Frame comprising dissimilar metals and electronic device comprising same

Abstract

An electronic device according to various embodiments disclosed herein may include a frame. The frame may include a metal portion and a polymer portion bonded to the metal portion. The metal portion may comprise: a first metal member including a first bonding surface; a second metal member made of a different material from the first metal member and including a second bonding surface; and a third metal member bonded to the first bonding surface of the first metal member and bonded to the second bonding surface of the second metal member. The polymer portion may be disposed to cover at least a portion of the first bonding surface and the second bonding surface exposed to the surface of the metal portion.

Description

Frame comprising dissimilar metals and electronic device comprising the same

[0001] Various embodiments of the present disclosure relate to a frame of an electronic device, and more particularly, to a frame including dissimilar metals and an electronic device including the same.

[0002] Electronic devices may include a frame to support components (e.g., a display, a substrate, a camera, and / or a battery). Metal materials are widely used as frames for portable electronic devices due to their high strength and impact resistance.

[0003] Additionally, electronic devices may include a housing that protects various internal components of the electronic device from external environments such as external forces, impacts, contaminants, and corrosive elements (e.g., water, electrolytes, and / or oxygen). Certain metallic materials can be used as the housing of electronic devices because they have airtightness, corrosion resistance, and high hardness. The side portion of the housing may be combined or integrated with an internal frame and may be referred to as a side frame.

[0004] Various metal materials, including aluminum, are used as frames for electronic devices due to their relative lightness compared to other metals, high strength and impact toughness, and excellent workability. Furthermore, other metal materials, including stainless steel and / or titanium, have relatively high corrosion resistance and hardness, making them suitable for the housing exterior of electronic devices (e.g., side frames). However, when forming the frame of an electronic device by bonding dissimilar metal materials, corrosion can occur at the joints due to differences in redox potentials between the dissimilar metal elements. Furthermore, the joints between dissimilar metal elements are mechanically fragile, making them prone to separation.

[0005] According to various embodiments of the present disclosure, an electronic device including a heterogeneous metal frame having improved corrosion resistance and robustness can be provided.

[0006] An electronic device according to various embodiments of the present disclosure may be an electronic device including a frame. The frame may include a metal portion. The metal portion may include a first metal member including a first bonding surface and a second metal member having a different material from the first metal member and including a second bonding surface. The metal portion may include a third metal member bonded to the first metal member at the first bonding surface and bonded to the second metal member at the second bonding surface. The frame may include a polymer portion bonded to the metal portion. The polymer portion may be arranged to cover at least a portion of the first bonding surface and the second bonding surface exposed to the surface of the metal portion.

[0007] According to various embodiments of the present invention, a frame is a frame for an electronic device, and the frame may include a metal portion. The metal portion may include a first metal member including a first bonding surface and a second metal member having a different material from the first metal member and including a second bonding surface. The metal portion may include a third metal member that is bonded to the first metal member at the first bonding surface and is bonded to the second metal member at the second bonding surface. The frame may include a polymer portion bonded to the metal portion. The polymer portion may be arranged to cover at least a portion of the first bonding surface and the second bonding surface exposed to the surface of the metal portion.

[0008] According to various embodiments of the present disclosure, the interface between the first metal and the third metal and the interface between the second metal and the third metal, which are dissimilar metals, is covered by a polymer portion, thereby protecting the dissimilar metal interface from corrosive elements such as moisture that cause galvanic corrosion, thereby improving the corrosion resistance and sturdiness of the dissimilar metal frame.

[0009] FIG. 1 is a block diagram of an exemplary electronic device capable of performing the operations described herein.

[0010] FIG. 2A is a perspective view of the front of an electronic device according to various embodiments of the present disclosure.

[0011] FIG. 2b is a perspective view of the rear surface of an electronic device according to various embodiments of the present disclosure.

[0012] FIG. 3 is an exploded perspective view of an electronic device according to various embodiments of the present disclosure.

[0013] FIG. 4A is a perspective view showing a frame of an electronic device according to various embodiments.

[0014] FIG. 4b is an exploded perspective view showing a frame of an electronic device according to various embodiments.

[0015] FIG. 4c is a plan view and a side view showing a frame of an electronic device according to various embodiments.

[0016] FIG. 4d is a plan view showing a metal part of a frame according to various embodiments.

[0017] FIG. 5 is an enlarged plan view of a metal part according to various embodiments of the present invention.

[0018] FIG. 6 is an enlarged cross-sectional view of a frame of an electronic device according to various embodiments.

[0019] FIG. 7a is an enlarged cross-sectional view of a first metal member of a frame according to various embodiments.

[0020] FIG. 7b is an enlarged cross-sectional view of a frame according to various embodiments.

[0021] Figure 7c is an enlarged cross-sectional view of a frame according to various embodiments.

[0022] Figure 8 is a schematic diagram showing a process for manufacturing a frame according to various embodiments of the present invention.

[0023] FIG. 9A is a perspective view of a frame of an electronic device according to various embodiments.

[0024] FIG. 9b is a vertical cross-sectional view of a frame of an electronic device according to various embodiments.

[0025] Figure 9c is a vertical cross-sectional view of a metal portion of a frame according to various embodiments.

[0026] FIG. 9d is a horizontal cross-sectional view of a frame of an electronic device according to various embodiments.

[0027] FIG. 9e is a perspective view of a frame of an electronic device according to various embodiments.

[0028] FIG. 9F is a cross-sectional view of a frame of an electronic device according to various embodiments.

[0029] FIG. 10A is a perspective view of a frame of an electronic device according to various embodiments.

[0030] FIG. 10b is a horizontal cross-sectional view of a frame of an electronic device according to various embodiments.

[0031] FIG. 10c is a vertical cross-sectional view of a frame of an electronic device according to various embodiments.

[0032] Figure 10d is a vertical cross-sectional view of a frame of an electronic device according to a comparative example.

[0033] FIG. 1 is a block diagram of an exemplary electronic device (100) capable of performing the operations described in this document.

[0034] Referring to FIG. 1, the electronic device (100) may be one of various forms of electronic devices, such as a notebook (190), smartphones (191) having various form factors (e.g., a bar-type smartphone (191-1), a foldable-type smartphone (191-2), or a sliderable (or rollable) type smartphone (191-3)), a tablet (192), a cellular phone (not shown), and other similar computing devices (not shown). The components, their relationships, and their functions illustrated in FIG. 1 are exemplary only and do not limit the implementations described or claimed in this document. The electronic device (100) may be referred to as a mobile device, a user device, a multi-function device, a portable device, or a server.

