Substrate detection apparatus

Abstract

Disclosed in the present invention is a substrate detection apparatus. The substrate detection apparatus comprises an illumination unit, an imaging unit, a storage unit, a search unit, and a determination unit. The illumination unit is used for irradiating illumination light to an imaging region including a plurality of substrates, wherein the plurality of substrates are inserted into a plurality of holding slots of a substrate holder; the imaging unit is used for capturing the imaging region and generating a captured image, wherein the captured image includes a plurality of pixel blocks for representing side surfaces of the plurality of substrates; the storage unit is used for storing a reference grid, a plurality of detection positions and a reference width of the side surface of a single substrate, wherein the reference grid comprises a search area and a defect area, and the plurality of detection positions comprise at least two detection positions configured for each holding slot; the search unit is used for searching, on each detection position, for pixel blocks of the captured image that are located in an image in the reference grid, and outputting search information of the pixel blocks in the reference grid; and the determination unit is used for determining, on the basis of the search information, the holding state of the plurality of substrates in the corresponding holding slots. By means of the present invention, there being abnormal substrates on a substrate holder can be discovered in a timely manner.

Description

Substrate inspection device Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing, and in particular to a substrate detection device. Background Art

[0002] FIG1 shows a schematic structural diagram of a flipping device and a material receiving device; FIG2 shows a schematic structural diagram of a material receiving device from a top view. In FIG1 , the flipping device 200 ′ flips a plurality of substrates 100 from a horizontal posture to a vertical posture. Referring to FIG1 and FIG2 , when a plurality of substrates 100 are transferred in a semiconductor device, a robot is first used to take out a plurality of substrates 100 in a horizontal posture from a storage box in a loading area, and the plurality of substrates 100 are transferred to the flipping device 200 ′, and then the flipping device 200 ′ is rotated to flip the plurality of substrates 100 from a horizontal posture to a vertical posture, and the plurality of substrates 100 in a vertical posture are handed over to the material receiving device 300 ′, which can move up and down. With reference to Figure 2 , the receiving device 300' includes a substrate holder 310' with multiple holding slots 312'. Each holding slot 312' includes a pair of latching slots 311'. Each pair of latching slots 311' is positioned opposite each other, with the sides of each substrate 100 inserted into the corresponding pair of latching slots 311', thereby holding the multiple substrates 100 in a vertical position. Finally, a robot removes the multiple substrates 100 from the substrate holder 310' and transfers them to a process tank, where they are immersed in the chemical solution in the process tank. This allows batch wet processing of the multiple substrates 100 in a vertical position.

[0003] However, during the process of repeatedly transferring multiple substrates 100 , abnormalities such as missing, overlapping, and oblique insertion of substrates 100 may occur due to certain reasons, such as deformation of the substrates 100 , resulting in unsuccessful transfer or interference breakage during the transfer process.

[0004] Therefore, in the process of conveying substrates, it is particularly important to add a substrate detection device to detect abnormal substrates in a timely manner. Summary of the Invention

[0005] An object of the present invention is to provide a substrate detection device that can promptly and effectively detect abnormal substrates.

[0006] To achieve the above objectives, an embodiment of the present invention provides a substrate detection device, comprising:

[0007] an illumination unit for irradiating illumination light to a shooting area including a plurality of substrates, wherein the plurality of substrates are inserted into a plurality of holding grooves of a substrate holder and arranged along a predetermined arrangement direction;

[0008] a photographing unit, configured to photograph a photographing area and generate a photographed image, wherein the photographed image includes a plurality of pixel blocks representing side surfaces of a plurality of substrates;

[0009] a storage unit configured to store a reference grid, a plurality of detection positions, and a reference width of a side surface of a single substrate, wherein the reference grid includes a search area and a defective area, each holding slot is configured with at least two detection positions spaced apart, and the reference grid is configured to search, at each detection position, for pixel blocks in a captured image that are within the reference grid, and output search information for the pixel blocks in the reference grid;

[0010] The judging unit is configured to judge the holding status of the plurality of substrates in the corresponding holding grooves based on the search information.

