Imaging device

Abstract

The present disclosure provides an imaging device that achieves a reduction in vibration leakage from a vibration body without increasing the size of a fixing part. An imaging device (100) comprises an outermost layer lens (1), a fixing part (2), a vibration body (3), a piezoelectric element (5), and a housing (8). The outermost layer lens (1) transmits light of a prescribed wavelength. The fixing part (2) has a cylindrical shape for holding the outermost layer lens (1). The vibration body (3) is disposed inside the fixing part (2) and vibrates the outermost layer lens (1). The piezoelectric element (5) is provided on the vibration body (3) and vibrates the vibration body (3). A side of the fixing part (2) opposite to a side thereof that holds the outermost layer lens (1) is directly welded to the housing (8).

Description

Imaging device

[0001] The present disclosure relates to an imaging device.

[0002] Image capture devices are installed at the front or rear of a vehicle, and the images captured by the image capture devices are used to control safety devices and perform driving assistance control. Because such image capture devices are often installed outside the vehicle, raindrops (water droplets), mud, dust, and other foreign matter can adhere to the transparent bodies (protective covers and lenses) that cover the exterior.

[0003] If foreign matter adheres to the light-transmitting body, the foreign matter will be reflected in the image obtained by the imaging device, making it impossible to obtain a clear image. Therefore, in International Publication No. 2023 / 127197 (Patent Document 1), an imaging device is provided with a vibration device that vibrates the light-transmitting body in order to remove foreign matter adhered to the surface of the light-transmitting body.

[0004] International Publication No. 2023 / 127197

[0005] In the imaging device described in Patent Document 1, a vibration device is configured by combining an outermost lens (translucent body), a vibration body, a piezoelectric element, and a fixed portion.

[0006] However, in the imaging device described in Patent Document 1, it is necessary to increase the mass of the fixed portion itself in order to suppress vibration leakage from the vibrating body, which poses a problem of increasing the size of the fixed portion.

[0007] Therefore, an object of the present disclosure is to provide an imaging device that can suppress vibration leakage from a vibrating body without increasing the size of the fixing portion.

[0008] An imaging device according to an embodiment of the present disclosure includes a light-transmitting body, a first housing, a vibrating body, a piezoelectric element, and a second housing. The light-transmitting body transmits light of a predetermined wavelength. The first housing has a cylindrical shape and holds the light-transmitting body. The vibrating body is disposed within the first housing and vibrates the light-transmitting body. The piezoelectric element is provided on the vibrating body and vibrates the vibrating body. The first housing on the side opposite to the side holding the light-transmitting body is connected to the second housing by direct welding.

[0009] According to the present disclosure, the first housing on the side opposite to the side holding the translucent body is connected to the second housing by direct welding, thereby suppressing vibration leakage from the vibrating body without increasing the size of the first housing (fixed part).

[0010] Fig. 1 is a perspective view of an imaging device according to an embodiment; Fig. 2 is a cross-sectional view of an imaging device according to an embodiment; Fig. 3 is a diagram for explaining an example of a connection between a holding member of an inner layer lens and a fixing portion; Fig. 4 is a cross-sectional view of an imaging device according to a first modified example; Fig. 5 is a cross-sectional view of an imaging device according to a second modified example; Fig. 6 is a cross-sectional view of an imaging device according to a third modified example;

[0011] The imaging device according to the present disclosure will be described in detail below with reference to the drawings. Note that the same reference numerals in the drawings indicate the same or corresponding parts. The imaging device described below is, for example, for vehicle installation, and can vibrate a transparent body (e.g., the outermost lens) to remove foreign matter adhering to the surface of the transparent body. The imaging device is not limited to vehicle installation. For example, the imaging device can also be applied to security surveillance cameras, drones, etc.

