Integrated temperature and pressure sensor

Abstract

An integrated temperature and pressure sensor, relating to the technical field of sensors. The integrated sensor comprises: a connecting member (1); a metal tube (2) having a cavity (21), wherein an open end of the cavity (21) of the metal tube (2) is connected to the connecting member (1), and the other end of the metal tube (2) away from the open end of the cavity (21) is provided with a first channel (22) and a second channel (23); a carrier member (4) having an accommodating cavity (41), wherein the carrier member (4) is arranged in the cavity (21), and the bottom of the carrier member (4) is provided with a third channel (43) communicated with the second channel (23); a protective tube (3), wherein the protective tube (3) has one end located in the first channel (22) and the other end extending out of the first channel (22); a temperature sensing member (5) disposed in the protective tube (3); a pressure sensing member (6) disposed in the accommodating cavity (41), wherein the pressure sensing member (6) is located on the third channel (43); and a circuit board (7).

Description

A temperature and pressure integrated sensor

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on January 5, 2024, with application number 202410020702.X and invention name “A Temperature and Pressure Integrated Sensor”, the entire contents of which are incorporated by reference into the application. Technical Field

[0002] The present application relates to the field of sensor technology, and in particular to an integrated temperature and pressure sensor. Background Art

[0003] With the increasing popularity of new energy vehicles, demands for electric vehicle range continue to rise, making the power consumption of thermal management systems particularly important. In new energy vehicle thermal management systems, precise control of the opening of the electromagnetic expansion valve requires timely measurement of the medium pressure and temperature before and after the expansion valve. In existing temperature and pressure sensors, the thermistor is exposed to the medium. While direct contact of the temperature signal with the medium significantly improves temperature response time, it also reduces reliability. Furthermore, the inevitable presence of conductive fibers (such as residual fibers from metal parts and iron filings) in the detection pipeline can easily cause the temperature signal to short-circuit as it circulates in the medium. Products currently available with encapsulated thermistors also face the challenge of transmitting the temperature signal through the pressure-sensing unit to the electrical processing unit.

[0004] Currently, either the thermistor and its carrier are integrally injection-molded, resulting in higher system costs. The plastic housing also hinders heat transfer between the medium and the thermistor's sensitive tip, leading to lower accuracy and longer response times for integrated temperature and pressure sensors. Alternatively, the thermistor is connected to a flexible printed circuit board, with the long flexible circuit board bypassing the pressure-sensing device along the sidewall to reach the electrical processing unit. This not only complicates the process, increases production costs, but also reduces product reliability.

[0005] In addition, the sensing channels of the integrated pressure and temperature sensors in the prior art mostly adopt an eccentric design, which leads to a problem of high production costs. Technical issues

[0006] The purpose of this application is to overcome the defects of the prior art and provide a temperature and pressure integrated sensor to improve the problems of high cost and low reliability of the integrated pressure and temperature sensors in the prior art. Technical Solutions

[0007] To achieve the above and other objectives, the present application is implemented by the following technical solutions: The present application provides a temperature and pressure integrated sensor, comprising: a connecting piece; a metal tube having a cavity, wherein the cavity opening end of the metal tube is connected to the connecting piece, and the metal tube is provided with a first channel and a second channel connected to the cavity and independent of each other at the other end away from the cavity opening end; a carrier having a receiving cavity, wherein the carrier is provided in the cavity, and a third channel connected to the second channel is provided at the bottom of the carrier, wherein the third channel is connected to the receiving cavity; a protective tube, wherein one end of the protective tube is located in the first channel and the other end of the protective tube extends out of the first channel; a temperature sensor disposed in the protective tube; a pressure sensor disposed in the receiving cavity, wherein the pressure sensor is located on the third channel;

[0008] and a circuit board placed in the cavity, one end of the circuit board being electrically connected to the connector, and the other end of the circuit board being electrically connected to the temperature sensor and the pressure sensor, wherein the electrical connection route between the temperature sensor and the circuit board passes through the first channel and then through the carrier;

[0009] The carrier component is provided with a first groove and a second groove on the end face that cooperates with the bottom of the cavity, the second groove is located outside the first groove, the first groove and the second groove are arranged on the bottom wall of the carrier component or at the bottom of the cavity, and the first sealing ring and the second sealing ring are respectively arranged in the first groove and the second groove, and the second channel is located between the first groove and the second groove.

