Electronic device comprising chip antenna

Abstract

An electronic device according to one embodiment may comprise: a printed circuit board; a chip antenna arranged on the printed circuit board; a conductive member which includes a cover portion that is positioned on the chip antenna and includes a first opening aligned with the chip antenna, and which is arranged on the printed circuit board; a nonmetallic layer arranged on the cover portion so as to close the first opening; and a shielding layer arranged on the nonmetallic layer. The shielding layer can include a second opening aligned with the first opening of the cover portion.

Description

Electronic device including chip antenna

[0001] The present disclosure relates to an electronic device including a chip antenna.

[0002] Electronic devices, such as smartphones, may include antennas for wireless communication. Using antennas used in wireless communication technologies like UWB (ultra-wide band), electronic devices can provide various services, such as detecting nearby devices and controlling car or home door locks.

[0003] The above information may be provided as background information to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art in connection with the present disclosure.

[0004] An electronic device according to one embodiment may include a printed circuit board, a chip antenna disposed on the printed circuit board, a cover portion including a first opening positioned over the chip antenna and aligned with the chip antenna, a conductive member disposed on the printed circuit board, a non-metallic layer disposed on the cover portion to close the first opening, and a shielding layer disposed on the non-metallic layer. The shielding layer may include a second opening aligned with the first opening of the cover portion.

[0005] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0006] FIG. 2A is a diagram illustrating an exemplary electronic device according to one embodiment.

[0007] FIG. 2b is an exploded perspective view of an exemplary electronic device according to one embodiment.

[0008] Figure 3 is a drawing for explaining the tilting of the beam pattern according to the position where the chip antenna is placed on the printed circuit board.

[0009] Figure 4 shows the radiation pattern according to the position of the chip antenna.

[0010] Figure 5 shows the current distribution when the chip antenna is located at the center of the printed circuit board.

[0011] Figure 6a shows the current distribution when the chip antenna is located near the edge of the printed circuit board.

[0012] Figure 6b shows the current distribution when the chip antenna is located near the edge of the printed circuit board.

[0013] FIG. 7A illustrates an example of a chip antenna disposed on a printed circuit board according to one embodiment.

[0014] FIG. 7b illustrates an example of a chip antenna disposed on a printed circuit board according to one embodiment.

[0015] FIG. 8A illustrates an example of a chip antenna disposed on a printed circuit board, according to one embodiment.

[0016] FIG. 8b illustrates an example of a chip antenna disposed on a printed circuit board according to one embodiment.

[0017] FIG. 8c shows the current distribution of a chip antenna disposed on a printed circuit board according to one embodiment.

[0018] Fig. 9 is a drawing showing the radiation pattern of a chip antenna.

[0019] FIG. 10A is a cross-sectional view of an electronic device according to one embodiment.

[0020] FIG. 10b is a cross-sectional view of an electronic device according to one embodiment.

[0021] FIG. 10c is a cross-sectional view of an electronic device according to one embodiment.

[0022] FIG. 11A illustrates an example of a printed circuit board having a chip antenna disposed thereon, according to one embodiment.

[0023] FIG. 11B illustrates an electronic device including a printed circuit board having a conductive member disposed thereon, according to one embodiment.

[0024] FIG. 11c illustrates an electronic device including an antenna module disposed on a conductive member.

[0025] Figure 11d is a cross-sectional view taken along line C-C' of Figure 11c.

[0026] FIG. 11e illustrates a radiation pattern of a chip antenna according to one embodiment.

[0027] FIG. 12A illustrates an electronic device including a printed circuit board having a conductive member disposed thereon, according to one embodiment.

[0028] FIG. 12b illustrates the current distribution of an electronic device according to one embodiment.

[0029] FIG. 13 is a drawing showing an alignment relationship between a chip antenna and an opening of a conductive member, according to one embodiment.

[0030] FIG. 14a illustrates a radiation pattern when the chip antenna is offset aligned with respect to the opening, according to one embodiment.

[0031] FIG. 14b illustrates a radiation pattern when the chip antenna is aligned at the center of the opening, according to one embodiment.

[0032] FIG. 15A is an exemplary drawing showing an electronic device according to one embodiment.

[0033] Figure 15b is a cross-sectional view taken along line D-D' of Figure 15a.

[0034] FIG. 16A is an exemplary drawing showing an electronic device according to one embodiment.

[0035] Figure 16b is a cross-sectional view taken along line E-E' of Figure 16a.

[0036] FIG. 17 is a drawing showing a chip antenna according to one embodiment.

[0037] FIG. 18a shows the current distribution of a chip antenna forming a first polarization according to one embodiment.

[0038] FIG. 18b shows the current distribution of a chip antenna forming a second polarization according to one embodiment.

[0039] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments. Referring to FIG. 1, in the network environment (100), the electronic device (101) may communicate with the electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of the electronic device (104) or the server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0040] The processor (120) may control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing, for example, software (e.g., a program (140)), and may perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculation, the processor (120) may store a command or data received from another component (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the command or data stored in the volatile memory (132), and store the resulting data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0041] The auxiliary processor (123) may control at least a part of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0042] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0043] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0044] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0045] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0046] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0047] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0048] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0049] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0050] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0051] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0052] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0053] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0054] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0055] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, Wi-Fi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0056] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) may support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0057] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. According to some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0058] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0059] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0060] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service by itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0061] FIG. 2A is a diagram illustrating an exemplary electronic device according to an embodiment. Referring to FIG. 2A, an electronic device (200) according to an embodiment may include a housing (210) forming an exterior of the electronic device (200). For example, the housing (210) may include a first side (or front side) (200A), a second side (or back side) (200B), and a third side (or side surface) (200C) surrounding a space between the first side (200A) and the second side (200B). In an embodiment, the housing (210) may also refer to a structure forming at least a portion of the first side (200A), the second side (200B), and / or the third side (200C).

[0062] An electronic device (200) according to one embodiment may include a substantially transparent front plate (202). In one embodiment, the front plate (202) may form at least a portion of the first surface (200A). In one embodiment, the front plate (202) may include, but is not limited to, a glass plate or a polymer plate including various coating layers.

[0063] An electronic device (200) according to one embodiment may include a substantially opaque back plate (211). In one embodiment, the back plate (211) may form at least a portion of the second surface (200B). In one embodiment, the back plate (211) may be formed of a coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials.

[0064] An electronic device (200) according to one embodiment may include a side bezel structure (e.g., a side member or bracket) (218). In one embodiment, the side bezel structure (218) may be combined with a front plate (202) and / or a rear plate (211) to form at least a portion of a third side (200C) of the electronic device (200). For example, the side bezel structure (218) may form the entire third side (200C) of the electronic device (200), or, for another example, the side bezel structure (218) may form the third side (200C) of the electronic device (200) together with the front plate (202) and / or the rear plate (211).

[0065] Unlike the illustrated embodiment, when the third side (200C) of the electronic device (200) is partially formed by the front plate (202) and / or the rear plate (211), the front plate (202) and / or the rear plate (211) may include a portion extending from its edge and curved toward the rear plate (211) and / or the front plate (202). The extending portion of the front plate (202) and / or the rear plate (211) may be positioned at both ends of a long edge of the electronic device (200), for example, but is not limited to the above-described example.

[0066] In one embodiment, the side bezel structure (218) may include a metal and / or a polymer. In one embodiment, the back plate (211) and the side bezel structure (218) may be formed integrally and may include the same material (e.g., a metal material such as aluminum), but is not limited thereto. For example, the back plate (211) and the side bezel structure (218) may be formed as separate components and / or may include different materials.

[0067] In one embodiment, the electronic device (200) may include a display (201) (e.g., the display module (160) of FIG. 1), an audio module (203, 204, 207) (e.g., the audio module (170) of FIG. 1), a sensor module (e.g., the sensor module (176) of FIG. 1), a camera module (205, 212, 213) (e.g., the camera module (180) of FIG. 1), a key input device (217) (e.g., the input module (150) of FIG. 1), a light-emitting element (not shown), and a connector hole (208). In one embodiment, the electronic device (200) may omit at least one of the above components (e.g., the key input device (217) or the light-emitting element (not shown)), or may additionally include other components.

[0068] In one embodiment, the display (201) may be visually exposed through a substantial portion of the front plate (202). For example, at least a portion of the display (201) may be visible through the front plate (202) forming the first side (200A). The display (201) may be disposed on the back surface of the front plate (202).

[0069] In one embodiment, in order to expand the area to which the display (201) is visually exposed, the outer shape of the display (201) may be formed to be substantially the same as the outer shape of the front plate (202) adjacent to the display (201). In one embodiment, the gap between the outer shape of the display (201) and the outer shape of the front plate (202) may be formed to be substantially the same.

[0070] In one embodiment, the display (201) (or the first surface (200A) of the electronic device (200)) may include a screen display area (201A). In one embodiment, the display (201) may provide visual information to a user through the screen display area (201A). In the illustrated embodiment, when the first surface (200A) is viewed from the front, the screen display area (201A) is depicted as being positioned on the inside of the first surface (200A) and spaced apart from the outer edge of the first surface (200A), but is not limited thereto. For example, when the first surface (200A) is viewed from the front, at least a portion of an edge of the screen display area (201A) may substantially coincide with an edge of the first surface (200A) (or the front plate (202)).

