Magnetic sensor and magnetic sensor manufacturing method

Abstract

The present invention relates to a magnetic sensor, comprising a substrate, multiple first TMR components, a soft magnetic structure, and a signal communication structure. A shielding plate exhibits less demagnetization in a direction parallel to the first TMR components (X-Y plane), and the shielding plate is prone to magnetization by a magnetic field within the X-Y plane. When an external magnetic field within the X-Y plane magnetizes the shielding plate, an induced magnetic field of which the direction is opposite to that of the external magnetic field can be generated, thereby counteracting the external magnetic field and achieving a shielding effect. The shielding plate exhibits greater demagnetization in a direction perpendicular to the first TMR components (Z-axis), and the shielding plate is not prone to magnetization by a magnetic field in the Z-axis direction, so that an external magnetic field in the Z-axis direction that is to be detected is not shielded by the shielding plate, and can be smoothly redirected by a redirecting column. In this way, a magnetic field within the X-Y plane can be shielded, thereby avoiding cross-axis interference with the detection of a magnetic field in the Z-axis direction. Thus, the magnetic sensor can significantly improve detection accuracy. In addition, the present invention further provides a magnetic sensor manufacturing method.

Description

Magnetic sensor and magnetic sensor preparation method Technical Field

[0001] The present invention relates to the technical field of sensors, and in particular to a magnetic sensor and a method for preparing the magnetic sensor. Background Art

[0002] Magnetic sensors convert changes in magnetic properties caused by a magnetic field into electrical signals, which they use to detect changes in the ambient magnetic field. They are widely used in defense construction, science and technology, and other fields. Tunnel magnetoresistance (TMR) sensors utilize the tunnel magnetoresistance effect of magnetic multilayer materials to sense magnetic fields. Compared to traditional magnetic sensors, they offer higher precision and are becoming increasingly popular in high-end applications.

[0003] The magnetic field distribution in space is three-dimensional, but the TMR magnetoresistive unit is only sensitive to the in-plane magnetic field. If the external out-of-plane magnetic field to be detected is converted into an in-plane magnetic field for detection, the external in-plane magnetic field may interfere with the detection of the TMR magnetoresistive unit, thereby affecting the detection accuracy. Summary of the Invention

[0004] Based on this, it is necessary to provide a magnetic sensor and a method for preparing a magnetic sensor that can improve detection accuracy to address the above problems.

[0005] A magnetic sensor comprising:

[0006] substrate;

[0007] A plurality of first TMR components are disposed on one side of the substrate;

[0008] a soft magnetic structure comprising a steering column and a shielding plate, wherein the shielding plate is parallel to the first TMR components, the steering column extends in a direction perpendicular to the first TMR components, and the shielding plate is located on a side of the steering column facing away from the plurality of first TMR components or on a side of the plurality of first TMR components facing away from the steering column;

[0009] a signal communication structure electrically connected to the plurality of first TMR components;

[0010] The orthographic projections of the plurality of first TMR components and the steering column in the plane where the surface of the shielding plate is located are located within the range of the shielding plate.

[0011] In one embodiment, the substrate includes a CMOS board and a signal layer covering the CMOS board.

[0012] In one embodiment, the signal layer is at least partially configured as a coil layer, and the coil layer of the signal layer can generate a magnetic field when energized.

[0013] In one embodiment, a carrying layer is formed on the surface of the substrate, and a first through hole is opened in the carrying layer extending through the thickness direction; a metal substrate layer is formed on the surface of the carrying layer, and a plurality of magnetic tunnel junctions are arranged on the metal substrate layer; a covering layer is also formed on the surface of the carrying layer, covering the metal substrate layer and exposing the plurality of magnetic tunnel junctions and the first through hole; a first metal layer is formed on the surface of the covering layer, and the first metal layer extends to the substrate through the first through hole; a plurality of magnetic tunnel junctions are connected in series through the metal substrate layer and the first metal layer to form a plurality of first TMR components; and the plurality of first TMR components are electrically connected to the substrate through the first metal layer.

[0014] In one embodiment, a covering layer is formed on the surface of the coating layer; a stop layer is formed on the surface of the covering layer; a steering column protective layer is formed on the surface of the covering layer, and the steering column protective layer is provided with a third through hole exposing the stop layer; the steering column is formed by a soft magnetic material in the third through hole, and the shielding plate is formed by a soft magnetic material on the surface of the steering column protective layer.

[0015] In one embodiment, the stop layer is at least partially configured as a coil layer, and the coil layer of the stop layer can generate a magnetic field when energized.

[0016] In one embodiment, the covering layer is provided with a second through hole extending through the thickness direction, and the second through hole exposes the first metal layer; a second metal layer stacked with the first metal layer is formed in the second through hole; the steering column protective layer is provided with a avoidance hole exposing the second through hole, and a soft magnetic layer formed of a soft magnetic body and stacked with the second metal layer is formed in the second through hole and the avoidance hole, and the first metal layer, the second metal layer and the soft magnetic layer together constitute the signal communication structure.

[0017] In one embodiment, a covering layer is formed on the surface of the coating layer; the steering column formed of a soft magnetic material and a steering column protective layer exposing the steering column are formed on the surface of the covering layer; and the shielding plate formed of a soft magnetic material is formed on the surface of the steering column protective layer.

[0018] In one embodiment, the covering layer is provided with a second through hole extending through the thickness direction, and the second through hole exposes the first metal layer; a soft magnetic layer formed of a soft magnetic body is formed in the second through hole, and the steering column protective layer exposes the soft magnetic layer, and the first metal layer and the soft magnetic layer together constitute the signal communication structure.

[0019] In one embodiment, the shielding plate is located on the side of the plurality of first TMR components facing away from the steering column, and the magnetic sensor further includes an adjustment layer arranged between the plurality of first TMR components and the shielding plate, and the adjustment layer is at least partially configured as a coil layer, and the coil layer of the adjustment layer can generate a magnetic field when energized.

[0020] In one embodiment, a steering column protection layer is formed on the surface of the substrate, and a first blind hole that does not penetrate the steering column protection layer in the thickness direction is opened; the steering column is formed by a soft magnetic material in the first blind hole; and a bearing layer covering the steering column is formed on the surface of the steering column protection layer.

[0021] In one embodiment, a metal substrate layer is formed on the surface of the carrier layer, and multiple magnetic tunnel junctions are arranged on the metal substrate layer; a coating layer is also formed on the surface of the carrier layer, which covers the metal substrate layer and exposes the multiple magnetic tunnel junctions; a fourth metal layer is formed on the surface of the coating layer; and the multiple magnetic tunnel junctions are connected in series through the metal substrate layer and the fourth metal layer to form multiple first TMR components.

[0022] In one embodiment, a covering layer is formed on the surface of the cladding layer, and the regulating layer is formed on the surface of the covering layer.

[0023] In one embodiment, an adjustment protection layer covering the adjustment layer is formed on the surface of the cover layer, and the shielding plate formed of a soft magnetic body is formed on the surface of the adjustment protection layer.

[0024] In one embodiment, the steering column protective layer is provided with a fourth through hole extending through the thickness direction, and a soft magnetic layer formed by a soft magnetic body and extending to the substrate is formed in the fourth through hole; the supporting layer is provided with a fifth through hole exposing the soft magnetic layer, and the cladding layer is provided with a sixth through hole exposing the fifth through hole, the first metal layer extends to the soft magnetic layer through the sixth through hole and the fifth through hole, and a plurality of the first TMR components are electrically connected to the substrate through the first metal layer and the soft magnetic layer; the covering layer is provided with a seventh through hole exposing the fourth metal layer, and a fourth metal layer stacked with the first metal layer is formed in the seventh through hole, and the fourth metal layer, the first metal layer and the soft magnetic layer together constitute a signal communication structure electrically connected to a plurality of the first TMR components.

[0025] In one embodiment, the magnetic sensor further includes a plurality of second TMR components, which are arranged on one side of the substrate and electrically connected to the signal communication structure, and the orthographic projections of the plurality of second TMR components in the plane where the substrate is located are outside the range of the orthographic projections of the soft magnetic structure in the plane where the substrate is located.

[0026] In the above-mentioned magnetic sensor, the shielding plate has a small demagnetization in the direction parallel to the first TMR component (XY plane), and the shielding plate is easily magnetized by the magnetic field in the XY plane. When the external magnetic field in the XY plane magnetizes the shielding plate, an induced magnetic field in the opposite direction to the external magnetic field can be generated, which can offset the external magnetic field and play a shielding role. The shielding plate has a large demagnetization in the direction perpendicular to the first TMR component (Z axis), and the shielding plate is not easily magnetized by the magnetic field in the Z-axis direction. Therefore, the shielding plate will not affect the external magnetic field in the Z-axis direction to be detected, that is, the external magnetic field in the Z-axis direction to be detected will not be shielded by the shielding plate and can be smoothly steered by the steering column. It can be seen that by setting up a soft magnetic structure, while detecting the Z-axis magnetic field, it can also play a shielding role for the magnetic field in the XY plane, thereby avoiding cross-axis interference in the detection of the Z-axis magnetic field. Therefore, the above-mentioned magnetic sensor can significantly improve the detection accuracy.

[0027] A method for preparing a magnetic sensor, comprising:

[0028] Step S201: forming a plurality of first TMR components on one side of a substrate;

[0029] Step S202: electrically connecting the plurality of first TMR components to a signal communication structure;

[0030] Step S203: Set up a soft magnetic structure including a steering column and a shielding plate, wherein the shielding plate is parallel to the first TMR component, the steering column extends in a direction perpendicular to the first TMR component, the shielding plate is located on the side of the steering column facing away from the multiple first TMR components or on the side of the multiple first TMR components facing away from the steering column, and the orthographic projections of the multiple first TMR components and the steering column in the plane where the surface of the shielding plate is located are located within the range of the shielding plate.

[0031] In one embodiment, step S201 includes: forming a carrier layer on the surface of the substrate; forming a metal substrate layer and a TMR film in sequence on the surface of the carrier layer; etching the TMR film to obtain a plurality of magnetic tunnel junctions, and etching the metal substrate layer to connect the plurality of magnetic tunnel junctions in series to form a plurality of the first TMR components.

[0032] In one embodiment, step S202 includes: opening a first through hole passing through the carrier layer along the thickness direction; forming a coating layer on the surface of the carrier layer to expose multiple first TMR components and the first through hole; forming a first metal layer on the surface of the coating layer, and the first metal layer extends to the substrate through the first through hole to electrically connect the multiple first TMR components and the substrate.

[0033] In one embodiment, step S203 includes:

[0034] A covering layer is formed on the surface of the coating layer; a stop layer is formed on the surface of the covering layer; a steering column protective layer is formed on the surface of the covering layer, and a third through hole is opened in the steering column protective layer to expose the stop layer; a soft magnetic material is deposited in the third through hole until the soft magnetic material spreads to the surface of the steering column protective layer, the soft magnetic material in the third through hole forms the steering column, and the soft magnetic material on the surface of the steering column protective layer forms the shielding plate.

[0035] In one embodiment, step S203 includes: forming a covering layer on the surface of the coating layer; depositing a soft magnetic material on the surface of the covering layer to obtain the steering column; forming a steering column protective layer on the surface of the covering layer to expose the steering column; depositing a soft magnetic material on the surface of the steering column protective layer to obtain the shielding plate.

[0036] In one embodiment, the step S201 further includes: etching the metal substrate layer to connect the plurality of magnetic tunnel junctions in series to form a plurality of second TMR components.

[0037] In one embodiment, the step S202 further includes: the cladding layer further exposes a plurality of the second TMR components, and the first metal layer further electrically connects the plurality of the second TMR components to the substrate.

[0038] The shielding plate of the magnetic sensor obtained by the above-mentioned method for preparing a magnetic sensor has low demagnetization in the XY plane, and the shielding plate is easily magnetized by the magnetic field in the XY plane. When the external magnetic field in the XY plane magnetizes the shielding plate, an induced magnetic field in the opposite direction of the external magnetic field is generated, which can offset the external magnetic field and play a shielding role. The shielding plate has high demagnetization in the Z axis and is not easily magnetized by the magnetic field in the Z axis direction. Therefore, the shielding plate will not affect the external magnetic field in the Z axis direction to be detected. In other words, the external magnetic field in the Z axis direction to be detected will not be shielded by the shielding plate and can be smoothly steered by the steering column. It can be seen that by providing a soft magnetic structure, the magnetic sensor can simultaneously detect the Z axis magnetic field while also shielding the axial magnetic field in the XY plane, thereby avoiding cross-axis interference in the detection of the Z axis magnetic field.