[0010] In some embodiments, a gap is reserved on the end surfaces of the carrier and the bottom of the metal tube cavity, the gap is located between the first groove and the second groove, and the gap is connected to the second channel and the third channel.

[0011] In some embodiments, a positioning post extends from the bottom wall of the carrier component, and the positioning post is at least partially located in the first channel.

[0012] In some embodiments, the first sealing ring abuts against or does not abut against the positioning post on a side close to the first channel.

[0013] In some embodiments, the first groove and the second groove are located at the bottom of the metal tube cavity, the width of the first groove is smaller than the width of the second groove, and a sealing edge is provided on the periphery of the positioning column, forming a sealing surface between the sealing edge and the first sealing ring.

[0014] In some embodiments, a third groove and a fourth groove are provided at the bottom of the accommodating cavity, the fourth groove is located outside the third groove, a third sealing ring is provided in the fourth groove, and the third groove is connected to the third channel.

[0015] In some embodiments, the pressure sensing element is located on the third sealing ring, and the circuit board is located on the pressure sensing element.

[0016] In some embodiments, a flange is provided on the outer wall of the protection tube, and a stepped notch is provided at an end of the first channel away from the cavity, and the stepped notch and the flange form a sealing surface.

[0017] In some embodiments, the temperature sensor is connected to the circuit board via a first conductive member, one end of the first conductive member is located in the first channel, and the other end of the first conductive member passes through the carrier member and out of the side wall of the accommodating cavity to connect to the circuit board.

[0018] In some embodiments, the connecting member and the carrier member are snap-connected, a snap-fit ​​member is provided on the outer side wall of the carrier member, a fastener is provided on the connecting member, and the fastener is snapped into the snap-fit ​​member to form a snap-fit ​​connection.

[0019] In some embodiments, the clamping member includes a clamping slot and a clamping point provided on the outer side wall of the carrier member, the clamping point is located on the inner side wall of the clamping slot, the fastener includes a buckle rod and a buckle hook, the buckle rod extends into the clamping slot, and the buckle hook hooks the clamping point to form a buckle connection.

[0020] In some embodiments, the pressure sensing element is a circular pressure sensing element.

[0021] In some embodiments, the clamping member and the fastener include two clamping members and two fasteners, and the two clamping members and the two fasteners are symmetrically distributed on both sides of the connection end between the first conductive member and the circuit board.

[0022] In some embodiments, the first conductive component and the carrier component are integrally formed.

[0023] In some embodiments, the first groove, the second groove, the third groove, the fourth groove and the first channel have the same axis. Beneficial effects

[0024] The present application provides a temperature and pressure integrated sensor. Compared with the existing technology, the present application has the following beneficial effects: the thermistor is wrapped in a thin-walled metal structure through thermally conductive adhesive, which protects the thermistor while maximizing its response time. At the same time, the temperature signal is passed through the pressure-sensing device through the carrier component, ensuring the independence of the temperature sensing path and the pressure sensing path. It not only retains the reliability advantages of the current single-temperature product, but also optimizes the assembly process to the maximum extent, thereby improving reliability and reducing system costs. In some embodiments, except for the pressure sensing channel hole, the remaining features on the metal tube and the carrier component adopt a centrally symmetrical design. Compared with the eccentric structure design of the sensor in the existing technology, it can significantly reduce the manufacturing cost of parts while ensuring structural and functional reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] FIG1 is a schematic diagram showing the overall structure of the integrated sensor of the present application;

[0026] FIG2 is a front cross-sectional view of the integrated sensor of the present application;

[0027] FIG3 is a schematic diagram showing the structure of the metal tube of the present application;

[0028] FIG4 is a schematic structural diagram of a carrier member of the present application;

