Multi-PCB production method in which common component similarity is reflected

Abstract

The present invention provides a multi-PCB production method for mounting components by using a plurality of pieces of equipment, comprising the steps of: calculating board similarity on the basis of the proportion of common components and the proportion of common mounting points between a plurality of different boards, and dividing the plurality of different boards into a plurality of bands on the basis of the calculated board similarity and grouping same; calculating the number of band-specific feeders on the basis of the maximum number of band-specific mounting points with respect to each component so as to allocate feeders to each band, and distributing mounting points of a board to each feeder allocated to a band; and moving and allocating a common component in the same equipment or between different pieces of equipment on the basis of the board similarity and a change value of productivity before and after the movement of the common component between the plurality of different boards.

Description

A multi-PCB production method that reflects the similarity of common components.

[0001] Embodiments of the present invention relate to a method for producing multiple PCBs that reflect common component similarity.

[0002] Multi-product manufacturing involves a wide variety of products and small production volumes for each. To efficiently produce a variety of PCBs, manufacturers prefer to produce multiple PCBs simultaneously, rather than individually. Optimization for multi-PCBs can be performed in two ways: sequential optimization for each PCB and full PCB optimization. In sequential optimization, optimization is performed sequentially, starting with the first PCB. Full PCB optimization optimizes all PCBs simultaneously. Depending on the common component layout of multi-PCBs, the results of sequential and full optimization can vary significantly. Users often resort to manual intervention after optimization to achieve optimal results.

[0003] In PCB sequential execution mode, single-PCB sequential optimization results in a prioritized PCB, resulting in poor performance for lower-priority PCB optimization. With the prioritized PCB optimization results fixed, lower-priority PCBs cannot achieve good results. As the number of PCBs and equipment on the line increases, the efficiency of work-balancing optimization deteriorates.

[0004] In PCB Full Run mode, all PCBs are executed simultaneously, but due to the lack of consideration for common component ratios and board-to-board similarity, optimization performance is poor. Furthermore, the overhead of single-component equipment tasks leads to manual user intervention. As demand for multi-product manufacturing grows, maximum productivity for multiple PCBs is becoming increasingly essential.

[0005] The present invention aims to address various issues, including those described above, by providing a method for producing multiple PCBs that reflects the similarity of common components. However, these tasks are exemplary and do not limit the scope of the present invention.

[0006] According to one aspect of the present invention, a method for producing a multi-PCB on which components are mounted using a plurality of pieces of equipment is provided, the method comprising: calculating board similarity based on a ratio of common components and a ratio of common mounting points between different plurality of boards; dividing and grouping different plurality of boards into a plurality of bands based on the calculated board similarity; calculating the number of feeders per band based on the maximum number of mounting points per band for each component and allocating feeders to each band; and distributing the mounting points of boards to each feeder allocated to the band; and moving and allocating common components within the same equipment or between different equipment based on a change in productivity before and after movement of common components between different plurality of boards and the board similarity.

[0007] The step of grouping the above boards may include a step of calculating board similarity by assigning preset weights to the ratio of common components and the ratio of common mounting points between different first and second boards, and a step of grouping the first board and the second board into one band when the board similarity is greater than or equal to the preset value.

[0008] The step of grouping the boards may include a step of calculating board similarity by assigning preset weights to the ratio of common components and the ratio of common mounting points between different first boards, second boards, and third boards, and a step of grouping the first board, the second board, and the third board into one band when the board similarity is greater than or equal to the preset value.

[0009] The step of distributing the above mounting points may include a step of checking the maximum number of mounting points among the number of mounting points of boards belonging to each band for each component, a step of calculating the number of feeders per band based on the maximum number of mounting points, and a step of allocating feeders per band based on the number of feeders per band.

[0010] The step of distributing the above mounting points may include a step of calculating the number of mounting points per feeder for each board by dividing the number of mounting points of boards belonging to each band by the number of feeders per band, and a step of distributing mounting points per board based on the number of mounting points per feeder for each feeder assigned to the band.

[0011] The step of moving and allocating the common component may include the step of calculating the GOB (Gantry of Balancing) of the first board and the second board having the common component with the first board before and after the movement of the common component within the same equipment, and the step of moving the common component within the same equipment when the GOB of the second board increases before and after the movement of the common component.

[0012] The step of moving and allocating the common component may include a step of moving the common component within the same equipment when the GOB change amount before and after the movement of the common component of the second board is greater than the product of the board similarity between the first board and the second board and the GOB change amount before and after the movement of the common component of the second board.