[0011] The substrate detection device of the present invention uses an illumination unit to irradiate illumination light to a shooting area including multiple substrates, uses the shooting unit to shoot the shooting area and generate a shooting image, searches for pixel blocks in the image located in the reference grid at each detection position through the reference grid, and outputs search information of the pixel blocks in the reference grid, and then uses the judgment unit to judge the holding status of multiple substrates in the corresponding holding grooves based on the search information. In this way, the purpose of timely discovering abnormal substrates on the substrate holder can be achieved, thereby avoiding unsuccessful film transfer or interference and breakage during the film transfer process.

[0012] Other features and corresponding beneficial effects of the present invention are described in the latter part of the specification, and it should be understood that at least some of the beneficial effects become obvious from the description in the specification of the present invention.

[0013] Summary of the Figures

[0014] FIG1 is a schematic structural diagram of a turning device and a material receiving device;

[0015] FIG2 is a schematic diagram of a top view of the structure of a material receiving device;

[0016] FIG3( a ) is a schematic diagram of a plurality of substrates in a normal state when the plurality of substrates are inserted into the plurality of holding grooves of the substrate holder of the present application;

[0017] 3( b ) to 3 ( e ) are schematic diagrams showing abnormal states of the substrates when the substrates are inserted into the holding grooves of the substrate holder according to the present application;

[0018] FIG4 is a schematic structural diagram of a substrate detection device according to Example 1 of the present application;

[0019] FIG5 is a schematic top view of the substrate support according to Example 1 of the present application;

[0020] FIG6 is a schematic structural diagram of the substrate detection device according to Example 1 of the present application from another perspective;

[0021] FIG7 is a schematic diagram of a captured image and a reference grid according to Example 1 of the present application;

[0022] FIG8 is a schematic diagram of a reference grid according to Example 1 of the present application;

[0023] 9( a ) to 9 ( c ) are schematic diagrams of three configurations of the reference grid and the detection position according to Example 1 of the present application;

[0024] 10( a ) to 10 ( d ) are schematic diagrams showing search information of pixel blocks in a reference grid under different substrate holding conditions according to Example 1 of the present application;

[0025] FIG11 is a schematic diagram of a captured image and a reference grid according to Example 2 of the present application; and

[0026] Figures 12(a) and 12(b) show schematic diagrams of the reference grid of Example 2 of the present application.

[0027] Preferred embodiments of the present invention

[0028] The following is an explanation of the embodiments of the present invention by specific specific examples. Those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. Although the description of the present invention will be introduced in conjunction with the preferred embodiment, this does not mean that the features of this invention are limited to this embodiment. On the contrary, the purpose of introducing the invention in conjunction with the embodiment is to cover other options or modifications that may be extended based on the claims of the present invention. In order to provide a deep understanding of the present invention, the following description will contain many specific details. The present invention can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present invention, some specific details will be omitted in the description. It should be noted that the embodiments of the present invention and the features in the embodiments can be combined with each other without conflict.

[0029] It should be noted that in this specification, similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0030] The technical solution of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described are only some embodiments of the present invention, not all embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0031] In the description of the present invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate and simplify the description of the present invention. They are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation, and therefore should not be construed as limitations on the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0032] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed, detachable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0033] To make the objectives, technical solutions and advantages of the present invention more clear, the embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.

[0034] The substrate detection device provided in the present application is used in semiconductor equipment to detect whether multiple substrates on a substrate holder have abnormalities such as missing substrates, overlapping substrates, warping, and slanted insertion.

[0035] FIG3( a ) is a schematic diagram showing a normal state of multiple substrates when multiple substrates are inserted into the multiple holding grooves of the substrate holder; FIG3( b ) to FIG3 ( e ) are schematic diagrams showing abnormal states of multiple substrates when multiple substrates are inserted into the multiple holding grooves of the substrate holder.

[0036] Referring to FIG3(a), the normal state refers to a plurality of substrates 100 being retained in their respective retaining slots 312. Referring to FIG3(b) to FIG3(e), abnormal states include substrate 100 missing abnormality, lamination abnormality, warping abnormality, and oblique insertion abnormality. As shown in FIG3(b), substrate 100 missing abnormality refers to an abnormality in which there is no substrate 100 in at least one retaining slot 312, and the number of substrates 100 retained in the plurality of retaining slots 312 is less than the normal number; as shown in FIG3(c), lamination abnormality refers to an abnormality in which at least two substrates 100 are inserted into one retaining slot 312; as shown in FIG3(d), warping abnormality refers to an abnormality in which the warping of the substrate 100 inserted into one retaining slot 312 does not meet the requirements; as shown in FIG3(e), oblique insertion abnormality refers to an abnormality in which one substrate 100 is inserted into two different retaining slots 312.

