Loudspeaker driver, loudspeaker module, and electronic device

Abstract

The present application provides a loudspeaker driver, a loudspeaker module, and an electronic device, used for enhancing the driving force of the loudspeaker driver and improving the sound production performance of the loudspeaker driver. The loudspeaker driver comprises a basket, a diaphragm, a first voice coil, and a second voice coil; the diaphragm is mounted on the basket; the first voice coil and the second voice coil are both located inside the basket and are both mounted on the diaphragm; the second voice coil is located inside the first voice coil and spaced apart from the first voice coil; the first voice coil has a first end face facing the diaphragm, the second voice coil has a second end face facing the diaphragm, and the second end face is located on the side of the first end face facing the diaphragm.

Description

Speaker cores, speaker modules, and electronics

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on January 12, 2024, with application number 202410050495.2 and application name “Speaker core, speaker module and electronic device”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of loudspeaker technology, and in particular to a loudspeaker core, a loudspeaker module and an electronic device. Background Art

[0003] With the continuous advancement of science and technology, electronic devices such as mobile phones are widely used in people's daily lives and work, becoming indispensable daily necessities. Existing electronic devices often use dynamic speaker cores to produce sound. However, existing dynamic speaker cores often use a single voice coil to drive the diaphragm to vibrate and produce sound, resulting in low driving force and poor sound performance. Summary of the Invention

[0004] The present application provides a speaker core, a speaker module and an electronic device for increasing the driving force of the speaker core and improving the sound performance of the speaker core.

[0005] In a first aspect, the present application provides a speaker core, comprising a frame, a diaphragm, a first voice coil, and a second voice coil, wherein the diaphragm is mounted on the frame, the first voice coil and the second voice coil are both located inside the frame and mounted on the diaphragm, and the second voice coil is located inside the first voice coil and spaced apart from the first voice coil;

[0006] The first voice coil has a first end surface facing the sound membrane, and the second voice coil has a second end surface facing the sound membrane. The second end surface is located on the side of the first end surface facing the sound membrane.

[0007] In this application, the speaker core uses a first voice coil and a second voice coil to jointly drive the diaphragm to vibrate and produce sound. The first and second voice coils can cooperate with the magnetic circuit assembly to shorten the magnetic path, fully utilizing the driving magnetic field provided by the magnetic circuit assembly and improving the magnetic field utilization rate of the magnetic circuit assembly. This is equivalent to achieving a high driving force for the speaker core, improving the sound sensitivity of the speaker core, and contributing to improved sound performance of the speaker core. Furthermore, the first and second voice coils are designed at different heights, further fully utilizing the driving magnetic field provided by the magnetic circuit assembly, achieving a high driving force for the speaker core, improving the sound sensitivity of the speaker core, and contributing to improved sound performance of the speaker core.

[0008] In one embodiment, the sound diaphragm includes a body and a convex hull, the body is mounted on the basin frame, the convex hull is connected to the body, and protrudes relative to the body in a direction away from the basin frame;

[0009] The first voice coil is installed on the main body, and the second voice coil is installed on the convex bulge, so that the first voice coil and the second voice coil are designed at different height surfaces. The driving magnetic field provided by the magnetic circuit component can be fully utilized to achieve a high driving force of the speaker core, thereby improving the sound sensitivity of the speaker core and helping to improve the sound performance of the speaker core.

[0010] In one embodiment, the ratio of the area of ​​the convex hull to the area of ​​the sound membrane is between 1 / 4 and 1 / 3.

[0011] The area of ​​the convex part is relatively small compared to the area of ​​the sound diaphragm, that is, the area occupied by the convex part on the sound diaphragm is relatively small, and the other areas on the sound diaphragm except the convex part can be used for air flow, which can reduce the height of the speaker core near the sound outlet and increase the cross-sectional area of ​​the sound outlet to achieve a reduction in air flow rate, which helps to improve the external sound quality of the speaker module and enhance the sound performance of the speaker module.

[0012] In one embodiment, the second voice coil is taller than the first voice coil. This height, compared to the first voice coil, is equivalent to using a long voice coil structure to drive the diaphragm, which can achieve low distortion in the speaker core and effectively improve the external sound quality of the speaker module.

[0013] In one embodiment, the speaker core further includes a first magnetic conductive plate, a first magnet, a second magnet, and a third magnet. The first magnetic conductive plate is located on a side of the basin frame facing away from the sound diaphragm and is spaced apart from the basin frame. The first magnet, the second magnet, and the third magnet are all located on a surface of the first magnetic conductive plate facing the basin frame. The second magnet is located on the inner side of the first magnet and forms a first gap with the first magnet. The third magnet is located on the inner side of the second magnet and forms a second gap with the second magnet.

[0014] The end of the first voice coil facing away from the diaphragm is located in the first gap, and the end of the second voice coil facing away from the diaphragm is located in the second gap. In other words, both the ends of the first and second voice coils facing away from the diaphragm are located in the magnetic field provided by the magnetic circuit assembly. When the first and second voice coils receive audio signals transmitted from the flexible printed circuit board, they move up and down along the Z-axis, cutting through the magnetic lines of force of the magnetic field and driving the diaphragm to vibrate.

[0015] In one embodiment, the second magnet includes a magnet body and a magnet protrusion. The magnet body is located on the surface of the first magnetic conductive plate facing the basin frame, and forms a first sub-gap between the magnet body and the third magnet. The magnet protrusion is connected to the surface of the magnet body facing away from the first magnetic conductive plate, and forms a second sub-gap between the magnet body and the third magnet. The second sub-gap is connected to the first sub-gap, and the second gap includes the first sub-gap and the second sub-gap.

[0016] The first magnet, the second magnet and the third magnet adopt a high-low matching structure. The low magnetic circuit structure is designed to match the first voice coil, and the high magnetic circuit structure is designed to match the second voice coil. This allows the first voice coil and the second voice coil to fully utilize the driving magnetic field provided by the magnetic circuit assembly to achieve high driving force of the speaker core, improve the sound sensitivity of the speaker core, and help improve the sound performance of the speaker core.

[0017] In one embodiment, the speaker core further includes a second magnetic conductive plate, a third magnetic conductive plate, and a fourth magnetic conductive plate;

[0018] The second magnetic conductive plate is located on a surface of the first magnet facing away from the first magnetic conductive plate. The third magnetic conductive plate is located on a surface of the second magnet facing away from the first magnetic conductive plate and is located on an inner side of the second magnetic conductive plate. A third gap is formed between the third magnetic conductive plate and the second magnetic conductive plate, and the third gap is connected to the first gap. The fourth magnetic conductive plate is located on a surface of the third magnet facing away from the first magnetic conductive plate and is located on an inner side of the third magnetic conductive plate. A fourth gap is formed between the third magnetic conductive plate and the third magnetic conductive plate, and the fourth gap is connected to the second gap.

