Laser scribing apparatus, laser scribing device, and control method

Abstract

A laser scribing apparatus (100), a laser scribing device (200), and a control method, the laser scribing apparatus (100) comprising: a light source (110) and a beam splitting unit. The light source (110) is used for emitting laser light; and the beam splitting unit comprises a beam splitter (120) and a light control assembly (130). The beam splitter (120) and the light control assembly (130) are sequentially arranged on the light path of the laser light. The beam splitter (120) is used for splitting the laser into multiple beams of scribing light, and the light control assembly (130) is used for controlling the multiple beams of scribing light, such that the multiple beams of scribing light sequentially scribe through along the same path.

Description

Laser scribing device, laser scribing equipment and control method

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on January 11, 2024, with application number 202410044084.2 and invention name “A laser marking device, laser marking equipment and control method”, the entire contents of which are incorporated by reference into the application. Technical Field

[0002] The present application relates to the technical field of marking equipment manufacturing, and in particular to a laser marking device, laser marking equipment, and a control method. Background Art

[0003] Currently, some laser marking equipment generally only uses a single laser beam for marking when operating. However, it is difficult to control the marking depth when using a single laser beam. When encountering work scenarios where deep marking is required, the laser energy of a single laser beam fluctuates greatly, resulting in poor consistency in the marking depth. In addition, the efficiency of single-beam laser marking is low, affecting production progress. Technical issues

[0004] This application aims to solve at least one of the technical problems existing in the prior art. Technical Solutions

[0005] To this end, the present application proposes a laser marking device, which utilizes a beam splitter and a light control component to split the laser into multiple marking beams. The multiple marking beams are used to mark in sequence. While achieving a deeper marking depth, it can also ensure the consistency of the marking and higher marking efficiency, which is conducive to ensuring the smooth progress of production.

[0006] Secondly, the present application also proposes a laser scribing device using the above-mentioned laser scribing device.

[0007] Thirdly, the present application also proposes a control method applied to the above-mentioned laser scribing equipment.

[0008] According to the embodiment of the first aspect of the present application, the laser marking device provided includes: a light source and a spectrometer unit, the light source is used to emit laser light; the spectrometer unit includes a spectrometer and a light control component, the spectrometer and the light control component are arranged in sequence in the optical path of the laser, the spectrometer is used to split the laser into multiple beams of marking light, and the light control component is used to control the multiple beams of marking light so that the multiple beams of marking light pass in sequence along the same path.

[0009] According to the laser marking device provided by the embodiment of the first aspect of the present application, the light control component includes a galvanometer and a field lens, and the galvanometer and the field lens cooperate to enable multiple beams of marking light to pass sequentially along the same path.

[0010] According to the laser scribing device provided by the embodiment of the first aspect of the present application, the spectroscopic unit further includes a collimator, which is arranged between the light source and the spectroscope.

[0011] The laser scribing equipment provided according to the embodiment of the second aspect of the present application includes the laser scribing device as described in the embodiment of the first aspect of the present application.

[0012] The laser marking equipment provided in accordance with the embodiment of the second aspect of the present application includes a unwinding device, a rewinding device and a plurality of the laser marking devices. The unwinding device and the rewinding device cooperate to realize the unwinding and rewinding of the material to be marked. The plurality of laser marking devices are arranged between the unwinding device and the rewinding device for marking the outer wall of the material to be marked.

[0013] According to the laser scribing equipment provided by the embodiment of the second aspect of the present application, the plurality of laser scribing devices are configured into two groups, one group is located on one side of the material to be scribed, and the other group is located on the other side opposite to the material to be scribed.

[0014] According to the laser scribing equipment provided by the embodiment of the second aspect of the present application, the two groups of laser scribing devices are arranged opposite to each other, and the material to be scribed is guided by a guide roller to pass through the two groups of laser scribing devices in sequence.

[0015] According to the laser marking equipment provided by the embodiment of the second aspect of the present application, a tension device is provided between the unwinding device and the laser marking device, and a tension device is provided between the laser marking device and the winding device, and the tension device is used to tension the material to be marked.