[0035] The electronic device (100) may include components including at least one processor (110) (hereinafter referred to as processor (110)), at least one memory (120) (hereinafter referred to as memory (120)), at least one display (140) (hereinafter referred to as display (140)), at least one image sensor (150) (hereinafter referred to as image sensor (150)), at least one communication circuit (160) (hereinafter referred to as communication circuit (160)), and / or at least one sensor (170) (hereinafter referred to as sensor (170)). The above components are merely exemplary. For example, the electronic device (100) may include other components (e.g., power management integrated circuitry (PMIC), audio processing circuitry, an antenna, a rechargeable battery, or an input / output interface). For example, some components may be omitted from the electronic device (100). For example, some components may be integrated into one component.

[0036] The processor (110) may be implemented as one or more IC (integrated circuit (or circuitry)) chips and may perform various data processing. The processor (110) may include at least one electrical circuit and may individually or collectively perform distributed processing of instructions (or programs, data) stored in the memory (120). The processor (110) may include a processor assembly including one or more processing circuits. The processor (110) may include any processing circuit operative to control the performance and operations of one or more components (e.g., the memory (120), the display (140), the image sensor (150), the communication circuit (160), and / or the sensor (170)) of the electronic device (100). For example, the processor (110) (e.g., the application processor (AP)) may be implemented as a system on chip (SoC) (e.g., a single chip or a chipset). For example, the processor (110) may be implemented with multiple cores (or at least one core circuit), multiple chips, or multiple chipsets. For example, the processor (110) may include one or more processing circuits. For example, the processor (110) may include one or more processing circuits configured to individually and / or collectively perform various functions of the present disclosure. As a non-limiting example, at least a portion of the processor (110) may be included in a first chip of the electronic device (100), and at least another portion of the processor (110) may be included in a second chip of the electronic device (100) that is different from the first chip of the electronic device (100).

[0037] For example, the processor (110) may include a central processing unit (CPU) (111), a graphics processing unit (GPU) (112), a neural processing unit (NPU) (113), an image signal processor (ISP) (114), a display controller (115), a memory controller (116), a storage controller (117), a communication processor (CP) (118), and / or a sensor interface (119). These components of the processor (110) are merely exemplary. For example, the processor (110) may further include other components. For example, some components of the processor (110) may be omitted from the processor (110). For example, some components of the processor (110) may be included as separate components of the electronic device (100) outside the processor (110). For example, some components of the processor (110) (e.g., memory controller (116)) may be included within other components (e.g., at least a portion of memory (120), an interface (e.g., available for connection to at least one component of the electronic device (100)), a display (140) and / or an image sensor (150)).

[0038] The processor (110) may cause other components of the electronic device (100) to perform various operations by executing instructions stored in the memory (120). The CPU (111) (or central processing circuit) may be configured to control components of the processor (110) based on the execution of instructions stored in the memory (120) (e.g., volatile memory (121) and / or non-volatile memory (122)). The GPU (112) (or graphics processing circuit) may be configured to execute parallel operations (e.g., rendering). The NPU (113) (or neural processing circuit, or artificial intelligence (AI) chip) may be configured to execute operations for an artificial intelligence model (e.g., convolution computation). The ISP (114) (or image signal processing circuit) may be configured to process a raw image acquired through the image sensor (150) into a format suitable for a component within the electronic device (100) or a component of the processor (110). The display controller (115) (or display control circuit, or display processing unit (DPU)) may be configured to process an image acquired from the CPU (111), the GPU (112), the ISP (114), or the memory (120) (e.g., the volatile memory (121)) into a format suitable for the display (140). The memory controller (116) (or memory control circuit) may be configured to control reading data from the volatile memory (121) and writing data to the volatile memory (121). The storage controller (117) (or storage control circuit) may be configured to control reading data from the nonvolatile memory (122) and writing data to the nonvolatile memory (122).The CP (118) (communication processing circuit) may be configured to process data acquired from a component of the processor (110) into a format suitable for transmission to another electronic device via the communication circuit (160), or to process data acquired from another electronic device via the communication circuit (160) into a format suitable for processing by the component of the processor (110). For example, the communication circuit (160) may include one or more communication circuits. The sensor interface (119) (or sensing data processing circuit, sensor hub) may be configured to process data about the state of the electronic device (100) and / or the state of the surroundings of the electronic device (100), acquired via the sensor (170), into a format suitable for the component of the processor (110).

[0039] The memory (120) may include one or more storage media (or one or more storage devices). For example, the memory (120) may include a memory assembly including one or more storage media. For example, the one or more storage media may include permanent memory (e.g., non-volatile memory (122)) such as a hard drive, flash memory, read-only memory (ROM), semi-permanent memory (e.g., volatile memory (121)) such as random access memory (RAM), any other suitable type of storage (or storage assembly), or any combination thereof. The memory (120) may include cache memory, which is one or more different types of memory used to temporarily store data for a function or feature of the electronic device (100). As a non-limiting example, the cache memory may be included within the processor (110). The memory (120) may be fixedly embedded within the electronic device (100) or incorporated into one or more suitable types of components (e.g., a subscriber identity module (SIM) card and / or a secure digital (SD) card) that may be repeatedly inserted into and removed from the electronic device (100).

[0040] For example, the memory (120) may store one or more software applications, such as an operating system (or system) software application, a firmware software application, a driver software application, a plug-in (e.g., add-in, add-on, and / or applet) software application, and / or any other suitable software applications. For example, the one or more software applications may include instructions executable by the processor (110). For example, the memory (120) may store instructions callable by an application programming interface (API). For example, the memory (120) may store instructions within a library.

[0041] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0042] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0043] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0044] Various embodiments of the present document may be implemented as software (e.g., a program) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (100)). For example, a processor (e.g., a processor (110)) of the machine (e.g., an electronic device (100)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0045] According to one embodiment, the method according to various embodiments disclosed in the present document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0046] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0047] FIG. 2A is a perspective view of the front of an electronic device according to various embodiments of the present disclosure. FIG. 2B is a perspective view of the rear of the electronic device of FIG. 2A according to various embodiments of the present disclosure.

[0048] The electronic device (200) of FIGS. 2A and 2B may be at least partially similar to the electronic device (100) of FIG. 1 or may include various embodiments of the electronic device.

