Printing control device and printing control method

Abstract

A printing control device according to the present invention comprises an acquisition unit and a setting unit. The acquisition unit acquires the printed state of solder printed on a substrate through the openings of a stencil as a squeegee slides over the stencil. The setting unit sets the presence or absence of multiple printings, where the squeegee is slid multiple times to print the solder on the substrate, on the basis of the printed state of the solder acquired by the acquisition unit.

Description

Print control device and print control method

[0001] This specification discloses a technique relating to a print control device and a print control method.

[0002] The mode setting unit described in Patent Document 1 performs a process for setting a printing operation mode. The printing operation mode specifies whether a unidirectional printing pattern or a reciprocating printing pattern is to be executed. The unidirectional printing pattern involves performing only a unidirectional squeegeeing operation in either the forward or backward direction on a single substrate when starting work after replacing a new screen mask.

[0003] The reciprocating printing pattern involves squeegeeing in both the forward and backward directions. The screen printing device described in Patent Document 1 is preset in either a manual operation mode in which an operator manually selects between the unidirectional printing pattern and the reciprocating printing pattern, or an automatic mode in which the reciprocating printing pattern is automatically executed without operator operation.

[0004] JP 2013-141752 A

[0005] For example, if the volume of solder printed on the board is smaller than the allowable range, printing multiple times by sliding the squeegee multiple times to print the solder on the board may increase the solder volume and improve print quality. On the other hand, if the volume of solder printed on the board is larger than the allowable range, printing multiple times may further increase the solder volume and reduce print quality. In this way, the need for multiple printing may vary depending on the solder printing condition.

[0006] In view of the above circumstances, this specification discloses a print control device and a print control method that can set whether or not to perform multiple printing based on the printed state of the solder.

[0007] This specification discloses a print control device including an acquisition unit and a setting unit. The acquisition unit acquires a print state of solder printed on a substrate by sliding a squeegee over a stencil through an opening in the stencil. The setting unit sets whether or not to perform multiple printing, in which the solder is printed on the substrate by sliding the squeegee multiple times, based on the print state of the solder acquired by the acquisition unit.

[0008] This specification also discloses a printing control method including an acquisition step and a setting step. The acquisition step acquires the printing state of solder printed on a substrate through an opening in a stencil by sliding a squeegee over the stencil. The setting step sets whether or not to perform multiple printing, in which the solder is printed on the substrate by sliding the squeegee multiple times, based on the printing state of the solder acquired in the acquisition step.

[0009] This specification discloses the technical idea of ​​changing "the print control device according to claim 1" to "the print control device according to any one of claims 1 to 5" in claim 6 of the claims originally attached to the application (hereinafter referred to as "initial claims"). Also, this specification discloses the technical idea of ​​changing "the print control device according to claim 1" to "the print control device according to any one of claims 1 to 8" in claim 9 of the initial claims.

[0010] According to the above print control device, it is possible to set whether or not to print multiple times based on the printed state of the solder. What has been described above about the print control device can also be said about the print control method.

[0011] It is a block diagram showing an example of the configuration of a substrate-related work line. It is a partial cross-sectional view showing an example of the configuration of a printing press. It is a block diagram showing an example of a control block of a print control device. It is a flowchart showing an example of a control procedure by the print control device.

[0012] 1. Embodiment 1-1. Configuration Example of Substrate-Related Work Line WML In the substrate-related work line WML, a substrate-related work machine WM0 performs a predetermined substrate-related work on a substrate 90 to produce a product substrate 900. The substrate-related work line WML of the embodiment only needs to include a printer WM1, and the type and number of substrate-related work machines WM0 that make up the substrate-related work line WML are not limited. As shown in Figure 1, the substrate-related work line WML of the embodiment includes multiple (five) substrate-related work machines WM0: a printer WM1, a print inspection machine WM2, a component placement machine WM3, a reflow oven WM4, and a visual inspection machine WM5, and the substrate 90 is transported in this order by a substrate transport device.

[0013] The printer WM1 prints solder 80 at the mounting positions of multiple components on the board 90. The print inspection machine WM2 inspects the printing condition of the solder 80 printed by the printer WM1. The component mounting machine WM3 mounts multiple components on the board 90 on which the solder 80 has been printed by the printer WM1. There may be one or more component mounting machines WM3. When multiple component mounting machines WM3 are provided, the multiple component mounting machines WM3 can share the mounting work of multiple components.

[0014] The reflow furnace WM4 heats the board 90 on which multiple components have been mounted by the component mounting machine WM3, melting the solder 80 and performing soldering. The visual inspection machine WM5 inspects the mounting state of the multiple components mounted by the component mounting machine WM3. In this way, the board-related work line WML uses multiple (five) board-related work machines WM0 to sequentially transport the boards 90 and perform production processes including inspection processes to produce the product board 900. Note that the board-related work line WML can also be equipped with other board-related work machines WM0 as needed, such as a function inspection machine, a buffer device, a board supply device, a board inverting device, a shield mounting device, an adhesive application device, and an ultraviolet irradiation device.