[0016] According to the laser marking equipment provided by the embodiment of the second aspect of the present application, the tension device includes a connecting frame and two tensioning rollers, the material to be marked is wound around the two tensioning rollers, and the two tensioning rollers can move toward or away from each other to adjust the tension of the material to be marked.

[0017] The laser marking equipment provided in accordance with the embodiment of the second aspect of the present application further includes a dust cleaning device, a dust cleaning device is arranged between the unwinding device and the laser marking device, and a dust cleaning device is arranged between the laser marking device and the winding device, and the dust cleaning device is used to clean the outer wall of the material to be marked.

[0018] According to the control method provided in the embodiment of the third aspect of the present application, the plurality of laser marking devices are configured into two groups, and a first area and a second area are set on the material to be marked; the control method includes: controlling the unwinding device and the rewinding device to pull the material to be marked so that the first group of laser marking devices is aligned with the first area; controlling the unwinding device and the rewinding device to pull the material to be marked, and the first group of laser marking devices marks the first area; after the first group of laser marking devices finishes marking, controlling the unwinding device and the rewinding device to pull the material to be marked so that the first group of laser marking devices skips the first area and the second group of laser marking devices is aligned with the second area; controlling the second group of laser marking devices to mark the second area. Beneficial effects

[0019] The laser marking device provided in accordance with the embodiment of the first aspect of the present application has at least the following beneficial effects: when the laser marking device is used to mark the outer wall of the material to be marked, the laser light emitted by the light source passes through the beam splitter and the light control component in sequence. When passing through the beam splitter, the laser light is divided into multiple beams of marking light and then injected into the light control component. The light control component can control the multiple beams of marking light so that the multiple beams of marking light pass through the outer wall of the material to be marked in sequence along the same path. Each beam of marking light can mark a line of a certain depth when passing through the outer wall of the material to be marked. After the multiple beams of marking light pass through in sequence along the same path, the depth of the lines marked is accumulated in sequence, thereby being able to mark a deeper line on the outer wall of the material to be marked. Since the laser light is divided into multiple beams of marking light during the marking process, the energy fluctuation of the multiple beams of marking light is small, so the consistency of the marking depth is better, and the multiple beams of marking light marking in sequence can also improve the marking efficiency, which is conducive to ensuring the smooth progress of production.

[0020] The laser marking equipment provided in accordance with the embodiment of the second aspect of the present application has at least the following beneficial effects: by using a beam splitter in conjunction with a light control component, the laser can be divided into multiple beams of marking light, and the multiple beams of marking light are used to mark in sequence. While achieving a deeper marking depth, the consistency of the marking and the higher marking efficiency can also be ensured, which is conducive to ensuring the smooth progress of production.

[0021] The control method provided in accordance with the third aspect of the present application has at least the following beneficial effects: two groups of laser marking devices mark the material to be marked at the same time, which can ensure a higher marking efficiency and is conducive to ensuring the smooth progress of production.

[0022] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become obvious from the description below, or will be learned through practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Additional aspects and advantages of the present application will become apparent and readily understood from the following description of the embodiments with reference to the accompanying drawings, in which:

[0024] FIG1 is an overall schematic diagram of a laser scribing device provided in an embodiment of the first aspect of the present application;

[0025] FIG2 is a schematic diagram of an optical path of a laser scribing device according to an embodiment of the first aspect of the present application;

[0026] FIG3 is a schematic diagram of a marking light and a marking depth of a laser marking device provided in an embodiment of the first aspect of the present application;

[0027] FIG4 is an overall schematic diagram of the laser scribing equipment provided in an embodiment of the second aspect of the present application.

[0028] The accompanying figures are as follows:

[0029] Laser scribing device 100; light source 110; beam splitter 120; light control assembly 130; galvanometer 131; field lens 132; collimator 140;

[0030] Laser scribing device 200; unwinding device 210; rewinding device 220; guide roller 230; tension device 240; connecting frame 241; tensioning roller 242; dust cleaning device 250;

[0031] The scribed material 300 . Modes for Carrying Out the Invention

[0032] The following describes in detail embodiments of the present application. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application and are not to be construed as limiting the present application.

