Particle removal system and method for controlling particle removal system

Abstract

This particle removal system (100) comprises a particle pick-up jig (10) that picks up particles, and a robot (150). When the particles are to be picked up, the robot (150) performs a pick-up operation including moving the particle pick-up jig (10) and / or pressing the particle pick-up jig (10) into a target region for picking up the particles.

Description

PARTICLE REMOVAL SYSTEM AND METHOD FOR CONTROLLING PARTICLE REMOVAL SYSTEM

[0001] TECHNICAL FIELD This disclosure relates to particle removal systems and methods for controlling particle removal systems.

[0002] Conventionally, jigs that attract particles such as dust in semiconductor manufacturing equipment have been known. JP 11-224895 A discloses a disk-shaped particle removal jig that is electrostatically charged. In JP 11-224895 A, the disk-shaped particle removal jig is held by a hand of a robot arm disposed in a substrate transport device, similar to a wafer. As a result, the particle removal jig comes into contact with the hand, and particles adhering to the hand are attracted to the charged particle removal jig. As a result, particles adhering to the hand are removed from the hand.

[0003] Japanese Patent Application Publication No. 11-224895

[0004] Here, when particles are removed using a particle removal jig that adsorbs particles, as in JP-A-11-224895, particles may be removed not only from a hand that holds a wafer, but also by transporting the particle removal jig to a mounting portion on which a wafer is placed within a semiconductor manufacturing apparatus. In such cases, it is desirable to efficiently adsorb particles in a target region for particle adsorption, such as the mounting portion.

[0005] This disclosure has been made to solve the above-mentioned problems, and one object of this disclosure is to provide a particle removal system that can efficiently adsorb particles in a target area for particle adsorption, and a method for controlling a particle removal system.

[0006] A particle removal system according to a first aspect of this disclosure includes a particle adsorption jig that adsorbs particles, and a robot that, when adsorbing particles, performs an adsorption operation that includes at least one of moving the particle adsorption jig and pressing down the particle adsorption jig in a target area for particle adsorption.

[0007] As described above, the particle removal system according to a first aspect of this disclosure includes a robot that, when adsorbing particles, performs a suction operation that includes at least one of moving the particle adsorption jig and pressing down the particle adsorption jig in a target area for particle adsorption. This allows particles to be more efficiently adsorbed by performing a suction operation that includes at least one of moving the particle adsorption jig and pressing down the particle adsorption jig when adsorbing particles, compared to simply transporting and placing the particle adsorption jig in the target area. As a result, particles can be efficiently adsorbed in the target area for particle adsorption.

[0008] A control method for a particle removal system according to a second aspect of this disclosure includes holding a particle adsorption jig that adsorbs particles by a robot, and performing an adsorption operation that includes at least one of moving the particle adsorption jig by the robot in a target area for particle adsorption and pressing down the particle adsorption jig when adsorbing the particles.

[0009] As described above, a control method for a particle removal system according to a second aspect of this disclosure includes performing, during particle adsorption, a suction operation that includes at least one of moving a particle adsorption jig by a robot and pressing down on the particle adsorption jig in a target region for particle adsorption. This allows particles to be adsorbed more efficiently by performing a suction operation that includes at least one of moving the particle adsorption jig and pressing down on the particle adsorption jig when adsorbing particles, compared to simply transporting and placing the particle adsorption jig in the target region. As a result, a control method for a particle removal system that can efficiently adsorb particles in a target region for particle adsorption can be provided.

[0010] According to the particle removal system and the control method for the particle removal system of the present disclosure, particles can be efficiently adsorbed in the target area for particle adsorption.

[0011] 4 is a diagram showing a semiconductor manufacturing apparatus according to a first embodiment. FIG. 5 is a block diagram of a particle removal system according to the first embodiment. FIG. 6 is a diagram showing a particle adsorption jig according to the first embodiment. FIG. 7 is a cross-sectional view taken along line IV-IV in FIG. 3. FIG. 8 is a diagram showing a charging device according to the first embodiment. FIG. 9 is a cross-sectional view of an accommodation container according to the first embodiment as seen from the side. FIG. 10 is a diagram explaining the arrangement of a particle adsorption jig with respect to a substrate transport device. FIG. 11 is a flow chart of a control method for the particle removal system according to the first embodiment. FIG. 12 is a diagram showing a state in which a particle adsorption jig is held by a hand. FIG. 13 is a diagram showing a particle adsorption jig placed on a substrate placement unit. FIG. 14 is a diagram explaining the operation of replacing the particle adsorption jig in the adsorption operation according to the first embodiment. FIG. 15 is a diagram showing a state in which the particle adsorption jig is cleaned by a cleaning device. FIG. 16 is a block diagram of a particle removal system according to a second embodiment. FIG. 17 is a diagram explaining the operation of sliding the particle adsorption jig in the adsorption operation according to the second embodiment. FIG. 18 is a block diagram of a particle removal system according to a third embodiment. FIG. 19 is a diagram explaining the operation of pressing down the particle adsorption jig in the adsorption operation according to the third embodiment.

[0012] First Embodiment A first embodiment of the present disclosure will now be described with reference to the drawings.

[0013] A particle removal system 100 according to a first embodiment will be described with reference to Figures 1 to 12. In this specification, the vertical direction is referred to as the Z direction. The upper side is referred to as the Z1 side, and the lower side is referred to as the Z2 side. The direction perpendicular to the Z direction is referred to as the X direction. One side of the X direction is referred to as the X1 side, and the other side is referred to as the X2 side. The direction perpendicular to the Z direction and the X direction is referred to as the Y direction. One side of the Y direction is referred to as the Y1 side, and the other side is referred to as the Y2 side.

[0014] (Semiconductor Manufacturing Apparatus) First, a semiconductor manufacturing apparatus 500 will be described. As shown in Fig. 1, the semiconductor manufacturing apparatus 500 is an apparatus for processing a substrate 1 made of a semiconductor such as a wafer. The semiconductor manufacturing apparatus 500 includes a substrate transfer apparatus 200 and a substrate processing apparatus 300. The semiconductor manufacturing apparatus 500 is disposed, for example, in a clean room.

[0015] (Substrate Transfer Apparatus) The substrate transfer apparatus 200 will be described. The substrate transfer apparatus 200 is, for example, an EFEM (Equipment Front End Module). The substrate transfer apparatus 200 includes a FOUP 110, a housing 120, a FOUP opener 130, an aligner 140, a robot 150, and a control unit 160 shown in FIG. 2 .

[0016] (FOUP) The FOUP 110 accommodates a plurality of substrates 1 before and after processing. The interior of the FOUP 110 is maintained in a clean state similar to that of a clean room. The FOUP 110 includes a housing 111 and an opening / closing unit 112. The housing 111 has a box shape including an opening 111a that opens into the substrate transfer device 200. The opening / closing unit 112 covers the opening 111a of the housing 111. For example, four FOUPs 110 are arranged.