[0049] Referring to FIGS. 2A and 2B , an electronic device (200) according to one embodiment may include a housing (210) that includes a first side (or front side) (210A), a second side (or back side) (210B), and a side surface (210C) that surrounds a space between the first side (210A) and the second side (210B). In one embodiment (not shown), the housing (210) may also refer to a structure that forms a portion of the first side (210A), the second side (210B), and the side surface (210C). According to one embodiment, the first side (210A) may be formed by a front plate (202) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate including various coating layers). The second side (210B) may be formed by a substantially opaque back plate (211). The rear plate (211) may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The side (210C) may be formed by a side frame (or “side member”) (218) that is coupled to the front plate (202) and the rear plate (211) and comprises a metal and / or polymer. In some embodiments, the rear plate (211) and the side frame (218) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).

[0050] In the illustrated embodiment, the front plate (202) may include a first region (210D) that extends seamlessly from the first surface (210A) toward the rear plate, at both ends of a long edge of the front plate. In the illustrated embodiment (see FIG. 2B), the rear plate (211) may include a second region (210E) that extends seamlessly from the second surface (210B) toward the front plate, at both ends of a long edge. In some embodiments, the front plate (202) or the rear plate (211) may include only one of the first region (210D) or the second region (210E). In some embodiments, the front plate (202) and the rear plate (211) may not include the first region and the second region, but may only include a flat plane that is arranged parallel to the second surface (210B). In the above embodiments, when viewed from the side of the electronic device, the side frame (218) may have a first thickness (or width) on the side that does not include the first region (210D) or the second region (210E), and may have a second thickness that is thinner than the first thickness on the side that includes the first region or the second region.

[0051] According to one embodiment, the electronic device (200) may include at least one of a display (300), an input device (203), an audio output device (207, 214), a sensor module (204, 219), a camera module (205, 212, 213), a key input device (217), an indicator (not shown), and a connector (208). In some embodiments, the electronic device (200) may omit at least one of the components (e.g., the key input device (217) or the indicator) or may additionally include other components.

[0052] The display (300) may be exposed, for example, through a substantial portion of the front plate (202). In some embodiments, at least a portion of the display (300) may be exposed through the front plate (202), which forms the first surface (210A) and the first region (210D) of the side surface (210C). The display (300) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer for detecting a magnetic field-type stylus pen. In some embodiments, at least a portion of the sensor modules (204, 219), and / or at least a portion of the key input device (217), may be disposed in the first region (210D), and / or the second region (210E).

[0053] The input device (203) may include a microphone. In some embodiments, the input device (203) may include a plurality of microphones arranged to detect the direction of sound. The audio output device (207, 214) may include speakers. The speakers may include an external speaker (207) and a call receiver (214). In some embodiments, the microphone, speakers, and connector (208) may be arranged in the space of the electronic device (200) and may be exposed to the external environment through at least one hole formed in the housing (210). In some embodiments, the hole formed in the housing (210) may be used jointly for the microphone and speakers. In some embodiments, the audio output device (207, 214) may include a speaker (e.g., a piezo speaker) that operates without the hole formed in the housing (210). In some embodiments, the electronic device (200) may include a tray member (2181) disposed through at least a portion of the side frame (218).

[0054] The sensor module (204, 219) can generate an electrical signal or data value corresponding to an internal operating state of the electronic device (200) or an external environmental state. The sensor module (204, 219) may include, for example, a first sensor module (204) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (210A) of the housing (210), and / or a third sensor module (219) (e.g., an HRM sensor) disposed on a second surface (210B) of the housing (210). The fingerprint sensor may be disposed on the first surface (210A) of the housing (210). A fingerprint sensor (e.g., an ultrasonic or optical fingerprint sensor) may be disposed under the display (300) on the first surface (210A). The electronic device (200) may further include at least one of a sensor module not shown, for example, a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor (204).

[0055] Camera modules (205, 212, 213) may include a first camera device (205) disposed on a first side (210A) of the electronic device (200), a second camera device (212) disposed on a second side (210B), and / or a flash (213). The camera modules (205, 212) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (213) may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (wide-angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device (200).

[0056] The key input device (217) may be positioned on a side surface (210C) of the housing (210). In one embodiment, the electronic device (200) may not include some or all of the above-mentioned key input devices (217), and the key input devices (217) that are not included may be implemented in another form, such as a soft key, on the display (300). In one embodiment, the key input device (217) may be implemented using a pressure sensor included in the display (300).

[0057] The indicator may be disposed, for example, on the first side (210A) of the housing (210). The indicator may provide, for example, status information of the electronic device (200) in the form of light. In one embodiment, the light-emitting element may provide a light source that is linked to the operation of, for example, the camera module (205). The indicator may include, for example, an LED, an IR LED, and a xenon lamp.

[0058] The connector hole (208) may include a first connector hole (208) that can accommodate a connector (e.g., a USB connector or an IF module (interface connector port module)) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (or earphone jack) that can accommodate a connector for transmitting and receiving audio signals with an external electronic device.

[0059] Some of the camera modules (205, 212), some of the sensor modules (204, 219), or indicators may be arranged to be exposed through the display (300). For example, the camera module (205), the sensor module (204), or the indicator may be arranged to be in contact with the external environment through an opening or a transparent area perforated from the internal space of the electronic device (200) to the front plate (202) of the display (300). In one embodiment, an area where the display (300) and the camera module (205) face each other may be formed as a transparent area having a certain transmittance as part of an area for displaying content. In one embodiment, the transparent area may be formed to have a transmittance in a range of about 5% to about 20%. Such a transparent area may include an area overlapping with an effective area (e.g., a field of view area) of the camera module (205) through which light passes to be imaged by the image sensor to create an image. For example, the transparent area of ​​the display (300) may include an area with a lower pixel density than the surrounding area. For example, the transparent area may replace the opening. For example, the camera module (205) may include an under-display camera (UDC). In one embodiment, some sensor modules (204) may be arranged to perform their functions without being visually exposed through the front plate (202) in the internal space of the electronic device. For example, in such a case, the area of ​​the display (300) facing the sensor module may not require a perforated opening.

[0060] FIG. 3 is an exploded perspective view of the electronic device of FIG. 2a according to various embodiments of the present disclosure.