[0033] In the description of this application, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on this application.

[0034] In the description of this application, if there is a description of first or second, it is only for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0035] In the description of this application, unless otherwise clearly defined, terms such as setting, installing, and connecting should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in this application based on the specific content of the technical solution.

[0036] In the field of new energy lithium-ion battery technology, to meet the requirements of battery charge and discharge time, it is necessary to perform electrode scribing before cleaning the electrode coil to meet specific process requirements. Currently, when using some laser scribing equipment to operate on the electrode, generally only a single laser beam is used for scribing. However, when single-beam scribing is used, it is difficult to control the scribing depth. When encountering work scenarios where deep scribing is required, the laser energy of a single laser beam fluctuates greatly, resulting in poor consistency in the scribing depth. In addition, the efficiency of single-beam laser scribing is low, affecting production progress.

[0037] To solve this problem, the first embodiment of the present application provides a laser marking device 100, which uses a beam splitter 120 and a light control component 130 to split the laser into multiple marking light beams, and the multiple marking light beams are used for marking in sequence. While achieving a deeper marking depth, it can also ensure the consistency of the marking and higher marking efficiency, which is conducive to ensuring the smooth progress of production. The specific structure and function of the laser marking device 100 provided in the embodiment of the present application will be further explained in combination with text and drawings.

[0038] 1 to 3 , a laser marking device 100 provided in accordance with an embodiment of the first aspect of the present application includes: a light source 110 and a spectrometer unit, the light source 110 is used to emit laser light; the spectrometer unit includes a spectrometer 120 and a light control component 130, the spectrometer 120 and the light control component 130 are sequentially arranged on the optical path of the laser, when the laser light emitted by the light source 110 passes through the spectrometer 120, the spectrometer 120 can split the laser into multiple marking light beams, and the light control component 130 is used to control the multiple marking light beams so that the multiple marking light beams pass sequentially along the same path.

[0039] According to the laser scribing device 100 provided in the embodiment of the first aspect of the present application, when the laser scribing device 100 is used to scribble the outer wall of the material 300 to be scribed, the laser light emitted by the light source 110 passes through the beam splitter 120 and the light control component 130 in sequence. After passing through the beam splitter 120, the laser light is split into multiple beams of scribing light and then enters the light control component 130. The light control component 130 can control the multiple beams of scribing light so that the multiple beams of scribing light sequentially pass along the same path along the outer wall of the material 300 to be scribed. Each beam of scribing light can scribble a line of a certain depth when passing through the outer wall of the material 300 to be scribed. After the multiple beams of scribing light sequentially pass along the same path, the depth of the scribing lines accumulates sequentially, thereby being able to scribble a deeper line on the outer wall of the material 300 to be scribed. Because the laser light is split into multiple beams of scribing light during the scribing process, the energy fluctuations of the multiple beams of scribing light are small, so the consistency of the scribing depth is better. In addition, the sequential scribing of the multiple beams of scribing light can also improve the scribing efficiency, which is conducive to ensuring the smooth progress of production.

[0040] It should be noted that the beam splitter 120 can split the laser into 3 beams of marking light, 4 beams of marking light, 8 beams of marking light, 20 beams of marking light, etc., and the number of marking lights is not limited here; when multiple beams of marking light are used for marking in sequence, a certain amount of material powder will be generated. At this time, the material powder can be pushed away from the marked position by the dust removal system, thereby reducing the influence of the material powder on the marking light, which is not only beneficial to improving the consistency of marking, but also beneficial to improving the marking efficiency.

[0041] As shown in FIG3 , when the laser scribing device 100 is used to scribble on the material 300 (pole sheet coil), the preset scribing depth is 16 microns. At this time, the incident laser can be divided into four scribing beams by using the beam splitter 120. The scribing depth of each scribing beam is 4 microns. When the four scribing beams are used to scribing along the same path, the first scribing beam completes the scribing at a depth of 4 microns (L1), the second scribing beam completes the scribing at a depth of 8 microns (L1 to L2), the third scribing beam completes the scribing at a depth of 12 microns (L2 to L3), and the fourth scribing beam completes the scribing at a depth of 16 microns (L3 to L4). When multiple scribing beams are used to scribble in sequence, the scribing depth is smaller and the energy fluctuation is smaller. Therefore, the consistency of the scribing depth and the scribing depth is better. In addition, multiple scribing beams are used to scribble in sequence, which is beneficial to improving the scribing efficiency.

