Imaging device

Abstract

This imaging device comprises: a cooling fan in which rotary vanes are arranged inside a housing, the axial direction of the rotation axis of the rotary vanes is in the thickness direction, and an air intake aperture is formed on at least one face in the thickness direction; a first heat sink having a plurality of first heat-dissipating fins and causing cooling air to flow in a first channel toward the air intake aperture; and a second heat sink having a plurality of second heat-dissipating fins and causing cooling air to flow in a second channel toward the air intake aperture, wherein the first and second heat sinks are disposed at different positions in a direction orthogonal to the thickness direction, and the first and second channels are formed into discrete spaces.

Description

Imaging device

[0001] The present technology relates to a technical field of an imaging device equipped with a cooling fan and a heat sink.

[0002] Various imaging devices such as video cameras and still cameras have heat-generating components such as various substrates in addition to imaging elements such as CCDs (Charge Coupled Devices) and CMOSs ​​(Complementary Metal Oxide Semiconductors), and it is necessary to suppress the temperature rise caused by the heat generated by these heat-generating components to ensure proper operating conditions.

[0003] Therefore, some imaging devices are provided with a cooling structure in which a cooling fan (sirocco fan) and a heat sink are arranged in the case body to suppress temperature increases due to heat generated by heat-generating components (see, for example, Patent Document 1).

[0004] The imaging device described in Patent Document 1 is provided with a cooling fan, a first heat sink, and a second heat sink, and describes a configuration in which cooling air taken in through an intake opening in the case body passes through the first heat sink and the second heat sink in order, is sucked into the cooling fan, is blown out from the cooling fan, and is discharged through an exhaust opening.

[0005] Japanese Patent Application Laid-Open No. 2016-201798

[0006] In an imaging device having the above-described cooling structure, since various heat-generating components are provided as described above, it is desirable to improve the cooling efficiency and sufficiently suppress the temperature rise due to the heat generated by the heat-generating components, thereby ensuring an appropriate operating state. In particular, in a configuration where multiple heat sinks are provided, it is desirable to improve the cooling efficiency by ensuring sufficient heat exchange between each heat sink and the cooling air.

[0007] Therefore, an object of the imaging device of the present technology is to improve cooling efficiency without increasing the size of components.

[0008] The imaging device according to the present technology includes a cooling fan in which rotating blades are arranged inside a housing, the axial direction of the rotation axis of the rotating blades being in the thickness direction, and an intake opening formed on at least one surface in the thickness direction; a first heat sink having a plurality of first heat dissipation fins and causing cooling air to flow in a first flow path toward the intake opening; and a second heat sink having a plurality of second heat dissipation fins and causing cooling air to flow in a second flow path toward the intake opening, wherein the first heat sink and the second heat sink are arranged at different positions in a direction perpendicular to the thickness direction, and the first flow path and the second flow path are separate spaces.

[0009] This allows the first flow path in which heat exchange is performed by the first heat sink and the second flow path in which heat exchange is performed by the second heat sink to be separate spaces, and the first flow path and the second flow path to the intake opening of the cooling fan are flow paths that do not overlap.

[0010] 2 to 14 show an embodiment of an imaging device according to the present technology, and this figure is a perspective view of the imaging device. FIG. 1 is a perspective view of the imaging device with a display unit and the like removed. FIG. 2 is a perspective view of the imaging device as viewed from a direction different from that of FIG. 1. FIG. 3 is an exploded perspective view showing a cooling structure and a control board. FIG. 4 is a perspective view of the cooling structure. FIG. 5 is a cross-sectional view of the cooling structure. FIG. 6 is a rear view showing the cooling structure and the like. FIG. 7 is a conceptual diagram showing the flow state of cooling air. FIG. 8 is a conceptual diagram showing an example in which cooling air is taken into the interior of a case body from opposite directions. FIG. 9 is a conceptual diagram showing an example in which cooling air is taken into the interior of a case body from orthogonal directions. FIG. 10 is a conceptual diagram showing an example in which four heat sinks are provided in the cooling structure. FIG. 11 is a perspective view showing an example of heat dissipation fins of a different shape. FIG. 12 is a cross-sectional view showing an example in which two air intake openings are formed. FIG. 13 is a block diagram showing an example of an imaging device.

[0011] Hereinafter, embodiments of the present technology will be described with reference to the accompanying drawings.

[0012] In the following embodiment, the imaging device of the present technology is applied to a video camera. Note that the application range of the present technology is not limited to video cameras, and can be widely applied to other imaging devices such as still cameras.

[0013] In the following description, the front, back, up, down, left and right directions are indicated as viewed from the photographer, so the subject side (object side) is the front and the photographer side (image side) is the rear.