[0012] (Embodiment) FIG. 1 is a perspective view of an imaging device 100 according to an embodiment. FIG. 2 is a cross-sectional view of the imaging device 100 according to the embodiment. Note that the X, Y, and Z directions in the figure indicate the horizontal, depth, and height directions of the imaging device 100, respectively. The imaging device 100 includes a fixed portion 2 (first housing) that holds an outermost lens 1, and a housing 8 (second housing) that is connected to the fixed portion by direct welding. A vibrating body 3, an inner lens 4, and a piezoelectric element 5 are provided inside the fixed portion 2. A sensor substrate 6 (first substrate) on which an imaging element (not shown) is mounted is provided inside the housing 8. The imaging element is arranged on the sensor substrate 6 so that the outermost lens 1 and the inner lens 4 are in the field of view.

[0013] After adjusting the alignment between the outermost lens 1 and the inner lens 4, the holding member 41 of the inner lens 4 is fixed to the fixing portion 2. Furthermore, after adjusting the alignment between the inner lens 4 and the imaging element, the sensor substrate 6 is fixed to the holding member 41 of the inner lens 4 with an adhesive on the surface facing the holding member 41. By fixing the sensor substrate 6 to the holding member 41 of the inner lens 4 with an adhesive, the sensor substrate 6 can be aligned with the inner lens 4 in six axes, and optical performance can be stabilized. Furthermore, the adhesive also acts as a buffer between the sensor substrate 6 and the holding member 41 of the inner lens 4, preventing vibration leakage to the sensor substrate 6 and stabilizing optical performance while reducing damping of the vibrating body 3.

[0014] The imaging element mounted on the sensor board 6 is, for example, an image sensor such as a CCD (Charge Coupled Device) or a CMOS (Complementary Metal-Oxide-Semiconductor) sensor, and is mounted on the sensor board 6. Semiconductor elements such as a general-purpose IC (Integrated Circuit) or ASIC (Application Specific Integrated Circuit) that control the imaging element are mounted on the sensor board 6. A connector 62 is provided on the sensor board 6, and the sensor board 6 inputs and outputs signals to and from an external device and receives power from an external power source via the connector 62.

[0015] The inner layer lens 4 (internal lens) has a structure in which multiple lenses are held by a holding member 41 (inner layer lens barrel). Note that in the drawings shown in this disclosure, the multiple lenses are illustrated as a single block in the inner layer lens 4. Because the multiple lenses that make up the inner layer lens 4 are held by the holding member 41 in an aligned state, there is no need to adjust the alignment of each individual lens again when mounting them in the imaging device 100.

[0016] The outermost lens 1 is a translucent body that transmits light of a predetermined wavelength (e.g., a wavelength of visible light, a wavelength that can be captured by an imaging element, etc.), and is made of, for example, borosilicate crown glass (BK7), quartz glass, crown glass, flint glass, a convex meniscus lens, etc. Note that the imaging device 100 may use a transparent member such as a protective cover instead of the outermost lens 1. The protective cover is made of glass or a resin such as transparent plastic.

[0017] An end of the outermost lens 1 is held by an end of a leaf spring 2a extending from the fixing portion 2. An adhesive is filled between the outermost lens 1 and a retainer 2b at the end of the leaf spring 2a. The fixing portion 2 is made of, for example, aluminum (e.g., A5052).

[0018] Furthermore, the imaging device 100 is provided with a vibrating body 3 for vibrating the outermost lens 1 held by the fixing portion 2. The vibrating body 3 is made of, for example, stainless steel (e.g., SUS304, SUS420, SUS440).

[0019] As shown in Fig. 2, the vibrating body 3 is a cylindrical body and is composed of a connecting portion 31 (first portion) that contacts the outermost lens 1, a vibrating portion 32 (second portion) that has a piezoelectric element 5, and a supporting portion 33 (third portion) that connects the connecting portion 31 and the vibrating portion 32. The cross section of the supporting portion 33 is S-shaped. An inner lens 4 is arranged inside the cylinder of the vibrating body 3, as shown in Fig. 2.

