Optical waveguide array manufacturing method and adhesive filling system

Abstract

Provided in the present application is an optical waveguide array manufacturing method, comprising: providing a plurality of waveguide mother pieces, each waveguide mother piece comprising a transparent substrate and a reflective film arranged on at least one surface of the transparent substrate; providing a separation layer on the reflective film of each waveguide mother piece; successively stacking the plurality of waveguide mother pieces to form a stack body, every two adjacent waveguide mother pieces being separated by the separation layers to form adhesive filling slits; respectively constructing communicating vessel structures at two opposite ends of the stack body, the two communicating vessels being communicated with each other by means of each adhesive filling slit; separately adding an adhesive into each communicating vessel until the adhesive fully fills each adhesive filling slit; curing the adhesive; and cutting the bonded stack body in a direction perpendicular to the transparent substrate to obtain a plurality of optical waveguide arrays. Further provided in the present application is an adhesive filling system.

Description

Optical waveguide array manufacturing method and glue filling system

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to a Chinese patent application filed with the Patent Office of China on January 31, 2024, with application number 202410142052.6 and application name “Optical Waveguide Array Manufacturing Method and Glue Filling System,” the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present application relates to a method for manufacturing an optical waveguide array and a glue potting system used in the method. Background Art

[0004] The current optical waveguide array is usually made by bonding multiple plate-shaped optical waveguide precursors to form a stack, and then cutting to obtain the optical waveguide array. Multiple optical waveguide precursors are usually glued together using vacuum glue pouring technology. However, vacuum glue pouring requires the stacked optical waveguide precursors to be placed in a vacuum chamber or sealed, which increases the complexity of the process and is difficult to operate. Moreover, the cost of vacuum glue pouring equipment is high, which reduces the economic applicability of the production process. In addition, the glass glue used in the sealing operation is prone to oil leakage under heating conditions, which affects the optical properties of the optical waveguide and the curing effect of the adhesive, resulting in many internal defects (such as bubbles, impurities, cracks, etc.) in the negative refractive flat lens, which in turn leads to low imaging quality and affects user physical examinations. Summary of the Invention

[0005] On one hand, the present application provides a method for manufacturing an optical waveguide array, comprising:

[0006] Providing a plurality of waveguide masters, each of the waveguide masters comprising a transparent substrate and a reflective film disposed on at least one surface of the transparent substrate;

[0007] providing a separation layer on the reflective film of each of the waveguide mother substrates;

[0008] stacking the plurality of waveguide mother slices in sequence to form a stacked body, wherein two adjacent waveguide mother slices are separated by the separation layer to form a glue filling gap;

[0009] Building communicating vessel structures at opposite ends of the stacked body, respectively, wherein the two communicating vessels are connected to each other through each of the glue-filled seams;

[0010] Adding adhesive to each communicating vessel respectively until the adhesive completely fills each glue filling seam;

[0011] curing the adhesive;

[0012] The bonded stacked body is cut along a direction perpendicular to the transparent substrate to obtain a plurality of optical waveguide arrays.

[0013] The optical waveguide array manufacturing method provided herein stacks multiple waveguide motherboards into a laminate, forms a glue-filling seam between adjacent waveguide motherboards, and constructs a connecting vessel structure at each end of the laminate, connecting the two connecting vessels through each glue-filling seam. This facilitates glue-filling the laminate using the connecting vessel principle, allowing adhesive to flow into each glue-filling seam, thereby bonding the multiple waveguide motherboards. This optical waveguide array manufacturing method is simple and reduces costs compared to vacuum glue-filling. Furthermore, since vacuum sealing is not required, the bonding process is not interfered with by the sealant, which improves the adhesive bonding effect and ensures the imaging quality of the optical waveguide array.

[0014] In one embodiment, the thickness difference between the plurality of transparent substrates is less than 3 μm, and the planarity deviation is less than 2 μm.

[0015] In one embodiment, the step of providing a plurality of waveguide mother substrates includes: coating the reflective film on one surface of each of the transparent substrates; or coating the reflective film on both surfaces of each of the transparent substrates.