[0014] It should be noted that the directions of front, back, up, down, left and right shown below are for the convenience of explanation, and the implementation of the present technology is not limited to these directions.

[0015] <General Configuration of Imaging Device> First, a general configuration of the imaging device 1 will be described (see FIGS. 1 to 4). The imaging device 1 includes, for example, a horizontally elongated outer casing 2 and required components arranged inside the outer casing 2.

[0016] A plurality of various operation units 3 are arranged on, for example, the top or rear surface of the outer casing 2. The operation units 3 include, for example, a power button, a shutter button, a zoom knob, a mode switching knob, and the like.

[0017] A circular opening (not shown) is formed in the front of the outer casing 2, and the area around the opening is provided as a mount for attaching an interchangeable lens (not shown). An image sensor (not shown), such as a CCD (Charge Coupled Device) or CMOS (Complementary Metal-Oxide Semiconductor), is disposed inside the outer casing 2, and the image sensor is located behind the opening. An interchangeable lens (not shown) can be attached and detached to the mount.

[0018] A display unit 4 having, for example, a liquid crystal display is connected to the rear side of the outer casing 2 so as to be openable (rotatable) relative to the outer casing 2 (see FIGS. 1 and 3).

[0019] A side panel 5 is attached to one of the left and right sides of the outer casing 2 (see FIGS. 1 to 3). A vertically elongated outlet hole 5a is formed at the rear end of the side panel 5. The outlet hole 5a is partitioned by a plurality of partitions 5b spaced apart from each other above and below. A bottom panel 6 is attached to the bottom end of the outer casing 2 (see FIG. 3). A horizontally elongated intake hole 6a is formed in the bottom panel 6. The intake hole 6a is partitioned by a plurality of partitions 6b spaced apart from each other above and below.

[0020] A control board 7 (see FIG. 4 ) that performs overall control of the imaging device 1 is disposed inside the outer casing 2. The control board 7 is formed, for example, in a horizontally elongated, substantially rectangular shape, and is disposed at the rear end side inside the outer casing 2, facing in the front-to-rear direction.

[0021] For example, a first card slot 8 and a second card slot 9 are attached to the rear surface of the control board 7 in a vertically aligned state (see FIGS. 2 and 4). The first card slot 8 and the second card slot 9 are attached to the right end of the control board 7 and are positioned to the side of the display unit 4.

[0022] The portion of the control board 7 where the first card slot 8 and the second card slot 9 are not attached is provided as a mechanism arrangement section 7a, and the mechanism arrangement section 7a is located in front of the display section 4. A plurality of electronic components (not shown), such as semiconductor packages that serve as heat generating elements and resistor components, are mounted on the mechanism arrangement section 7a.

[0023] <Configuration of Cooling Structure> Next, the cooling structure 10 will be described (see FIGS. 2 and 4 to 7).

[0024] The cooling structure 10 is disposed on the rear side of the mechanism arrangement section 7a of the control board 7, and includes a case body 11, a first heat sink 12, a second heat sink 13, and a cooling fan (a centrifugal fan or a sirocco fan) 14 (see FIGS. 4 and 5). Each part of the cooling structure 10 is made of a material with high heat dissipation properties, such as a metal material.

[0025] The case body 11 is formed, for example, in a horizontally elongated, substantially rectangular shape, and is configured by joining a mounting plate 15 and a cover 16 at the front and rear.

[0026] The mounting plate 15 is formed in a horizontally long rectangular shape facing the front-rear direction, and corresponds to the front portion of the case body 11 .

[0027] The cover 16 is formed in a box shape that is open to the front and one side, and consists of a base surface portion 17 facing in the front-to-rear direction, an upper surface portion 18 that protrudes forward from the upper edge of the base surface portion 17, a lower surface portion 19 that protrudes forward from the lower edge of the base surface portion 17, a first side surface portion 20 that protrudes forward from the right edge of the base surface portion 17, and a second side surface portion 21 that protrudes forward from the left edge of the base surface portion 17.

[0028] The base surface portion 17 corresponds to the rear surface portion of the case body 11. Therefore, the base surface portion 17 is formed to have substantially the same size and shape as the mounting plate 15.

[0029] A first air intake hole 22 is formed in the lower surface 19, penetrating vertically throughout the entire surface except for the right end, and a second air intake hole 23 is formed in the right end, penetrating vertically. The first air intake hole 22 is partitioned, for example, by a plurality of bridging portions 19a provided at a distance on the left and right.

