Component mounting system, management device, and information processing method

Abstract

This component mounting system (1) comprises: a nozzle (15) that is capable of sucking and holding a component (P); a measurement unit (16) that measures a physical quantity of air flowing through a flow path communicating with the nozzle (15) in a state in which the nozzle (15) is not sucking the component (P); an imaging unit that images the component (P) sucked to the nozzle (15); a component suction determination unit (35a) that determines the quality of a suction state of the component (P) on the basis of image information obtained through the imaging by the imaging unit; an inspection unit (35b) for inspecting the state of the flow path on the basis of a measured value from the measurement unit (16); and a threshold setting unit (36) that sets a threshold (Th) for detecting an abnormal state of the flow path by means of the inspection unit (35b) on the basis of the determination result from the component suction determination unit (35a) and the inspection result from the inspection unit (35b).

Description

Component mounting system, management device, and information processing method

[0001] The present disclosure relates to a component mounting system, a management device, and an information processing method.

[0002] Conventionally, component mounting devices have been known that include a mounting head with one or more nozzles for holding components, which adsorbs and holds the components using the mounting head, thereby mounting the components on a board. The component mounting device applies negative pressure to a gas flow path leading to the nozzle, generating a suction force at the tip of the nozzle to adsorb and hold the components. If the pressure in the flow path does not decrease when the component is being adsorbed, the component mounting device may encounter errors such as an inability to adsorb the component or an error related to the adsorption state of the component held by the nozzle. Repeated occurrences of such component adsorption errors could halt production by the component mounting device and reduce productivity. Therefore, it is desirable to inspect the mounting head by measuring the physical quantity (e.g., flow rate or pressure) of air in the flow path and comparing the measured value with a threshold value. Patent Document 1 discloses a system for detecting abnormalities in a nozzle that adsorbs components. This system detects nozzle abnormalities by comparing the output value of a flow meter measuring the flow rate of air passing through the nozzle with an abnormality detection value used to determine nozzle abnormalities.

[0003] Japanese Patent Application Laid-Open No. 2004-103922

[0004] The pressure in the flow path when a component is picked up varies depending on the cross-sectional area of ​​the nozzle tip occupied by the component. In other words, the combination of the type of component picked up by the nozzle and the type of nozzle affects the pressure in the flow path when the component is picked up. The system described in Patent Document 1 measures the physical quantity of air for a nozzle when it is not picking up a component and can determine whether the nozzle is malfunctioning based on the measurement value, but it cannot determine whether the pressure in the flow path when picking up a component is sufficiently low. As a result, there is a risk of false detection, such as a nozzle that has not experienced a component pick-up error being identified as malfunctioning, or a nozzle that has experienced a component pick-up error being identified as normal. Such false detections could halt production by the component mounting device and reduce productivity.

[0005] The present disclosure provides a component mounting system, etc., that can suppress false detection of abnormalities in a flow path by measuring the physical quantity of air in a flow path leading to a nozzle and appropriately setting a threshold value for detecting an abnormal state of the flow path based on the measured physical quantity.

[0006] A component mounting system according to one aspect of the present disclosure includes a nozzle capable of adsorbing and holding a component, a measurement unit that measures the physical quantity of air flowing through a flow path connected to the nozzle when the nozzle is not adsorbing a component, an imaging unit that images the component adsorbed by the nozzle, a component adsorption determination unit that determines whether the component is in a good or bad state based on image information obtained by imaging by the imaging unit, an inspection unit that inspects the state of the flow path based on measurements by the measurement unit, and a threshold setting unit that sets a threshold for detecting an abnormal state of the flow path by the inspection unit based on the determination result of the component adsorption determination unit and the inspection result of the inspection unit.

[0007] A management device according to one aspect of the present disclosure includes a component adsorption determination unit that determines whether the component adsorption state is good or bad based on image information obtained by capturing an image of the component adsorbed onto the nozzle; an inspection unit that inspects the state of the flow path based on a measurement value obtained by measuring the physical quantity of air flowing through the flow path connected to the nozzle when the nozzle is not adsorbing the component; and a threshold setting unit that sets a threshold value for detecting an abnormal state of the flow path by the inspection unit based on the determination result of the component adsorption determination unit and the inspection result of the inspection unit.

[0008] An information processing method according to one aspect of the present disclosure includes the steps of obtaining a measurement value obtained by measuring a physical quantity of air flowing through a flow path connected to a nozzle when the nozzle is not adsorbing a component; capturing an image of the component adsorbed by the nozzle; determining whether the component is in a good or bad state based on image information obtained in the step of capturing the image of the component; inspecting the state of the flow path based on the measurement value; and setting a threshold value for detecting an abnormal state in the inspection of the state of the flow path based on the determination result of whether the component is in a good or bad state and the inspection result of the state of the flow path.

[0009] These comprehensive or specific aspects may be realized as an apparatus, a system, a method, an integrated circuit, a computer program, or a computer-readable recording medium such as a CD-ROM, or may be realized as any combination of an apparatus, a system, a method, an integrated circuit, a computer program, and a recording medium. The recording medium may also be a non-transitory recording medium.

[0010] According to the component mounting system etc. of the present disclosure, it is possible to suppress false detection of an abnormality in the flow path leading to the nozzle.

[0011] FIG. 1 is a diagram showing the configuration of a component mounting system according to a first embodiment. FIG. 2 is an external perspective view of a component mounting device included in the component mounting system. FIG. 3 is a plan view of the component mounting device. FIG. 4 is a perspective view showing a transfer head used in the component mounting device. FIG. 5 is a block diagram showing the configurations of a vacuum suction system and an air blow system in the component mounting device. FIG. 6 is a block diagram showing the configurations of a component mounting device and a management device included in the component mounting system according to the first embodiment. FIG. 7 is a diagram showing the pass / fail of a component suction state, the relationship between a flow rate measured by a measurement unit and a threshold value for determining the pass / fail of the physical amount of air in the nozzle, and whether the threshold value has been changed. FIG. 8 is a diagram showing an example of threshold reset information stored in a storage unit. FIG. 9 is a flowchart showing an information processing method according to the first embodiment. FIG. 10 is a diagram showing an example of a screen displayed in a component mounting system according to a modification of the first embodiment. FIG. 11 is a block diagram showing the configurations of a component mounting device and a management device included in a component mounting system according to a second embodiment. FIG. 12 is a flowchart showing an information processing method according to the second embodiment. FIG. 13 is a block diagram showing the configuration of an information processing system including a component mounting system according to a third embodiment.

[0012] (Background to the present disclosure) In component mounting devices, if dust, dirt, or other particles adhere to the tip of the nozzle that picks up an electronic component, the nozzle's suction power decreases, which can lead to incorrect pickup of the electronic component and incorrect placement on the board. Therefore, at production sites, the flow rate of air flowing through the flow path leading to the nozzle is detected, and when the detected flow rate falls below a predetermined threshold, maintenance is performed on the flow path (e.g., nozzle, filter).

[0013] Although the predetermined threshold is set in advance for each nozzle, in reality, for example, multiple types of electronic components may be handled with one type of nozzle to avoid excessive nozzle variations, making it difficult to set the predetermined threshold to accommodate multiple types of electronic components. For example, if the predetermined threshold is set too high, there is a problem that the number of times the component mounting device is stopped and the number of times maintenance work is performed on the flow path increases more than necessary. On the other hand, if the predetermined threshold is set too low, there is a problem that a decrease in the nozzle's component suction force cannot be detected, resulting in an increase in pickup errors and placement errors.

[0014] In order to solve the above problems, the component mounting system of the present disclosure has the following configuration: The component mounting system etc. of the present disclosure will be exemplified below.

[0015] The component mounting system of Example 1 includes a nozzle capable of adsorbing and holding a component, a measurement unit that measures the physical quantity of air flowing through a flow path connected to the nozzle when the nozzle is not adsorbing a component, an imaging unit that images the component adsorbed by the nozzle, a component adsorption determination unit that determines whether the component is in a good or bad state based on image information obtained by imaging by the imaging unit, an inspection unit that inspects the state of the flow path based on measurement values ​​by the measurement unit, and a threshold setting unit that sets a threshold value for detecting an abnormal state of the flow path by the inspection unit based on the determination result of the component adsorption determination unit and the inspection result of the inspection unit.

[0016] With this configuration, it is possible to appropriately set a threshold value for detecting an abnormal state of the flow path based on the physical quantity of air flowing in the flow path connected to the nozzle, thereby making it possible to appropriately determine the abnormal state of the flow path and suppress erroneous detection of an abnormality in the flow path.

[0017] The component mounting system of Example 2 is the component mounting system described in Example 1, and the inspection unit may determine that the flow path is not in an abnormal state when the measurement value is equal to or greater than the threshold value, and may determine that the flow path is in an abnormal state when the measurement value is smaller than the threshold value.

[0018] With this configuration, the state of the flow path can be inspected based on the measurement value and the threshold value before resetting, and the threshold value can be reset based on the inspection result of the flow path and the judgment result of the component adsorption judgment unit, thereby making it possible to appropriately inspect the state of the flow path using the reset threshold value.

[0019] A component mounting system of Example 3 is the component mounting system described in Example 1 or 2, and the threshold setting unit may reset the threshold so that the threshold is lower than a preset value when the component adsorption determination unit determines that the component adsorption state is good and the inspection unit detects that the flow path is in an abnormal state.

[0020] In this way, when the component suction state is determined to be good and the flow path is detected to be in an abnormal state, the flow path state can be appropriately inspected by lowering the threshold value, which, for example, corrects erroneous detection of an abnormal state of the flow path and prevents unnecessary increases in the number of times the component mounting device is stopped and maintenance of the flow path is performed.

[0021] A component mounting system of Example 4 is the component mounting system according to Example 3, wherein the threshold setting unit may reset the threshold so that the threshold is a value lower than the measurement value.

[0022] In this way, by resetting the threshold value so that the threshold value is lower than the measured value, the state of the nozzles can be inspected appropriately.