[0016] In one embodiment, the step of providing a separation layer on the reflective film of each waveguide motherboard specifically includes: providing a plurality of columnar spacers on the surface of the reflective film, wherein the height of each spacer is 1 μm-100 μm, the width of each spacer is 50 μm-200 μm, and the distance between two adjacent spacers is 100 μm-5000 μm.

[0017] In one embodiment, the step of providing a spacer layer on the reflective film of each waveguide master specifically includes providing a plurality of spacers on the surface of the reflective film by photolithography exposure, screen printing, inkjet printing, nanoimprinting, ultraviolet curing transfer, laser etching, or electrostatic spray curing.

[0018] In one embodiment, the plurality of waveguide mother slices are stacked in sequence to form a stack, and the step of separating two adjacent waveguide mother slices by the spacer layer to form a glue filling gap includes: setting the levelness tolerance between each waveguide mother slice in the stack to be less than or equal to 2 μm.

[0019] In one embodiment, the adhesive has a viscosity of less than 1000 Pa·s and a curing temperature of 70° C.-200° C.

[0020] In one embodiment, communicating vessel structures are respectively constructed at opposite ends of the stack, and the steps of connecting the two communicating vessels to each other through each of the glue filling seams specifically include: providing a communicating groove, the communicating groove including a bottom groove and two glue filling grooves, the two glue filling grooves are respectively connected to one end of the bottom groove; providing a bottom baffle and two side baffles, covering the bottom baffle on the bottom groove, and movably setting the two side baffles on the opening side of the glue filling groove, so that the two glue filling grooves are connected through the bottom groove; placing the stack on the bottom baffle, and aligning the two ends of each of the glue filling seams with the two side baffles.

[0021] In one embodiment, the step of adding adhesive to each communicating vessel until the adhesive completely fills each glue filling gap specifically includes: injecting the adhesive into the two glue filling grooves until the communicating grooves are filled with adhesive; removing the two side baffles to allow the adhesive in the glue filling grooves to flow into each glue filling gap; and continuing to inject the adhesive until the adhesive completely fills each glue filling gap.

[0022] In one embodiment, communicating vessels are constructed at opposite ends of the stack, and the steps of connecting the two communicating vessels to each other through each of the glue-filled seams specifically include: providing a carrying device, the carrying device comprising a bottom plate and side plates arranged at both ends of the bottom plate; placing the stack on the bottom plate, with glue injection gaps formed between the stack and the two side plates, and opposite ends of each of the glue-filled seams aligned with the two side plates; and providing sealing films on the waveguide motherboards at both ends of the stack to seal the stack and the carrying device.

[0023] In one embodiment, the step of adding adhesive into each communicating vessel until the adhesive completely fills each adhesive injection gap specifically includes: injecting the adhesive into the two adhesive injection gaps respectively.

[0024] In one embodiment, the width of the glue injection gap is 1 cm-5 cm.

[0025] A second aspect of the present application provides a glue filling system, comprising:

[0026] A communication groove, the communication groove comprising a bottom groove and two glue pouring grooves, the two glue pouring grooves being respectively connected to one end of the bottom groove;

[0027] a bottom baffle, arranged on the bottom trough;

[0028] Two side baffles are movably arranged on the opening sides of the glue pouring tank; and

[0029] A stacked body is arranged on the bottom baffle, and the stacked body includes a plurality of stacked waveguide mother sheets. A glue filling seam is formed between two adjacent waveguide mother sheets, and both ends of the glue filling seam correspond to one of the side baffles respectively.

[0030] A third aspect of the present application provides a glue filling system, comprising:

[0031] The bearing device comprises a bottom plate and side plates arranged at both ends of the bottom plate;

[0032] a stacked body disposed on the bottom plate, the stacked body comprising a plurality of stacked waveguide mother sheets, a glue filling seam formed between two adjacent waveguide mother sheets, and two ends of the glue filling seam corresponding to one of the side panels respectively; and

[0033] A plurality of sealing films are respectively arranged between the two waveguide mother sheets at both ends of the stack and the carrying device. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the technical solutions in the embodiments of the present application, a brief introduction will be given below to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0035] FIG1 is a flow chart of a method for manufacturing an optical waveguide array according to an embodiment of the present application.

[0036] FIG2 is a structural flow chart of steps S1 to S3 in FIG1 .

[0037] FIG3 is a partially enlarged schematic diagram of the spacer layer in FIG2 .