[0015] The plurality (five) of substrate-related performing machines WM0 and the control device WMC that make up the substrate-related performing line WML are communicatively connected by a communication unit LC0. The communication unit LC0 may perform communication via a wired connection or wirelessly. Various communication methods are possible. In this embodiment, the plurality (five) of substrate-related performing machines WM0 and the control device WMC form a local area network (LAN). This allows the plurality (five) of substrate-related performing machines WM0 to communicate with each other via the communication unit LC0. Furthermore, the plurality (five) of substrate-related performing machines WM0 can communicate with the control device WMC via the communication unit LC0.

[0016] The management device WMC controls the plurality (five) of substrate-related performing machines WM0 that make up the substrate-related performing line WML and monitors the operating status of the substrate-related performing line WML. The management device WMC stores various control data for controlling the plurality (five) substrate-related performing machines WM0. The management device WMC transmits the control data to each of the plurality (five) substrate-related performing machines WM0. Furthermore, each of the plurality (five) substrate-related performing machines WM0 transmits its operating status and production status to the management device WMC.

[0017] The management device WMC may be provided with a data server DSV. The data server DSV may store, for example, acquired data acquired by the substrate-related performing machine WM0 regarding substrate-related performing operations. For example, the acquired data may include various image data captured by the substrate-related performing machine WM0. The acquired data may also include records (log data) of the operating status acquired by the substrate-related performing machine WM0.

[0018] The data server DSV can also store various production information related to the production of the board 90. For example, component data such as information on the shape of each component type, information on electrical characteristics, and information on how to handle the components are included in the production information. Furthermore, the inspection results obtained by inspection machines such as the print inspection machine WM2 and the appearance inspection machine WM5 are included in the acquired data as well as in the production information.

[0019] 1-2. Configuration Example of Printer WM1 In the printer WM1 of this embodiment, the squeegee 34 slides over the stencil 70 to print solder 80 onto the substrate 90 through the openings 71 in the stencil 70. As shown in FIG. 2 , the printer WM1 of this embodiment includes a substrate transport device 10, a stencil support device 20, a squeegee moving device 30, a control device 40, and a display device 41. In this specification, the transport direction of the substrate 90 (the direction perpendicular to the paper surface of FIG. 2 ) is defined as the X-axis direction. Furthermore, the direction perpendicular to the X-axis direction in the horizontal plane (XY plane) (the front-to-rear direction of the printer WM1, the left-to-right direction on the paper surface of FIG. 2 ) is defined as the Y-axis direction. Furthermore, the vertical direction perpendicular to the X-axis direction and the Y-axis direction (the up-to-down direction on the paper surface of FIG. 2 ) is defined as the Z-axis direction.

[0020] The board transfer device 10 transfers a board 90 to be printed. The board 90 is a circuit board on which various circuits such as electronic circuits, electric circuits, and magnetic circuits are formed. The board transfer device 10 is provided on a base BS1 of the printing machine WM1. The board transfer device 10 transfers the board 90, for example, by a belt conveyor extending in the X-axis direction.

[0021] The substrate transport device 10 includes a substrate holding unit 11 that holds the substrate 90 that has been carried into the printing machine WM1. The substrate holding unit 11 is provided below the stencil 70 and is configured to be able to move up and down in the Z-axis direction by, for example, a linear motion mechanism such as a feed screw mechanism. Specifically, the substrate holding unit 11 is lowered when the substrate 90 is transported, and when the substrate 90 is transported to a predetermined position, it rises together with the substrate 90 and holds the substrate 90 with the upper surface of the substrate 90 in close contact with the lower surface of the stencil 70.

[0022] The stencil support device 20 is provided above the substrate transfer device 10. The stencil support device 20 supports the stencil 70 using a pair of support tables. The pair of support tables are arranged on the left side (the far side of the paper in FIG. 2 and shown in the figure) and the right side (the near side of the paper in FIG. 2 and not shown in the figure) of the printing machine WM1 when viewed from the front, and are formed to extend along the Y-axis direction.

[0023] 2 is a partial cross-sectional view of the printer WM1 taken along the Y-axis direction, and schematically shows the interior of the printer WM1 as viewed from the side, as well as cross sections of the stencil 70 and the substrate 90. The stencil 70 has openings 71 formed therethrough at predetermined positions on the wiring pattern of the substrate 90. The stencil 70 is supported by the stencil support device 20, for example, via a frame member provided on the outer periphery.