[0071] In one embodiment, the screen display area (201A) may include a sensing area (201B) configured to acquire a user's biometric information. Here, the meaning of "the screen display area (201A) includes the sensing area (201B)" may be understood to mean that at least a portion of the sensing area (201B) may overlap the screen display area (201A). For example, the sensing area (201B) may refer to an area that, like other areas of the screen display area (201A), can display visual information by the display (201) and additionally acquire the user's biometric information (e.g., a fingerprint). Although the sensing area (201B) is illustrated as being formed within the screen display area (201A), it is not limited thereto. For example, the sensing area (201B) may also be formed in the key input device (217).

[0072] In one embodiment, the display (201) may include an area where a first camera module (205) is positioned. For example, an opening may be formed in the area of ​​the display (201), and the first camera module (205) (e.g., a punch hole camera) may be at least partially positioned within the opening so as to face the first surface (200A). In this case, the screen display area (201A) may surround at least a portion of an edge of the opening. In one embodiment, the first camera module (205) (e.g., an under display camera (UDC)) may be positioned below the display (201) so as to overlap the area of ​​the display (201). In this case, the display (201) may provide visual information to the user through the area, and additionally, the first camera module (205) may acquire an image corresponding to a direction facing the first surface (200A) through the area of ​​the display (201).

[0073] In one embodiment, the display (201) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer capable of detecting a magnetic field-type stylus pen.

[0074] In one embodiment, the audio module (203, 204, 207) may include a microphone hole (203, 204) and a speaker hole (207).

[0075] In one embodiment, the microphone holes (203, 204) may include a first microphone hole (203) formed in a portion of the third surface (200C) and a second microphone hole (204) formed in a portion of the second surface (200B). A microphone (not shown) for acquiring external sound may be placed inside the microphone holes (203, 204). The microphone may include a plurality of microphones to detect the direction of the sound, but is not limited thereto.

[0076] In one embodiment, a second microphone hole (204) formed in a portion of the second surface (200B) may be positioned adjacent to a camera module (205, 212, 213). For example, the second microphone hole (204) may acquire sound according to the operation of the camera module (205, 212, 213). However, the present invention is not limited thereto.

[0077] In one embodiment, the speaker hole (207) may include an external speaker hole (207) and a call receiver hole (not shown). The external speaker hole (207) may be formed in a part of the third surface (200C) of the electronic device (200). In one embodiment, the external speaker hole (207) may be integrated into the microphone hole (203), and the speaker hole (207) and the microphone hole (203) may be implemented as a single hole. Although not shown, the call receiver hole (not shown) may be formed in another part of the third surface (200C). For example, the call receiver hole may be formed on the opposite side of the external speaker hole (207) on the third surface (200C). For example, based on the city of FIG. 2A, the external speaker hole (207) may be formed on the third surface (200C) corresponding to the lower part of the electronic device (200), and the call receiver hole may be formed on the third surface (200C) corresponding to the upper part of the electronic device (200). However, this is not limited thereto, and in other embodiments, the call receiver hole may be formed at a location other than the third surface (200C). For example, the call receiver hole may be formed by a spaced space between the front plate (202) (or, display (201)) and the side bezel structure (218).

[0078] In one embodiment, the electronic device (200) may include at least one speaker (not shown) (e.g., an audio output module (155) of FIG. 1) configured to output sound to the outside of the housing (210) through an external speaker hole (207) and / or a call receiver hole (not shown).

[0079] In one embodiment, a sensor module (not shown) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (200) or an external environmental state. For example, the sensor module may include at least one of a proximity sensor, an HRM sensor, a fingerprint sensor, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0080] In one embodiment, the camera modules (205, 212, 213) may include a first camera module (205) arranged to face a first side (200A) of the electronic device (200), a second camera module (212) arranged to face a second side (200B), and a flash (213).

[0081] In one embodiment, the second camera module (212) may include multiple cameras (e.g., dual cameras, triple cameras, or quad cameras). However, the second camera module (212) is not necessarily limited to including multiple cameras and may include one camera.

[0082] In one embodiment, the first camera module (205) and the second camera module (212) may include one or more lenses, image sensors, and / or image signal processors.

[0083] In one embodiment, the flash (213) may include, for example, a light-emitting diode or a xenon lamp. In one embodiment, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be arranged on one side of the electronic device (200).

[0084] In one embodiment, the key input device (217) may be arranged on the third side (200C) of the electronic device (200). In one embodiment, the electronic device (200) may not include some or all of the key input devices (217), and the key input devices (217) that are not included may be implemented in another form, such as a soft key, on the display (201).

[0085] In one embodiment, a connector hole (208) may be formed on the third side (200C) of the electronic device (200) so that a connector of an external device can be accommodated. A connection terminal (e.g., a connection terminal (178) of FIG. 1) electrically connected to the connector of the external device may be arranged within the connector hole (208). The electronic device (200) according to one embodiment may include an interface module (e.g., an interface (177) of FIG. 1) for processing an electrical signal transmitted and received through the connection terminal.

[0086] In one embodiment, the electronic device (200) may include a light-emitting element (not shown). For example, the light-emitting element (not shown) may be disposed on a first surface (200A) of the housing (210). The light-emitting element (not shown) may provide status information of the electronic device (200) in the form of light. In one embodiment, the light-emitting element (not shown) may provide a light source that is linked to the operation of the first camera module (205). For example, the light-emitting element (not shown) may include an LED, an IR LED, and / or a xenon lamp.

[0087] FIG. 2B is an exploded perspective view of an exemplary electronic device according to an embodiment. Referring to FIG. 2B, an electronic device (200) according to an embodiment may include a frame structure (240) (e.g., the side bezel structure (218) of FIG. 2A), a first printed circuit board (250), a second printed circuit board (252), a cover plate (260), a chip antenna (230) (e.g., the antenna module (197) of FIG. 1), and a battery (270) (e.g., the battery (189) of FIG. 1).

[0088] In one embodiment, the frame structure (240) may be positioned between the display (201) and the back plate (211). In one embodiment, the frame structure (240) may support or accommodate components included in the electronic device (200). For example, the display (201) may be disposed on one side of the frame structure (240) facing one direction (e.g., +Z direction). A first printed circuit board (250), a second printed circuit board (252), a battery (270), and a second camera module (212) may be disposed on the other side of the frame structure (240) facing the opposite direction (e.g., -Z direction). The first printed circuit board (250), the second printed circuit board (252), the battery (270), and the second camera module (212) may be disposed within recesses formed in the frame structure (240).

[0089] In one embodiment, the frame structure (240) may include a first part (241) and a second part (243) surrounding the first part (241). The first part (241) may be positioned below the display (201) (e.g., in the -Z direction) to support the display (201). Alternatively, the first part (241) may support the display (201) together with the second part (243). The second part (243) may surround a space between the back plate (211) and the front plate (202) (and / or the display (201)). The second part (243) surrounding the space may form a side surface of the electronic device (200) (e.g., the third surface (200C) of FIG. 2A), and the first part (241) positioned within the space may extend inwardly from the second part (243). The above side may extend from the front surface of the electronic device (200) (e.g., the first surface (200A) of FIG. 2A) or the perimeter of the front plate (202). In one embodiment, the first part (241) and the second part (243) may be formed of metal and / or polymer. The frame structure (240) or the first part (241) of the frame structure (240) may be referred to as a support member.

[0090] In one embodiment, the first printed circuit board (250), the second printed circuit board (252), and the battery (270) may be respectively coupled to the frame structure (240). For example, the first printed circuit board (250) and the second printed circuit board (252) may be fixedly disposed to the frame structure (240) through a coupling member such as a screw. For example, the battery (270) may be fixedly disposed to the frame structure (240) through an adhesive member (e.g., double-sided tape). However, the present invention is not limited to the above-described examples.

[0091] In one embodiment, the display (201) may be positioned between a frame structure (240) and a front plate (202). For example, the front plate (202) may be positioned on one side (e.g., in the +Z direction) of the display (201), and the frame structure (240) may be positioned on the other side (e.g., in the -Z direction).

[0092] In one embodiment, the front plate (202) can be coupled with the display (201). For example, the display (201) can be attached to the back surface of the front plate (202) via an optically clear adhesive (e.g., optically clear adhesive (OCA) or optically clear resin (OCR)).

[0093] In one embodiment, the front plate (202) may be coupled to a frame structure (240). For example, the front plate (202) may include an outer portion extending outside the display (201) when viewed in the z-axis direction. The frame structure (240) (e.g., the second part (243)) may be attached to the outer portion, but is not limited thereto.

[0094] In one embodiment, a processor (e.g., processor (120) of FIG. 1), a memory (e.g., memory (130) of FIG. 1), and / or an interface (e.g., interface (177) of FIG. 1) may be disposed on the first printed circuit board (250) and / or the second printed circuit board (252). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The memory may include, for example, volatile memory or non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (200) to an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector. In one embodiment, the first printed circuit board (250) and the second printed circuit board (252) may be operatively or electrically connected to each other via a connecting member (e.g., a flexible printed circuit board).