[0061] Referring to FIG. 3, the electronic device (200) may include a frame (301), a front plate (202) (e.g., a front cover), a display (300), a substrate (240), a battery (250), a support bracket (260) (e.g., a rear case or support member), an antenna (270), and a rear plate (211) (e.g., a rear cover). At least one of the components of the electronic device (200) may be identical to or similar to at least one of the components of the electronic device (200) of FIG. 2A or 2B, and any redundant description will be omitted below.

[0062] According to various embodiments, the frame (301) may include a side member (218) (e.g., the side frame (218) of FIGS. 2A and 2B) and an inner frame (2181a) (e.g., an extension member or a support member).

[0063] The inner frame (2181a) may be disposed inside the electronic device (200) and structurally connected to the side member (218) or formed integrally with the side member (218). The inner frame (2181a) may be formed of, for example, a metallic material and / or a non-metallic (e.g., polymer) material. The inner frame (2181a) may have a display (300) connected to one surface and a substrate (240) connected to the other surface. A processor, a memory, and / or an interface may be mounted on the substrate (240). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The memory may include, for example, a volatile memory or a non-volatile memory.

[0064] In some embodiments, the electronic device (200) may omit at least one of the components (e.g., the inner frame (2181a), or the support bracket (260)) or may additionally include other components.

[0065] The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (200) to an external electronic device, for example, and may include a USB connector, an SD card / MMC (multi-media card) connector, or an audio connector.

[0066] The battery (250) is a device for supplying power to at least one component of the electronic device (200), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (250) may be disposed substantially on the same plane as the substrate (240), for example. The battery (250) may be integrally disposed within the electronic device (200). In one embodiment, the battery (250) may be disposed so as to be detachable from the electronic device (200).

[0067] Antenna (270) may be positioned between the rear plate (211) and the battery (250). The antenna (270) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna (270) may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging. In one embodiment, the antenna structure may be formed by a portion of the side member (218) and / or the inner frame (2181a) or a combination thereof.

[0068] FIG. 4A is a perspective view showing a frame (401) of an electronic device according to various embodiments.

[0069] FIG. 4b is an exploded perspective view showing a frame (401) of an electronic device according to various embodiments.

[0070] FIG. 4c is a plan view and a side view showing a frame (401) of an electronic device according to various embodiments.

[0071] FIG. 4d is a plan view showing a metal part (402) of a frame (401) according to various embodiments.

[0072] Referring to FIGS. 4A to 4D, a frame (401) (e.g., frame (301) of FIG. 3) of an electronic device (e.g., electronic device (100) of FIG. 1, electronic device (200) of FIGS. 2A to 3) may include a metal portion (402) and a polymer portion (440). The metal portion (402) may include a first metal member (410), a second metal member (420), and a third metal member (430).

[0073] In various embodiments, the first metal member (410) may be a metal member that forms an externally exposed portion of the electronic device, for example, a side frame (401) of the electronic device (for example, the side frame (218) of FIGS. 2A to 3 ), or an exterior portion of the side frame (401). The first metal member (410) may include a material that has relatively high hardness and strength compared to the second metal member (420) and the third metal member (430) described below. For example, the first metal member (410) may include a material such as a titanium alloy and / or stainless steel. The above-described materials have high resistance to external impact, scratches, or dents, and thus can effectively protect internal components of the electronic device and reduce or prevent deterioration of the appearance of the electronic device due to use.

[0074] The second metal member (420) is a member positioned relatively further inside the electronic device than the first metal member (410), and may be a member supporting internal components of the electronic device. For example, the second metal member (420) may be the internal frame (401) (2181a) of FIG. 3, or a part thereof.

[0075] The second metal member (420) may include a material that is relatively lightweight or has excellent processability compared to the first metal member (410). For example, the first metal member (410) may include aluminum, magnesium, and / or an alloy material containing the same. The above-described materials can be easily processed by processing methods such as pressing, extrusion, and / or milling. Since the above-described materials have excellent processability, the manufacturing time and cost of the frame (401) can be reduced.

[0076] In various embodiments, the third metal member (430) may be a member that connects the first metal member (410) and the second metal member (420). For example, the third metal member (430) may be a member that is coupled to the first metal member (410) and the second metal member (420), respectively. The third metal member (430) may be located inside the electronic device compared to the first metal member (410) and outside the electronic device compared to the second metal member (420). In various embodiments, the third metal member (430) may be cast in a coupled state to the first metal member (410) and the second metal member (420), respectively, by means such as insert die casting. The coupling means between the first metal member (410) and the second metal member (420) and the third metal member (430) will be described later.

[0077] In various embodiments, the polymer portion (440) may be positioned relatively inside the electronic device compared to the first metal member (410) and may be a member coupled to the metal member (402). In various embodiments, the polymer portion (440) may maintain other portions of the first metal member (410) except for a portion coupled to the third metal member (430) in a state in which they are electrically isolated from the second metal member (420).

[0078] In various embodiments, the polymer portion (440) may include various polymer materials such as PC (polycarbonate), PET (polyethylene terephthalate), PBT (polybutylene terephthalate), PPS (polyphenylene sulfide), PPSU (polyphenylsulfone), polyamide (e.g., PPA (polyphthalamide)), PEEK (polyether etherketone) and / or PAEK (polyaryl ether ketone). In various embodiments, the polymer portion (440) may further include an inorganic filler (e.g., glass fiber, carbon fiber, talc, ceramic whiskers, wollastonite, glass powder and / or zirconia powder) mixed with the above-described polymer materials. The inorganic filler may improve the strength and impact resistance of the polymer portion (440).

[0079] FIG. 5 is an enlarged plan view of a metal part (402) according to various embodiments of the present invention.

[0080] Figure 5 is an enlarged view of portion A of Figure 4d.

[0081] Referring to FIG. 5, in various embodiments, the first metal member (410) may include a plurality of segments. For example, the first metal member (410) may include a first segment (411) and a second segment (412). The plurality of segments may be spaced apart from each other by a predetermined gap (W). Although not shown, a dielectric may be positioned in the gap (W) between the segments. For example, a portion of the polymer portion (440) may be positioned in the gap (W) between the segments. The gap (W) may be referred to as, for example, an 'insulation strip'. In various embodiments, the plurality of segments may be electrically connected to the second metal member (420) by the third metal member (430). For example, the third metal member (430) may include a 3-1 metal member (431) coupled with the first segment (411) and the second metal member (420). Additionally, the third metal member (430) may include a 3-2 metal member (432) coupled with the second segment (412) and the second metal member (420).