[0030] An exhaust hole 24 is formed in the second side surface portion 21, penetrating from left to right. The exhaust hole 24 is partitioned by, for example, a plurality of bridging portions 21a that are provided spaced apart from each other in the vertical direction.

[0031] The first heat sink 12 has a plurality of first heat dissipation fins 12a arranged side by side, and is composed of, for example, a first portion 25 and a second portion 26, and is attached to the rear surface of the mounting plate 15. The first heat dissipation fins 12a are formed, for example, in the shape of a plate extending in the vertical direction. The first portion 25 and the second portion 26 have, for example, the same size (height) in the front-to-back direction and the same size (length) in the vertical direction. However, the height and length of the first portion 25 and the second portion 26 may be different. Furthermore, in the imaging device 1, only the first portion 25 may be provided as the first heat sink 12.

[0032] The first portion 25 has a larger width in the left-right direction than the second portion 26, and is attached to the lower end of the mounting plate 15 except for the right end. The second portion 26 has fewer first heat dissipation fins 12a than the first heat sink 12, and is attached to the mounting plate 15 above the right end of the first portion 25.

[0033] The second heat sink 13 has a plurality of second heat dissipation fins 13a arranged on the left and right sides and is attached to the rear surface of the mounting plate 15. The second heat dissipation fins 13a are formed, for example, in the shape of a plate extending in the vertical direction. Therefore, the first heat dissipation fins 12a of the first heat sink 12 and the second heat dissipation fins 13a of the second heat sink 13 are arranged in parallel.

[0034] The second heat sink 13 is higher than the first heat sink 12 and longer than the first heat sink 12 (see FIGS. 4 and 6). The second heat sink 13 is attached to the right end of the mounting plate 15, with its lower end protruding downward from the mounting plate 15. The length of the second heat dissipation fins 13a increases as the distance from the first heat sink 12 increases in the left-right direction. Therefore, the upper end of the second heat sink 13 is inclined downward as it approaches the first heat sink 12 in the left-right direction.

[0035] In the second heat sink 13, the lengths of the second heat dissipation fins 13a may be partially different.

[0036] The cooling fan 14 is formed in a thin, flat shape and has a housing 27 that functions as a case and predetermined parts arranged inside the housing 27. The housing 27 has a first surface 28 provided as a front surface, a second surface 29 provided as a rear surface, and a peripheral surface 30 that corresponds to the outer periphery.

[0037] The first surface portion 28 is formed with an intake opening 31 having, for example, a circular shape.

[0038] The housing 27 is formed with an opening on the left side, and the left opening is formed as an exhaust opening 32. Rotating vanes 33 are arranged inside the housing 27, and the rotating vanes 33 rotate around a rotation shaft 33a. The axial direction of the rotation shaft 33a is the thickness direction. The intake opening 31 formed in the housing 27 is formed in a circular shape centered on the rotation shaft 33a of the rotating vanes 33.

[0039] The cooling fan 14 is attached to the rear surface of the mounting plate 15 or the front surface of the base surface portion 17 of the cover 16, to the left of the second heat sink 13. When the cooling fan 14 is attached to the mounting plate 15 or the cover 16, a portion of the cooling fan 14 overlaps at least a portion of the first heat sink 12 from the rear (see FIG. 7 ). Specifically, the outer portion of the intake opening 31 of the cooling fan 14 faces and overlaps with a portion of the first portion 25 excluding the right end and a portion of the second portion 26 excluding the right end. Therefore, the intake opening 31 of the cooling fan 14 does not overlap with the first heat sink 12.

[0040] When the first heat sink 12, the second heat sink 13, and the cooling fan 14 are attached to the case body 11, the sum of the height T1 of the first heat sink 12 and the thickness T2 of the cooling fan is less than or equal to the height T3 of the second heat sink 13 (see Figure 6).

[0041] In this way, by making the sum of the height T1 of the first heat sink 12 and the thickness T2 of the cooling fan less than the height T3 of the second heat sink 13, it is possible to make the thickness of the cooling structure 10 less than a certain value, thereby making it possible to make the cooling structure 10 and the imaging device 1 thinner.

[0042] Although the cooling fan 14 and the first heat sink 12 are partially opposed to each other in the thickness direction, a small gap H may be formed between the cooling fan 14 and the first heat sink 12. In this case, the sum of the height T1 of the first heat sink 12, the thickness T2 of the cooling fan, and the gap H is set to be equal to or less than the height T3 of the second heat sink 13. In this case, it is also possible to keep the thickness of the cooling structure 10 at a certain level or less, thereby enabling the cooling structure 10 and the imaging device 1 to be made thinner.