[0020] The connecting portion 31 has a cylindrical shape that is elongated in the axial direction (Z direction) of the cylindrical body, with the ends elongated in the radial directions (X and Y directions) of the cylindrical body. This allows the ends of the connecting portion 31 to stably contact the peripheral edge of the outermost lens 1. Note that the connecting portion 31 may consist of only the portion that is elongated in the axial direction (Z direction) of the cylindrical body, or only the portion that is elongated in the radial directions (X and Y directions) of the cylindrical body.

[0021] The vibrating portion 32 is a portion that vibrates together with the vibration of the piezoelectric element 5, and has a thickness greater than the thicknesses of the connecting portion 31 and the supporting portion 33. This makes it easier to transmit the vibration of the piezoelectric element 5 to the outermost lens 1 more efficiently.

[0022] The support portion 33 is a portion that supports the connection portion 31 and transmits vibrations of the vibration portion 32 to the connection portion 31. The connection portion 31, the vibration portion 32, and the support portion 33 may be formed integrally or separately.

[0023] The piezoelectric element 5 is provided on the surface of the vibrating section 32 opposite to the side in contact with the outermost lens 1. The piezoelectric element 5 has a hollow circular shape and vibrates by being polarized in the thickness direction, for example. The piezoelectric element 5 is made of lead zirconate titanate piezoelectric ceramics. However, (K,Na)NbO ３ Other piezoelectric ceramics such as LiTaO may also be used. ３ A piezoelectric single crystal such as

[0024] The hollow circular piezoelectric element 5 vibrates in the radial direction, and this vibration is converted into vibration in the Z direction (up and down direction in the figure) by the support part 33 of the vibrating body 3, causing the outermost lens 1 to vibrate in the Z direction.

[0025] The vibrating body 3 displaces the outermost lens 1 in the Z direction by elastically deforming the support portion 33 like a spring. The vibration of the vibrating body 3 also elastically deforms the leaf spring 2a of the fixing portion 2 that holds the outermost lens 1. The vibration of the vibrating body 3 maximizes the displacement of the outermost lens 1, while the displacement of the central portion of the S-shaped cross section of the support portion 33 becomes smaller.

[0026] Most of the vibration of the outermost lens 1 is absorbed by the elastic deformation of the leaf spring 2a, but the vibration that cannot be absorbed is transmitted to the fixed portion 2, causing the fixed portion 2 itself to vibrate. This vibration of the fixed portion 2 is vibration leakage from the vibrating body 3, and one way to suppress this vibration leakage is to increase the mass of the fixed portion 2 itself. However, increasing the mass of the fixed portion 2 itself raises the problem of increasing the size of the fixed portion 2.

[0027] Therefore, in the imaging device 100 according to the present embodiment, rather than increasing the mass of the fixed portion 2 itself, the housing 8 is connected to the fixed portion 2 by direct welding. In other words, by connecting the housing 8 to the fixed portion 2, the mass of the fixed portion 2 is increased by adding the housing 8 to the fixed portion 2, thereby suppressing vibration leakage from the vibrating body 3. By directly connecting the fixed portion 2 and the housing 8 by the weld 22, it is possible to suppress noise caused by vibration friction at the contact points between the components compared to when the fixed portion 2 and the housing 8 are connected by screws. Furthermore, when the fixed portion 2 and the housing 8 are connected by direct welding, it is possible to ensure waterproofing of the joint between the fixed portion 2 and the housing 8 and to suppress deterioration such as galvanic corrosion, thereby improving the reliability of the imaging device 100.

[0028] The fixed part 2 and the housing 8 are made of the same metal material. Specifically, if the fixed part 2 is made of aluminum (for example, A5052), the housing 8 is also made of aluminum (for example, A5052). This makes welding between the fixed part 2 and the housing 8 easier because the same metals are being welded together.

[0029] The fixed portion 2 and the housing 8 may be formed from different metals as long as they can be welded together. For example, the fixed portion 2 and the housing 8 may be formed from the following combinations of different metals: aluminum (e.g., A5052) and stainless steel (e.g., SUS304, SUS420, SUS440), aluminum and brass, or brass and stainless steel. When the fixed portion 2 and the housing 8 are formed from different metals, it is preferable to form the housing 8 from a metal material with a higher density than the fixed portion 2. This can further increase the combined mass of the fixed portion 2 and the housing 8, further improving the vibration containment and further suppressing vibration leakage from the vibrating body 3.

