Composite material with adhesion promoter layer

Abstract

The invention relates to a composite material comprising a substrate layer and a polymer layer, wherein the polymer layer and the substrate layer are directly connected to each other by an adhesion promoter layer, and wherein the adhesion promoter layer is obtainable by plasma-enhanced chemical vapour deposition (PE-CVD) in which, at least partially, a precursor material containing at least one organosilicon compound is used, wherein the polymer layer has a Shore hardness of 60 to 95 Shore A, measured according to DIN ISO 7619-1: 2021-02, Shore A, 23°C. The invention also relates to a method for producing such composite materials, sealing articles, and uses.

Description

[0001]January 7, 2025 Composite material with adhesion promoter layer The invention relates to a composite material comprising a substrate layer and a polymer layer bonded together by an adhesion promoter layer. The invention also relates to methods for producing the composite materials, sealing articles, and uses. State of the art Composite materials are materials made of different, interconnected materials whose material properties are combined. They often consist of layers of different, interconnected materials. Composite materials are used, among other things, to impart different properties to the surface of a substrate. For example, composite materials made of metals and polymers are known that exhibit high hardness due to the metal component and high elasticity on a polymer surface.In other composite materials, different plastics with different properties are advantageously combined. The fundamental problem with composite materials is that the different materials must be permanently and stably bonded to one another. This is particularly problematic when the components have very different physical and chemical properties. This can be the case with metals and elastomers, but also with different plastics. In the current state of the art, the layers of such a composite material are often bonded together by adhesive bonding or welding. The surfaces of the layers can also be activated for better bonding, for example by functionalization in a plasma or by chemical reaction with a primer. Adhesion promoter layers can also be used to bond less compatible materials.Such adhesion promoter layers are often created by applying wet-chemical binders, for example, from solutions or melts. Composite materials made up of components with very different properties are particularly important in the field of sealing technology. For example, very hard, stable components are combined with elastic materials, which, among other things, enable a form-fitting, sealing connection. Composite materials made up of hard base materials and elastomers are also used in sealing technology to provide the base materials with a better sealing effect against various media, depending on the application conditions. Composite materials are known in the art in which an adhesion promoter layer is applied to a substrate by plasma-enhanced chemical vapor deposition (PE-CVD), which is then bonded to another layer.For example, WO 01 / 61069 A2 describes processes for producing composite materials made of plastic and metal, in which a carbon-rich layer is applied to a metal substrate by PE-CVD. Acetylene is used as the precursor compound in the plasma. It is known that the deposition of acetylene in the plasma produces highly cross-linked amorphous carbon layers, also referred to as "diamond-like carbon" (DLC). It is also proposed to bond such metal substrates coated with carbon in the plasma to plastics. However, adhesion promoter layers made of DLC, which essentially consist of carbon, hydrogen, and possibly small amounts of oxygen, have various disadvantages. For example, the bond to many substrates, especially metallic substrates, and especially stainless steel, is often inadequate.Another disadvantage is that DLC layers exhibit relatively high residual stress, which can reduce layer stability and adhesion to the substrate. This can lead to such DLC layers flaking off the substrate. The stability of such composite materials with DLC layers therefore still needs to be improved. Further composite materials with plasma-generated adhesion promoter layers are described in WO 01 / 38596 A2. It is proposed to provide metallic substrates with an adhesion promoter layer produced from an oxidizing gas and organosilicon compounds such as hexamethyldisiloxane (HMDSO), which are not tetramethylsilane, as precursor compounds. The substrate coated with the adhesion promoter layer is then coated with an organic coating, which is preferably a varnish. In particular, a coil coating varnish is used and baked.However, paints typically have a thin layer thickness of just a few micrometers and are harder than elastomers, making them less suitable as sealing materials. DE 19856227 A1 discloses composite materials made of fluoropolymers and other materials, such as metals, adhesives, or elastomers. In this process, the surface of a fluoropolymer is coated with an adhesion promoter layer in a plasma. Various precursor compounds are proposed for the reaction in the plasma, with the reaction specifically being carried out only with HMDSO, so that the adhesion promoter layer has a relatively high hardness. Even with these materials, the stable and permanent bond to other materials, such as elastomers, still needs improvement.EP3132861A3 describes a method for coating a substrate using a plasma, wherein at least one surface of the substrate is activated by the plasma in a first step, and a silane is polymerized onto the surface of the substrate in the plasma in a second step, and an elastomer is subsequently applied to the surface of the substrate. The silane can be deposited in a vacuum or at atmospheric pressure and can contain various functional groups for promoting adhesion. Even with these materials, the stable and permanent bonding to other materials, such as elastomers, still requires improvement.EP 3680100 A1 describes a composite material comprising a substrate and a polymer layer bonded to one another by an adhesion promoter layer. The adhesion promoter layer is obtainable by plasma-enhanced chemical vapor deposition (PE-CVD), in which a mixture of precursor compounds containing an unsaturated hydrocarbon and an organosilicon compound is used, at least in part. The polymer layer described includes, among others, ethylene-propylene-diene rubber, peroxide-crosslinked and filled with carbon black. Such polymer layers can be produced in a wide variety of hardnesses, for example, by varying the filler content, plasticizer content, the proportion of crosslinking aids, or by appropriately selecting the vulcanization conditions. The composite material already enables a stable and durable bond to a variety of substrates.However, in the state of the art, with increasing demands, there is a continuous need for improved composite materials in which layers of different materials are stably bonded to one another. Object of the invention The object of the invention is to provide composite materials, methods and uses that solve the problems described above. In particular, the object of the invention is to provide methods and composite materials that enable a stable bond between different materials. In particular, the invention is based on the problem of stably bonding metals to polymers or different polymers to one another. In particular, there is the problem of stably bonding rigid materials, such as metals or rigid plastics, to flexible, elastic materials, such as elastomers.The bond should be stable even if the materials are only bonded to one another in partial areas. The composite materials should preferably be obtainable from conventional components and using relatively simple processes in a few steps. The invention is further based on the object of providing adhesion promoter layers that adhere well to a variety of different, particularly rigid, substrates and, in particular, enable a stable bond with elastic materials. Disclosure of the Invention: Surprisingly, the object underlying the invention is achieved by composite materials and processes according to the patent claims.The invention relates to a composite material comprising a substrate layer and a polymer layer, wherein the polymer layer and substrate layer are directly bonded to one another by an adhesion promoter layer. The adhesion promoter layer is obtainable by plasma-enhanced chemical vapor deposition (PE-CVD), in which a precursor material containing at least one organosilicon compound is used at least in part, and wherein the polymer layer has a Shore hardness, measured according to DIN ISO 48-4: 2021-02, of 60 to 95 Shore A. The composite material comprises at least three layers. The layers are bonded to one another over a large area and in a stable manner. The polymer layer and substrate layer are further directly bonded to one another by an adhesion promoter layer. Thus, there are no further layers between the adhesion promoter layer and the substrate layer or between the adhesion promoter layer and the polymer layer.However, the composite material can have further layers on the side of the substrate layer or polymer layer facing away from the adhesion promoter layer. The three layers of the composite material, i.e. the substrate layer, the adhesion promoter layer and the polymer layer, are integrally bonded to one another. The adhesion promoter layer is preferably covalently bonded to the polymer layer, with the bonding occurring in particular through a crosslinking reaction. Preferably, the substrate layer is also covalently bonded to the adhesion promoter layer. The polymer layer is directly bonded to the substrate layer by the adhesion promoter layer. This means that between the substrate layer and the polymer layer there is only the adhesion promoter layer, which was generated in the plasma. According to the invention, the substrate layer, the adhesion promoter layer and the polymer layer are not bonded via an additional binder.It is not necessary to bond the polymer layer to the plasma-coated substrate layer using an additional binder. It has been found that a highly stable composite material can be obtained if the polymer layer is applied directly to the adhesion promoter layer. According to the invention, the composite material therefore has no additional binder between the substrate layer, the polymer layer, and the adhesion promoter layer. Surprisingly, it has been found that using a polymer layer with a Shore A hardness of 60 to 95 Shore A, measured according to DIN ISO 7619-1: 2021-02, in combination with an adhesion promoter layer obtainable by plasma-enhanced chemical vapor deposition (PE-CVD) and in which a precursor material containing an organosilicon compound is used at least in part, a particularly stable bond to a wide variety of substrate layers can be obtained.Without committing to a specific mechanism, it is suspected that the organosilicon compound has a particularly beneficial effect on the interfacial properties, since, compared to pure hydrocarbon layers, organosilicon precursor compounds have a particularly large number of functional groups available for bonding the substrate and polymer layers. The beneficial effect of the organosilicon compound is achieved particularly efficiently by combining it with a polymer layer with a higher Shore A hardness, because the interfacial forces are distributed particularly favorably within the composite due to the high hardness of the polymer layer. The intrinsic properties of the adhesion promoter layer also have a beneficial effect, as it is highly three-dimensionally cross-linked and also comparatively hard, which further improves the distribution of the forces acting on the interfaces.The layers are bonded to one another so securely that an additional form-fitting connection is unnecessary. In one embodiment, the substrate layer therefore has regions in which it is not bonded to the polymer layer. Due to this only partial coverage of the substrate layer with the polymer layer, the bonded connection between the layers is particularly important. This is in contrast to substrate layers completely enclosed with polymer, since here a form-fitting connection is added to the bonded connection, which facilitates adhesion. The advantage of the embodiment according to the invention is that more technical degrees of freedom can be made available for product design. In one embodiment, the connection between the polymer layer and the substrate layer is not a form-fitting connection.In a specific embodiment, the substrate layer therefore has regions that are directly bonded to the polymer layer by the adhesion promoter layer, and other regions that are not bonded to the polymer layer. A key feature of the surprisingly good bond between the substrate, adhesion promoter, and polymer layers is a combination of organosilicon precursor compounds in the plasma and polymer layers with a Shore hardness between 60 and 95 Shore A. It is assumed that this allows for a particularly good adaptation of the interfacial properties of the composite partners. In particular, the combination of the adhesion promoter layer, which is brittle and highly cross-linked in three dimensions, and a polymer layer with a specific hardness appears to enable the interfacial forces to be distributed particularly advantageously within the composite.The polymer layer preferably has a Shore hardness of 60 to 85 Shore A and in particular of 60 to 80 Shore A, measured according to DIN ISO 7619-1: 2021-02. In principle, the substrate layer can consist of any material that can be provided with a coating based on Si, C, and optionally O and H in the plasma. For example, the substrate layer can be a metal layer, a plastic layer, or a ceramic layer. In one embodiment, the substrate layer is rigid. The substrate layer itself can also be a composite material, for example, a polymer layer containing fillers, fibers, or other components. The substrate layer is preferably a metal layer or a plastic layer. In a particularly preferred embodiment, the substrate layer is a metal layer. Metal layers can be provided particularly efficiently with coatings based on Si, C, and optionally