[0017] (Housing) The housing 120 includes an internal space 121. The internal space 121 is filled with a highly clean ambient gas. The robot 150 is disposed in the internal space 121 of the housing 120. The housing 120 has, for example, a rectangular parallelepiped shape. An opening 122a connected to the internal space 113 of the FOUP 110 is formed in a wall 122 on the Y1 side of the housing 120. The opening 122a allows the substrate 1 to move between the FOUP 110 and the substrate transfer device 200. An opening 123a connected to the internal space 311 of the substrate processing apparatus 300 is formed in a wall 123 on the Y2 side of the housing 120. The opening 123a allows the substrate 1 to move between the substrate processing apparatus 300 and the substrate transfer device 200.

[0018] The FOUP opener 130 will now be described. The FOUP opener 130 is disposed on the Y1 side of the substrate transfer device 200. The FOUP opener 130 includes an opening / closing unit 131 and a FOUP support unit 132. The opening / closing unit 131 is disposed in an opening 122a in a wall 122 on the Y1 side of the housing 120. An opening / closing mechanism that operates the opening / closing unit 131 and the opening / closing unit 112 opens the opening / closing unit 131 of the FOUP opener 130 and the opening / closing unit 112 of the FOUP 110, thereby connecting the internal space 113 of the FOUP 110 with the internal space 121 of the housing 120.

[0019] The aligner 140 will now be described. The substrate 1 is placed on the aligner 140. The aligner 140 aligns the substrate 1. The aligner 140 performs at least one of rotating the substrate 1 to adjust the orientation of the substrate 1 so that a notch or an orientation flat formed in the substrate 1 faces a predetermined direction, and detecting eccentricity of the substrate 1 while rotating the substrate 1 and detecting the edge of the substrate 1. The aligner 140 is disposed in the internal space 121 of the housing 120 of the substrate transfer device 200.

[0020] The robot 150 will now be described. The robot 150 is disposed in the internal space 121 of the housing 120 of the substrate transfer device 200. The robot 150 is, for example, a horizontal articulated type. The robot 150 includes a hand 151 and a robot arm 152. The hand 151 holds the substrate 1. For example, the hand 151 has a Y-shape with a bifurcated tip. The hand 151 is also disposed at the tip of the robot arm 152. The robot arm 152 includes a plurality of link sections.

[0021] The configuration of the control unit 160 will be described. The control unit 160 is a robot controller. As shown in FIG. 2 , the control unit 160 includes a main control unit 161, a servo control unit 162, a drive circuit unit 163, and a storage unit 164. The main control unit 161 and the servo control unit 162 each include, for example, a CPU (Central Processing Unit). The main control unit 161 controls the drive unit 152a of the robot arm 152. The servo control unit 162 controls the power supplied to the drive unit 152a of the robot arm 152 based on a command from the main control unit 161. The drive circuit unit 163 supplies drive power to the drive unit 152a of the robot arm 152. A plurality of drive units 152a are arranged in the robot arm 152, and a drive circuit unit 163 is arranged for each of the drive units 152a of the robot arm 152. Alternatively, one drive circuit unit 163 may be provided in common for each of the drive units 152 a. Each drive unit 152 a includes a servo motor, an encoder, and a reducer. The storage unit 164 stores programs executed by the control unit 160.

[0022] (Substrate Processing Apparatus) The substrate processing apparatus 300 will now be described. As shown in FIG. 1 , the substrate processing apparatus 300 performs processing on a substrate 1. For example, the substrate processing apparatus 300 performs heat treatment, impurity implantation, thin film formation, lithography, cleaning, and planarization on the substrate 1. The substrate processing apparatus 300 is disposed adjacent to the substrate transfer apparatus 200. The substrate processing apparatus 300 includes a housing 310 having an internal space 311. A wall 312 on the Y1 side of the housing 310 of the substrate processing apparatus 300 is shared with a wall 123 on the Y2 side of the housing 120 of the substrate transfer apparatus 200. The internal space 311 of the substrate processing apparatus 300 also includes a substrate placement section 313 on which the substrate 1 is placed.

[0023] (Particle Removal System) The particle removal system 100 is a system for removing particles in a semiconductor manufacturing apparatus 500. As shown in Fig. 2, the particle removal system 100 includes an aligner 140, a robot 150, a particle adsorption jig 10, a charging device 20, a container 30, a detection unit 50, a cleaning device 60, and a control unit 160.

[0024] (Particle Adsorption Jig) The particle adsorption jig 10 will be described. The particle adsorption jig 10 is held by a hand 151. The particle adsorption jig 10 is charged with static electricity and adsorbs particles by the charged static electricity. As shown in FIG. 3 , the particle adsorption jig 10 has, for example, a disk shape and the same diameter as the substrate 1. That is, the particle adsorption jig 10 has a disk shape that resembles the substrate 1. In the first embodiment, the hand 151 of the robot 150 holds the substrate 1 and the particle adsorption jig 10 in the substrate transfer device 200. The hand 151 is an active-type substrate holding hand that holds the substrate 1 and the particle adsorption jig 10 in a fixed state by edge grips that clamp and hold the peripheral edges of the substrate 1 or the particle adsorption jig 10.

[0025] As shown in FIG. 4 , the particle adsorption jig 10 includes, for example, a semiconductor substrate 11, a positive electrode 12, a negative electrode 13, a bias electrode 14, and an interface 15. The positive electrode 12 and the negative electrode 13 are formed by implanting impurities. The positive electrode 12, the bias electrode 14, and the negative electrode 13 are arranged in this order on one surface 11 a of the main surfaces of the semiconductor substrate 11. The interface 15 is arranged on the other surface 11 b of the main surfaces of the semiconductor substrate 11. The interface 15 is connected to the positive electrode 12 and the negative electrode 13. A voltage is applied to the interface 15 from the charging device 20 shown in FIG. 1 . This applies a voltage to the positive electrode 12 and the negative electrode 13, and the one surface 11 a of the semiconductor substrate 11 is charged.

[0026] (Charging Device) The charging device 20 will be described. The charging device 20 is a device that charges the particle adsorptive jig 10 with static electricity. As shown in FIG. 2 , the charging device 20 includes a voltage application unit 21.

[0027] As shown in FIG. 5 , the voltage application unit 21 contacts the interface 15 of the particle adsorption jig 10 and applies a voltage to the particle adsorption jig 10. For example, the voltage application unit 21 includes a plurality of probes. When the plurality of probes of the voltage application unit 21 contact the interface 15 of the particle adsorption jig 10, a voltage is applied to the positive electrode 12 and the negative electrode 13. For example, as shown in FIG. 1 , the charging device 20 is disposed in the internal space 121 of the housing 120 of the substrate transport device 200. The charging device 20 contacts the probes of the voltage application unit 21 with the interface 15 of the particle adsorption jig 10 held by the hand 151 of the robot 150. The particle adsorption jig 10 is held by the hand 151 so that one surface 11 a faces downward, that is, toward the Z2 side. In the charging device 20, the probe of the voltage application unit 21 is arranged to face downward, toward the Z2 side, so as to contact the interface 15 arranged on the other surface 11b held by the hand 151 from the upper Z1 side.

