Selective electroplating and electroless plating apparatus and method

Abstract

The present disclosure relates to an improved selective electroplating and electroless plating apparatus and method for selectively performing electroplating and electroless plating by using one plating apparatus.

Description

Selective electrolytic and electroless plating apparatus and method thereof

[0001] The present invention relates to a selective electrolytic and electroless plating device and method thereof, and more particularly, to a selective electrolytic and electroless plating device and method thereof which are improved to selectively perform electrolytic plating and electroless plating using one plating device and to control metal web tension.

[0002] Lithium-ion secondary batteries are commonly used to power devices such as cell phones, mobile computers, portable music players, and digital cameras. Rolled copper foil or electrolytic copper foil is used as the negative current collector of these lithium-ion secondary batteries. It is important that the copper foil does not cause a battery reaction on its surface, and BTA or chromate treatment, which are inexpensive to manufacture, are commonly used as anti-rust treatments. Furthermore, metal foils plated with a metal film are widely used in various fields, including electronic devices and information and communication devices. Furthermore, chromium (Cr)-plated copper foil is used in batteries such as the lithium-ion secondary batteries to prevent oxidation. To obtain such plated metal foils, electrolytic plating using an anode and cathode is typically employed. However, electrolytic plating requires prolonged immersion of the metal foil in a plating solution until the plating is complete, which requires a long process time and increases plating costs. Furthermore, continuous plating of metal webs is difficult. To solve this problem, it is possible to consider applying an electroless plating method, but in this case, it is difficult to evenly remove the plating solution impregnated into the metal foil using the existing squeegee roller, making it impossible to apply a plating of a uniform thickness, and there is a high possibility of damage to the metal foil, so it is not actually used.

[0003] The present invention was created to solve the above problems, and its purpose is to provide a selective electrolytic and electroless plating device and method that can selectively perform electrolytic plating and electroless plating using one plating device.

[0004] In order to achieve the above object, the selective electrolytic and electroless plating device of the present invention is characterized by including a metal foil generating device including a metal foil drum for generating a metal foil of a metal web; a winding roller for winding the metal web continuously generated from the metal foil generating device; a plating tank containing a plating solution to a predetermined height and having an open upper portion; a dipping roller and a squeezing roller installed so as to be partially submerged in the plating solution in the plating tank and installed facing each other so as to form a squeezing nip at a position higher than the level of the plating solution in the plating tank; an anode (+) electrode member installed in the plating tank and installed so as to be submerged in the plating solution; and a power supply unit provided to supply current to the anode (+) electrode member and the metal web or to cut off the current supply.

[0005] In the present invention, a pressure regulating device is provided connected to the rotational axis of the squeezing roller to regulate pressure between the squeezing roller and the dipping roller, the pressure regulating device comprising: a pressing member installed on the rotational axis of the squeezing roller to pressurize the squeezing roller; an actuator providing a driving force to pressurize the pressing member; a pressure regulating member installed between the actuator and the pressing member to move the shaft of the squeezing roller in the direction of the dipping roller or in the opposite direction according to the driving of the actuator; a load cell installed on the pressing member to transmit an electric signal corresponding to a pressing force applied to the pressing member; A selective electrolytic and electroless plating device is provided, characterized in that it includes an actuator controller that receives an electric signal from the load cell to estimate the pressing force of the squeezing roller, compares the estimated value with a predetermined set value, and drives and controls the actuator so that the pressing force of the squeezing roller is controlled.

[0006] In the present invention, a selective electrolytic and electroless plating device is provided, characterized in that it is provided with a pair of air knives installed on both sides of the metal web coming out of the plating tank and blowing high-temperature air onto the metal web to dry the metal web at a high temperature.

[0007] In the present invention, a selective electrolytic and electroless plating device is provided, which comprises a tension dividing part including a tension dividing roller through which a metal web continuously supplied from the dipping roller and the squeezing roller passes, wherein the tension dividing part comprises: a tension dividing roller through which the metal web passes between the plating tank and the winding roller; a dividing roller rotation operating part that operates the tension dividing roller; and a tension dividing roller shaft that transmits the rotational force of the dividing roller rotation operating part to the tension dividing roller, wherein a close roller groove, which is a groove, is formed on the surface of the tension dividing roller.