[0082] By connecting the second metal member (420) to a plurality of spaced apart segments through the third metal members (430), a current loop (L) centered on the gap (W) between the plurality of segments can be formed. For example, a current loop can be formed that connects the first segment (411) to the 3-1 metal member (431), the second metal member (420), the 3-2 metal member (432), and the second segment (412). Accordingly, a plurality of segments spaced apart from each other can act as antennas that radiate electromagnetic waves. The length, size, shape, and gap (W) between the segments of each segment can be adjusted based on the wavelength band of the electromagnetic waves to be radiated.

[0083] FIG. 6 is an enlarged cross-sectional view of a frame (401) of an electronic device according to various embodiments.

[0084] The cross-section of Fig. 6 is a cross-section taken along the BB direction of Fig. 5.

[0085] Referring to FIG. 6, in various embodiments, the first metal member (410) may include a first bonding surface (410a). The first bonding surface (410a) may be a surface where the first metal member (410) is in contact with and bonded to the third metal member (430). In one embodiment, the first bonding surface (410a) may include a surface where the first metal member (410) and the polymer portion (440) are in contact with and bonded to each other. In various embodiments, the second metal member (420) may include a second bonding surface (420a). The second bonding surface (420a) may be a surface where the first metal member (410) is in contact with and bonded to the third metal member (430). In one embodiment, the second bonding surface (420a) may include a surface where the second metal member (420) and the polymer portion (440) are in contact with and bonded to each other.

[0086] In various embodiments, the polymer portion (440) may be positioned to cover the first bonding surface (410a) and / or the second bonding surface (420a) exposed to the surface of the metal portion (402). The polymer portion (440) may reduce or prevent the inflow of corrosive elements, such as moisture, electrolyte, and / or oxygen, from the outside into the first bonding surface (410a) and / or the second bonding surface (420a). Accordingly, the polymer portion (440) may reduce galvanic corrosion caused by the difference in oxidation potential between the different materials of the first metal member (410) and the third metal member (430) at the first bonding surface (410a).

[0087] In various embodiments, the frame (401) may include an organic adhesive layer (441) positioned at an interface between the polymer portion (440) and the metal portion (402) (e.g., a surface where the polymer portion (440) contacts at least one of the first metal member (410), the second metal member (420), or the third metal member (430). The organic adhesive layer (441) may be a layer that bonds and adheres the metal (e.g., aluminum alloy, magnesium alloy, titanium alloy, amorphous alloy (e.g., liquidmetal and / or metallic glass), high-entropy alloy (HEA), and / or stainless steel) of the metal portion (402) to the polymer portion (440). In various embodiments, the organic adhesive layer (441) may include triazinethiol, dithio pyrimidine, or a silane-based compound.

[0088] In various embodiments, a fluorine-based compound for activating surface treatment may be added between the organic adhesive layer (441) and the metal portion (402) of the frame (401). The fluorine-based compound may be combined with the organic adhesive layer (441) to improve waterproof performance.

[0089] FIG. 7a is an enlarged cross-sectional view of a first metal member (410) of a frame (401) according to various embodiments.

[0090] FIG. 7b is an enlarged cross-sectional view of a frame (401) according to various embodiments.

[0091] FIG. 7c is an enlarged cross-sectional view of a frame (401) according to various embodiments.

[0092] Figure 7b is an enlarged view of area C of Figure 6, and Figure 7c is an enlarged view of area D of Figure 6.

[0093] Referring to FIGS. 7A and 7B, a protrusion (405) may be formed on a first bonding surface (410a) of a first metal member (410) according to various embodiments. The protrusion (405) may be a roughened surface of the first bonding surface (410a). For example, the protrusion (405) may include a recessed portion (405a) or a protruding portion (405b) formed in a portion of the first bonding surface (410a). In various embodiments, the protrusion (405) may be formed by cutting or engraving the surface of the first bonding surface (410a) of the first metal member (410) by means such as etching, laser etching, laser engraving, or sand blasting. In various embodiments, the depth of the protrusion (405) (e.g., the distance H1 between the top of the protrusion (405b) and the bottom of the depression (405a)) may be 0.4 to 0.6 millimeters. The width (W1) of the protrusion (405) may be 0.1 to 0.3 millimeters.

[0094] Referring to FIG. 7b, the protrusions (405) on the first bonding surface (410a) can join the first metal member (410) and the third metal member (430). For example, the third metal member (430) can have a shape corresponding to the protrusions (405) on the first bonding surface (410a) and can be mechanically fixed to the first bonding surface (410a) by the protrusions (405). In various embodiments, the third metal member (430) can be injected in a molten state into the first metal member (410) on which the protrusions (405) are formed by a technical means such as insert die casting, and then solidified to have a shape corresponding to the protrusions (405) on the first bonding surface (410a) and be joined to the protrusions (405). Insert die casting can provide relatively high dimensional stability and short production times compared to other means (e.g., welding) for joining the first metal member (410) and the second metal member (420).

[0095] Referring to Fig. 7c, a protrusion (405) may be formed on the second joint surface (420a) of the second metal member (420). As for the protrusion (405) of the second joint surface (420a), reference may be made to the description regarding the protrusion (405) of the first joint surface (410a) as long as it is not contradictory.

[0096] Figure 8 is a schematic diagram showing a manufacturing process of a frame (401) according to various embodiments of the present invention.

[0097] Referring to FIG. 8, the frame (401) according to various embodiments comprises an operation (801) of preparing a first metal member (410) and a second metal member (420), an operation (802) of forming an organic adhesive layer (441) on the first metal member (410) and the second metal member (420), an operation (803) of forming a protrusion (405) on the first joint surface (410a) and the second joint surface (420a) of the second metal member (420) by inserting the first metal member (410) and the second metal member (420) into a die-casting mold, an operation (804) of forming a third metal member (430) by injecting and casting metal while the first metal member (410) and the second metal member (420) are inserted into a die-casting mold, and an operation (804) of forming a polymer part (440) by injection molding the metal part (402) on which die-casting is completed. It can be manufactured through operation (805) and operation (806) of processing the frame (401) into its final shape after injection.

[0098] By joining the third metal member (430) to the first metal member (410) and the second metal member (420) through insert die casting as in the above-described operations, the risk of warping or dimensional defects in the frame (401) can be reduced compared to other joining means such as welding.

