Heat dissipation assembly and terminal device

Abstract

The present application relates to the technical field of electronic devices, and provides a heat dissipation assembly and a terminal device, which aim to solve the problem of poor heat dissipation performance of terminal devices. The heat dissipation assembly provided by the present application comprises a throttling member, a heat dissipation member and an air source; the throttling member comprises a plurality of through holes, a first end of each through hole penetrating through a first surface of the throttling member, and a second end of each through hole penetrating through a second surface of the throttling member; the heat dissipation member comprises a heat conduction surface and a heat dissipation surface which face away from each other, the heat conduction surface being used to be in heat conduction fit with a device to be heat-dissipated, and the heat dissipation surface and the second surface being oppositely disposed; the air source is used for generating airflows flowing through the plurality of through holes, the airflows flowing from the first end to the second end of each through hole, and the diameter of each through hole being smaller than or equal to 1 mm. In the present heat dissipation assembly, the heat conduction surface of the heat dissipation member can be in heat conduction fit with a device to be heat-dissipated, and airflows generated by the air source are blown toward the heat dissipation surface after passing through the through holes of the throttling member, so as to take away the heat of the heat dissipation member, thus achieving cooling of the device to be heat-dissipated.

Description

Heat dissipation component and terminal device

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office of the People's Republic of China on January 4, 2024, with application number 202410015107.7 and application name "A heat dissipation component and terminal device", the entire contents of which are incorporated by reference into this application. Technical Field

[0003] The present application relates to the technical field of electronic equipment, and in particular to a heat dissipation component and a terminal device. Background Art

[0004] As terminal device performance continues to improve, the operating power consumption and heat generation of terminal devices have also increased significantly. Therefore, in order to ensure the operating performance and safety of terminal devices, terminal devices need to be cooled. In current terminal devices, passive cooling is generally adopted. Taking mobile phones as an example, the chip in the mobile phone is one of the main components that generates a lot of heat. Materials with high thermal conductivity, such as graphene, are usually used to transfer the heat from the chip to the phone's casing, and then dissipate it to the outside world through the casing, thereby achieving heat dissipation of the chip. In actual applications, in order to meet the demand for better portability, the terminal device will be relatively small in size, resulting in a small heat dissipation area, which can no longer meet the increasing heat dissipation demand. Therefore, how to improve the heat dissipation performance of terminal devices has become a technical problem that needs to be solved urgently.

[0005] Summary of the Invention

[0006] The present application provides a heat dissipation component and a terminal device with good heat dissipation performance.

[0007] In the first aspect, the present application provides a heat dissipation component, comprising a throttle, a heat sink and an air source. The throttle comprises a plurality of through holes, the first end of each through hole extending through the first surface of the throttle, and the second end of each through hole extending through the second surface of the throttle. The heat sink comprises a heat-conducting surface and a heat-dissipating surface which are opposed to each other, the heat-conducting surface being used to thermally fit with the device to be dissipated, and the heat-dissipating surface being arranged opposite to the second surface. The air source is used to generate an airflow flowing through the plurality of through holes, the airflow flowing from the first end to the second end of each through hole, and the diameter of each through hole is less than or equal to 1 mm. In the heat dissipation component provided in the present application, the heat-conducting surface of the heat sink can be thermally fit with the device to be dissipated, so that the heat of the device to be dissipated can be transferred to the heat sink by heat transfer. The airflow generated by the air source blows toward the heat-dissipating surface after passing through the through hole of the throttle, thereby taking away the heat of the heat sink, so as to achieve cooling of the device to be dissipated. Among them, the diameter of each through hole in the throttling element is less than or equal to 1mm, so that the air flow has a higher flow speed after flowing through the through hole, thereby producing a jet effect, so that it can blow toward the heat dissipation surface at a faster speed and quickly take away the heat of the heat dissipation element.

[0008] In one example, the heat dissipation surface has a plurality of heat dissipation teeth extending perpendicular to the heat dissipation surface. The provision of the heat dissipation teeth can effectively increase the heat exchange area between the heat dissipation element and the airflow, which helps the airflow to remove heat from the heat dissipation element more quickly, thereby improving the heat dissipation performance of the heat dissipation assembly.

[0009] In one example, the angle between each through hole and the heat dissipation surface is greater than or equal to 80° and less than or equal to 90°, so as to effectively remove the heat of the heat dissipation element.

[0010] In one example, the cross-section of the through hole is the same from the first end to the second end of the through hole. The straight through hole structure allows the airflow to have a lower flow resistance when flowing through the through hole, which is conducive to ensuring the flow speed of the airflow.

[0011] In one example, the cross-sectional area of ​​the first end of the through-hole is larger than that of the second end. When air flows through the through-hole, because the cross-sectional area of ​​the second end is smaller than that of the first end, the airflow has a higher flow velocity when it is discharged from the second end, which helps improve the heat dissipation efficiency of the heat dissipation component.