[0039] In addition, a method for preparing a magnetic sensor is provided, comprising:

[0040] Step S201 ′: forming a plurality of first TMR components on one side of the substrate;

[0041] Step S202 ′: electrically connecting the plurality of first TMR components to a signal communication structure;

[0042] Step S203': Set up a soft magnetic structure including a steering column and a shielding plate, wherein the shielding plate is parallel to the first TMR component, the steering column extends in a direction perpendicular to the first TMR component, the shielding plate is located on the side of the steering column facing away from the multiple first TMR components or on the side of the multiple first TMR components facing away from the steering column, and the orthographic projections of the multiple first TMR components and the steering column in the plane where the surface of the shielding plate is located are located within the range of the shielding plate.

[0043] In one embodiment, step S201' includes: forming a first passivation layer on the surface of the substrate; sequentially forming a metal substrate layer and a TMR film on the surface of the first passivation layer; etching the TMR film to obtain a plurality of magnetic tunnel junctions, and etching the metal substrate layer to connect the plurality of magnetic tunnel junctions in series to form a plurality of the first TMR components.

[0044] In one embodiment, step S202' includes: opening a first through hole penetrating the first passivation layer along the thickness direction; forming a second passivation layer on the surface of the first passivation layer to expose the plurality of first TMR components and the first through hole; forming a first metal layer on the surface of the second passivation layer, the first metal layer extending to the substrate through the first through hole to electrically connect the plurality of first TMR components and the substrate.

[0045] In one embodiment, the step S203' includes: forming a third passivation layer on the surface of the second passivation layer; forming a stop layer on the surface of the third passivation layer; forming a fourth passivation layer on the surface of the third passivation layer, and opening a third through hole in the fourth passivation layer to expose the stop layer; depositing a soft magnetic material in the third through hole until the soft magnetic material spreads to the surface of the fourth passivation layer, the soft magnetic material in the third through hole forms the steering column, and the soft magnetic material on the surface of the fourth passivation layer forms the shielding plate.

[0046] In one embodiment, step S203' includes: forming a third passivation layer on the surface of the second passivation layer; depositing a soft magnetic material on the surface of the third passivation layer to obtain the steering column; forming a fourth passivation layer on the surface of the third passivation layer to expose the steering column; depositing a soft magnetic material on the surface of the fourth passivation layer to obtain the shielding plate.

[0047] In one embodiment, the step S201 ′ further includes: etching the metal substrate layer to connect the plurality of magnetic tunnel junctions in series to form a plurality of second TMR components.

[0048] In one embodiment, the step S202 ′ further includes: the second passivation layer further exposes a plurality of the second TMR components, and the first metal layer further electrically connects the plurality of the second TMR components to the substrate.

[0049] The above-described method for preparing a magnetic sensor results in a shielding plate having minimal demagnetization in the XY plane, making it easily magnetized by the magnetic field within the XY plane. When the shielding plate is magnetized by an external magnetic field within the XY plane, an induced magnetic field is generated in the opposite direction of the external magnetic field, thereby canceling out the external magnetic field and providing a shielding effect. The shielding plate exhibits significant demagnetization in the Z axis and is not easily magnetized by the magnetic field in the Z axis direction. Therefore, the shielding plate does not affect the external magnetic field in the Z axis direction to be detected. In other words, the external magnetic field in the Z axis direction to be detected is not shielded by the shielding plate and can be smoothly steered by the steering column. Thus, by forming a steering column and shielding plate formed from a soft magnetic material, the magnetic sensor can simultaneously detect the Z axis magnetic field while also providing a shielding effect for the axial magnetic field in the XY plane, thereby avoiding cross-axis interference in the detection of the Z axis magnetic field.

[0050] Furthermore, when current flows through the coil layer of the regulating layer, it generates a magnetic field. This magnetic field can magnetize the free layer of the magnetic tunnel junction in the first TMR component, thereby achieving magnetic reset of the magnetic sensor. Furthermore, the theoretical value of the magnetic field strength generated by the coil layer can be calculated using parameters such as the number of coil turns and the current. By comparing the measured value of the magnetic sensor with the theoretical value, the magnetic sensor can also be self-tested, ensuring precise measurement accuracy, provided the ambient magnetic field is zeroed. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0052] FIG1 is a schematic structural diagram of a magnetic sensor according to one embodiment of the present invention;

[0053] FIG2 is a schematic structural diagram of a magnetic sensor according to another embodiment of the present invention;

[0054] FIG3 is a schematic flow chart of a method for preparing a magnetic sensor according to a first embodiment of the present invention;

[0055] FIG4 is a schematic diagram of a scene corresponding to step S201 in the method for preparing the magnetic sensor shown in FIG3 ;

[0056] FIG5 is a schematic diagram of a scene corresponding to step S202 in the method for preparing the magnetic sensor shown in FIG3 ;

[0057] FIG6 is a schematic diagram of a scenario corresponding to step S203 of one implementation method in the first embodiment of the present invention;

[0058] FIG7 is a schematic diagram of a scenario corresponding to step S203 of another implementation manner in the first embodiment of the present invention;

[0059] 8 and 9 are schematic diagrams of simulations showing an external magnetic field passing through a soft magnetic structure;

[0060] FIG10 is a schematic structural diagram of a magnetic sensor according to a second embodiment of the present invention;

[0061] FIG11 is a simplified simulation diagram of the magnetic sensor shown in FIG10 ;

[0062] FIG12 is a schematic flow chart of a method for preparing a magnetic sensor according to a second embodiment of the present invention;

[0063] FIG13 is a schematic diagram of a scene corresponding to step S201′ in the method for preparing the magnetic sensor shown in FIG12 ;

[0064] FIG14 is a schematic diagram of a scene corresponding to step S202′ in the method for preparing the magnetic sensor shown in FIG12 ;

[0065] FIG. 15 is a schematic diagram of a scene corresponding to step S203 ′ in the method for preparing the magnetic sensor shown in FIG. 12 . DETAILED DESCRIPTION

[0066] To make the above-mentioned objects, features, and advantages of the present invention more readily apparent, specific embodiments of the present invention are described in detail below with reference to the accompanying drawings. The following description sets forth numerous specific details to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways than those described herein, and those skilled in the art may make similar modifications without departing from the scope of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0067] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0068] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0069] In the present invention, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection; direct connection, or indirect connection through an intermediate medium; internal communication between two components, or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0070] In the present invention, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediary. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0071] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only implementation methods.

[0072] 1 , 8 and 9 , a magnetic sensor 100 in a first embodiment of the present invention includes a substrate 110 , a plurality of first TMR (Tunnel Magnetoresistance) components 120 , a soft magnetic structure 130 and a signal communication structure 140 .

[0073] The substrate 110 can support the multiple first TMR components 120, the soft magnetic structure 130, and the signal communication structure 140. The multiple first TMR components 120 are disposed on one side of the substrate 110 and are electrically connected to the signal communication structure 140. The soft magnetic structure 130 cooperates with the multiple first TMR components 120 to shield the external in-plane magnetic field and change the magnetic field direction of the external out-of-plane magnetic field to be detected to the in-plane direction for detection by the multiple first TMR components 120. The multiple first TMR components 120 can have the same structure and can be connected in series, in parallel, or in a combination of series and parallel to jointly detect the external out-of-plane magnetic field in the conversion direction. The analog signal generated by detecting the external out-of-plane magnetic field in the conversion direction can be output through the signal communication structure 140 for further processing to generate a digital signal.

[0074] Specifically, the first TMR component 120 can be composed of one or more magnetic tunnel junctions connected in series. A magnetic tunnel junction generally includes a ferromagnetic layer / tunnel barrier layer / ferromagnetic layer / antiferromagnetic layer. The ferromagnetic layer below the tunnel barrier layer is also called the pinned layer, and the ferromagnetic layer above the tunnel barrier layer is also called the free layer. The exchange coupling between the pinned layer and the antiferromagnetic layer determines the magnetization direction of the pinned layer, and changes in the magnetic field in the environment will cause the magnetization direction of the free layer to change. When the magnetization directions of the two ferromagnetic layers are parallel to each other, the magnetic tunnel junction is in a low-resistance state; when the magnetization directions of the two ferromagnetic layers are antiparallel, the magnetic tunnel junction is in a high-resistance state. In other words, changes in the magnetic field in the environment will cause the magnetization direction of the free layer to change, which in turn causes the resistance of the magnetic tunnel junction to change, thereby causing the resistance of the first TMR component 120 composed of the magnetic tunnel junction to change.

[0075] Considering that the multiple first TMR components 120 can only detect in-plane magnetic fields parallel to the first TMR components 120, but cannot detect out-of-plane magnetic fields perpendicular to the first TMR components 120, the magnetic field direction of the external out-of-plane magnetic field to be detected is changed to an in-plane direction by the soft magnetic structure 130 for detection by the multiple first TMR components 120. The soft magnetic structure 130 also shields the external in-plane magnetic field to avoid detection output caused by the external in-plane magnetic field. In other words, the soft magnetic structure 130 can eliminate or greatly reduce the interference of the external in-plane magnetic field, and the detection output generated by the multiple first TMR components 120 only corresponds to or substantially corresponds to the external out-of-plane magnetic field to be detected.

[0076] The analog signal generated by the resistance change of the first TMR element 120 can be output through the signal communication structure 140 for further processing to generate a digital signal.

[0077] In this embodiment, the substrate 110 includes a CMOS board 111 and a signal layer 112 covering the CMOS board 111. The CMOS board 111 integrates an integrated circuit consisting of several MOS transistors, which can process analog signals, and the signal layer 112 can realize functions such as receiving analog signals and outputting digital signals. The signal layer 112 can be in the form of a metal layer, an integrated circuit layer, etc. Among them, the metal layer can be a copper layer, an aluminum layer, a copper alloy layer, or an aluminum alloy layer. In this way, the analog signal is transmitted to the substrate 110 and processed by the substrate 110 to obtain a digital signal reflecting the external out-of-plane magnetic field to be detected, thereby completing the detection of the external out-of-plane magnetic field. The digital signal can also be transmitted to the outside of the magnetic sensor 100 through the signal communication structure 140 for easy reading or calling. By integrating the substrate 110 with the CMOS board 111 and the signal layer 112, the magnetic sensor 100 can be formed in a single-chip manner, eliminating the need for an additional integrated ASIC chip for signal processing, which helps to reduce the package size of the magnetic sensor 100.

[0078] Furthermore, in this embodiment, the signal layer 112 is at least partially configured as a coil layer. When current flows through the coil layer, it generates a magnetic field. This magnetic field can magnetize the free layer of the magnetic tunnel junction in the first TMR component 120, thereby achieving magnetic resetting of the magnetic sensor 100. Furthermore, the theoretical value of the magnetic field strength generated by the coil layer can be calculated based on parameters such as the number of coil turns and the current. Therefore, by comparing the measured value of the magnetic sensor 100 with the theoretical value, a self-test of the magnetic sensor 100 can be performed.

[0079] The soft magnetic structure 130 is formed from a soft magnetic material, such as iron, iron-silicon alloy, ferrite, or iron-nickel alloy, and is easily magnetized and demagnetized. The soft magnetic structure 130 includes a steering column 131 and a shielding plate 132. The steering column 131 is used to redirect the magnetic field of the external out-of-plane magnetic field to be detected to an in-plane direction, and the shielding plate 132 is used to shield the external in-plane magnetic field. The shielding plate 132 and the steering column 131 can be integrally formed or separately formed. Furthermore, the separately formed shielding plate 132 and steering column 131 can be connected to each other or spaced apart.

[0080] The shielding plate 132 is parallel to the plurality of first TMR assemblies 120. The steering column 131 extends in a direction perpendicular to the plurality of first TMR assemblies 120. The orthographic projections of the steering column 131 and the plurality of first TMR assemblies 120 on the plane of the shielding plate 132 are located within the shielding plate 132. Furthermore, the shielding plate 132 is located on the side of the steering column 131 facing away from the plurality of first TMR assemblies 120. The direction perpendicular to the first TMR assemblies 120 is defined as the Z-axis direction, and two directions parallel to the first TMR assemblies 120 and perpendicular to each other are defined as the X-axis direction and the Y-axis direction. Specifically, the shielding plate 132 is parallel to the XY plane, the steering column 131 extends in the Z-axis direction, the orthographic projections of the steering column 131 and the plurality of first TMR assemblies 120 on the XY plane are located within the orthographic projection of the shielding plate 132 on the XY plane, and the shielding plate 132 is located on the side of the steering column 131 facing away from the plurality of first TMR assemblies 120 in the Z-axis direction.