[0095] In one embodiment, the cover plate (260) may be disposed between the first printed circuit board (250) and the back plate (211). In one embodiment, the cover plate (260) may be disposed on the first printed circuit board (250). For example, the cover plate (260) may be disposed on a surface of the first printed circuit board (250) facing the -Z direction.

[0096] In one embodiment, the cover plate (260) may at least partially overlap the first printed circuit board (250) with respect to the z-axis. In one embodiment, the cover plate (260) may cover at least a portion of the first printed circuit board (250). In this way, the cover plate (260) may protect the first printed circuit board (250) from physical impact or prevent detachment of a connector coupled to the first printed circuit board (250).

[0097] In one embodiment, the cover plate (260) may be fixedly positioned on the first printed circuit board (250) via a joining member (e.g., a screw), or may be coupled to the frame structure (240) together with the first printed circuit board (250) via the joining member. For example, the cover plate (260) may be coupled to the first printed circuit board (250) and / or the frame structure (240) so as to be positioned on or above the first printed circuit board (250).

[0098] In one embodiment, the cover plate (260) may include a conductive portion. Additionally, the cover plate (260) may include a non-conductive portion. For example, the conductive portion of the cover plate (260) may be formed of a conductive metal, such as stainless steel, and the non-conductive portion may be formed of a non-conductive material, such as plastic. For example, the conductive portion of the cover plate (260) may be referred to as conductive members (760, 860, 1060, 1160, 1260, 1560, or 1660), which will be described later. The non-conductive portion of the cover plate (260) may be referred to as non-conductive members (1590 or 1690), which will be described later.

[0099] In one embodiment, the cover plate (260) may include an opening (265). The opening (265) may be formed to penetrate the cover plate (260). The opening (265) may be aligned with a chip antenna (230) disposed on a printed circuit board (250). For example, the opening (265) may overlap the chip antenna (230). For example, the opening (265) may overlap the chip antenna (230) with respect to the Z direction.

[0100] In one embodiment, the opening (265) may be referred to as openings (765, 865, 1065, 1165, 1265, 1565, or 1665), which will be described below. In one embodiment, the opening (265) may be formed within the conductive portion of the cover plate (260). For example, the opening (265) may be formed within conductive members (760, 860, 1060, 1160, 1260, or 1560), such as openings (765, 865, 1065, 1165, 1265, or 1565), which will be described below. Alternatively, the opening (265) may be formed between the non-conductive portion and the conductive portion of the cover plate (260). For example, an opening (265) may be formed between a conductive member (1660) and a non-conductive member (1690), such as an opening (1665) described below.

[0101] In one embodiment, the chip antenna (230) may be disposed on a printed circuit board (250). For example, the chip antenna (230) may be disposed on the printed circuit board (250) using a surface mount device (SMD). The chip antenna (230) may be positioned between the printed circuit board (250) and a cover plate (260). In one embodiment, a wireless communication circuit of the electronic device (200) (e.g., the wireless communication module (192) of FIG. 1) may transmit and / or receive a radio frequency (RF) signal using the chip antenna (230). For example, the RF signal may include, but is not limited to, an ultra-wide band (UWB) signal. In one embodiment, the chip antenna (230) may include an LTCC (low temperature co-fired ceramic) type antenna. A detailed configuration of the chip antenna (230) will be described later with reference to FIG. 17.

[0102] In one embodiment, the battery (270) may power at least one component of the electronic device (200). For example, the battery (270) may include a rechargeable secondary battery or a fuel cell.

[0103] In one embodiment, a first camera module (205) (e.g., a front camera) may be disposed in at least a portion of a frame structure (240) (e.g., a first part (241)) such that the lens can receive external light through a portion of the front plate (202) (e.g., the camera area (237)) (e.g., the front (200A) of FIG. 2A).

[0104] In one embodiment, a second camera module (212) (e.g., a rear camera) may be disposed between the frame structure (240) and the rear plate (211). In one embodiment, the second camera module (212) may be electrically connected to the first printed circuit board (250) via a connecting member (e.g., a connector). In one embodiment, the second camera module (212) may be disposed such that the lens can receive external light through the camera area (284) of the rear plate (211) of the electronic device (200).

[0105] In one embodiment, the camera area (284) may be formed on a surface of the rear plate (211) (e.g., the rear surface (200B) of FIG. 2A). In one embodiment, the camera area (284) may be formed to be at least partially transparent so that external light may be incident on the lens of the second camera module (212). In one embodiment, at least a portion of the camera area (284) may protrude from the surface of the rear plate (211) by a predetermined height. However, the present invention is not limited thereto, and in another embodiment, the camera area (284) may form a substantially same plane as the surface of the rear plate (211).

[0106] In one embodiment, the housing (210) of the electronic device (200) may refer to a configuration or structure that forms at least a portion of the exterior of the electronic device (200). In this respect, at least a portion of the front plate (202), the frame structure (240), and / or the rear plate (211) that form the exterior of the electronic device (200) may be referred to as the housing (210) of the electronic device (200).

[0107] An electronic device (200) according to one embodiment may include an antenna module (not shown) (e.g., a cover layer (1180) of FIG. 11C). In one embodiment, the antenna module may be disposed between a rear plate (211) and a cover plate (260). The antenna module may include, for example, a near field communication (NFC) antenna (e.g., an antenna pattern (1086) of FIG. 10C), a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna module may, for example, perform short-range communication with an external device or wirelessly transmit and receive power with an external device.

[0108] Fig. 3 is a diagram for explaining the tilting of the beam pattern according to the position where the chip antenna is placed on the printed circuit board. Fig. 4 shows the radiation pattern according to the position of the chip antenna. Fig. 5 shows the current distribution when the chip antenna is located at the center of the printed circuit board. Fig. 6a and Fig. 6b show the current distribution when the chip antenna is located near the edge of the printed circuit board.

[0109] Referring to FIG. 3, a chip antenna (330) (e.g., the chip antenna (230) of FIG. 2B) may be placed on a printed circuit board (350) (e.g., the printed circuit board (250) of FIG. 2B). For example, the chip antenna (330) may be placed at a first position (L1) corresponding to the center of the printed circuit board (350) or a second position (L2) near an edge (351) of the printed circuit board (350).

[0110] Depending on the position where the chip antenna (330) is placed on the printed circuit board (350), the ground condition of the chip antenna (330) may vary. Accordingly, the resonant frequency of the chip antenna (330) may shift or the antenna efficiency may change. Due to the asymmetry of the ground depending on the position of the chip antenna (330), the radiation pattern of the chip antenna (330) may tilt in one direction. For example, as illustrated in FIG. 4, the radiation pattern (420) of the chip antenna (330) at the second position (L2) may be tilted in the direction of -90 degrees overall compared to the radiation pattern (410) of the chip antenna (330) at the first position (L1). For example, referring to FIG. 5, when the chip antenna (330) is positioned at the center of the printed circuit board (350), the radiation pattern of the chip antenna (330) may be formed uniformly overall without being biased in one direction. In contrast, referring to FIGS. 6A and 6B, when the chip antenna (330) is positioned near the edge (351) of the printed circuit board (350), the radiation pattern of the chip antenna (330) may be tilted toward the side of the printed circuit board (350) (e.g., in the direction in which the edge (351) faces). This may be because the current is formed asymmetrically around the chip antenna (330). When the radiation pattern is tilted, a performance deviation of the chip antenna (330) depending on the direction may occur, and the performance of services provided using UWB technology, such as peripheral device detection, may vary.

[0111] In order to reduce tilting of the radiation pattern of the chip antenna (330), the chip antenna (330) may be placed at the center of the printed circuit board (350). However, since various components as well as the chip antenna (330) are placed on the printed circuit board (350), it may be difficult to place the chip antenna (330) at the center of the printed circuit board (350). In addition, the operating characteristics of the chip antenna (330) may change due to influences from other components placed on the printed circuit board (350), and thus the position of the chip antenna (330) must be determined by taking these influences into consideration.

[0112] Referring to the drawings below, the arrangement structure of a chip antenna that can minimize the influence of beam tilting and other components is described.

[0113] Figures 7a and 7b illustrate a chip antenna disposed on a printed circuit board according to one embodiment. Figure 7b may be a cross-sectional view taken along line A-A' of Figure 7a.

[0114] Referring to FIGS. 7A and 7B, an electronic device according to an embodiment (e.g., the electronic device (200) of FIG. 2B) may include a printed circuit board (750) (e.g., the printed circuit board (250) of FIG. 2B), a chip antenna (730) (e.g., the chip antenna (230) of FIG. 2B), and a conductive member (760) (e.g., the cover plate (260) of FIG. 2B or a conductive portion of the cover plate (260), or a shield can).

[0115] In one embodiment, the printed circuit board (750) may include a first side (750A) and a second side (750B) opposite the first side (750A). For example, the chip antenna (730) may be disposed on the first side (750A) of the printed circuit board (750).