[0012] In one example, the heat dissipation assembly further includes a first housing. The first housing covers one side of the first surface of the throttle member and has an air inlet that communicates with the first end of each through-hole. The first housing provides effective accommodation space for the air source, preventing foreign matter from contacting the air source during practical use, thereby ensuring the safety of the air source.

[0013] In one example, the heat dissipation assembly further includes a second housing. The second housing is connected between the throttle element and the heat dissipation element, and has an exhaust port that communicates with the second end of each through-hole. The second housing securely connects the throttle element and the heat dissipation element, thereby improving the integrity of the heat dissipation assembly and enabling better application of the entire heat dissipation assembly in terminal devices.

[0014] In one example, the heat dissipation surface has a plurality of heat dissipation teeth extending perpendicularly to the heat dissipation surface, and the heat dissipation teeth extend toward the exhaust port. When airflow blows toward the heat dissipation surface in a substantially perpendicular direction, the airflow can be guided by the heat dissipation teeth, thereby allowing the airflow to be discharged from the exhaust port more smoothly.

[0015] In one example, the thermally conductive surface is configured to be bonded to the device to be cooled. Alternatively, the heat dissipation assembly further includes a thermally conductive member, which is configured to be connected between the thermally conductive surface and the device to be cooled. In general, the thermally conductive surface can be bonded directly to the device to be cooled, or the thermally conductive surface can be bonded to the device to be cooled via the thermally conductive member.

[0016] In a second aspect, a terminal device includes a device to be dissipated heat and the aforementioned heat dissipation assembly, wherein a heat-conducting surface is thermally bonded to the device to be dissipated heat. In a specific configuration, the heat-conducting surface and the device to be dissipated heat can be bonded directly or through other structures such as a heat conductor. In the terminal device provided in this application, the heat dissipation performance of the terminal device can be effectively enhanced by configuring the heat dissipation assembly. Furthermore, the position and number of the heat dissipation assemblies can be reasonably configured according to actual needs, providing good flexibility and adaptability.

[0017] In one example, a terminal device includes a display, a middle frame, and a back panel. The display and back panel are positioned opposite each other, and the middle frame is connected between the display and back panel. A heat dissipation component is located on the side of the back panel facing away from the display, with the heat conducting surface in contact with the back panel. In general, the heat dissipation component can be located externally to the terminal device to enhance heat dissipation.

[0018] In one example, the heat dissipation assembly is located on the side of the backplate facing the display. The backplate has an air inlet, and the midframe has an air outlet. The air inlet communicates with the first end of each through-hole, and the air outlet communicates with the second end of each through-hole. In summary, the heat dissipation assembly can be located inside the terminal device to enhance heat dissipation.

[0019] In one example, the terminal device further includes a protrusion and a lens module. The protrusion can be located on the side of the back panel facing away from the display screen. The lens module is located between the middle frame and the back panel, and the lens module extends to the outer surface of the protrusion. A heat dissipation assembly is located within the protrusion, and the sidewalls of the protrusion have an air inlet and an exhaust port. The air inlet is connected to the first end of each through hole, and the exhaust port is connected to the second end of each through hole. In actual application, the heat dissipation assembly can be effectively combined with the lens module in the terminal device, thereby achieving reuse of the protrusion structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] FIG1 is a schematic diagram of the three-dimensional structure of a conventional mobile phone provided in an embodiment of the present application;

[0021] FIG2 is a schematic diagram of the three-dimensional structure of a heat dissipation assembly provided in an embodiment of the present application;

[0022] FIG3 is a schematic diagram of the cross-sectional structure taken along line AA in FIG2 ;

[0023] FIG4 is a schematic diagram of a partial cross-sectional structure of a throttling element provided in an embodiment of the present application;

[0024] FIG5 is a schematic diagram of a partial cross-sectional structure of another throttling member provided in an embodiment of the present application;

[0025] FIG6 is a schematic diagram of a partial cross-sectional structure of another throttling member provided in an embodiment of the present application;

[0026] FIG7 is a schematic diagram of a partial cross-sectional structure of another throttling member provided in an embodiment of the present application;

[0027] FIG8 is a schematic diagram of a partial cross-sectional structure of another throttling member provided in an embodiment of the present application;

[0028] FIG9 is a schematic diagram of a planar structure of a throttling member provided in an embodiment of the present application;

[0029] FIG10 is a schematic diagram of the planar structure of another throttling member provided in an embodiment of the present application;

[0030] FIG11 is a schematic diagram of the planar structure of another throttling member provided in an embodiment of the present application;

[0031] FIG12 is a schematic diagram of a three-dimensional structure of a heat dissipation element provided in an embodiment of the present application;

[0032] FIG13 is a schematic diagram of the three-dimensional structure of another heat dissipation element provided in an embodiment of the present application;

[0033] FIG14 is a schematic diagram of the three-dimensional structure of another heat dissipation element provided in an embodiment of the present application;

[0034] FIG15 is a schematic diagram of a three-dimensional structure of a terminal device provided in an embodiment of the present application;

[0035] FIG16 is a schematic diagram of an exploded structure of a terminal device provided in an embodiment of the present application;

[0036] FIG17 is a schematic diagram of the exploded structure of another terminal device provided in an embodiment of the present application;

[0037] FIG18 is a schematic diagram of a partial cross-sectional structure of a terminal device provided in an embodiment of the present application;

[0038] FIG19 is a schematic diagram of the exploded structure of another terminal device provided in an embodiment of the present application;

[0039] Figure 20 is a schematic diagram of a partial cross-sectional structure of a terminal device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0040] In order to make the purpose, technical solutions and advantages of this application clearer, this application will be further described in detail below with reference to the accompanying drawings.

