Electronic device

Abstract

The present application relates to the technical field of electronic devise. Disclosed is an electronic device. The electronic device provided in the embodiments of the present application comprises, successively arranged in a first direction, a first casing, a circuit board support, a first circuit board, a microphone and a second circuit board; the first casing is provided with a first sound receiving hole; the circuit board support is provided with a second sound receiving hole; the first circuit board is provided with a third sound receiving hole; the microphone is arranged on the first circuit board at a position corresponding to the third sound receiving hole; the third sound receiving hole, the second sound receiving hole and the first sound receiving hole are successively connected to each other so as to form a sound receiving passage of the microphone. In the present application, the microphone can be electrically connected to the second circuit board by means of the first circuit board, and the first circuit board, the microphone and the second circuit board are all arranged on the same side of the circuit board support away from the first casing, such that short wiring is provided on the first circuit board, which can reduce the electric connection length between the microphone and the second circuit board, thus simplifying the electric connection mode therebetween.

Description

electronic devices

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on January 4, 2024, with application number 202410027151.X and application name “Electronic Device”. The entire contents of the above application are incorporated by reference into this application. Technical Field

[0002] The present application relates to the technical field of electronic equipment, and in particular to an electronic equipment. Background Art

[0003] Electronic devices such as mobile phones and tablets are equipped with one or more microphones (MIC). The microphone can receive the sounds around the electronic device (for example, the user's voice, ambient noise, etc.) to meet the user's needs for recording, call noise reduction, and operating the electronic device based on voice commands.

[0004] Currently, microphones are installed inside electronic devices, requiring a sound pickup channel to connect the microphone to external sound sources. Furthermore, the microphone must be connected to the electronic device's motherboard to convert acoustic signals into electrical signals. However, the internal space of electronic devices is limited, and the increasing number of other functional components (such as cameras) takes up more and more space. Therefore, how to arrange the microphone's position, sound pickup channel, and connection between the microphone and the motherboard within this limited space is an urgent problem to be solved. Summary of the Invention

[0005] To solve the above problems, an embodiment of the present application provides an electronic device.

[0006] An electronic device provided in an embodiment of the present application includes: a first shell, a circuit board bracket, a first circuit board, a microphone, and a second circuit board arranged in sequence along a first direction; wherein the first shell is provided with a first sound pickup hole, the circuit board bracket is provided with a second sound pickup hole, and the first circuit board is provided with a third sound pickup hole; the microphone is arranged on the first circuit board and corresponds to the position of the third sound pickup hole, and the third sound pickup hole, the second sound pickup hole and the first sound pickup hole are connected in sequence to form a sound pickup channel of the microphone; the first circuit board, the microphone and the second circuit board are all arranged on the same side of the circuit board bracket away from the first shell, and the first circuit board is used to electrically connect the microphone and the second circuit board.

[0007] The microphone may be a rear microphone in an electronic device. The second circuit board may be a mainboard of the electronic device. The rear microphone may collect sound data through a sound pickup channel formed by sequentially connecting the first sound pickup hole, the second sound pickup hole, and the third sound pickup hole, and transmit the sound data to the mainboard via the first circuit board, where the sound data is processed by a processor on the mainboard.

[0008] Based on the above solution, the microphone, the first circuit board and the second circuit board are all located on the same side of the circuit board bracket, so that the microphone and the second circuit board can be connected through the first circuit board. In addition, the wiring of the first circuit board is shorter, which can shorten the electrical connection length between the microphone and the second circuit board and simplify the electrical connection method between the two.

[0009] In some possible implementations, a sealing member is provided between the first housing and the circuit board bracket.

[0010] In some possible embodiments, the first sound pickup hole passes through the first shell along the first direction, the second sound pickup hole passes through the circuit board bracket along the first direction or the second direction, wherein the angle between the second direction and the first direction is an acute angle; and the third sound pickup hole passes through the first circuit board along the first direction.

[0011] It can be understood that a second sound pickup hole is set on the circuit board bracket, and the second sound pickup hole can adopt an oblique opening design, so that the setting position of the microphone is more flexible, which can reduce the difficulty of layout of internal components of the electronic device and greatly enhance the appearance of the electronic device.

[0012] In some possible embodiments, the first circuit board includes a first surface and a second surface arranged opposite to each other along a first direction, the first circuit board is fixedly connected to the circuit board bracket through the first surface, the microphone is arranged on the second surface, and a conductive member is also provided on the second surface, and the conductive member is electrically connected to the second circuit board.

