectional view of the camera device 1, similar to Fig. 2. The following description will focus on configurations that differ from the first embodiment, and will omit a description of the same configurations.

[0030] In the main board 5, only the connector connection portion 50 is arranged in the board region 52 included in the second space 12. In the second embodiment, electronic components are also arranged in the board region 52 included in the second space 12. In the example shown in FIG. 4 , two electronic components 15a and 15b are arranged. These electronic components 15a and 15b are also sealed with the sealant 13 filled in the second space 12. As in the first embodiment, the sealant 13 is filled into the second space 12 by placing the housing 8 (base portion 8a and cover portion 8b) in an orientation such that the connector 7 faces upward, and filling the sealant 13 into both the space of the base portion 8a and the space of the cover portion 8b through the opening of the second space 12. The sealant 13 seals the board region 52 including the electronic components 15a and 15b and the connector connection portion 50.

[0031] Among the electronic components mounted on the main board 5, large electronic components such as electrolytic capacitors may develop cracks in the board connections (solder connections, etc.) due to vibration, resulting in poor connections. Therefore, in this embodiment, electronic components 15a and 15b that are vulnerable to vibration, such as electrolytic capacitors, are provided in board region 52 on the main board 5 and are housed on the second space 12 side. Since the second space 12 is filled with sealing material 13, the electronic components 15a and 15b are also sealed by sealing material 13, thereby reducing the stress applied to the electronic components 15a and 15b.

[0032] As described above, in the second embodiment, some of the electronic components (electronic components 15a and 15b) mounted on the main board 5 are also accommodated in the second space 12 and enclosed by the sealing material 13. This not only improves the waterproofing performance of the second space 12, but also improves the earthquake resistance of the connector connection portion 50 and the reliability of the electronic components 15a and 15b, which are susceptible to vibration.

[0033] <Third Embodiment> Fig. 5 is a diagram illustrating a third embodiment, and is a cross-sectional view of the camera device 1 similar to Fig. 2 described above. The following description will focus on configurations that differ from those of the first embodiment, and descriptions of identical configurations will be omitted. In the third embodiment, a buffer material 90 is arranged at the connection boundary between the partitions 81 and 82, at least one between the partition 81 and the main board 5 and between the partition 82 and the main board 5. In the example shown in Fig. 5, the buffer material 90 is arranged both between the partition 81 and the main board 5 and between the partition 82 and the main board 5.

[0034] In the configuration of the first embodiment shown in FIG. 2 , the partition walls 81 and 82 separate the spaces by directly contacting the main board 5. However, manufacturing tolerances of the main board 5, base portion 8a, and cover portion 8b may result in gaps between the partition walls 81 and 82 and the main board 5. Because uncured sealant 13 has high fluidity, if a gap occurs between the partition walls 81 and 82 and the main board 5, the uncured sealant 13 may flow into the first space 11 through the gap. Therefore, even if a specified amount of sealant 13 is filled into the second space 12, the sealant 13 may flow into the first space 11, resulting in an insufficient amount of sealant 13 in the second space 12 and a decrease in waterproofing. Furthermore, there is a concern that the sealant 13 that flows into the first space 11 may adhere to electronic components housed in the first space 11, causing contact problems and affecting optical components.

[0035] In this embodiment, by interposing the deformable buffer material 90 between the partition walls 81, 82 and the main substrate 5, it is possible to prevent the occurrence of gaps due to manufacturing tolerances caused by deformation of the buffer material 90. As a result, it is possible to prevent the uncured sealant 13 from flowing from the second space 12 into the first space 11.

[0036] 5, the buffer material 90 is provided between both the partition walls 81 and 82 and the main board 5, but it may be provided on only one side. For example, when the main board 5 is fixed to the fixing part 80 with screws as described above, the screw fixation brings the main board 5 and the partition wall 81 into close contact, thereby reducing gaps that occur due to manufacturing tolerances. Therefore, it is possible to apply a configuration in which the buffer material 90 is provided only between the partition wall 82 and the main board 5, which is preferable from the viewpoint of cost reduction.

[0037] The material of the buffer material 90 is preferably one that reduces stress on the main board 5 when it comes into contact with the board. For example, a rubber gasket such as ethylene propylene rubber, butadiene rubber, or silicone rubber, a lower elasticity elastomer, or a liquid gasket (low elasticity adhesive, waterproof adhesive) is used. From the viewpoint of manufacturability, a waterproof adhesive is preferable.