[0099] In various embodiments, intermediate processing (e.g., milling or drilling) may be performed on the metal portion (402) after die casting is completed. In various embodiments, an operation of forming an organic adhesive layer (441) on the metal portion (402) may be performed prior to an operation (805) of injecting the polymer portion (440) after die casting is completed.

[0100] FIG. 9A is a perspective view of a frame (401) of an electronic device according to various embodiments.

[0101] FIG. 9b is a vertical cross-sectional view of a frame (401) of an electronic device according to various embodiments.

[0102] FIG. 9c is a vertical cross-sectional view of a metal portion (402) of a frame (401) according to various embodiments.

[0103] FIG. 9d is a horizontal cross-sectional view of a frame (401) of an electronic device according to various embodiments.

[0104] FIG. 9e is a perspective view of a frame (401) of an electronic device according to various embodiments.

[0105] FIG. 9f is a cross-sectional view of a frame (401) of an electronic device according to various embodiments.

[0106] Figure 9a is a perspective view of portion M of Figure 4c.

[0107] The cross sections of FIGS. 9b and 9c are cross sections taken along the EE direction of FIG. 9a.

[0108] Figure 9c illustrates a state in which the polymer portion (440) is not positioned in Figure 9b.

[0109] The cross-section of Fig. 9d is a cross-section along the FF direction of Fig. 9a.

[0110] Figure 9e is an enlarged view of the P portion of Figure 4.

[0111] Figure 9f is a cross-section along the JJ direction of Figure 9e.

[0112] Referring to FIGS. 9A to 9F , in various embodiments, the electronic device may include a through hole (450). The through hole (450) may penetrate the first metal member (410) in a direction toward the interior of the electronic device (e.g., the y direction in the drawings). In various embodiments, the through hole (450) may penetrate at least a portion of the third metal member (430) and the second metal member (420). For example, the through hole (450) may penetrate the first metal member (410) and partially penetrate the third metal member (430), may penetrate the first metal member (410) and the third metal member (430) to expose the second metal member (420) to the outside, or may penetrate the first metal member (410) and the third metal member (430) and partially or completely penetrate the second metal member (420). In one embodiment, the through hole (450) may penetrate an area of ​​the frame (401) where the polymer portion (440) is positioned between the first metal member (410) and the second metal member (420) and where the third metal member (430) is not positioned.

[0113] In various embodiments, the through-hole (450) may be a stylus hole (451) as illustrated in FIGS. 9 a to 9d. The stylus hole (451) may be a portion for receiving and storing an input device of an electronic device (e.g., a stylus pen (501) of FIG. 9f). In some embodiments, the through-hole (450) may include a key hole, a charging and wired connection terminal hole (e.g., a USB socket hole (454)), a headphone jack hole, a microphone hole (455), an IC card tray (e.g., a SIM card tray) insertion hole (456), and / or a speaker hole (457).

[0114] In various embodiments, when the through hole (450) passes through the first metal member (410) and the third metal member (430), the first bonding surface (410a) and the second bonding surface (420a) may be exposed to the inner surface (450a) of the through hole (450). Since the through hole (450) is formed through the area where the first metal member (410) and the third metal member (430) are bonded, the first bonding surface (410a) may be exposed to the inner surface (450a) of the through hole (450). In addition, since the through hole (450) is formed through the area where the third metal member (430) and the second metal member (420) are bonded, the second bonding surface (420a) may be exposed to the inner surface (450a) of the through hole (450).

[0115] In various embodiments, the polymer portion (440) may be positioned on the inner surface (450a) of the through hole (450) to cover the first bonding surface (410a) exposed to the inner surface (450a) of the through hole (450). In various embodiments, the polymer portion (440) may be positioned on the inner surface (450a) of the through hole (450) to cover the second bonding surface (420a) exposed to the inner surface (450a) of the through hole (450). The polymer portion (440) positioned on the inner surface (450a) of the through hole (450) may reduce or prevent corrosive factors such as moisture, electrolyte, and / or oxygen from entering the first bonding surface (410a) and / or the second bonding surface (420a) from the outside. According to embodiments of the present invention, even if a corrosive factor such as water, electrolyte, and / or oxygen is introduced through an opening that is necessarily formed in a housing of an electronic device, such as a stylus hole (451), a button hole, or a wired connection terminal hole, galvanic corrosion caused by a redox potential difference that may occur at a first bonding surface (410a) and / or a second bonding surface (420a) where metals of different materials are bonded can be reduced.

[0116] Referring to FIGS. 9c and 9d, in various embodiments, a groove (453) may be positioned on the inner surface (450a) of the through hole (450). For example, in a region of the metal portion (402) corresponding to the through hole (450), a portion of the inner surface (450a) of the through hole (450) may be sunken or cut in the radial direction of the through hole (450) to form a groove (453). The groove (453) may be formed in a region on the inner surface (450a) of the through hole (450) where the first joint surface (410a) and / or the second joint surface (420a) is exposed.

[0117] In various embodiments, the polymer portion (440) may be positioned in the groove (453). For example, a portion of the polymer portion (440) may be positioned to cover the first bonding surface (410a) and / or the second bonding surface (420a) exposed within the groove (453). By forming the groove (453) on the inner side of the through hole (450) and positioning the polymer portion (440) within the groove (453), the polymer portion (440) may cover the exposed portion of the first bonding surface (410a) and / or the second bonding surface (420a), while maintaining a smooth shape of the inner surface of the through hole (450).

[0118] Referring to FIGS. 9E and 9F, in various embodiments, the second metal member (420) may include a first surface (420b) facing the entrance of the through hole (450). The first surface (420b) may be any surface of a member that restricts over-insertion of the stylus pen, as illustrated in FIG. 9F. The polymer portion (440) may be arranged to cover the first surface (420b) when viewed from the entrance of the through hole. The operation and effect of the above-described configuration will be described later.

[0119] FIG. 10A is a perspective view of a frame (401) of an electronic device according to various embodiments.

[0120] FIG. 10b is a horizontal cross-sectional view of a frame (401) of an electronic device according to various embodiments.

[0121] FIG. 10c is a vertical cross-sectional view of a frame (401) of an electronic device according to various embodiments.

[0122] FIG. 10d is a vertical cross-sectional view of a frame (401) of an electronic device according to a comparative example.

[0123] Figure 10a is an enlarged view of the N portion of Figure 4c.

[0124] The cross-section of Fig. 10b is a cross-section along the GG direction of Fig. 10a.