[0030] The weld 22 between the fixed part 2 and the housing 8 is located near the portion where the holding member 41 of the inner layer lens 4 is fixed to the fixed part 2. Therefore, if heat generated during welding at the weld 22 is transferred to the inner layer lens 4 and the holding member 41, it may cause distortion of the inner layer lens 4 or affect the alignment between the inner layer lens 4 and the outermost lens 1. Therefore, it is desirable to use a configuration that makes it difficult for heat generated during welding to be transferred to the inner layer lens 4 and the holding member 41. For example, Figure 3 is a diagram illustrating an example of the connection between the holding member 41 of the inner layer lens 4 and the fixed part 2.

[0031] 3, the holding member 41 of the inner layer lens 4 is not held directly by the fixing part 2, but is held to the fixing part 2 by fasteners 42a, 43a at the ends of buffer layers 42, 43 provided on the holding member 41. Furthermore, a gap 44 is provided between the end of the holding member 41 of the inner layer lens 4 and the fixing part 2, and the fasteners 42a, 43a hold the holding member 41 of the inner layer lens 4 to the fixing part 2. Note that if the heat generated during welding is small, the end of the holding member 41 of the inner layer lens 4 may be held directly by the fixing part 2 without providing the gap 44.

[0032] The holding member 41 has a buffer layer 42 on the surface facing the vibrating body 3 and a buffer layer 43 on the surface facing the housing 8. A fastener 42a is provided at the end of the buffer layer 42, and a fastener 43a is provided at the end of the buffer layer 43. The buffer layers 42 and 43 are formed of, for example, rubber or resin. By providing the buffer layers 42 and 43 on the holding member 41, vibration leakage from the vibrating body 3 can be suppressed, reducing damping of the vibrating body 3. Furthermore, the buffer layers 42 and 43 are preferably made of a material with lower thermal conductivity than the fixing part 2. This allows the buffer layers 42 and 43 to be configured to be less likely to transmit heat during welding to the inner layer lens 4 and the holding member 41.

[0033] The fasteners 42a and 43a are preferably made of a material with lower thermal conductivity than the fixing portion 2. This makes it difficult for the fasteners 42a and 43a to transmit heat during welding to the inner layer lens 4 and holding member 41. For example, the fasteners 42a and 43a are made of resin, ceramic, or the like. Although not shown, the fasteners 42a and 43a are, for example, ring-shaped screws that correspond to thread grooves provided on the inner wall surface of the fixing portion 2. The fasteners 42a and 43a can fix the position of the inner layer lens 4 relative to the fixing portion 2 by clamping the ends of the holding member 41. Note that the fasteners 42a and 43a do not have to be ring-shaped screws and may be fixed to the fixing portion 2 with an adhesive.

[0034] The imaging device 100 further includes a weight 21 (first weight) between the fixed portion 2 and the vibrating body 3. The weight 21 may be made of the same metal material as the fixed portion 2, but is preferably made of a metal material with a higher density than the fixed portion 2. For example, if the fixed portion 2 is made of aluminum (e.g., A5052), the weight 21 is made of stainless steel (e.g., SUS304, SUS420, SUS440). This makes it possible to further increase the combined mass of the fixed portion 2 and the weight 21, further improving the containment of vibrations and further suppressing vibration leakage from the vibrating body 3.

[0035] (Variation 1) In the imaging device 100 shown in Fig. 2, a configuration in which the weight 21 is provided between the fixed portion 2 and the vibrating body 3 has been described, but the weight may also be provided on the housing 8. Fig. 4 is a cross-sectional view of an imaging device 100a according to Variation 1. In the imaging device 100a, components similar to those of the imaging device 100 shown in Fig. 2 are designated by the same reference numerals, and description thereof will not be repeated.

