Heat sink and electronic device

Abstract

The present application discloses a heat sink and an electronic device. The heat sink comprises a heat dissipation base (10) and first heat pipes (20). The heat dissipation base (10) is provided with evaporation chambers (11); a first phase-change medium is disposed in the evaporation chambers (11); two ends of each of the first heat pipes (20) are both closed ends; a second phase-change medium is disposed in pipe cavities (21) of the first heat pipes (20); evaporation ends (22) of the first heat pipes (20) are connected to a heat dissipation surface (12) of the heat dissipation base (10), and condensation ends (23) of the first heat pipes (20) extend beyond the edge of the heat dissipation surface (12) and extend away from the heat dissipation base (10); and the pipe cavities (21) of the first heat pipes (20) are isolated from the evaporation chambers (11).

Description

Radiators and electronic equipment

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to a Chinese patent application filed with the Patent Office of China on January 19, 2024, with application number 202410084741.6 and invention name “Radiator and Electronic Device”. The entire contents of the Chinese patent application are incorporated herein by reference. Technical Field

[0003] The present application belongs to the technical field of radiators, and in particular relates to a radiator and an electronic device. Background Art

[0004] Servers are core electronic components for the development of big data and communications technologies. As server computing power continues to increase, their power consumption and heat flux density are also rising year by year. This places higher demands on the heat sinks used with servers. However, existing heat sinks still suffer from poor heat dissipation. Of course, this isn't limited to servers; other devices that generate high levels of heat during operation also require heat sinks, but these heat sinks also suffer from poor heat dissipation. Summary of the Invention

[0005] The present application discloses a radiator and an electronic device to solve the problem of poor heat dissipation effect of radiators in related technologies.

[0006] In a first aspect, an embodiment of the present application discloses a radiator, which includes a heat dissipation base and a first heat pipe, the heat dissipation base is provided with an evaporation chamber, a first phase change medium is provided in the evaporation chamber, both ends of the first heat pipe are closed ends, a second phase change medium is provided in the tube cavity of the first heat pipe, the evaporation end of the first heat pipe is connected to the heat dissipation surface of the heat dissipation base, the condensation end of the first heat pipe extends beyond the edge of the heat dissipation surface and extends away from the heat dissipation base, and the tube cavity of the first heat pipe is isolated from the evaporation chamber.

[0007] In a second aspect, an embodiment of the present application discloses an electronic device, and the disclosed electronic device includes the heat sink described in the above embodiment. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] FIG1 is a schematic diagram of the three-dimensional structure of a radiator disclosed in an embodiment of the present application;

[0009] FIG2 is a schematic perspective view of a partial structure of a heat sink disclosed in an embodiment of the present application, wherein the shell 14 and the cover 15 in FIG2 are in an unassembled state;

[0010] FIG3 is a cross-sectional view of a portion of the heat sink disclosed in an embodiment of the present application. The hollow arrows in FIG3 indicate the direction of heat flow from the heat generated by the heat dissipation object to the heat dissipation base. The solid arrows in FIG3 indicate the direction of liquid flow when the corresponding phase change medium is in a liquid state. The dashed arrows in FIG3 indicate the direction of vapor flow when the corresponding phase change medium is in a gaseous state.

[0011] FIG4 and FIG5 are partial structural schematic diagrams of two different heat sinks.

[0012] Explanation of the accompanying numbers: 10-heat dissipation base, 11-evaporation chamber, 12-heat dissipation surface, 13-third capillary structure, 14-shell, 15-cover, 20-first heat pipe, 21-tube cavity, 22-evaporation end, 23-condensation end, 24-first capillary structure, 30-first heat sink, 40-first enclosure, 50-connecting substrate, 60-second heat pipe, 61-evaporation end, 62-tube cavity, 63-condensation end, 64-second capillary structure, 70-second heat sink, 80-second enclosure, 01-first heat dissipation structure, 011-sub-heat dissipation structure, 02-second heat dissipation structure, 03-heated object. DETAILED DESCRIPTION

[0013] To make the objectives, technical solutions, and advantages of this application more clear, the technical solutions of this application will be clearly and completely described below in conjunction with the specific embodiments of this application and the corresponding drawings. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0014] The technical solutions disclosed in various embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0015] Referring to Figures 1 to 5 , embodiments of the present application disclose a heat sink. The disclosed heat sink is used to dissipate heat from a heat sink object 03. Heat sink 03 may be a server, a chip, or the like, and the embodiments of the present application do not limit the type of heat sink 03. The disclosed heat sink may include a heat sink base 10 and a first heat pipe 20.

