Thermoplastic housing
The thermoplastic housing with integrated heat exchangers and conductive coatings addresses thermal and electromagnetic interference challenges, offering efficient thermal management and electromagnetic shielding for electric vehicle components.
Patent Information
- Application Number
- PCT/US2025/012716
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-01-23
- Filing Date
- 2025-01-23
- Publication Date
- 2025-07-31
AI Technical Summary
Existing thermoplastic housings for electronic components in electric vehicles face challenges in managing thermal, magnetic, and electrical energy, as polymers are not inherently conductive and do not effectively block electromagnetic interference, leading to inefficiencies and potential component malfunctions.
A thermoplastic housing design incorporating a thermoplastic body with integrated heat exchangers and heat sinks, along with a conductive coating, which includes a metal layer applied via vapor deposition to manage thermal and electromagnetic interference, while maintaining lightweight and durable properties.
The solution provides effective thermal management and electromagnetic shielding, enhancing the durability and assembly efficiency of electronic components, while maintaining a lightweight structure.
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Figure US2025012716_31072025_PF_FP_ABST
Abstract
Description
THERMOPLASTIC HOUSINGFIELD OF THE DISCLOSURE
[0001] The present disclosure relates to a thermoplastic housing and a method of making the thermoplastic housing. The thermoplastic housing is designed to hold electronic components, e.g., convertors, inverters, onboard chargers, transistors, etc., and dissipate heat generated by the electronic components.BACKGROUND
[0002] Electric vehicles (EV’s) are powered by a plurality of battery cells within a housing, e.g., a battery pack. To move, EV’s utilize an electronic component referred to as a converter to convert DC power to AC power to drive the electric motor. An operator (a human or otherwise) signals a controller, which adjusts the vehicle's speed by changing the frequency of AC power from an electronic component referred to as an inverter to the motor that turns the wheels. EV’s often include electronic components such as inverter and converter units housed in a metal housing, which is configured to remove heat and reduce magnetic and electrical energy.
[0003] Managing thermal, magnetic, and electrical energy in EV’s is a challenging task. The accumulation of electromagnetic radiation EV’s creates electromagnetic pollution or EMI that can result in the malfunction of electronic components. Converter-inverter housings must manage thermal, magnetic, and electrical energy. Further, converter-inverter housings require various coupling fixtures, wire-harnesses, and cooling features, which makes assembly thereof time consuming and inefficient. Of course, thermoplastic housings are more design flexible than metal housings as a result of the processing advantages associated with polymeric materials, e.g., injection molding over metal forming processes, e.g., stamping. Plus, polymers are much lighter than metals, and reductions in housing weight mean increased efficiency for notoriously heavy EV’s. However, managing thermal, magnetic, and electrical energy within thermoplastic housings can be difficult with polymeric housings since polymers are not inherently conductors, and are thus not as effective as metals from a thermal management perspective, and do not block or reduce the emittance of magnetic and electrical energy like metals do. Further, hybrid structures comprising metal and polymers can lack the durability required to protect electronic components, and bonding between metal and polymers can be inconsistent and may result in a bonding interface that lacks the integrity to maintain the fluidic seal required to maintain cooling passages that circulate cooling fluids to cool the electrical components in the housing.
[0004] Considering the challenges above and the evolving strategies required to deal with the challenges, there remains a continued need for an improved housing for electronic components. Ideally, the improved housing would possess the energy management advantages of a metal housing, and the weight advantages of polymeric housing. Further, the improved housing would be made efficiently, capitalizing on advantages associated with polymeric forming techniques such as injection molding, which would result in simplified assembly at the component and vehicle level.SUMMARY
[0005] In a first embodiment, a thermoplastic housing comprises a thermoplastic body and at least one heat exchanger. The thermoplastic body has an exterior surface, an interior surface, a first end, and a second end, and at least partially defines an interior cavity and a plurality of windows. The at least one heat exchanger is disposed in one of the plurality of windows and comprises a heat exchange portion and a base portion. The heat exchange portion presents a heat exchange surface and at least partially defines the interior cavity, and also presents a chamber surface opposite the heat exchange surface. The base portion is coupled to the heat exchange portion and has a flow surface that cooperates with the chamber surface of the heat exchange portion to define a flow chamber for a thermal fluid within the at least one heat exchanger.
[0006] In a second embodiment, a thermoplastic housing comprises a thermoplastic body and a heat sink. The thermoplastic body has an exterior surface, an interior surface at least partially defining an interior cavity and a plurality of windows, four side walls extending from a first to a second end, and a mounting wall defining one or more windows disposed at the second end. The at least one heat sink comprises a back portion that cooperates with the mounting wall to define a fluid reservoir which is configured to provide cooling fluid and cool electronic components situated in the interior cavity and disposed adjacent to, on, or in the one or more windows of the mounting wall. The thermoplastic body also includes a conductive coating comprising metal applied via vapor disposition and disposed on at least a portion of the exterior surface and / or the interior surface, which has a thickness of from about 1 to about 10 pm.
[0007] In a third embodiment, a thermoplastic housing comprising a thermoplastic body, at least one heat sink, and at least one heat exchanger is disclosed. The thermoplastic body has an exterior surface, an interior surface, a first end, and a second end. The thermoplastic body at least partially defines an interior cavity and a plurality of windows. The heat sink presents a conduction surface, which is at least partially disposed in one or more ofthe plurality of windows and at least partially defines the interior cavity. The at least one heat exchanger is disposed at the second end of the thermoplastic body and comprises a heat exchange portion and a base portion. The heat exchange portion presents a heat exchange surface, which is disposed in one or more of the plurality of windows and at least partially defines the interior cavity.
[0008] A method of making a thermoplastic housing is also disclosed. In one embodiment, the method comprising the steps of: molding a thermoplastic body having an exterior surface, an interior surface, a first end, a second end, four side walls extending from the first end to the second end, and a mounting wall defining one or more windows disposed at the second; forming a back portion comprising metal; coupling the back portion to the thermoplastic body to form at least one heat sink wherein an interior surface of the back portion cooperates with the mounting wall to define a fluid reservoir which is configured to provide cooling fluid and cool electronic components disposed in the one or more windows of the mounting wall; and applying a conductive coating comprising metal on at least a portion of the exterior surface and / or the interior surface at a coating thickness of from about 1 to about 10 pm applied via vapor disposition.
[0009] In a second embodiment, a method of making a thermoplastic housing comprising a thermoplastic body, at least one heat sink, and at least one heat exchanger is also disclosed. In this embodiment, the method comprises the steps of: providing the heat sink; molding the thermoplastic body at least partially defining the interior cavity; coupling the heat sink to the thermoplastic body; and forming the heat exchanger.
[0010] Advantageously, the thermoplastic housing possess the energy management advantages and durability associated with metal housings and the processing and assembly advantages associated with polymeric housings. These and other features of the disclosure will be more fully understood and appreciated by reference to the description of the embodiments and the drawings. Before the embodiments of the disclosure are explained in detail, it is to be understood that the disclosure is not limited to the details of operation or to the details of construction and the arrangement of the components set forth in the following description or illustrated in the drawings. The disclosure may be implemented in various other embodiments and of being practiced or being conducted in alternative ways not expressly disclosed herein. In addition, it is to be understood that the phraseology and terminology used herein are for the purpose of description and should not be regarded as limiting. The use of “including” and “comprising” and variations thereof is meant to encompass the items listed thereafter and equivalents thereof as well as additional items and equivalents thereof. Further, enumerationmay be used in the description of various embodiments. Unless otherwise expressly stated, the use of enumeration should not be construed as limiting the disclosure to any specific order or number of components. Nor should the use of enumeration be construed as excluding from the scope of the disclosure any additional steps or components that might be combined with or into the enumerated steps or components.BRIEF DESCRIPTION OF THE DRAWINGS
[0011] Figure 1 is a perspective side view of an embodiment of a thermoplastic housing.
[0012] Figure 2 is an exploded view of the thermoplastic housing of Figure 1.
[0013] Figure 3 is a partial exploded view of the thermoplastic housing of Figure 2 along line 3-3.
[0014] Figure 4 is a cross-sectional view of the thermoplastic housing of Figure 2 along line 4-4.
[0015] Figure 5 is an exploded view of a conduction portion and a back portion which are coupled together to form a heat sink, which is included in the thermoplastic housing of claim 1.
[0016] Figure 6 is an exploded view of a heat exchange portion and a base portion which are coupled together to form a heat exchanger, which is included in the thermoplastic housing of claim 1.
[0017] Figure 7 is an isolated side view of a plurality of undercut channels formed on a chamber surface of a heat exchange portion.