[0041] In order to facilitate understanding of the heat dissipation component provided in the embodiment of the present application, its application scenario is first introduced below.

[0042] The heat dissipation assembly provided in the embodiments of the present application can be used in various types of terminal devices such as mobile phones, tablet computers, and laptop computers to improve the heat dissipation performance of the terminal devices.

[0043] For example, as shown in FIG1 , in a conventional mobile phone 01 provided herein, mobile phone 01 may include a display screen 011, a middle frame 012, and a back panel 013. Display screen 011 and back panel 013 are arranged relative to each other, and middle frame 012 is connected between display screen 011 and back panel 013. The space between display screen 011 and back panel 013 can be used to house components such as circuit boards and chips 014. In actual applications, electronic components such as chips 014 in mobile phone 01 generate considerable heat. To ensure the performance of chip 014, current mobile phones 01 typically use materials with high thermal conductivity, such as graphene, to conduct heat from chip 014 to the back panel 013 or display screen 011 of mobile phone 01. The heat is then dissipated to the outside world through back panel 013 or display screen 011, thereby dissipating heat from chip 014. In actual applications, to improve the portability of mobile phones, mobile phones are often made relatively small, resulting in a relatively limited heat dissipation area for back panel 013 or display screen 011, resulting in relatively low heat dissipation efficiency. In addition, with the continuous development of technology and the continuous improvement of user needs, the performance of mobile phone 01 has also been significantly improved, and the power and heat generation of components such as chip 014 have also increased significantly. Therefore, the current heat dissipation structure can no longer meet the growing heat dissipation needs.

[0044] To this end, an embodiment of the present application provides a heat dissipation assembly that can improve the heat dissipation performance of a terminal device by means of air cooling. The heat dissipation assembly can be detachable from the terminal device, or the heat dissipation assembly can be integrated into the terminal device.

[0045] In order to make the purpose, technical solutions and advantages of this application clearer, this application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0046] As shown in Figures 2 and 3, in an example provided in the present application, the heat dissipation assembly 10 includes a throttle 11, a heat sink 12 and an air source 13. Among them, the air source 13 is a device for generating airflow. In actual application, the air source 13 can be a fan. Alternatively, the air source 13 can also be a device similar to a diaphragm that drives the air flow by its own vibration. Please refer to Figures 3 and 4 in combination. The throttle 11 includes a plurality of through holes 111, and the first end 111a of each through hole 111 passes through the first surface of the throttle 11 (such as the upper surface in Figure 4), and the second end 111b of each through hole 111 passes through the second surface of the throttle 11 (such as the lower surface in Figure 4). The heat sink 12 includes a heat-conducting surface 121 (such as the lower surface in Figure 4) and a heat dissipation surface 122 (such as the upper surface in Figure 4) that are opposite to each other. The heat-conducting surface 121 is used to thermally bond with the device 02 to be dissipated, and the heat dissipation surface 122 is arranged opposite to the second surface. The air source 13 is used to generate an air flow that flows through a plurality of through holes 111, and the air flow flows from the first end 111a of each through hole 111 to the second end 111b. For example, the diameter of each through hole 111 can be less than or equal to 1 mm. It should be noted that the through hole 111 passes through the throttle member 11, so the first end 111a of the through hole 111 passes through the first surface of the throttle member 11, which can also be understood as the first end 111a of the through hole 111 extending to the first surface of the throttle member 11, that is, the first end 111a is located on the first surface. Correspondingly, the second end 111b of the through hole 111 passes through the second surface of the throttle member 11, which can also be understood as the second end 111b of the through hole 111 extending to the second surface of the throttle member 11, that is, the second end 111b is located on the second surface.

[0047] In addition, as shown in Figures 2 and 3, in an example provided in the present application, the heat dissipation assembly 10 also includes a first shell 14. The first shell 14 is sealed on one side of the first surface of the throttle member 11. The space enclosed by the first shell 14 and the first surface can constitute a chamber for installing the air source 13. The first shell 14 has an air inlet 141, which is connected to the first end 111a of each through hole 111. It should be noted that the connection between the air inlet 141 and the first end 111a of each through hole 111 can be understood as the air flow path between the air inlet 141 and the first end 111a of each through hole 111 is connected, so that the air flow can effectively circulate between the air inlet 141 and the first end 111a of the through hole 111. External air can enter the chamber through the air inlet 141, and under the driving action of the air source 13, the air in the chamber can enter the through hole 111 through the first end 111a of each through hole 111 and be discharged outward from the second end 111b.

