Measuring method, measuring device, and processing system

Abstract

This measuring method uses a measuring unit to acquire a three-dimensional shape. The measuring method comprises: disposing a first holder, which is capable of holding a workpiece, inside a measuring device that includes a measuring unit; acquiring first point cloud information relating to the first holder by using the measuring unit if the relative positional relationship between the measuring unit and the first holder is a first positional relationship; acquiring second point cloud information relating to the first holder by using the measuring unit if the relative positional relationship between the measuring unit and the first holder is a second positional relationship; disposing a second holder that holds one or a plurality of first workpieces inside the measuring device; acquiring third point cloud information relating to the one or plurality of first workpieces held with the second holder by using the measuring unit; and acquiring the three-dimensional shape of the one or plurality of first workpieces on the basis of the third point cloud information and at least one part of the first point cloud information.

Description

Measurement method, measurement device, and processing system

[0001] The present invention relates to the technical fields of a measurement method, a measurement device, and a processing system.

[0002] An example of a processing apparatus for processing an object is described in Patent Document 1. Such a processing apparatus may be controlled by processing control information based on measurement results of the object to be processed. For such a processing apparatus, improvement in throughput is required.

[0003] US Patent Application Publication No. 2018 / 0029298

[0004] According to a first aspect, there is provided a measurement method for acquiring a three-dimensional shape using a measurement unit, the measurement method including: placing a first holder capable of holding a workpiece in a measurement device having the measurement unit; when the relative positional relationship between the measurement unit and the first holder is a first positional relationship, using the measurement unit to acquire first point cloud information regarding the first holder; when the relative positional relationship between the measurement unit and the first holder is a second positional relationship different from the first positional relationship, using the measurement unit to acquire second point cloud information regarding the first holder; placing a second holder holding one or more first workpieces in the measurement device; using the measurement unit to acquire third point cloud information regarding the one or more first workpieces held by the second holder; and acquiring the three-dimensional shape of the one or more first workpieces based on at least a portion of the first point cloud information and the third point cloud information.

[0005] According to a second aspect, there is provided a measurement method for acquiring a three-dimensional shape using a measurement unit, the measurement method including: acquiring first information regarding a holder capable of holding a workpiece; placing the holder holding the workpiece in a measurement device having the measurement unit; measuring a portion of the workpiece held by the holder using the measurement unit to acquire point cloud information including a point cloud corresponding to the portion of the workpiece; and acquiring the three-dimensional shape of the workpiece held by the holder based on the first information and the point cloud information.

[0006] According to a third aspect, a measurement method for acquiring a three-dimensional shape using a measurement unit is provided, the measurement method including: placing a first holder capable of holding a workpiece in a measurement device having the measurement unit; when the relative positional relationship between the measurement unit and the first holder is a first positional relationship, acquiring first point cloud information regarding the first holder using the measurement unit; placing a second holder holding one or more first workpieces in the measurement device; using the measurement unit to acquire third point cloud information regarding the one or more first workpieces held by the second holder; and acquiring the three-dimensional shape of the one or more first workpieces based on at least a portion of the first point cloud information and the third point cloud information.

[0007] According to a fourth aspect, there is provided a measurement apparatus that performs measurement using the measurement method according to any one of the first to third aspects.

[0008] According to a fifth aspect, there is provided a processing system including the measuring device of the fourth aspect and a processing device that processes the one or more first workpieces.

[0009] FIG. 1 is a block diagram showing the overall configuration of a machining system according to an embodiment. FIG. 2 is a block diagram showing the system configuration of a machining apparatus according to an embodiment. FIG. 3 is a cross-sectional view showing the configuration of a machining apparatus according to an embodiment. FIG. 4 is a block diagram showing the system configuration of a measurement apparatus according to an embodiment. FIG. 5 is a diagram showing a schematic configuration of a shape measurement device provided in a measurement apparatus according to an embodiment. FIG. 6 is a block diagram showing the configuration of a control information generation device provided in a measurement apparatus according to an embodiment. FIG. 7 is a block diagram showing the configuration of an information processing apparatus according to an embodiment. FIG. 8 is a perspective view showing the structure of an example of a jig when not holding a workpiece. FIG. 9 is a perspective view showing the structure of an example of a jig when actually holding a workpiece. FIG. 10(a) is a diagram schematically showing a reference model, and FIG. 10(b) is a diagram schematically showing an object model. FIG. 11(a) is a diagram schematically showing a reference model, FIG. 11(b) is a diagram schematically showing an object model, and FIG. 11(c) is a diagram schematically showing a differential model generated based on the reference model shown in FIG. 11(a) and the object model shown in FIG. 11(b). FIG. 12 is a conceptual diagram showing an example of a usage mode of a machining system according to an embodiment. 13(a) to 13(e) are diagrams showing an example of the transition of information registered in the information processing apparatus according to the embodiment. FIG. 14 is a diagram showing an example of information related to jigs registered in the information processing apparatus according to the embodiment. FIG. 15 is a flowchart showing an example of an operation for acquiring batch information. FIG. 16 is a diagram showing an example of a processing cycle related to repair processing. FIG. 17 is a conceptual diagram showing an example of a measurement operation of a shape measurement device provided in the measuring apparatus according to the embodiment. FIG. 18 is a flowchart showing an example of a measurement operation. FIG. 19 is a diagram for explaining the measurement operation when measuring a long workpiece. FIG. 20 is a diagram showing an example of a measuring member attached to a jig. FIG. 21 is a conceptual diagram showing an example of a measurement method. FIG. 22 is a conceptual diagram showing an example of a table showing reference coordinates. FIG. 23 is a conceptual diagram showing an example of a measurement method in which a portion of past measurement results is reused. FIG. 24 is a flowchart showing an example of a measurement method in which a portion of past measurement results is reused. FIG. 25 is a flowchart showing an example of the operation of a control information generation device provided in the measuring apparatus according to the embodiment.Fig. 26 is a conceptual diagram showing another example of a measurement method for reusing a part of past measurement results. Fig. 27 is a flowchart showing another example of a measurement method for reusing a part of past measurement results. Fig. 28 is a block diagram showing a system configuration of a processing apparatus according to a modified example of the embodiment.

[0010] Hereinafter, embodiments of a measurement method, a measurement device, and a machining system will be described with reference to the drawings. Hereinafter, embodiments of a measurement method, a measurement device, and a machining system will be described using a machining system SYS capable of machining a workpiece W.

[0011] In the following description, a turbine blade constituting a turbine will be given as a specific example of at least one of the workpiece W and the shaped object. Examples of turbines include at least one of a power generation turbine and an aircraft engine turbine. At least one of the workpiece W and the shaped object may be at least one of (i) a propeller-shaped part, (ii) a body part for a vehicle such as an automobile, motorcycle, electric vehicle, or railcar, (iii) an engine part for an automobile engine, motorcycle engine, or aerospace engine, and (iv) a battery part for an electric vehicle.

[0012] (1) Configuration of Machining System SYS (1-1) Overall Configuration of Machining System SYS First, the overall configuration of the machining system SYS will be described with reference to Fig. 1. Fig. 1 is a block diagram showing the overall configuration of the machining system SYS.

[0013] As shown in FIG. 1 , the processing system SYS includes a plurality of processing apparatuses 1, a plurality of measuring apparatuses 2, a conveying apparatus 3, and an information processing apparatus 4. In the example shown in FIG. 1 , the processing system SYS includes four processing apparatuses 1#1, 1#2, 1#3, and 1#4. However, the processing system SYS may include three or fewer processing apparatuses, or may include five or more processing apparatuses. In the example shown in FIG. 1 , the processing system SYS includes two measuring apparatuses 2#1 and 2#2. However, the processing system SYS may include a single measuring apparatus 2, or may include three or more measuring apparatuses 2. The number of processing apparatuses 1 included in the processing system SYS may be greater than the number of measuring apparatuses 2. Alternatively, the number of measuring apparatuses 2 included in the processing system SYS may be greater than the number of processing apparatuses 1.

[0014] For ease of explanation, in the following, when a description is common to a plurality of processing devices (e.g., processing devices 1#1, 1#2, 1#3, and 1#4), the plurality of processing devices will not be distinguished from one another and will simply be referred to as "processing device 1." Similarly, when a description is common to a plurality of measuring devices (e.g., measuring devices 2#1 and 2#2), the plurality of measuring devices will not be distinguished from one another and will simply be referred to as "measuring device 2."

[0015] In the example shown in FIG. 1 , the processing system SYS includes a single conveying device 3. However, the processing system SYS may include a plurality of conveying devices 3. For example, the conveying device 3 may be an automatic guided vehicle (AGV), a robot, a belt conveyor, or the like. The conveying device 3 may include an arm, a carrier, a belt, a chain, or the like as a conveying tool for conveying the workpiece W. Note that the processing system SYS does not necessarily have to include the conveying device 3. In this case, a person (for example, a worker) may convey the workpiece W.

[0016] The information processing device 4 may control the operation of the entire processing system SYS. For example, the information processing device 4 may control the operation of each of the multiple processing devices 1. For example, the information processing device 4 may control the operation of each of the multiple measuring devices 2. For example, the information processing device 4 may control the operation of the transport device 3. The information processing device 4 may be able to communicate with at least one of the multiple processing devices 1, the multiple measuring devices 2, and the transport system 3.

[0017] For example, the information processing device 4 may be connected to at least one of the multiple processing devices 1, the multiple measuring devices 2, and the conveying system 3 via a wired and / or wireless network (or a data bus and / or communication line).

[0018] The wired network may be a network using a serial bus interface, such as at least one of IEEE1394, RS-232x, RS-422, RS-423, RS-485, and USB. The wired network may be a network using a parallel bus interface. The wired network may be a network using an Ethernet (registered trademark) interface, such as at least one of 10BASE-T, 100BASE-TX, and 1000BASE-T.

[0019] A network using radio waves may be used as the wireless network. An example of a network using radio waves is a network conforming to IEEE 802.1x (for example, at least one of a wireless LAN and Bluetooth (registered trademark)). A network using infrared rays may be used as the wireless network. A network using optical communication may be used as the wireless network.

[0020] The information processing device 4 and at least one of the multiple processing devices 1, the multiple measuring devices 2, and the transport system 3 may be configured to be able to send and receive various information via a network. The information processing device 4 may be able to send information such as commands and control parameters to at least one of the multiple processing devices 1, the multiple measuring devices 2, and the transport system 3 via the network. At least one of the multiple processing devices 1, the multiple measuring devices 2, and the transport system 3 may be equipped with a receiving device that receives information such as commands and control parameters from the information processing device 4 via the network. At least one of the multiple processing devices 1, the multiple measuring devices 2, and the transport system 3 may be equipped with a transmitting device that transmits information such as commands and control parameters to the information processing device 4 via the network (i.e., an output device that outputs information to the information processing device 4).

[0021] At least a part of the information processing device 4 may be located on a network. That is, at least a part of the information processing device 4 may be configured as, for example, a cloud server. As described above, the information processing device 4 may control the operation of the entire machining system SYS. For example, when at least a part of the information processing device 4 is configured as a cloud server, the information processing device 4 may be referred to as a control server. In this case, the information processing device 4 or the information processing device 4 may be, for example, a computer such as a notebook personal computer or a desktop personal computer.

[0022] The processing device 1 is capable of processing a workpiece W. In this embodiment, an example will be described in which the processing device 1 is a processing device that can process the workpiece W by irradiating the workpiece W with processing light EL (i.e., an energy beam in the form of light). However, the processing device 1 may also process the workpiece W without using the processing light EL. Note that, since the workpiece W is an object to be processed by the processing device 1, the workpiece W may also be referred to as an object to be processed.

[0023] The processing apparatus 1 is capable of performing additive processing on the workpiece W. In other words, the processing apparatus 1 is capable of forming a structure on the workpiece W by performing additive processing on the workpiece W. In this case, the processing apparatus 1 may form a structure that is integrated with or separable from the workpiece W by performing additive processing on the workpiece W. The structure formed by the processing apparatus 1 may refer to any object formed by the processing apparatus 1. For example, the processing apparatus 1 may form a three-dimensional structure ST (that is, a three-dimensional structure that has a size in all three-dimensional directions, a solid object, in other words, a structure that has a size in the X-axis direction, Y-axis direction, and Z-axis direction) as an example of a structure.

[0024] The processing apparatus 1 may perform additive processing using any additive processing method (i.e., a manufacturing method) capable of manufacturing a shaped object. Examples of additive processing methods include at least one of laser metal deposition (LMD), powder bed fusion (PBF) methods such as selective laser sintering (SLS), binder jetting, material jetting, stereolithography, and laser metal fusion (LMF). The laser build-up welding method may also be referred to as directed energy deposition (DED).

[0025] The workpiece W may be an item that has a missing portion and needs to be repaired. In this case, the processing device 1 may perform repair processing to repair (in other words, restore) the item that needs to be repaired by performing additional processing to form a shaped object to fill the missing portion. In other words, the additional processing performed by the processing device 1 may include additional processing to add a three-dimensional structure ST corresponding to the shaped object to fill the missing portion to the workpiece W. An example of an item that has a missing portion and needs to be repaired is a worn turbine blade.

[0026] The workpiece W may be a base for forming a three-dimensional structure ST. In this case, the processing device 1 may manufacture the three-dimensional structure ST from scratch by performing additional processing to form the three-dimensional structure ST on the workpiece W. As an example, the processing device 1 may manufacture a turbine blade from scratch by performing additional processing to form a three-dimensional structure ST corresponding to a turbine blade on the workpiece W.

[0027] The workpiece W may be an intermediate product produced in the process of forming a three-dimensional structure ST. In this case, the processing device 1 may perform additional processing on the workpiece W, which is an intermediate product of the three-dimensional structure ST, to complete the three-dimensional structure ST, thereby producing the three-dimensional structure ST from the intermediate product. As an example, the processing device 1 may perform additional processing on the workpiece W, which is an intermediate product of a turbine blade, to complete the turbine blade, thereby producing a finished turbine blade from the intermediate product of the turbine blade.

[0028] The processing device 1 may be capable of performing removal processing on the workpiece W in addition to or instead of performing additional processing. That is, the processing device 1 may be capable of performing removal processing to remove a part of the workpiece W. Note that, in addition to or instead of performing removal processing on the workpiece W, the processing device 1 may perform removal processing on a shaped object formed on the workpiece W by the processing device 1. Furthermore, an item requiring repair may be repaired by performing removal processing. This repair by removal processing may be combined with repair by additional processing.

[0029] The measuring device 2 may measure the workpiece W, for example, before the processing device 1 actually starts processing the workpiece W. In this embodiment, the measuring device 2 measures the three-dimensional shape of the workpiece W. Once the three-dimensional shape of the workpiece W is determined, the position of the workpiece W in three-dimensional space in the measurement coordinate system of the measuring device 2 (for example, the position of the surface of the workpiece W) can be determined. For this reason, measuring the three-dimensional shape of the workpiece W is essentially equivalent to measuring the position of the workpiece W.

[0030] The measuring device 2 further generates processing control information based on the measurement results of the workpiece W. The processing control information is control information used to control the processing device 1 to process the workpiece W. For example, the processing control information may include processing path information. The processing path information may indicate a target irradiation position to which the processing light EL should be irradiated in order to process the workpiece W. Specifically, the processing path information may indicate a target movement path, which is a path to a target irradiation position to which the processing light EL should be irradiated in order to process the workpiece W. This target movement path may be referred to as a processing path or a tool path. In this case, the measuring device 2 may generate a G-code indicating the processing path or tool path as the processing control information. The measuring device 2 may generate a file with an extension "gcode" or "gco" as the processing control information.

[0031] 1, the processing device 1 and the measuring device 2 are separate devices. However, the processing system SYS may include a device in which the processing device 1 and the measuring device 2 are integrated. In other words, one processing device 1 and one measuring device 2 may be integrated.

[0032] The processing system SYS may include, in addition to the information processing device 4, a first computer (e.g., a control device 17 described later) that controls the processing device 1 as part of the processing device 1. That is, the processing device 1 may include the first computer. The processing system SYS may include, in addition to the information processing device 4, a second computer (e.g., a control device 23 described later) that controls the measuring device 2 as part of the measuring device 2. That is, the measuring device 2 may include the second computer. The processing system SYS may include, in addition to the information processing device 4, a third computer that controls the transport device 3 as part of the transport device 3. That is, the transport device 3 may include the third computer. The first computer, the second computer, and the third computer may be, for example, a notebook personal computer, a desktop personal computer, etc.

[0033] (1-2) Configuration of Processing Apparatus 1 The configuration of the processing apparatus 1 will be described with reference to Fig. 2 and Fig. 3. Fig. 2 is a block diagram showing the system configuration of the processing apparatus 1. Fig. 3 is a cross-sectional view showing the configuration of the processing apparatus 1.

[0034] In the following description, the positional relationships of the various components constituting the processing apparatus 1 will be described using an XYZ Cartesian coordinate system defined by mutually orthogonal X, Y, and Z axes as the processing coordinate system. For ease of explanation, the X-axis and Y-axis directions are each assumed to be horizontal (i.e., a predetermined direction within a horizontal plane), and the Z-axis direction is assumed to be vertical (i.e., a direction perpendicular to the horizontal plane, essentially an up-down direction). Furthermore, the rotation directions around the X-axis, Y-axis, and Z-axis (in other words, tilt directions) are referred to as the θX direction, θY direction, and θZ direction, respectively. Here, the Z-axis direction may be the direction of gravity. Furthermore, the XY plane may be assumed to be horizontal.

[0035] In addition, in the following description, for convenience of explanation, a configuration of a processing device 1 that performs additional processing will be described as an example of the configuration of the processing device 1. In particular, in the following description, a configuration of a processing device 1 that performs additional processing using a laser build-up welding method will be described as an example of the configuration of the processing device 1.

[0036] The processing device 1, which performs additive processing using the laser build-up welding method, performs additive processing by processing a modeling material M using processing light EL. The modeling material M is a material that can be melted by irradiation with processing light EL of a predetermined intensity or higher. For example, at least one of a metallic material and a resinous material can be used as the modeling material M. However, materials other than metallic materials and resinous materials may also be used as the modeling material M. The modeling material M is a powdered or granular material. In other words, the modeling material M is a powdered or granular material. However, the modeling material M does not have to be a powdered or granular material. For example, at least one of a wire-shaped modeling material and a gaseous modeling material may be used as the modeling material M.

[0037] A processing apparatus 1 that performs additive processing using laser build-up welding sequentially forms multiple structural layers to form a three-dimensional structure in which multiple structural layers are stacked. In this case, the processing apparatus 1 first sets the surface of the workpiece W as the build surface on which the object is actually built, and builds the first structural layer on that build surface. Thereafter, the processing apparatus 1 sets the surface of the first structural layer as a new build surface, and builds the second structural layer on that build surface. Thereafter, the processing apparatus 1 repeats the same operation to build a three-dimensional structure in which multiple structural layers are stacked.

[0038] 2 and 3 , the processing apparatus 1 includes a material supply source 11, a processing unit 12, a stage unit 13, a light source 15, a gas supply source 16, and a control device 17. The processing unit 12 and the stage unit 13 may be housed in a chamber space 183IN inside a housing 18. Note that at least one of the processing unit 12 and the stage unit 13 does not have to be housed in the chamber space 183IN inside the housing 18.

[0039] The material supply source 11 supplies the molding material M to the processing unit 12. The material supply source 11 supplies a desired amount of the molding material M according to the required amount so that the amount of the molding material M required per unit time for performing additive processing is supplied to the processing unit 12.

[0040] The processing unit 12 processes the modeling material M supplied from the material supply source 11 to form a model. To form the model, the processing unit 12 includes a processing head 121 and a head drive system 122. The processing head 121 further includes an irradiation optical system 1211 and a material nozzle 1212. In the example shown in FIGS. 2 and 3 , the processing head 121 includes a single irradiation optical system 1211, but the processing head 121 may include multiple irradiation optical systems 1211. In the example shown in FIGS. 2 and 3 , the processing head 121 includes a single material nozzle 1212, but the processing head 121 may include multiple material nozzles 1212.

[0041] The irradiation optical system 1211 is an optical system (e.g., a focusing optical system) for emitting the processing light EL. Specifically, the irradiation optical system 1211 is optically connected to the light source 15 that emits the processing light EL via an optical transmission member 151 such as an optical fiber or a light pipe. The irradiation optical system 1211 emits the processing light EL propagated from the light source 15 via the optical transmission member 151. The irradiation optical system 1211 irradiates the processing light EL downward (i.e., toward the -Z side) from the irradiation optical system 1211. A stage 131 is disposed below the irradiation optical system 1211. When a workpiece W is placed on the stage 131, the irradiation optical system 1211 irradiates the emitted processing light EL onto the workpiece W. In this case, the irradiation optical system 1211 irradiates the processing light EL from above the workpiece W toward the workpiece W. Specifically, the irradiation optical system 1211 can irradiate the processing light EL onto a target irradiation area EA that is set on or near the workpiece W as an area to be irradiated (typically, focused) with the processing light EL. Furthermore, under the control of the control device 17, the state of the irradiation optical system 1211 can be switched between a state in which the processing light EL is irradiated onto the target irradiation area EA and a state in which the processing light EL is not irradiated onto the target irradiation area EA.

[0042] The material nozzle 1212 supplies (e.g., injects, jets, spouts, or sprays) the modeling material M. The material nozzle 1212 is physically connected to the material supply source 11, which is a supply source of the modeling material M, via the supply pipe 111 and the mixer 112. The material nozzle 1212 supplies the modeling material M supplied from the material supply source 11 via the supply pipe 111 and the mixer 112. The material nozzle 1212 may pressure-feed the modeling material M supplied from the material supply source 11 via the supply pipe 111. That is, the modeling material M from the material supply source 11 and a conveying gas (i.e., a pressure-feed gas, for example, an inert gas such as nitrogen or argon) may be mixed in the mixer 112 and then pressure-feed to the material nozzle 1212 via the supply pipe 111. As a result, the material nozzle 1212 supplies the modeling material M together with the conveying gas. For example, a purge gas supplied from the gas supply source 16 is used as the conveying gas. However, the transport gas may be a gas supplied from a gas supply source different from the gas supply source 16. The material nozzle 1212 supplies the modeling material M downward (i.e., toward the -Z side) from the material nozzle 1212. A stage 131 is disposed below the material nozzle 1212. When a workpiece W is mounted on the stage 131, the material nozzle 1212 supplies the modeling material M toward the workpiece W or the vicinity of the workpiece W.

[0043] In this embodiment, the material nozzle 1212 supplies the modeling material M to the irradiation position of the processing light EL (i.e., the target irradiation area EA onto which the processing light EL from the irradiation optical system 1211 is irradiated). For this reason, the material nozzle 1212 and the irradiation optical system 1211 are aligned so that a target supply area MA, which is set on or near the workpiece W as the area onto which the material nozzle 1212 supplies the modeling material M, coincides with (or at least partially overlaps with) the target irradiation area EA. In this case, the modeling material M supplied from the material nozzle 1212 is irradiated with the processing light EL emitted by the irradiation optical system 1211. As a result, the modeling material M melts. That is, a molten pool MP containing the molten modeling material M is formed on the workpiece W.

[0044] The stage unit 13 includes a stage 131 and a stage drive system 132 .

[0045] A workpiece W held by a jig 5 (see FIGS. 7 and 8 ) is placed on the stage 131. The stage 131 is capable of supporting the jig 5 placed on the stage 131. The stage 131 may be capable of holding the jig 5 placed on the stage 131. In this case, the stage 131 may be equipped with at least one of a mechanical chuck, an electrostatic chuck, a vacuum chuck, etc. to hold the jig 5. Alternatively, the stage 131 may not be capable of holding the jig 5 placed on the stage 131. In this case, the jig 5 may be placed on the stage 131 in a clampless manner. The workpiece W does not have to be held by a holder such as the jig 5. In this case, the workpiece W may be placed, supported, or held on the stage 131. At least one of the jig 5 and the workpiece W does not have to be placed on the stage 131 and may be placed on the floor, for example.

[0046] The stage drive system 132 moves the stage 131 under the control of the control device 17. The stage drive system 132 moves the stage 131, for example, along at least one of the X-axis, Y-axis, Z-axis, θX direction, θY direction, and θZ direction. When the stage drive system 132 moves the stage 131, the relative positions of the stage 131 and the workpiece W placed on the stage 131, and the machining head 121 change. As a result, the target irradiation area EA and the target supply area MA (and further, the molten pool MP) move relative to the workpiece W.