[0036] The imaging device 100a further includes a weight 81 (second weight) on the housing 8. The weight 81 may be made of the same metal material as the housing 8, but is preferably made of a metal material with a higher density than the housing 8. For example, if the housing 8 is made of aluminum (e.g., A5052), the weight 81 is made of stainless steel (e.g., SUS304, SUS420, or SUS440). This increases the combined mass of the housing 8 and the weight 81, further improving the containment of vibrations and further suppressing vibration leakage from the vibrating body 3.

[0037] The position of the weight 81 may be any position within the housing 8 as long as it can improve the containment of vibrations. In order to avoid increasing the size of the imaging device 100a, it is preferable to provide the weight 81 inside the housing 8 rather than outside it.

[0038] (Modification 2) In the imaging device 100 shown in Fig. 2, a configuration has been described in which the sensor board 6 is provided inside the housing 8. However, the board provided inside the housing 8 is not limited to the sensor board 6, and another board may be provided. Fig. 5 is a cross-sectional view of an imaging device 100b according to Modification 2. In the imaging device 100b, the same components as those in the imaging device 100 shown in Fig. 2 are denoted by the same reference numerals, and description thereof will not be repeated.

[0039] 5, the imaging device 100b includes a fixed portion 2 (first housing) that holds the outermost lens 1, and a housing 8 (second housing) that is connected to the fixed portion by direct welding. A vibrating body 3, an inner lens 4, and a piezoelectric element 5 are provided inside the fixed portion 2. A sensor board 6 (first board) on which an imaging element (not shown) is mounted, and a drive board 70 (second board) on which a drive circuit that drives the piezoelectric element 5 is mounted are provided inside the housing 8.

[0040] The drive substrate 70 is fixed by a support member 83 to a lid 82 that fits into the housing 8. The drive substrate 70 also has mounted thereon a drive circuit that drives the piezoelectric element 5, such as a semiconductor element such as a general-purpose IC or ASIC. A flexible substrate 51 is provided to electrically connect the piezoelectric element 5 and the drive substrate 70.

[0041] The flexible substrate 51 is electrically connected to the piezoelectric element 5, and passes through a via 45 provided in the holding member 41, leading out to the surface of the holding member 41 facing the sensor substrate 6. The via 45 is provided on the inner lens 4 side of the holding member 41. Furthermore, to electrically connect the flexible substrate 51 and the drive substrate 70, a spring-like conductive pin 71 is provided on the drive substrate 70. Therefore, when the lid 82 that holds the drive substrate 70 is fitted into the housing 8, the conductive pin 71 comes into contact with the electrode of the flexible substrate 51, and the piezoelectric element 5 and the drive substrate 70 can be electrically connected by the flexible substrate 51.

[0042] The drive substrate 70 inputs and outputs signals to and from an external device and receives power from an external power source via the connector 62. Therefore, the drive substrate 70 can supply signals and power to the piezoelectric element 5 via the conductive pins 71 and the flexible substrate 51. By fixing the flexible substrate 51 to the holding member 41, vibrations via the flexible substrate 51 are not transmitted to the sensor substrate 6 or the drive substrate 70, and noise caused by the vibrations can be suppressed.

[0043] Furthermore, although not shown, it is preferable to insert a buffer material (e.g., rubber, resin, etc.) that damps vibrations between the flexible substrate 51 and the holding member 41. By providing the buffer material, it is possible to suppress noise from the flexible substrate 51. It is also possible to reduce friction loss due to vibrations that occur between the flexible substrate 51 and the holding member 41, thereby suppressing damping of vibrations caused by fixing the flexible substrate 51 to the holding member 41.

[0044] In the imaging device 100b, spring conductive pins 71 are used to electrically connect the flexible substrate 51 and the drive substrate 70, but the flexible substrate 51 and the drive substrate 70 may be electrically connected by other means such as wiring instead of the spring conductive pins 71. Also, in the imaging device 100b, the drive substrate 70 is provided inside the housing 8, but the drive substrate 70 may be provided outside the housing 8. In that case, the flexible substrate 51 is drawn out from the housing 8 and electrically connected to the drive substrate 70 outside the housing 8.

