Vehicle camera with specifically configured thermally conducting material chain on a board, as well as method for mounting a vehicle camera

Abstract

An aspect of the invention relates to a vehicle camera (1) with a housing (2) and with a board (6), which is arranged in the housing (2), wherein the board (6) comprises a carrier (11) of a base material (12) and comprises a material layer (13), which is applied to the base material (12), wherein the material layer (13) has higher thermal conductivity than the base material (12), wherein the board (6) comprises a main zone (14) and at least one secondary zone (15, 16, 17, 18) and a hole (19, 20, 21, 22) for a mounting pin (9) is formed in the secondary zone (15 to 18), wherein the material layer (13) is interrupted between the main zone (14) and the secondary zone (15 to 18) in a separation area (23), such that a first material layer area (14b) and a second material layer area (15b, 16b, 17b, 18b) separated therefrom are formed, and this separation area (23) is filled with a connection material (24) at least in certain areas in the manufactured final state of the board (6) such that the material layer areas (14b, 15b, 16b, 17b, 18b) are connected by the connection material (24).

Description

[0001] Vehicle camera with specifically configured thermally conducting material chain on a board, as well as method for mounting a vehicle camera

[0002] An aspect of the invention relates to a vehicle camera with a housing and with a board, which is arranged in the housing. The board comprises a carrier or a carrier plate of a base material and at least one material layer, which is applied to the base material. The material layer has higher thermal conductivity than the base material. The board has a main zone and at least one secondary zone. In the secondary zone, a hole for attaching a mounting pin of the vehicle camera is formed. A further aspect of the invention relates to a method for mounting a vehicle camera.

[0003] Vehicle cameras are known in diverse configurations. Usually, they are very compactly constructed to be able to be installed at a vehicle as space-saving as possible. However, it is moreover required that such a vehicle camera withstands very different environmental conditions on the one hand, is formed highly functional for capturing, for example the environment of the vehicle, on the other hand. Therefore, diverse and robust members are also provided for such a vehicle camera. However, due to these requirements, waste heat can arise, which has to be dissipated, in the operation of the vehicle camera, in particular of an image sensor of the vehicle camera. Namely in order to also permanently ensure the functionality of the camera and to avoid corresponding functional impairments, for example by too high temperatures.

[0004] Therefore, a corresponding thermal management of the vehicle camera in the operation is required to provide sufficient heat dissipation in this respect. On the other hand, due to the compactness and the required components, mounting conditions are also to be complied with in the production in this context. In this context, it is then also required to avoid undesired impairments of components of the camera already during the production such that undesired functional impairments can be avoided already in the production thereby too.

[0005] It is the object of the present invention to provide a vehicle camera as well as a method for mounting such a vehicle camera, in which or by which the thermal management is improved and the functionality of the vehicle camera in the finished state is allowed in unrestricted manner. This object is solved by a vehicle camera and a method according to the independent claims.

[0006] An aspect of the invention relates to a vehicle camera with a housing and with a board, which is arranged in the housing. The board comprises a carrier or a carrier plate of a base material and at least one material layer, which is applied to the base material. The material layer has higher thermal conductivity than the base material. The board comprises a main zone and at least one secondary zone. A hole for attaching a mounting pin of the vehicle camera is formed in the secondary zone.