[0008] In the present invention, a selective electrolytic and electroless plating device is provided, characterized by including a first tension detection roller that contacts a metal web between the metal foil generating device and the plating tank; a first tension detection sensor that is connected to the first tension detection roller and senses a pressing force by the metal web passing through the first tension detection roller; a second tension detection roller that contacts the metal web between the tension dividing unit and the winding roller; and a second tension detection sensor that is connected to the second tension detection roller and senses a pressing force by the metal web passing through the second tension detection roller.

[0009] In the present invention, a selective electrolytic and electroless plating device is provided, characterized in that it includes a plating device control unit that controls the operation of the plating device, and the plating device control unit analyzes the pressure information of the metal web transmitted from a first tension detection sensor and a second tension detection sensor, and includes a tension analysis module that analyzes the tension of the metal web in a first tension section and a second tension section.

[0010] In the present invention, a selective electrolytic and electroless plating method is provided, characterized by comprising: (a) a step of introducing a metal web of copper foil or metal foil into a plating tank filled with a plating solution to a predetermined height; (b) a step of detecting the metal web introduced into the plating solution of the plating tank; (c) a step of determining whether current is supplied to the metal web and an electrode member in the plating tank; (d) a step of performing electrolytic plating on the surface of the metal web when current is supplied in the step (c); and (e) a step of pressing a squeezing roller so that a squeezing nip is formed between the dipping roller and the squeezing roller through which the metal web passes to perform plating.

[0011] In the present invention, in the step (d), a positive electrode member is installed in the plating tank and is immersed in the plating solution, and current is supplied, and a negative current is supplied to the metal web so that a negative current is passed through the metal web, and in the step (d), a selective electrolytic and electroless plating method is provided, characterized in that the plating thickness of the metal web is controlled by controlling the amount of current supplied to the positive electrode member and the metal web.

[0012] In the present invention, a selective electrolytic and electroless plating method is provided, characterized in that, following the step (e), a step of drying the metal web by blowing high-temperature air from both sides of the metal web on which plating has been performed is further included.

[0013] In the present invention, a selective electrolytic and electroless plating method is provided, characterized in that, in the step (c), a step of performing electroless plating on the surface of the metal web is further included when the current supply is not performed.

[0014] According to an embodiment of the present invention, electrolytic plating and electroless plating can be selectively performed using one plating device.

[0015] In addition, a metal web can be passed through a plating tank filled with a plating solution to form a rust-preventive film through a chemical reaction, and the thickness of the metal foil rust-preventive film can be controlled by controlling the amount of current.

[0016] Therefore, a uniform thin film thickness of an anti-rust film can be formed on the surface of the metal web.

[0017] And, by placing an insoluble positive electrode (+) on both sides of a metal foil in a plating tank filled with a plating solution, and using an actuator composed of a pneumatic regulator and an air cylinder whose pneumatic pressure is controlled through a load cell and an input electric signal, a uniform contact pressure can be formed through feedback pneumatic control according to a set value, thereby controlling the load of the metal web.

[0018] Figure 1 is a schematic diagram showing the overall configuration of a selective electrolytic and electroless plating device according to the present invention.

[0019] Figure 2 is a flowchart sequentially showing the selective electrolytic and electroless plating methods according to the present invention.

[0020] Figure 3 is a schematic diagram showing the overall configuration including the tension dividing section of the selective electrolytic and electroless plating device according to the present invention.

[0021] FIG. 4 is an enlarged view of part A of FIG. 3, and is a detailed enlarged view of a part of the tension dividing roller of the tension dividing unit in the selective electrolytic and electroless plating device according to the present invention.

[0022] FIG. 5 is a perspective view illustrating a tension dividing roller of a tension dividing section in a selective electrolytic and electroless plating device according to the present invention.

[0023] Figure 6 is a control configuration diagram of a selective electrolytic and electroless plating device according to the present invention.