[0018] Figure 8 are isolated top and side views of a plurality of undercut channels including parallel furrows on a chamber surface of a heat exchange portion formed with successive laser passes.
[0019] Figure 9 is a perspective top view of another embodiment of a thermoplastic housing.
[0020] Figure 10 is a perspective bottom view of the thermoplastic housing of Figure 9.
[0021] Figure 11 is an exploded view of the thermoplastic housing of Figure 9.
[0022] Figure 12 is a perspective cross-sectional view of the thermoplastic housing ofFigure 9 along line 12-12.
[0023] Figure 13 is a perspective cross-sectional view of the thermoplastic housing of Figure 9 along line 13-13.
[0024] Figure 14 is a cross-sectional view of the thermoplastic housing of Figure 9 along line 13-13.
[0025] Figure 15 is a perspective cross-sectional view of the thermoplastic housing ofFigure 9 along line 15-15.
[0026] Figure 16 is a cross-sectional view of the thermoplastic housing of Figure 9 along line 15-15.
[0027] Figure 17 is a flow chart documenting an embodiment of a method of making a thermoplastic housing.
[0028] Figure 18 is a flow chart documenting another embodiment of a method of making a thermoplastic housing.DETAILED DESCRIPTION
[0029] A thermoplastic housing and a method of making the thermoplastic housing is provided. While discussed below in connection with a converter-inverter housing or an onboard charger for use in an electric vehicle (“EV”), the thermoplastic housing is suitable in a wide range of applications, inside and outside of EV’s, including applications in consumer electronics.
[0030] Referring now to Figures 1-4, wherein like numerals indicate corresponding parts throughout the several views, the thermoplastic housing is illustrated and generally designated at 10. The thermoplastic housing 10 can be manufactured efficiently, is light weight, and durable. Furthermore, electronic components can be efficiently assembled in the thermoplastic housing 10, and the thermoplastic housing 10 including electronic components such as a converter, an inverter, or an onboard charger can be assembled in the thermoplastic housing 10 efficiently and the converter-inverter unit can be, in turn, efficiently assembled in an EV.
[0031] The thermoplastic housing 10 comprises a thermoplastic body 12, at least one heat sink 14, and at least one heat exchanger 16. Each of the thermoplastic body 12, the heat sink(s) 14, and the heat exchanger(s) 16 is described in-tum.
[0032] Generally, the thermoplastic body 12 has an interior surface 18, an exterior surface 20, a first end 22, and a second end 24. The thermoplastic body 12 at least partially defines an interior cavity 26 and a plurality of windows 28. The thermoplastic body 12 comprises a thermoplastic composition, which is flame resistant and provides an effective barrier to magnetic and electrical energy having a frequency. Plus, the thermoplastic body 12 is typically molded which provides design flexibility, allowing for the incorporation of features such as fasteners, heat stake posts, hooks, mounting backets, and wire harnesses, which simplifies assembly at the component and the vehicle level.
[0033] The thermoplastic composition comprises a polymer selected from polyamide, polykeytone, polyphenylene sulfide (PPS), and polypropylene. In some embodiments the thermoplastic composition comprises a polyamide (nylon) selected from the group ofpolyamide 6, polyamide 11, polyamide 12, polyamide 46, polyamide 6,6, polyamide 6,10, polyamide 6,12, and polyamide PPA. In a preferred example, the thermoplastic composition comprises polyamide 6 or polyamide 6,6. In some embodiments, the polymer is present in the thermoplastic composition in an amount of from 10 to 100, 35 to 95, or 60 to 85 wt. %, based on 100 parts by weight of the thermoplastic composition. Some non-limiting examples of the thermoplastic composition are available under the tradenames of ULTRADUR® and ULTRAMID®, which are commercially available from BASF of Florham Park, New Jersey. Other non-limiting examples of the thermoplastic composition are available under the tradenames of FRIANYL® and FORTRON® from Celanese of Dallas, TX. Still other nonlimiting examples of the thermoplastic composition are available under TORELINA®, from Toray Industries, Inc. of New York, NY.
[0034] Typically, the thermoplastic composition comprises a filler. Exemplary fillers include mineral fillers. Some non-limiting examples of mineral filler include particles and fibers comprising barites, calcium carbonate, carbon and carbon black, clays (e.g., kaolin clay), glass, mica, silica, talc, and wollastonite. In many embodiments, the thermoplastic composition comprises a fibrous filler selected from aramid fibers, carbon fibers, cellulose fibers, acrylic fibers, polyvinyl alcohol fibers, glass fibers, carbon nanotubes, and mineral fibers. In some embodiments, the thermoplastic composition comprises glass fibers, carbon fibers, graphite fibers, carbon nanotubes, or combinations thereof. In some embodiments, the filler is present in the thermoplastic composition in an amount of from 1 to 50, 10 to 40, or 15 to 35 wt. %, based on 100 parts by weight of the thermoplastic composition. In some preferred embodiments, the thermoplastic body comprises the thermoplastic composition comprising: polyamide 6,6, a blend of polyamide 6,6 and polyamide 6, and / or polyphenylene sulfide (PPS); and a fibrous filler selected from glass fiber or carbon fiber, or combinations thereof in an amount of from about 20 to about 50 wt. %, based on 100 wt. % of the thermoplastic composition.
[0035] Table 1 below sets forth non-limiting examples of the thermoplastic composition that can be molded to form the thermoplastic housing:Table 1 :
[0036] The thermoplastic composition provides electromotive force (“EMF”) and electromagnetic interference (“EMI”) shielding for the electronic components in the interior cavity 26 of the thermoplastic housing 10. In many embodiments, the thermoplastic composition absorbs electromagnetic radiation generated within the interior cavity 26 and prevents the penetration of magnetic and electrical energy, e.g., electromagnetic radiation, into the interior cavity 26 to reduce or eliminate any electromagnetic field(s) within the interior cavity 26. The accumulation of electromagnetic radiation in the interior cavity 26 creates electromagnetic pollution or EMI that can result in the malfunction of electronic components within the interior cavity 26. In some embodiments, the thermoplastic body 12 creates a Faraday cage and isolates the electronic devices and cables within the thermoplastic housing 10 from their surroundings. Electromagnetic shielding that blocks radio frequency (RF) electromagnetic radiation is also known as RF shielding. Generally, the thermoplastic composition absorbs and reflects electromagnetic radiation having a frequency of from 1 KHz to 300 GHz or IKHz to 10 GHz thereby protecting the electronic components and wires within the thermoplastic housing 10.
[0037] The electromagnetic shielding properties of the thermoplastic composition can be accomplished via incorporation of conductive and magnetic fillers, inclusion of a metal frame and or metal panels (e.g., via over-molding) within the thermoplastic housing 10, and / or use of a conductive coating (e.g., a vapor deposited metal coating) thereon. Examples of fillers that improve the EMI shielding properties of the thermoplastic composition include, but are not limited to, metal powders, carbon fibers, and fillers that have been surface-treated with conductive layers and coatings. In some embodiments, the thermoplastic composition, or the thermoplastic housing 10 reduces magnetic and electrical energy having a frequency of from 1 kilohertz to 10 gigahertz going into or out of the interior cavity by at least 10, 20, 30, 40, 50, 60, 70, 80, or 90 %. In other embodiments, the thermoplastic housing 10 reduces a dB level in the interior cavity by at least 10, 20, 30, 40, 50, 60, 70, 80, or 90 %.
[0038] As set forth above, once the thermoplastic housing comprising the thermoplastic composition is molded, a conductive coating can be applied to the thermoplastic housing. In many embodiments, the conductive coating comprises metal to prevent emission of electromagnetic radiation from the interior cavity and penetration of electromagnetic radiation into the interior cavity. In many embodiments, the coating comprises aluminum, chromium, chromium nitride, copper, gold, nickel, titanium, titanium nitride, or a combination thereof. In one preferred embodiment, the conductive coating comprises aluminum (Al) applied at coating thickness of from 1 to 10, from 1.5 to 6, or from 2.5 to 5, pm. In another preferred embodiment, the coating comprises copper (Cu), nickel (Ni), and Chromium (Cr) applied at coating thickness of from 1 to 10, from 1.5 to 5, or from 2 to 4, pm.
[0039] General, the conductive coating is applied via vapor disposition and has a thickness of from about 1 to about 10 pm, optionally from about 1.5 to about 5.5, or optionally from about 2 to about 6, pm. The coating can be applied with various techniques know in the art, including but not limited to, brushing, spraying, dipping, roll coating, spin coating, flow coating, electro-coating, and vapor deposition. In a preferred embodiment, the conductive coating is applied via vapor deposition. For example, in some embodiments, the coating is applied via Physical Vapor Deposition (PVD). During PVD, the solid coating composition is vaporized in a vacuum and then deposited as a thin film onto the surface of the thermoplastic housing. The PVD process may be conducted in a high-vacuum chamber to minimize contamination. The coating material / composition (e.g., metals, ceramics) is transformed into a vapor phase through various methods including evaporation, sputtering, or arc evaporation. Finally, the coating composition is deposited on the surfaces of the thermoplastic housing when it travels through the vacuum and condenses onto the surfaces, forming a thin, adherent coating. All of or portions of the thermoplastic housing can be coated.