[0125] The cross-section of Fig. 10c is a cross-section taken along the HH direction of Fig. 10b.

[0126] Referring to FIGS. 10A to 10C, in various embodiments, the electronic device may include a through hole (450). The through hole (450) may penetrate the first metal member (410) in a direction toward the interior of the electronic device (a first direction; for example, the -x direction in the drawings).

[0127] In various embodiments, the through hole (450) may be a key hole as illustrated in FIGS. 10A to 10C. The key hole (452) may be a through hole (450) provided in the frame (401) to position a key input device of an electronic device (e.g., the key input device (217) of FIGS. 2A and 3). A key switch (409) configured to open and close a circuit by a pressing action of a button may be arranged at an end of the key hole (452) in the first direction.

[0128] In various embodiments, the through hole (450) is formed by penetrating the first metal member (410), and the second metal member (420) may not penetrate or may partially penetrate. The second metal member (420) may include a first surface (420b) that faces the through hole (450) in the opposite direction (x direction) to the penetrating direction (first direction; -x direction in the drawing) of the through hole (450). For example, the first surface (420b) may be a surface of the second metal member (420) that is visible through the through hole (450) in the first direction (-x direction) when the polymer portion (440) is not present. In various embodiments, the first surface (420b) may be any surface of a member for fixing and supporting the key switch (409), as illustrated in FIGS. 10b and 10c.

[0129] In various embodiments, the polymer portion (440) may be positioned to cover the first surface (420b) of the second metal member (420). For example, the polymer portion (440) may be positioned on the first surface (420b) such that the second metal member (420) is not visible through the through hole (450) in the first direction and is covered by the polymer portion (440).

[0130] Referring again to FIGS. 9E and 9F, in various embodiments, the through hole (450) may be a stylus hole (451). The first surface (420b) may be one surface of a member that restricts over-insertion of the stylus pen, as illustrated in FIG. 9F. A polymer portion (440) may be positioned on the first surface (420b).

[0131] In various embodiments, the polymer portion (440) can protect the second metal member (420) from damage applied from the outside. For example, the second metal member (420) can be protected from physical or chemical abrasives (e.g., particles for shot blasting or sand blasting (which may be referred to as blast medium, hereinafter the same) and / or chemicals such as phosphoric acid for anodizing) applied to the surface of the first metal member (410) during the manufacturing of the frame (401) for surface treatment.

[0132] Referring to FIG. 10d, when surface treating the frame (40) according to the comparative example, physical abrasive elements (e.g., sandblasting particles (9)) or chemical abrasive elements (not shown) applied for surface treating the metal exterior (41) may enter through the through-hole (45) and damage the metal internal components (e.g., the internal frame (42)) inside the through-hole (45). When the materials of the metals constituting the metal exterior (41) and the internal components are different, the physical / chemical treatment means used for surface treating the metal exterior (41) may not be compatible with the metal component of the internal components, and thus may damage the metal material of the internal components. Therefore, by protecting the first surface (420b) of the second metal member (420) exposed through the through-hole (450) with the polymer portion (440) as in the present invention, the above-described damage can be prevented and / or reduced.

[0133] An electronic device according to various embodiments of the present invention may be an electronic device including a frame (401). The frame (401) may include a metal portion (402). The metal portion (402) may include a first metal member (410) including a first bonding surface (410a) and a second metal member (420) having a different material from the first metal member (410) and including a second bonding surface (420a). The metal portion (402) may include a third metal member (430) that is bonded to the first metal member (410) at the first bonding surface (410a) and is bonded to the second metal member (420) at the second bonding surface (420a). The frame (401) may include a polymer portion (440) bonded to the metal portion (402). The polymer portion (440) may be arranged to cover at least a portion of the first bonding surface (410a) and the second bonding surface (420a) exposed to the surface of the metal portion (402).

[0134] In various embodiments, the electronic device may further include protrusions (405) formed on the first bonding surface (410a) and the second bonding surface (420a) of the first metal member (410) and the second metal member (420).

[0135] In various embodiments, the protrusions (405) may be formed by laser etching.

[0136] In various embodiments, the third metal member (430) may be formed by insert die casting, which inserts the first metal member (410) and the second metal member (420) into a die and injects molten metal into the die.

[0137] In various embodiments, the third metal member (430) may be cast to have a surface shape corresponding to the shape of the protrusions (405) in the area where it joins the first bonding surface (410a) and the second bonding surface (420a).

[0138] In various embodiments, the first metal member (410) may include a first segment (411) and a second segment (412) spaced apart from the first segment (411). The third metal member (430) may be electrically connected to the first segment (411) and the second segment (412), respectively, via the second metal member (420).

[0139] In various embodiments, the electronic device may further include an organic adhesive layer (441) that adheres the polymer portion (440) to at least one of the first metal member (410), the second metal member (420), or the third metal member (430).

[0140] In various embodiments, the frame (401) may include a through hole (450) penetrating the first metal member (410) in a first direction toward the inside of the frame (401) and at least partially penetrating at least one of the second metal member (420) or the third metal member (430). The polymer portion (440) may be positioned to cover at least one of the first bonding surface (410a) or the second bonding surface (420a) exposed on the inner surface (450a) of the through hole (450).

[0141] In various embodiments, the through hole (450) may include a groove (453) formed by recessing an area on the inner surface (450a) where at least one of the first bonding surface (410a) or the second bonding surface (420a) is exposed. The polymer portion (440) may be positioned to fill the groove (453).

[0142] In various embodiments, the second metal member (420) may include a first surface (420b) facing the through hole (450) in a direction opposite to the first direction. The polymer portion (440) may be arranged to cover the first surface (420b) when viewed in the first direction.

[0143] According to various embodiments of the present invention, a frame (401) for an electronic device may include a metal portion (402). The metal portion (402) may include a first metal member (410) including a first bonding surface (410a) and a second metal member (420) having a different material from the first metal member (410) and including a second bonding surface (420a). The metal portion (402) may include a third metal member (430) that is bonded to the first metal member (410) at the first bonding surface (410a) and is bonded to the second metal member (420) at the second bonding surface (420a). The frame (401) may include a polymer portion (440) bonded to the metal portion (402). The polymer portion (440) may be arranged to cover at least a portion of the first bonding surface (410a) and the second bonding surface (420a) exposed to the surface of the metal portion (402). In various embodiments, the electronic device may further include the first metal member (410) and the second metal member (420) having protrusions (405) formed on the first bonding surface (410a) and the second bonding surface (420a).