[0038] FIG4 is a schematic diagram of the explosion structure of the connecting groove in one embodiment of the present application.

[0039] FIG5 is a schematic structural diagram of a glue filling system in one embodiment of the present application.

[0040] FIG6 is a schematic structural diagram of a glue filling system in another embodiment of the present application.

[0041] FIG7 is a structural flow chart of step S7 in FIG1 .

[0042] Description of the main component symbols: Steps S1, S2, S3, S4, S5, S6, S7 Laminated body 100 Waveguide motherboard 10 Transparent substrate 11 Reflective film 13 Separator 50 Spacer 51 Glue filling gap 60 Glue filling system 200, 300 Connecting groove 210 Bottom groove 211 Glue filling groove 213 Bottom baffle 215 Side baffle 217 Carrying device 310 Bottom plate 311 Side plate 313 Glue filling gap 314 Sealing film 315 Adhesive 80 Syringe 90 Optical waveguide array 400 Height a Widthb spacing c, d

[0043] The following specific embodiments will further illustrate the present invention in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0044] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments.

[0045] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0046] In order to further illustrate the technical means and effects adopted by this application to achieve the intended purpose, the following detailed description of this application is made in conjunction with the accompanying drawings and preferred implementation methods.

[0047] Referring to FIG. 1 , the optical waveguide array manufacturing method provided in an embodiment of the present application includes:

[0048] Step S1: providing a plurality of waveguide masters, each of the waveguide masters comprising a transparent substrate and a reflective film disposed on at least one surface of the transparent substrate;

[0049] Step S2: providing a separation layer on the reflective film of each waveguide motherboard;

[0050] Step S3: stacking the plurality of waveguide mother slices in sequence to form a stacked body, wherein two adjacent waveguide mother slices are separated by the separation layer to form a glue filling gap;

[0051] Step S4: constructing communicating vessels at opposite ends of the stacked body, respectively, wherein the two communicating vessels are connected to each other through each of the glue-filled seams;

[0052] Step S5: adding adhesive to each communicating vessel until the adhesive completely fills each glue filling seam;

[0053] Step S6: curing the adhesive;

[0054] Step S7: cutting the bonded stack along a direction perpendicular to the transparent substrate to obtain a plurality of optical waveguide arrays.

[0055] Specifically, referring to Figure 2, in step S1, the transparent substrate 11 is a transparent plate, such as glass, resin, plastic (such as polycarbonate or acrylic, etc.), etc. The thickness of the transparent substrate 11 can be 0.1mm-5mm.

[0056] The thickness difference between the multiple transparent substrates 11 is less than 33 μm, and the flatness deviation is less than 2 μm. Specifically, the optical waveguide array includes multiple optical waveguides arranged in parallel and a reflective layer disposed between two adjacent optical waveguides. The reflective layer is plated on the surface of the optical waveguides and is used to reflect light in the same direction. The optical waveguides are cut from the waveguide mother substrate 10. Therefore, by setting the thickness difference and flatness deviation between the multiple transparent substrates 11, the thickness difference and flatness deviation between the multiple waveguide mother substrates 10 can be controlled, which helps to ensure the consistency of the dimensions of the multiple optical waveguides. In turn, the multiple reflective surfaces are arranged parallel and equidistantly, which helps to ensure the imaging effect of the optical waveguides.

[0057] In this embodiment, step S1 specifically includes: coating the reflective film 13 on both sides of each transparent substrate 11. In other embodiments, step S1 may also be coating the reflective film 13 on only one side of each transparent substrate 11, which is not limited in this application.

[0058] The thickness of the reflective film 13 is 1 μm to 300 μm. Specifically, the reflective film 13 can be a metal reflective film such as aluminum, silver, copper, gold, chromium, or platinum, or a metal-dielectric reflective film such as silicon monoxide, magnesium fluoride, silicon dioxide, or aluminum oxide, or a combination of these. The reflective film 13 can be deposited on the transparent substrate 11 by one or more of vacuum evaporation, magnetron sputtering, ion plating, chemical vapor deposition, sol-gel, photolithography, and other processes, which are not limited in this application.