[0013] It can be understood that the microphone is arranged on the first circuit board, and the first circuit board is fixed on the circuit board bracket, so that the circuit board bracket can provide a rigid supporting force for the microphone on the first circuit board, thereby improving the stability of the microphone.

[0014] In some possible implementations, the first circuit board is glued to the circuit board bracket.

[0015] In some possible embodiments, the circuit board bracket includes a plurality of brackets stacked in sequence along a first direction, wherein each bracket is provided with a through hole, and the through hole penetrates the bracket along a second direction; and the plurality of through holes corresponding to the plurality of brackets are connected in sequence to form a second pickup hole.

[0016] In some possible implementations, the plurality of brackets include a first bracket and a second bracket, wherein the first bracket is provided with a first through hole, the second bracket is provided with a second through hole, and the first through hole is connected to the second through hole to form a second sound pickup hole.

[0017] It is understood that the circuit board bracket can be a single-layer structure or a multi-layer structure. In the multi-layer structure, the circuit board bracket can include multiple brackets stacked along the first direction, and the oblique openings on each bracket are staggered to expand the range of microphone position settings.

[0018] In some possible implementations, an opening of the first through hole close to the second through hole and an opening of the first through hole connected to the first through hole close to the first through hole are offset in the first direction.

[0019] In some possible embodiments, the first bracket is arranged between the second bracket and the first shell; a first groove is provided on the surface of the first bracket facing the second bracket, and a second groove is provided on the surface of the second bracket facing the first bracket; the first through hole extends from the bottom of the first groove to the surface of the first bracket facing the first shell, and the second through hole extends from the bottom of the second groove to the surface of the second bracket facing the second circuit board.

[0020] It can be understood that the opening of the first through hole close to the second through hole can refer to the opening of the first through hole at the bottom of the first groove, and the opening of the first through hole connected to the first through hole close to the first through hole can refer to the opening of the second through hole at the bottom of the second groove. The two openings corresponding to the two through holes are not aligned in the first direction, so that the first through hole and the second through hole can be staggered.

[0021] In some possible implementations, a filling piece is provided in the cavity formed by the first groove and the second groove. The filling piece is provided with a third through hole. One end of the third through hole is connected to the first through hole, and the other end is connected to the second through hole.

[0022] It is understood that providing a filler can prevent the loss of sound data caused by the cavity being too large, thereby affecting the sound reception effect of the microphone. For example, the filler can include foam or adhesive.

[0023] In some possible implementations, the angle between the second direction and the first direction is 0 to 38 degrees. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] FIG1 is a schematic diagram of the rear side of a mobile phone provided in an embodiment of the present application;

[0025] FIG2 is a schematic diagram of a partial structure of the interior of a mobile phone provided in an embodiment of the present application;

[0026] FIG3 is a schematic diagram of a partial structure of an internal portion of an electronic device provided in an embodiment of the present application;

[0027] FIG4 is a schematic diagram of a partial structure of another electronic device provided in an embodiment of the present application;

[0028] FIG5A is a schematic diagram of a partial structure of the interior of another mobile phone provided in an embodiment of the present application;

[0029] FIG5B is a cross-sectional view taken along the line AA′ in FIG5A provided by an embodiment of the present application;

[0030] FIG5C is a cross-sectional view taken along the line BB′ in FIG5A provided in an embodiment of the present application. DETAILED DESCRIPTION

[0031] The illustrative embodiments of the present application include but are not limited to an electronic device. Specific implementation methods of the present application will be described in detail below with reference to the accompanying drawings.

[0032] It is understood that the electronic devices provided herein may include, but are not limited to, mobile phones, tablet computers, laptop computers, cameras, ultra-mobile personal computers (UMPCs), handheld computers, touch-screen televisions, walkie-talkies, netbooks, POS machines, personal digital assistants (PDAs), wearable devices, virtual reality devices, smart vehicles, smart robots, industrial equipment, and any other electronic device with a microphone, and this application does not impose any such restrictions. For ease of description, the following description uses a mobile phone as an example of the electronic device.