[0007] This material layer is interrupted between the main zone and the at least one secondary zone in a separation area. Thereby, a first material layer area of this material layer and a second material layer area of this material layer separated therefrom are formed. Therefore, these material layer areas are formed without contact with each other in their basic configuration and attachment to the base material. In the manufactured final state of the board, this separation area between the two material layer areas is filled with a connection material at least in certain areas. This filling of the separation area is such that the material layer areas are connected to each other, in particular directly connected in thermally conducting manner, by this connection material. Thereby, an own material area is materially and / or geometrically formed by this connection material, which is virtually arranged as a material connection bridge between the material layer areas in the manufactured state. Thereby, a thermally conducting connection between the material layer areas is generated by this connection material. Thereby, it is allowed that these two material layer areas and the connection material form an overall layer as a material chain, which has high thermal conductivity. Thereby, it is allowed that heat, for example waste heat, which arises in the operation of the vehicle camera from a member of the vehicle camera, such as for example an image sensor, can be dissipated from the main zone to the secondary zone via this connection material. Because this waste heat is then conducted from the first material layer area, which is formed in the main zone, to the second material layer area, which is formed in the secondary zone, via this connection material. Thereby, it is then also allowed that this waste heat can be dissipated from the board, because this waste heat can be dissipated from the board from this secondary zone via the mounting pin, which is thermally coupled, in particular directly connected, to the second material layer area. Thereby, in the manufactured final state of the vehicle camera, a highly effective thermal management for dissipating waste heat away from the board is achieved. On the other hand, however, it is also allowed that by this concept in mounting the vehicle camera, an undesirably high thermal impairment, in particular of the main zone, can be avoided. Because, it is in particular provided that thermal energy is input upon attaching the mounting pin in the hole in the area of the secondary zone. In particular if the mounting pin is for example fixed in the hole of the secondary zone by solder material, at least short-term impact of thermal energy on the board and in particular the material layer formed with higher thermal conductivity is concomitant. This is for example effected by a laser. If such a separation area would not be formed between the material layer areas, thus, this thermal impact would substantially pass over to the entire material layer in the manufacture. This would result in the fact that a heat-sensitive member in particular already mounted on the board, such as for example an image sensor, which is arranged on the main zone, could be thermally impaired and thereby the functionality of this member could optionally be impaired. In order to be able to counteract such undesired potential influences in the manufacture of the vehicle camera, in particular of the board, the separation area in the material layer is particularly advantageous because these two material layer areas are thus then completely separated from each other and are formed in specific areas of the base material, namely the main zone on the one hand and the secondary zone on the other hand. Thereby, the mounting pin can also be mounted in the secondary zone without problem by impact of thermal energy in the manufacture of the vehicle camera, since such a transfer of the thermal energy impact here required due to the manufacture does not get up to the main zone and thus to the first material layer area of this material layer. Thereby too, an improved thermal management, in particular in the area of the board, is thus particularly advantageously achieved in the manufacture.

[0008] Thus, by this concept in particular of the board and the material layer with the connection material, an improvement is achieved both for the production of the vehicle camera and then in the manufactured final state. This nevertheless satisfies the two important aspects, which are actually opposed in this sense and come into focus in different lifetime states of the vehicle camera and can be very advantageously supported by this new concept of the vehicle camera.

[0009] In an embodiment, the connection material is a meltable material. Thereby, by specific input of thermal energy into the connection material, the melting thereof is allowed in very simple manner such that this separation area is then also filled with the melting connection material and a relevant material connection between the connection material and both material layer areas occurs. Thereby, a suitable connection bridge between the material layer areas is also generated in particularly advantageous manner. In particular, the thermal conductivity of this overall system of the two material layer areas and the connection material is thereby very high. Especially the connection bridge therefore also presents a material area in this overall construct or the overall structure, which has high thermal conductivity. In particular, the connection material has a thermal conductivity, which is in a range between 80 % and 120 % of the thermal conductivity of the material layer. The connection material can be a solder material.

[0010] Thereby, the connection material is preferably also a material, which has high thermal conductivity compared to the base material. Therefore, the thermal conductivity of the connection material is also higher than the thermal conductivity of the base material.

[0011] The connection material can also be a material that distributes, especially melts away, but is not a solder material.

[0012] In an embodiment, the base material can be an epoxy material. Compared to a material layer, which comprises at least proportionally metal, it has a considerably lower thermal conductivity. Therefore, it is not required in the proposed concept to separate also this base material into specific base material layer areas. Because in the manufacture of the vehicle camera, in particular in mounting the mounting pin in the hole of the secondary zone, high thermal energy is in particular only generated for a short time. Due to the lower thermal conductivity of this base material in this respect, a situation does not occur in the manufacture, in which thermal energy would also get into the main zone via this base material to undesired extent and would thermally influence a mounted member such as for example an image sensor there. For this reason, the concept of this separation into areas is provided and required only for this mentioned material layer and also correspondingly advantageous in this respect.

[0013] In an embodiment, the connection material is electrically conductive. In particular, it is metal or a metal-containing material. Thereby, it is also achieved that the material layer, which can be correspondingly made of metal or a metal-containing material, does not only have high thermal conductivity, but also electrical conductivity.