[0016] The heat dissipation base 10 is the base of the heat sink. The heat dissipation base 10 can contact the heat dissipation object 03, allowing the heat generated by the heat dissipation object 03 (for example, along the direction indicated by the hollow arrow in Figure 3) to be transferred to the heat dissipation base 10, and then transferred to the heat sink for dissipation. The heat dissipation base 10 is provided with an evaporation chamber 11, which contains a first phase change medium. Heat generated by the heat dissipation object 03 is transferred to the evaporation chamber 11, thereby heating the first phase change medium, which in turn evaporates into a gaseous state and absorbs heat. The gaseous first phase change medium can be cooled in an area away from the heat dissipation object and condense, thereby releasing heat and ultimately dissipating heat. Of course, the condensed first phase change medium will flow back and then evaporate due to heat, entering the next heat dissipation cycle. In this embodiment of the present application, the heat dissipation base 10 has a heat dissipation surface 12. The heat dissipation surface 12 can be flat or non-flat, such as a curved surface. This embodiment of the present application does not limit the shape of the heat dissipation surface 12.

[0017] In an embodiment of the present application, the heat dissipation base 10 may have a variety of structures. For example, the heat dissipation base 10 may be a plate-like structure or a non-plate-like structure. In one embodiment, the heat dissipation base 10 may be a heat spreader. A heat spreader is a heat dissipation component with good heat dissipation performance, which helps to improve the heat dissipation performance of the entire radiator. In an embodiment of the present application, the heat dissipation base 10 may be a split structure or an integral structure. In order to facilitate the formation of the evaporation chamber 11, in one embodiment, the heat dissipation base 10 may include a shell 14 and a cover 15. The cover 15 can be detachably fixed at the opening of the shell 14, and together with the shell 14, form an evaporation chamber 11, as shown in Figure 2.

[0018] In an exemplary embodiment, the heat dissipation base 10 can be fixed on the heat dissipation object 03, thereby realizing the assembly of the heat sink and the heat dissipation object 03. This solution can ensure a relatively stable heat transfer cooperation between the heat dissipation base 10 and the heat dissipation object 03.

[0019] Both ends of the first heat pipe 20 are closed ends, and a second phase change medium is provided in the tube cavity 21 of the first heat pipe 20. Since both ends of the first heat pipe 20 are closed ends, the second phase change medium will be confined in the tube cavity 21 of the first heat pipe 20. The evaporation end 22 of the first heat pipe 20 is connected to the heat dissipation surface 12 of the heat dissipation base 10, and the condensation end 23 of the first heat pipe 20 extends in a direction away from the heat dissipation base 10. The tube cavity 21 of the first heat pipe 20 is isolated from the evaporation cavity 11 of the heat dissipation base 10, so that the first phase change medium and the second phase change medium will not blend. In the embodiment of the present application, the first phase change medium and the second phase change medium each achieve heat dissipation through an evaporation-condensation cycle. While performing its heat dissipation function, the heat dissipation surface 12 can also cooperate with the evaporation end 22 of the first heat pipe 20 to transfer heat to the first heat pipe 20 and then be dissipated by the first heat pipe 20, thereby improving the efficiency of the condensation-liquid return-re-evaporation cycle of the heat dissipation surface 12, which is beneficial to increasing the critical heat flux density of the radiator and enhancing the heat dissipation capacity of the radiator.

[0020] In order to ensure the structural stability of the radiator, the first heat pipe 20 and the heat dissipation base 10 can be fixedly connected by welding, bonding, connecting with connectors, snap-fitting, etc. This connection method can ensure that the evaporation end 22 of the first heat pipe 20 is in relatively stable contact with the heat dissipation surface 12, which is conducive to receiving the heat dissipated by the heat dissipation base 10 and then dissipating the heat. The first heat pipe 20 can be connected to the heat dissipation base 10 in a non-detachable manner or in a detachable manner. In order to facilitate the flexible maintenance and replacement of individual components, an exemplary embodiment is that the first heat pipe 20 can be detachably connected to the heat dissipation base 10. For example, the first heat pipe 20 and the heat dissipation base 10 are detachably connected by connecting with connectors (such as threaded connectors) or snap-fitting. It should be noted that the embodiment of the present application does not limit the connection method between the first heat pipe 20 and the heat dissipation base 10.

[0021] In an exemplary embodiment, the condensation end 23 of the first heat pipe 20 can extend beyond the edge of the heat dissipation surface 12. In other words, the condensation end 23 of the first heat pipe 20 is not within the space facing the heat dissipation surface 12. This structure prevents the condensation end 23 of the first heat pipe 20 from condensing and dissipating heat within the space facing the heat dissipation surface 12 of the heat dissipation base 10. This allows the heat to be better transferred to a farther location, achieving a better heat dissipation effect and better avoiding the adverse effect of proximity to the heat dissipation base 10 on the heat dissipation of the heat dissipation base 10.

