Three-dimensional mounting device and three-dimensional mounting method

Abstract

A three-dimensional mounting device (10) comprises a stage (20) that supports a three-dimensional substrate, a mounting head (24) that mounts components (2) on the surface of the three-dimensional substrate, and a controller (16). The controller (16) includes: a permissible angle acquisition unit (36) that acquires a permissible angle indicating an inclination angle of the components (2) at which the amount of positional deviation after mounting is suppressed to a prescribed amount or less; a mounting order determination unit that determines a mounting order for the components (2), with respect to a plurality of mounting areas (50) that are set on the surface of the three-dimensional substrate, so that the mounted components (2) assume an inclination angle equal to or less than the permissible angle; a stage control unit (32) that controls the stage (20) so that the plurality of mounting areas (50) sequentially assume a horizontal state in accordance with the mounting order; and a head control unit (33) that controls the mounting head (24) so that the components (2) are sequentially mounted in the horizontal-state mounting areas (50) in accordance with the mounting order.

Description

Three-dimensional mounting device and three-dimensional mounting method

[0001] The technology disclosed in this specification relates to a three-dimensional mounting device and a three-dimensional mounting method.

[0002] In the technical field relating to three-dimensional mounting devices, a three-dimensional mounting device that mounts components on a three-dimensional substrate, such as that disclosed in Patent Document 1, is known.

[0003] International Patent Application Publication No. 2018 / 207313

[0004] When mounting components in mounting areas set on the surface of a three-dimensional substrate, the tilt angle of the three-dimensional substrate is adjusted so that the mounting areas are horizontal. When a first component is mounted in a first mounting area and then a second component is mounted in a second mounting area, the first mounting area may be tilted with respect to the horizontal plane. If the first mounting area is tilted with respect to the horizontal plane, the first component may be misaligned due to the action of gravity.

[0005] The technology disclosed in this specification aims to suppress misalignment of components.

[0006] This specification discloses a three-dimensional mounting apparatus including a stage for supporting a three-dimensional substrate, a mounting head for mounting components on the surface of the three-dimensional substrate, and a controller. The controller includes an allowable angle acquisition unit for acquiring an allowable angle indicating a tilt angle of components at which the amount of misalignment after mounting is suppressed to a specified amount or less, a mounting order determination unit for determining a mounting order for components on multiple mounting areas set on the surface of the three-dimensional substrate so that the mounted components are at or below the allowable angle, a stage control unit for controlling the stage so that the multiple mounting areas are successively horizontal according to the mounting order, and a head control unit for controlling the mounting head so that the components are successively mounted on the horizontal mounting areas according to the mounting order. The three-dimensional mounting apparatus may also include a dispensing head for dispensing adhesive on the surface of the three-dimensional substrate. The controller may further include a fixation control unit for controlling the dispensing head so that the first component and the first mounting area are fixed with adhesive after mounting the first component on the first mounting area and before tilting the three-dimensional substrate if the first component does not fall below the allowable angle when mounting the second component on the first mounting area.

[0007] According to the technology disclosed in this specification, misalignment of components is suppressed.

[0008] FIG. 1 is a perspective view showing a substrate and components according to the first embodiment. FIG. 2 is a perspective view showing a pallet that holds a substrate according to the first embodiment. FIG. 3 is an exploded perspective view showing a substrate and pallet according to the first embodiment. FIG. 4 is a side view schematically showing a three-dimensional mounting apparatus according to the first embodiment. FIG. 5 is a plan view schematically showing a three-dimensional mounting apparatus according to the first embodiment. FIG. 6 is a perspective view showing a pallet and a stage according to the first embodiment. FIG. 7 is an exploded perspective view showing a pallet and a stage according to the first embodiment. FIG. 8 is a diagram schematically showing a mounting head according to the first embodiment. FIG. 9 is a hardware configuration diagram of a controller according to the first embodiment. FIG. 10 is a functional block diagram showing a three-dimensional mounting apparatus according to the first embodiment. FIG. 11 is a plan view schematically showing a substrate according to the first embodiment. FIG. 12 is a diagram explaining the operation of the stage and the mounting head according to the first embodiment. FIG. 13 is a diagram explaining the operation of the stage and the mounting head according to the first embodiment. FIG. 14 is a diagram explaining the operation of the laser head according to the first embodiment. FIG. 15 is a diagram explaining misalignment of components according to the first embodiment. FIG. 16 is a diagram explaining the mounting order of components according to the first embodiment. FIG. 17 is a diagram illustrating the component mounting order according to the first embodiment. FIG. 18 is a diagram illustrating a component for which misalignment according to the first embodiment is not resolved. FIG. 19 is a diagram illustrating a component for which misalignment according to the first embodiment is not resolved. FIG. 20 is a diagram illustrating the operation of the three-dimensional mounting apparatus when a component for which misalignment according to the first embodiment is not resolved exists. FIG. 21 is a diagram illustrating the operation of the three-dimensional mounting apparatus when a component for which misalignment according to the first embodiment is not resolved exists. FIG. 22 is a flowchart illustrating a method for determining the component mounting order according to the first embodiment. FIG. 23 is a flowchart illustrating a component mounting method according to the first embodiment. FIG. 24 is a side view schematically illustrating a three-dimensional mounting apparatus according to a second embodiment. FIG. 25 is a functional block diagram illustrating a three-dimensional mounting apparatus according to the second embodiment. FIG. 26 is a diagram illustrating the operation of a dispensing head according to the second embodiment. FIG. 27 is a diagram illustrating the operation of the three-dimensional mounting apparatus when a component for which misalignment according to the second embodiment is not resolved exists.Fig. 28 is a diagram explaining the operation of the three-dimensional mounting device when there is a component whose positional deviation has not been resolved according to the second embodiment. Fig. 29 is a flowchart showing a component mounting method according to the second embodiment. Fig. 30 is a diagram schematically showing an allowable angle storage unit according to the embodiment. Fig. 31 is a diagram schematically showing a controller according to the embodiment.

[0009] Hereinafter, embodiments will be described with reference to the drawings. In the embodiments, an XYZ Cartesian coordinate system is defined, and the positional relationship of each part will be described with reference to this XYZ Cartesian coordinate system. The direction parallel to the X axis of a predetermined plane is defined as the X-axis direction. The direction parallel to the Y axis of the predetermined plane, which is perpendicular to the X axis, is defined as the Y-axis direction. The direction parallel to the Z axis, which is perpendicular to the predetermined plane, is defined as the Z-axis direction. The direction of rotation or tilt around the X-axis direction is defined as the θX direction. The direction of rotation or tilt around the Y-axis direction is defined as the θY direction. The direction of rotation or tilt around the Z-axis direction is defined as the θZ direction. In the embodiments, the predetermined plane and the horizontal plane are parallel. The Z axis is parallel to the vertical axis, and the Z axis direction is the up-down direction. The +Z side is the upper side, and the -Z side is the lower side. In the embodiments, the predetermined plane including the X axis and the Y axis is referred to as the XY plane as appropriate.

[0010] First Embodiment A first embodiment will be described.

[0011] <Substrate> Fig. 1 is a perspective view showing a substrate 1 and a component 2 according to an embodiment. In the embodiment, the substrate 1 is a three-dimensional substrate. A three-dimensional substrate refers to a substrate having a non-planar surface. The surface of the substrate 1 includes a curved surface. At least a portion of the surface of the substrate 1 is curved. The surface of the substrate 1 may include corners. A protrusion may be provided on the surface of the substrate 1.

[0012] An electric circuit is provided on the surface of the substrate 1. In this embodiment, the substrate 1 is formed by in-mold molding technology. The substrate 1 includes a base material 1A having a curved surface and a film 1B bonded to the surface of the base material 1A. The film 1B is flexible. The film 1B is a flexible film. The film 1B includes the electric circuit. The surface of the substrate 1 includes the surface of the film 1B.