[0014] In an embodiment, the connection material is formed as a connection strip in the manufactured final state. Thereby, a relatively narrow structure is provided. Thereby, relatively little connection material is required on the one hand to establish this connection between the material layer areas. On the other hand, a specific extensive connection of the material layer areas over a specific length is nevertheless allowed by such a strip-like shaping. In this context, this length is oriented perpendicularly to the direction, in which these material layer areas orient themselves, in particular are facing each other.

[0015] This separation area and thus in particular by this finally manufactured connection material, in particular as a connection strip, thus, a structure is provided, which is narrower in a direction, in which the first material layer area, then the connection material and then the second material layer area arrange themselves in series, than in the other spatial direction perpendicular thereto, which also extends in the plane, in which the board spans.

[0016] In an embodiment, the connection material is provided as a material deposit in the separation area before the manufactured final state, and in particular before the impact for generating the connection geometry for connecting the two material layer areas. However, this material deposit is arranged without contact with the material layer areas. Thus, this means that this connection material is already arranged on the board, in particular present on the base material in the separation area, in manufacturing the vehicle camera, before the mounting pin is fixed in the hole of the secondary zone. Thereby, it is particularly advantageously allowed that the board can be pre-manufactured with regard to its materially essential constituents before attaching the mounting pin. By this material deposit in the specific arrangement in the separation area, thus, a thermal separation between the material layer areas and this material deposit then also exists. Nevertheless, this required connection material is then already regionally locally and specifically present on the board. Thereby, it is in particular then also achieved that after attaching the mounting pin in the hole of the secondary zone, the connection material then does not first have to be brought onto the board. But it is already present and only has to be deformed by then specific local thermal impact, in particular melted, to then establish a connection to the two material layer areas.

[0017] In an embodiment, the material layer is made of a metal, in particular it comprises at least proportionally copper. Copper is particularly advantageous to the effect that it has a very high thermal conductivity. Thereby, a particularly advantageous thermal management in the vehicle camera is achieved. On the other hand, a corresponding electrical conductivity is also achieved by copper. In particular, copper is also relatively robust with respect to the processing and also very resistant with regard to corresponding influences on the vehicle camera. Thereby, especially in this exposed position, namely this specific material layer, particular robustness and permanently high functionality can be allowed in this respect. In an embodiment, an image sensor of the vehicle camera is in particular connected on the main zone. In particular, it is also in contact with the material layer, in particular the first material layer area. Especially the connection is a thermal connection. It can be an electrical connection too. In an embodiment the image sensor is arranged on a first top side of the circuit board and the main zone is arranged on a second top side of the circuit board. The first top side is opposite to the second top side.

[0018] In an embodiment, the material layer is a heat dissipation layer. Thus, it is conceived as intended and arranged on the board such that it allows thermal management. In particular, this heat dissipation layer is provided as intended to conduct waste heat of an image sensor of the vehicle camera arranged on the board to the mounting pin and from there away from the board. Thereby, a specific defined thermal path is also generated in the vehicle camera, which specifically dissipates the waste heat of the image sensor from the board. In particular, by the mentioned material chain.

[0019] In an embodiment, the material layer is thus a heat dissipation layer, by which waste heat of an image sensor of the vehicle camera arranged on the board can be conducted to the mounting pin and from there away from the board. Thereby, a defined thermal heat dissipation path, which reaches from the main zone up to the hole in the secondary zone, is virtually generated by the arrangement of the two separated material layer areas on the base material and the connection material connecting the material layer areas in the finally manufactured state.

[0020] In an embodiment, the secondary zones are formed as exposed corner areas to the main zone. In particular, the main zone can be quadrangularly formed. Then, such four secondary zones are in particular formed as corner areas. In an embodiment, the second material layer areas can be arrowhead- 1 ike formed in the secondary zones.

[0021] In an embodiment, the connection material can be metallic solder material.

[0022] By thermal energy impact, a particularly simple deformation, in particular melting, is then allowed. Thereby, a particularly uniform distribution of this connection material in the separation area is achieved. Thereby, a particularly uniform connection material layer in the finally manufactured state of the vehicle camera is also achieved such that a homogeneous layer with respect to the material and the layer thickness is formed here too. A particularly advantageous direct connection to the two material layer areas is thereby also supported. Thereby, the thermal management of this mentioned chain of the material layer areas and of the connection material is also allowed. A particularly efficient dissipation of the waste heat, in particular of a member on the main zone, is thereby achieved.