[0023] A component mounting system of Example 5 is the component mounting system described in Example 1 or 2, and the threshold setting unit may reset the threshold so that it is higher than a preset value when the component adsorption determination unit determines that the component adsorption state is not good and the inspection unit does not detect an abnormal state of the flow path.

[0024] In this way, when it is determined that the component suction state is not good and the flow path is not abnormal, the flow path state can be properly inspected by increasing the threshold value, which corrects the failure to detect, for example, a decrease in the nozzle's component suction force, and prevents an increase in suction errors and placement errors.

[0025] A component mounting system of Example 6 is the component mounting system according to Example 5, wherein the threshold setting unit may reset the threshold so that the threshold is equal to or greater than the measured value.

[0026] In this way, by resetting the threshold value so that the threshold value is equal to or greater than the measured value, the state of the flow path can be appropriately inspected.

[0027] The component mounting system of Example 7 is the component mounting system described in any one of Examples 1 to 6, wherein the threshold setting unit may maintain the threshold value without changing it when the component adsorption determination unit determines that the component adsorption state is good and the inspection unit does not detect an abnormal state of the flow path, or when the component adsorption determination unit determines that the component adsorption state is not good and the inspection unit detects an abnormal state of the nozzle.

[0028] This makes it possible to appropriately inspect the state of the flow path using the current threshold value without changing the threshold value more than necessary.

[0029] The component mounting system of Example 8 is a component mounting system described in any of Examples 1 to 7, wherein when the threshold setting unit resets the threshold, it outputs information about the reset threshold to the inspection unit, and the inspection unit inspects the state of the flow path based on the measurement value and the reset threshold.

[0030] This allows the threshold to be changed in real time according to the state of the nozzle, thereby enabling the state of the flow passage to be appropriately inspected in real time.

[0031] The component mounting system of Example 9 is the component mounting system described in any one of Examples 1 to 8, and further includes a memory unit that stores information regarding the type of component, the type of nozzle, and the threshold value, and when the threshold value is reset, the threshold value setting unit outputs information regarding the reset threshold value to the memory unit, and the memory unit may store the information regarding the type of component, the type of nozzle, and the reset threshold value in association with each other.

[0032] This makes it possible to appropriately inspect the state of the flow path using the reset threshold value that is stored in association with the type of component and the type of nozzle.

[0033] The component mounting system of Example 10 is the component mounting system described in Example 9, and the inspection unit may detect an abnormal state of the flow path based on the measurement value and the reset threshold value stored in the memory unit.

[0034] This makes it possible to properly inspect the state of the flow path using the reset threshold value stored in the storage unit even in future component mounting operations that use the same component and nozzle combination, for example.Furthermore, it becomes possible to properly inspect the state of the flow path using the reset threshold value stored in the storage unit even in component mounting devices other than the component mounting device that reset the threshold value.

[0035] The component mounting system of Example 11 is a component mounting system described in any one of Examples 1 to 10, and further includes an alarm unit that notifies information regarding an abnormal state of the flow path, and when the threshold value setting unit resets the threshold value, it outputs reset information indicating that the threshold value has been reset to the alarm unit, and the alarm unit may notify the reset information.

[0036] This makes it possible to notify the worker or the like working on the component mounting system that the threshold value has been reset.

[0037] The component mounting system of Example 12 is a component mounting system described in any one of Examples 1 to 10, and further includes an alarm unit that notifies a status indicating an abnormal state of the flow path for each nozzle, and the alarm unit may notify that the status has been changed due to the resetting of the threshold value.

[0038] This makes it possible to notify an operator working on the component mounting system that the status of the flow path has been changed.

[0039] The management device of Example 13 includes a component adsorption determination unit that determines whether the component adsorption state is good or bad based on image information obtained by capturing an image of the component adsorbed onto the nozzle; an inspection unit that inspects the state of the flow path based on a measurement value obtained by measuring the physical quantity of air flowing through the flow path connected to the nozzle when the nozzle is not adsorbing the component; and a threshold setting unit that sets a threshold value for detecting an abnormal state of the flow path by the inspection unit based on the determination result of the component adsorption determination unit and the inspection result of the inspection unit.

[0040] With this configuration, it is possible to appropriately set a threshold value for detecting an abnormal state of the flow path based on the physical quantity of air flowing in the flow path connected to the nozzle, thereby making it possible to appropriately determine the abnormal state of the flow path and suppress erroneous detection of an abnormality in the flow path.

[0041] The information processing method of Example 14 includes the steps of obtaining a measurement value obtained by measuring a physical quantity of air flowing through a flow path connected to a nozzle when the nozzle is not adsorbing a component; capturing an image of the component adsorbed by the nozzle; determining whether the component is in a good or bad state based on the image information obtained in the step of capturing the image of the component; inspecting the state of the flow path based on the measurement value; and setting a threshold value for detecting an abnormal state in the inspection of the state of the flow path based on the determination result of whether the component is in a good or bad state and the inspection result of the state of the flow path.

[0042] This allows the threshold value for detecting an abnormal state of the flow path to be appropriately set based on the physical quantity of air flowing in the flow path connected to the nozzle, thereby making it possible to appropriately determine the abnormal state of the flow path and suppress erroneous detection of an abnormality in the flow path.

[0043] Hereinafter, the embodiments will be described in detail with reference to the drawings. Note that the embodiments described below are all comprehensive or specific examples. The numerical values, shapes, materials, components, component placement and connection forms, steps, and step order shown in the following embodiments are merely examples and are not intended to limit the present disclosure. Furthermore, among the components in the following embodiments, components that are not described in the independent claims that represent the highest concept will be described as optional components.

[0044] In addition, each drawing is a schematic diagram and is not necessarily an exact illustration. In addition, the same components are denoted by the same reference numerals in each drawing.

[0045] First Embodiment [Overall Configuration of Component Mounting System] FIG. 1 is a diagram showing the configuration of a component mounting system 1 including a component mounting line L1.

[0046] The component mounting system 1 includes a component mounting line L1 and a management device 100.

[0047] The component mounting line L1 is an example of a production facility for mounting boards. The line produces mounted boards by mounting at least one component P on a board B carried in from the upstream side, and then carries the produced mounted board downstream. In this embodiment, the transport direction of the board is referred to as the X-axis direction, and the direction perpendicular to the X-axis direction is referred to as the Y-axis direction. The X-axis and Y-axis directions are directions along a horizontal plane. Furthermore, the direction perpendicular to the X-axis and Y-axis directions is referred to as the Z-axis direction. The positive and negative sides of the X-axis direction are the downstream and upstream sides, respectively, in the transport direction of the board B, and the positive and negative sides of the Y-axis direction are the rear (or back) and front (or near) sides, respectively, in the front-to-back direction. The positive and negative sides of the Z-axis direction are the upper and lower sides, respectively, in the vertical direction. FIG. 1 shows the top surface of the component mounting line L1.

[0048] Component mounting line L1 comprises a solder printing device M1, a print inspection device M2, component mounting devices M3 to M6, a mounting inspection device M7, and a reflow device M8. These devices are arranged in series from upstream to downstream in the conveying direction in the following order: solder printing device M1, print inspection device M2, component mounting devices M3 to M6, mounting inspection device M7, reflow device M8.

[0049] The solder printing device M1, print inspection device M2, component mounting devices M3 to M6, mounting inspection device M7, and reflow device M8 are connected to management device 100 via communication network 50. The solder printing device M1 prints solder on a board B carried in from the upstream side. The print inspection device M2 inspects the condition of the solder printed on board B using a solder inspection camera.

[0050] Component mounting devices M3 to M6 perform component mounting work to mount components P on board B. Note that, although component mounting line L1 is equipped with four component mounting devices M3 to M6, the number is not limited to four and may be one to three, or five or more.

[0051] The mounting inspection device M7 uses a component inspection camera to inspect the condition of the components P attached (mounted) on the board B. The reflow device M8 heats the board B that has been carried into the device, hardening the solder on the board B and joining the electrodes of the board B to the components P.

[0052] The management device 100 is located, for example, in the same building as the component mounting line L1 and communicates with the solder printing device M1, print inspection device M2, component mounting devices M3-M6, mounting inspection device M7, and reflow device M8 included in the component mounting line L1. The management device 100 may communicate with these devices wirelessly or via a wired connection. Wireless communication may be via Wi-Fi (registered trademark), Bluetooth (registered trademark), ZigBee (registered trademark), or specified low-power radio. The management device 100 acquires information indicating the operating rate of each device included in the component mounting line L1 and manages each device based on that information. The management device 100 may also be configured as a personal computer, tablet terminal, smartphone, or the like.

[0053] 2 is a perspective view of the appearance of the component mounting apparatus M3 included in the component mounting system 1. The component mounting apparatuses M4 to M6 may also have the same appearance as the component mounting apparatus M3.

[0054] The component mounting device M3 includes, for example, two component supply units 4 and a notification unit 34. Note that in Fig. 2, one of the two component supply units 4 is shown, and the other is hidden at the back (i.e., on the positive side in the Y-axis direction).

[0055] A plurality of tape feeders 5 are arranged in parallel along the X-axis direction in the component supply unit 4. The tape feeders 5 supply the components P by pitch-feeding a carrier tape containing the components P in the tape feed direction.

[0056] The notification unit 34 presents information to workers working on the component mounting line L1. For example, the notification unit 34 notifies by displaying the presented content. As a specific example, the notification unit 34 is configured as a liquid crystal display or an organic EL (electroluminescence) display.

[0057] Fig. 3 is a plan view of the component mounting device M3. Fig. 4 is a perspective view showing the transfer head 8 used in the component mounting device M3. Note that the plan views of the component mounting devices M4 to M6 may be the same as the plan view of the component mounting device M3, and the explanation thereof will be omitted.

[0058] The component mounting device M3 includes a base 1a, a board transport unit 2, a component supply unit 4, a Y-axis beam 6, an X-axis beam 7, a transfer head 8, a component recognition camera 11, and a board recognition camera 12. The component recognition camera 11 is an example of an imaging unit.