[0042] It should be noted that, during the marking process, multiple beams of marking light are simultaneously irradiated onto the marking material 300 and marks are made on the marking material 300, which is beneficial to improving the marking efficiency; during the marking process, multiple beams of marking light pass through the same path in sequence, and the distance between adjacent marking lights is maintained between 0.1 mm and 0.2 mm. The distance between adjacent marking lights can be modified according to actual processing requirements; the marking depth of the marking light is not limited to 4 microns, but can also be 5 microns, 6 microns, etc., and no specific limitation is made to the marking depth of the marking light here.

[0043] 1 and 2 , according to the laser marking device 100 provided in the embodiment of the first aspect of the present application, the light control component 130 includes a galvanometer 131 and a field lens 132. The laser is separated into multiple marking beams by the beam splitter 120. The galvanometer 131 is first used to adjust the offset and movement direction so that the multiple marking beams move along the same path, and then the field lens 132 is used to focus the multiple marking beams onto the material 300 to be marked and mark the material.

[0044] 1 and 2 , in the laser marking device 100 according to the first embodiment of the present application, the spectrometer unit further includes a collimator 140 , which is disposed between the light source 110 and the spectrometer 120 . The collimator 140 can adjust the accuracy of the laser emitted by the light source 110 and entering the spectrometer 120 .

[0045] The laser scribing equipment 200 provided according to the embodiment of the second aspect of the present application includes the laser scribing device 100 according to the embodiment of the first aspect of the present application.

[0046] According to the laser marking device 200 provided in the embodiment of the second aspect of the present application, the beam splitter 120 cooperates with the light control component 130 to split the laser into multiple marking light beams, and the multiple marking light beams are used for marking in sequence. While achieving a deeper marking depth, it can also ensure the consistency of the marking and higher marking efficiency, which is conducive to ensuring the smooth progress of production.

[0047] 4 , a laser marking device 200 provided in accordance with an embodiment of the second aspect of the present application includes a unwinding device 210, a rewinding device 220, and a plurality of laser marking devices 100. The unwinding device 210 cooperates with the rewinding device 220 to realize the unwinding and rewinding of the material 300 to be marked. The plurality of laser marking devices 100 are arranged between the unwinding device 210 and the rewinding device 220, and are used to mark the outer wall of the material 300 to be marked. By cooperating with the unwinding device 210, the rewinding device 220, and the laser marking device 100, efficient marking can be achieved on the material 300 to be marked.

[0048] It should be noted that the number of the laser scribing devices 100 can be 2, 3, 4, etc., and the number of the laser scribing devices 100 is not limited herein.

[0049] For example, when there are two laser scribing devices 100 and the two laser scribing devices 100 are distributed on the same side of the material 300 to be scribed, the two laser scribing devices 100 simultaneously scribe the outer wall of the material 300 to be scribed, and the scribing efficiency is high.

[0050] 4 , in the laser scribing equipment 200 provided in accordance with the second aspect of the present application, a plurality of laser scribing devices 100 are configured into two groups, one of which is located on one side of the material to be scribed 300, and the other is located on the other side opposite to the material to be scribed 300. The cooperation of the two groups of a total of a plurality of laser scribing devices 100 is conducive to improving the scribing efficiency.

[0051] It should be noted that the number of laser scribing devices 100 can be 2, 4, 8, etc. When the number of laser scribing devices 100 is 2, each group contains 1 laser scribing device 100; when the number of laser scribing devices 100 is 4, each group contains 2 laser scribing devices 100. The number of laser scribing devices 100 in each group can be an odd number or an even number; the number of laser scribing devices 100 in each group can be the same or different, and the number of laser scribing devices 100 in each group is not limited here.