[0040] Shielding Effectiveness (SE) represents the reduction in the strength of an electromagnetic field (EMF) when it encounters a shielding material. Shielding Effectiveness can be measured on a dB Scale - decibels use a logarithmic scale to express ratios. This makes it easier to handle large ranges of signal strengths. And can be calculated with the equation below:SE (dB) = 20 * loglO (El / E2)El is the strength of the EMF before the shield.E2 is the strength of the EMF after the shield.
[0041] For example, if a shield reduces the EMF strength by a factor of 10, the SE would be: SE (dB) = 20 * loglO (10) = 20 dB. Higher dB values indicate better shieldingperformance. Shielding effectiveness can vary depending on the frequency of the electromagnetic waves, the type of shielding material, and the specific geometry of the shield. In some embodiments, the thermoplastic housing 10 has a shielding effectiveness of from 5 to 100, 15 to 75, or from 30 to 60, dB.
[0042] In many embodiments, the thermoplastic composition is flame-resistant. In one such embodiment, the thermoplastic composition complies with UL 94, the Standard for Safety of Flammability of Plastic Materials for Parts in Devices and Appliances testing. UL 94 is a plastics flammability standard released by Underwriters Laboratories of the United States. The standard determines the tendency of a material, e.g., the thermoplastic composition, to either extinguish or spread the flame once the specimen has been ignited. In some such embodiments the thermoplastic composition can have a UL 94 classification of HB, V-2, V-l, V-0, 5VB, or 5VA. For embodiments with a V-0 rating, a sample of the thermoplastic composition is exposed to two 10 second combustion tests and the flame goes out within 30 seconds, with no combustibles falling off. For embodiments with a V-l rating, a sample of the thermoplastic composition is exposed to two 10 second combustion tests, the flame goes out within 60 seconds, with no combustibles falling off. For embodiments with a V-2 rating, a sample of the thermoplastic composition is exposed to two 10 second combustion tests, the flame goes out within 60 seconds, but combustibles fall off. For embodiments with a HB rating, a sample of the thermoplastic composition is exposed to two 10 second combustion tests, and burning stops within 30 seconds on the sample with drops of vertical flammable thermoplastic composition allowed. For embodiments with a 5VB rating, a sample of the thermoplastic composition is exposed to two 10 second combustion tests, and there is fall off or drops of flaming thermoplastic composition, the sample can have a bum-through or hole subsequent to testing. For embodiments with a 5VA rating, a sample of the thermoplastic composition is exposed to two 10 second combustion tests, and there is no fall-off or drops of flaming thermoplastic composition, the sample cannot have a bum-through or hole subsequent to testing.
[0043] The thermoplastic composition may comply with CSA Standard C22.2 No. 0.17, Evaluation of Properties of Polymeric Materials, part of a series of Standards issued by CSA International under Part II of the Canadian Electrical Code. For example, in some such embodiments, a sample of the thermoplastic composition 3 to 13 mm thick may exhibit a combustion rate of less than 40 mm per minute. As another example, in some such embodiments, a sample of the thermoplastic composition less than 3 mm thick may exhibit a combustion rate of less than 70 mm per minute.
[0044] In some embodiments, the thermoplastic composition is thermally conductiveand includes polyamide 6 (PA6). The thermoplastic composition of these embodiments exhibits good electrical conductivity, EMI shielding, and EMF shielding characteristics. As described above, in many embodiments, the thermoplastic composition comprises polyamide, is thermally conductive, and can be injection molded or extruded. As such, the thermoplastic composition provides design freedom and excellent performance in applications previously restricted to metals.
[0045] In some embodiments, the thermoplastic body 12 comprises a metal frame (not illustrated) or metal panels over- molded with a thermoplastic composition. These embodiments can yield a thermoplastic housing 10 having increased strength and rigidity.
[0046] In some embodiments, the thermoplastic composition has a specific gravity of from 1.2 to 2.0, 1.3 to 1.4, 1.2 to 1.5, 1.4 to 1.8, 1.5 to 1.7, or 1.55 to 1.65 g / cm3, when tested in accordance with International Organization for Standardization (“ISO”) 1183-1:2019. In many embodiments, the thermoplastic composition has a melting temperature of from 210 to 310, 210 to 300, 260 to 290, or 230 to 290 °C, when tested in accordance with ISO 11357.
[0047] Referring again to Figures 1-4, the thermoplastic body 12 has the interior surface 18, the exterior surface 20, the first end 22, and the second end 24. The thermoplastic body 12 at least partially defines the interior cavity 26 and typically includes the plurality of windows 28, which provides access to the interior cavity 26 for assembly purposes and also provide a means for the cooling components, e.g. any heat sink(s) 14 or heat exchanger(s)16 included in the thermoplastic housing 10, to contact and cool the electronic components within the interior cavity 26.
[0048] In the embodiment of Figure 1, the thermoplastic body 12 comprises four side walls 30 extending from the first end 22 to the second end 24 of the thermoplastic body 12. In Figure 1, the thermoplastic body 12 includes a plurality of tabs on the second end 24 that line up with a plurality of corresponding tabs on the heat exchanger 16 to provide a mean to mechanically couple the heat exchanger 16 to the thermoplastic body 12. In the embodiment illustrated, one of the four walls 30 defines a window 28a, which provides a passageway for wires and other infrastructure to enter and exit the thermoplastic housing 10. The thermoplastic body 12 also comprises a mounting wall 32, which is disposed at the first end 22 of the thermoplastic body 12. A perspective view of the mounting wall 32 is provided in Figure 4. The mounting wall 32 presents a mounting surface 34 that at least partially defines the interior cavity 26 and, in this exemplary embodiment, defines three windows 28b, 28c, 28d. In this embodiment, three cooling towers defining a conduction surface 44 of the heat sink 14 are disposed in the three windows 28b, 28c, 28d. To this end, the conduction surface 44 comprisesthree portions. Further, the heat sink 14 partially defines the interior cavity 26. The cooling towers maximize contact with the electronic components that are disposed in the interior cavity 26. With reference to Figure 5, the central cooling tower includes one or more cooling fins 56.
[0049] An advantage of being able to injection mold the thermoplastic body 12 is that features such as heat stake posts, hooks, mounting brackets, and wire harnesses can be molded on the interior surface 18 and / or the mounting surface 34. These features can extend into the interior cavity 26. Of course, such features can also be molded onto the exterior surface 20 of the thermoplastic body 12 or onto the interior surface 18 of the thermoplastic body 12. The thermoplastic body 12 can comprise one or more heat stake posts 36, one or more hooks (not illustrated), one or more mounting brackets (not illustrated), and one or more wire harnesses (not illustrated) extending from the interior surface 18 and / or the mounting surface 34 into the interior cavity 26.
[0050] The interior surface 18 of the thermoplastic body 12 and / or the mounting surface 34 of the mounting wall 32 can comprise the one or more heat stake posts 36 extending into the interior cavity 26. Figure 4 illustrates a plurality of the one or more heat stake posts 36 extending into the interior cavity 26. The one or more heat stake posts 36 can have different shapes as is illustrated in Figure 4. The one or more heat stake posts 36 can also act like threaded fastener bosses, not only heat stakes / heat stake posts. When using different fasteners, the inner diameter / outer diameter of the thread forming diameter will change according to the fastener size. These one or more heat stake posts 36 can also be molded in such a way that a central plate slips over the heat stake post 36 acting as a locating feature for assembly before a component is heat staked or fastened. The use of the one or more heat stake posts 36 to produce assemblies is repeatable, economical, and safe. As such, the one or more heat stake posts 36 provide an efficient means of plastic assembly.