[0022] The radiator disclosed in the embodiment of the present application is designed to have a structure such that the heat dissipation base 10 and the first heat pipe 20 cooperate with each other to dissipate heat, while also enabling the first heat pipe 20 to transfer the heat obtained from the heat dissipation base 10 to the condensation end 23 of the first heat pipe 20 and dissipate the heat at a position away from the heat dissipation surface 12. In this process, the first heat pipe 20 can transport the heat to a position further away from the heat dissipation base 10 for dissipation, thereby ensuring that the first heat pipe 20 can perform its independent heat dissipation function and avoiding the first heat pipe 20 from having an adverse effect on the heat dissipation of the heat dissipation base 10, thereby greatly improving the heat dissipation performance of the entire radiator.

[0023] In addition, the tube cavity 21 of the first heat pipe 20 and the evaporation cavity 11 of the heat dissipation base 10 are isolated from each other, so there is no need for connection, thereby avoiding the problem of cumbersome operation caused by the connection between the tube cavity 21 of the first heat pipe 20 and the evaporation cavity 11 of the heat dissipation base 10. Since the evaporation cavity 11 and the tube cavity 21 of the first heat pipe 20 are isolated from each other, the heat dissipation base 10 and the first heat pipe 20 can be independently processed and manufactured before being connected. It is easier for product manufacturers to use simpler or ready-made production lines for production, with higher process maturity and higher yield rate, which is also conducive to controlling manufacturing costs. During the assembly process, it is only necessary to connect the evaporation end 22 of the first heat pipe 20 to the heat dissipation surface 12 of the heat dissipation base 10. There is no need for further connection, and there is no need to consider the sealing problems that may be caused by the connection. This is also conducive to improving the yield rate of the radiator.

[0024] Of course, when a first capillary structure 24 is provided in the tube cavity 21 of the first heat pipe 20 and a third capillary structure 13 is provided in the evaporation chamber 11 of the heat dissipation base 10, if the tube cavity 21 of the first heat pipe 20 is connected to the evaporation chamber 11 of the heat dissipation base 10, it is also necessary to perform effective overlap between the first capillary structure 24 and the third capillary structure 13. The overlap between the first capillary structure 24 and the third capillary structure 13 is a relatively delicate operation and is not easy to succeed, which can easily lead to a low yield rate of the radiator. In the embodiment of the present application, since the evaporation chamber 11 of the heat dissipation base 10 and the tube cavity 21 of the first heat pipe 20 are isolated from each other and do not need to be connected, there is no need to overlap the first capillary structure 24 in the first heat pipe 20 and the third capillary structure 13 in the heat dissipation base 10, thereby eliminating the more cumbersome and difficult to succeed assembly operation between the first heat pipe 20 and the heat dissipation base 10, which is beneficial to the manufacture of the radiator and can also ensure the yield rate of the radiator.

[0025] To increase the thermal contact area, in one exemplary embodiment, the evaporation end 22 of the first heat pipe 20 may be a flattened end. This flattened end can be connected to the heat dissipation surface 12 through surface-to-surface bonding. This structure allows the first heat pipe 20 to contact the heat dissipation surface 12 over a larger area, thereby better absorbing the heat dissipated by the heat dissipation surface 12 and further facilitating the transfer of this heat to the more distant condensation end 23 for dissipation.

[0026] The flat structure end and the heat dissipation surface 12 can be connected by a surface-to-surface connection formed by non-planar surfaces, or by a surface-to-surface connection formed by planes, and the embodiments of the present application are not limited thereto. Considering that a relatively regular surface is conducive to assembly and also helps to improve the appearance of the product, in an exemplary embodiment, the heat dissipation base 10 can be a heat sink, and the heat dissipation surface 12 can be a plane. Accordingly, the evaporation end 22 of the first heat pipe 20 can be a flat structure end. The flat structure end and the heat dissipation surface 12 can be connected by a surface-to-surface connection structure formed by planes.

[0027] In order to further improve the heat dissipation capacity, in an exemplary embodiment, the radiator disclosed in the embodiment of the present application may also include a first heat dissipation structure 01, and the condensation end 23 of the first heat pipe 20 may be connected to the first heat dissipation structure 01. The first heat dissipation structure 01 may be provided with a first air passage that runs through along a first preset direction. In this case, the heat dissipated from the condensation end 23 of the first heat pipe 20 can be better dissipated by the first heat dissipation structure 01. The addition of the first heat dissipation structure 01 can increase the heat dissipation area at the condensation end 23 of the first heat pipe 20, thereby reducing the thermal resistance of the entire radiator, allowing the condensation end 23 of the first heat pipe 20 connected thereto to dissipate heat more efficiently, thereby helping to improve the heat dissipation efficiency. At the same time, the first air passage can guide the cold air to flow along the first preset direction, thereby preventing the cold air from scattering, thereby extending the contact time between the cold air and the first heat dissipation structure 01, and ultimately helping to improve the heat dissipation effect.