[0024] The squeegee moving device 30 raises and lowers the squeegee 34 in a direction perpendicular to the stencil 70 (Z-axis direction), and moves the squeegee 34 in the Y-axis direction on the top surface of the stencil 70. The squeegee moving device 30 includes a head driving device 31, a squeegee head 32, a pair of lifting devices 33, 33, and a pair of squeegees 34, 34. The head driving device 31 is disposed on the upper side of the printing machine WM1. The head driving device 31 can move the squeegee head 32 in the Y-axis direction by, for example, a linear motion mechanism such as a feed screw mechanism.

[0025] The squeegee head 32 is clamped and fixed to a moving body that constitutes the linear motion mechanism of the head drive device 31. The squeegee head 32 holds a pair of lifting devices 33, 33. Each of the pair of lifting devices 33, 33 holds a squeegee 34 and can be driven independently of each other. Each of the pair of lifting devices 33, 33 drives an actuator such as an air cylinder to raise and lower the squeegee 34 that it holds.

[0026] The squeegee 34 slides over the upper surface of the stencil 70, moving the solder 80 supplied to the upper surface of the stencil 70 along the stencil 70. Cream solder (solder paste) can be used as the solder 80. The solder 80 is imprinted onto the substrate 90 through the openings 71 in the stencil 70, and the solder 80 is printed on the substrate 90 arranged on the lower surface side of the stencil 70. In this embodiment, each of the pair of squeegees 34, 34 is a plate-like member formed to extend along a width direction (X-axis direction) perpendicular to the printing direction (Y-axis direction) in a horizontal plane (XY plane).

[0027] The front squeegee 34 (on the left side of FIG. 2 ) of the pair of squeegees 34 is used in a printing process that moves the solder 80 from the front side to the rear side, with the direction from the front side to the rear side of the printer WM1 being the traveling direction. The rear squeegee 34 (on the right side of FIG. 2 ) of the pair of squeegees 34 is used in a printing process that moves the solder 80 from the rear side to the front side, with the direction from the rear side to the front side of the printer WM1 being the traveling direction. Furthermore, for both squeegees 34, the direction opposite to the traveling direction is the retreating direction.

[0028] Each of the pair of squeegees 34, 34 is held by the lifting device 33 at an inclination such that the front portion located on the traveling direction side faces downward. In other words, each of the pair of squeegees 34, 34 is held by the lifting device 33 at an inclination such that the back portion located on the retreating direction side faces upward. The inclination angle of each of the pair of squeegees 34, 34 can also be adjusted by an adjustment mechanism provided below the lifting device 33.

[0029] The control device 40 includes a known arithmetic unit and storage device, and forms a control circuit. The control device 40 is communicably connected to the management device WMC via the communication unit LC0 shown in FIG. 1, and can send and receive various data. The control device 40 can drive and control the substrate transport device 10, stencil support device 20, squeegee moving device 30, and display device 41 based on the production program, detection results of various sensors, etc.

[0030] As shown in Figure 3, the control device 40 is provided with a storage device 60. The storage device 60 can be, for example, a magnetic storage device such as a hard disk drive, or a storage device using semiconductor elements such as flash memory. The storage device 60 stores a production program for driving the printing press WM1, etc. The control device 40 acquires various pieces of information stored in the storage device 60 and detection results of various sensors provided in the printing press WM1.

[0031] The control device 40, for example, drives and controls the squeegee moving device 30. The control device 40 sends a control signal to the squeegee moving device 30 based on the above-mentioned various information and detection results, etc. This controls the Y-axis position, Z-axis position (height), and movement speed of the pair of squeegees 34, 34 held by the squeegee head 32. Then, as described above, the pair of squeegees 34, 34 are driven and controlled, and solder 80 is printed on the substrate 90 arranged on the underside of the stencil 70.

[0032] As shown in Figures 2 and 3, the control device 40 is provided with a display device 41. The display device 41 can display the operating status of the printing press WM1. The display device 41 is also configured as a touch panel and functions as an input device that accepts various operations by the operator. The operator can learn the operating status of the printing press WM1 via the display device 41. The operator can also set the printing press WM1, give instructions to the printing press WM1, and so on via the display device 41.

[0033] 1-3. Configuration example of print control device 50 For example, if the volume of solder 80 printed on the substrate 90 is smaller than the allowable range, performing multiple printing by sliding the squeegee 34 multiple times to print the solder 80 on the substrate 90 may increase the volume of the solder 80 and improve print quality. On the other hand, if the volume of solder 80 printed on the substrate 90 is larger than the allowable range and multiple printing is performed, the volume of the solder 80 may increase further, potentially degrading print quality. In this way, the need for multiple printing may vary depending on the printing state of the solder 80.

[0034] Therefore, the substrate-related work line WML of the embodiment is provided with a print control device 50. The print control device 50 makes it possible to set whether or not to perform multiple printing based on the printing state of the solder 80. Specifically, when considered as a control block, the print control device 50 includes an acquisition unit 51 and a setting unit 52. The print control device 50 can also include a memory unit 53. As shown in FIG. 3 , the print control device 50 of the embodiment includes the acquisition unit 51, the setting unit 52, and the memory unit 53.