[0059] The base 1a is capable of arranging the substrate B, the substrate transport unit 2, etc. The base 1a has the substrate transport unit 2 disposed on its upper surface, extending along the X-axis direction.

[0060] The board transport unit 2 transports the board B handed over from an upstream device (e.g., print inspection device M2), thereby positioning and holding the board B at the mounting work position. Component supply units 4 are arranged on both sides of the board transport unit 2 in the Y-axis direction.

[0061] The component supply unit 4 is a structure for the transfer head 8 to pick up components P, in other words, for supplying components P to the transfer head 8. A plurality of tape feeders 5 are attached to the component supply unit 4 in a parallel arrangement. The tape feeders 5 feed the carrier tape holding the components P at a pitch, so that the transfer head 8 constituting the component mounting mechanism can position the components P at the mounting position. Note that the component supply unit 4 is not limited to being equipped with tape feeders 5, and may be equipped with, for example, a bulk feeder or the like.

[0062] A long Y-axis beam 6 is disposed horizontally along the Y-axis at one end on the positive side of the X-axis direction on the top surface of the base 1a. A pair of long X-axis beams 7 are attached to the Y-axis beam 6 so as to be slidable along the Y-axis direction.

[0063] One of the pair of X-axis beams 7 is disposed on the positive side of the Y-axis direction relative to the substrate transport unit 2, and the other of the pair of X-axis beams 7 is disposed on the negative side of the Y-axis direction relative to the substrate transport unit 2. In addition, the pair of X-axis beams 7 are disposed horizontally along the X-axis direction.

[0064] The pair of X-axis beams 7 can be moved in the Y-axis direction by a linear drive mechanism of the Y-axis beam 6. A transfer head 8 is slidably mounted on each of the pair of X-axis beams 7.

[0065] 4, the nozzle 15 is a suction nozzle capable of suctioning and holding the component P. The nozzle 15 rotates the picked-up component P at a predetermined angle in a rotation direction (θ direction) parallel to the mounting surface of the board B to mount the component P. The transfer head 8 has a plurality of nozzles 15, and rotates the component P in a rotation direction parallel to the mounting surface of the board B using the nozzles 15 to mount the component P on the board B.

[0066] The transfer head 8 has a plurality of nozzle units 9. The transfer head 8 can move along the X-axis direction by a linear drive mechanism of the X-axis beam 7.

[0067] The linear drive mechanism allows the X-axis beam 7 and the transfer head 8 to move freely in the X-Y plane, and the transfer head 8 uses multiple nozzles 15 provided in the nozzle unit 9 to vacuum suction (suck) the components P from the tape feeders 5 arranged in each component supply section 4, and then moves above the board B to attach (mount) the components P at the mounting position on the board B.

[0068] Furthermore, component recognition cameras 11, which are an example of an imaging unit, are disposed on the base 1a between the board transport unit 2 and each component supply unit 4. When the transfer head 8 that has picked up a component P from the component supply unit 4 passes above the component recognition camera 11, the component recognition camera 11 captures an image of the component P held by the multiple nozzles 15 attached to the transfer head 8 at the same time as the transfer head 8 passes by. This allows the component recognition camera 11 to recognize the component P that has been picked up by the multiple nozzles 15. The multiple nozzles 15 may be nozzles for picking up the same type of component P, or may be nozzles for picking up different types of component P.

[0069] The nozzles 15 can also suck (vacuum suck) the component P, and can release the component P by releasing the suction after suction. The nozzles 15 can also blow, in addition to vacuum sucking.

[0070] A board recognition camera 12 is disposed on the coupling plate 8a to which the transfer head 8 is attached, and is located on the underside of the X-axis beam 7 and moves integrally with the transfer head 8. The board recognition camera 12 is disposed on the coupling plate 8a with its imaging direction facing downward. By moving the transfer head 8 above the board B held by the board transport unit 2, the board recognition camera 12 captures images of position recognition marks and the like on the board B, and after component mounting, moves above the board B to capture images of the components attached (mounted) on the board B.

[0071] Image data acquired by the component recognition camera 11 and the board recognition camera 12 is subjected to image recognition processing to detect the suction state of the component P held by the nozzle 15 in the transfer head 8 (for example, positional misalignment of the component P) and the positional misalignment of the board B held by the board transport unit 2. In the component mounting operation, the transfer head 8 takes these positional misalignments into account, corrects the position, and mounts the component P at the mounting position on the board B.

[0072] As shown in Figures 3 and 4, the transfer head 8 is attached to the X-axis beam 7 via a connecting plate 8a. The transfer head 8 has a plurality of nozzle units 9 arranged side by side. Each nozzle unit 9 is arranged so that a nozzle shaft 13 extends downward from a nozzle drive unit 9a. A plurality of nozzles 15 are detachably attached to a nozzle mounting unit 14 connected to the lower end of the nozzle shaft 13. Each nozzle drive unit 9a has a nozzle elevating mechanism that uses a linear motor to raise and lower the elevating shaft connected to the nozzle shaft 13. When the nozzle drive unit 9a is driven, the plurality of nozzles 15 attached to the nozzle mounting unit 14 are individually raised and lowered. In addition to the plurality of nozzle units 9, the transfer head 8 has a nozzle drive unit 9a, a nozzle shaft 13, a nozzle mounting unit 14, and a nozzle 15. The transfer head 8 has multiple nozzle units 9, multiple nozzle drive units 9a, multiple nozzle shafts 13, multiple nozzle mounting units 14, and multiple nozzles 15, but unless otherwise specified, the following description will focus on one nozzle unit 9, one nozzle drive unit 9a, one nozzle shaft 13, one nozzle mounting unit 14, and one nozzle 15.

[0073] A number of types of nozzles 15 are available depending on the size and shape of the component P to be vacuum-suctioned. For example, a nozzle 15 with a large suction surface at the bottom end is used for a large component. Nozzles 15 of different sizes may be attached to the transfer head 8.

[0074] Furthermore, multiple types of transfer heads 8 are prepared according to the type of nozzle 15 to be attached. For example, when attaching a large nozzle 15 that picks up a large component, a transfer head 8 having a large nozzle unit 9 is used.

[0075] FIG. 5 is a block diagram showing the configuration of a vacuum suction system and an air blow system in the component mounting apparatus M3.

[0076] The nozzle shaft 13 is in communication with the nozzle 15 via a nozzle mounting portion 14. A flow path hole provided inside the nozzle shaft 13 is in communication with the nozzle 15 via a measuring portion 16. That is, the suction hole of the nozzle shaft 13 is connected to an output port of a switching valve 18 via the measuring portion 16, thereby connecting the switching valve 18 and the nozzle 15.

[0077] The measuring unit 16 measures the physical quantity of air (a physical quantity indicating the air flow state) flowing through a flow path connected to the nozzle 15 when the nozzle 15 is not suctioning a component P. The measuring unit 16 is a flow sensor that measures the flow rate F of air in two directions: the forward direction flowing out from the measuring unit 16 in the direction of the nozzle axis 13 (arrow a), and the negative direction (reverse direction) flowing from the nozzle axis 13 in the direction of the measuring unit 16 (arrow b).

[0078] The measuring unit 16 is not limited to a flow sensor that measures the air flow rate F, but may also be a pressure sensor that measures the pressure in the flow path of the nozzle shaft 13. That is, the measuring unit 16 measures the air flow rate or air pressure (a physical quantity related to gas) in the flow path corresponding to the measuring unit 16 among the multiple nozzles 15. For example, the measurement by the measuring unit 16 is performed on a predetermined number of flow paths corresponding to a predetermined number of nozzles 15 among the multiple nozzles 15. The predetermined number is, for example, three, but is not limited to three and may be two or less, or four or more. If the total number of the multiple nozzles 15 is greater than the predetermined number, the measurement by the measuring unit 16 is performed multiple times. The number of measurements by the measuring unit 16 may be, for example, the smallest integer number greater than the number obtained by dividing the total number by the predetermined number. This allows measurements to be performed on all of the multiple nozzles 15 by dividing the measurement multiple times and switching the predetermined number of nozzles 15 to be measured in each measurement.

[0079] The switching valve 18 is a solenoid valve having two input ports P1 and P2 and an output port A1. By receiving a selection signal from an external device, the switching valve 18 switches between one state, in which the path from the input port P1 to the output port A1 is open, and another state, in which the path from the input port P2 to the output port A1 is open. The input port P1 of the switching valve 18 is connected to a vacuum pump 19, the input port P2 is connected to the output port A2 of the blow valve 20, and the output port A1 is connected to the output path 17 leading to the measuring unit 16. The vacuum pump 19 generates a negative pressure (vacuum).

[0080] The blow valve 20 is a solenoid valve having two input ports P3 and P4 and an output port A2. By receiving a selection signal from an external device, the blow valve 20 switches between one state, in which the path from the input port P3 to the output port A2 is open, and another state, in which the path from the input port P4 to the output port A2 is open. The input port P3 of the blow valve 20 is connected to an air supply source 21, the input port P4 is connected to an atmospheric air supply source 22, and the output port A2 is connected to the input port P2 of the switching valve 18. The air supply source 21 supplies positive pressure air. The atmospheric air supply source 22 supplies atmospheric air. The atmospheric air supply source 22 can also be realized by opening the input port P4 of the blow valve 20.

[0081] The switching valve 18 and the blow valve 20 are connected to a valve control unit 24. The valve control unit 24 is provided in the transfer head 8, and is connected to a control unit 30 so as to be able to communicate with each other.

[0082] When the valve control unit 24 controls the switching valve 18 to open the path from the input port P1 to the output port A1 (suction state), the vacuum pump 19 communicates with the nozzle 15 via the measuring unit 16, and the nozzle 15 performs vacuum suction from the suction holding surface 15a at the lower end.