[0028] In an embodiment of the present application, the first heat dissipation structure 01 can have multiple structures. For example, the first heat dissipation structure 01 can be a first air-conducting heat dissipation pipe, and the condensation end 23 of the first heat pipe 20 can extend into the first air-conducting heat dissipation pipe. In this case, the tube cavity of the first heat-conducting heat dissipation pipe can be considered as the first air passage.

[0029] Of course, the first heat dissipation structure 01 can also have other structures. In an exemplary embodiment, the first heat dissipation structure 01 can include a first heat sink 30 and a first enclosure 40. The first enclosure 40 is arranged around the first heat sink 30, thereby forming a first air passage between the first heat sink 30 and the first heat sink 30. The first heat sink 30 can be one or more, and the embodiment of the present application does not limit the number of first heat sinks 30. When there is one first heat sink 30, the first enclosure 40 surrounds the first heat sink 30, thereby forming a first air passage together with the first heat sink 30. When there are multiple first heat sinks 30, the multiple first heat sinks 30 are stacked and distributed, and two adjacent first heat sinks 30 are spaced apart to form a first heat dissipation gap. The first enclosure 40 surrounds the circumference of the entire stack of multiple first heat sinks 30, so as to enclose the first heat dissipation gap between two adjacent first heat sinks 30 to form a first air passage.

[0030] The first heat dissipation structure 01 may include at least a first heat sink 30. In order to further increase the heat dissipation area, the first heat dissipation structure 01 may also include a heat dissipation protrusion arranged on the surface of the first heat sink 30. The heat dissipation protrusion may be a strip-shaped protrusion or a needle-shaped protrusion, which is not limited in the embodiment of the present application.

[0031] In the embodiment of the present application, there may be one or more first heat pipes 20. To improve heat dissipation, in one exemplary embodiment, there may be multiple first heat pipes 20. In one embodiment, the evaporation ends 22 of the multiple first heat pipes 20 are connected to the heat dissipation surface 12 at intervals, thereby reducing the mutual heat dissipation effect. Any two first heat pipes 20 are spaced apart.

[0032] In the case of multiple first heat pipes 20, the first heat pipes 20 may not be grouped, and accordingly, the first heat dissipation structures 01 may not be grouped. In other embodiments, the first heat pipes 20 may be grouped, and accordingly, the first heat dissipation structures 01 may also be grouped.

[0033] In an exemplary embodiment, when the radiator includes a first heat dissipation structure 01 and there are multiple first heat pipes 20, any two first heat pipes 20 are spaced apart, and the multiple first heat pipes 20 can be distributed in at least two groups, each group including at least one first heat pipe 20. The first heat dissipation structure 01 can include multiple sub-heat dissipation structures 011, and the condensing end 23 of each group of first heat pipes 20 can be connected to a corresponding sub-heat dissipation structure 011. Each sub-heat dissipation structure 011 can be provided with a first air passage extending along a first preset direction.

[0034] In an exemplary embodiment, each sub-heat dissipation structure 011 may include multiple first heat dissipation fins 30 and a first enclosure 40. In each sub-heat dissipation structure 011, the multiple first heat dissipation fins 30 are stacked and distributed. The first enclosure 40 may surround the circumference of the stacked plurality of first heat dissipation fins 30, thereby enclosing the first heat dissipation gap between two adjacent first heat dissipation fins 30 into a first air passage. In this case, the multiple first heat pipes 20 are distributed in groups. The first heat dissipation structure 01 can be configured with a corresponding sub-heat dissipation structure 011 for each group of first heat pipes 20, avoiding the need for all first heat pipes 20 to be concentrated in one place. This allows each group of first heat pipes 20 to improve heat dissipation through the corresponding sub-heat dissipation structure 011, which undoubtedly further enhances the heat dissipation capacity of the entire radiator.

[0035] The first air passage allows air to flow from one end to the other, enabling better and continuous heat exchange with the first heat sink 30. Essentially, in this structure, the first enclosure 40 partially blocks the edge of the first air passage, preventing air from dispersing and causing insufficient heat exchange, thereby indirectly improving the heat dissipation capacity of the radiator. Furthermore, the first enclosure 40 enhances the strength of the first heat dissipation structure 01, achieving a dual purpose.

[0036] The heat sink disclosed in the embodiment of the present application may further include a connecting substrate 50, which is fixedly connected to the heat dissipation base 10, and the first heat dissipation structure 01 is supported on the connecting substrate 50. In this structure, the connecting substrate 50 is similar to a base connected to the heat dissipation base 10, thereby forming an integral base with the heat dissipation base 10, thereby providing support for the first heat dissipation structure 01, thereby facilitating the overall structural stability of the heat sink. At the same time, the connecting substrate 50 also has a reinforcing function, which helps to improve the overall strength of the heat sink.