[0013] The component 2 includes an electronic component. The component 2 may be a lead-type electronic component having leads protruding from a body. The component 2 may be a chip-type electronic component having no leads. By mounting the component 2 on the surface of the substrate 1, an electronic device is manufactured.

[0014] <Pallet> Fig. 2 is a perspective view showing a pallet 3 that holds a substrate 1 according to an embodiment. Fig. 3 is an exploded perspective view showing the substrate 1 and pallet 3 according to an embodiment. The pallet 3 holds the substrate 1. In the embodiment, the substrate 1 is handled while held by the pallet 3. The pallet 3 has a support member 4 that supports the substrate 1 and a clamp mechanism 5 that fixes the substrate 1.

[0015] The support member 4 includes a base portion 4A that supports the substrate 1 from the -Z side, guard portions 4B provided on each of the +Y side and -Y side of the base portion 4A, and a plurality of pin portions 4C that support the substrate 1 from each of the +Y side and -Y side.

[0016] The base portion 4A is a plate-like member having a plurality of openings. Two holes 4D are provided in the base portion 4A. The holes 4D penetrate the top and bottom surfaces of the base portion 4A.

[0017] The guard portion 4B is long in the X-axis direction. A pair of guard portions 4B are provided. The pair of guard portions 4B are spaced apart in the Y-axis direction. One guard portion 4B protrudes toward the +Z side from the +Y side end of the upper surface of the base portion 4A. The other guard portion 4B protrudes toward the +Z side from the -Y side end of the upper surface of the base portion 4A.

[0018] Each of the multiple pin portions 4C protrudes from the upper surface of the base portion 4A to the +Z side. Some of the pin portions 4C are arranged on the +Y side of the center of the base portion 4A. Some of the pin portions 4C are arranged on the -Y side of the center of the base portion 4A. The multiple pin portions 4C arranged on the +Y side of the center of the base portion 4A support the end of the +Y side of the substrate 1. The multiple pin portions 4C arranged on the -Y side of the center of the base portion 4A support the end of the -Y side of the substrate 1.

[0019] The clamping mechanism 5 is provided on the support member 4. The clamping mechanism 5 fixes the substrate 1 to the support member 4. The clamping mechanism 5 includes a pair of support parts 5A that support the end of the substrate 1 on the -X side, and a movable part 5B that supports the end of the substrate 1 on the +X side. The movable part 5B is movable in the X-axis direction on the upper surface of the base part 4A. With the substrate 1 disposed between the support parts 5A and the movable part 5B, the movable part 5B moves in the -X direction, thereby sandwiching the substrate 1 between the support parts 5A and the movable part 5B. The substrate 1 is fixed to the pallet 3 by being sandwiched between the support parts 5A and the movable part 5B.

[0020] <Three-dimensional mounting apparatus> Fig. 4 is a side view schematically showing a three-dimensional mounting apparatus 10 according to an embodiment. Fig. 5 is a plan view schematically showing the three-dimensional mounting apparatus 10 according to an embodiment. The three-dimensional mounting apparatus 10 mounts a component 2 on a substrate 1.

[0021] The three-dimensional mounting device 10 includes a base member 18, a conveying device 19, a stage 20, a stage moving device 21, a component supply device 22, a mounting head 24 including a nozzle 23, a camera 25, a head moving device 27, a dispenser 11, a laser head 12, a chamber 29, and a controller 16.

[0022] The base member 18 supports the transport device 19 , the stage 20 , the stage moving device 21 , the component supply device 22 , the mounting head 24 , the dispenser 11 , the laser head 12 , and the head moving device 27 .

[0023] The transport device 19 transports the pallet 3 holding the substrate 1 in the X-axis direction. The transport device 19 transports the pallet 3 to a processing position of the three-dimensional mounting device 10. The processing position is defined by the transport path of the transport device 19.

[0024] The conveying device 19 has a conveying belt 19A that conveys the pallet 3 in the X-axis direction, and a guide member 19B that guides the pallet 3.

[0025] The guide member 19B is long in the X-axis direction. A pair of guide members 19B are provided. The pair of guide members 19B are spaced apart in the Y-axis direction. One guide member 19B is disposed on the +Y side of the pallet 3. The other guide member 19B is disposed on the -Y side of the pallet 3.

[0026] The conveyor belt 19A is circular. A pair of conveyor belts 19A is provided. The conveyor belts 19A are supported by guide members 19B via a drive pulley and a driven pulley. The conveyor belts 19A are looped around the drive pulley and the driven pulley. One of the conveyor belts 19A is supported by one of the guide members 19B. The other conveyor belt 19A is supported by the other guide member 19B.

[0027] Of the pair of conveyor belts 19A, the conveyor belt 19A located on the +Y side supports the +Y side end of the underside of the pallet 3. The conveyor belt 19A located on the -Y side supports the -Y side end of the underside of the pallet 3. The drive pulley is rotated by a drive motor (not shown), thereby conveying the pallet 3 in the X-axis direction.

[0028] An actuator (not shown) allows one guide member 19B to move in the Y-axis direction relative to the other guide member 19B. When one guide member 19B and the other guide member 19B move away from each other in the Y-axis direction, support of the pallet 3 by the conveyor belt 19A is released.

[0029] Fig. 6 is a perspective view showing the pallet 3 and the stage 20 according to the embodiment. Fig. 7 is an exploded perspective view showing the pallet 3 and the stage 20 according to the embodiment.

[0030] The stage 20 supports the substrate 1 via the pallet 3. The stage 20 supports the pallet 3 from the -Z side when it is transported to the processing position. Two positioning members 20A are provided on the upper surface of the stage 20. The positioning members 20A are inserted into the holes 4D of the pallet 3. The stage 20 and the pallet 3 are positioned by inserting the positioning members 20A into the holes 4D from the -Z side of the pallet 3. A hook is provided on the upper end of the positioning member 20A. The hook is hooked onto the pallet 3. The hook includes a ball that moves by air pressure. After the positioning member 20A is inserted into the hole 4D from the -Z side of the pallet 3, the ball is hooked onto the pallet 3, thereby fixing the stage 20 and the pallet 3.

[0031] The stage moving device 21 moves the stage 20. In the embodiment, the stage moving device 21 moves the stage 20 in each of the Y-axis direction, the Z-axis direction, the θX direction, and the θY direction. The stage moving device 21 includes a Y-axis motor that generates power to move the stage 20 in the Y-axis direction, a Z-axis motor that generates power to move the stage 20 in the Z-axis direction, a θX motor that generates power to rotate the stage 20 in the θX direction, and a θY motor that generates power to rotate the stage 20 in the θY direction.

[0032] After the pallet 3 is transported to the processing position by the transport device 19, the +Y side guide member 19B moves in the +Y direction away from the other guide member 19B, and the stage moving device 21 moves the stage 20 in the +Z direction. When the +Y side guide member 19B moves in the Y axis direction away from the other guide member 19B, support of the pallet 3 by the transport belt 19A is released. When support of the pallet 3 by the transport belt 19A is released and the stage 20 moves in the +Z direction, the pallet 3 is transferred from the transport device 19 to the stage 20. With the pallet 3 supported on the stage 20, the stage moving device 21 moves the stage 20 in the +Y direction so that it is centered between the two guide members 19B, making it possible to move the stage 20 in each of the Z axis direction, the θX direction, and the θY direction.