[0043] Furthermore, at least a portion of the first heat sink 12 and a portion of the first surface 28 of the cooling fan 14 are opposed to each other in the thickness direction.

[0044] Therefore, since at least a portion of the first heat sink 12 and a portion of the cooling fan 14 are positioned so as to overlap in the thickness direction, the external shape of the cooling structure 10 perpendicular to the thickness direction can be made smaller.

[0045] Furthermore, since the second heat sink 13 is positioned outside the outer periphery of the cooling fan 14 and the first heat sink 12 is positioned outside the intake opening 31, both the first heat sink 12 and the second heat sink 13 are positioned outside the intake opening 31 of the cooling fan 14, ensuring high intake performance of cooling air by the cooling fan 14. Also, since the second heat sink 13 does not overlap with the cooling fan 14 in the thickness direction, the height of the second heat dissipation fins 13a can be increased to increase the heat dissipation area, thereby improving cooling efficiency.

[0046] With the first heat sink 12, the second heat sink 13, and the cooling fan 14 respectively positioned in the predetermined positions as described above, the mounting plate 15 and the cover 16 are joined together to form the cooling structure 10 (see FIG. 5).

[0047] The cooling structure 10, which is disposed on the rear side of the mechanism mounting portion 7a of the control board 7, is positioned to the sides of the first card slot 8 and the second card slot 9. In addition, in the cooling structure 10, the first heat sink 12 is positioned directly above the first air intake hole 22 in the case body 11, and the second heat sink 13, with some exceptions, is positioned directly above the second air intake hole 23 in the case body 11. The first portion 25 of the first heat sink 12 is positioned close to the first air intake hole 22, and the second portion 26 is positioned on the opposite side of the first portion 25 from the first air intake hole 22.

[0048] In the cooling structure 10, the lower end of the second heat sink 13 protrudes downward from the second air intake hole 23. Therefore, the lower end of the second heat sink 13 is provided as a protruding portion 13b. However, the cooling structure 10 may be configured so that a portion of the second heat sink 13 does not protrude downward from the second air intake hole 23.

[0049] When the cooling structure 10 is disposed on the rear side of the mechanism arrangement portion 7a, an imaging element or the like is connected to the cooling structure 10 by a heat conductor such as a graphite sheet or a thin copper plate (not shown). Heat-generating components such as electronic components mounted on the control board 7 are in contact with or in close proximity to the mounting plate 15 of the case body 11. Heat-generating components such as electronic components mounted on the control board 7 may also be connected to the cooling structure 10 by a heat conductor such as a graphite sheet or a thin copper plate.

[0050] Therefore, the heat generated in the heat-generating components is made transferable by the heat conductor to the cooling structure 10. In particular, the imaging device 1 is configured so that heat from the imaging element is mainly transferred to the first heat sink 12, and heat from the heat-generating components mounted on the control board 7 is mainly transferred to the second heat sink 13, with the first heat sink 12 mainly serving to suppress a temperature rise in the imaging element, and the second heat sink 13 mainly serving to suppress a temperature rise in the heat-generating components mounted on the control board 7.

[0051] In addition, in the imaging device 1, for example, the second heat sink 13 may have the role of suppressing the temperature rise of heat-generating components mounted on the control board 7, as well as the role of suppressing the temperature rise of the first card slot 8 and the second card slot 9.

[0052] Furthermore, the imaging device 1 may be configured such that at least a portion of the heat generated in each of the heat-generating components is transferred to the outer casing 2 and is also released from the outer casing 2 .

[0053] <Cooling Air Flow Path> Hereinafter, the cooling air flow path in the cooling structure 10 will be described (see FIG. 8).

[0054] In the imaging device 1, as the rotating blades of the cooling fan 14 rotate, air present outside the imaging device 1 is taken in as cooling air through the first air intake hole 22 and the second air intake hole 23 of the case body 11 via the intake hole 6a of the bottom panel 6.

[0055] The cooling air taken in through the first air intake holes 22 passes between the plurality of first heat dissipation fins 12a of the first heat sink 12 and is sucked into the cooling fan 14 through the air intake opening 31. The flow path from the first air intake holes 22, passing between the plurality of first heat dissipation fins 12a, to the air intake opening 31 is defined as a first flow path S1. At this time, heat transferred to the first heat sink 12 is released and heat is exchanged between the released heat and the cooling air passing through the first flow path S1.

[0056] The cooling air taken in through the second air intake holes 23 passes between the second heat dissipation fins 13a of the second heat sink 13 and is sucked into the cooling fan 14 through the air intake opening 31. The flow path from the second air intake holes 23, passing between the second heat dissipation fins 13a, to the air intake opening 31 is defined as a second flow path S2. At this time, heat transferred to the second heat sink 13 is released and heat is exchanged between the released heat and the cooling air passing through the second flow path S2.