[0033] Currently, most mobile phones are equipped with multiple microphones, which can be configured in different locations on the phone, such as the front, back, top, or bottom. The microphone configured on the back of the phone is usually called the rear microphone, back microphone, or 3MIC. The rear microphone is mainly used for recording video. When the user holds the phone to shoot a video, the phone can use this microphone to collect sound. The rear microphone is also the key to noise reduction technology. The phone uses the rear microphone to collect noisy sound data and then compares it with the information database. If it is determined to be noisy, it will be blocked, which can improve the sound quality heard by the user.

[0034] 1 and 2, FIG1 is a schematic diagram of the rear side of a mobile phone 10 provided in an embodiment of the present application, and FIG2 is a schematic diagram of a partial structure of the interior of a mobile phone 10 provided in an embodiment of the present application. For the convenience of subsequent description, before introducing the mobile phone 10, the directions indicated in the various figures of the present application are explained. In the various figures of the present application, the X-axis direction represents the width direction of the mobile phone 10, the Y-axis direction represents the length direction of the mobile phone 10, and the Z-axis direction (the first direction mentioned in the present application) represents the thickness direction of the mobile phone 10. The X-axis direction, the Y-axis direction, and the Z-axis direction can be perpendicular to each other. In addition, it can be understood that one side of the mobile phone 10 that is arranged opposite to each other along the Z-axis direction is the screen, and the other side is the back cover. Therefore, the back side mentioned in the present application refers to the side facing the back cover.

[0035] As shown in FIG1 , the back cover 10 - 1 of the mobile phone 10 is provided with a rear lens ring 11, which is provided with a sound pickup hole 12. As shown in FIG2 , the interior of the mobile phone 10 is provided with a rear microphone 13, which is arranged in the direction in which the sound pickup hole 12 extends along the Z axis toward the interior of the mobile phone 10 (the negative Z axis direction). That is, the positions of the rear microphone 13 and the sound pickup hole 12 are aligned in the Z axis direction.

[0036] Referring to Figure 2 , within the mobile phone 10, a rear microphone 13 is electrically connected to a motherboard 15 via a flexible printed circuit (FPC) 14. This allows the rear microphone 13 to transmit collected sound data to the motherboard 15 via the FPC 14, where it is processed by a processor (not shown) on the motherboard 15. The rear microphone 13 is soldered to one end of the FPC 14, while the other end of the FPC 14 is electrically connected to the motherboard 15 via a BTB connector 16. The BTB connector 16 includes a first connector 16-1 disposed on the FPC 14 and a second connector 16-2 disposed on the motherboard 15. The first connector 16-1 and the second connector 16-2 interlock to achieve an electrical connection between the FPC 14 and the motherboard 15. Specifically, the first connector 16-1 can be a male connector, and the corresponding second connector 16-2 can be a female connector, or the first connector 16-1 can be a female connector, and the corresponding second connector 16-2 can be a male connector.

[0037] Continuing with Figure 2, along the Z-axis, the back cover 10-1, flexible circuit board 14, and rear microphone 13 are stacked in sequence. The flexible circuit board 14 has a through-hole 14a at the location where the rear microphone 13 is soldered. This through-hole 14a forms a sound pickup channel L1 between the rear microphone 13 and the external environment, connecting the rear microphone 13 to the sound pickup hole 12 and the through-hole 14a. Sound emitted from external sources can be collected by the rear microphone 13 via the sound pickup hole 12 and the through-hole 14a. Furthermore, to prevent the sound data in the sound pickup channel L1 from being leaked and to ensure its tightness, a seal 17 is provided between the flexible circuit board 14 and the back cover 10-1.

[0038] Since the flexible circuit board 14 is made of a relatively soft material and cannot support the rear microphone 13, it is necessary to utilize other rigid structures 18 inside the mobile phone 10 to provide support. The rigid structure 18 abuts against the flexible circuit board 14, and the rear microphone 13 can be placed inside the cavity 18a of the rigid structure 18, with a gap left between it and the inner wall of the cavity 18a.

[0039] In some embodiments, the rigid structure 18 may be a motherboard bracket, which primarily provides rigid support for the motherboard 15. The motherboard bracket is positioned between the motherboard 15 and the back cover 10-1, that is, the motherboard 15 and the back cover 10-1 are positioned on opposite sides of the motherboard bracket along the Z-axis. In this case, the back cover 10-1, the flexible circuit board 14, the rear microphone 13, the motherboard bracket, and the motherboard 15 are sequentially arranged along the negative Z-axis. To electrically connect the rear microphone 13 to the motherboard 15, the flexible circuit board 14 must first extend along the X-axis and then along the Z-axis, bypassing the motherboard bracket before connecting to the motherboard 15. The flexible circuit board 14 generally forms a "Z" shape, as shown in FIG2 . Consequently, the current wiring of the flexible circuit board 14 is excessively long, increasing the consumables cost of the mobile phone 10. Furthermore, the motherboard bracket requires a cavity 18a on the side facing the back cover 10-1 to accommodate the rear microphone 13, which increases its thickness along the Z-axis and hinders the reduction in weight and miniaturization of the mobile phone 10.