[0019] The end of the first voice coil facing away from the diaphragm is located in the third gap, and the end of the second voice coil facing away from the diaphragm is located in the fourth gap. In other words, both the ends of the first and second voice coils facing away from the diaphragm are located in the magnetic field provided by the magnetic circuit assembly. When the first and second voice coils receive audio signals transmitted from the flexible printed circuit board, they move up and down along the Z-axis, cutting through the magnetic lines of force of the magnetic field and driving the diaphragm to vibrate.

[0020] In one embodiment, the third magnetic conductive plate includes a magnetic conductive plate body and a magnetic conductive protrusion. The magnetic conductive plate body is located on the surface of the second magnet facing away from the first magnetic conductive plate, and forms a third sub-gap with the fourth magnetic conductive plate. The magnetic conductive protrusion is connected to the surface of the magnetic conductive plate body facing away from the first magnetic conductive plate, and forms a fourth sub-gap with the fourth magnetic conductive plate. The second sub-gap connects the first sub-gap and the second gap, and the fourth gap includes the third sub-gap and the fourth sub-gap.

[0021] The second magnetic conductive plate, the third magnetic conductive plate and the fourth magnetic conductive plate adopt a high-low matching structure. The low magnetic circuit structure is designed to match the first voice coil, and the high magnetic circuit structure is designed to match the second voice coil. This allows the first voice coil and the second voice coil to fully utilize the driving magnetic field provided by the magnetic circuit component to achieve high driving force of the speaker core, improve the sound sensitivity of the speaker core, and help improve the sound performance of the speaker core.

[0022] In one embodiment, the first voice coil has a third end face opposite the first end face, and the second voice coil has a fourth end face opposite the second end face. The third and fourth end faces are aligned to ensure that the third and fourth end faces of the first and second voice coils are both located within the magnetic field provided by the magnetic circuit assembly. When the first and second voice coils receive audio signals transmitted by the flexible printed circuit board, they move up and down along the Z-axis, cutting through the magnetic field lines and driving the diaphragm to vibrate.

[0023] In one embodiment, the speaker core further includes a first frame and a second frame, both of which are located inside the basin frame, the first frame is connected between the sound diaphragm and the first voice coil, and the second frame is connected between the sound diaphragm and the second voice coil, and is located inside the first frame and spaced apart from the first frame.

[0024] The first frame is taller than the second frame, ensuring that the ends of the first and second voice coils facing away from the diaphragm are both within the magnetic field provided by the magnetic circuit assembly. When the first and second voice coils receive audio signals from the flexible printed circuit board, they move up and down along the Z-axis, cutting through the magnetic field lines and driving the diaphragm to vibrate.

[0025] In one embodiment, the speaker core further comprises a flexible circuit board, which is mounted on the basin frame and electrically connected to the first voice coil and the second voice coil;

[0026] The first frame is provided with a first avoidance groove, the opening of the first avoidance groove is located on the surface of the first frame facing the sound membrane, the first avoidance groove runs through the inner side surface and the outer side surface of the first frame, and avoids the flexible circuit board to avoid mutual interference between the first frame and the flexible circuit board, thereby ensuring the reliability of the speaker core.

[0027] In one embodiment, the third magnetic conductive plate is provided with a second avoidance groove, the opening of the second avoidance groove is located on the surface of the third magnetic conductive plate facing the basin frame, the second avoidance groove passes through the inner side surface and the outer side surface of the third magnetic conductive plate, and avoids the flexible circuit board to avoid mutual interference between the third magnetic conductive plate and the flexible circuit board, thereby ensuring the reliability of the speaker core.

[0028] In one embodiment, the sound membrane includes a diaphragm and a dome, the diaphragm includes a first fixing part, a second fixing part and a folding ring part, the first fixing part is installed on the basin frame, the second fixing part is located on the inner side of the first fixing part, and is spaced apart from the first fixing part, the folding ring part is connected between the first fixing part and the second fixing part, and is recessed toward the basin frame to reduce the height of the speaker core near the sound outlet, which can increase the cross-sectional area of ​​the sound outlet to achieve a reduction in air flow rate, which helps to improve the external sound quality of the speaker module and enhance the sound performance of the speaker module.

[0029] The dome is mounted on the second fixing portion, and the first voice coil and the second voice coil are both mounted on the dome.

[0030] In the second aspect, the present application provides a speaker module, comprising a first shell and any one of the above-mentioned speaker cores, the speaker core being installed in the first shell, a front sound cavity being formed between the sound membrane and the first shell, the first shell being provided with a sound outlet hole, the sound outlet hole connecting the front sound cavity and the outside of the speaker module.

[0031] In this application, the speaker core uses a first voice coil and a second voice coil to jointly drive the diaphragm to vibrate to achieve vibration sound. The first and second voice coils can cooperate with the magnetic circuit assembly to shorten the magnetic path, fully utilizing the driving magnetic field provided by the magnetic circuit assembly and improving the magnetic field utilization rate of the magnetic circuit assembly. This is equivalent to achieving a high driving force for the speaker core, improving the sound sensitivity of the speaker core, and helping to improve the sound performance of the speaker core. Moreover, the first and second voice coils are designed at different heights, which can further fully utilize the driving magnetic field provided by the magnetic circuit assembly, achieving a high driving force for the speaker core, improving the sound sensitivity of the speaker core, and helping to improve the sound performance of the speaker module.

[0032] In one embodiment, the speaker module further includes a second shell, the second shell and the first shell are fixed to each other, the speaker core is located on the inner side of the second shell and the first shell, and the side of the sound membrane facing away from the front sound cavity forms a rear sound cavity.

[0033] In a third aspect, the present application provides an electronic device comprising a processor and any one of the above-mentioned speaker modules, wherein the speaker module is electrically connected to the processor.

[0034] In this application, the speaker core uses a first voice coil and a second voice coil to jointly drive the diaphragm to vibrate and produce sound. The first and second voice coils can cooperate with the magnetic circuit assembly to shorten the magnetic path, fully utilizing the driving magnetic field provided by the magnetic circuit assembly and improving the magnetic field utilization rate of the magnetic circuit assembly. This is equivalent to achieving a high driving force for the speaker core, improving the sound sensitivity of the speaker core, and contributing to improved sound performance of the speaker core. Furthermore, the first and second voice coils are designed at different heights, further fully utilizing the driving magnetic field provided by the magnetic circuit assembly, achieving a high driving force for the speaker core, improving the sound sensitivity of the speaker core, and contributing to improved sound performance of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be described below.