[0116] In one embodiment, the conductive member (760) can be disposed on a printed circuit board (750). For example, the conductive member (760) can be disposed on a first side (750A) of the printed circuit board (750). As another example, the conductive member (760) can be positioned to cover at least a portion of the printed circuit board (750). For example, the conductive member (760) can be disposed on the first side (750A) of the printed circuit board (750) to cover the chip antenna (730). In one embodiment, the conductive member (760) can at least partially surround the chip antenna (730). The conductive member (760) can define an internal space (S1) together with the first side (750A) of the printed circuit board (750). The chip antenna (730) can be positioned within the internal space (S1).

[0117] In one embodiment, the conductive member (760) may include a first portion (761) and a second portion (762). In one embodiment, the first portion (761) may extend from an upper portion of the second portion (762). The first portion (761) may be spaced apart from the printed circuit board (750). The first portion (761) may be positioned above the chip antenna (730). For example, the chip antenna (730) may be positioned between the first portion (761) and the printed circuit board (750). In one embodiment, the first portion (761) may be referred to as an upper portion of the conductive member (760), a cover, a cover portion, or a cover member. In one embodiment, the second portion (762) can extend from at least a portion of an outer edge of the first portion (761) to a first side (750A) of the printed circuit board (750). The second portion (762) can be coupled to the printed circuit board (750). For example, the second portion (762) can be coupled to the printed circuit board (750) via a fastening member, such as a screw. In one embodiment, the second portion (762) can be referred to as an end portion, a side portion, a side member, a side wall, a side wall portion, or a side wall member of the conductive member (760). The first portion (761) and the second portion (762) can be formed integrally, but are not limited thereto. For example, the first portion (761) and the second portion (762) of the conductive member (760) can be configured to be mechanically coupled. In one embodiment, the conductive member (760) may provide electromagnetic shielding for the chip antenna (730) by surrounding the chip antenna (730). This may reduce the influence of other components around the chip antenna (730) on the performance of the chip antenna (730). For example, the conductive member (760) may be referred to as a conductive cover, a conductive structure, or a shield can.

[0118] In one embodiment, the conductive member (760) may include an opening (765) formed in the first portion (761) (e.g., opening (265) of FIG. 2B). The opening (765) may penetrate the first portion (761) to be connected to the interior space (S1) of the conductive member (760). In one embodiment, the opening (765) of the conductive member (760) may be aligned with the chip antenna (730). For example, the opening (765) of the conductive member (760) may overlap the chip antenna (730). For example, when the first side (750A) of the printed circuit board (750) is viewed from above, the chip antenna (730) may be positioned within the opening (765). In one embodiment, when looking from above at the first side (750A) of the printed circuit board (750), the centers of the opening (765) and the chip antenna (730) may be substantially aligned with each other, but are not limited thereto. The opening (765) may be referred to as an aperture.

[0119] In one embodiment, the opening (765) may be positioned in a first direction (1) from the center (C1) of the first portion (761). For example, the chip antenna (730) may be positioned in the first direction (1) from the center (C1). The center (C1) may be a midpoint of the length of the second portion (762) based on an imaginary line (e.g., line A-A') when the second portion (762) is viewed from above. The first direction (1) may be a direction substantially parallel to the first surface (750A) of the printed circuit board (750), and the second direction (2) may be a direction opposite to the first direction (1). Through this, the beam of the chip antenna (730) may be tilted in the first direction (1). This may be because, depending on the relative positions of the chip antenna (730) and the opening (765) with respect to the conductive member (760), the ground area in the first direction (1) and the ground area in the second direction (2) with respect to the chip antenna (730) may differ. For example, as illustrated in FIGS. 7A and 7B , when the positions of the chip antenna (730) and the opening (765) with respect to the conductive member (760) are tilted in the first direction (1), the ground area in the second direction (2) with respect to the chip antenna (730) may become wider than the ground area in the first direction (1). Accordingly, the radiation pattern of the chip antenna (730) may be tilted in the first direction (1). Unlike the city, when the positions of the chip antenna (730) and the opening (765) with respect to the conductive member (760) are tilted in the second direction (2), the radiation pattern of the chip antenna (730) can be tilted in the second direction (2). Accordingly, even if the radiation pattern of the chip antenna (730) is tilted in an unintended direction due to the position of the chip antenna (730) placed on the printed circuit board (750) and other surrounding components, the radiation pattern of the chip antenna (730) can be adjusted to the intended direction. The radiation pattern of the chip antenna (730) is illustrated in FIG. 9.

[0120] Figures 8a and 8b illustrate a chip antenna disposed on a printed circuit board according to one embodiment. Figure 8c illustrates a current distribution of a chip antenna disposed on a printed circuit board according to one embodiment. Figure 8b may be a cross-sectional view taken along line B-B' of Figure 8a.

[0121] Referring to FIGS. 8A and 8B, an electronic device according to one embodiment (e.g., the electronic device (200) of FIG. 2B) may include a printed circuit board (850), a chip antenna (830), and a conductive member (860) (e.g., the cover plate (260) of FIG. 2B or a conductive portion of the cover plate (260)).

[0122] In one embodiment, for the printed circuit board (850), the description provided with reference to the printed circuit board (250) of FIG. 2B and / or the printed circuit board (750) of FIGS. 7A and 7B may apply substantially identically or in a corresponding manner. For example, the printed circuit board (850) may include a first side (850A) (e.g., the first side (750A)) and a second side (850B) opposite the first side (850A) (e.g., the second side (750B)).

[0123] In one embodiment, for the chip antenna (830), the description provided with reference to the chip antenna (230) of FIG. 2B and / or the chip antenna (730) of FIGS. 7A and 7B may be applied substantially identically or in a corresponding manner. For example, the chip antenna (830) may be disposed on the first side (850A) of the printed circuit board (850). The chip antenna (830) may be positioned within the conductive member (860).

[0124] In one embodiment, for the conductive member (860), the description provided with reference to the conductive member (760) of FIGS. 7A and 7B may be applied substantially identically or in a corresponding manner. Any description of the conductive member (860) that overlaps with the description of the conductive member (760) may be omitted.

[0125] In one embodiment, the conductive member (860) may be disposed on a first surface (850A) of a printed circuit board (850). The conductive member (860), together with the first surface (850A) of the printed circuit board (850), may form an internal space (S2) in which the chip antenna (830) is positioned.

[0126] In one embodiment, the conductive member (860) may include a first portion (861) (e.g., the first portion (761) of FIG. 7B) and a second portion (862) (e.g., the second portion (762) of FIG. 7B). An opening (865) (e.g., the opening (765) of FIG. 7A) aligned with the chip antenna (830) may be formed in the first portion (861) of the conductive member (860). The opening (865) and the chip antenna (830) are illustrated as being positioned at the center of the conductive member (860), but are not limited thereto. For example, as described above with reference to FIGS. 7A and 7B, the positions of the opening (865) and the chip antenna (830) relative to the conductive member (860) may be biased in one direction to allow tilting of the radiation pattern of the chip antenna (830). For example, unlike the city, the positions of the opening (865) and the chip antenna (830) for the conductive member (860) can be oriented in the first direction (1), the second direction (2), or a direction different from these.

[0127] In one embodiment, the conductive member (860) may include an opening (875) (or aperture) formed by penetrating the second portion (862). The opening (875) may be connected to the internal space (S2). The opening (875) may be positioned in the first direction (1) from the chip antenna (830).

[0128] Referring to FIG. 8c, a chip antenna (830) according to one embodiment can radiate through openings (865, 875) formed in a conductive member (860). By the opening (875) of the conductive member (860) open in the first direction (1), the radiation pattern of the chip antenna (830) can be tilted in the first direction (1).

[0129] Fig. 9 is a drawing showing a radiation pattern of a chip antenna. The pattern (910) of Fig. 9 may be a radiation pattern of a chip antenna (730) disposed on a printed circuit board (750) without the conductive member (760) of Fig. 7a. The pattern (910) of Fig. 9 may be a radiation pattern of a chip antenna (830) disposed on a printed circuit board (850) without the conductive member (860) of Fig. 8a. The pattern (920) may be a radiation pattern of a chip antenna (730) surrounded by the conductive member (760) of Fig. 7a. The pattern (930) may be a radiation pattern of a chip antenna (830) surrounded by the conductive member (860) of Fig. 8a.

[0130] Referring to the pattern (910) and pattern (920) of FIG. 9, the radiation pattern of the chip antenna (730) can be tilted in the first direction (1) by the location of the chip antenna (730) and the opening (765) and the conductive member (760) having the opening (765) aligned with the chip antenna (730). Through this, the radiation pattern of the chip antenna (730) can be adjusted in the intended direction.

[0131] Referring to the pattern (910) and the pattern (930) of FIG. 9, the radiation pattern of the chip antenna (830) can be tilted in the first direction (1) by the conductive member (860) having the opening (865) aligned with the chip antenna (830) and the opening (875) positioned in the first direction (1) of the chip antenna (830). Through this, the radiation pattern of the chip antenna (830) can be adjusted in the intended direction.

[0132] FIGS. 10A, 10B, and 10C are cross-sectional views of an electronic device according to one embodiment.