[0040] To solve the above problems, an embodiment of the present application provides an electronic device. By adjusting the position of the rear microphone and the pickup channel between the rear microphone and the pickup hole on the back cover, the electrical connection between the rear microphone and the motherboard can be simplified, consumables can be saved, and the space occupied by the rear microphone can be reduced.

[0041] Referring to Figure 3, Figure 3 is a schematic diagram of a partial internal structure of an electronic device provided by an embodiment of the present application. The electronic device includes a back cover 20-1 (an example of the first housing of the present application), a mainboard bracket 28 (an example of the circuit board bracket of the present application), a printed circuit board 24 (an example of the first circuit board of the present application), a rear microphone 23 (an example of the microphone of the present application), and a mainboard 25 (an example of the second circuit board of the present application), which are arranged in sequence along the negative direction of the Z axis.

[0042] The back cover 20-1 may refer to the back cover 10-1 in FIG. The back cover 20-1 is provided with a rear lens ring, and a sound pickup hole 22 (an example of the first sound pickup hole of the present application) is provided on the rear lens ring. It is understood that in other embodiments, the back cover 20-1 may be provided with a rear lens area of ​​other shapes, and the sound pickup hole 22 may be provided in the rear lens area or in other areas of the back cover 20-1, such as the fingerprint unlocking area. The present application does not limit the position of the sound pickup hole 22.

[0043] The printed circuit board 24 includes a first surface 241 and a second surface 242, which are arranged opposite each other along the Z-axis. The printed circuit board 24 is fixedly connected to the mainboard bracket 28 via the first surface 241. The rear microphone 23 is disposed on the second surface 242. For example, the rear microphone 23 can be directly soldered to the second surface 242. A conductive member 26 is also provided on the second surface 242. The conductive member 26 can be electrically connected to the rear microphone 23 via internal wiring within the printed circuit board 24. Furthermore, the conductive member 26 is also electrically connected to the mainboard 25. In this way, the rear microphone 23 can transmit collected sound data to the mainboard 25 via the printed circuit board 24 and the conductive member 26, where the sound data is processed by a processor on the mainboard 25. Because the printed circuit board 24 and the mainboard 25 are located on the same side of the mainboard bracket 28, they can be electrically connected via a conductive member 26 (e.g., a conductive spring). Compared to the above-described embodiment in which the flexible printed circuit board 14 needs to bypass the mainboard bracket and then connect to the mainboard via the BTB connector 16, the electrical connection length between the rear microphone 23 and the mainboard 25 is greatly shortened, simplifying the electrical connection between the two. Furthermore, the size of the printed circuit board 24 only needs to meet the placement requirements of the rear microphone 23 and the conductive member 26, saving consumables and reducing hardware costs.

[0044] It can be understood that placing the rear microphone 23 in the gap between the mainboard bracket 28 and the mainboard 25 along the Z-axis direction will not cause the thickness of the mainboard bracket 28 in the Z-axis direction to increase. At the same time, the rear microphone 23 is fixed to the mainboard bracket 28 through the printed circuit board 24. The mainboard bracket 28 can directly provide rigid support for the rear microphone 23, thereby improving the stability of the rear microphone 23.

[0045] Continuing with FIG3 , the electronic device of the embodiment of the present application may be provided with a through hole 28a (an example of the second sound pickup hole of the present application) on the mainboard bracket 28, and a through hole 24a (an example of the third sound pickup hole of the present application) may be provided on the printed circuit board 24 at a position corresponding to the rear microphone 23. In this way, the through hole 24a, the through hole 28a, and the sound pickup hole 22 are sequentially connected to form a sound pickup channel L2 that connects the rear microphone 23 to the outside. The through hole 28a may be designed as an oblique opening, for example, the through hole 28a may be an oblique opening inclined in the Z-axis direction. In this way, the rear microphone 23 and the sound pickup hole 22 can be arranged in a flexible position, and the two do not need to be aligned with the sound pickup hole 22 in the Z-axis direction. This not only reduces the difficulty of layout of the internal components of the electronic device, but also allows the position of the sound pickup hole 22 to be flexibly adjusted according to the design requirements, which can greatly enhance the appearance of the electronic device.