[0028] (Storage Container) The storage container 30 will now be described. As shown in FIG. 6 , the storage container 30 accommodates a particle adsorption jig 10 in advance. As shown in FIG. 7 , the storage container 30 is attached to the substrate transfer device 200 and disposed at a position in the substrate transfer device 200 where a FOUP 110 for accommodating the substrates 1 is disposed. As shown in FIG. 6 , the particle adsorption jig 10 is disposed in the internal space 33 of the storage container 30. Like the FOUP 110, the interior of the storage container 30 is maintained in a clean state similar to that of a clean room. The storage container 30 also includes a housing 34 and an opening / closing unit 35. The housing 34 has a box shape including an opening 32 that opens into the substrate transfer device 200. The opening / closing unit 35 covers the opening 32 of the housing 34. As shown in FIG. 7 , the storage container 30 is disposed in the FOUP opener 130 in the substrate transfer device 200 where the FOUP 110 is disposed. Then, by opening the opening / closing part 131 of the FOUP opener 130 and the opening / closing part 35 of the storage container 30, the internal space 33 of the storage container 30 and the internal space 121 of the housing 120 are connected. This allows the particle suction jig 10 to move back and forth between the storage container 30 and the substrate transfer device 200 via the opening 122a of the housing 120. In addition, the particle suction jig 10 can move back and forth between the substrate transfer device 200 and the substrate processing apparatus 300 via the opening 123a of the housing 120.

[0029] In the first embodiment, as shown in FIG. 7 , the outer shape of the storage container 30 and the outer shape of the FOUP 110 are the same. Specifically, the housing 34 of the storage container 30 shown in FIG. 6 and the housing 111 of the FOUP 110 shown in FIG. 1 have the same size. Therefore, the storage container 30 can be placed in the FOUP opener 130 instead of the FOUP 110. Furthermore, the diameter of the particle adsorption jig 10 and the diameter of the substrate 1 are the same. As a result, the particle adsorption jig 10 is accommodated in the storage container 30 in the same way as the substrate 1 is accommodated in the FOUP 110. For example, the particle adsorption jig 10 is supported by a support portion 30 a of the storage container 30. With the particle adsorption jig 10 accommodated in the storage container 30, the interior of the storage container 30 is maintained clean.

[0030] (Detection Unit) In the first embodiment, the detection unit 50 detects the degree of particle attraction by the particle attraction jig 10 during a series of operations of the robot arm 152. The series of operations of the robot arm 152 will be described later. As shown in FIG. 2 , the detection unit 50 includes a charge amount detection unit 51 that detects the charge amount of the particle attraction jig 10 and an imaging unit 52 that images the particles attracted to the particle attraction jig 10. The charge amount detection unit 51 is, for example, a surface electrometer. The surface electrometer measures the amount of static electricity by utilizing the electrostatic induction phenomenon in which charged objects are attracted to a conductor when brought close to it. The surface electrometer measures the amount of static electricity without coming into contact with the particle attraction jig 10.

[0031] As shown in FIG. 5 , the charge amount detection unit 51 and the imaging unit 52 of the detection unit 50 are disposed on the Z2 side, which is the lower side of the charging device 20. The charge amount detection unit 51 detects the degree of particle attraction by the particle attraction jig 10 held by the hand 151 in the charging device 20. The imaging unit 52 detects the degree of particle attraction by the particle attraction jig 10 by capturing an image of the particle attraction jig 10 disposed on the charging device 20. In the first embodiment, particles are attracted to the particle attraction jig 10 with the charged surface 11 a of the particle attraction jig 10 disposed on the Z2 side, which is the lower side. The imaging unit 52 captures an image of the particle attraction jig 10 with the surface 11 a facing the Z2 side. Therefore, the imaging unit 52 is disposed on the Z2 side, which is the lower side of the charging device 20, so as to capture an image from the Z2 side toward the Z1 side. For example, the imaging unit 52 is a high-resolution camera capable of capturing images of particles.

[0032] In the first embodiment, the cleaning device 60 cleans the particle adsorption jig 10. As shown in Fig. 1 , the cleaning device 60 is disposed, for example, in an internal space 311 of a substrate processing apparatus 300. The substrate processing apparatus 300 is, for example, a spin dryer. The spin dryer rotates the particle adsorption jig 10 to remove particles adsorbed to the particle adsorption jig 10 by centrifugal force.

[0033] (Method of Controlling the Particle Removal System) Next, a method of controlling the particle removal system 100 in the operation of removing particles inside the semiconductor manufacturing apparatus 500 by the substrate transfer apparatus 200 will be described. The operation of the substrate transfer apparatus 200 is controlled by the control unit 160. The particle adsorption jig 10 is manually placed in the storage container 30 in advance. The storage container 30 is then placed in the substrate transfer apparatus 200 with the particle adsorption jig 10 placed in the storage container 30 and the interior of the storage container 30 clean. When the particle removal operation is performed, the semiconductor manufacturing apparatus 500 is not processing the substrate 1. As shown in FIG. 7 , the storage container 30 is placed in the FOUP opener 130 instead of the FOUP 110. One storage container 30 may be placed in the FOUP opener 130, or multiple storage containers 30 may be placed in the FOUP opener 130. An example in which one storage container 30 is placed in the FOUP opener 130 will be described below.

[0034] As shown in Figure 8, in step S1, the control unit 160 operates the opening and closing mechanism to open the opening and closing portion 131 of the FOUP opener 130 and the opening and closing portion 35 of the storage container 30, thereby connecting the internal space 33 of the storage container 30 with the internal space 121 of the housing 120 of the substrate transport device 200.

[0035] 9 , in the first embodiment, the control unit 160 executes a process of causing the hand 151 of the robot arm 152 to hold the particle suction jig 10, which has been previously accommodated in the accommodation container 30, in step S2. Specifically, the control unit 160 causes the hand 151 to enter the internal space 33 of the accommodation container 30 through the opening 122 a of the housing 120 of the substrate transfer device 200.

[0036] 5 , in the first embodiment, in step S3, the control unit 160 controls the operation of the robot 150 to cause the charging device 20 to charge static electricity on the particle adsorption jig 10. The control unit 160 moves the robot arm 152 to move the particle adsorption jig 10 held by the hand 151 to the charging device 20. The control unit 160 then moves the robot arm 152 to bring the particle adsorption jig 10 held by the hand 151 into contact with the voltage application unit 21, thereby executing a process of charging the particle adsorption jig 10. Note that the control of the application of voltage from the voltage application unit 21 of the charging device 20 may be performed by the control unit 160 or the charging device 20.