[0013] The step of moving and allocating the common component may include the step of calculating the LOB (Line of Balancing) of the first board and the second board having the common component with the first board before and after the movement of the common component within another device, and the step of moving the common component within another device when the LOB of the second board becomes larger than the LOB of the first board after the movement of the common component.

[0014] The step of moving and allocating the common component may include the step of calculating a deviation production time compared to the average production time for each piece of equipment for the second board before and after moving the common component between different pieces of equipment, and the step of moving the common component within the different pieces of equipment when the absolute value of the deviation production time decreases before and after moving the common component.

[0015] Other aspects, features and advantages other than those described above will become apparent from the following detailed description, claims and drawings for carrying out the invention.

[0016] According to one embodiment of the present invention, as described above, a multi-PCB production method can be implemented that effectively improves the productivity of multi-PCB production by reflecting common component similarity. Of course, the scope of the present invention is not limited by these effects.

[0017] FIG. 1 is a flowchart illustrating a multi-PCB production method according to one embodiment of the present invention.

[0018] FIGS. 2 to 4 are diagrams for explaining band grouping according to board similarity according to one embodiment of the present invention.

[0019] FIG. 5 is a drawing for explaining a method of distributing mounting points of a board to a feeder according to one embodiment of the present invention.

[0020] FIG. 6 is a drawing for explaining a method for moving common parts between gantries within the same equipment according to one embodiment of the present invention.

[0021] FIG. 7 is a drawing for explaining a method for moving common parts between different devices according to one embodiment of the present invention.

[0022] The present invention is capable of various modifications and embodiments. Specific embodiments are illustrated in the drawings and described in detail in the detailed description. The effects and features of the present invention, as well as the methods for achieving them, will become clearer with reference to the embodiments described in detail below, along with the drawings. However, the present invention is not limited to the embodiments disclosed below and can be implemented in various forms.

[0023] Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings. When describing with reference to the drawings, identical or corresponding components are given the same reference numerals and redundant descriptions thereof will be omitted.

[0024] In the following examples, terms such as "first" and "second" are not used in a limiting sense, but rather to distinguish one component from another. Furthermore, singular expressions include plural expressions unless the context clearly dictates otherwise. Furthermore, terms such as "include" and "have" imply the presence of features or components described in the specification, but do not exclude the possibility that one or more other features or components may be added.

[0025] For convenience of explanation, the sizes of components in the drawings may be exaggerated or reduced. For example, the sizes and thicknesses of each component shown in the drawings are arbitrarily indicated for convenience of explanation, and thus the present invention is not necessarily limited to what is shown.

[0026] In the following embodiments, when a part such as an area, component, sub-part, block or module is said to be on or above another part, this includes not only the case where it is directly on top of the other part, but also the case where another area, component, sub-part, block or module is interposed therebetween. And when it is said that an area, component, sub-part, block or module is connected, this includes not only the case where the areas, components, sub-parts, blocks or modules are directly connected, but also the case where another area, component, sub-part, block or module is interposed therebetween and is indirectly connected therebetween.

[0027] Hereinafter, various embodiments of the present invention will be described in detail with reference to the attached drawings so that a person having ordinary skill in the art to which the present invention pertains can easily practice the present invention.

[0028] FIG. 1 is a flowchart illustrating a multi-PCB production method according to one embodiment of the present invention.

[0029] A method for producing multiple PCBs according to one embodiment of the present invention may be performed by a multiple PCB production device. For example, the multiple PCB production device according to one embodiment of the present invention may be a device that produces multiple PCBs using multiple pieces of equipment in an SMT (Surface Mounting Technology) line equipped with multiple pieces of equipment. The multiple PCB production device according to one embodiment of the present invention may include a memory, a processor, and a communication module. However, the present invention is not limited thereto, and some components of the multiple PCB production device may be separated into multiple devices, or multiple components may be merged into a single device.

[0030] Memory is a computer-readable storage medium, which may include random access memory (RAM), read-only memory (ROM), and permanent mass storage devices such as disk drives. Furthermore, memory may temporarily or permanently store program code for controlling multiple PCB production devices.