[0045] (Variation 3) In the imaging device 100b shown in Figure 5, a configuration has been described in which the via 45 through which the flexible substrate 51 passes is provided on the inner lens 4 side of the holding member 41. However, the position where the via through which the flexible substrate 51 passes is not limited to the inner lens 4 side, and the via may be provided at another position. Figure 6 is a cross-sectional view of an imaging device 100c according to Variation 3. In the imaging device 100c, components similar to those of the imaging device 100 shown in Figure 2 and the imaging device 100b shown in Figure 5 are designated by the same reference numerals, and descriptions thereof will not be repeated.

[0046] The flexible substrate 51a is electrically connected to the piezoelectric element 5, and passes through a via 45a provided in the holding member 41, leading out to the surface of the holding member 41 facing the sensor substrate 6. The via 45a is provided on the fixed portion 2 side of the holding member 41. Furthermore, in order to electrically connect the flexible substrate 51a and the drive substrate 70, a spring-like conductive pin 71 is provided on the drive substrate 70. Therefore, when the lid portion 82 that holds the drive substrate 70 is fitted into the housing 8, the conductive pin 71 comes into contact with the electrode of the flexible substrate 51a, and the piezoelectric element 5 and the drive substrate 70 can be electrically connected by the flexible substrate 51a.

[0047] (Other Modifications) In the vibrating body 3 according to the above-described embodiment, the cross-sectional shape of the support portion 33 is described as being S-shaped, but the cross-sectional shape of the support portion is not limited to an S-shape as long as it is a shape that does not cause stress concentration in the vibrating body. The cross-sectional shape of the support portion 33 may be, for example, a shape formed by connecting multiple S-shapes, a curved shape that is half an S-shape, or the like.

[0048] In the imaging devices 100, 100a to 100c according to the above-described embodiments, the sensor board 6 on which the imaging element is mounted is fixed to the holding member 41 with an adhesive on the surface facing the holding member 41. However, the present invention is not limited to this, and the imaging devices 100, 100a to 100c may fix the sensor board 6 to the housing 8 or the lid portion 82.

[0049] In the imaging devices 100, 100b to 100c according to the above-described embodiments, the fixed unit 2 is provided with the weight 21, and in the imaging device 100a, the fixed unit 2 is provided with the weight 21 and the housing 8 is provided with the weight 81. However, the present invention is not limited to this, and the imaging devices 100, 100a to 100c may be configured such that the weight 21 and the weight 81 are not provided, or may be configured such that at least one of the weight 21 and the weight 81 is provided.

[0050] The imaging devices 100, 100a to 100c according to the above-described embodiments may include a camera, LiDAR, radar, etc. Furthermore, a plurality of imaging devices 100, 100a to 100c may be arranged side by side.

[0051] The imaging devices 100, 100a to 100c according to the above-described embodiments are not limited to imaging devices installed in vehicles, but can be similarly applied to any imaging device that includes an optical device and an imaging element arranged so that a light-transmitting body is in the field of view, and that requires the removal of foreign matter from the light-transmitting body.

[0052] (Aspects) (1) An imaging device according to the present disclosure includes: a translucent body that transmits light of a predetermined wavelength; a cylindrical first housing that holds the translucent body; a vibrator that is disposed within the first housing and vibrates the translucent body; a piezoelectric element that is provided in the vibrator and vibrates the vibrator; and a second housing that is connected by direct welding to the first housing on the side opposite to the side that holds the translucent body.

[0053] As a result, in the imaging device according to the present disclosure, the first housing on the side opposite to the side holding the translucent body is connected to the second housing by direct welding, thereby suppressing vibration leakage from the vibrating body without increasing the size of the first housing.

[0054] (2) In the imaging device described in (1), the first housing and the second housing are made of the same metal material.

[0055] (3) In the imaging device described in (1), the second housing is made of a metal material different from that of the first housing and having a higher density than that of the first housing.