[0038] The assembly procedure for the camera device 1 when a waterproof adhesive is used for the cushioning material 90 will be described with reference to Fig. 6 . Fig. 6 is a plan view showing the state in which the main board 5, to which the camera module 2, camera cover 3, and connector 7 are connected, is attached to the base portion 8a of the housing 8, and the imaging board 20 and main board 5 are connected via the communication line 4. The hatched portion of the main board 5 is the board area 52. The main board 5 is placed on the fixing portion 80 and the partition wall 81 of the base portion 8a and is fixed to the fixing portion 80 with screws. Most of the main board 5 is located on the first space side, and only the board area 52, including the connector connection portion 50, is located beyond the partition wall 81 and on the second space 12 side.

[0039] In Fig. 6 , the thick two-dot chain line represents the waterproof adhesive 9. The waterproof adhesive 9 is placed (applied) using, for example, a dispenser into the groove 84 of the base portion 8a and into the area on the main board 5 that is connected to the partition wall 82. In Fig. 6 , the two-dot chain line drawn around the partition wall 81 shown in dashed line represents the waterproof adhesive 9 used to connect the partition wall 82 of the cover portion 8b to the main board 5, and also functions as the cushioning material 90 described above. By applying the waterproof adhesive 9 to connect the base portion 8a and the cover portion 8b in this way, the waterproofness of the connection portion of the housing 8 is ensured.

[0040] By using the same material (waterproof adhesive) for the cushioning material 90 and the waterproof adhesive 9 for connecting the housing, continuous application work can be performed in one process, as shown by the two-dot chain line in Figure 6. In other words, the cushioning material 90 and the waterproof adhesive 9 can be disposed continuously, simplifying the manufacturing process. When applying the waterproof adhesive 9 as shown by the thick two-dot chain line, the waterproof adhesive 9 can be easily applied continuously and integrally by aligning the height of the application surface of the base portion 8a and the application surface of the main board 5.

[0041] For example, if there is a clear step between the application surface of the base portion 8a and the application surface of the main substrate 5 at the location indicated by symbol C in Figure 6, a process is required to move the dispenser up and down (height direction) at the step. As a result, excess adhesive will accumulate at the step (location indicated by symbol C). In order to prevent this situation from occurring at the step, when moving the dispenser from the base portion 8a to the main substrate 5, it is necessary to temporarily halt the dispensing of the waterproof adhesive 9 and move the dispenser in the height direction, which has the disadvantage of increasing the working time.

[0042] On the other hand, by roughly matching the height of the application surface of the base portion 8a and the application surface of the main substrate 5 as described above, the waterproof adhesive 9 can be applied uniformly around the entire circumference in one process without interrupting the dispenser's discharge.

[0043] As described above, the manufacturing process can be simplified by using the same waterproof adhesive 9 for the adhesive used to connect the base portion 8a and the cover portion 8b and for the cushioning material in the partition walls 81, 82, and by continuously applying the waterproof adhesive 9 used for connection and the waterproof adhesive 9 used for the cushioning material. Furthermore, by roughly matching the height of the application surface of the base portion 8a and the application surface of the main board 5, the waterproof adhesive 9 can be applied evenly. The configuration of the sealing material 13 in the second space 12 is the same as in the first embodiment, and the same effects as in the first embodiment can be achieved.

[0044] According to the above-described embodiment and modified examples, the following advantageous effects are achieved.

[0045] 1, 2, etc., camera device 1 includes camera module 2 having an imaging board 20 on which an imaging element is mounted and a lens, main board 5 on which an image processing circuit is mounted and connected to camera module 2 via communication line 4, connector 7 having connection terminal 70 connected to connector connection portion 50 of main board 5, and housing 8 having base portion 8a and cover portion 8b connected to each other, and accommodating camera module 2 and main board 5. Housing 8 includes first space 11 accommodating at least a portion of camera module 2 and main board 5, and second space 12 separated from first space 11 by partition walls (partition walls 81, 82) and accommodating board region 52 including connector connection portion 50 of main board 5, and sealing material 13 is disposed in second space 12 so as to enclose board region 52.

[0046] Since the second space 12 is separated from the first space 11 by the partitions (partitions 81, 82), the sealing material 13 can be disposed in the second space 12 without affecting the lens of the camera module 2 housed in the first space 11 or the connection portion of the communication line 4. Furthermore, by disposing the sealing material 13 so as to enclose the board region 52, that is, so as to enclose the connector connection portion 50 to which the connection terminal 70 of the connector 7 is connected, the stress acting on the connector connection portion 50 can be reduced.