[0057] As described above, in the cooling structure 10, the flow path from the first air intake hole 22 through the first heat dissipation fins 12a to the air intake opening 31 is designated as the first flow path S1, and the flow path from the second air intake hole 23 through the second heat dissipation fins 13a to the air intake opening 31 is designated as the second flow path S2, so that the first flow path S1 and the second flow path S2 are separate spaces.

[0058] The cooling air, whose temperature has risen through heat exchange as it passes through the first flow path S1 and the second flow path S2, passes through the inside of the cooling fan 14, is blown out from the exhaust opening 32, passes through the exhaust hole 24 of the case body 11, and is exhausted to the outside of the imaging device 1 from the outlet hole 5a of the side panel 5. Therefore, the temperature rise of heat-generating components such as the imaging element and electronic components of the control board 7 is suppressed.

[0059] <Summary> As described above, the imaging device 1 includes the cooling fan 14 having the intake opening 31 formed therein, the first heat sink 12 that causes cooling air to flow in the first flow path S1, and the second heat sink 13 that causes cooling air to flow in the second flow path S2, and the first heat sink 12 and the second heat sink 13 are arranged at different positions in a direction perpendicular to the thickness direction, and the first flow path S1 and the second flow path S2 are separate spaces.

[0060] Therefore, the first flow path S1 in which heat exchange is performed by the first heat sink 12 and the second flow path S2 in which heat exchange is performed by the second heat sink 13 are provided in separate spaces, and the first flow path S1 and the second flow path S2 to the intake opening 31 of the cooling fan 14 are provided as non-overlapping flow paths. As a result, the cooling airs flowing through the first flow path S1 and the second flow path S2 do not affect each other, and the cooling efficiency can be improved without increasing the size of the components.

[0061] In addition, since a gap H is formed between the first heat sink 12 and the cooling fan 14, a flow path for the cooling air flowing through the first flow path S1 is formed between the first heat sink 12 and the cooling fan 14, which increases the flow rate of the cooling air to the intake opening 31 and improves cooling efficiency.

[0062] Furthermore, the case body 11 is formed with a first intake hole 22 for cooling air directed toward the first flow path S1 and a second intake hole 23 for cooling air directed toward the second flow path S2, and the first intake hole 22 and the second intake hole 23 are formed on the same surface portion (lower surface portion 19) of the case body 11.

[0063] Therefore, since the cooling air heading toward the first flow path S1 and the cooling air heading toward the second flow path S2 are taken in from the same direction, the flow paths of the cooling air throughout the entire imaging device 1 can be easily designed.

[0064] Furthermore, the first heat sink 12 is composed of a first part 25 and a second part 26 which have different numbers of first heat dissipation fins 12a, and the second part 26 is positioned on the opposite side of the first air intake hole 22 across the first part 25.

[0065] Therefore, the number of first heat dissipation fins 12a of the first heat sink 12 is increased by the first portion 25 and the second portion 26, and therefore the cooling efficiency can be improved.

[0066] Furthermore, the number of first heat dissipation fins 12 a in the first portion 25 is greater than the number of first heat dissipation fins 12 a in the second portion 26 .

[0067] Therefore, since the first portion 25, which has a larger number of first heat dissipation fins 12a, is positioned closer to the first air intake hole 22 than the second portion 26, it is possible to increase the number of first heat dissipation fins 12a without interfering with the position of the cooling fan 14, thereby improving the cooling efficiency while ensuring the miniaturization of the imaging device 1.

[0068] Furthermore, since a portion of the second heat sink 13 (the protrusion 13b) protrudes outward from the second air intake hole 23, the length of the second heat dissipation fin 13a is increased, thereby improving the cooling efficiency of the second heat sink 13.

[0069] Furthermore, since the first heat dissipation fin 12a and the second heat dissipation fin 13a are positioned in parallel, the cooling air flowing through the first flow path S1 and the cooling air flowing through the second flow path S2 do not mix, thereby improving cooling efficiency.

[0070] In addition, the case body 11 is positioned facing the control board 7 in the thickness direction, and the first surface 28 of the two surfaces of the cooling fan 14 in the thickness direction is positioned closer to the control board 7 than the second surface 29.

[0071] Therefore, since the intake opening 31 formed on the first surface portion 28 is positioned on the control board 7 side, the intake opening 31 is positioned on the side closer to the heat-generating components mounted on the control board 7, ensuring high cooling efficiency for the heat-generating components.