[0081] In this embodiment, multiple first TMR components 120 are arranged on the substrate 110, the steering column 131 is located on the side of the multiple first TMR components 120 facing away from the substrate 110, and the shielding plate 132 is located on the side of the steering column 131 facing away from the multiple first TMR components 120.

[0082] Of course, in other embodiments, the shielding plate 132 may also be located on the side of the multiple first TMR components 120 facing away from the steering column 131, that is, the shielding plate 132 is located on the side of the multiple first TMR components 120 facing away from the steering column 131 in the Z-axis direction.

[0083] The steering column 131 has a three-dimensional shape and can be cylindrical, rectangular, or prismatic. As shown in Figures 8 and 9, the steering column 131 can change the magnetic field direction of the external out-of-plane magnetic field to be detected to the in-plane direction. Specifically, the magnetic field direction of the external magnetic field to be detected in the Z-axis direction can be changed to the X-axis direction or the Y-axis direction. Because the deflection of magnetic flux lines is more obvious at the edge of the steering column 131, the multiple first TMR assemblies 120 are generally distributed along the circumference of the steering column 131 and opposite the edge of the steering column 131.

[0084] The thickness of shielding plate 132, i.e., its dimension in the Z-axis direction, is relatively small, typically less than 10 microns. However, its length and width, i.e., its dimensions in the X- and Y-axis directions, are relatively large, typically exceeding 100 microns. Therefore, shielding plate 132 can be considered a relatively thin sheet. This allows shielding plate 132 to experience minimal demagnetization in the XY plane, making it easily magnetized by magnetic fields in that plane. Furthermore, shielding plate 132 experiences significant demagnetization in the Z-axis direction, making it less susceptible to magnetization by magnetic fields in that direction. Because shielding plate 132 is easily magnetized by magnetic fields in the XY plane, it can effectively shield against external magnetic fields in the XY plane. For example, if an external magnetic field in the positive X-axis direction is applied above shielding plate 132, shielding plate 132 is easily magnetized by this magnetic field. After magnetization, the magnetic flux lines within shielding plate 132 are also oriented in the positive X-axis direction. Given that the magnetic flux lines are closed, the magnetic flux lines below shielding plate 132 should be oriented in the negative X-axis direction. In other words, an induced magnetic field opposite to the external magnetic field is generated below shielding plate 132, thereby canceling out the external magnetic field and providing a shielding effect. Furthermore, because shielding plate 132 is not easily magnetized by magnetic fields in the Z-axis direction, it does not affect the external magnetic field to be detected in the Z-axis direction. In other words, the external magnetic field in the Z-axis direction to be detected is not shielded by shielding plate 132 and can be smoothly steered by steering column 131.

[0085] It should be noted that after the external magnetic field in the Z-axis direction to be detected is deflected by the steering column 131, a magnetic field in the XY plane to be detected is formed at the multiple first TMR components 120. In order to avoid the shielding plate 132 from having unnecessary influence on the magnetic field in the XY plane to be detected, the shielding plate 132 needs to be set on the side of the steering column 131 facing away from the multiple first TMR components 120.

[0086] Alternatively, the shielding plate 132 may be disposed on a side of the plurality of first TMR assemblies 120 facing away from the steering column 131. In other words, the shielding plate 132 does not need to be disposed between the steering column 131 and the plurality of first TMR assemblies 120 to meet the requirement.

[0087] In addition, it should be noted that the closer to the edge of the shielding plate 132, the weaker the shielding effect for the magnetic field in the external XY plane. In order to ensure the shielding effect for the magnetic field in the external XY plane, the distance between the edge of the positive projection of each first TMR component 120 on the surface of the shielding plate 132 and the edge of the shielding plate 132 is greater than or equal to 10 microns.

[0088] In this embodiment, a carrying layer 150 is formed on the surface of the substrate 110, and the carrying layer 150 is provided with a first through hole 151 extending through the thickness direction (see Figure 5); a metal substrate layer (not shown) is formed on the surface of the carrying layer 150, and a plurality of magnetic tunnel junctions are arranged on the metal substrate layer; a cladding layer 160 is also formed on the surface of the carrying layer 150, which clads the metal substrate layer and exposes a plurality of magnetic tunnel junctions and the first through hole 151; a first metal layer 141 is formed on the surface of the cladding layer 160, and the first metal layer 141 extends to the substrate 110 through the first through hole 151.

[0089] Multiple magnetic tunnel junctions are connected in series via the metal substrate layer and the first metal layer 141 to form the first TMR components 120, and the series / parallel connection between the multiple first TMR components 120 is also achieved via the metal substrate layer and the first metal layer 141. In addition, the first metal layer 141 extends to the substrate 110 via the first via 151 to be electrically connected to the substrate 110. In other words, the first metal layer 141 extends to the substrate 110 via the first via 151 to electrically connect the multiple first TMR components 120 to the substrate 110.

[0090] The carrier layer 150 serves as an insulating layer and protects the signal layer 112, while the cladding layer 160 serves as an insulating layer and protects the plurality of first TMR components 120. The material of the carrier layer 150 can be silicon oxide (SiO2), polyimide (PI), fluorine-containing silicon oxide (F-SiO2), aluminum oxide (AlOx), etc., and can be formed on the substrate 110 by coating, physical vapor deposition (PVD), chemical vapor deposition (CVD), etc. The material and molding method of the cladding layer 160 are generally the same as those of the carrier layer 150. Before molding the cladding layer 160, the positions corresponding to the first TMR components 120 and the first through holes 151 can be coated with a photoresist 300 (see Figure 5) by exposure, development, and etching. After the cladding layer 160 is molded, the photoresist 300 is removed to expose the first TMR components 120 and the first through holes 151.

[0091] The metal substrate layer deposited on the carrier layer 150 may be formed by first depositing and then etching, so as to realize the series connection of multiple magnetic tunnel junctions and the series / parallel connection of multiple first TMR components 120 .

[0092] The first metal layer 141 can be deposited on the cladding layer 160 by first depositing and then etching. A portion of the first metal layer 141 is used to realize the series connection of multiple magnetic tunnel junctions and the series / parallel connection of multiple first TMR components 120, and the other portion is connected to the substrate 110 through the first through hole 151, thereby electrically connecting the multiple first TMR components 120 to the substrate 110.

[0093] Obviously, in other embodiments, the plurality of first TMR components 120 may also be electrically connected to the substrate 110 by means of perforation and bonding.

[0094] Depending on the molding method, the soft magnetic structure 130 can also have different structures. For example, in one embodiment, a covering layer 170 is formed on the surface of the cladding layer 160; a stop layer 171 is formed on the surface of the covering layer 170; a steering column protection layer 180 is formed on the surface of the covering layer 170, and the steering column protection layer 180 has a third through hole 181 (see Figure 6) that exposes the stop layer 171; a steering column 131 is formed in the third through hole 181 from a soft magnetic material, and a shielding plate 132 is formed on the surface of the steering column protection layer 180 from a soft magnetic material.

[0095] The material and molding method of the covering layer 170 and the steering column protection layer 180 can be the same as those of the supporting layer 150, so they will not be described in detail. After the covering layer 170 is formed, a stop layer 171 can be formed at the position of the covering layer 170 where the steering column 131 needs to be formed by deposition, patching, etc. The stop layer 171 can be a metal layer that has a blocking effect on lasers and etching liquids. During the molding process of the steering column protection layer 180, the stop layer 171 will be covered first, and then etched by laser or chemical etching until the stop layer 171 is reached, thereby exposing the position where the steering column 131 needs to be formed. The stop layer 171 can prevent the covering layer 170 from being etched through, thereby protecting the first TMR component 120.

[0096] Next, soft magnetic material is deposited within third through-hole 181. The soft magnetic material filling third through-hole 181 forms steering column 131. Once third through-hole 181 is completely filled, soft magnetic material is further deposited to form shielding plate 132 on the surface of steering column protective layer 180. Thus, steering column 131 and shielding plate 132 are integrally formed.

[0097] Furthermore, at least a portion of the stop layer 171 is configured as a coil layer, and the coil layer can generate a magnetic field when energized.

[0098] When current flows through the coil layer, it generates a magnetic field. This magnetic field magnetizes the free layer of the magnetic tunnel junction in the first TMR component 120, thereby achieving magnetic reset of the magnetic sensor 100. Furthermore, the theoretical value of the magnetic field strength generated by the coil layer can be calculated based on parameters such as the number of coil turns and the current. Therefore, by comparing the measured value of the magnetic sensor 100 with the theoretical value, the magnetic sensor 100 can be self-tested, provided that the ambient magnetic field is cleared.

[0099] Furthermore, the covering layer 170 is provided with a second through hole 172 (see FIG6 ) extending through the covering layer 170 in the thickness direction, and the second through hole 172 exposes the first metal layer 141; a second metal layer 142 stacked with the first metal layer 141 is formed in the second through hole 172; the steering column protection layer 180 is provided with a avoidance hole 182 (see FIG6 ) exposing the second through hole 172, and a soft magnetic layer 143 formed of a soft magnetic body and stacked with the second metal layer 142 is formed in the second through hole 172 and the avoidance hole 182, and the first metal layer 141, the second metal layer 142 and the soft magnetic layer 143 together constitute the signal communication structure 140.

[0100] After the covering layer 170 is formed, the second through hole 172 can be formed by laser or chemical etching. At the same time as the stop layer 171 is formed, the second metal layer 142 can be formed in the second through hole 172 by the same process. In other words, the structure and material of the second metal layer 142 can be the same as the stop layer 171. After the same metal layer is deposited, it is patterned so that part of it constitutes the stop layer 171 and part of it constitutes the second metal layer 142. After the steering column protection layer 180 is formed, the same process can be used to open the avoidance hole 182 while opening the third through hole 181. Finally, when forming the soft magnetic structure 130, the same process can be used to deposit the soft magnetic layer 143 in the second through hole 172 and the avoidance hole 182, thereby obtaining the signal communication structure 140.

[0101] It can be seen that the formation of the signal communication structure 140 does not require additional steps, thereby helping to reduce the processing cost of the magnetic sensor 100 .

[0102] It should be noted that, in other embodiments, the substrate 110 may also have a connector for digital signal output, thereby serving as the signal communication structure 140 .

[0103] As shown in Figure 2, in another embodiment, a covering layer 170 is formed on the surface of the coating layer 160; a steering column 131 formed of a soft magnetic material and a steering column protective layer 180 exposing the steering column 131 are formed on the surface of the covering layer 170; a shielding plate 132 formed of a soft magnetic material is formed on the surface of the steering column protective layer 180.

[0104] The formation of the cover layer 170 and the steering column protective layer 180 is similar to the previous embodiment, with the following difference: in this embodiment, the steering column 131 is first deposited on the surface of the cover layer 170, then the steering column protective layer 180 is formed, and finally the shielding plate 132 is deposited on the surface of the steering column protective layer 180. As can be seen, the steering column 131 and the shielding plate 132 are formed separately.

[0105] Compared to the previous embodiment, the magnetic sensor 100 in this embodiment omits the stop layer 171, thereby simplifying the processing steps. Furthermore, since there is no stop layer 171 separating the first TMR element 120 and the soft magnetic structure 130, the detection sensitivity of the magnetic sensor 100 is also higher.

[0106] Furthermore, the covering layer 170 is provided with a second through hole 172 (see FIG. 7 ) extending through the covering layer 170 in the thickness direction, and the second through hole 172 exposes the first metal layer 141 ; a soft magnetic layer 143 formed of a soft magnetic body is formed in the second through hole 172 , and the steering column protection layer 180 exposes the soft magnetic layer 143 , and the first metal layer 141 and the soft magnetic layer 143 together constitute the signal communication structure 140 .

[0107] Similarly, after the cover layer 170 is formed, the second through hole 172 can be formed by laser or chemical etching. While the soft magnetic material is being deposited on the surface of the cover layer 170, the soft magnetic material can be deposited within the second through hole 172 using the same process to form the soft magnetic layer 143. This eliminates the need for additional steps in forming the signal communication structure 140, thereby reducing the processing cost of the magnetic sensor 100.

[0108] In addition, in this embodiment, a shielding plate protection layer 190 is formed on the surface of the steering column protection layer 180 to cover the shielding plate 132 and expose the signal communication structure 140 , and a third metal layer 144 is formed on the surface of the soft magnetic layer 143 of the signal communication structure 140 .

[0109] The shielding plate protective layer 190 can be made of the same material and formed using the same method as the carrier layer 150. After forming, the signal communication structure 140 can be exposed through local etching. The shielding plate protective layer 190 protects the soft magnetic structure 130. The third metal layer 144, exposed at the outermost portion of the magnetic sensor 100, enhances the electrical conductivity of the signal communication structure 140.