[0059] In other embodiments, after the reflective film 13 is plated on the transparent substrate 11, an inorganic material protective film layer or a polymer material anti-reflective film layer may be plated on the surface of the reflective film 13 to provide protection or enhance transmission.

[0060] Referring to Figures 2 and 3 , step S2 includes disposing a plurality of columnar spacers 51 on the surface of the reflective film 13 at intervals. Each spacer 51 has a height a ranging from 1 μm to 100 μm, a width b ranging from 50 μm to 200 μm, and a distance c between two adjacent spacers 51 ranging from 100 μm to 5000 μm. Specifically, the separation layer 50 comprises a plurality of spacers 51 arranged at intervals. Each spacer 51 is a columnar structure with a flat top. The spacers 51 are used to abut the two waveguide masters 10 when stacked, thereby preventing the two waveguide masters 10 from being completely aligned. Glue filling gaps 60 are formed between the plurality of spacers 51. After the two waveguide masters 10 are separated by the plurality of spacers 51, adhesive can flow through the glue filling gaps 60 between the two waveguide masters 10, thereby bonding the two waveguide masters 10 together. When the viscosity of the adhesive is high, the height a of the spacer 51 can be set larger to facilitate the adhesive to flow into the glue filling gap 60. When the viscosity of the adhesive is low, the height a of the spacer 51 can be set smaller to enable the waveguide mother sheets 10 to be stacked compactly.

[0061] The spacer 51 can be set on the reflective film 13 by one of the methods of photolithography exposure, screen printing, inkjet printing, nanoimprinting, ultraviolet curing transfer, laser etching or electrostatic spray curing. Depending on the setting process, the spacer 51 can also be made of different materials, and this application does not impose any restrictions on this.

[0062] When the spacers 51 are arranged using photolithography, screen printing, inkjet printing, nanoimprinting, UV curing transfer, or laser etching, the multiple spacers 51 can be arranged at equal intervals. If the spacing c between the spacers 51 is too large, it can easily cause deformation of the waveguide master 10, and thus deformation of the optical waveguide, affecting the imaging effect. If the spacing between the spacers 51 is too small, the overall volume of the glue filling gap 60 will be reduced, resulting in a smaller amount of adhesive injected between the two waveguide masters 10, reducing the bonding strength.

[0063] When the spacers 51 are disposed using an electrostatic spraying and curing process, spherical particles of 1 μm to 20 μm can be selected and disposed on the reflective film 13 by electrostatic spraying, and then fixed to the surface of the reflective film 13 by heating and curing. During the electrostatic spraying process, the spacing between the spacers can be controlled by controlling the density of the sprayed spacers 51, thereby achieving the effect of disposing the spacers 51 at approximately equal intervals.

[0064] The spacers 51 can be set to black or other dark colors to avoid affecting the imaging of the optical waveguide array. Specifically, the optical waveguide array is used to reflect light. When the spacers 51 are set to white or other colors, when the light passes through the optical waveguide array, the color of the spacers 51 itself will be mixed with the light, thereby changing the color of the light and affecting the final imaging effect.

[0065] Continuing with FIG2 , step S3 includes setting the levelness tolerance between each waveguide master 10 in the stack 100 to be less than or equal to 2 μm. Specifically, because the optical waveguide array requires that multiple optical waveguides be arranged in parallel, it is necessary to ensure the levelness tolerance between the multiple waveguide masters 10 when stacking them.

[0066] During the process of arranging the stacked body 100, when only one side of each transparent substrate 11 is provided with the reflective film 13 and the spacer layer 50, the multiple waveguide masters 10 need to be arranged in the same direction, so that the side of each waveguide master 10 provided with the reflective film 13 is bonded to the side of another waveguide master 10 not provided with the reflective film 13. When both sides of each transparent substrate 11 are provided with the reflective film 13, the arrangement direction of the multiple waveguide masters 10 is not restricted.

[0067] In this embodiment, please refer to FIG. 4 and FIG. 5 , step S4 specifically includes:

[0068] Step S411: providing a communication groove 210, wherein the communication groove 210 includes a bottom groove 211 and two glue pouring grooves 213, and the two glue pouring grooves 213 are respectively connected to one end of the bottom groove 211;

[0069] Step S412: providing a bottom baffle 215 and two side baffles 217, covering the bottom groove 217 with the bottom baffle 215, and movably setting the two side baffles 217 on the opening side of the glue pouring groove 213, so that the two glue pouring grooves 213 are connected through the bottom groove 211;

[0070] Step S413 : placing the stacked body 100 on the bottom baffle 215 , with both ends of each glue caulking seam 60 aligned with the two side baffles 217 .