[0037] In step S4, in the first embodiment, the control unit 160 performs a process of charging the particle attracting jig 10, and then moves the robot arm 152 to perform a process of attracting particles in at least one of the interior of the substrate transfer device 200 and the interior of the substrate processing apparatus 300 with the particle attracting jig 10 held by the hand 151. Specifically, the particle attracting jig 10 accommodated in the accommodation container 30 is moved to the substrate transfer device 200 or the substrate processing apparatus 300 through the openings 122a and 123a of the housing 120 of the substrate transfer device 200. Then, particles adhering to a portion of the aligner 140 arranged in the internal space 121 of the substrate transfer device 200 on which the substrate 1 is placed, or to a substrate placement portion 313 on which the substrate 1 is placed in the internal space 311 of the substrate processing apparatus 300, are attracted by the particle attracting jig 10.

[0038] In the particle removal system 100 according to the first embodiment, the control unit 160 controls the operation of the robot 150 to perform a suction operation of moving the particle suction jig 10 in a target region for particle suction during particle suction. For example, under the control of the control unit 160, the robot 150 holds the particle suction jig 10 in the hand 151 and performs a transport operation of transporting the particle suction jig 10 held by the hand 151 to the substrate placement unit 313 of the substrate processing apparatus 300, which is the target region for particle suction. Then, during particle suction after the transport operation, the robot 150 places the particle suction jig 10 on the substrate placement unit 313, which is the target region, and moves the placed particle suction jig 10 by the hand 151 to perform the suction operation.

[0039] 10 , the substrate placement section 313 has a pair of fan-shaped sections 313a. The sections 313a are plate-like members arranged along the horizontal XY plane. Each of the pair of sections 313a has a rectangular shape that curves to fit along the periphery of the substrate 1 and the disk-shaped particle adsorption jig 10 that resembles the substrate 1.

[0040] 11 , during the suction operation, the robot 150 performs an operation of repositioning the particle suction jig 10 placed on the substrate placement unit 313 multiple times while changing its position. For example, the robot 150 repositions the particle suction jig 10 while changing its position in a circular motion on a horizontal plane along the shape of the curved portion 313a of the substrate placement unit 313. That is, during the suction operation, the robot 150 alternately performs an operation of holding the placed particle suction jig 10 and an operation of changing the position of the hand 151 while holding the particle suction jig 10. In the first embodiment, the robot 150 holds the particle suction jig 10 and lifts it from the substrate placement unit 313, changes the position of the particle suction jig 10 in the XY plane, which is a horizontal plane, and then places the particle suction jig 10 on the substrate placement unit 313 again, thereby repositioning the particle suction jig 10. 11, an example of the particle suction jig 10 when the placement position is changed is shown by a dashed line. The control unit 160 performs a suction operation in each of the multiple target areas including the substrate placement unit 313. That is, the robot 150 performs a transport operation to transport the particle suction jig 10 to each of the multiple target areas, and also performs a suction operation in each of the multiple target areas. After the suction operation is completed, the process proceeds to step S5.

[0041] In step S5, in the first embodiment, the control unit 160 causes the detection unit 50 to detect the degree of particle adsorption by the particle adsorption jig 10. Specifically, the control unit 160 moves the particle adsorption jig 10, held by the hand 151, to the position of the charging device 20 where the detection unit 50 is located. Then, the control unit 160 causes the charge amount detection unit 51 and the imaging unit 52 of the detection unit 50 to detect the amount of particles adsorbed to the particle adsorption jig 10.

[0042] Then, in step S6, the control unit 160 determines whether or not the particle adsorption jig 10 can further adsorb particles. If the detection unit 50 is the imaging unit 52, the control unit 160 uses a technique such as image processing to detect the amount of adsorbed particles from the image of the particle adsorption jig 10 captured by the imaging unit 52. If the amount of adsorbed particles is equal to or less than a predetermined particle amount threshold, the control unit 160 determines that the particle adsorption jig 10 can further adsorb particles, and the process returns to step S4. If the amount of adsorbed particles is greater than the predetermined particle amount threshold, the control unit 160 determines that the particle adsorption jig 10 cannot further adsorb particles, and the process proceeds to step S7. If the detection unit 50 is the charge amount detection unit 51, the charge amount detection unit 51 detects the charge amount of the particle adsorption jig 10. If the particle attracting jig 10 detected by the charge amount detection unit 51 is greater than a predetermined charge amount threshold, the control unit 160 determines that the particle attracting jig 10 is capable of further attracting particles, and the process returns to step S4. On the other hand, if the particle attracting jig 10 detected by the charge amount detection unit 51 is equal to or less than the predetermined charge amount threshold, the control unit 160 determines that the particle attracting jig 10 is not capable of further attracting particles, and the process proceeds to step S7. In this way, the detection unit 50 detects the degree of particle attraction during the series of operations in which particle attraction is repeatedly performed in step S4.

[0043] 12 , in the first embodiment, the control unit 160 executes a process of causing the particle adsorption jig 10 to adsorb particles in step S7, and then executes a process of moving the hand 151 with the robot arm 152 to move the particle adsorption jig 10 to the cleaning device 60. That is, after performing the particle adsorption operation in step S4, the robot 150 moves the particle adsorption jig 10 to the cleaning device 60. The cleaning device 60 executes a process of cleaning the particle adsorption jig 10 that has been moved.

[0044] Then, in step S8, the control unit 160 causes the charging device 20 to charge static electricity on the particle attracting jig 10, as in step S3. Then, in step S9, the control unit 160 executes the same process of attracting particles in the target region as in step S4 to confirm whether particle attraction has been completed in the target region for particle attraction in at least one of the interior of the substrate transfer device 200 and the interior of the substrate processing apparatus 300. In step S9, as in step S4, the control unit 160 performs an attraction operation of moving the particle attracting jig 10 in the target region during particle attraction. For example, as in step S4, the control unit 160 transports the particle attracting jig 10 held by the hand 151 to the substrate placement unit 313 of the substrate processing apparatus 300, which is the target region for particle attraction, places the particle attracting jig 10 on the substrate placement unit 313, and moves the placed particle attracting jig 10 with the hand 151 to perform the attraction operation.