[0023] In an embodiment, at least one intermediate material layer is internally formed in the base material. This intermediate material layer has higher thermal conductivity than the base material. In particular, this intermediate material layer is connected to the material layer by a contact structure. Thereby, an even more efficient thermal management is achieved. Because a higher and more effective heat dissipation from the main zone, in particular of the first material layer area and this intermediate material layer area to the connection material and from it towards the second material layer area can also be achieved thereby. Thereby, the dissipation of the waste heat in the main zone is even more extensively and efficiently allowed.

[0024] For example, a contact structure can be at least one thermal via.

[0025] A further aspect of the invention relates to a method for mounting a vehicle camera. In particular, the method comprises the following steps:

[0026] - Providing a board of the vehicle camera with a carrier of a base material, to which a material layer is applied, which has higher thermal conductivity than the base material;

[0027] - generating at least one separation area of the material layer such that the material layer is interrupted between a main zone of the board and a secondary zone of the board, such that a first material layer area and a second material layer area separated therefrom are formed,

[0028] - providing a deformable connection material as at least one local material deposit in the separation area separated from the material layer areas;

[0029] - connecting at least one mounting pin to at least one hole in the secondary zone;

[0030] - after fixing the mounting pin in the hole, melting the material deposit such that the connection material spreads in the separation area and connects the material layer areas.

[0031] By such a method, improved mounting of the vehicle camera in particular with regard to the thermal management is allowed. In particular, the mounting of the mounting pin in the hole of the secondary zone by thermal energy impact is thereby very advantageously allowed, on the other hand, the main zone, in particular the first material layer area, is not impaired by this thermal energy in mounting the mounting pin. In particular if the image sensor of the vehicle camera is already arranged on the main zone and is in contact with the first material layer area before mounting the mounting pin, an undesired thermal influence on this image sensor can be avoided.

[0032] In an embodiment, it is in particular provided that the connection material is provided as a local material deposit in the separation area before the mounting pin is fixed in the hole of the secondary zone, in particular by thermal energy impact. In particular, this material deposit is generated and provided in the separation area such that the material deposit is arranged still apart or separated from the material layer areas.

[0033] In an embodiment, a thermally conductive connection bridge is generated between the material layer areas by the melted connection material such that a contiguous thermally conducting material chain is formed, by which waste heat of an image sensor of the vehicle camera arranged on the board can be conducted from the first material layer area to the finally manufactured connection material and from there to the second material layer area and from there to the mounting pin to be then conducted away from the board by the mounting pin. Therefore, a particularly specific multi-material and multi-zone thermal energy dissipation path is provided on this board. By this structure, both the manufacture of the vehicle camera is improved and the dissipation of the waste heat from the main zone of the board in the finally manufactured state of the vehicle camera is particularly advantageously provided.

[0034] Vehicle cameras, such as satellite cameras, i.e. cameras that are almost exactly the same no matter where they are placed on the vehicle, are now produced in quantities of several million per year. It is therefore important to constantly improve the production process of such cameras, in particular to shorten it. Every second by which the production of such a camera can be reduced is therefore important. For this reason, the lens module is no longer glued to the housing during production. Instead, the lens module is preferably firmly screwed to the housing. The positioning of the image sensor to the lens module is achieved by first aligning the circuit board with the image sensor to the lens module, especially to the lenses of said lens module, and, once this has been achieved, the circuit board is firmly connected to the housing via the mounting pins with a soldering process.

[0035] It is important to note that even with such a high number of units, the lens module is never perfectly identical. This means that the positioning of the image sensor in relation to the lens module is always specific to each individual camera and can only be achieved in the best possible way by electronically connecting the circuit board with the image sensor during the manufacturing process and using specific target objects to find the optimum position in relation to the lenses of the lens module. This is achieved in particular by moving the circuit board in all degrees of freedom. The board is already placed in its end position and the mounting pins, which are firmly connected to the housing, already protrude through the holes in the board. The movement of the circuit board can be generated by a robot in the production system.

[0036] This is why the holes in the board are preferably large enough to allow such movement of the board, even though the mounting pins already protrude through the holes. And only when the optimum optical arrangement is measured, i.e. the image is clear enough for different colors and patterns, for example, soldering at the end of the pins is carried out very quickly with a laser. This soldering is done on the side of the board where the image sensor is not located. To minimize the time required for this process, high temperatures must be used, which in turn can damage the image sensor and / or other electronic components, even if they are placed on the other side of the circuit board. The invention is intended to avoid this impairment in particular.