[0071] Specifically, the connecting groove 210 is a U-shaped groove structure, including a bottom groove 211 and two glue pouring grooves 213 at the ends. The opening of the bottom groove 211 faces the two glue pouring grooves 213, and the openings of the two glue pouring grooves 213 are arranged opposite each other. The bottom baffle 215 is used to cover the opening of the bottom groove 211, and the side baffles 217 are used to movably cover the openings of the glue pouring grooves 213. When the bottom baffle 215 and the side baffles 217 are both installed on the connecting groove 210, the connecting groove 210 forms a communicating vessel structure. That is, when liquid is injected into one glue pouring groove 213, because the two glue pouring grooves 213 are connected through the bottom groove 211, the liquid will flow into the other glue pouring groove 213 under the action of atmospheric pressure, and the liquid level in the two glue pouring grooves 213 will be the same.

[0072] Step S413 specifically involves placing the stack 100 on the bottom baffle 215 so that three of the four surfaces formed by overlapping the plurality of waveguide mother sheets 10 correspond to the bottom baffle 215 and the two side baffles 217. This allows one side baffle 217 to communicate with another side baffle 217 through each glue slit 60.

[0073] Step S413 further includes: sealing the two waveguide mother sheets 10 at both ends of the stacked body 100 with the communicating groove 210 respectively, so that the stacked body 100 and the communicating groove 210 together form a groove structure with an open top.

[0074] In this embodiment, step S5 is specifically as follows:

[0075] Step S511: injecting the adhesive into the adhesive filling tank until the communicating tank is filled with the adhesive;

[0076] Step S512: removing the two side baffles to allow the adhesive in the adhesive filling groove to flow into each of the adhesive filling seams;

[0077] Step S513: Continue injecting the adhesive until the adhesive completely fills each of the adhesive filling gaps.

[0078] Specifically, in step S511 , the adhesive 80 may be injected into only one of the adhesive filling grooves 213 , or may be injected into both adhesive filling grooves 213 at the same time, which is not limited in this embodiment.

[0079] The adhesive 80 may be injected through a syringe 90 or poured directly. The adhesive 80 needs to be injected continuously and at a uniform speed to avoid air being drawn in.

[0080] In step S512, after the side baffles 217 are removed, a communicating vessel structure is formed between the glue trough 213 and the glue slit 60. Therefore, under the influence of atmospheric pressure, the adhesive 80 in the glue trough 213 begins to flow into the glue slit 60, thereby filling the glue slit 60. Specifically, the adhesive 80 first flows from both sides of the glue slit 60 toward the center, and then begins to flow upward under the influence of atmospheric pressure until the liquid level of the adhesive 80 in the glue slit 60 is flush with the liquid level in the glue trough 213.

[0081] In step S513, the adhesive 80 is continued to be injected by injecting the adhesive 80 into only one glue pouring groove 213, or by injecting the adhesive 80 into both glue pouring grooves 213 at the same time. Since the adhesive 80 is also connected through the bottom groove 211, when the adhesive 80 is injected into only one glue pouring groove 213, the adhesive 80 can flow into the other glue pouring groove 213 through the bottom groove 211 under the action of atmospheric pressure, thereby ensuring that the glue pouring gap 60 can still be injected with adhesive 80 by the two glue pouring grooves 213 at the same time, thereby ensuring that the adhesive liquid level in the glue pouring gap 60 remains flat, thereby improving the stability of the glue pouring.

[0082] In another embodiment, referring to FIG. 6 , step S4 specifically includes:

[0083] Step S421: providing a carrying device, wherein the carrying device includes a bottom plate and side plates provided at both ends of the bottom plate;

[0084] Step S422: placing the stacked body on the bottom plate, forming glue injection gaps between the stacked body and the two side plates, and aligning opposite ends of each glue injection gap with the two side plates;

[0085] Step S423: Sealing films are respectively provided on the waveguide motherboards at both ends of the stacked body to seal the stacked body and the supporting device.