[0110] The magnetic sensor 100 also includes multiple second TMR components (not shown in the figure), which are arranged on one side of the substrate 110 and electrically connected to the signal communication structure 140. The orthographic projections of the multiple second TMR components in the plane where the substrate 110 is located are outside the range of the orthographic projection of the soft magnetic structure 130 in the plane where the substrate 110 is located.

[0111] The second TMR components are also composed of one or more magnetic tunnel structures connected in series. By setting the orthographic projections of the multiple second TMR components in the plane of the substrate 110 to be outside the range of the orthographic projection of the soft magnetic structure 130 in the plane of the substrate 110, the soft magnetic structure 130 has no effect on the multiple second TMR components, thereby enabling the multiple second TMR components to detect external in-plane magnetic fields.

[0112] Furthermore, the analog signal for detecting the external in-plane magnetic field can also be transmitted to the substrate 110 via the signal communication structure 140, and processed by the substrate 110 to obtain a digital signal reflecting the external in-plane magnetic field to be detected, thereby completing the detection of the external in-plane magnetic field. This digital signal can also be transmitted to the outside of the magnetic sensor 100 via the signal communication structure 140 for easy reading or access.

[0113] It is understood that the second TMR component can be formed using the same process as the first TMR component 120. That is, multiple magnetic tunnel junctions can be formed, with some of the magnetic tunnel junctions forming the first TMR component 120 and others forming the second TMR component.

[0114] Furthermore, a portion of the second TMR component is used to detect the X-axis magnetic field, and the other portion is used to detect the Y-axis magnetic field.

[0115] In the magnetic sensor 100, the shielding plate 132 has a relatively low demagnetization in the XY plane, and is easily magnetized by the magnetic field in the XY plane. When the external magnetic field in the XY plane magnetizes the shielding plate 132, an induced magnetic field in the opposite direction of the external magnetic field is generated, thereby canceling out the external magnetic field and providing a shielding effect. The shielding plate 132 has a relatively high demagnetization in the Z-axis direction, and is not easily magnetized by the magnetic field in the Z-axis direction. Therefore, the shielding plate 132 does not affect the external magnetic field in the Z-axis direction to be detected. That is, the external magnetic field in the Z-axis direction to be detected will not be shielded by the shielding plate 132 and can be smoothly steered by the steering column 131. It can be seen that by providing the soft magnetic structure 130, while detecting the Z-axis magnetic field, it can also shield the magnetic field in the XY plane, thereby avoiding cross-axis interference in the detection of the Z-axis magnetic field. Therefore, the magnetic sensor 100 can significantly improve detection accuracy.

[0116] Furthermore, the magnetic sensor 100 includes a first TMR component 120 and a second TMR component, which can respectively detect an external out-of-plane magnetic field and an external in-plane magnetic field, so that the magnetic sensor 100 can detect the external space magnetic field.

[0117] In addition, this embodiment also provides a method for manufacturing a magnetic sensor, which is used to manufacture the magnetic sensor 100 shown in FIG. 1 and FIG. 2 .

[0118] Please refer to FIG3 , the method for preparing a magnetic sensor in this embodiment includes steps S201 to S203 , wherein:

[0119] In step S201 , a plurality of first TMR components 120 are formed on one side of the substrate 110 .

[0120] In step S202 , the plurality of first TMR components 120 are electrically connected to the signal communication structure 140 .

[0121] Step S203, setting a soft magnetic structure 130 including a steering column 131 and a shielding plate 132, the shielding plate 132 is parallel to the first TMR component 120, the steering column 131 extends in a direction perpendicular to the first TMR component 120, the shielding plate 132 is located on the side of the steering column 131 facing away from the multiple first TMR components 120 or on the side of the multiple first TMR components 120 facing away from the steering column 131, and the orthographic projections of the multiple first TMR components 120 and the steering column 131 in the plane where the surface of the shielding plate 132 is located are located within the range of the shielding plate 132.

[0122] It should be noted that the above steps S201 to S203 can be executed sequentially, or simultaneously if conditions permit, and the execution order can be adjusted if conditions permit.

[0123] Please refer to Figure 4. In this embodiment, the above-mentioned step S201 includes: forming a carrier layer 150 on the surface of the substrate 110; sequentially forming a metal substrate layer and a TMR film 120a on the surface of the carrier layer 150; etching the TMR film 120a to obtain a plurality of magnetic tunnel junctions, and etching the metal substrate layer to connect the plurality of magnetic tunnel junctions in series to form a plurality of first TMR components 120.

[0124] The TMR film 120a has a multilayer structure, generally including a ferromagnetic layer / tunnel barrier layer / ferromagnetic layer / antiferromagnetic layer, consistent with the layered structure of a magnetic tunnel junction. The antiferromagnetic layer is deposited on a metal substrate layer, followed by the ferromagnetic layer, tunnel barrier layer, and ferromagnetic layer. After the TMR film 120a is formed, multiple magnetic tunnel junctions can be obtained by patterning the TMR film 120a. The metal substrate layer can be formed by first depositing and then etching to achieve the series connection of multiple magnetic tunnel junctions, thereby forming multiple first TMR components 120 on one side of the carrier layer 150. This shows that the processing efficiency of the first TMR components 120 is high and the consistency between the multiple first TMR components 120 is good.

[0125] It should be noted that, in other embodiments, a plurality of pre-formed first TMR components 120 may also be disposed on the substrate 110 in a patch manner.

[0126] The signal communication structure 140 may be a standardized connector, or may be a structure for signal transmission formed during the molding process of the magnetic sensor 100 .

[0127] The above step S201 further includes: etching the metal substrate layer to connect multiple magnetic tunnel junctions in series to form multiple second TMR components.

[0128] It is understood that after etching the TMR film 120a, multiple magnetic tunnel junctions can be obtained. After etching the metal substrate layer, the multiple magnetic tunnel junctions can be selectively connected in series. Thus, some of the magnetic tunnel junctions are connected in series to form the first TMR component 120, and another part of the magnetic tunnel junctions are connected in series to form the second TMR component.

[0129] Please refer to Figure 5. In this embodiment, the above-mentioned step S202 includes: opening a first through hole 151 that penetrates the carrier layer 150 along the thickness direction; forming a cladding layer 160 on the surface of the carrier layer 150 to expose the multiple first TMR components 120 and the first through hole 151; forming a first metal layer 141 on the surface of the cladding layer 160, and the first metal layer 141 extends to the substrate 110 through the first through hole 151 to electrically connect the multiple first TMR components 120 and the substrate 110.

[0130] The material and molding method of the coating layer 160 are generally the same as those of the carrier layer 150, and it can protect the first TMR element 120. Before forming the coating layer 160, the locations corresponding to the first TMR element 120 and the first through hole 151 can be coated with a photoresist 300 through exposure, development, and etching. After the coating layer 160 is formed, the photoresist is removed to expose the first TMR element 120 and the first through hole 151.

[0131] The first metal layer 141 can be formed by deposition followed by etching. A portion of the first metal layer 141 is used to implement the series connection of multiple magnetic tunnel junctions and the series / parallel connection of multiple first TMR components 120. Another portion passes through the first through-holes 151 to connect to the substrate 110, thereby electrically connecting the multiple first TMR components 120 to the substrate 110. It can be seen that the first metal layer 141 can serve as part of the signal communication structure 140 or act as a bridge between the multiple first TMR components 120 and the signal communication structure 140.

[0132] Obviously, in other embodiments, the plurality of first TMR components 120 may also be electrically connected to the substrate 110 by means of perforation and bonding.

[0133] In addition, when there are multiple second TMR components, the above step S202 further includes: the cladding layer 160 further exposes the multiple second TMR components, and the first metal layer 141 further electrically connects the multiple second TMR components and the substrate 110 .

[0134] Specifically, a portion of the first metal layer 141 is used to realize the series connection of multiple magnetic tunnel junctions, the series / parallel connection of multiple first TMR components 120, and the series / parallel connection of multiple second TMR components, and another portion is connected to the substrate 110 through the first through hole 151, thereby electrically connecting the multiple first TMR components 120 and the multiple second TMR components to the substrate 110.

[0135] Furthermore, after the plurality of second TMR components are connected in series or parallel, some are used to detect the X-axis magnetic field, and the other part is used to detect the Y-axis magnetic field.

[0136] The soft magnetic structure 130 can be formed in various ways. For example, referring to FIG. 6 , in one embodiment, step S203 includes: forming a covering layer 170 on the surface of the cladding layer 160; forming a stop layer 171 on the surface of the covering layer 170; forming a steering column protection layer 180 on the surface of the covering layer 170, and defining a third through hole 181 in the steering column protection layer 180 to expose the stop layer 171; and depositing a soft magnetic material within the third through hole 181 until the soft magnetic material spreads to the surface of the steering column protection layer 180. The soft magnetic material within the third through hole 181 forms the steering column 131, and the soft magnetic material on the surface of the steering column protection layer 180 forms the shielding plate 132.

[0137] The forming method of the covering layer 170 and the steering column protection layer 180 can be the same as that of the supporting layer 150, so it will not be repeated here. After the covering layer 170 is formed, a stop layer 171 can be formed at the position of the covering layer 170 where the steering column 131 needs to be formed by deposition, pasting, etc. The stop layer 171 can be a metal layer that has a blocking effect on lasers and etching liquids. During the forming process of the steering column protection layer 180, the stop layer 171 will be covered first, and then etched by laser or chemical etching until the stop layer 171 is reached, thereby exposing the position where the steering column 131 needs to be formed. The stop layer 171 can prevent the covering layer 170 from being etched through, thereby protecting the first TMR component 120.

[0138] Next, soft magnetic material is deposited within third through-hole 181. The soft magnetic material filling third through-hole 181 forms steering column 131. Once third through-hole 181 is completely filled, soft magnetic material is deposited again. The soft magnetic material that reaches the surface of steering column protective layer 180 forms shielding plate 132. Thus, steering column 131 and shielding plate 132 are integrally formed.

[0139] In this embodiment, a seed layer is first deposited, and then a soft magnetic material is electroplated and deposited based on the seed layer. After the electroplating deposition, the excess seed layer and soft magnetic material are etched away, so that the soft magnetic material filled in the third through hole 181 constitutes the steering column 131, and the soft magnetic material located on the surface of the steering column protective layer 180 and connected to the steering column 131 constitutes the shielding plate 132.

[0140] Furthermore, in this embodiment, the step of forming the stop layer 171 on the surface of the cover layer 170 is as follows: when forming the stop layer 171 on the surface of the cover layer 170, at least a portion of the stop layer 171 is set as a coil layer. When current flows through the coil layer, the coil layer can generate a magnetic field, and the magnetic field of the coil layer can magnetize the free layer of the magnetic tunnel junction in the first TMR component 120, thereby achieving magnetic reset of the magnetic sensor 100. Moreover, the theoretical value of the magnetic field strength generated by the coil layer can be calculated based on parameters such as the number of coil turns and the current. Therefore, under the premise of clearing the ambient magnetic field, by comparing the measured value of the magnetic sensor 100 with the theoretical value, the magnetic sensor 100 can also be self-tested.

[0141] Furthermore, in this embodiment, the step of forming the covering layer 170 on the surface of the cladding layer 160 further includes: forming a second through hole 172 penetrating the covering layer 170 along the thickness direction, the second through hole 172 exposing the first metal layer 141; the step of forming the stop layer 171 on the surface of the covering layer 170 further includes: forming the second metal layer 142 stacked with the first metal layer 141 in the second through hole 172;

[0142] Among them, the steering column protection layer 180 is provided with an avoidance hole 182 exposing the second through hole 172. While soft magnetic material is deposited in the third through hole 181, soft magnetic material is also deposited in the second through hole 172 and the avoidance hole 182 to form a soft magnetic layer 143 stacked with the second metal layer 142. The first metal layer 141, the second metal layer 142 and the soft magnetic layer 143 together constitute the signal communication structure 140.

[0143] After the covering layer 170 is formed, the second through hole 172 can be formed by laser or chemical etching. While forming the stop layer 171, the same process can be used to form the second metal layer 142 in the second through hole 172. That is to say, the structure and material of the second metal layer 142 can be the same as the stop layer 171. After the same metal layer is deposited, it is patterned so that part of it constitutes the stop layer 171 and part of it constitutes the second metal layer 142. After the steering column protection layer 180 is formed, the same process can be used to open the avoidance hole 182 while opening the third through hole 181. Finally, when forming the soft magnetic structure 130, the same process can be used to deposit the soft magnetic layer 143 in the second through hole 172 and the avoidance hole 182, thereby obtaining the signal communication structure 140.