O and H in the plasma.The metal layer preferably comprises at least one metal selected from the group consisting of iron, iron alloys, aluminum, aluminum alloys, copper, copper alloys, nickel, nickel alloys, titanium, and / or titanium alloys. Preferred iron alloys are steel, in particular stainless steel. Preferred aluminum alloys contain magnesium, copper, manganese, zinc, and / or silicon as alloying elements. A preferred copper alloy is brass. Preferred nickel alloys contain carbon, chromium, molybdenum, aluminum, copper, niobium, titanium, and / or iron as alloying elements. Preferred titanium alloys contain aluminum, nickel, tantalum, vanadium, tin, molybdenum, zirconium, and iron and / or precious metals such as platinum, palladium, rhodium, and / or ruthenium as alloying elements. An alloy can be obtained by adding alloying elements to a base metal.The base metal represents the main component by weight in the alloy. The metal layer particularly preferably consists of one or more of the aforementioned metals. As is known to those skilled in the art, the metals can be surface-oxidized or provided with an additional layer, for example a phosphate layer, zinc layer, zinc-nickel layer, or siloxane layer. It is assumed that Si and O in particular are very beneficial for good adhesion of the coating to metals, since ionic and electrostatic interactions can occur here. In a further preferred embodiment, the substrate layer is a plastic layer. The term plastic layer means that a plastic forms a matrix. The plastic is preferably a thermoplastic or thermoset. Suitable plastics include, for example, thermoplastics, preferably from the classes of standard thermoplastics, engineering thermoplastics, and / or high-performance thermoplastics.Preferred thermoplastics are polyolefins (polypropylene, polyethylene), polyamides, polyesters (such as polybutylene terephthalate), polyphenylene sulfides, or fluoropolymers such as polytetrafluoroethylene, polyvinylidene fluoride, perfluoroalkoxy polymers, or mixtures of such polymers. Particularly preferred thermoplastics are polyamides, polyphenylene sulfides, polyesters, and mixtures thereof. Fiber- or particle-reinforced materials based on these plastics can also be used. In general, the plastic matrix can contain conventional additives, in particular fillers. Such polymers have sufficient resistance to be coated in plasma with coatings based on Si, C, and optionally O and H. The substrate layer can also be an inorganic layer, and in particular a layer of ceramic, glass, or oxides of metals or semimetals, such as silica.In a preferred embodiment, the substrate layer is formed as a shaped body and / or semi-finished product. Shaped bodies and semi-finished products are both raw materials made from specific materials. Shaped bodies have a specific three-dimensional geometric shape and size that already resembles the final product. Sheets, foils, profiles, pipes, hoses, continuous fibers, or ropes, for example, are not shaped bodies. These products are referred to as semi-finished products. Semi-finished products have a simple geometric shape, which in the expert world is often referred to as 2- to 2.5-dimensional, and serve as raw material for further production steps. Shaped bodies are preferred according to the invention. The adhesion promoter layer is obtainable by plasma-assisted chemical vapor deposition (PE-CVD). In this process, the adhesion promoter layer is applied to the substrate using PE-CVD. The bonding with the polymer layer only takes place after the plasma process has been completed.The adhesion promoter layer contains the elements Si, C, H and optionally O. Since the structure is dominated by Si, C and, if present, O, while the H atoms are terminally attached to the other elements, the adhesion promoter layer can also be referred to in this application as an adhesion promoter layer based on Si, C and optionally O. The adhesion promoter layer can also contain other elements, such as N, S or halogens, such as Cl or F. Methods for producing coatings on substrates using PE-CVD are known and described in the prior art. Reference is made merely to the documents discussed in the introduction as examples. In general, coatings made of Si, C, H and optionally O are obtained in a plasma when gaseous or finely atomized liquid, e.g. vaporous, precursor materials containing precursor compounds that have Si, C, H and optionally O atoms are fed to the plasma.The precursor compounds are activated in the plasma and form cross-linked layers on the substrate surface. Precursor compounds are compounds whose constituents contribute to layer growth. Carrier gases or inert gases that may also be present in the mixture are therefore not considered precursor compounds. Plasma coatings differ significantly from coatings with comparable compositions obtained, for example, through conventional polymerization and cross-linking processes. Plasma coatings form characteristic, non-stoichiometric structures that cannot easily be described by a chemical formula. The adhesion promoter layer is obtained through a PE-CVD process, using at least a precursor material that contains at least one organosilicon compound as a precursor compound.Furthermore, the precursor material can also be present as a mixture in which the organosilicon compound is mixed with at least one other precursor compound, for example at least one unsaturated hydrocarbon. Furthermore, the precursor material can contain two, three, or more organosilicon compounds. Preferably, the precursor material contains no other precursor compounds besides the organosilicon compound. Surprisingly, it has been found that with such a precursor material, a particularly stable adhesive bond can be achieved in combination with a polymer layer having a Shore A hardness between 60 and 95. In particular, the stability of the composite materials is higher than that of comparable composite materials in which the polymer layer is softer. According to the invention, the adhesion promoter layer is obtained by plasma-enhanced chemical vapor deposition (PE-CVD).PE-CVD is a coating process belonging to the category of chemical vapor deposition (CVD). In CVD, a coating, i.e. a solid, is deposited onto a surface through a chemical reaction from the gas or vapor phase. In PE-CVD, the layer is deposited from a layer-forming plasma. For this purpose, a gas, vapor, and / or aerosol containing the precursor material is converted into the plasma state. For this purpose, a plasma can be ignited directly from the gas, vapor, and / or aerosol. Alternatively, the gas, vapor, and / or aerosol containing the precursor material can be fed into an already ignited non-layer-forming plasma. A non-layer-forming plasma is based, for example, on inert and / or inorganic gases, e.g., air, oxygen, nitrogen, or noble gases. In the layer-forming plasma, several precursor compounds can also be used simultaneously or sequentially.In the plasma phase, the precursor material is excited and fragmented by interactions with the active components of the plasma (free electrons, electromagnetic energy, ions, radicals, neutral particles) and usually reacts partly in the plasma phase and partly on the adjacent surfaces to form a coating. The location of the layer deposition and, in particular, the properties of the coatings are largely controlled by the parameters of the coating process. PE-CVD can be carried out in a vacuum. Thus, the plasma-assisted chemical vapor deposition in the process according to the invention can be a vacuum PE-CVD. This is advantageous, among other things, due to the lower process temperatures, particularly for the coating of temperature-sensitive materials such as plastics. Vacuum PE-CVD usually uses a reaction chamber that is initially evacuated to below 1 Pascal process pressure. Subsequently, the process gases, i.e.Precursor material and, if necessary, an inert gas are added and converted into the plasma state by excitation with electromagnetic radiation, e.g., radio frequency or microwave. The key process parameters for the deposition of an adhesion promoter layer are the quantity and ratio of the process gases, the process power, the process pressure, and the process time. In a PE-CVD process in a vacuum, the process parameters can be varied over the entire process duration, even over time. A PE-CVD process is particularly preferred, initially using non-layer-forming process gases to activate the surfaces, which then transitions to a process with the layer-forming precursor material and, if necessary, inert gases. The precursor material can consist of one or more precursor compounds, the quantity and ratio of which can also be varied over time.If the process parameters are kept constant during PE-CVD coating, a homogeneous single-layer system is created on the workpiece to be coated. If the aforementioned process parameters are varied over the process duration, a multi-layer system can be created on the workpiece to be coated. In a preferred embodiment, PE-CVD is carried out at atmospheric pressure. Thus, in one embodiment, the plasma-enhanced chemical vapor deposition in the process according to the invention is an atmospheric-pressure PE-CVD. This is advantageous because of the possibility of local coating and inline integration of the coating process into existing process chains. Here, the coating is preferably deposited using a plasma nozzle. A plasma is generated in the nozzle from a gas stream of one or more inert gases.Plasma generation can be implemented, but is not limited to, in an arc discharge or a dielectric barrier discharge. Typically, the process gas enters the nozzle at the upper end of the reaction chamber, is then excited into plasma in the reaction chamber, and exits the active plasma zone as plasma at the lower end of the nozzle. At the lower end of the nozzle, the precursor material is usually fed to the plasma gas in the form of a gas, vapor, and / or aerosol. The surface swept over by the plasma emerging from the nozzle can thus be coated. A larger area can be coated by moving the nozzle over the workpiece surface. The key process parameters here are the respective gas flows and quantities of precursor material, the process power, and in particular the distance of the nozzle from the workpiece, as well as the travel speed of the nozzle over the surface to be coated.If all process parameters are kept constant while the nozzle passes over the workpiece, the deposited layers are single-layer systems. Step gradients can be created by repeated passes with changed process parameters. The layers deposited using PE-CVD are usually highly cross-linked in three dimensions and not stoichiometrically composed. The layer properties are essentially influenced by the choice of process parameters. Layers deposited using PE-CVD usually continue to react after the end of the process. For example, free radicals trapped in the layer can react with atmospheric oxygen, meaning that oxygen can also be detected in coatings from oxygen-free processes. In general, however, it should be noted that the exact structure of layers produced by PE-CVD is difficult or only approximately determinable.Since a multitude of reactive radicals, ions, neutral particles, and compounds can react and be deposited in a variety of ways in plasma, plasma layers do not have precisely defined structures at the molecular level. For example, the coatings can contain functional groups such as carbon double bonds, acrylate, carboxy, amino, alcohol, keto, carbonyl, mercapto groups, or radical groups. Therefore, it is common practice and also useful in the technical field to characterize plasma coatings by the precursor compounds. In the context of this application, "organosilicon compound" typically means that the compound contains Si, C, H, and optionally other elements, such as preferably O, S, and / or N. Furthermore, silanes are also encompassed within the scope of the present invention. The organosilicon compound can also contain halogens as additional elements.The organosilicon compound is preferably a low-molecular-weight, i.e., non-polymeric compound. Low-molecular-weight preferably means average molar masses below 1000 g / mol, preferably 50 to 1000 g / mol, even more preferably below 800 g / mol, preferably 50 to 800 g / mol, even more preferably below 600 g / mol, preferably 50 to 600 g / mol, as measured by mass spectroscopy. The organosilicon compound preferably comprises a silane, an organosilane, a siloxane, an alkoxysilane, and / or mixtures thereof. More preferably, the organosilicon compound comprises an organosilane, a siloxane, an alkoxysilane, and / or mixtures thereof. Particular preference is given to siloxanes or alkoxysilanes and / or mixtures thereof.The organosilicon compound is particularly preferably a silane, an organosilane, a compound of the general formula (I) Y−[O−Si(-XZ)p(OY)m]n−O−Y or a crosslinked form thereof, or a cyclic form thereof, in which for each Si atom concerned, m is 0 to 2 and p is 2-m, Z is selected from amino, preferably primary amino (-NH2), secondary amino, in particular (-NHCH3), tertiary amino, in particular (-N(CH3)2), (-N(CH2CH3)2); C1-C. 14 -Carboxyl- (ie -C(=O)OR 1 with R 1 = C 1 - to C 14 -rest), preferably (-C(=O)OR 1 ) with R 1 = C1-C12 alkyl, C2-C12 alkenyl, C5-C12 aryl, C1-C 12 Acrylic, especially C3-C 12 Acryloxy, C3-C 12 Acrylamino, C4-C 12 - Methacrylic, especially C4-C 12 -Methacryloxy, C4-C 12 - Methacrylamino, C4-C12 maleate, C4-C12 maleate anhydride, C4-C12 maleimide; C1-C12 carbonyl, especially R 3C(=O)- with R 3 =H, C1-C3-alkyl or C1-C 12 -aryl, especially phenyl; C1-C 14 -Oxycarbonyl- (ie -O(C=O)R 2 with R 2 = C1- to C 14 -rest), preferably (-O(C=O)R 2 ) with R 2 = C1-C12-alkyl, C2-C12-alkenyl, in particular C2-alkenyl, C5-C 12 -aryl, C3-C 12 -Acrylic, especially C3-C 12 -Acryloxy and C3-C 12 -Acrylamino, C4-C 12 - Methacrylic, especially C4-C12-methacryloxy, C4-C12-methacrylamino, C4-C 12 -Maleate, C4-C 12 -Maleal anhydride, C4-C 12 - Maleimide, C1-C 12 -Carbonyl, especially R 3 C(=O)- with R 3 =H, C1-C3-alkyl, C1-C12-aryl, especially phenyl; C1-C14 amide (i.e. -NH(C=O)R 2 with R 2 = C1 to C14 residue), preferably (- NH(C=O)R 2 ) with R 2 = C1-C 12 -Alkyl, C2-C 12-Alkenyl, in particular C2-alkenyl, C5-C12-aryl, C3-C12-acryl, in