[0144] In various embodiments, the protrusions (405) may be formed by laser etching.

[0145] In various embodiments, the third metal member (430) may be formed by insert die casting, which inserts the first metal member (410) and the second metal member (420) into a die and injects molten metal into the die.

[0146] In various embodiments, the third metal member (430) may be cast to have a surface shape corresponding to the shape of the protrusions (405) in the area where it joins the first bonding surface (410a) and the second bonding surface (420a).

[0147] In various embodiments, the first metal member (410) may include a first segment (411) and a second segment (412) spaced apart from the first segment (411). The third metal member (430) may be electrically connected to the first segment (411) and the second segment (412), respectively, via the second metal member (420).

[0148] In various embodiments, the electronic device may further include an organic adhesive layer (441) that adheres the polymer portion (440) to at least one of the first metal member (410), the second metal member (420), or the third metal member (430).

[0149] In various embodiments, the frame (401) may include a through hole (450) penetrating the first metal member (410) in a first direction toward the inside of the frame (401) and at least partially penetrating at least one of the second metal member (420) or the third metal member (430). The polymer portion (440) may be positioned to cover at least one of the first bonding surface (410a) or the second bonding surface (420a) exposed on the inner surface (450a) of the through hole (450).

[0150] In various embodiments, the through hole (450) may include a groove (453) formed by recessing an area on the inner surface (450a) where at least one of the first bonding surface (410a) or the second bonding surface (420a) is exposed. The polymer portion (440) may be positioned to fill the groove (453).

[0151] In various embodiments, the second metal member (420) may include a first surface (420b) facing the through hole (450) in a direction opposite to the first direction. The polymer portion (440) may be arranged to cover the first surface (420b) when viewed in the first direction.

[0152] And the embodiments disclosed in this document disclosed in this specification and drawings are only specific examples to easily explain the technical contents according to the embodiments disclosed in this document and to help understand the embodiments disclosed in this document, and are not intended to limit the scope of the embodiments disclosed in this document. Therefore, the scope of the various embodiments disclosed in this document should be interpreted as including all changes or modified forms derived based on the technical ideas of the various embodiments disclosed in this document in addition to the embodiments disclosed herein.

Claims

1. In an electronic device including a frame (401), the frame (401) comprises: Metal part (402); and It includes a polymer part (440) bonded to the above metal part (402), The above metal part (402) is A first metal member (410) including a first bonding surface (410a); A second metal member (420) having a different material from the first metal member (410) and including a second bonding surface (420a); and It includes a third metal member (430) that is joined to the first metal member (410) at the first joining surface (410a) and joined to the second metal member (420) at the second joining surface (420a). An electronic device in which the polymer portion (440) is positioned to cover at least a portion of the first bonding surface (410a) and the second bonding surface (420a) exposed to the surface of the metal portion (402).

2. In paragraph 1, An electronic device in which the first metal member (410) and the second metal member (420) include protrusions (405) formed on the first bonding surface (410a) and the second bonding surface (420a).

3. In paragraph 2, The above-mentioned protrusion (405) is an electronic device formed by laser etching.

4. In paragraph 2, The third metal member (430) is an electronic device formed by insert die casting, which inserts the first metal member (410) and the second metal member (420) into a die and injects molten metal into the die.

5. In paragraph 4, An electronic device in which the third metal member (430) is cast to have a surface shape corresponding to the shape of the unevenness (405) in the area where it is joined with the first bonding surface (410a) and the second bonding surface (420a).

6. In paragraph 1, The above first metal member (410) includes a first segment (411) and a second segment (412) spaced apart from the first segment (411), An electronic device in which the third metal member (430) is electrically connected to the first segment (411) and the second segment (412) through the second metal member (420).

7. In paragraph 1, An electronic device including an organic adhesive layer (441) that adheres the polymer portion (440) to at least one of the first metal member (410), the second metal member (420), or the third metal member (430).

8. In paragraph 1, The above frame (401) includes a through hole (450) penetrating the first metal member (410) in a first direction toward the inside of the frame (401) and penetrating at least partially through at least one of the second metal member (420) or the third metal member (430), An electronic device in which the polymer portion (440) is positioned to cover at least one of the first bonding surface (410a) or the second bonding surface (420a) exposed on the inner surface (450a) of the through hole (450).

9. In paragraph 8, The above through hole (450) includes a groove (453) formed by embedding an area on the inner surface (450a) where at least one of the first joint surface (410a) or the second joint surface (420a) is exposed, An electronic device in which the polymer portion (440) is positioned to fill the groove (453).

10. In paragraph 8, The second metal member (420) includes a first surface (420b) facing the through hole (450) in a direction opposite to the first direction, An electronic device in which the polymer portion (440) is positioned to cover the first surface (420b) when viewed from the first direction.

11. In the frame (401) of the electronic device, Metal part (402); and It includes a polymer part (440) bonded to the above metal part (402), The above metal part (402) is A first metal member (410) including a first bonding surface (410a); A second metal member (420) having a different material from the first metal member (410) and including a second bonding surface (420a); and It includes a third metal member (430) that is joined to the first metal member (410) at the first joining surface (410a) and joined to the second metal member (420) at the second joining surface (420a). The above polymer portion (440) is arranged to cover at least a portion of the first bonding surface (410a) and the second bonding surface (420a) exposed to the surface of the metal portion (402).

12. In paragraph 11, The first metal member (410) and the second metal member (420) are a frame (401) including protrusions (405) formed on the first joint surface (410a) and the second joint surface (420a).

13. In paragraph 11, The above first metal member (410) includes a first segment (411) and a second segment (412) spaced apart from the first segment (411), The third metal member (430) is electrically connected to the first segment (411) and the second segment (412) through the second metal member (420), respectively, in a frame (401).

14. In paragraph 11, A frame (401) including an organic adhesive layer (441) that adheres the polymer portion (440) to at least one of the first metal member (410), the second metal member (420), or the third metal member (430).

15. In paragraph 11, The above frame (401) includes a through hole (450) penetrating the first metal member (410) in a first direction toward the inside of the frame (401) and penetrating at least partially through at least one of the second metal member (420) or the third metal member (430), The above polymer portion (440) is positioned to cover at least one of the first bonding surface (410a) or the second bonding surface (420a) exposed on the inner surface (450a) of the through hole (450).

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