[0024] Hereinafter, a preferred embodiment according to the present invention will be described in detail with reference to the attached drawings.

[0025] FIG. 1 is a schematic diagram showing the overall configuration of a selective electrolytic and electroless plating device (103) according to the present invention. Referring to FIG. 1, the selective electrolytic and electroless plating device (103) according to the present invention includes a plating tank (60) containing a Cr plating solution at a predetermined height (H) and having an open upper portion, and a dipping roller (20) installed so as to be partially submerged in the plating solution in the plating tank (60), but installed facing each other so as to form a squeezing nip (35) at a position higher than the level (H) of the plating solution in the plating tank (60). The plating device (103) includes a squeezing roller (30), and a pressure regulating device that is connected to the rotational shaft of the squeezing roller (30) and regulates the pressure between the squeezing roller (30) and the dipping roller (20). The plating device (103) is installed in the plating tank (60), and includes an anode (+) electrode member (61) installed while being immersed in the plating solution, and a power supply unit (60a) provided to supply a cathode (-) current to the anode (+) electrode member (61) and the metal web (10a) or to cut off the current supply. That is, the squeezing roller (30) is installed while being pressed toward the dipping roller (20) by the squeezing roller (30). In addition, the selective electrolytic and electroless plating device (103) according to the present invention is installed with a guide roller (25) installed in the plating tank (60) to guide the metal web (10a) to be introduced into the plating tank (60) and transferred to the dipping roller (20).

[0026] And the pressure regulating device is configured to include a pressure member (52) installed on the rotational axis of the squeezing roller (30) to pressurize the squeezing roller (30), an actuator (50) that provides a driving force to pressurize the pressure member (52), a pressure regulating member (51) that is installed between the actuator (50) and the pressure member (52) to move the shaft of the squeezing roller (30) in the direction of the dipping roller (20) or the opposite direction according to the driving of the actuator (50), and a load cell (53) that is installed on the pressure member (52) to transmit an electric signal corresponding to the pressing force applied to the pressure member (52). In addition, the pressure control device is equipped with an actuator controller (50a) that receives an electric signal from the load cell (53) to estimate the pressing force of the squeezing roller (30), compares the estimated value with a predetermined setting value, and drives and controls the actuator (50) so that the pressing force of the squeezing roller (30) is controlled.

[0027] And, the selective electrolytic and electroless plating device (103) according to the present invention is provided with a pair of air knives (40) which are installed on both sides of the metal web (10b) coming out of the plating tank (60) and blow high-temperature air onto the metal web (10a) to dry the plated metal web (10a) at a high temperature. In addition, the positive electrode member (61) includes an insoluble positive electrode, and the positive electrode member (61) is arranged on both sides of the metal web (10a).

[0028] In this way, the operation of the selective electrolytic and electroless plating device (103) according to the present invention is explained. First, when electrolytic plating is performed, a current is supplied so that a negative current (-) flows through the metal web (10a) of copper foil or metal foil through the control of the current supply unit (60a), and a current is supplied so that a positive current (+) flows through the insoluble electrode member (61) of the positive electrode (+) placed on both sides of the metal web (10a) in the plating tank (60) filled with the Cr plating solution.

[0029] And by controlling the current amount of the current supply unit (60a), Cr plating of a desired thickness is formed on the metal web (10a). That is, the thickness of the Cr plating can be controlled by controlling the current amount of the current supply unit (60a). In addition, an actuator (50) composed of an electro-pneumatic regulator and an air cylinder that control pneumatic pressure through an electric signal input from the load cell (53) is connected and installed to the squeezing roller (30), so that the pressure of the squeezing nip (35) can be formed uniformly and the load (stress) transmitted to the metal web (10a) can be adjusted through real-time feedback control according to the set value. And, by using the air knife (40), high-temperature air is blown onto both sides of the metal web (10b) that has come out of the plating tank (60) after plating is completed, to dry it.