[0031] The processor controls the overall operation of the multi-PCB production device. For example, the processor may be implemented in a form that optionally includes a processor, an Application-Specific Integrated Circuit (ASIC), another chipset, a logic circuit, a register, a communication modem, and / or a data processing device known in the art to perform the above-described operations. For example, the processor may perform basic arithmetic, logic, and input / output operations, and may execute program code stored in memory, for example. The processor may store data in memory or load data stored in memory.

[0032] The communication module may provide functionality for communicating with an external server via a network. For example, a request generated by a processor based on program code stored in a storage device such as memory may be transmitted to an external server via a network under the control of the communication module. Conversely, control signals, commands, content, files, etc. provided by the external server's processor under the control of the communication module may be received via the network through the communication module. For example, control signals or commands from an external server received via the communication module may be transmitted to the processor or memory.

[0033] The communication method is not limited, and may include not only a communication method that utilizes a communication network that the network may include (e.g., a mobile communication network, a wired Internet, a wireless Internet, a broadcasting network), but also short-range wireless communication between devices. For example, the network may include any one or more of a personal area network (PAN), a local area network (LAN), a campus area network (CAN), a metropolitan area network (MAN), a wide area network (WAN), a broadband network (BBN), and the Internet. In addition, the network may include any one or more of a network topology including, but not limited to, a bus network, a star network, a ring network, a mesh network, a star-bus network, a tree, or a hierarchical network.

[0034] Additionally, the communication module can communicate with production equipment installed on the line via a network. The communication method is not limited, but the network can be a short-range wireless communication network. For example, the network can be Bluetooth, Bluetooth Low Energy (BLE), or Wi-Fi.

[0035] Additionally, the multi-PCB production device according to the present invention may include an input / output interface. The input / output interface may be a means for interfacing with an input / output device. The input / output interface may display status information of the production equipment. For example, the input device may include a device such as a keyboard or mouse, and the output device may include a device such as a display for displaying a communication session of an application. As another example, the input / output interface may be a means for interfacing with a device that integrates input and output functions, such as a touchscreen.

[0036] Such a processor can control a multi-PCB production device to perform steps (S110 to S130) included in the multi-PCB production method of FIG. 1. For example, the processor and components of the processor can be implemented to execute instructions according to the code of an operating system and the code of at least one program included in the memory. Here, the components of the processor can be representations of different functions of the processor performed by the processor according to instructions provided by the program code stored in the multi-PCB production device. The internal configuration and specific operation of the processor will be described with reference to the flowchart of the multi-PCB production method of FIG. 1.

[0037] In step S110, a multi-PCB production method according to one embodiment of the present invention calculates board similarity based on the ratio of common components and the ratio of common mounting points between a plurality of different boards, and groups the plurality of different boards into a plurality of bands based on the calculated board similarity.

[0038] In step S120, a multi-PCB production method according to one embodiment of the present invention calculates the number of feeders per band based on the maximum number of mounting points per band for each component, allocates feeders to each band, and distributes mounting points of the board to each feeder assigned to the band.

[0039] In step S130, a multi-PCB production method according to one embodiment of the present invention goes through a step of moving and allocating common components within the same equipment or between different equipment based on the change in productivity before and after moving common components between different boards and the board similarity.

[0040] FIGS. 2 to 4 are diagrams for explaining band grouping according to board similarity according to one embodiment of the present invention.

[0041] Referring to FIGS. 2 to 4, drawings are shown explaining a step of grouping boards in a multi-PCB production method according to one embodiment of the present invention.

[0042] The step of grouping boards according to one embodiment of the present invention may include a step of calculating board similarity by assigning preset weights to the ratio of common components and the ratio of common mounting points between different first and second boards, respectively.

[0043] Additionally, the step of grouping boards according to one embodiment of the present invention may include the step of grouping the first board and the second board into one band when the board similarity is greater than or equal to a preset value.

[0044] For example, board similarity can represent a value that quantifies the similarity between multiple PCBs. For example, boards with high board similarity can be grouped into a single band. Accordingly, boards within a single band can represent a group of boards with high similarity.

[0045] Board similarity can be calculated by weighting the proportion of common components and common mounting points between boards, as shown in the following mathematical formula.

[0046] Board Similarity = W c *N(c) / T(c) + W p *N(p) / T(p)

[0047] Here, Wc = 0.4 (common part weight), Wp = 0.6 (common mounting point weight), N(c) = number of common parts, T(c) = total number of parts, N(p) = number of common mounting points, T(p) = total number of mounting points can be represented.

[0048] For example, if the board similarity is 85% or higher, the similarity is considered high and the boards can be grouped into one band.