particular C3-C12-acryloxy and C3-C12-acrylamino, C4-C12-methacryl, in particular C4-C 12 -Methacryloxy, C4-C 12 -Methacrylamino, C4-C 12 -Maleate, C4-C 12 - Maleate anhydride, C4-C 12 -Maleimide, C1-C 12 -Carbonyl, especially R 3 C(=O)- with R 3 =H, C1-C3-alkyl, C1-C12-aryl, especially phenyl; C1-C 12 -Alkyl, preferably methyl, ethyl, propyl; C2-C 12 -Alkenyl, preferably C2-C6-alkenyl, especially vinyl; C1-C12 aldehyde, C1-C12 peroxo, C1-C12 mercapto, C1-C12 thiocyanato, C3-C12 glycidyl ether, C2-C12 epoxy, especially C3-C12 acryloxy, C4-C 12-Methacryloxy-; X represents a linker, preferably selected from C1-C5 alkylene, in particular methylene, ethylene, propylene, C5-C8 arylene, C3-C6 ethers, C3-C6 thioethers; Y independently represents C1-C5 alkyl, n represents an integer from 1 to 100, preferably 1 to 15, and / or mixtures thereof. Particularly preferably, n = 1. Likewise particularly preferably, the organosilicon compound is a silane, an organosilane, a compound of the general formula (I) Y−[O−Si(-XZ)p(OY)m]n−O−Y or a crosslinked form thereof, or a cyclic form thereof, wherein for each Si atom concerned, m is 0 to 2, and p is 2-m, Z is selected from secondary amino, in particular (-NHCH3), tertiary amino, in particular (-N(CH3)2), (-N(CH2CH3)2); C1-C14-carboxyl- (ie -C(=O)OR 1 with R 1 = C 1 - to C 14 -rest), preferably (-C(=O)OR 1 ) with R 1 = C1-C12 alkyl, C2-C12 alkenyl, C5-C12 aryl, C1-C 12Acrylic, especially C3-C 12 Acryloxy, C3-C 12 Acrylamino, C4-C 12 - Methacrylic, especially C4-C 12 -Methacryloxy, C4-C 12 - Methacrylamino, C4-C12 maleate, C4-C12 maleate anhydride, C4-C12 maleimide; C1-C 12 -Carbonyl, especially R 3 C(=O)- with R 3 =H, C1-C3-alkyl or C1-C 12 -aryl, especially phenyl; C1-C14-oxycarbonyl- (ie -O(C=O)R 2 with R 2 = C1 to C14 residue), preferably (-O(C=O)R 2 ) with R 2 = C1-C 12 -Alkyl, C2-C 12 -Alkenyl, especially C2-alkenyl, C5-C 12 -aryl, C3-C 12 -Acrylic, especially C3-C12 acryloxy and C3-C12 acrylamino, C4-C12 methacrylic, especially C4-C12 methacryloxy, C4-C12 methacrylamino, C4-C 12 -Maleate, C4-C 12 -Maleal anhydride, C4-C 12 - Maleimide, C1-C 12 -Carbonyl, especially R 3 C(=O)- with R 3=H, C1-C3-alkyl, C1-C12-aryl, especially phenyl; C1-C 14 -Amide- (ie -NH(C=O)R 2 with R 2 = C1- to C 14 -rest), preferably (- NH(C=O)R 2 ) with R 2 = C1-C 12 -Alkyl, C2-C 12 -Alkenyl, in particular C2-alkenyl, C5-C12-aryl, C3-C12-acrylic, in particular C3- C 12 -Acryloxy and C3-C 12 -Acrylamino, C4-C 12 -Methacryl, especially C4-C 12 -Methacryloxy, C4-C 12 -Methacrylamino, C4-C 12 -Maleate, C4-C 12 - Maleate anhydride, C4-C12 maleimide, C1-C12 carbonyl, especially R 3 C(=O)- with R 3 =H, C1-C3-alkyl, C1-C12-aryl, especially phenyl; C1-C12-alkyl, preferably methyl, ethyl, propyl; C2-C12-alkenyl, preferably C2-C6-alkenyl, especially vinyl; C1-C 12 -Aldehyde, C1-C 12 -Peroxo, C1-C 12 -Mercapto, C1-C 12 -Thiocyanato, C3- C 12 -Glycidyl ether, C2-C 12-Epoxy-, especially C3-C 12 -Acryloxy-, C4- C12-Methacryloxy-; X represents a linker, preferably selected from C1-C 5- Alkylene, in particular methylene, ethylene, propylene, C5-C8 arylene, C3-C6 ethers, C3-C6 thioethers; Y independently of one another represents C1-C5 alkyl, n represents an integer from 1 to 100, preferably 1 to 15, and / or mixtures thereof. Silanes are chemical compounds consisting of a silicon backbone and hydrogen. Silanes that can be used according to the invention include silanes consisting of a silicon backbone and hydrogen. Silanes can have a branched (iso- and neo-silanes) or unbranched (n-silanes) structure. The general molecular formula of acyclic (open-chain, also called catena-silanes) silanes is SinH2n+2. Ring-shaped silicon-hydrogen compounds are called cyclosilanes (general molecular formula: Si n H 2n). The silane as precursor compound preferably has 1 to 6 silicon atoms, particularly preferably 1 to 3 silicon atoms. In particular, the silane is selected from disilane (Si2H6) or trisilane (Si3H8). Organosilanes are organo-substituted silanes that comprise a silicon backbone and hydrogen, in which the hydrogen is partially replaced by organic groups, or in which the hydrogen is completely replaced by organic groups. Each silicon atom can be bonded to one to four organo groups. Organo-substituted silanes can have a branched (iso- and neo-silanes) or unbranched (n-silanes) structure. In a preferred embodiment, the organo-substituted silane has the formula Si n R 2n+2 where n is an integer from 1 to 15, and R is R 1 , R 2 , R 3 and R 4 where R 1 , R 2 , R 3 and R 4are independently selected from C1-C 12 Alkyl, C1-C 12 Alkenyl or hydrogen, where at least one substituent R is not hydrogen. The organosilane is preferably tetramethylsilane (TMS). The organosilicon compound is particularly preferred. Processes for producing plasma coatings with TMS are known in the art. Due to its physical and chemical properties, TMS is particularly suitable for producing plasma coatings. It is also suitable in mixtures with unsaturated hydrocarbons for producing adhesion promoter layers. Alkoxysilanes are organosilanes that comprise at least one alkoxy substituent, wherein the alkoxy substituents are preferably C1-C12 alkoxy, in particular C1-C5 alkoxy. In a preferred embodiment, the organosilicon compound is an alkoxysilane. The alkoxysilane is particularly preferably a compound of the general formula (I) Y−[O−Si(-XZ)p (OY) m ] n −O−Y or a crosslinked form thereof, or a cyclic form thereof, wherein for each Si atom concerned, m is 0 to 2, and p is 2-m, Z is selected from amino, preferably primary amino (-NH2), secondary amino, in particular (-NHCH3), tertiary amino, in particular (-N(CH3)2), (-N(CH2CH3)2); C1-C14-carboxyl (ie -C(=O)OR 1 with R 1 = C 1 - to C 14 -rest), preferably (-C(=O)OR 1 ) with R 1 = C1-C 12 -Alkyl, C2-C 12 -Alkenyl, C5-C 12 Aryl, C1-C 12 Acrylic, especially C3-C 12 Acryloxy, C3-C 12 Acrylamino, C4-C 12 - Methacrylic, especially C4-C12-methacryloxy, C4-C12-methacrylamino, C4-C 12 -Maleate, C4-C 12 -Maleal anhydride, C4-C 12 - Maleimide; C1-C 12 -Carbonyl, especially R 3 C(=O)- with R 3=H, C1-C3-alkyl or C1-C12-aryl, especially phenyl; C1-C 14 -Oxycarbonyl- (ie -O(C=O)R 2 with R 2 = C1- to C 14 -rest), preferably (-O(C=O)R 2 ) with R 2 = C1-C 12 -Alkyl, C2-C 12 -Alkenyl, in particular C2-alkenyl, C5-C12-aryl, C3-C12-acryl, in particular C3-C12-acryloxy and C3-C12-acrylamino, C4-C12-methacryl, in particular C4-C 12 -Methacryloxy, C4-C 12 - Methacrylamino, C4-C 12 -Maleate, C4-C 12 -Maleal anhydride, C4-C 12 - Maleimide, C1-C12 carbonyl, especially R 3 C(=O)- with R 3 =H, C1-C3-alkyl, C1-C 12 -aryl, especially phenyl; C1-C14-amide- (ie -NH(C=O)R 2 with R 2 = C1- to C 14 -rest), preferably (- NH(C=O)R 2 ) with R 2 = C1-C12-alkyl, C2-C12-alkenyl, in particular C2-alkenyl, C5-C 12 -aryl, C3-C 12 -Acrylic, especially C3- C12 -Acryloxy and C3-C 12 -Acrylamino, C4-C 12 -Methacryl, especially C4-C12 methacryloxy, C4-C12 methacrylamino, C4-C12 maleate, C4-C12 maleate anhydride, C4-C12 maleimide, C1-C12 carbonyl, especially R 3 C(=O)- with R 3 =H, C1-C3-alkyl, C1-C 12 -aryl, especially phenyl; C1-C12-alkyl, preferably methyl, ethyl, propyl; C2-C 12 -alkenyl, preferably C2-C6-alkenyl, especially vinyl; C1-C 12 -Aldehyde, C1-C 12 -Peroxo, C1-C 12 -Mercapto, C1-C 12 -Thiocyanato, C3-C12 glycidyl ether, C2-C12 epoxy, especially C3-C12 acryloxy, C4-C 12 -Methacryloxy-; X represents a linker, preferably selected from C1-C 5-Alkylene, in particular methylene, ethylene, propylene, C5-C8 arylene, C3-C6 ethers, C3-C6 thioethers; Y independently represents C1-C5 alkyl, n represents 1. The alkoxysilane is also particularly preferably a compound of the general formula (I) Y−[O−Si(-XZ) p (OY) m ] n −O−Y or a crosslinked form thereof, or a cyclic form thereof, wherein for each Si atom concerned, m is 0 to 2, and p is 2-m, Z is selected from C1-C14-carboxyl- (ie -C(=O)OR 1 with R 1 = C 1 - to C 14 -rest), preferably (-C(=O)OR 1 ) with R 1 = C1-C12 alkyl, C2-C12 alkenyl, C5-C12 aryl, C1-C 12 Acrylic, especially C3-C 12 Acryloxy, C3-C 12 Acrylamino, C4-C 12 - Methacrylic, especially C4-C 12 -Methacryloxy, C4-C 12 - Methacrylamino, C4-C12 maleate, C4-C12 maleate anhydride, C4-C12 maleimide; C1-C12 carbonyl, especially R 3C(=O)- with R 3 =H, C1-C3-alkyl or C1-C 12 -aryl, especially phenyl; C1-C14-oxycarbonyl- (ie -O(C=O)R 2 with R 2 = C1 to C14 residue), preferably (-O(C=O)R 2 ) with R 2 = C1-C12-alkyl, C2-C12-alkenyl, in particular C2-alkenyl, C5-C 12 -aryl, C3-C 12 -Acrylic, especially C3-C 12 -Acryloxy and C3-C 12 -Acrylamino, C4-C 12 - Methacrylic, especially C4-C 12 -Methacryloxy, C4-C 12 - Methacrylamino, C4-C12 maleate, C4-C12 maleate anhydride, C4-C12 maleimide, C1-C12 carbonyl, especially R 3 C(=O)- with R 3 =H, C1-C3-alkyl, C1-C 12 -aryl, especially phenyl; C1-C14-amide- (ie -NH(C=O)R 2 with R 2 = C1- to C 14 -rest), preferably (- NH(C=O)R 2 ) with R 2 = C1-C12-alkyl, C2-C12-alkenyl, in particular C2-alkenyl, C5-C 12 -aryl, C3-C 12-Acrylic, especially C3- C 12 -Acryloxy and C3-C 12 -Acrylamino, C4-C 12 -Methacryl, especially C4-C12 methacryloxy, C4-C12 methacrylamino, C4-C12 maleate, C4-C12 maleate anhydride, C4-C 12 -Maleimide, C1-C 12 -Carbonyl, especially R 3 C(=O)- with R 3 =H, C1-C3-alkyl, C1-C 12 -aryl, especially phenyl; C1-C12-alkyl, preferably methyl, ethyl, propyl; C2-C 12 -alkenyl, preferably C2-C6-alkenyl, especially vinyl; C1-C 12 -Aldehyde, C1-C 12 -Peroxo, C1-C 12 -Mercapto, C1-C 12 -Thiocyanato, C3-C12 glycidyl ether, C2-C12 epoxy, especially C3-C12 acryloxy, C4-C 12-Methacryloxy-; X represents a linker, preferably selected from C1-C5 alkylene, in particular methylene, ethylene, propylene, C5-C8 arylene, C3-C6 ethers, C3-C6 thioethers; Y independently represents C1-C5 alkyl, n represents 1. The organosilicon compound is particularly preferably an alkoxysilane selected from tetraethylorthosilicate (TEOS), (3-aminopropyl)triethoxysilane (APTES), vinyltriethoxysilane (VEOS), 3-methacryloxypropyltrimethoxysilane (MEMO), (3-glycidyloxypropyl)trimethoxysilane (GLYMO), (3-mercaptopropyl)trimethoxysilane (MTMO), 3-thiocyanatopropyltriethoxysilane (TCPS) and mixtures thereof. Particularly preferably, the organosilicon compound is an alkoxysilane selected from aminopropyl)triethoxysilane (APTES), vinyltriethoxysilane (VEOS), 3-methacryloxypropyltrimethoxysilane (MEMO), 3-thiocyanatopropyltriethoxysilane (TCPS) and / or (3-mercaptopropyl)trimethoxysilane (MTMO).More particularly, the organosilicon compound is an alkoxysilane selected from vinyltriethoxysilane (VEOS), 3-methacryloxypropyltrimethoxysilane (MEMO) and / or (3-mercaptopropyl)trimethoxysilane (MTMO), 3-thiocyanatopropyltriethoxysilane (TCPS), and mixtures thereof. Siloxanes are chemical compounds with the general formula R3Si−[O−SiR2]. n−O−SiR3, where R, independently of one another, can preferably be hydrogen atoms, alkyl groups, aryl groups, or alkoxy groups, and n, in one preferred embodiment, is equal to 0 to 4, and in another preferred embodiment, is greater than 10, and in particular is at most 100. In contrast to silanes, the silicon atoms are not linked to one another, but rather to their neighboring silicon atom through exactly one oxygen atom: Si–O–Si. Siloxanes with R = CH3 are called polydimethylsiloxanes. The siloxanes preferably have 2 to 6 silicon atoms. The siloxane is particularly preferably selected from disiloxane, in particular hexamethyldisiloxane (HMDSO), or trisiloxanes, in particular octamethyltrisiloxane. In a preferred embodiment, the siloxane is HMDSO.Due to its physical and chemical properties, HMDSO is often used for the production of silicon-containing coatings in plasma because it is comparatively inexpensive and, due to its high vapor pressure, is easily transferred into the plasma. In a particularly preferred embodiment, the organosilicon compound comprises a siloxane of the general formula (I) Y−[O−Si(-XZ). p (OY) m ] n −O−Y or a crosslinked form thereof, or a cyclic form thereof, wherein for each Si atom in question, m is 0 to 2, and p is 2-m, Z is selected from amino, preferably primary amino (-NH2), secondary amino, in particular (-NHCH3), tertiary amino, in particular (-N(CH3)2), (-N(CH2CH3)2); C1-C 14 -Carboxyl- (ie -C(=O)OR 1 with R 1 = C 1 - to C 14 -rest), preferably (-C(=O)OR 1 ) with R 1 = C1-C12 alkyl, C2-C12 alkenyl, C5-C12 aryl, C1-C 12Acrylic, especially C3-C 12 Acryloxy, C3-C 12 Acrylamino, C4-C 12 - Methacrylic, especially C4-C 12 -Methacryloxy, C4-C 12 - Methacrylamino, C4-C12 maleate, C4-C12 maleate anhydride, C4-C12 maleimide; C1-C 12 -Carbonyl, especially R 3 C(=O)- with R 3 =H, C1-C3-alkyl or C1-C 12 -aryl, especially phenyl; C1-C14-oxycarbonyl- (ie -O(C=O)R 2 with R 2 = C1 to C14 residue), preferably (-O(C=O)R 2 ) with R 2 = C1-C12-alkyl, C2-C12-alkenyl, in particular C2-alkenyl, C5-C 12 -aryl, C3-C 12 -Acrylic, especially C3-C12 acryloxy and C3-C12 acrylamino, C4-C12 methacrylic, especially C4-C12 methacryloxy, C4-C12 methacrylamino, C4-C 12 -Maleate, C4-C 12 -Maleal anhydride, C4-C 12 - Maleimide, C1-C 12 -Carbonyl, especially R 3 C(=O)- with R 3=H, C1-C3-alkyl, C1-C12-aryl, especially phenyl; C1-C14 amide (i.e. -NH(C=O)R 2 with R 2 = C1- to C 14 -rest), preferably (- NH(C=O)R 2 ) with R 2 = C1-C 12 -Alkyl, C2-C 12 -Alkenyl, in particular C2-alkenyl, C5-C12-aryl, C3-C12-acryl, in particular C3-C12-acryloxy and C3-C12-acrylamino, C4-C12-methacryl, in particular C4-C 12 -Methacryloxy, C4-C 12 -Methacrylamino, C4-C 12 -Maleate, C4-C 12 - Maleate anhydride, C4-C 12 -Maleimide, C1-C 12 -Carbonyl, especially R 3 C(=O)- with R 3 =H, C1-C3-alkyl, C1-C12-aryl, especially phenyl; C1-C 12 -Alkyl, preferably methyl, ethyl, propyl; C2-C12-alkenyl, preferably C2-C6-alkenyl, in particular vinyl; C1-C 12 -Aldehyde, C1-C 12 -Peroxo, C1-C 12 -Mercapto, C1-C 12 -Thiocyanato, C3- C 12 -Glycidyl ether, C2-C 12-Epoxy-, especially C3-C 12 -Acryloxy-, C4- C12-Methacryloxy-; X represents a linker, preferably selected from C1-C 5- Alkylene, in particular methylene, ethylene, propylene, C5-C8 arylene, C3-C6 ethers, C3-C6 thioethers; Y independently of one another represents C1-C5 alkyl, n represents an integer from 2 to 100, preferably 2 to 15. In a particularly preferred embodiment, the organosilicon compound comprises a siloxane of the general formula (I) Y−[O−Si(-XZ)p(OY)m]n−O−Y or a crosslinked form thereof, or a cyclic form