[0036] FIG1 is a schematic structural diagram of a first electronic device provided in an embodiment of the present application;

[0037] FIG2 is a schematic cross-sectional view of the speaker module in the electronic device shown in FIG1 ;

[0038] FIG3 is a schematic structural diagram of the speaker core in the speaker module shown in FIG2 ;

[0039] FIG4 is a schematic diagram of the exploded structure of the speaker core shown in FIG3 ;

[0040] FIG5 is a schematic structural diagram of a vibration component in the speaker core shown in FIG4 ;

[0041] FIG6 is a schematic diagram of the exploded structure of the vibration assembly shown in FIG5 ;

[0042] FIG7 is a schematic cross-sectional view of the vibration assembly shown in FIG5 taken along point II;

[0043] FIG8 is a schematic structural diagram of the sound diaphragm in the vibration assembly shown in FIG6;

[0044] FIG9 is a schematic diagram of the exploded structure of the sound diaphragm shown in FIG8 ;

[0045] FIG10 is a schematic cross-sectional view of the sound membrane shown in FIG8 taken along II-II;

[0046] FIG11 is a schematic diagram of a partial structure of the vibration assembly shown in FIG5 ;

[0047] FIG12 is a schematic diagram of the assembly structure of the basin frame and the vibration component in the speaker core shown in FIG4;

[0048] FIG13 is a schematic structural diagram of the assembly structure of the basin frame and the vibration assembly shown in FIG12 at another angle;

[0049] FIG14 is a schematic cross-sectional view of the assembled structure of the basin frame and the vibration assembly shown in FIG12 taken along line III-III;

[0050] FIG15 is a schematic structural diagram of the magnetic circuit assembly in the speaker core shown in FIG4 ;

[0051] FIG16 is a schematic diagram of the exploded structure of the magnetic circuit assembly shown in FIG15;

[0052] FIG17 is a schematic cross-sectional view of the magnetic circuit assembly shown in FIG15 taken along line IV-IV;

[0053] FIG18 is a schematic diagram of a partial structure of the magnetic circuit assembly shown in FIG15;

[0054] FIG19 is a schematic cross-sectional view of the speaker core shown in FIG3 taken along line VV;

[0055] FIG20 is a schematic diagram of the cross-sectional structure of the speaker core in the second electronic device provided by the present application after being cut along VV. DETAILED DESCRIPTION

[0056] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application.

[0057] Please refer to FIG. 1 , which is a schematic structural diagram of an electronic device 1000 provided in an embodiment of the present application.

[0058] The electronic device 1000 may be a mobile phone, tablet computer, laptop computer, car computer, smart watch, smart bracelet, POS terminal (point of sales terminal), or other electronic products with audio playback function. Next, the embodiment of the present application is described by taking the electronic device 1000 as a mobile phone as an example.

[0059] The electronic device 1000 includes a housing 100 , a display module 200 , a circuit board 300 , a processor 400 , and a speaker module 500 . The display module 200 , the circuit board 300 , the processor 400 , and the speaker module 500 are all mounted on the housing 100 .

[0060] The housing 100 is provided with a speaker hole 1001, which connects the inner side and the outer side of the housing 100. In this embodiment, the housing 100 includes a middle frame 110 and a back cover 120. The middle frame 110 is provided with a speaker hole 1001. The back cover 120 is mounted on one side of the middle frame 110. Exemplarily, the back cover 120 can be mounted on the middle frame 110 in a detachable manner to facilitate the repair and replacement of internal devices or modules of the electronic device 1000, or the back cover 120 can be integrally formed with the middle frame 110 to increase the overall strength of the housing 100. Among them, the back cover 120 can be a battery cover of the electronic device 1000.

[0061] The display module 200 is mounted on the side of the middle frame 110 facing away from the back cover 120. When the user uses the electronic device 1000, the display module 200 is placed toward the user and the back cover 120 is placed away from the user. The display module 200 includes a cover plate and a display screen (not shown) fixed to the cover plate. The cover plate can be made of a transparent material such as glass. The display screen can be a display screen such as an LCD (liquid crystal display) or an OLED (organic light-emitting diode display) for displaying information such as images or text.

[0062] The circuit board 300, the processor 400 and the speaker module 500 are all installed on the inner side of the housing 100. Specifically, the circuit board 300, the processor 400 and the speaker module 500 are all installed on the inner side of the middle frame 110. The processor 400 is installed on the circuit board 300 and is electrically connected to the circuit board 300. Among them, the circuit board 300 can be the main board (main board) of the electronic device 1000, and the processor 400 can be the CPU (central processing unit) of the electronic device 1000. The speaker module 500 is electrically connected to the circuit board 300 and the processor 400 is realized through the circuit board 300. The speaker module 500 can receive the audio signal sent by the processor 400 through the circuit board 300, and vibrate and make sound according to the audio signal. The sound diffuses into the external environment through the speaker hole 1001, thereby realizing the sound of the electronic device 1000.

[0063] Please also refer to FIG. 2 , which is a schematic cross-sectional view of the speaker module 500 in the electronic device 1000 shown in FIG. 1 .

[0064] The speaker module 500 includes a first housing 510, a second housing 520, and a speaker core 530. The first housing 510 and the second housing 520 are connected to each other and enclose a sound cavity 501. The first housing 510 is provided with a sound outlet 511, which extends through the first housing 510 along the thickness of the second housing 520 and connects the sound cavity 501 to the external environment. The speaker core 530 is located in the sound cavity 501 and is electrically connected to the circuit board 300 to achieve electrical connection between the speaker module 500 and the circuit board 300. The speaker core 530 includes a diaphragm 21, which divides the sound cavity 501 into a front sound cavity 502 and a rear sound cavity 503. The front sound cavity 502 is formed between the diaphragm 21 and the first housing 510 and is connected to the sound outlet 511. The rear sound cavity 503 is located on the side of the diaphragm 21 facing away from the front sound cavity 502.

[0065] Please refer to FIG. 3 and FIG. 4 . FIG. 3 is a schematic structural diagram of the speaker core 530 in the speaker module 500 shown in FIG. 2 , and FIG. 4 is a schematic exploded structural diagram of the speaker core 530 shown in FIG. 3 .

[0066] For ease of description, the width direction of the speaker core 530 is defined as the X-axis direction, the length direction of the speaker core 530 is defined as the Y-axis direction, and the height direction of the speaker core 530 is defined as the Z-axis direction. The X-axis direction, the Y-axis direction, and the Z-axis direction are perpendicular to each other.

[0067] Speaker core 530 includes a frame 10, a vibration assembly 20, and a magnetic circuit assembly 30. Both the vibration assembly 20 and the magnetic circuit assembly 30 are mounted on the frame 10. The frame 10 has a first mounting surface 101 and a second mounting surface 102. Along the height of the frame 10, the first mounting surface 101 and the second mounting surface 102 are arranged opposite each other. For example, the frame 10 is in the shape of a square ring, with the first mounting surface 101 and the second mounting surface 102 both parallel to the XY plane.