[0049] The step of grouping boards according to one embodiment of the present invention may include a step of calculating board similarity by assigning preset weights to the ratio of common components and the ratio of common mounting points between different first boards, second boards, and third boards, respectively.

[0050] In addition, the step of grouping boards according to one embodiment of the present invention may include the step of grouping the first board, the second board, and the third board into one band when the board similarity is greater than or equal to a preset value.

[0051] For example, referring to FIG. 2, a table is shown for an example of grouping six boards. For example, board similarity can be calculated in order of board ID starting from board ID 1000. First, if the similarity between board IDs 1000 and 2000 exceeds 85%, they can be configured as a single band, and band 1 (band ID 1) can be created. Here, Comp can represent the number of components mounted on the board, and Plc can represent the number of mounting points on the board where the components are mounted.

[0052] Next, for board ID 3000, the similarity of three boards, 1000, 2000, and 3000, can be calculated. In this case, if the board similarity exceeds 85%, board 3000 is also included in band 1 together with boards 1000 and 2000, and if the board similarity does not exceed 85%, board 3000 is not included in band 1. For example, referring to Fig. 2(a), board 3000 was not included in band 1 in the embodiment of Fig. 2. Next, the similarity with respect to band 1 is also calculated for boards 4000, 5000, and 6000, and if the board similarity exceeds 85%, boards 1000 and 2000 are included in band 1, and if the board similarity does not exceed 85%, boards 3000 are not included in band 1. For example, referring to FIG. 2(a), in the embodiment of FIG. 2, boards 4000, 5000, and 6000 are not included in band 1.

[0053] Next, for board 3000, the similarity between boards 3000 and 4000 does not exceed 85%, so they are not configured as a single band. Next, for boards 5000 and 6000, the similarity also does not exceed 85%, so board 3000 can be grouped into band 2 (band ID 2) alone.

[0054] Next, for board 4000, since the similarity between boards 4000 and 5000 does not exceed 85%, they are not configured as a single band, and since the similarity between boards 4000 and 6000 exceeds 85%, boards 4000 and 6000 can be grouped into band 3 (band ID 3). Next, board 5000 can be grouped alone into band 4 (band ID 4).

[0055] For example, inter-band board similarity can be calculated during the band grouping stage. For example, the board similarity between bands 1 and 2 can represent the similarity between boards 1000, 2000, and 3000. For example, referring to Figure 2(b), which illustrates inter-band similarity, it can be seen that the similarity between bands 2 and 4 is 63.9%.

[0056] Referring to FIG. 3(a), in one embodiment of the present invention, four boards, 1000, 3000, 5000, and 7000, can be grouped into band 1, and four boards, 2000, 4000, 6000, and 8000, can be grouped into band 2. In addition, referring to FIG. 3(b), it can be seen that the similarity between band 1 and band 2 is 54.6%.

[0057] Referring to FIG. 4(a) and FIG. 4(b), in one embodiment of the present invention, seven boards, 1000, 2000, 3000, 4000, 5000, 6000, and 7000, can be grouped into seven bands, band 1 to band 7, respectively.

[0058] FIG. 5 is a drawing for explaining a method for distributing board mounting points on a feeder according to one embodiment of the present invention. For example, in the embodiment of FIG. 5, four boards, namely board 1, board 3, board 5, and board 7, may be grouped into band 1, and four boards, namely board 2, board 4, board 6, and board 8, may be grouped into band 2.

[0059] The step of distributing mounting points according to one embodiment of the present invention may include a step of checking the maximum number of mounting points among the number of mounting points of boards belonging to each band for each component.

[0060] For example, referring to FIG. 5(a), for component ID 45 and component ID 87, the number of mounting points of boards belonging to band 1 and band 2 can be confirmed for each component.

[0061] Also, referring to FIG. 5(b), the maximum number of mounting points for each component can be confirmed for bands 1 and 2. For example, in band 1, the maximum number of mounting points for boards 5 and 7 for component ID 45 is 360. In addition, in band 2, the maximum number of mounting points for boards 2 and 4 for component ID 45 is 78.

[0062] The step of distributing mounting points according to one embodiment of the present invention may include a step of calculating the number of feeders per band based on the maximum number of mounting points. For example, referring to FIG. 5(b), for component ID 45, three feeders may be calculated for band 1, and one feeder may be calculated for band 2. For example, the number of feeders per band may be calculated based on the total number of mounting points, the total number of feeders, and the mounting point ratio. Here, the total number of feeders may be preset.