[0033] When transferring the pallet 3 from the stage 20 to the transport device 19, the stage 20 moves in the -Y direction until one side of the pallet 3 is on the transport belt 19A, and the guide member 19B on the +Y side moves in the -Y side until the other side of the pallet 3 is on the transport belt 19A. After the hook provided at the upper end of the positioning member 20A is released from fixation, the stage 20 moves in the -Z direction by the stage movement device 21. As a result, support of the pallet 3 by the stage 20 is released, and the pallet 3 is supported by the transport belt 19A.

[0034] The component supply device 22 supplies the components 2. The component supply device 22 includes a plurality of tape feeders. The tape feeders hold a plurality of components 2. The component supply device 22 supplies at least one component 2 of the plurality of components 2 to a supply position. The component supply device 22 is disposed on the -Y side of the conveying device 19. Note that the component supply devices 22 may be disposed on both the +Y side and the -Y side of the conveying device 19.

[0035] The mounting head 24 mounts components 2 on the board 1. The mounting head 24 supports a plurality of nozzles 23. The mounting head 24 holds the components 2 supplied from the component supply device 22 with the nozzles 23 and mounts them on the board 1. The mounting head 24 is movable between a supply position where the components 2 are supplied from the component supply device 22 and a processing position where the board 1 is placed. The mounting head 24 holds the components 2 supplied to the supply position with the nozzles 23, moves to the processing position, and then mounts the components 2 on the surface of the board 1 placed at the processing position.

[0036] The head moving device 27 moves the mounting head 24. In this embodiment, the head moving device 27 moves the mounting head 24 in both the X-axis direction and the Y-axis direction. The head moving device 27 includes an X-axis moving device 27X that moves the mounting head 24 in the X-axis direction, and a Y-axis moving device 27Y that moves the mounting head 24 in the Y-axis direction. Each of the X-axis moving device 27X and the Y-axis moving device 27Y includes an actuator. The X-axis moving device 27X is connected to the mounting head 24. Operation of the X-axis moving device 27X causes the mounting head 24 to move in the X-axis direction. The Y-axis moving device 27Y is connected to the mounting head 24 via the X-axis moving device 27X. Operation of the Y-axis moving device 27Y causes the X-axis moving device 27X to move in the Y-axis direction, thereby moving the mounting head 24 in the Y-axis direction.

[0037] FIG. 8 is a schematic diagram showing a mounting head 24 according to an embodiment. As shown in FIG. 8 , the mounting head 24 has a plurality of nozzles 23. The nozzles 23 detachably hold the component 2. The nozzles 23 are suction nozzles that suction-hold the component 2. An opening is provided at the lower end of the nozzle 23. The opening of the nozzle 23 is connected to a vacuum system. With the lower end of the nozzle 23 and the component 2 in contact, a suction operation is performed through the opening provided at the lower end of the nozzle 23, thereby suction-holding the component 2 at the lower end of the nozzle 23. When the suction operation through the opening is released, the component 2 is released from the nozzle 23. Note that the nozzle 23 may be a gripper nozzle that clamps and holds the component 2.

[0038] The mounting head 24 has a nozzle moving device 28 that moves the nozzle 23. The nozzle moving device 28 moves the nozzle 23 in both the Z-axis direction and the θZ direction. The nozzle moving device 28 is supported by the mounting head 24. The nozzle 23 is connected to the lower end of a shaft 23A. A plurality of shafts 23A are provided. The plurality of nozzles 23 are connected to the plurality of shafts 23A, respectively. A plurality of nozzle moving devices 28 are provided. The plurality of nozzle moving devices 28 are connected to the plurality of shafts 23A, respectively. The nozzle 23 is supported by the mounting head 24 via the shaft 23A and the nozzle moving device 28. The nozzle moving device 28 moves the shaft 23A in the Z-axis direction and the θZ direction, thereby moving the nozzle 23.

[0039] The nozzle 23 can be moved in each of the X-axis direction, Y-axis direction, Z-axis direction, and θZ direction by the head moving device 27 and the nozzle moving device 28. By moving the nozzle 23, the component 2 held by the nozzle 23 can also be moved in each of the X-axis direction, Y-axis direction, Z-axis direction, and θZ direction.

[0040] The camera 25 captures an image of the board 1. In this embodiment, the camera 25 captures an image of the surface of the board 1 from the +Z side of the board 1. The camera 25 is provided on the mounting head 24. The camera 25 moves in the X-axis direction and the Y-axis direction together with the mounting head 24. The camera 25 can capture an image of an alignment mark provided on the surface of the board 1. The camera 25 can capture an image of the component 2 after it has been mounted on the board 1.

[0041] The dispenser 11 applies cream solder to the board 1. The dispenser 11 moves in the X-axis direction, Y-axis direction, and Z-axis direction on the +Z side of the conveying device 19. The dispenser 11 and the mounting head 24 can move separately. After the dispenser 11 applies cream solder to the surface of the board 1, the mounting head 24 mounts the components 2 on the board 1. The mounting head 24 mounts the components 2 on the board 1 to which the cream solder has been applied.

[0042] The laser head 12 irradiates the cream solder with laser light so that the cream solder melts. After the component 2 is mounted on the board 1 via the cream solder, the laser head 12 irradiates the cream solder with laser light. The laser head 12 irradiates the cream solder with laser light to melt the cream solder. The laser head 12 moves in the X-axis direction, Y-axis direction, and Z-axis direction on the +Z side of the conveying device 19. The laser head 12, the dispenser 11, and the mounting head 24 can move separately.

[0043] The chamber 29 has an internal space that accommodates the base member 18, the conveying device 19, the stage 20, the stage moving device 21, the component supply device 22, the mounting head 24, the head moving device 27, the nozzle moving device 28, the dispenser 11, and the laser head 12.

[0044] <Controller> FIG. 9 is a hardware configuration diagram of the controller 16 according to the embodiment. The controller 16 includes a computer system. The controller 16 includes a processor 16A such as a CPU (Central Processing Unit), a main memory 16B including a nonvolatile memory such as a ROM (Read Only Memory) and a volatile memory such as a RAM (Random Access Memory), a storage 16C, and an interface 16D including an input / output circuit. The functions of the controller 16 are stored in the storage 16C as a computer program. The processor 16A reads the computer program from the storage 16C, loads it into the main memory 16B, and executes predetermined processing in accordance with the computer program. The computer program may be distributed to the controller 16 via a network.

[0045] 10 is a functional block diagram showing the three-dimensional mounting apparatus 10 according to the embodiment. As shown in FIG. 10, the controller 16 has an allowable angle storage unit 30, a mounting order storage unit 40, a dispenser control unit 31, a stage control unit 32, a head control unit 33, a laser control unit 34, a positional deviation amount calculation unit 35, an allowable angle acquisition unit 36, and a mounting order determination unit 37.

[0046] The dispenser control unit 31 controls the dispenser 11. The dispenser control unit 31 controls the dispenser 11 so that the cream solder 60 is applied to the surface of the substrate 1.

[0047] Fig. 11 is a plan view schematically showing a substrate 1 according to an embodiment. As shown in Fig. 11, a plurality of mounting areas 50 are set on the surface of the substrate 1. The mounting areas 50 are areas where components 2 are mounted. A component 2 is mounted in each of the plurality of mounting areas 50. A dispenser control unit 31 applies cream solder 60 to each of the plurality of mounting areas 50.

[0048] The stage control unit 32 controls the stage 20. The head control unit 33 controls the mounting head 24 so that the components 2 are mounted on the substrate 1 supported by the stage 20.

[0049] 12 and 13 are diagrams illustrating the operation of the stage 20 and mounting head 24 according to the embodiment. A plurality of mounting areas 50 are set on the surface of the substrate 1. In the example shown in FIGS. 12 and 13, the mounting areas 50 set on the surface of the substrate 1 include mounting areas 50A, 50B, and 50C. Cream solder 60 is applied to each of the plurality of mounting areas 50. The components 2 include a component 2A mounted in mounting area 50A, a component 2B mounted in mounting area 50B, and a component 2C mounted in mounting area 50C.