[0083] When vacuum suction is performed from the nozzle 15 while the component P is in contact with the suction holding surface 15a, the component P is vacuum-sucked by the nozzle 15. At this time, the air flow rate F measured by the measuring unit 16 is almost zero. When vacuum suction is performed from the nozzle 15 while the component P is not in contact with the suction holding surface 15a, outside air (air) is sucked through the nozzle 15. Therefore, the measuring unit 16 measures a negative air flow rate F.

[0084] When the valve control unit 24 controls the switching valve 18 to open the path from the input port P2 to the output port A1 and also controls the blow valve 20 to open the path from the input port P3 to the output port A2 (blowing state), the air supply source 21 communicates with the nozzle 15 via the measuring unit 16, and positive pressure air is discharged from the nozzle 15. At this time, the flow rate F of the positive air is measured by the measuring unit 16.

[0085] When the valve control unit 24 controls the switching valve 18 to open the path from the input port P2 to the output port A1 and controls the blow valve 20 to open the path from the input port P4 to the output port A2 (atmospheric pressure state), the air supply source 22 communicates with the nozzle 15 via the measuring unit 16, and the nozzle 15 becomes atmospheric pressure. At this time, the air flow rate F measured by the measuring unit 16 becomes almost zero.

[0086] In this way, the switching valve 18 and the blow valve 20 selectively connect the vacuum pump 19 and the air supply source 21 to the nozzle 15. The measuring unit 16 is provided in the suction / air blow circuit that connects the switching valve 18 and the blow valve 20 to the nozzle 15, and measures the flow rate F of air passing through the suction / air blow circuit in both forward and reverse directions.

[0087] FIG. 6 is a block diagram showing the configuration of the component mounting device M3 and the management device 100 included in the component mounting system 1.

[0088] The component mounting device M3 includes a control unit 30, a memory unit 31, a communication unit 40, a board transport unit 2, a component supply unit 4, a transfer head 8, a head movement mechanism 10, a component recognition camera (imaging unit) 11, a board recognition camera 12, a measurement unit 16, a switching valve 18, a blow valve 20, a vacuum pump 19, an air supply source 21, an atmospheric air supply source 22, an input unit 32, and a notification unit 34. The transfer head 8 includes a nozzle drive unit 9a and a valve control unit 24. The measurement unit 16, the switching valve 18, and the blow valve 20 are connected to the valve control unit 24 via control lines.

[0089] The communication unit 40 is communicably connected to the management device 100 and exchanges information with the management device 100. Specifically, the communication unit 40 may be communicably connected to a communication network 50 of the component mounting line L1 to exchange information with each device included in the component mounting line L1 and the management device 100. The communication between the communication unit 40 and the communication network 50 may be realized by wired communication or wireless communication.

[0090] The input unit 32 receives input of operation commands, data, etc. from a user (e.g., an operator or an administrator; hereinafter, also referred to as an operator, etc.). The input unit 32 may be realized by an input device such as a keyboard, a touch panel, or a mouse, or may be realized by a device that receives input by voice (e.g., a microphone).

[0091] The notification unit 34 displays various information such as an operation screen for operation by the input unit 32. Furthermore, if the flow path of the nozzle 15 is in an abnormal state, the notification unit 34 displays information indicating that the flow path of the nozzle 15 is in an abnormal state. The notification unit 34 is realized by a display device such as a liquid crystal panel. Note that the notification unit 34 may also be an alarm light, flash lamp, buzzer, or the like that notifies the operator of an operating status such as an abnormality of the component mounting device M3.

[0092] The storage unit 31 is a storage device that stores production data including various data for controlling the operation of the component mounting device M3.

[0093] The production data includes information regarding the mounting position of the component P on the board B, the type of component P to be mounted (component name), the type of nozzle 15 corresponding to the type of component P, and a threshold Th for determining whether the physical quantity of air flowing through the nozzle 15 is acceptable. The type of component P may include information regarding the model number and manufacturer of the component P. The type of nozzle 15 may include information regarding the model number and manufacturer of the nozzle 15. The production data also includes information such as timing information for the valve control unit 24 to switch the states of the switching valve 18 and the blow valve 20 when the nozzle 15 attaches (mounts) the component P vacuum-sucked by the nozzle 15 onto the board B. The production data also includes information such as timing information for measuring the physical quantity of air flowing through the nozzle 15.

[0094] The control unit 30 is an arithmetic processing device equipped with a CPU (Central Processing Unit). The control unit 30 acquires detection results from various sensors equipped in the component mounting device M3 and control signals from the outside, and controls the operation of various actuators of the component mounting device M3 based on the acquired detection results or control signals. The control unit 30 controls various actuators, such as the board transport unit 2, component supply unit 4, transfer head 8, nozzle drive unit 9a, and head movement mechanism 10, based on production data, to control the mounting of components P on the board B by the nozzle 15.

[0095] The component mounting device M3 of this embodiment further includes a determination unit 35 and a threshold setting unit 36. The determination unit 35 includes a component suction determination unit 35a that determines whether the component P is in a good or bad state, and an inspection unit 35b that inspects the state of the flow path of the nozzle 15.

[0096] The component suction determination unit 35a determines whether the component P is in a good or bad state based on image information obtained by image capture by the component recognition camera (image capture unit) 11. As described above, the component recognition camera 11 captures an image of the component P held by the nozzle 15. The image obtained by image capture may be a still image or a moving image. The good or bad state of the component P is determined, for example, by the amount of positional deviation and the tilt of the orientation of the component P relative to the nozzle 15. The specified ranges for the amount of positional deviation and the tilt of the orientation of the component P are predetermined depending on the type of component P.

[0097] The component adsorption determining unit 35a determines whether the adsorption state of the component P is good or bad depending on whether the adsorption state of the component P is within a specified range. For example, the component adsorption determining unit 35a determines that the adsorption state of the component P is good if the position or orientation of the component P is within a specified range, and determines that the adsorption state of the component P is bad if the position or orientation of the component P exceeds the specified range.

[0098] The inspection unit 35b inspects the state of the flow path of the nozzle 15 based on the measurement value of the flow rate F by the measurement unit 16 and the threshold value Th for determining whether the physical quantity of air is acceptable. In this case, the flow rate F is the air flow rate F when the nozzle 15 is in a suction state, i.e., when the air inside the nozzle 15 is drawn into the vacuum pump 19, without the nozzle 15 picking up a component P. It is desirable to measure the flow rate F before the component P is imaged by the component recognition camera 11 and before the nozzle 15 picks up the component P. Note that the inspection by the inspection unit 35b may be performed after the measurement of the flow rate F, either after or before the determination by the component adsorption determination unit 35a.

[0099] The inspection unit 35b detects the state of the flow path of the nozzle 15, specifically, whether or not there is an abnormality in the nozzle 15, depending on whether the measured value of the flow rate F is equal to or greater than the threshold value Th. For example, the inspection unit 35b detects that the flow path of the nozzle 15 is not in an abnormal state when the measured value of the flow rate F is equal to or greater than the threshold value Th, and detects that the flow path of the nozzle 15 is in an abnormal state when the measured value of the flow rate F is smaller than the threshold value Th. Note that the abnormal state may not be a completely abnormal state, but may be a state that indicates a sign of an abnormality before it becomes abnormal. The threshold value Th may be set by regarding a state that indicates a sign of an abnormality as the above-mentioned abnormal state. The abnormal state of the flow path of the nozzle 15 includes at least one of a state in which the nozzle 15 is clogged and a state in which a filter in a shaft to which the nozzle 15 is attached is clogged.

[0100] The threshold setting unit 36 ​​resets the threshold value Th for detecting an abnormal state of the flow path by the inspection unit 35 b based on the determination result of the component adsorption determination unit 35 a and the inspection result of the inspection unit 35 b. For example, the threshold setting unit 36 ​​sets the threshold value Th according to the following multiple cases.

[0101] FIG. 7 is a diagram showing the relationship between the flow rate F measured by the measuring unit 16 and the threshold value Th for determining whether the suction state of the component P is good or bad, the flow rate F measured by the measuring unit 16, and the physical amount of air in the nozzle 15, and whether the threshold value Th has been changed.

[0102] As shown in the figure, the combination of the quality of the suction state of the component P and the magnitude relationship between the flow rate F and the threshold value Th is shown in four cases shown in (a), (b), (c), and (d) of Figure 7. In the following, the magnitude relationship between the flow rate F and the threshold value Th is expressed as the magnitude relationship of absolute values.

[0103] The first case is a combination of "suction state of component P = G" and "flow rate F ≥ threshold value Th," as shown in Figure 7A. If the measured flow rate F is equal to or greater than threshold value Th, the inspection unit 35b detects that the flow path of the nozzle 15 is not in an abnormal state. If the flow path of the nozzle 15 is not in an abnormal state, a component P pickup error is unlikely to occur, so the inspection result of the inspection unit 35b matches the determination result of the component pickup determination unit 35a, "suction state of component P = G." In this case, the threshold value setting unit 36 ​​does not need to change the threshold value Th because it is appropriate.

[0104] In this way, the threshold setting unit 36 ​​maintains the threshold value Th unchanged when the component adsorption determination unit 35a determines that the adsorption state of the component P is good and the inspection unit 35b detects that the flow path of the nozzle 15 is not in an abnormal state.

[0105] The second case is a combination of "suction state of component P = G" and "flow rate F < threshold value Th," as shown in Figure 7(b). If the measured flow rate F is smaller than threshold value Th, the inspection unit 35b detects that the flow path of the nozzle 15 is in an abnormal state. If the flow path of the nozzle 15 is in an abnormal state, component P pickup errors are likely to occur, and therefore the inspection result of the inspection unit 35b does not match the judgment result of the component pickup judgment unit 35a, "suction state of component P = G." In this case, it is thought that an incorrect detection has occurred, whereby a nozzle that did not experience a component pickup error is detected as abnormal because threshold value Th is inappropriate. Therefore, the threshold setting unit 36 ​​changes threshold value Th to a lower value.