[0029] FIG5 is a schematic diagram showing the bottom wall structure of the carrier member of the present application;

[0030] FIG6 is a schematic structural diagram of the connector of the present application;

[0031] FIG7 shows an exploded view of a portion of the structure of the present application;

[0032] FIG8 is a side cross-sectional view of the integrated sensor of the present application;

[0033] FIG9 is a diagram showing the electrical connection relationship of the sensor of the present application;

[0034] FIG10 is a cross-sectional view of an integrated sensor according to an embodiment of the present application;

[0035] FIG11 is a cross-sectional view of an integrated sensor according to an embodiment of the present application;

[0036] FIG12 is a cross-sectional view of an integrated sensor according to an embodiment of the present application;

[0037] FIG13 is a cross-sectional view of an integrated sensor according to an embodiment of the present application;

[0038] FIG14 is a schematic structural diagram of the bottom wall of the carrier member in FIG13 ;

[0039] FIG15 is a cross-sectional view of an integrated sensor according to an embodiment of the present application.

[0040] In the figure: 1-connecting part, 2-metal tube, 3-protective tube, 4-carrier, 5-temperature sensor, 6-pressure sensor, 7-circuit board, A-second conductive part, B-connecting line, C-first conductive part, S1-first sealing ring, S2-second sealing ring, S3-third sealing ring, S4-fourth sealing ring, 11-through hole, 12-fastener, 12a-fastener rod, 12b-fastener hook, 21-cavity, 22-cavity groove, G1-first groove, G 2-second groove, 22-first channel, 22a-stepped notch, 23-second channel, 23a-first passage, 23b-second passage, 31-flange, 42-accommodating cavity groove, 42a-third groove, 42b-fourth groove, 43-third channel, 44-positioning column, 45-clamp, 45a-clamping slot, 45b-clamping point, 46-sealing edge, 51-thermal conductive adhesive, 61-pressure-sensitive thick plate, 62-pressure-sensitive thin plate, 63-lead-out terminal. Modes for Carrying Out the Invention

[0041] Please refer to Figures 1 to 15. The following describes the embodiments of the present application through specific examples. Those skilled in the art will readily understand the other advantages and benefits of the present application from the disclosure herein. The present application may also be implemented or applied through various other specific embodiments, and the details in this specification may be modified or altered based on different viewpoints and applications without departing from the spirit of the present application.

[0042] As shown in Figure 1, the present application provides a temperature and pressure integrated sensor, which is a sensor that can measure pressure and temperature at the same time. The integrated sensor includes a connector 1, which can electrically connect the sensor to a monitoring and reading device such as a computer. The structure of the connector 1 is not fixed and can be made into various shapes according to needs.

[0043] As shown in FIG2 , the integrated sensor includes a metal tube 2 , which may be an aluminum metal tube.

[0044] As shown in Figures 2 and 3, the metal tube 2 has a cavity 21. The open end of the metal tube cavity 21 can be connected to one end of the connector 1. The other end of the metal tube 2, away from the open end, is provided with a first channel 22 and a second channel 23 that communicate with the cavity 21. The first channel 22 and the second channel 23 are independent of each other. The first channel 22 is a temperature sensing channel, and the second channel 23 is a pressure sensing channel. The first channel 22 can be located in the center of the protective tube 3, and the second channel 23 is located to one side of the first channel 22.

[0045] As shown in Figures 2 and 3, a protective tube 3 is provided at the end of the first channel 22 away from the cavity 21. One end of the protective tube 3 is arranged in the first channel 22, and the other end of the protective tube 3 extends a certain distance out of the first channel 22 to sense the temperature of the detection medium. The protective tube 3 can be made of stainless steel.