[0037] In particular, when the first heat dissipation structure 01 includes multiple sub-heat dissipation structures 011, the multiple sub-heat dissipation structures 011 are all supported on the connecting substrate 50, thereby facilitating improved structural stability of the multiple sub-heat dissipation structures 011. The first heat dissipation structure 01 can be fixed to the connecting substrate 50. For example, the first heat sink 30 can be fixedly connected to the connecting substrate 50 by welding, bonding, or connecting with connectors, thereby achieving a fixed connection between the first heat dissipation structure 01 and the connecting substrate 50, which can further improve the overall strength of the heat sink.

[0038] In one embodiment, the first end of the connecting substrate 50 can be fixed on the heat dissipation surface 12, and the second end of the connecting substrate 50 can be fixed on the first heat dissipation structure 01 and support the first heat dissipation structure 01. This structure is also beneficial to ensuring the local strength of the radiator such as the condensation end 23 of the first heat pipe 20 and the first heat dissipation structure 01.

[0039] During the heat dissipation process, the second phase-change medium within the first heat pipe 20 evaporates into a gaseous state at the evaporation end 22 and then moves to the condensation end 23 of the first heat pipe 20 to condense. The condensed second phase-change medium, now in liquid form, flows back toward the evaporation end 22 of the first heat pipe 20. To facilitate the return of the liquid second phase-change medium, in one exemplary embodiment, the condensation end 23 of the first heat pipe 20 may be higher than the evaporation end 22 of the first heat pipe 20.

[0040] Considering that the condensation end 23 of the first heat pipe 20 extends to a relatively distant location, in an embodiment of the present application, a first capillary structure 24 may be provided in the first heat pipe 20. The first capillary structure 24 facilitates the rapid reflux of the liquid second phase change medium. The second phase change medium may be water or other solutions, such as a refrigerant. The embodiment of the present application does not limit the type of the second phase change medium. When the second phase change medium is water, the provision of the first capillary structure 24 in the first heat pipe 20 can prevent water from solidifying, thereby preventing damage to the first heat pipe 20 due to ice swelling caused by local water solidification. Of course, when the second phase change medium is water, a third capillary structure 13 may be provided in the evaporation chamber 11 of the heat dissipation base 10, thereby preventing damage to the heat dissipation base 10 due to ice swelling caused by local water solidification. Of course, the second phase change medium may be a phase change medium with a freezing point below the freezing point, such as a refrigerant. In this case, the second phase change medium is not easy to solidify, and the first capillary structure 24 may not be provided in the first heat pipe 20 . Similarly, the third capillary structure 13 may not be provided in the heat dissipation base 10 .

[0041] In order to improve the heat dissipation performance of the radiator, the radiator disclosed in the embodiment of the present application may further include a second heat pipe 60. The evaporation end 61 of the second heat pipe 60 is an open end, and is connected to the tube cavity 62 of the second heat pipe 60 and the evaporation cavity 11. The condensation end 63 of the second heat pipe 60 extends in a direction away from the heat dissipation surface 12. The second heat pipe 60 can be located in the space surrounded by the edge of the heat dissipation surface 12. In this case, the second heat pipe 60 also plays a heat dissipation function and can dissipate heat in the space surrounded by the edge of the heat dissipation surface 12. At the same time, the first heat pipe 20 and the second heat pipe 60 can make full use of the heat dissipation surface 12 to connect with the heat dissipation base 10, which is beneficial to improving the heat dissipation efficiency.

[0042] In the heat sink disclosed in the embodiment of the present application, the heat sink base 10 can have an independent evaporation chamber 11 and a condensation chamber, thereby being able to independently achieve heat dissipation through the first phase change medium. In an embodiment where the heat sink includes a second heat pipe 60 and the tube cavity 62 of the second heat pipe 60 is connected to the evaporation chamber 11 of the heat sink base 10, the evaporation chamber 11 of the heat sink base 10 serves as the evaporation region of a 3DVC heat sink formed by the heat sink base 10 and the second heat pipe 60, and the condensation end 63 of the second heat pipe 60 serves as the condensation region of the 3DVC heat sink formed by the heat sink base 10 and the second heat pipe 60, thereby forming a more multi-dimensional three-dimensional heat dissipation structure, thereby improving the heat dissipation capacity of the heat sink.

[0043] The second heat pipe 60 may be perpendicular to the heat dissipation surface 12. Of course, the second heat pipe 60 may also form an acute angle with the heat dissipation surface 12. The embodiment of the present application does not limit the angle between the second heat pipe 60 and the heat dissipation surface 12.

[0044] The second heat pipe 60 can be one or more. In order to further improve the heat dissipation capacity of the radiator, in an exemplary embodiment, the second heat pipe 60 can be multiple, and the multiple second heat pipes 60 can be distributed on the heat dissipation surface 12 in a preset manner. Among them, the multiple second heat pipes 60 can be distributed in rows and columns on the heat dissipation surface 12, or the multiple second heat pipes 60 can be evenly distributed within a circular area. Of course, the embodiment of the present application does not limit the distribution method of the multiple second heat pipes 60 on the heat dissipation surface 12.