[0047] (2) In the above (1), as shown in Fig. 4, at least one electronic component 15a, 15b is mounted on the substrate region 52, and the sealing material 13 encloses the electronic components 15a, 15b and the substrate region 52. By enclosing the electronic components 15a, 15b, such as electrolytic capacitors, which are vulnerable to vibration, in the sealing material 13, stress on the electronic components can be reduced, thereby improving reliability.

[0048] (3) In the above (1), as shown in Fig. 2 and other figures, the partitions (81, 82) are formed by connecting the first partition (partition 81) of the base portion 8a and the second partition (partition 82) of the cover portion 8b, and the substrate region 52 is disposed in the second space 12, penetrating the connection boundary 85 between the partitions 81 and 82. By disposing the substrate region 52 in the second space 12, penetrating the connection boundary 85 between the partitions 81 and 82, it becomes easy to separate the first space 11, which accommodates the image processing circuit and communication lines 4 mounted on the main substrate 5, from the second space 12 by the partitions 81, 82.

[0049] (4) In the above item (3), as shown in Fig. 5, a deformable buffer material 90 is provided between at least one of the first partition wall (partition wall 81) and the second partition wall (partition wall 82) and the main substrate 5. By providing such a deformable buffer material 90 between the partition walls 81, 82 and the main substrate 5, gaps due to dimensional tolerances of the partition walls 81, 82 and the main substrate 5 can be eliminated, and leakage of the sealing material 13 from the second space 12 to the first space 11 can be prevented.

[0050] (5) In the above (4), as shown in Fig. 6, the base portion 8a and the cover portion 8b are connected by a waterproof adhesive 9, and it is preferable to use the same adhesive for the cushioning material 90 as the waterproof adhesive 9. By using the same adhesive for the cushioning material 90 and the waterproof adhesive 9, it is possible to install (apply) the cushioning material 90 and apply the waterproof adhesive 9 in the same process.

[0051] (6) In the above (5), as shown in Fig. 6, it is preferable that the waterproof adhesive 9 connecting the base portion 8a and the cover portion 8b and the cushioning material 90, for which the same adhesive as the waterproof adhesive 9 is used, are formed continuously and integrally. In this case, in the manufacturing method, the application of the waterproof adhesive 9 and the application of the adhesive constituting the cushioning material 90 are carried out continuously and without interruption in the application process. As a result, it is possible to simplify the manufacturing process.

[0052] Although the embodiments of the present invention have been described above, the above embodiments merely illustrate some of the application examples of the present invention, and it is not intended that the technical scope of the present invention be limited to the specific configurations of the above embodiments.

[0053] DESCRIPTION OF SYMBOLS 1...camera device, 2...camera module, 3...camera cover, 4...communication line, 5...main board, 7...connector, 8...housing, 8a...base portion, 8b...cover portion, 9...waterproof adhesive, 11...first space, 12...second space, 13...sealant, 15a, 15b...electronic components, 20...imaging board, 21...imaging optical system, 50...connector connection portion, 51, 52...board area, 70...connection terminal, 80...fixing portion, 81, 82...partition wall, 85...connection boundary, 90...buffer material

Claims

1. A camera device comprising: a camera module having an imaging substrate on which an imaging element is mounted and a lens; a main substrate on which an image processing circuit is mounted and which is connected to the camera module via a communication line; a connector to which a connection terminal is connected at a connector connection portion of the main substrate; and a housing having a base portion and a cover portion connected to each other and accommodating the camera module and the main substrate, wherein the housing has: a first space in which at least a part of the camera module and the main substrate are accommodated; and a second space separated from the first space by a partition wall and accommodating a substrate region including the connector connection portion of the main substrate, and a sealing material is disposed in the second space so as to enclose the substrate region.

2. The camera device according to claim 1, wherein at least one electronic component is mounted on the substrate region, and the sealing material encloses the electronic component and the substrate region.

3. The camera device according to claim 1, wherein the partition wall is formed by connecting a first partition wall of the base portion and a second partition wall of the cover portion, and the substrate region is disposed in the second space so as to penetrate a connection boundary between the first partition wall and the second partition wall.

4. The camera device according to claim 3, wherein a deformable cushioning material is provided between at least one of the first partition wall and the second partition wall and the main substrate.

5. The camera device according to claim 4, wherein the base portion and the cover portion are connected by a waterproof adhesive, and the same adhesive as the waterproof adhesive is used for the cushioning material.

6. The camera device according to claim 5, wherein the waterproof adhesive connecting the base portion and the cover portion and the cushioning material using the same adhesive as the waterproof adhesive are continuously formed integrally.

7. A method of manufacturing the camera device according to claim 6, the method having a coating step of continuously and uninterruptedly performing coating of the waterproof adhesive and coating of the adhesive constituting the cushioning material.

Images