[0046] As shown in Figure 2, a temperature sensor 5 is provided inside the protective tube 3. The temperature sensor 5 can be a thermistor or an NTC thermistor. A thermal conductive adhesive 51 is also provided between the temperature sensor 5 and the protective tube 3. The thermal conductive adhesive 51 can be a thermal conductive adhesive made of silicone or epoxy. The temperature sensor 5 is wrapped in the protective tube 3 so that the temperature sensor 5 does not directly contact the measured medium, thereby preventing short circuits caused by conductive impurities in the medium and ensuring its service life and reliability. The filled thermal conductive adhesive 51 can also greatly improve the response speed of the temperature sensor and also play a role in positioning and protecting the thermistor. The wall thickness of the protective tube 3 can be 0.05-1mm, for example 0.08mm, 0.5mm, etc. The protective tube 3 and the metal tube 2 are manufactured separately. The size of the protective tube can be flexibly adjusted to match thermistors with different wire lengths to meet customer needs for different products and reduce manufacturing costs.

[0047] As shown in Figures 2 and 7 , the hardness of the protective tube 3 and the metal tube 2 can be different. The protective tube 3 can be made of stainless steel, such as 430 stainless steel, which has good thermal conductivity, and the hardness of the protective tube 3 can be greater than that of the metal tube 2. The bottom end of the first passage 22 is provided with a stepped notch 22a that matches the protective tube 3. The outer wall of the protective tube 3 is provided with a flange 31. The flange 31 and the stepped notch 22a are formed by interference compression to form a sealing surface, thereby sealing the first passage 22. The interference compression can be achieved by a riveting process.

[0048] As shown in Figures 2 and 3, the carrier member 4 has a first groove G1 and a second groove G2 on its end surface that mates with the bottom of the cavity 21. The second groove G2 is located outside the first groove G1. The first groove G1 and the second groove G2 are arranged on the bottom wall of the carrier member 4 or on the bottom of the cavity 21. The axis of the first groove G1, the second groove G2, and the first channel 22 can be the same to reduce processing costs.

[0049] In one embodiment, the first groove G1 and the second groove G2 are disposed at the bottom of the cavity 21 .

[0050] As shown in Figures 2 and 3, a groove is provided at the bottom of the cavity 21, and the groove includes a first groove G1 and a second groove G2. The first groove G1 is connected to the first channel 22, and a first sealing ring S1 is provided in the first groove G1. A second sealing ring S2 is provided in the second groove G2. The second channel 23 is provided between the first groove G1 and the second groove G2. The first sealing ring S1 and the second sealing ring S2 can cooperate to prevent the measuring medium from entering the sensor through the second channel 23 and damaging the electrical components of the sensor.

[0051] As shown in FIG2 and FIG3 , a gap O is reserved between the bottom wall of the carrier member 2 and the metal tube cavity 21 . The gap O is located between the first groove G1 and the second groove G2 . The gap O communicates with the second channel 23 and the third channel 43 .

[0052] As shown in Figures 2 and 3, a gap O is formed between the side wall between the first groove G1 and the second groove G2 and the metal tube cavity 21. This allows the carrier member 4 to be directly placed into the cavity 21 when assembling the metal tube 2. This avoids the problem of having to align the holes of the second channel 23 to connect the second channel 23 and the third channel 43 during installation, thereby improving installation efficiency.

[0053] As shown in Figures 2, 3 and 4, the sensor includes a carrier member 4, which is disposed in the cavity 21 of the metal tube 2 and includes an accommodating cavity 41. An accommodating cavity groove 42 is disposed in the accommodating cavity 41, and the accommodating cavity groove 42 includes a third groove 42a and a fourth groove 42b. The fourth groove 42b is disposed around the third groove 42a, and a third sealing ring S3 is disposed in the fourth groove 42b. A third channel 43 communicating with the second channel 23 is disposed at the bottom of the carrier member 4, and the third groove 42a is communicated with the third channel 43. The first sealing ring S1 and the second sealing ring S2 can jointly form a sealing surface on both sides of the connection between the second channel 23 and the third channel 43 to prevent the detection medium from entering the interior of the sensor.

[0054] The first groove G1 , the second groove G2 , the third groove 42 a , the fourth groove 42 b and the first channel 22 may have the same axis.

