Mounting device

Abstract

The present invention provides a mounting device for achieving secure mounting while preventing attachment tool contamination when performing face-down mounting of a chip component onto a board using a pre-applied underfill. Specifically, there is provided a mounting device comprising: a board stage that holds a board; a mounting head that holds a chip component; a lifting means that raises and lowers the mounting head in a direction perpendicular to the board; an imaging means for observing the chip component held by the mounting head; a chip temporary holding unit allowing the chip component to be transferred to and from the mounting head; and a control unit which is connected to the imaging means and which calculates the position of the chip component relative to an attachment tool that forms a surface of the mounting head for holding the chip component.

Description

Mounting Equipment

[0001] The present invention relates to a mounting apparatus for mounting chip components on a substrate such as a wiring board.

[0002] 10 is a schematic diagram of a mounting apparatus 101 as an example of an apparatus for mounting chip components such as semiconductor chips on a substrate such as a wiring board. In the mounting apparatus 101, a chip component held by an attachment tool 42 of a mounting head 4 is mounted at a predetermined location on a substrate held by a suction table 23.

[0003] 10 performs so-called face-down mounting (also called flip-chip mounting), in which electrodes of a chip component and electrodes of a substrate are placed opposite each other and joined together. In face-down mounting, the electrodes are generally joined together by melting at least one of the electrodes of the chip component and the electrodes of the substrate.

[0004] In face-down mounting, joining electrodes together provides electrical bonding, but the mechanical bonding strength may be insufficient. For this reason, resin is filled into the gap between the chip component and the substrate (underfill). One example of this method is a technique in which a thermosetting resin is applied in advance to the electrode surface of either the chip component or the substrate (pre-applied underfill), and the thermosetting resin is cured in parallel with the bonding of the electrodes by heating (see, for example, Patent Document 1).

[0005] 11(a), an insulating paste NCP containing a thermosetting resin (which may contain insulating inorganic fine particles) is applied to the portion of the substrate S where the chip component C is to be mounted, and the substrate S and the chip component C are aligned before the chip component C comes into contact with the insulating paste NCP on the substrate S. In addition, the heat generated from the heater portion 41 raises the temperature of the chip component C held by the attachment tool 42.

[0006] Therefore, if the temperature of the chip component C is above the softening temperature of the insulating paste NCP, the mounting head 4 can be lowered as shown in Figure 11 (b) to bring the electrodes of the chip component C and the electrodes of the substrate close enough to be in close contact with each other, and by further heating, the electrodes are electrically joined and the insulating paste NCP hardens, completing the mounting.

[0007] In FIG. 11, the surface of the attachment tool 42 that holds the chip component C is made the same size as the chip component C. This is to prevent contamination of the surface of the attachment tool 42 that holds the chip component C while allowing the insulating paste NCP to harden sufficiently.

[0008] That is, as shown in FIG. 12( a), if the surface of the attachment tool 42 that holds the chip component C is larger than the chip component C, the insulating paste NCP that spills out from the periphery of the chip component C during the heat-pressure bonding stage will adhere to the outer periphery of the attachment tool 42 (FIG. 12( b)), causing contamination.

[0009] Furthermore, if the surface of the attachment tool 42 that holds the chip component C is smaller than the chip component C, as in Figure 13(a), the state shown in Figure 13(b) will occur, and pressure and heat will not be applied to the outer periphery of the chip component C sufficiently, which may result in incomplete bonding between the electrodes near the outer periphery of the chip component C and insufficient hardening of the insulating paste NCP.

[0010] For this reason, in face-down mounting using a pre-applied underfill such as insulating paste NCP, it is desirable that the surface of the attachment tool 42 that holds the chip component C and the chip component C have the same shape and size.

[0011] JP 2017-179186 A

[0012] In a configuration such as the mounting device 101 illustrated in FIG. 10, a chip component C supplied from a chip supply unit (not shown) is mounted on the chip slider 61 of the chip transport means 6, moved to directly below the mounting head 4, and then transferred to the attachment tool 42.

[0013] Here, as shown in FIG. 11A, it is desirable that the chip component C is delivered in a state where the surface of the attachment tool 42 that holds the chip component C is aligned with the position of the chip component C.