[0106] In this way, when the component adsorption determination unit 35a determines that the component P is in a good state, but the inspection unit 35b detects that the flow path of the nozzle 15 is in an abnormal state, the threshold setting unit 36 ​​resets the threshold Th to a value lower than the preset value. For example, the threshold setting unit 36 ​​resets the threshold Th to a value lower than the measurement value of the measurement unit 16.

[0107] The third case is a combination of "suction state of component P = NG" and "flow rate F < threshold value Th," as shown in Figure 7(c). If the measured flow rate F is smaller than threshold value Th, the inspection unit 35b detects that the flow path of the nozzle 15 is in an abnormal state. If the flow path of the nozzle 15 is in an abnormal state, a component P is likely to be picked up incorrectly, so the inspection result of the inspection unit 35b matches the judgment result of the component suction judgment unit 35a, which is "suction state of component P = NG." In this case, the threshold value setting unit 36 ​​does not need to change the threshold value Th because it is appropriate.

[0108] In this way, the threshold setting unit 36 ​​maintains the threshold value Th without changing it when the component adsorption determination unit 35a determines that the adsorption state of the component P is not good and the inspection unit 35b detects that the flow path of the nozzle 15 is in an abnormal state.

[0109] The fourth case is a combination of "component P pickup state = NG" and "flow rate F ≥ threshold value Th," as shown in Figure 7(d). If the measured flow rate F is equal to or greater than threshold value Th, the inspection unit 35b determines that the flow path of the nozzle 15 is not in an abnormal state. If the flow path of the nozzle 15 is not in an abnormal state, a pickup error of the component P is unlikely to occur, so the inspection result of the inspection unit 35b does not match the determination result of the component pickup determination unit 35a, "component P pickup state = NG." In this case, it is thought that because threshold value Th is inappropriate, a nozzle in which a component pickup error has occurred is not detected as being in an abnormal state, and therefore the threshold setting unit 36 ​​changes threshold value Th to a higher value.

[0110] In this way, when the component suction determination unit 35a determines that the suction state of the component P is not good but the inspection unit 35b detects that the flow path of the nozzle 15 is not in an abnormal state, the threshold setting unit 36 ​​resets the threshold Th to a value higher than the preset value. For example, the threshold setting unit 36 ​​resets the threshold Th to a value equal to or greater than the measurement value of the measurement unit 16. Note that the threshold setting unit 36 ​​may reset the measured value of the flow rate F itself as the threshold Th.

[0111] When the threshold value Th is reset, the threshold value setting unit 36 ​​outputs information about the reset threshold value Th to the inspection unit 35 b. The inspection unit 35 b receives the information about the reset threshold value Th output from the threshold value setting unit 36, and after receiving the information, detects an abnormal state of the flow path of the nozzle 15 based on the measurement value measured by the measurement unit 16 and the reset threshold value Th.

[0112] Furthermore, when the threshold value Th is reset, the threshold value setting unit 36 ​​outputs reset information is (see FIG. 8 ) indicating that the threshold value Th has been reset to the storage unit 31. The storage unit 31 stores information relating to the type of component P, the type of nozzle 15, and the reset threshold value Th in association with each other.

[0113] Furthermore, when the threshold value Th is reset, the threshold value setting unit 36 ​​outputs reset information "is" to the notification unit 34. The notification unit 34 displays the reset information "is" output from the threshold value setting unit 36 ​​to notify the worker of the reset information "is."

[0114] Furthermore, when the threshold value setting unit 36 ​​resets the threshold value Th, it outputs reset information is to the management device 100 via the communication unit 40. That is, the threshold value setting unit 36 ​​outputs information regarding the type of component P, the type of nozzle 15, and the reset threshold value Th to the management device 100.

[0115] [Configuration of Management Device] As shown in FIG. 6, the management device 100 includes a communication unit 140, a production data creation unit 110, a control unit 130, a storage unit 131, an input unit 132, and a notification unit 134.

[0116] The input unit 132 is a user interface for inputting various data to the management device 100. For example, when creating a production plan for producing component-mounted boards using the component mounting device M3, the input unit 132 receives initial settings for the type of component P, the type of nozzle 15, and the threshold value Th from the administrator, and outputs the settings to the production data creation unit 110.

[0117] The production data creation unit 110 creates production data for producing component-mounted boards based on the data input by the input unit 132 and the data stored in the storage unit 131. The production data includes information regarding the mounting positions of the components P on the board B, the types of the components P to be mounted, the types of nozzles 15 corresponding to the types of the components P, and the setting of the threshold value Th. The production data created by the production data creation unit 110 is output to the component mounting device M3 via the communication unit 140.

[0118] The communication unit 140 is communicably connected to the component mounting device M3 and exchanges information with the component mounting device M3. Specifically, the communication unit 140 is communicably connected to the communication network 50 of the component mounting line L1 and exchanges information with each device included in the component mounting line L1. The communication between the communication unit 140 and the communication network 50 may be realized by wired communication or wireless communication.

[0119] The control unit 130 is a processing unit including a CPU, and controls the operations of the production data creation unit 110, the storage unit 131, the input unit 132, and the notification unit 134.

[0120] When the control unit 130 acquires the reset information "is" output from the component mounting device M3 via the communication unit 140, the control unit 130 outputs the reset information "is" to the notification unit 134. The reset information "is" includes information indicating that the threshold value Th has been reset. The notification unit 134 displays the reset information "is" to notify the administrator operating the management device 100 of the reset information "is."

[0121] Furthermore, the control unit 130 outputs the reset information "is" to the storage unit 131, and the storage unit 131 stores the reset information "is." The storage unit 131 stores information relating to the type of component P, the type of nozzle 15, and the reset threshold value Th in association with each other.

[0122] FIG. 8 is a diagram showing an example of the reset information "is" of the threshold value Th stored in the storage unit 131. As shown in FIG.

[0123] The figure shows information relating to the type of nozzle 15, the type of part P, the threshold value Th corresponding to each type, and so on.

[0124] Specifically, (a) and (b) of Figures 8 show that the components that can be mounted using nozzle 15A are components Pa and Pb, and that the set values ​​of threshold value Th when mounting components Pa and Pb using nozzle 15A are 90, respectively.

[0125] 8A shows that component Pa was mounted using nozzle 15A, and the results of detecting the suction state of component Pa and any abnormal conditions in the flow path of nozzle 15A showed that there was no problem with threshold Th, so that threshold Th was not changed. Also, FIG. 8B shows that component Pb was mounted using nozzle 15A, and the results of detecting the suction state of component Pb and any abnormal conditions in the flow path of nozzle 15A showed that threshold Th was too lenient, so that threshold Th was reset to a value higher than the previously set value.

[0126] (c) and (d) of Figure 8 show that the components that can be mounted using nozzle 15B are component Pa and component Pc, and that the set values ​​of threshold Th when mounting component Pa and component Pc using nozzle 15B are 100, respectively.

[0127] 8(c) shows that component Pa was mounted using nozzle 15B, and the suction state of component Pa and any abnormal states in the flow paths of nozzle 15B were detected, and as a result, threshold value Th was found to be normal and therefore not changed. Also, FIG. 8(d) shows that component Pc was mounted using nozzle 15B, and the suction state of component Pc and any abnormal states in the flow paths of nozzle 15B were detected, and as a result, threshold value Th was found to be strict, and therefore threshold value Th was reset to a value lower than the previously set value.

[0128] When creating production data, the production data creation unit 110 updates the production data based on the master data stored in the storage unit 131 and the reset information "is." That is, the production data creation unit 110 updates the production data based on the information output from the component mounting device M3, such as the type of component P, the type of nozzle 15, and the reset threshold value Th. The updated production data is output to the component mounting device M3 via the communication unit 140.

[0129] The component mounting system 1 according to this embodiment includes a nozzle 15 capable of adsorbing and holding a component P, a measurement unit 16 that measures the physical quantity of air flowing through a flow path connected to the nozzle 15 when the nozzle 15 is not adsorbing a component P, an imaging unit (component recognition camera 11) that images the component P adsorbed to the nozzle 15, a component adsorption determination unit 35a that determines whether the adsorption state of the component P is good or bad based on image information obtained by the imaging unit, an inspection unit 35b that inspects the state of the flow path based on the measurement values ​​obtained by the measurement unit 16, and a threshold setting unit 36 ​​that sets a threshold value Th for the inspection unit 35b to detect an abnormal state of the flow path based on the determination result of the component adsorption determination unit 35a and the inspection result of the inspection unit 35b.

[0130] According to this configuration, it is possible to appropriately set the threshold value Th for detecting an abnormal state of the flow path based on the physical quantity of air flowing in the flow path communicating with the nozzle 15. This makes it possible to appropriately determine the abnormal state of the flow path and suppress erroneous detection of an abnormality in the flow path.

[0131] [Information Processing Method] A description will be given of an information processing method according to embodiment 1. In this example, the operation flow of the component mounting system 1 will be described as the flow of the information processing method.

[0132] FIG. 9 is a flowchart showing an information processing method according to the first embodiment.

[0133] The component mounting device M3 acquires production data from the management device 100 (step S11). The production data includes information regarding the mounting position of the component P on the board B, the type of the component P to be mounted, the type of nozzle 15 corresponding to the type of component P, and a threshold value Th for determining whether the physical quantity of air flowing through the nozzle 15 is acceptable. In this example, the threshold value Th is expressed as a flow rate value.

[0134] Next, the component mounting device M3 starts the production of component-mounted boards based on the acquired production data (step S12). Specifically, the component mounting device M3 starts the operation of mounting components P onto the board B.

[0135] Next, the component mounting device M3 determines whether the component mounting device M3 is set to the automatic operation mode (step S13).

[0136] If the automatic operation mode is set (Yes in S13), the component mounting device M3 performs the following process while producing component-mounted boards.