[0068] Please refer to Figures 5 to 7. Figure 5 is a schematic diagram of the structure of the vibration assembly 20 in the speaker core 530 shown in Figure 4. Figure 6 is a schematic diagram of the exploded structure of the vibration assembly 20 shown in Figure 5. Figure 7 is a schematic diagram of the cross-sectional structure of the vibration assembly 20 shown in Figure 5 taken along line II. The term "cross-sectional view along line II" refers to a cross-sectional view along the plane along line II. Similar descriptions of the figures hereinbelow shall be understood in the same manner.

[0069] The vibration assembly 20 includes a diaphragm 21, a first voice coil 22, a second voice coil 23, a first frame 24, a second frame 25, and a flexible circuit board 26. The first voice coil 22, the second voice coil 23, the first frame 24, the second frame 25, and the flexible circuit board 26 are all located below the diaphragm 21. The second voice coil 23 is located inside the first voice coil 22 and spaced apart from the first voice coil 22. The first frame 24 is located between the diaphragm 21 and the first voice coil 22 and is connected thereto. The second frame 25 is located between the diaphragm 21 and the second voice coil 23 and is connected thereto. It is located inside the first frame 24 and spaced apart from the first frame 24. One end of the flexible circuit board 26 is electrically connected to the first voice coil 22 and the second voice coil 23, and the other end is electrically connected to the circuit board 300 (as shown in FIG. 1 ), thereby electrically connecting the speaker core 530 to the circuit board 300.

[0070] It should be noted that the directional terms such as "up", "down", "inside" and "outside" used in describing the speaker core 530 in the embodiment of the present application are mainly explained based on the display orientation of the speaker core 530 in the accompanying drawings. "Towards the positive direction of the Z axis is "up", toward the negative direction of the Z axis is "down", toward the middle of the speaker core 530 is "inside", and away from the middle of the speaker core 530 is "outside", which does not constitute a limitation on the orientation of the speaker core 530 in actual application scenarios.

[0071] Please refer to Figures 8 to 10. Figure 8 is a structural schematic diagram of the sound membrane 21 in the vibration component 20 shown in Figure 6, Figure 9 is a decomposed structural schematic diagram of the sound membrane 21 shown in Figure 8, and Figure 10 is a cross-sectional structural schematic diagram of the sound membrane 21 shown in Figure 8 after being cut along II-II.

[0072] The sound diaphragm 21 includes a main body 211 and a convex portion 212. The convex portion 212 is located on the inner side of the main body 211 and is connected to the main body 211. The convex portion 212 is convexly arranged relative to the main body 211. That is, the convex portion 212 protrudes relative to the main body 211 in a direction away from the first voice coil 22 and the second voice coil 23. The provision of the convex portion 212 can save space on the lower side of the sound diaphragm 21, allowing the first voice coil 22, the second voice coil 23 and the magnetic circuit assembly 30 located on the lower side of the sound diaphragm 21 to be provided with a larger height dimension, which can increase the driving force of the speaker core 530 and help improve the sound performance of the speaker core 530. Exemplarily, the main body 211 is roughly square ring-shaped, and the convex portion 212 is roughly rounded rectangular.

[0073] The ratio of the area of ​​the convex portion 212 to the area of ​​the sound diaphragm 21 is between 1 / 4 and 1 / 3. For example, the ratio of the area of ​​the convex portion 212 to the area of ​​the sound diaphragm 21 can be 1 / 4, 7 / 24 or 1 / 3. It should be noted that the area of ​​the convex portion 212 is relatively small compared to the area of ​​the sound diaphragm 21, that is, the area occupied by the convex portion 212 on the sound diaphragm 21 is relatively small, and the other areas of the sound diaphragm 21 except the convex portion 212 can be used for air flow, which can reduce the height of the speaker core 530 near the sound outlet 511 and increase the cross-sectional area of ​​the sound outlet 511 to achieve a reduction in air flow rate, which helps to improve the external sound quality of the speaker module 500 and enhance the sound performance of the speaker module 500.

[0074] In this embodiment, the sound membrane 21 includes a diaphragm 27 and a dome 28, and the dome 28 is mounted on the diaphragm 27. Exemplarily, the diaphragm 27 is roughly square ring-shaped. The diaphragm 27 includes a first fixed portion 271, a second fixed portion 272 and a folded ring portion 273. The second fixed portion 272 is located on the inner side of the first fixed portion 271 and is spaced apart from the first fixed portion 271. The folded ring portion 273 is connected between the first fixed portion 271 and the second fixed portion 272. Exemplarily, the first fixed portion 271, the second fixed portion 272 and the folded ring portion 273 are all roughly square ring-shaped. The folded ring portion 273 can be deformed when subjected to external force so that the second fixed portion 272 can move relative to the first fixed portion 271.

[0075] The folding ring portion 273 is recessed relative to the first fixing portion 271 and the second fixing portion 272. That is, the folding ring portion 273 is recessed relative to the first fixing portion 271 and the second fixing portion 272 in a direction away from the dome 28 to reduce the height of the speaker core 530 near the sound outlet 511, which can increase the cross-sectional area of ​​the sound outlet 511 to reduce the air flow rate, thereby helping to improve the external sound quality of the speaker module 500 and enhance the sound performance of the speaker module 500. In some other embodiments, the folding ring portion 273 can also be convex relative to the first fixing portion 271 and the second fixing portion 272. That is, the folding ring portion 273 can also protrude relative to the first fixing portion 271 and the second fixing portion 272 toward the dome 28, and this application does not impose any specific restrictions on this.

[0076] The dome 28 is mounted on the second fixing portion 272 of the diaphragm 27. The dome 28 includes a third fixing portion 281, a convex portion 212 and a first connecting portion 282. The third fixing portion 281 is located on the lower side of the second fixing portion 272 and is mounted on the second fixing portion 272 to achieve assembly between the dome 28 and the diaphragm 27. The convex portion 212 is located on the inner side of the third fixing portion 281 and is spaced apart from the third fixing portion 281. The first connecting portion 282 is connected between the third fixing portion 281 and the convex portion 212. Exemplarily, the third fixing portion 281 and the first connecting portion 282 are both roughly square ring-shaped. Among them, the main body 211 includes the first fixing portion 271, the second fixing portion 272, the folding ring portion 273, the third fixing portion 281 and the first connecting portion 282.

[0077] Please refer to Figures 6 and 7. The first voice coil 22, the second voice coil 23, the first skeleton 24 and the second skeleton 25 are all located on the lower side of the dome 28. The first voice coil 22 is located on the lower side of the body 211 and is installed on the body 211. Specifically, the first voice coil 22 is located on the lower side of the third fixing portion 281 and is installed on the third fixing portion 281. The first voice coil 22 has a first end face 221 and a third end face 222. Along the height direction of the first voice coil 22, the first end face 221 and the third end face 222 are arranged back to back. Among them, the first end face 221 is the end face of the first voice coil 22 facing the sound membrane 21, and the third end face 222 is the end face of the first voice coil 22 away from the sound membrane 21. Exemplarily, the first voice coil 22 is a rounded rectangle.