[0133] Referring to FIG. 10A, an electronic device (e.g., the electronic device (200) of FIG. 2B) according to one embodiment may include a printed circuit board (1050) (e.g., the printed circuit board (750 or 850)), a chip antenna (1030) (e.g., the chip antenna (730 or 830)) disposed on the printed circuit board (1050), a conductive member (1060) (e.g., the conductive member (760 or 860)) disposed on the printed circuit board (1050) to cover the chip antenna (1030), and a shielding layer (1084) disposed on the conductive member (1060).

[0134] In one embodiment, the conductive member (1060) may include an opening (1065) (e.g., opening (765 or 865)) aligned with the chip antenna (1030).

[0135] In one embodiment, the shielding layer (1084) can be disposed on a first portion (1061) of the conductive member (1060) (e.g., the first portion (761 or 861)). The shielding layer (1084) can be disposed around an opening (1065) of the conductive member (1060). For example, the shielding layer (1084) can at least partially surround a perimeter of the opening (1065) of the conductive member (1060). The shielding layer (1084) can include an opening (1085) aligned with the opening (1065) of the conductive member (1060). The opening (1085) of the shielding layer (1084) can overlap the opening (1065) of the conductive member (1060). The opening (1085) of the shielding layer (1084) may be connected to the opening (1065) of the conductive member (1060). For example, the opening (1085) of the shielding layer (1084) may have a larger diameter than the opening (1065) of the conductive member (1060), but is not limited thereto. In one embodiment, the chip antenna (1030) may be exposed to the outside of the conductive member (1060) through the opening (1065) of the conductive member (1060) and the opening (1085) of the shielding layer (1084).

[0136] In one embodiment, the shielding layer (1084) may be formed of materials having a high permeability (e.g., several hundred or more) to block electromagnetic waves. For example, the shielding layer (1084) may include, but is not limited to, a ferrite sheet. Due to the high permeability of the shielding layer (1084), the intrinsic impedance may be increased. The shielding layer (1084) disposed on the conductive member (1060) may block the surface current (SC) flowing through the conductive member (1060). Accordingly, when the chip antenna (1030) operates, the surface current flowing horizontally along the surface of the conductive member (1060) may be blocked. Accordingly, the tilting of the radiation pattern of the chip antenna (1030) due to the position where the chip antenna (1030) is placed on the printed circuit board (1050) and / or other components around the chip antenna (1030) can be reduced or prevented. Since the radiation pattern can be tilted due to the asymmetrical current flowing to the ground, the beam tilting of the chip antenna (1030) can be reduced or prevented by blocking such surface current with the shielding layer (1084).

[0137] Referring to FIG. 10B, according to one embodiment, the electronic device may further include a non-metallic layer (1082) interposed between the shielding layer (1084) and the conductive member (1060). In one embodiment, the non-metallic layer (1082) may include a section overlapping the opening (1065) of the conductive member (1060) and the opening (1085) of the shielding layer (1084). For example, the section of the non-metallic layer (1082) may be positioned between the opening (1065) of the conductive member (1060) and the opening (1085) of the shielding layer (1084). In one embodiment, the opening (1065) of the conductive member (1060) may be closed by the non-metallic layer (1082). The chip antenna (1030) may be covered by a non-metallic layer (1082) covering the opening (1065) of the conductive member (1060). In one embodiment, the non-metallic layer (1082) may be formed of an electrically non-conductive material. For example, the non-metallic layer (1082) may include, but is not limited to, graphite and / or polyimide.

[0138] Referring to FIG. 10c, according to one embodiment, the electronic device may further include an antenna pattern (1086) disposed on a shielding layer (1084). The antenna pattern (1086) may be formed of a conductive material (e.g., copper). In one embodiment, the antenna pattern (1086) may include a coil-shaped conductive pattern. For example, it may include an NFC antenna.

[0139] FIG. 11A illustrates a printed circuit board having a chip antenna disposed thereon, according to an embodiment. FIG. 11B illustrates an electronic device including a printed circuit board having a conductive member disposed thereon, according to an embodiment. FIG. 11C illustrates an electronic device including an antenna module disposed on a conductive member, according to an embodiment. FIG. 11D is a cross-sectional view taken along line C-C' of FIG. 11C. FIG. 11E illustrates a radiation pattern of a chip antenna, according to an embodiment.

[0140] Referring to FIG. 11A, according to one embodiment, an electronic device (1101) (e.g., the electronic device (200) of FIG. 2B) may include a printed circuit board (1150) (e.g., printed circuit board (750, 850, or 1050)), a chip antenna (1130) (e.g., chip antenna (730, 830, 1030)) disposed on the printed circuit board (1150), and a shield can (1170).

[0141] In one embodiment, the shield can (1170) may be placed on a printed circuit board (1150). For example, the shield can (1170) may be placed on a surface of the printed circuit board (1150) on which the chip antenna (1130) is placed (e.g., the first surface (850A) of FIG. 8B). The shield can (1170) may be positioned adjacent to the chip antenna (1130).

[0142] Referring to FIG. 11B, an electronic device (1101) according to one embodiment may include a conductive member (1160) (e.g., conductive member (760, 860, or 1060)) positioned to cover at least a portion of a chip antenna (1130) and a printed circuit board (1150). An opening (1165) (e.g., opening (765, 865, or 1065)) aligned with the chip antenna (1130) may be formed in the conductive member (1160). The opening (1165) may overlap the chip antenna (1130). In FIG. 11B, a portion of a shield can (1170) is illustrated as being positioned within the opening (1165), but is not limited thereto. For example, the shield can (1170) may not overlap the opening (1165) or the boundary of the shield can (1170) may coincide with the boundary of the opening (1165).

[0143] In one embodiment, another opening (1167) may be formed in the conductive member (1160). Although not shown, a connecting member, such as a cable or a flexible printed circuit board (FPCB), may pass through the other opening (1167) of the conductive member (1160) and be connected to the printed circuit board (1150).

[0144] In one embodiment, the second part (243) of the frame structure (240) may include a first side (246), a second side (247), and / or a third side (248). The first side (246) may extend along a first direction (11). The second side (247) may extend from a first end of the first side (246) that faces the first direction (11). The second side (247) may be substantially perpendicular to the first side (246), but is not limited thereto. The third side (248) may extend from a second end of the first side (246) that faces the second direction (12) opposite to the first direction (11). The third side (248) may be substantially perpendicular to the first side (246), but is not limited thereto. In a non-limiting embodiment, the length of the first side (246) may be, but is not limited to, less than the length of the second side (247) and / or the third side (248). In this respect, the first side (246) may be referred to as the short side, the second side (247) may be referred to as the first long side, and the third side (248) may be referred to as the second long side. In one embodiment, the first direction (11) may be, but is not limited to, a direction substantially parallel to the first direction (1) of FIG. 7a, FIG. 7b, FIG. 8a, FIG. 8b, FIG. 8c, or FIG. 9. In one embodiment, the second direction (12) may be, but is not limited to, a direction substantially parallel to the second direction (2) of FIG. 7a, FIG. 7b, FIG. 8a, FIG. 8b, FIG. 8c, or FIG. 9.

[0145] In one embodiment, a virtual line (M1) passing through the center (C2) of the chip antenna (1130) may be defined. The virtual line (M1) may be parallel to the first direction (11) or the second direction (12), but is not limited thereto. In addition, although not shown, a center (N1) of a printed circuit board (1150) based on the virtual line (M1) may be defined. The center (N1) of the printed circuit board (1150) may be a midpoint of the length of the printed circuit board (1150) based on the virtual line (M1). In addition, a center (O1) of a conductive member (1160) (or the first portion (1161)) may be defined based on the virtual line (M1). The center (O1) of the conductive member (1160) may be the midpoint of the length of the first portion (1161) based on the virtual line (M1).

[0146] The center (C2) of the chip antenna (1130) may be positioned in a first direction (11) from the center (N1) of the printed circuit board (1150). Since the chip antenna (1130) is positioned asymmetrically with respect to the ground of the printed circuit board (1150), the radiation pattern of the chip antenna (1130) may be tilted unintentionally. For example, the radiation pattern of the chip antenna (1130) may be tilted in the first direction (11). For example, the opening (1165) may be positioned in a second direction (12) from the center (O1) of the conductive member (1160). Accordingly, the radiation pattern of the chip antenna (1130) aligned to the opening (1165) may be adjusted in an intended direction. For example, the radiation pattern of the chip antenna (1130) may be tilted in the second direction (12).

[0147] As described above, in FIG. 11B, the case in which the opening (1165) and the chip antenna (1130) are tilted in the second direction (12) with respect to the conductive member (1160) is illustrated, but is not limited thereto. In order to adjust the tilting of the radiation pattern of the chip antenna (1130), the method described with reference to FIGS. 7A and 7B, or the method described with reference to FIGS. 8A to 8C may be applied. In order to adjust the beam pattern in an intended direction, the printed circuit board (1150), the chip antenna (1130), the conductive member (1160), and the opening (1165) of the conductive member (1160) may have a positional relationship different from the illustrated example.