[0052] It should be noted that when the laser scribing device 100 is used to simultaneously scribble on both sides of the material to be scribed 300, the scribing areas of the laser scribing devices 100 on both sides are staggered. For example, the laser scribing device 100 on one side first scribbles multiple lines in an area on the material to be scribed 300, and then leaves a blank area with a certain distance and continues scribing, while the laser scribing device 100 on the other side scribbles on the blank area.

[0053] 4 , in the laser marking equipment 200 provided in accordance with the second aspect of the present application, the laser marking devices 100 distributed on both sides of the processed material are arranged relative to each other and are positioned flush with each other. The material to be marked 300 is guided by a guide roller 230 to pass through the two groups of laser marking devices 100 in sequence. The entire laser marking equipment 200 has a highly compact structure, which is beneficial to reducing the volume of the laser marking equipment 200.

[0054] 4 , in the laser marking device 200 provided in accordance with the embodiment of the second aspect of the present application, a tension device 240 is provided between the unwinding device 210 and the laser marking device 100. When the marked material 300 passes through the tension device 240 provided between the unwinding device 210 and the laser marking device 100, the marked material 300 can remain tensioned so that the marking device can draw lines of uniform depth and width on the marked material 300. A tension device 240 is provided between the laser marking device 100 and the winding device 220. When the marked material passes through the tension device 240 provided between the laser marking device 100 and the winding device 220, the marked material can remain tensioned so that the winding device 220 can wind it up.

[0055] 4 , according to the laser marking equipment 200 provided in the embodiment of the second aspect of the present application, the tension device 240 includes a connecting frame 241 and two tensioning rollers 242. The material to be marked 300 is wound around the two tensioning rollers 242. The two tensioning rollers 242 can move toward or away from each other to adjust the tension of the material to be marked 300. The tension of the material to be marked 300 can be adjusted by adjusting the distance between the two tensioning rollers 242. The adjustment method is simple and reliable.

[0056] 4 , the laser marking device 200 provided in accordance with the embodiment of the second aspect of the present application further includes a dust cleaning device 250. The dust cleaning device 250 is arranged between the unwinding device 210 and the laser marking device 100. When the material to be marked 300 passes through the dust cleaning device 250 arranged between the unwinding device 210 and the laser marking device 100, impurities remaining on the outer wall of the material to be marked 300 during production or transportation are removed, so that the marking device can mark a line of consistent depth and width on the material to be marked 300. The dust cleaning device 250 is arranged between the laser marking device 100 and the winding device 220. When the marked material passes through the dust cleaning device 250 arranged between the laser marking device 100 and the winding device 220, the dust cleaning device 250 can clear the material powder generated during the marking process to ensure the cleanliness of the outer wall of the material wound up by the winding device 220.

[0057] According to the control method provided by the embodiment of the second aspect of the present application, a plurality of laser scribing devices 100 are configured into two groups. The two groups of laser scribing devices 100 are spaced apart in the direction of movement when controlling the unwinding device 210 and the rewinding device 220 to pull the material 300 to be scribed. A first area and a second area are set on the material 300 to be scribed. The control method includes:

[0058] Controlling the unwinding device 210 and the rewinding device 220 to pull the material 300 to be scribed, so that the first set of laser scribing devices 100 is aligned with the first area;

[0059] The unwinding device 210 and the rewinding device 220 are controlled to pull the material 300 to be scribed, and the first group of laser scribing devices 100 scribes the first area. After the first group of laser scribing devices 100 finishes scribing, the unwinding device 210 and the rewinding device 220 are controlled to pull the material 300 to be scribed, so that the first group of laser scribing devices 100 skips the first area and the second group of laser scribing devices 100 is aligned with the second area.

[0060] The second group of laser scribing devices 100 is controlled to scribing the second area.

[0061] According to the control method provided in the third embodiment of the present application, two groups of laser marking devices 100 mark the material 300 to be marked at the same time, which can ensure a high marking efficiency and is conducive to ensuring the smooth progress of production.