[0055] As shown in Figures 2 and 5, the carrier member 4 is provided with a positioning post 44 on the bottom wall away from the accommodating cavity 41 to facilitate installation and positioning. The positioning post 44 can be located at the center of the carrier member 4. During installation, the positioning post 44 can be at least partially located within the first channel 22 to install the positioning post 44 in the cavity 21. One side of the first sealing ring S1 can be in contact with the positioning post 44.

[0056] By setting the third groove 42a and the fourth groove 42b, the present application can stabilize the third sealing ring S3, and prevent the third sealing ring S3 from being sucked inward when there is negative pressure in the detection pipeline, thereby causing pressure to be pressed on the pressure-sensitive area of ​​the pressure-sensitive sensor 6, causing pressure perception errors, or exposing the third channel 43 to cause leakage.

[0057] As shown in Figures 2, 4, and 7, a pressure sensor 6 is also provided within the accommodating cavity 41. The pressure sensor 6 is located on the third channel 43. The pressure of the medium in the second channel 23 is sensed by the pressure sensor 6 as it passes through the third channel 43. The pressure sensor 6 can be a ceramic pressure-sensitive core, such as a ceramic resistor, a ceramic capacitor, or a pressure-sensitive IC connected to a ceramic substrate. The pressure sensor can include a thin pressure-sensitive plate 62 and a thick pressure-sensitive plate 61. The thick pressure-sensitive plate 61 can be located on the thin pressure-sensitive plate 62. The thin pressure-sensitive plate 62 and the thick pressure-sensitive plate 61 can be connected together. The thin pressure-sensitive plate 62 deforms under pressure, and after deformation and connection to the circuit board 7, a pressure signal is output. The cross-section of the pressure sensor 6 can be rectangular, circular, or other shapes, but is not limited thereto. The top of the sidewall of the third recess 42a and the pressure sensor 6 can be free from contact to prevent contact with the pressure-sensitive area of ​​the pressure sensor, which could affect the accuracy of the pressure data.

[0058] As shown in Figures 2, 7, 8, and 9, a circuit board 7 is further disposed within the cavity 21. The circuit board 7 may be a flexible circuit board and is disposed on the pressure sensor 6. One end of the circuit board 7 is electrically connected to the second conductive member A in the connector 1, and the other end of the circuit board 7 is electrically connected to both the pressure sensor 6 and the first conductive member C in the first channel 22. The pressure sensor 6 is connected to the circuit board 7 via a lead terminal 63.

[0059] As shown in Figures 2 and 6, the circuit board 7 and the connector 1 are electrically connected. In some embodiments, the connector 1 is provided with a through hole 11 at one end close to the metal tube 2. A second conductive member A can be provided in the through hole 11. The second conductive member A can be used to output the signal collected by the circuit board 7 to the outside.

[0060] As shown in Figures 4, 5 and 7, in order to connect the connecting member 1 and the carrier member 4 together, in some embodiments, a clamping member 45 is provided on the outer wall of the carrier member 4, and the clamping member 45 includes a clamping slot 45a and a clamping point 45b, and the inner wall of the clamping slot 45a is provided with a clamping point 45b. Correspondingly, a fastener 12 is provided at the bottom end of the connecting member 1, and the fastener 12 is clamped with the clamping member 45. The fastener 12 extends a distance from the bottom end of the connecting member 1, and the fastener 12 includes a clamping rod 12a and a hook 12b. The hook 12b is located at the bottom of the clamping rod 12a. When the connecting member 1 and the carrier member 4 are connected, the fastener 12 is inserted into the clamping member 45, and the hook 12b hooks the clamping point 45b to complete the clamping connection between the connecting member 1 and the carrier member 4. The clamping member 45 and the fastener 12 each include two clamping members 45 and two fasteners 12 symmetrically distributed on both sides of the connection end between the first conductive member C and the circuit board 7 .

[0061] As shown in FIG. 2 and FIG. 7 , the temperature sensing element 5 and the circuit board 7 may be electrically connected, and the temperature sensing element 5 and the circuit board 7 may be connected via a connecting wire B and a first conductive element C.