[0148] Referring to FIGS. 11C and 11D , an electronic device (1101) according to an embodiment may include a cover layer (1180) disposed on a conductive member (1160). In an embodiment, the cover layer (1180) may include one or more layers. For example, the cover layer (1180) may include a shielding layer (1084), as shown in FIG. 10A . For another example, the cover layer (1180) may include a non-metallic layer (1082) and a shielding layer (1084), as shown in FIG. 10B . For another example, the cover layer (1180) may include a non-metallic layer (1082), a shielding layer (1084), and an antenna pattern (1086), as shown in FIG. 10C . For another example, the cover layer (1180) may include a non-metallic layer (1082), a shielding layer (1084), an antenna pattern (1086), and a protective layer (1188) covering them, as shown in FIGS. 11C and 11D . The protective layer (1188) may at least partially cover the non-metallic layer (1082), the shielding layer (1084), and the antenna pattern (1086). The protective layer (1188) may include a material capable of absorbing impact, such as a sponge, for example.

[0149] Referring to FIG. 11D, the shield can (1170) may be positioned within the internal space (S3) (e.g., the internal space (S1 or S2)) of the conductive member (1160). In one embodiment, the shield can (1170) may include a cover (1171) facing the first portion (1161) of the conductive member (1160) and a side wall (1172) facing the chip antenna (1130). The cover (1171) may extend from the top of the side wall (1172). In one embodiment, the radiation pattern of the chip antenna (1130) may be tilted due to the shield can (1170). For example, the radiation pattern of the chip antenna (1130) can be tilted in the first direction (11) by the shield can (1170) blocking the internal space (S3) (or the path leading to one direction of the opening (1165)) of the second direction (12) of the chip antenna (1130).

[0150] In one embodiment, a shielding layer (1084) may be disposed on the conductive member (1160) (or the non-metallic layer (1082)) to surround at least a portion of the opening (1165), thereby reducing or preventing unintended tilting of the radiation pattern of the chip antenna (1130). For example, as illustrated in FIG. 11e, a radiation pattern may be formed that is not tilted in the first direction (11) or the second direction (12), but rather in a third direction (13) (e.g., the -Z direction in FIG. 2b) perpendicular to the first direction (11) and the second direction (12).

[0151] FIG. 12A illustrates an electronic device including a printed circuit board having a conductive member disposed thereon, according to an embodiment. FIG. 12B illustrates a current distribution of the electronic device, according to an embodiment. FIG. 12B may be a current distribution of the electronic device (1201) of FIG. 12A, viewed in a direction (A1).

[0152] Referring to FIG. 12A, according to one embodiment, an electronic device (1201) (e.g., the electronic device (200) of FIG. 2B) may include a printed circuit board (1250) (e.g., printed circuit board (750, 850, 1050, or 1150)), a chip antenna (1230) (e.g., chip antenna (730, 830, 1030, or 1030)) disposed on the printed circuit board (1250), and a conductive member (1260) (e.g., conductive member (760, 860, 1060, or 1160)) disposed to overlap at least a portion of the printed circuit board (1250) so as to cover the chip antenna (1230).

[0153] In one embodiment, the conductive member (1260) may be formed with an opening (1265) (e.g., opening (765, 865, 1065, or 1165)) aligned with the chip antenna (1230). The opening (1265) may overlap the chip antenna (1230). In one embodiment, the conductive member (1260) may be formed with a plurality of openings (1267). The size of each of the plurality of openings (1267) may be, for example, substantially the same as or larger than the opening (1265). For example, the size (e.g., width or height) of each of the plurality of openings (1267) may be equal to or greater than a wavelength (λ) / 10. The wavelength may be a wavelength of a signal to be transmitted and received using the chip antenna (1230).

[0154] Although not shown, additionally or optionally, a cover layer (e.g., cover layer (1180) of FIG. 11d) may be placed on the conductive member (1260).

[0155] In one embodiment, a virtual line (M2) passing through the center (C3) of the chip antenna (1230) may be defined. The virtual line (M2) may be perpendicular to the first direction (11) and the second direction (12), but is not limited thereto. Although not illustrated, the first portion (1261) of the conductive member (1260) may include a first region and a second region, which are distinguished based on the virtual line (M2). For example, the first region of the conductive member (1260) may be a region of the first portion (1261) located in the first direction (11) based on the virtual line (M2). For example, the second region of the conductive member (1260) may be a region of the first portion (1261) located in the second direction (12) based on the virtual line (M2). In one embodiment, the areas of the first region and the second region may be different. The surface current flowing to the conductive member (1260) through the opening (1265) may flow differently in the first region and the second region. Due to the asymmetry of the surface current, the radiation pattern of the chip antenna (1230) may be tilted. According to one embodiment, to prevent this, a plurality of openings (1267) may be formed penetrating the first portion (1261). The plurality of openings (1267) may disturb the current flowing in the conductive member (1260), thereby causing the flow of the current to be irregular. Accordingly, the tilting of the radiation pattern of the chip antenna (1230) in a specific direction may be reduced or prevented. For example, the second region may have a larger area than the first region, and due to the asymmetrical surface current resulting therefrom, the radiation pattern of the chip antenna (1230) may be tilted in the first direction (11). The plurality of openings (1267) may be formed in greater numbers in the second region among the first region and the second region. For example, the centers of each of the plurality of openings (1267) may be located in the second region.Accordingly, the tilting of the radiation pattern of the chip antenna (1230) in the first direction (11) can be reduced or prevented. For example, as illustrated in FIG. 12b, a current distribution that is not biased toward the first direction (11) or the second direction (12) can be formed. In addition, due to the multiple openings (1267), the weight of the conductive member (1260) can be reduced and the weight balance can be improved.

[0156] FIG. 13 is a diagram illustrating an alignment relationship between a chip antenna and an opening of a conductive member, according to one embodiment. FIG. 14a illustrates a radiation pattern when the chip antenna is offset aligned with respect to the opening, according to one embodiment. FIG. 14b illustrates a radiation pattern when the chip antenna is aligned at the center of the opening, according to one embodiment.

[0157] Referring to FIG. 13, the chip antenna (1330) may be aligned with an offset with respect to the opening (1365). For example, the center (C4) of the chip antenna (1330) may not coincide with the center of the opening (1365) formed in the first portion (1361) of the conductive member (1360). For example, a distance from the center (C4) of the chip antenna (1330) to the boundary of the opening (1365) in one direction (e.g., the first direction (11)) may be a first distance (D1). A distance from the center (C4) of the chip antenna (1330) to the boundary of the opening (1365) in the opposite direction (e.g., the second direction (12)) may be a second distance (D2). The first distance (D1) and the second distance (D2) may be different from each other. For example, the first distance (D1) may be smaller than the second distance (D2). The radiation pattern of the chip antenna (1330) may be tilted as the chip antenna (1330) is offset with respect to the opening (1365). For example, as illustrated, when the chip antenna (1330) is offset in the first direction (11) with respect to the opening (1365), the radiation pattern of the chip antenna (1330) may be tilted in the first direction (11). For example, the radiation pattern of FIG. 14A may be a radiation pattern when the chip antenna (1330) of FIG. 13 is offset in the first direction (11) with respect to the opening (1365). The radiation pattern of FIG. 14B may be a radiation pattern when the chip antenna (1330) is not offset but aligned with the center of the opening (1365). The radiation pattern of Fig. 14a can be tilted further in the first direction (11) than the radiation pattern of Fig. 14b.

[0158] The description of the conductive member (1360), the opening (1365), and the chip antenna (1330) of FIG. 13 described above can be substantially equally applied to the conductive member (760, 860, 1060, 1160, or 1260), the opening (765, 865, 1065, 1165, or 1265), and the chip antenna (730, 830, 1030, 1130, or 1230) described above.

[0159] The description of the conductive member (1360), the opening (1365), and the chip antenna (1330) of FIG. 13 described above can be substantially equally applied to the conductive member (1560), the opening (1665), and the chip antenna (1630) described later.

[0160] The description of the alignment relationship of the opening (1365) and the chip antenna (1330) of FIG. 13 described above can be substantially equally applied to the alignment relationship of the opening (1665) and the chip antenna (1630) described later.

[0161] FIG. 15A is an exemplary drawing showing an electronic device according to one embodiment. FIG. 15B is a cross-sectional view taken along line D-D' of FIG. 15A.

[0162] Referring to FIGS. 15A and 15B , an electronic device (1501) (e.g., electronic device (200) of FIG. 2B ) according to one embodiment may include a printed circuit board (1550) (e.g., printed circuit board (750, 850, 1050, 1150, or 1250)), a chip antenna (1530) (e.g., chip antenna (730, 830, 1030, 1130, or 1230)) disposed on the printed circuit board (1550), and a conductive member (1560) (e.g., conductive member (760, 860, 1060, 1160, or 1260)) disposed to cover the chip antenna (1530). In one embodiment, the conductive member (1560) can include a first portion (1561) (e.g., first portion (761, 861, 1061, 1161, or 1261)) and a second portion (1562) (e.g., second portion (762, 862, or 1262)). In one embodiment, the first portion (1561) of the conductive member (1560) can have an opening (1565) formed therein (e.g., opening (765, 865, 1065, 1165, or 1265)).

[0163] In one embodiment, the electronic device (1501) may further include a non-conductive member (1590), a non-metallic layer (1582) (e.g., the non-metallic layer (1082) of FIG. 10b), and a shielding layer (1584) (e.g., the shielding layer (1084) of FIG. 10b).