[0137] The component mounting device M3 acquires the measured value of the flow rate F (step S14). The measured value of the flow rate F is a value obtained by measuring the flow rate F of air flowing through the nozzle 15 when the nozzle 15 is not suctioning a component P. The flow rate F is the air flow rate F when the nozzle 15 is in a suction state, i.e., when the air inside the nozzle 15 is drawn into the vacuum pump 19. The measurement of the flow rate F by the measuring unit 16 is performed before the nozzle 15 suctions a component P. The measured flow rate F may be the flow rate during blowing.

[0138] Next, the component mounting device M3 performs a process of inspecting the state of the flow path of the nozzle 15 by comparing the measured flow rate F with a threshold value Th. The component mounting device M3 determines whether the measured flow rate F is equal to or greater than a preset threshold value Th. Based on the determination result, the component mounting device M3 detects that the flow path of the nozzle 15 is in an abnormal state. Note that the component mounting device M3 may also detect that the flow path of the nozzle 15 is in a normal state based on the determination result.

[0139] Next, the component mounting device M3 picks up the component P using the nozzle 15 (step S15). Then, the component mounting device M3 picks up an image of the component P picked up by the nozzle 15 using the component recognition camera (image capturing unit) 11 (step S16).

[0140] Next, the component mounting device M3 determines whether the component P is in a good state (step S17). The goodness of the component P is determined based on, for example, the amount of positional deviation and the tilt of the posture of the component P relative to the nozzle 15.

[0141] Next, the component mounting device M3 obtains the result of comparing the measured flow rate F with the threshold value Th (steps S18 and S21). Note that instead of the result of comparing the flow rate F with the threshold value Th, at least one of an inspection result indicating the abnormal state or normal state of the flow path of the nozzle 15, or information regarding the presence or absence of an error indicating an abnormal state (for example, a flag) may be obtained.

[0142] If the flow rate F is equal to or greater than the threshold value Th for a nozzle determined to have a good suction state for the component P (Yes in S17) (Yes in S18), the component mounting device M3 maintains the threshold value Th without changing it (step S19) and returns to step S13. At this time, the component mounting device M3 displays current status information on the notification unit 34, indicating that the suction state for the component P was good, that the flow rate F was equal to or greater than the threshold value Th, that the nozzle 15 was detected to be in a normal state, and that the threshold value Th was not changed, and also outputs this current status information to the management device 100. The management device 100 may display this current status information on the notification unit 134.

[0143] On the other hand, for a nozzle determined to have a good suction state for the component P (Yes in S17), if the flow rate F is not equal to or greater than the threshold value Th (No in S18), the component mounting device M3 changes the threshold value Th so that it is lower than the preset value (step S20), and returns to step S13. At this time, the component mounting device M3 displays current status information on the notification unit 34, indicating that the suction state for the component P was good, that the flow rate F was not equal to or greater than the threshold value Th before the change, that the flow path of the nozzle 15 was detected to be in an abnormal state, and indicating that the threshold value Th has been changed, and also outputs this information to the management device 100. The management device 100 may display this current status information on the notification unit 134.

[0144] Furthermore, if the flow rate F is not equal to or greater than the threshold value Th for a nozzle determined to have an unsatisfactory suction state of the component P (No in S17), the component mounting device M3 maintains the threshold value Th without changing it (step S22) and returns to step S13. At this time, the component mounting device M3 displays, on the notification unit 34, current status information indicating that the suction state of the component P was unsatisfactory, that the flow rate F was not equal to or greater than the threshold value Th, that the flow path of the nozzle 15 was detected to be in an abnormal state, and that the threshold value Th was not changed, and also outputs this information to the management device 100. The management device 100 may display this current status information on the notification unit 134.

[0145] On the other hand, if the flow rate F is equal to or greater than the threshold value Th for a nozzle determined to have an unsatisfactory suction state of the component P (No in S17) (Yes in S21), the component mounting device M3 changes the threshold value Th so that it is higher than the preset value (step S23), and returns to step S13. At this time, the component mounting device M3 displays, on the notification unit 34, current status information indicating that the suction state of the component P was unsatisfactory, that the flow rate F was equal to or greater than the threshold value Th before the change, that the nozzle 15 was detected to be in a normal state, and that the threshold value Th has been changed, and also outputs this information to the management device 100. The management device 100 may display this current status information on the notification unit 134.

[0146] Returning to step S13, if it is determined that the component mounting device M3 is set to automatic operation mode (Yes in S13), the component mounting device M3 detects an abnormal state of the flow path of the nozzle 15 based on the reset threshold value Th, etc. while producing the component mounting board.

[0147] On the other hand, if it is determined in step S13 that the automatic operation mode is not set (No in S13), the component mounting device M3 stops operating. In this way, the processing of steps S11 to S23 is repeated, thereby executing the information processing method according to this embodiment.

[0148] The information processing method according to this embodiment includes the steps of: acquiring a measurement value obtained by measuring the physical quantity of air flowing through a flow path connected to the nozzle 15 when the nozzle 15 is not adsorbing a component; capturing an image of the component adsorbed by the nozzle 15; determining whether the component P is in a good or bad state based on the image information obtained in the step of capturing the image of the component P; inspecting the state of the flow path based on the measurement value; and setting a threshold value Th for detecting an abnormal state in the inspection of the state of the flow path based on the determination result of whether the component P is in a good or bad state and the inspection result of the state of the flow path.

[0149] This makes it possible to appropriately set the threshold value Th for detecting an abnormal state of the flow path based on the physical quantity of air flowing in the flow path connected to the nozzle 15. This makes it possible to appropriately determine the abnormal state of the flow path and suppress erroneous detection of an abnormality in the flow path.

[0150] Although the above example shows a case where the threshold value Th is reset in real time when the determination result of the suction state of the component P and the determination result of the abnormal state of the flow path of the nozzle 15 do not match, the present invention is not limited to this. For example, if the abnormal state is set as a state that indicates a sign of an abnormality before it actually occurs, there is no need to change the threshold value Th in real time. In this case, the component mounting system 1 may change the threshold value Th after the production of component mounting boards by the component mounting device M3 is completed.

[0151] [Modification] A modification of the first embodiment will be described below. In this modification, an example in which the status of the nozzle 15 is displayed on the screen will be described.

[0152] The component mounting device M3 monitors the flow path of the nozzle 15 in real time for abnormal conditions, and displays the status of the nozzle 15 on the notification unit 34 while the component mounting device M3 is operating. The status of the nozzle 15 is divided into multiple ranks by comparing the flow rate F measured by the measurement unit 16 with the threshold value Th. For example, the status of the nozzle 15 is divided into five ranks, "normal, quasi-normal, abnormality warning, abnormal, undetected," in order from the normal state toward the abnormal state. Here, "normal, quasi-normal" are included in the normal state, and "abnormality warning, abnormal, undetected" are included in the abnormal state. "Abnormality warning" is a state that indicates a sign of an abnormality before it actually becomes abnormal, for example. "Quasi-normal" is a state between normal and abnormality warning.

[0153] As in the above-described component mounting system 1, when the threshold value Th is reset by the threshold value setting unit 36, the status of the nozzle 15 changes depending on the reset threshold value Th. Therefore, the component mounting system 1 displays that the status of the nozzle 15 has been changed.

[0154] The notification unit 34 of the component mounting system 1 notifies by displaying the status of the nozzle 15, which indicates the abnormal state of the flow path of the nozzle 15, on a screen.

[0155] FIG. 10 is a diagram showing an example of a screen displayed on the notification unit 34 of the component mounting system 1 according to the modified example of the first embodiment.

[0156] The screen in Fig. 10(a) shows that the rank indicating the current status of the nozzle 15 has become higher than before due to the threshold value Th being lowered. The screen in Fig. 10(b) shows that the rank indicating the current status of the nozzle 15 has become lower than before due to the threshold value Th being higher. The screen in Fig. 10(c) shows that the rank indicating the current status of the nozzle 15 has not changed since the threshold value Th was not changed. Each of Figs. 10(a) to 10(c) also shows information regarding the combination of the type of component P and the type of nozzle 15.

[0157] In this way, the notification unit 34 may notify that the status has been changed in accordance with the resetting of the threshold value Th. Note that the component mounting system 1 may notify that the status has been changed using the notification unit 134 of the management device 100.

[0158] (Embodiment 2) A description will be given of the configuration of a component mounting system 1 according to embodiment 2. In embodiment 2, an example will be described in which the management device 100A resets the threshold value Th.

[0159] FIG. 11 is a block diagram showing the configuration of a component mounting apparatus M3a and a management apparatus 100A included in the component mounting system 1 according to the second embodiment.

[0160] The component mounting system 1 includes a component mounting apparatus M3a and a management apparatus 100A. The component mounting apparatus M3a is an apparatus that mounts components P on a board B. The management apparatus 100A is an apparatus that manages the component mounting apparatus M3a. The component mounting apparatus M3a and the management apparatus 100A are connected via a communication network 50.

[0161] Similar to the first embodiment, the component mounting device M3a includes a control unit 30, a memory unit 31, a communication unit 40, a board transport unit 2, a component supply unit 4, a transfer head 8, a head moving mechanism 10, a component recognition camera (imaging unit) 11, a board recognition camera 12, a measurement unit 16, a switching valve 18, a blow valve 20, a vacuum pump 19, an air supply source 21, an atmospheric air supply source 22, an input unit 32, and a notification unit 34. The transfer head 8 includes a nozzle driving unit 9a and a valve control unit 24. The measurement unit 16, the switching valve 18, and the blow valve 20 are connected to the valve control unit 24 via control lines.

[0162] In the second embodiment, component mounting apparatus M3a does not include a determination unit and a threshold setting unit, and management apparatus 100A includes a determination unit 135 and a threshold setting unit 136. In order for management apparatus 100A to perform determination by determination unit 135 and threshold setting by threshold setting unit 136, information relating to the measurement values ​​measured by measurement unit 16 is transmitted to management apparatus 100A via communication unit 40. In addition, image information captured by component recognition camera 11 is transmitted to management apparatus 100A via communication unit 40.