[0035] The acquisition unit 51, the setting unit 52, and the memory unit 53 can be provided in various control devices, such as the control device of the substrate-related performing machine WM0, and various management devices, such as the management device WMC. For example, at least one of the acquisition unit 51, the setting unit 52, and the memory unit 53 can be provided in the control device 40 of the printing machine WM1. At least one of the acquisition unit 51, the setting unit 52, and the memory unit 53 can also be provided in the management device WMC. At least one of the acquisition unit 51, the setting unit 52, and the memory unit 53 can also be formed on the cloud. The acquisition unit 51, the setting unit 52, and the memory unit 53 can also be distributed among various control devices, various management devices, on the cloud, etc.

[0036] As shown in FIG. 3, in the print control device 50 of this embodiment, an acquisition unit 51, a setting unit 52, and a storage unit 53 are provided in the control device 40 of the printer WM1. The print control device 50 can also execute control in accordance with the flowchart shown in FIG. 4. The acquisition unit 51 performs the process shown in step S11. The setting unit 52 makes the determinations and performs the processes shown in steps S12 to S14. The storage unit 53 performs the process shown in step S15. The matters described in this specification can be selected and applied as appropriate. The matters described in this specification can also be combined as appropriate.

[0037] 1-3-1. Acquisition Unit 51, Setting Unit 52, and Storage Unit 53 Acquisition unit 51 acquires the printing state of solder 80 printed on substrate 90 by sliding squeegee 34 over stencil 70 through opening 71 of stencil 70 (step S11 shown in FIG. 4). Furthermore, setting unit 52 sets whether or not to perform multiple printing, in which solder 80 is printed on substrate 90 by sliding squeegee 34 multiple times, based on the printing state of solder 80 acquired by acquisition unit 51 (steps S12 to S14 shown in FIG. 4).

[0038] The acquisition unit 51 may take various forms as long as it can acquire the printing state of the solder 80 for multiple printing. As described above, if the volume of the solder 80 printed on the substrate 90 is smaller than the allowable range, printing multiple times may increase the volume of the solder 80 and improve the print quality. What has been described above regarding the volume of the solder 80 also applies to the area and height of the solder 80.

[0039] Therefore, the acquisition unit 51 can acquire a printing defect in which at least one of the volume, area, and height of the solder 80 printed on the board 90 is less than the allowable range. The allowable range can be set arbitrarily. For example, the allowable range can be set to the same as the allowable range for inspection by the print inspection machine WM2. For example, the acquisition unit 51 can acquire the above printing defect using an inspection device equivalent to the print inspection machine WM2 provided on the printer WM1. The acquisition unit 51 can also acquire the above printing defect using the print inspection machine WM2.

[0040] For example, the acquisition unit 51 can irradiate the solder 80 printed on the substrate 90 with moiré fringe light, capture the reflected light with an imaging device, and acquire the above-mentioned printing defect based on the phase difference of the reflected light (phase shift method). The acquisition unit 51 can also capture images of the solder 80 printed on the substrate 90 from multiple directions with an imaging device, reconstruct a three-dimensional shape from the captured parallax images, and acquire the above-mentioned printing defect (stereo camera method). Furthermore, the acquisition unit 51 can irradiate the solder 80 printed on the substrate 90 with laser light, reconstruct a three-dimensional shape, and acquire the above-mentioned printing defect (light cutting method).

[0041] The acquisition unit 51 can also measure two-dimensional or three-dimensional shape profiles. For example, the acquisition unit 51 can use a three-dimensional profile sensor FC1 capable of measuring at least the volume of the solder 80 printed on the substrate 90 to acquire printing defects including volume deficiency, where the volume of the solder 80 is less than the allowable range. The acquisition unit 51 can also use the three-dimensional profile sensor FC1 to acquire printing defects including area deficiency, where the area of ​​the solder 80 is less than the allowable range. The acquisition unit 51 can also use the three-dimensional profile sensor FC1 to acquire printing defects including height deficiency, where the height of the solder 80 is less than the allowable range.

[0042] The three-dimensional profile sensor FC1 may be any known sensor capable of measuring at least the volume of the solder 80 printed on the substrate 90. Instead of the three-dimensional profile sensor FC1, the acquisition unit 51 may use an imaging device capable of acquiring two-dimensional images to acquire printing defects, such as an insufficient area of ​​the solder 80, where the area of ​​the solder 80 is smaller than the allowable range. For example, the acquisition unit 51 may acquire the area of ​​the solder 80 by processing the image of the solder 80 captured by the imaging device. In an embodiment, the acquisition unit 51 or the imaging device is provided in the printer WM1. Therefore, the acquisition unit 51 can acquire printing defects within the same printer WM1 without removing the substrate 90 from the printer WM1 after the first printing. The printer WM1 can then perform multiple printing operations within the same printer WM1 as needed.