[0014] That is, if the surface of the attachment tool 42 that holds the chip components C does not align with the position of the chip components C (FIG. 14(a)), part of the attachment tool 42 will be contaminated with the insulating paste NCP, and some parts of the insulating paste NCP will not harden sufficiently, resulting in defective mounting. For this reason, a control mechanism may be introduced to keep the position at which the chip components C are loaded from the chip supply unit onto the chip slider 61, the position of the chip slider 61 when transferring the chip components C, etc., within predetermined ranges.

[0015] However, even when such a control mechanism is introduced, a sudden disturbance or the like may cause the positional deviation of the chip component C from the surface of the attachment tool 42 that holds the chip component C to exceed the allowable range. If such a positional deviation occurs that exceeds the allowable range, the surface that holds the chip component C becomes contaminated, and it becomes necessary to replace the attachment tool 42. However, the time required to replace the attachment tool 42 is lost, and many spare attachment tools 42 must be prepared, which has a significant impact on mounting costs.

[0016] The present invention has been made in view of the above problems, and provides a mounting device that can perform reliable mounting while preventing contamination of the attachment tool when mounting chip components face-down on a substrate using a pre-applied underfill such as insulating paste NCP.

[0017] In order to solve the above problem, the invention described in claim 1 is a mounting device for mounting chip components on a substrate, comprising: a substrate stage for holding the substrate; a mounting head for holding the chip components; a lifting means for raising and lowering the mounting head in a direction perpendicular to the substrate; an imaging means for observing the chip components held by the mounting head; a temporary chip holding unit capable of transferring the chip components to and from the mounting head; and a control unit connected to the imaging means for calculating the relative position of the chip components with respect to an attachment tool that forms the surface of the mounting head that holds the chip components.

[0018] A second aspect of the present invention is the mounting apparatus according to the first aspect, wherein the control unit calculates a positional deviation of the chip component from a predetermined position of the attachment tool.

[0019] The invention described in claim 3 is the mounting device described in claim 2, wherein at least one of the chip temporary holding unit and the mounting head has the function of moving in the in-plane direction of the substrate and is connected to the control unit.

[0020] The invention described in claim 4 is the mounting device described in claim 3, wherein after the control unit calculates the positional misalignment, the chip component is transferred from the mounting head to the temporary chip holding unit, and the control unit moves at least one of the temporary chip holding unit and the mounting head so as to correct the positional misalignment, and then the chip component is transferred from the temporary chip holding unit to the mounting head.

[0021] The invention described in claim 5 is a mounting device described in any one of claims 1 to 4, wherein the mounting head is capable of adjusting its rotational position around a rotation axis perpendicular to the substrate, and the chip temporary holding portion is capable of adjusting its position in two intersecting axial directions within the plane of the substrate.

[0022] The invention described in claim 6 is the mounting apparatus described in claim 5, wherein the substrate stage has a function of moving in an in-plane direction of the substrate, and the chip temporary holding unit is linked to the substrate stage.

[0023] According to the present invention, when chip components are face-down mounted on a substrate using a pre-applied underfill such as insulating paste NCP, the chip components can be reliably mounted on the substrate without contaminating the surface of the attachment tool that holds the chip components, thereby making it possible to achieve both high quality and high productivity.

[0024] FIG. 1 is a schematic diagram of a mounting apparatus according to an embodiment of the present invention; FIG. 2 is a block diagram of a control system according to an embodiment of the present invention; FIG. 3 is a schematic diagram showing a state in which a mounting apparatus according to an embodiment of the present invention is determining the positional relationship between an attachment tool and a chip component; FIG. 4 is a diagram illustrating the operation of the mounting apparatus according to an embodiment of the present invention, in which (a) a chip component is transported directly below a mounting head by a chip transport means, (b) the chip component is held by an attachment tool of the mounting head, and (c) the attachment tool is observing whether the chip component is held in a predetermined position. FIG. 1 is a diagram illustrating the operation of the mounting apparatus according to an embodiment of the present invention, in which (a) a state in which the chip component and the substrate are aligned after it is confirmed that the chip component is held in a predetermined position on the attachment tool, (b) the mounting head is lowered and the chip component is mounted on the substrate, and (c) the mounting head is raised after the chip component has been mounted on the substrate. FIG. 2 is a diagram illustrating the operation of the mounting apparatus according to an embodiment of the present invention, in which a state is determined after the chip component has been misaligned with the predetermined position of the attachment tool. 1A and 1B are diagrams illustrating operations performed by a mounting apparatus according to an embodiment of the present invention after it has been determined that a chip component has been misaligned with respect to a predetermined position of an attachment tool, the diagram illustrating (a) the state in which the amount of misalignment is being measured, (b) the state in which a temporary chip holder is disposed directly below the chip component, (c) the state in which a mounting head is lowered to transfer the chip component to the temporary chip holder, and (d) the state in which the mounting head is raised with the temporary chip holder holding the chip component. 1A and 1B are diagrams illustrating operations performed by a mounting apparatus according to an embodiment of the present invention after it has been determined that a chip component has been misaligned with respect to a predetermined position of an attachment tool, the diagram illustrating (a) the state in which the positional relationship between the attachment tool and the temporary chip holder is adjusted to correct the misalignment, the diagram illustrating (b) the state in which a mounting head is lowered to transfer the chip component to the temporary chip holder, and (c) the state in which the mounting head is raised with the temporary chip holder holding the chip component.1A and 1B are diagrams illustrating how to correct misalignment of a chip component relative to an attachment tool in a mounting apparatus according to an embodiment of the present invention, showing (a) an example of a state in which misalignment occurs, (b) a state in which the chip center is aligned with the rotation center of the attachment tool, (b) a state in which the attachment tool, which is not holding a chip component, has been rotated to be parallel to the chip component, and (d) a state in which the attachment tool has held the chip component and then returned to its original orientation.