thereof, wherein for each Si atom concerned, m is 0 to 2, and p is 2-m, Z is selected from primary amino (NH2), C1-C14 oxycarbonyl, preferably (-O(C=O)R2) with R2 = C1-C12 alkyl, C2-C 12 -Alkenyl, C5-C 12 -aryl, C3-C 12 Acrylic, especially C3-C 12 -Acryloxy and C3-C 12 -Acrylamino, C4-C 12 -Methacryl, especially C4-C 12- Methacryloxy, C4-C12-Methacrylamino, C1-C 12 -Alkyl, Vinyl, C1-C12-Mercapto, C1-C12-Thiocyanato, C3-C12-Glycidylether, C3-C12- Acryloxy und C4-C 12-Methacryloxy, X represents a linker, preferably selected from C1-C5 alkylene, in particular methylene, ethylene, propylene, C5-C8 arylene, C3-C6 ethers, C3-C6 thioethers, Y independently represent C1-C5 alkyl, n represents an integer from 2 to 100, preferably 2 to 15. The aliphatic radicals can be straight-chain or branched. The organosilicon compound is particularly preferably selected from - alkoxysilane selected from tetraethylorthosilicate (TEOS), (3-aminopropyl)triethoxysilane (APTES), vinyltriethoxysilane (VEOS), 3-methacryloxypropyltrimethoxysilane (MEMO), (3-glycidyloxypropyl)trimethoxysilane (GLYMO), (3-mercaptopropyl)trimethoxysilane (MTMO), 3-thiocyanatopropyltriethoxysilane (TCPS), - siloxane selected from disiloxane, in particular hexamethyldisiloxane (HMDSO), and octamethyltrisiloxane, - silane selected from disilane (Si2H6) and trisilane (Si3H8) - organosilane selected from tetramethylsilane (TMS),and mixtures thereof. The organosilicon compound is particularly preferably selected from tetraethylorthosilicate (TEOS), (3-aminopropyl)triethoxysilane (APTES), vinyltriethoxysilane (VEOS), 3-methacryloxypropyltrimethoxysilane (MEMO), (3-glycidyloxypropyl)trimethoxysilane (GLYMO), (3-mercaptopropyl)trimethoxysilane (MTMO), 3-thiocyanatopropyltriethoxysilane (TCPS), hexamethyldisiloxane (HMDSO), tetramethylsilane (TMS), disiloxane, or octamethyltrisiloxane, and mixtures thereof. More preferably, the organosilicon compound is selected from tetraethylorthosilicate (TEOS), (3-aminopropyl)triethoxysilane (APTES), vinyltriethoxysilane (VEOS), 3-methacryloxypropyltrimethoxysilane (MEMO), (3-glycidyloxypropyl)trimethoxysilane (GLYMO), (3-mercaptopropyl)trimethoxysilane (MTMO), 3-thiocyanatopropyltriethoxysilane (TCPS), tetramethylsilane (TMS), and mixtures thereof. Even more preferably, the organosilicon compound is selected from tetraethylorthosilicate (TEOS),Vinyltriethoxysilane (VEOS), 3-methacryloxypropyltrimethoxysilane (MEMO), (3-glycidyloxypropyl)trimethoxysilane (GLYMO), (3-mercaptopropyl)trimethoxysilane (MTMO), 3-thiocyanatopropyltriethoxysilane (TCPS), tetramethylsilane (TMS), and mixtures thereof. More preferably, the organosilicon compound is selected from tetraethylorthosilicate (TEOS), vinyltriethoxysilane (VEOS), 3-methacryloxypropyltrimethoxysilane (MEMO), (3-glycidyloxypropyl)trimethoxysilane (GLYMO), (3-mercaptopropyl)trimethoxysilane (MTMO), 3-thiocyanatopropyltriethoxysilane (TCPS), and mixtures thereof. In one embodiment, the precursor material comprises unsaturated hydrocarbons as further precursor compounds. Unsaturated hydrocarbons are compounds of C and H,which have at least one double or triple bond. According to the invention, aliphatic hydrocarbons are used in particular. Alkenes or alkynes are particularly preferred. Preference is given to using alkenes or alkynes which have 2 to 6 carbon atoms, in particular 2 to 4 carbon atoms. For example, the unsaturated hydrocarbon can be selected from ethylene (ethene), propene, butene, pentene, hexene, cyclohexene, propylene or butylene, or from acetylene (ethyne), propyne or butyne. In a preferred embodiment, the unsaturated hydrocarbon is ethylene or acetylene. Due to their physical and chemical properties, ethylene and acetylene are particularly suitable for the production of plasma coatings. In one embodiment, it is preferred that acetylene is used. When acetylene is used together with an organosilicon precursor compound to produce plasma adhesion promoter layers,A strong adhesion effect can be achieved. Without being bound by any theory, this could be due to the relatively high proportion of unsaturated groups on the surface of such a primer layer, which can be crosslinked with the polymer layer. In addition, the surfaces of such plasma coatings often contain polar functional groups, such as carbonyl or carboxyl groups, which are formed through subsequent reactions with atmospheric oxygen and are also available for further reactions. In a preferred embodiment, the precursor material comprises at least one organosilicon compound selected from tetraethylorthosilicate (TEOS), (3-aminopropyl)triethoxysilane (APTES), vinyltriethoxysilane (VEOS), 3-methacryloxypropyltrimethoxysilane (MEMO), (3-glycidyloxypropyl)trimethoxysilane (GLYMO), (3-mercaptopropyl)trimethoxysilane (MTMO), 3-thiocyanatopropyltriethoxysilane (TCPS), hexamethyldisiloxane (HMDSO), tetramethylsilane (TMS) and mixtures thereof,in combination with at least one unsaturated hydrocarbon, in particular ethylene and / or acetylene. The adhesion promoter layer can have a substantially homogeneous structure or a heterogeneous structure and / or composition. The composition of the layer can vary, in particular, across the thickness of the layer. A homogeneous structure can be obtained if the process conditions, and in particular the composition of the precursor material, are kept constant during PE-CVD. A heterogeneous structure can be obtained if the process conditions, and in particular the composition of the precursor material, are kept constant during plasma coating.is changed. In PE-CVD, the precursor material containing at least one organosilicon compound is used at least partially. In such PE-CVD processes, the type and amount of precursor compounds in the precursor material can be changed during the reaction. In this context, "partially" means that the PE-CVD can be conducted such that part of the adhesion promoter layer is not produced from the precursor material. This can be advantageous, for example, for producing gradient layers. The adhesion promoter layer is preferably obtained by PE-CVD, in which the precursor material is used to deposit the adhesion promoter layer for at least 30%, preferably 30 to 100%, particularly preferably 50 to 100% of the total coating time. In a preferred embodiment, a precursor material containing at least one organosilicon compound is used to produce part of the adhesion promoter layer.wherein another part of the adhesion promoter layer is made of unsaturated hydrocarbons or of a mixture of unsaturated hydrocarbons and organosilicon compounds. In a further preferred embodiment, a precursor material consisting exclusively of at least one organosilicon compound is used to produce the adhesion promoter layer. The precursor material preferably comprises other precursor compounds that are not organosilicon compounds in a proportion of less than 0.5 wt.%, based on the total weight of the precursor material. This produces a predominantly homogeneous layer structure. In a further preferred embodiment, the plasma reaction is carried out with a precursor material,which consists exclusively of unsaturated hydrocarbons and at least one organosilicon compound as precursor compounds. In a further preferred embodiment, the adhesion promoter layer is formed as a gradient layer. The gradient can be a continuous gradient or a step gradient. To generate a continuous gradient, the composition of the precursor material can be continuously changed during the vacuum plasma process. To produce a step gradient, the composition of the precursor material can be changed step by step. A gradient layer can also be generated if the concentration of the precursor material remains the same, but other essential process parameters, such as the power, travel speed, or distance from the substrate layer, are changed. In a preferred embodiment, the adhesion promoter layer has an average thickness of 20 nm to 5 µm,more preferably from 20 to 950 nm, in particular from 20 to 550 nm. In general, it is preferred that the adhesion promoter layer has the smallest possible thickness, while at the same time ensuring a stable bond between the substrate layer and the polymer layer. The average layer thickness is preferably measured by means of scanning electron microscopy on a cross-section of the sample. The cross-section is preferably prepared using argon ion beams in a cross-section polisher. The precursor material used in the PE-CVD process preferably contains exclusively organosilicon compounds or exclusively organosilicon compounds in combination with unsaturated hydrocarbons. In particular, it is preferred that the precursor material consists of an organosilicon compound selected from HMDSO, TMS, MEMO, MTMO, TCPS, VEOS, GLYMO and / or APTES, or of an organosilicon compound,selected from HMDSO, TMS, MEMO, MTMO, TCPS, VEOS, GLYMO, and / or APTES in combination with an unsaturated hydrocarbon, preferably selected from ethylene or acetylene. According to the invention, it has been found that an adhesion promoter layer with strong bonding properties can be obtained if only these reactive precursor compounds are used. In this way, the adhesion promoter layer can be easily produced from readily available and manageable precursor compounds, resulting in a relatively homogeneous adhesion promoter layer. The elemental composition of the adhesion promoter layer is determined on the surface of the layer, in particular by X-ray photoelectron spectroscopy (ESCA, XPS). Fourier transform infrared spectrometry (FTIR) can be used in addition to structure elucidation.and in particular for identifying functional groups. If the composition of the adhesion promoter layer is not uniform across the layer thickness, for example because the layer has a gradient, the composition inside the layer can be determined, for example, by XPS on oblique sections. Preferred compositions of the adhesion promoter layer are described below. In a preferred embodiment, at least the surface of the adhesion promoter layer has the respective composition. The composition of the adhesion promoter layer can be determined at the surface, in particular to a depth of 10 nm.can be easily determined using XPS. The composition on the surface is of particularly high importance for the bonding to the polymer layer. In a further embodiment, the adhesion promoter layer has the stated composition overall. The proportions in atomic % for the elements Si, O and C given here and below are preferably determined using XPS. The proportion of H cannot be detected using XPS. The remainder of the weight preferably consists of H and optionally other elements, such as N, halogens such as F or Cl, S or metals such as Fe. The remainder preferably consists of hydrogen and optionally other elements from the substrate. It is knownthat in such processes, atoms or molecules can detach from the substrate surface in the plasma and transfer into the plasma coating. For example, in the case of coatings on plastics, a larger proportion of carbon can often be detected in the coating, and in the case of coatings on fluorine-containing polymers, a proportion of fluorine can often be detected in the coating. The proportion of Si + C + O on the surface of the adhesion promoter layer and / or the adhesion promoter layer as a whole is preferably >80 at%, in particular >85 at%, 90 at% or >95 at%. The surface of the adhesion promoter layer and / or the adhesion promoter layer as a whole preferably has a proportion of Si that is between 3 at% and 25 at%, in particular between 4 at% and 20 at%, and particularly preferably between 4 at% and 15 at%. The surface of the adhesion promoter layer and / or the adhesion promoter layer as a whole preferably has a proportion of C,which is in particular >25 at.% or >30 at.%. It is preferred that the proportion of C is between 25 at.% and 90 at.%, in particular between 30 at.% and 85 at.%, and particularly preferably between 30 at.% and 80 at.%. The surface of the adhesion promoter layer and / or the adhesion promoter layer as a whole preferably have a proportion of O which is in particular <65 at.% or <60 at.%. It is preferred that the proportion of O is between 10 at.% and 65 at.%, in particular between 15 at.% and 50 at.