[0072] <Others> Other configurations of the cooling structure 10 will be described below (see FIGS. 9 to 12).

[0073] The above shows an example in which the cooling air flowing through the first flow path S1 and the cooling air flowing through the second flow path S2 are both taken into the inside of the case body 11 from the same direction (below), but it is also possible to configure the two cooling airs to be taken into the inside of the case body 11 from different directions.

[0074] For example, it is possible to configure the case body 11 so that the cooling air is taken into the case body 11 from opposite directions in the vertical or horizontal direction (see FIG. 9 ). In this case, for example, the first air intake hole 22 is formed in the lower surface 19 of the case body 11, and the second air intake hole 23 is formed in the upper surface 18 of the case body 11.

[0075] It is also possible to configure the case body 11 so that both cooling air streams are taken into the case body 11 from perpendicular directions (see FIG. 10 ). In this case, for example, the first intake hole 22 is formed in the bottom surface 19 of the case body 11, and the second intake hole 23 is formed in the first side surface 20 of the case body 11.

[0076] Even in such a configuration in which both cooling airs are taken into the inside of the case body 11 from different directions, the cooling efficiency can be improved by making the first flow path S1 and the second flow path S2 separate spaces.

[0077] Furthermore, although the above example shows a configuration in which the cooling structure 10 is provided with a first heat sink 12 and a second heat sink 13, the cooling structure 10 may be provided with three or more heat sinks (see Figure 11).

[0078] For example, the cooling structure 10 may be provided with a third heat sink 34 in addition to the first heat sink 12 and the second heat sink 13, or may be provided with a third heat sink 34 and a fourth heat sink 35 in addition to the first heat sink 12 and the second heat sink 13. In this case, the case body 11 may be separated by the portions where the third heat sink 34 and the fourth heat sink 35 exist, and may be configured with three portions (see lines P and Q in FIG. 11 ). Alternatively, the case body 11 may be separated only by line P and may be configured with two portions.

[0079] In a configuration in which the first heat sink 12, the second heat sink 13, the third heat sink 34, and the fourth heat sink 35 are provided, for example, it is possible to configure the first heat sink 12 and the second heat sink 13 to mainly have the role of suppressing the temperature rise of each heat-generating component such as electronic components mounted on the control board 7, the third heat sink 34 to have the role of suppressing the temperature rise of the imaging element, and the fourth heat sink 35 to mainly have the role of suppressing the temperature rise of the first card slot 8 and the second card slot 9.

[0080] By configuring the cooling structure 10 in this way, it becomes possible to efficiently suppress the temperature rise of various heat-generating components in the imaging device 1, and it is possible to further improve the cooling efficiency.

[0081] Furthermore, although the above example shows that the first heat dissipation fins 12a of the first heat sink 12 and the second heat dissipation fins 13a of the second heat sink 13 are both formed in a plate-like shape or the like, the first heat dissipation fins 12a and the second heat dissipation fins 13a may also be formed in, for example, an axial shape or a pin shape (see Figure 12).

[0082] In the imaging device 1, the heat dissipation fins of the third heat sink 34 and the fourth heat sink 35 may also be in a plate-like shape or the like, or may be in a shaft-like or pin-like shape or the like.

[0083] Furthermore, although the above example shows the case where the intake opening 31 is formed on the first surface 28, which is one surface of the cooling fan 14, the cooling fan 14 may also have the intake opening 40 formed on a surface other than the first surface 28, for example, on the second surface 29 (see FIG. 13 ). In this case, cooling air is taken into the cooling fan 14 from the intake opening 40 through the space between the base surface 17 of the case body 11 and the second surface 29, thereby further improving the cooling efficiency.

[0084] <One Embodiment of Imaging Apparatus> An example of the configuration of one embodiment of the imaging apparatus 1 will be described below (see FIG. 14).

[0085] The imaging device 1 is equipped with a camera block 90 that performs imaging functions, and includes a camera signal processing unit 91 that performs signal processing such as analog-to-digital conversion of captured image signals, and an image processing unit 92 that performs recording and playback processing of image signals. The imaging device 1 also includes a display unit 93 (display unit 4) that displays captured images, etc., an R / W (reader / writer) 94 that writes and reads image signals to and from a memory 99, a CPU (Central Processing Unit) 95 that controls the entire imaging device 1, a lens drive control unit 96 that controls the drive of a lens arranged in the camera block 90, and an operation unit 97 (operation unit 3) such as various switches that are used by the user to perform required operations.

[0086] The camera block 90 is, for example, an interchangeable lens.

[0087] The imaging device 1 is provided with an imaging element 98 such as a CCD or CMOS that converts an optical image captured by the camera block 90 into an electrical signal.