[0045] In order to make the reflux of the first phase change medium easier, a second capillary structure 64 can be provided in the second heat pipe 60, and a third capillary structure 13 can be provided in the evaporation chamber 11. The second capillary structure 64 and the third capillary structure 13 are connected to form a liquid guiding structure. As described above, the second heat pipe 60 and the heat dissipation base 10 form a 3DVC radiator. The condensation end 63 of the second heat pipe 60 serves as the condensation area of ​​the 3DVC radiator, and the evaporation chamber 11 of the heat dissipation base 10 serves as the evaporation area of ​​the 3DVC radiator. During the heat dissipation process, the first phase change medium evaporates into a gaseous state in the evaporation chamber 11. The gaseous first phase change medium will enter the condensation area (exchanging heat with the cold source air as shown in Figure 3) and condense in the condensation area to release heat. The first phase change medium that becomes liquid after condensation in the condensation area will quickly return to the evaporation chamber 11 under the guidance of the liquid guiding structure, thereby preparing for the next cycle of evaporation. The liquid guiding structure formed by the second capillary structure 64 and the third capillary structure 13 can increase the reflux speed of the liquid first phase change medium, thereby improving the heat dissipation cycle efficiency and achieving the purpose of improving the heat dissipation capacity of the radiator.

[0046] In order to further improve the heat dissipation capacity of the radiator, the radiator disclosed in the embodiment of the present application may also include a second heat dissipation structure 02, and the condensation end 63 of the second heat pipe 60 can be connected to the second heat dissipation structure 02. The second heat dissipation structure 02 is provided with a second air passage that runs through along a second preset direction. In this case, the heat dissipated from the condensation end 63 of the second heat pipe 60 can be better dissipated by the second heat dissipation structure 02. The addition of the second heat dissipation structure 02 can increase the heat dissipation area at the condensation end 63 of the second heat pipe 60, thereby reducing the thermal resistance of the entire radiator, allowing the condensation end 63 of the second heat pipe 60 connected thereto to dissipate heat more efficiently, thereby helping to improve the heat dissipation efficiency. At the same time, the second air passage can guide the cold air to flow along the second preset direction, thereby preventing the cold air from scattering, thereby extending the contact time between the cold air and the second heat dissipation structure 02, and ultimately helping to improve the heat dissipation effect.

[0047] In an embodiment of the present application, the second heat dissipation structure 02 can have multiple structures. For example, the second heat dissipation structure 02 can be a second air-conducting heat dissipation pipe, and the condensation end 63 of the second heat pipe 60 can extend into the second air-conducting heat dissipation pipe. In this case, the tube cavity of the second air-conducting heat dissipation pipe can be considered as a second air passage.

[0048] Of course, the second heat dissipation structure 02 can also have other structures. In an exemplary embodiment, the second heat dissipation structure 02 can include a second heat sink 70 and a second enclosing plate 80. The second enclosing plate 80 is arranged around the second heat sink 70, thereby forming a second air passage with the second heat sink 70. The second heat sink 70 can be one or more, and the embodiment of the present application does not limit the number of second heat sinks 70. When there is one second heat sink 70, the second enclosing plate 80 surrounds the second heat sink 70, thereby forming a second air passage with the second heat sink 70. When there are multiple second heat sinks 70, the multiple second heat sinks 70 are stacked and arranged, with adjacent second heat sinks 70 spaced apart, thereby forming a second heat dissipation gap. The second enclosing plate 80 surrounds the circumference of the stacked structure formed by the multiple second heat sinks 70, thereby enclosing the second heat dissipation gap between adjacent second heat sinks 70 into a second air passage.

[0049] In the embodiment of the present application, the second heat dissipation structure 02 is formed by at least the second heat sink 70. The second heat dissipation structure 02 may also include heat dissipation protrusions provided on the surface of the second heat sink 70 in addition to the second heat sink 70. The heat dissipation protrusions may be strip-shaped protrusions or needle-shaped protrusions, and the embodiment of the present application is not limited thereto. Of course, considering that if there are multiple second heat sinks 70, the second heat sinks 70 can be stacked. In this case, the second heat dissipation structure 02 may also include connectors (such as threaded connectors) connecting the multiple second heat sinks 70.

[0050] In one embodiment, when there are multiple second heat sinks 70, in order to improve the convective heat dissipation effect, in an exemplary embodiment, the multiple second heat sinks 70 are spaced apart, and a second airflow gap can be formed between two adjacent second heat sinks 70. Air can pass through the second airflow gap by convection, thereby improving the heat dissipation effect.