[0048] By providing the first shell 14 , an effective accommodation space can be provided for the gas source 13 . In actual application, the gas source 13 can be prevented from being touched by external foreign objects, thereby ensuring the safety of the gas source 13 .

[0049] It should be noted that in the example provided herein, the air inlet 141 is located on one side of the first housing 14. In other examples, the air inlet 141 may be located on any one or more side surfaces of the first housing 14, or the air inlet 141 may be provided on a surface of the first housing 14 facing away from the throttle member 11. In actual applications, parameters such as the position, shape, and number of the air inlet 141 may be appropriately configured based on actual circumstances, and are not further described here.

[0050] In addition, in the example provided in this application, the heat dissipation assembly 10 further includes a second housing 15. The second housing 15 is connected between the throttle member 11 and the heat dissipation member 12, and the second housing 15 has an exhaust port 151, which is in communication with the second end 111b of each through hole 111. It should be noted that the communication between the exhaust port 151 and the second end 111b of each through hole 111 can be understood as the airflow path between the exhaust port 151 and the second end 111b of each through hole 111 is in communication, so that airflow can effectively flow between the exhaust port 151 and the second end 111b of the through hole 111.

[0051] The second housing 15 can be provided to fixedly connect the throttling element 11 and the heat sink 12 , thereby improving the integrity of the heat sink assembly 10 and enabling the entire heat sink assembly 10 to be better applied to terminal equipment.

[0052] It will be appreciated that in the example provided herein, the exhaust port 151 is disposed on one side surface of the second housing 15. In other examples, the exhaust port 151 may be located on any one or more side surfaces of the second housing 15. In actual applications, parameters such as the position, shape, and number of the exhaust port 151 may be appropriately configured based on actual circumstances, and detailed description thereof is omitted here.

[0053] In summary, in the example provided herein, the heat conducting surface 121 of the heat sink 12 can be thermally conductively bonded to the device 02 to be dissipated, thereby allowing the heat from the device 02 to be dissipated to be transferred to the heat sink 12 through heat transfer. The airflow generated by the air source 13 passes through the through-holes 111 of the throttle 11 and blows toward the heat dissipation surface 122, thereby removing the heat from the heat sink 12 and cooling the device 02 to be dissipated. For example, the diameter of each through-hole 111 in the throttle 11 can be less than or equal to 1 mm, so that the airflow has a relatively high flow velocity after passing through the through-holes 111, thereby generating a jet effect, so that the airflow is blown toward the heat dissipation surface 122 at a relatively high speed, quickly removing the heat from the heat sink 12. Specifically, under the action of the air source 13, an airflow is generated flowing through the through-holes 111. The larger the diameter of the through-holes 111, the smaller the flow velocity of the airflow. Conversely, the smaller the diameter of the through-holes 111, the greater the flow velocity of the airflow. In the example provided in this application, by limiting the diameter of the through-hole 111 to less than 1 mm, a higher airflow velocity can be achieved and a jet effect can be achieved, so that after the airflow is discharged outward from the second end 111b of the through-hole 111, it can flow to the heat dissipation surface 122 of the heat sink 12 at a higher speed, thereby quickly removing heat from the heat dissipation surface 122. Alternatively, it can be understood that if the diameter of the through-hole 111 is greater than 1 mm, the airflow may have difficulty reaching the heat dissipation surface 122 after being discharged from the second end 111b of the through-hole 111, or the airflow velocity when reaching the heat dissipation surface 122 is low, and the heat dissipation surface 122 cannot be effectively removed. In this application, by limiting the diameter of the through-hole 111 to less than 1 mm, the heat dissipation efficiency of the entire heat dissipation assembly 10 can be effectively guaranteed. In specific settings, the diameter of the through-hole 111 can be 1 mm, 0.9 mm, 0.8 mm, or 0.1 mm, etc. In actual applications, the diameter of each through-hole 111 can be reasonably set according to actual needs.

[0054] It should be noted that the first surface and the second surface of the throttle member 11 described above represent two opposite surfaces of the throttle member 11. In practical applications, the first surface and the second surface can be flat or curved, and the present application does not limit the specific structural shapes of the first surface and the second surface.

[0055] Furthermore, the heat conducting surface 121 of the heat sink 12 described above refers to the surface of the heat sink 12 that contacts the heat dissipating device 02. The heat dissipating surface 122 refers to the surface that exchanges heat with the airflow. In practical applications, the heat conducting surface 121 and the heat dissipating surface 122 can be flat or curved, and this application does not impose any restrictions on the specific structures and shapes of the heat conducting surface 121 and the heat dissipating surface 122.