[0144] It can be seen that the formation of the signal communication structure 140 does not require additional steps, thereby simplifying the process of the above-mentioned magnetic sensor manufacturing method and helping to reduce the processing cost of the magnetic sensor 100 .

[0145] Please refer to Figure 7. In another embodiment, the above step S203 includes: forming a covering layer 170 on the surface of the coating layer 160; depositing a soft magnetic material on the surface of the covering layer 170 to obtain a steering column 131; forming a steering column protective layer 180 on the surface of the covering layer 170 to expose the steering column 131; depositing a soft magnetic material on the surface of the steering column protective layer 180 to obtain a shielding plate 132.

[0146] The formation of the covering layer 170 and the steering column protective layer 180 is the same as in the previous embodiment. Furthermore, the steering column 131 and the shielding plate 132 are also obtained by electroplating and depositing the seed layer. The difference is that in this embodiment, the steering column 131 is first deposited on the surface of the covering layer 170, and then the steering column protective layer 180 is formed. Finally, the shielding plate 132 is deposited on the surface of the steering column protective layer 180. Therefore, the steering column 131 and the shielding plate 132 are formed separately.

[0147] Compared to the previous embodiment, the magnetic sensor 100 of this embodiment omits the step of providing the stop layer 171, further simplifying the process. Furthermore, since the stop layer 171 is not present between the first TMR element 120 and the soft magnetic structure 130, the resulting magnetic sensor 100 has a higher detection sensitivity.

[0148] Furthermore, in this embodiment, the step of forming a covering layer 170 on the surface of the coating layer 160 includes: opening a second through hole 172 that penetrates the covering layer 170 along the thickness direction, and the second through hole 172 exposes the first metal layer 141; the step of depositing a soft magnetic material on the surface of the covering layer 170 and obtaining a steering column 131 includes: depositing a soft magnetic material in the second through hole 172 and obtaining a soft magnetic layer 143 stacked with the first metal layer 141, and the first metal layer 141 and the soft magnetic layer 143 together constitute the signal communication structure 140.

[0149] Similarly, after the cover layer 170 is formed, the second through hole 172 can be formed by laser or chemical etching. While the soft magnetic material is being deposited on the surface of the cover layer 170, the soft magnetic material can be deposited within the second through hole 172 using the same process to form the soft magnetic layer 143. This eliminates the need for additional steps in forming the signal communication structure 140, thereby reducing the processing cost of the magnetic sensor 100.

[0150] Furthermore, in this embodiment, the magnetic sensor fabrication method further includes forming a shielding plate protective layer 190 on the surface of the steering column protective layer 180, covering the shielding plate 132. The shielding plate protective layer 190 can be made of the same material and formed in the same manner as the carrier layer 150. After forming, the signal communication structure 140 can be exposed by etching. The shielding plate protective layer 190 protects the soft magnetic structure 130.

[0151] In this embodiment, the magnetic sensor fabrication method further includes forming a third metal layer 144 on the surface of the soft magnetic layer 143 of the signal communication structure 140. The third metal layer 144 is exposed at the outermost portion of the magnetic sensor 100 and can enhance the electrical conductivity of the signal communication structure 140.

[0152] The magnetic sensor fabrication method described above produces a magnetic sensor 100 having a soft magnetic structure 130. The shielding plate 132 exhibits minimal demagnetization within the XY plane, making it easily magnetized by the magnetic field within the XY plane. When the external magnetic field within the XY plane magnetizes the shielding plate 132, an induced magnetic field is generated in the opposite direction of the external magnetic field, thereby canceling out the external magnetic field and providing a shielding effect. The shielding plate 132 exhibits significant demagnetization in the Z-axis direction, making it less easily magnetized by the magnetic field in the Z-axis direction. Therefore, the shielding plate 132 does not affect the external magnetic field in the Z-axis direction to be detected. That is, the external magnetic field in the Z-axis direction to be detected is not shielded by the shielding plate 132 and can be smoothly steered by the steering column 131. Thus, by providing the soft magnetic structure 130, the Z-axis magnetic field can be detected while also providing a shielding effect on the magnetic field within the XY plane, thereby avoiding cross-axis interference in the detection of the Z-axis magnetic field.

[0153] Furthermore, the magnetic sensor 100 also includes a second TMR component. By preparing the first TMR component 120 and the second TMR component, the external out-of-plane magnetic field and the external in-plane magnetic field can be detected respectively, so that the magnetic sensor 100 can realize the detection of the external space magnetic field.

[0154] 10 and 11 , a magnetic sensor 100 ′ in a second embodiment of the present invention includes a substrate 110 ′, a plurality of first TMR elements 120 ′, a soft magnetic structure 130 ′, and an adjustment layer 140 ′.

[0155] The substrate 110' can support the multiple first TMR components 120', the soft magnetic structure 130', and the adjustment layer 140'. The multiple first TMR components 120', the soft magnetic structure 130', and the adjustment layer 140' are all arranged on one side of the substrate 110'. The first TMR components 120' can be composed of one or more magnetic tunnel junctions connected in series. The structure and function of the magnetic tunnel junction are the same as those in the first embodiment and are not described again here. The soft magnetic structure 130' cooperates with the multiple first TMR components 120' and has the same function as the soft magnetic structure 130 in the first embodiment and is not described again here. The adjustment layer 140' also cooperates with the multiple first TMR components 120' to generate a magnetic field to regulate the multiple first TMR components 120'. The magnetic field can be a reset magnetic field to magnetically reset the multiple first TMR components 120', or it can be a self-test magnetic field to detect and calibrate the multiple first TMR components 120'.

[0156] In this embodiment, the magnetic sensor 100' further includes a signal communication structure 150'. The plurality of first TMR elements 120' are electrically connected to the signal communication structure 150'. The analog signals generated by the plurality of first TMR elements 120' detecting the external out-of-plane magnetic field in the switching direction can be output through the signal communication structure 150' for further processing to generate a digital signal. Furthermore, the adjustment layer 140' can also be electrically connected to the signal communication structure 150' and generate a corresponding magnetic field based on the adjustment signal transmitted by the signal communication structure 150'.

[0157] In this embodiment, the substrate 110' includes a CMOS board 111' and a signal layer 112' covering the CMOS board 111'. The CMOS board 111' integrates an integrated circuit composed of a number of MOS tubes, which can process analog signals, and the signal layer 112' can realize functions such as receiving analog signals and outputting digital signals. The signal layer 112' can be in the form of a metal layer, an integrated circuit layer, etc. Among them, the metal layer can be a copper layer, an aluminum layer, a copper alloy layer or an aluminum alloy layer. In this way, the analog signal can be transmitted to the substrate 110' and processed by the substrate 110' to obtain a digital signal reflecting the external out-of-plane magnetic field to be detected, thereby completing the detection of the external out-of-plane magnetic field. The digital signal can also be transmitted to the outside of the magnetic sensor 100' through the signal communication structure 150' to facilitate reading or calling.

[0158] By integrating the substrate 110 ′ with the CMOS board 111 ′ and the signal layer 112 ′, the magnetic sensor 100 ′ can be formed in a single chip manner without the need for an additional ASIC chip for signal processing, which helps to reduce the package size of the magnetic sensor 100 ′.

[0159] Furthermore, in this embodiment, the signal layer 112' is at least partially configured as a coil layer. When current flows through the coil layer, it generates a magnetic field. This magnetic field can magnetize the free layer of the magnetic tunnel junction in the first TMR component 120', thereby achieving magnetic resetting of the magnetic sensor 100'. Furthermore, the theoretical value of the magnetic field strength generated by the coil layer can be calculated based on parameters such as the number of coil turns and the current. Therefore, by comparing the measured value of the magnetic sensor 100' with the theoretical value, the magnetic sensor 100' can also be self-tested, thereby ensuring the accuracy of the magnetic sensor 100'.

[0160] Considering that the multiple first TMR components 120' can only detect in-plane magnetic fields parallel to the first TMR components 120', and cannot detect out-of-plane magnetic fields perpendicular thereto, the soft magnetic structure 130' is used to change the magnetic field direction of the external out-of-plane magnetic field to be detected to an in-plane direction for detection by the multiple first TMR components 120'. Furthermore, the soft magnetic structure 130' shields the external in-plane magnetic field to avoid detection outputs caused by the external in-plane magnetic field. In other words, the soft magnetic structure 130' can eliminate or greatly reduce interference from the external in-plane magnetic field, and the detection outputs generated by the multiple first TMR components 120' only correspond to, or substantially correspond to, the external out-of-plane magnetic field to be detected.

[0161] The soft magnetic structure 130' is formed from a soft magnetic material, such as iron, iron-silicon alloy, ferrite, or iron-nickel alloy, and is easily magnetized and demagnetized. The soft magnetic structure 130' includes a steering column 131' and a shielding plate 132'. The steering column 131' is used to redirect the magnetic field of an external out-of-plane magnetic field to be detected to an in-plane direction, while the shielding plate 132' is used to shield the external in-plane magnetic field. The steering column 131' and the shielding plate 132' are spaced apart, with the adjustment layer 140' and the plurality of first TMR assemblies 120' disposed between the steering column 131' and the shielding plate 132'. The steering column 131' extends perpendicular to the shielding plate 132', that is, perpendicular to the plurality of TMR assemblies 120'. The shielding plate 132' is parallel to the plurality of first TMR assemblies 120'. The orthographic projections of the steering column 131' and the plurality of first TMR assemblies 120' on the plane of the shielding plate 132' are located within the shielding plate 132'.

[0162] The direction perpendicular to the first TMR assembly 120' is defined as the Z-axis direction, and the two directions parallel to the first TMR assembly 120' and perpendicular to each other are defined as the X-axis direction and the Y-axis direction. Specifically, the shielding plate 132' is parallel to the XY plane, the steering column 131' extends along the Z-axis direction, the orthographic projections of the steering column 131' and the plurality of first TMR assemblies 120' in the XY plane are located within the orthographic projection of the shielding plate 132' in the XY plane, and the adjustment layer 140' and the plurality of first TMR assemblies 120' are located between the shielding plate 132' and the steering column 131' in the Z-axis direction.

[0163] The steering column 131' has a three-dimensional shape and can be cylindrical, rectangular, or prismatic. As shown in Figure 11, the steering column 131' can change the magnetic field direction of the external out-of-plane magnetic field to be detected to the in-plane direction. Specifically, it can change the magnetic field direction of the external magnetic field to be detected in the Z-axis direction to the X-axis direction or the Y-axis direction. Because the deflection of magnetic flux lines is more obvious at the edge of the steering column 131', the multiple first TMR assemblies 120' are generally distributed along the circumference of the steering column 131' and opposite the edge of the steering column 131.

[0164] The thickness of shielding plate 132', or its dimension along the Z-axis, is relatively small, typically less than 10 microns. However, its length and width, or its dimensions along the X- and Y-axis, are relatively large, typically exceeding 100 microns. Therefore, shielding plate 132' can be considered a relatively thin sheet. This allows shielding plate 132' to experience minimal demagnetization in the XY plane, making it easily magnetized by magnetic fields in that plane. However, shielding plate 132' experiences significant demagnetization in the Z-axis, making it less susceptible to magnetization by magnetic fields along that direction.

[0165] Because shielding plate 132' is easily magnetized by magnetic fields within the XY plane, it can shield external magnetic fields within the XY plane. For example, if an external magnetic field in the positive X-axis direction is applied above shielding plate 132', shielding plate 132' is easily magnetized by this field. After magnetization, the magnetic flux lines within shielding plate 132' are also oriented in the positive X-axis direction. Given that the magnetic flux lines are closed, the magnetic flux lines below shielding plate 132' should be oriented in the negative X-axis direction. In other words, an induced magnetic field is generated below shielding plate 132' that is opposite in direction to the external magnetic field, thereby canceling out the external magnetic field and providing a shielding effect. Furthermore, because shielding plate 132' is not easily magnetized by magnetic fields in the Z-axis direction, it does not affect the external magnetic field to be detected in the Z-axis direction. Specifically, the external magnetic field in the Z-axis direction is not shielded by shielding plate 132' and can be smoothly steered by steering column 131'.

[0166] In addition, it should be noted that the closer to the edge of the shielding plate 132', the weaker the shielding effect for the magnetic field in the external XY plane. In order to ensure the shielding effect for the magnetic field in the external XY plane, the distance between the edge of the orthographic projection of each first TMR component 120' on the surface of the shielding plate 132' and the edge of the shielding plate 132' is greater than or equal to 10 microns.