[0086] Specifically, the carrier 310 includes a base plate 311 and side plates 313 perpendicular to the base plate 311 and disposed at either end of the base plate 311. The base plate 311 and the side plates 313 form a U-shaped structure. The stack 100 is disposed on the base plate 311, with a glue injection gap 314 formed between the stack and the two side plates 313. Three of the four surfaces formed by the overlapping waveguide motherboards 10 correspond to the base plate 311 and the two side plates 313, respectively. This allows one glue injection gap 314 to communicate with another glue injection gap 314 via each glue injection seam 60.

[0087] In step S423 , the sealing film 315 is specifically used to connect and seal the stacked body 100 , the bottom plate 311 , and the two side plates 313 , so that the two glue injection gaps 314 form a communicating vessel structure.

[0088] The width of the glue injection gap 314 can be set to 1cm-5cm, which can be determined according to the glue injection method in actual application. The smaller the width of the glue injection gap 314, the higher the glue injection accuracy requirement, and the less amount of adhesive 80 is ultimately used.

[0089] The sealing film 315 is a high temperature resistant film to prevent the adhesive 80 from being damaged when releasing heat. The sealing film 315 can also be made of a transparent material to facilitate observation of the height of the liquid level in the glue injection gap 314.

[0090] In this embodiment, step S5 specifically includes injecting adhesive 80 into each of the two adhesive injection gaps 314 until the adhesive gaps 60 are completely filled with the adhesive 80. Specifically, by injecting adhesive 80 into the two adhesive injection gaps 314, the adhesive 80 flows toward the middle adhesive gap 60 under the action of atmospheric pressure, thereby filling the adhesive gap 60. Ultimately, when the adhesive 80 fills both adhesive injection gaps 314, all adhesive gaps 60 are also completely filled with the adhesive 80.

[0091] Step S6 specifically includes placing the communicating vessel structure into an oven for curing, thereby obtaining a fully bonded laminate 100. Specifically, after all the glue slits 60 of the laminate 100 are filled with adhesive 80, the entire glue slit system can be directly heated to cure the adhesive 80, thereby preventing the adhesive 80 from flowing out of the glue slits 60 when the laminate 100 is removed, thereby affecting the bonding effect.

[0092] Step S6 further includes: after the curing time exceeds 24 hours, performing annealing treatment on the stacked body 100 twice or more to eliminate the curing stress.

[0093] Referring to Figure 7, step S7 specifically includes cutting the laminate 100, and performing processes such as grinding and polishing to obtain multiple optical waveguide arrays 400. Specifically, the laminate 100 is first cut out of the communicating vessel structure, and then the laminate 100 is cut perpendicularly to the transparent substrate 11 to obtain multiple optical waveguide arrays 400. The optical waveguide arrays 400 are then processed through processes such as grinding and polishing to eliminate surface wear caused by the previous processes.

[0094] Adhesive 80 can be a two-component thermosetting adhesive. The two components are stored separately when not in use and are mixed together when in use to form a viscous adhesive 80. The viscosity of adhesive 80 is less than or equal to 1000 Pa.s. The workable time of the mixed adhesive 80 is greater than one hour. The curing temperature of adhesive 80 is between 70°C and 200°C. In other embodiments, adhesive 80 can also be configured as a single-component adhesive, as desired, and this application is not limited thereto.

[0095] The optical waveguide array manufacturing method provided in the embodiments of the present application places a stacked body 100 formed by stacking multiple waveguide mother sheets 10 into a connecting tube. The glue-filling seams 60 between two adjacent waveguide mother sheets 10 are connected to the connecting tube structure. Adhesive can then be injected into the connecting tube structure to flow into the glue-filling seams 60, thereby bonding the multiple waveguide mother sheets 10 together. This manufacturing method is simple, ensures imaging quality, and helps reduce production costs.