[0045] Then, in step S10, the control unit 160 detects the degree of particle adsorption by the particle adsorption jig 10 using the detection unit 50, as in step S5. Then, in step S11, it determines whether particle adsorption in the target area is sufficient. For example, if the detection unit 50 is the imaging unit 52, the control unit 160 detects the amount of adsorbed particles from the image of the particle adsorption jig 10 captured by the imaging unit 52, as in step S6. Then, if the amount of adsorbed particles is greater than a predetermined particle amount threshold, the control unit 160 determines that particle adsorption is insufficient, and returns to step S4. On the other hand, if the amount of adsorbed particles is equal to or less than the predetermined particle amount threshold, the control unit 160 determines that particle adsorption is sufficient. If it is determined that particle adsorption is sufficient, the particle removal operation inside the semiconductor manufacturing apparatus 500 by the substrate transport device 200 ends, and the processing of the control method for the particle removal system 100 ends. The predetermined particle amount threshold in step S11 may be a value of a magnitude different from that in step S6.

[0046] In step S11, the determination of whether particle adsorption in the target area is sufficient may be performed based on the detection result of the charge amount detection unit 51. In this case, the charge amount detection unit 51 detects the charge amount of the particle adsorption jig 10. If the charge amount of the particle adsorption jig 10 detected by the charge amount detection unit 51 is equal to or less than a predetermined charge amount threshold, the control unit 160 determines that the charge amount has decreased due to particle adsorption in the same target area, and determines that a particle has been detected. In this case, the control unit 160 determines that particle adsorption is insufficient, and returns to step S4. On the other hand, if the charge amount of the particle adsorption jig 10 detected by the charge amount detection unit 51 is greater than the predetermined charge amount threshold, the control unit 160 determines that no further particle adsorption is occurring and that particle adsorption is sufficient, and terminates the control process.

[0047] Furthermore, if multiple target areas for particle adsorption are arranged, it is possible to perform the processes from step S8 to step S11 for each of the multiple target areas, thereby confirming whether particle adsorption has been completed for each of the multiple target areas.

[0048] Effect of First Embodiment The particle removal system 100 includes a robot 150 that, when adsorbing particles, performs a suction operation that includes at least one of moving the particle adsorption jig 10 and pressing down the particle adsorption jig 10 in a target area for particle adsorption. As a result, compared to simply transporting and placing the particle adsorption jig 10 to the target area, particles can be more efficiently adsorbed by performing a suction operation that includes at least one of moving the particle adsorption jig 10 and pressing down the particle adsorption jig 10. As a result, particles can be efficiently adsorbed in the target area for particle adsorption.

[0049] The robot 150 includes a hand 151 that holds the particle adsorption jig 10. The robot 150 performs a transport operation of transporting the particle adsorption jig 10 to a target area by holding the particle adsorption jig 10 in the hand 151. Then, when adsorbing particles after the transport operation, the robot 150 performs a suction operation in the target area, which includes at least one of moving the particle adsorption jig 10 with the hand 151 and pressing down the particle adsorption jig 10. As a result, the particle adsorption jig 10 is transported to the target area by the hand 151 of the robot 150, and the adsorption operation is performed using the particle adsorption jig 10 while being held by the hand 151. This makes it possible to reduce the complexity of the configuration of the particle removal system 100 compared to when the transport operation to the target area and the adsorption operation in the target area are performed using different configurations. Therefore, particles can be efficiently adsorbed in the target area while reducing the complexity of the configuration of the particle removal system 100.

[0050] When adsorbing particles, the robot 150 performs the adsorption operation by moving the particle adsorption jig 10 placed in the target area. By moving the particle adsorption jig 10 in the target area, particles can be adsorbed efficiently over a wider range of the target area. Furthermore, the movement of the particle adsorption jig 10 can stir up particles accumulated in the target area, allowing for more efficient particle adsorption.

[0051] The robot 150 performs the suction operation by repositioning the particle suction jig 10. This allows the robot 150 to more efficiently suction particles in the target area by repositioning the particle suction jig 10 compared to when the particle suction jig 10 is placed only once.

[0052] The robot 150 performs the suction operation by changing the position of the particle suction jig 10 placed in the target area and then repositioning it, thereby enabling particles to be more efficiently adsorbed over a wider range of the target area by changing the position of the particle suction jig 10 and then repositioning it.

[0053] The robot 150 performs a suction operation in the substrate placement part 313 on which the substrate 1 is placed as a target area. This allows particles to be efficiently adsorbed in the substrate placement part 313 on which the substrate 1 is placed. Therefore, when the substrate 1 is placed on the substrate placement part 313, adhesion of particles to the substrate 1 can be effectively suppressed, and therefore, abnormalities caused by particles can be effectively suppressed in the processing of the substrate 1.

[0054] The robot 150 includes a hand 151 that holds the substrate 1 and a disk-shaped particle suction jig 10 that resembles the substrate 1. The robot 150 performs a suction operation by placing the disk-shaped particle suction jig 10 on a substrate placement unit 313 of the substrate processing apparatus 300, which is located inside at least one of the substrate transfer apparatus 200 and the substrate processing apparatus 300, using the hand 151. This allows the hand 151 that holds the substrate 1 to perform the suction operation while holding the disk-shaped particle suction jig 10 that resembles the substrate 1. This reduces the complexity of the particle suction configuration compared to when the suction operation is performed using a configuration different from the hand 151 that holds the substrate 1. Furthermore, because the particle suction jig 10 has a disk shape that resembles the substrate 1, the particle suction jig 10 can be easily transported and placed at the position where the substrate 1 is to be placed in at least one of the substrate transfer apparatus 200 and the substrate processing apparatus 300. This allows particles to be easily removed from at least one of the substrate transfer apparatus 200 and the substrate processing apparatus 300.

[0055] The particle removal system 100 includes a control unit 160 that controls the operation of the robot 150 to cause the robot 150 to perform the adsorption operation. As a result, the control unit 160 executes the control process, thereby making it possible to easily cause the robot 150 to perform the adsorption operation.

[0056] The particle removal system 100 includes a detection unit 50 that detects the degree of particle adsorption by the particle adsorption jig 10. This makes it possible to easily determine whether particles are being normally adsorbed by the adsorption operation of the robot 150 based on the detection results of the detection unit 50. Furthermore, by determining whether the particle adsorption jig 10 is capable of adsorbing additional particles based on the detection results of the detection unit 50, it is possible to prevent the particle adsorption operation from being continued in a state in which the particle adsorption jig 10 is unable to adsorb particles.

[0057] The particle removal system 100 includes a cleaning device 60 that cleans the particle adsorption jig 10. After performing the adsorption operation, the robot 150 moves the particle adsorption jig 10 to the cleaning device 60. This cleans the particle adsorption jig 10 to which particles are attached, so that the next time particles are adsorbed, the adsorption operation can be performed using the cleaned particle adsorption jig 10. This eliminates the need to arrange multiple particle adsorption jig 10.