[0023] FIG. 1B is a schematic diagram of a mounting apparatus for mounting chip components on a substrate.

[0024] FIG. 1A is a diagram illustrating an example in which the chip holding surface of the attachment tool is equal in size to the chip component when mounting the chip component on a substrate to which NCP has been applied, showing (a) the state before mounting and (b) the state during mounting.

[0025] FIG. 1B is a diagram illustrating an example in which the chip holding surface of the attachment tool is larger than the chip component when mounting the chip component on a substrate to which NCP has been applied, showing (a) the state before mounting and (b) the state during mounting. 1A and 1B are diagrams showing an example of a chip component mounting process on a substrate coated with NCP, in which the chip holding surface of the attachment tool is smaller than the chip component, (a) showing the state before mounting and (b) showing the state during mounting. 1B and 1C are diagrams showing an example of a chip component mounting process on a substrate coated with NCP, in which the chip holding surface of the attachment tool and the chip component are equal in size but misaligned, (a) showing the state before mounting and (b) showing the state during mounting.

[0025] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described with reference to the accompanying drawings. Fig. 1 is a schematic diagram of a mounting apparatus 1 according to an embodiment of the present invention.

[0026] The mounting device mounts chip components on a substrate such as a wiring board, and the mounting device 1 shown in Fig. 1 is configured for face-down mounting, in which the electrode surface of the chip component faces the electrode surface of the substrate. Furthermore, an insulating paste (NCP) is applied to the substrate at the position where the chip component (C) is to be mounted before the chip component (C) is mounted. The insulating paste (NCP) contains a thermosetting insulating resin as a component, and may also contain insulating inorganic fine particles.

[0027] 1 has a substrate stage 2 mounted on a base 200, which holds a substrate and controls its movement in the in-plane direction of the substrate. Elevating means 3 is fixed above the substrate stage 2 by a gate-shaped frame (not shown) mounted on the base 200, and a mounting head 4 is connected to the vertical drive shaft of the elevating means 3. The mounting apparatus 1 also has a chip transport means 6 which transports chip components C to the mounting head 4, and a dual-view camera 5 with upper and lower fields of view which acquires positional information for the chip components C and the substrate when aligning them.

[0028] The above components are common to the mounting device 101 shown in Fig. 10, but the mounting device 1 further includes an imaging means 7 and a chip temporary holding unit 8. Each component constituting the mounting device 1 in Fig. 1 will now be described.

[0029] First, the substrate stage 2 is composed of an adsorption table 23 that adsorbs and holds the substrate placed on its surface, a Y-direction adjustment unit 22 that can move the adsorption table 23 linearly in the Y direction, and an X-direction adjustment unit 21 that is provided on the base 200 and can move the Y-direction adjustment unit 22 linearly in the X direction.

[0030] The Y-direction adjustment unit 22 has a suction table 23 mounted on a movable part arranged on a slide rail, and the movement and position of the movable part are controlled by a Y-direction servo 221. The X-direction adjustment unit 21 has a Y-direction adjustment unit 22 mounted on a movable part arranged on a slide rail, and the movement and position of the movable part are controlled by an X-direction servo 211. Here, the X-direction servo 211 and the Y-direction servo 221 are servo motors.