[0096] The present application also provides a glue potting system 200, as shown in Figures 4 and 5. The glue potting system 200 includes a connecting groove 210, a bottom baffle 215, two side baffles 217, and a stacking body 100. The connecting groove 210 is a U-shaped groove structure, comprising a bottom groove 211 at the bottom and glue potting grooves 213 at two ends. The opening of the bottom groove 211 faces the two glue potting grooves 213, and the openings of the two glue potting grooves 213 are arranged opposite each other, so that the two glue potting grooves 213 are connected through the bottom groove 211. The bottom baffle 215 is used to cover the opening of the bottom groove 211, and the side baffles 217 are used to movably cover the openings of the glue potting grooves 213. The stacking body 100 is disposed on the bottom baffle 215. The stacking body 100 includes a plurality of stacked waveguide motherboards 10. A glue potting gap 60 is formed between two adjacent waveguide motherboards 10, and each end of the glue potting gap 60 corresponds to a side baffle 217.

[0097] The glue potting system 200 provided in this embodiment of the present application forms a communicating vessel structure between two glue potting tanks 213 by providing a connecting tank 210 in combination with a bottom baffle 215 and two side baffles 217. By placing the stacked body 100 on the bottom baffle 215 and providing two movable side baffles 217, the glue potting slit 60 can be connected to the two glue potting tanks 213 after the side baffles 217 are removed from the openings of the glue potting tanks 213. This facilitates the flow of adhesive 80 through the glue potting tanks 213 into the glue potting slit 60, thereby enabling the bonding of multiple waveguide motherboards 10.

[0098] The present embodiment also provides a glue injection system 300. Referring to FIG6 , the glue injection system 300 includes a carrier 310, a stack 100, and multiple sealing films 315. The carrier 310 includes a base plate 311 and side plates 313 perpendicular to the base plate 311 and disposed at both ends of the base plate 311. The base plate 311 and the side plates 313 form a U-shaped structure. The stack 100 is disposed on the base plate 311, and a glue injection gap 314 is formed between the stack 100 and the two side plates 313. Three of the four surfaces formed by the overlapping waveguide mother sheets 10 correspond to the base plate 311 and the two side plates 313, respectively. This allows one glue injection gap 314 to communicate with another glue injection gap 314 through each glue injection seam 60. The sealing films 315 are specifically used to connect and seal the stack 100 with the base plate 311 and the two side plates 313, thereby forming a communicating vessel structure between the two glue injection gaps 314.

[0099] The glue potting system 300 provided in the embodiment of the present application, by providing a bottom plate 311, side plates 313, a laminated body 100, and a sealing film 315, can form a communicating vessel structure with the glue potting seam 60 and the two glue injection gaps 314. When the adhesive 80 is injected into the two glue injection gaps 314, the adhesive 80 can flow into the glue potting seam 60 under the action of atmospheric pressure, thereby achieving bonding of multiple waveguide motherboards 10.

[0100] Those skilled in the art should recognize that the above embodiments are merely intended to illustrate the present application and are not intended to limit the present application. As long as they are within the spirit of the present application, appropriate changes and modifications to the above embodiments are within the scope of protection claimed in the present application.

Claims

1. A method for manufacturing an optical waveguide array, characterized in that: include: Providing a plurality of waveguide masters, each of the waveguide masters comprising a transparent substrate and a reflective film disposed on at least one surface of the transparent substrate; providing a separation layer on the reflective film of each of the waveguide mother substrates; stacking the plurality of waveguide mother slices in sequence to form a stacked body, wherein two adjacent waveguide mother slices are separated by the separation layer to form a glue filling gap; Building communicating vessel structures at opposite ends of the stacked body, respectively, wherein the two communicating vessels are connected to each other through each of the glue-filled seams; Adding adhesive to each communicating vessel respectively until the adhesive completely fills each glue filling seam; curing the adhesive; The bonded stacked body is cut along a direction perpendicular to the transparent substrate to obtain a plurality of optical waveguide arrays.

2. The method for manufacturing an optical waveguide array according to claim 1, wherein: The thickness difference between the plurality of transparent substrates is less than 3 μm, and the planarity deviation is less than 2 μm.

3. The method for manufacturing an optical waveguide array according to claim 1, wherein: The step of providing a plurality of waveguide mother substrates includes: coating the reflective film on one surface of each of the transparent substrates; or coating the reflective film on both surfaces of each of the transparent substrates.