[0037] Example 1:

[0038] Figure 4 shows a structural schematic diagram of the substrate detection device of Example 1 of the present application; Figure 5 shows a top-view structural schematic diagram of the substrate bracket of Example 1 of the present application; Figure 6 shows a structural schematic diagram of the substrate detection device of Example 1 of the present application from another perspective, and the illumination part 400 is marked in Figure 6 for convenience.

[0039] With reference to Figures 4 to 6 , the substrate inspection apparatus provided in this embodiment includes an illumination unit 400, an imaging unit 500, a storage unit, and a determination unit. Referring to Figure 3(a), the illumination unit 400 is configured to illuminate a region containing multiple substrates 100, which are inserted into the plurality of holding slots 312 of a substrate holder 310 and arranged along a predetermined arrangement direction. The imaging unit 500 is configured to capture the region and generate an image.

[0040] In this embodiment, as shown in Figures 4 and 5 , the substrate holder 310 includes a base 313 and a plurality of retaining grooves 312. The base 313 is generally concave, and the plurality of retaining grooves 312 are disposed on the base 313 and arranged along the arrangement direction of the substrates 100. Each retaining groove 312 includes a pair of latching grooves 311, which are disposed on opposite sides of the base 313 (left and right sides in Figure 4 ). The side surfaces of each substrate 100 are inserted into the corresponding pair of latching grooves 311, thereby holding the plurality of substrates 100 in a vertical position. In other embodiments, the substrate holder 310 can be configured on the aforementioned receiving device 300, on a flipping device, in a process tank, or as a transfer robot.

[0041] 4 to 7 , in Example 1, the illumination unit 400 is disposed below the plurality of substrates 100, and the photographing unit 500 is disposed above the plurality of substrates 100. The illumination unit 400 is disposed on the side of the base 313 facing the substrate 100, so that the illumination light of the illumination unit 400 passes through the gaps between the plurality of substrates 100. The photographing unit 500 is used to photograph the photographing area and generate a photographed image after the illumination light passes through the gaps between the plurality of substrates 100. FIG7 shows a schematic diagram of a photographed image and a reference grid of Example 1 of the present application. As shown in FIG7 , the photographed image includes a plurality of pixel blocks 610 representing the plurality of substrates 100. In this example, the plurality of pixel blocks 610 are a plurality of dark blocks whose illumination light is blocked by the sides of the plurality of substrates 100. In other embodiments, both the illumination unit 400 and the photographing unit 500 are disposed above the plurality of substrates 100. The illumination unit 400 illuminates the sides of the multiple substrates 100, and the camera unit 500 is used to capture the captured area after the illumination unit 400 illuminates the sides of the multiple substrates 100 and generate a captured image. The captured image includes multiple pixel blocks 610, which are bright blocks of light reflected from the sides of the multiple substrates 100 where the illumination light is irradiated. It should be noted that this application does not specifically limit the number of light bars and cameras. The illumination unit 400 can include at least one light bar, for example, two light bars, which can be LED light bars; and the camera unit 500 can include at least one camera, for example, one camera. In the following description, the example shown in Figure 4 is used for explanation.