[0164] In one embodiment, the non-conductive member (1590) may be positioned to overlap at least a portion of the printed circuit board (1550). For example, the non-conductive member (1590) may cover some of the components positioned on the printed circuit board (1550). For example, the non-conductive member (1590) may be coupled to the conductive member (1560).

[0165] In one embodiment, a non-metallic layer (1582) may be disposed on the non-conductive member (1590) and the conductive member (1560). Unlike the non-metallic layer (1082) of FIG. 10b, the non-metallic layer (1582) may include a through hole (1587) connected to the opening (1565).

[0166] In one embodiment, the shielding layer (1584) may surround only a portion of the periphery of the opening (1565). In one embodiment, the shielding layer (1584) may be disposed on a portion of the non-conductive member (1590) (or the first portion (1561)). For example, the first portion (1561) of the conductive member (1560) (or a section of the non-metallic layer (1582) disposed on the first portion (1561)) may include a first region (R1) and a second region (R2). The first region (R1) and the second region (R2) may be regions divided based on an imaginary line (M3) passing through the center (C4) of the chip antenna (1530). For example, a virtual line (M3) dividing the first region (R1) and the second region (R2) may pass through the center (C4) of the chip antenna (1530) and be parallel to the first direction (11), but is not limited thereto. In one embodiment, the areas of the first region (R1) and the second region (R2) may be different. For example, the area of ​​the first region (R1) may be larger than the area of ​​the second region (R2). In one embodiment, the area of ​​the shielding layer (1584) formed on the first region (R1) may be larger than the area of ​​the shielding layer (1584) formed on the second region (R2). Since the areas of the first region (R1) and the second region (R2) of the conductive member (1560) are different, the surface current of the chip antenna (1530) may flow asymmetrically in the conductive member (1560), and the radiation pattern of the chip antenna (1530) may be tilted unintentionally. The first region (R1) having a larger area than the second region (R2) of the conductive member (1560) may have a greater influence on the tilting of the radiation pattern of the chip antenna (1530). By forming the area where the shielding layer (1584) is disposed to be wider in the first region (R1) than in the second region (R2), the unintentional tilting of the radiation pattern of the chip antenna (1530) due to the conductive member (1560) can be reduced or prevented.

[0167] Unlike the illustration in FIG. 15b, the non-metallic layer (1582) may be omitted, and a shielding layer (1584) may be disposed on the conductive member (1560). Additionally, an antenna pattern (e.g., antenna pattern (1086) of FIG. 11d) and / or a protective layer (e.g., protective layer (1188) of FIG. 11d) may be disposed on the shielding layer (1584).

[0168] FIG. 16A is an exemplary drawing showing an electronic device according to one embodiment. FIG. 16B is a cross-sectional view taken along line E-E' of FIG. 16A.

[0169] Referring to FIGS. 16A and 16B, an electronic device (1601) (e.g., electronic device (200) of FIG. 2B) according to one embodiment may include a printed circuit board (1650) (e.g., printed circuit board (750, 850, 1050, 1150, 1250, or 1550)), and a chip antenna (1630) (e.g., chip antenna (730, 830, 1030, 1130, 1230, or 1530)) disposed on the printed circuit board (1650).

[0170] According to one embodiment, the electronic device (1601) may include a conductive member (1660) and a non-conductive member (1690) (e.g., the non-conductive member (1590) of FIG. 15A). Unlike the aforementioned openings (765, 865, 1065, 1165, 1265, and 1565) which are formed in the conductive members (760, 860, 1060, 1160, 1260, and 1565), the opening (1665) of the electronic device (1601) may be formed by the conductive member (1660) and the non-conductive member (1690). For example, the opening (1665) may be formed by a gap between the conductive member (1660) and the non-conductive member (1690). The chip antenna (1630) may be positioned on the printed circuit board (1650) so as to be aligned with the opening (1665). The chip antenna (1630) may be positioned between the non-conductive member (1690) and the conductive member (1660).

[0171] According to one embodiment, the electronic device (1601) may include a non-metallic layer (1682) (e.g., non-metallic layer (1082, or 1582)) and a shielding layer (1684) (e.g., shielding layer (1084 or 1584)). The non-metallic layer (1682) may be disposed on a first portion (1661) of a conductive member (1660). The shielding layer (1684) may be disposed on the non-metallic layer (1682). For example, the shielding layer (1684) may surround at least a portion of the periphery of the opening (1665). The surface current of the chip antenna (1630) may flow through the conductive member (1660), thereby causing an unintentional tilting of the radiation pattern of the chip antenna (1630). Such unintended tilting of the radiation pattern can be reduced or prevented by a shielding layer (1684) positioned over the conductive member (1660).

[0172] Unlike the illustration in FIG. 16b, the non-metallic layer (1682) may be omitted, and a shielding layer (1684) may be disposed on the conductive member (1660). Additionally, an antenna pattern (e.g., antenna pattern (1086) of FIG. 11d) and / or a protective layer (e.g., protective layer (1188) of FIG. 11d) may be disposed on the shielding layer (1684).

[0173] Although not shown, the non-conductive member (1690) may further include a portion extending to the printed circuit board (1650) to face the chip antenna (1630).

[0174] FIG. 17 is a diagram illustrating a chip antenna according to an embodiment. FIG. 18a illustrates a current distribution of a chip antenna forming a first polarization according to an embodiment. FIG. 18b illustrates a current distribution of a chip antenna forming a second polarization according to an embodiment. The description of the chip antenna (1730) described below can be substantially equally applied to the chip antennas (230, 730, 830, 1030, 1130, 1230, 1530, and 1630) described above.

[0175] Referring to FIG. 17, a chip antenna (1730) according to an embodiment may include a plurality of layers formed of ceramic. The chip antenna (1730) may include a first patch (1720), a feed pad (1710), a ground pad (1740), and a signal line (1750) formed within the plurality of layers. The ground pad (1740) may surround the feed pad (1710). The signal line (1750) may extend from the feed pad (1710) toward the first patch (1720) to transmit an electrical signal transmitted through the feed pad (1710) to the first patch (1720). The location of the first patch (1720), which is powered via the power supply pad (1710) and the signal line (1750), may be offset from the center of the first patch (1720), but is not limited thereto. In one embodiment, the signal line (1750) may include a conductive via.

[0176] In one embodiment, a first side (1730A) of a chip antenna (1730) having a feed pad (1710) and a ground pad (1740) formed thereon may be disposed on a printed circuit board (e.g., printed circuit boards (250, 750, 850, 1050, 1150, 1250, 1550, and 1650)). The feed pad (1710) may be electrically connected to a wireless communication circuit of an electronic device (e.g., a wireless communication module (192) of FIG. 1). The ground pad (1740) may be electrically connected to a ground of the printed circuit board. The first patch (1720) may be located on or under a second side (1730B) of the chip antenna (1730) opposite to the first side (1730A). Alternatively or optionally, the chip antenna (1730) may not include a ground pad (1740).

[0177] In one embodiment, the first patch (1720) may have a rectangular shape including short sides and long sides. In one embodiment, the first patch (1720) may form a first resonant frequency corresponding to the long sides and a second resonant frequency corresponding to the short sides and higher than the first resonant frequency. The first resonant frequency may support, for example, UWB channel 5 having a center frequency of 6489.6 MHz and a bandwidth of 499.2 MHz. The second resonant frequency may support, for example, UWB channel 9 having a center frequency of 7987.2 MHz and a bandwidth of 499.2 MHz.

[0178] Additionally, the chip antenna (1730) may include a second patch (1722) and / or a third patch (1724). The second patch (1722) may be positioned below a first short side of the short sides of the first patch (1720). The second patch (1722) may include one or more conductive patches in one or more layers. The chip antenna (1730) may include one or more conductive vias for connecting the first patch (1720) and the second patch (1722). The third patch (1724) may be positioned below a second short side of the short sides of the first patch (1720). The third patch (1724) may include one or more conductive patches in one or more layers. The chip antenna (1730) may include one or more conductive vias for connecting the first patch (1720) and the third patch (1724). The second patch (1722) and the third patch (1724) may increase the length for forming the resonant frequency of the chip antenna (1730). In one embodiment, the first patch (1720), the second patch (1722), the third patch (1724), the feed pad (1710), the ground pad (1740), and the signal line (1750) may be formed of a conductive material (e.g., copper).

[0179] Referring to FIG. 18a, a strong current (or electric field) may be formed along the long sides of the first patch (1720), and the current may flow in a direction opposite to the direction toward the long sides (e.g., the first direction (11) or the second direction (12)) from the center of the first patch (1720). Accordingly, a signal having a first polarization may be radiated by the first patch (1720). Referring to FIG. 18b, a strong current may be formed along the short sides of the first patch (1720), and the current may flow in a direction toward the short sides (e.g., the third direction (13) perpendicular to the first direction (11) or the fourth direction (14) opposite to the third direction (13)) from the center of the first patch (1720). The current flow of the first patch (1720) of FIG. 18b may be substantially perpendicular to the current flow of the first patch (1720) of FIG. 18a. Accordingly, a signal having a second polarization perpendicular to the first polarization may be radiated by the first patch (1720).