[0051] Please refer to Figure 1 again. The heat sink disclosed in the embodiment of the present application may also include a second enclosing plate 80. The second enclosing plate 80 surrounds the circumference of the second heat dissipation structure 02 so as to form a second air passage extending along a second preset direction between two adjacent second heat dissipation fins 70 in the second heat dissipation structure 02. As described above, a second air gap is formed between two adjacent second heat dissipation fins 70, and the provision of the second enclosing plate 80 enables the second air gap to form a second air passage. The second air passage, with its two ends open, formed by the second heat dissipation fins 70 and the second enclosing plate 80, enables air to flow from one end of the second air passage to the other, thereby enabling better and continuous heat exchange with the second heat dissipation fins 70. In essence, in this structure, the second enclosing plate 80 can block part of the edge of the second air gap, thereby preventing the problem of insufficient heat exchange caused by air flowing in all directions, thereby indirectly improving the heat dissipation capacity of the radiator.

[0052] Similarly, the second enclosure 80 is connected to the second heat dissipation structure 02, thereby further strengthening the strength of the second heat dissipation structure 02, thereby facilitating the improvement of the local strength of the radiator.

[0053] In the embodiment of the present application, the second preset direction and the first preset direction can be the same or different. The second preset direction and the first preset direction can be parallel to the heat dissipation surface 12 or not, and the embodiment of the present application does not limit this. As shown in Figure 1, in one embodiment, the second preset direction can be consistent with the first preset direction, and both are parallel to the heat dissipation surface 12.

[0054] In order to improve the heat dissipation effect of the condensation end 23 of the first heat pipe 20, the inlet or outlet of the second air passage can be directed toward the condensation end 23 of the first heat pipe 20 or toward other parts of the first heat pipe 20 except its evaporation end 22. In this case, the air guided by the second air passage will blow directly toward or flow through the condensation end 23 of the first heat pipe 20 or other parts except the evaporation end 22, thereby accelerating the convective heat dissipation of these parts. This can further enhance the heat dissipation capacity of the radiator. Of course, the through-direction of the first air passage and the second air passage can also be in other directions, and the embodiment of the present application does not limit the through-direction of the first air passage and the second air passage.

[0055] In the embodiments of the present application, the first phase change medium and the second phase change medium may be of the same or different types. In one embodiment, the first phase change medium and the second phase change medium may be water or a refrigerant. The embodiments of the present application do not limit the types of the first phase change medium and the second phase change medium.

[0056] In the embodiment of the present application, the structure of the heat dissipation base 10 can be various. For example, the heat dissipation base 10 can be a heat spreader. Of course, it can also be other plate-shaped structures. The two opposite plate surfaces of the heat dissipation base 10 can both be heat dissipation surfaces 12, and each heat dissipation surface 12 can be connected to a first heat pipe 20. In this case, the heat absorbed by the heat dissipation base 10 from the heat dissipation object will be transmitted to a distant location through the two opposite heat dissipation surfaces 12 through the first heat pipes 20 connected to each other. This will undoubtedly better share the heat flux density and thus improve the heat dissipation capacity of the radiator.

[0057] The first heat pipe 20 and the second heat pipe 60 can be metal pipes with good heat dissipation performance, such as copper pipes, aluminum pipes, etc. The heat dissipation base 10 can be a cavity structure formed by metal components. The material of the heat dissipation base 10 can be copper, aluminum, iron, etc. The embodiment of the present application does not limit the material of the first heat pipe 20, the second heat pipe 60 and the heat dissipation base 10.

[0058] The heat sink disclosed in the embodiment of the present application can be used in heat dissipation scenarios of chips with high power consumption and high heat flux density, and can also be used in heat dissipation scenarios of large servers, and is not limited to heat dissipation scenarios of communication products, automobiles, consumer electronics products, etc.

[0059] Based on the heat sink disclosed in the embodiments of this application, the embodiments of this application also disclose an electronic device. The disclosed electronic device includes the heat sink described in the embodiments above. The electronic device disclosed in the embodiments of this application can be a large server, a distribution box, or other heat-generating device, and the embodiments of this application do not limit the type of electronic device.

[0060] The above embodiments of this application focus on the differences between the various embodiments. As long as the different optimization features of the various embodiments are not contradictory, they can be combined to form a better embodiment. Considering the simplicity of the text, they will not be repeated here.

[0061] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of this application, ordinary technicians in this field can also make many forms without departing from the purpose of this application and the scope of protection of the claims, all of which are within the protection of this application.

Claims

1. A radiator, comprising a heat dissipation base (10) and a first heat pipe (20). The heat dissipation base (10) is provided with an evaporation chamber (11) which is provided with a first phase change medium. Both ends of the first heat pipe (20) are closed ends. A second phase change medium is provided in the lumen (21) of the first heat pipe (20). The evaporation end (22) of the first heat pipe (20) is connected to the heat dissipation surface (12) of the heat dissipation base (10) and extends away from the heat dissipation base (10). The lumen (21) of the first heat pipe (20) is isolated from the evaporation chamber (11).