4. The method for manufacturing an optical waveguide array according to claim 1, wherein: The step of providing a separation layer on the reflective film of each waveguide motherboard specifically includes: providing a plurality of columnar spacers on the surface of the reflective film, wherein the height of each spacer is 1 μm-100 μm, the width of each spacer is 50 μm-200 μm, and the distance between two adjacent spacers is 100 μm-5000 μm.

5. The method for manufacturing an optical waveguide array according to claim 1, wherein: The step of providing a separation layer on the reflective film of each waveguide master specifically includes providing a plurality of spacers on the surface of the reflective film by photolithography exposure, screen printing, inkjet printing, nanoimprinting, ultraviolet curing transfer, laser etching or electrostatic spray curing.

6. The method for manufacturing an optical waveguide array according to claim 1, wherein: The step of stacking the plurality of waveguide mother slices in sequence to form a stacked body, wherein two adjacent waveguide mother slices are separated by the spacer layer to form a glue filling seam includes: setting a levelness tolerance between each waveguide mother slice in the stacked body to be less than or equal to 2 μm.

7. The method for manufacturing an optical waveguide array according to claim 1, wherein: The viscosity of the adhesive is less than 1000 Pa·s, and the curing temperature is 70° C.-200° C.

8. The method for manufacturing an optical waveguide array according to claim 1, wherein: The steps of respectively building communicating vessel structures at opposite ends of the stack, wherein the two communicating vessels are connected to each other through each of the glue-filled seams, specifically include: Providing a communication groove, the communication groove includes a bottom groove and two glue pouring grooves, the two glue pouring grooves are respectively connected to one end of the bottom groove; Providing a bottom baffle and two side baffles, covering the bottom trough with the bottom baffle, and movably setting the two side baffles on the opening side of the glue pouring trough so that the two glue pouring troughs are connected through the bottom trough; The stacked body is placed on the bottom baffle, with both ends of each of the glue-filled seams aligned with the two side baffles.

9. The method for manufacturing an optical waveguide array according to claim 8, wherein: The step of adding adhesive to each communicating vessel until the adhesive completely fills each glue filling seam specifically includes: injecting the adhesive into the adhesive pouring groove until the communicating groove is filled with the adhesive; Removing the two side baffles to allow the adhesive in the glue pouring groove to flow into each glue pouring seam; Continue injecting the adhesive until the adhesive completely fills each of the adhesive filling gaps.

10. The method for manufacturing an optical waveguide array according to claim 1, wherein: The steps of respectively building communicating vessel structures at opposite ends of the stack, wherein the two communicating vessels are connected to each other through each of the glue-filled seams, specifically include: Providing a carrying device, the carrying device comprising a bottom plate and side plates arranged at both ends of the bottom plate; Placing the stacked body on the bottom plate, forming glue injection gaps between the stacked body and the two side plates, and aligning opposite ends of each glue injection gap with the two side plates; Sealing films are respectively provided on the waveguide motherboards at both ends of the stacked body to seal the stacked body and the carrying device.

11. The method for manufacturing an optical waveguide array according to claim 10, wherein: The step of adding adhesive to each communicating vessel respectively until the adhesive completely fills each glue injection gap specifically includes: injecting the adhesive into the two glue injection gaps respectively.

12. The method for manufacturing an optical waveguide array according to claim 10, wherein: The width of the glue injection gap is 1cm-5cm.

13. A glue filling system, characterized in that: include: A communication groove, the communication groove comprising a bottom groove and two glue pouring grooves, the two glue pouring grooves being respectively connected to one end of the bottom groove; a bottom baffle, arranged on the bottom trough; Two side baffles are movably arranged on the opening sides of the glue pouring trough; as well as A stacked body is arranged on the bottom baffle, and the stacked body includes a plurality of stacked waveguide mother sheets. A glue filling seam is formed between two adjacent waveguide mother sheets, and both ends of the glue filling seam correspond to one of the side baffles respectively.

14. A glue filling system, characterized in that: include: The bearing device comprises a bottom plate and side plates arranged at both ends of the bottom plate; a stacked body disposed on the bottom plate, the stacked body comprising a plurality of stacked waveguide mother sheets, a glue filling seam formed between two adjacent waveguide mother sheets, and two ends of the glue filling seam corresponding to one of the side panels respectively; and A plurality of sealing films are respectively arranged between the two waveguide mother sheets at both ends of the stack and the supporting device.

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