[0167] The adjustment layer 140' is at least partially configured as a coil layer. The coil layer of the adjustment layer 140' is capable of generating a magnetic field when energized. This magnetic field can be a reset magnetic field. The magnetic field of the coil layer of the adjustment layer 140' can magnetize the free layer of the magnetic tunnel junction in the first TMR component 120', thereby achieving magnetic reset of the magnetic sensor 100'. This magnetic field can be a self-test magnetic field. The theoretical value of the magnetic field strength generated by the coil layer can be calculated based on parameters such as the number of coil turns and the current. Therefore, by comparing the measured value of the magnetic sensor 100' with the theoretical value, the magnetic sensor 100' can also be self-tested, thereby ensuring the accuracy of the magnetic sensor 100'.

[0168] Moreover, the adjustment layer 140' and the first TMR component 120' are both located between the shielding plate 132' and the steering column 131'. Therefore, the adjustment layer 140' and the first TMR component 120' are closer and less blocked, so the magnetic reset and calibration effect of the magnetic sensor 100' is better through the adjustment layer 140'.

[0169] In this embodiment, the adjustment layer 140 ′ is located on a side of the plurality of first TMR components 120 ′ facing away from the steering column 131 ′, that is, the adjustment layer 140 ′ is located between the plurality of first TMR components 120 ′ and the shielding plate 132 ′.

[0170] As shown in Figure 13, in this embodiment, a steering column protection layer 160' is formed on the surface of the substrate 110'. The steering column protection layer 160' is provided with a first blind hole 161'. The first blind hole 161' extends along the thickness direction of the steering column protection layer 160' but does not penetrate through it. A steering column 131' is formed in the first blind hole 161' by a soft magnetic material. A bearing layer 170' is formed on the surface of the steering column protection layer 160' to cover the steering column 131'.

[0171] The steering column protective layer 160' serves as an insulating layer and protects the signal layer 112' and the steering column 131'. The supporting layer 160' is generally made of the same material and formed in the same manner as the steering column protective layer 160'. It serves as an insulating layer and protects the steering column 131', as well as supporting the subsequently formed first TMR assembly 120'. The steering column protective layer 160' can be made of silicon oxide (SiO2), polyimide (PI), fluorine-containing silicon oxide (F-SiO2), aluminum oxide (AlOx), etc., and can be formed on the substrate 110' by coating, physical vapor deposition (PVD), chemical vapor deposition (CVD), or other methods.

[0172] Furthermore, in this embodiment, the steering column protection layer 160' is provided with a fourth through hole 162' extending through the thickness direction, and a soft magnetic layer 152' formed by a soft magnetic body and extending to the substrate 110' is formed in the fourth through hole 162'; the supporting layer 170' is provided with a fifth through hole 171' exposing the soft magnetic layer 152'.

[0173] Specifically, the soft magnetic layer 152' and the steering column 131' can be formed simultaneously. A seed layer is first deposited, and then a soft magnetic material is electroplated on the seed layer. After the electroplating, the excess seed layer and soft magnetic material are etched away. This leaves the soft magnetic material within the first blind hole 161' as the steering column 131', while the soft magnetic material within the fourth through hole 162' as the soft magnetic layer 152'. The soft magnetic layer 152' can serve as part of the signal communication structure 150' and can be electrically connected to the substrate 110'.

[0174] As shown in Figure 14, in this embodiment, a metal substrate layer 121' is formed on the surface of the carrying layer 170', and a plurality of magnetic tunnel junctions are arranged on the metal substrate layer 121'; a coating layer 180' is also formed on the surface of the carrying layer 170', which covers the metal substrate layer 121' and exposes a plurality of magnetic tunnel junctions; a first metal layer 151' is formed on the surface of the coating layer 180'; and a plurality of magnetic tunnel junctions are connected in series through the metal substrate layer 121' and the first metal layer 151' to form a plurality of first TMR components 120'.

[0175] The metal substrate layer 121' can be deposited on the carrier layer 170' by first depositing and then etching. The first metal layer 151' can also be deposited on the cladding layer 180' by first depositing and then etching. Multiple magnetic tunnel junctions are connected in series via the metal substrate layer 121' and the first metal layer 141' to form the first TMR component 120'. The series / parallel connection between multiple TMR components 120' is also achieved via the metal substrate layer 121' and the first metal layer 141'.

[0176] Furthermore, in this embodiment, the cladding layer 180' defines a sixth through-hole 181' that exposes the fifth through-hole 171'. The first metal layer 151' extends through the sixth through-hole 181' and the fifth through-hole 171' to the soft magnetic layer 152'. The plurality of first TMR elements 120' are electrically connected to the substrate 110' via the first metal layer 151' and the soft magnetic layer 152'. Thus, a portion of the first metal layer 151' is used to implement the series connection of the plurality of magnetic tunnel junctions and the series / parallel connection of the plurality of first TMR elements 120', while another portion can serve as part of the signal communication structure 150', electrically connecting the plurality of first TMR elements 120' to the substrate 110' via the signal communication structure 150'.

[0177] In this way, the analog signal generated by the first TMR component 120' in detecting the magnetic field can be transmitted to the substrate 110' and processed by the substrate 110' to obtain a digital signal reflecting the external out-of-plane magnetic field to be detected, thereby completing the detection of the external out-of-plane magnetic field.

[0178] In this embodiment, a cover layer 190' is formed on the surface of the cladding layer 180', and an adjustment layer 140' is formed on the surface of the cover layer 190'. The cover layer 190' can be used for insulation and can protect the plurality of first TMR components 120'.

[0179] As shown in FIG. 15 , in this embodiment, an adjustment protection layer 1100 ′ covering the adjustment layer 140 ′ is formed on the surface of the cover layer 190 ′. A shielding plate 132 ′ formed of a soft magnetic material is formed on the surface of the adjustment protection layer 1100 ′.

[0180] The regulating and protective layer 1100' also serves as an insulator and protects the regulating layer 140'. Specifically, a seed layer is first deposited on the surface of the regulating and protective layer 1100'. A soft magnetic material is then electroplated onto the seed layer. After the electroplating, the excess seed layer and soft magnetic material are etched away, leaving a shielding plate 132' formed of the soft magnetic material on the surface of the regulating and protective layer 1100'.

[0181] Furthermore, in this embodiment, the covering layer 190' is provided with a seventh through hole 191' exposing the first metal layer 151', and a fourth metal layer 153' stacked with the first metal layer 151' is formed in the seventh through hole 191'. The fourth metal layer 153', the first metal layer 151' and the soft magnetic layer 152' together constitute a signal communication structure 150' electrically connected to the multiple first TMR components 120'.

[0182] When forming the adjustment layer 140' on the surface of the covering layer 190', the same process can be used to form the fourth metal layer 153' in the seventh through hole 191'. In other words, the material and molding method of the fourth metal layer 153' can be the same as those of the adjustment layer 140'. After the same metal layer is deposited and then patterned, part of it constitutes the adjustment layer 140' and part of it constitutes the fourth metal layer 153'. It can be seen that since the fourth metal layer 153' and the soft magnetic layer 152' can be formed in the same process as the adjustment layer 140' and the steering column 131' respectively, the formation of the signal communication structure 150' does not require additional processes, thereby helping to reduce the processing cost of the magnetic sensor 100'.

[0183] Obviously, in other embodiments, the substrate 110 ′ may also have its own connector for digital signal output, thereby serving as the signal communication structure 150 ′.

[0184] One end of the signal communication structure 150' (the soft magnetic layer 152') is electrically connected to the substrate 110', while the other end (the fourth metal layer 153') is exposed to the outside of the magnetic sensor 100'. Therefore, a digital signal reflecting the external out-of-plane magnetic field to be detected can also be transmitted to the outside of the magnetic sensor 100' via the signal communication structure 150' for easy reading or access. Specifically, the adjustment protective layer 1100' is provided with an eighth through-hole 1101' that exposes the fourth metal layer 153'.

[0185] In addition, in this embodiment, a shielding plate protection layer 1120' is formed on the surface of the adjustment protection layer 1100', which covers the shielding plate 132' and exposes the fourth metal layer 153'. The shielding plate protection layer 1120' can provide protection for the shielding plate 132'.

[0186] In this embodiment, the magnetic sensor 100' further includes a plurality of second TMR components (not shown), which are disposed on one side of the substrate 110'. The orthographic projections of the plurality of second TMR components in the plane where the substrate 110' is located are outside the range of the orthographic projections of the soft magnetic structure 130' in the plane where the substrate 110' is located.

[0187] The second TMR component is also composed of one or more magnetic tunnel junctions connected in series. It is understandable that the second TMR component can be formed using the same process as the first TMR component 120. That is, multiple magnetic tunnel junctions can be formed, of which a portion of the magnetic tunnel structures constitute the first TMR component 120' and another portion of the magnetic tunnel structures constitute the second TMR component. By setting the orthographic projections of the multiple second TMR components in the plane where the substrate 110' is located to be outside the range of the orthographic projections of the soft magnetic structure 130' in the plane where the substrate 110' is located, the soft magnetic structure 130' has no effect on the multiple second TMR components, thereby allowing the multiple second TMR components to detect external in-plane magnetic fields. Furthermore, a portion of the second TMR components is used to detect the X-axis magnetic field, and another portion is used to detect the Y-axis magnetic field.

[0188] The second TMR component is also electrically connected to the signal communication structure 150'. The analog signal generated by the second TMR component when detecting the external in-plane magnetic field can also be transmitted to the substrate 110' via the signal communication structure 150'. The substrate 110' processes the signal to generate a digital signal reflecting the external in-plane magnetic field to be detected, thereby completing the detection of the external in-plane magnetic field. Furthermore, this digital signal can also be transmitted to the outside of the magnetic sensor 100' via the signal communication structure 150' for easy reading or access.

[0189] In the aforementioned magnetic sensor 100', the shielding plate 132' exhibits minimal demagnetization in a direction parallel to the first TMR assembly 120' (the XY plane), making it easily magnetized by the magnetic field within the XY plane. When the external magnetic field within the XY plane magnetizes the shielding plate 132', an induced magnetic field is generated in the opposite direction of the external magnetic field, thereby canceling out the external magnetic field and providing a shielding effect. The shielding plate 132' exhibits significant demagnetization in a direction perpendicular to the first TMR assembly 120' (the Z axis), making it less easily magnetized by the magnetic field in the Z axis. Therefore, the shielding plate 132' does not affect the external magnetic field in the Z axis to be detected. Specifically, the external magnetic field in the Z axis to be detected is not shielded by the shielding plate 132' and can be smoothly steered by the steering column 131'. Thus, by providing the soft magnetic structure 130', the Z axis magnetic field can be detected while also shielding the magnetic field in the XY plane, thereby preventing cross-axis interference in the detection of the Z axis magnetic field. Therefore, the magnetic sensor 100 ′ can significantly improve detection accuracy.

[0190] Furthermore, when current flows through the coil layer of the adjustment layer 140', a magnetic field can be generated. The magnetic field can be a reset magnetic field, and the magnetic field of the coil layer of the adjustment layer 140' can magnetize the free layer of the magnetic tunnel junction in the first TMR component 120', thereby achieving magnetic reset of the magnetic sensor 100'. The magnetic field can be a self-test magnetic field, and the theoretical value of the magnetic field strength of the magnetic field generated by the coil layer can be calculated by parameters such as the number of coil turns and the current size. Under the premise of clearing the environmental magnetic field, by comparing the measured value of the magnetic sensor 100' with the theoretical value, the magnetic sensor 100' can also be self-tested, thereby ensuring the precise measurement accuracy of the magnetic sensor 100'.

[0191] The magnetic sensor 100' in the second embodiment differs primarily from the magnetic sensor 100 in the first embodiment in that, in the first embodiment, the first TMR component 120, steering column 131, and shielding plate 132 are sequentially arranged in a direction away from the substrate 110; whereas, in the second embodiment, the steering column 131', first TMR component 120', and shielding plate 132' are sequentially arranged in a direction away from the substrate 110'. Therefore, the position and specific construction of other features, such as the supporting layer, covering layer, and cladding layer, require adaptive adjustment. The various technical features of the first and second embodiments may be arbitrarily combined, provided no inconsistencies exist. For example, the adjustment layer 140' in the second embodiment may also be applied to the first embodiment. Due to space limitations, this application does not describe all possible combinations of the various technical features in the aforementioned different embodiments.

[0192] In addition, this embodiment also provides a method for manufacturing a magnetic sensor, which is used to manufacture the magnetic sensor 100 ′ shown in FIG. 10 .