[0042] The storage unit is used to store the reference grid 700, multiple detection positions, and the reference width of the side surface of a single substrate 100. In this embodiment, the storage unit may include, but is not limited to, a magnetic storage device (e.g., a hard disk, a floppy disk, a magnetic stripe), an optical disk (e.g., a compact disk (CD), a digital versatile disk (DVD)), a smart card, and a flash memory device (e.g., an electrically erasable programmable read-only memory (EPROM), a card, a stick, or a key drive). Referring to FIG8 , the reference grid 700 includes a search area 710 and two defective areas 720, which are established on either side of the search area 710. The search area 710 represents the area that appears when the substrate 100 is normally retained in the holding slot 312 (such as the holding slot 312 in FIG3 ), and the defective area 720 represents the area that appears when the substrate 100 is abnormally retained in the holding slot 312. Referring to FIG5 and FIG7 , the multiple detection positions include at least two detection positions configured for each holding slot 312. In the captured image shown in FIG7 , the holding slots 312 are not shown, but the positions of the multiple detection positions correspond to the positions of the respective holding slots 312. For convenience, FIG7 only illustrates two detection positions (a first detection position 31401 and a second detection position 31402) configured for one holding slot 312, and these two detection positions are arranged at intervals. It should be understood that, in practice, each holding slot 312 is configured with two detection positions. The purpose of designing the detection positions in this embodiment is to achieve the positioning of the reference grid 700. Each detection position is located on the center line of the corresponding holding slot 312. When the reference grid 700 is positioned at the corresponding detection position, the center of the search area 710 of the reference grid 700 coincides with the corresponding detection position. In other embodiments, each holding slot 312 can be configured with more than two detection positions to complement each other and enhance the detection effect. In FIG7, the captured image also shows a first image acquisition area 601 (upper dashed box in the figure) and a second image acquisition area 602 (lower dashed box in the figure). The first image acquisition area 601 and the second image acquisition area 602 both contain pixel blocks representing multiple substrates 100. When inspecting a plurality of substrates 100 in a plurality of holding slots 312, the two inspection positions corresponding to each holding slot 312 are respectively located in the first image acquisition area 601 and the second image acquisition area 602 of the captured image. The search unit is used to search for the pixel blocks 610 in the partial image of the captured image located within the reference grid 700 at each inspection position, and output search information for the pixel blocks 610 in the reference grid 700. The search information includes the presence or absence of the pixel blocks 610 in the search area 710, the width of the pixel blocks 610 in the search area 710, and the presence or absence of the pixel blocks 610 in the defective area 720. The judgment unit is used to judge the retention status of the plurality of substrates 100 in the holding slots 312 based on the above search information. It should be noted that the pixel blocks 610 mentioned in this embodiment refer to the pixel blocks representing the side surfaces of the substrates 100.In this embodiment, the search unit and the judgment unit are configured as data processors such as a CPU that performs various calculations. The processor can be one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DAPDs), programmable logic devices (PLDs), field programmable gate arrays (FPGAs), processors, controllers, microcontrollers, microprocessors, or combinations thereof.

[0043] Figures 9(a) to 9c) show schematic diagrams of three configurations of the reference grid and detection positions in Example 1 of the present application. In Figures 9(a) and 9(b), only the detection positions corresponding to two retaining slots 312 are shown, and the movable reference grid after movement is represented by a dotted outline; in Figure 9(c), only the detection positions corresponding to four retaining slots 312 are shown. In Figures 9(a) to 9(c), each retaining slot 312 is provided with two detection positions, respectively designated as the first detection position 31401 and the second detection position 31402, and each detection position is located on the center line of the corresponding retaining slot 312.

[0044] In some embodiments, the reference grid 700 includes at least one movable reference grid. In the example shown in FIG9( a ), the reference grid 700 includes a movable reference grid that can move between a first detection position 31401 and a second detection position 31402 configured in a holding slot 312 to search at these two detection positions, thereby detecting the retention status of the substrate 100 in this holding slot 312. After completing the search at the position of the holding slot 312, the movable reference grid moves to the two detection positions corresponding to the next holding slot 312 to search at the first detection position 31401 and the second detection position 31402 configured in the next holding slot 312. In this way, the movable reference grid sequentially detects the retention status of multiple substrates 100 in multiple holding slots 312.

[0045] In the example shown in FIG9( b ), the reference grid 700 includes a pair of movable reference grids. The pair of movable reference grids simultaneously searches two detection positions configured in one holding slot 312, and then moves to the position of the next holding slot 312 to simultaneously search the first detection position 31401 and the second detection position 31402 configured in the next holding slot 312. In this way, the movable reference grid 700 sequentially detects the holding status of multiple substrates 100 in multiple holding slots 312.

[0046] In other embodiments, referring to FIG9( c ), the reference grid 700 includes multiple fixed reference grids, each of which is located at a plurality of detection positions. In other words, each first detection position 31401 and second detection position 31402 configured in each holding slot 312 has a corresponding fixed reference grid, so that the multiple fixed reference grids can simultaneously detect the holding status of multiple substrates 100 in the multiple holding slots 312.