[0031] The lifting means 3 is fixed to a gate-shaped frame (not shown), and its vertical drive shaft is arranged perpendicular to the suction table 23, with the mounting head 4 connected to the vertical drive shaft. The lifting means 3 drives the mounting head 4 up and down, and also has the function of applying a pressure force according to a setting. Furthermore, in the mounting device 1, the lifting means 3 is supported from two directions and is connected linearly to the mounting head 4, so that lateral force is unlikely to be applied to the mounting head 4 when pressure is applied.

[0032] The mounting head 4 holds the chip component C and presses it parallel to the substrate (held on the suction table 23 of the substrate stage 2). The mounting head 4 is composed of a heater unit 41, an attachment tool 42, and a tool position adjustment unit 43. The heater unit 41 has a heat generating function and heats the chip component C via the attachment tool 42. The heater unit 41 also has a function of suction-holding the attachment tool 42 using a reduced pressure flow path. The attachment tool 42 suctions and holds the chip component C, and is replaced depending on the shape of the chip component C. The tool position adjustment unit 43 finely adjusts the positions of the heater unit 41 and the attachment tool 42 in the vertical plane of the up / down drive shaft of the lifting means 3.

[0033] The tool position adjustment unit 43 includes an X-direction adjustment unit 431, a Y-direction adjustment unit 432, and a rotational direction adjustment unit 433. In the embodiment shown in FIG. 1 , the rotational direction adjustment unit 433 adjusts the rotational direction of the attachment tool 42 (and the heater unit 41), the Y-direction adjustment unit 432 adjusts the Y-direction position of the rotational direction adjustment unit 433, and the X-direction adjustment unit 431 adjusts the X-direction position of the Y-direction adjustment unit 432. However, the present invention is not limited to this configuration, and any other configuration may be adopted as long as it is possible to adjust the X-direction position, Y-direction position, and rotation angle of the attachment tool 42. Here, as long as the X-direction adjustment unit 21 and the Y-direction adjustment unit 22 of the substrate stage 2 satisfy the desired alignment accuracy, the X-direction adjustment unit 431 and the Y-direction adjustment unit 432 of the tool position adjustment unit 43 are not essential components of this embodiment.

[0034] The two-viewpoint camera 5 is used to align the chip component C with the board S by acquiring position information of the chip recognition mark provided on the chip component C with the upward-facing camera and acquiring position information of the board recognition mark provided on the board S with the downward-facing camera. Note that the camera is not limited to a two-viewpoint camera with two integrated cameras, as long as it can acquire position information of the chip recognition mark provided on the chip component C and position information of the board recognition mark provided on the board S. For example, if the position information of the chip recognition mark is acquired by the imaging means 7 having an upper field of view and a separate imaging means having a lower field of view is provided to acquire position information of the board recognition mark provided on the board S, then it is not necessary to use a two-viewpoint camera with an upper and lower field of view.

[0035] The chip transport means 6 is composed of a transport rail 60 and a chip slider 61, and the chip slider 61 holds the chip component C supplied from a chip supply unit (not shown) and slides it below the attachment tool 42 to transport it.

[0036] Here, a chip supply unit (not shown) places the chip component C at a predetermined position on the chip slider 61. The placement position of the chip component C placed on the chip slider 61 may be recognized by an imaging means. Also, the position of the chip slider 61 may be controlled so that the chip component C is delivered within a predetermined range of the attachment tool 42. After the attachment tool 42 has held the chip component C, the chip slider 61 moves to a retracted position.

[0037] The imaging means 7 is used to determine the positional relationship between the attachment tool 42 (the surface that holds the chip part C) and the chip component C when the attachment tool 42 is holding the chip component C, and is positioned in the mounting device 1 so as to observe the underside of the attachment tool 42 (the surface that holds the chip component C) from below.

[0038] The chip temporary holding portion 8 is adapted to receive and hold chip components C that are held in a state where the positional deviation relative to the attachment tool 42 (the surface that holds the chip components C) exceeds the allowable range, and has the function of adsorbing and holding the electrode surface side of the chip components C.

[0039] In the mounting device 1, the imaging means 7 and the chip temporary holding portion 8 are fixed to a chip position adjustment table 230 connected to the end of the suction table 23, but this is not limited to this and any form that allows the position to be adjusted in the in-plane direction (XY direction) of the chip component C (as long as it does not interfere with the suction table 23) may be used.