[0163] Similar to the first embodiment, the management device 100A includes a production data creation unit 110, a control unit 130, a storage unit 131, an input unit 132, a notification unit 134, and a communication unit 140. The management device 100A also includes a determination unit 135 and a threshold setting unit 136.

[0164] The determination unit 135 has a component adsorption determination unit 135a that determines whether the component P is properly adsorbed, and an inspection unit 135b that detects abnormal conditions in the flow path of the nozzle 15. The configuration of the component adsorption determination unit 135a is substantially the same as the component adsorption determination unit 35a in the first embodiment. The configuration of the inspection unit 135b is substantially the same as the inspection unit 35b in the first embodiment. The configuration of the threshold setting unit 136 is substantially the same as the threshold setting unit 36 ​​in the first embodiment.

[0165] The component adsorption determination unit 135a determines whether the adsorption state of the component P is good or bad based on image information obtained by imaging with the component recognition camera (imaging unit) 11 of the component mounting device M3a. For example, the component adsorption determination unit 135a determines that the adsorption state of the component P is good when the position or orientation of the component P is within a specified range, and determines that the adsorption state of the component P is not good when the position or orientation of the component P exceeds the specified range.

[0166] The inspection unit 135b inspects the state of the flow path of the nozzle 15 based on the measurement value of the flow rate F by the measurement unit 16 and a threshold value Th for determining whether the physical quantity of air (a physical quantity indicating the state of air circulation) is good or bad. For example, the inspection unit 135b detects that the flow path of the nozzle 15 is not in an abnormal state when the measurement value of the flow rate F is equal to or greater than the threshold value Th, and detects that the flow path of the nozzle 15 is in an abnormal state when the measurement value of the flow rate F is smaller than the threshold value Th.

[0167] The threshold setting unit 136 resets the threshold value Th for detecting an abnormal state of the flow path by the inspection unit 135b based on the determination result of the component adsorption determination unit 135a and the inspection result of the inspection unit 135b.

[0168] When the threshold value Th is reset, the threshold value setting unit 136 outputs information about the reset threshold value Th to the inspection unit 135 b. The inspection unit 135 b receives the information about the reset threshold value Th output from the threshold value setting unit 136, and after receiving the information, detects an abnormal state of the flow path of the nozzle 15 based on the measurement value measured by the measurement unit 16 and the reset threshold value Th.

[0169] Furthermore, when the threshold value Th is reset, the threshold value setting unit 136 outputs reset information "is" indicating that the threshold value Th has been reset to the storage unit 131. The storage unit 131 stores information relating to the type of component P, the type of nozzle 15, and the reset threshold value Th in association with each other.

[0170] Furthermore, when the threshold value Th is reset, the threshold value setting unit 136 outputs reset information "is" indicating that the threshold value Th has been reset to the notification unit 134. The notification unit 134 displays the reset information "is" output from the threshold value setting unit 136 to notify the administrator of the reset information "is."

[0171] Furthermore, when the threshold value setting unit 136 resets the threshold value Th, it outputs reset information is to the component mounting device M3a via the communication unit 40. That is, the threshold value setting unit 136 outputs information regarding the type of component P, the type of nozzle 15, and the reset threshold value Th to the component mounting device M3a.

[0172] In the following, the operational flow of the management device 100A will be described as the flow of an information processing method, and the following flow also includes the operational flow of the component mounting device M3a.

[0173] FIG. 12 is a flowchart showing an information processing method according to the second embodiment.

[0174] The component mounting device M3a acquires production data from the management device 100A (step S11).

[0175] Next, the component mounting device M3a starts producing component-mounted boards based on the production data (step S12).

[0176] Next, the management device 100A determines whether the component mounting device M3a is set to the automatic operation mode (step S13A).

[0177] If the automatic operation mode is set (Yes in S13A), the management device 100A performs the following process while the component mounting device M3a is producing component mounted boards.

[0178] The management device 100A acquires the measured value of the flow rate F (step S14A). The management device 100A acquires information relating to the measured value of the flow rate F measured by the measuring unit 16 of the component mounting device M3a.

[0179] The component mounting device M3a picks up the component P using the nozzle 15 (step S15). Then, the component mounting device M3a picks up an image of the component P picked up by the nozzle 15 using the component recognition camera (image capturing unit) 11 (step S16).

[0180] Next, the management device 100A determines whether the suction state of the component P is good or not (step S17A). The management device 100A determines whether the suction state of the component P is good or not based on image information regarding the suction state of the component P captured by the component mounting device M3a.

[0181] If the flow rate F is equal to or greater than the threshold value Th for a nozzle determined to have a good suction state for the component P (Yes in S17A) (Yes in S18A), the management device 100A maintains the threshold value Th without changing it (step S19A) and returns to step S13A. At this time, the management device 100A displays current status information on the notification unit 134 indicating that the suction state for the component P was good, that the flow rate F was equal to or greater than the threshold value Th, that the nozzle 15 was detected to be in a normal state, and that the threshold value Th was not changed, and also outputs this information to the component mounting device M3a. The component mounting device M3a may display this current status information on the notification unit 134.

[0182] On the other hand, if the flow rate F for a nozzle determined to have a good suction state for the component P (Yes in S17A) is not equal to or greater than the threshold value Th (No in S18A), the management device 100A changes the threshold value Th so that it is lower than the preset value (step S20A) and returns to step S13A. At this time, the management device 100A displays current status information indicating that the suction state for the component P was good, that the flow rate F was not equal to or greater than the threshold value Th before the change, that the flow path of the nozzle 15 was detected to be in an abnormal state, and that the threshold value Th has been changed on the notification unit 134 and also outputs this information to the component mounting device M3a. The component mounting device M3a may display this current status information on the notification unit 134.

[0183] Furthermore, if the flow rate F is not equal to or greater than the threshold value Th for a nozzle that is not in a good state of suction of the component P (No in S17A), the management device 100A maintains the threshold value Th without changing it (step S22A) and returns to step S13A. At this time, the management device 100A displays current status information indicating that the suction state of the component P was not good, that the flow rate F was not equal to or greater than the threshold value Th, that the flow path of the nozzle 15 was detected to be in an abnormal state, and that the threshold value Th was not changed on the notification unit 134, and also outputs this information to the component mounting device M3a. The component mounting device M3a may display this current status information on the notification unit 134.

[0184] On the other hand, if the flow rate F is equal to or greater than the threshold value Th for a nozzle that is not in a good state of suction of the component P (No in S17A) (Yes in S21A), the management device 100A changes the threshold value Th so that it is higher than the preset value (step S23A) and returns to step S13A. At this time, the management device 100A displays on the notification unit 134 current status information indicating that the suction state of the component P was not good, that the flow rate F was equal to or greater than the threshold value Th before the change, that the nozzle 15 was detected to be in a normal state, and that the threshold value Th has been changed, and also outputs this information to the component mounting device M3a. The component mounting device M3a may display this current status information on the notification unit 134.

[0185] Returning to step S13A, if it is determined that the component mounting device M3a is set to automatic operation mode (Yes in S13A), the management device 100A detects an abnormal state of the flow path of the nozzle 15 based on the reset threshold value Th, etc., while producing component mounting boards using the component mounting device M3a.

[0186] On the other hand, if it is determined in step S13A that the component mounting device M3a is not set to the automatic operation mode (No in S13A), the management device 100A stops the operation of the component mounting device M3a. In this way, the processing of steps S11 to S23A is repeated, thereby executing the information processing method according to the present embodiment.

[0187] The management device 100A of this embodiment includes a component adsorption determination unit 135a that determines whether the component P is in a good or bad state based on image information obtained by capturing an image of the component P adsorbed onto the nozzle 15; an inspection unit 135b that inspects the state of the flow path based on a measurement value obtained by measuring the physical quantity of air flowing through the flow path connected to the nozzle 15 when the nozzle 15 is not adsorbing a component P; and a threshold setting unit 136 that sets a threshold value Th for the inspection unit 135b to detect an abnormal state of the flow path based on the determination result of the component adsorption determination unit 135a and the inspection result of the inspection unit 135b.

[0188] With this configuration, it is possible to appropriately set a threshold value for detecting an abnormal state of the flow path based on the physical quantity of air flowing in the flow path connected to the nozzle, thereby making it possible to appropriately determine the abnormal state of the flow path and suppress erroneous detection of an abnormality in the flow path.

[0189] (Embodiment 3) A description will be given of an information processing system 200 including a component mounting system 1 according to embodiment 3. In embodiment 3, an example will be described in which information regarding the reset threshold value Th is shared between a manufacturer that develops, produces (manufactures), or sells component mounting apparatus M3 and a user that uses component mounting apparatus M3.

[0190] FIG. 13 is a block diagram showing the configuration of an information processing system 200 including the component mounting system 1 according to the third embodiment.

[0191] 13 , the information processing system 200 includes a plurality of component mounting systems 1 each including a component mounting device M3 and a management device 100, and an upper-level management device 250 serving as an upper-level server. The management device 250 is communicatively connected to the plurality of component mounting systems 1 via a communication network 50. Each component mounting system 1 has the same configuration as that of the first embodiment.

[0192] The management device 250 manages the threshold value Th that has been reset in each component mounting system 1. The management device 250 may have the same functions as the management device 100A of the second embodiment, for example, the same functions as the communication unit 140, the control unit 130, the storage unit 131, the input unit 132, the notification unit 134, the determination unit 135, and the threshold value setting unit 136. When the threshold value Th has been reset, the management device 250 outputs reset information is indicating that the threshold value Th has been reset to each component mounting system 1.

[0193] The management device 100 in each component mounting system 1 creates subsequent production data based on the reset information is output from the management device 250. The component mounting device M3 in each component mounting system 1 notifies the worker of the reset information is by displaying the reset information is output from the management device 250. This allows information related to the reset threshold value Th to be shared within the information processing system 200.

[0194] (Other Embodiments) While the component mounting system according to one or more aspects has been described above based on the embodiments, the present disclosure is not limited to these embodiments. As long as it does not deviate from the spirit of the present disclosure, various modifications conceivable by a person skilled in the art to the embodiments and forms constructed by combining components of different embodiments may also be included in the present disclosure.