[0047] The light source 15 emits, for example, at least one of infrared light, visible light, and ultraviolet light as the processing light EL. However, other types of light may be used as the processing light EL.

[0048] The control device 17 controls the operation of the processing device 1. For example, the control device 17 may control the processing unit 12 (for example, at least one of the processing head 121 and the head drive system 122) provided in the processing device 1 so as to process the workpiece W. For example, the control device 17 may control the stage unit 13 (for example, the stage drive system 132) provided in the processing device 1 so as to process the workpiece W.

[0049] The control device 17 may include, for example, an arithmetic unit 171 and a storage device 172. The arithmetic unit 171 is hardware that includes at least a circuit (for example, at least one of an electronic circuit and an electric circuit). For this reason, the arithmetic unit 171 may be referred to as a group of circuits (Circuitry).

[0050] The arithmetic device 171 may include at least one processor (i.e., a single processor or multiple processors) as hardware. The processor may include, for example, a processor conforming to a von Neumann computer architecture. The processor conforming to the von Neumann computer architecture may include at least one of a CPU (Central Processing Unit) and a GPU (Graphics Processing Unit). The processor may include, for example, a processor conforming to a non-von Neumann computer architecture. The processor conforming to the non-von Neumann computer architecture may include at least one of an FPGA (Field Programmable Gate Array) and an ASIC (Application Specific Circuit). The processor may be realized by the above-mentioned circuit group.

[0051] The storage device 172 includes at least one memory capable of storing desired data. In other words, the storage device 172 includes at least one memory that stores desired data. The memory may be realized by a group of circuits (e.g., at least one of electronic circuits and electric circuits). For example, the storage device 172 may store a computer program executed by the arithmetic device 171. In this case, the storage device 172 including at least one memory may be used as a recording medium for recording the computer program executed by the arithmetic device 171. The storage device 172 may temporarily store data that the arithmetic device 171 temporarily uses when the arithmetic device 171 is executing a computer program. The storage device 172 may also store data that the control device 17 stores long-term.

[0052] The storage device 172 may include at least one of a RAM (Random Access Memory), a ROM (Read Only Memory), a hard disk device, a magneto-optical disk device, an SSD (Solid State Drive), and a disk array device. In other words, the storage device 172 may include a non-transitory recording medium. The control device 17 is not limited to a single storage device 172, and may include multiple storage devices 172.

[0053] The arithmetic device 171 loads a computer program including at least one of computer program code and computer program instructions. The control device 17 functions as a device that controls the operation of the processing device 1 by the arithmetic device 171 executing the computer program. This computer program is a computer program for causing the arithmetic device 171 to perform (i.e., execute) the operation that the control device 17 should perform. In other words, this computer program is a computer program for causing the control device 17 to function so as to cause the processing device 1 to perform a predetermined operation. The arithmetic device 171, together with the storage device 172 or the like in which the computer program is recorded (in other words, together with the storage device 172 and the computer program recorded in the storage device 172 or the like), causes the control device 17 to function as a device that controls the operation of the processing device 1. In other words, at least one processor included in the arithmetic device 171, a memory (recording medium) included in the storage device 172 or the like, and the computer program are configured to cause the control device 17 to perform the processing that the control device 17 should perform.

[0054] The computer program executed by the arithmetic device 171 may be recorded in a storage device 172 (i.e., a recording medium) provided in the control device 17, or may be recorded in any storage medium (for example, a hard disk or semiconductor memory) built into the control device 17 or externally attachable to the control device 17. Alternatively, the arithmetic device 171 may download the computer program to be executed from a device external to the control device 17 via a network interface.

[0055] If the arithmetic device 171 includes a single processor, the arithmetic device 171 may execute a computer program using the single processor. If the arithmetic device 171 includes multiple processors, the arithmetic device 171 may execute a computer program using the multiple processors. In this case, the arithmetic device 171 may execute a part of the computer program using one processor and execute another part of the computer program using another processor. The arithmetic device 171 may execute a computer program using any one of the multiple processors.

[0056] The control device 17 may control the emission mode of the processing light EL by the irradiation optical system 1211. The emission mode may include, for example, at least one of the intensity of the processing light EL and the emission timing of the processing light EL. When the processing light EL includes multiple pulsed lights, the emission mode may include, for example, at least one of the emission duration of the pulsed light, the emission cycle of the pulsed light, and the ratio between the emission duration of the pulsed light and the emission cycle of the pulsed light (so-called duty ratio). Furthermore, the control device 17 may control the movement mode of the processing head 121 by the head drive system 122. The control device 17 may control the movement mode of the stage 131 by the stage drive system 132. The movement mode may include, for example, at least one of the movement amount, movement speed, movement direction, and movement timing (movement time). Furthermore, the control device 17 may control the supply mode of the modeling material M by the material nozzle 1212. The supply mode may include, for example, at least one of the supply amount (particularly, the supply amount per unit time) and the supply timing (supply time).

[0057] The processing device 1 may include an integrated circuit configured to execute instructions. The integrated circuit may include at least one of a calculation device (e.g., calculation device 171), a communication device, an input device, and an output device. In this case, the processing device 1 may not include a memory device (e.g., memory device 172). That is, the device including the integrated circuit and the device including the memory device may be different. In this case, the device including the integrated circuit and the device including the memory device may communicate with each other (e.g., communicate).

[0058] (1-3) Configuration of the Measuring Apparatus 2 The configuration of the measuring apparatus 2 will be described with reference to Fig. 4 to Fig. 6. Fig. 4 is a block diagram showing the system configuration of the measuring apparatus 2. Fig. 5 is a diagram showing the schematic configuration of the shape measuring device 21 provided in the measuring apparatus 2. Fig. 6 is a block diagram showing the configuration of the control information generating device 23 provided in the measuring apparatus 2.

[0059] As shown in Fig. 4, the measurement device 2 includes a shape measuring device 21, a control information generating device 22, and a control device 23. The shape measuring device 21 and the control information generating device 22 may operate under the control of the control device 23. The configuration of the control device 23 shown in Fig. 4 may be different from the configuration of the control device 17 of the processing device 1 shown in Fig. 2. The configuration of the control device 23 may be the same as the configuration of the control device 17.

[0060] (1-3-1) Configuration of Shape Measuring Apparatus 21 An example of the configuration of the shape measuring apparatus 21 is shown in Figures 4 and 5. As shown in Figures 4 and 5, the shape measuring apparatus 21 includes a shape measuring head 211, a head driving system 212, a stage 213, and a stage driving system 214. However, the shape measuring apparatus 21 does not necessarily have to include at least one of the head driving system 212 and the stage driving system 214. As shown in Figure 5, the shape measuring head 211 and the stage 213 may be housed in a housing 210. The shape measuring head 211 may also be referred to as a measurement unit.

[0061] The shape measuring device 21 may measure the workpiece W. Therefore, the measurement object of the shape measuring device 21 may include the workpiece W. The shape measuring device 21 may measure a holder (e.g., jig 5) that actually holds the workpiece W. Therefore, the measurement object of the shape measuring device 21 may include the holder that holds the workpiece W. In other words, the measurement object of the shape measuring device 21 may include the holder that holds the workpiece W and the workpiece W held by the holder. The shape measuring device 21 may measure a holder (e.g., jig 5) that does not hold the workpiece W. Therefore, the measurement object of the shape measuring device 21 may include a holder (e.g., jig 5) that does not hold the workpiece W.

[0062] The shape measurement head 211 is a measurement device capable of measuring the three-dimensional shape of a measurement object. For example, the shape measurement head 211 may measure the three-dimensional shape of the measurement object using a pattern projection method or a light section method, in which a measurement light is irradiated onto the surface of the measurement object to project a light pattern onto the surface, and the shape of the projected pattern is measured. In this case, the shape measurement head 211 may be equipped with a stereo camera. For example, the shape measurement head 211 may measure the three-dimensional shape of the measurement object using a time-of-flight method, in which the shape measurement head 211 projects measurement light onto the surface of the measurement object, calculates the time it takes for the projected measurement light to return from the measurement object to the shape measurement device 21, and measures the distance to the measurement object based on this time, at multiple positions on the measurement object. For example, the shape measurement head 211 may measure the three-dimensional shape of the measurement object using at least one of a moire topography method (specifically, a grating projection method or a grating projection method), a holographic interferometry method, an autocollimation method, a stereo method, an astigmatism method, a critical angle method, and a knife-edge method.

[0063] The head drive system 212 moves the shape measuring head 211. The head drive system 212 may move the shape measuring head 211, for example, along at least one of the X axis, Y axis, Z axis, θX direction, θY direction, and θZ direction in the measurement coordinate system of the measurement device 2.

[0064] 5 , the shape measuring head 211 is attached to a second support mechanism 2112 that supports the first support mechanism 2111 and the shape measuring head 211 so that the depression angle can be changed, via the first support mechanism 2111 that supports the shape measuring head 211, and that supports the first support mechanism 2111 and the shape measuring head 211 so that the shape measuring head 211 can move up and down. When the head drive system 212 moves the shape measuring head 211, the positional relationship between the measurement range FOV of the shape measuring head 211 and the measurement object changes. As a result, the shape measuring head 211 is more likely to be able to measure the three-dimensional shape of a portion of the measurement object (e.g., workpiece W) whose three-dimensional shape could not be measured before the shape measuring head 211 moved. In other words, the blind spot of the shape measuring head 211 is narrowed or eliminated. In particular, in the example shown in FIG. 5, the shape measuring head 211 is movable in the Z-axis direction (up and down direction), so that a long workpiece W can be measured without unnecessarily widening the measurement range FOV (angle of view in the case of a camera) of the shape measuring head 211, thereby preventing a decrease in measurement accuracy due to an expansion of the measurement range FOV (angle of view).

[0065] A measurement target is placed on the stage 213. The stage 213 is capable of supporting the jig 5 placed on the stage 231. The stage 213 may be capable of holding the jig 5 placed on the stage 213. In this case, the stage 213 may be equipped with at least one of a mechanical chuck, an electrostatic chuck, a vacuum chuck, or the like in order to hold the jig 5. Alternatively, the stage 213 may not be capable of holding the jig 5 placed on the stage 213. In this case, the jig 5 may be placed on the stage 213 in a clampless manner.

[0066] The workpiece W does not have to be held by a holder such as the jig 5. In this case, the workpiece W may be placed, supported, or held on the stage 231. At least one of the jig 5 and the workpiece W does not have to be placed on the stage 231, and may be placed on the floor, for example.

[0067] The stage drive system 214 moves the stage 213. The stage drive system 214 moves the stage 213, for example, along at least one of the X-axis, Y-axis, Z-axis, θX direction, θY direction, and θZ direction in the measurement coordinate system of the measurement device 2. In the example shown in FIG. 5 , the stage 213 moves and rotates along the θZ direction, in other words, along a rotation direction around the Z axis. When the stage drive system 214 moves the stage 213, the positional relationship between the measurement range of the shape measuring head 211 and the measurement target placed on the stage 213 changes. As a result, the blind spot of the shape measuring head 211 is narrowed or eliminated, similar to when the shape measuring head 211 moves.

[0068] It should be noted that the shape measurement device 21 is not limited to a device that measures the three-dimensional shape of a measurement object stored in the housing 210. For example, the shape measurement device 21 may be attached to a robot arm so as to be movable around the measurement object.

[0069] (1-3-2) Configuration of the control information generating device 22 The control information generating device 22 generates processing control information. The operation of generating the processing control information will be described in detail later. Here, the configuration of the control information generating device 22 will be described with reference to Fig. 6. Fig. 6 is a block diagram showing the configuration of the control information generating device 22.

[0070] 6 , the control information generating device 22 includes a calculation device 221, a storage device 222, a communication device 223, an input device 224, and an output device 225. The calculation device 221, the storage device 222, the communication device 223, the input device 224, and the output device 225 may be connected via a data bus 226. Note that the control information generating device 22 does not necessarily include at least one of the input device 224 and the output device 225.

[0071] The arithmetic device 221 is hardware including at least a circuit (e.g., at least one of an electronic circuit and an electric circuit). Therefore, the arithmetic device 221 may be referred to as a group of circuits. The arithmetic device 221 includes at least one processor (i.e., a single processor or multiple processors) as hardware. The processor may include, for example, a processor conforming to a von Neumann computer architecture. A processor conforming to a von Neumann computer architecture may include at least one of a CPU and a GPU. The processor may include, for example, a processor conforming to a non-von Neumann computer architecture. A processor conforming to a non-von Neumann computer architecture may include at least one of an FPGA and an ASIC. The processor may be realized by the group of circuits.

[0072] The storage device 222 includes at least one memory capable of storing desired data. In other words, the storage device 222 includes at least one memory that stores desired data. The memory may be realized by a group of circuits (e.g., at least one of electronic circuits and electric circuits). For example, the storage device 222 may store a computer program 2221 executed by the arithmetic device 221. In this case, the storage device 222, which includes at least one memory, may be used as a recording medium that records the computer program 2221 executed by the arithmetic device 221. The storage device 222 may temporarily store data that the arithmetic device 221 temporarily uses when the arithmetic device 221 is executing the computer program 2221. The storage device 222 may also store data that the control information generating device 22 stores long-term.

[0073] The storage device 222 may include at least one of a RAM, a ROM, a hard disk device, a magneto-optical disk device, an SSD, and a disk array device. In other words, the storage device 222 may include a non-transitory recording medium. The control information generating device 22 is not limited to a single storage device 222, and may include multiple storage devices 222.

[0074] The arithmetic device 221 loads a computer program 2221 including at least one of computer program code and computer program instructions. For example, the control information generating device 22 functions as a device that generates processing control information when the arithmetic device 221 executes the computer program 2221. The computer program 2221 is a computer program for causing the arithmetic device 221 to perform (i.e., execute) the operation to be performed by the control information generating device 22. In other words, the computer program 2221 is a computer program for causing the control information generating device 22 to function to perform a predetermined operation (e.g., an operation of generating processing control information). The arithmetic device 221, together with the storage device 222 or the like in which the computer program 2221 is recorded (in other words, together with the storage device 222 and the computer program 2221 recorded in the storage device 222 or the like), causes the control information generating device 22 to function, for example, as a device that generates processing control information. In other words, the at least one processor provided in the arithmetic device 221, the memory (recording medium) provided in the storage device 222, etc., and the computer program 2221 are configured so that the control information generating device 22 performs the processing that should be performed by the control information generating device 22.

[0075] The computer program 2221 executed by the arithmetic device 221 may be recorded in a storage device 222 (i.e., a recording medium) provided in the control information generating device 22, or may be recorded in any storage medium (for example, a hard disk or semiconductor memory) built into the control information generating device 22 or externally attachable to the control information generating device 22. Alternatively, the arithmetic device 221 may download the computer program 2221 to be executed from a device external to the control information generating device 22 via a network interface.

[0076] If the arithmetic device 221 includes a single processor, the arithmetic device 221 may use the single processor to execute the computer program 2221. If the arithmetic device 221 includes multiple processors, the arithmetic device 221 may use the multiple processors to execute the computer program 2221. In this case, the arithmetic device 221 may use one processor to execute a part of the computer program 2221, and another processor to execute another part of the computer program 2221. The arithmetic device 221 may use any one of the multiple processors to execute the computer program 2221.

[0077] A computation model that can be constructed by machine learning may be implemented in the control information generating device 22 by the computation device 221 executing the computer program 2221. An example of a computation model that can be constructed by machine learning is a computation model that includes a neural network (so-called artificial intelligence (AI)). In this case, learning of the computation model may include learning of parameters of the neural network (for example, at least one of a weight and a bias).

[0078] Note that a computation model already constructed by offline machine learning using teacher data may be implemented in the control information generating device 22. Furthermore, the computation model implemented in the control information generating device 22 may be updated by online machine learning on the control information generating device 22. Alternatively, the control information generating device 22 may use a computation model implemented in a device external to the control information generating device 22 (i.e., a device provided outside the measuring device 2) in addition to or instead of the computation model implemented in the control information generating device 22.

[0079] The recording medium for recording the computer program 2221 executed by the arithmetic device 221 may be at least one of a CD-ROM, CD-R, CD-RW, flexible disk, MO, DVD-ROM, DVD-RAM, DVD-R, DVD+R, DVD-RW, DVD+RW, and Blu-ray (registered trademark) optical disk, magnetic medium such as magnetic tape, magneto-optical disk, semiconductor memory such as USB memory, and any other medium capable of storing a program. The recording medium may include a device capable of recording the computer program 2221 (for example, a general-purpose device or dedicated device in which the computer program 2221 is implemented in a state in which it can be executed in at least one of the forms of software and firmware). Furthermore, each process or function included in the computer program 2221 may be realized by a logical processing block realized within the arithmetic device 221 when the arithmetic device 221 executes the computer program, or may be realized by hardware such as a predetermined gate array (FPGA, ASIC) provided in the control information generating device 22, or may be realized in a form that mixes logical processing blocks and partial hardware modules that realize some elements of the hardware.

[0080] The communication device 223 is capable of communicating with the shape measurement device 21 and the control device 23. The communication device 223 may be configured to be capable of communicating with devices external to the measurement device 2 via a communication network (not shown).

[0081] The input device 224 is a device that accepts information input to the control information generating device 22 from outside the control information generating device 22. For example, the input device 224 may include an operation device that can be operated by a user (for example, at least one of a keyboard, a mouse, and a touch panel). For example, the input device 224 may include a reading device that can read information recorded as data on a recording medium that can be externally attached to the control information generating device 22. For example, the input device 224 may accept information input from a computer (for example, the control device 23) external to the control information generating device 22.

[0082] The output device 225 is a device that outputs information to the outside of the control information generating device 22. For example, the output device 225 may output information as an image. That is, the output device 225 may include a display device (a so-called display) that can display an image showing the information to be output. For example, the output device 225 may output information as sound. That is, the output device 225 may include an audio device (a so-called speaker) that can output sound. For example, the output device 225 may output information on paper. That is, the output device 225 may include a printing device (a so-called printer) that can print desired information on paper.

[0083] (1-3-3) Configuration of the control device 23 The control device 23 may include, for example, an arithmetic device 231 and a storage device 232. The arithmetic device 231 is hardware that includes at least a circuit (for example, at least one of an electronic circuit and an electric circuit). For this reason, the arithmetic device 231 may be referred to as a group of circuits.

[0084] The computing device 231 may include at least one processor (i.e., a single processor or multiple processors) as hardware. The processor may include, for example, a processor conforming to a von Neumann computer architecture. The processor conforming to a von Neumann computer architecture may include at least one of a CPU and a GPU. The processor may include, for example, a processor conforming to a non-von Neumann computer architecture. The processor conforming to a non-von Neumann computer architecture may include at least one of an FPGA and an ASIC. The processor may be realized by the above-mentioned circuit group.

[0085] The storage device 232 includes at least one memory capable of storing desired data. In other words, the storage device 232 includes at least one memory that stores desired data. The memory may be realized by a group of circuits (e.g., at least one of electronic circuits and electric circuits). For example, the storage device 232 may store a computer program executed by the arithmetic device 231. In this case, the storage device 232 including at least one memory may be used as a recording medium for recording the computer program executed by the arithmetic device 231. The storage device 232 may temporarily store data that the arithmetic device 231 temporarily uses when the arithmetic device 231 is executing a computer program. The storage device 232 may also store data that the control device 23 stores long-term.

[0086] The storage device 232 may include at least one of a RAM, a ROM, a hard disk device, a magneto-optical disk device, an SSD, and a disk array device. In other words, the storage device 232 may include a non-transitory recording medium. The control device 23 is not limited to a single storage device 232, and may include multiple storage devices 232.

[0087] The arithmetic device 231 loads a computer program including at least one of computer program code and computer program instructions. The arithmetic device 231 executes the computer program, causing the control device 23 to function as a device that controls the operation of the measuring device 2. This computer program is a computer program for causing the arithmetic device 231 to perform (i.e., execute) the operation that the control device 23 should perform. In other words, this computer program is a computer program for causing the control device 23 to function so as to cause the measuring device 2 to perform a predetermined operation. The arithmetic device 231, together with a storage device 232 or the like in which a computer program is recorded (in other words, together with the storage device 232 and the computer program recorded in the storage device 232 or the like), causes the control device 23 to function as a device that controls the operation of the measuring device 2. In other words, at least one processor included in the arithmetic device 231, a memory (recording medium) included in the storage device 232 or the like, and the computer program are configured so that the control device 23 performs the processing that the control device 23 should perform.

[0088] The computer program executed by the arithmetic device 231 may be recorded in a storage device 232 (i.e., a recording medium) provided in the control device 23, or may be recorded in any storage medium (for example, a hard disk or semiconductor memory) built into the control device 23 or externally attachable to the control device 23. Alternatively, the arithmetic device 231 may download the computer program to be executed from a device external to the control device 23 via a network interface.

[0089] If the arithmetic device 231 includes a single processor, the arithmetic device 231 may execute a computer program using the single processor. If the arithmetic device 231 includes multiple processors, the arithmetic device 231 may execute a computer program using the multiple processors. In this case, the arithmetic device 231 may execute a part of the computer program using one processor and execute another part of the computer program using another processor. The arithmetic device 231 may execute a computer program using any one of the multiple processors.

[0090] A computational model that can be constructed by machine learning may be implemented in the control device 23 by the computation device 231 executing a computer program. An example of a computational model that can be constructed by machine learning is a computational model that includes a neural network (so-called artificial intelligence (AI). In this case, learning of the computational model may include learning of parameters of the neural network (for example, at least one of weights and biases).

[0091] Note that a computational model already constructed by offline machine learning using teacher data may be implemented in the control device 23. Furthermore, the computational model implemented in the control device 23 may be updated by online machine learning on the control device 23. Alternatively, the control device 23 may use a computational model implemented in a device external to the control device 23 (i.e., a device provided outside the measurement device 2) in addition to or instead of the computational model implemented in the control device 23.

[0092] The recording medium for recording the computer program executed by the arithmetic unit 231 may be at least one of optical disks such as CD-ROM, CD-R, CD-RW, flexible disk, MO, DVD-ROM, DVD-RAM, DVD-R, DVD+R, DVD-RW, DVD+RW, and Blu-ray (registered trademark), magnetic media such as magnetic tape, magneto-optical disk, semiconductor memory such as USB memory, and any other medium capable of storing a program. The recording medium may include a device capable of recording a computer program (for example, a general-purpose device or a dedicated device in which a computer program is implemented in an executable state in at least one form such as software or firmware). Furthermore, each process or function included in the computer program may be realized by a logical processing block realized within the arithmetic unit 231 when the arithmetic unit 231 executes the computer program, or may be realized by hardware such as a predetermined gate array (FPGA, ASIC) provided in the control unit 23, or may be realized in a form that mixes logical processing blocks and partial hardware modules that realize some elements of the hardware.

[0093] The measuring device 2 may include a scanner for reading a read code or a non-contact communication tag that indicates identification information for identifying the jig 5 and is attached to a part of the jig 5. The measuring device 2 may include an integrated circuit configured to execute instructions. The integrated circuit may include at least one of an arithmetic unit (e.g., a processor 231), a communication unit, an input unit, and an output unit. In this case, the measuring device 2 may not include a storage unit (e.g., a memory 232). In other words, the device including the integrated circuit and the device including the storage unit may be different. In this case, the device including the integrated circuit and the device including the storage unit may communicate with each other (e.g., wirelessly).

[0094] (1-4) Configuration of Information Processing Device 4 The configuration of the information processing device 4 will be described with reference to FIG. 7. FIG. 7 is a block diagram showing the configuration of the information processing device 4. As shown in FIG. 1, the information processing device 4 may be a device different from the processing device 1 and the measuring device 2. However, the information processing device 4 may be configured as a part of at least one of the processing device 1 and the measuring device 2 (e.g., a part of at least one of the control device 17 and the control device 23). Alternatively, the information processing device 4 may be built into at least one of the processing device 1 and the measuring device 2. For example, the information processing device 4 may be built into at least one of the processing device 1 and the measuring device 2 in the form of an information processing unit. Alternatively, the information processing device 4 may be realized in at least one of the processing device 1 and the measuring device 2 by, for example, executing a predetermined computer program (in other words, information processing software) by at least one of the control device 17 and the control device 23. In other words, the information processing device 4 may be a device realized by a predetermined computer program.

[0095] 7 , the information processing device 4 includes a calculation device 41, a storage device 42, a communication device 43, an input device 44, and an output device 45. The calculation device 41, the storage device 42, the communication device 43, the input device 44, and the output device 45 may be connected via a data bus 46. The information processing device 4 does not need to include at least one of the input device 44 and the output device 45.