[0062] As shown in Figures 2, 6, and 7, one end of the first conductive member C is connected to the connecting wire B, and the other end of the first conductive member C passes through the carrier member 4 and is connected to the circuit board 7. The connecting wire B is connected to the temperature sensing member 5. The connecting wires B may be two connecting wires, and the first conductive members C may be two symmetrically arranged conductive members. The first conductive members C can pass through the first channel 22 and the carrier member 4 before being connected to the circuit board 7. They are symmetrically distributed at both ends of the pressure sensing member 6. The first conductive members C can pass through the first channel 22, that is, can be located on one side of the second channel 23 and the third channel 43 in the pressure sensing route. This effectively separates the temperature sensing route from the pressure sensing route. The structure adopted in this application allows the pressure sensing route to completely bypass the temperature sensing route, allowing the two channels to connect to the circuit board 7 through their own routes without affecting each other.

[0063] As shown in Figures 6 and 7, one end of the first conductive component C is located in the first channel 22, and the other end of the first conductive component C is bent and extended in the carrier component 4 along the horizontal and vertical directions of the pressure sensing component 6. The first conductive component C and the carrier component 4 can be formed as one piece.

[0064] As shown in FIG. 2 , FIG. 8 and FIG. 9 , the connection end of the first conductive member C and the circuit board 7 passes through the side wall of the accommodating cavity 41 and is connected to the circuit board 7 .

[0065] As shown in FIG10 , in some embodiments, the first groove G1 and the second groove G2 can be provided on the bottom wall of the carrier member 4, which can further reduce production costs. For example, the first groove G1 can be provided around the periphery of the positioning post 44, and a gap O can be left between the bottom wall of the carrier member 4 and the metal tube cavity 21.

[0066] As shown in FIG11 , in some embodiments, the first groove G1 can be provided on the bottom wall of the carrier member 4, the second groove G2 can be provided at the bottom of the metal tube cavity 21, and the first groove G1 can be provided around the periphery of the positioning post 44. The sidewall height of the second groove G2 on the side close to the first channel 22 is smaller than the sidewall height away from the first channel 22, thereby facilitating the formation of the gap O between the cavity 21 and the bottom wall of the carrier member 4.

[0067] As shown in Figure 12, in some embodiments, the first groove G1 can be set at the bottom of the metal tube cavity 21, and the second groove G2 can be set on the bottom wall of the carrier part 4. The first groove G1 is connected to the first channel 22, and the side wall height of the second groove G2 close to the first channel 22 is smaller than the side wall of the second groove G2 away from the first channel 22 to form the gap O.

[0068] As shown in Figures 13 and 14, in some embodiments, the first groove G1 and the second groove G2 can be located at the bottom of the metal tube cavity 21, and the width of the first groove G1 is smaller than the width of the second groove G2, so that a gap O can be formed between the bottom wall of the carrier member 4 and the cavity 21, and a sealing edge 46 can be further provided on the periphery of the positioning column 44, and the sealing edge 46 can cooperate with the first sealing ring S1 to form a sealing surface.

[0069] As shown in Figure 13, the third channel 43 can form an angle with the second channel 23, that is, the structure of the third channel 43 is not restricted. The specific structure includes an inclined state or a vertical state relative to the second channel 23, but is not limited to this, as long as it can maintain communication with the second 23 channels.

[0070] As shown in Figure 15, in some embodiments, the first sealing ring S1 may not be against the positioning column 44. At this time, the space of the second channel 23 is subject to certain restrictions. The second channel 23 may include a first passage 23a and a second passage 23b that are connected and axially offset. The second passage is arranged at one end close to the gap O.

[0071] In the present application, the first sealing ring S1 may or may not be in contact with the positioning post 44 on the side close to the first channel 22 , as long as a sealing surface can be formed.

[0072] As shown in Figures 2 and 7, the assembly process of the present application is exemplified as follows. When assembling the sensor described in the present application, the carrier member 4 and the connector 1 can be snap-connected first, and then the entire body can be placed in the metal tube 2. Finally, the upper edge of the metal tube 2 can be bent to achieve riveting with the connector 1 and the carrier member 4. Finally, room temperature vulcanized silicone rubber adhesive is evenly applied to the bend and cured at room temperature to form a fourth sealing ring S4. The first conductive member C and the carrier member 4 of the present application can be integrally formed by an embedded injection molding process.