[0050] When components 2 are mounted in mounting areas 50 set on the surface of the substrate 1, the tilt angle of the substrate 1 is adjusted so that the mounting areas 50 are horizontal. The stage control unit 32 controls the stage 20 so that the multiple mounting areas 50 are successively made horizontal. The head control unit 33 controls the mounting head 24 so that the components 2 are successively mounted in the horizontal mounting areas 50.

[0051] 12 , when mounting a component 2A on a mounting area 50A, the stage control unit 32 controls the stage 20 so that the mounting area 50A is horizontal. The head control unit 33 controls the mounting head 24 so that the component 2A is mounted on the horizontal mounting area 50A. The component 2A is mounted on the mounting area 50A via the cream solder 60 that has been applied to the mounting area 50A.

[0052] 13 , after component 2A is mounted in mounting area 50A, component 2B is mounted in mounting area 50B. When mounting component 2B in mounting area 50B, stage control unit 32 controls stage 20 so that mounting area 50B is in a horizontal position. Head control unit 33 controls mounting head 24 so that component 2B is mounted in mounting area 50B in a horizontal position. Component 2B is mounted in mounting area 50B via cream solder 60 that has been applied to mounting area 50B.

[0053] After component 2B is mounted in mounting area 50B, component 2C is mounted in mounting area 50C. When mounting component 2C in mounting area 50C, stage control unit 32 controls stage 20 so that mounting area 50C is in a horizontal position. Head control unit 33 controls mounting head 24 so that component 2C is mounted in mounting area 50C in a horizontal position. Component 2C is mounted in mounting area 50C via cream solder 60 applied to mounting area 50C.

[0054] The laser control unit 34 controls the laser head 12. After the component 2 is mounted in the mounting area 50 via the cream solder 60, the laser control unit 34 controls the laser head 12 so that laser light is irradiated onto the cream solder 60. The cream solder 60 is melted by being irradiated with laser light. The melted cream solder 60 cools, and the component 2 is soldered to the board 1.

[0055] 14 is a diagram illustrating the operation of the laser head 12 according to the embodiment. As shown in FIG. 14 , the laser head 12 irradiates the cream solder 60 with laser light after mounting the components 2 on the mounting areas 50. When irradiating the cream solder 60 in the mounting areas 50 on which the components 2 have been mounted with laser light, the tilt angle of the board 1 is adjusted so that the mounting areas 50 are horizontal. The stage control unit 32 controls the stage 20 so that the multiple mounting areas 50 are successively brought into a horizontal state. The laser control unit 34 controls the laser head 12 so that the cream solder 60 in the horizontal mounting areas 50 is successively irradiated with laser light.

[0056] 14 , when irradiating the cream solder 60 in the mounting area 50A on which the component 2A has been mounted with laser light, the stage control unit 32 controls the stage 20 so that the mounting area 50A is in a horizontal position. The laser control unit 34 controls the laser head 12 so that the laser light is irradiated onto the cream solder 60 in the horizontal mounting area 50A. The cream solder 60 in the mounting area 50A is melted by the irradiation of the laser light. The melted cream solder 60 in the mounting area 50A is cooled, thereby soldering the component 2A to the mounting area 50A.

[0057] When irradiating the cream solder 60 in the mounting area 50B on which the component 2B is mounted with laser light, the stage control unit 32 controls the stage 20 so that the mounting area 50B is in a horizontal position. The laser control unit 34 controls the laser head 12 so that the laser light is irradiated onto the cream solder 60 in the horizontal mounting area 50B. The cream solder 60 in the mounting area 50B is melted by the irradiation of the laser light. The melted cream solder 60 in the mounting area 50B is cooled, thereby soldering the component 2B to the mounting area 50B.

[0058] When irradiating the cream solder 60 in the mounting area 50C on which the component 2C is mounted with laser light, the stage control unit 32 controls the stage 20 so that the mounting area 50C is horizontal. The laser control unit 34 controls the laser head 12 so that the laser light is irradiated onto the cream solder 60 in the horizontal mounting area 50C. The cream solder 60 in the mounting area 50C is melted by the irradiation of the laser light. The melted cream solder 60 in the mounting area 50C is cooled, thereby soldering the component 2C to the mounting area 50C.

[0059] <Allowable Angle> The misalignment amount calculation unit 35 calculates the misalignment amount ΔD of the component 2 after mounting relative to the mounting area 50. The component 2 after mounting on the board 1 is imaged by the camera 25. The misalignment amount calculation unit 35 calculates the misalignment amount ΔD of the component 2 after mounting based on the image data of the component 2 after mounting imaged by the camera 25.

[0060] 15 is a diagram illustrating misalignment of the component 2 according to the embodiment. After the component 2 is mounted on the mounting area 50 via the cream solder 60, the component 2 is not soldered to the mounting area 50 before the cream solder 60 is irradiated with laser light. Therefore, as shown in FIG. 15 , if the mounting area 50 is tilted with respect to the horizontal plane, the component 2 may be misaligned with respect to the mounting area 50 due to the effect of gravity.

[0061] 13, when a component 2A is mounted on a mounting area 50A and then a component 2B is mounted on a mounting area 50B, the mounting area 50A is tilted with respect to the horizontal plane. When the mounting area 50A is tilted with respect to the horizontal plane, the component 2A may be misaligned due to the action of gravity.

[0062] When calculating the misalignment amount ΔD of the component 2, the component 2 is mounted on the mounting area 50 via the cream solder 60, and then the camera 25 captures an image of the component 2 before the cream solder 60 is irradiated with laser light. The misalignment amount calculation unit 35 can calculate the misalignment amount ΔD of the component 2 based on the image data of the component 2 captured by the camera 25.

[0063] The allowable angle acquisition unit 36 ​​acquires an allowable angle θ indicating the maximum tilt angle of the component 2 at which the amount of misalignment ΔD of the component 2 after mounting is suppressed to a predetermined specified amount or less. The tilt angle of the component 2 is equal to the tilt angle of the mounting area 50 on which the component 2 is mounted. The tilt angles of the component 2 and the mounting area 50 are tilt angles with respect to the horizontal plane. The specified amount is a value close to zero. In the embodiment, the allowable angle θ is the maximum tilt angle at which the component 2 does not substantially misalign.

[0064] 15 , when the misalignment amount calculation unit 35 calculates the misalignment amount ΔD, the stage control unit 32 tilts the mounting area 50 to an arbitrary tilt angle. The stage control unit 32 gradually increases the tilt angle of the mounting area 50 relative to the horizontal plane from 0 degrees. The camera 25 captures images of the components 2 mounted in the mounting area 50 at gradually increasing tilt angles. Based on the image data of the components 2 mounted in the mounting area 50 at gradually increasing tilt angles, the misalignment amount calculation unit 35 can calculate the maximum tilt angle of the components 2 at which the misalignment amount ΔD is equal to or less than a specified value. In the embodiment, based on the image data of the components 2, the misalignment amount calculation unit 35 can calculate the maximum tilt angle of the components 2 at which the components 2 are not substantially misaligned.

[0065] The allowable angle acquisition unit 36 ​​acquires, as the allowable angle θ, the maximum value of the tilt angle of the component 2 at which the positional deviation ΔD of the component 2 calculated by the positional deviation calculation unit 35 is equal to or less than a specified amount. The positional deviation calculation unit 35 calculates the allowable angle θ of each of the multiple components 2 mounted on the board 1. The allowable angle acquisition unit 36 ​​acquires the allowable angle θ of each of the multiple components 2 mounted on the board 1. The allowable angle θ acquired by the allowable angle acquisition unit 36 ​​is stored in the allowable angle storage unit 30.