[0051] In many embodiments, the thermoplastic body 12 comprises one or more spigots 38. Each of the one or more spigots 38 can be spin welded onto the thermoplastic body 12, mechanically attached to the thermoplastic body 12, or simply molded as an integral part of the thermoplastic body 12. Each of the one or more spigots 38 at least partially defines a flow passage 40 that extends into the thermoplastic body 12 and is in fluidic communication with a flow chamber 70 of the heat exchanger 16 or a fluid reservoir 54 of the heat sink 14. In some embodiments, the one or more spigots 38 are hybrid spigots comprising a metal base and a thermoplastic stem. In other embodiments, the one or more spigots 38 comprise, consist of, or consist essentially of metal. In yet other embodiments, the one or more spigots 38 comprise, consist of, or consist essentially of thermoplastic. For purposes of the subject disclosure“consists essentially of’ can be defined as greater than 85, 96, 97, 98, or 99 weight percent of the noun, e.g., metal, plastic, etc., based on the total weight of the component. In the embodiment illustrated, the thermoplastic body 12 at least partially defines one or more of the flow passage 40 that is in fluidic communication with one of the one or more spigots 38 and the flow chamber 70 of the heat exchanger 16 or the fluid reservoir 54 within the heat sink 14. The flow passages 40 are best illustrated in Figure 3. It should be appreciated that embodiments disclosed and contemplated herein may not include the flow passages in the thermoplastic body and spigots can be arranged on the heat exchanger or on the heat sink, e.g., on the base portion or the back portion.
[0052] The thermoplastic housing 10 comprises a least one heat sink 14. In the embodiment illustrated, the heat sink 14 is disposed at the first end 22 of the thermoplastic body 12. In this embodiment, the heat sink 14 presents the conduction surface 44, which is at least partially disposed in one or more of the plurality of windows 28e and at least partially defines the interior cavity 26. The at least one heat sink 14 comprises a conduction portion 42 and a back portion 48. The conduction portion 42 defines the conduction surface 44 and a transfer surface 46. The back portion 48 comprises a reservoir surface 50 that cooperates with the transfer surface 46 to define the fluid reservoir 54. The heat sink 14 includes two openings (not illustrated, one for the input of cooling fluid into the fluid reservoir 54 and another for the output of cooling fluid from fluid reservoir 54). The two openings can connect to two flow passages in the thermoplastic body 12 and put two of the one or more spigots 38 in fluidic communication with the fluid reservoir 54. The fluid reservoir 54 illustrated comprises a plurality of cooling channels, various cooling channel path designs are contemplated herein and the fluid reservoir 54 can even be designed as a single cavity. The back portion 48 also defines a back surface 52. Figure 5 is an exploded view of the conduction portion 42 and the back portion 48, which cooperate to form the fluid reservoir 54.
[0053] In a first embodiment, the conduction portion 42 comprises thermoplastic, and the back portion 48 comprises thermoplastic. In such embodiments, the conduction portion 42 and the back portion 48 can be injection molded or extruded. In this embodiment, the conduction portion 42 and the back portion 48 can be melt-bonded to form the heat sink 14. For example, the conduction portion 42 and the back portion 48 can be laser welded. The basic principle of laser welding is to irradiate a laser beam on portions, which provides energy, which is transformed into heat, to weld the portions together. The conduction portion 42 and the back portion 48 can be laser welded directly or indirectly, e.g., via transmissible laser welding. An example of indirect welding is laser transmission welding, which is also referred to as laserplastic welding, through-transmission welding (TTLW) and laser polymer welding. Unlike direct welding where the energy is applied at the surface of the materials, transmission welding aims to apply the energy in between two thermoplastic portions at their interface. In some such examples, the portions comprise a thermoplastic composition, just like the thermoplastic compositions described above with reference to the thermoplastic body 12. In embodiments where the portions welded together via transmissible laser welding, the thermoplastic composition of the conduction portion 42 and / or the back portion 48 can be characterized as transparent to laser wavelengths in the infrared and near-infrared spectrum, e.g., transparent to a laser beam having a wavelength of 808 nm or 980 nm. Regardless of how the conduction portion 42 and the back portion 48 are contacted with the laser beam, once the melted thermoplastic at the interface between the two portions cools, the conduction portion 42 and the back portion 48 are joined or bonded to form the heat sink 14. Advantageously, laser welding the conduction portion 42 and the back portion 48 form the heat sink 14, which is homogenously bonded, lightweight, and chemically / environmentally resistant.
[0054] In a second, preferred embodiment, the conduction portion 42 comprises metal, and the back portion 48 comprises the thermoplastic composition. In such embodiments, the conduction portion 42 can comprise a metal such as aluminum, steel, copper, or alloys thereof. The conduction portion 42 typically comprises a weldable metal or metal alloy. For example, the metal may be a 2000, 3000, 4000, 5000, 6000, 7000, or 8000 series aluminum alloy. In one embodiment, the conduction portion 42 comprises a 3000 series aluminum alloy, which is aluminum alloyed with manganese. 3000 series aluminum alloys have higher strength than aluminum while maintaining good formability and corrosion resistance. Non-limiting examples of 3000 series aluminum include commercial grades 3004 and 3003. In another embodiment, the conduction portion 42 comprises a 5000 series aluminum alloy, which is a non-heat-treatable aluminum alloy with magnesium as its major alloying element. 5000 series aluminum alloys have exceptional strength and corrosion resistance. Non-limiting examples of 5000 series aluminum include commercial grades 5083, 5052, 5754, and 5251. In many embodiments, the metal is a 2000, 3000, 40000, 5000, 6000, 7000, or 8000 series aluminum alloy.
[0055] As is described in detail below, the transfer surface 46 can be micro-textured via continuous-wave or pulsed fiber laser etching to form a region having undercut grooves or channels, which allows the melt bonding of the back portion 48 to the conduction portion 42. In this embodiment, the back portion 48 comprises the thermoplastic composition as is described above with reference to the thermoplastic body 12, a description of which is notrepeated herein for brevity.
[0056] In a third embodiment, the conduction portion 42 comprises metal, and the back portion 48 comprises metal. In this embodiment, the conduction portion 42 and the back portion 48 comprises a weldable metal or metal alloy just like those described above with reference to the conduction portion 42 (e.g., aluminum and aluminum alloys). In this embodiment, the portions can be extruded, stamped, forged, and / or formed and then welded together to form the heat sink 14.
[0057] Referring now to Figure 4, the mounting wall 32 presents the mounting surface 34 that at least partially defines the interior cavity 26 and defines three windows 28b, 28c, 28d. In this embodiment, three cooling towers defining the conduction surface 44 of the heat sink 14 are disposed in the three windows 28b, 28c, 28d. The central cooling tower includes a plurality of the one or more cooling fins 56. It should be appreciated that various embodiments of the heat sink 14 are contemplated. For example, a single portion (e.g., cooling tower) of the heat sink 14 could extend through a single window in the mounting wall 32. As another example, two portions (e.g., cooling towers) of the heat sink 14 could extend through two windows in the mounting wall 32. Of course, three portions, e.g., cooling towers extending through three windows in the mounting wall 32 is illustrated in this particular embodiment.
[0058] Referring now to Figures 4 and 5, the embodiment of heat sink 14 illustrated comprises three U-shaped cooling fins 56. Of course, various embodiments of the heat sink 14 could comprise 3, 4, 5, 6, or more cooling fins 56. Although the cooling fins are U-shaped in the example embodiment of these Figures as is illustrated best in Figure 5, the one or more cooling fins 56 can have a linear shape or any other shape desired.
[0059] Coupling of the heat sink 14 to the thermoplastic body 12 can be achieved via various mechanical fastening means. In the example illustrated the heat sink 14 is fastened to the thermoplastic body 12 via welding. However, in alternative embodiments, the heat sink 14 can be attached to the thermoplastic body 12 via thread forming fasteners which extend through a flange and thread into a plastic boss. The heat sink 14 can be attached to the thermoplastic body 12 via a mechanical clipping feature (comprising metal or thermoplastic), which is designed to either anchor into the metallic or plastic side or hinge and provide force when pushed to full engagement. Further, brass or steel hot / cold inserts can be pressed into the thermoplastic body 12, and fasteners can be employed to bolt the heat sink 14 down. The heat sink 14 can also be over- molded. In another embodiment, the heat sink 14 can be attached to the thermoplastic body 12 via hybrid welding wherein a laser etched feature on the metal heat sink 14 is pressed into the thermoplastic body 12, creating a mechanical bond.
[0060] The thermoplastic housing 10 comprises at least one heat exchanger 16. The heat exchanger 16 comprises a heat exchange portion 58 and a base portion 64. Figure 6 is an exploded view of the heat exchange portion 58 and the base portion 64. In the embodiment illustrated in the drawings, the heat exchange portion 58 presents a heat exchange surface 60, which is disposed in the window 28e and at least partially defines the interior cavity 26. In the embodiment illustrated, the at least one heat exchanger 16 is disposed at the second end 24 of the thermoplastic body 12. The heat exchange portion 58 presents the heat exchange surface 60 and a chamber surface 62 opposite the heat exchange surface 60. In Figure 6, there are two openings 41, one for the input of cooling fluid into the flow chamber 70 and another for the output of cooling fluid from the flow chamber 70. The two openings 41 can connect to two flow passages 40 and put two of the one or more spigots 38 in fluidic communication with the flow chamber 70. The flow chamber 70 illustrated comprises a plurality of cooling channels, various cooling channel path designs are contemplated herein and the flow chamber 70 can even be designed as a single cavity. The base portion 64 has a flow surface 66 that cooperates with the chamber surface 62 of the heat exchange portion 58 to define the flow chamber 70 for a thermal fluid within the at least one heat exchanger 16. The base portion 64 also has a base surface 68. Figure 6 is an exploded view of the heat exchange portion 58 and the base portion 64.