[0046] In some embodiments, the through hole 28a is designed with an oblique opening, that is, the angle between the extension direction of the through hole 28a (the second direction mentioned in this application) and the Z-axis direction is an acute angle. Thus, after determining the position of the sound pickup hole 22, the position of the rear microphone 23 can be flexibly adjusted according to actual needs. For example, if the rear microphone 23 is located close to the motherboard 25, the position of the rear microphone 23 must meet the requirements of avoiding certain functional components on the motherboard 25 (for example, a series of vibration components such as a motor and a camera).

[0047] In some embodiments, the acute angle between the extension direction of the through hole 28 a and the negative direction of the Z axis ranges from 0 to 38 degrees.

[0048] In some embodiments, the through hole 28 a may extend along the Z-axis direction so that the rear microphone 23 is aligned with the sound pickup hole 22 in the Z-axis direction.

[0049] It can be understood that the mainboard bracket 28 is usually made of rigid material. Therefore, the through hole 28a formed therein is used as a part of the sound pickup channel L2 to improve the sealing performance of the sound pickup channel L2.

[0050] In some embodiments, the conductive member 26 may include any one of conductive springs, metal connecting wires, BTB connectors, and other plug-in components.

[0051] In some embodiments, a seal 27 is provided between the rear cover 20-1 and the motherboard bracket 28. This seal 27 fills the gap between the rear cover 20-1 and the motherboard bracket 28 along the Z-axis, thereby preventing sound data in the sound pickup channel L2 from leaking through this gap. It should be understood that the seal 27 should avoid the connection between the sound pickup hole 22 and the through hole 28a to avoid blocking the sound pickup channel L2 and affecting the sound pickup effect of the rear microphone 23.

[0052] In some embodiments, the printed circuit board 24 is glued to the motherboard bracket 28. Specifically, the printed circuit board 24 is coated with adhesive 29 on its first surface 241 and then directly glued to the motherboard bracket 28. This fixing solution is simple and significantly saves space required to support the rear microphone 23.

[0053] As previously mentioned, the through-hole 28a adopts an oblique opening design, which can expand the adjustable range of the rear microphone 23 position. It is understandable that due to the limitations of the processing technology, the maximum acute angle between the extension direction of the through-hole 28a formed by the opening in the single-layer mainboard bracket 28 and the negative direction of the Z axis is 38 degrees. Therefore, in some embodiments of the present application, the mainboard bracket 28 of a single structural component can be disassembled to form multiple structural components. In other words, the single-layer structure of the mainboard bracket 28 is adjusted to a multi-layer structure. In this multi-layer structure, the mainboard bracket can include multiple brackets stacked along the Z axis, with the oblique openings on each bracket staggered, thereby expanding the adjustable range of the rear microphone 23 position.

[0054] Refer to FIG. 4 , which is a schematic diagram of a partial structure inside another electronic device provided in an embodiment of the present application.

[0055] As shown in Figure 4, the mainboard bracket 28' includes a first bracket 28-1 and a second bracket 28-2 stacked in sequence along the negative direction of the Z axis, and the first bracket 28-1 is arranged between the second bracket 28-2 and the back cover 20-1; wherein, the first bracket 28-1 is provided with a first through hole 28b-1, and the second bracket 28-2 is provided with a second through hole 28b-2, and the first through hole 28b-1 is connected to the second through hole 28b-2. At this time, the through hole 24a, the second through hole 28b-2, the first through hole 28b-1 and the pickup hole 22 on the printed circuit board 24 are connected in sequence to form a pickup channel L3 connecting the rear microphone 23 with the outside.

[0056] In addition, a first groove 281 is provided on the surface of the first bracket 28-1 facing the second bracket 28-2, and a first through hole 28b-1 extends from the bottom of the first groove 281 to the surface of the first bracket 28-1 facing the back cover 20-1; a second groove 282 is provided on the surface of the second bracket 28-2 facing the first bracket 28-1, and a second through hole 28b-2 extends from the bottom of the second groove 282 to the surface of the second bracket 28-2 facing the printed circuit board 24.