[0037] Below, embodiments of the invention are explained in more detail based on schematic drawings. There show:

[0038] Fig. 1 a schematic sectional representation through an embodiment of a vehicle camera according to the invention;

[0039] Fig. 2 a top view to an embodiment of a board of the vehicle camera according to Fig. 1 ; and

[0040] Fig. 3 a simplified sectional representation through an embodiment of a board of the vehicle camera 1 .

[0041] In the figures, identical or functionally identical elements are provided with the same reference characters.

[0042] In Fig. 1 , a vehicle camera 1 is shown in a schematic representation. The vehicle camera 1 comprises a housing 2. It is an outer housing. The housing 2 comprises a housing rear part or a housing back part 3 and a housing front part 4 separate therefrom. An inner area 5 is formed by the housing 2. In the inner area 5, electronic and optical components of the vehicle camera 1 are arranged. Therein, Fig. 1 only shows a schematic representation, which is not to be understood as conclusive with regard to location and / or completeness of the components. In this respect, the vehicle camera 1 comprises a lens module L. This lens module L comprises a lens or multiple lenses. The lens module L is arranged in the housing front part 4. The lens module L is screwed into the housing front part 4. It has an external thread that is screwed to an internal thread of the housing front part 4. Here, it extends into the inner area 5 in certain areas and partially out of the inner area 5. Moreover, the vehicle camera 1 comprises a board 6. It is completely arranged in the inner area 5. At least one electronic member, here an image sensor 7, is arranged on the board 6. In this respect, it is arranged on a top side 8a of the board 6.

[0043] In the mounted final state of the vehicle camera 1 , the top side 8a faces the lens module L.

[0044] Moreover, two mounting pins 9 only to be exemplarily and schematically understood in position, number and orientation are also shown. The mounting pins 9 are connected to the board 6. In particular, they can also be connected to further components 10 of the vehicle camera 1 . Especially the component 10 is a part area of the housing front part 4.

[0045] In Fig. 2, an embodiment of the board 6 is shown. Here, a top view to the top side 8a is illustrated. The board 6 comprises a carrier 11 , which is a plate. This carrier 11 comprises a base material 12. It can for example be made of epoxy. A material layer 13 is applied to this base material 12. Here, the material layer 13 is applied to a top side 8b. It is an external layer. The material layer 13 has higher thermal conductivity than the base material 12. In particular, the material layer 13 is at least proportionally made of the material, in particular at least proportionally of copper. The top side 8b is opposite to the top side 8a.

[0046] The board 6 comprises a main zone 14. Moreover, the board 6 comprises at least one secondary zone, here multiple secondary zones 15, 16, 17 and 18. These zones 14 to 18 are designed on the top side 8b. Here, the secondary zones 15 to 18 are formed as corner areas of the board 6. In the central or middle main zone 14, the image sensor 7 is arranged opposite thereto. In this context, it is arranged on the opposite top side 8a and is connected to a main zone 14a of the material layer 13, which is arranged on the top side 8b. Moreover, the secondary zone 15 comprises a secondary zone 15a of the material layer 13. Correspondingly, further secondary zones 16a, 17a and 18a of the material layer 13 are formed here.

[0047] As is apparent, these secondary areas 15a to 18a of this material layer 13 are areas exposed towards the edge and towards the corner areas, respectively. In particular, they are arrowhead-like configured.

[0048] Moreover, it is apparent that a hole 19, 20, 21 and 22 is respectively formed in these secondary zones 15 to 18 of the board 6. These holes 19 to 22 are formed penetrating the entire board 6. These holes 19 to 22 are provided as intended such that mounting pins 9 are introduced and fixed therein.

[0049] For mounting or manufacturing the vehicle camera 1 , the board 6 is first also provided. Thereto, it is provided that the material layer 13 is formed in the first material layer area 14b and second material layer areas 15b, 16b, 17b and 18b separated and apart therefrom. The first material layer area 14b thus represents the main zone 14a of the material layer 13. The second material layer areas 15b, 16b, 17b, 18b represent the secondary zones 15a to 18a of the material layer 13.

[0050] As is shown in Fig. 2, a separation area 23 is formed between the first material layer area 14b of the material layer 13 and a second material layer area 15b of the material layer 13. The relevant edges 23a and 23b of the separation area 23 are shown. By such a separation area 23, the material layer 13 is specifically separated and the material layer areas 14b and 15b are arranged without touching or without contact with each other.