[0040] As shown in the block diagram of Figure 2, the mounting device 1 is equipped with a control unit 10 connected to a substrate stage 2, a lifting means 3, a mounting head 4, a two-view camera 5 with upper and lower views, a chip transport means 6, an imaging means 7, and a chip temporary holder 8.

[0041] The control unit 10 essentially consists of a CPU and a storage device as its main components, and interfaces with each device as necessary. The control unit 10 also has a built-in program that allows it to perform calculations using acquired data and output the results of the calculations.

[0042] The control unit 10 is connected to the substrate stage 2, and controls the operation of the X-direction servo 211 and the Y-direction servo 221 to control the in-plane movement of the suction table 23. The control unit 10 also controls the suction table 23 to control suction holding and release of the substrate S.

[0043] The control unit 10 is connected to the lifting means 3 and has the function of controlling the position of the mounting head 4 in the vertical direction (Z direction) and also controlling the pressure applied when the chip component C is pressure-bonded to the substrate S.

[0044] The control unit 10 is connected to the mounting head 4 and has the function of controlling the suction, holding and release of the chip component C by the attachment tool 42, the heating temperature of the heater unit 41, and the positions of the heater unit 41 and the attachment tool 42 in the XY plane.

[0045] The control unit 10 is connected to the upper and lower dual field of view camera 5 and has the function of controlling the horizontal (in the XY plane) and vertical (Z direction) driving, as well as controlling the imaging operation to acquire image data. The control unit 10 also has an image processing function, and has the function of calculating position information of the board recognition mark and / or chip recognition mark in the images acquired by the upper and lower cameras.

[0046] The control unit 10 is connected to the chip transport means 6 and has a function of controlling the position of the chip slider 61 which moves along the transport rail 60. It is also desirable that the control unit 10 has a function of controlling whether the chip slider 61 holds or releases the chip components.

[0047] The control unit 10 has a function of connecting to the imaging means 7 and controlling the imaging operation to acquire image data. The control unit 10 also has an image processing function, and has a function of calculating the positional relationship of the (held) chip component with respect to the surface of the attachment tool 42 that holds the chip component C in the acquired image.

[0048] The control unit 10 is connected to the chip temporary holder 8 and has a function of controlling whether the chip component C is held or released.

[0049] The following describes the process by which the mounting device 1 mounts chip components C on the substrate S. The mounting process according to the present invention basically includes a chip transport process for transferring chips C supplied from a chip supply unit to the attachment tool 42, a tool holding state determination process for determining whether or not the chip components are held at predetermined positions on the attachment tool 42, an alignment process for aligning the chip mounting location on the substrate S directly below the attachment tool 42, and a mounting process for crimping the chip components C to the mounting location, and also includes a chip position adjustment process for adjusting the position of the chip components C if the determination result in the tool holding state determination process is NG.

[0050] In the mounting apparatus 1, the mounting head 4 is connected to the fixed lifting means 3 (by a gate-shaped frame, not shown), and therefore cannot be moved significantly. Furthermore, since the imaging means 7 and the temporary chip holder 8 are disposed on the outer periphery of the suction table 23, the suction table 23 of the substrate stage 2 is moved as shown in FIG. 3 in order to bring the imaging means 7 or the temporary chip holder 8 into opposition to the attachment tool 42. However, the present invention is effective in embodiments other than those described above, and can also be applied to configurations in which the mounting head moves on the suction table.

[0051] 4 and 5 are diagrams illustrating the operation of the mounting apparatus 1 from the chip transport process to the mounting process, and show the state as viewed from the Y direction.

[0052] 4(a) and 4(b) relate to the chip transport process. FIG. 4(a) shows the state in which the chip slider 61 holding the chip component C moves along the transport rail 60 to a position directly below the mounting head 4, and FIG. 4(b) shows the state in which the mounting head 4 descends and transfers the chip component C from the chip slider 61 to the attachment tool 42.

[0053] 4(c) shows the state in which, in the tool holding state determination step, the imaging means 7 observes and images the underside of the attachment tool 42 and the chip component C. The image data captured by the imaging means 7 is sent to the control unit 10, which calculates the positional relationship of the (held) chip component with respect to the surface of the attachment tool 42 that holds the chip component C, and determines whether or not the positional relationship is within an allowable range.