[0047] Referring to FIG. 9( a ), the width W1 of the search area 710 of this embodiment is no greater than the opening width W2 of the retaining groove 312. For example, the width W1 is one-half, three-fifths, or three-quarters of the width W2, so as to improve the accuracy of detecting the retention status of the substrate in the corresponding retaining groove 312. The overall width of the reference grid 700, i.e., the sum of the width W1 of the search area 710 and the width of the defective area, does not exceed the distance d between the centerlines of the two retaining grooves 312 to avoid interference between the detection data of the previous reference grid 700 and the detection data of the next reference grid 700. It should be noted that the width W1 of the search area 710 and the overall width of the reference grid 700 can be determined based on actual on-site processes and are not particularly limited in this application. Figures 10(a) to 10(d) respectively show schematic diagrams of search information of pixel blocks in the reference grid under different holding states of the substrate in Example 1 of the present application. For convenience, the search information of multiple detection positions of the reference grid 700 corresponding to multiple holding slots 312 is also shown in Figures 10(a) to 10(d).

[0048] For example, the captured image shown in FIG7 shows a first image acquisition area 601 and a second image acquisition area 602. Each holding slot 312 is configured with a first detection position 31401 and a second detection position 31402. The first detection position 31401 is located in the first image acquisition area 601, and the second detection position 31402 is located in the second image acquisition area 602. The reference grid 700 includes a pair of movable reference grids, which are used to simultaneously correspond to the two detection positions configured in one holding slot 312. In this case:

[0049] 7 and 10(a), for the same holding slot 312, when the search information outputted by the reference grid 700 at the first detection position 31401 is: there is a pixel block 610 in the search area 710 of the reference grid 700 and the width of the pixel block 610 meets the reference width, and there is no pixel block 610 in the defective area 720 of the reference grid 700, at the same time,

[0050] The search information output by the second detection position 31402 of the reference grid 700 is as follows: if there is a pixel block 610 in the search area 710 of the reference grid 700 and the width of the pixel block 610 meets the reference width, and if there is no pixel block 610 in the defective area 720 of the reference grid 700, the determination unit determines that the substrate 100 being inspected is in a normal holding state. Otherwise, the determination unit determines that the substrate 100 being inspected is in an abnormal holding state. In other words, the substrate 100 being inspected is being properly held in the corresponding holding groove 312 and is not being affected by interference from adjacent substrates 100.

[0051] 7 and 10( b ), for the same holding slot 312, when the search information outputted by the reference grid 700 at the first detection position 31401 is: there is a pixel block 610 in the search area 710 of the reference grid 700 and the width of the pixel block 610 does not meet the reference width, and there is no pixel block 610 in the defective area 720 of the reference grid 700, at the same time,

[0052] The search information output by the reference grid 700 at the second detection position 31402 is: if there is a pixel block 610 in the search area 710 of the reference grid 700 and the width of the pixel block 610 does not meet the reference width, and if there is no pixel block 610 in the defective area 720 of the reference grid 700, the judgment unit determines that the substrate 100 being inspected has a lamination or warpage abnormality. In this embodiment, "the width of the pixel block 610 in the search area 710 does not meet the reference width" means that the width of the pixel block 610 in the search area 710 is greater than the reference width, indicating that at the detection position where the reference grid 700 is located, at least two substrates 100 are simultaneously inserted into the holding slot 312 (see FIG. 3(c)), or that the warpage of one substrate 100 in the holding slot 312 does not meet the specified conditions (see FIG. 3d). Whether it is a lamination abnormality or a warpage abnormality can be confirmed through on-site manual inspection.

[0053] 7 and 10( c ), for the same holding slot 312 , when the search information output by the reference grid 700 at the first detection position 31401 is: there is no pixel block 610 in the search area 710 of the reference grid 700 , and there is no pixel block 610 in the defective area 720 of the reference grid 700 , at the same time,

[0054] When the search information output by the reference grid 700 at the second detection position 31402 is: there are no pixel blocks 610 in the search area 710 of the reference grid 700, and no pixel blocks 610 in the defective area 720 of the reference grid 700, the judgment unit determines that a missing abnormality has occurred in the substrate 100 being detected. In other words, at the detection position where the reference grid 700 is located, there is no substrate 100 in the holding slot 312. It should be noted that the missing abnormality described herein refers to the detection of the absence of a substrate 100 in a holding slot 312 where a substrate 100 should be present. It is understood that, under conditions that meet regulations, vacancies may occur in multiple holding slots 312. For example, if one hundred holding slots 312 normally hold one hundred substrates 100, or if one hundred holding slots 312 normally hold fifty substrates 100, there may be a vacant position between any two adjacent substrates 100 in these fifty substrates 500. In this case, this vacant position is considered normal, and the judgment unit should not determine that a missing abnormality has occurred.