[0051] Moreover, it is shown in Fig. 2 that connection material 24 is arranged in this separation area 23. Here, the connection material 24 is still symbolized by a material deposit 24a. Here, they are exemplarily two deposit strips. This material deposit 24a of the connection material 24 is arranged and provided in the separation area 23 such that it is also arranged without contact with these material layer areas 14b and 15b. Here, a situation is shown in this corner area 15 in this context, in which a mounting pin 9 is not yet fixed in the hole 19.

[0052] Identical separation areas 23 with the edges 23a and 23b are also formed between the first material layer area 14b and the further second material layer areas 16b, 17b and 18b in the original state in the manufacture. In this context, these separation areas 23 are only shown by the dashed edges 23a and 23b. Because in the areas between the first material layer area 14b and the second material layer areas 16b, 17b and 18b, the respective mounting pin 9 is already mounted or fixed in the holes 20, 21 and 22 and moreover the material deposit 24a respectively provided there is then also already deformed, in particular melted, subsequently in the manufacturing method. Thereby, the connection material 24 is respectively formed such that a continuous, in particular homogeneous connection material strip 25, 26, 27 is respectively formed. Thereby, the material layer areas 14b and 16b, 17b and 18b are then connected to each other in thermally conducting manner or directly contacted.

[0053] Thus, if a mounting pin 9 is then subsequently fixed in the hole 19, in particular by thermal energy impact, in particular by melting a solder material, based on the representation in the left lower corner area of the secondary zone 15, thus, a thermal energy transfer from the second material layer area 15b to the first material layer area 14b is not effected in this process. If this mounting pin 9 is then correspondingly mounted in the hole 19, the material deposit 24a can then also be deformed, in particular melted, in a further subsequent step, such that a structure, in particular in the form of such a strip-shaped connection material bridge, as it is represented by the connection material bridges 25 and 26 and 27, is then formed there too. By this melting, it can also be provided that the melted connection material also slightly flows into the respective material layer areas 14b and 15b, 16b, 17b, 18b over the edges 23a and 23b.

[0054] In particular, this connection material 24 can be a material, which has an identical or similar thermal conductivity as the material of the material layer 13. It is possible that the connection material 24 has got a less thermal conductivity as copper.

[0055] Moreover, contact structures 28 are also formed in an embodiment according to the representation in Fig. 2. Here, they are only represented with the reference character in the area between the main zone 14 and the secondary zone 17 for the sake of clarity.

[0056] This coupling structure 28 is also formed in the other transitions between the main zone 14 and the secondary zone 15, 16 and 18. These contact structures 28 can be thermal vias. Thereby, a thermal contact between the material layer 13 formed on the top side 8b and thus externally and at least one further intermediate material layer 29, 30 (Fig. 3) formed in the interior of the base material 12 is generated. This intermediate material layer 29 and / or 30 too can be formed of the material as is the externally attached material layer 13. In particular, the intermediate material layer 29 and / or 30 has a thickness between 20 micrometers and 50 micrometers, especially between 30 micrometers and 40 micrometers, in particular of 35 micrometers. Preferably, the external material layer 13 also has such a thickness.

[0057] In Fig. 3, the board 6 is shown in a partial area, in particular in the area between the main zone 14 and the secondary zone 15, in a schematic sectional representation.

[0058] Here, it is exemplarily shown that the material deposit 24 with the two deposit strips of the material deposit 24a to be exemplarily and not conclusively understood here can have a height between 100 micrometers and 300 micrometers. A distance between two such deposit strips of the material deposit 24a can be between 200 micrometers and 1000 micrometers. For example, this can also be the distance of the material deposit 24a to the first material layer area 14b and / or the second material layer area 15b.

[0059] In an embodiment, the board 6, in particular the base material 12 and the material layer 13, can have a thickness between one millimeter and 1 .6 millimeters, as it is also exemplarily shown in Fig. 3.

[0060] Both the structure, position and geometry of a separation area 23 and / or of a material deposit 24 are to be only exemplarily and not conclusively understood.

[0061] In particular, heating of a material, in particular of a solder material, is effected by means of a laser in the area of a hole 19 to 22 for fixing a mounting pin 9.