[0066] <Mounting Order> The mounting order determination unit 37 determines the mounting order of the components 2 for the multiple mounting areas 50 set on the surface of the substrate 1 so that the angle of the components 2 after mounting on the substrate 1 is equal to or less than the allowable angle θ. The stage control unit 32 controls the stage 20 so that the multiple mounting areas 50 are successively brought into a horizontal state, in accordance with the mounting order determined by the mounting order determination unit 37. The head control unit 33 controls the mounting head 24 so that the components 2 are successively mounted in the horizontal mounting areas 50, in accordance with the mounting order determined by the mounting order determination unit 37.

[0067] 16 and 17 are diagrams illustrating the mounting order of components 2 according to the embodiment. In the examples shown in FIGS. 16 and 17, the allowable angle θa of component 2A is smaller than the allowable angle θb of component 2B. FIG. 16 shows an example in which component 2A is mounted in mounting area 50A, and then component 2B is mounted in mounting area 50B. FIG. 17 shows an example in which component 2B is mounted in mounting area 50B, and then component 2A is mounted in mounting area 50A.

[0068] As shown in the diagram marked with (A) in Fig. 16 , when mounting component 2A in mounting area 50A, stage control unit 32 controls stage 20 so that mounting area 50A is in a horizontal position. As shown in the diagram marked with (B) in Fig. 16 , when mounting component 2B in mounting area 50B after component 2A has been mounted in mounting area 50A, stage control unit 32 controls stage 20 so that mounting area 50B is in a horizontal position. Because the allowable angle θa of component 2A is small, if mounting area 50A is inclined with respect to the horizontal plane, there is a high possibility that component 2A will be misaligned due to the action of gravity.

[0069] As shown in the diagram marked with (A) in Fig. 17, when mounting component 2B in mounting area 50B, stage control unit 32 controls stage 20 so that mounting area 50B is in a horizontal state. As shown in the diagram marked with (B) in Fig. 17, when mounting component 2A in mounting area 50A after component 2B has been mounted in mounting area 50B, stage control unit 32 controls stage 20 so that mounting area 50A is in a horizontal state. Because the allowable angle θb of component 2B is large, there is little possibility that component 2B will become misaligned even if mounting area 50B is inclined with respect to the horizontal plane.

[0070] 17 , component 2A with a small allowable angle θa is mounted after component 2B with a large allowable angle θb, thereby suppressing misalignment of components 2A and 2B. Mounting order determination unit 37 determines the mounting order of components 2 for each of the multiple mounting areas 50 so that components 2 with a small allowable angle θ are mounted after components 2 with a large allowable angle θ. The mounting order determined by mounting order determination unit 37 is stored in mounting order storage unit 40.

[0071] The mounting order of the components 2 determined by the mounting order determination unit 37 is stored in the mounting order storage unit 40, and the components are mounted in accordance with that order, thereby preventing misalignment.

[0072] <Handling of Components with Unresolved Positional Misalignment> Even if the mounting order is adjusted, there may be components 2 whose mounting angle does not become equal to or less than the allowable angle θ due to factors such as the weight of the components 2, the size of the components 2, and the shape of the board 1. In other words, even if the mounting order is adjusted, there may be components 2 whose positional misalignment is not resolved.

[0073] In the following description, components 2 whose positional deviation is eliminated by adjusting the mounting order will be referred to as permissible components, and components 2 whose positional deviation is not eliminated even when the mounting order is adjusted will be referred to as non-permissible components.

[0074] 18 and 19 are diagrams illustrating a component 2 in which misalignment is not eliminated according to an embodiment. In the example shown in FIGS. 18 and 19 , the mounting area 50 set on the surface of the board 1 includes a mounting area 50D, a mounting area 50E, and a mounting area 50F. Cream solder 60 is applied to each of the multiple mounting areas 50. The components 2 include a component 2D mounted in the mounting area 50D, a component 2E mounted in the mounting area 50E, and a component 2F mounted in the mounting area 50F. The allowable angle θf of the component 2F is large. The allowable angle θd of the component 2D and the allowable angle θe of the component 2E are small. The component 2F is an allowable component. The components 2D and 2E are each an unallowable component. FIG. 18 illustrates an example in which the component 2D is mounted in the mounting area 50D, and then the component 2E is mounted in the mounting area 50E. 19 shows an example in which a component 2E is mounted in a mounting area 50E, and then a component 2D is mounted in a mounting area 50D. A component 2F has already been mounted in a mounting area 50F.

[0075] As shown in the diagram marked with (A) in Fig. 18 , when a component 2D is mounted in mounting area 50D, stage control unit 32 controls stage 20 so that mounting area 50D is in a horizontal position. As shown in the diagram marked with (B) in Fig. 18 , when a component 2E is mounted in mounting area 50E after component 2D has been mounted in mounting area 50D, stage control unit 32 controls stage 20 so that mounting area 50E is in a horizontal position. Because the allowable angle θd of component 2D is small, if mounting area 50D is inclined with respect to the horizontal plane, there is a high possibility that component 2D will be misaligned due to the action of gravity.

[0076] As shown in the diagram marked with (A) in Fig. 19 , when a component 2E is mounted in a mounting area 50E, the stage control unit 32 controls the stage 20 so that the mounting area 50E is horizontal. As shown in the diagram marked with (B) in Fig. 19 , when a component 2D is mounted in a mounting area 50D after the component 2E has been mounted in the mounting area 50E, the stage control unit 32 controls the stage 20 so that the mounting area 50D is horizontal. Because the allowable angle θe of the component 2E is small, if the mounting area 50E is inclined with respect to the horizontal plane, there is a high possibility that the component 2E will be misaligned due to the action of gravity.

[0077] That is, when component 2E is mounted in mounting area 50E after component 2D is mounted in mounting area 50D, component 2D does not become equal to or less than the allowable angle θd when mounting component 2E, causing misalignment of component 2D. Even when the mounting order is reversed and component 2D is mounted in mounting area 50D after component 2E is mounted in mounting area 50E, a situation may arise in which component 2E does not become equal to or less than the allowable angle θe when mounting component 2D.

[0078] 18 and 19 may occur, i.e., after mounting component 2D on mounting area 50D, component 2D does not become equal to or less than allowable angle θd when mounting component 2E, and even if the mounting order is reversed, component 2E does not become equal to or less than allowable angle θe when mounting component 2D after mounting component 2E on mounting area 50E. In this case, laser control unit 34 irradiates the cream solder 60 on mounting area 50D with laser light after mounting component 2D and before tilting board 1, and fixes component 2D by soldering before tilting associated with mounting component 2E. If the mounting order were reversed, laser head 12 is controlled so that laser light is irradiated onto cream solder 60 on mounting area 50E after mounting component 2E and before tilting board 1.

[0079] 20 and 21 are diagrams illustrating the operation of the three-dimensional mounting apparatus 10 when there is a component 2 whose positional deviation has not been eliminated according to the embodiment.

[0080] As shown in the diagram marked with (A) in Fig. 20 , when mounting a component 2D on a mounting area 50D, the stage control unit 32 controls the stage 20 so that the mounting area 50D is in a horizontal position. As shown in the diagram marked with (B) in Fig. 20 , after the component 2D is mounted on the mounting area 50D, the cream solder 60 on the mounting area 50D is irradiated with a laser beam while the mounting area 50D is maintained in a horizontal position. The cream solder 60 melted by the laser beam is cooled, thereby soldering the component 2D to the mounting area 50D.