[0063] The step of distributing mounting points according to one embodiment of the present invention may include a step of allocating feeders to each band based on the number of feeders to each band. For example, referring to FIGS. 5(c) and 5(d), which are examples of a component with component ID 45, conventionally, feeders are evenly distributed to each band as shown in FIG. 5(c), with feeders 1 to 4 allocated to band 1 and feeders 1 to 3 allocated to band 2. However, according to the present invention, feeders 1 to 3 may be allocated to band 1 and feeder 4 may be allocated to band 2.

[0064] The step of distributing mounting points according to one embodiment of the present invention may include a step of calculating the number of mounting points for each feeder for each board by dividing the number of mounting points for boards belonging to each band by the number of feeders for each band. In addition, the step of distributing mounting points according to one embodiment of the present invention may include a step of distributing mounting points for each board based on the number of mounting points for each feeder assigned to the band.

[0065] For example, referring to FIG. 5(d), which is an example for part ID 45, for board 1 belonging to band 1, the number of mounting points is calculated as 116 by dividing 348 by 3, and 116 mounting points can be distributed to feeders 1 to 3.

[0066] Additionally, for board 3 belonging to band 1, the number of mounting points is calculated as 116 by dividing 348 by 3, and 116 mounting points can be distributed to feeders 1 to 3.

[0067] Additionally, for board 5 belonging to band 1, the number of mounting points is calculated as 120 by dividing 360 by 3, and 120 mounting points can be distributed to feeders 1 to 3.

[0068] Additionally, for board 7 belonging to band 1, the number of mounting points is calculated as 120 by dividing 360 by 3, and 120 mounting points can be distributed to feeders 1 to 3.

[0069] Additionally, for board 2 belonging to band 2, the number of mounting points is calculated as 78 by dividing 78 by 1, and 78 mounting points can be distributed to feeder 4.

[0070] Additionally, for board 4 belonging to band 2, the number of mounting points is calculated as 78 by dividing 78 by 1, and 78 mounting points can be distributed to feeder 4.

[0071] Additionally, for board 6 belonging to band 2, the number of mounting points is calculated as 74 by dividing 74 by 1, and 74 mounting points can be distributed to feeder 4.

[0072] Additionally, for board 8 belonging to band 2, the number of mounting points is calculated as 74 by dividing 74 by 1, and 74 mounting points can be distributed to feeder 4.

[0073] FIG. 6 is a drawing for explaining a method for moving common parts between gantries within the same equipment according to one embodiment of the present invention.

[0074] The step of moving and allocating common components according to one embodiment of the present invention may include the step of calculating GOB (Gantry of Balancing) of a first board before and after moving the common components within the same equipment and a second board having the common components with the first board, respectively. For example, GOB is a cycle time equalization rate between Gantries and may be calculated as GOB = Average Gantry Cycle Time / Max Gantry Cycle Time. In addition, each board may have a GOB value for each equipment. Here, the first board is a board currently selected for calculation for moving the common components, and the second board may represent another board having the common components with the first board.

[0075] In addition, the step of moving and allocating a common component according to one embodiment of the present invention may include a step of moving the common component within the same equipment when the GOB of the second board increases before and after the movement of the common component. For example, referring to Fig. 6(a), in case 1-1, since the GOB of the second board increases from 0.7 to 0.8, the movement of the common component is possible. In addition, in case 1-2, since the GOB of the second board decreases from 0.7 to 0.6, the movement of the common component is not possible. However, in this case, the movement of the common component may be possible by considering a separate condition. Here, the separate condition is described in the embodiment for Fig. 6(b) below.

[0076] In addition, the step of moving and allocating a common component according to one embodiment of the present invention may include a step of moving the common component within the same equipment when the GOB change amount before and after the movement of the common component of the second board is greater than the value obtained by multiplying the board similarity between the first board and the second board by the GOB change amount before and after the movement of the common component of the second board.