[0096] The arithmetic device 41 is hardware including at least a circuit (e.g., at least one of an electronic circuit and an electric circuit). Therefore, the arithmetic device 41 may be referred to as a group of circuits. The arithmetic device 41 may include at least one processor (i.e., a single processor or multiple processors) as hardware. The processor may include, for example, a processor conforming to a von Neumann computer architecture. A processor conforming to a von Neumann computer architecture may include at least one of a CPU and a GPU. The processor may include, for example, a processor conforming to a non-von Neumann computer architecture. A processor conforming to a non-von Neumann computer architecture may include at least one of an FPGA and an ASIC. The processor may be realized by the group of circuits.

[0097] The storage device 42 includes at least one memory capable of storing desired data. In other words, the storage device 42 includes at least one memory that stores desired data. The memory may be realized by a group of circuits (e.g., at least one of electronic circuits and electric circuits). For example, the storage device 42 may store a computer program executed by the arithmetic device 41. In this case, the storage device 42 including at least one memory may be used as a recording medium for recording the computer program executed by the arithmetic device 41. The storage device 42 may temporarily store data that the arithmetic device 41 temporarily uses when the arithmetic device 41 is executing a computer program. The storage device 42 may also store data that the information processing device 4 stores long-term.

[0098] The storage device 42 may include at least one of a RAM, a ROM, a hard disk device, a magneto-optical disk device, an SSD, and a disk array device. In other words, the storage device 42 may include a non-transitory recording medium. The information processing device 4 is not limited to a single storage device 42, and may include multiple storage devices 42.

[0099] The arithmetic device 41 loads a computer program 421 including at least one of computer program code and computer program instructions. The information processing device 4 functions as a device that performs a predetermined operation when the arithmetic device 41 executes the computer program 421. The computer program 421 is a computer program for causing the arithmetic device 41 to perform (i.e., execute) the operation that the information processing device 4 is to perform. In other words, the computer program 421 is a computer program for causing the information processing device 4 to function so as to perform the predetermined operation. The arithmetic device 41, together with the storage device 42 or the like in which the computer program 421 is recorded (in other words, together with the storage device 41 and the computer program 421 recorded in the storage device 42 or the like), causes the information processing device 4 to function as a device that performs the predetermined operation. In other words, at least one processor included in the arithmetic device 41, a memory (recording medium) included in the storage device 42 or the like, and the computer program 421 are configured to cause the information processing device 4 to perform the processing that the information processing device 4 is to perform.

[0100] The computer program 421 executed by the arithmetic device 41 may be recorded in a storage device 42 (i.e., a recording medium) included in the information processing device 4, or may be recorded in any storage medium (for example, a hard disk or semiconductor memory) built into the information processing device 4 or externally attachable to the information processing device 4. Alternatively, the arithmetic device 41 may download the computer program 421 to be executed from a device external to the information processing device 4 via a network interface.

[0101] If the arithmetic device 41 includes a single processor, the arithmetic device 41 may use the single processor to execute the computer program 421. If the arithmetic device 41 includes multiple processors, the arithmetic device 41 may use the multiple processors to execute the computer program 421. In this case, the arithmetic device 41 may use one processor to execute a part of the computer program 421, and another processor to execute another part of the computer program 421. The arithmetic device 41 may use any one of the multiple processors to execute the computer program 421.

[0102] A computational model that can be constructed by machine learning may be implemented in the information processing device 4 by the computation device 41 executing the computer program 421. An example of a computational model that can be constructed by machine learning is a computational model including a neural network (so-called artificial intelligence (AI). In this case, learning of the computational model may include learning of parameters of the neural network (for example, at least one of weights and biases).

[0103] Note that a computational model already constructed by offline machine learning using teacher data may be implemented in the information processing device 4. Furthermore, the computational model implemented in the information processing device 4 may be updated by online machine learning on the information processing device 4. Alternatively, the information processing device 4 may use a computational model implemented in a device external to the information processing device 4 in addition to or instead of the computational model implemented in the information processing device 4.

[0104] The recording medium for recording the computer program 421 executed by the arithmetic device 41 may be at least one of a CD-ROM, CD-R, CD-RW, flexible disk, MO, DVD-ROM, DVD-RAM, DVD-R, DVD+R, DVD-RW, DVD+RW, Blu-ray (registered trademark), or other optical disk, a magnetic medium such as a magnetic tape, a magneto-optical disk, a semiconductor memory such as a USB memory, or any other medium capable of storing a program. The recording medium may include a device capable of recording the computer program 421 (for example, a general-purpose device or a dedicated device in which the computer program 421 is implemented in a state in which it can be executed in at least one of the forms of software and firmware). Furthermore, each process or function included in the computer program 421 may be realized by a logical processing block realized within the arithmetic device 41 when the arithmetic device 41 executes the computer program, or may be realized by hardware such as a predetermined gate array (FPGA, ASIC) provided in the information processing device 4, or may be realized in a form that mixes logical processing blocks and partial hardware modules that realize some elements of the hardware.

[0105] The communication device 43 may be configured to be able to communicate with devices external to the information processing device 4 (for example, at least one of the processing device 1, the measuring device 2, and the transport device 3) via a communication network not shown.

[0106] The input device 44 is a device that accepts information input to the information processing device 4 from outside the information processing device 4. For example, the input device 44 may include an operation device that can be operated by a user (for example, at least one of a keyboard, a mouse, and a touch panel). For example, the input device 44 may include a reading device that can read information recorded as data on a recording medium that can be externally attached to the information processing device 4. For example, the input device 44 may accept information input from a computer external to the information processing device 4.

[0107] The output device 45 is a device that outputs information to the outside of the information processing device 4. For example, the output device 45 may output information as an image. That is, the output device 45 may include a display device 451 (a so-called display) that can display an image showing the information to be output. For example, the output device 45 may output information as sound. That is, the output device 45 may include an audio device (a so-called speaker) that can output sound. For example, the output device 45 may output information on paper. That is, the output device 45 may include a printing device (a so-called printer) that can print desired information on paper.

[0108] As shown in FIG. 1 , the information processing device 4 constitutes a part of the processing system SYS. However, the information processing device 4 does not have to be a part of the processing system SYS. In other words, the information processing device 4 may be a device external to the processing system SYS. For example, the information processing device 4 may be an information terminal device or a display system different from the processing system SYS. An example of a display system is at least one of a tablet terminal and a smartphone.

[0109] The information processing device 4 may include an integrated circuit configured to execute instructions. The integrated circuit may include a calculation device 41. In this case, the information processing device 4 may not include a storage device 42. That is, the device including the integrated circuit and the device including the storage device 42 may be different devices. In this case, the device including the integrated circuit and the device including the storage device 42 may communicate (e.g., transmit) with each other.

[0110] (1-5) Configuration of the Jig 5 With reference to FIGS. 8 and 9, an example structure of a jig 5 for holding a workpiece W will be described. FIG. 8 is a perspective view showing the structure of the jig 5 when it is not holding a workpiece W, and FIG. 9 is a perspective view showing the structure of the jig 5 when it is actually holding a workpiece W. Note that the structure of the jig 5 shown in FIGS. 8 and 9 is only an example, and the structure of the jig 5 is not limited to the structure shown in FIGS. 8 and 9. This is because the jig is created according to the workpiece W to be machined and the location on the workpiece W to be machined. As a result, various types of jigs exist at the site where the workpiece W is machined. In order to efficiently machine the workpiece W, the jig is often configured to be able to hold multiple workpieces W. Note that the jig 5 may also be referred to as a holder because it holds one or multiple workpieces W.

[0111] 8 and 9, the jig 5 includes a bottom member 51, a plurality of support members 52, and a plurality of connecting members 53. In the example shown in FIGS. 8 and 9, the jig 5 includes four support members 52 and four connecting members 53. However, the jig 5 may include a single support member 52. The jig 5 may include a single connecting member 53. The jig 5 may not include the connecting member 53. The jig 5 may be kinematically supported. The jig 5 may be kinematically supported at three points. The jig 5 may be kinematically supported at two or less points or four or more points.

[0112] The bottom member 51 is a plate-shaped member. The upper surface of the bottom member 51 (the surface facing the +Z side in the example shown in FIGS. 8 and 9 ) may be a surface along the XY plane. The lower surface of the bottom member 51 (the surface facing the −Z side in the example shown in FIGS. 8 and 9 ) may be a surface along the XY plane. The shape of the bottom member 51 is not limited to a rectangle. For example, the bottom member 51 may be placed on the stage 131 of the processing apparatus 1. Specifically, the bottom member 51 may be placed on the stage 131 with the lower surface of the bottom member 51 facing the stage 131. For example, the bottom member 51 may be placed on the stage 213 of the measuring apparatus 2. Specifically, the bottom member 51 may be placed on the stage 213 with the lower surface of the bottom member 51 facing the stage 213.

[0113] At least a portion of the upper surface of the bottom member 51 functions as a mounting surface 510 on which the workpiece W is placed. The workpiece W is placed on the mounting surface 510. The mounting surface 510 is capable of supporting the workpiece W placed on the mounting surface 510. The mounting surface 510 is capable of holding the workpiece W placed on the mounting surface 510. In this case, the mounting surface 510 may be equipped with at least one of a mechanical chuck, an electrostatic chuck, a vacuum chuck, or the like to hold the workpiece W. Alternatively, a workpiece holding member for holding the workpiece W may be arranged on the mounting surface 510. Alternatively, the mounting surface 510 may not be capable of holding the workpiece W placed on the mounting surface 510. In this case, the workpiece W may be placed on the mounting surface 510 without clamping.

[0114] 8 and 9, the mounting surface 510 is provided with a plurality of mechanical chucks 55. For example, as shown in FIG. 9, the jig 5 may hold the same number of workpieces W as the number of chucks 55. The jig 5 may hold a number of workpieces W that is fewer than the number of chucks 55. The jig 5 may hold a plurality of workpieces W, or may hold a single workpiece W. The number of chucks 55 shown in FIGS. 8 and 9 is an example and is not limited to this. In other words, the jig 5 may be provided with three or fewer chucks 55, or may be provided with five or more chucks 55. The jig 5 does not necessarily have to be provided with a chuck 55.

[0115] Each of the multiple support members 52 is a columnar member extending upward (toward the +Z side in the example shown in FIGS. 8 and 9 ) from the upper surface of the bottom member 51. Each of the multiple support members 52 is a member for supporting a base plate 50. Therefore, each of the multiple support members 52 supports a plurality of base plates 50. Therefore, multiple base plates 50 are arranged on the jig 5. However, when the jig 5 has a single support member 52, a single base plate 50 may be arranged on the jig 5.

[0116] 8 and 9, the multiple support members 52 are arranged at each vertex of a rectangular region on the top surface of the bottom member 51. However, the arrangement of the multiple support members 52 is not limited to the example shown in Figures 8 and 9. Also, in the example shown in Figures 8 and 9, four support members 52 are arranged on the bottom member 51. However, the number of support members 52 is not limited to four. Three or less or five or more support members 52 may be arranged on the bottom member 51.

[0117] The base plate 50 may be supported by the support member 52 so that the positional relationship between the reference portion of the jig 5 and the base plate 50 is a predetermined positional relationship. Information regarding the positional relationship between the reference portion of the jig 5 and the base plate 50 may be known information in the machining system SYS.

[0118] At least two of the multiple support members 52 may have different heights. In other words, the heights at which at least two of the multiple support members 52 support the base plate 50 may be different. Note that the "height" here may refer to the distance in the Z-axis direction from the bottom member 51. As a result, at least two of the multiple base plates 50 arranged in the jig 5 may be arranged at positions with different heights. However, all of the multiple support members 52 may have the same height. The height of at least one of the multiple support members 52 may be set to a height that matches the height of the workpiece W placed on the placement surface 510.

[0119] Each of the multiple connecting members 53 connects two non-adjacent support members 52. When the jig 5 is viewed in plan from above (the +Z side in the examples shown in FIGS. 8 and 9 ), each connecting member 53 may be a member extending along a diagonal of a polygon having the multiple support members 52 as vertices. Each connecting member 53 may be a member extending in a direction intersecting the direction in which the support members 52 extend. Note that in addition to or instead of a single connecting member 53, multiple connecting members 53 may connect two non-adjacent support members 52. Note that each of the multiple connecting members 53 may connect two adjacent support members 52.

[0120] At least one of a read code or a non-contact communication tag indicating identification information for identifying the jig 5 may be attached to a part of the jig 5 (for example, the bottom member 51). An example of the read code is at least one of a two-dimensional code and a barcode.

[0121] (2) Operation of the Machining System SYS The operation performed by the machining system SYS will be described. In this embodiment, the machining system SYS may perform a machining operation for machining the workpiece W, mainly using the machining device 1. Furthermore, the machining system SYS may perform a control information generation operation for generating machining control information, mainly using the measuring device 2. Therefore, the machining operation and the control information generation operation will be described in order below.

[0122] (2-1) Processing Operation First, the processing operation will be described. In particular, as an example of the processing operation, the additional processing operation performed by the processing apparatus 1 will be described. As described above, the processing apparatus 1 forms a three-dimensional structure using a laser build-up welding method. Therefore, the processing apparatus 1 may form a three-dimensional structure by performing an existing additional processing operation that complies with the laser build-up welding method. Below, a brief description will be given of an example of the processing operation for forming a three-dimensional structure using the laser build-up welding method.

[0123] To form a three-dimensional structure, the processing apparatus 1 sequentially forms, for example, a plurality of layered partial structures (hereinafter referred to as "structural layers") aligned along the Z-axis direction. For example, the processing apparatus 1 sequentially forms a plurality of structural layers obtained by slicing the three-dimensional structure along the Z-axis direction, one by one. As a result, a three-dimensional structure is formed, which is a layered structure in which a plurality of structural layers are stacked.

[0124] (2-2) Control Information Generating Operation The control information generating operation will be described below. As described above, the measuring device 2 (particularly, the control information generating device 22) generates processing control information by performing the control information generating operation.

[0125] The control information generating device 22 may generate processing control information based on object information that indicates the actual three-dimensional shape of the object, the workpiece W, that the processing device 1 is about to process.

[0126] An example of object information is measurement information indicating the measurement results of the three-dimensional shape of the workpiece W by the shape measuring device 21. In this case, in order to generate processing control information, the shape measuring device 21 may measure the three-dimensional shape of the workpiece W, and the control information generating device 22 may generate the processing control information based on the measurement information. When the processing apparatus 1 processes multiple workpieces W, the shape measuring device 21 may measure the three-dimensional shapes of each of the multiple workpieces W collectively or sequentially, and the control information generating device 22 may sequentially generate multiple pieces of processing control information to be used for processing the multiple workpieces W, respectively, based on the measurement information of the multiple workpieces W.

[0127] However, when the processing device 1 processes multiple workpieces W that are assumed to have the same characteristics (e.g., shape), the shape measuring device 21 does not need to measure the three-dimensional shapes of all of the multiple workpieces W in order to generate processing control information. For example, the shape measuring device 21 may measure the three-dimensional shape of one workpiece W among the multiple workpieces W, while not measuring the three-dimensional shapes of the remaining workpieces W among the multiple workpieces W. In this case, the control information generating device 22 may generate processing control information that is commonly used to process each of the multiple workpieces W, based on measurement information indicating the measurement results of the three-dimensional shape of one workpiece W.

[0128] An example of multiple workpieces W assumed to have the same characteristics is multiple turbine blades attached to a rotor that constitutes a turbine and is rotatable around a rotation axis. Multiple turbine blades with the same characteristics are typically attached to the rotor. However, as the turbine is used, friction between the fluid and the turbine blades causes the turbine blades to wear. As a result, at least two of the multiple turbine blades that had the same characteristics before the turbine began to be used may have different characteristics (especially their shapes) due to the use of the turbine. However, even in this case, the amount of wear of the multiple turbine blades is likely to be approximately the same. As a result, at least two of the multiple turbine blades that had the same characteristics before the turbine began to be used may be considered to be approximately the same, even after the turbine has been used, although strictly speaking, they may be different. Furthermore, when repairing worn turbine blades, a portion of the worn portion of the turbine blade may be removed to make the shapes of the multiple turbine blades in need of repair approximately the same. In such cases, the shape measurement device 21 may measure the three-dimensional shape of one of the multiple worn turbine blades while not measuring the three-dimensional shapes of the remaining turbine blades. The control information generating device 22 may generate processing control information that is commonly used to process (typically repair) each of multiple worn turbine blades based on measurement information that indicates the measurement results of the three-dimensional shape of one turbine blade.

[0129] The object information may be any information as long as it can directly or indirectly indicate the actual three-dimensional shape of the workpiece W. For example, the object information may be point cloud information that indicates the actual three-dimensional shape of the workpiece W using multiple points. In this embodiment, an example will be described in which an object model OM (see FIG. 10( a)) is used as object information. In other words, in this embodiment, an example will be described in which model information indicating the object model OM is used as object information. The object model OM is a three-dimensional model that indicates the actual three-dimensional shape of the workpiece W. In other words, the object model OM is a three-dimensional model that has the same three-dimensional shape as the actual three-dimensional shape of the workpiece W. Examples of three-dimensional models include at least one of a wireframe model, a surface model, and a solid model. In this embodiment, an example will be described in which a mesh model (typically a polygonal mesh model, the same applies hereinafter), which is a specific example of a surface model, is used as the object model OM. A mesh model is a three-dimensional model that represents the three-dimensional shape of an object using vertices, edges, and faces. A mesh model is a three-dimensional model that represents the three-dimensional shape of an object using multiple meshes (in other words, facets or computational grids) having polygonal shapes.

[0130] The object model OM may be generated based on measurement information indicating the measurement results of the three-dimensional shape of the workpiece W by the shape measuring device 21. In other words, the object model OM may be generated based on the measurement results of the three-dimensional shape of the workpiece W by the shape measuring device 21. In this case, the control information generating device 22 may generate the object model OM based on the measurement information. Alternatively, a device different from the control information generating device 22 (for example, the shape measuring device 21) may generate the object model OM based on the measurement information.

[0131] Alternatively, the object model OM may be generated without using measurement information indicating the measurement results of the three-dimensional shape of the workpiece W by the shape measurement device 21. For example, the control information generating device 22 (or a device different from the control information generating device 22, the same applies hereinafter in this paragraph) may estimate the actual three-dimensional shape of the workpiece W based on events that affect the three-dimensional shape of the workpiece W, and generate the object model OM based on the estimation results. In other words, the control information generating device 22 may generate a three-dimensional model indicating the estimated three-dimensional shape as the object model OM. In this case, the control information generating device 22 may estimate the actual three-dimensional shape of the workpiece W using a computational model that can be constructed by machine learning (e.g., a computational model including a neural network (so-called artificial intelligence (AI))). Alternatively, a user of the machining system SYS may estimate the actual three-dimensional shape of the workpiece W based on events that affect the three-dimensional shape of the workpiece W, and generate the object model OM based on the estimation results. In other words, the user may generate a three-dimensional model indicating the estimated three-dimensional shape as the object model OM. Alternatively, the control information generating device 22 may generate the object model OM based on the result of estimation of the actual three-dimensional shape of the workpiece W by the user.

[0132] An example of an event that affects the three-dimensional shape of the workpiece W is the environment in which the workpiece W is used. Another example of an event that affects the three-dimensional shape of the workpiece W is the force applied to the workpiece W under the conditions in which the workpiece W is used. Another example of an event that affects the three-dimensional shape of the workpiece W is the period of time the workpiece W is used. For example, if the workpiece W is the turbine blade described above, an example of an event that affects the three-dimensional shape of the turbine blade is at least one of the environment in which the turbine blade is used, the force applied to the turbine blade, and the period of time the turbine blade is used. In this case, the control information generating device 22, a device different from the control information generating device 22, or a user may estimate the amount of wear on the turbine blade (i.e., the missing portion of the turbine blade) based on the event that affects the three-dimensional shape of the turbine blade, and estimate the actual three-dimensional shape of the turbine blade based on the estimated amount of wear.

[0133] A three-dimensional model represented by a file representing CAD (Computer Aided Design) data may be used as the object model OM. Examples of files representing CAD data include at least one of a file with an extension "DWF," a file with an extension "DXF," a file with an extension "DWG," and a file with an extension "STP." When a mesh model is used as the object model OM, a three-dimensional model represented by a file with an extension "STL" may be used as the object model OM.

[0134] In addition to or instead of the object information described above, the control information generating device 22 may generate the processing control information based on reference information indicating a target shape of the workpiece W. In other words, the control information generating device 22 may generate the processing control information based on reference information indicating a designed or ideal three-dimensional shape of the workpiece W.

[0135] The reference information may be any information as long as it can directly or indirectly indicate the target shape of the workpiece W. For example, the reference information may be point cloud information that indicates the target shape of the workpiece W using a plurality of points. In this embodiment, an example will be described in which a reference model RM (see FIG. 10(b)) is used as the reference information. In other words, in this embodiment, an example will be described in which model information indicating the reference model RM is used as the reference information. The reference model RM is a three-dimensional model that indicates the target shape of the workpiece W. In other words, the reference model RM is a three-dimensional model that has the same three-dimensional shape as the target shape of the workpiece W. In this embodiment, an example will be described in which a mesh model, which is a specific example of a surface model, is used as the reference model RM.

[0136] A CAD model of a workpiece W having a target shape may be used as the reference model RM. A three-dimensional model generated based on information obtained by actually measuring the three-dimensional shape of a workpiece W having a target shape may be used as the reference model RM. In this case, a three-dimensional model indicated by a file indicating CAD data may be used as the reference model RM. Examples of files indicating CAD data include at least one of a file with an extension DWF, a file with an extension DXF, a file with an extension DWG, and a file with an extension STP. When a mesh model is used as the reference model RM, a three-dimensional model indicated by a file with an extension STL may be used as the reference model RM.

[0137] Here, as shown in FIGS. 10( a) and 10(b), which respectively schematically illustrate a reference model RM and an object model OM, the target shape of the workpiece W represented by the reference model RM (i.e., the design or ideal three-dimensional shape of the workpiece W) typically differs from the actual three-dimensional shape of the workpiece W represented by the object model OM. For example, as described above, if a defective part requiring repair is used as the workpiece W, as shown in FIG. 10(b), the object model OM represents the three-dimensional shape of the workpiece W that has been partially damaged due to use of the workpiece W, while as shown in FIG. 10(a), the reference model RM represents the three-dimensional shape of the workpiece W without any defects. In other words, the object model OM represents the three-dimensional shape of the workpiece W after actual use, while the reference model RM represents the three-dimensional shape of the workpiece W before it was actually used. As an example, if the workpiece W is a turbine blade with a worn portion, the object model OM represents the three-dimensional shape of the worn turbine blade, while the reference model RM represents the three-dimensional shape of the unworn turbine blade. That is, the object information indicates the three-dimensional shape of the turbine blade after it has actually been used as a turbine component, while the reference information indicates the three-dimensional shape of the turbine blade before it has actually been used as a turbine component. In other words, the object information indicates the three-dimensional shape of a used turbine blade, while the reference information indicates the three-dimensional shape of an unused turbine blade. Therefore, when a portion of the workpiece W is lost (e.g., worn) as the workpiece W is used, the target shape of the workpiece W indicated by the reference model RM usually differs from the actual three-dimensional shape of the workpiece W indicated by the object model OM. Note that because the reference model RM indicates the target shape of the workpiece W, the reference model RM may also be referred to as a target model.

[0138] In this embodiment, "use of the workpiece W" may include using the workpiece W in a manner suited to the intended use of the workpiece W. When the workpiece W is used as a component of a product, "use of the workpiece W" may include using a product including the workpiece W in a manner suited to the intended use of the product. For example, when the workpiece W includes a turbine blade, "use of the turbine blade" may include using a turbine including the turbine blade in a manner suited to the intended use of the turbine.

[0139] Furthermore, considering that a situation in which a portion of the workpiece W is lost (e.g., worn) due to use of the workpiece W as described above is an example of a situation in which the machining system SYS of this embodiment is used, "use of the workpiece W" may include use of the workpiece W that causes loss of a portion of the workpiece W. For example, "use of the workpiece W" may include use of the workpiece W for a long period of time that causes loss of a portion of the workpiece W. Therefore, an actually used workpiece W may include a workpiece W that has been used long enough to cause loss of a portion of the workpiece W. On the other hand, a workpiece W before actual use may include a workpiece W that has been used but not long enough to cause loss of a portion of the workpiece W. For example, a workpiece W before actual use may include use of the workpiece W for a short period of time that does not cause loss of a portion of the workpiece W (e.g., a test run of the workpiece W or a product including the workpiece W). Of course, a workpiece W before actual use may literally include a workpiece W that has not yet been used. For example, a workpiece W before actual use may include a workpiece W before it is shipped as a product or part. For example, a workpiece W before actual use may include a workpiece W in the design stage.