[0062] In particular, the contact structures 28 also allow electrical conductivity. In an embodiment, this can also be the primary function of such contact structures 28. The thermal conductivity is then a secondary function.

[0063] By these mounting pins 9, it is in particular also allowed that the board 6 can be electrically set to a ground potential.

Claims

Claims1 . A vehicle camera (1 ) with a housing (2) and with a board (6), which is arranged in the housing (2), wherein the board (6) comprises a carrier (11) of a base material (12) and comprises a material layer (13), which is applied to the base material (12), wherein the material layer (13) has higher thermal conductivity than the base material (12), wherein the board (6) comprises a main zone (14) and at least one secondary zone (15, 16, 17, 18), and a hole (19, 20, 21 , 22) for a mounting pin (9) is formed in the secondary zone (15 to 18), characterized in that the material layer (13) is interrupted between the main zone (14) and the secondary zone (15 to 18) in a separation area (23), such that a first material layer area (14b) and a second material layer area (15b, 16b, 17b, 18b) separated therefrom are formed, and this separation area (23) is filled with a connection material (24) at least in certain areas in the manufactured final state of the board (6), such that the material layer areas (14b, 15b, 16b, 17b, 18b) are connected by the connection material (24).

2. The vehicle camera (1 ) according to claim 1 , characterized in that the connection material (24) is a meltable material.

3. The vehicle camera (1) according to claim 1 or 2, characterized in that the connection material (24) has higher thermal conductivity than the base material (12).

4. The vehicle camera (1 ) according to any one of the preceding claims, characterized in that the connection material (24) is formed as connection strips in the manufactured final state.

5. The vehicle camera (1 ) according to any one of the preceding claims, characterized in that the connection material (24) is provided as a material deposit (24a) in the separation area (23) before the manufactured final state, and the material deposit (24a) is arranged without contact with the material layer areas (14b, 15b, 16b, 17b, 18b).

6. The vehicle camera (1 ) according to any one of the preceding claims, characterized in that the material layer (13) is made of a metal, in particular at least proportionally comprises copper.

7. The vehicle camera (1 ) according to any one of the preceding claims, characterized in that an image sensor (7) of the vehicle camera (1) is connected on the main zone (14).

8. The vehicle camera (1 ) according to any one of the preceding claims, characterized in that the material layer (13) is a heat dissipation layer, by which waste heat of an image sensor (7) of the vehicle camera (1) arranged on the board (6) can be conducted to the mounting pin (9) and from there away from the board (6).

9. The vehicle camera (1 ) according to any one of the preceding claims, characterized in that the secondary zones (15 to 18) are formed as exposed corner areas to the main zone (14).

10. The vehicle camera (1 ) according to any one of the preceding claims, characterized in that the connection material (24) is a metallic solder material.11 . The vehicle camera (1 ) according to any one of the preceding claims, characterized in that at least one intermediate material layer (29, 30) is internally formed in the base material (12), which has higher thermal conductivity than the base material (12),wherein the intermediate material layer (29, 30) is connected to the material layer (13) by a contact structure (28), in particular thermal vias.

12. A method for mounting a vehicle camera (1 ), comprising the following steps:- providing a board (6) of the vehicle camera (1 ) with a carrier (1 1 ) of a base material (12), to which a material layer (13) is applied, which has higher thermal conductivity than the base material (12);- generating at least one separation area (23) of the material layer (13), such that the material layer (13) is interrupted between a main zone (14) of the board (6) and a secondary zone (15 to 18) of the board (6), such that a first material layer area (14b) and a second material layer area (15b, 16b, 17b, 18b) separated therefrom are formed,- providing a deformable connection material (24) as at least one local material deposit (24a) in the separation area (23) separated from the material layer areas (14b, 15b to 18b);- connecting at least one mounting pin (9) to at least one hole (19 to 22) in the secondary zone (15 to 18);- after fixing the mounting pin (9) in the hole (19 to 22), melting the material deposit (24a) such that the connection material (24) spreads in the separation area (23) and connects the material layer areas (14b, 15b to 18b).

13. The method according to claim 12, wherein a thermally conductive connection material bridge is generated between the material layer areas (14b, 15b to 18b) by the melted connection material (24) such that a contiguous heat dissipation layer is formed, by which waste heat of an image sensor (7) of the vehicle camera (1 ) arranged on the board (6) is conducted to the at least one mounting pin (9) and from there away from the board (6).

Images