[0058] The particle adsorption jig 10 is charged with static electricity and adsorbs particles using the charged static electricity. The particle removal system 100 includes a charging device 20 that charges the particle adsorption jig 10 with static electricity. The robot 150 performs adsorption using the particle adsorption jig 10 that has been charged with static electricity by the charging device 20. As a result, since the charging device 20 is disposed in the particle removal system 100, the adsorption operation can be performed with the particle adsorption jig 10 sufficiently charged by the charging device 20. Therefore, the particle adsorption jig 10 can adequately adsorb particles.

[0059] Second Embodiment A particle removal system 600 according to a second embodiment of the present disclosure will be described with reference to Figures 13 and 14. Unlike the first embodiment in which the robot 150 repositions the particle adsorption jig 10 during the adsorption operation, in the second embodiment, the robot 150 slides the particle adsorption jig 10.

[0060] As shown in Fig. 13, the particle removal system 600 of the second embodiment includes a control unit 760. Similar to the control unit 160 of the first embodiment, the control unit 760 is a robot controller and includes a main control unit 161, a servo control unit 162, a drive circuit unit 163, and a storage unit 164. The hardware configuration of the control unit 760 is similar to that of the control unit 160 of the first embodiment. Similar to the control unit 160 of the first embodiment, the control unit 760 controls the operation of each unit of the particle removal system 600, including the robot 150, and executes the control processing from step S1 to step S11, similar to the control method of the particle removal system 100 in the particle removal operation shown in Fig. 8.

[0061] In the second embodiment, in the particle adsorption control process in step S4, the control unit 760 controls the operation of the robot 150 to perform the adsorption operation, as in the first embodiment. In the second embodiment, as shown in FIG. 14 , the robot 150 performs the adsorption operation by sliding the particle adsorption jig 10 placed on the substrate placement unit 313, which is the target area for particle adsorption. Specifically, the robot 150 places the particle adsorption jig 10 on the substrate placement unit 313, and then moves the hand 151 to contact the upper Z1-side surface 11 b of the particle adsorption jig 10. Then, with the hand 151 in contact with the particle adsorption jig 10, the robot 150 moves the hand 151 in a circular motion on the horizontal XY plane along the curved shape of the portion 313 a of the substrate placement unit 313, thereby sliding the particle adsorption jig 10 on the substrate placement unit 313. That is, in the second embodiment, in the suction operation, the robot 150 does not lift the particle suction jig 10 from the substrate mounting part 313, but slides the particle suction jig 10 while keeping it in contact with the substrate mounting part 313. Note that the hand 151 may slide the particle suction jig 10 while holding it from the Z2 side, which is below the particle suction jig 10. The other configurations in the second embodiment are similar to those in the first embodiment.

[0062] Effect of the Second Embodiment The robot 150 performs the adsorption operation by sliding the placed particle adsorption jig 10. This allows the robot 150 to efficiently adsorb particles over a wider range by sliding the particle adsorption jig 10, which is a relatively simple operation compared to the case where the particle adsorption jig 10 is lifted multiple times while changing its position.

[0063] 15 and 16, a particle removal system 800 according to a third embodiment of the present disclosure will be described. Unlike the first embodiment in which the robot 150 repositions the particle adsorption jig 10 during the adsorption operation, in the third embodiment, the robot 150 presses down the particle adsorption jig 10.

[0064] As shown in FIG. 15 , the particle removal system 800 of the third embodiment includes a control unit 960. Similar to the control unit 160 of the first embodiment and the control unit 760 of the second embodiment, the control unit 960 is a robot controller and includes a main control unit 161, a servo control unit 162, a drive circuit unit 163, and a storage unit 164. The hardware configuration of the control unit 960 is similar to that of the control unit 160 of the first embodiment and the control unit 760 of the second embodiment. Similar to the control unit 160 of the first embodiment and the control unit 760 of the second embodiment, the control unit 960 controls the operation of each unit of the particle removal system 800, including the robot 150, and executes control processing from step S1 to step S11, similar to the control method of the particle removal system 100 in the particle removal operation shown in FIG. 8 .

[0065] In the third embodiment, in the particle adsorption control process in step S4, the control unit 960 controls the operation of the robot 150 to perform the adsorption operation, as in the first and second embodiments. In the third embodiment, as shown in FIG. 16 , the robot 150 performs the adsorption operation by pressing down the particle adsorption jig 10 placed on the substrate placement unit 313, which is the target area for particle adsorption. Specifically, after placing the particle adsorption jig 10 on the substrate placement unit 313, the robot 150 moves the hand 151 to contact the upper Z1-side surface 11b of the particle adsorption jig 10. Then, with the hand 151 in contact with the particle adsorption jig 10, the robot 150 moves the hand 151 downward toward the Z2 side, thereby pressing down the particle adsorption jig 10 against the substrate placement unit 313. That is, in the third embodiment, in the suction operation, the robot 150 applies force to press the particle suction jig 10 toward the substrate placement part 313 without moving the particle suction jig 10 relative to the substrate placement part 313. Note that other configurations in the third embodiment are similar to those in the first and second embodiments.

[0066] Effect of Third Embodiment The robot 150 performs a suction operation by pressing down on the particle suction jig 10 placed on the substrate placement part 313. By pressing down the particle suction jig 10, more particles are attracted to the particle suction jig 10, and thus the particles can be more efficiently attracted.

[0067] [Modifications] The embodiments disclosed herein should be considered to be illustrative and not restrictive in all respects. The scope of the present disclosure is defined by the claims, not by the description of the above-mentioned embodiments, and includes all modifications (modifications) within the meaning and scope of the claims.

[0068] In the above-described first, second, and third embodiments, an example has been shown in which the outer shape of the storage container 30 and the outer shape of the FOUP 110 are the same, but the present disclosure is not limited to this. In the present disclosure, the outer shape of the storage container and the outer shape of the FOUP may be different, as long as the storage container can be placed on the substrate transport device.

[0069] In the first, second, and third embodiments, the particle suction jig 10 is transported by the hand 151, and a suction operation including moving and pressing the particle suction jig 10 by the hand 151 is performed. However, the present disclosure is not limited to this. In the present disclosure, the transport of the particle suction jig to the target region for particle suction and the suction operation for the particle suction jig may be performed by different configurations.

[0070] In the first embodiment, the adsorption operation is performed by the robot 150 to replace the particle adsorption jig 10. In the second embodiment, the adsorption operation is performed by the robot 150 to slide the particle adsorption jig 10. In the third embodiment, the adsorption operation is performed by the robot 150 to press down the particle adsorption jig 10. However, the present disclosure is not limited to this. In the present disclosure, the adsorption operation may be performed by combining some of the replacement operation, the sliding operation, and the pressing operation. For example, the particle adsorption jig may be pressed down every time it is replaced, or the replacement operation and the sliding operation may be alternately repeated. Furthermore, the particle adsorption jig may be moved in a manner different from the above during the adsorption operation. For example, the particle adsorption jig may be placed with momentum in order to stir up accumulated particles. In this case, the particle suction jig may be moved by increasing the operating speed of the robot relatively, or the particle suction jig may be released from its grip at a position away from the placement position, allowing the particle suction jig to be accelerated by gravity and placed in the target area at a relatively high speed. For example, the particle suction jig may be released from its grip at an angle relative to the horizontal plane, causing it to tilt due to gravity and then be placed.