[0057] 4 , the opening A of the first through hole 28b-1 at the bottom of the first groove 281 and the opening B of the second through hole 28b-2 at the bottom of the second groove 282 are not aligned in the Z-axis direction, that is, the first through hole 28b-1 and the second through hole 28b-2 are staggered.

[0058] It can be understood that the maximum acute angle between the extension direction of the first through hole 28b-1 and the negative direction of the Z axis, or the maximum acute angle between the extension direction of the second through hole 28b-2 and the positive direction of the Z axis, remains 38 degrees. However, along the X axis, increasing the distance between openings A and B causes them to be offset along the Z axis. While maintaining the same angle of the oblique openings, this also increases the distance between the sound pickup hole 22 and the rear microphone 23 along the X axis, thereby expanding the adjustable range of the rear microphone 23 position.

[0059] Alternatively, in some other alternative implementations, the distance between the opening A of the first through hole 28b-1 at the bottom of the first groove 281 and the opening B of the second through hole 28b-2 at the bottom of the second groove 282 is increased along the Y-axis direction, and the opening A and the opening B are also offset in the Z-axis direction, thereby expanding the setting range of the position of the rear microphone 23.

[0060] In some embodiments, a filler (not shown) is disposed within the cavity 280 formed by the first groove 281 and the second groove 282. The filler has a third through hole, one end of which communicates with the opening A of the first through hole 28b-1 and the other end with the opening B of the second through hole 28b-2. This prevents loss of sound data due to an excessively large cavity 280, which could affect the sound pickup quality of the rear microphone 23. Exemplary fillers may include foam or adhesive.

[0061] It is understood that in other embodiments, the first bracket 28-1 may not be provided with the first groove 281, and the second bracket 28-2 may not be provided with the second groove 282. The opening A for the first through hole 28b-1 to communicate with the second through hole 28b-2 may be directly provided on the surface of the first bracket 28-1 facing the second bracket 28-2, and the opening B for the second through hole 28b-2 to communicate with the first through hole 28b-1 may be directly provided on the surface of the second bracket 28-2 facing the first bracket 28-1. By increasing the spacing between the first bracket 28-1 and the second bracket 28-2 along the Z-axis, and then increasing the spacing between opening A and opening B along the X-axis or along the Y-axis, opening A and opening B can also be offset along the Z-axis, thereby expanding the adjustable range of the rear microphone 23.

[0062] In some embodiments, a seal is provided between the first bracket 28-1 and the second bracket 28-2. This seal may refer to the seal 27 provided between the first bracket 28-1 and the back cover 20-1, and is primarily used to fill the gap between the first bracket 28-1 and the second bracket 28-2 along the Z-axis to prevent sound data from leaking through the gap.

[0063] FIG5A is a schematic diagram of a partial structure of the interior of a mobile phone provided in an embodiment of the present application, FIG5B is a cross-sectional view along the line AA' in FIG5A , and FIG5C is a cross-sectional view along the line BB' in FIG5A .

[0064] 5A-5C , the mainboard bracket 28 ′ adopts an upper and lower stacked structure, including a first bracket 28-1 and a second bracket 28-2 stacked in sequence along the negative direction of the Z axis, the first bracket 28-1 is provided with a first through hole 28b-1, and the second bracket 28-2 is provided with a second through hole 28b-2; wherein, the first through hole 28b-1 and the second through hole 28b-2 are staggered along the Y axis direction, and therefore, the first through hole 28b-1 and the second through hole 28b-2 are shown by different XZ sections.

[0065] 5B and 5C , a filler 29 is disposed between the first bracket 28 - 1 and the second bracket 28 - 2 . A third through hole 29 a is disposed in the center of the filler 29 . The third through hole 29 a is connected to the first through hole 28 b - 1 and the second through hole 28 b - 2 , respectively. The second through hole 28 b - 2 can extend into the third through hole 29 a . It is understood that the first bracket 28 - 1 and the second bracket 28 - 2 can define a first groove 281 and a second groove 282 on their opposing surfaces based on the structure of the filler 29 to accommodate the filler 29 . The present application does not limit the structures of the filler 29 , the first groove 281 , and the second groove 282 .

[0066] In some embodiments, the filler 29 can be adhered to the surface of the first bracket 28-1 facing the second bracket 28-2 by adhesive to improve its stability and ensure the sealing of the connection between the first through hole 28b-1 and the second through hole 28b-2.