[0140] The reference model RM may be generated based on the measurement results of the three-dimensional shape of the workpiece W before it is actually used. In this case, the shape measuring device 21 (or a device different from the shape measuring device 21, the same applies hereinafter in this paragraph) measures the three-dimensional shape of the workpiece W before it is actually used, and the reference model RM may be generated based on the measurement results of the shape measuring device 21. Alternatively, the reference model RM may be generated based on CAD data or the like that indicates the designed three-dimensional shape of the workpiece W.

[0141] In this embodiment, the control information generating device 22 generates processing control information based on both an object model OM, which is an example of object information, and a reference model RM, which is an example of reference information. Specifically, as described above, the reference model RM indicates a target shape of the workpiece W, and the object model OM indicates an actual three-dimensional shape of the workpiece W. In this case, the difference between the reference model RM and the object model OM corresponds to a three-dimensional model indicating the three-dimensional shape of the object (i.e., the three-dimensional structure ST) to be formed by the processing device 1 performing additive processing. Therefore, the control information generating device 22 may generate a three-dimensional model corresponding to the difference between the reference model RM and the object model OM as a differential model DM indicating the three-dimensional shape of the three-dimensional structure ST to be formed by the processing device 1 performing additive processing. The differential model DM is typically a three-dimensional model corresponding to a portion of the reference model RM. 11(a) schematically illustrates a reference model RM, FIG. 11(b) schematically illustrates an object model OM, and FIG. 11(c) schematically illustrates a differential model DM generated based on the reference model RM shown in FIG. 11(a) and the object model OM shown in FIG. 11(b). The control information generating device 22 may then generate processing control information based on the differential model DM. For example, the control information generating device 22 may perform a slicing process to divide the differential model DM into multiple layered models at a layering pitch corresponding to the thickness of the structural layer SL, thereby generating multiple slice data corresponding to each of the multiple structural layers SL that constitute the three-dimensional structure ST. The control information generating device 22 may then generate multiple pieces of processing control information used to form each of the multiple structural layers SL based on the multiple slice data.

[0142] Note that, when the workpiece W is deformed as the workpiece W is used, the object model OM indicates the actual three-dimensional shape of the deformed workpiece W. In contrast, the reference model RM may indicate the target shape of the undeformed workpiece W. In this case, the control information generating device 22 may deform the target shape indicated by the reference model RM to match the actual three-dimensional shape of the deformed workpiece W indicated by the object model OM. In other words, the control information generating device 22 may deform the reference model RM to match the object model OM. The control information generating device 22 may generate a three-dimensional model corresponding to the difference between the deformed reference model RM and the object model OM as a differential model DM. In other words, the control information generating device 22 may generate the differential model DM based on the deformed reference model RM and the object model OM.

[0143] A three-dimensional model represented by a file representing CAD data may be used as the differential model DM. Examples of files representing CAD data include at least one of a file with an extension "DWF," a file with an extension "DXF," a file with an extension "DWG," and a file with an extension "STP." When a mesh model is used as the differential model DM, a three-dimensional model represented by a file with an extension "STL" may be used as the differential model DM.

[0144] Assembly information may be included in a file (e.g., a CAD file representing CAD data; the same applies hereinafter in this paragraph). Here, "assembly information" may refer to information for associating data related to multiple parts with each other. For example, a file may include assembly information that associates information related to a differential model DM with information related to an object model OM. For example, a file may include assembly information that associates information related to a differential model DM with information related to an object model OM with information related to a reference model RM. In this case, the object model OM and the differential model DM, or the object model OM, the differential model DM, and the reference model RM, may be included in the file in the form of assembly information. The file may include a first object model OM obtained by measuring a workpiece W with a first measurement accuracy and a first object model OM obtained by measuring a workpiece W with a second measurement accuracy higher than the first measurement accuracy. In this case, the file may include information related to the measurement accuracy used when the object model OM was acquired. For example, a first object model OM may be associated in a file with information about the measurement accuracy used when the first object model OM was acquired, and for example, a second object model OM may be associated in a file with information about the measurement accuracy used when the second object model OM was acquired.

[0145] Alternatively, at least one of the object model OM, the reference model RM, and the differential model DM may be included in a file (e.g., a CAD file indicating CAD data; the same applies hereinafter in this paragraph) in an information format different from the information format of the assembly information. Alternatively, at least one of a file including the object model OM, a file including the reference model RM, and a file including the differential model DM may be stored in the storage device 222 or the like. In other words, the object model OM, the reference model RM, and the differential model DM may be included in separate files. In this case, a management file including information indicating that at least two of the file including the object model OM, the file including the reference model RM, and the file including the differential model DM are associated with each other may be stored in the storage device 222 or the like.

[0146] However, the control information generating device 22 may generate the processing control information using the object model OM but without using the reference model RM. The control information generating device 22 may generate the processing control information using the reference model RM but without using the object model OM.

[0147] (3) Usage of the Machining System SYS Next, an example of usage of the machining system SYS will be described with reference to Figs. 12 to 16. Fig. 12 is a conceptual diagram showing an example of usage of the machining system SYS. Figs. 13(a) to 13(e) are diagrams showing an example of the transition of information registered in the information processing device 4. Fig. 14 is a diagram showing an example of information related to jigs registered in the information processing device 4. Fig. 15 is a flowchart showing an example of an operation for acquiring batch information. Fig. 16 is a diagram showing an example of a processing cycle related to repair processing.

[0148] 12, for convenience, two processing devices 1 (e.g., processing devices 1#1 and 1#2) and a single measuring device 2 (e.g., measuring device 2#1) are depicted, but the number of processing devices 1 and the number of measuring devices 2 are not limited to this. The processing devices 1 and the measuring devices 2 may be installed on the same floor, or may be installed on different floors.

[0149] The measurement coordinates in the measuring device 2 may be associated with the processing coordinates in the processing device 1 (for example, processing devices 1#1 and 1#2). The association of the measurement coordinates with the processing coordinates may mean that coordinates in one of the measurement coordinates and the processing coordinates can be converted into coordinates in the other of the measurement coordinates and the processing coordinates. Note that the measurement coordinates and the processing coordinates may be the same.

[0150] Below, a process related to repair processing of a workpiece W that has a missing portion and needs to be repaired will be described. Repair processing of the workpiece W may be performed, for example, as follows: A measuring device 2 (specifically, shape measuring device 21) may measure the workpiece W. A measuring device 2 (specifically, control information generating device 22) may generate processing control information based on the measurement results of the workpiece W. One processing device 1 (here, processing device 1#1 or 1#2) may process the workpiece W based on the processing control information. A measuring device 2 (specifically, shape measuring device 21) may re-measure the processed workpiece W.

[0151] The repair processing of the workpiece W may be performed in a state where the workpiece W is attached to the jig 5. In other words, the repair processing of the workpiece W may be performed in a state where the jig 5 holds the workpiece W. For this reason, in the example shown in FIG. 12 , the workpiece W and the jig 5 that holds the workpiece W are registered in the information processing device 4.

[0152] For example, the information processing device 4 may register jig information related to a jig 5 that holds one or more workpieces W. That is, the calculation device 41 of the information processing device 4 may store the jig information related to the jig 5 in the storage device 42. The jig information may include identification information for identifying the jig 5. Note that the identification information of the jig 5 may be the serial number of the jig 5.

[0153] As described above, the jig 5 may be provided with at least one of a read code and a non-contact communication tag indicating identification information. Therefore, the information processing device 4 may acquire the identification information of the jig 5 by reading at least one of the read code and the non-contact communication tag assigned to the jig 5. The information processing device 4 may then register the acquired identification information. Note that a character string indicating the identification information for each jig may be written on the jig 5. In this case, the information processing device 4 may acquire and register the jig information related to the jig 5 by detecting the identification information from an image in which the character string indicating the identification information written on the jig 5 is captured. Note that the operator of the information processing device 4 may input the identification information of the jig 5 via the input device 44, thereby registering the identification information in the information processing device 4.

[0154] For example, the information processing device 4 may register work information related to one or more workpieces W held in the jig 5. That is, the calculation device 41 may store the workpiece information related to the workpiece W in the storage device 42. The workpiece information may include identification information for identifying the workpiece W. The identification information of the workpiece W may be the serial number of the workpiece W. If the workpiece W is a turbine blade, the workpiece information may include information related to the turbine to which the workpiece W, which is a turbine blade, belongs.

[0155] The workpiece W may be provided with at least one of a read code and a contactless communication tag indicating identification information for identifying the workpiece W. Therefore, the information processing device 4 may acquire the identification information of the workpiece W by reading at least one of the read code and the contactless communication tag assigned to the workpiece W. The information processing device 4 may then register the acquired identification information. The workpiece W may have a character string indicating the identification information written thereon. In this case, the information processing device 4 may acquire and register work information related to the workpiece W by detecting the identification information from an image in which the character string indicating the identification information written on the workpiece W is captured. The operator of the information processing device 4 may input the identification information of the workpiece W via the input device 44, thereby registering the identification information in the information processing device 4.

[0156] The jig information and the workpiece information may be registered in the information processing device 4 before one or more workpieces W are attached to the jig 5. Note that the jig information and the workpiece information may be registered in the information processing device 4 after one or more workpieces W are attached to the jig 5.

[0157] After one or more workpieces W are attached to the jig 5 (in other words, after one or more workpieces W are held in the jig 5), position information indicating the position of one or more workpieces W on the jig 5 may be registered in the information processing device 4 as part of the workpiece information.

[0158] An example of the above-mentioned read code is at least one of a two-dimensional code and a barcode. An example of the above-mentioned non-contact communication tag is at least one of an IC (Integrated Circuit) tag, an RFID (Radio Frequency Identification) tag, an NFC (Near Field Communication), and Felica (registered trademark).

[0159] In repair processing of the workpieces W, one jig 5 and one or more workpieces W held by the one jig 5 may be treated as one processing unit. Such one processing unit may be called a "batch." In the following description, one jig 5 and one or more workpieces W held by the one jig 5 will be referred to as a "batch" as appropriate. Furthermore, information related to one batch will be referred to as "batch information" as appropriate.

[0160] 13, the registration of the above-mentioned jig information and workpiece information in the information processing device 4 will be described. An image U1 shown in Fig. 13(a) is an example of an image (e.g., UI: User Interface) displayed on the display device 451 of the information processing device 4. The image U1 has a display field U101 showing the name of one batch, a display field U102 showing jig information, a plurality of display fields U103 showing workpiece information, a display field U104 showing difference data, and a display field U105 showing machining paths.

[0161] For example, before the jig information is registered in the information processing device 4, the operator of the information processing device 4 may input the name of the batch via the input device 44. When the operator inputs the name of the batch via the input device 44 and furthermore the jig information related to the jig 5 is registered in the information registration device 4, the calculation device 41 of the information processing device 4 may control the output device 45 so that, for example, the image U2 shown in FIG. 13(b) is displayed on the display device 451. In FIG. 13(b), the name of the batch is "220320_1" (see display field U101 in FIG. 13(b)). Also, the jig information is "xxxxxx" (see display field U102 in FIG. 13(b)). Also, the jig information may be identification information of the jig 5.

[0162] When workpiece information related to one or more workpieces W held by the jig 5 is registered in the information processing device 4, the calculation device 41 may control the output device 45 so that, for example, image U3 shown in FIG. 13(c) is displayed on the display device 451. In FIG. 13(c), the workpiece information is denoted as "aaa" for convenience. However, the actual workpiece information may differ for each workpiece W. In FIG. 13, there are three display fields U103, but the number of display fields U103 is not limited to three. For example, the number of display fields U103 may be the same as the maximum number of workpieces W that the jig 5 can hold. In this case, the number of display fields U103 may be changed based on the registered jig information. The position of the workpiece W (denoted as "Position A" in FIG. 13) may be information indicating, for example, which of the multiple mechanical chucks 55 provided on the jig 5 is being used (in other words, information indicating how many workpieces W are held by the jig 5).

[0163] In this way, in one batch of information, jig information (e.g., identification information of the jig 5) and work information (e.g., identification information and position information of the work W) are linked to each other. That is, the jig information and the work information are linked to each other and registered in the information processing device 4. In other words, the jig information and the work information may be linked to each other and stored in the storage device 42 of the information processing device 4.

[0164] Here, with reference to FIG. 14, jig information will be further explained. For example, a table relating to jig information as shown in FIG. 14 may be stored in the storage device 42 of the information processing device 4. In other words, the jig information may be organized and stored in the storage device 42. In FIG. 14, the jig information may include the type of jig, the repair location, the maximum number of jigs that can be placed, the corresponding device, and the jig number. Although not shown in FIG. 14, the jig information also includes identification information (for example, a serial number). The type of jig, the repair location, the maximum number of jigs that can be placed, the corresponding device, and the jig number (jig No.) are examples of jig information, and the jig information is not limited to these.

[0165] For example, a jig type "JIG AA4" may include four jigs with jig numbers "AA4-001," "AA4-002," "AA4-003," and "AA4-004." For example, a jig type "JIG AA6" may include four jigs with jig numbers "AA6-001," "AA6-002," "AA6-003," and "AA6-004." For example, a jig type "JIG BB4" may include four jigs with jig numbers "BB4-001," "BB4-002," "BB4-003," and "BB4-004." For example, a jig type "JIG CC2" may include two jigs with jig numbers "CC2-001" and "CC2-002."

[0166] For example, when at least one of the reading code and the non-contact communication tag attached to the jig 5 is read, the calculation device 41 of the information processing device 4 may obtain information about the jig corresponding to the read information (e.g., identification information) based on the table shown in Figure 14.

[0167] For example, it is assumed that the read information indicates a jig with jig number "AA4-001." As shown in FIG. 14, the jig with jig number "AA4-001" is a jig for repairing the tip portion of a turbine blade, which is the workpiece W. In this case, sequence information related to the repair of the tip portion may be linked to the jig with jig number "AA4-001." For example, when the read information indicates a jig with jig number "AA4-001," the calculation device 41 may acquire sequence information related to the repair of the tip portion linked to the jig with jig number "AA4-001." In this case, the calculation device 41 may include the sequence information related to the repair of the tip portion in the batch information. Note that the sequence information may mean information indicating a processing flow related to the workpiece W. When the workpiece W is processed according to sequence information, the sequence information may be referred to as a processing flow or processing information. When the workpiece W is measured according to the sequence information, the sequence information may be referred to as a measurement flow or measurement information. When the workpiece W is repaired according to the sequence information, the sequence information may be referred to as a repair flow or repair information.

[0168] 12 , before one or more workpieces W included in one batch are processed by one processing device 1, when one batch (i.e., a jig 5 holding one or more workpieces W) is placed on the measuring device 2, the measuring device 2 may acquire identification information of the jig 5 by reading at least one of a read code and a non-contact communication tag attached to the jig 5. For example, the measuring device 2 may transmit the identification information of the jig 5 to the information processing device 4. The information processing device 4 may identify one batch information based on the identification information of the jig 5 transmitted from the measuring device 2. Then, the information processing device 4 may transmit workpiece information included in the identified one batch information (in other words, linked to the identification information of the jig 5 transmitted from the measuring device 2) to the measuring device 2.

[0169] The measuring device 2 may link the measurement results of one batch to the identification information of the jig 5 and transmit them to the information processing device 4. As a result, the information processing device 4 may register the measurement results of one batch in one piece of batch information corresponding to the one batch. In other words, when the measuring device 2 links the measurement results of one batch to the identification information of the jig 5 and transmits them to the information processing device 4, the information processing device 4 may add the measurement results of one batch to the one piece of batch information based on the identification information of the jig 5. In other words, the calculation device 41 of the information processing device 4 may link the measurement results of one batch to the jig information and workpiece information included in the corresponding one piece of batch information and store them in the storage device 42.

[0170] As described above, the measuring device 2 (specifically, the control information generating device 22) generates machining control information. For example, the measuring device 2 may transmit machining path information included in the machining control information to the information processing device 4 as the measurement result of one batch. Furthermore, the measuring device 2 may transmit information related to the differential model DM to the information processing device 4 as the measurement result of one batch. For example, the information processing device 4 may register the machining path information and information related to the differential model DM in one batch of batch information corresponding to one batch. In this case, the calculation device 41 of the information processing device 4 may control the output device 45 so that an image U4 shown in FIG. 13(d) is displayed on the display device 451. In the image U4, information related to the differential model DM may be displayed in the display field U104 showing the differential data. In the example shown in FIG. 13(d), a figure corresponding to the differential model DM is displayed in the display field U104. Machining path information may be displayed in the display field U105 showing the machining path. In the example shown in FIG. 13(d), an arrow indicating the machining path is displayed in the display field U105. Incidentally, "mode" in image U4 may indicate a mode related to measurement (see "(4-4-1) First Object").

[0171] By registering the measurement results of one batch in one batch information, the measurement results (for example, at least one of information related to the differential model DM and machining path information) are linked to workpiece information. In this case, for example, the identification information of each workpiece W may be linked to the machining control information related to each workpiece W as the measurement results.

[0172] When the measuring device 2 is measuring another batch, the batch may be placed in a predetermined location (for example, a table marked "Waiting to scan" in FIG. 12).

[0173] The one batch measured by the measuring device 2 may be processed by either of the two processing devices 1#1 and 1#2. That is, one or more workpieces W included in one batch may be subjected to repair processing by one processing device 1. In other words, one processing device 1 may perform repair processing to repair one or more workpieces W having missing portions.

[0174] When a batch (i.e., a jig 5 holding one or more workpieces W) is placed on a processing device 1 (e.g., one of processing devices 1#1 and 1#2), the processing device 1 may obtain identification information of the jig 5 by reading at least one of the reading code and the non-contact communication tag attached to the jig 5.

[0175] For example, the processing device 1 may transmit identification information of the jig 5 to the information processing device 4. The information processing device 4 may identify batch information based on the identification information of the jig 5 transmitted from the processing device 1. Then, the information processing device 4 may transmit workpiece information and processing control information included in the identified batch information (in other words, linked to the identification information of the jig 5 transmitted from the processing device 1) to the processing device 1. The processing device 1 may receive the workpiece information and processing control information transmitted from the information processing device 4. Having received the workpiece information and processing control information, the processing device 1 may process one or more workpieces W included in the batch based on the received processing control information.

[0176] Here, one or more workpieces W are targets to be processed by one processing device 1. Therefore, workpiece information may also be referred to as processing target information. As described above, one processing device 1 acquires the identification information of the jig 5, thereby acquiring workpiece information (i.e., processing target information) from the information processing device 4. Therefore, it can be said that processing target information related to one or more workpieces W is acquired by acquiring the identification information of the jig 5.

[0177] After the processing of one or more workpieces W is completed (in other words, after the processing of one batch is completed), the processing device 1 may, for example, link the processing details of the one or more workpieces W to the identification information of the jig 5 holding the one or more workpieces W and transmit the linked processing details to the information processing device 4. In other words, the processing device 1 may link the processing details of the batch to the identification information of the jig 5 and transmit the linked processing details to the information processing device 4. As a result, the information processing device 4 may register the processing details of the batch in the batch information corresponding to the batch. In other words, when the processing device 1 links the processing details of the batch to the identification information of the jig 5 and transmits the linked processing details of the batch to the information processing device 4, the information processing device 4 may add the processing details of the batch to the batch information based on the identification information of the jig 5. In other words, the calculation device 41 of the information processing device 4 may store the processing details of the batch in the storage device 42, linking the processing details of the batch to the jig information and workpiece information included in the corresponding batch information.

[0178] By registering the processing details of one batch in one batch information, the processing details and workpiece information are linked. In this case, for example, the identification information of each workpiece W may be linked to the processing details of each workpiece W.

[0179] Furthermore, when both of the two processing devices 1#1 and 1#2 are processing workpieces W included in another batch, the above-mentioned one batch may be placed in a predetermined location (for example, a table labeled "Waiting for Forming" in Figure 12).

[0180] A batch in which one or more workpieces W are machined by the above-mentioned one processing device 1 may be measured again by the measuring device 2. For example, the measuring device 2 may perform post-machining measurement (i.e., inspection) on one or more workpieces W that are included in one batch and machined by the above-mentioned one processing device 1.

[0181] When one batch is placed on the measuring device 2, the measuring device 2 may acquire identification information of the jig 5 by reading at least one of the read code and the non-contact communication tag attached to the jig 5. The measuring device 2 may link the measurement results of the one batch to the identification information of the jig 5 and transmit them to the information processing device 4. As a result, the information processing device 4 may register the measurement results of the one batch in one batch information corresponding to the one batch. In other words, when the measuring device 2 links the measurement results of the one batch to the identification information of the jig 5 and transmits them to the information processing device 4, the information processing device 4 may add the measurement results of the one batch to the one batch information based on the identification information of the jig 5. In other words, the calculation device 41 of the information processing device 4 may link the measurement results of the one batch to the jig information and workpiece information included in the corresponding one batch information and store them in the storage device 42.

[0182] In this case, the calculation device 41 of the information processing device 4 may control the output device 45 so that the image U5 shown in Fig. 13(e) is displayed on the display device 451. The image U5 has a display field U106 showing the measurement results of one or more workpieces W machined by the machining device 1. Note that the image U5 does not need to have multiple display fields U103 showing workpiece information. In the image U5, the display field U106 may display the three-dimensional shape of the workpiece W machined by the machining device 1.

[0183] When the measuring device 2 is measuring another batch, the batch may be placed in a predetermined location (for example, a table labeled "Waiting for inspection after molding" in FIG. 12).

[0184] After being measured again by the measuring device 2, one or more workpieces W included in the batch may be removed from the jig 5. At this time, for example, an operator of the information processing device 4 may compare the jig 5 and one or more workpieces W with the jig information and workpiece information registered in the information processing device 4, respectively.

[0185] Furthermore, at least part of the transportation of the workpiece W (specifically, the jig 5 holding the workpiece W) from the measuring device 2 to one of the processing devices 1, the transportation of the workpiece W from one of the processing devices 1 to the measuring device 2, and the transportation of the workpiece W from a predetermined location to the measuring device 2 or one of the processing devices 1 may be performed by the transporting device 3 or by a user of the processing system SYS.

[0186] Here, the transition of information included in the batch information described with reference to FIGS. 13(a) to 13(e) (in other words, the method of acquiring the batch information) will be further described with reference to the flowchart of FIG. 15.

[0187] 15 , the arithmetic unit 41 of the information processing device 4 may acquire jig information related to the jig 5 (step S101). In this case, the arithmetic unit 41 may store the acquired jig information in the storage device 42 as part of one batch of information. In this case, the arithmetic unit 41 of the information processing device 4 may control the output device 45 so that, for example, an image U2 shown in FIG. 13( b) is displayed on the display device 451. At this time, the arithmetic unit 41 may link the one batch of information to the jig 5 registered in the table shown in FIG. 14 , for example, based on the jig information.

[0188] Next, the calculation device 41 may acquire workpiece information related to one or more workpieces W held on the jig 5 (step S102). In this case, the calculation device 41 may store the acquired workpiece information in the storage device 42 as another part of one batch information. In this case, the calculation device 41 may control the output device 45 so that, for example, an image U3 shown in 15(c) is displayed on the display device 451.

[0189] When one or more workpieces W held by the jig 5 are measured by the measuring device 2 before being machined by one machining device 1, the calculation device 41 may acquire the results of the pre-machining measurement from the measuring device 2 (step S103). In this case, the calculation device 41 may store the acquired results of the pre-machining measurement (for example, at least one of information related to the differential model DM and machining path information) in the storage device 42 as another part of one batch information. In this case, the calculation device 41 of the information processing device 4 may control the output device 45 so that an image U4 shown in FIG. 13(d) is displayed on the display device 451.

[0190] When one or more workpieces W held by the jig 5 are processed by one processing device 1, the arithmetic device 41 may acquire the processing details from the one processing device 1 (step S104). In this case, the arithmetic device 41 may store the acquired processing details in the storage device 42 as another part of one batch information.