[0030] In addition, when electroless plating is performed, the metal web (10a) is passed through a plating tank (60) filled with a Cr plating solution without supplying current, and Cr plating is performed through a chemical reaction within the plating tank (60). Then, the pressure of the squeezing roller (30) is adjusted to form a uniform Cr plating thickness. At this time, the pressure is detected through the load cell (53), and the operation of the actuator (50) is controlled to form a uniform pressure in the squeezing nip (35) and adjust the load (stress) transmitted to the metal web (10a) through real-time feedback control according to the set value. Similarly, the metal web (10b) on which plating is completed is dried at high temperature using an air knife (40). Then, as shown in Fig. 1, the metal web (10a) introduced into the plating tank (60) passes through the dipping roller (20) and the squeezing roller (30), and a Cr film (12) is formed on the surface of the metal web (10b).

[0031] The selective electrolytic and electroless plating device (103) according to the present invention, which is provided as described above, performs anti-corrosion plating on both sides of a continuously supplied metal web. To this end, a metal foil generating device (10) including a metal foil drum (101) for generating a metal foil of the metal web is provided, and a winding roller (102) for winding the metal web continuously generated from the metal foil generating device (10) is provided. Accordingly, for this metal web, in the plating device (103) as an intermediate section, a plating tank (60) is provided which is open at the top and contains a plating solution in which the continuously supplied metal web is immersed to a predetermined height, thereby forming a Cr film (12) on both sides of the metal web.

[0032] To this end, a dipping roller (20) is installed so that a portion of the plating solution in the plating tank (60) is submerged, but is installed facing each other on both sides of the plating tank (60) so that a squeezing nip is formed at a position higher than the level of the plating solution in the plating tank (60), and a squeezing roller (30) that rotates with the dipping roller (20) on one side and the metal web in between, so that a plating layer is formed with a thickness of a specified specification by the dipping roller (20) and the squeezing roller (30). In addition, a power supply unit (60a) is included that supplies current to or cuts off current supply to the positive (+) electrode member (61) and the metal web passing continuously in the plating tank (60).

[0033] In addition, as illustrated in FIG. 3, when the dipping roller (20) is driven in the plating device (103), a slimming phenomenon occurs between the dipping roller (20) and the metal web due to the plating solution. To solve this problem, the plating solution is removed with an air knife (40), and the metal web is transferred to a separate roller, a tension dividing roller (71). Accordingly, the metal web is stably transferred from the tension dividing roller (71) from which the plating solution has been removed. As a result, a metal web in good condition without bends or wrinkles can be formed.

[0034] For this purpose, a tension dividing section (70) including a tension dividing roller (71) through which a metal web continuously supplied from the dipping roller (20) and the squeezing roller (30) passes is further provided. Accordingly, by means of this tension dividing section (70), the tension of the metal web can be divided into the first tension section in the metal foil generating device (10) and the plating device (103), and the second tension section, which is the section wound by the winding roller (102). In general, the first tension section can act with a stronger tension because it must pass through a number of rollers for plating.

[0035] And in the winding section, the tension can be applied more weakly, and the tension can be applied differently in both sections according to the necessary situation. In particular, if necessary, by applying the tension differently in the first tension section and the second tension section, it will be possible to prevent cutting or wrinkling of the metal web. That is, in the first tension section, while the metal web of the metal foil is continuously progressing from the metal foil drum (101), Cr plating is performed in the plating tank (60) of the plating device (103), and since it passes through many rollers during this series of processes, it should be pulled with a stronger tension. Therefore, the metal web is pulled by the tension splitting roller (71) by the split roller rotation operating unit (72) including the step motor, etc. Therefore, a stronger tension will be required. In particular, since the situation in which the metal web is pulled by multiple rollers, including the tension dividing roller (71), changes frequently, the tension detected by the first tension detection sensor (82) is analyzed and the tension dividing roller (71) is operated by reflecting the changed tension.