[0055] 7 and 10 (d), when the search information outputted by the reference grid 700 at the first detection position 31401 is: there is a pixel block 610 in the defective area 720 of the reference grid 700, or,

[0056] The search information output by the second detection position 31402 of the reference grid 700 indicates that when a pixel block 610 is found in the defective region 720 of the reference grid 700, the determination unit determines that the substrate 100 being inspected has experienced an oblique insertion anomaly. In other words, at the detection position where the reference grid 700 is located, a substrate 100 has appeared in the abnormally retained area. In this embodiment, at the detection position where the reference grid 700 is located, regardless of whether a substrate 100 is present in the holding slot 312, if a pixel block 610 is found in the defective region 720 of the reference grid 700, it is determined that the substrate 100 corresponding to the pixel block 610 in the defective region 720 has experienced an oblique insertion anomaly.

[0057] In some embodiments, the substrate inspection apparatus further includes an alarm unit configured to generate an alarm when the determination unit determines that the inspected substrate 100 is abnormal. The alarm unit may include, for example, at least one of a display and a speaker.

[0058] After the substrate detection device of the present application detects the multiple substrates 100 on the substrate holder 310, the multiple substrates 100 will be sent to the process tank and immersed in the liquid in the process tank for wet treatment. Unlike the above embodiment, the substrate detection device of the present application can also detect multiple substrates 100 in the process tank. In this case, the substrate holder 310 is configured in the process tank, and the illumination unit 400 of the substrate detection device can be set outside the process tank and located below the process tank. The process tank is made of a light-transmitting material. The illumination unit 400 emits light toward the process tank and passes through the gaps between the multiple substrates 100. The shooting unit 500 is set above the process tank to shoot the shooting area including the multiple substrates 100 in the process tank and generate a shot image. The judgment logic of the detection position, the reference grid 700 and the judgment unit is similar to the relevant description above and will not be repeated here.

[0059] Example 2:

[0060] FIG11 shows a schematic diagram of a captured image and a reference grid in Example 2 of the present application, and FIG12( a ) and FIG12( b ) show schematic diagrams of the reference grid in Example 2 of the present application. The difference between Example 2 and Example 1 is that: First, the bad area 720 of the reference grid 700 provided in Example 2 is configured such that when there is a pixel block 610 in the search area 710, the bad area 720 is established on both sides of the pixel block 610. In other words, if the pixel block 610 is not found in the search area 710, the bad area 720 will not be established. Second, the judgment logic of the judgment unit for judging whether the detected substrate 100 has a missing abnormality or an oblique insertion abnormality is different. It should be noted that the pixel block 610 mentioned in this embodiment refers to the pixel block representing the side of the substrate 100 in the captured image. The principle of determining the search area size of the reference grid involved in Example 2 is similar to the principle of determining the search area size in Example 1. The defective area size of the reference grid involved in Example 2 is determined according to the actual on-site process, and can avoid interference between the substrate and the docking mechanism (such as the turning device or the material receiving device) during the wafer transfer process.

[0061] The captured image shown in FIG11 shows a first image acquisition area 601 (in the upper dashed box in the figure) and a second image acquisition area 602 (in the lower dashed box in the figure). Each holding slot 312 is configured with a first detection position 31401 and a second detection position 31402. The first detection position 31401 is located in the first image acquisition area 601, and the second detection position 31402 is located in the second image acquisition area 602. The reference grid 700 includes a pair of movable reference grids, which are used to simultaneously correspond to the first detection position 31401 and the second detection position 31402 configured in each holding slot 312. In this case, the judgment logic of the judgment unit for judging whether the detected substrate 100 has a missing abnormality or an oblique insertion abnormality is described as follows:

[0062] When the search information outputted by the reference grid 700 at the first detection position 31401 is: for the same holding slot 312, there is no pixel block 610 in the search area 710 of the reference grid 700, and at the same time,

[0063] The search information output by the reference grid 700 at the second detection position 31402 indicates that when no pixel block 610 is found in the search area 710 of the reference grid 700, the determination unit determines that a missing abnormality has occurred in the substrate 100 being inspected. In other words, at the detection position where the reference grid 700 is located, no substrate 100 is present in the holding groove 312. In this embodiment, no pixel block 610 is found in the search area 710 of the reference grid 700 at the first detection position 31401 and the second detection position 31402. Therefore, no defective areas 720 are established on either side of the pixel block 610, and no pixel block 610 is searched in the defective areas 720.