[0054] If the positional relationship of the (held) chip component C with respect to the surface of the attachment tool 42 that holds the chip component C is within the tolerance range, the process proceeds to the alignment step. Figure 5(a) shows the alignment step, in which the control unit 10 operates the substrate stage 2 to move the suction table 23. After this, the upper and lower dual-view camera 5 captures images of the chip recognition mark on the chip component C and the substrate recognition mark on the substrate S. Both captured image data are sent to the control unit 10, which calculates the amount of misalignment of the chip component C with respect to a predetermined position on the substrate S (the location where the chip component C should be mounted). If the amount of misalignment exceeds the tolerance range, alignment is performed. During alignment, the control unit 10 controls the substrate stage 2 or the tool position adjustment unit 43. Regarding angle adjustment around the Z direction as the center of rotation, it controls the rotation direction adjustment unit 433 of the tool position adjustment unit 43.

[0055] After the alignment process, the control unit 10 moves the upper and lower dual-view camera 5 to the back, and then lowers the mounting head 4 as shown in FIG. 5B. The heater unit 41 is heated to heat and compress the chip component C onto the substrate S. When the mounting head 4 is lowered for thermocompression bonding, insulating paste NCP is applied to predetermined locations on the substrate S. The thermocompression bonds the electrodes of the chip component C and the substrate S, and the insulating paste NCP hardens, firmly securing the chip component C to the substrate S. After the mounting process is completed, the control unit 10 releases the attachment tool 42 from its suction force and raises the mounting head 4 as shown in FIG. 5C. At this stage, the control unit 10 turns off the heater unit 41 to lower the temperature of the attachment tool 42. The control unit 10 then raises the mounting head 4 to the position shown in FIG. 4A, and the next semiconductor chip C to be mounted is transported by the chip transport means 6.

[0056] In the above explanation, we have described a form in which chip components are mounted after the insulating paste NCP has been applied to the substrate S, but the present invention is applicable to pre-applied underfill in general and is also effective for mounting chip components C with an insulating film NCF attached to the electrode surface.

[0057] In the above description, in the tool holding state determination process shown in FIG. 4(c), the positional relationship of the chip component C with respect to the surface of the attachment tool 42 that holds the chip component C is within an allowable range. However, if the positional relationship is outside the allowable range, the process proceeds to the chip position adjustment process instead of the alignment process shown in FIG. 5(a).

[0058] The chip position adjustment process adjusts the position of the chip component C relative to the surface of the attachment tool 42 that holds the chip component C so that it falls within a predetermined range.The attachment tool 42 first releases the chip component C from its holding position, adjusts its relative position to correct any misalignment, and then holds the chip component C again.

[0059] In the chip position adjustment process, the control unit 10 acquires the relative positional relationship of the chip component C with respect to the surface of the attachment tool 42 that holds the chip component C, with the imaging means 7 positioned directly below the mounting head 4 as shown in Figure 4(c), and then drives the substrate stage 2 to adjust the position so that the chip temporary holding portion 8 is positioned directly below the mounting head 4 (Figure 6).

[0060] The chip position adjusting step will be described below with reference to FIGS. 7 and 8, which show enlarged views of the vicinity of the mounting head 4. FIG.

[0061] 7(a) is a partial enlargement of the state of FIG. 4(c), showing the state in which the imaging means 7 is observing the surface of the attachment tool 42 that holds the chip component C and the chip component C, with the rotation center 43C being the rotation center of the rotation direction adjustment unit 433 in the tool position adjustment unit 43, and the chip center CC being the center position of the chip component C. The attachment tool 42 is held by the heater unit 41 with its center position aligned with the rotation center 43C. In the state of FIG. 7(a), information on the relative position of the chip component C with respect to the surface of the attachment tool 42 that holds the chip component C is calculated and stored by the control unit 10.

[0062] 7(b) shows a state in which the control unit 10 drives the substrate stage 2 to adjust the position so that the temporary chip holder 8 is located directly below the mounting head 4. In this state, it is desirable to position the center of the temporary chip holder 8 near directly below the chip center CC.

[0063] Thereafter, the control unit 10 lowers the mounting head 4, and as shown in Fig. 7(c), the chip component C is transferred from the attachment tool 42 to the temporary chip holder 8. Note that the reason why the position of the temporary chip holder 8 is adjusted so that the center of the temporary chip holder 8 is immediately below the chip center CC at the stage shown in Fig. 7(b) is to ensure that the temporary chip holder 8 securely holds the chip component when transferring the chip component C to it.