[0036] On the other hand, the second tension section is to wind the metal web on the final winding roller (102), and when it is first wound, it is wound stably by rotating the winding roller (102) at the same rotation speed. On the other hand, as the metal web is continuously wound on the winding roller (102), the thickness of the wound metal web gradually becomes thicker. Therefore, if the rotation speed of the initial winding roller (102) is continued, the metal web may be strongly pulled by the wound radius, which may cause the metal web to be cut. Therefore, the rotation speed of the winding roller (102) should be reduced as much as the metal web becomes thicker by being wound on the winding roller (102). That is, by analyzing the metal web tension of the second tension section detected by the second tension detection sensor (84), the rotation speed of the winding roller (102) is adjusted to reflect the changing tension, and thus the tension of the second tension section can be adjusted to suit the condition.

[0037] As a configuration for this, the tension dividing unit (70) includes a tension dividing roller (71) through which a metal web passes between the plating tank (60) and the winding roller (102), as shown in FIG. 5, a dividing roller rotation operating unit (72) that operates the tension dividing roller (71), and a tension dividing roller shaft (73) that transmits the rotational force of the dividing roller rotation operating unit (72) to the tension dividing roller (71). This dividing roller rotation operating unit (72) is operated by the control of the tension dividing roller operating module (94) of the plating device control unit (90).

[0038] In particular, as illustrated in FIG. 4, the tension dividing roller (71) forms a contact roller groove (711), which is a groove formed on the surface of the tension dividing roller (71). This contact roller groove (711) is intended to allow the metal web to better contact the surface of the tension dividing roller (71). In other words, when a metal web generally passes through a tension dividing roller (71), an air pocket, which is an air layer, may be included between the roller and the metal web, and in this case, a slim phenomenon may occur in the metal web from the roller due to the air pocket. Therefore, by gathering the air pockets in this contact roller groove (711), the roller and the metal web will eventually contact each other, thereby achieving a stable roller operation.

[0039] As an example of the above-mentioned close roller groove (711) for this purpose, it may be formed of at least one groove among a dot-shaped groove, a belt groove, a groove formed with a predetermined length, a longitudinal groove formed parallel to the axial direction of the tension dividing roller (71), a diagonal groove formed diagonally with respect to the axial direction of the tension dividing roller (71), and a zigzag groove, a groove formed in a zigzag direction with respect to the axial direction of the tension dividing roller (71), and more preferably, it may be formed as a longitudinal groove as in FIG. 4.

[0040] Next, as illustrated in FIG. 3, it includes a first tension detection roller (81) that contacts the metal web between the metal foil generating device (10) and the plating tank (60), and a first tension detection sensor (82) that is connected to the first tension detection roller (81) and senses the pressing force caused by the metal web passing through the first tension detection roller (81). It also includes a second tension detection roller (83) that contacts the metal web between the tension dividing unit (70) and the winding roller (102), and a second tension detection sensor (84) that is connected to the second tension detection roller (83) and senses the pressing force caused by the metal web passing through the second tension detection roller (83). The first tension detection sensor (82), the second tension detection sensor (84), etc. are configured as load cells and can detect the pressing force caused by the metal web having tension. Thus, the signals detected by the first tension detection sensor (82) and the second tension detection sensor (84), which are load cells, can be converted into the tension of the metal web.

[0041] In addition, as illustrated in FIG. 6, the plating device control unit (90) for controlling the operation of the plating device (103) and the metal foil generating device (10) is included. In detail, the plating device control unit (90) includes a metal foil drum operating module (91) for driving the metal foil drum (101) of the metal foil generating device (10), and a winding roller operating module (92) for driving the winding roller (102), so that the continuously generated metal web is wound around the winding roller (102). In addition, it includes a squeezing control module (93) for controlling the power supply unit (60a) to operate the actuator (50), and a tension dividing roller operating module (94) for operating the tension dividing roller (71) of the tension dividing unit (70). Accordingly, a Cr film (12), etc. is formed on both sides of the metal web.