2. The radiator according to claim 1, wherein, The evaporation end (22) of the first heat pipe (20) is a flat structure end, and the flat structure end is connected to the heat dissipation surface (12) by surface-to-surface fitting.

3. The radiator according to claim 2, wherein, The heat dissipation base (10) is a vapor chamber, the heat dissipation surface (12) is a plane, and the evaporation end (22) of the first heat pipe (20) is a flat structure end.

4. The radiator according to claim 1, wherein, The radiator further comprises a first heat dissipation structure (01). The condensation end (23) of the first heat pipe (20) is connected in the first heat dissipation structure (01), and the first heat dissipation structure (01) is provided with a first air passage penetrating along a first preset direction.

5. The radiator according to claim 4, wherein, There are multiple first heat pipes (20). The evaporation ends (22) of the multiple first heat pipes (20) are connected to the heat dissipation surface (12) at intervals. Any two of the first heat pipes (20) are spaced apart. The multiple first heat pipes (20) are distributed in at least two groups. The first heat dissipation structure (01) comprises multiple sub-heat dissipation structures (011). The condensation ends (23) of each group of the first heat pipes (20) are connected in the corresponding sub-heat dissipation structure (011), and each sub-heat dissipation structure (011) is provided with the first air passage penetrating along the first preset direction.

6. The radiator according to claim 5, wherein, Each sub-heat dissipation structure (011) comprises multiple first heat dissipation fins (30) and a first enclosing plate (40). The multiple first heat dissipation fins (30) are stacked and distributed. The first enclosing plate (40) surrounds the periphery of the whole formed by the stacked multiple first heat dissipation fins (30) to enclose the first air passage between two adjacent first heat dissipation fins (30).

7. The radiator according to claim 4, wherein, The radiator further comprises a connection substrate (50). The connection substrate (50) is fixedly connected to the heat dissipation base (10), and the first heat dissipation structure (01) is supported on the connection substrate (50).

8. The radiator according to claim 1, wherein, The condensation end (23) of the first heat pipe (20) is higher than the evaporation end (22) of the first heat pipe (20).

9. The radiator according to claim 1, wherein, The second phase change medium is water, and a first capillary structure (24) is provided in the first heat pipe (20); or the freezing point of the second phase change medium is lower than the freezing point.

10. The radiator according to claim 1, wherein, The radiator further includes a second heat pipe (60). The evaporation end (61) of the second heat pipe (60) is an open end, and communicates with the lumen (62) of the second heat pipe (60) and the evaporation chamber (11). The condensation end (63) of the second heat pipe (60) extends in a direction away from the heat dissipation surface (12), and the second heat pipe (60) is located in the space surrounded by the edge of the heat dissipation surface (12).

11. The radiator according to claim 10, wherein, The second heat pipe (60) is perpendicular to the heat dissipation surface (12).

12. The radiator according to claim 10, wherein, There are multiple second heat pipes (60), which are distributed on the heat dissipation surface (12) in a preset manner.

13. The radiator according to claim 10, wherein, A second capillary structure (64) is provided in the second heat pipe (60), and a third capillary structure (13) is provided in the evaporation chamber (11). The second capillary structure (64) is connected to the third capillary structure (13) to form a liquid guiding structure.

14. The radiator according to claim 10, wherein, The radiator further includes a second heat dissipation structure (02). The condensation end (63) of the second heat pipe (60) is connected to the second heat dissipation structure (02), and the second heat dissipation structure (02) is provided with a second air passage penetrating along a second preset direction.

15. The radiator according to claim 14, wherein, The second heat dissipation structure (02) includes a plurality of second heat dissipation fins (70) and a second enclosure (80). The plurality of second heat dissipation fins (70) are stacked and distributed, and the second enclosure (80) surrounds the periphery of the whole formed by the stacking of the plurality of second heat dissipation fins (70) to enclose the second heat dissipation gap between two adjacent second heat dissipation fins (70) into the second air passage.

16. The radiator according to claim 14, wherein, The inlet or outlet of the second air passage faces the condensation end (23) of the first heat pipe (20) or other parts of the first heat pipe (20) except its evaporation end (22).

17. The radiator according to claim 1, wherein, The heat dissipation base (10) is a heat spreader, and both opposite plate surfaces of the heat spreader are the heat dissipation surfaces (12), and each heat dissipation surface (12) is connected to the first heat pipe (20).

18. The radiator according to any one of claims 1 to 17, wherein, The condensation end (23) of the first heat pipe (20) extends beyond the edge of the heat dissipation surface (12).

19. An electronic device, including the radiator according to any one of claims 1 to 18.

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