[0081] As shown in the diagram marked with (A) in FIG. 21 , after component 2D is soldered to mounting area 50D, component 2E is mounted to mounting area 50E. When mounting component 2E to mounting area 50E, stage control unit 32 controls stage 20 so that mounting area 50E is horizontal. By horizontally positioning mounting area 50E, mounting area 50D is tilted relative to the horizontal plane. Because component 2D is soldered to mounting area 50D, even if the tilt angle of mounting area 50D exceeds the allowable angle θd, misalignment of component 2D is suppressed. As shown in the diagram marked with (B) in FIG. 21 , after component 2E is mounted to mounting area 50E, laser light is irradiated onto cream solder 60 in mounting area 50E while maintaining the horizontal state of mounting area 50E. As the cream solder 60 melted by the laser light cools, component 2E is soldered to mounting area 50E. Then, allowable components are sequentially soldered using laser light.

[0082] 22 is a flowchart showing a method for determining the mounting order of components 2 according to an embodiment. When determining the mounting order, a test board 1 and test components 2 are used.

[0083] The stage control unit 32 controls the stage 20 so that the plurality of mounting areas 50 are successively brought into a horizontal state. The dispenser control unit 31 controls the dispenser 11 so that the cream solder 60 is applied to each of the plurality of mounting areas 50 of the substrate 1 (step SA1).

[0084] The head control unit 33 controls the mounting head 24 so that the components 2 are mounted on the mounting area 50 in a horizontal state (step SA2).

[0085] The positional deviation calculation unit 35 causes the camera 25 to capture an image of the component 2 in the mounting area 50 (step SA3).

[0086] The misalignment amount calculation unit 35 calculates the misalignment amount ΔD of each component 2 based on the image data of the component 2 captured in step SA3 (step SA4). It is determined whether the misalignment amount ΔD calculated by the misalignment amount calculation unit 35 is equal to or less than a specified amount (step SA5).

[0087] In step SA5, if it is determined that the positional deviation amount ΔD is less than the specified amount (step SA5: Yes), the stage control unit 32 increases the inclination angle of the mounting area 50, and the positional deviation amount calculation unit 35 repeats imaging and calculation of the positional deviation amount ΔD (step SA6).

[0088] In step SA5, if it is determined that the positional deviation amount ΔD exceeds the specified amount (step SA5: No), the tilt angle before the positional deviation amount ΔD exceeds the specified amount is stored in the allowable angle memory unit 30 as the allowable angle θ of the tilt angle of the part 2 (step SA7).

[0089] This operation is performed for each component 2 to be mounted on the board 1. The allowable angle θ stored in the allowable angle storage unit 30 can be applied to other boards 1 as long as the components 2 are the same.

[0090] The mounting order determination unit 37 determines the mounting order of the components 2 for the multiple mounting areas 50 based on the allowable angle θ of each of the multiple components 2 .

[0091] The mounting order determination unit 37 tentatively determines the mounting order based on the optimum mounting order for a conventional planar board (step SA8).

[0092] It is checked whether each component 2 will be an acceptable component or an unacceptable component when mounted in accordance with the mounting order (step SA9).

[0093] The unacceptable components are moved to the back of the mounting order, and it is checked whether each component 2 becomes an acceptable component or an unacceptable component (step SA10).

[0094] The mounting order is changed and checked repeatedly until the identification of acceptable and unacceptable components remains unchanged (step SA11).

[0095] The mounting order and the identification of the allowable and non-allowable components in that order are stored in the mounting order storage unit 40 (step SA12).

[0096] By doing this, components 2 with a small allowable angle θ, i.e., components 2 that are prone to misalignment, are mounted later and are less susceptible to tilt of the board 1 when other components 2 are mounted. Therefore, by increasing the number of allowable components and decreasing the number of non-allowable components, continuous mounting operations become possible and the mounting tact time can be shortened.

[0097] <Mounting Method> FIG. 23 is a flowchart showing a mounting method for the component 2 according to this embodiment.

[0098] The dispenser control unit 31 controls the dispenser 11 so that the cream solder 60 is applied to each of the plurality of mounting areas 50 of the board 1 (step SB1).

[0099] The stage control unit 32 controls the stage 20 so that the multiple mounting areas 50 are successively brought into a horizontal state, according to the mounting order stored in the mounting order storage unit 40. The head control unit 33 controls the mounting head 24 so that the components 2 are successively mounted in the horizontal mounting areas 50, according to the mounting order stored in the mounting order storage unit 40, and mounts the allowable components (step SB2).

[0100] The head control unit 33 determines whether or not there is an unacceptable part (step SB3).

[0101] If it is determined in step SB3 that an unacceptable component exists (step SB3 returns Yes), the head control unit 33 mounts the unacceptable component in the mounting area 50 (step SB4).

[0102] As explained with reference to Figures 20 and 21, after the non-acceptable component is mounted in the mounting area 50, the laser control unit 34 controls the laser head 12 so that laser light is irradiated onto the cream solder 60 of the non-acceptable component while maintaining the mounting area 50 in a horizontal position (step SB5).

[0103] The head control unit 33 determines whether or not mounting of all non-permissible components has been completed (step SB6).

[0104] If it is determined in step SB6 that the mounting of non-permissible components has not been completed (step SB6: No), the process returns to step SB4.

[0105] If it is determined in step SB6 that the mounting of the non-acceptable components has been completed (step SB6: Yes), the laser control unit 34 controls the laser head 12 so that laser light is irradiated onto the cream solder 60 of the acceptable components (step SB7).

[0106] The laser control unit 34 controls the laser head 12 so that the cream solder 60 of each of the plurality of acceptable components is sequentially irradiated with the laser light. Similarly, if it is determined in step SB3 that no unacceptable components exist (step SB3: No), the laser control unit 34 controls the laser head 12 so that the cream solder 60 of each of the plurality of acceptable components is irradiated with the laser light (step SB7).

[0107] At this time, the order of soldering with the laser beam is the opposite of the order of component mounting, thereby preventing the components before soldering from being tilted at an angle greater than the angle at which they are mounted.

[0108] <Effects> As described above, according to the embodiment, the mounting order of the components 2 is determined based on the allowable angle θ of the components 2. Since the mounting order of the components 2 is determined so that the angle of the mounted components 2 is equal to or less than the allowable angle θ, positional deviation of the components 2 is suppressed.

[0109] The three-dimensional mounting device 10 is designed to achieve an optimal takt time and increase productivity when continuously picking up and placing components 2. According to the present invention, by distinguishing between permissible and non-permissible components, permissible components can be mounted using continuous pick-up and continuous placement as in the past, and the decrease in takt time can be minimized even in three-dimensional mounting where the board 1 is tilted while being placed.

[0110] Second Embodiment A second embodiment will be described below. In the following description, the same or equivalent components as those in the above-described embodiment will be denoted by the same reference numerals, and the description of those components will be simplified or omitted.

[0111] Fig. 24 is a side view schematically showing a three-dimensional mounting apparatus 110 according to an embodiment. In the embodiment, the three-dimensional mounting apparatus 110 includes a coating head 13 that coats an adhesive 70 on the surface of the substrate 1, and an ultraviolet light head 14 that emits ultraviolet light. In Fig. 24, the dispenser 11 is not shown. Note that the cream solder 60 may be coated on the substrate 1 by a coating apparatus separate from the three-dimensional mounting apparatus 110.

[0112] 25 is a functional block diagram showing a three-dimensional mounting apparatus 110 according to an embodiment. In the embodiment, the controller 16 has a fixed control unit 38 that controls each of the application head 13 and the ultraviolet light head 14.