[0043] 2, the three-dimensional profile sensor FC1 is provided below the stencil 70 and can be moved in the X-axis and Y-axis directions by, for example, an XY table. This allows the three-dimensional profile sensor FC1 to move linearly above the substrate 90 on which the solder 80 is printed and acquire printing defects. Specifically, after the first printing is performed, the acquisition unit 51 lowers the substrate holding unit 11 and moves the substrate 90 on which the solder 80 is printed downward in the vertical direction (Z-axis direction).

[0044] The acquisition unit 51 can acquire printing defects by linearly moving the three-dimensional profile sensor FC1 while the substrate 90 is moving downward in the vertical direction (Z-axis direction). When a printing defect is acquired by the acquisition unit 51 and the printer WM1 performs multiple printings, the control device 40 raises the substrate holding unit 11 together with the substrate 90 and causes the substrate holding unit 11 to hold the substrate 90 with the upper surface of the substrate 90 in close contact with the lower surface of the stencil 70. The control device 40 can then perform multiple printings (second and subsequent printings) on the substrate 90 held by the substrate holding unit 11. The above-described method for driving the three-dimensional profile sensor FC1 can also be applied to an imaging device capable of acquiring two-dimensional images.

[0045] A printing defect in which the printed state of the solder 80 falls below the allowable range (for example, a printing defect in which at least one of the volume, area, and height of the solder 80 is less than the allowable range, as described above) can occur even in normal printing, and the timing at which the acquisition unit 51 acquires the printing defect is not limited. In particular, after cleaning the stencil 70, the amount of solder 80 remaining in the openings 71 may be reduced compared to before cleaning. Furthermore, after cleaning the stencil 70, the solder 80 remaining in the openings 71 is likely to dry, and the fluidity of the solder 80 may be reduced compared to before cleaning.

[0046] As a result, there is a possibility that printing defects will occur in which the printed state of the solder 80 falls below the acceptable range for a predetermined number of boards 90 on which printing is performed after cleaning of the stencil 70. Therefore, it is preferable that the acquisition unit 51 acquires the printed state of the solder 80 for a target board 90t, which is at least one board 90 on which printing is performed after cleaning of the stencil 70, and the setting unit 52 sets whether or not to perform multiple printing on the target board 90t. This allows the setting unit 52 to appropriately set multiple printing depending on the printed state of the solder 80 on the target board 90t.

[0047] The setting unit 52 can set to perform printing multiple times when the acquisition unit 51 acquires a printing defect in which the printed state of the solder 80 has fallen below an acceptable range, and can set to not perform printing multiple times when the acquisition unit 51 does not acquire a printing defect (steps S12 to S14). Specifically, the setting unit 52 determines whether the acquisition unit 51 has acquired a printing defect in which the printed state of the solder 80 has fallen below an acceptable range (the predetermined printing defect in FIG. 4 ) (step S12).

[0048] For example, the setting unit 52 determines whether the acquiring unit 51 has acquired a printing defect in which at least one of the volume, area, and height of the solder 80 printed on the substrate 90 is below the allowable range. If the acquiring unit 51 has acquired a predetermined printing defect (Yes in step S12), the setting unit 52 sets a setting to perform printing multiple times (step S13). The multiple printing can be performed as long as the solder 80 can be printed on the substrate 90 by sliding the squeegee 34 multiple times, and the printing direction and the number of times it is performed are not limited.

[0049] For example, the multiple printing may be reciprocating printing in which the printing process is performed by moving the solder 80 using both of the pair of squeegees 34, 34 shown in Fig. 2, or unidirectional printing in which the printing process is performed by moving the solder 80 using one of the pair of squeegees 34, 34. In reciprocating printing, for example, after a printing process is performed in which the solder 80 is moved from the front side to the rear side using the squeegee 34 on the front side (left side of the paper in Fig. 2), a printing process is performed in which the solder 80 is moved from the rear side to the front side using the squeegee 34 on the rear side (right side of the paper in Fig. 2).

[0050] In unidirectional printing, for example, a printing process is performed in which the solder 80 is moved from the front side to the rear side using the squeegee 34 on the front side (left side of the paper in FIG. 2 ), followed by a printing process in which the solder 80 is collected using a solder recovery plate and then moved again from the front side to the rear side using the front squeegee 34. In unidirectional printing, a printing process is performed in which the solder 80 is moved from the rear side to the front side using the squeegee 34 on the rear side (right side of the paper in FIG. 2 ), followed by a printing process in which the solder 80 is collected using a solder recovery plate and then moved again from the rear side to the front side using the rear squeegee 34. Note that reciprocating printing can also move the solder 80 using a single squeegee 34. Furthermore, multiple printing can be performed using both reciprocating printing and unidirectional printing.