[0061] In some embodiments, the flow surface 66 defines a plurality of channels to define a flow path for a thermal fluid within heat exchanger 16. Of course, the flow surface 66 could also define a chamber with a smooth or a patterned surface, e.g., dimpled surface, to create fluid turbulence to aid in heat transfer.
[0062] In a first embodiment, the heat exchange portion 58 and the base portion 64 comprise thermoplastic. More specifically, the heat exchange portion 58 and the base portion 64 comprise the thermoplastic composition described above. Of course, the heat exchange portion 58 and the base portion 64 can comprise the same or different thermoplastic compositions. In such embodiments, the heat exchange portion 58 and the base portion 64 can be injection molded or extruded. In this embodiment, the heat exchange portion 58 and the base portion 64 can be melt-bonded to form the heat exchanger 16. For example, the heat exchange portion 58 and the base portion 64 can be laser welded as is described above.
[0063] In a second, preferred embodiment, the heat exchange portion 58 comprises metal and the base portion 64 comprises thermoplastic. More specifically, the heat exchange portion 58 comprises a metal as described herein, e.g., aluminum as described above, and the base portion 64 comprises the thermoplastic composition as is also described herein.
[0064] In a third embodiment, the heat exchange portion 58 and the base portion 64 comprise metal, as is described above, e.g., with reference to the conduction portion 42.
[0065] In embodiments of the heat exchanger 16 wherein the heat exchange portion 58 comprises metal and the base portion 64 comprises thermoplastic and in embodiments of the heat sink where the conduction portion 42 comprises metal and the back portion 48 comprises thermoplastic, a bonding surface of the heat exchange portion 58 and the conduction portion 42 can be prepared by forming a micro-textured region 72 by laser-texturing the metal bonding surface of the metal portion (e.g. the heat exchange portion 58 or the conduction portion 42) to create microstructures 74, e.g. undercut channels therein, and subsequently melt-bonding the thermoplastic composition of the corresponding portions (e.g. the base portion 64 or the back portion 48) to help bond the respective metal portion to the thermoplastic portion. Figure 7 is an isolated side view of a plurality of undercut channels 74 formed on a metal bonding surface of the conduction portion 42 or the heat exchange portion 58. Figure 8 are isolated top and side views of a plurality of undercut channels 74 including parallel furrows on a metal bonding surface of the conduction portion 42 or the heat exchange portion 58 formed with successive laser passes. The thermoplastic portions can be heated and contacted with the micro-textured region the metal portion to the thermoplastic portion. This contact (e.g., pressing together) allows the thermoplastic composition to melt and flow into or penetrate into the plurality of undercut channels 74 of the micro-textured region 72 to secure the metal portion to the thermoplastic portion.
[0066] As used herein, “micro-texturing” means the selective removal or melting of material from the surface of the metal sheet, resulting in channels, recesses, or grooves having an average depth of between 1 pm and 200 pm. For example, micro-texturing the metal portion can include forming a region of undercut grooves or channels having an average depth of from 5 to 200 pm. Micro-texturing can be performed via pulsed laser ablation or continuous-wave laser etching, by non-limiting example. In the application of this joining techniques, the thermoplastic composition softens / melts and penetrates into the undercut grooves or channels and conforms to the micro-textured region of the metal portion against which it is contacted. After hardening inside the undercut grooves or channels, the thermoplastic portion and the metal portion are now joined. As a result, a fastener or snap connection is not required, and the thermoplastic portion adheres to the metal portion as a hybrid component. The micro-textured interface provides a hermetic seal, which provides a barrier to cooling fluids, for example water, glycol -based fluids, oil, and air.
[0067] In a third embodiment, the heat exchange portion 58 and the base portion 64comprise metal, as is described above, e.g., with reference to the conduction portion 42.
[0068] Attachment of the heat exchanger 16 to the thermoplastic body 12 can be achieved via various mechanical fastening means such as those described herein for attaching the heat sink 14 to the thermoplastic body 12. In the example illustrated the heat exchanger 16 is fastened to the thermoplastic body 12 via bolting. Figure 2 provides a good view of a plurality of flanges on the heat exchange portion 58, the base portion 64, and the second end 24 of the thermoplastic body 12.
[0069] In the embodiment illustrated, the thermoplastic housing 10 comprises one of the heat exchanger 16, which is located at the second end 24 of the thermoplastic body 12. Nonetheless, it should be appreciated that the thermoplastic housing 10 could comprise one or more additional heat exchangers of different sizes and in different locations. For example, the thermoplastic housing 10 could comprise 2, 3, 4, 5, or more heat exchangers 16. In one example, one or more of the four side walls 30 of the thermoplastic body 12 could be replaced with an additional heat exchanger 16. In another embodiment, there could be one or more heat exchangers 16 disposed in the interior cavity 26. The additional heat exchangers 16 could be disposed in the interior cavity 26 of the thermoplastic housing 10 in different orientations. The additional heat exchangers 16 could be formed as described herein, with a with a heat exchange portion 58 and a base portion 64.
[0070] In the embodiment of Figures 9-16, the thermoplastic housing 110 comprises a thermoplastic body 112 and a heat sink 114. The thermoplastic body 110 has an exterior surface 120, an interior surface 118, which define an interior cavity 126 and also defining a plurality of windows 128. In this embodiment, four sidewalls 130 extend from a first end 122 to a second end 124, and a mounting wall 132 defines one or more windows 128 (in this embodiment, 6 windows). The mounting wall 132 is disposed at the first end 122. The heat sink 114 comprises a back portion 148 that cooperates with the mounting wall 132 to define a fluid reservoir 154 which is configured to provide cooling fluid and cool electronic components 176 situated in the interior cavity 126 that are disposed adjacent to, on, or in the one or more windows of the mounting wall 132. The thermoplastic body 112 also includes a conductive coating (not numbered) comprising metal applied via vapor disposition and disposed on at least a portion of the exterior surface 120 and / or the interior surface 118, which has a thickness of from about 1 to about 10 pm.
[0071] Figure 9 is a perspective top view of this embodiment of the thermoplastic housing 110 is illustrated. In Figure 9, two of the four sidewalls 130 are illustrated as well as one of the plurality of windows 128. A heat exchanger 116 is disposed in one of the pluralityof windows 128 at the second end 124. The heat exchanger 116 is just like described herein with respect to the embodiment of Figure 1 and, likewise, includes a heat exchange portion 158 presenting a heat exchange surface that at least partially defines the interior cavity 126 and also presents a chamber surface opposite the heat exchange surface. The heat exchanger 116 also includes a base portion 164, which can be melt bonded to the heat exchange portion 158 in embodiments where the base portion 164 comprises thermoplastic. The base portion 164 has a flow surface that cooperates with the chamber surface of the heat exchange portion 158 to define a flow chamber 170 that allows for circulation of thermal fluid within the heat exchanger 116. Just like in Figure 1 , a plurality of tabs on the thermoplastic body 112 and corresponding tabs on the heat exchanger 116 are illustrated which allow for the mechanical coupling of the heat exchanger 116 to the thermoplastic body 112.
[0072] Figure 10 is a perspective bottom view of the thermoplastic housing 110 of Figure 9. In Figure 9, the other two of the four sidewalls 130 are illustrated as well as four spigots 138 that are in fluidic communication with the flow passages 140 defined by the thermoplastic body 112 and used to circulate cooling fluid into the heat exchanger 116 and the heat sink 114. The spigots 138 are in fluidic communication with the flow passages 140 and the flow chamber 70 of the heat exchanger 116 or the fluid reservoir 154 of the heat sink 114. In this particular embodiment, the heat sink 114 comprises the mounting wall 132, which cooperates with the back portion 148 to define a fluid reservoir 154 that is used to cool electronic components within the interior cavity 126.