[0088] The camera signal processing unit 91 performs various signal processing such as converting the output signal from the image sensor 98 into a digital signal, removing noise, correcting image quality, and converting into a luminance and color difference signal.

[0089] The image processing unit 92 performs processes such as compression encoding and decompression decoding of image signals based on a predetermined image data format, and conversion of data specifications such as resolution.

[0090] The display unit 93 has a function of displaying various data such as the operation status of the user on the operation unit 97 and the captured image, etc. The imaging device 1 does not necessarily have to be provided with the display unit 93, and may be configured so that the captured image data is sent to another display device and the image is displayed thereon.

[0091] The R / W 94 writes image data coded by the image processing unit 92 into the memory 99 and reads image data recorded in the memory 99 .

[0092] The CPU 95 functions as a control processing unit that controls each circuit block provided in the imaging device 1, and controls each circuit block based on instruction input signals from the operation unit 97, etc.

[0093] The lens drive control unit 96 controls a drive source that moves the lens based on a control signal from the CPU 95 .

[0094] The operation unit 97 outputs to the CPU 95 an instruction input signal in response to an operation by the user.

[0095] The memory 99 is, for example, a semiconductor memory that is detachable from a slot connected to the R / W 94 or a semiconductor memory that is pre-installed inside the imaging device 1 .

[0096] The operation of the imaging device 1 will be described below.

[0097] In a standby state for photographing, a photographed image signal is output to the display unit 93 via the camera signal processing unit 91 and displayed as a camera-through image under the control of the CPU 95. When an instruction input signal is input from the operation unit 97, the CPU 95 outputs a control signal to the lens drive control unit 96, and the lens is moved under the control of the lens drive control unit 96.

[0098] When a photographing operation is performed in response to an instruction input signal from the operation unit 97, the photographed image signal is output from the camera signal processing unit 91 to the image processing unit 92, where it is compressed and encoded and converted into digital data in a predetermined data format. The converted data is output to the R / W 94 and written to the memory 99.

[0099] When image data recorded in memory 99 is to be reproduced, the R / W 94 reads out the specified image data from memory 99 in response to an operation on the operation unit 97, and after the image processing unit 92 performs an expansion and decoding process, the reproduced image signal is output to the display unit 93 and the reproduced image is displayed.

[0100] In this technology, "imaging" refers to processing that includes only some or all of a series of processing, from photoelectric conversion processing that converts light captured by the imaging element 98 into an electrical signal, to processing by the camera signal processing unit 91 that converts the output signal from the imaging element 98 into a digital signal, noise removal, image quality correction, conversion into luminance and color difference signals, etc., to compression encoding / decompression decoding processing of the image signal based on a predetermined image data format and conversion processing of data specifications such as resolution, etc., by the image processing unit 92, and writing processing of the image signal to the memory 99 by the R / W 94.

[0101] That is, "imaging" may refer only to the photoelectric conversion process of converting the light taken in by the imaging element 98 into an electrical signal, or may refer to the process from the photoelectric conversion process of converting the light taken in by the imaging element 98 into an electrical signal to the process of converting the output signal from the imaging element 98 into a digital signal by the camera signal processing unit 91, noise removal, image quality correction, conversion into luminance and color difference signals, etc. ... to the process of converting the output signal from the imaging element 98 into an electrical signal by the image processing unit 91, noise removal, image quality correction, conversion into luminance and color difference signals, etc. It may also refer to processes such as the photoelectric conversion process by the image sensor 98 to convert the light captured by the image sensor 98 into an electrical signal, the conversion of the output signal from the image sensor 98 into a digital signal, noise removal, image quality correction, conversion into luminance and color difference signals, etc. by the camera signal processing unit 91, and the compression coding / decompression decoding process by the image processing unit 92 to convert the image signal into a predetermined image data format and conversion of data specifications such as resolution, etc., by the image processing unit 92, or the writing process of the image signal into the memory 99 by the R / W 94.

[0102] <Present Technology> The present technology can also be configured as follows.

[0103] (1) An imaging device comprising: a cooling fan in which rotating blades are arranged inside a housing, the axial direction of the rotation axis of the rotating blades being in the thickness direction, and an air intake opening formed on at least one surface in the thickness direction; a first heat sink having a plurality of first heat dissipation fins and causing cooling air to flow in a first flow path toward the air intake opening; and a second heat sink having a plurality of second heat dissipation fins and causing cooling air to flow in a second flow path toward the air intake opening, wherein the first heat sink and the second heat sink are arranged at different positions in a direction perpendicular to the thickness direction, and the first flow path and the second flow path are separate spaces.