[0191] When one or more workpieces W held in the jig 5 are machined by one processing device 1 and then measured by the measuring device 2, the calculation device 41 may acquire the post-machining measurement results from the measuring device 2 (step S105). In this case, the calculation device 41 may store the acquired post-machining measurement results (e.g., information indicating the three-dimensional shape of the workpieces W after machining) in the storage device 42 as another part of one batch information. In this case, the calculation device 41 of the information processing device 4 may control the output device 45 so that an image U5 shown in FIG. 13( e) is displayed on the display device 451.

[0192] As a result of the operation shown in the flowchart of FIG. 15 , the work content for one batch is compiled into one batch of batch information (i.e., management data). As a result, for example, when an operator of the information processing device 4 tracks the repair information after repairing one batch, the operator can obtain the repair information (i.e., batch information) for each batch, which is the unit of processing (i.e., repair). In addition, the batch information includes workpiece information. Therefore, the operator can track the repair information for each workpiece W based on the batch information. Furthermore, as described above, one batch of batch information may be linked to a jig 5 registered, for example, in the table shown in FIG. 14 . In this case, the batch information linked to the jig 5 may be read from the jig 5 registered in the table shown in FIG. 14 . Specifically, when the computing device 41 acquires the jig information for the jig 5, the computing device 41 may read the past batch information linked to the jig 5 from the storage device 42.

[0193] By the above-described series of processes, at least a part of the process from receiving the workpieces W as items requiring repair to shipping the workpieces W after repair processing may be managed by the information processing device 4. The above-described series of processes is performed for each batch. That is, one or more workpieces W held in one jig 5 are measured by the measuring device 2, and one or more workpieces W held in one jig 5 are processed by one processing device 1. Therefore, it is possible to remove one or more workpieces W from one jig 5 and then measure and process the one or more workpieces W without attaching the one or more workpieces W to another jig 5.

[0194] As described above, the measurement results of one or more workpieces W by the measuring device 2 and the processing details of one or more workpieces W by one processing device 1 are included in one batch information. In other words, the measurement results and processing details are linked to the jig information included in the one batch information. Therefore, the operator of the information processing device 4 can track the measurement results of one or more workpieces W by the measuring device 2 and the processing details of one or more workpieces W by one processing device 1 for each jig 5 (in other words, for each batch).

[0195] For example, if the workpiece W is a turbine blade, the workpiece information may include information related to the turbine to which the turbine blade workpiece W belongs. The measurement results of one or more workpieces W by the measuring device 2 and the processing details of one or more workpieces W by one processing device 1 are also linked to the workpiece information included in the batch information. Therefore, the operator of the information processing device 4 can track the measurement results by the measuring device 2 and the processing details by one processing device 1 for each workpiece W. Furthermore, because the workpiece information includes information related to the turbine, the operator can track the measurement results by the measuring device 2 and the processing details by one processing device 1 for each turbine based on the information related to the turbine.

[0196] The above-mentioned process related to the repair processing of the workpieces W will be further explained with reference to FIG. 16 . In the repair processing of the workpieces W, jig information related to one jig 5 may be registered in the information processing device 4 as part of one batch information. In parallel with or before or after the registration of the jig information, workpiece information related to one or more workpieces W held in one jig 5 may be registered in the information processing device 4 as another part of the one batch information. Thereafter, one or more workpieces W may be attached to one jig 5. In other words, one or more workpieces W may be held in one jig 5.

[0197] One or more workpieces W held by one jig 5 may be measured by a measuring device 2 (specifically, a shape measuring device 21). Thereafter, one or more workpieces W held by one jig 5 may be machined by one processing device 1 (here, processing device 1#1 or 1#2). One or more machined workpieces W held by one jig 5 may be inspected by a measuring device 2 (specifically, a shape measuring device 21). Thereafter, one or more machined workpieces W may be removed from one jig 5.

[0198] The jig information relating to the jig 5 from which the processed workpiece(s) W have been removed may be registered again in the information processing device 4 as part of other batch information. After that, a new workpiece W may be attached to the jig 5. In this way, the jig 5 is repeatedly used in repair processing of the workpieces W.

[0199] (4) Measurement Operation (4-1) One Aspect of Measurement Operation One aspect of the measurement operation of the measurement device 2 will be described with reference to FIGS. 17 and 18 . In FIGS. 5 and 17 , the shape measurement head 211 has a camera-like contour. However, the shape measurement head 211 does not need to be equipped with a camera. In other words, the measurement according to this embodiment is not limited to measurement using a camera. As described above, the shape measurement device 21 may measure the three-dimensional shape of a measurement object (e.g., workpiece W) using at least one of the following methods: pattern projection method, light section method, time-of-flight method, moire topography method (specifically, grating illumination method or grating projection method), holographic interferometry, autocollimation method, stereo method, astigmatism method, critical angle method, and knife-edge method.

[0200] 17(a), when the shape measuring head 211 measures the three-dimensional shape of one workpiece W, for example, a portion of the one workpiece W surrounded by a dashed circle C1 is a blind spot from the shape measuring head 211. In other words, in the state shown in FIG. 17(a), the three-dimensional shape of the portion of the one workpiece W surrounded by the dashed circle C1 is not measured.

[0201] For this reason, the stage driving unit 214 of the shape measuring device 21 may move (in other words, rotate) the stage 213 so that the one workpiece W rotates by a predetermined angle around the Z axis. For example, as shown in Fig. 17(b) , after the one workpiece W is rotated by a predetermined angle around the Z axis, the shape measuring head 211 may measure the three-dimensional shape of the one workpiece W.

[0202] The shape measuring device 21 may measure the entirety of one workpiece W by repeatedly performing partial measurements of the one workpiece W with the shape measuring head 211 and moving the stage 213 to rotate the one workpiece W by a predetermined angle around the Z axis. For example, if the predetermined angle is 22.5 degrees, the shape measuring head 211 may measure the entirety of one workpiece W by performing partial measurements of the one workpiece W 16 times.

[0203] The partial measurement results of one workpiece W by the shape measuring head 211 may be, for example, point cloud data that indicates a partial three-dimensional shape of one workpiece W using multiple points. Here, the coordinate values ​​of each of the multiple points indicated by the point cloud data (e.g., coordinate values ​​in an XYZ Cartesian coordinate system) may be coordinate values ​​in a coordinate system related to the shape measuring head 211. The coordinate system related to the shape measuring head 211 will hereinafter be referred to as the "head coordinate system" as appropriate. As described above, the measurement information indicates the measurement results of the three-dimensional shape of the workpiece W (i.e., the three-dimensional shape of the entire workpiece W) by the shape measuring device 21. Therefore, the partial measurement results of the workpiece W (i.e., the measurement results of the partial three-dimensional shape of the workpiece W) may be referred to as partial measurement information. The partial measurement results of one workpiece W may be, for example, at least one of mesh data (also referred to as polygon data, STL (stereolithography) data) and surface data generated by three-dimensional modeling of the point cloud data. The partial measurement result of one workpiece W may be, for example, a three-dimensional model that indicates a partial three-dimensional shape of one workpiece W. Examples of the three-dimensional model include at least one of a wireframe model and a solid model.

[0204] The partial measurement result of one workpiece W by the shape measuring head 211 may be linked to the position of the shape measuring head 211 and the position of the stage 213. As shown in Fig. 5, if the depression angle of the shape measuring head 211 is changeable, the position of the shape measuring head 211 may include the depression angle of the shape measuring head 211. Here, the position of the shape measuring head 211 is represented in the measurement coordinate system of the measurement device 2. Similarly, the position of the stage 213 is also represented in the measurement coordinate system. Therefore, by using the positions of the shape measuring head 211 and the stage 213, the coordinate values ​​of each of the multiple points indicated by the point cloud data can be converted from coordinate values ​​in the head coordinate system to coordinate values ​​in the measurement coordinate system.

[0205] For example, point cloud data as a partial measurement result of one workpiece W by the shape measuring head 211 may be linked to the position of the shape measuring head 211 and the position of the stage 213, and transmitted to the control information generating device 22. The arithmetic device 221 of the control information generating device 22 may convert the coordinate values ​​of each of the multiple points indicated by the point cloud data from coordinate values ​​in the head coordinate system to coordinate values ​​in the measurement coordinate system using the positions of the shape measuring head 211 and the stage 213.

[0206] The arithmetic device 221 may acquire the three-dimensional shape of the entire workpiece W based on a plurality of partial measurement results of the workpiece W. For example, the arithmetic device 221 may extract one or a plurality of feature points from each of a plurality of point cloud data representing a plurality of partial measurement results. Note that various existing methods can be applied to the method of extracting feature points from point cloud data, and therefore detailed description thereof will be omitted.

[0207] For example, the calculation device 221 may determine, from one or more feature points extracted from each point cloud data, coordinate axes in each point cloud data that correspond to the axes of the measurement coordinate system of the measurement device 2. Then, the calculation device 221 may perform axis alignment processing to rotate the point cloud data so that the determined coordinate axes are parallel to the axes of the measurement coordinate system.

[0208] For example, the arithmetic unit 221 may synthesize (in other words, stitch together) a plurality of point cloud data as a plurality of partial measurement results by feature point matching using the extracted feature points. At this time, the arithmetic unit 221 may use at least one well-known method, for example, ICP (Iterative Closest Point), RANSAC (Random Sample Consensus), SIFT (Scale-Invariant Feature Transform), and DSO (Direct Sparse Odometry).

[0209] For example, the calculation device 221 may align one point cloud data with another point cloud data based on the coordinate values ​​of the extracted feature points. After that, the calculation device 221 may align the one point cloud data with the other point cloud data with high accuracy using at least one of ICP, RANSAC, SIFT, and DSO.

[0210] In this way, the calculation device 221 may synthesize a plurality of point cloud data as a plurality of partial measurement results to obtain the three-dimensional shape of the entire workpiece W. The coordinate values ​​of each of the plurality of points indicating the three-dimensional shape of the entire workpiece W may be coordinate values ​​in the measurement coordinate system of the measurement device 2.

[0211] The measurement operation of the measurement device 2 will be further described with reference to the flowchart of FIG. 18 . The arithmetic device 221 of the control information generating device 22 may acquire multiple partial measurement results (i.e., multiple partial measurement information) related to one workpiece W from the shape measuring device 21 (step S201). At this time, the arithmetic device 221 may store the multiple partial measurement results in the storage device 222. Next, the arithmetic device 221 may extract one or multiple feature points from each of the multiple partial measurement results acquired in the processing of step S201 (step S202). The arithmetic device 221 may combine the multiple partial measurement results acquired in the processing of step S201 based on the feature points extracted in the processing of step S202 (step S203). As a result, the arithmetic device 221 may acquire measurement results (i.e., measurement information) of the three-dimensional shape of the entire one workpiece W.

[0212] (4-2) Issues with Measurement Operation The workpiece W as the measurement target of the measuring device 2 may include a long workpiece W. Here, with reference to FIG. 19 , the measurement operation of the shape measuring device 21 when measuring a long workpiece W will be described.

[0213] As described above, the shape measuring head 211 is movable in the Z-axis direction (up and down direction) along the second support mechanism 2112. When the shape measuring device 21 measures a long workpiece W, for example, the shape measuring head 211 at position P1 shown in Fig. 19 may measure the lower part of the workpiece W, and the shape measuring head 211 at position P2 may measure the upper part of the workpiece W. Note that the measurement range FOV1 of the shape measuring head 211 at position P1 and the measurement range FOV2 of the shape measuring head 211 at position P2 may partially overlap.

[0214] In this case, the shape measuring head 211 at position P1 may measure the lower part of the workpiece W each time the stage 213 moves so that the workpiece W rotates by a predetermined angle around the Z axis. After the workpiece W rotates 360 degrees around the Z axis due to the movement of the stage 213, the head drive system 212 may move the shape measuring head 211 from position P1 to position P2. Thereafter, the shape measuring head 211 at position P2 may measure the lower part of the workpiece W each time the stage 213 moves so that the workpiece W rotates by a predetermined angle around the Z axis.

[0215] For example, the arithmetic device 221 of the control information generating device 22 may combine multiple partial measurement results of the workpiece W obtained by the shape measuring head 211 at position P1 to obtain the three-dimensional shape of the lower part of the workpiece W. The arithmetic device 221 may combine multiple partial measurement results of the workpiece W obtained by the shape measuring head 211 at position P2 to obtain the three-dimensional shape of the upper part of the workpiece W. The arithmetic device 221 may combine the three-dimensional shape of the lower part of the workpiece W and the three-dimensional shape of the upper part of the workpiece W to obtain the three-dimensional shape of the entire workpiece W.

[0216] For example, when the predetermined angle is 22.5 degrees, the shape measuring head 211 measures the lower part of the workpiece W 16 times and measures the upper part of the workpiece W 16 times. As a result, the time required to measure a long workpiece W is relatively long. For example, turbine blades as the workpiece W include relatively long turbine blades. For this reason, in repair processing of relatively long turbine blades, there is a problem that the throughput of the entire repair processing decreases due to the relatively long time required for measurement.

[0217] In order to properly process the workpiece W using the processing device 1, data on the reference position of the workpiece W is required. Here, the reference position of the workpiece W in the height direction (Z-axis direction) may be a fixed portion of the jig 5 (for example, the mechanical chuck 55). For this reason, it is difficult to omit measurement of the lower part of the workpiece W by the shape measuring head 211 located at position P1, for example.

[0218] 19, the shape measuring head 211 has two measurement ranges: a measurement range FOV1 for measuring the lower part of the workpiece W, and a measurement range FOV2 for measuring the upper part of the workpiece W. However, the number of measurement ranges of the shape measuring head 211 is not limited to two, and may be three or more.

[0219] (4-3) Data Reuse For example, as described with reference to Fig. 16, one jig 5 is used repeatedly in repair processing of the workpiece W. Therefore, for example, the reference position of the workpiece W in the height direction (Z-axis direction) (for example, the position of the mechanical chuck 55 of one jig 5) does not change.

[0220] The machining location (in other words, the repair location) of the workpiece W held by one jig 5 is often near the end of the workpiece W on the opposite side from the reference position in the height direction of the workpiece W (see, for example, the dashed circle C2 in FIG. 19 ). For this reason, the portion of the workpiece W held by one jig 5 that is included in, for example, the measurement range FOV1 of the shape measuring head 211 does not change before and after machining.

[0221] As described above, a jig (for example, the jig 5) is created according to the workpiece W to be machined and according to the machining location of the workpiece W. For this reason, the same type of workpiece W is repeatedly attached to one jig 5, and the machining location of the attached workpiece W is the same.

[0222] From these facts, for example, the measurement results of the shape measurement head 211 at position P1 (i.e., the measurement results of the measurement range FOV1) can be considered to be unchanged even if the workpiece W held by one jig 5 changes.

[0223] For this reason, the arithmetic device 221 of the control information generating device 21 may acquire one three-dimensional shape that can be regarded as the three-dimensional shape of the entire one workpiece W, for example, by combining the three-dimensional shape of the upper part of one workpiece W currently measured by the shape measuring head 211 at position P2 with the three-dimensional shape of the lower part of another workpiece W previously measured by the shape measuring head 211 at position P1. In other words, part of the past measurement results by the shape measuring device 21 may be reused.

[0224] 19, there are a base plate 50, a support member 52, a connecting member 53, and the like around the workpiece W held by the jig 5, as shown in, for example, FIG. 9. Therefore, for example, the measurement result of the shape measuring head 211 at position P2 may include a part of the jig 5 in addition to the upper part of the workpiece W. Also, the measurement result of the shape measuring head 211 at position P1 may include another part of the jig 5 in addition to the lower part of the workpiece W.

[0225] When the arithmetic unit 221 of the control information generating device 22 combines the measurement results of the shape measuring head 211 at position P2 and the measurement results of the shape measuring head 211 at position P1, the arithmetic unit 221 may use one or more feature points related to the jig 5 extracted from the measurement results of the shape measuring head 211 at position P2 and one or more feature points related to the jig 5 extracted from the measurement results of the shape measuring head 211 at position P1. In other words, the arithmetic unit 221 may combine the measurement results of the shape measuring head 211 at position P2 and the measurement results of the shape measuring head 211 at position P1 using the feature points related to the jig 5. Note that the measurement results of the shape measuring head 211 at position P1 and the measurement results of the shape measuring head 211 at position P2 may be point cloud data. However, the measurement results of the shape measuring head 211 at position P1 and the measurement results of the shape measuring head 211 at position P2 are not limited to point cloud data and may be, for example, at least one of mesh data and surface data.

[0226] In this case, the measurement results of the shape measuring head 211 at position P1 may not include the three-dimensional shape of the workpiece W. In other words, the arithmetic unit 221 of the control information generating device 22 may combine a three-dimensional shape related to the measurement results obtained when the shape measuring head 211 at position P2 measures one jig 5 holding the workpiece W, and a three-dimensional shape related to the measurement results obtained when the shape measuring head 211 at position P1 measures one jig 5 not holding the workpiece W.

[0227] The arithmetic device 221 of the control information generating device 22 may use, as the above-mentioned object model OM, one three-dimensional shape that can be regarded as the three-dimensional shape of the entire workpiece W, obtained by combining the measurement results of the shape measuring head 211 at position P2 and the measurement results of the shape measuring head 211 at position P1. The arithmetic device 221 may generate a differential model DM based on the object model OM and the reference model RM.

[0228] With this configuration, it is possible to reduce the number of measurements (for example, measurements of the lower part of the workpiece W) by the shape measuring head 211 at position P1, for example. As a result, it is possible to shorten the time required to measure a long workpiece W. Therefore, with this configuration, it is possible to improve the throughput of the entire repair process.

[0229] (4-4) Specific Examples of Data Reuse Specific examples of data reuse are described below.

[0230] (4-4-1) First Aspect The first aspect will be described with reference to FIGS. 20 to 24. For example, as shown in FIG. 20, multiple measuring members IM may be attached to the jig 5. One example of multiple measuring members IM is stickers with a relatively high reflectivity. By attaching multiple measuring members IM to the jig 5 in this manner, one or more feature points can be relatively easily extracted from the point cloud data resulting from the measurement by the shape measurement device 21 (specifically, the shape measurement head 211). Note that the measuring members IM may be attached to at least one of the stage 213 of the shape measurement device 21 and the workpiece W, in addition to the jig 5. In addition, by attaching multiple measuring members IM to the jig 5, when the workpiece W is measured while being rotated around the Z axis, as described with reference to FIG. 17, for example, at least one measuring member IM can be included in the measurement range FOV of the shape measurement head 211. Furthermore, the multiple feature points respectively corresponding to the multiple measurement members IM may be used as markers when multiple pieces of partial measurement information (see "(4-1) One mode of measurement operation"), which are measurement results obtained by measuring the workpiece W while the workpiece W is rotated around the Z axis, are combined. The multiple feature points respectively corresponding to the multiple measurement members IM may also be used as markers when, for example, the measurement results of the shape measuring head 211 at position P2 and the measurement results of the shape measuring head 211 at position P1 are combined. Note that the multiple feature points respectively corresponding to the multiple measurement members IM do not have to be used as markers when the multiple pieces of partial measurement information are combined.

[0231] The shape measurement device 21 may measure the jig 5 that does not hold the workpiece W. After the jig 5 that does not hold the workpiece W is placed on the stage 213 of the shape measurement device 21, for example, the shape measurement head 211 at position P1 may measure the jig 5 each time the stage 213 moves so that the jig 5 rotates by a predetermined angle around the Z axis. After the jig 5 rotates 360 degrees around the Z axis due to the movement of the stage 213, the head drive system 212 may move the shape measurement head 211 from position P1 to position P2. Thereafter, the shape measurement head 211 at position P2 may measure the jig 5 each time the stage 213 moves so that the jig 5 rotates by a predetermined angle around the Z axis. Note that the depression angle of the shape measurement head 211 at position P1 and the depression angle of the shape measurement head 211 at position P2 may be the same or different. That is, in addition to moving the shape measuring head 211 from position P1 to position P2, the depression angle of the shape measuring head 211 may be changed.

[0232] For example, the shape measuring head 211 at position P1 may measure the jig 5, thereby measuring a portion of the jig 5 that is included in, for example, a range R1 shown in FIG. 21 . The measurement result of the shape measuring head 211 at position P1 may be point cloud data that indicates the three-dimensional shape of a portion of the jig 5. Hereinafter, the point cloud data that indicates the three-dimensional shape of a portion of the jig 5 will be appropriately referred to as "lower point cloud data Lpc0." Note that the lower point cloud data Lpc0 may include a plurality of points that indicate the three-dimensional shape of at least a portion of the stage 213 of the shape measuring device 21 on which the jig 5 is placed.

[0233] For example, by measuring the jig 5 with the shape measuring head 211 at position P2, other parts of the jig 5, for example, included in range R2 shown in FIG. 21 , may be measured. The measurement result of the shape measuring head 211 at position P2 may be point cloud data indicating the three-dimensional shape of the other parts of the jig 5. Hereinafter, the point cloud data indicating the three-dimensional shape of the other parts of the jig 5 will be appropriately referred to as "upper point cloud data Upc0."

[0234] If the positional relationship between the shape measuring head 211 and the jig 5 at position P1 in one direction (for example, the Z-axis direction) is referred to as a first positional relationship, the positional relationship between the shape measuring head 211 and the jig 5 at position P2 may be referred to as a second positional relationship. In this case, the lower point cloud data Lpc0 may be referred to as first point cloud information. The upper point cloud data Upc0 may be referred to as second point cloud information.

[0235] As shown in FIG. 21 , the lower point cloud data Lpc0 may include feature points fp#1 and fp#2. The upper point cloud data Upc0 may also include feature points fp#1 and fp#2. In other words, the lower point cloud data Lpc0 and the upper point cloud data Upc0 may include common feature points. The number of common feature points included in the lower point cloud data Lpc0 and the upper point cloud data Upc0 is not limited to two, and may be three or more, or may be one. The feature points fp#1 and fp#2 may be feature points corresponding to the measuring member IM.

[0236] The arithmetic device 221 of the control information generating device 22 may generate point cloud data indicating the three-dimensional shape of the entire jig 5 as the measurement result MD0 by combining the lower point cloud data Lpc0 and the upper point cloud data Upc0 with reference to the above-mentioned common feature points (e.g., feature points fp#1 and fp#2).

[0237] For example, the arithmetic device 221 may determine, based on the measurement result MD0, the coordinate values ​​of each of the multiple feature points corresponding to the multiple measurement members IM attached to the jig 5 as reference coordinates. Here, the coordinate values ​​of each of the multiple feature points may be coordinate values ​​in the measurement coordinate system of the measuring device 2. The arithmetic device 221 may generate a table IT (see FIG. 22 ) showing the coordinate values ​​of each of the multiple feature points as reference coordinates. For example, the arithmetic device 221 may associate the table IT, the lower point cloud data Lpc0, and the upper point cloud data Upc0 with the jig 5 (e.g., identification information of the jig 5) and store them in the storage device 222. Note that the arithmetic device 221 may acquire the identification information of the jig 5 by, for example, using a scanner for reading a read code or a non-contact communication tag provided in the measuring device 2 to read at least one of the read code and the non-contact communication tag attached to the jig 5.

[0238] The arithmetic device 221 may link the table IT, the lower point cloud data Lpc0, and the upper point cloud data Upc0 to the jig 5 (e.g., identification information of the jig 5) and transmit them to the information processing device 4. In this case, the arithmetic device 41 of the information processing device 4 may link the table IT, the lower point cloud data Lpc0, and the upper point cloud data Upc0 to the jig 5 (e.g., identification information of the jig 5) and store them in the storage device 42. At this time, the arithmetic device 41 may link the table IT, the lower point cloud data Lpc0, and the upper point cloud data Upc0 to the jig 5 (e.g., identification information of the jig 5) and register them in the table shown in FIG. 14 .

[0239] Thereafter, the shape measuring device 21 may measure the jig 5 holding the workpiece W. Note that the jig 5 is not limited to holding a single workpiece W, and may hold a plurality of workpieces W. However, to avoid complicating the explanation, it will be simply referred to as "workpiece W."

[0240] After the jig 5 holding the workpiece W is placed on the stage 213 of the shape measurement device 21, for example, the shape measurement head 211 at position P2 may measure the jig 5 holding the workpiece W each time the stage 213 moves so that the jig 5 holding the workpiece W rotates by a predetermined angle around the Z axis. In this case, the shape measurement head 211 may measure the jig 5 holding the workpiece W only at position P2 without performing measurements at position P1. Note that the depression angle of the shape measurement head 211 at position P2 when measuring the jig 5 holding the workpiece W may be the same as or different from the depression angle of the shape measurement head 211 at position P2 when measuring the jig 5 not holding the workpiece W.