[0195] In the above embodiment, an example has been shown in which the flow rate of air flowing through the flow path connected to the nozzle 15 is obtained by measurement by the measuring unit 16, but this is not limiting. For example, the component mounting system may calculate the flow rate of air based on the pressure in the flow path connected to the nozzle 15 or the flow velocity of the gas flowing through the flow path connected to the nozzle 15.

[0196] In the above embodiment, an example has been shown in which the physical quantity of air flowing in the flow path connected to the nozzle 15 is measured before the nozzle 15 picks up the component P, but the present invention is not limited to this. For example, on the assumption that the condition of the nozzle 15 does not suddenly deteriorate before and after a single mounting of the component P, the physical quantity of air may be measured after the nozzle 15 has mounted the component P on the board B. Specifically, the component mounting system may use the measuring unit 16 to measure the physical quantity of air in a state in which the nozzle 15 is not picking up the component P after mounting the component P on the board B using the nozzle 15, and detect an abnormal state of the flow path of the nozzle 15 based on the obtained measurement value and the threshold value Th.

[0197] For example, the component mounting device may be provided with a clearing unit that clears clogging of the nozzle 15. Furthermore, the clearing unit that clears clogging of the nozzle 15 may be provided as a nozzle maintenance device separate from the component mounting device. In the clearing unit, the nozzle 15 is cleared by a known suction device or blow device.

[0198] For example, the division of functional blocks in the block diagram is an example, and multiple functional blocks may be realized as a single functional block, one functional block may be divided into multiple blocks, or some functions may be moved to another functional block.Furthermore, the functions of multiple functional blocks having similar functions may be processed in parallel or in time-sharing by a single piece of hardware or software.

[0199] Furthermore, the management device according to the above embodiment may be realized as a single device or may be realized by multiple devices. When the management device is realized by multiple devices, the components of the management device may be distributed among the multiple devices in any manner. When the management device is realized by multiple devices, the communication method between the multiple devices is not particularly limited, and may be wireless communication or wired communication. Furthermore, wireless communication and wired communication may be combined between the devices.

[0200] Furthermore, each component described in the above embodiments may be realized as dedicated hardware, software, or typically as an LSI, which is an integrated circuit. These components may be individually integrated into a single chip, or may be integrated into a single chip containing some or all of the components. While the term "LSI" is used here, it may also be referred to as an IC, system LSI, super LSI, or ultra LSI depending on the level of integration. Furthermore, the integrated circuit implementation is not limited to LSIs, and may be implemented using dedicated circuits or general-purpose processors. A field programmable gate array (FPGA), which can be programmed after LSI fabrication, or a reconfigurable processor, which can reconfigure the connections or settings of circuit cells within an LSI, may also be used. Furthermore, if an integrated circuit implementation technology that replaces LSIs emerges due to advances in semiconductor technology or other derivative technologies, that technology may naturally be used to integrate the components.

[0201] A system LSI is an ultra-multifunctional LSI manufactured by integrating multiple processing units on a single chip. Specifically, it is a computer system that includes a microprocessor, ROM (Read Only Memory), RAM (Random Access Memory), etc. Computer programs are stored in the ROM. The system LSI achieves its functions when the microprocessor operates in accordance with the computer program.

[0202] Furthermore, one aspect of the present disclosure may be a computer program that causes a computer to execute each of the characteristic steps included in the information processing method described above.

[0203] Furthermore, for example, the program may be a program to be executed by a computer. Another aspect of the present disclosure may be a computer-readable non-transitory recording medium on which such a program is recorded. For example, such a program may be recorded on a recording medium and distributed or circulated. For example, the distributed program may be installed in a device having another processor, and the program may be executed by the processor, thereby causing the device to perform each of the above processes.

[0204] The order in which the steps (processes) in the above flowchart are executed is merely an example for specifically explaining the present disclosure, and an order other than the above may be used. Also, some of the steps (processes) may not be executed.

[0205] Furthermore, each step in the component mounting method described in the above embodiment may be performed in a single step or in separate steps. "Performed in a single step" is intended to include each step being performed using a single device, each step being performed consecutively, or each step being performed at the same location. "Separate steps" is intended to include each step being performed using a separate device, each step being performed at a different time (e.g., on a different day), or each step being performed at a different location.

[0206] The present disclosure is useful as a component mounting system that can determine an abnormal state of a nozzle.

[0207] REFERENCE SIGNS LIST 1 Component mounting system 1a Base 2 Board transport section 4 Component supply section 5 Tape feeder 6 Y-axis beam 7 X-axis beam 8 Transfer head 8a Coupling plate 9 Nozzle unit 9a Nozzle drive section 10 Head movement mechanism 11 Component recognition camera (imaging section) 12 Board recognition camera 13 Nozzle shaft 14 Nozzle mounting section 15, 15A, 15B Nozzle 15a Suction holding surface 16 Measurement section 17 Output path 18 Switching valve 19 Vacuum pump 20 Blow valve 21 Air supply source 22 Atmospheric air supply source 24 Valve control section 30 Control section 31 Memory section 32 Input section 34 Notification section 35 Determination section 35a Component suction determination section 35b Inspection section 36 Threshold setting section 40 Communication section 50 Communication network 100, 100A Management device 110 Production data creation unit 130 Control unit 131 Memory unit 132 Input unit 134 Notification unit 135 Determination unit 135a Component adsorption determination unit 135b Inspection unit 136 Threshold value setting unit 140 Communication unit 200 Information processing system 250 Management device B Board F Flow rate is Reset information L1 Component mounting line M1 Solder printing device M2 Printing inspection device M3, M3a, M4, M5, M6 Component mounting device M7 Mounting inspection device M8 Reflow device P, Pa, Pb, Pc Component Th Threshold value

Claims

1. A component mounting system comprising: a nozzle capable of picking up and holding a component; a measurement unit that measures the physical quantity of air flowing in a flow path connected to the nozzle when the nozzle is not picking up a component; an imaging unit that images the component picked up by the nozzle; a component pick-up determination unit that determines whether the pick-up state of the component is good or bad based on image information obtained by imaging by the imaging unit; an inspection unit that inspects the state of the flow path based on measurements by the measurement unit; and a threshold setting unit that sets a threshold for the inspection unit to detect an abnormal state of the flow path based on the determination result of the component pick-up determination unit and the inspection result of the inspection unit.

2. The component mounting system according to claim 1, wherein the inspection unit determines that the flow path is not in an abnormal state when the measurement value is equal to or greater than the threshold value, and detects that the flow path is in an abnormal state when the measurement value is smaller than the threshold value.

3. The component mounting system according to claim 1, wherein the threshold setting unit resets the threshold so that it is lower than a preset value when the component suction determination unit determines that the component suction state is good and the inspection unit detects that the flow path is in an abnormal state.

4. The component mounting system according to claim 3, wherein the threshold setting unit resets the threshold so that the threshold is a value lower than the measured value.

5. The component mounting system according to claim 1, wherein the threshold setting unit resets the threshold so that it is higher than a preset value when the component suction determination unit determines that the component suction state is not good and the inspection unit does not detect an abnormal state of the flow path.

6. The component mounting system according to claim 5, wherein the threshold setting unit resets the threshold so that the threshold is equal to or greater than the measured value.

7. A component mounting system according to any one of claims 1 to 6, wherein the threshold setting unit maintains the threshold value without changing it when the component adsorption determination unit determines that the component is in a good state of adsorption and the inspection unit does not detect an abnormal state of the flow path, or when the component adsorption determination unit determines that the component is in a bad state of adsorption and the inspection unit detects an abnormal state of the nozzle.

8. A component mounting system according to any one of claims 1 to 6, wherein when the threshold value is reset, the threshold value setting unit outputs information relating to the reset threshold value to the inspection unit, and the inspection unit inspects the state of the flow path based on the measurement value and the reset threshold value.

9. A component mounting system according to any one of claims 1 to 6, further comprising a memory unit that stores information relating to the type of component, the type of nozzle, and the threshold value, wherein when the threshold value is reset, the threshold value setting unit outputs information relating to the reset threshold value to the memory unit, and the memory unit stores the information relating to the type of component, the type of nozzle, and the reset threshold value in association with each other.

10. The component mounting system according to claim 9, wherein the inspection unit detects an abnormal state of the flow path based on the measurement value and the reset threshold value stored in the memory unit.

11. A component mounting system according to any one of claims 1 to 6, further comprising an alarm unit that notifies information relating to an abnormal state of the flow path, wherein when the threshold value setting unit resets the threshold value, it outputs reset information indicating that the threshold value has been reset to the alarm unit, and the alarm unit notifies the reset information.

12. A component mounting system according to any one of claims 1 to 6, further comprising a notification unit that notifies a status indicating an abnormal state of the flow path for each nozzle, wherein the notification unit notifies that the status has been changed in accordance with the resetting of the threshold value.

13. A management device comprising: a component suction determination unit that determines whether the component suction state is good or bad based on image information obtained by capturing an image of the component suctioned by the nozzle; an inspection unit that inspects the state of the flow path based on a measurement value obtained by measuring the physical quantity of air flowing in the flow path connected to the nozzle when the nozzle is not suctioning the component; and a threshold setting unit that sets a threshold for the inspection unit to detect an abnormal state of the flow path based on the determination result of the component suction determination unit and the inspection result of the inspection unit.

14. An information processing method comprising: a step of obtaining a measurement value obtained by measuring the physical quantity of air flowing through a flow path connected to a nozzle when the nozzle is not picking up a component; a step of capturing an image of the component picked up by the nozzle; a step of determining whether the component is in a good or bad state based on image information obtained in the step of capturing an image of the component; a step of inspecting the state of the flow path based on the measurement value; and a step of setting a threshold value for detecting an abnormal state in the inspection of the state of the flow path based on the determination result of whether the component is in a good or bad state and the inspection result of the state of the flow path.

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