[0051] If the acquisition unit 51 does not acquire any predetermined printing defects (No in step S12), the printed state of the solder 80 is within the acceptable range (for example, the volume, area, and height of the solder 80 are all within the acceptable range), and multiple printing is not necessary. Therefore, if the acquisition unit 51 does not acquire any predetermined printing defects (No in step S12), the setting unit 52 sets the printing to not be performed multiple times (step S14). In this case, the control device 40 can remove the board 90 that has been printed the first time from the printer WM1 without performing multiple printing.

[0052] As in the case of defective printing, the acquisition unit 51 can also acquire information that the printed state of the solder 80 has become good printing within the acceptable range after multiple printings. In this embodiment, the acquisition unit 51 is provided in the printer WM1. Therefore, the acquisition unit 51 can acquire information that the printing state has changed from bad printing to good printing within the printer WM1 while multiple printings are being performed (e.g., between the Nth (N is a natural number greater than or equal to 2) printing and the N+1th printing). When the acquisition unit 51 acquires information that the printing state has changed from good printing to bad printing, the setting unit 52 can change the setting to not perform multiple printing and terminate the multiple printing. The number of multiple printings (the number of required multiple printings) is included in the control parameters described below, stored in the memory unit 53, and can be used as learning data.

[0053] For example, the acquisition unit 51 acquires the printing status of the solder 80 for the first target board 90t to be printed on after cleaning the stencil 70. If the acquisition unit 51 acquires a printing defect for the first target board 90t, the setting unit 52 sets the printer WM1 to print multiple times. Then, the printer WM1 prints multiple times on the first target board 90t. If the acquisition unit 51 acquires a good printing result while printing multiple times, the setting unit 52 changes the setting to not print multiple times. Then, the printer WM1 carries the first target board 90t out of the printer.

[0054] By performing multiple printing operations on the first target substrate 90t, the amount of solder 80 remaining in the openings 71 of the stencil 70 may be restored to the same level as before cleaning. Similarly, the fluidity of the solder 80 remaining in the openings 71 of the stencil 70 may be restored to the same level as before cleaning. Therefore, the target substrate 90t may be set to, for example, one substrate. Furthermore, the rate of reduction in the volume of the solder 80 after cleaning the stencil 70 may vary depending on, for example, the shape of the lands on the substrate 90 (the shape of the openings 71 of the stencil 70), the type of surface treatment of the openings 71, the properties of the solder 80 (e.g., viscosity), the cleaning method of the stencil 70, etc.

[0055] The difference in the rate of decrease in the volume of the solder 80 is due to the difference in the flow resistance of the solder 80 in the opening 71. Therefore, it may be better to perform printing multiple times on the second and subsequent target substrates 90t on which printing is to be performed after cleaning the stencil 70. In this case, the acquisition unit 51 can acquire the printing state of the solder 80 for the second and subsequent target substrates 90t on which printing is to be performed after cleaning the stencil 70, in the same way as for the first target substrate 90t. Then, the setting unit 52 can set whether or not to perform printing multiple times based on the printing state of the solder 80 acquired by the acquisition unit 51.

[0056] When the acquisition unit 51 no longer detects any printing defects for the target substrate 90t immediately after it has been loaded into the printer WM1 on which multiple printings have not been performed, the setting unit 52 can set the target substrate 90t not to be printed multiple times and terminate control by the print control device 50. The print control device 50 can also terminate control a specified number of times after the acquisition unit 51 no longer detects any printing defects for the target substrate 90t immediately after it has been loaded into the printer WM1 on which multiple printings have not been performed. In this case, the print control device 50 can confirm that the acquisition unit 51 has not detected any printing defects for the specified number of substrates 90.

[0057] In other words, the print control device 50 can infer that the amount of solder 80 remaining in the openings 71 of the stencil 70 has recovered to the same level as before cleaning. Furthermore, the print control device 50 can infer that the fluidity of the solder 80 remaining in the openings 71 of the stencil 70 has recovered to the same level as before cleaning. In this way, the acquisition unit 51 acquires the printing state of the solder 80 for the target substrate 90t, which is at least one substrate 90 on which printing is to be performed after cleaning of the stencil 70, and the setting unit 52 can set whether or not to perform multiple printing operations on the target substrate 90t.

[0058] The setting unit 52 can set control parameters for printing the solder 80 on the board 90 on which printing is performed multiple times (step S13). The control parameters may be the same as or different from those when printing is not performed multiple times. For example, the setting unit 52 can set control parameters so as to improve a printing defect in which the printed state of the solder 80 falls below an acceptable range. This makes it easier to improve the printing defect. The setting unit 52 can also set control parameters so that printing can be performed appropriately multiple times. The control parameters are not limited as long as they relate to control when printing the solder 80.