[0077] For example, referring to Fig. 6(b), the GOB of another board before and after the common component movement is calculated within the same equipment, and if the GOB increases, the common component movement is possible, and if the GOB decreases, the movement is impossible. Even in this case, if the value obtained by multiplying the GOB change amount of another board (e.g., the second board) by the board similarity and the GOB change amount of the current board (e.g., the first board) are compared, and if the value obtained by multiplying the GOB change amount of another board by the board similarity < the GOB change amount of the current board, the common component movement is possible. On the other hand, if the value obtained by multiplying the GOB change amount of another board by the board similarity > the GOB change amount of the current board, the common component movement is impossible. For example, in the case of the first embodiment of Fig. 6(b), the common component movement is possible because the value obtained by multiplying the GOB change amount of another board by the board similarity of 0.5, which is 0.2, is less than the GOB change amount of the current board by 0.8.

[0078] In the second embodiment of Fig. 6(b), the value 0.1, which is the product of the board similarity 0.5 and the GOB change amount of the other board 0.2, is greater than the GOB change amount of the current board 0.05, making common component movement impossible. Here, the board similarity may represent the board similarity between the first board and the second board.

[0079] FIG. 7 is a drawing for explaining a method for moving common parts between different devices according to one embodiment of the present invention.

[0080] The step of moving and allocating common components according to one embodiment of the present invention may include a step of calculating LOB (Line of Balancing) of a first board before and after moving the common components within another piece of equipment and a second board having common components with the first board, respectively. For example, LOB is a cycle time equalization rate between machines, and may be calculated as LOB = Average Machine Cycle Time / Max Machine Cycle Time. In addition, each board may have its own LOB value. Here, the first board is a board currently selected for calculation for moving the common components, and the second board may represent another board having common components with the first board.

[0081] Additionally, the step of moving and allocating a common component according to one embodiment of the present invention may include a step of moving the common component within another piece of equipment when the LOB of the second board becomes larger than the LOB of the first board after the movement of the common component.

[0082] The step of moving and allocating common components according to one embodiment of the present invention may include calculating a deviation production time relative to the average production time for each piece of equipment for the second board before and after moving the common components between different pieces of equipment. For example, the deviation production time relative to the average production time may represent the difference between the current cycle time and the average cycle time for each piece of equipment.

[0083] Additionally, the step of moving and allocating a common component according to one embodiment of the present invention may include a step of moving the common component within another piece of equipment if the absolute value of the deviation production time decreases before and after the common component is moved. For example, if the absolute value of the Deviation Time is calculated before and after the common component is moved between different pieces of equipment (between the Source equipment and the Target equipment), and the value decreases (e.g., becomes close to 0), the common component may be moved.

[0084] For example, referring to Fig. 7(a), in the case of a source device in which a part is missing and the Deviation Time becomes negative (-), movement of a common part may be possible when the Deviation Time changes from +5 to +3 and when it changes from +5 to -3.

[0085] Also, referring to Fig. 7(b), in the case of a target device in which a part is added and the Deviation Time becomes positive (+), movement of common parts may be possible when the Deviation Time changes from -5 to -3 and from -5 to +2.

[0086] According to the present invention, the productivity of multi-PCB production can be improved by considering the similarity of common components between boards and reflecting line production conditions to maximize multi-PCB productivity.

[0087] The devices and / or systems described above may be implemented as hardware components, software components, and / or a combination of hardware components and software components. The devices and components described in the embodiments may be implemented using one or more general-purpose computers or special-purpose computers, such as, for example, a processor, a controller, an arithmetic logic unit (ALU), a digital signal processor, a microcomputer, a field programmable gate array (FPGA), a programmable logic unit (PLU), a microprocessor, or any other device capable of executing instructions and responding to them. The processing device may execute an operating system (OS) and one or more software applications running on the operating system. In addition, the processing device may access, store, manipulate, process, and generate data in response to the execution of the software. For ease of understanding, the processing device is sometimes described as being used alone; however, one of ordinary skill in the art will recognize that the processing device may include multiple processing elements and / or multiple types of processing elements. For example, a processing unit may include multiple processors, or a processor and a controller. Other processing configurations, such as parallel processors, are also possible.

[0088] Software may include computer programs, codes, instructions, or a combination of one or more of these, which may configure a processing device to perform a desired operation or may, independently or collectively, command the processing device. The software and / or data may be permanently or temporarily embodied in any type of machine, component, physical device, virtual equipment, computer storage media or device, or transmitted signal waves, for interpretation by the processing device or for providing instructions or data to the processing device. The software may also be distributed over networked computer systems and stored or executed in a distributed manner. The software and data may be stored on one or more computer-readable recording media.