[0073] Figure 11 is an exploded view of the thermoplastic housing of Figure 9. Figure 11 provides an isolated view of the heat exchange portion 158 and the base portion 164 of the heat exchanger 116 that cooperate to define the flow chamber 170 that allows for circulation of thermal fluid within the heat exchanger 116. Figure 11 also illustrates an isolated view of the back portion 148 of the heat sink 114 that cooperates with the mounting wall 132 to define a fluid reservoir 154 which is configured to provide cooling fluid and cool electronic components 176 situated in the interior cavity 126 that are disposed on the one or more windows 128 of the mounting wall 132. In many embodiments, such as the embodiment illustrated, there are two windows 128 for each electronic component 176, a first window 128 that allows flow of cooling fluid into the portion of the fluid reservoir 154 in contact with the electronic component, and a second window 128 that allows cooling fluid to flow out of the fluid reservoir 154 in contact with the electronic component. In the embodiment illustrated, a portion of the fluid reservoir 154 is formed by each walled mounting slot 178, the mounting surface 134, and a surface of the electronic component 176 (e.g., a lower surface), with theelectronic component 176 adjacent to the two windows 128 formed in the mounting wall 132. In other embodiments, the electronic component 176 could be on or in a window 128 in the mounting wall 132 and there would not be a portion or a sub-chamber of the fluid reservoir 154 formed directly under the electronic component as illustrated. In many embodiments, there is a perimeter seal disposed on the perimeter (or the bottom) of the electronic component 176 that cooperates with the walls of the walled mounting slot 178 to seal the portion of the fluid reservoir 154 that cools the electronic component 176. Of course, the seal could also be provided on the inside of the walls of the walled mounting slot 178, or the mounting surface 134.
[0074] In a preferred embodiment, the mounting wall 132, which comprises the thermoplastic composition, and the back portion 148, which comprises metal are melt-bonded together. For example, the reservoir surface 150 of the back portion 148 can be laser etched, e.g., to form a micro-textured region like described previously, which allows for a durable fluidic seal between the outer surface of the mounting wall and the reservoir surface 150 of the back portion 148. In some embodiments a perimeter seal can also be disposed between the mounting wall and the back portion. For example, in one embodiment, a seal track is mounted in on the outer surface of the mounting wall and a seal is disposed in the track so that when the mounting wall and the back portion are melt bonded, the seal provides additional fluidic sealing of the cooling reservoir.
[0075] Figure 12 is a perspective cross-sectional view of the thermoplastic housing 110 of Figure 9 along line 12-12. Figure 12 provides a perspective view of the interior cavity 126. In particular, heat stake posts 136 are illustrated extending from the mounting surface 134 into the interior cavity 126. Further, three electronic components 176 are illustrated within the interior cavity 126 which are disposed on the three of the one or more windows 128 of the mounting wall 132. In the embodiment illustrated the electronic components 176 are heat staked to the mounting wall 132. The electronic components 176 are exposed to the fluid reservoir 154 of the heat sink 114 for cooling purposes. The view of Figure 10 also illustrates the reservoir surface 150 of the back portion 148 that allows for circulation of cooling fluid when coupled to the mounting wall 132.
[0076] Figure 13 is a perspective cross-sectional view of the thermoplastic housing 110 of Figure 9 along line 13-13. Figure 13 illustrates the three electronic components 176 removed from three walled mounting slots 178 formed on the mounting wall 132. Within each of the three walled mounting slots 178 are the three of the one or more windows 128 of the mounting wall 132. The heat stake posts 136 that are used to secure (heat stake) the electronic components176 to the mounting wall 132 are also illustrated. When the reservoir surface 150 of the back portion 148 is aligned with the mounting wall 132 and the electronic components 176 are heat staked to the mounting wall 132, the flow passages of the back portion 148 line up with the corresponding windows 128 to cool the electronic components 176. Figure 14 is another cross- sectional view of the thermoplastic housing 110 of Figure 9 along line 13-13.
[0077] Figure 15 is a perspective cross-sectional view of the thermoplastic housing 110 of Figure 9 along line 15-15. In Figure 13 the heat exchanger 116 is disposed at the second end 124 of the thermoplastic housing 110 with the base portion 164 coupled to the heat exchange portion 158. The flow chamber 170 that allows for circulation of thermal fluid within the heat exchanger 116 is shown. The plurality of tabs of the thermoplastic body are aligned with corresponding tabs on the base portion 164 and the heat exchange portion 158 that allow for the mechanical coupling of the heat exchanger 116 to the thermoplastic body 112 once the electronic and other components are arranged within the interior cavity 126. In Figure 15, the spigots 138 are illustrated in fluidic communication with the flow passages 140 of the thermoplastic body 12. The flow passages 140 provide a pathway for the input and output of cooling fluid into the flow chamber 170 of the heat exchanger 116 and the fluid reservoir 154 of the heat sink 114. Of course, it should be appreciated that in some embodiments, the spigots 138 are on the heat exchanger 116 and the heat sink 114 and, as such, the thermoplastic body does not require or include the flow passages 140. Further, in this view one of the three electronic components 176 is visible are disposed on two of the one or more windows 128 of the mounting wall 132. In the embodiment illustrated the electronic components 176 are heat staked to the mounting wall 132. The electronic components 176 are exposed to the fluid reservoir 154 of the heat sink 114 for cooling purposes. Figure 16 is another cross-sectional view of the thermoplastic housing 110 of Figure 9 along line 15-15.
[0078] Methods of making the embodiments of the thermoplastic housing described above are also disclosed herein. The method steps described herein can be mixed and matched depending on the thermoplastic housing to be made. In particular, it should be appreciated that the method steps can be mixed and matched depending on whether the conduction portion, the back portion, the heat exchange portion, and the base portion of the heat exchanger and the heat sink comprise thermoplastic or metal. All methods contemplated herein include the step of molding the thermoplastic body (with or without a metal base / insert). In some embodiments, the thermoplastic body can be formed with a thermoplastic composition including conductive filler, in other embodiments, the method can include the step of coating the thermoplastic body with the conductive coating and or inclusion of metal shielding by molding metal shields intothe thermoplastic body or by coupling the metal shields thereto. Of course, the embodiments of the thermoplastic housing and the methods disclosed herein are not to be construed as requiring both the heat exchanger and the heat sink. For example, various embodiments of the thermoplastic housing can include the heat exchanger without the heat sink. As another example, various embodiments of the thermoplastic housing can include the heat sink without heat exchanger. In yet other embodiments, the thermoplastic housing can include the heat exchanger and the heat sink That is, the heat exchanger and the heat sink are not necessarily required. To this end, some embodiments of the method involve the steps of forming the heat exchanger and the heat sink, while other embodiments may involve forming one or more of the heat exchanger or one or more of the heat sink. Of course, the heat sink can be formed with a conduction portion and a back portion. In other embodiments of the method, the mounting wall is used in lieu of (or as) the conduction portion.
[0079] As a first, non-limiting example, a method of making the thermoplastic housing 10, as it is described above, comprising the thermoplastic body 12, the at least one heat sink 14, and the at least one heat exchanger 16 is disclosed. Referring now to Figure 17, the method 1700 comprises the steps of: providing the heat sink 14 (1702); molding the thermoplastic body 12 at least partially defining the interior cavity 26 (1704); coupling the heat sink 14 to the thermoplastic body 12 (1706); and forming the heat exchanger 16 (108).
[0080] In some embodiments, the step of providing the heat sink 14 comprises the steps of: forming the conduction portion 42 comprising metal; molding a back portion 48 comprising thermoplastic; and melt bonding the back portion 48 to the conduction portion 42 to form the heat sink 14. In other embodiments, the step of providing the heat sink 14 comprises the steps of: forming a conduction portion 42 comprising metal; forming a back portion 48 comprising metal; and welding the back portion 48 to the conduction portion 42 to form the heat sink 14. Of course, the conduction portion 42 and the back portion 48 can comprise thermoplastic and be molded and laser welded together.
[0081] In some embodiments, the steps of molding the thermoplastic body and forming the heat exchanger are conducted simultaneously. In some embodiments, the step of forming the heat exchanger 16 comprises the steps of: forming the heat exchange portion 58 comprising metal; molding a base portion 64 comprising thermoplastic; and melt bonding the base portion 64 to the heat exchange portion 58 to form the heat exchanger 16. In other embodiments, the step of forming the heat exchanger 16 comprises the steps of: forming the heat exchange portion 58 the base portion 64 comprising metal and over molding the heat exchanger 16 to simultaneously form the thermoplastic body 12 and the heat exchanger 16. In someembodiments, the step of forming the heat exchanger 16 comprises the steps of: forming the heat exchange portion 58 comprising metal; forming a base portion 64 comprising metal; and welding the base portion 64 to the heat exchange portion 58 to form the heat exchanger 16. Of course, the heat exchange portion 58 and the base portion 64 can comprise thermoplastic and be molded and then laser welded together. In embodiments where the heat exchanger 16 is formed independent of the thermoplastic body 12, the method includes the step of coupling heat exchanger 16 to the thermoplastic body 12. One embodiment of the method also includes the step molding the thermoplastic body 12 by overholding a metal frame and / or metal panels with the thermoplastic composition.