%. Preferably, the surface of the adhesion promoter layer and / or the adhesion promoter layer as a whole consists of: Si: 3 at% to 25 at%, in particular 4 at% to 20 at%, C: 25 at% to 90 at%, in particular 30 at% to 85 at%, O: 7 at% to 65 at%, in particular 15 at% to 50 at%, wherein the sum of Si + C + O is preferably >80 at%, in particular >85 at%, 90 at% or >95 at%, wherein the remainder is preferably H, N, S and further elements,for example from the substrate. The surface of the adhesion promoter layer and / or the adhesion promoter layer preferably contains: Si: 3 at% to 25 at%, in particular 4 at% to 20 at%, C: 25 at% to 90 at%, in particular 30 at% to 85 at%, O: 7 at% to 65 at%, in particular 15 at% to 50 at%, where the sum of Si + C + O is preferably >80 at%, in particular >85 at%, 90 at% or >95 at%, where the remainder is preferably H, N, S and further elements, for example from the substrate. The adhesion promoter layer can be bonded to the polymer layer via various bonding mechanisms, for example via covalent, ionic interactions, hydrogen bonds, entanglements and / or Van der Waals interactions. The adhesion promoter layer is preferably covalently bonded to the polymer layer. The covalent bond is preferably created after the polymer layer, or a polymer compound as a precursor of the polymer layer,was applied to the adhesion promoter layer. Conditions are then established under which the polymer layer or the polymer compound forms a covalent bond with the adhesion promoter layer in a chemical reaction. Without committing to a specific mechanism, it is assumed that the covalent bond between the adhesion promoter layer and the polymer layer occurs via oxygen and / or carbon radicals. If the precursor material contains unsaturated hydrocarbons, the covalent bond between the adhesion promoter layer and the polymer layer preferably occurs via CC single bonds. The CC single bonds are preferably formed by functional groups on the surface of the adhesion promoter layer reacting with functional groups on the polymer layer. The functional groups are preferably unsaturated carbon bonds.In particular, C-C double bonds. In a particularly preferred embodiment, the polymer compound for producing the polymer layer has unsaturated carbon bonds, in particular double bonds that can be crosslinked to form single carbon bonds that connect the adhesion-promoting layer and the polymer layer. Without committing to a specific mechanism, it is suspected that the organosilicon compounds and the unsaturated hydrocarbons act synergistically in that, on the one hand, the silicon atoms have a stabilizing effect on the three-dimensional network of the hydrocarbon plasma layers by reducing residual stresses in the layers and thus producing more stable layers. On the other hand, a precursor material containing unsaturated hydrocarbons can significantly improve the adhesion-promoting effect of organosilicon precursor compounds.by making additional reactive sites available in the coating. In a preferred embodiment, the polymer layer is obtained by applying a polymer compound to the adhesion promoter layer and crosslinking it, wherein, upon crosslinking of the polymer compound, the adhesion promoter layer is also bonded, preferably covalently, to the polymer layer. This means that two reactions proceed in parallel, namely the crosslinking of the polymer compound to obtain the polymer layer, and the reaction leading to a stable covalent bond between the adhesion promoter layer and the polymer layer. The surface of the adhesion promoter layer and the polymer compound preferably have identical or similar functional groups, in particular CC-,CO and / or unsaturated carbon bonds. In a preferred embodiment, the polymer layer is crosslinked by vulcanization. Preferably, the polymer layer is covalently bonded to the adhesion promoter layer. Generally, vulcanization occurs in the presence of reactive auxiliaries and / or catalysts that effect or support crosslinking. These auxiliaries and / or catalysts can be added to the polymer layer and / or the polymer compound prior to vulcanization. Examples of vulcanization auxiliaries used include sulfur, peroxides, metal compounds, especially metal oxides, silanes, amines, bisphenols, phenolic resins, maleic anhydride, unsaturated hydrocarbons, or high-energy radiation. Vulcanization can be induced or accelerated by external influences.for example, by exposure to heat or radiation. In a preferred embodiment, the adhesion promoter layer has unsaturated carbon bonds, in particular carbon double or triple bonds, on its surface prior to application of the polymer layer. When producing plasma coatings with unsaturated hydrocarbons, adhesion promoter layers can be obtained that have unsaturated CC bonds on their surface. It is preferred to use ethylene or acetylene, which allows a relatively high proportion of unsaturated functional groups to be obtained on the surface of the coating. In a preferred embodiment, the polymer compound used to produce the polymer layer is an unsaturated compound that, in particular, does not contain aromatic double bonds. Such polymer compounds can be crosslinked relatively well.in particular by vulcanization. In a preferred embodiment, the polymer layer is an elastomeric layer. Elastomers are dimensionally stable, cross-linked, yet widely elastically deformable plastics whose glass transition temperature (measured according to DIN EN ISO 11357-2:2020-08) is below the operating temperature, preferably below 22 °C. The polymer layer is preferably available from a rubber. Rubber refers to largely uncrosslinked, cross-linkable, mostly amorphous polymers whose glass transition temperature is below 0 °C. Rubbers are generally suitable for the production of elastomeric layers by cross-linking, e.g., by vulcanization, whereby elastomers are formed from the flowable rubbers with the addition of auxiliaries.which are rubber-elastic and no longer flowable. Rubbers contain double bonds and can therefore be easily crosslinked, optionally forming a covalent bond with the adhesion promoter layer. According to the invention, the polymer layer has a Shore hardness, measured according to DIN ISO 7619-1: 2021-02, Shore A, 23 °C, of ​​60 to 95 Shore A. The hardness can be adjusted in a manner known to those skilled in the art, for example, by appropriately selecting the filler content, the plasticizer content, the proportion of crosslinking aids, or by appropriately selecting the vulcanization conditions. Without committing to a specific mechanism, it is assumed that the organosilicon compound therefore has a particularly favorable effect on the interfacial properties.This is because, compared to pure hydrocarbon layers, organosilicon precursor compounds offer a particularly high number of functional groups for bonding substrate and polymer layers. The beneficial effect of the organosilicon compound is further enhanced by the combination with the polymer layer with a higher Shore A hardness, because the interfacial forces are distributed particularly favorably within the composite due to the high hardness of the polymer layer. The intrinsic properties of the adhesion promoter layer also have a beneficial effect, as it is highly cross-linked in three dimensions and also comparatively hard, which further improves the distribution of the forces acting on the interfaces. In a preferred embodiment, the polymer layer comprises a polymer available from fluororubber (FKM), ethylene-propylene copolymers, such as ethylene-propylene-diene rubber (EPDM), polyacrylate rubber (ACM),Ethylene acrylate rubber (AEM), butadiene rubber, such as acrylonitrile butadiene rubber (NBR), hydrogenated acrylonitrile butadiene rubber (HNBR), styrene butadiene rubber (SBR), silicone rubber, natural rubber (NR), chloroprene rubber (CR), epichlorohydrin rubber (ECO), polyurethane, in particular thermoplastic polyurethanes (TPU), polyurethane casting resins (PUR), and / or epoxy polymers. In a further preferred embodiment, the polymer layer comprises a polymer that is obtainable from fluororubber (FKM), ethylene-propylene copolymer, such as ethylene-propylene-diene rubber (EPDM), polyacrylate rubber (ACM), ethylene-acrylate rubber (AEM), butadiene rubber, such as acrylonitrile-butadiene rubber (NBR), hydrogenated acrylonitrile-butadiene rubber (HNBR), styrene-butadiene rubber (SBR), silicone rubber, natural rubber (NR), chloroprene rubber (CR), epichlorohydrin rubber (ECO), thermoplastic elastomers (TPE),in particular thermoplastic polyolefins (TPO) and / or thermoplastic vulcanizates (TPV), polyurethane, in particular thermoplastic polyurethanes (TPU), polyurethane casting resins (PUR) and / or epoxy polymers. In a further preferred embodiment, the polymer layer comprises a polymer obtainable from fluororubber (FKM), ethylene-propylene copolymer, such as ethylene-propylene-diene rubber (EPDM), polyacrylate rubber (ACM), ethylene-acrylate rubber (AEM), butadiene rubber, such as acrylonitrile-butadiene rubber (NBR), hydrogenated acrylonitrile-butadiene rubber (HNBR), silicone rubber, natural rubber (NR), chloroprene rubber (CR), epichlorohydrin rubber (ECO), thermoplastic elastomers (TPE), in particular thermoplastic polyolefins (TPO) and / or thermoplastic vulcanizates (TPV), and / or epoxy polymers. The polymer layer preferably contains one or more of the aforementioned polymers in a proportion of at least 70 percent by weight.More preferably, 80 to 100 percent by weight based on the total weight of the polymers. The aforementioned polymers are advantageous because they can be crosslinked relatively easily and bonded to the adhesion promoter layer. In a particularly preferred embodiment, the polymer layer comprises a polymer obtainable from fluororubber (FKM), ethylene-propylene copolymers, such as ethylene-propylene-diene rubber (EPDM), polyacrylate rubber (ACM), butadiene rubber, such as acrylonitrile-butadiene rubber (NBR), hydrogenated acrylonitrile-butadiene rubber (HNBR), silicone rubbers, natural rubber (NR), and / or chloroprene rubber (CR). In a further particularly preferred embodiment, the polymer layer comprises a polymer which is obtainable from fluororubber (FKM), ethylene-propylene copolymers, such as ethylene-propylene-diene rubber (EPDM), ethylene-acrylate rubber (AEM) and / or butadiene rubber, such as acrylonitrile-butadiene rubber (NBR),hydrogenated acrylonitrile-butadiene rubber (HNBR). The polymer layer preferably contains one or more of the aforementioned polymers in a proportion of at least 70 percent by weight, more preferably 80 to 100 percent by weight, based on the total weight of the polymers. In a preferred embodiment, the polymer layer is obtainable from a rubber and has a filler content of at least 30 pHr, preferably at least 50 pHr. It has been found that the combination of the adhesion promoter layer with a polymer layer, which is obtainable from a rubber and has a filler content of at least 30, preferably 50 pHr, forms particularly well-adhering composites. Preferred fillers are carbon modifications, silicas, and / or mineral fillers. Particularly preferred carbon modifications are carbon black, graphite, and / or carbon nanotubes. Particularly preferred mineral fillers are silicates, alumina, iron oxides, titanium oxide, calcium carbonate,Barium sulfate, aluminum hydroxide, zinc oxide, and / or magnesium hydroxide. A particularly preferred filler is carbon black. The advantage of using the aforementioned fillers is that they have a high hardness, which in particular optimizes the interfacial properties for the interface between the adhesion promoter layer and the polymer layer by approximating the hardness of the respective components, and forces acting on the composite can be better distributed within the composite. In a further preferred embodiment, the polymer layer is available from the rubber FKM and has a filler content, in particular a carbon black content, of at least 30 pHr, preferably at least 50 pHr, and / or the polymer layer is made from the rubbers ethylene-propylene copolymers, such as ethylene-propylene-diene rubber (EPDM), polyacrylate rubber (ACM), ethylene-acrylate rubber (AEM), butadiene rubber, such as acrylonitrile-butadiene rubber (NBR),hydrogenated acrylonitrile-butadiene rubber (HNBR), styrene-butadiene rubber (SBR), silicone rubbers, natural rubber (NR), chloroprene rubber (CR), epichlorohydrin rubber (ECO), polyurethane and / or epoxy polymers, and has a filler content, in particular a carbon black content, of at least 50 pHr, preferably at least 60 pHr. In a further preferred embodiment, the polymer layer is available from the rubber FKM and / or thermoplastic elastomers (TPE), in particular thermoplastic polyolefins (TPO) and / or thermoplastic vulcanizates (TPV), and has a filler content, in particular a carbon black content, of at least 30 pHr, preferably at least 40 pHr, and / or the polymer layer is made from the rubbers ethylene-propylene copolymers, such as ethylene-propylene-diene rubber (EPDM), polyacrylate rubber (ACM), ethylene-acrylate rubber (AEM), butadiene rubber, such as acrylonitrile-butadiene rubber (NBR),hydrogenated acrylonitrile-butadiene rubber (HNBR), styrene-butadiene rubber (SBR), silicone rubber, natural rubber (NR), chloroprene rubber (CR), epichlorohydrin rubber (ECO), polyurethane, and / or epoxy polymers, and has a filler content, in particular a carbon black content, of at least 50 pHr, preferably at least 60 pHr. In a further preferred embodiment, the polymer layer has a plasticizer content, in particular natural or synthetic plasticizers, of 3 to 30 pHr, particularly preferably 5 to 15 pHr. Plasticizers are generally understood by those skilled in the art to be substances that generate free volume in the polymer matrix. Common plasticizers are paraffinic, naphthenic and / or aromatic substances, esters, ethers and thioethers as well as low molecular weight substances with average molecular weights below 1000 g / mol, measured by mass spectroscopy, which are liquid under standard conditions (20°C, atmospheric pressure).such as water and / or polymer solutions. Thus, the polymer layer preferably has a total proportion of plasticizer selected from paraffins, naphthenes, aromatics, esters, ethers, thioethers, and polymer solutions that are liquid under standard conditions (20°C, atmospheric pressure) and have an average molecular weight below 1000 g / mol, measured by mass spectroscopy, of 3 to 30 pHr, particularly preferably 5 to 15 pHr. In a further embodiment, the polymer layer has less than 30 pHr, particularly preferably less than 15 pHr, in particular 0 pHr plasticizer. In a preferred embodiment, the polymer layer has an average thickness, measured optically, of 1 to 100 mm, preferably 1 to 50 mm, and particularly preferably 1 to 20 mm. According to the invention, it is preferredfirst providing the substrate layer with the adhesion promoter layer and then applying the polymer layer to the adhesion promoter layer. The invention also relates to a process for producing a composite material according to the invention, comprising the steps: (a) providing the substrate layer, (b) coating the substrate layer with the adhesion promoter layer by plasma-assisted chemical vapor deposition (PE-CVD), (c) applying a polymer compound, which upon crosslinking can produce a polymer layer with a Shore hardness of 60 to 95, to the adhesion promoter layer, so that the substrate layer is at least partially provided with the polymer compound, (d) crosslinking the polymer compound,so that a polymer layer with a Shore hardness of 60 to 95 Shore A is obtained, and wherein the adhesion promoter layer is preferably covalently bonded to the polymer layer. Steps (a) to (d) are carried out in the specified order. The polymer compound is preferably applied such that the substrate layer has regions provided with the polymer compound and other regions not provided with the polymer compound. The adhesion promoter layer applied in step (b) preferably has unsaturated carbon bonds on its surface. These react preferentially with the polymer compound, which preferably also has reactive groups, during crosslinking of the polymer compound in step (d). This achieves the advantages of a stable layer bond.which are described above for the composite material according to the invention. Embodiments of the method according to