[0059] For example, when the printing pressure when printing the solder 80 is set higher than when printing is not performed multiple times, a printing defect in which the printed state of the solder 80 falls below the allowable range is more easily corrected. Specifically, a printing defect in which at least one of the volume, area, and height of the solder 80 printed on the substrate 90 is less than the allowable range is corrected, and at least one of the volume, area, and height of the solder 80 printed on the substrate 90 is more likely to fall within the allowable range. Similarly, when the printing speed when printing the solder 80 is set slower than when printing is not performed multiple times, a printing defect in which the printed state of the solder 80 falls below the allowable range is more easily corrected.

[0060] Furthermore, by appropriately setting the number of times that multiple printing is performed, it becomes easier to improve printing defects in which the printed state of the solder 80 falls below an acceptable range. Furthermore, if the tilt angle of the squeegee 34 when printing the solder 80 (the angle of the squeegee 34 with respect to the stencil 70) is set smaller than when multiple printing is not performed, it becomes easier to improve printing defects in which the printed state of the solder 80 falls below an acceptable range. Therefore, it is preferable that the control parameter be at least one of the printing pressure, printing speed, number of times that multiple printing is performed, and tilt angle of the squeegee 34 when printing the solder 80.

[0061] The printing press WM1 may have a function to automatically adjust the tilt angle of each of the pair of squeegees 34, 34 by drive control of the control device 40. In this case, the tilt angle of the squeegee 34 can be included in the control parameters. Specific parameter values ​​of the control parameters can be obtained, for example, by simulation or verification using an actual machine. The parameter values ​​of the control parameters used for multiple printings can be stored in the storage unit 53 and can be used as learning data.

[0062] The storage unit 53 stores, in association with each other, board identification information for identifying the board 90, used component identification information for identifying the components 100 used when printing the solder 80 on the board 90 and including the stencil 70, and the presence or absence of multiple printing set by the setting unit 52 (step S15). This allows, for example, an operator or the management device WMC to track and investigate the used components 100 including the stencil 70 and the presence or absence of multiple printing when a printing defect is found on the product board 900.

[0063] Furthermore, for example, the operator or the management device WMC can estimate whether multiple printing is required when a printing process is performed on the same type of board 90 as the board 90 stored in the memory unit 53 using the same type of materials 100. For example, assume a case where a printing process is performed on the same type of board 90 as the board 90 that requires multiple printing stored in the memory unit 53 using the same type of materials 100. In this case, for example, at least the first target board 90t to be printed after cleaning the stencil 70 can be printed multiple times without acquiring the printing state of the solder 80 by the acquisition unit 51.

[0064] The used component 100 may include various components used when printing the solder 80 on the substrate 90, in addition to the stencil 70. For example, the solder 80 is included in the used component 100. Furthermore, the substrate identification information can be obtained from the substrate 90 using, for example, a one-dimensional code, a two-dimensional code, or the like. Similarly, the used component identification information can be obtained from the used component 100 using, for example, a one-dimensional code, a two-dimensional code, a wireless tag, or the like.

[0065] The storage unit 53 may take various forms as long as it can store the board identification information, used component identification information, and whether or not multiple printing has occurred in association with each other. For example, the storage unit 53 may store the board identification information, used component identification information, and whether or not multiple printing has occurred in association with each other in the storage device 60. The storage unit 53 may also store the board identification information, used component identification information, and whether or not multiple printing has occurred in association with each other in the data server DSV. The storage unit 53 may also store the board identification information, used component identification information, and whether or not multiple printing has occurred in association with each other on the cloud.

[0066] The storage unit 53 can also store the parameter values ​​of the control parameters used in multiple printings in association with the above information. By utilizing this information as learning data, for example, an operator or the management device WMC can reduce the work of adjusting the parameter values ​​of the control parameters. In this way, once the storage unit 53 has stored the specified information, including whether multiple printings were performed, control by the print control device 50 is temporarily terminated. Control by the print control device 50 can be repeatedly executed at a specified interval.

[0067] 1-3-2. Other Forms As already described, the acquisition unit 51, setting unit 52, and storage unit 53 can be arranged in various control devices, various management devices, on the cloud, etc. Furthermore, the acquisition unit 51, setting unit 52, and storage unit 53 can also be distributed and arranged in various control devices, various management devices, on the cloud, etc. For example, the acquisition unit 51 can be provided in the print inspection machine WM2, and the setting unit 52 can be provided in the control device 40 of the printing machine WM1 or in the management device WMC.

[0068] In the above embodiment, for example, when the first target substrate 90t to be printed after cleaning the stencil 70 is loaded into the printer WM1, the first printing is performed. Then, when the first target substrate 90t is loaded from the printer WM1 and into the print inspection machine WM2, the acquisition unit 51 acquires the printing state of the solder 80. If the acquisition unit 51 acquires a printing defect for the first target substrate 90t, the setting unit 52 sets the printing to be performed multiple times. In this case, the printer WM1 performs printing multiple times on the second target substrate 90t that is loaded into the printer WM1 next.