[0078] The second voice coil 23 is located on the lower side of the convex portion 212 and is installed on the convex portion 212. The second voice coil 23 has a second end face 231 and a fourth end face 232. Along the height direction of the second voice coil 23, the second end face 231 and the fourth end face 232 are arranged opposite to each other. Among them, the second end face 231 is the end face of the second voice coil 23 facing the sound membrane 21, and is located on the side of the first end face 221 facing the sound membrane 21. The fourth end face 232 is the end face of the second voice coil 23 facing away from the sound membrane 21, and is flush with the third end face 222. In some other embodiments, the fourth end face 232 may not be flush with the third end face 222, and this application does not impose specific restrictions on this. Exemplarily, the second voice coil 23 is a rounded rectangle.

[0079] The height h1 of the first voice coil 22 is less than the height h2 of the second voice coil 23. In this embodiment, the speaker core 530 utilizes the first voice coil 22 and the second voice coil 23 to jointly drive the diaphragm 21 to vibrate, thereby producing sound. The first voice coil 22 and the second voice coil 23 can cooperate with the magnetic circuit assembly 30 to shorten the magnetic path, fully utilizing the driving magnetic field provided by the magnetic circuit assembly 30 and improving the magnetic field utilization of the magnetic circuit assembly 30. This effectively achieves high driving force for the speaker core 530, improves the sound sensitivity of the speaker core 530, and contributes to improved sound performance of the speaker core 530. Furthermore, the first voice coil 22 and the second voice coil 23 are designed at different heights, further fully utilizing the driving magnetic field provided by the magnetic circuit assembly 30, achieving high driving force for the speaker core 530, improving the sound sensitivity of the speaker core 530, and contributing to improved sound performance of the speaker core 530. Furthermore, the height h2 of the second voice coil 23 is greater than the height h1 of the first voice coil 22 , which is equivalent to using a long voice coil structure to drive the sound membrane 21 , which can achieve low distortion of the speaker core 530 and effectively improve the external sound quality of the speaker module 500 .

[0080] The first frame 24 is located between the third fixing portion 281 and the first voice coil 22, and is connected therebetween. The first frame 24 has a first surface 241 and a second surface 242. Along the height direction of the first frame 24 (the Z-axis direction in the figure), the first surface 241 and the second surface 242 are arranged opposite each other. The first surface 241 is the surface of the first frame 24 facing the diaphragm 21, and the second surface 242 is the surface of the first frame facing away from the diaphragm 21.

[0081] The first frame 24 is provided with a first avoidance groove 243, the opening of which is located on the first surface 241. The first avoidance groove 243 is recessed from the first surface 241 toward the second surface 242 (in the negative direction of the Z axis as shown) and extends through the inner side surface and the outer side surface of the first frame 24. There are four first avoidance grooves 243, which are spaced apart and arranged around the first frame 24. For example, the first frame 24 is in the shape of a square ring, with the four first avoidance grooves 243 located at the four corners of the first frame 24.

[0082] The second frame 25 is located between the convex portion 212 and the second voice coil 23, and is connected therebetween. Exemplarily, the second frame 25 has a square ring shape. The height h4 of the second frame 25 is less than the height h3 of the first frame 24, so that the third end face 222 of the first voice coil 22 and the fourth end face 232 of the second voice coil 23 can both be located within the driving magnetic field of the magnetic circuit assembly 30, ensuring that the first and second voice coils 22, 23 can drive the diaphragm 21 to vibrate under the action of the driving magnetic field of the magnetic circuit assembly 30.

[0083] In this embodiment, the first bobbin 24 prevents direct contact between the first voice coil 22 and the diaphragm 21, and the second bobbin 25 prevents direct contact between the second voice coil 23 and the diaphragm 21. The first bobbin 24 and the second bobbin 25 provide heat dissipation, preventing the first and second voice coils 22, 23 from overheating and potentially damaging the diaphragm 21, thereby ensuring the reliability of the speaker core 530. In other embodiments, the speaker core 530 may not include the first bobbin 24, and the first voice coil 22 may be directly mounted to the diaphragm 21. Alternatively, the speaker core 530 may not include the second bobbin 25, and the second voice coil 23 may be directly mounted to the diaphragm 21. This streamlines the structure of the speaker core 530 and facilitates a lightweight and thin design for the speaker core 530.

[0084] Please refer to Figure 6 and Figure 11. Figure 11 is a partial structural diagram of the vibration assembly 20 shown in Figure 5. Figure 11 does not show the sound membrane 21.

[0085] The flexible circuit board 26 includes four sub-flexible circuit boards 29, each connected to the second frame 25 and spaced apart around the second frame 25. Specifically, one end of each sub-flexible circuit board 29 is electrically connected to the first voice coil 22 and the second voice coil 23, and the other end is electrically connected to the circuit board 300. For example, each sub-flexible circuit board 29 can be electrically connected to the first voice coil 22 and the second voice coil 23 via a wire (not shown). Each sub-flexible circuit board 29 is positioned within a first avoidance groove 243. In other words, each first avoidance groove 243 allows for a sub-flexible circuit board 29 to be avoided, preventing interference between the first frame 24 and the flexible circuit board 26, thereby ensuring the reliability of the speaker core 530.

[0086] For example, the four sub-flexible circuit boards 29 have the same structure. Each sub-flexible circuit board 29 includes a fourth fixing portion 291, an electrical connection portion 292, and a second connection portion 293. The fourth fixing portion 291 is located below the first fixing portion 271 of the diaphragm 27. The electrical connection portion 292 is located inside the fourth fixing portion 291 and below the dome 28, electrically connecting the first voice coil 22 and the second voice coil 23. The electrical connection portion 292 passes through the first avoidance groove 243. That is, the first avoidance groove 243 avoids the electrical connection portion 292. The second connection portion 293 is located below the edge portion 273 of the diaphragm 27 and connects between the fourth fixing portion 291 and the electrical connection portion 292.

[0087] Please refer to Figures 12 to 14. Figure 12 is a schematic diagram of the assembly structure of the basin frame 10 and the vibration component 20 in the speaker core 530 shown in Figure 4. Figure 13 is a schematic diagram of the structure of the assembly structure of the basin frame 10 and the vibration component 20 shown in Figure 12 at another angle. Figure 14 is a schematic diagram of the cross-sectional structure of the assembly structure of the basin frame 10 and the vibration component 20 shown in Figure 12 after being cut along III-III.

[0088] The vibration assembly 20 is mounted on the first mounting surface 101 of the frame 10. Part of the vibration assembly 20 is fixed relative to the frame 10, while part of the vibration assembly 20 can vibrate relative to the frame 10. Specifically, the diaphragm 21 is mounted on the first mounting surface 101 of the frame 10. The first voice coil 22, second voice coil 23, first frame 24, and second frame 25 are all located on the inner side of the frame 10 and spaced apart from the frame 10. The flexible circuit board 26 is mounted on the second mounting surface 102 of the frame 10. The first fixing portion 271 of the diaphragm 27 is mounted on the first mounting surface 101 of the frame 10. The fourth fixing portion 291 of the sub-flexible circuit board 29 is located on the lower side of the frame 10 and mounted on the second mounting surface 102 of the frame 10.