[0056] When the through hole 111 in the throttling member 11 is set, the angle between the extension direction of the through hole 111 and the heat dissipation surface 122 can be greater than or equal to 80° and less than or equal to 90°. In summary, the extension direction of the through hole 111 and the heat dissipation surface 122 are in a roughly vertical positional relationship, so that after the airflow is discharged from the through hole 111, it can blow toward the heat dissipation surface 122 in a roughly vertical direction, which can effectively improve the heat dissipation performance of the heat dissipation component 10. When specifically set, the angle between the extension direction of the through hole 111 and the heat dissipation surface 122 can specifically be 80°, 85°, 89° or 90°, etc. In other embodiments, the angle between the extension direction of the through hole 111 and the heat dissipation surface 122 can also be other angles, which are not described here.

[0057] In addition, when the through holes 111 in the throttling member 11 are provided, parameters such as the size, shape, and position arrangement of the through holes 111 can be varied.

[0058] For example, as shown in FIG4 , in an example provided in this application, the through hole 111 may be a straight through hole 111. That is, the cross section of the through hole 111 remains unchanged from the first end 111a to the second end 111b of the through hole 111.

[0059] Alternatively, as shown in FIG5 , in another example provided herein, through hole 111 may be a stepped hole. That is, from first end 111a to second end 111b, through hole 111 is divided into two sections with different cross-sections. The cross-section near first end 111a is larger, while the cross-section near second end 111b is smaller.

[0060] Alternatively, as shown in Figure 6, in another example provided herein, through hole 111 may be a chamfered stepped hole. Specifically, from first end 111a to second end 111b, through hole 111 is divided into two sections with different cross-sections. The section near first end 111a is larger, while the section near second end 111b is smaller. Furthermore, a chamfer creates a gradual transition between the two sections.

[0061] Alternatively, as shown in FIG7 , in another example provided in the present application, the through hole 111 may be a tapered hole, that is, the cross-section of the through hole 111 decreases linearly from the first end 111 a to the second end 111 b of the through hole 111 .

[0062] Alternatively, as shown in FIG. 8 , in another example provided in the present application, the cross-section of the through hole 111 decreases linearly in the form of a gradient line from the first end 111 a to the second end 111 b of the through hole 111 .

[0063] In summary, in the examples shown in Figures 5 to 8, the cross-sectional area of ​​the first end 111a of the through hole 111 is larger than the cross-sectional area of ​​the second end 111b. Therefore, when air flows into the through hole 111 from the first end 111a and is discharged from the second end 111b, the flow rate of the air will be significantly improved, thereby improving the heat dissipation performance of the heat dissipation component 10.

[0064] It is understood that in actual applications, the cross-sectional shape of through hole 111 from first end 111a to second end 111b may vary in other ways, which are not described in detail here. Furthermore, in a specific configuration, the cross-sectional shape of through hole 111 perpendicular to the extension direction of through hole 111 may be circular, elliptical, polygonal, or other irregular shapes. In actual applications, the cross-sectional shape of through hole 111 can be appropriately configured based on actual needs, which is not described in detail here.

[0065] In addition, in specific configuration, the position layout of the through holes 111 may also be diverse.

[0066] For example, as shown in FIG. 9 , in an example provided in the present application, a plurality of through holes 111 may be arranged at equal intervals, and the diameter of each through hole 111 is substantially the same.

[0067] Alternatively, as shown in FIG. 10 , in another example provided in the present application, a plurality of through holes 111 may be arranged in a crisscross manner, and the diameter of each through hole 111 is substantially the same.

[0068] Alternatively, as shown in FIG11 , in another example provided in the present application, the plurality of through holes 111 may be arranged in a mixed manner, wherein the plurality of through holes 111 may include two through holes 111 having different diameters.

[0069] It is understood that the examples shown in Figures 9 to 11 are merely exemplary illustrations of the arrangement of the through holes 111. In other examples, parameters such as the diameter, number, and position arrangement of the through holes 111 can be reasonably selected and adjusted according to actual needs, and this application does not impose any restrictions on this.

[0070] In addition, when the heat sink 12 is provided, the structure and shape of the heat sink 12 may also be varied.

[0071] For example, as shown in Figures 3 and 12, in an example provided in the present application, the heat dissipation surface 122 of the heat sink 12 has a plurality of heat dissipation teeth 123 extending perpendicularly to the heat dissipation surface 122. By providing the heat dissipation teeth 123, the heat dissipation area of ​​the heat sink 12 can be effectively increased. When the airflow blows toward the heat dissipation surface 122, it will also take away the heat in the heat dissipation teeth 123, which can effectively improve the heat dissipation performance of the heat dissipation assembly 10. It should be noted that the extension of the heat dissipation teeth 123 perpendicular to the heat dissipation surface 122 means that the angle between the extension direction of the heat dissipation teeth 123 and the heat dissipation surface 122 is about 90°, so as to reduce or avoid the heat dissipation teeth 123 from blocking the airflow blowing toward the heat dissipation surface 122, thereby ensuring the heat dissipation efficiency of the heat sink 12. In addition, in other examples, the extension direction of the heat dissipation teeth 123 and the heat dissipation surface 122 can also be at other angles, which will not be elaborated here.