[0071] In the first embodiment, the robot 150 repositions the particle suction jig 10 while changing the position where it is placed during the suction operation, but the present disclosure is not limited to this. In the present disclosure, the particle suction jig may be repositioned without changing the position during the suction operation.

[0072] In the first, second, and third embodiments, the substrate placement unit 313 in the substrate processing apparatus 300 is used as the target region for particle adsorption. However, the present disclosure is not limited to this. In the present disclosure, the substrate placement unit in the substrate transport apparatus may be used as the target region for particle adsorption. Furthermore, a position other than the position where the substrate is placed may be used as the target region. Furthermore, the particle adsorption tool may not be placed during the adsorption operation. For example, the particle adsorption tool may be transported to the target region while being held by a hand and then moved while still held by the hand. In this case, the particle adsorption tool may be moved without coming into contact with the target region, such as the substrate placement unit, during the adsorption operation. For example, the particle adsorption tool may be swung from side to side while being held by a robot hand in the target region to perform the adsorption operation.

[0073] In the first, second, and third embodiments, an example was described in which the target region for particle adsorption is the substrate placement portion 313 having a pair of fan-shaped portions 313a. However, the present disclosure is not limited to this. In the present disclosure, the target region may be a substrate placement portion having a shape other than a fan shape. For example, a rectangular or circular substrate placement portion may be the target region for particle adsorption. Furthermore, a substrate placement portion having rod-shaped support members such as pins may be the target region for particle adsorption. Furthermore, when particles are adsorbed in multiple target regions, the shapes of structures such as the substrate placement portion may differ from each other in the multiple target regions. Furthermore, the operations performed as adsorption operations may differ from each other in the multiple target regions.

[0074] In the first, second, and third embodiments, examples have been shown in which the particle adsorption jig 10 is in the shape of a disk imitating the substrate 1, but the present disclosure is not limited to this. In the present disclosure, the particle adsorption jig does not have to imitate the substrate. For example, it may be in the shape of a polygonal plate such as a rectangle, or it may not be in the shape of a plate.

[0075] In the first, second, and third embodiments, examples have been described in which the particle adsorption jig 10 is housed in the storage container 30, but the present disclosure is not limited to this. In the present disclosure, the particle adsorption jig may be disposed in a substrate transport device or a substrate processing device without being housed in a storage container.

[0076] In the first, second, and third embodiments, an example has been described in which the charging device 20 is disposed in the internal space 121 of the housing 120 of the substrate transport device 200. However, the present disclosure is not limited to this. In the present disclosure, the charging device may be disposed inside the substrate processing apparatus. Alternatively, the charging device may be housed in a storage container. Alternatively, the charging device may be housed in a container different from the storage container in which the particle adsorption jig is housed. Alternatively, the charging device may be disposed in a robot or an aligner in the substrate transport apparatus. Alternatively, the charging device may be disposed outside the substrate transport apparatus. That is, the charging device may be disposed outside the semiconductor manufacturing apparatus, and a particle adsorption jig that has been pre-charged with static electricity may be carried into the semiconductor manufacturing apparatus.

[0077] In the above-described first, second, and third embodiments, an example has been shown in which the voltage application unit 21 is brought into contact with the interface 15 arranged on the surface 11 b of the main surface of the disk-shaped particle adsorption jig 10 to apply a voltage to the particle adsorption jig 10, but the present disclosure is not limited to this. In the present disclosure, a voltage may be applied by bringing the voltage application unit into contact with the peripheral portion of the particle adsorption jig.

[0078] In the first and second embodiments described above, the particle removal system 100 includes the detection unit 50 including the charge amount detection unit 51 and the imaging unit 52 disposed on the charging device 20. However, the present disclosure is not limited to this. In the present disclosure, the particle removal system does not necessarily need to include a detection unit. In this case, for example, the particle adsorption operation ends when a series of particle adsorption operations using the particle adsorption jig is completed once. The detection unit may also include either a charge amount detection unit or an imaging unit. The charge amount detection unit or the imaging unit may be disposed in any position of the robot, the substrate transport device, the substrate processing apparatus, or the FOUP. The detection unit may also be disposed outside the substrate transport device, the substrate processing apparatus, or the FOUP.

[0079] In the first, second, and third embodiments, the hand 151 is an active type that uses an edge grip to clamp and hold the substrate 1 or the particle suction jig 10, but the present disclosure is not limited to this. In the present disclosure, the hand may be an active type that uses a vacuum. Also, the hand may be a passive type that holds the substrate or the particle suction jig without fixing it.

[0080] In the first, second, and third embodiments, the particle adsorption jig 10 is transported by the robot 150 to the cleaning apparatus 60 disposed in the substrate processing apparatus 300, but the present disclosure is not limited to this. In the present disclosure, the cleaning apparatus may be disposed in the substrate transfer apparatus. Alternatively, the cleaning apparatus may be disposed outside the substrate processing apparatus and the substrate transfer apparatus. Alternatively, the particle adsorption jig may be transported to the cleaning apparatus by a transfer apparatus other than the robot.

[0081] In the first, second, and third embodiments, examples have been described in which the particle adsorption jig 10 adsorbs particles by electrostatic charge, but the present disclosure is not limited to this. In the present disclosure, particles may be adsorbed by a method other than static electricity. For example, particles may be adsorbed by applying a sticky substance to the surface of the particle adsorption jig, or suction holes for sucking air may be provided in the particle adsorption jig, and particles may be adsorbed by sucking air through the suction holes.

[0082] In the first, second, and third embodiments, the particle removal operation is terminated after the particle adsorption jig 10 is cleaned by the cleaning device 60, but the present disclosure is not limited to this. In the present disclosure, after the particle adsorption jig is cleaned by the cleaning device, the particle adsorption jig may be charged again by the charging device through the operation of the robot, and the particle removal operation may be resumed.

[0083] In the first, second, and third embodiments, an example was shown in which the control unit 160, which is a robot controller, controls the operation of the robot 150, the operation of the aligner 140, the operation of the charging device 20, the operation of the cleaning device 60, and the detection of the degree of particle adsorption by the detection unit 50, but the present disclosure is not limited to this. In the present disclosure, some of the control processes of the operation of the robot, the operation of the aligner, the operation of the charging device, the operation of the cleaning device, and the detection of the degree of particle adsorption by the detection unit may be executed by different hardware. For example, the operation of the aligner and the operation of the cleaning device may be controlled by a control device arranged separately from the robot controller that controls the operation of the robot.