the invention comprise the embodiments described above and below for the composite material according to the invention, mutatis mutandis. Thus, the adhesion promoter layer is obtainable by plasma-enhanced chemical vapor deposition (PE-CVD), in which at least partially a precursor material is used that contains at least one organosilicon compound. In general, the adhesion promoter layer can be applied to the substrate layer by reaction in the plasma according to known methods. In this regard, reference is made to the prior art discussed in the introduction, which describes by way of example how plasma layers from hydrocarbons,organosilicon compounds or mixtures of precursor compounds. In general, the substrate is first cleaned and introduced into a suitable plasma device. If necessary, a non-layer-forming pretreatment is carried out in the device in a plasma gas that does not contain any layer-forming precursor compounds, for example in the presence of noble gases, oxygen, or nitrogen. The substrate can then be cleaned again and, if necessary, activated on the surface. Suitable precursor compounds are then added, and the plasma-assisted chemical vapor deposition is carried out. The thickness, composition, and growth of the layer can be controlled by known measures, for example, by adjusting the amount and concentration of the precursor compounds, the temperature, the process power, the pressure, the coating time,The speed of the plasma nozzle, the distance between the nozzle and the substrate layer, the supply of inert gas, and other parameters can be varied. After the desired coating has been formed, the PE-CVD process is stopped, for example, by removing the substrate from the device; or by interrupting the power input or the inflow of precursor compounds. Corresponding processes and modifications are known and are adequately described in the literature. For example, reference is made to the textbook "Advanced Plasma Technology", d'Agostino et al. (Editor), Wiley-VCH, 2008. The polymer layer can be applied using conventional methods. It is preferred that a polymer compound is not in solid form, and in particular in liquid form.pasty or highly viscous form and then solidified to form the polymer layer. The polymer compound is applied in particular as a melt or as a mixture with a solvent. According to the invention, the polymer layer is preferably applied to the adhesion promoter layer in such a way that the substrate layer has regions that are provided with the polymer compound and other regions that are not provided with the polymer compound. The solidification of the polymer compound is preferably carried out by vulcanization and / or crosslinking. The liquid, pasty, or highly viscous polymer compound can be applied using conventional molding processes, for example by injection molding, compression molding, or transfer molding. In this case, a molding compound is placed in a chamber on the coated substrate,in which it is crosslinked under heat and pressure. The process is particularly suitable for the production of elastomer components, such as seals. During crosslinking under heat and pressure, the formation of covalent bonds between the polymer layer and the adhesion promoter layer can occur in parallel. In a preferred embodiment, the polymer layer and / or the polymer compound can contain additives. In particular, additives that promote curing are preferred, such as crosslinking aids and catalysts for vulcanization. Crosslinking aids that can be present include, in particular, sulfur, peroxides, metal compounds, especially metal oxides, silanes, amines, bisphenols, or phenolic resins. In a preferred embodiment, the polymer layer contains crosslinking aids selected from peroxides, amines, bisphenols, and mixtures thereof. The polymer layer can also contain conventional additives that modify the properties in the desired manner.such as fillers, plasticizers, processing aids, binding aids, light stabilizers or dyes. The invention also relates to the use of an adhesion promoter layer for bonding a substrate layer to a polymer layer, wherein the polymer layer and substrate layer are bonded to one another by the adhesion promoter layer, and wherein the adhesion promoter layer is obtainable by plasma-enhanced chemical vapor deposition (PE-CVD), in which at least partially a precursor compound is used which contains at least one organosilicon compound, and wherein the polymer layer has a Shore hardness, measured according to DIN ISO 7619-1: 2021-02, Shore A, 23 °C,from 60 to 95 Shore A. The use is particularly with the composite materials according to the invention. Embodiments of the use according to the invention comprise the embodiments described above and below for the composite material according to the invention, mutatis mutandis. For example, the substrate layer preferably has regions that are directly connected to the polymer layer by the adhesion promoter layer, and other regions that are not connected to the polymer layer. The composite materials according to the invention are characterized by high stability. The substrate layer can only be separated from the polymer layer by strong mechanical forces. Therefore, the composite materials can be used for applications,where strong mechanical forces act on the materials. Alternatively, applications in contact with material-stressing and / or aggressive liquid or gaseous media can be advantageous. The composite materials are preferably characterized by a high adhesive force or bond strength between the polymer layer and the substrate layer. Thus, high separation forces are preferably required to detach the polymer layer from the substrate layer. The bond strength of layered materials is preferably determined according to ASTM D429: 2014-01. The bond strength of polymer layers is preferably determined in the 90° peel test based on Method B. Deviating from the standard, the test is carried out at a test speed of 100 mm / min. The test specimens also differ slightly,because the rubber layer is less than 6 mm and a peel path or a test length on the peel strip of at least 30 mm is considered. Preferably, the composite materials according to the invention show a failure pattern in the elastomer material, i.e. in the polymer layer (failure pattern R according to the exemplary embodiments), and not a detachment of the layers from one another. The invention also relates to the use of the composite material according to the invention as a sealing article or for producing a sealing article. A preferred subject of the invention is a sealing article comprising a composite material according to one or more of the embodiments described above or below. The composite materials according to the invention are particularly suitable as sealing articles due to their high stability. A sealing article is an element that has the task ofto prevent or limit unwanted mass transfers from one location to another. The invention also relates to a sealing article containing a composite material according to the invention. A preferred sealing article is a flange seal, plug-in connection (e.g., plug & seal), a metal O-ring, a valve seal, a liquid seal, or an integrated static seal on a metallic or polymer component (e.g., an elastomer seal on metallic bipolar plates for fuel cell applications), a mechanical seal, a radial shaft seal, a labyrinth shaft seal, a flat seal, a piston ring, a magnetic armature, a bellows, or a diaphragm seal. A preferred use is as a dynamic sealing article, preferably as a mechanical seal, a radial shaft seal, a labyrinth shaft seal, a flat seal, a piston ring, or a special seal, such as a magnetic armature.Bellows or diaphragm. Dynamic sealing articles are used to seal moving machine parts that have a common, moving interface. A dynamic sealing article is characterized by considerable movement of this interface, which is absent in static sealing articles. Especially in dynamic sealing articles, sealing materials must provide a consistent sealing effect under high mechanical loads over long periods of time. The sealing article is preferably a dynamic sealing article, in particular a mechanical seal, a radial shaft seal, a labyrinth shaft seal, a flat gasket, a piston ring, or a special seal, such as a magnet armature, bellows, or diaphragm. A particularly preferred use is the use of the composite material as a static sealing article, preferably as flange seals, plug-in connections (e.g., plug & seal), metal O-rings, valves,Liquid seals or integrated static seals on metallic or polymeric components (e.g., elastomer seals on metallic bipolar plates for fuel cell applications). Preferably, the sealing article is a static sealing article, in particular flange seals, plug-in connections (e.g., plug & seal), metal O-rings, valves, liquid seals, or integrated static seals on metallic or polymeric components (e.g., elastomer seals on metallic bipolar plates for fuel cell applications). The composite materials, methods, and uses according to the invention solve the problem underlying the invention. Composite materials are provided,in which a multitude of different substrates can be stably and permanently bonded to various other materials. In particular, the invention enables a stable bond between metals and polymers or between different polymers. The composite materials consist of common components. They are obtainable in just a few steps using relatively simple processes. The adhesion promoter layers based on organosilicon compounds adhere well to a multitude of different substrates and enable a stable bond with a multitude of other, different materials. Exemplary embodiments Production of the coating Various base bodies are provided with a coating in a plasma-assisted chemical vapor deposition process. Two process sequences are available for this: In variant 1, a low-pressure plasma system is used for an asymmetric,Capacitively coupled radiofrequency discharge is used. The substrates are positioned in contact with the electrode. This process uses a precursor material containing an organosilicon compound and, optionally, acetylene or ethylene as a carbon source. The addition of other reactive gases, such as oxygen, argon, or nitrogen, is also possible. Through excitation with electromagnetic radiation, for example, at radiofrequency, these gases are converted into a plasma state at process pressures of a few Pascals. The molecules are split and condense as a PE-CVD layer on the surface of the substrate. To improve the bonding of the layer to the substrates, they are first evaporated in a non-layer-forming plasma, such as argon and / or oxygen.activated. Depending on the nature of the substrate surface, fragments from the surface can pass into the plasma phase and be incorporated into the coating. In principle, it is possible and common practice with this process variant to combine several process steps into one overall process. For example, the process gas compositions and / or the composition of the precursor material can be varied during the process and the local layer composition can be influenced gradually or in stages. The second process variant (hereinafter variant 2) is carried out with atmospheric pressure plasma systems. Here, the plasma from a non-layer-forming gas (e.g. air or nitrogen) is ignited at atmospheric pressure in a nozzle and guided by gas flow onto the substrate to be coated. At the nozzle outlet, the precursor material in gaseous form,In vapor form or as an aerosol, activated in the plasma, and then deposited as a coating on the substrate. For the full-surface coating of a surface, the nozzle moves parallel to the substrate surface at a defined distance from it. In variant 2a, the plasma is generated in the nozzle using an arc discharge (ARC). In variant 2b, the plasma is generated in a dielectric barrier discharge (DBD). Unless otherwise specified, stainless steel substrates (polished, degreased stainless steel strips type 1.4301 with dimensions width x length 20 mm x 100 mm) are used in the following examples. Examples Example 1: Metal-elastomer composites PE-CVD layer A is deposited on stainless steel substrates using the low-pressure plasma process (variant 1). The process for the deposition of PE-CVD layer A initially consists of an activation step in a non-layer-forming plasma (process gas flow: 70 sccm Ar,Bias voltage: 400 V), which then gradually transitions into a layer-forming plasma from an organosilicon-enriched base (process gas flow: 30 sccm HMDSO (CAS No.: 107-46-0); bias voltage: 400 V) and subsequently a carbon-rich and silicon-poor final layer (process gas flow: 60 sccm acetylene (CAS No.: 74-86-2), 4 sccm HMDSO, process power: 400 W). PE-CVD layer B is also deposited on stainless steel substrates using the low-pressure plasma process. The process initially consists of an activation step in non-layer-forming plasma (process gas flow: 70 sccm Ar, bias voltage: 400 V), which is then converted into a layer-forming plasma from a silicon-organic enriched base (process gas flow: 30 sccm HMDSO; bias voltage: 400 V) and subsequently a carbon-rich final step (process gas flow: 60 sccm ethene (CAS No.: 74-85-1),Process power: 400 W). After the coating systems are applied to the base bodies, they are coated with a layer of elastomer in a compression molding process (CM process). For this purpose, the unvulcanized elastomer compound is applied to the metal strips and vulcanized to the coated base body under pressure and at a high temperature (process conditions: T = 180 °C, p = 230 bar, t = 10 min). Four elastomer compounds with different formulations and resulting different Shore hardnesses are used. The Shore hardness of the elastomer compounds is tested based on 6 mm plates and is determined according to DIN ISO 7619-1:2021-02 (Shore A, 23 °C). The following elastomer compound variants,based on the base polymer EPDM are used: Ingredient Category Mixture Mixture Mixture Mixture 1 2 3 4 (comparison mixture) Keltan® 2450 Rubber 100 100 100 100 N 772 Filler 60 30 80 100 (carbon black) Tudalen® D18 Plasticizer 0 0 10 25 Perkadox® BC- Crosslinking 8 8 8 8 40 (peroxidic) Zinc oxide Activator 3 3 3 3 TMQ Activator 2 2 2 2 Stearic acid Activator, 1 1 1 1 Dispersant Hardness of the elastomer mixture in Shore A 66 59 63 61 Table 1: Overview of the