[0180] In a comparative example, instead of the chip antenna (1730), an FPCB antenna including a plurality of conductive patches may be used. However, the chip antenna (1730) may have a smaller area and be less expensive than the FPCB antenna. Although the chip antenna (1730) may be thicker than the FPCB antenna, the height of the chip antenna (1730) may not have a significant effect because there are other components positioned on the printed circuit board (1730) that are taller than the chip antenna (1730).

[0181] An electronic device (e.g., electronic device (101, 200, 1101, 1201, 1501, or 1601)) according to one embodiment comprises a printed circuit board (e.g., printed circuit board (250, 750, 850, 1050, 1150, 1250, 1550, or 1650), a chip antenna (e.g., chip antenna (230, 730, 830, 1030, 1130, 1230, 1530, or 1630)) disposed on the printed circuit board, and a first opening (e.g., first opening (265, 765, 865, 1065, 1165, 1265, 1565, or 1665)) positioned over the chip antenna and aligned with the chip antenna. A printed circuit board may include a portion (e.g., a first portion (761, 861, 1061, 1161, 1261, 1561, or 1661)), a conductive member (e.g., a conductive member (760, 860, 1060, 1160, 1260, 1560, or 1660)) disposed on the printed circuit board, a non-metallic layer (e.g., a non-metallic layer (1082, 1582, or 1682)) disposed on the cover portion to close the first opening, and a shielding layer (e.g., a shielding layer (1084, 1584, or 1684)) disposed on the non-metallic layer. The shielding layer may include a second opening (e.g., an opening (1085)) aligned with the first opening of the cover portion.

[0182] In one embodiment, the cover portion of the conductive member may include a first region (e.g., the first region (R1) of FIG. 15A) and a second region (e.g., the second region (R2) of FIG. 15A), which are divided based on an imaginary line passing through the center of the chip antenna. The size of the first region may be larger than the size of the second region. The size of the first section of the shielding layer disposed on at least a portion of the first region may be larger than the size of the second section of the shielding layer disposed on at least a portion of the second region.

[0183] In one embodiment, the printed circuit board may include a center relative to the virtual line. The center of the chip antenna may be located in a first direction from the center of the printed circuit board.

[0184] In one embodiment, the center of the first opening may be located in the first direction or in a second direction opposite to the first direction from the center of the cover portion.

[0185] In one embodiment, the center of the chip antenna may be substantially aligned with the center of the first opening.

[0186] In one embodiment, the center of the chip antenna may be closer to the center of the printed circuit board than to the center of the first opening.

[0187] In one embodiment, the center of the chip antenna may be further from the center of the printed circuit board than the center of the first opening.

[0188] In one embodiment, the printed circuit board may include a housing (e.g., a frame structure (240) of FIG. 11B) in which the printed circuit board is disposed. The sides of the housing may include a long side (e.g., a second side (247) or a third side (248) of FIG. 11B) and a short side (e.g., a first side (246) of FIG. 11B) connected to the long side. The first direction may be a direction substantially parallel to the short side.

[0189] In one embodiment, the cover portion of the conductive member may include a plurality of openings (e.g., a plurality of openings (1267) of FIG. 12A). The center of each of the plurality of openings may be located in a second direction opposite to the first direction from the center of the chip antenna.

[0190] In one embodiment, the center of each of the plurality of openings may be located on the first region of the cover portion.

[0191] In one embodiment, the non-metallic layer may include sections overlapping the plurality of openings. The shielding layer may include sections overlapping the sections of the non-metallic layer.

[0192] In one embodiment, the electronic device may include a shield can (e.g., shield can (1170) of FIG. 11A) disposed on the printed circuit board. The cover portion of the conductive member may be positioned on the shield can.

[0193] In one embodiment, the shield can may include a sidewall facing the side of the chip antenna (e.g., sidewall (1172) of FIG. 11d).

[0194] In one embodiment, the shielding layer may include an antenna pattern (e.g., antenna pattern (1086) of FIG. 10c) disposed on the shielding layer.

[0195] In one embodiment, the antenna pattern may include a protective layer (e.g., protective layer (1188) of FIG. 11D) disposed on the antenna pattern. The protective layer may include a section overlapping the second opening of the shielding layer.

[0196] In one embodiment, the chip antenna may include a first conductive patch (e.g., a first patch (1720) of FIG. 17), a feed pad (e.g., a feed pad (1710) of FIG. 17) spaced from the first conductive patch and in contact with the printed circuit board, a signal line extending from the feed pad toward the first conductive patch (e.g., a signal line (1750) of FIG. 17), and a ground pad (e.g., a ground pad (1740) of FIG. 17) in contact with the printed circuit board.

[0197] In one embodiment, the first conductive patch may have a rectangular shape including short sides and long sides. The chip antenna may include a second conductive patch (e.g., the second patch (1722) of FIG. 17) positioned between the first conductive patch and the ground pad so as to be aligned with the first short side of the first conductive patch, a first conductive via electrically connecting the first short side of the first conductive patch and the second conductive patch, a third conductive patch (e.g., the third patch (1724) of FIG. 17) positioned between the first conductive patch and the ground pad so as to be aligned with the second short side of the first conductive patch, and a second conductive via electrically connecting the second short side of the first conductive patch and the third conductive patch.

[0198] In one embodiment, the signal line may include a conductive via.

[0199] In one embodiment, the electronic device may include a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1). The wireless communication circuit may be configured to transmit or receive an ultra-wideband antenna (UWB) signal using the chip antenna.

[0200] In one embodiment, the shielding layer may include a ferrite sheet.

[0201] The conductive member may include a portion (e.g., a second portion (762, 862, 1262, or 1562)) extending from the cover portion to the printed circuit board and coupled to the printed circuit board.

[0202] In one embodiment, the conductive member may include a sidewall (e.g., second portion (762, 862, 1262, or 1562)) extending from an outer edge of the cover portion to the printed circuit board. An aperture (e.g., opening (875) of FIG. 8B) may be formed in a portion of the sidewall. The opening may be positioned in the first direction from the chip antenna.

[0203] In one embodiment, the shielding layer may not be disposed on the second region of the cover portion.

[0204] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments disclosed in this document are not limited to the aforementioned devices.

[0205] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0206] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0207] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more commands stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one command among the one or more commands stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one command called. The one or more commands may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0208] According to one embodiment, the method according to various embodiments disclosed in the present document may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0209] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In electronic devices, printed circuit board; A chip antenna arranged on the above printed circuit board; A conductive member, comprising a cover portion positioned over the chip antenna and disposed on the printed circuit board, the cover portion including a first opening aligned with the chip antenna; a non-metallic layer disposed on the cover portion to close the first opening; and comprising a shielding layer disposed on the above non-metallic layer; The shielding layer comprises a second opening aligned with the first opening of the cover portion. Electronic devices.

2. In claim 1, The cover portion of the conductive member includes a first region and a second region, which are distinguished based on a virtual line passing through the center of the chip antenna, The size of the above first region is larger than the size of the above second region, The size of the first section of the shielding layer disposed on at least a portion of the first region is larger than the size of the second section of the shielding layer disposed on at least a portion of the second region. Electronic devices.

3. In claim 2, The above printed circuit board includes a center based on the above virtual line, The center of the chip antenna is located in a first direction from the center of the printed circuit board. Electronic devices.

4. In claim 3, The center of the first opening is located in the first direction or in a second direction opposite to the first direction from the center of the cover portion. Electronic devices.

5. In claim 4, The center of the chip antenna is substantially aligned with the center of the first opening, Electronic devices.

6. In claim 4, The center of the chip antenna is closer to the center of the printed circuit board than the center of the first opening. Electronic devices.

7. In claim 4, The center of the chip antenna is further from the center of the printed circuit board than the center of the first opening. Electronic devices.

8. In any one of claims 3 to 6, comprising a housing in which the printed circuit board is placed; The sides of the above housing include a long side and a short side connected to the long side, The above first direction is a direction substantially parallel to the short side, Electronic devices.

9. In any one of claims 3 to 8, The cover portion of the above-mentioned conductive member comprises a plurality of openings, The center of each of the above plurality of openings is located in a second direction opposite to the first direction from the center of the chip antenna. Electronic devices.

10. In claim 9, The center of each of the above plurality of openings is located on the first area of ​​the cover portion, Electronic devices.

11. In claim 9, The above non-metallic layer includes sections overlapping the plurality of openings, The above shielding layer comprises sections overlapping the sections of the non-metallic layer. Electronic devices.

12. In any one of claims 1 to 11, A shield can is included, which is arranged on the printed circuit board. The cover portion of the above conductive member is positioned on the shield can. Electronic devices.

13. In claim 12, The above shield can includes a side wall facing the side of the chip antenna. Electronic devices.

14. In any one of claims 1 to 13, comprising an antenna pattern disposed on the above shielding layer; Electronic devices.

15. In claim 14, comprising a protective layer disposed on the above antenna pattern; The above protective layer comprises a section overlapping the second opening of the shielding layer. Electronic devices.

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