[0069] Then, when the second target board 90t is carried out from the printer WM1 and carried into the print inspection machine WM2, the acquisition unit 51 acquires the printing state of the solder 80. The same applies to the third and subsequent target boards 90t. Note that, for example, if a printing defect is acquired for the first target board 90t, the first target board 90t can be determined to be a defective board without undergoing multiple printing operations, or multiple printing operations can be separately performed. The same applies to the case where a printing defect is acquired for the second and subsequent target boards 90t.

[0070] As already described, it is assumed that printing is performed using the same type of materials 100 on the same type of substrate 90 as the substrate 90 that requires multiple printing operations and that is stored in the memory unit 53. In this case, for example, at least the first target substrate 90t to be printed on after cleaning the stencil 70 can be printed multiple times in the printer WM1 without acquiring the printing state of the solder 80 by the acquisition unit 51.

[0071] As described above, the setting unit 52 can set whether or not to print multiple times for a predetermined number of boards 90, including the board 90 for which the printing state of the solder 80 has been acquired by the acquisition unit 51 (a configuration in which the acquisition unit 51 is provided in the printer WM1). The setting unit 52 can also set whether or not to print multiple times for a predetermined number of boards 90 that will be carried into the printer WM1 after the board 90 for which the printing state of the solder 80 has been acquired by the acquisition unit 51 (a configuration in which the acquisition unit 51 is provided other than the printer WM1). Furthermore, the setting unit 52 can also set whether or not to print multiple times for a predetermined number of boards 90 based on the printing state of the solder 80 previously acquired by the acquisition unit 51 (a configuration in which acquisition of the printing state of the solder 80 by the acquisition unit 51 is omitted).

[0072] 2. Printing Control Method What has already been described about the printing control device 50 also applies to the printing control method. Specifically, the printing control method includes an acquisition step and a setting step. The acquisition step corresponds to the control performed by the acquisition unit 51. The setting step corresponds to the control performed by the setting unit 52. The printing control method may also include a storage step. The storage step corresponds to the control performed by the storage unit 53. Note that duplicated explanations will be omitted in this specification.

[0073] 3. Example of Effects of the Embodiment According to the print control device 50, it is possible to set whether or not to print multiple times based on the print state of the solder 80. What has been described above about the print control device 50 also applies to the print control method.

[0074] 34: Squeegee, 50: Print control device, 51: Acquisition unit, 52: Setting unit, 53: Memory unit, 70: Stencil, 71: Opening, 90: Substrate, 90t: Target substrate, 100: Members used, FC1: Three-dimensional profile sensor.

Claims

1. An acquisition unit that slides a squeegee over a stencil and acquires a printing state of solder printed on a substrate through an opening of the stencil; and a setting unit that sets whether to perform multiple printing of sliding the squeegee a plurality of times to print the solder on the substrate based on the printing state of the solder acquired by the acquisition unit. A printing control apparatus comprising the above components.

2. The printing control apparatus according to claim 1, wherein the setting unit performs a setting to perform the multiple printing when a printing defect in which the printing state of the solder has dropped below an allowable range is acquired by the acquisition unit, and performs a setting not to perform the multiple printing when the printing defect is not acquired by the acquisition unit.

3. The printing control apparatus according to claim 2, wherein the acquisition unit acquires the printing defect in which at least one of a volume, an area, and a height of the solder printed on the substrate is less than the allowable range.

4. The printing control apparatus according to claim 3, wherein the acquisition unit uses a three-dimensional profile sensor capable of at least measuring a volume of the solder printed on the substrate, and acquires the printing defect including a volume shortage in which the volume of the solder is less than the allowable range.

5. The acquisition unit acquires the printing state of the solder for a target substrate which is at least one substrate to be printed after cleaning the stencil, and the setting unit sets whether to perform the multiple printing for the target substrate. The printing control apparatus according to any one of claims 1 to 4.

6. The printing control apparatus according to claim 1, wherein the setting unit sets control parameters for printing the solder for the substrate on which the multiple printing is performed.

7. The printing control apparatus according to claim 6, wherein the setting unit sets the control parameters so that a printing defect in which the printing state of the solder has dropped below an allowable range is improved.

8. The control parameters are at least one of a printing pressure, a printing speed, a number of times of performing the multiple printing, and an inclination angle of the squeegee when printing the solder. The printing control apparatus according to claim 6 or claim 7.

9. The printing control apparatus according to claim 1, further comprising a storage unit that stores in association substrate identification information for identifying the substrate, use member identification information for identifying a use member including the stencil, which is a member used when printing the solder on the substrate, and presence or absence of the plurality of times of printing set by the setting unit.

10. A printing control method comprising: an acquisition step of acquiring a printing state of solder printed on a substrate through an opening of a stencil as a squeegee slides over the stencil; and a setting step of setting presence or absence of a plurality of times of printing for printing the solder on the substrate by sliding the squeegee a plurality of times based on the printing state of the solder acquired in the acquisition step.

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