[0104] (2) The imaging device according to (1), wherein at least a portion of the first heat sink and a portion of the one surface of the cooling fan are opposed to each other in the thickness direction.

[0105] (3) The imaging device according to (2), wherein the second heat sink is positioned outside an outer periphery of the cooling fan, and the first heat sink is positioned outside the intake opening.

[0106] (4) The imaging device according to (2), wherein the sum of the height of the first heat sink in the thickness direction and the thickness of the cooling fan is equal to or less than the height of the second heat sink in the thickness direction.

[0107] (5) The imaging device according to (2), wherein a gap is formed between the first heat sink and the cooling fan.

[0108] (6) An imaging device according to any one of (1) to (5), wherein a case body is provided inside which at least a portion of the cooling fan, the first heat sink, and the second heat sink are disposed, the case body is formed with a first intake hole for taking in cooling air flowing through the first flow path and a second intake hole for taking in cooling air flowing through the second flow path, and the first intake hole and the second intake hole are formed on the same surface of the case body.

[0109] (7) The imaging device according to (6), wherein the first heat sink is composed of a first portion and a second portion having different numbers of the first heat dissipation fins, and the second portion is positioned on the opposite side of the first air intake hole, sandwiching the first portion therebetween.

[0110] (8) The imaging device according to (7), wherein the number of the first heat dissipation fins in the first portion is greater than the number of the first heat dissipation fins in the second portion.

[0111] (9) The imaging device according to (6), wherein a portion of the second heat sink protrudes outward from the second air intake hole.

[0112] (10) The imaging device according to any one of (1) to (5), wherein the first heat dissipation fin and the second heat dissipation fin are positioned in parallel.

[0113] (11) The imaging device described in (6), wherein the case body is positioned facing the control board in the thickness direction, and one of the two surfaces of the cooling fan in the thickness direction is positioned closer to the control board than the other surface.

[0114] REFERENCE SIGNS LIST 1 imaging device 7 control board 11 case body 12 first heat sink 12a first heat dissipation fin 13 second heat sink 13a second heat dissipation fin 14 cooling fan 22 first air intake hole 23 second air intake hole 25 first portion 26 second portion 27 housing 31 air intake opening 33 gap 40 air intake opening S1 first flow path S2 second flow path

Claims

1. A cooling fan having a rotating blade disposed inside a housing, wherein an axial direction of a rotation axis of the rotating blade is in a thickness direction, and an intake opening is formed in at least one of the end faces in the thickness direction; a first heat sink having a plurality of first heat radiation fins and configured to cause cooling air to flow in a first flow path toward the intake opening; and a second heat sink having a plurality of second heat radiation fins and configured to cause cooling air to flow in a second flow path toward the intake opening, wherein the first heat sink and the second heat sink are disposed at different positions in a direction orthogonal to the thickness direction, and the first flow path and the second flow path are in separate spaces, and an imaging device.

2. The imaging device according to claim 1, wherein at least a part of the first heat sink and a part of the one end face of the cooling fan face each other in the thickness direction.

3. The imaging device according to claim 2, wherein the second heat sink is located outside the outer periphery of the cooling fan, and the first heat sink is located outside the intake opening.

4. The imaging device according to claim 2, wherein a sum of a height of the first heat sink in the thickness direction and a thickness of the cooling fan is less than or equal to a height of the second heat sink in the thickness direction.

5. The imaging device according to claim 2, wherein a gap is formed between the first heat sink and the cooling fan.

6. The imaging device according to claim 1, further comprising a case body having at least a part of the cooling fan, the first heat sink, and the second heat sink disposed therein, wherein the case body is formed with a first intake hole for taking in cooling air flowing through the first flow path and a second intake hole for taking in cooling air flowing through the second flow path, and the first intake hole and the second intake hole are formed in the same end face of the case body.

7. The imaging device according to claim 6, wherein the first heat sink is composed of a first portion and a second portion having different numbers of the first heat radiation fins, and the second portion is located on the opposite side of the first intake hole with the first portion interposed therebetween.

8. The imaging device according to claim 7, wherein the number of the first heat radiation fins in the first portion is larger than the number of the first heat radiation fins in the second portion.

9. The imaging device according to claim 6, wherein a part of the second heat sink protrudes outward from the second intake hole.

10. The imaging device according to claim 1, wherein the first heat radiation fins and the second heat radiation fins are positioned in a parallel state.

11. The imaging device according to claim 6, wherein the case body is positioned to face the control board in the thickness direction, and one surface portion of both surface portions of the cooling fan in the thickness direction is positioned closer to the control board side than the other surface portion.

Images