[0064] When the search information outputted by the reference grid 700 at the first detection position 31401 is: there is a pixel block 610 in the search area 710 of the reference grid 700, and there is a pixel block 610 in the defective area 720 of the reference grid 700, or,

[0065] The search information output by the reference grid 700 at the second detection position 31402 indicates that the determination unit determines that the substrate 100 being inspected has an oblique insertion anomaly when a pixel block 610 is found in the search area 710 of the reference grid 700 and a pixel block 610 is found in the defective area 720 of the reference grid 700. In this embodiment, when a pixel block 610 is found in the search area 710 of the reference grid 700 at the first detection position 31401 or the second detection position 31402, two defective areas 720 are established on either side of the pixel block 610. If a pixel block 610 is found in at least one of the defective areas 720, it is determined that the substrate 100 corresponding to the pixel block 610 in the defective area 720 has an oblique insertion anomaly. In this case, the width of the pixel block 610 found in the search area 710 may meet the reference width or exceed the reference width. When the width of the pixel block 610 is greater than the reference width, it is possible that the substrate 100 corresponding to the pixel block 610 has overlapping or warping abnormalities. At this time, should an alarm be issued first for overlapping or warping abnormalities or for oblique insertion abnormalities? The priority can be determined based on the actual process.

[0066] It should be noted that the embodiments of the present application only describe one determination condition for determining when the substrate 100 is in the aforementioned abnormal holding state (e.g., an abnormal oblique insertion). It is understood that those skilled in the art may also use another determination condition based on the substrate detection principles of the embodiments of the present application to determine when the abnormal holding state (e.g., an abnormal oblique insertion) is present.

[0067] In addition, the embodiments of the present application give examples of substrate stacking or warping anomalies, missing anomalies, and oblique insertion anomalies, and do not list all anomalies exhaustively. As long as they do not deviate from the main purpose of this article, various anomaly judgments can be made, which are determined specifically according to the actual process.

[0068] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A substrate detection device, characterized in that, Comprising: A lighting unit for irradiating illumination light to a shooting area including a plurality of substrates, wherein the plurality of substrates are inserted into a plurality of holding grooves of a substrate holder and arranged in a specified arrangement direction; A shooting unit for shooting the shooting area and generating a shooting image, the shooting image including a plurality of pixel blocks representing the sides of the plurality of substrates; A storage unit for storing a reference grid, a plurality of detection positions, and a reference width of the side of a single substrate, wherein the reference grid includes a search area and a defective area, and the plurality of detection positions include at least two detection positions configured for each of the holding grooves; A search unit for searching for the pixel blocks in the image of the shooting image located within the reference grid at each of the detection positions and outputting search information of the pixel blocks in the reference grid; A judgment unit for judging the holding state of the plurality of substrates in the corresponding holding grooves based on the search information.

2. The substrate detection device according to claim 1, wherein The search information includes the presence or absence of the pixel blocks in the search area, the width of the pixel blocks in the search area, and the presence or absence of the pixel blocks in the defective area.

3. The substrate detection device according to claim 2, wherein, The reference grid includes one search area and two defective areas, and the two defective areas are respectively established on both sides of the search area.

4. The substrate detection device according to claim 2, wherein The reference grid includes one search area and two defective areas, wherein the two defective areas are configured to be established on both sides of the pixel block when there is the pixel block in the search area.

5. The substrate detection device according to claim 3 or 4, characterized in that The at least two detection positions for each of the holding grooves include a first detection position and a second detection position; The search information output by the reference grid at the first detection position is that there is the pixel block in the search area of the reference grid and the width of the pixel block conforms to the reference width, and there is no pixel block in the defective area of the reference grid. At the same time, The search information output by the reference grid at the second detection position is that when there is the pixel block in the search area of the reference grid and the width of the pixel block conforms to the reference width, and there is no pixel block in the defective area of the reference grid, the judgment unit judges that the detected substrate is in a normal holding state. Otherwise, the judgment unit judges that the detected substrate is in an abnormal holding state.