[0064] After the chip component C is transferred to the chip temporary holder 8, the control unit 10 releases the attachment tool 42 from holding the chip component C, and then raises the mounting head 4 (FIG. 7D) in the same manner as in the state shown in FIG. 7B.

[0065] In this state, the control unit 10 controls the substrate stage 2 or the tool position adjustment unit 43 to correct the positional misalignment of the chip component C relative to the surface of the attachment tool 42 that holds the chip component C, as calculated in Figure 7 (a), but controls the rotation direction adjustment unit 433 of the tool position adjustment unit 43 for angle adjustment around the Z direction as the center of rotation.

[0066] 8(a) shows the state after the misalignment correction operation has been performed, and by lowering the mounting head 4 from this state, the position of the chip component C coincides with the surface of the attachment tool 42 that holds the chip component C when the attachment tool 42 is in close contact with the chip component C (FIG. 8(b)). Therefore, the control unit 10 transfers the chip component C from the temporary chip holder 8 to the attachment tool 42, releases the temporary chip holder 8 from holding the chip component C, and then raises the mounting head 4. After the mounting head 4 has been raised, the process proceeds to the alignment step as shown in FIG.

[0067] 9 shows the change in the positional relationship between the attachment tool 42 and the chip component C during the chip position adjustment process as viewed from the Z direction. In Fig. 9, the shape of the chip component C is shown by a dotted line, and the first chip recognition mark CA1 and the second chip recognition mark CA2 are chip recognition marks CA arranged at two positions on a diagonal line and are also used for alignment with the substrate S.

[0068] The shape of the attachment tool 42 is shown by a solid line, but as depicted in Figures 7 and 8, the attachment tool 42 has a two-stage shape, and in Figure 9, the outer solid line indicates the outer periphery, while the inner solid line indicates the surface that holds the chip component C. The tool center 42C is the center position of the attachment tool 42, and is aligned with the rotation center 43C as described above.

[0069] 9, a tool recognition mark 42A consisting of a first tool recognition mark 42A1 and a second tool recognition mark 42A2 is arranged on the outer diagonal of the surface of the attachment tool 42 that holds the chip component C. Therefore, the attachment tool 42 and the chip component C can be aligned using the tool recognition mark 42A and the chip recognition mark AC. However, the method for aligning the attachment tool 42 and the chip component C is not limited to this, and alignment can also be performed by image recognition of the surface of the attachment mark 42 that holds the chip component C and the shape of the chip component C.

[0070] The chip position adjustment process will be described below with reference to Figures 9(a) to 9(d). First, Figure 9(a) shows a state in which the chip component C is misaligned with respect to the surface of the attachment tool 42 that holds the chip component C, as shown in Figure 7(a). This positional relationship remains unchanged in the stages of Figures 7(b) and 7(c). Furthermore, if the mounting head 4 is vertically elevated in the stage of Figure 7(d), there is no change in the misalignment shown in Figure 9(a) even if the chip component C is separated from the attachment tool 42.

[0071] 8A, first, the chip center CC is aligned with the rotation center 43C as shown in FIG. 9B by moving the chip position adjustment table 230 in conjunction with the suction table 23 using the substrate stage 2, or by using the tool position adjustment unit 43. Then, by using the rotation direction adjustment unit 433 of the tool position adjustment unit 43 to adjust the angle (with the Z direction as the rotation axis), the surface of the attachment tool 42 that holds the chip component C and the position of the chip component C are aligned as shown in FIG. 9C.

[0072] In this state, if the mounting head 4 is lowered and the chip component C is transferred from the temporary chip holder 8 to the attachment tool 42 in the state shown in Fig. 8(b), the chip component C will be held in a state aligned with the surface holding the chip component C. Thereafter, the temporary chip holder 8 releases the chip component C from its hold, the mounting head 4 is raised, and the angle (with the Z direction as the rotation axis) is returned to its original state using the rotation direction adjuster 433 of the tool position adjuster 43, resulting in the state shown in Fig. 9(d), allowing for transition to the alignment shown in Fig. 5(a).