[0089] The method according to the embodiment may be implemented in the form of program commands that can be executed through various computer means and recorded on a computer-readable medium. The computer-readable medium may include program commands, data files, data structures, etc., alone or in combination. The program commands recorded on the medium may be those specially designed and configured for the embodiment or may be those known and available to those skilled in the art of computer software. Examples of the computer-readable recording medium include magnetic media such as hard disks, floppy disks, and magnetic tapes, optical media such as CD-ROMs and DVDs, magneto-optical media such as floptical disks, and hardware devices specially configured to store and execute program commands, such as ROMs, RAMs, and flash memories. Examples of the program commands include not only machine language codes generated by a compiler, but also high-level language codes that can be executed by a computer using an interpreter, etc. The above-mentioned hardware devices may be configured to operate as one or more software modules to perform the operations of the embodiment, and vice versa.

[0090] Although the embodiments described above have been described by way of limited examples and drawings, those skilled in the art will appreciate that various modifications and variations can be made based on the above teachings. For example, appropriate results can still be achieved even if the described techniques are performed in a different order than described, and / or components of the described systems, structures, devices, circuits, etc. are combined or combined in a different manner than described, or are replaced or substituted with other components or equivalents.

[0091] Therefore, other implementations, other embodiments, and equivalents to the claims also fall within the scope of the claims described below.

Claims

1. A method for producing a multi-PCB on which components are mounted using multiple equipment, A step of calculating board similarity based on the ratio of common components and the ratio of common mounting points between a plurality of different boards, and dividing a plurality of different boards into a plurality of bands and grouping them based on the calculated board similarity; A step of calculating the number of feeders per band based on the maximum number of mounting points per band for each component, allocating feeders to each band, and distributing mounting points of the board to each feeder assigned to the band; and A step of moving and allocating common components within the same equipment or between different equipment based on the change in productivity before and after moving common components between different boards and the board similarity; A method for producing multiple PCBs, comprising:

2. In paragraph 1, The steps for grouping the above boards are: A step of calculating board similarity by assigning preset weights to the ratio of common components and the ratio of common mounting points between different first and second boards; and A method for producing multiple PCBs, comprising the step of grouping the first board and the second board into one band when the board similarity is greater than or equal to a preset value.

3. In paragraph 1, The steps for grouping the above boards are: A step of calculating board similarity by assigning preset weights to the ratio of common components and the ratio of common mounting points between different first boards, second boards, and third boards, respectively; and A method for producing multiple PCBs, comprising the step of grouping the first board, the second board, and the third board into one band when the board similarity is greater than or equal to a preset value.

4. In paragraph 1, The step of distributing the above mounting points is: A step for checking the maximum number of mounting points among the number of mounting points of boards belonging to each band for each component; A step of calculating the number of feeders per band based on the number of the maximum mounting points; and A method for producing multiple PCBs, comprising the step of allocating feeders for each band based on the number of feeders for each band.

5. In paragraph 4, The step of distributing the above mounting points is: A step of calculating the number of mounting points for each feeder for each board by dividing the number of mounting points of boards belonging to each band by the number of feeders for each band; and A method for producing multiple PCBs, comprising the step of distributing mounting points to each board based on the number of mounting points per feeder assigned to each band.

6. In paragraph 1, The step of moving and assigning the above common parts is: A step of calculating the GOB (Gantry of Balancing) of the first board before and after the movement of common components within the same equipment and the second board having common components with the first board respectively; and A method for producing multiple PCBs, comprising the step of moving common components within the same equipment when the GOB of the second board increases before and after moving the common components.

7. In paragraph 6, A method for producing multi-PCBs, wherein the step of moving and allocating the common component includes the step of moving the common component within the same equipment when the amount of change in GOB of the common component of the first board before and after the movement is greater than the product of the amount of change in GOB of the common component of the second board before and after the movement and the board similarity between the first board and the second board.

8. In paragraph 1, The step of moving and assigning the above common parts is: A step of calculating the LOB (Line of Balancing) of the first board before and after the movement of common components within another device and the second board having common components with the first board, respectively; and A method for producing multiple PCBs, comprising the step of moving common components within another piece of equipment when the LOB of the second board becomes larger than the LOB of the first board after moving the common components.

9. In paragraph 8, The step of moving and assigning the above common parts is: A step of calculating the deviation production time for each equipment compared to the average production time for the second board before and after moving common parts between different equipment; and A method for producing multiple PCBs, comprising a step of moving common components within different equipment when the absolute value of the above-mentioned deviation production time decreases before and after moving the common components.

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