6. The substrate detection device according to claim 3 or 4, characterized in that The at least two detection positions for each of the holding grooves include a first detection position and a second detection position; The search information output by the reference grid at the first detection position is that there is the pixel block in the search area of the reference grid and the width of the pixel block does not conform to the reference width, and there is no pixel block in the defective area of the reference grid. At the same time, The search information output by the reference grid at the second detection position is that when there is the pixel block in the search area of the reference grid and the width of the pixel block does not conform to the reference width, and there is no pixel block in the defective area of the reference grid, the judgment unit judges that the detected substrate has a lamination or warping abnormality.

7. The substrate detection device according to claim 3, characterized in that, The at least two detection positions for each of the holding grooves include a first detection position and a second detection position; The search information output by the reference grid at the first detection position is that there is no pixel block in the search area of the reference grid, and there is no pixel block in the defective area of the reference grid. At the same time, The search information output by the reference cell at the second detection position is that when there is no such pixel block in the search area of the reference cell and there is no such pixel block in the defective area of the reference cell, the judgment unit determines that the detected substrate has a missing abnormality.

8. The substrate detection device according to claim 4, characterized in that, The at least two detection positions of each of the holding grooves include a first detection position and a second detection position; The search information output by the reference cell at the first detection position is that there is no such pixel block in the search area of the reference cell, and at the same time, The search information output by the reference cell at the second detection position is that when there is no such pixel block in the search area of the reference cell, the judgment unit determines that the detected substrate has a missing abnormality.

9. The substrate detection device according to claim 3, characterized in that The at least two detection positions of each of the holding grooves include a first detection position and a second detection position; The search information output by the reference cell at the first detection position is that there is such pixel block in the defective area of the reference cell, or The search information output by the reference cell at the second detection position is that when there is such pixel block in the defective area of the reference cell, the judgment unit determines that the detected substrate has an inclined insertion abnormality.

10. The substrate detection device according to claim 4, wherein The at least two detection positions of each of the holding grooves include a first detection position and a second detection position; The search information output by the reference cell at the first detection position is that there is such pixel block in the search area of the reference cell and there is such pixel block in the defective area of the reference cell, or The search information output by the reference cell at the second detection position is that when there is such pixel block in the search area of the reference cell and there is such pixel block in the defective area of the reference cell, the judgment unit determines that the detected substrate has an inclined insertion abnormality.

11. The substrate detection device according to claim 1, wherein The illumination unit is arranged below the multiple substrates, so that the irradiation light of the illumination unit passes through the gaps between the multiple substrates; The photographing unit is arranged above the multiple substrates and is used for photographing the photographing area after the irradiation light passes through the gap and generating the photographed image. The multiple pixel blocks included in the photographed image are multiple dark blocks where the illumination light is blocked by the side surfaces of the multiple substrates.

12. The substrate detection device according to claim 11, wherein, The illumination unit is arranged on the substrate support.

13. The substrate detection device according to claim 1, wherein The illumination unit is arranged above the multiple substrates, so that the illumination light of the illumination unit irradiates the side surfaces of the multiple substrates; The photographing unit is arranged above the multiple substrates and is used for photographing the photographing area after the illumination light of the illumination unit irradiates the side surfaces of the multiple substrates and generating the photographed image. The multiple pixel blocks included in the photographed image are bright blocks of the reflected light where the illumination light irradiates the side surfaces of the multiple substrates.

14. The substrate detection device according to claim 1, wherein The photographing unit includes at least one camera.

15. The substrate detection device according to claim 1, characterized in that, The illumination unit includes at least one light bar.

16. The substrate detection device according to claim 1, wherein, The reference cell includes at least one movable reference cell, and the movable reference cell can move to the multiple detection positions.

17. The substrate detection device according to claim 1, characterized in that, The reference cell includes multiple fixed reference cells, and the multiple fixed reference cells are respectively located at the multiple detection positions.

18. The substrate detection device according to claim 1, wherein, Further included: An alarm unit for giving an alarm when the judgment unit determines that the detected substrate has an abnormality.

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