[0089] When the first voice coil 22 and the second voice coil 23 move relative to the frame 10, they drive the dome 28, the first frame 24, and the second frame 25 of the diaphragm 21 to move relative to the frame 10. In the diaphragm 27 of the diaphragm 21, the first fixing portion 271 is fixed relative to the frame 10, and the second fixing portion 272 moves relative to the frame 10 driven by the dome 28. The folded ring portion 273 moves relative to the frame 10 and deforms under the drive of the second fixing portion 272. In the flexible circuit board 26, the fourth fixing portion 291 of the sub-flexible circuit board 29 is fixed relative to the frame 10. The electrical connection portion 292 of the sub-flexible circuit board 29 moves relative to the frame 10 following the movement of the first voice coil 22 and the second voice coil 23 relative to the frame 10. The second connection portion 293 of the sub-flexible circuit board 29 moves relative to the frame 10 under the drive of the electrical connection portion 292.

[0090] Please refer to Figures 15 to 17. Figure 15 is a structural schematic diagram of the magnetic circuit component 30 in the speaker core 530 shown in Figure 4, Figure 16 is a decomposed structural schematic diagram of the magnetic circuit component 30 shown in Figure 15, and Figure 17 is a cross-sectional structural schematic diagram of the magnetic circuit component 30 shown in Figure 15 after being cut along IV-IV.

[0091] The magnetic circuit assembly 30 includes a first magnetic conductive plate 31, a first magnet 32, a second magnet 33, a third magnet 34, a second magnetic conductive plate 35, a third magnetic conductive plate 36, and a fourth magnetic conductive plate 37. The first magnet 32, the second magnet 33, the third magnet 34, the second magnetic conductive plate 35, the third magnetic conductive plate 36, and the fourth magnetic conductive plate 37 are all located on the upper side of the first magnetic conductive plate 31.

[0092] The first magnetic conductive plate 31 has a third surface 311 and a fourth surface 312. Along the thickness direction of the first magnetic conductive plate 31, the third surface 311 and the fourth surface 312 are disposed opposite each other. The third surface 311 is the surface of the first magnetic conductive plate 31 facing the basin frame 10, and the fourth surface 312 is the surface of the first magnetic conductive plate 31 facing away from the basin frame 10. Exemplarily, both the third surface 311 and the fourth surface 312 are parallel to the XY plane.

[0093] Please refer to Figure 18, which is a partial structural diagram of the magnetic circuit assembly 30 shown in Figure 15. Figure 18 does not show the second magnetic conductive plate 35, the third magnetic conductive plate 36 and the fourth magnetic conductive plate 37.

[0094] The first magnet 32, the second magnet 33, and the third magnet 34 are all located on the third surface 311. The first magnet 32 ​​is located at the edge of the third surface 311. The first magnet 32 ​​includes two first magnet portions 321 and two second magnet portions 322. The two first magnet portions 321 are arranged at intervals along the X-axis direction. The two second magnet portions 322 are arranged at intervals along the Y-axis direction and are spaced apart from the two first magnet portions 321. A first corner gap 323 is formed between each first magnet portion 321 and a second magnet portion 322.

[0095] The second magnet 33 is located inside the first magnet 32 ​​and forms a first gap 331 between the second magnet 32 ​​and the first magnet 32. The first gap 331 is connected to all four first corner gaps 323. Exemplarily, the first gap 331 and the second magnet 33 are both elliptical ring-shaped. The third magnet 34 is located inside the second magnet 33. A second gap 341 is formed between the third magnet 34 and the second magnet 33. Exemplarily, the second gap 341 is elliptical ring-shaped. The height h6 of the third magnet 34 is greater than the height h5 of the second magnet 33.

[0096] Referring to Figures 15 to 17 , the second magnetic conductive plate 35 is located on the surface of the first magnet 32 ​​facing away from the first magnetic conductive plate 31. The second magnetic conductive plate 35 includes a magnetic conductive frame 351, two first magnetic conductive portions 352, and two second magnetic conductive portions 353. The magnetic conductive frame 351 is located on the surface of the two first magnet portions 321 and the two second magnet portions 322 facing away from the first magnetic conductive plate 31. The two first magnetic conductive portions 352 and the second magnetic conductive portions 353 are both located inside the magnetic conductive frame 351 and connected to the magnetic conductive frame 351. Each first magnetic conductive portion 352 is located on the surface of a first magnet portion 321 facing away from the first magnetic conductive plate 31, and each second magnetic conductive portion 353 is located on the surface of a second magnet portion 322 facing away from the first magnetic conductive plate 31. A second corner gap 354 is formed between each first magnetic conductive portion 352 and each second magnetic conductive portion 353, and each second corner gap 354 is connected to a first corner gap 323.

[0097] The third magnetic conductive plate 36 is located on the surface of the second magnet 33 facing away from the first magnetic conductive plate 31, and is located on the inner side of the second magnetic conductive plate 35, and forms a third gap 361 between the third magnetic conductive plate 35 and the second magnetic conductive plate 35. The third gap 361 is connected to the first gap 331 and the four second corner gaps 354. The third magnetic conductive plate 36 is provided with a second avoidance groove 362, and the opening of the second avoidance groove 362 is located on the surface of the third magnetic conductive plate 36 facing away from the second magnet 33. The second avoidance groove 362 passes through the inner side surface of the third magnetic conductive plate 36 and the outer side surface of the third magnetic conductive plate 36, and is connected to the third gap 361. There are four second avoidance grooves 362, and the four second avoidance grooves 362 are arranged around the third magnetic conductive plate 36 at intervals from each other. Exemplarily, the third magnetic conductive plate 36 is in the shape of a square ring, and the four second avoidance grooves 362 are respectively located at the four corners of the third magnetic conductive plate 36.

[0098] In this embodiment, the third magnetic conductive plate 36 includes a magnetic conductive plate body 363 and a magnetic conductive protrusion 364. The magnetic conductive plate body 363 is located on the surface of the second magnet 33 facing away from the first magnetic conductive plate 31. The magnetic conductive protrusion 364 is connected to the surface of the magnetic conductive plate body 363 facing away from the second magnet 33 and is located on the side of the magnetic conductive plate body 363 away from the second magnetic conductive plate 35. The inner side surface of the magnetic conductive protrusion 364 is flush with the inner side surface of the magnetic conductive plate body 363, and the outer side surface of the magnetic conductive protrusion 364 is located on the side of the outer side surface of the magnetic conductive plate body 363 facing away from the second magnetic conductive plate 35. In this case, the inner side surface of the third magnetic conductive plate 36 includes the inner side surface of the magnetic conductive plate body 363 and the inner side surface of the magnetic conductive protrusion 364, and the outer side surface of the third magnetic conductive plate 36 is the outer side surface of the magnetic conductive plate body 363. In other embodiments, the inner side surface of the magnetic conductive protrusion 364 may not be flush with the inner side surface of the magnetic conductive plate body 363.