[0042] Furthermore, the plating device control unit (90) includes a tension analysis module (96) that analyzes the pressure information of the metal web transmitted from the first tension detection sensor (82) and the second tension detection sensor (84), and analyzes the tension of the metal web in the first tension section and the second tension section. Accordingly, the tension applied to the continuously generated metal web is analyzed to determine whether the tension is too strong or too weak. If the tension applied to the metal web is too strong, the continuously generated metal web may be cut. In addition, if the tension of the metal web is weak, the metal webs may overlap and wrinkles may occur, which may result in defects. Therefore, by sensing the tension for each required section of the continuously generated metal web and comparing it with a predetermined setting value, a high-quality metal web can be obtained.

[0043] Accordingly, the tension analysis module (96) includes a first tension analysis unit (961) that analyzes a sensing signal transmitted from a first tension detection sensor (82) installed in a first tension section between the metal foil generating device (10) and the plating tank (60).

[0044] And it includes a second tension analysis unit (962) that analyzes the sensing signal transmitted from the second tension detection sensor (84) installed in the second tension section between the tension dividing unit (70) and the winding roller (102). In this way, the tension analysis module (96) determines whether the tension of the first tension section and the second tension section are included in the preset tension setting value range for each section, and if the tension sensed for each section is stronger or weaker than the setting value by the plating device control unit (90), it controls the operation of the tension dividing roller (71) of the first tension section or the winding roller (102) of the second tension section.

[0045] The selective electrolytic and electroless plating method according to the present invention is described below using the selective electrolytic and electroless plating device (103) according to the present invention having the above-described configuration and functioning.

[0046] Figure 2 is a flow chart sequentially illustrating the selective electrolytic and electroless plating methods according to the present invention. Referring to Figures 1 and 2, the selective electrolytic and electroless plating methods according to the present invention first introduce a metal web (10a) of copper foil or metal foil into a plating tank (60) filled with a Cr plating solution to a predetermined height (step 110).

[0047] Next, the metal web (10a) introduced into the Cr plating solution in the plating tank (60) is detected (step 120). That is, it is determined whether the metal web (10a) is immersed in the Cr plating solution.

[0048] And it is determined whether current is supplied to the metal web (10a) and the (+) electrode member (61) in the plating tank (60) and the metal web (10a). (Step 130)

[0049] In the above step 130, when current is supplied, Cr electrolytic plating is performed on the surface of the metal web (10a). (Step 140) In the above step 140, a positive (+) current is supplied to the positive (+) electrode member (61) installed on both sides of the metal web (10a) through the power supply unit (60a) while being immersed in the Cr plating solution of the plating tank (60), and a current is supplied to the metal web (10a) so that a negative (-) current is passed through. In addition, in the above step 140, the amount of current supplied to the positive (+) electrode member (61) and the metal web (10a) is controlled to control the plating thickness of the metal web (10a).

[0050] And the squeezing roller (30) is pressed so that a squeezing nip (35) is formed between the dipping roller (20) and the squeezing roller (30) through which the metal web (10a) passes to perform plating. (Step 150) At this time, the pressure is detected through the load cell (53), and the operation of the actuator (50) is controlled to form a uniform pressure in the squeezing nip (35) and adjust the load transmitted to the metal web (10a) through real-time feedback control according to the set value.

[0051] Next, following the step 150, high-temperature air is blown from both sides of the metal web (10b) on which plating has been performed using an air knife (40) to dry the metal web (10a). (Step 160)

[0052] Meanwhile, in the step 130, if no current is supplied, electroless plating is performed on the surface of the metal web (10a). (Step 210) The electroless plating in the step 210 is performed so that plating is performed through a chemical reaction inside the plating tank (60).

[0053] As described above, the present invention has been described with reference to one embodiment illustrated in the drawings. However, this is merely exemplary, and those skilled in the art will understand that various modifications and equivalent embodiments are possible. Therefore, the true scope of protection of the present invention should be determined solely by the appended claims.

Claims

1. A metal foil generating device including a metal foil drum for generating metal foil of a metal web; A winding roller for winding up a metal web continuously generated from the above metal foil generating device; A plating tank containing a plating solution at a predetermined height and having an open top; A dipping roller and a squeezing roller, which are installed so that a portion of the dipping roller is submerged in the plating solution in the plating tank, but are installed facing each other so that the squeezing nip is formed at a position higher than the level of the plating solution in the plating tank; An anode (+) electrode member installed in the above plating tank and immersed in the above plating solution; A selective electrolytic and electroless plating device characterized by including a power supply unit configured to supply current to the positive (+) electrode member and the metal web or to cut off the current supply.