[0241] For example, the shape measuring head 211 at position P2 may measure the jig 5 holding the workpiece W, thereby measuring the workpiece W and the jig 5 included in range R2 shown in Fig. 23. The measurement result of the shape measuring head 211 at position P2 may be point cloud data indicating the three-dimensional shapes of the workpiece W and the jig 5 included in range R2. Hereinafter, the point cloud data indicating the three-dimensional shapes of the workpiece W and the jig 5 included in range R2 will be referred to as "upper point cloud data Upc1" as appropriate.

[0242] The calculation device 221 may acquire the upper point cloud data Upc1 by combining multiple partial measurement results of the jig 5 holding the workpiece W obtained by the shape measuring head 211 at position P2. At this time, the calculation device 221 may combine the multiple partial measurement results of the jig 5 holding the workpiece W based on feature points corresponding to the measurement member IM included in the multiple partial measurement results and on table IT. When the coordinate values ​​of each of the multiple feature points indicated by table IT are expressed in the coordinate system of the measurement coordinate system of the measuring device 2, the use of table IT makes it possible to omit processing related to coordinate conversion from the head coordinate system to the measurement coordinate system.

[0243] The arithmetic unit 221 of the control information generating device 22 may acquire the lower point cloud data Lpc0 from, for example, the storage device 222, based on, for example, the identification information of the jig 5. As shown in FIG. 23 , the upper point cloud data Upc1 may include feature points fp#1 and fp#2. That is, the lower point cloud data Lpc0 and the upper point cloud data Upc1 may include a common feature point. Note that the number of common feature points included in the lower point cloud data Lpc0 and the upper point cloud data Upc1 is not limited to two, and may be three or more, or may be one.

[0244] The calculation device 221 may refer to the common feature points (for example, feature points fp#1 and fp#2) and combine the lower point cloud data Lpc0 and the upper point cloud data Upc1 to generate, as the measurement result MD1, point cloud data that indicates the three-dimensional shape of the entire jig 5 that holds the workpiece W. In other words, the calculation device 221 may acquire the measurement result MD1 by combining the lower point cloud data Lpc0 and the upper point cloud data Upc1.

[0245] In this case, the lower point cloud data Lpc0 does not include the three-dimensional shape of the workpiece W. However, the measurement result MD1 includes the three-dimensional shape of the machining portion of the workpiece W (in other words, the repair portion). If the measurement result MD1 includes the three-dimensional shape of the machining portion of the workpiece W, the control information generating device 22 (specifically, the arithmetic device 221) can generate the above-mentioned differential model DM (see FIG. 11(c)) and generate machining control information. Therefore, the measurement result MD1 can be considered as the three-dimensional shape of the entire jig 5 holding the workpiece W.

[0246] The calculation device 221 may generate STL data by three-dimensionally modeling the point cloud data as the measurement result MD1. The calculation device 221 may use the STL data as the object model OM. The calculation device 221 may generate a differential model DM based on the STL data as the object model OM and a reference model RM.

[0247] The calculation device 221 may generate, as an object model OM, shape data of the upper part of the workpiece W corresponding to the three-dimensional shape represented by the upper point cloud data Upc1, from one or more feature points (e.g., feature points fp#1 and fp#2) included in the upper point cloud data Upc1 and STL data (or surface data) generated by three-dimensionally modeling the upper point cloud data Upc1. The calculation device 221 may generate a differential model DM based on the generated object model OM and the reference model RM.

[0248] The calculation device 221 may generate a partial reference model (e.g., a reference model corresponding to the three-dimensional shape of the workpiece W indicated by the upper point cloud data Upc1) used to generate the differential model DM from the reference model RM based on one or more feature points (e.g., feature points fp#1 and fp#2) included in the upper point cloud data Upc1. The calculation device 221 may generate the differential model DM from the difference between the partial reference model and STL data (or surface data) generated by three-dimensional modeling of the upper point cloud data Upc1.

[0249] The calculation device 221 may delete, for example, a portion below a feature point having a minimum Z coordinate from the three-dimensional shape represented by the reference model RM based on one or more feature points (e.g., feature points fp#1 and fp#2) included in the upper point cloud data Upc1. The calculation device 221 may generate a differential model DM from the difference between the reference model RM from which part of the three-dimensional shape has been deleted and STL data (or surface data) generated by three-dimensionally modeling the upper point cloud data Upc1.

[0250] It can be said that the upper point cloud data Upc1 includes a plurality of points (point cloud) corresponding to the processing location of the workpiece W (in other words, the portion of the workpiece W that is processed by the processing device 1) in the jig 5 that holds the workpiece W. In other words, it can be said that the upper point cloud data Upc1 includes a plurality of points (point cloud) corresponding to the portion of the workpiece W that changes due to processing when the workpiece W is processed by the processing device 1. On the other hand, it can be said that the lower point cloud data Lpc0 includes a plurality of points (point cloud) corresponding to at least a portion of the portion of the workpiece W that does not change due to processing when the workpiece W is processed by the processing device 1.

[0251] The calculation device 221 may generate the measurement result MD1 by combining a portion of the lower point cloud data Lpc0 with the upper point cloud data Upc1. In this case, the portion of the lower point cloud data Lpc0 may include, for example, one or more points that indicate the three-dimensional shape of a reference position of the workpiece W in the height direction (Z direction) (for example, the position of the mechanical chuck 55 of one jig 5) among the multiple points included in the lower point cloud data Lpc0.

[0252] If the lower point cloud data Lpc0 is referred to as the first point cloud information and the upper point cloud data Upc0 is referred to as the second point cloud information, the upper point cloud data Upc1 may be referred to as the third point cloud information. In this case, it can be said that the arithmetic device 221 generates point cloud data indicating the three-dimensional shape of the entire jig 5 holding the workpiece W based on at least a part of the first point cloud information and the third point cloud information.

[0253] When the shape measuring head 211 measures the jig 5 holding the workpiece W, the position of the shape measuring head 211 may be different from positions P1 and P2. In other words, as long as one or more feature points of the multiple feature points included in the lower point cloud data Lpc0 are included in the measurement range of the shape measuring head 211 when measuring the jig 5 holding the workpiece W, the position of the shape measuring head 211 when measuring the jig 5 holding the workpiece W may be arbitrary.

[0254] The operation of the measurement apparatus 2 according to the first aspect will be described with reference to the flowchart of FIG. 24 . In FIG. 24 , the arithmetic unit 221 of the control information generating device 22 may acquire from the shape measuring device 21 a plurality of partial measurement results (i.e., a plurality of partial measurement information) of a single measurement object (e.g., a jig 5 not holding a workpiece W) as a result of the shape measuring head 221 at a first measurement position (e.g., position P1) measuring the single measurement object while the single measurement object is rotated around the Z axis (step S301). At this time, the arithmetic unit 221 may store the plurality of partial measurement results in the storage device 222. Next, the arithmetic unit 221 may extract one or more feature points from each of the plurality of partial measurement results acquired in the processing of step S301 (step S302). The arithmetic unit 221 may combine the plurality of partial measurement results acquired in the processing of step S301 based on the feature points extracted in the processing of step S302 (step S303). As a result, the arithmetic device 221 may acquire first partial measurement data (for example, lower point cloud information Lpc0) indicating the three-dimensional shape of a portion of the measurement object. The arithmetic device 221 may store the first partial measurement data in the storage device 222.

[0255] Thereafter, the arithmetic unit 221 may acquire from the shape measurement device 21 a plurality of partial measurement results (i.e., a plurality of partial measurement information) of the measurement object as a result of the shape measurement head 221 measuring the measurement object at a second measurement position (e.g., position P2) while the measurement object is rotated around the Z axis (step S304). At this time, the arithmetic unit 221 may store the plurality of partial measurement results in the storage device 222. Next, the arithmetic unit 221 may extract one or more feature points from each of the plurality of partial measurement results acquired in the processing of step S304 (step S305). The arithmetic unit 221 may combine the plurality of partial measurement results acquired in the processing of step S304 based on the feature points extracted in the processing of step S305 (step S306). As a result, the arithmetic unit 221 may acquire second partial measurement data (e.g., upper point cloud information Upc0) indicating the three-dimensional shape of another portion of the measurement object. The computing device 221 may store the second partial measurement data in the storage device 222 .

[0256] Thereafter, the calculation device 221 may combine the first partial measurement data and the second partial measurement data based on one or more feature points (e.g., feature points fp#1 and fp#2) included in the first partial measurement data and one or more feature points (e.g., feature points fp#1 and fp#2) included in the second partial measurement data (step S307). As a result, measurement data (e.g., measurement result MD0) indicating the three-dimensional shape of the entire measurement object may be generated.

[0257] After one measurement object is removed from the shape measurement device 21 and another measurement object (e.g., the jig 5 holding the workpiece W) is placed on the stage 213 of the shape measurement device 21, the calculation device 221 may acquire from the shape measurement device 21 multiple partial measurement results (i.e., multiple partial measurement information) related to the other measurement object as a result of the shape measurement head 221 measuring the other measurement object at a second measurement position (e.g., position P2) while the other measurement object is rotated around the Z axis (step S308). At this time, the calculation device 221 may store the multiple partial measurement results in the storage device 222. Next, the calculation device 221 may extract one or multiple feature points from each of the multiple partial measurement results acquired in the processing of step S308 (step S309). The calculation device 221 may combine the multiple partial measurement results acquired in the processing of step S308 based on the feature points extracted in the processing of step S309 (step S310). As a result, the calculation device 221 may acquire third partial measurement data (e.g., upper point cloud information Upc1) indicating the three-dimensional shape of a portion of the other measurement object. The calculation device 221 may store the third partial measurement data in the storage device 222.

[0258] Thereafter, the arithmetic unit 221 may acquire first partial measurement data from the storage device 222 (step S311). Next, the arithmetic unit 221 may combine the first partial measurement data and the third partial measurement data based on one or more feature points (e.g., feature points fp#1 and fp#2) included in the first partial measurement data and one or more feature points (e.g., feature points fp#1 and fp#2) included in the third partial measurement data (step S312). As a result, measurement data (e.g., measurement result MD1) indicating the entire three-dimensional shape of the other measurement object may be generated.

[0259] Note that measurement of the measurement object including processes equivalent to the processes of steps S301 to S307 (i.e., a method in which the shape measuring head 211 measures the entire measurement object) may be referred to as a high-resolution mode. Measurement of the measurement object including processes equivalent to the processes of steps S308 to S312 (i.e., a method in which the shape measuring head 211 measures only a portion of the measurement object and reuses past partial measurement data) may be referred to as a high-speed mode.

[0260] When the measurement of the workpiece W is performed in high-resolution mode, the calculation device 221 may include measurement mode information indicating that the measurement is performed in high-resolution mode in the measurement results of one batch. Then, the calculation device 221 may link the measurement results of one batch including the measurement mode information to the identification information of the jig 5 and transmit them to the information processing device 4. The calculation device 41 of the information processing device 4 may store the measurement results of one batch including the measurement mode information in the storage device 42, linking them to the jig information and workpiece information included in the corresponding batch information.

[0261] Similarly, when the measurement of the workpiece W is performed in high-speed mode, the calculation device 221 may include measurement mode information indicating that the measurement is performed in high-speed mode in the measurement results of one batch. Then, the calculation device 221 may link the measurement results of one batch including the measurement mode information to the identification information of the jig 5 and transmit them to the information processing device 4. The calculation device 41 of the information processing device 4 may link the measurement results of one batch including the measurement mode information to the jig information and workpiece information included in the corresponding batch information and store them in the storage device 42.

[0262] As described above, even in high-speed mode, the arithmetic device 221 acquires data (e.g., measurement result MD1) that can be considered to represent the three-dimensional shape of the entire workpiece W, for example, by combining the upper point cloud data Upc1 and the lower point cloud data Lpc0. Therefore, the position of the portion of the workpiece W that will be machined relative to the reference position included in the lower point cloud data Lpc0 can be identified. In other words, even in high-speed mode, the arithmetic device 221 can acquire position information of the portion that will be machined relative to the reference position. In this way, since the position of the portion that will be machined relative to the reference position is known, for example, additive machining with a more accurate buildup amount is possible. In addition, because the buildup amount is accurate, the effort required for post-processing (cutting, removal, etc.) of excess portions of additive manufacturing, which was previously required, can be reduced. Not only is the effort required for post-processing reduced, but it is also expected that post-processing will be completely eliminated.

[0263] As described in "(1-3-1) Configuration of Shape Measuring Device 21", the head driving system 212 may move the shape measuring head 211, for example, along at least one of the X-axis, Y-axis, Z-axis, θX direction, θY direction, and θZ direction in the measurement coordinate system of the measurement device 2. Furthermore, the stage driving system 214 moves the stage 213, for example, along at least one of the X-axis, Y-axis, Z-axis, θX direction, θY direction, and θZ direction in the measurement coordinate system of the measurement device 2.

[0264] Therefore, a first positional relationship, which is the positional relationship between the shape measuring head 211 and the jig 5 at position P1 in one direction (for example, the Z-axis direction), may be realized by the stage drive system 214 moving the stage 213 on which the jig 5 is placed in the Z-axis direction. In other words, the first positional relationship may be realized by at least one of movement of the shape measuring head 211 by the head drive system 212 and movement of the stage 213 by the stage drive system 214. In other words, the first positional relationship may be realized by relative movement of the shape measuring head 211 and the jig 5 placed on the stage 213 along an axis extending in one direction.

[0265] Similarly, a second positional relationship, which is the positional relationship between the shape measuring head 211 and the jig 5 at position P2 in one direction (for example, the Z-axis direction), may be realized by the stage drive system 214 moving the stage 213 on which the jig 5 is placed in the Z-axis direction. In other words, the second positional relationship may be realized by at least one of movement of the shape measuring head 211 by the head drive system 212 and movement of the stage 213 by the stage drive system 214. In other words, the second positional relationship may be realized by relative movement of the shape measuring head 211 and the jig 5 placed on the stage 213 along an axis extending in one direction.

[0266] In the example shown in FIG. 19 , the workpiece W is placed on the stage 213 so as to extend in the Z-axis direction. However, the workpiece W may be placed on the stage 213 so as to extend, for example, along the XY plane. In this case, the shape measurement device 21 may include a support mechanism capable of moving the shape measurement head 211 along the XY plane. The head drive system 212 may move the shape measurement head 211 along the XY plane. In this case, the stage drive system 214 may move the stage 213 so that the workpiece W moves along the XY plane. For example, at least one of the head drive system 212 moving the shape measurement head 211 and the stage 213 moving by the stage drive system 214 may be performed so that the shape measurement head 211 and at least one of the workpiece W and the jig 5 move relatively along another axis extending along the XY plane.

[0267] It should be noted that the measuring device 2 (for example, the shape measuring head 211) may measure at least one of the jig 5 and the workpiece W without distinguishing between the jig 5 and the workpiece W. For this reason, it can be said that the jig 5 not holding the workpiece W, the workpiece W held by the jig 5, and the jig 5 holding the workpiece W are all objects to be measured by the measuring device 2. Therefore, the jig 5 not holding the workpiece W may also be referred to as an object. Similarly, the workpiece W held by the jig 5 and the jig 5 holding the workpiece W may also be referred to as an object.

[0268] For example, if the jig 5 that does not hold the workpiece W (i.e., only the jig 5) is referred to as the first object, and the jig 5 that holds the workpiece W (i.e., the workpiece W and the jig 5) is referred to as the second object, then both the first object and the second object include the jig 5. Therefore, it can be said that the first object and the second object have a common part.

[0269] Next, the operation of the control information generating device 22 will be described with reference to the flowchart of Fig. 25. In Fig. 25, when one workpiece W held by one jig 5 is measured by the shape measuring device 21, the arithmetic device 221 of the control information generating device 22 may generate an object model OM of the one workpiece W based on the measurement result of the one workpiece W held by the one jig 5 by the shape measuring device 21 (step S401).

[0270] Here, the shape measurement device 21 may measure the entirety of one workpiece W. In this case, the calculation device 221 may generate an object model OM of one workpiece W by combining, for example, point cloud data indicating the three-dimensional shapes of one workpiece W and one jig 5 included in a range R1 shown in FIG. 21 with point cloud data indicating the three-dimensional shapes of one workpiece W and one jig 5 included in a range R2 shown in FIG. 21. In this case, the calculation device 221 may associate the point cloud data indicating the three-dimensional shapes of one workpiece W and one jig 5 included in a range R1 shown in FIG. 21 with the one jig 5 and store them in the storage device 222.

[0271] The shape measuring device 21 may measure only a portion of one workpiece W. In this case, the calculation device 221 may generate an object model OM of one workpiece W by combining point cloud data (e.g., upper point cloud data Upc1) indicating the three-dimensional shapes of one workpiece W and one jig 5 included in the range R2 shown in Fig. 21 with a previous measurement result (e.g., lower point cloud data Lpc0) related to one jig 5.

[0272] The calculation device 221 may acquire a reference model RM related to one workpiece W (step S402). Next, the calculation device 221 may generate a differential model DM using the object model OM generated in the processing of step S401 and the reference model RM acquired in the processing of step S402 (step S403). Next, the calculation device 221 may generate processing control information related to one workpiece W based on the differential model DM generated in the processing of step S403 (step S404).

[0273] Next, the arithmetic device 221 may determine whether or not the next workpiece is to be machined (step S405). The arithmetic device 221 may determine whether or not the next workpiece is to be machined, for example, based on an instruction from an operator of the measuring device 2 via the input device 224. The arithmetic device 221 may determine that the next workpiece is to be machined, for example, when the measuring device 2 reads jig information (e.g., identification information) related to one jig 5. If it is determined in the processing of step S405 that the next workpiece is not to be machined (step S405: No), the operation shown in the flowchart of FIG. 25 may be terminated.

[0274] In the processing of step S405, if it is determined that the next workpiece is to be processed (step S405: Yes), the calculation device 221 may generate an object model OM of the other workpiece W based on the measurement results of the other workpiece W held on one jig 5 by the shape measurement device 21 (step S406).

[0275] Here, the shape measurement device 21 may measure only a portion of the other workpiece W. In this case, the calculation device 221 may generate an object model OM of the other workpiece W by combining, for example, point cloud data (e.g., upper point cloud data Upc1) indicating the three-dimensional shapes of the other workpiece W and the one jig 5 included in the range R2 shown in FIG. 21 with past measurement results related to the one jig 5 (e.g., point cloud data indicating the three-dimensional shapes of the one workpiece W and the one jig 5 included in the range R1 shown in FIG. 21 ). In other words, the point cloud data indicating the three-dimensional shapes of the one workpiece W and the one jig 5 used when generating the object model OM of the one workpiece W in the processing of step S401 may be reused.

[0276] The shape measuring device 21 may measure the entirety of the other workpiece W. In this case, the calculation device 221 may generate an object model OM of the other workpiece W by combining, for example, point cloud data indicating the three-dimensional shapes of the other workpiece W and the one jig 5 included in a range R1 shown in Fig. 21 with point cloud data indicating the three-dimensional shapes of the other workpiece W and the one jig 5 included in a range R2 shown in Fig. 21 .

[0277] The arithmetic device 221 may acquire a reference model RM related to another workpiece W (step S407). Next, the arithmetic device 221 may generate a differential model DM using the object model OM generated in the processing of step S406 and the reference model RM acquired in the processing of step S407 (step S408). Next, the arithmetic device 221 may generate processing control information related to one workpiece W based on the differential model DM generated in the processing of step S408 (step S409). Thereafter, the arithmetic device 221 may perform the processing of step S405.

[0278] The repeated execution of the processes of steps S405 to S409 described above means that one jig 5 is repeatedly used in the repair processing of the workpiece W. Furthermore, the repeated execution of the processes of steps S405 to S409 means that past measurement results (for example, point cloud data) are repeatedly reused.

[0279] Note that instead of the shape measuring device 21 measuring one workpiece W held by one jig 5, the shape measuring device 21 may measure one jig 5 that does not hold a workpiece W. In this case, in the processing of step S401, for example, point cloud data indicating the three-dimensional shape of one jig 5 may be generated. In this case, the processing of steps S402 to S404 may not be performed.

[0280] (4-4-2) Second Mode The second mode will be described. In the first mode, the lower point cloud data Lpc0 relating to a jig 5 that does not hold a workpiece W is reused in measuring a jig 5 that holds a workpiece W. In the second mode, the lower point cloud data Lpc2 relating to a jig 5 that holds one workpiece W may be reused in measuring a jig 5 that holds another workpiece W. Note that, with regard to the second mode, explanations that overlap with those of the first mode described above will be omitted as appropriate.

[0281] Note that one workpiece W and another workpiece W may be of the same type. This may mean that the structure and function of one workpiece W are the same as the structure and function of the other workpiece W. "The same type" may also be rephrased as "having the same model." However, the workpiece W as the object of repair processing may be partially missing and / or partially deformed. Therefore, even if two workpieces W are of the same model, if the overall shapes of the two workpieces W are dissimilar due to at least one of a missing part and a deformation, the two workpieces W may be considered not to be of the same type (i.e., different types).

[0282] The shape measurement device 21 may measure the jig 5 holding one workpiece W. Note that the jig 5 is not limited to a single workpiece W as one workpiece W, and may hold multiple workpieces W. For example, the shape measurement head 211 at position P1 may measure the jig 5 holding one workpiece W each time the stage 213 moves so that the jig 5 holding one workpiece W rotates a predetermined angle around the Z axis. After the jig 5 holding one workpiece W rotates 360 degrees around the Z axis due to the movement of the stage 213, the head drive system 212 may move the shape measurement head 211 from position P1 to position P2. Thereafter, the shape measurement head 211 at position P2 may measure the jig 5 holding one workpiece W each time the stage 213 moves so that the jig 5 holding one workpiece W rotates a predetermined angle around the Z axis.

[0283] For example, the shape measuring head 211 at position P1 may measure the jig 5 holding one workpiece W, thereby measuring the one workpiece W and the jig 5 included in range R1 shown in Fig. 21. The measurement result of the shape measuring head 211 at position P2 may be point cloud data indicating the three-dimensional shapes of the one workpiece W and the jig 5 included in range R2. The point cloud data indicating the three-dimensional shapes of the one workpiece W and the jig 5 included in range R2 will hereinafter be referred to as "upper point cloud data Upc2" as appropriate.

[0284] For example, the shape measuring head 211 at position P2 may measure the jig 5 holding one workpiece W, thereby measuring the one workpiece W and the jig 5 included in range R2 shown in Fig. 21. The measurement result of the shape measuring head 211 at position P2 may be point cloud data indicating the three-dimensional shapes of the one workpiece W and the jig 5 included in range R2. Hereinafter, the point cloud data indicating the three-dimensional shapes of the one workpiece W and the jig 5 included in range R2 will be referred to as "upper point cloud data Upc2" as appropriate.

[0285] For example, the calculation device 221 may store the lower point cloud data Lpc2 and the upper point cloud data Upc2 in the storage device 222 in association with the jig 5 (for example, identification information of the jig 5).

[0286] The arithmetic device 221 may link the lower point cloud data Lpc2 and the upper point cloud data Upc2 to the jig 5 (e.g., identification information of the jig 5) and transmit them to the information processing device 4. In this case, the arithmetic device 41 of the information processing device 4 may link the lower point cloud data Lpc2 and the upper point cloud data Upc2 to the jig 5 (e.g., identification information of the jig 5) and store them in the storage device 42. At this time, the arithmetic device 41 may link the lower point cloud data Lpc2 and the upper point cloud data Upc2 to the jig 5 (e.g., identification information of the jig 5) and register them in the table shown in FIG. 14 .

[0287] After one workpiece W is removed from the jig 5 and another workpiece W is attached to the jig 5, the shape measuring device 21 may measure the jig 5 holding the other workpiece W. Note that the jig 5 may hold not only a single workpiece W but also multiple workpieces W as the other workpiece W. For example, the shape measuring head 211 at position P2 may measure the jig 5 holding the other workpiece W each time the stage 213 moves so that the jig 5 holding the other workpiece W rotates by a predetermined angle around the Z axis. In this case, the shape measuring head 211 may measure the jig 5 holding the other workpiece W only at position P2, without performing measurements at position P1.