[0193] Please refer to FIG. 12 , the method for preparing a magnetic sensor in this embodiment includes steps S201 ′ to S203 ′. In particular:

[0194] Step S201 ′: forming a steering column 131 ′ formed of a soft magnetic material on one side of the substrate 110 ′.

[0195] Step S202 ′: forming an adjustment layer 140 ′ and a plurality of first TMR components 120 ′ on a side of the steering column 131 ′ facing away from the substrate 110 ′, wherein at least a portion of the adjustment layer 140 ′ is configured as a coil layer.

[0196] Step S203': forming a shielding plate 132' formed of a soft magnetic material on the side of the multiple first TMR components 120' and the adjustment layer 140' facing away from the steering column 131', wherein the shielding plate 132' is parallel to the multiple first TMR components 120', and the steering column 131' extends in a direction perpendicular to the shielding plate 132'. The orthographic projections of the multiple first TMR components 120' and the steering column 131' in the plane where the surface of the shielding plate 132' is located are located within the range of the shielding plate 132'.

[0197] It should be noted that the above steps S201 ′ to S203 ′ may be executed sequentially, or simultaneously if conditions permit, and the execution order may be adjusted if conditions permit.

[0198] Please also refer to Figure 13. The above step S201' includes: forming a steering column protection layer 160' on the surface of the substrate 110', and opening a first blind hole 161' that does not penetrate the steering column protection layer 160' along the thickness direction; and depositing a soft magnetic material in the first blind hole 161' to form a steering column 131' in the first blind hole 161'.

[0199] Furthermore, in this embodiment, a steering column protection layer 160' is formed on the surface of the substrate 110', and in the process of opening a first blind hole 161' that does not penetrate the steering column protection layer 160' in the thickness direction, a fourth through hole 162' that penetrates the steering column protection layer 160' in the thickness direction is formed on the surface of the steering column protection layer 160'; in the process of depositing a soft magnetic material in the first blind hole 161' to form a steering column 131' in the first blind hole 161', a soft magnetic material is deposited in the fourth through hole 162' to form a soft magnetic layer 152' extending to the substrate 110' in the fourth through hole 162'.

[0200] Specifically, the fourth through hole 162' can be formed in the same process as the first blind hole 161', or the first blind hole 161' and the second blind hole can be formed in the same process, and then the second blind hole is further penetrated in the thickness direction to form the fourth through hole 162'. The soft magnetic layer 152' can be formed in the same process as the steering column 131'. When the soft magnetic layer 152' and the steering column 131' are formed at the same time, a seed layer is first deposited, and then the soft magnetic material is electroplated based on the seed layer. After the electroplating deposition, the excess seed layer and soft magnetic material are etched away, so that the soft magnetic material filled in the first blind hole 161' constitutes the steering column 131', and the soft magnetic material filled in the fourth through hole 162' constitutes the soft magnetic layer 152'. The soft magnetic layer 152' can be electrically connected to the substrate 110'.

[0201] Please refer to Figure 14. In this embodiment, the above-mentioned step S202' includes: forming a supporting layer 170' covering the steering column 131' on the surface of the steering column protection layer 160'; sequentially forming a metal substrate layer 121' and a TMR film 120a' on the surface of the supporting layer 170'; etching the TMR film 120a' to obtain a plurality of magnetic tunnel junctions; forming a cladding layer 180' on the surface of the supporting layer 170', which covers the metal substrate layer 121' and exposes the plurality of magnetic tunnel junctions; forming a first metal layer 151' on the surface of the cladding layer 180', and the plurality of magnetic tunnel junctions are connected in series through the metal substrate layer 121' and the first metal layer 151' to form a plurality of first TMR components 120'.

[0202] Specifically, the TMR film 120a' has a multilayer structure, generally comprising a ferromagnetic layer, a tunnel barrier layer, a ferromagnetic layer, and an antiferromagnetic layer, consistent with the layered structure of a magnetic tunnel junction. The antiferromagnetic layer is deposited on the metal substrate layer 121', followed by the ferromagnetic layer, the tunnel barrier layer, and the ferromagnetic layer. After the TMR film 120a' is formed, it is patterned to form multiple magnetic tunnel junctions.

[0203] The metal substrate layer 121' can be deposited on the carrier layer 170' by first depositing and then etching. The first metal layer 151' can also be deposited on the cladding layer 180' by first depositing and then etching. Multiple magnetic tunnel junctions are connected in series via the metal substrate layer 121' and the first metal layer 151' to form the first TMR component 120'. The series / parallel connection between multiple TMR components 120' is also achieved via the metal substrate layer 121' and the first metal layer 151'. This demonstrates that the processing efficiency of the first TMR components 120' is high, and the consistency between the multiple first TMR components 120' is good.

[0204] It should be noted that, in other embodiments, a plurality of pre-formed first TMR components 120 ′ may also be disposed on the carrier layer 170 ′ in a patch manner.

[0205] Furthermore, in this embodiment, during or after etching the TMR film 120a' and obtaining a plurality of magnetic tunnel junctions, a fifth through hole 171' exposing the soft magnetic layer 152' is opened on the carrying layer 170'; during the process of forming the cladding metal substrate layer 121' on the surface of the carrying layer 170' and exposing the cladding layer 180' of the plurality of magnetic tunnel junctions, a sixth through hole 181' exposing the fifth through hole 171' is opened on the cladding layer 180'; during the process of forming the first metal layer 151' on the surface of the cladding layer 180', the first metal layer 151' extends to the soft magnetic layer 152' through the sixth through hole 181' and the fifth through hole 171'.

[0206] In other words, a portion of the first metal layer 151' is used to achieve the series connection of multiple magnetic tunnel junctions and the series / parallel connection of multiple first TMR components 120', while the other portion can serve as a bridge between the multiple first TMR components 120' and the substrate 110', electrically connecting the multiple first TMR components 120' to the substrate 110' through the first metal layer 151' and the soft magnetic layer 152'. In this way, the analog signals generated by the first TMR components 120' in response to magnetic field detection can be transmitted to the substrate 110' and processed by the substrate 110' to generate digital signals reflecting the external out-of-plane magnetic field to be detected, thereby completing the detection of the external out-of-plane magnetic field.

[0207] Before forming the cladding layer 180', the positions corresponding to the first TMR element 120' and the fifth through hole 171' can be covered with photoresist 300' by exposure, development and etching. After the cladding layer 180' is formed, the photoresist is removed to expose the first TMR element 120' and the fifth through hole 171'.

[0208] In this embodiment, the step S202 further includes: forming a covering layer 190 ′ on the surface of the cladding layer 180 ′; and forming an adjustment layer 140 ′ on the surface of the covering layer 190 ′.

[0209] 15 , in this embodiment, the step S203 ′ includes: forming an adjustment protection layer 1100 ′ covering the adjustment layer 140 ′ on the surface of the cover layer 190 ′; and depositing a soft magnetic material on the surface of the adjustment protection layer 1100 ′ to form a shielding plate 132 ′ on the surface of the adjustment protection layer 1100 ′.

[0210] A soft magnetic material is deposited on the surface of the adjustment protective layer 1100' to form a shielding plate 132' on the surface of the adjustment protective layer 1100'. Specifically, a seed layer is first deposited on the surface of the adjustment protective layer 1100', and then the soft magnetic material is electroplated based on the seed layer. After the electroplating deposition, the excess seed layer and soft magnetic material are etched away, so that the soft magnetic material located on the surface of the adjustment protective layer 1100' constitutes the shielding plate 132'.

[0211] Furthermore, in this embodiment, in the process of forming the covering layer 190' on the surface of the cladding layer 180', a seventh through hole 191' exposing the first metal layer 151' is opened on the covering layer 190'; in the process of forming the adjustment layer 140' on the surface of the covering layer 190', a fourth metal layer 153' stacked with the first metal layer 151' is formed in the seventh through hole 191'; the fourth metal layer 153', the first metal layer 151' and the soft magnetic layer 152' together constitute the signal communication structure 150'.

[0212] Specifically, when the adjustment layer 140' is formed on the surface of the covering layer 190', the fourth metal layer 153' can be formed in the seventh through hole 191' using the same process. In other words, the material and molding method of the fourth metal layer 153' can be the same as those of the adjustment layer 140'. After the same metal layer is deposited and then patterned, part of it constitutes the adjustment layer 140' and part of it constitutes the fourth metal layer 153'. As can be seen from this, since the fourth metal layer 153' and the soft magnetic layer 152' can be formed in the same process as the adjustment layer 140' and the steering column 131' respectively, the formation of the signal communication structure 150' does not require additional processes, thereby helping to reduce the processing cost of the magnetic sensor 100'.

[0213] During the process of forming the adjustment protection layer 1100' covering the adjustment layer 140' on the surface of the covering layer 190', an eighth through hole 1101' is opened on the adjustment protection layer 1100' to expose the fourth metal layer 153'. Since one end of the signal communication structure 150' (the soft magnetic layer 152') is electrically connected to the substrate 110', the other end (the fourth metal layer 153') is exposed to the outside of the magnetic sensor 100' through the eighth through hole 1101'. Therefore, the digital signal reflecting the external out-of-plane magnetic field to be detected can also be transmitted to the outside of the magnetic sensor 100' through the signal communication structure 150' to facilitate reading or calling.

[0214] Obviously, in other embodiments, the substrate 110 ′ may also have its own connector for digital signal output, thereby serving as the signal communication structure 150 ′.

[0215] The above step S203' generally further includes forming a shielding plate protective layer 1120' on the surface of the adjustment protective layer 1100', the shielding plate protective layer 1120' covering the shielding plate 132' and exposing the fourth metal layer 153'. The shielding plate protective layer 1120' can provide protection for the shielding plate 132'.

[0216] In addition, in this embodiment, the above-mentioned step S202' also includes: multiple magnetic tunnel junctions are further connected in series through the metal substrate layer 121' and the first metal layer 151' to form multiple second TMR components, and the orthographic projections of the multiple second TMR components in the plane where the substrate 110' is located are located outside the range of the orthographic projection of the shielding plate 132' in the plane where the substrate 110' is located.

[0217] Specifically, the second TMR component can be formed using the same process as the first TMR component 120'. That is, a plurality of magnetic tunnel junctions can be formed, wherein a portion of the magnetic tunnel structures constitute the first TMR component 120', and another portion of the magnetic tunnel structures constitute the second TMR component. The second TMR component is also composed of one or more magnetic tunnel structures connected in series. By setting the orthographic projections of the plurality of second TMR components in the plane where the substrate 110' is located to be outside the range of the orthographic projections of the soft magnetic structure 130' in the plane where the substrate 110' is located, the soft magnetic structure 130' does not act on the plurality of second TMR components, thereby enabling the plurality of second TMR components to detect the external in-plane magnetic field. Furthermore, a portion of the second TMR components is used to detect the X-axis magnetic field, and another portion is used to detect the Y-axis magnetic field.

[0218] The second TMR component can also be electrically connected to the signal communication structure 150'. The analog signal generated by the second TMR component when detecting the external in-plane magnetic field can also be transmitted to the substrate 110' via the signal communication structure 150'. The substrate 110' processes the signal to generate a digital signal reflecting the external in-plane magnetic field to be detected, thereby completing the detection of the external in-plane magnetic field. Furthermore, the digital signal can also be transmitted to the outside of the magnetic sensor 100' via the signal communication structure 150' for easy reading or access.

[0219] The above-described magnetic sensor fabrication method yields a magnetic sensor 100' having a shielding plate 132' with minimal demagnetization in the XY plane, making it easily magnetized by the magnetic field within the XY plane. When the external magnetic field within the XY plane magnetizes the shielding plate 132', it generates an induced magnetic field with a direction opposite to that of the external magnetic field, thereby canceling out the external magnetic field and providing a shielding effect. The shielding plate 132' exhibits significant demagnetization in the Z axis, making it less easily magnetized by the magnetic field in the Z axis. Therefore, the shielding plate 132' does not affect the external magnetic field in the Z axis to be detected. Specifically, the external magnetic field in the Z axis to be detected is not shielded by the shielding plate 132' and can be smoothly steered by the steering column 131'. Thus, by forming the steering column 131' and shielding plate 132' from a soft magnetic material, the magnetic sensor 100' can simultaneously detect the Z axis magnetic field and shield the axial magnetic field in the XY plane, thereby preventing cross-axis interference in the detection of the Z axis magnetic field.