[0082] In some embodiments, metal components (e.g., the conduction portion 42 and the heat exchange portion 58) can be coupled to the thermoplastic housing 12 and the heat sink 14 and the heat exchanger 16 can then be formed by coupling the back portion 48 or the base portion 64 or thereto, respectively.
[0083] Of course, the method can also include the steps of assembling electronic components in the interior cavity 26 of the thermoplastic housing 10 and coupling the heat exchanger 16 to the thermoplastic body 12. In an exemplary embodiment, the thermoplastic housing 10 including the converter-inverter can be made and assembled by first molding the thermoplastic housing 10. During molding, one or more shielding panels (not illustrated) can be over molded into the thermoplastic housing 10 (as necessary) or a functional filler can be incorporated into the thermoplastic composition to aid in shielding. In parallel, metal components (e.g., the conduction portion 42 and the heat exchange portion 58) can be laser etched and then fitted into the thermoplastic housing, heated locally at the etched joint, and pressed together forming a hermetically sealed mechanical joint. Other embodiments may forgo laser etching technology and use a metal plate, with press in place gasket, bolted onto mating thermoplastic bosses via thread forming screws, or a hot insert / bolted combination. A final assembly option would forgo the bolts / screws and would consist of a metal clip that would “bite” into the metal and into the thermoplastic plastic creating a permanent connection. Once assembly is complete, power electronics can be added to the thermoplastic housing 10 in layers, with heat exchangers therebetween, as necessary.
[0084] As a second, non- limiting example, in Figure 18, the steps of a method of making a thermoplastic housing are illustrated. In this example, the method (1800) comprises the steps of: molding a thermoplastic body having an exterior surface, an interior surface, a first end, a second end, four side walls extending from the first end to the second end, and a mounting wall defining one or more windows disposed at the second (1802); forming a back portioncomprising metal (1804); coupling the back portion to the thermoplastic body to form at least one heat sink wherein an interior surface of the back portion cooperates with the mounting wall to define a fluid reservoir which is configured to provide cooling fluid and cool electronic components disposed adjacent to, on, or in the one or more windows of the mounting wall (1806); and applying a conductive coating comprising metal on at least a portion of the exterior surface and / or the interior surface at a coating thickness of from about 1 to about 10 pm applied via vapor disposition (1808).
[0085] In some embodiments of the method, the mounting wall, conduction portion, and / or heat exchange portion comprise a thermoplastic composition, and can even be molded or co-molded with the thermoplastic body. In some such embodiments, the back portion and the base portion are metal and can be melt bonded to the respective component to form the heat exchanger and / or the heat sink. As such, the method could in the embodiment of the method presently being described, further include the step of melt bonding the back portion comprising metal to the mounting wall. For example, the reservoir surface of the back portion can be laser etched, e.g., to form a micro-textured region like described previously, which allows for a durable fluidic seal between the outer surface of the mounting wall and the reservoir surface of the back portion.
[0086] This embodiment of the method could also include the step of forming the heat exchanger comprising the heat exchange portion and the back portion. Of course, the heat exchanger could be mounted in in one of the plurality of windows of the thermoplastic body or even in the interior cavity of the heat exchanger. As described immediately and further above, many of the embodiments of the method disclosed herein include the step assembling, which includes organizing and mounting, electronic components in the interior cavity of the thermoplastic body. The subject invention provides numerous advantages over the metal housings of the prior art, allowing for heat staking, wire harnesses, and other connector to be molded right into the housing.
[0087] Statement A: A thermoplastic housing, said thermoplastic housing comprising: a thermoplastic body having an exterior surface, an interior surface, a first end, and a second end, the thermoplastic body at least partially defining an interior cavity and a plurality of windows; at least one heat sink presenting a conduction surface at least partially disposed in one or more of the plurality of windows and at least partially defining the interior cavity; and at least one heat exchanger at the second end of the thermoplastic body comprising: a heat exchange portion presenting a heat exchange surface disposed in one or more ofthe plurality of windows and at least partially defining the interior cavity and a chamber surface opposite the heat exchange surface; and a base portion melt bonded to the heat exchange portion, the base portion having a flow surface that cooperates with the chamber surface of the heat exchange portion to define a flow chamber for a thermal fluid within the at least one heat exchanger.
[0088] Statement B: The thermoplastic housing of Statement A, wherein the heat exchange portion comprises metal and the base portion comprises thermoplastic.
[0089] Statement C: The thermoplastic housing of Statement A, wherein the heat exchange portion and the base portion comprise thermoplastic.
[0090] Statement D: The thermoplastic housing of Statement A, wherein the flow surface defines a plurality of channels to define a flow path for a thermal fluid within the heat exchanger.
[0091] Statement E: The thermoplastic housing of Statement A, wherein the thermoplastic body comprises four side walls extending from the first end to the second end.
[0092] Statement F: The thermoplastic housing of Statement A, wherein the thermoplastic body comprises a mounting wall presenting a mounting surface that at least partially defines the interior cavity and defines in one or more of the plurality of windows, the mounting wall disposed at the second end of the thermoplastic housing.
[0093] Statement G: The thermoplastic housing of Statement F, comprising one or more heat stake posts extending from the mounting surface into the interior cavity.
[0094] Statement H: The thermoplastic housing of Statement F, wherein the thermoplastic body comprises at least one of a heat stake post, a hook, a mounting backet, and a wire harness extending from the interior surface and / or the mounting surface into the interior cavity.
[0095] Statement I: The thermoplastic housing of Statement A, wherein the thermoplastic body comprises one or more spigots, each of the one or more spigots at least partially defining a flow passage that extends into the thermoplastic body and is in fluidic communication with the flow chamber of the heat exchanger.
[0096] Statement J : The thermoplastic housing of Statement I, wherein the one or more spigots are hybrid spigots comprising a metal base and a thermoplastic stem.
[0097] Statement K: The thermoplastic housing of Statement A, wherein the thermoplastic body at least partially defines one or more flow passages that are fluidic communication with one or more spigots and the flow chamber of the heat exchanger or a fluid reservoir within the heat sink.
[0098] Statement L: The thermoplastic housing of Statement A, wherein the at least one heat sink comprises: a conduction portion defining the conduction surface and a transfer surface; and a back portion comprising an interior surface that cooperates with the transfer surface to define a fluid reservoir.
[0099] Statement M: The thermoplastic housing of Statement L, wherein the thermoplastic body comprises one or more spigots, each of the one or more spigots at least partially defining a flow passage that extends into the thermoplastic body and is in fluidic communication with the fluid reservoir of the heat sink.
[0100] Statement N: The thermoplastic housing of Statement L, wherein the conduction surface comprises one or more cooling fins.
[0101] Statement O: The thermoplastic housing of Statement L, wherein the conduction portion comprises metal and the back portion comprises thermoplastic.
[0102] Statement P: The thermoplastic housing of Statement A, wherein the thermoplastic body comprises a metal frame over-molded with a thermoplastic composition.
[0103] Statement Q: The thermoplastic housing of Statement A, wherein the thermoplastic body comprises a thermoplastic composition comprising a conductive filler and / or a conductive coating to prevent emission of electromagnetic radiation from the interior cavity and penetration of electromagnetic radiation into the interior cavity.
[0104] Statement R: The thermoplastic housing of Statement A, wherein the thermoplastic body comprises a thermoplastic composition having a UL 94 classification of V- 1 or V-0.
[0105] Statement S: The thermoplastic housing of Statement A, wherein the thermoplastic body further comprises one or more heat exchangers and / or one or more cooling towers positioned within the interior cavity.
[0106] Statement T: An electric vehicle component comprising the thermoplastic housing of Statement A having an inverter, converter, or onboard charger disposed therein.
[0107] Statement U: A method of making a thermoplastic housing defining an interior cavity comprising a thermoplastic body, a heat sink presenting a conduction surface, and a heat exchanger, the method comprising the steps of: providing the heat sink; molding the thermoplastic body at least partially defining the interior cavity; coupling the heat sink to the thermoplastic body; and forming the heat exchanger.
[0108] Statement V : The method of Statement U, wherein the step of providing the heat sink comprises the steps of: forming a conduction portion comprising metal; molding a base portion comprising thermoplastic; and melt bonding the base portion to the conduction portion to form the heat sink.
[0109] Statement W: The method of Statement U, wherein the steps of molding the thermoplastic body and forming the heat exchanger are conducted simultaneously.