[0062] It can be understood that the number of laser scribing devices 100 can be 2, 4, 8, etc. When the number of laser scribing devices 100 is 2, the first group contains 1 laser scribing device 100, and the second group contains 1 laser scribing device 100. When the number of laser scribing devices 100 is 4, each group contains 2 laser scribing devices 100. The number of laser scribing devices 100 in each group can be an odd number or an even number; the number of laser scribing devices 100 in each group can be the same or different, and the number of laser scribing devices 100 in each group is not limited here.

[0063] It should be noted that two sets of laser scribing devices 100 can be installed on both the front and back sides of the material 300 to scribe the material 300. It should be noted that the area of ​​the material 300 scribed by the first set of laser scribing devices 100 can be considered as the first area, and the area of ​​the material 300 scribed by the second set of laser scribing devices 100 can be considered as the second area. The positions of the first area and the second area can be configured according to the actual production process.

[0064] The embodiments of the present application are described in detail above in conjunction with the accompanying drawings. The above embodiments are only used to illustrate the technical solution of the present application, rather than to limit it. The present application is not limited to the above embodiments. Within the scope of knowledge possessed by ordinary technicians in the relevant technical field, various changes can be made without departing from the purpose of the present application.

Claims

1. A laser scribing device, wherein, The laser scribing device includes: a light source for emitting laser light; a beam splitting unit including a beam splitter and a light control component. The beam splitter and the light control component are arranged in sequence on the optical path of the laser. The beam splitter is used to split the laser into multiple scribing beams, and the light control component is used to control the multiple scribing beams so that the multiple scribing beams sequentially cross along the same path.

2. The laser scribing device according to claim 1, wherein, The light control component includes a galvanometer scanner and a field lens. The galvanometer scanner and the field lens cooperate to enable the multiple scribing beams to sequentially cross along the same path.

3. A laser scribing device, wherein, The laser scribing equipment includes the laser scribing device according to any one of claims 1 to 2.

4. The laser scribing device according to claim 3, wherein, The laser scribing equipment includes an unwinding device, a winding device, and multiple laser scribing devices. The unwinding device and the winding device cooperate to realize the unwinding and winding of the material to be scribed. The multiple laser scribing devices are arranged between the unwinding device and the winding device and are used to scribe on the outer wall of the material to be scribed.

5. The laser scribing device according to claim 4, wherein, The multiple laser scribing devices are configured into two groups, one group is located on one side of the material to be scribed, and the other group is located on the opposite side of the material to be scribed.

6. The laser scribing device according to claim 5, wherein, The two groups of laser scribing devices are arranged oppositely, and the material to be scribed is guided by guide rollers to sequentially pass through the two groups of laser scribing devices.

7. The laser scribing device according to claim 4, wherein, Tension devices are arranged between the unwinding device and the laser scribing device, and tension devices are arranged between the laser scribing device and the winding device. The tension devices are used to tension the material to be scribed.

8. The laser scribing device according to claim 7, wherein, The tension device includes a connecting frame and two tension rollers. The material to be scribed is wound around the two tension rollers, and the two tension rollers can move towards or away from each other to adjust the tension of the material to be scribed.

9. The laser scribing device according to claim 4, wherein, It further includes a dust cleaning device. The dust cleaning device is arranged between the unwinding device and the laser scribing device, and the dust cleaning device is arranged between the laser scribing device and the winding device. The dust cleaning device is used to clean the outer wall of the material to be scribed.

10. A control method, wherein, The control method is applied to the laser scribing equipment according to claim 4. The multiple laser scribing devices are configured into two groups. A first area and a second area are set on the material to be scribed. The control method includes: controlling the unwinding device and the winding device to pull the material to be scribed so that the first group of laser scribing devices are aligned with the first area; controlling the unwinding device and the winding device to pull the material to be scribed, and the first group of laser scribing devices scribe on the first area; after the first group of laser scribing devices finish scribing, controlling the unwinding device and the winding device to pull the material to be scribed so that the first group of laser scribing devices skip the first area and the second group of laser scribing devices are aligned with the second area; controlling the second group of laser scribing devices to scribe on the second area.

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