[0072] In specific configuration, the heat dissipation teeth 123 may have various shapes.

[0073] For example, as shown in Figure 12, in an example provided in the present application, each heat dissipation tooth 123 is a flat plate-like structure, and multiple heat dissipation teeth 123 can be arranged in a parallel manner, so that a channel for smooth air flow can be formed between two adjacent heat dissipation teeth 123.

[0074] Alternatively, as shown in Figure 13, in another example provided in the present application, each heat dissipation tooth 123 has a tree-like structure, and multiple heat dissipation teeth 123 can be arranged in a parallel manner, so that a channel for smooth air flow can be formed between two adjacent heat dissipation teeth 123.

[0075] Alternatively, as shown in FIG14 , in another example provided in the present application, the heat sink 12 includes two different types of heat dissipation teeth 123. One type of heat dissipation tooth 123 is a straight plate-shaped structure, and the other type of heat dissipation tooth 123 is hemispherical. Multiple heat dissipation teeth 123 of a plate-shaped structure can be arranged in parallel with each other, and a channel for smooth airflow can be formed between two adjacent heat dissipation teeth 123. In addition, multiple hemispherical heat dissipation teeth are arranged in a row, and the plate-shaped heat dissipation teeth 123 and the hemispherical heat dissipation teeth are arranged alternately in sequence.

[0076] In summary, in the example provided in this application, by setting the heat dissipation teeth 123, the heat exchange area between the airflow and the heat dissipation element 12 can be effectively increased, so that the airflow can take away more heat during the flow process, thereby improving the heat dissipation performance of the heat dissipation component 10.

[0077] In actual application, parameters such as the shape, number, and position arrangement of the heat dissipation teeth 123 can be reasonably set according to actual needs, and will not be elaborated here.

[0078] In addition, when setting the heat dissipation teeth 123 , the relative positions of the heat dissipation teeth 123 and the exhaust port 151 can be reasonably set to enhance the disturbance of the heat dissipation teeth 123 on the airflow, so that the airflow can be discharged from the exhaust port 151 more smoothly.

[0079] For example, please refer to Figure 3 and Figure 12 in combination. The exhaust port 151 can be located in the extension direction of the heat dissipation teeth 123. When the airflow blows toward the heat dissipation surface 122 in a roughly vertical direction, the airflow can be guided by the heat dissipation teeth 123, so that the airflow can be discharged from the exhaust port 151 more smoothly. It can be understood that in the example provided in Figure 3, the exhaust port 151 is only on the right side of the second shell 15. In other examples, the exhaust port 151 can also be provided on the left side or other side surfaces of the second shell 15 to improve the exhaust efficiency of the airflow. In the specific setting, the positions of the exhaust port 151 and the heat dissipation teeth 123 can be reasonably set locally according to actual conditions.

[0080] In specific applications, the heat dissipation assembly 10 can be directly applied to a terminal device, and the heat dissipation assembly 10 and the terminal device are independent of each other. Alternatively, some components of the heat dissipation assembly 10 can be reused with some components of the terminal device.

[0081] For example, as shown in FIG. 15 and FIG. 16 , in an example provided in the present application, the heat dissipation assembly 10 can be used as an integral structure and applied in a terminal device to enhance the heat dissipation performance of the terminal device.

[0082] Specifically, in the example provided in FIG16 , terminal device 20 is a mobile phone, which includes a display screen 21, a midframe 22, a back panel 23, and a chip 24. Display screen 21 and back panel 23 are arranged opposite each other, midframe 22 is connected between display screen 21 and back panel 23, and chip 24 is installed in the space between display screen 21 and back panel 23. It will be understood that in actual applications, a mobile phone also includes components such as a circuit board, and other components or parts of the mobile phone are not described in detail here.

[0083] In actual use, the mobile phone may further include a heat conductor 25 and a heat conductor 26. The heat conductor 25 may be attached between the chip 24 and the display screen 21, allowing the heat from the chip 24 to be transferred to the display screen 21 for dissipation. Furthermore, the heat conductor 26 may be attached between the chip 24 and the back panel 23, allowing the heat from the chip 24 to be transferred to the back panel 23 for dissipation.

[0084] The heat dissipation assembly 10 can be directly attached to the surface of the back plate 23, and the heat sink 12 in the heat dissipation assembly 10 can be in contact with the surface of the back plate 23. In this case, the back plate 23 can be considered as the heat dissipation device 02 shown in Figure 2, so that the heat of the back plate 23 can be effectively transferred to the heat sink 12. In summary, the provision of the heat dissipation assembly 10 can effectively improve the cooling efficiency of the back plate 23, so that the heat of the chip 24 can be more effectively transferred to the back plate 23 for dissipation, which is beneficial to improving the heat dissipation performance of the entire terminal device.

[0085] The specific materials of the heat conductor 25 and the heat conductor 26 may include materials with good thermal conductivity such as graphite and heat pipes. The present application does not limit the specific materials and structural types of the heat conductor 25 and the heat conductor 26.