[0084] The functions of the elements disclosed herein can be performed using circuits or processing circuits, including general-purpose processors, special-purpose processors, integrated circuits, ASICs (Application Specific Integrated Circuits), conventional circuits, and / or combinations thereof, configured or programmed to perform the disclosed functions. A processor is considered a processing circuit or circuit because it includes transistors and other circuitry. In this disclosure, a circuit, unit, or means is hardware that performs the recited functions or hardware that is programmed to perform the recited functions. The hardware may be hardware disclosed herein or other known hardware that is programmed or configured to perform the recited functions. Where the hardware is a processor, which is considered a type of circuit, the circuit, means, or unit is a combination of hardware and software, and the software is used to configure the hardware and / or processor.

[0085] Aspects It will be appreciated by those skilled in the art that the exemplary embodiments described above are examples of the following aspects.

[0086] (Aspect 1) A particle removal system comprising: a particle adsorption jig that adsorbs particles; and a robot that, when adsorbing particles, performs an adsorption operation that includes at least one of moving the particle adsorption jig and pressing down the particle adsorption jig in a target area for particle adsorption.

[0087] (Aspect 2) The particle removal system according to aspect 1, wherein the robot includes a hand that holds the particle adsorption jig, and by holding the particle adsorption jig in the hand, performs a transport operation of transporting the particle adsorption jig to the target area, and when adsorbing particles after the transport operation, performs the adsorption operation in the target area, which includes at least one of moving the particle adsorption jig with the hand and pressing down the particle adsorption jig.

[0088] (Aspect 3) The particle removal system according to aspect 1 or aspect 2, wherein the robot performs the suction operation by moving the particle suction jig placed in the target area when suctioning particles.

[0089] (Aspect 4) The particle removal system according to aspect 3, wherein the robot performs the suction operation by repositioning the particle suction jig that is currently placed.

[0090] (Aspect 5) In the particle removal system according to aspect 4, the robot performs the suction operation by changing and repositioning the particle suction jig placed in the target area.

[0091] (Aspect 6) The particle removal system according to any one of Aspects 3 to 5, wherein the robot performs the particle adsorption operation by sliding the particle adsorption jig in a placed state.

[0092] (Aspect 7) The particle removal system according to any one of Aspects 1 to 6, wherein the robot performs the suction operation in a substrate placement portion on which a substrate is placed as the target area.

[0093] (Aspect 8) A particle removal system as described in Aspect 7, wherein the robot includes a hand that holds the substrate and the disk-shaped particle suction jig that resembles the substrate, and performs the suction operation by using the hand to place the disk-shaped particle suction jig on the substrate placement portion of at least one of the inside of a substrate transport device and the inside of a substrate processing device.

[0094] (Aspect 9) The particle removal system according to aspect 7 or 8, wherein the robot performs the suction operation by pressing down the particle suction jig placed on the substrate placement part.

[0095] (Aspect 10) The particle removal system according to any one of aspects 1 to 9, further comprising a control unit that controls the operation of the robot to cause the robot to perform the adsorption operation.

[0096] (Aspect 11) The particle removal system according to any one of Aspects 1 to 10, further comprising a detector that detects the degree of particle adsorption by the particle adsorption jig.

[0097] (Aspect 12) The particle removal system according to any one of Aspects 1 to 11, further comprising a cleaning device that cleans the particle adsorption jig, wherein the robot moves the particle adsorption jig to the cleaning device after performing the adsorption operation.

[0098] (Aspect 13) A particle removal system according to any one of Aspects 1 to 12, wherein the particle adsorption jig is charged with static electricity and adsorbs particles using the charged static electricity, and further comprises a charging device that charges the particle adsorption jig with static electricity, and the robot performs the adsorption operation using the particle adsorption jig that has been charged with static electricity by the charging device.

[0099] (Aspect 14) A method for controlling a particle removal system, comprising: holding a particle adsorption jig that adsorbs particles by a robot; and performing an adsorption operation, during particle adsorption, that includes at least one of moving the particle adsorption jig by the robot in a target area for particle adsorption and pressing down the particle adsorption jig.

Claims

1. A particle removal system comprising: a particle adsorption jig for adsorbing particles; and a robot that performs an adsorption operation including at least one of moving the particle adsorption jig and pressing the particle adsorption jig in a target area for particle adsorption when adsorbing the particles.

2. The robot according to claim 1, wherein the robot includes a hand for holding the particle adsorption jig, and by holding the particle adsorption jig by the hand, the robot performs a conveyance operation of conveying the particle adsorption jig to the target area, and at the time of adsorbing the particles after the conveyance operation, the robot performs the adsorption operation including at least one of moving the particle adsorption jig by the hand and pressing the particle adsorption jig in the target area.

3. The particle removal system according to claim 1, wherein the robot performs the adsorption operation by moving the particle adsorption jig placed in the target area at the time of adsorbing the particles.

4. The particle removal system according to claim 3, wherein the robot performs the adsorption operation by replacing the particle adsorption jig placed in the placed state.

5. The particle removal system according to claim 4, wherein the robot performs the adsorption operation by replacing the particle adsorption jig placed in the placed state while changing the position where the particle adsorption jig is placed in the target area.

6. The particle removal system according to claim 3, wherein the robot performs the adsorption operation by sliding the particle adsorption jig placed in the placed state.

7. The particle removal system according to claim 1, wherein the robot performs the adsorption operation in a substrate placement portion on which a substrate is placed as the target area.

8. The particle removal system according to claim 7, wherein the robot includes a hand for holding the substrate and the disc-shaped particle adsorption jig simulating the substrate, and the robot performs the adsorption operation by placing the disc-shaped particle adsorption jig on at least one of the substrate placement portions inside the substrate transfer device and inside the substrate processing device by the hand.

9. The particle removal system according to claim 7, wherein the robot performs the adsorption operation by pressing the particle adsorption jig placed on the substrate placement unit.

10. The particle removal system according to claim 1, further comprising a control unit that controls the operation of the robot to cause the robot to perform the adsorption operation.

11. The particle removal system according to claim 1, further comprising a detection unit that detects the degree of particle adsorption by the particle adsorption jig.

12. The particle removal system according to claim 1, further comprising a cleaning device for cleaning the particle adsorption jig, and the robot moves the particle adsorption jig to the cleaning device after performing the adsorption operation.

13. The particle adsorption jig is charged with static electricity, and the charged static electricity adsorbs particles. The particle removal system according to claim 1 further comprises a charging device for charging the particle adsorption jig with static electricity, and the robot performs the adsorption operation with the particle adsorption jig charged with static electricity by the charging device.

14. A control method for a particle removal system, comprising: holding a particle adsorption jig for adsorbing particles by a robot; performing an adsorption operation including at least one of moving the particle adsorption jig by the robot in a target area for particle adsorption and pressing the particle adsorption jig when adsorbing particles.

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