[0113] 26 is a diagram illustrating the operation of the dispensing head 13 according to the embodiment. In the embodiment, adhesive 70 is dispensed onto the mounting area 50 where the non-permissible component is to be mounted. The non-permissible component and the mounting area 50 are fixed together with the adhesive 70.

[0114] In this embodiment, the adhesive 70 is ultraviolet light curing type. After the non-acceptable component is mounted on the mounting area 50 via the adhesive 70 and the cream solder 60, the fixing control unit 38 controls the ultraviolet light head 14 so that ultraviolet light is irradiated onto the adhesive 70 applied to the mounting area 50.

[0115] 27 and 28 are diagrams illustrating the operation of the three-dimensional mounting apparatus 110 when there is a component 2 whose positional deviation has not been eliminated according to the embodiment.

[0116] If, after mounting component 2D on mounting area 50D, component 2D does not become equal to or smaller than allowable angle θd when mounting component 2E, and if, after mounting component 2E on mounting area 50E, component 2E does not become equal to or smaller than allowable angle θe when mounting component 2D, then fixing control unit 38 controls application head 13 so that component 2D and mounting area 50D are fixed with adhesive 70 after mounting component 2D and before tilting substrate 1, and so that component 2E and mounting area 50E are fixed with adhesive 70 after mounting component 2E and before tilting substrate 1.

[0117] Before component 2D, which is an unacceptable component, is mounted in mounting area 50D, cream solder 60 and adhesive 70 are applied to mounting area 50D. Before component 2E, which is an unacceptable component, is mounted in mounting area 50E, cream solder 60 and adhesive 70 are applied to mounting area 50E.

[0118] As shown in the diagram labeled (A) in FIG. 27 , when mounting a component 2D on the mounting area 50D, the stage control unit 32 controls the stage 20 so that the mounting area 50D is in a horizontal position. The component 2D is mounted on the mounting area 50D via adhesive 70 and cream solder 60. As shown in the diagram labeled (B) in FIG. 27 , after the component 2D is mounted on the mounting area 50D via adhesive 70 and cream solder 60, ultraviolet light is irradiated onto the adhesive 70 on the mounting area 50D while the mounting area 50D is maintained in a horizontal position. Irradiating the adhesive 70 with ultraviolet light hardens the adhesive 70, and the component 2D and the mounting area 50D are fixed together by the adhesive 70.

[0119] As shown in the diagram marked with (A) in FIG. 28 , after the component 2D and the mounting area 50D are fixed with adhesive 70, the component 2E is mounted on the mounting area 50E. When mounting the component 2E on the mounting area 50E, the stage control unit 32 controls the stage 20 so that the mounting area 50E is horizontal. By making the mounting area 50E horizontal, the mounting area 50D is tilted with respect to the horizontal plane. Because the component 2D is fixed to the mounting area 50D with adhesive 70, even if the tilt angle of the mounting area 50D exceeds the allowable angle θd, misalignment of the component 2D is suppressed. As shown in the diagram marked with (B) in FIG. 28 , after the component 2E is mounted on the mounting area 50E via adhesive 70 and cream solder 60, ultraviolet light is irradiated onto the adhesive 70 on the mounting area 50E while the mounting area 50E is maintained in a horizontal state. By irradiating the adhesive 70 with ultraviolet light, the adhesive 70 hardens, and the component 2E and the mounting area 50E are fixed by the adhesive 70.

[0120] The adhesive does not need to be cured by ultraviolet light immediately after the component 2 is mounted, and there is no problem as long as it is cured before the component 2 is tilted beyond the allowable angle θ. Therefore, as long as this condition is met, it is possible to simultaneously cure adjacent non-allowable components, thereby enabling faster takt time.

[0121] FIG. 29 is a flowchart showing a method for mounting a component 2 according to the embodiment.

[0122] The dispenser control unit 31 controls the dispenser 11 so that the cream solder 60 is applied to each of the plurality of mounting areas 50 of the board 1 (step SC1).

[0123] The stage control unit 32 controls the stage 20 so that the multiple mounting areas 50 are successively placed in a horizontal state, according to the mounting order stored in the mounting order storage unit 40. The head control unit 33 controls the mounting head 24 so that the components 2 are successively mounted in the horizontal mounting areas 50, according to the mounting order stored in the mounting order storage unit 40 (step SC2).

[0124] The head control unit 33 determines whether or not there is an unacceptable part (step SC3).

[0125] If it is determined in step SC3 that an unacceptable component is present (step SC3: Yes), the fixing control unit 38 applies adhesive 70 to the mounting area 50 where the unacceptable component is to be mounted (step SC4).

[0126] The head control unit 33 mounts the non-permissible component in the mounting area 50 (step SC5).

[0127] As explained with reference to Figures 27 and 28, after the non-acceptable component is mounted in the mounting area 50, the fixing control unit 38 controls the ultraviolet light head 14 so that ultraviolet light is irradiated onto the adhesive 70 of the non-acceptable component within a range in which the inclination angle of the mounting area 50 does not exceed the allowable angle θ.

[0128] The head control unit 33 determines whether or not mounting of all non-permissible components has been completed (step SC6).

[0129] If it is determined in step SC6 that the mounting of non-permissible components has not been completed (step SC6: No), the process returns to step SC4.

[0130] If it is determined in step SC6 that the mounting of the non-permissible components has been completed (step SC6: Yes), the laser control unit 34 controls the laser head 12 so that the cream solder 60 of all components 2, including the permissible and non-permissible components, is irradiated with laser light (step SC7). Similarly, if it is determined in step SC3 that there are no non-permissible components (step SC3: No), the laser control unit 34 controls the laser head 12 so that the cream solder 60 of all the permissible components is irradiated with laser light (step SC7).

[0131] By irradiating the laser beam in the opposite order to the mounting order, it is possible to prevent the components before soldering from being tilted beyond the reference angle.

[0132] In step SC7, the substrate 1 on which the plurality of components 2 are mounted may be carried into the reflow furnace without tilting it, without using the laser head 12. In this case, soldering by laser light is not required, and productivity is greatly improved by performing batch soldering.

[0133] As described above, in the embodiment, the positional deviation of the component 2 is suppressed while minimizing the decrease in productivity due to three-dimensional mounting. In the embodiment, even if a non-permissible component is present, the adhesive 70 suppresses the positional deviation of the non-permissible component.

[0134] 30 is a diagram schematically illustrating the allowable angle storage unit 30 according to an embodiment. In the above-described embodiment, the allowable angle θ is calculated based on image data of the component 2 captured by the camera 25. The allowable angle θ of the component 2 may be measured by a measurement device separate from the three-dimensional mounting device 10. In that case, correlation data (allowable angle table) between the component 2 and the allowable angle θ as shown in FIG. 30 may be stored directly in the allowable angle storage unit 30 from external measurement data, without going through the allowable angle acquisition unit 36.

[0135] FIG. 31 is a diagram schematically illustrating a controller 16 according to an embodiment. As shown in FIG. 31 , the controller 16 may include an allowable angle calculation unit 39 that calculates the allowable angle θ of the component 2 based on the weight of the component 2. The allowable angle acquisition unit 36 ​​may acquire the allowable angle θ from the allowable angle calculation unit 39. The weight of the component 2 and the allowable angle θ are correlated. The heavier the weight of the component 2, the smaller the allowable angle θ. Note that the allowable angle calculation unit 39 may calculate the allowable angle θ taking into account not only the weight of the component 2 but also the volume of the component 2 and the physical properties of the cream solder 60. By taking into account not only the weight of the component 2 but also the volume of the component 2 and the physical properties of the cream solder 60, the calculation accuracy of the allowable angle θ is improved.