[0086] In addition, in the example provided in this application, the air flow channel in the heat dissipation component 10 and the terminal device 20 are independent of each other, that is, the heat dissipation component 10 will not destroy the airtightness of the terminal device, thereby avoiding adverse effects on the dustproof and waterproof performance of the terminal device 20.

[0087] In a specific configuration, the heat dissipation component 10 can be fixedly connected to the back plate 23 by bonding or magnetic attraction. Among them, the heat dissipation component 10 and the back plate 23 can be connected in a suitable manner and structure according to actual needs, and this application does not limit this.

[0088] In the above example, the heat dissipation component 10 and the terminal device 20 are independent structures. However, in other examples, the heat dissipation component 10 and the terminal device 20 can also be integrated.

[0089] For example, as shown in FIG17 , in another example provided in the present application, an air inlet 231 can be provided in the back panel 23, an exhaust port 221 can be provided in the middle frame 22, and the throttling element 11 and the heat sink 12 in the heat dissipation assembly 10 can both be provided inside the mobile phone.

[0090] Specifically, please refer to Figures 17 and 18 . The mobile phone includes a display screen 21, a middle frame 22, a back panel 23, and a chip 24. The display screen 21 and the back panel 23 are arranged opposite each other, the middle frame 22 is connected between the display screen 21 and the back panel 23, and the chip 24 is installed in the space between the display screen 21 and the back panel 23. A thermal conductor 25 can be attached between the chip 24 and the display screen 21, so that the heat of the chip 24 can be transferred to the display screen 21 through the thermal conductor 25 for dissipation. In addition, a thermal conductor 26 can be attached between the chip 24 and the heat sink 12, so that the heat of the chip 24 can be transferred to the heat sink 12 in the heat dissipation assembly 10 through the thermal conductor 26 for dissipation.

[0091] Alternatively, it can be understood that, referring to Figures 3 and 17 in combination, it can be considered that the first shell 14 in Figure 3 and the back panel 23 in Figure 17 are integrated into one piece, and the second shell 15 in the figure and the middle frame 22 in Figure 17 are integrated into one piece.

[0092] It should be noted that in actual application, the air duct between the air inlet 141 and the exhaust port 151 is isolated from other spaces inside the mobile phone to prevent external impurities such as water vapor or dust from entering the interior of the mobile phone through the air inlet 141 or the exhaust port 151, thereby reducing the airtightness of the mobile phone.

[0093] Alternatively, as shown in FIG19 , in another example provided in the present application, the heat dissipation assembly 10 may also be integrated with the lens assembly in the mobile phone.

[0094] Specifically, the terminal device also includes a protrusion 232, which is located on the side of the back plate 23 facing away from the display screen 21. The terminal device includes a lens module (not shown in Figure 19), which is located between the middle frame 22 and the back plate 23, and the lens module extends to the outer surface of the protrusion 232, so that it can capture external images. The heat dissipation assembly 10 is located within the protrusion 232, and the sidewall of the protrusion 232 has an air inlet 2321 and an exhaust port 2322. External air can enter the interior of the back plate 23 through the air inlet 2321 and be discharged from the exhaust port 2322, thereby cooling the mobile phone. Alternatively, it can be understood that, referring to Figures 3 and 19 in combination, the first shell 14 and the second shell 15 in Figure 3 can be considered to be replaced with the protrusion 232 in Figure 19, the air inlet 141 can be considered to be the air inlet 2321, and the exhaust port 151 can be considered to be the exhaust port 2322. In a specific configuration, the protrusion 232 may be a structural member independent of the back plate 23 , or the protrusion 232 and the back plate 23 may be an integrated structure, which is not limited in this application.

[0095] Please refer to Figures 19 and 20 in conjunction. Figure 20 shows a schematic cross-sectional structure of the protrusion 232 in the terminal device. In the example provided in this application, the protrusion 232 is a hollow, convex-shaped structure, and the throttle 11 and heat sink 12 in the heat dissipation assembly 10 are both fixed inside the protrusion 232. In actual application, the heat conductor 26 can be attached between the chip 24 and the backplate 23, and the heat conduction surface in the heat dissipation assembly 10 (such as the lower surface in Figure 20) can be attached to the upper surface of the backplate 23, that is, the heat generated by the chip 24 can be transferred to the heat dissipation assembly 10 through the heat conductor 26 and the backplate 23. Alternatively, in some examples, a window can be opened at the position of the backplate 23 corresponding to the protrusion 232 to prevent the backplate 23 from transferring heat, thereby shortening the heat transfer path. That is, the heat conductor 26 can be attached between the chip 24 and the heat conduction surface of the heat dissipation assembly 10, and the heat generated by the chip 24 can be directly transferred to the heat dissipation assembly 10 through the heat conductor 26.