[0073] Therefore, the present application effectively overcomes the various shortcomings of the prior art and has a high industrial application value. The above embodiments are merely illustrative of the principles and effects of the present application and are not intended to limit the present application. Anyone familiar with the technology may modify or alter the above embodiments without departing from the spirit and scope of the present application. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical ideas disclosed in the present application shall still be covered by the claims of the present application.

Claims

1. A temperature and pressure integrated sensor, wherein, The integrated sensor comprises: Connectors; A metal tube having a cavity, wherein an opening end of the cavity of the metal tube is connected to the connecting piece, and the metal tube is provided with a first channel and a second channel connected to the cavity and independent of each other at the other end away from the opening end of the cavity; A carrier member having a receiving cavity, wherein the carrier member is disposed in the cavity, and a third channel communicating with the second channel is disposed at the bottom of the carrier member, wherein the third channel is connected with the receiving cavity; a protection tube, one end of which is located in the first channel and the other end of which extends out of the first channel; A temperature sensor is placed in the protection tube; A pressure sensor is placed in the accommodating cavity, and the pressure sensor is located on the third channel; as well as A circuit board is placed in the cavity, one end of the circuit board is electrically connected to the connecting member, the other end of the circuit board is electrically connected to the temperature sensor and the pressure sensor, and the electrical connection route between the temperature sensor and the circuit board passes through the first channel and then penetrates the carrier member; The carrier component is provided with a first groove and a second groove on the end face that cooperates with the bottom of the cavity, the second groove is located outside the first groove, the first groove and the second groove are arranged on the bottom wall of the carrier component or at the bottom of the cavity, the first groove and the second groove are respectively provided with a first sealing ring and a second sealing ring, and the second channel is located between the first groove and the second groove.

2. The integrated sensor according to claim 1, wherein, A gap is reserved on the matching end surfaces of the carrier component and the bottom of the metal tube cavity, the gap is located between the first groove and the second groove, and the gap is communicated with the second channel and the third channel.

3. The integrated sensor according to claim 1, wherein A positioning column extends from the bottom wall of the carrier component, and the positioning column is at least partially located in the first channel.

4. The integrated sensor according to claim 3, wherein, The first sealing ring abuts against or does not abut against the positioning column at a side close to the first channel.

5. The integrated sensor according to claim 1, wherein, The bottom of the accommodating cavity is provided with a third groove and a fourth groove, the fourth groove is located at the periphery of the third groove, a third sealing ring is provided in the fourth groove, and the third groove is communicated with the third channel.

6. The integrated sensor according to claim 5, wherein, The pressure sensing element is located on the third sealing ring, and the circuit board is located on the pressure sensing element.

7. The integrated sensor according to claim 1, wherein, A flange is arranged on the outer wall of the protection tube, and a stepped notch is arranged at one end of the first channel away from the cavity, wherein the stepped notch and the flange form a sealing surface.

8. The integrated sensor according to claim 1, wherein, The temperature sensor is connected to the circuit board via a first conductive member, one end of the first conductive member is located in the first channel, and the other end of the first conductive member penetrates the carrier member and passes through the side wall of the accommodating cavity to be connected to the circuit board.

9. The integrated sensor according to claim 1, wherein, The connecting member and the carrier member are snap-connected, a clamping member is arranged on the outer side wall of the carrier member, a fastener is arranged on the connecting member, and the fastener is snapped into the clamping member to form a snap-connection.

10. The integrated sensor according to claim 9, wherein, The card member includes a card slot and a clamping point provided on the outer side wall of the carrier member. The clamping point is located on the inner side wall of the card slot. The fastening member includes a fastening rod and a fastening hook. The fastening rod extends into the card slot, and the fastening hook hooks the clamping point to form a snap connection.

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