[0056] (4) The imaging device described in any one of (1) to (3) further includes an internal lens provided in the first housing at a position opposite the light-transmitting body, the internal lens being held to the first housing by a holding member, the holding member having a buffer layer on the surface facing the vibrating body and the surface facing the second housing, a gap being provided between the end of the holding member and the first housing, and the holding member being held to the first housing by a fastener provided at the end of the buffer layer.

[0057] (5) In the imaging device described in (4), the buffer layer and the fastener are made of a material having a lower thermal conductivity than the first housing.

[0058] (6) The imaging device according to (4) or (5) further includes an imaging element arranged so that the light-transmitting body and the internal lens are in the field of view, and the first substrate on which the imaging element is mounted is fixed to the holding member with an adhesive on the surface facing the holding member.

[0059] (7) In the imaging device described in (6), the flexible substrate electrically connected to the piezoelectric element passes through a via provided in the holding member and is drawn out to the side of the surface of the holding member that faces the first substrate.

[0060] (8) The imaging device according to (7) further comprises a second substrate mounted with a drive circuit for driving the piezoelectric element within the second housing, the second substrate being electrically connected to the flexible substrate.

[0061] (9) In the imaging device according to any one of (1) to (8), the first housing has a first weight made of a material having a higher density than the first housing.

[0062] (10) In the imaging device according to any one of (1) to (9), the second housing has a second weight made of a material having a higher density than the second housing.

[0063] The embodiments disclosed herein should be considered to be illustrative in all respects and not restrictive. The scope of the present disclosure is defined by the claims, not by the above description, and is intended to include all modifications within the meaning and scope of the claims.

[0064] REFERENCE SIGNS LIST 1 outermost lens, 2 fixed portion, 2a leaf spring, 2b retainer, 3 vibrating body, 4 inner lens, 5 piezoelectric element, 6 sensor substrate, 8 housing, 21, 81 weight, 22 welded portion, 41 holding member, 42, 43 buffer layer, 42a, 43a fastener, 44 gap, 45, 45a via, 51 flexible substrate, 70 drive substrate, 71 conductive pin, 82 lid portion, 83 support member, 100, 100a to 100c imaging device.

Claims

1. An imaging device comprising: a translucent body that transmits light of a predetermined wavelength; a cylindrical first housing that holds the translucent body; a vibrating body disposed within the first housing that vibrates the translucent body; a piezoelectric element provided on the vibrating body that vibrates the vibrating body; and a second housing that is directly connected to the first housing on the side opposite to the side that holds the translucent body by welding.

2. The imaging device according to claim 1, wherein the first housing and the second housing are made of the same metal material.

3. The imaging device according to claim 1, wherein the second housing is made of a metal material different from that of the first housing and having a higher density than the first housing.

4. Further comprising an internal lens provided at a position facing the translucent body within the first housing, the internal lens being held by the first housing with a holding member, the holding member having buffer layers on the surface on the side of the vibrating body and the surface on the side of the second housing, and providing a gap between an end of the holding member and the first housing, and the holding member being held by the first housing with a fastener provided at an end of the buffer layer. The imaging device according to any one of claims 1 to 3.

5. The imaging device according to claim 4, wherein the buffer layer and the fastener are made of a material having a lower thermal conductivity than the first housing.

6. Further comprising an imaging element arranged such that the translucent body and the internal lens are in the viewing direction, and a first substrate on which the imaging element is mounted is fixed to the holding member with an adhesive on the surface facing the holding member. The imaging device according to claim 4 or claim 5.

7. The imaging device according to claim 6, wherein a flexible substrate electrically connected to the piezoelectric element is drawn out through a via provided in the holding member to the side of the surface of the holding member facing the first substrate.

8. The imaging device according to claim 7, further comprising a second substrate mounted with a drive circuit for driving the piezoelectric element within the second housing, the second substrate being electrically connected to the flexible substrate.

9. The imaging device according to any one of claims 1 to 8, wherein the first housing has a first weight made of a material having a higher density than the first housing.

10. The imaging device according to any one of claims 1 to 9, wherein the second housing has a second weight made of a material having a higher density than the second housing.

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