[0110] Statement X: The method of Statement U, wherein the step of forming the heat exchanger comprises the steps of: forming a heat exchange portion comprising metal; molding a back portion comprising thermoplastic; and melt bonding the back portion to the heat exchange portion to form the heat exchanger.
[0111] Statement Y: The method of Statement X further comprising the step of coupling the heat exchanger to the thermoplastic body.
[0112] Statement Z: The method of Statement U, wherein the step of molding the thermoplastic body is further defined as over molding a metal frame with a thermoplastic composition.
[0113] Statement AA: The method of Statement U further comprising the step of assembling electronic components in the interior cavity of the thermoplastic body and coupling the heat exchanger to the thermoplastic body.
[0114] The previous description is that of current embodiments of the disclosure. Various alterations and changes can be made without departing from the spirit and broader aspects of the disclosure as defined in the appended claims, which are to be interpreted in accordance with the principles of patent law including the doctrine of equivalents. This disclosure is presented for illustrative purposes and should not be interpreted as an exhaustive description of all embodiments of the disclosure or to limit the scope of the claims to the specific elements illustrated or described in connection with these embodiments. For example, and without limitation, any individual element(s) of the described disclosure may be replaced by alternative elements that provide substantially similar functionality or otherwise provide adequate operation. This includes, for example, presently known alternative elements, such as those that might be currently known to one skilled in the art, and alternative elements that may be developed in the future, such as those that one skilled in the art might, upon development, recognize as an alternative. Further, the disclosed embodiments include a plurality of features that are described in concert and that might cooperatively provide a collection of benefits. Thepresent disclosure is not limited to only those embodiments that include all these features or that provide all the stated benefits, except to the extent otherwise expressly set forth in the issued claims. Any reference to claim elements in the singular, for example, using the articles “a,” “an,” “the” or “said,” is not to be construed as limiting the element to the singular.
Claims
CLAIMS1. A thermoplastic housing, said thermoplastic housing comprising: a thermoplastic body having an exterior surface, an interior surface, a first end, and a second end, the thermoplastic body at least partially defining an interior cavity and a plurality of windows; at least one heat exchanger at the first or the second end of the thermoplastic body comprising: a heat exchange portion presenting a heat exchange surface disposed in one or more of the plurality of windows and at least partially defining the interior cavity and a chamber surface opposite the heat exchange surface; and a base portion melt bonded to the heat exchange portion, the base portion having a flow surface that cooperates with the chamber surface of the heat exchange portion to define a flow chamber for a thermal fluid within the at least one heat exchanger.
2. The thermoplastic housing of claim 1, wherein the thermoplastic body comprises a thermoplastic composition comprising: polyamide 6,6 and / or polyphenylene sulfide (PPS); and a fibrous filler selected from glass fiber or carbon fiber in an amount of from about 20 to about 50 wt. %, based on 100 wt. % of the thermoplastic composition.
3. The thermoplastic housing of claim 1, wherein the thermoplastic body comprises: a metal frame over-molded with a thermoplastic composition; and / or a conductive coating comprising metal to prevent emission of electromagnetic radiation from the interior cavity and penetration of electromagnetic radiation into the interior cavity.
4. The thermoplastic housing of any preceding claim, wherein the thermoplastic body comprises a conductive coating disposed on at least a portion of the exterior surface and / or the interior surface, wherein the conductive coating comprises aluminum, chromium, chromium nitride, copper, gold, nickel, titanium, titanium nitride, and combinations thereof.
5. The thermoplastic housing of claim 4, wherein the conductive coating is applied via vapor disposition and has a thickness of from about 1 to about 10 pm, optionally from about 1.5 to about 5.5 pm.
6. The thermoplastic housing of any preceding claim, wherein the thermoplastic body has: a shielding effectiveness of from about 15 to about 75, dB; and / ora UL 94 classification of V-l or V-0.
7. The thermoplastic housing of any preceding claim, wherein the thermoplastic body comprises at least one of a heat stake post, a hook, a mounting backet, and a wire harness extending from the interior surface.
8. The thermoplastic housing of any preceding claim, wherein the thermoplastic body at least defines a flow passage that extends into the thermoplastic body and is in fluidic communication with the flow chamber of the heat exchanger and comprises one or more spigots, each of the one or more spigots in fluid communication with the flow passage that extends into the thermoplastic body.
9. The thermoplastic housing of claim 1, wherein: the heat exchange portion and / or the base portion comprises thermoplastic; and the flow surface defines a plurality of channels to define a flow path for the thermal fluid within the heat exchanger.
10. The thermoplastic housing of claim 1, wherein the thermoplastic body comprises a mounting wall presenting a mounting surface that at least partially defines the interior cavity and defines one or more of the plurality of windows, the mounting wall disposed at the first end of the thermoplastic housing.
11. The thermoplastic housing of claim 10, wherein the mounting surface: comprises at least one of a heat stake post, a hook, a mounting backet, and a wire harness extending into the interior cavity; defines one or more of the plurality of windows; and / or has one or more of an electronic component disposed thereon.
12. The thermoplastic housing of claim 11, wherein the mounting surface defines one or more of the plurality of windows and further comprising at least one heat sink presenting a conduction surface that is at least partially disposed in one or more of the plurality of windows, the heat sink comprising: a conduction portion defining the conduction surface and a transfer surface; and a back portion comprising an interior surface that cooperates with the transfer surface to define a fluid reservoir.
13. The thermoplastic housing of claim 11, wherein the mounting surface has one or more of an electronic component disposed thereon and further comprises a base portion comprising an interior surface that cooperates with an outer surface of the mounting surface and / or a surface of the one or more of the electronic component to define a fluid reservoir.
14. The thermoplastic housing of claim 13, wherein the base portion comprises metal,wherein the interior surface is mounted on the mounting wall of thermoplastic body via hybrid welding wherein a laser etched portion of the interior surface of the base portion is in contact with the mounting wall to create a mechanical bond and fluidically seal the fluid reservoir which is partially defined by and cools the surface of the one or more of the electronic component.
15. An electric vehicle component comprising the thermoplastic housing of any preceding claim having an inverter, a converter, or an onboard charger disposed therein.
16. A thermoplastic housing, said thermoplastic housing comprising: a thermoplastic body having an exterior surface, an interior surface at least partially defining an interior cavity and defining a plurality of windows, four side walls extending from a first to a second end, and a mounting wall defining one or more windows disposed at the first end; at least one heat sink comprising a back portion that cooperates with the mounting wall to define a fluid reservoir which is configured to provide cooling fluid and cool one or more of an electronic component disposed in the interior cavity and adjacent to, on, or in the one or more windows of the mounting wall; and a conductive coating comprising metal applied via vapor disposition and disposed on at least a portion of the exterior surface and / or the interior surface and having a thickness of from about 1 to about 10 pm.
17. The thermoplastic housing of claim 16, further comprising at least one heat exchanger disposed in one of the plurality of windows or in the interior cavity, said heat exchanger comprising: a heat exchange portion presenting a heat exchange surface at least partially defining the interior cavity and a chamber surface opposite the heat exchange surface; and a base portion melt bonded to the heat exchange portion, the base portion having a flow surface that cooperates with the chamber surface of the heat exchange portion to define a flow chamber for a thermal fluid within the at least one heat exchanger.
18. A method of making a thermoplastic housing at least partially defining an interior cavity and defining a plurality of windows, said method comprising the steps of: molding a thermoplastic body having an exterior surface, an interior surface, a first end, a second end, four side walls extending from the first end to the second end, and a mounting wall defining one or more windows disposed at the first end of the thermoplastic housing;forming a back portion comprising metal; coupling the back portion to the thermoplastic body to form at least one heat sink wherein an interior surface of the back portion cooperates with the mounting wall to define a fluid reservoir which is configured to provide cooling fluid and cool an electronic component disposed adjacent to, on, or in the one or more windows of the mounting wall; and applying a conductive coating comprising metal via vapor disposition to at least a portion of the exterior surface and / or the interior surface at a thickness of from about 1 to about 10 pm.
19. The method of claim 18, wherein the step of coupling is further defined as melt bonding the back portion comprising metal to the mounting wall.
20. The method of claim 18, further comprising the steps of: forming a heat exchanger comprising a heat exchange portion and a back portion; and mounting the heat exchanger in one of the plurality of windows or the interior cavity.
21. The method of claim 18 further comprising the step of assembling the electronic component in the interior cavity of the thermoplastic body.
Citation Information
Patent Citations
Plain bearing unit
US20100080701A1
Dimmable LED luminaire
US20100277067A1
Luminaire Having Vented Optical Chamber And Associated Methods
US20140133153A1
Resistor and method for manufacturing resistor
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Composite pane for a head-up display with an electrically conductive coating and an Anti-reflective coating
US20210018749A1