[0136] The present disclosure includes the following aspects: (1) A three-dimensional mounting device comprising: a stage that supports a three-dimensional substrate; a mounting head that mounts components on a surface of the three-dimensional substrate; and a controller, wherein the controller has: an allowable angle acquisition unit that acquires an allowable angle indicating a maximum value of the tilt angle of the components at which a positional deviation amount after mounting is suppressed to a specified amount or less; a mounting order determination unit that determines an order of mounting components on a plurality of mounting areas set on the surface of the three-dimensional substrate so that the mounted components are at or below the allowable angle; a stage control unit that controls the stage so that the plurality of mounting areas are successively horizontal in accordance with the mounting order; and a head control unit that controls the mounting head so that components are successively mounted on the horizontal mounting areas in accordance with the mounting order. (2) The three-dimensional mounting device described in (1), wherein the controller has a misalignment amount calculation unit that calculates a positional deviation amount of the components after mounting based on image data of the mounted components, and the allowable angle acquisition unit acquires as the allowable angle the maximum value of the tilt angle of the components at which the positional deviation amount calculated by the misalignment amount calculation unit is at or below the specified amount. (3) The three-dimensional mounting device according to (1), wherein the controller has an allowable angle storage unit that stores correlation data between the component and the allowable angle, and the allowable angle storage unit acquires and stores the allowable angle from the allowable angle acquisition unit. (4) The three-dimensional mounting device according to (1), wherein the controller has an allowable angle calculation unit that calculates the allowable angle based on the weight of the component, and the allowable angle acquisition unit acquires the allowable angle from the allowable angle calculation unit. (5) The three-dimensional mounting device according to (1), wherein the mounting order determination unit determines the mounting order such that a mounted component does not exceed the allowable angle during subsequent component mounting.(6) The three-dimensional mounting device according to (5), further comprising: a laser head that applies cream solder to the mounting area and irradiates the cream solder with laser light after components are mounted on the mounting area, wherein the controller has a laser control unit that controls the laser head so that, after a first component has been mounted on a first mounting area and a mounting order that causes the first component to be at an angle equal to or less than the allowable angle when a second component is mounted, the cream solder in the first mounting area is irradiated with laser light after the first component has been mounted and before the three-dimensional substrate is tilted, thereby soldering the first component. (7) The three-dimensional mounting device according to (1), further comprising: a coating head that applies adhesive to a surface of the three-dimensional substrate, wherein the controller further has a fixing control unit that controls the coating head so that, after the first component has been mounted on the first mounting area and the first component does not be at an angle equal to or less than the allowable angle when a second component is mounted, the first component and the first mounting area are fixed with adhesive after the first component has been mounted and before the three-dimensional substrate is tilted. (8) The three-dimensional mounting device according to (7), wherein the adhesive is ultraviolet-curing, and the device includes an ultraviolet light head that emits ultraviolet light, and the fixing control unit controls the ultraviolet light head to irradiate the adhesive applied to the mounting area with ultraviolet light. (9) A three-dimensional mounting method, comprising: acquiring an allowable angle indicating a maximum tilt angle of components at which an amount of misalignment of the components after mounting on a surface of a three-dimensional substrate is suppressed to a specified amount or less; determining a mounting order of components for a plurality of mounting areas set on the surface of the three-dimensional substrate so that the mounted components are at or below the allowable angle; rotating the three-dimensional substrate so that the plurality of mounting areas are successively horizontal in accordance with the mounting order; and mounting components successively in the horizontal mounting areas in accordance with the mounting order. (10) The three-dimensional mounting method according to (9), further comprising, if the angle of the first component does not become equal to or less than an allowable angle when a second component is mounted after the first component is mounted on the first mounting area, fixing the first component and the three-dimensional substrate with an adhesive after the first component is mounted and before tilting the three-dimensional substrate.

[0137] This application is based on Japanese Patent Application Nos. 2023-223337 and 2023-223338, filed on December 28, 2023, the contents of which are incorporated herein by reference.

Claims

1. A three-dimensional mounting apparatus comprising a stage for supporting a three-dimensional substrate, a mounting head for mounting components on the surface of the three-dimensional substrate, and a controller, wherein the controller includes a tolerance angle acquisition unit that acquires a tolerance angle indicating the maximum value of the inclination angle of a component whose displacement amount after mounting is suppressed to be equal to or less than a specified amount, a mounting order determination unit that determines the mounting order of components with respect to a plurality of mounting areas set on the surface of the three-dimensional substrate so that the components after mounting are equal to or less than the tolerance angle, a stage control unit that controls the stage so that the plurality of mounting areas are sequentially in a horizontal state according to the mounting order, and a head control unit that controls the mounting head so that components are sequentially mounted on the mounting areas in the horizontal state according to the mounting order.

2. The three-dimensional mounting apparatus according to claim 1, wherein the controller includes a displacement amount calculation unit that calculates the displacement amount of a component after mounting based on the image data of the component after mounting, and the tolerance angle acquisition unit acquires the maximum value of the inclination angle of the component whose displacement amount calculated by the displacement amount calculation unit is equal to or less than the specified amount as the tolerance angle.

3. The three-dimensional mounting apparatus according to claim 1, wherein the controller includes a tolerance angle storage unit that stores correlation data between the component and the tolerance angle, and the tolerance angle storage unit acquires and stores the tolerance angle from the tolerance angle acquisition unit.

4. The three-dimensional mounting apparatus according to claim 1, wherein the controller includes a tolerance angle calculation unit that calculates the tolerance angle based on the weight of the component, and the tolerance angle acquisition unit acquires the tolerance angle from the tolerance angle calculation unit.

5. The three-dimensional mounting apparatus according to claim 1, wherein the mounting order determination unit determines the mounting order so that the component after mounting does not exceed the tolerance angle during subsequent component mounting.

6. A laser head that applies cream solder to the mounting area and irradiates the cream solder with laser light after mounting components on the mounting area. The controller has a laser control unit that controls the laser head so that when it is impossible to have a mounting sequence that keeps the first component below the allowable angle when mounting the second component after mounting the first component on the first mounting area, laser light irradiates the cream solder in the first mounting area after mounting the first component and before tilting the three-dimensional substrate, and soldering of the first component is performed. The three-dimensional mounting apparatus according to claim 5.

7. Further comprising an application head that applies an adhesive to the surface of the three-dimensional substrate. The controller further has a fixing control unit that controls the application head so that when the first component does not become below the allowable angle when mounting the second component after mounting the first component on the first mounting area, the first component and the first mounting area are fixed with an adhesive after mounting the first component and before tilting the three-dimensional substrate. The three-dimensional mounting apparatus according to claim 1.

8. The adhesive is an ultraviolet curable type and includes an ultraviolet head that emits ultraviolet light. The fixing control unit controls the ultraviolet head so that the adhesive applied to the mounting area is irradiated with ultraviolet light. The three-dimensional mounting apparatus according to claim 7.

9. A three-dimensional mounting method including: obtaining an allowable angle indicating the maximum value of the tilt angle of a component that suppresses the amount of displacement of the mounted component on the surface of the three-dimensional substrate to be equal to or less than a specified amount after mounting; determining the mounting sequence of components for a plurality of mounting areas set on the surface of the three-dimensional substrate so that the mounted components are below the allowable angle; rotating the three-dimensional substrate so that the plurality of mounting areas are sequentially in a horizontal state according to the mounting sequence; and sequentially mounting components on the mounting areas in the horizontal state according to the mounting sequence.

10. Further including fixing the first component and the three-dimensional substrate with an adhesive after mounting the first component on the first mounting area and before tilting the three-dimensional substrate when the first component does not become below the allowable angle when mounting the second component after mounting the first component on the first mounting area. The three-dimensional mounting method according to claim 9.

Images