[0288] For example, the shape measuring head 211 at position P2 may measure the jig 5 holding another workpiece W, thereby measuring the other workpiece W and the jig 5 included in range R2 shown in Fig. 21. The measurement result of the shape measuring head 211 at position P2 may be point cloud data indicating the three-dimensional shapes of the other workpiece W and the jig 5 included in range R2. Hereinafter, the point cloud data indicating the three-dimensional shapes of the other workpiece W and the jig 5 included in range R2 will be referred to as "upper point cloud data Upc3" as appropriate.

[0289] The arithmetic device 221 may acquire the lower point cloud data Lpc2, for example, from the storage device 222, based on, for example, the identification information of the jig 5. The arithmetic device 221 may generate, as the measurement result MD2, point cloud data that indicates the three-dimensional shape of the entire jig 5 that holds another workpiece W, by combining the lower point cloud data Lpc2 and the upper point cloud data Upc3.

[0290] For example, if a jig 5 holding one workpiece W (i.e., the one workpiece W and the jig 5) is referred to as the first object, and a jig 5 holding another workpiece W (i.e., the other workpiece W and the jig 5) is referred to as the second object, then both the first object and the second object include the jig 5. Therefore, it can be said that the first object and the second object have a common part. Furthermore, the other workpiece W is the same type of workpiece as the one workpiece W. Therefore, it can be said that at least a portion of the one workpiece W included in the first object and at least a portion of the other workpiece W included in the second object are common parts of the first object and the second object.

[0291] (4-4-3) Third Mode The third mode will now be described. In the third mode, the lower point cloud data Lpc4 relating to the jig 5 holding one workpiece W before machining may be reused in measuring the jig 5 holding one workpiece W after machining. Note that, with regard to the third mode, explanations that overlap with those of the first mode described above will be omitted as appropriate.

[0292] The shape measurement device 21 may measure the jig 5 holding the workpiece W before the workpiece W is machined by the processing device 1. The jig 5 may hold multiple workpieces W, not just a single workpiece W. For example, the shape measurement head 211 at position P1 may measure the jig 5 holding the workpiece W each time the stage 213 moves so that the jig 5 holding the workpiece W rotates a predetermined angle around the Z axis. After the jig 5 holding the workpiece W rotates 360 degrees around the Z axis due to the movement of the stage 213, the head drive system 212 may move the shape measurement head 211 from position P1 to position P2. Thereafter, the shape measurement head 211 at position P2 may measure the jig 5 holding the workpiece W each time the stage 213 moves so that the jig 5 holding the workpiece W rotates a predetermined angle around the Z axis.

[0293] For example, the shape measuring head 211 at position P1 may measure the jig 5 holding one workpiece W, thereby measuring the one workpiece W and the jig 5 included in range R1 shown in Fig. 21. The measurement result of the shape measuring head 211 at position P1 may be point cloud data indicating the three-dimensional shapes of the one workpiece W and the jig 5 included in range R1. Hereinafter, the point cloud data indicating the three-dimensional shapes of the one workpiece W and the jig 5 included in range R1 will be appropriately referred to as "lower point cloud data Lpc4".

[0294] For example, the shape measuring head 211 at position P2 may measure the jig 5 holding one workpiece W, thereby measuring the one workpiece W and the jig 5 included in range R2 shown in Fig. 21. The measurement result of the shape measuring head 211 at position P2 may be point cloud data indicating the three-dimensional shapes of the one workpiece W and the jig 5 included in range R2. Hereinafter, the point cloud data indicating the three-dimensional shapes of the one workpiece W and the jig 5 included in range R2 will be referred to as "upper point cloud data Upc5" as appropriate.

[0295] The arithmetic device 221 may generate, as the measurement result MD3, point cloud data indicating the three-dimensional shape of the entire jig 5 holding one workpiece W by combining the lower point cloud data Lpc4 and the upper point cloud data Upc4. The arithmetic device 221 may generate processing control information based on the measurement result MD3. The processing control information may be used when the processing device 1 processes one workpiece W.

[0296] For example, the calculation device 221 may store the lower point cloud data Lpc4 and the upper point cloud data Upc4 in the storage device 222 in association with the jig 5 (for example, identification information of the jig 5).

[0297] The calculation device 221 may link the lower point cloud data Lpc4 and the upper point cloud data Upc4 to the jig 5 (e.g., identification information of the jig 5) and transmit them to the information processing device 4. In this case, the calculation device 41 of the information processing device 4 may link the lower point cloud data Lpc4 and the upper point cloud data Upc4 to the jig 5 (e.g., identification information of the jig 5) and store them in the storage device 42. At this time, the calculation device 41 may link the lower point cloud data Lpc4 and the upper point cloud data Upc4 to the jig 5 (e.g., identification information of the jig 5) and register them in the table shown in FIG. 14 .

[0298] When the processing device 1 processes one workpiece W and the jig 5 holding the processed workpiece W is placed on the shape measuring device 21 of the measuring device 2, the shape measuring device 21 may measure the jig 5 holding the processed workpiece W. For example, the shape measuring head 211 at position P2 may measure the jig 5 holding the processed workpiece W each time the stage 213 moves so that the jig 5 holding the processed workpiece W rotates by a predetermined angle around the Z axis. In this case, the shape measuring head 211 may measure the jig 5 holding the processed workpiece W only at position P2, without performing measurement at position P1.

[0299] For example, the shape measuring head 211 at position P2 may measure the jig 5 holding the machined workpiece W, thereby measuring the machined workpiece W and the jig 5, which are included in range R2 shown in Fig. 21. The measurement result of the shape measuring head 211 at position P2 may be point cloud data indicating the three-dimensional shapes of the machined workpiece W and the jig 5, which are included in range R2. Hereinafter, the point cloud data indicating the three-dimensional shapes of the machined workpiece W and the jig 5, which are included in range R2, will be referred to as "upper point cloud data Upc5" as appropriate.

[0300] The arithmetic device 221 may acquire the lower point cloud data Lpc4, for example, from the storage device 222, based on, for example, the identification information of the jig 5. The arithmetic device 221 may generate, as the measurement result MD4, point cloud data that indicates the three-dimensional shape of the entire jig 5 that holds one machined workpiece W, by combining the lower point cloud data Lpc4 and the upper point cloud data Upc5.

[0301] For example, if the jig 5 holding a workpiece W before machining (i.e., the workpiece W before machining and the jig 5) is referred to as the first object, and the jig 5 holding a workpiece W after machining (i.e., the workpiece W after machining and the jig 5) is referred to as the second object, then both the first object and the second object include the jig 5. Therefore, it can be said that the first object and the second object have a common part. Furthermore, the part of the workpiece W after machining other than the machining location is the same as the workpiece W before machining. Therefore, it can be said that the part of the workpiece W before machining included in the first object and the part of the workpiece W after machining included in the second object are common parts of the first object and the second object.

[0302] (4-4-4) Fourth Aspect The fourth aspect will now be described. For example, as shown in FIG. 14 , another jig 5 of the same type as a first jig 5 may exist. Here, “the same type” may mean that the structure and function of the first jig 5 are the same as the structure and function of the other jig 5. “The same type” may also be rephrased as, for example, “having the same model.” Although there may be very slight differences between the first jig 5 and the other jig 5 due to, for example, manufacturing errors, the first jig 5 and the other jig 5 can be considered to be the same jig. Note that multiple measurement members IM may be attached to the first jig 5 and the other jig 5. In the fourth aspect, the lower point cloud data Lpc6 associated with the first jig 5 may be reused in measuring the other jig 5 holding a workpiece W. Note that the first jig 5 may or may not hold a workpiece W. When one jig 5 holds a workpiece W, the workpiece W held by the one jig 5 may be the same type of workpiece W as the workpiece W held by another jig 5. Note that, with regard to the fourth aspect, explanations that overlap with the above-described first aspect will be omitted as appropriate.

[0303] The shape measurement device 21 may measure one jig 5. Note that one jig 5 is not limited to holding a single workpiece W, and may hold multiple workpieces W. However, one jig 5 does not have to hold a workpiece W. For example, the shape measurement head 211 at position P1 may measure the one jig 5 each time the stage 213 moves so that the one jig 5 rotates by a predetermined angle around the Z axis. After the one jig 5 rotates 360 degrees around the Z axis due to the movement of the stage 213, the head drive system 212 may move the shape measurement head 211 from position P1 to position P2. Thereafter, the shape measurement head 211 at position P2 may measure the one jig 5 each time the stage 213 moves so that the one jig 5 rotates by a predetermined angle around the Z axis.

[0304] For example, the shape measuring head 211 at position P1 may measure one jig 5, thereby measuring one jig 5 included in range R1 shown in Fig. 21. The measurement result of the shape measuring head 211 at position P2 may be point cloud data indicating the three-dimensional shape of one jig 5 included in range R2. Hereinafter, the point cloud data indicating the three-dimensional shape of one jig 5 included in range R2 will be appropriately referred to as "upper point cloud data Upc6".

[0305] For example, the shape measuring head 211 at position P2 may measure one jig 5, thereby measuring one jig 5 included in range R2 shown in Fig. 21. The measurement result of the shape measuring head 211 at position P2 may be point cloud data indicating the three-dimensional shape of one jig 5 included in range R2. Hereinafter, the point cloud data indicating the three-dimensional shape of one jig 5 included in range R2 will be appropriately referred to as "upper point cloud data Upc6".

[0306] For example, the calculation device 221 may store the lower point cloud data Lpc6 and the upper point cloud data Upc6 in the storage device 222 in association with one jig 5 (for example, identification information of one jig 5).

[0307] The arithmetic device 221 may link the lower point cloud data Lpc6 and the upper point cloud data Upc6 to one jig 5 (e.g., identification information of one jig 5) and transmit them to the information processing device 4. In this case, the arithmetic device 41 of the information processing device 4 may link the lower point cloud data Lpc6 and the upper point cloud data Upc6 to one jig 5 (e.g., identification information of one jig 5) and store them in the storage device 42. At this time, the arithmetic device 41 may link the lower point cloud data Lpc6 and the upper point cloud data Upc6 to one jig 5 (e.g., identification information of one jig 5) and register them in the table shown in FIG. 14 .

[0308] Thereafter, the shape measuring device 21 may measure another jig 5 holding a workpiece W. The other jig 5 may hold a single workpiece W, or may hold multiple workpieces W. For example, the shape measuring head 211 at position P2 may measure the other jig 5 holding the workpiece W each time the stage 213 moves so that the other jig 5 holding the workpiece W rotates by a predetermined angle around the Z axis. In this case, the shape measuring head 211 may measure the other jig 5 holding the workpiece W only at position P2, without performing measurements at position P1.

[0309] For example, the shape measuring head 211 at position P2 may measure the other jig 5 holding the workpiece W, thereby measuring the workpiece W and the other jig 5 included in range R2 shown in Fig. 21. The measurement result of the shape measuring head 211 at position P2 may be point cloud data indicating the three-dimensional shapes of the workpiece W and the other jig 5 included in range R2. The point cloud data indicating the three-dimensional shapes of the workpiece W and the other jig 5 included in range R2 will hereinafter be referred to as "upper point cloud data Upc7" as appropriate.

[0310] The calculation device 221 may acquire, for example, from the storage device 222, lower point cloud data Lpc6 relating to a jig 5 of the same type as the other jig 5, based on, for example, the identification information of the other jig 5. The calculation device 221 may generate, as the measurement result MD5, point cloud data indicating the entire three-dimensional shape of the other jig 5 holding the workpiece W, by combining the lower point cloud data Lpc6 and the upper point cloud data Upc7.

[0311] For example, one jig 5 (however, the one jig 5 may hold a workpiece W) is referred to as a first object, and another jig 5 holding the workpiece W (i.e., the workpiece W and the other jig 5) is referred to as a second object. The other jig 5 is the same type of jig as the one jig 5. Therefore, the one jig 5 included in the first object and the other jig 5 included in the second object can be said to be a common part of the first object and the second object.

[0312] (4-4-5) Fifth Aspect The fifth aspect will be described. In the fifth aspect, the coordinate values ​​(i.e., reference coordinates) of each of the multiple feature points indicated by table IT may be used to measure the jig 5 that holds the workpiece W. In other words, in the fifth aspect, the reference coordinates indicated by table IT may be reused. Note that, with regard to the fifth aspect, explanations that overlap with those of the first aspect described above will be omitted as appropriate.

[0313] The shape measuring device 21 may measure the jig 5 holding the workpiece W. The jig 5 may hold a single workpiece W, or may hold multiple workpieces W. For example, the shape measuring head 211 at position P2 may measure the jig 5 holding the workpiece W each time the stage 213 moves so that the jig 5 holding the workpiece W rotates by a predetermined angle around the Z axis. In this case, the shape measuring head 211 may measure the jig 5 holding the workpiece W only at position P2, without performing measurements at position P1.

[0314] For example, the shape measuring head 211 at position P2 may measure the jig 5 holding the workpiece W, thereby measuring another workpiece W and the jig 5 included in range R2 shown in Fig. 21. The measurement result of the shape measuring head 211 at position P2 may be point cloud data indicating the three-dimensional shapes of the workpiece W and the jig 5 included in range R2. Hereinafter, the point cloud data indicating the three-dimensional shapes of the workpiece W and the jig 5 included in range R2 will be referred to as "upper point cloud data Upc8" as appropriate.

[0315] The upper point cloud data Upc8 includes one or more feature points corresponding to portions of the multiple measurement members IM. The calculation device 221 of the control information generation device 22 may correct the coordinate values ​​of each of the multiple points included in the upper point cloud data Upc8 by correcting the coordinate values ​​of one or more feature points included in the upper point cloud data Upc8 corresponding to portions of the multiple measurement members IM based on the reference coordinates indicated by table IT. The calculation device 221 may generate the upper point cloud data Upc8 with the corrected coordinate values ​​as the measurement result MD6. Then, the calculation device 221 may generate processing control information based on the measurement result MD6.

[0316] As described above, in order to properly process the workpiece W with the processing device 1, data on the reference position of the workpiece W in the height direction (Z direction), for example, is required because the value of the distance (in other words, the height) from the reference position in the height direction of the processing location of the workpiece W is required.

[0317] Here, the reference coordinates indicated by table IT may include reference coordinates corresponding to a reference position in the height direction. In other words, the coordinates of the reference position in the height direction may be known. For example, the distance of each of the multiple points from the reference position in the height direction can be calculated from the Z coordinate value of each of the multiple points and the reference coordinate corresponding to the reference position in the height direction. Therefore, in the fifth aspect, for example, the processing control information may be generated based on the upper point cloud information Upc8 (i.e., the measurement result MD6) with corrected coordinate values, without reusing the lower point cloud data Lpc0.

[0318] (4-4-6) Sixth Aspect The sixth aspect will be described below. Note that, with regard to the sixth aspect, the description that overlaps with the first aspect described above will be omitted as appropriate.

[0319] In a sixth aspect, the arithmetic device 221 of the control information generating device 22 may perform a first matching process using, for example, at least one of the lower point cloud data Lpc0 and the upper point cloud data Upc0 and CAD data representing a three-dimensional model of the jig 5. In the first matching process, the arithmetic device 221 may translate, enlarge, reduce, and / or rotate the three-dimensional model so that characteristic locations in the three-dimensional model represented by the CAD data approach (typically, coincide) with characteristic locations in the three-dimensional shape represented by at least one of the lower point cloud data Lpc0 and the upper point cloud data Upc0. In other words, the arithmetic device 221 may change the positional relationship between the coordinate system of the three-dimensional model (e.g., the coordinate system of the CAD model) and the measurement coordinate system of the measuring device 2 so that characteristic locations in the three-dimensional model approach (typically, coincide) with characteristic locations in the three-dimensional shape represented by at least one of the lower point cloud data Lpc0 and the upper point cloud data Upc0.

[0320] The shape measuring device 21 may measure the jig 5 holding the workpiece W. The jig 5 may hold a single workpiece W, or may hold multiple workpieces W. For example, the shape measuring head 211 at position P2 may measure the jig 5 holding the workpiece W each time the stage 213 moves so that the jig 5 holding the workpiece W rotates by a predetermined angle around the Z axis. In this case, the shape measuring head 211 may measure the jig 5 holding the workpiece W only at position P2, without performing measurements at position P1.

[0321] For example, the shape measuring head 211 at position P2 may measure the jig 5 holding the workpiece W, thereby measuring another workpiece W and the jig 5 included in range R2 shown in Fig. 21. The measurement result of the shape measuring head 211 at position P2 may be point cloud data indicating the three-dimensional shapes of the workpiece W and the jig 5 included in range R2. Hereinafter, the point cloud data indicating the three-dimensional shapes of the workpiece W and the jig 5 included in range R2 will be referred to as "upper point cloud data Upc9" as appropriate.

[0322] The arithmetic device 221 may perform a second matching process using the upper point cloud data Upc9 and the three-dimensional model on which the first matching process has been performed (i.e., the three-dimensional model represented by the CAD data of the jig 5). In the second matching process, the arithmetic device 221 may translate, enlarge, reduce, and / or rotate the three-dimensional shape represented by the upper point cloud data Upc9 so that characteristic locations in the three-dimensional shape represented by the upper point cloud data Upc9 approach (typically, match) characteristic locations in the three-dimensional model on which the first matching process has been performed.

[0323] The arithmetic device 221 may generate the result of the second matching process as a measurement result MD7 indicating the three-dimensional shape of the entire jig 5 holding the workpiece W. Then, the arithmetic device 221 may generate processing control information based on the measurement result MD7.

[0324] In the sixth aspect, since at least one of the lower point cloud data Lpc0 and the upper point cloud data Upc0 is used in the first matching process, it can be said that at least one of the lower point cloud data Lpc0 and the upper point cloud data Upc0 is reused. Instead of the lower point cloud data Lpc0 and the upper point cloud data Upc0, the first matching process may be performed using at least one of the lower point cloud data and the upper point cloud data as the measurement results obtained when the shape measuring head 211 measures the jig 5 holding another workpiece W, and CAD data indicating a three-dimensional model of the jig 5 holding another workpiece W. In this case, the second matching process may use the three-dimensional model of the jig 5 holding the other workpiece W and the upper point cloud data Upc9.

[0325] (4-4-7) Seventh Aspect The seventh aspect will be described with reference to Figures 26 and 27. Note that, for the seventh aspect, the description that overlaps with the first aspect described above will be omitted as appropriate.

[0326] The shape measuring device 21 may measure the jig 5 that is not holding the workpiece W. For example, the shape measuring head 211 at position P1 may measure the jig 5 each time the stage 213 moves so that the jig 5 rotates by a predetermined angle around the Z axis. In a seventh aspect, the shape measuring head 211 may measure the jig 5 only at position P1, without performing measurement at position P2.

[0327] For example, when the shape measuring head 211 at position P1 measures the jig 5, a portion of the jig 5 included in, for example, a range R1 shown in FIG. 26( a) may be measured. The measurement result of the shape measuring head 211 at position P1 may be point cloud data indicating the three-dimensional shape of the portion of the jig 5. Hereinafter, the point cloud data indicating the three-dimensional shape of the portion of the jig 5 will be appropriately referred to as "lower point cloud data Lpc0a."

[0328] The arithmetic device 221 may associate the lower point cloud data Lpc0a with the jig 5 (e.g., identification information of the jig 5) and store it in the storage device 222. The arithmetic device 221 may associate the lower point cloud data Lpc0a with the jig 5 (e.g., identification information of the jig 5) and transmit it to the information processing device 4. In this case, the arithmetic device 41 of the information processing device 4 may associate the lower point cloud data Lpc0a with the jig 5 (e.g., identification information of the jig 5) and store it in the storage device 42. At this time, the arithmetic device 41 may associate the lower point cloud data Lpc0a with the jig 5 (e.g., identification information of the jig 5) and register it in the table shown in FIG. 14 .

[0329] Thereafter, the shape measuring device 21 may measure the jig 5 holding the workpiece W. Note that the jig 5 is not limited to holding a single workpiece W, and may hold multiple workpieces W. However, to avoid complicating the explanation, it will be simply referred to as "workpiece W."

[0330] For example, the shape measuring head 211 at position P2 may measure the jig 5 holding the workpiece W each time the stage 213 moves so that the jig 5 holding the workpiece W rotates by a predetermined angle around the Z axis. In this case, the shape measuring head 211 may measure the jig 5 holding the workpiece W only at position P2, without performing measurements at position P1.

[0331] For example, the shape measuring head 211 at position P2 may measure the jig 5 holding the workpiece W, thereby measuring the workpiece W and the jig 5 included in range R2 shown in Fig. 26(b). The measurement result of the shape measuring head 211 at position P2 may be point cloud data (i.e., upper point cloud data Upc1) indicating the three-dimensional shapes of the workpiece W and the jig 5 included in range R2.

[0332] The calculation device 221 may acquire the lower point cloud data Lpc0a based on, for example, the identification information of the jig 5. As shown in FIG. 26B, the lower point cloud data Lpc0a may include feature points fp#1 and fp#2. The upper point cloud data Upc1 may also include feature points fp#1 and fp#2. In other words, the lower point cloud data Lpc0a and the upper point cloud data Upc1 may include a common feature point. Note that the number of common feature points included in the lower point cloud data Lpc0a and the upper point cloud data Upc1 is not limited to two, and may be three or more, or may be one.

[0333] The calculation device 221 may generate point cloud data indicating the three-dimensional shape of the entire jig 5 holding the workpiece W as the measurement result MD1a by combining the lower point cloud data Lpc0a and the upper point cloud data Upc1 with reference to the above-mentioned common feature points (e.g., feature points fp#1 and fp#2).

[0334] The operation of the measurement apparatus 2 according to the seventh aspect will be described with reference to the flowchart of FIG. 27 . In FIG. 27 , the arithmetic unit 221 of the control information generating device 22 may acquire from the shape measuring device 21 a plurality of partial measurement results (i.e., a plurality of partial measurement information) of a single measurement object (e.g., a jig 5 not holding a workpiece W) as a result of the shape measuring head 221 at a first measurement position (e.g., position P1) measuring the single measurement object while the single measurement object is rotated around the Z axis (step S501). At this time, the arithmetic unit 221 may store the plurality of partial measurement results in the storage device 222. Next, the arithmetic unit 221 may extract one or more feature points from each of the plurality of partial measurement results acquired in the processing of step S501 (step S502). The arithmetic unit 221 may combine the plurality of partial measurement results acquired in the processing of step S501 based on the feature points extracted in the processing of step S502 (step S503). As a result, the arithmetic device 221 may acquire first partial measurement data (for example, lower point cloud information Lpc0a) indicating the three-dimensional shape of a portion of the measurement object. The arithmetic device 221 may store the first partial measurement data in the storage device 222.

[0335] After one measurement object is removed from the shape measurement device 21 and another measurement object (e.g., the jig 5 holding the workpiece W) is placed on the stage 213 of the shape measurement device 21, the calculation device 221 may acquire from the shape measurement device 21 multiple partial measurement results (i.e., multiple partial measurement information) related to the other measurement object as a result of the shape measurement head 221 measuring the other measurement object at a second measurement position (e.g., position P2) while the other measurement object is rotated around the Z axis (step S504). At this time, the calculation device 221 may store the multiple partial measurement results in the storage device 222. Next, the calculation device 221 may extract one or multiple feature points from each of the multiple partial measurement results acquired in the processing of step S504 (step S505). The calculation device 221 may combine the multiple partial measurement results acquired in the processing of step S504 based on the feature points extracted in the processing of step S505 (step S506). As a result, the calculation device 221 may acquire third partial measurement data (e.g., upper point cloud information Upc1) indicating the three-dimensional shape of a portion of the other measurement object. The calculation device 221 may store the third partial measurement data in the storage device 222.

[0336] Thereafter, the arithmetic device 221 may acquire first partial measurement data from the storage device 222 (step S507). Next, the arithmetic device 221 may combine the first partial measurement data and the third partial measurement data based on one or more feature points (e.g., feature points fp#1 and fp#2) included in the first partial measurement data and one or more feature points (e.g., feature points fp#1 and fp#2) included in the third partial measurement data (step S508). As a result, measurement data (e.g., measurement result MD1a) indicating the entire three-dimensional shape of the other measurement object may be generated.

[0337] (4-4-8) Others The workpiece W does not have to be held by the jig 5. In other words, the measurement device 2 (specifically, the shape measurement device 21) may measure a workpiece W that is not held by the jig 5. In this case, for example, part of the measurement results of one workpiece W before processing may be reused in measuring one workpiece W after processing. Here, one workpiece W is assumed to be a long workpiece W.