[0067] 5B , the printed circuit board 24 is disposed on the surface of the second bracket 28-2 facing the mainboard 25 and is electrically connected to the mainboard 25 via the conductive member 26. The number of the conductive members 26 may include one or more, which is not limited in this application.

[0068] The rear microphone 23 can be directly soldered to the surface of the printed circuit board 24 facing the main board 25. It is understood that the main board 25 is also used to set other functional components, such as motors, cameras, etc. The position of the rear microphone 23 can be flexibly adjusted according to the actual layout of the functional components on the main board 25.

[0069] In other embodiments, the mainboard bracket 28' may include two or more brackets stacked in sequence along the Z-axis direction. The structure and stacking method of two adjacent brackets among the two or more brackets can refer to the above-mentioned embodiments of the first bracket and the second bracket, and will not be repeated in this application.

[0070] It should be noted that in the examples and description of the present application, relational terms such as first and second, etc. are merely used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply the existence of any such actual relationship or order between these entities or operations. Moreover, the terms "comprise", "include" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the statement "comprises a" does not exclude the presence of other identical elements in the process, method, article or device comprising the element.

[0071] While the present application has been shown and described with reference to certain preferred embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the scope of the present application.

Claims

1. An electronic device, characterized in that: include: A first housing, a circuit board bracket, a first circuit board, a microphone, and a second circuit board are sequentially arranged along a first direction, wherein: The first shell is provided with a first sound pickup hole, the circuit board bracket is provided with a second sound pickup hole, and the first circuit board is provided with a third sound pickup hole; The microphone is arranged on the first circuit board and corresponds to the position of the third sound pickup hole. The third sound pickup hole, the second sound pickup hole and the first sound pickup hole are connected in sequence to form a sound pickup channel of the microphone. The first circuit board, the microphone and the second circuit board are all arranged on the same side of the circuit board bracket away from the first housing, and the first circuit board is used to electrically connect the microphone and the second circuit board.

2. The electronic device according to claim 1, wherein The first sound pickup hole penetrates the first shell along the first direction, The second sound pickup hole passes through the circuit board bracket along the first direction or the second direction, wherein the angle between the second direction and the first direction is an acute angle; The third sound pickup hole passes through the first circuit board along the first direction.

3. The electronic device according to claim 1, wherein The first circuit board includes a first surface and a second surface disposed opposite to each other along the first direction. The first circuit board is fixedly connected to the circuit board bracket via the first surface. The microphone is arranged on the second surface, and a conductive member is also provided on the second surface. The conductive member is electrically connected to the second circuit board.

4. The electronic device according to claim 1, wherein: The circuit board bracket includes a plurality of brackets stacked in sequence along the first direction, wherein each of the brackets is provided with a through hole, the through hole penetrates the bracket along the second direction, and, The multiple through holes corresponding to the multiple brackets are connected in sequence to form the second sound pickup hole.

5. The electronic device according to claim 4, characterized in that The plurality of brackets include a first bracket and a second bracket, wherein, The first bracket is provided with a first through hole, the second bracket is provided with a second through hole, and the first through hole is communicated with the second through hole to form the second sound pickup hole.

6. The electronic device according to claim 5, characterized in that An opening of the first through hole close to the second through hole and an opening of the first through hole connected to the first through hole are offset in the first direction.

7. The electronic device according to claim 5, wherein: The first bracket is arranged between the second bracket and the first shell; A first groove is provided on a surface of the first bracket facing the second bracket, and a second groove is provided on a surface of the second bracket facing the first bracket; The first through hole extends from the bottom of the first groove to the surface of the first bracket facing the first housing, and the second through hole extends from the bottom of the second groove to the surface of the second bracket facing the second circuit board.

8. The electronic device according to claim 7, wherein: A filling piece is provided in the cavity formed by the first groove and the second groove. The filling piece is provided with a third through hole. One end of the third through hole is communicated with the first through hole, and the other end of the third through hole is communicated with the second through hole.

9. The electronic device according to any one of claims 2, 4-8, characterized in that: The angle between the second direction and the first direction is 0 to 38 degrees.

10. The electronic device according to claim 3, wherein: The first circuit board is glued to the circuit board bracket.

11. The electronic device according to claim 1, wherein A sealing member is provided between the first shell and the circuit board bracket.

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