[0099] The fourth magnetic conductive plate 37 is located on the surface of the third magnet 34 facing away from the first magnetic conductive plate 31 and on the inner side of the third magnetic conductive plate 36. A fourth gap 371 is formed between the fourth magnetic conductive plate 37 and the magnetic conductive plate body 363. Specifically, a third sub-gap 372 is formed between the fourth magnetic conductive plate 37 and the magnetic conductive plate body 363. The third sub-gap 372 connects the second gap 341 and the four second avoidance slots 362. A fourth sub-gap 373 is formed between the fourth magnetic conductive plate 37 and the magnetic conductive protrusion 364. The fourth sub-gap 373 connects the third sub-gap 372 and the four second avoidance slots 362. The fourth gap 371 includes the third sub-gap 372 and the fourth sub-gap 373. Exemplarily, the fourth gap 371 is in the shape of a square ring.

[0100] Please also refer to FIG. 19 , which is a schematic cross-sectional view of the speaker core 530 shown in FIG. 3 taken along line VV.

[0101] The magnetic circuit assembly 30 is mounted on the second mounting surface 102 of the basin frame 10. The magnetic circuit assembly 30 is fixed relative to the basin frame 10 and provides a driving magnetic field for the vibration assembly 20. Specifically, the first magnetic conductive plate 31 is located on the side of the basin frame 10 away from the sound membrane 21 and is spaced apart from the basin frame 10. The first magnet 32, the second magnet 33, the third magnet 34 and the second magnetic conductive plate 35 are all located between the first magnetic conductive plate 31 and the basin frame 10. Among them, the second magnetic conductive plate 35 is mounted on the second mounting surface 102 of the basin frame 10. The third magnetic conductive plate 36 and the fourth magnetic conductive plate 37 are both located on the inner side of the basin frame 10. At this time, the four second avoidance grooves 362 of the third magnetic conductive plate 36 respectively avoid the electrical connection parts 292 of the four sub-flexible circuit boards 29 to avoid interference between the magnetic circuit assembly 30 and the flexible circuit board 26, thereby ensuring the reliability of the speaker core 530.

[0102] The end of the first voice coil 22 facing away from the diaphragm 21 is located in the first gap 331 and the third gap 361, while the end of the second voice coil 23 facing away from the diaphragm 21 is located in the second gap 341 and the fourth gap 371. In other embodiments, the end of the first voice coil 22 facing away from the diaphragm 21 may be located in the first gap 331 or the third gap 361, and / or the end of the second voice coil 23 facing away from the diaphragm 21 may be located in the second gap 341 or the fourth gap 371. That is, both the ends of the first voice coil 22 and the ends of the second voice coil 23 facing away from the diaphragm 21 are located in the magnetic field provided by the magnetic circuit assembly 30. When the first and second voice coils 22 and 23 receive audio signals transmitted by the flexible printed circuit board 26, they move up and down along the Z-axis, cutting through the magnetic lines of force of the magnetic field and causing the diaphragm 21 and the flexible printed circuit board 26 to vibrate.

[0103] In the magnetic circuit assembly 30 of the speaker core 530 shown in this embodiment, the first magnet 32, the second magnet 33, the third magnet 34, the second magnetic conductive plate 35, the third magnetic conductive plate 36 and the fourth magnetic conductive plate 37 adopt a high-low matching structure. The low magnetic circuit structure is designed to match the first voice coil 22, and the high magnetic circuit structure is designed to match the second voice coil 23. This allows the first voice coil 22 and the second voice coil 23 to fully utilize the driving magnetic field provided by the magnetic circuit assembly 30, thereby achieving a high driving force for the speaker core 530, improving the sound sensitivity of the speaker core 530, and helping to improve the sound performance of the speaker core 530.

[0104] Please refer to FIG. 20 , which is a schematic cross-sectional structure diagram of the speaker core in the second electronic device provided by the present application after being cut along IV-IV.

[0105] The speaker core 530 of this embodiment differs from the speaker core 530 of the first embodiment described above in that the second magnet 33 includes a magnet body 332 and a magnet protrusion 333. The magnet body 332 is located on the third surface 311. The magnet body 332 is in a square ring shape. The magnet protrusion 333 is connected to the surface of the magnet body 332 facing away from the third surface 311 and is located on the side of the magnet body 332 away from the first magnet 32. The inner surface of the magnet protrusion 333 is flush with the inner surface of the magnet body 332, while the outer surface of the magnet protrusion 333 is located on the side of the outer surface of the magnet body 332 away from the first magnet 32. In this case, the inner surface of the second magnet 33 includes the inner surface of the magnet body 332 and the inner surface of the magnet protrusion 333, while the outer surface of the second magnet 33 includes the outer surface of the magnet body 332. In other embodiments, the inner surface of the magnet protrusion 333 may not be flush with the inner surface of the magnet body 332.

[0106] Specifically, a first sub-gap 342 is formed between the magnet body 332 and the third magnet 34. A second sub-gap 343 is formed between the magnet protrusion 333 and the third magnet 34. The second sub-gap 343 connects the first sub-gap 342 and the fourth gap 371. The second gap 341 includes the first sub-gap 342 and the second sub-gap 343.

[0107] In this embodiment, the speaker core 530 utilizes the first voice coil 22 and the second voice coil 23 to jointly drive the diaphragm 21 to vibrate, thereby producing sound. The first voice coil 22 and the second voice coil 23 can cooperate with the magnetic circuit assembly 30 to shorten the magnetic path. The first voice coil 22 and the second voice coil 23 can fully utilize the driving magnetic field provided by the magnetic circuit assembly 30, improving the magnetic field utilization rate of the magnetic circuit assembly 30. This effectively achieves high driving force for the speaker core 530, enhances the sound sensitivity of the speaker core 530, and contributes to improved sound performance of the speaker core 530. Furthermore, the first voice coil 22 and the second voice coil 23 are designed at different heights, which can cooperate with the high-low magnet structure of the magnetic circuit assembly 30, further fully utilizing the driving magnetic field provided by the magnetic circuit assembly 30, achieving high driving force for the speaker core 530, enhancing the sound sensitivity of the speaker core 530, and contributing to improved sound performance of the speaker core 530. Furthermore, the height h2 of the second voice coil 23 is greater than the height h1 of the first voice coil 22, effectively using a long voice coil structure to drive the diaphragm 21. This achieves low distortion in the speaker core 530 and effectively improves the sound quality of the speaker module 500. Furthermore, the convex portion 212 of the diaphragm 21, designed to mate with the second voice coil 23, allows for a lower height near the sound outlet 511 of the speaker core 530, increasing the sound output area and reducing air velocity, thereby improving the sound quality of the speaker module 500.