[0073] As a modification of the embodiment of the present invention, the tip holder 8 may have a rotational direction adjustment function for adjusting the angle around the Z direction as the rotation axis. If the tip holder 8 has the rotational direction adjustment function, it can be changed from the state shown in Fig. 9(b) to the state shown in Fig. 9(d) at the stage shown in Fig. 8(a).

[0074] If there is an inclination relative to the vertical direction during the ascent from the state shown in Fig. 7(c) to the state shown in Fig. 7(d), a difference will occur with respect to the positional relationship shown in Fig. 9(a). However, if the height of the mounting head 7 is the same in Fig. 7(a) and Fig. 7(d), the difference in positional relationship will be canceled out, so it is desirable to make the height of the mounting head 4 in the state shown in Fig. 7(a) the same as that in Fig. 7(d) and Fig. 8(a).

[0075] As described above, the present invention allows chip components to be held without misalignment relative to the chip component-holding surface of the attachment tool. Therefore, if the chip component and the chip component-holding surface of the attachment tool are the same size, the chip component can cover the entire chip component-holding surface of the attachment tool and can be held without protruding. As a result, when chip components are face-down mounted on a substrate using pre-applied underfill, the chip component can be reliably mounted on the substrate without contaminating the chip component-holding surface. This means that high-quality mounting is possible, and high productivity can be maintained by reducing the need for replacement of the attachment tool due to contamination.

[0076] In the mounting apparatus 1 of the embodiment, the lifting means 3 to which the mounting head 4 is connected is fixed, and the suction table 23 of the substrate stage 2 is movable, but the scope of application of the present invention is not limited to this. In other words, even in an apparatus configuration in which the suction table is fixed and the mounting head is movable in the X and Y directions, the present invention is effective in addressing the problem of contamination of the attachment tool of the mounting head.

[0077] Furthermore, the application of the present invention is not limited to face-down mounting, but is also effective for face-up mounting in which the electrodes of the chip component and the electrodes of the substrate face in the same direction. That is, in face-up mounting, when mounting a chip component on a substrate, an adhesive is used to bond the electrode surface of the substrate to the side opposite the electrode surface of the chip component, which poses a problem of preventing contamination of the attachment tool, and the present invention is suitable for solving this problem.

[0078] REFERENCE SIGNS LIST 1, 101 Mounting device 2 Substrate stage 3 Elevating means 4 Mounting head 5 Upper and lower two-view camera 6 Chip transport means 7 Imaging means 8 Chip temporary holding section 10 Control section 21 X-direction adjustment section 22 Y-direction adjustment section 23 Suction table 41 Heater section 42 Attachment tool 42A (42A1, 42A2) Tool recognition mark 42C Tool center 43 Tool position adjustment section 43C Rotation center 60 Transport rail 61 Chip slider 200 Base 230 Chip position adjustment table 431 X-direction adjustment section 432 Y-direction adjustment section 433 Rotation direction adjustment section C Chip component CA (CA1, CA2) Chip recognition mark CC Chip center NCP Insulating paste S Substrate

Claims

1. A mounting device for mounting chip components on a substrate, comprising: a substrate stage for holding the substrate; a mounting head for holding the chip components; lifting means for lifting and lowering the mounting head in a direction perpendicular to the substrate; imaging means for observing the chip components held by the mounting head; a chip temporary holding part capable of mutually transferring the chip components with the mounting head; and a control unit connected to the imaging means for calculating the relative position of the chip components with respect to an attachment tool forming a surface for holding the chip components of the mounting head.

2. The mounting device according to claim 1, wherein the control unit calculates a misalignment of the chip components with respect to a predetermined position of the attachment tool.

3. The mounting device according to claim 2, wherein at least one of the chip temporary holding part and the mounting head has a function of moving in the in-plane direction of the substrate and is connected to the control unit.

4. The mounting device according to claim 3, after the control unit calculates the misalignment, the chip component is transferred from the mounting head to the chip temporary holding part, and at least one of the chip temporary holding part and the mounting head is moved so that the control unit corrects the misalignment, and then the chip component is transferred from the chip temporary holding part to the mounting head.

5. The mounting device according to any one of claims 1 to 4, wherein the mounting head can adjust its rotational position about a rotation axis in a direction perpendicular to the substrate, and the chip temporary holding part can adjust its position in two axial directions intersecting within the plane of the substrate.

6. The mounting device according to claim 5, wherein the substrate stage has a function of moving in the in-plane direction of the substrate, and the chip temporary holding part is interlocked with the substrate stage.

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