mixture compositions used (all data in pHr). Compounds 1, 3, and 4 have Shore hardnesses within the range of 60 to 95 Shore A. Compound 2 has a lower Shore hardness. After the vulcanization process, test specimens are punched out of the cooled elastomer-metal composite and ground. For the peel test, a specimen is created consisting of a rigid, metallic base body,a plasma bonding layer and a vulcanized elastomer coating. To evaluate the bond, a 90° peel test is carried out in accordance with ASTM D429: 2014-01 according to Method B. Deviating from the standard, the test is carried out at a test speed of 100 mm / min. The test specimens also differ slightly from the specifications of the standard, as the rubber coating is less than 6 mm thick and a peel path or test length on the peel strip of more than 30 mm is considered. The most important evaluation criterion for the bonding is the failure pattern. R denotes failure in the elastomer, RC the failure between the elastomer and the bonding agent, MC between the metal and the bonding agent, and MR between the metal and the elastomer. In addition to the failure pattern R, a number indicates the elastomer coating on the bonding layer in percent, i.e., 100 R denotes a remaining elastomer coating of 100%.specified. Mixture 1 Mixture 2 Mixture 3 Mixture 4 (comparison mix) Hardness of the elastomer mix in Shore A 66 59 63 61 Failure pattern in the peel test 100 R 0 R 95 R 100 R (PE-CVD layer A on stainless steel) Failure pattern in the peel test 100 R 0 R 100 R 100 R (PE-CVD layer B on stainless steel) Table 2: Shore hardness of the EPDM mixes and results of the adhesion test with PE-CVD-coated stainless steel strips It can be seen that with elastomer mixes with a Shore hardness in the inventive range (mixtures 1, 3 and 4) in combination with the PE-CVD layers A and B, significantly better failure patterns and thus adhesion results are achieved. This is particularly surprising for the elastomer mixes 3 and 4,since high plasticizer additions are generally detrimental to the formation of stable metal-elastomer composites. Example 2: Rubber-thermoplastic composites. The coating processes for PE-CVD layer A and PE-CVD layer B are carried out analogously to Example 1. However, instead of the stainless steel base bodies, base bodies made of PA 66 with 30% glass fibers (PA66 GF) with dimensions of 25 mm x 100 mm (width x length) are coated. The test specimens are also produced analogously to Example 1. Mixture 1 Mixture 2 Mixture 3 Mixture 4 (comparison mixture) Hardness of the 66 59 63 61 elastomer mixture in Shore A Failure pattern in the peel test 100 R 0 R 100 R 95 R (PE-CVD layer A on PA66 GF) Failure pattern in the peel test 100 R 0 R 100 R 75 R (PE-CVD layer B on PA66 GF) Table 3: Results of the adhesion test with PE-CVD coated PA66 strips with different EPDM mixtures It can be seen,that significantly better failure patterns and thus adhesion results are achieved with elastomer mixtures with a Shore hardness in the inventive range (mixtures 1, 3, and 4) in combination with the PE-CVD layers A and B. Example 3: Chemical Composition The PE-CVD layers A and B are deposited on stainless steel and PA66 GF using process 1 and analyzed using X-ray photoelectron spectroscopy (XPS). This method analyzes the uppermost nanometers (up to 10 nm).which is in direct contact with the phase to be bonded. Percentage Percentage Si Percentage C Percentage O PE-CVD layer other [at%] [at%] [at%] [at%] A (on stainless steel) 3 87 10 A (on PA66GF) 3 85 12 B (on stainless steel) 93 7 B (on PA66GF) 91 9 Table 4: Chemical composition of the adhesion promoter surfaces Example 4: Rubber-metal composites PE-CVD layer C is deposited on stainless steel base bodies using the low-pressure plasma process (variant 1). The process for the deposition of layer system C initially consists of an activation step in a non-layer-forming plasma (process gas flow: 70 sccm Ar, bias voltage: 400 V), which is then converted into a layer-forming plasma from an organosilicon-enriched base (process gas flow: 30 sccm HMDSO; bias voltage: 400 V) and subsequently a carbon-rich plasma with an organosilicon finish (process gas flow: 60 sccm acetylene, 30 sccm HMDSO,Process power: 400 W). The base bodies are further processed into peel test specimens analogously to the previous examples. Mixture 5 with the base polymer FKM and Mixture 6 with the base polymer AEM are used as the binding partner (see Tables 5 and 6 for composition). The test specimens with Mixture 5 are first vulcanized at 180 °C for 10 minutes and then post-heated at 200 °C for 24 hours. The test specimens with Mixture 6 are also vulcanized at 180 °C for 10 minutes and then post-heated at 175 °C for 5 hours. The peel test is carried out analogously to Example 1. Ingredient Category Mixture 5 Tecnoflon® T Rubber 100 636 N 772 Filler (Carbon black) 30 Calcium activator, acid scavenger 6 hydroxide ger Magnesium oxide activator, acid scavenger 3 ger, heat stabilizer Tecnoflon® FOR crosslinking 4 M 1 (bisphenolic) Tecnoflon® FOR accelerator 1,5 M 2 Table 5: Overview of the mixture compositions used for mixture 5 (all data in pHr) Ingredient Category Mixture 6 Vamac® Ultra Polymer 100 IP N 550 Filler (carbon black) 65 Rhenosin® W Plasticizer 10 759 Stearic acid Activator, Dispersant 1.5 CDPA Anti-aging agent 2 Vanfre® VAM Processing aid 1 Armeen® 18D Processing aid 0.5 HMDC Crosslinking agent 1.5 (diaminic) Rhenogran® Activator, 2 XLA-60 Accelerator Table 6: Overview of the mixture compositions used for mixture 6 (all data in pHr) Mixture 5 Mixture 6 Hardness of the elastomer mixture in Shore A 71 67 Failure pattern in the peel test 100 R 90 R (PE-CVD layer C on stainless steel) Table 7: Results of the adhesion test with plasma-coated stainless steel strips with various elastomer compounds Example 5: Rubber-metal composites PE-CVD layer D is deposited using the atmospheric pressure plasma process, variant 2b. Nitrogen (80 slm) is used as the plasma gas.Nitrogen (5 slm) is used as the carrier gas. MEMO (CAS No. 2530-85-0) is used as the precursor material, mixed with the carrier gas at a flow rate of 1 slm, and then fed into the plasma gas. The plasma is ignited with a voltage of 450 W. The nozzle moves over the stainless steel substrate to be coated at a distance of 1 mm and a speed of 50 mm / s. Three coating passes are carried out. The test specimens are manufactured with Compound 7, based on the polymer FKM (see Table 8 for composition). The vulcanization of the compound and test specimen takes place at 180 °C for 10 minutes. The test specimens are then post-heated at 230 °C for 22 hours. The peel test specimens fail in the elastomer,The failure pattern is 100 R. Ingredient Category Compound 7 Tecnoflon® P 757 Rubber 100 N 990 Filler (carbon black) 30 Zinc oxide Activator 5 TAIC 70% Coagent 4 Luperox® 101 XL 45 Crosslinking (peroxide) 3 Table 8: Overview of the compound composition used for Compound 7 (all values ​​in pHr) Comparative Example 6: Rubber-metal composites PE-CVD layer E is deposited using the atmospheric pressure plasma process, variant 2b. Nitrogen (80 slm) is used as the plasma gas.Nitrogen (5 slm) is used as the carrier gas. Ethylene glycol methacrylate (CAS No. 97-90-5) is used as the precursor material, mixed with the carrier gas at a flow rate of 1 slm, and then fed into the plasma gas. The plasma is ignited at a voltage of 450 W. The nozzle moves at a distance of 1 mm and a speed of 50 mm / s over the stainless steel substrate to be coated. Three coating passes are performed. Test specimens are produced with mixture 1 and mixture 7. No bond could be achieved between the substrate and the mixture; all test specimens failed with failure patterns 0 R or RC. This shows that the use of organosilicon precursor compounds for the PE-CVD adhesion promoter layer promotes the production of stable elastomer-metal composites. Example 7: Rubber-metal composites. PE-CVD layer F is applied using the atmospheric pressure plasma process.Variant 2b is deposited. Nitrogen (80 slm) is used as the plasma gas, and nitrogen (5 slm) as the carrier gas. MTMO (CAS No. 4420-74-0) is used as the precursor material, mixed with the carrier gas at a flow rate of 1 slm, and fed into the plasma gas. The plasma is ignited at a voltage of 450 W. The nozzle moves over the stainless steel substrate to be coated at a distance of 1 mm and a speed of 50 mm / s. Three coating passes are performed. The test specimens are produced with mixtures 5 and 7. The peel test specimens fail in the elastomer; the failure pattern is 100 R. Example 8: Rubber-metal composites. PE-CVD layer G is deposited using the atmospheric pressure plasma process, variant 2a. Air (30 l / min) is used as the plasma gas, and nitrogen (8 l / min) as the carrier gas. MEMO is used as the precursor material.heated to 200 °C and mixed with the carrier gas at a flow rate of 8 g / h and fed into the plasma gas. The plasma is ignited with a voltage of 250 V, a frequency of 21 kHz and a power to cycle time of 100%. The nozzle moves over the stainless steel base body to be coated at a distance of 10 mm and a speed of 15 m / min. Test specimens for peel tests are then prepared as in Example 1. In addition to Compounds 5 and 6, the adhesion to Compound 8 with the base polymer HNBR is also tested here. Compound 8 is vulcanized at 180 °C for 10 minutes. Ingredient Category Compound 8 Zetpol® 2010 Rubber 100 N 772 Filler (Carbon black) 50 Zinc oxide Activator 3 Magnesium oxide Activator, acid scavenger,3 Heat stabilizer Deogum® 80 Processing aid 2 TRIM 70% Coagent 5 Peroxan® BIB-40 Crosslinking (peroxidic) 7 Table 9: Overview of the mixture composition used for mixture 8 (all values ​​in pHr) Mixture 5 Mixture 6 Mixture 8 Hardness of the elastomer mixture in Shore A 71 67 71 Failure pattern in the peel test 80 R 90 R 100 R (PE-DVD layer G on stainless steel) Table 10: Results of the adhesion test with plasma-coated stainless steel strips with different elastomer mixtures Example 9: Rubber-metal composites PE-DVD layer H is deposited using the atmospheric pressure plasma process, variant 2a. Air (30 l / min) is used as the plasma gas, and nitrogen (8 l / min) as the carrier gas. MTMO is used as the precursor material, heated to 200 °C, and mixed with the carrier gas at a flow rate of 10 g / h, then added to the plasma gas. The plasma is circulated at a voltage of 250 V.a frequency of 21 kHz and a power to cycle time of 100%. The nozzle moves over the base body to be coated at a distance of 10 mm and a speed of 15 m / min for coating. Base bodies made of PA 66 with 30% glass fibers (PA66 GF) with dimensions of 25 mm x 100 mm (width x length) are now coated. The test specimens are manufactured with mixture 7, based on the polymer FKM. The peel test specimens fail in the elastomer; the failure pattern is 100 R. Example 10: Rubber-metal composites PE-DVD layer I is deposited using the atmospheric pressure plasma process, variant 2a. Air (30 l / min) is used as the plasma gas, and nitrogen (8 l / min) as the carrier gas. GLYMO (CAS No. 2530-83-8) is used as the precursor material, heated to 180 °C, and mixed with the carrier gas at a flow rate of 5 g / h, then added to the plasma gas. The plasma is circulated at a voltage of 250 V.a frequency of 21 kHz and a power to cycle time of 35%. The nozzle moves over the substrate to be coated at a distance of 15 mm and a speed of 10 m / min for coating. Substrates made of the aforementioned stainless steel are coated. The test specimens are manufactured using Compound 5. The peel test specimens fail in the elastomer, with a failure pattern of 100 R. Example 11: Rubber-metal composites. PE-DVD layer J is deposited using the atmospheric pressure plasma process, variant 2a. Air (30 l / min) is used as the plasma gas, and air (8 l / min) is also used as the carrier gas. VEOS (CAS No. 78-08-0) is used as the precursor material, heated to 100 °C, and mixed with the carrier gas at a flow rate of 15 g / h, and then added to the plasma gas. The plasma is applied at a voltage of 280 V.a frequency of 23 kHz and a power-to-cycle time of 40%. The nozzle moves at a distance of 20 mm and a speed of 20 m / min over the substrate to be coated. The offset of the tracks is 4 mm. Substrates made of PA 66 with 30% glass fibers (PA66 GF) with dimensions of 25 mm x 100 mm (width x length) are then coated. The test specimens are manufactured with Compound 7. The peel test specimens fail in the elastomer,the failure pattern is 100 R. Example 12: Chemical composition The PE-CVD layers G and H are deposited using process 2a on PA66 GF and additionally on stainless steel and examined using X-ray photoelectron spectroscopy (XPS). Percentage Percentage Si Percentage C Percentage O Adhesive layer other [at%] [at%] [at%] [at%] G (on stainless steel) 12 45 43 G (on PA66GF) 13 47 37 3 H (on stainless steel) 15 41 39 4 (sulfur) H (on PA66GF) 16 38 43 4 (sulfur) Table 11: Chemical composition of the adhesion promoter surfaces Example 13: Metal-elastomer composites The coating processes for PE-CVD layer A and PE-CVD layer B are carried out analogously to Example 1. The stainless steel base bodies described in Example 1 are used as substrates. The test specimens are also manufactured analogously to Example 1. The following elastomer mixture variants,based on the base polymer EPDM are used: Ingredient Category Mixture 9 Mixture 10 (comparison mixture) Keltan® 2450 Rubber 100 100 N 550 Filler 100 (carbon black) N 990 Filler 15 (carbon black) Perkadox® BC- Crosslinking 8 8 40 (peroxidic) Zinc oxide Activator 3 3 TMQ Activator 2 2 Stearic acid Activator, 1 1 Dispersant Table 12: Overview of the mixture compositions used (all data in pHr). Mixture 9 (comparison Mixture 10 mixture) Hardness of the elastomer mixture in Shore A 52 85 Failure pattern in the peel test 0 R 100 R (PE-CVD layer A on stainless steel) Failure pattern in the peel test 0 R 100 R (PE-CVD layer B on stainless steel) Table 13: Shore hardness of the EPDM mixtures and results of the adhesion test with PE-CVD coated stainless steel strips It can be seen,that with elastomer mixtures with a Shore hardness in the range of the invention (mixture 10) in combination with the PE-CVD layers A and B, significantly better failure patterns and thus adhesion results are achieved.