[0338] The shape measuring device 21 may measure one workpiece W before the workpiece W is machined by the machining device 1. For example, the shape measuring head 211 at position P1 may measure one workpiece W each time the stage 213 moves so that the one workpiece W rotates by a predetermined angle around the Z axis. After the one workpiece W rotates 360 degrees around the Z axis by the movement of the stage 213, the head drive system 212 may move the shape measuring head 211 from position P1 to position P2. Thereafter, the shape measuring head 211 at position P2 may measure one workpiece W each time the stage 213 moves so that the one workpiece W rotates by a predetermined angle around the Z axis.

[0339] For example, the shape measuring head 211 at position P1 may measure a workpiece W, thereby measuring a portion of the workpiece W included in range R1 shown in Fig. 21. The measurement result of the shape measuring head 211 at position P1 may be point cloud data indicating the three-dimensional shape of the portion of the workpiece W included in range R1. Hereinafter, the point cloud data indicating the three-dimensional shape of the portion of the workpiece W included in range R1 will be appropriately referred to as "lower point cloud data Lpc10".

[0340] For example, by measuring one workpiece W with the shape measuring head 211 at position P2, another portion of the one workpiece W included in range R2 shown in Fig. 21 may be measured. The measurement result of the shape measuring head 211 at position P2 may be point cloud data indicating the three-dimensional shape of another portion of the one workpiece W included in range R2. Hereinafter, the point cloud data indicating the three-dimensional shape of the one workpiece W included in range R2 will be appropriately referred to as "upper point cloud data Upc10".

[0341] The arithmetic device 221 may generate point cloud data indicating the three-dimensional shape of the entire one workpiece W as the measurement result MD8 by combining the lower point cloud data Lpc10 and the upper point cloud data Upc10. The arithmetic device 221 may generate processing control information based on the measurement result MD8. The processing control information may be used when the processing device 1 processes the one workpiece W.

[0342] For example, the calculation device 221 may store the lower point cloud data Lpc10 and the upper point cloud data Upc10 in the storage device 222 in association with one work W (for example, identification information of one work W).

[0343] When the processing device 1 processes one workpiece W and the processed workpiece W is placed on the shape measuring device 21 of the measuring device 2, the shape measuring device 21 may measure the processed workpiece W. For example, the shape measuring head 211 at position P2 may measure the processed workpiece W each time the stage 213 moves so that the processed workpiece W rotates by a predetermined angle around the Z axis. In this case, the shape measuring head 211 may measure the processed workpiece W only at position P2, without performing measurement at position P1.

[0344] For example, the shape measuring head 211 at position P2 may measure a portion of the machined workpiece W that is included in range R2 shown in Fig. 21 . The measurement result of the shape measuring head 211 at position P2 may be point cloud data that indicates the three-dimensional shape of the portion of the machined workpiece W that is included in range R2. Hereinafter, the point cloud data that indicates the three-dimensional shape of the portion of the machined workpiece W that is included in range R2 will be referred to as "upper point cloud data Upc11" as appropriate.

[0345] The arithmetic device 221 may acquire the lower point cloud data Lpc10 based on, for example, identification information of one workpiece W. The arithmetic device 221 may generate point cloud data indicating the entire three-dimensional shape of the machined one workpiece W as the measurement result MD9 by combining the lower point cloud data Lpc10 and the upper point cloud data Upc11.

[0346] The arithmetic unit 221 of the control information generating device 22 does not need to reuse part of the past measurement results of the shape measuring device 21. In this case, the arithmetic unit 221 may use at least one of the position and depression angle of the shape measuring head 211.

[0347] For example, the positional relationship between the head coordinate system of the measurement head 211 and the measurement coordinate system of the measurement device 2 can be determined from the position of the measurement head 211 on the second support mechanism 2112 (in other words, the movement distance of the measurement head 211 on the second support mechanism 2112) and the depression angle of the measurement head 211.

[0348] For example, the shape measuring head 211 at position P1 may measure the jig 5 (i.e., the jig 5 not holding the workpiece W), thereby measuring a portion of the jig 5 that is included in, for example, a range R1 shown in FIG. 21 . The measurement result of the shape measuring head 211 at position P1 may be point cloud data indicating the three-dimensional shape of a portion of the jig 5. Thereafter, the position of the shape measuring head 211 may be moved from position P1 to position P2. At this time, the arithmetic unit 221 of the control information generating device 22 may acquire information regarding the movement distance of the shape measuring head 211 from position P1 to position P2. Then, the arithmetic unit 211 may store the information regarding the movement distance of the shape measuring head 211 in the storage device 222. Thereafter, the shape measuring head 211 at position P2 may measure the jig 5, thereby measuring another portion of the jig 5 that is included in, for example, a range R2 shown in FIG. 21 .

[0349] The jig 5 not holding the workpiece W may be removed from the shape measuring device 21, and the jig 5 holding the workpiece W may be placed on the stage 213 of the shape measuring device 21. Thereafter, for example, the shape measuring head 211 at position P2 may measure the jig 5 holding the workpiece W each time the stage 213 moves so that the jig 5 holding the workpiece W rotates by a predetermined angle around the Z axis. In this case, the shape measuring head 211 may measure the jig 5 holding the workpiece W only at position P2, without performing measurements at position P1.

[0350] For example, the shape measuring head 211 at position P2 may measure the jig 5 holding the workpiece W, thereby measuring the workpiece W and the jig 5 included in range R2 shown in Fig. 23. The measurement result of the shape measuring head 211 at position P2 may be point cloud data (e.g., upper point cloud data Upc1) indicating the three-dimensional shapes of the workpiece W and the jig 5 included in range R2.

[0351] The arithmetic device 221 may specify the positional relationship between the head coordinate system and the measurement coordinate system, for example, from information regarding the position P1, the depression angle of the shape measuring head 211 at position P2, and the movement distance of the shape measuring head 211 from position P1 to position P2. The arithmetic device 221 may correct the coordinate values ​​of each of a plurality of points included in the point cloud data indicating the three-dimensional shapes of the workpiece W and the jig 5 included in range R2, based on the specified positional relationship.

[0352] (5) Modifications The processing system SYS may include a processing device 6 in addition to the multiple processing devices 1 or instead of at least one of the multiple processing devices 1. The processing device 6 may be a processing device that performs processing using powder bed fusion (PBF), as described below. The processing system SYS may include various stereolithography processing devices, such as a processing device 1 that performs additive processing using directed energy deposition (DED), and a processing device 6. The processing system SYS may include multiple processing devices that employ the same type of processing method but are different models. The processing system SYS may include at least one of a processing device that performs laser removal processing and a processing device that performs mechanical cutting processing, in addition to the processing device 1 and the processing device 6, or instead of at least one of the processing device 1 and the processing device 6.

[0353] The identification information of the jig 5 may include information about an apparatus (e.g., a processing apparatus) to which the jig 5 is applicable, because different jigs are generally made for each apparatus to which the jig is compatible.

[0354] The configuration of the processing device 6 will be described with reference to FIG. 28 . FIG. 28 is a cross-sectional view showing the structure of the processing device 6. As shown in FIG. 28 , the processing device 6 includes a carrier 611 and a material application device 612. The carrier 611 is a member on which a material layer ML is formed. The material application device 612 is a device capable of forming the material layer ML on the carrier 611 under the control of a control device 63 conceptually shown in FIG. 28 . Note that, for ease of explanation, FIG. 28 does not show a cross section of the control device 63. The material layer ML is a layer of a modeling material M. The modeling material M is, for example, a powder. As an example, the modeling material M may be at least one of a metal powder and a resin powder. However, the modeling material M does not have to be a powder.

[0355] The processing device 6 irradiates at least a portion of the material layer ML formed on the carrier 611 with processing light EL. The processing light EL may also be referred to as a processing beam or a processing beam. The processing light EL may also be referred to as an energy beam. When the processing light EL is irradiated onto at least a portion of the material layer ML, at least a portion of the material layer ML melts. Then, after the processing light EL is no longer irradiated onto the molten material layer ML, the molten material layer ML solidifies. As a result, a structure layer SL corresponding to the solidified material layer ML is formed. The structure layer SL may be equivalent to a sintered layer formed by sintering the modeling material M.

[0356] The processing device 6 includes a beam scanning device 62 capable of emitting the processing light EL to irradiate the material layer ML with the processing light EL. The processing device 6 may irradiate the material layer ML with the processing light EL emitted from the beam scanning device 62. The beam scanning device 62 may selectively irradiate the material layer ML with the processing light EL under the control of the control device 63 to selectively solidify the material layer ML. To selectively irradiate the material layer ML with the processing light EL, the beam scanning device 62 may deflect the processing light EL using a scanning optical element (not shown), which may be, for example, a galvanometer mirror. In other words, the beam scanning device 62 may use the scanning optical element to change the emission direction of the processing light EL emitted from the beam scanning device 62.

[0357] The beam scanning device 62 may be called an irradiation device because it irradiates the material layer ML with the processing light EL. The beam scanning device 62 is capable of emitting the processing light EL.

[0358] For example, the beam scanning device 62 may deflect the processing light EL in the θx direction, which is a rotation direction about the X axis in FIG. 28, and in the θy direction, which is a rotation direction about the Y axis.

[0359] The beam scanning device 62 may deflect the processing light EL based on processing path information indicating the movement trajectory of the irradiation position of the processing light EL so that the processing light EL is irradiated at the position indicated by the processing path information. The processing path information may be generated based on, for example, CAD data of the three-dimensional structure to be formed. Therefore, the structure layer SL to be formed matches the shape of a part of the three-dimensional structure to be formed.

[0360] After forming the structure layer SL, the processing device 6 may lower the carrier 611. Therefore, the carrier 611 is movable along the Z-axis direction in FIG. 28 . To move the carrier 611 in the Z-axis direction, the processing device 6 includes a carrier moving device 613. The carrier moving device 613 is a device that can move the carrier 611 along the Z-axis direction under the control of the control device 63. After the carrier moving device 613 lowers the carrier 611 (in the example shown in FIG. 28 , the carrier 611 is moved toward the −Z side), the material application device 612 may form a new material layer ML on the carrier 611 (more specifically, on the already-formed structure layer SL and the already-formed old material layer ML). Thereafter, the processing device 6 may irradiate the newly formed material layer ML with the processing light EL emitted from the beam scanning device 62. As a result, a new structure layer SL is formed on the already-formed structure layer SL. In other words, the new structure layer SL is stacked on the already-formed structure layer SL.

[0361] Thereafter, the processing device 6 repeats the same operations. That is, the processing device 6 alternately repeats the operation of forming a material layer ML, the operation of solidifying at least a portion of the formed material layer ML to form a structure layer SL, and the operation of lowering the carrier 611. As a result, a three-dimensional structure in which a plurality of structure layers SL are stacked is formed on the carrier 611. That is, the processing device 6 forms a three-dimensional structure on the carrier 611 by performing additional processing on the carrier 611 (specifically, by performing additional processing using the material layer ML formed on the carrier 611). In other words, the processing device 6 forms a three-dimensional structure on the carrier 611 by performing additional processing on the carrier 611 using the material layer ML formed on the carrier 611. In this way, the processing device 6 performs additive processing based on powder bed fusion, such as selective laser sintering (SLS), to form a three-dimensional structure.

[0362] 28 , a build plate 614 may be disposed on a carrier 611. In this case, the processing apparatus 6 may form a material layer ML on the build plate 614. As a result, a three-dimensional structure in which a plurality of structural layers SL are stacked may be formed on the build plate 614. That is, the processing apparatus 6 may form a three-dimensional structure on the build plate 614 by performing additional processing on the build plate 614 (i.e., performing additional processing using the material layer ML formed on the build plate 614). In other words, the processing apparatus 6 may form a three-dimensional structure on the build plate 614 by performing additional processing on the build plate 614 using the material layer ML formed on the build plate 614.

[0363] The processing device 6 may further include a build cylinder 615. The build cylinder 615 includes at least one side wall 6151. The at least one side wall 6151 may be in contact with the building material M. In this case, the build cylinder 615 may function as a container for containing the building material M. The at least one side wall 6151 may be in contact with the carrier 611.

[0364] The processing apparatus 6 may further include a processing chamber 620. The processing chamber 620 may also be referred to as a processing room. The processing chamber 620 includes a side wall 621 extending perpendicular to the XY plane, and a bottom wall 622 and a top wall 623 extending parallel to the XY plane. The processing chamber 620 is a box-shaped structure having a rectangular parallelepiped or cubic shape. However, the processing chamber 620 may also have a box-shaped structure having another shape. For example, the processing chamber 620 may be a box-shaped structure having a cylindrical, conical, or pyramidal shape.

[0365] The control device 63 can control the operation of the processing device 6. For example, the control device 63 may be able to control the movement of the carrier 611 by the carrier moving device 613. That is, the control device 63 may be able to control the carrier moving device 613. For example, the control device 63 may be able to control the formation of the material layer ML by the material coating device 612. That is, the control device 63 may be able to control the material coating device 612. For example, the control device 63 may be able to control the irradiation of the processing light EL by the beam scanning device 62. That is, the control device 63 may be able to control the beam scanning device 62.

[0366] <Supplementary Notes> The following supplementary notes are further disclosed regarding the above-described embodiment.

[0367] (Supplementary Note 1) A measurement method for acquiring a three-dimensional shape using a measurement unit, comprising: placing a first object including a first workpiece mounted on a holder in a measurement device having the measurement unit; acquiring first point cloud information of the first object using the measurement unit while the measurement unit is at a first position; acquiring second point cloud information of the first object while the measurement unit is at a second position different from the first position; placing a second object different from the first object in the measurement device; acquiring third point cloud information of the second object while the measurement unit is at a third position higher than the first position; and acquiring the three-dimensional shape of the second object based on the first point cloud information and the third point cloud information.

[0368] (Supplementary Note 2) A measurement method for acquiring a three-dimensional shape using a measurement unit, the measurement method comprising: placing a first object in a measurement device having the measurement unit; acquiring first point cloud information about the first object placed in the measurement device using the measurement unit at a first position; acquiring second point cloud information of the first object placed in the measurement device using the measurement unit at a second position different from the first position; placing a second object in the measurement device, the second object including a common portion with a part of the first object; acquiring third point cloud information of the second object placed in the measurement device using the measurement unit at a third position different from the first position; and acquiring the three-dimensional shape of the second object based on the first point cloud information and the third point cloud information.

[0369] (Supplementary Note 3) A measurement method for acquiring a three-dimensional shape using a measurement unit, comprising: placing a first object in a measurement device having the measurement unit; when a relative positional relationship between the measurement unit and the first object is a first positional relationship, acquiring first point cloud information about the first object using the measurement unit; when a relative positional relationship between the measurement unit and the first object is a second positional relationship different from the first positional relationship, acquiring second point cloud information about the first object using the measurement unit; placing a second object including a common portion with a part of the first object in the measurement device; using the measurement unit to acquire third point cloud information about the second object; and acquiring the three-dimensional shape of the second object based on at least a portion of the first point cloud information and the third point cloud information.

[0370] (Supplementary Note 4) The measurement method described in Supplementary Note 3, wherein the first object includes a first holder capable of holding a workpiece, the second object includes the first holder as at least a part of the common part, and the second object further includes one or more first workpieces held by the first holder.

[0371] (Appendix 5) The first object includes, as part of the common part, the one or more first workpieces held by the first holder, the one or more first workpieces included in the first object are in a state before being processed by a processing device, and the one or more first workpieces included in the second object are in a state after being processed by the processing device. This is the measurement method described in Appendix 4.

[0372] (Appendix 6) The first object includes one or more second workpieces held by the first holder as part of the common part, and the one or more second workpieces are workpieces of the same type as the one or more first workpieces. This is the measurement method described in Appendix 4.

[0373] (Supplementary Note 7) The measurement method described in Supplementary Note 3, wherein the first object includes a first holder capable of holding a workpiece, the second object includes a second holder as at least a part of the common part, the second object further includes one or more first workpieces held by the second holder, and the second holder is a holder of the same type as the first holder.

[0374] (Appendix 8) The measurement method described in Appendix 7, wherein the first object includes one or more second workpieces held by the first holder as part of the common part, and the one or more second workpieces are workpieces of the same type as the one or more first workpieces.

[0375] The present invention is not limited to the above-described embodiments, but can be modified as appropriate within the scope of the claims and the gist or idea of ​​the invention as can be read from the entire specification, and measurement methods, measurement devices, and processing systems that involve such modifications are also included in the technical scope of the present invention.

[0376] SYS Machining system 1 Machining device 2 Measuring device 3 Conveying device 4 Information processing device

Claims

1. A measurement method for obtaining a three-dimensional shape using a measurement unit, comprising: arranging a first holder capable of holding a workpiece to be machined within a measuring device having the measurement unit; when the relative positional relationship between the measurement unit and the first holder is a first positional relationship, obtaining first point cloud information regarding the first holder using the measurement unit; when the relative positional relationship between the measurement unit and the first holder is a second positional relationship different from the first positional relationship, obtaining second point cloud information regarding the first holder using the measurement unit; arranging a second holder holding one or more first workpieces to be machined within the measuring device; obtaining third point cloud information regarding the one or more first workpieces held by the second holder using the measurement unit; and obtaining the three-dimensional shape of the one or more first workpieces based on at least a part of the first point cloud information and the third point cloud information.

2. The measurement method according to claim 1, wherein obtaining the three-dimensional shape of the one or more first workpieces includes synthesizing the three-dimensional shape indicated by at least a part of the first point cloud information and the three-dimensional shape indicated by the third point cloud information.

3. The first point cloud information includes one or more feature points related to the first holder, the third point cloud information includes one or more feature points related to the second holder, and synthesizing the three-dimensional shape indicated by at least a part of the first point cloud information and the three-dimensional shape indicated by the third point cloud information is based on feature points among the one or more feature points related to the second holder that correspond to at least a part of the one or more feature points related to the first holder, and synthesizing the three-dimensional shape indicated by at least a part of the first point cloud information and the three-dimensional shape indicated by the third point cloud information. The measurement method according to claim 2.

4. The one or more feature points related to the first holder are feature points corresponding to one or more measurement members attached to the first holder, and the one or more feature points related to the second holder are feature points corresponding to one or more measurement members attached to the second holder. The measurement method according to claim 3.

5. The measurement method according to any one of claims 1 to 4, wherein the third point group information is obtained by measuring a part of the one or more first objects to be processed using the measurement unit.

6. The measurement method according to any one of claims 1 to 5, wherein the third point group information includes a point group corresponding to a part of the one or more first objects to be processed that is processed by a processing device.

7. The measurement method according to any one of claims 1 to 5, wherein the third point group information includes a point group corresponding to a part that changes due to processing when the one or more first objects to be processed are processed by a processing device.

8. The measurement method according to any one of claims 1 to 7, wherein the measurement unit and the first holder in the first positional relationship are relatively moved along an axis extending in one direction, so that the first positional relationship is changed to the second positional relationship.

9. The measurement method according to claim 8, wherein the measurement unit among the measurement unit and the first holder in the first positional relationship is moved along an axis extending in the one direction, so that the first positional relationship is changed to the second positional relationship.

10. The measurement method according to claim 8 or 9, wherein the first holder among the measurement unit and the first holder in the first positional relationship is moved along an axis extending in the one direction, so that the first positional relationship is changed to the second positional relationship.

11. The measurement method according to any one of claims 8 to 10, wherein the one direction is the height direction of the measuring device.

12. The measurement method according to claim 1, wherein at least one angle of the measurement unit and the first holder in the second positional relationship is changed from at least one angle of the measurement unit and the first holder in the first positional relationship.

13. The measurement method according to any one of claims 1 to 12, wherein the first holder and the second holder are the same holder.

14. The first holder holds one or more second objects to be processed, and the first point group information and the second point group information are point group information regarding the first holder that holds the one or more second objects to be processed. The measurement method according to claim 13.

15. The measurement method according to claim 14, wherein the one or more first objects to be processed and the one or more second objects to be processed are objects to be processed of the same type.

16. The measurement method according to claim 14, wherein the one or more first objects to be processed and the one or more second objects to be processed are the same object to be processed.

17. The first point cloud information and the second point cloud information are acquired before the one or more second objects to be processed, which are the one or more first objects to be processed held by the first holder, are processed. The third point cloud information is acquired after the one or more first objects to be processed held by the second holder, which is the first holder, are processed. The measurement method according to claim 16.

18. The measurement method according to any one of claims 1 to 12, wherein the first holder and the second holder are holders of the same type.

19. The first holder holds one or more second objects to be processed. The first point cloud information and the second point cloud information are point cloud information regarding the first holder that holds the one or more second objects to be processed. The measurement method according to claim 18.

20. The measurement method according to claim 19, wherein the one or more first objects to be processed and the one or more second objects to be processed are objects to be processed of the same type.

21. The first point cloud information is stored in a storage device in association with information related to the first holder. Acquiring the three-dimensional shape of the one or more first objects to be processed includes reading the first point cloud information from the storage device. The measurement method according to any one of claims 1 to 20.

22. The information related to the first holder is identification information related to the first holder. The measurement method according to claim 21.

23. Acquiring the three-dimensional shape of the one or more first objects to be processed includes reading the first point cloud information from the storage device based on the information related to the second holder. The measurement method according to claim 21 or 22.

24. The information related to the second holder is identification information related to the second holder. The measurement method according to claim 23.

25. Acquiring the three-dimensional shape of the one or more first objects to be processed includes acquiring the identification information related to the second holder and reading the first point cloud information from the storage device based on the information related to the second holder. The measurement method according to claim 24.

26. The second holder is provided with at least one of a reading code and a non-contact communication tag, and acquiring the identification information related to the second holder includes reading at least one of the reading code and the non-contact communication tag. The measurement method according to claim 25.

27. After the one or more first objects to be processed are removed from the second holder that holds the one or more first objects to be processed, and one or more third objects to be processed different from the one or more first objects to be processed are attached to the second holder, further including placing the second holder that holds the one or more third objects to be processed in the measurement device. The measurement method according to any one of claims 1 to 26.

28. Acquiring the three-dimensional shape of the one or more first objects to be processed includes generating coordinate information based on at least a part of the first point cloud information, and specifying coordinates of the three-dimensional shape indicated by the third point cloud information based on the coordinate information. The measurement method according to any one of claims 1 to 27.

29. A measurement method for acquiring a three-dimensional shape using a measurement unit, including acquiring first information regarding a holder capable of holding an object to be processed, placing the holder holding the object to be processed in a measurement device having the measurement unit, acquiring point cloud information including a point cloud corresponding to a part of the object to be processed by measuring a part of the object to be processed held by the holder using the measurement unit, and acquiring the three-dimensional shape of the object to be processed held by the holder based on the first information and the point cloud information.

30. The measurement method according to claim 29, wherein the first information is acquired by using the measurement unit.

31. The measurement method according to claim 30, wherein the first information is acquired based on information regarding the positional relationship of the measurement unit.

32. The obtaining of the first information includes obtaining first point cloud information regarding the holder using the measurement unit when the relative positional relationship between the measurement unit and the holder is a first positional relationship, and obtaining second point cloud information regarding the holder using the measurement unit when the relative positional relationship between the measurement unit and the first holder is a second positional relationship different from the first positional relationship. The measurement method according to claim 31.

33. The obtaining of the first information includes measuring the holder using the measurement unit when the relative positional relationship between the measurement unit and the holder is a first positional relationship, and measuring the holder using the measurement unit when the relative positional relationship between the measurement unit and the first holder is a second positional relationship different from the first positional relationship. The first information includes information regarding the moving distance of the measurement unit in the first positional relationship and the second positional relationship. The measurement method according to claim 31.

34. The first information includes information regarding the reference position of the arranged holder. The measurement method according to any one of claims 30 to 33.

35. The first information includes information regarding the height from the reference position. The measurement method according to claim 34.

36. The first information includes information regarding the designed shape of the holder. The measurement method according to claim 29.

37. A measurement method for obtaining a three-dimensional shape using a measurement unit, including arranging a first holder capable of holding a workpiece to be processed in a measurement device having the measurement unit, obtaining first point cloud information regarding the first holder using the measurement unit when the relative positional relationship between the measurement unit and the first holder is a first positional relationship, arranging a second holder holding one or more first workpieces to be processed in the measurement device, obtaining third point cloud information regarding the one or more first workpieces held by the second holder using the measurement unit, and obtaining the three-dimensional shape of the one or more first workpieces based on at least a part of the first point cloud information and the third point cloud information. The measurement method.

38. A measurement device that performs measurement using the measurement method according to any one of claims 1 to 37.

39. A processing system comprising the measuring device according to claim 38 and a processing device that processes the one or more first objects to be processed.

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