[0096] It is understood that in the above example, the terminal device 20 is equipped with one heat dissipation component 10. In actual applications, the terminal device 20 can be equipped with two or more heat dissipation components 10, wherein the specific number of heat dissipation components 10 equipped in the terminal device 20 is not limited in this application.

[0097] In addition, the above examples illustrate the application of the heat dissipation assembly 10 to a mobile phone. In actual applications, the heat dissipation assembly 10 can also be used in devices such as tablet computers, laptop computers, routers, and base stations. In summary, any terminal device that requires enhanced heat dissipation performance can be equipped with the heat dissipation assembly 10 provided in this application.

[0098] In the various embodiments of the present application, unless otherwise specified or there is a logical conflict, the terms and / or descriptions between different embodiments are consistent and can be referenced by each other. The technical features in different embodiments can be combined to form new embodiments according to their inherent logical relationships.

[0099] In this application, "plurality" refers to two or more. "and / or" describes the relationship between related objects, indicating that three relationships can exist. For example, "A and / or B" can mean: A exists alone, A and B exist simultaneously, and B exists alone. A and B can be singular or plural.

[0100] It is understood that the various numbers used in the embodiments of this application are merely for ease of description and are not intended to limit the scope of the embodiments of this application. The order of the sequence numbers of the above-mentioned processes does not necessarily imply a specific order of execution; the order of execution of the processes should be determined by their functions and inherent logic.

Claims

1. A heat dissipation component, characterized in that, Including throttling parts, heat sinks and air sources; The throttle member includes a plurality of through holes, a first end of each of the through holes penetrates to a first surface of the throttle member, and a second end of each of the through holes penetrates to a second surface of the throttle member; The heat sink comprises a heat conducting surface and a heat dissipating surface which are separated from each other, the heat conducting surface is used for heat-conductingly fitting with the device to be cooled, and the heat dissipating surface is arranged opposite to the second surface; The air source is used to generate an air flow flowing through the plurality of through holes, the air flow flows from the first end to the second end of each through hole, and the diameter of each through hole is less than or equal to 1 mm.

2. The heat dissipation component according to claim 1, wherein The heat dissipation surface has a plurality of heat dissipation teeth extending perpendicularly to the heat dissipation surface.

3. The heat dissipation component according to claim 1 or 2, characterized in that, The included angle between each of the through holes and the heat dissipation surface is greater than or equal to 80° and less than or equal to 90°.

4. The heat dissipation component according to any one of claims 1 to 3, characterized in that The cross-section of the through hole is the same from the first end to the second end of the through hole.

5. The heat dissipation component according to any one of claims 1 to 3, characterized in that A cross-sectional area of ​​the first end of the through hole is greater than a cross-sectional area of ​​the second end.

6. The heat dissipation component according to any one of claims 1 to 5, characterized in that, The heat dissipation assembly also includes a first housing; The first housing covers one side of the first surface of the throttle element, and the first housing has an air inlet, which is communicated with the first end of each of the through holes.

7. The heat dissipation component according to claim 6, wherein The gas source is located in a space enclosed by the first shell and the first surface of the throttling element.

8. The heat dissipation component according to any one of claims 1 to 7, characterized in that, The heat dissipation assembly also includes a second housing; The second shell is connected between the throttling element and the heat sink, and has an exhaust port, which is communicated with the second end of each through hole.

9. The heat dissipation component according to claim 8, wherein The heat dissipation surface has a plurality of heat dissipation teeth extending perpendicularly to the heat dissipation surface, and the heat dissipation teeth extend toward the exhaust port.

10. The heat dissipation component according to any one of claims 1 to 9, wherein The heat-conducting surface is used to fit with the device to be cooled; or, the heat dissipation assembly further includes a heat-conducting member, and the heat-conducting member is used to be connected between the heat-conducting surface and the device to be cooled.

11. A terminal device, characterized in that, It comprises a device to be cooled and a heat dissipation assembly as claimed in any one of claims 1 to 10, wherein the heat conductive surface is thermally bonded to the device to be cooled.

12. The terminal device according to claim 11, wherein The terminal device comprises a display screen, a middle frame and a back plate, the display screen and the back plate are arranged opposite to each other, and the middle frame is connected between the display screen and the back plate; The heat dissipation component is located at a side of the back plate away from the display screen, and the heat conducting surface is in contact with the back plate.

13. The terminal device according to claim 12, wherein The terminal device also includes a protrusion and a lens module; The protrusion is located on a side of the back plate away from the display screen; The lens module is located between the middle frame and the back plate, and the lens module extends to the outer surface of the protrusion; The heat dissipation assembly is located in the protrusion, and the side wall of the protrusion has an air inlet and an air outlet, the air inlet is communicated with the first end of each of the through holes, and the air outlet is communicated with the second end of each of the through holes.

14. The terminal device according to claim 11, wherein The heat dissipation component is located on a side of the back plate facing the display screen; The back plate has an air inlet, and the middle frame has an air outlet. The air inlet is communicated with the first end of each of the through holes, and the air outlet is communicated with the second end of each of the through holes.

Images