Claims

PATENT CLAIMS 1. A composite material comprising a substrate layer and a polymer layer, wherein the polymer layer and substrate layer are directly bonded to one another by an adhesion promoter layer, and wherein the adhesion promoter layer is obtainable by plasma-enhanced chemical vapor deposition (PE-CVD), in which a precursor material containing at least one organosilicon compound is used at least in part, characterized in that the polymer layer has a Shore hardness, measured according to DIN ISO 7619-1: 2021-02, Shore A, 23°C, of 60 to 95 Shore A.

2. The composite material according to claim 1, wherein the substrate layer has regions that are directly bonded to the polymer layer by the adhesion promoter layer and other regions that are not bonded to the polymer layer. 3.The composite material according to claim 1 or 2, wherein the substrate layer is a metal layer, wherein the metal layer comprises at least one metal selected from the group consisting of iron, iron alloys, in particular steel, aluminum, aluminum alloys, copper, copper alloys, in particular brass, nickel, nickel alloys, titanium, titanium alloys, and mixtures thereof.

4. The composite material according to claim 1 or 2, wherein the substrate layer is a plastic layer, wherein the plastic layer comprises at least one thermoplastic selected from the group consisting of polyamide, polyphenylene sulfide, polyester, and mixtures thereof.

5. Composite material according to at least one of the preceding claims, wherein the organosilicon compound is a silane, an organosilane, a siloxane, an alkoxysilane and / or mixtures thereof.

6. Composite material according to at least one of the preceding claims, wherein the organosilicon compound is a silane, an organosilane, a compound of the general formula (I) Y−[O−Si(-XZ)p(OY)m]n−O−Y or a crosslinked form thereof, or a cyclic form thereof, wherein for each Si atom concerned, m is 0 to 2, and p is 2-m, Z is selected from amino, preferably primary amino (-NH2), secondary amino, in particular (-NHCH3), tertiary amino, in particular (-N(CH3)2), (-N(CH2CH3)2); C1-C 14 -Carboxyl- (ie -C(=O)OR 1 with R 1 = C 1 - to C 14 -rest), preferably (-C(=O)OR 1 ) with R 1= C1-C12-Alkyl, C2-C12-Alkenyl, C5-C12 Aryl, C1- C12 Acryl, insbesondere C3-C12 Acryloxy, C3-C12 Acrylamino, C4-C12- Methacryl, insbesondere C4-C 12 -Methacryloxy, C4-C 12 - Methacrylamino, C4-C 12 -Maleat, C4-C 12 -Maleatanhydrid, C4-C 12 - Maleinimid; C1-C12-Carbonyl, insbesondere R 3 C(=O)- mit R 3 =H, C1- C3-Alkyl oder C1-C12-Aryl, dabei insbesondere Phenyl; C1-C 14 -Oxycarbonyl- (d.h. -O(C=O)R 2 mit R 2 = C1- bis C 14 -Rest), vorzugsweise (-O(C=O)R 2 ) mit R 2 = C1-C12-Alkyl, C2-C12-Alkenyl, dabei insbesondere C2-Alkenyl, C5-C12-Aryl, C3-C12-Acryl, insbesondere C3-C 12 -Acryloxy und C3-C 12 -Acrylamino, C4-C 12 - Methacryl, insbesondere C4-C 12 -Methacryloxy, C4-C 12 - Methacrylamino, C4-C 12 -Maleat, C4-C 12 -Maleatanhydrid, C4-C 12 - Maleinimid, C1-C12-Carbonyl, insbesondere R3 C(=O)- with R 3 =H, C1-C3-alkyl, C1-C12-aryl, especially phenyl; C1-C 14 -amide- (ie -NH(C=O)R 2 with R 2 = C1- to C 14 -rest), preferably (- NH(C=O)R 2 ) with R 2 = C1-C 12 -Alkyl, C2-C 12 -Alkenyl, in particular C2-alkenyl, C5-C12-aryl, C3-C12-acrylic, in particular C3- C 12 -Acryloxy and C3-C 12 -Acrylamino, C4-C 12 -Methacryl, especially C4-C 12 -Methacryloxy, C4-C 12 -Methacrylamino, C4-C 12 -Maleate, C4-C 12 - Maleate anhydride, C4-C12 maleimide, C1-C12 carbonyl, especially R 3 C(=O)- with R 3 =H, C1-C3 alkyl, C1-C 12 -aryl, in particular phenyl; C1-C12-alkyl, preferably methyl, ethyl, propyl; C2-C12-alkenyl, preferably C2-C6-alkenyl, in particular vinyl; C1-C 12 -Aldehyde, C1-C 12 -Peroxo, C1-C 12 -Mercapto, C1-C 12 -Thiocyanato, C3- C12 -Glycidyl ether, C2-C 12 -Epoxy-, especially C3-C 12 -Acryloxy-, C4-C12-Methacryloxy-; X represents a linker, preferably selected from C1-C 5- Alkylene, in particular methylene, ethylene, propylene, C5-C8 arylene, C3-C6 ethers, C3-C6 thioethers; Y independently represents C1-C5 alkyl, n represents an integer from 1 to 100, preferably 1 to 15, and / or mixtures thereof. n is particularly preferably 1.

7. Composite material according to at least one of the preceding claims, wherein the organosilicon compound is selected from - alkoxysilane selected from tetraethylorthosilicate (TEOS), (3-aminopropyl)triethoxysilane (APTES), vinyltriethoxysilane (VEOS), 3-methacryloxypropyltrimethoxysilane (MEMO), (3-glycidyloxypropyl)trimethoxysilane (GLYMO), (3-mercaptopropyl)trimethoxysilane (MTMO), 3-thiocyanatopropyltriethoxysilane (TCPS), - siloxane selected from disiloxane, in particular hexamethyldisiloxane (HMDSO), and octamethyltrisiloxane, - silane selected from disilane (Si2H6) and trisilane (Si3H8), - organosilane selected from tetramethylsilane (TMS), and - mixtures thereof. 8.Composite material according to at least one of the preceding claims, wherein the surface of the adhesion promoter layer and / or the adhesion promoter layer as a whole contains: Si: 3 at% to 25 at%, in particular 4 at% to 20 at%, C: 25 at% to 90 at%, in particular 30 at% to 85 at%, O: 7 at% to 65 at%, in particular 15 at% to 50 at%, the sum of Si + C + O preferably being > 80 at%, the remainder preferably being H, N, S and optionally further elements from the substrate.

9. Composite material according to at least one of the preceding claims, wherein the polymer layer comprises at least one polymer selected from fluororubber (FKM), ethylene-propylene copolymers, such as ethylene-propylene-diene rubber (EPDM), polyacrylate rubber (ACM), ethylene-. Acrylate rubber (AEM), butadiene rubber, such as acrylonitrile-butadiene rubber (NBR), hydrogenated acrylonitrile-butadiene rubber (HNBR), styrene-butadiene rubber (SBR), silicone rubbers, natural rubber (NR), chloroprene rubber (CR), epichlorohydrin rubber (ECO), polyurethane and / or epoxy polymer. 10.Composite material according to at least one of the preceding claims, wherein the polymer layer is obtainable from the rubber FKM and the polymer layer has a filler content of at least 30 pHr, preferably at least 50 pHr, and / or wherein the polymer layer is obtainable from the rubbers ethylene-propylene copolymers, such as ethylene-propylene-diene rubber (EPDM), polyacrylate rubber (ACM), ethylene-acrylate rubber (AEM), butadiene rubber, such as acrylonitrile-butadiene rubber (NBR), hydrogenated acrylonitrile-butadiene rubber (HNBR), styrene-butadiene rubber (SBR), silicone rubbers, natural rubber (NR), chloroprene rubber (CR), epichlorohydrin rubber (ECO), polyurethane and / or epoxy polymers and the polymer layer has a filler content of at least 50 pHr, preferably has a pH of at least 60. 11.Composite material according to at least one of the preceding claims, wherein the connection between the polymer layer and the substrate layer is not a positive connection.

12. Composite material according to at least one of the preceding claims, wherein - the polymer layer is obtainable from the rubber FKM and the polymer layer has a filler content, in particular a carbon black content, of at least 30 pHr, preferably at least 50 pHr, and / or wherein the polymer layer is made from the rubbers ethylene-propylene copolymers, such as ethylene-propylene-diene rubber (EPDM), polyacrylate-. Rubber (ACM), ethylene acrylate rubber (AEM), butadiene rubber, such as acrylonitrile butadiene rubber (NBR), hydrogenated acrylonitrile butadiene rubber (HNBR), styrene butadiene rubber (SBR), silicone rubbers, natural rubber (NR), chloroprene rubber (CR), epichlorohydrin rubber (ECO), polyurethane and / or epoxy polymers, and the polymer layer has a filler content, in particular a carbon black content, of at least 50 pHr, preferably at least 60 pHr, and - the polymer layer has a plasticizer content, in particular natural or synthetic plasticizers, of 3 to 30 pHr, particularly preferably 5 to 15 pHr. 13.Sealing article, in particular selected from a flange seal, a plug-in connection, a metal O-ring, a valve seal, a liquid seal, an integrated static seal on a metallic or polymeric component, a mechanical seal, a radial shaft seal, a labyrinth shaft seal, a flat seal, a piston ring, a magnetic armature, a bellows, and a diaphragm seal, containing a composite material according to at least one of the preceding claims. 14.A method for producing a composite material or a sealing article according to at least one of the preceding claims, comprising the steps of: (e) providing the substrate layer, (f) coating the substrate layer with the adhesion promoter layer by plasma-enhanced chemical vapor deposition (PE-CVD), (g) applying a polymer compound which, upon crosslinking, can produce a polymer layer with a Shore hardness of 60 to 95 Shore, to the adhesion promoter layer, so that the substrate layer is at least partially provided with the polymer compound. (h) crosslinking the polymer compound to obtain a polymer layer having a Shore hardness of 60 to 95 Shore A, and wherein the adhesion promoter layer is preferably covalently bonded to the polymer layer.

15. The method according to claim 14, wherein the polymer compound is applied such that the substrate layer has regions provided with the polymer compound and other regions not provided with the polymer compound. 16.Use of a composite material according to at least one of claims 1 to 11 as a sealing article, in particular selected from a flange seal, a plug-in connection, a metal O-ring, a valve seal, a liquid seal, an integrated static seal on a metallic or polymeric component, a mechanical seal, a radial shaft seal, a labyrinth shaft seal, a flat seal, a piston ring, a magnetic armature, a bellows and a diaphragm seal, or for producing a sealing article.