[0108] The above description is only a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by any person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application; the embodiments of this application and the features of the embodiments can be combined with each other unless there is a conflict. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. A speaker core, characterized in that, The invention comprises a basin frame, a sound membrane, a first voice coil and a second voice coil, wherein the sound membrane is installed on the basin frame, the first voice coil and the second voice coil are both located on the inner side of the basin frame and are both installed on the sound membrane, and the second voice coil is located on the inner side of the first voice coil and is spaced apart from the first voice coil; The first voice coil has a first end surface facing the sound membrane, the second voice coil has a second end surface facing the sound membrane, and the second end surface is located on a side of the first end surface facing the sound membrane.

2. The loudspeaker core according to claim 1, characterized in that The sound membrane includes a body and a convex bulge, wherein the body is mounted on the basin frame, and the convex bulge is connected to the body and protrudes in a direction away from the basin frame relative to the body; The first voice coil is installed on the body, and the second voice coil is installed on the convex hull.

3. The loudspeaker core according to claim 2, wherein The ratio of the area of the convex hull to the area of the sound membrane is between 1 / 4 and 1 / 3.

4. The loudspeaker core according to any one of claims 1 to 3, characterized in that The height of the second voice coil is greater than the height of the first voice coil.

5. The loudspeaker core according to claim 4, characterized in that, The speaker core further includes a first magnetic conductive plate, a first magnet, a second magnet and a third magnet. The first magnetic conductive plate is located on a side of the basin frame away from the sound membrane and is spaced apart from the basin frame. The first magnet, the second magnet and the third magnet are all located on a surface of the first magnetic conductive plate facing the basin frame. The second magnet is located on the inner side of the first magnet and forms a first gap with the first magnet. The third magnet is located on the inner side of the second magnet and forms a second gap with the second magnet. The end of the first voice coil away from the sound membrane is located in the first gap, and the end of the second voice coil away from the sound membrane is located in the second gap.

6. The loudspeaker core according to claim 5, wherein The second magnet includes a magnet body and a magnet protrusion. The magnet body is located on the surface of the first magnetic conductive plate facing the basin frame and forms a first sub-gap with the third magnet. The magnet protrusion is connected to the surface of the magnet body facing away from the first magnetic conductive plate and forms a second sub-gap with the third magnet. The second sub-gap is connected to the first sub-gap, and the second gap includes the first sub-gap and the second sub-gap.

7. The loudspeaker core according to claim 5 or 6, characterized in that The speaker core also includes a second magnetic conductive plate, a third magnetic conductive plate and a fourth magnetic conductive plate; The second magnetic conductive plate is located on a surface of the first magnet facing away from the first magnetic conductive plate, the third magnetic conductive plate is located on a surface of the second magnet facing away from the first magnetic conductive plate, and is located on the inner side of the second magnetic conductive plate, and a third gap is formed between the third magnetic conductive plate and the second magnetic conductive plate, and the third gap is connected to the first gap, the fourth magnetic conductive plate is located on a surface of the third magnet facing away from the first magnetic conductive plate, and is located on the inner side of the third magnetic conductive plate, and a fourth gap is formed between the third magnetic conductive plate and the third magnetic conductive plate, and the fourth gap is connected to the second gap; The end of the first voice coil facing away from the sound membrane is also located in the third gap, and the end of the second voice coil facing away from the sound membrane is also located in the fourth gap.

8. The loudspeaker core according to claim 7, characterized in that, The third magnetic conduction plate includes a magnetic conduction plate body and magnetic conduction protrusions. The magnetic conduction plate body is located on the surface of the second magnet facing away from the first magnetic conduction plate, and a third sub-gap is formed between the magnetic conduction plate body and the fourth magnetic conduction plate. The magnetic conduction protrusions are connected to the surface of the magnetic conduction plate body facing away from the first magnetic conduction plate, and a fourth sub-gap is formed between the magnetic conduction protrusions and the fourth magnetic conduction plate. The second sub-gap communicates with the first sub-gap and the second gap. The fourth gap includes the third sub-gap and the fourth sub-gap.

9. The loudspeaker core according to any one of claims 5 to 8, characterized in that, The first voice coil has a third end face arranged opposite to the first end face, and the second voice coil has a fourth end face arranged opposite to the second end face. The third end face is flush with the fourth end face.

10. The loudspeaker core according to claim 9, characterized in that, The speaker core further includes a first skeleton and a second skeleton. Both the first skeleton and the second skeleton are located inside the speaker frame. The first skeleton is connected between the sound film and the first voice coil. The second skeleton is connected between the sound film and the second voice coil, and is located inside the first skeleton and spaced from the first skeleton. Wherein, the height of the first skeleton is greater than the height of the second skeleton.

11. The loudspeaker core according to claim 10, wherein The speaker core further includes a flexible circuit board. The flexible circuit board is installed on the speaker frame and electrically connects the first voice coil and the second voice coil. The first skeleton is provided with a first avoidance groove. The opening of the first avoidance groove is located on the surface of the first skeleton facing the sound film. The first avoidance groove penetrates the inner side surface and the outer side surface of the first skeleton and avoids the flexible circuit board.

12. The speaker core according to claim 11, wherein, The third magnetic conduction plate is provided with a second avoidance groove. The opening of the second avoidance groove is located on the surface of the third magnetic conduction plate facing the speaker frame. The second avoidance groove penetrates the inner side surface and the outer side surface of the third magnetic conduction plate and avoids the flexible circuit board.

13. The loudspeaker core according to any one of claims 1 to 12, characterized in that, The sound film includes a diaphragm and a dome. The diaphragm includes a first fixing portion, a second fixing portion, and a surround portion. The first fixing portion is installed on the speaker frame. The second fixing portion is located inside the first fixing portion and spaced from the first fixing portion. The surround portion is connected between the first fixing portion and the second fixing portion and is recessed in the direction of the speaker frame. The dome is installed on the second fixing portion. Both the first voice coil and the second voice coil are installed on the dome.

14. A speaker module, characterized in that, It includes a first housing and the speaker core according to any one of claims 1 to 13. The speaker core is installed in the first housing. A front sound cavity is formed between the sound film and the first housing. The first housing is provided with a sound outlet hole, and the sound outlet hole communicates the front sound cavity with the outside of the speaker module.

15. The loudspeaker module according to claim 14, wherein The speaker module further includes a second housing. The second housing and the first housing are fixed to each other. The speaker core is located inside the second housing and the first housing. A rear sound cavity is formed on the side of the sound film facing away from the front sound cavity.

16. An electronic device, characterized in that, It includes a processor and the speaker module according to claim 14 or 15. The speaker module is electrically connected to the processor.

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