[0220] Furthermore, when current flows through the coil layer of the adjustment layer 140', a magnetic field can be generated. The magnetic field can be a reset magnetic field, and the magnetic field of the coil layer of the adjustment layer 140' can magnetize the free layer of the magnetic tunnel junction in the first TMR component 120', thereby achieving magnetic reset of the magnetic sensor 100'. The magnetic field can be a self-test magnetic field, and the theoretical value of the magnetic field strength of the magnetic field generated by the coil layer can be calculated by parameters such as the number of coil turns and the current size. Under the premise of clearing the environmental magnetic field, by comparing the measured value of the magnetic sensor 100' with the theoretical value, the magnetic sensor 100' can also be self-tested, thereby ensuring the precise measurement accuracy of the magnetic sensor 100'.

[0221] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0222] The above-described embodiments merely illustrate several implementations of the present invention, and while their descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent. It should be noted that a person skilled in the art would be able to make numerous variations and improvements without departing from the spirit of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the patent for this invention shall be determined by the appended claims.

Claims

1. A magnetic sensor, characterized in that, Comprising: A substrate; A plurality of first TMR components, disposed on one side of the substrate; A soft magnetic structure, the soft magnetic structure including a steering column and a shielding plate, the shielding plate being parallel to the first TMR components, the steering column extending in a direction perpendicular to the first TMR components, the shielding plate being located on a side of the steering column facing away from the plurality of first TMR components or on a side of the plurality of first TMR components facing away from the steering column; A signal communication structure, electrically connected to the plurality of first TMR components; Wherein, the orthographic projections of the plurality of first TMR components and the steering column on the plane where the surface of the shielding plate is located are within the range of the shielding plate.

2. The magnetic sensor according to claim 1, wherein The substrate includes a CMOS board and a signal layer covering the CMOS board.

3. The magnetic sensor according to claim 2, characterized in that, At least a part of the signal layer is arranged as a coil layer, and when the coil layer of the signal layer is energized, a magnetic field can be generated.

4. The magnetic sensor according to claim 1, characterized in that A bearing layer is formed on the surface of the substrate, and a first through hole penetrating in the thickness direction is formed in the bearing layer; a metal underlayer is formed on the surface of the bearing layer, and a plurality of magnetic tunnel junctions are arranged on the metal underlayer; a coating layer covering the metal underlayer and exposing the plurality of magnetic tunnel junctions and the first through hole is further formed on the surface of the bearing layer; a first metal layer is formed on the surface of the coating layer, and the first metal layer extends to the substrate through the first through hole; The plurality of magnetic tunnel junctions are connected in series through the metal underlayer and the first metal layer to form the plurality of first TMR components; the plurality of first TMR components are electrically connected to the substrate through the first metal layer.

5. The magnetic sensor according to claim 4, wherein A covering layer is formed on the surface of the coating layer; a stop layer is formed on the surface of the covering layer; a steering column protection layer is formed on the surface of the covering layer, and the steering column protection layer is provided with a third through hole exposing the stop layer; the steering column is formed by a soft magnetic body in the third through hole, and the shielding plate is formed by a soft magnetic body on the surface of the steering column protection layer.

6. The magnetic sensor according to claim 5, characterized in that, At least a part of the stop layer is arranged as a coil layer, and when the coil layer of the stop layer is energized, a magnetic field can be generated.

7. The magnetic sensor according to claim 5, characterized in that, A second through hole penetrating in the thickness direction is formed in the covering layer, and the second through hole exposes the first metal layer; a second metal layer stacked with the first metal layer is formed in the second through hole; an avoidance hole exposing the second through hole is formed in the steering column protection layer, and a soft magnetic layer formed by a soft magnetic body and stacked with the second metal layer is formed in the second through hole and the avoidance hole, and the first metal layer, the second metal layer and the soft magnetic layer together constitute the signal communication structure.

8. The magnetic sensor according to claim 4, characterized in that, A covering layer is formed on the surface of the coating layer; the steering column formed by a soft magnetic body and a steering column protection layer exposing the steering column are formed on the surface of the covering layer; the shielding plate formed by a soft magnetic body is formed on the surface of the steering column protection layer.

9. The magnetic sensor according to claim 8, wherein The covering layer is provided with a second through hole penetrating along the thickness direction, and the second through hole exposes the first metal layer; a soft magnetic layer formed by a soft magnetic body is formed in the second through hole, the steering column protection layer exposes the soft magnetic layer, and the first metal layer and the soft magnetic layer together constitute the signal communication structure.

10. The magnetic sensor according to claim 1, characterized in that, The shielding plate is located on the side of the plurality of first TMR components facing away from the steering column, and the magnetic sensor further includes an adjustment layer disposed between the plurality of first TMR components and the shielding plate. At least a part of the adjustment layer is arranged as a coil layer, and a magnetic field can be generated when the coil layer of the adjustment layer is energized.

11. The magnetic sensor according to claim 10, wherein A steering column protection layer is formed on the surface of the substrate, and the steering column protection layer is provided with a first blind hole that does not penetrate along the thickness direction; the steering column is formed by a soft magnetic body in the first blind hole; a bearing layer covering the steering column is formed on the surface of the steering column protection layer.

12. The magnetic sensor according to claim 11, characterized in that, A metal substrate layer is formed on the surface of the bearing layer, and a plurality of magnetic tunnel junctions are arranged on the metal substrate layer; a coating layer covering the metal substrate layer and exposing the plurality of magnetic tunnel junctions is further formed on the surface of the bearing layer; a first metal layer is formed on the surface of the coating layer; the plurality of magnetic tunnel junctions are connected in series through the metal substrate layer and the first metal layer to form the plurality of first TMR components.

13. The magnetic sensor according to claim 12, characterized in that, A covering layer is formed on the surface of the coating layer, and an adjustment layer is formed on the surface of the covering layer.

14. The magnetic sensor according to claim 13, characterized in that, An adjustment protection layer covering the adjustment layer is formed on the surface of the covering layer, and the shielding plate formed by a soft magnetic body is formed on the surface of the adjustment protection layer.

15. The magnetic sensor according to claim 13, characterized in that, The steering column protection layer is provided with a fourth through hole penetrating along the thickness direction, and a soft magnetic layer formed by a soft magnetic body and extending to the substrate is formed in the fourth through hole; the bearing layer is provided with a fifth through hole exposing the soft magnetic layer, the coating layer is provided with a sixth through hole exposing the fifth through hole, the first metal layer extends to the soft magnetic layer through the sixth through hole and the fifth through hole, and the plurality of first TMR components are electrically connected to the substrate through the first metal layer and the soft magnetic layer; the covering layer is provided with a seventh through hole exposing the first metal layer, and a fourth metal layer stacked with the first metal layer is formed in the seventh through hole. The fourth metal layer, the first metal layer and the soft magnetic layer together constitute a signal communication structure electrically connected to the plurality of first TMR components.

16. The magnetic sensor according to any one of claims 1-15, characterized in that, The magnetic sensor further includes a plurality of second TMR components, the plurality of second TMR components are arranged on one side of the substrate and electrically connected to the signal communication structure, and the orthographic projection of the plurality of second TMR components in the plane of the substrate is located outside the orthographic projection range of the soft magnetic structure in the plane of the substrate.

17. A method for preparing a magnetic sensor, characterized in that, Including: Step S201: Form a plurality of first TMR components on one side of the substrate; Step S202: Electrically connect the plurality of first TMR components to the signal communication structure; Step S203: Set up a soft magnetic structure including a steering column and a shielding plate. The shielding plate is parallel to the first TMR component, the steering column extends in a direction perpendicular to the first TMR component, the shielding plate is located on one side of the steering column facing away from the plurality of first TMR components or on one side of the plurality of first TMR components facing away from the steering column, and the orthographic projections of the plurality of first TMR components and the steering column in the plane of the surface of the shielding plate are within the range of the shielding plate.

18. The method for manufacturing a magnetic sensor according to claim 17, wherein The step S201 includes: forming a carrier layer on the surface of the substrate; sequentially forming a metal underlayer and a TMR thin film on the surface of the carrier layer; etching the TMR thin film to obtain a plurality of magnetic tunnel junctions, and etching the metal underlayer to form a series connection of the plurality of magnetic tunnel junctions to form the plurality of first TMR components.

19. The method for manufacturing a magnetic sensor according to claim 18, wherein, The step S202 includes: opening a first through hole penetrating the carrier layer in the thickness direction; forming a coating layer on the surface of the carrier layer to expose the plurality of first TMR components and the first through hole; forming a first metal layer on the surface of the coating layer, and the first metal layer extends through the first through hole to the substrate to electrically connect the plurality of first TMR components to the substrate.

20. The method for preparing a magnetic sensor according to claim 19, wherein, The step S203 includes: forming a covering layer on the surface of the coating layer; forming a stop layer on the surface of the covering layer; forming a steering column protection layer on the surface of the covering layer, and opening a third through hole in the steering column protection layer to expose the stop layer; depositing a soft magnetic material in the third through hole until the soft magnetic material spreads to the surface of the steering column protection layer, the soft magnetic material in the third through hole forms the steering column, and the soft magnetic material on the surface of the steering column protection layer forms the shielding plate.

21. The method for manufacturing a magnetic sensor according to claim 19, characterized in that, The step S203 includes: forming a covering layer on the surface of the coating layer; depositing a soft magnetic material on the surface of the covering layer to obtain the steering column; forming a steering column protection layer on the surface of the covering layer to expose the steering column; depositing a soft magnetic material on the surface of the steering column protection layer to obtain the shielding plate.

22. The method for manufacturing a magnetic sensor according to claim 18, characterized in that, The step S201 further includes: etching the metal underlayer to form a series connection of the plurality of magnetic tunnel junctions to form a plurality of second TMR components.

23. The method for manufacturing a magnetic sensor according to claim 22, wherein: The step S202 further includes: the coating layer also exposes the plurality of second TMR components, and the first metal layer also electrically connects the plurality of second TMR components to the substrate.

24. A method for preparing a magnetic sensor, characterized in that, Includes: Step S201': Form a plurality of first TMR components on one side of the substrate; Step S202': Electrically connect the plurality of first TMR components to a signal communication structure; Step S203': Set up a soft magnetic structure including a steering column and a shielding plate. The shielding plate is parallel to the first TMR component. The steering column extends in a direction perpendicular to the first TMR component. The shielding plate is located on one side of the steering column facing away from the plurality of first TMR components or on one side of the plurality of first TMR components facing away from the steering column. The orthographic projections of the plurality of first TMR components and the steering column on the plane where the surface of the shielding plate is located are within the range of the shielding plate.

25. The method for preparing a magnetic sensor according to claim 24, wherein The step S201' includes: forming a first passivation layer on the surface of the substrate; sequentially forming a metal buffer layer and a TMR thin film on the surface of the first passivation layer; etching the TMR thin film to obtain a plurality of magnetic tunnel junctions, and etching the metal buffer layer to serially connect the plurality of magnetic tunnel junctions to form the plurality of first TMR components.

26. The method for manufacturing a magnetic sensor according to claim 25, wherein The step S202' includes: opening a first through hole penetrating the first passivation layer in the thickness direction; forming a second passivation layer on the surface of the first passivation layer to expose the plurality of first TMR components and the first through hole; forming a first metal layer on the surface of the second passivation layer, and the first metal layer extends through the first through hole to the substrate to electrically connect the plurality of first TMR components to the substrate.

27. The method for preparing a magnetic sensor according to claim 26, wherein, The step S203' includes: forming a third passivation layer on the surface of the second passivation layer; forming a stop layer on the surface of the third passivation layer; forming a fourth passivation layer on the surface of the third passivation layer, and opening a third through hole in the fourth passivation layer to expose the stop layer; depositing a soft magnetic material in the third through hole until the soft magnetic material spreads to the surface of the fourth passivation layer. The soft magnetic material in the third through hole forms the steering column, and the soft magnetic material on the surface of the fourth passivation layer forms the shielding plate.

28. The method for preparing a magnetic sensor according to claim 26, wherein, The step S203' includes: forming a third passivation layer on the surface of the second passivation layer; depositing a soft magnetic material on the surface of the third passivation layer to obtain the steering column; forming a fourth passivation layer on the surface of the third passivation layer to expose the steering column; depositing a soft magnetic material on the surface of the fourth passivation layer to obtain the shielding plate.

29. The method for manufacturing a magnetic sensor according to claim 26, wherein The step S201' further includes: etching the metal buffer layer to serially connect the plurality of magnetic tunnel junctions to form a plurality of second TMR components.

30. The method for preparing a magnetic sensor according to claim 29, wherein: The step S202' further includes: the second passivation layer also exposes the plurality of second TMR components, and the first metal layer also electrically connects the plurality of second TMR components to the substrate.

Images