2. In paragraph 1, It includes a pressure regulating device connected to the rotational axis of the squeezing roller to regulate the pressure between the squeezing roller and the dipping roller, The above pressure regulating device, A pressurizing member installed on the rotation axis of the above squeezing roller and pressurizing the above squeezing roller; An actuator providing a driving force for pressurizing the above pressurizing member; A pressure regulating member installed between the actuator and the pressure member to move the shaft of the squeezing roller toward or in the opposite direction of the dipping roller according to the operation of the actuator; A load cell installed on the pressurizing member and transmitting an electric signal corresponding to the pressing force applied to the pressurizing member; A selective electrolytic and electroless plating device characterized by including an actuator controller that receives an electric signal from the load cell to estimate a pressing force of the squeezing roller, compares the estimated value with a predetermined set value, and drives and controls the actuator so that the pressing force of the squeezing roller is controlled.

3. In paragraph 1, A selective electrolytic and electroless plating device characterized by having a pair of air knives installed on both sides of the metal web coming out of the plating tank and blowing high-temperature air onto the metal web to dry the metal web at a high temperature.

4. In paragraph 1, A tension dividing section including a tension dividing roller through which a metal web continuously supplied from the above dipping roller and squeezing roller passes, The above tension dividing section, A tension dividing roller through which a metal web passes between the above plating tank and the winding roller; A split roller rotation operating unit that operates the above tension split roller; and It includes a tension split roller shaft that transmits the rotational force of the above split roller rotating operation unit to the tension split roller, A selective electrolytic and electroless plating device characterized in that a grooved, close roller groove is formed on the surface of the tension dividing roller.

5. In paragraph 1, A first tension-detecting roller that contacts the metal web between the metal foil generating device and the plating tank; A first tension detection sensor connected to the first tension detection roller and sensing a pressure applied by a metal web passing over the first tension detection roller; A second tension-detecting roller with which the metal web is in contact between the tension divider and the winding roller; and A selective electrolytic and electroless plating apparatus characterized by including a second tension detection sensor connected to the second tension detection roller and sensing a pressing force caused by a metal web passing over the second tension detection roller.

6. In paragraph 5, A plating device control unit for controlling the operation of the plating device is included. A selective electrolytic and electroless plating device, characterized in that the plating device control unit includes a tension analysis module that analyzes the pressure information of the metal web transmitted from the first tension detection sensor and the second tension detection sensor, and analyzes the tension of the metal web in the first tension section and the second tension section. 7.(a) A step of introducing a metal web of copper foil or metal foil into a plating tank filled with a plating solution to a predetermined height; (b) a step of detecting the metal web introduced into the plating solution of the plating tank; (c) a step of determining whether current is supplied to the metal web and the electrode member in the plating tank; (d) a step of performing electrolytic plating on the surface of the metal web when current is supplied in the step (c); (e) a step of pressing the squeezing roller so that a squeezing nip is formed between the dipping roller and the squeezing roller through which the metal web passes and plating is performed; A selective electrolytic and electroless plating method characterized by comprising the step of; 8. In paragraph 7, In the above step (d), the plating tank is immersed in the plating solution and an anode (+) electrode member is installed and current is supplied, and a cathode (-) current is supplied to the metal web. A selective electrolytic and electroless plating method, characterized in that in the step (d), the plating thickness of the metal web is controlled by controlling the amount of current supplied to the positive (+) electrode member and the metal web.

9. In paragraph 7, A selective electrolytic and electroless plating method characterized in that, following the above step (e), it further includes a step of drying the metal web by blowing high-temperature air on both sides of the metal web on which plating has been performed.

10. In paragraph 7, A selective electrolytic and electroless plating method characterized in that, in the step (c) above, a step of performing electroless plating on the surface of the metal web is further included.

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